Apparatus for refrigeration, refrigeration device

Abstract

This application relates to the field of refrigeration equipment technology, and discloses a refrigeration device, including a multi-temperature zone module, the multi-temperature zone module having a control module, and a base with a sealed structure, the multi-temperature zone module being disposed outside the base; a semiconductor module disposed inside the base, including a first terminal for detecting the temperature of the multi-temperature zone module and a second terminal for detecting the ambient temperature; an energy-consuming device disposed inside the base and connected to the semiconductor module; and a microcontroller connected to the semiconductor module, configured to activate the energy-consuming device when the temperature of the multi-temperature zone module and the ambient temperature meet a first preset condition. This device can reduce the energy consumption of the refrigeration equipment. This application also discloses a refrigeration device.

Description

Technical Field

[0001] This application relates to the field of refrigeration equipment technology, for example to a device and refrigeration equipment for refrigeration. Background Technology

[0002] Currently, multi-temperature zone modules are commonly used small refrigeration units in freezers and refrigerators for refrigerating small-volume beverages. Due to their small footprint and good refrigeration effect, refrigeration equipment with multi-temperature zone modules is popular among consumers. Each multi-temperature zone module contains a control module, which includes a temperature sensor and semiconductor components. The multi-temperature zone module operates using the semiconductor temperature control principle. The temperature sensor detects the temperature of the multi-temperature zone module. During operation, the temperature of the multi-temperature zone module is higher than the internal temperature of the refrigeration equipment, causing the temperature in the localized area where the multi-temperature zone module is located to rise. To maintain a constant internal temperature, the freezer compressor responds to the temperature rise in this localized area, increasing the compressor's power consumption and thus the freezer's energy consumption. Summary of the Invention

[0003] To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general commentary, nor is it intended to identify key / important components or describe the scope of protection of these embodiments, but rather as a prelude to the detailed description that follows.

[0004] This disclosure provides an apparatus or refrigeration device for refrigeration, thereby reducing the energy consumption of the refrigeration equipment.

[0005] In some embodiments, the cooling device includes a multi-temperature zone module, the multi-temperature zone module having a control module and a base, which is a sealed structure, with the multi-temperature zone module disposed outside the base; a semiconductor module disposed inside the base, including a first end for detecting the temperature of the multi-temperature zone module and a second end for detecting the ambient temperature; an energy-consuming device disposed inside the base and connected to the semiconductor module; and a microcontroller connected to the semiconductor module and configured to activate the energy-consuming device when the temperature of the multi-temperature zone module and the ambient temperature meet a first preset condition.

[0006] In some embodiments, the first end of the semiconductor module includes a first thermally conductive element disposed inside the base; a first electrical connection portion, one end of which is connected to the first thermally conductive element and the other end of which is connected to the control module; and a second temperature sensor, which is connected to the microcontroller and the first thermally conductive element, for detecting the temperature of the first thermally conductive element.

[0007] In some embodiments, the base includes a base plate, in which the semiconductor module and the energy-consuming device are disposed; a side plate, disposed on one side of the base plate, enclosing the base plate to accommodate the multi-temperature zone module, and the first electrical connection portion is disposed inside the side plate and penetrates the side plate.

[0008] In some embodiments, the second end of the semiconductor module includes a second thermally conductive element disposed on the bottom outside of the base; and a third temperature sensor connected to the microcontroller and the second thermally conductive element for detecting the temperature of the second thermally conductive element.

[0009] In some embodiments, the first preset condition includes the difference between the temperature of the multi-temperature zone module and the ambient temperature being greater than or equal to a preset temperature.

[0010] In some embodiments, the microcontroller is further configured to adjust the energy consumption state of the energy-consuming device when the energy-consuming device is turned on and the temperature of the multi-temperature zone module meets the second preset condition with respect to the ambient temperature.

