Substrate processing apparatus and substrate processing method

Abstract

The present invention provides a substrate processing apparatus and a substrate processing method for miniaturizing a substrate processing apparatus for supercritical drying. A substrate processing apparatus replaces a liquid film formed on an upper surface of a horizontal substrate with a supercritical fluid, and dries the substrate. The substrate processing apparatus includes a pressure vessel, a lid, and a support. The pressure vessel forms a drying chamber for the substrate inside. The lid closes an opening of the drying chamber. The support supports the substrate horizontally in the drying chamber. The support is fixed to the drying chamber.

Description

Technical Field

[0001] This disclosure relates to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] Patent Document 1 describes a drying apparatus that replaces a liquid film formed on the upper surface of a horizontal substrate with a supercritical fluid to dry the substrate. This drying apparatus includes a rectangular box-shaped container body, a lid, and a substrate mounting stage. The lid and substrate mounting stage also function as a feeding and discharging mechanism for the substrate, and are configured to be able to move forward and backward. The same technology is also disclosed in Patent Document 2.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2013-254904

[0006] Patent Document 2: Japanese Patent Application Publication No. 2019-67863 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] One technical solution disclosed herein provides a technique for miniaturizing a substrate processing apparatus for supercritical drying.

[0009] Solution for solving the problem

[0010] A substrate processing apparatus disclosed herein replaces a liquid film formed on the upper surface of a horizontal substrate with a supercritical fluid to dry the substrate. The substrate processing apparatus includes a pressure vessel, a cover, and a support. The pressure vessel forms a drying chamber for the substrate inside. The cover closes the opening of the drying chamber. The support horizontally supports the substrate within the drying chamber. The support is fixed to the drying chamber.

[0011] The effects of the invention

[0012] According to a technical solution disclosed herein, a substrate processing apparatus for supercritical drying can be miniaturized. Attached Figure Description

[0013] Figure 1 This is a top view of a substrate processing apparatus according to one embodiment.

[0014] Figure 2 This is a front view of a substrate processing apparatus according to one embodiment.

[0015] Figure 3 This is a side view of a substrate processing apparatus according to one embodiment.

[0016] Figure 4 This is a flowchart illustrating a substrate processing method according to one embodiment.

[0017] Figure 5 (A) is a cross-sectional view showing an example of the standby position of the cover. Figure 5 (B) is a cross-sectional view showing an example of the open position of the cover. Figure 5 (C) is a cross-sectional view showing an example of the closed position of the cover.

[0018] Figure 6 (A) is a horizontal sectional view showing an example of a rectifier plate. Figure 6 (B) is along Figure 6 A sectional view of line B-B in (A). Figure 6 (C) is along Figure 6 A cross-sectional view of line C-C of (A).

[0019] Figure 7 (A) is a horizontal cross-sectional view showing an example of flow during pressure increase. Figure 7 (B) is a vertical sectional view showing an example of flow during pressure increase.

[0020] Figure 8 (A) is a horizontal sectional view showing an example of flow during purging. Figure 8 (B) is a vertical sectional view showing an example of flow during purging.

[0021] Figure 9 (A) is a side view showing the state of the drying unit when fluid is supplied. Figure 9 (B) is along Figure 9 A cross-sectional view of line B-B of (A).

[0022] Figure 10 (A) is a side view showing the state of the substrate being fed into and out of the drying unit. Figure 10 (B) is along Figure 10 A cross-sectional view of line B-B of (A).

[0023] Figure 11 (A) is a cross-sectional view showing an example of the state when the lock key begins to rise. Figure 11 (B) is a cross-sectional view of an example of the state when the lock key is fully extended.

[0024] Figure 12 It means Figure 4 A flowchart of an example of S4.

[0025] Figure 13 This is a top view of the substrate processing apparatus of the first modified example.

[0026] Figure 14 This is a front view of the substrate processing apparatus of the first modified example.

[0027] Figure 15 This is a top view of the substrate processing apparatus of the second modified example.

[0028] Figure 16 This is a side view of the substrate processing apparatus of the second modified example.

[0029] Figure 17 (A) is a vertical sectional view of the first modified example of flow during pressure increase. Figure 17 (B) is a vertical sectional view of the first modified example of the flow during purging.