[0011] In some embodiments, the cooling device includes multiple multi-temperature zone modules, each multi-temperature zone module having a control module and a base, which is a sealed structure, with all multi-temperature zone modules disposed outside the base; a semiconductor module disposed inside the base, including a first end for detecting the temperature of any multi-temperature zone module and a second end for detecting the ambient temperature; an energy-consuming device disposed inside the base and connected to the semiconductor module; and a microcontroller connected to the semiconductor module and configured to activate the energy-consuming device corresponding to any multi-temperature zone module when the temperature of any multi-temperature zone module and the ambient temperature meet a first preset condition; wherein, one multi-temperature zone module corresponds to one semiconductor module and one energy-consuming device.

[0012] In some embodiments, the first end of the semiconductor module includes a third thermally conductive element disposed inside the base; a second electrical connection portion, one end of which is connected to the third thermally conductive element and the other end of which is connected to one of the plurality of control modules; and a second temperature sensor, which is connected to the microcontroller and the third thermally conductive element, for detecting the temperature of the third thermally conductive element.

[0013] In some embodiments, the refrigeration equipment includes a cabinet; a door that encloses the cabinet to form a refrigeration space; and a device for refrigeration as described above; wherein the base may be installed on the door and located inside the refrigeration space.

[0014] In some embodiments, a third electrical connection portion is also included, which can be installed on the base and connected to the microcontroller; a power supply is disposed inside the door body and connected to the third electrical connection portion.

[0015] The refrigeration device, refrigeration cabinet, and refrigeration equipment provided in this disclosure can achieve the following technical effects:

[0016] When this device is applied inside a refrigeration device, the temperatures at the first and second ends of the semiconductor module are the temperature of the multi-temperature zone module and the ambient temperature, respectively. Because of the temperature difference between the inside of the refrigeration device and the inside of the multi-temperature zone module, the temperature of the multi-temperature zone module is higher than the temperature inside the refrigeration device. The microcontroller, under the condition that the temperature of the multi-temperature zone module and the ambient temperature meet a first preset condition, converts the temperature difference between the two ends of the semiconductor module into electrical energy, which is then consumed by an energy-consuming device. This gradually reduces the temperature difference between the inside of the refrigeration device and the temperature of the multi-temperature zone module. In this way, the temperature in the local area where the multi-temperature zone module is located slowly increases, thereby reducing the impact on the temperature inside the refrigeration device and ultimately reducing the energy consumption of the refrigeration device.

[0017] The above general description and the description below are exemplary and illustrative only and are not intended to limit this application. Attached Figure Description

[0018] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations and drawings do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are shown as similar elements. The drawings are not to be scaled. And wherein:

[0019] Figure 1 This is a schematic diagram of a cooling device provided in an embodiment of this disclosure;

[0020] Figure 2 This is a cross-sectional schematic diagram of another cooling device provided in an embodiment of this disclosure;

[0021] Figure 3 This is a schematic diagram of the structure of a multi-temperature zone module provided in an embodiment of this disclosure;

[0022] Figure 4 This is an exploded view of another multi-temperature zone module provided in an embodiment of this disclosure;

[0023] Figure 5 This is a cross-sectional schematic diagram of another multi-temperature zone module provided in an embodiment of this disclosure;

[0024] Figure 6 This is a schematic diagram of another cooling device provided in an embodiment of this disclosure;

[0025] Figure 7 This is a hardware schematic diagram of a cooling device provided in an embodiment of this disclosure;

[0026] Figure 8This is a schematic diagram of the structure of a refrigeration device provided in an embodiment of this disclosure;

[0027] Figure 9 This is a schematic diagram of another refrigeration device provided in an embodiment of this disclosure.

[0028] Figure label:

[0029] 1: Multi-temperature zone module; 2: Base; 3: Semiconductor module; 4: Energy-consuming device; 5: Microcontroller; 3a: First end; 3b: Second end; 12: Housing; 13: Cup body; 14: Lid body; 15: Control module; 16: Base plate; 17: Heat-conducting sheet; 131: Handle; 161: Connecting rod; 16a: Bracket; 21: Base plate; 22: Side plate; 31: First heat-conducting element; 32: First electrical connection part; 33: Second heat-conducting element; 34: Second electrical connection part; 35: Third electrical connection part; 100: Door body. Detailed Implementation

[0030] To provide a more detailed understanding of the features and technical content of the embodiments of this disclosure, the implementation of the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for illustrative purposes only and are not intended to limit the embodiments of this disclosure. In the following technical description, for ease of explanation, several details are used to provide a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be simplified in their depiction to simplify the drawings.

[0031] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this disclosure described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0032] In this disclosure, the terms "upper," "lower," "inner," "middle," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for better description of the embodiments of this disclosure and their implementations, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to require them to be constructed and operated in a specific orientation. Furthermore, some of the aforementioned terms may be used to indicate other meanings besides orientation or positional relationship; for example, the term "upper" may in some cases indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in the embodiments of this disclosure according to the specific circumstances.

[0033] Furthermore, the terms "set up," "connect," and "fix" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure according to the specific circumstances.

[0034] Unless otherwise stated, the term "multiple" means two or more.

[0035] It should be noted that, unless otherwise specified, the embodiments and features described in the present disclosure can be combined with each other.

[0036] Combination Figure 1 , Figure 3 and Figure 7 As shown, this embodiment of the present disclosure provides a cooling device, including a multi-temperature zone module 1, which has a control module 15. The cooling device also includes a base 2, a semiconductor module 3, a power-consuming device 4, and a microcontroller 5. The base 2 is a sealed structure, with the multi-temperature zone module 1 disposed outside the base 2. The semiconductor module 3 is disposed inside the base 2, including a first end 3a for detecting the temperature of the multi-temperature zone module 2 and a second end 3b for detecting the ambient temperature. The power-consuming device 4 is disposed inside the base 2 and connected to the semiconductor module 3. The microcontroller 5 is connected to the semiconductor module 3 and configured to activate the power-consuming device 4 when the temperature of the multi-temperature zone module 1 and the ambient temperature meet a first preset condition.

[0037] The cooling apparatus provided in this embodiment is used inside a cooling device. The temperatures of the first and second ends of the semiconductor module are the temperature of the multi-temperature zone module and the ambient temperature, respectively. Because there is a temperature difference between the inside of the cooling device and the inside of the multi-temperature zone module, the temperature of the multi-temperature zone module is higher than the temperature inside the cooling device. A microcontroller converts the temperature difference between the two ends of the semiconductor module into electrical energy and consumes it through an energy-consuming device when the temperature of the multi-temperature zone module and the ambient temperature meet a first preset condition. This gradually reduces the temperature difference between the inside of the cooling device and the temperature of the multi-temperature zone module. Consequently, the temperature in the local area where the multi-temperature zone module is located slowly increases, reducing its impact on the temperature inside the cooling device and thus reducing the energy consumption of the cooling device.

[0038] Optionally, semiconductor module 3 is a semiconductor cooling chip.

[0039] Optionally, the first end 3a of the semiconductor module 3 includes a first thermally conductive element 31, a first electrical connection portion 32, and a second temperature sensor. The first thermally conductive element 31 is disposed inside the base 2. One end of the first electrical connection portion 32 is connected to the first thermally conductive element 31, and the other end of the first electrical connection portion 32 is connected to the control module 15. The second temperature sensor is connected to the microcontroller 5 and the first thermally conductive element 31, and is used to detect the temperature of the first thermally conductive element 31. In this way, the microcontroller obtains the temperature of the first thermally conductive element through the second temperature sensor, thereby obtaining the temperature of the multi-temperature zone module.

[0040] Optionally, the first electrical connection 32 can be a spring or a sheet spring.

[0041] Optionally, the base 2 can be a vacuum. This prevents heat from the base from dissipating into the cooling device, thus avoiding increased power consumption.