[0030] Figure 18 (A) is a vertical sectional view of the second modified example of flow during pressure increase. Figure 18 (B) is a vertical sectional view of the second variation of the flow during purging. Detailed Implementation

[0031] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. Furthermore, the same or corresponding structures are labeled with the same reference numerals in the various drawings, and descriptions are sometimes omitted. In this specification, the X-axis, Y-axis, and Z-axis are mutually perpendicular directions. The X-axis and Y-axis are horizontal directions, and the Z-axis is a vertical direction.

[0032] First, refer to Figures 1-3 The substrate processing apparatus 1 of the embodiment will be described below. Figure 1 As shown, the substrate processing apparatus 1 includes an infeed / outfeed station 2 and a processing station 3. The infeed / outfeed station 2 and the processing station 3 are arranged adjacent to each other in the X-axis direction.

[0033] The infeed / outfeed station 2 includes a loading platform 21, a conveying section 22, and a transfer section 23. The loading platform 21 is used to load multiple carriers C. The multiple carriers C respectively hold multiple horizontal substrates W at intervals in the vertical direction.

[0034] The substrate W includes a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, or a glass substrate. The substrate W may also include electronic circuits or other devices formed on the surface of the semiconductor substrate or glass substrate. The substrate W may also have raised or recessed patterns on its surface.

[0035] The conveying section 22 is disposed adjacent to the mounting stage 21. A first conveying device 22a is disposed inside the conveying section 22. The first conveying device 22a conveys the substrate W inside the conveying section 22 and conveys the substrate W between a plurality of devices disposed next to the conveying section 22.

[0036] The first conveying device 22a includes a first conveying arm for holding the substrate W. The first conveying arm is capable of moving in both the horizontal (X-axis and Y-axis) and vertical directions, and rotating about the vertical axis. There can be one or more first conveying arms.

[0037] The transfer section 23 is disposed adjacent to the conveying section 22. The transfer section 23 has a conveying device 23a for temporarily storing the substrate W. Alternatively, as shown below... Figure 2 As shown, multiple conveying devices 23a are stacked in the vertical direction. However, the configuration and number of conveying devices 23a are not particularly limited.

[0038] Processing station 3 includes a conveying module 31 and multiple processing modules 32. The conveying module 31 is disposed adjacent to the junction 23. The conveying module 31 is cuboid in shape. A second conveying device 31a is disposed inside the conveying module 31. The second conveying device 31a conveys the substrate W between multiple devices disposed next to the conveying module 31.

[0039] The second conveying device 31a includes a second conveying arm for holding the substrate W. The second conveying arm is capable of moving in both the horizontal (X-axis and Y-axis) and vertical directions, and rotating about the vertical axis. There can be one or more second conveying arms.

[0040] The processing module 32 is arranged adjacent to the conveying module 31. Multiple processing modules 32 may also be provided. Figure 1 As shown, if multiple processing modules 32 are symmetrically arranged on both sides of the conveying module 31 in the Y-axis direction, the deviation in processing time of the substrate W can be reduced among the multiple processing modules 32, and the deviation in processing quality of the substrate W can be reduced. Furthermore, as... Figure 2 As shown, if multiple processing modules 32 are stacked in the vertical direction, the installation area of ​​the processing modules 32 can be reduced. However, the configuration and number of processing modules 32 are not particularly limited.

[0041] In the case where multiple processing modules 32 are stacked in the vertical direction, such as Figure 3 As shown, multiple transport modules 31 can also be stacked vertically. The number of layers of transport modules 31 is the same as the number of layers of processing modules 32. Multiple substrates W can be transported simultaneously at different heights, increasing the number of substrates W processed per unit time. However, the configuration and number of transport modules 31 are not particularly limited.

[0042] The processing module 32 includes a liquid film forming unit 32a, a drying unit 32b, and a supply unit 32c. Alternatively, the processing module 32 may have multiple (e.g., two sets) groups of liquid film forming units 32a, drying units 32b, and supply units 32c. As will be described later, according to this embodiment, since the drying unit 32b can be miniaturized, even if the number of various units is increased, the enlargement of the processing module 32 can be suppressed.

[0043] The liquid film forming unit 32a supplies liquid to the upper surface of a horizontal substrate W. The liquid film forming unit 32a includes, for example, a rotating chuck that horizontally holds the substrate W and a nozzle that sprays liquid onto the upper surface of the substrate W. The nozzle supplies liquid to the center of the upper surface of the rotating substrate W. Under the action of centrifugal force, the liquid wets and spreads from the center of the upper surface of the substrate W towards the periphery. The liquid may be, for example, a chemical solution, a rinsing solution, and a drying solution supplied sequentially. Multiple types of chemical solutions can be supplied, or a rinsing solution can be supplied between the supply of one chemical solution and the supply of other chemical solutions.