[0042] Optional, combined Figure 1 and Figure 2 As shown, the base 2 includes a base plate 21 and a side plate 22. A semiconductor module 3 and a power-consuming device 4 are disposed inside the base plate 21. The side plate 22 is located on one side of the base plate 21 and encloses the base plate 21 to accommodate the multi-temperature zone module 1. A first electrical connection portion 32 is disposed inside the side plate 22 and extends through the side plate 22. Thus, by placing the multi-temperature zone module above the base plate, the control module of the multi-temperature zone module and the first electrical connection portion can be connected.

[0043] Optional, combined Figure 2 As shown, the second end 3b of the semiconductor module 3 includes a second thermally conductive element 33 and a third temperature sensor (not shown in the figure). The second thermally conductive element 33 is disposed on the outside of the bottom of the base 2. The third temperature sensor is connected to the microcontroller 5 and the second thermally conductive element 33 and is used to detect the temperature of the second thermally conductive element 33. In this way, the microcontroller can obtain the temperature of the second thermally conductive element through the third temperature sensor. Since the second thermally conductive element is disposed outside the base, the ambient temperature value can be obtained based on the temperature value of the third temperature sensor.

[0044] Optionally, the first heat-conducting element 31 and the second heat-conducting element 33 are heat-conducting plates. In this way, since the heat-conducting plate is made of a heat-conducting material and has good heat conduction function, the temperature of the first heat-conducting element is well consistent with that of the multi-temperature zone module, and the temperature of the second heat-conducting element is well consistent with that of the ambient temperature.

[0045] Optionally, the first preset condition includes that the temperature difference between the multi-temperature zone module 1 and the ambient temperature is greater than or equal to a preset temperature. The preset temperature is the temperature value corresponding to the conduction of the semiconductor module 3. Thus, when the semiconductor module is turned on, it generates current, the microcontroller activates the energy-consuming circuit, and converts the temperature difference across the semiconductor module into electrical energy, which is then dissipated through the energy-consuming device, thereby gradually reducing the temperature difference between the internal temperature of the cooling equipment and the temperature of the multi-temperature zone module.

[0046] Optionally, the power-consuming module 4 includes a lamp panel. In this way, when the temperature difference between the multi-temperature zone module and the ambient temperature is greater than or equal to a preset temperature, the semiconductor module is turned on, and the temperature difference across the semiconductor module is converted into electrical energy to drive the lamp panel to light up.

[0047] Optionally, the microcontroller 5 is also configured to adjust the energy consumption state of the energy-consuming device 4 when the energy-consuming device 4 is turned on and the temperature of the multi-temperature zone module 1 meets the second preset condition with respect to the ambient temperature. In this way, the energy consumption state of the energy-consuming device is set according to actual needs, so that the energy consumption state corresponds to the working mode of the multi-temperature zone module, and the working mode of the multi-temperature zone module can be determined based on the energy consumption state.

[0048] Optionally, energy-consuming device 4 is a lighting device. The energy consumption state is the lighting state of the lighting device. The lighting state includes lighting color, lighting brightness, or lighting flicker frequency. In this way, the user can determine the operating mode of the multi-temperature zone module based on the lighting state of the lighting device.

[0049] Optionally, the lighting device includes a light panel. In this case, when the lighting device is a light panel, the lighting state is set to the light color of the light panel, and the light panel's operating mode is set to red light mode, blue light mode, and off mode. The red light mode corresponds to the cooling state of the multi-temperature zone module, and the blue light mode corresponds to the heating state of the multi-temperature zone module. When the light panel displays blue, it indicates that the light panel is in blue mode, the first heat-conducting element is in cooling mode, and the multi-temperature zone module is in heating mode. When the light panel displays red, it indicates that the light panel is in red mode, the first heat-conducting element is in heating mode, and the multi-temperature zone module is in cooling mode. When the light panel is off, it indicates that the light panel is in off mode, and the multi-temperature zone module is in either cooling or heating mode.

[0050] Optionally, the second preset condition includes:

[0051] When the temperature difference between the multi-temperature zone module 1 and the ambient temperature falls within the first temperature range, the energy-consuming device 4 is adjusted to the first energy-consuming state.

[0052] When the temperature difference between the multi-temperature zone module 1 and the ambient temperature falls within the second temperature range, the energy-consuming device 4 is adjusted to the second energy-consuming state.

[0053] When the temperature difference between the multi-temperature zone module 1 and the ambient temperature falls into the third temperature zone, the energy-consuming device 4 is adjusted to the third energy-consuming state.

[0054] The first energy consumption state, the second energy consumption state, and the third energy consumption state represent different working states of the energy consumption device 4, and correspond to the working mode of the multi-temperature zone module.

[0055] In practical applications, combined with Figure 4 and Figure 5 As shown, the multi-temperature zone module 1 includes a housing 12, a cup body 13, a cover 14, a heat-conducting plate 17, and a base plate 16. The housing 12 is a hollow cylindrical structure filled with inert gas. The cup body 13 is disposed inside the housing 12. The cover 14 is disposed on the top of the housing 12 and hinged to the top of the housing 12. The heat-conducting plate 17 is located at the bottom of the body 13. The body 13 is a hollow cylindrical structure. A handle 131 is provided on the top of the body 13. The base plate 16 is disposed at the bottom of the housing 12. A control module 15 and a bracket 16a are provided above the base plate 16. The control module 15 includes a drive circuit, a fourth temperature sensor, and a battery. The battery and the drive circuit are connected. The bracket 16a is located on one side of the control module 15. A connecting rod 161 is installed inside the bracket 16a. The connecting rod 161 includes a first end and a second end. The first end is detachably disposed inside the bracket 16a, and the second end abuts against the outer wall of the control module 15 and is connected to the control module 15. In this way, a space for refrigerating beverages is formed inside the cup. The drive circuit adjusts the temperature of the multi-temperature zone module based on the temperature value detected by the fourth temperature sensor. With the multi-temperature zone module placed inside the base, the fixing plate connects to the first electrical connection part, thereby connecting the first electrical connection part to the control module. Thus, when the temperature of the multi-temperature zone module and the ambient temperature meet a first preset condition, the microcontroller converts the temperature difference across the semiconductor module into electrical energy and consumes it through an energy-consuming device, thereby gradually reducing the temperature difference between the inside of the refrigeration equipment and the temperature of the multi-temperature zone module.

[0056] Optionally, the multi-temperature zone module 1 also includes a handle. The handle 131 is hinged to the top of the cup body 13. This facilitates the taking and placing of the cup.

[0057] Optionally, the control module 15 also includes a pressure sensor and a wireless communication module. The pressure sensor and wireless communication module are connected to the drive circuit. Thus, the control module can obtain the pressure value of the beverage inside the cup based on the pressure sensor, and this pressure value can indicate the remaining amount of beverage. When the user connects to the wireless communication module using a terminal device, the control module feeds back the pressure value to the external terminal device connected to the wireless communication module, allowing the user to know the remaining amount of beverage inside the cup in real time. When this multi-temperature zone module is applied to a refrigeration device and the refrigeration device has a display screen, the control module feeds back the pressure value to the display screen via the wireless communication module to indicate the remaining amount of beverage inside the cup to the user.

[0058] This disclosure also provides a cooling device, including multiple multi-temperature zone modules 1, each multi-temperature zone module 1 having a control module 15. The cooling device further includes a base 2, a semiconductor module 3, a power-consuming device 4, and a microcontroller 5. The base 2 is a sealed structure. All multi-temperature zone modules 1 are disposed outside the base 2. The semiconductor module 3 is disposed inside the base 2, including a first end 3a for detecting the temperature of any multi-temperature zone module 1 and a second end 3b for detecting the ambient temperature. The power-consuming device 4 is disposed inside the base 2 and connected to the semiconductor module 3. The microcontroller 5 is connected to the semiconductor module 3 and configured to activate the power-consuming device 4 corresponding to any multi-temperature zone module 1 when the temperature of any multi-temperature zone module 1 and the ambient temperature meet a first preset condition. Each multi-temperature zone module 1 corresponds to one semiconductor module 3 and one power-consuming device 4.

[0059] Using the cooling apparatus provided in this embodiment, when applied inside a cooling device, the temperatures of the first and second ends of the semiconductor module are respectively the temperature of any multi-temperature zone module and the ambient temperature. Because a temperature difference exists between the inside of the cooling device and the inside of all the multi-temperature zone modules, the temperature of all the multi-temperature zone modules is higher than the temperature inside the cooling device. By using a microcontroller, under the condition that the temperature of any multi-temperature zone module and the ambient temperature meet a first preset condition, the temperature difference between the two ends of the semiconductor module is converted into electrical energy and consumed by the energy-consuming device corresponding to that multi-temperature zone module, thereby gradually reducing the temperature difference between the inside of the cooling device and the temperature of the multi-temperature zone module. This causes the temperature of the local area where the multi-temperature zone module is located to rise slowly, thereby reducing the impact on the temperature inside the cooling device and thus reducing the energy consumption of the cooling device.

[0060] Optional, combined Figure 6As shown, the first end 3a of the semiconductor module 3 includes a third thermally conductive element (not shown), a second electrical connection 34, and a second temperature sensor. The third thermally conductive element is disposed inside the base 2. One end of the second electrical connection 34 is connected to the third thermally conductive element, and the other end of the second electrical connection 34 is connected to one of the multiple control modules 15. The second temperature sensor is connected to the microcontroller 5 and the third thermally conductive element to detect the temperature of the third thermally conductive element. In this way, the microcontroller can obtain the temperature of the multi-temperature zone module corresponding to the control module through the third thermally conductive element.

[0061] Optionally, the third heat-conducting element can be an integrated structure. In this way, due to the excellent heat conduction function of the third heat-conducting element, heat can be transferred between the corresponding third heat-conducting elements in multiple multi-temperature zone modules, thereby reducing energy consumption.

[0062] Optionally, the third heat-conducting element is a heat-conducting plate. Since the heat-conducting plate is made of a thermally conductive material and has excellent heat conduction capabilities, the temperature of the third heat-conducting element and the multi-temperature zone module exhibits good consistency.

[0063] Left view of the refrigeration equipment as shown Figure 8 As shown, the main view of the refrigeration equipment is as follows: Figure 9 As shown in the figure. This disclosure also provides a refrigeration device, including a cabinet (not shown), a door 100, and a refrigeration device as described above. The door 100 and the cabinet enclose a refrigeration space. A base 2 can be installed on the door 100 and located inside the refrigeration space. The ambient temperature represents the temperature of the refrigeration space. Thus, by using a microcontroller, under the condition that the temperature of the multi-temperature zone module and the temperature of the refrigeration space meet a first preset condition, the temperature difference across the semiconductor module is converted into electrical energy and consumed by the energy-consuming device, thereby gradually reducing the temperature difference between the inside of the refrigeration device and the temperature of the multi-temperature zone module. This causes the temperature of the local area where the multi-temperature zone module is located to rise slowly, thereby reducing the impact on the temperature inside the refrigeration device and thus reducing the energy consumption of the refrigeration device.

[0064] Optional, combined Figure 6 As shown, the refrigeration device also includes a third electrical connection 35 and a power supply. The third electrical connection 35 can be installed on the base 2 and connected to the microcontroller 5. The power supply is located inside the door 100 and connected to the third electrical connection 35. In this way, the microcontroller is powered by the power supply.

[0065] Optionally, the third electrical connection 35 is a charging copper post or a spring pin.

[0066] Optional, combined Figure 9As shown, all multi-temperature zones 1 are arranged in parallel above the base 2. This allows users to store different types of beverages in the corresponding multi-temperature zones according to their needs, thus achieving beverage refrigeration.

[0067] The foregoing description and accompanying drawings fully illustrate embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included or substituted for parts and features of other embodiments. Embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from its scope. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A device for refrigeration, comprising a multi-temperature zone module, wherein the multi-temperature zone module is equipped with a control module, characterized in that, Also includes: The base is a sealed structure, and the multi-temperature zone module is located outside the base. A semiconductor module, disposed inside the base, includes a first end for detecting the temperature of the multi-temperature zone module and a second end for detecting the ambient temperature. An energy-consuming device is disposed inside the base and connected to the semiconductor module; A microcontroller, connected to the semiconductor module, is configured to turn on the power-consuming device when the temperature of the multi-temperature zone module and the ambient temperature meet a first preset condition. The first preset condition includes: the difference between the temperature of the multi-temperature zone module and the ambient temperature is greater than or equal to a preset temperature; the preset temperature is the temperature value corresponding to the conduction of the semiconductor module.

2. The refrigeration apparatus according to claim 1, characterized in that, The first end of the semiconductor module includes: A first heat-conducting element is disposed inside the base; The first electrical connection part has one end connected to the first heat-conducting element and the other end connected to the control module; A second temperature sensor, connected to the microcontroller and the first thermally conductive element, is used to detect the temperature of the first thermally conductive element.

3. The refrigeration apparatus according to claim 2, characterized in that, The base includes: The base plate contains the semiconductor module and the energy-consuming device. A side plate is disposed on one side of the base plate and surrounds the base plate to accommodate the multi-temperature zone module. The first electrical connection part is disposed inside the side plate and penetrates the side plate.

4. The refrigeration apparatus according to claim 1, characterized in that, The second end of the semiconductor module includes: The second heat-conducting element is disposed on the bottom outside of the base; A third temperature sensor, connected to the microcontroller and the second thermally conductive element, is used to detect the temperature of the second thermally conductive element.

5. The apparatus for refrigeration according to any one of claims 1 to 4, characterized in that, The microcontroller is also configured to adjust the energy consumption state of the energy-consuming device when the energy-consuming device is turned on and the temperature of the multi-temperature zone module meets the second preset condition with respect to the ambient temperature.

6. A device for refrigeration, comprising multiple multi-temperature zone modules, each multi-temperature zone module being equipped with a control module, characterized in that, Also includes: The base is a sealed structure, and all multi-temperature zone modules are located on the outside of the base. A semiconductor module, disposed inside the base, includes a first end for detecting the temperature of the corresponding multi-temperature zone module and a second end for detecting the ambient temperature. An energy-consuming device is disposed inside the base and connected to the semiconductor module; A microcontroller, connected to the semiconductor module, is configured to turn on the energy-consuming device corresponding to any multi-temperature zone module when the temperature of any multi-temperature zone module and the ambient temperature meet a first preset condition. One multi-temperature zone module corresponds to one semiconductor module and one power consumption device; The first preset condition includes that the difference between the temperature of the multi-temperature zone module and the ambient temperature is greater than or equal to a preset temperature; the preset temperature is the temperature value corresponding to the conduction of the semiconductor module.

7. The apparatus for refrigeration according to claim 6, characterized in that, The first end of the semiconductor module includes: A third heat-conducting element is disposed inside the base; The second electrical connection part is connected at one end to the third heat-conducting element and at the other end to one of the multiple control modules; The second temperature sensor is connected to the microcontroller and the third thermally conductive element, and is used to detect the temperature of the third thermally conductive element.

8. A refrigeration device, characterized in that, include: Cabinet; The door, together with the cabinet, encloses a cooling space; as well as The device for refrigeration as described in any one of claims 1 to 5; wherein the base is mounted on the door and located inside the refrigeration space.

9. The device according to claim 8, characterized in that, Also includes: The third electrical connection part is installed on the base and connected to the microcontroller; The power supply is located inside the door and is connected to the third electrical connection part.

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