[0044] The liquid film forming unit 32a forms, for example, a liquid film of a chemical solution on the upper surface of a horizontal substrate W. Next, the liquid film of the chemical solution is replaced with a liquid film of a rinsing solution, and then the liquid film of the rinsing solution is replaced with a liquid film of a drying solution. The chemical solution is, for example, SC1 (aqueous solution of ammonia and hydrogen peroxide) or DHF (dilute hydrofluoric acid). The rinsing solution is, for example, DIW (deionized water). The drying solution is, for example, an organic solvent such as IPA (isopropanol).

[0045] Drying unit 32b replaces the liquid film formed on the upper surface of the horizontal substrate W with a supercritical fluid to dry the substrate W. A supercritical fluid is a fluid that exists at temperatures above its critical temperature and pressure above its critical pressure; it is a fluid whose liquid and gas states cannot be distinguished. By replacing the liquid film, such as the drying liquid, with a supercritical fluid, the collapse of the uneven pattern on the substrate W caused by surface tension can be suppressed. Details of drying unit 32b will be described later.

[0046] The supply unit 32c supplies fluid to the drying unit 32b. Specifically, the supply unit 32c includes a supply device assembly having a flow meter, a flow regulator, a back pressure valve, and a heater, and a housing for housing the supply device assembly. The supply unit 32c supplies the drying unit 32b with a fluid, such as CO2.

[0047] Viewed from above, the liquid film forming unit 32a and the drying unit 32b included in the same processing module 32 are connected to the long side of the rectangular conveying module 31. The multiple liquid film forming units 32a included in the same processing module 32 are adjacent to each other and are arranged closer to the conveying device 23a than the drying unit 32b.

[0048] Viewed from above, the drying unit 32b and supply unit 32c included in the same processing module 32 are arranged alternately in the X-axis direction. The supply unit 32c supplies fluid to the drying unit 32b adjacent to it on the negative X-axis side. The supply unit 32c may or may not be adjacent to the delivery module 31. This is because the substrate W is not fed into or out of the supply unit 32c.

[0049] Viewed from above, the processing module 32 protrudes further in the positive X-axis direction than the conveying module 31. A supply unit 32c is disposed in this protruding portion. The supply unit 32c is open on three sides (positive Y-axis direction, negative Y-axis direction, and positive X-axis direction), facilitating good workability during maintenance.

[0050] In the case where multiple processing modules 32 are provided, the second conveying device 31a conveys a substrate W between multiple units included in the same processing module 32 (e.g., between the liquid film forming unit 32a and the drying unit 32b). The second conveying device 31a does not convey the substrate W between multiple processing modules 32.

[0051] The substrate processing apparatus 1 includes a control device 4. The control device 4 is, for example, a computer, including a CPU (Central Processing Unit) 41 and a storage medium 42 such as a memory. The storage medium 42 stores programs that control various processes executed in the substrate processing apparatus 1. The control device 4 controls the operation of the substrate processing apparatus 1 by executing the programs stored in the storage medium 42 on the CPU 41.

[0052] Next, refer to Figure 4 The operation of the substrate processing apparatus 1 will be explained. It is performed under the control of the control device 4. Figure 4 The steps S1 to S4 are shown.

[0053] First, the first conveying device 22a removes the substrate W from the carrier C and conveys the removed substrate W to the conveying device 23a. Next, the second conveying device 31a removes the substrate W from the conveying device 23a and conveys the removed substrate W to the liquid film forming unit 32a.

[0054] Next, the liquid film forming unit 32a supplies a chemical solution to the upper surface of the horizontal substrate W (S1). The chemical solution is supplied to the center of the upper surface of the rotating substrate W and spreads radially across the entire upper surface under the action of centrifugal force to form a liquid film.

[0055] Next, the liquid film forming unit 32a supplies rinsing liquid (S2) to the upper surface of the horizontal substrate W. The rinsing liquid is supplied to the center of the upper surface of the rotating substrate W and expands radially across the entire upper surface under the action of centrifugal force, forming a liquid film. The liquid film of the chemical solution is replaced by the liquid film of the rinsing liquid.

[0056] Next, the liquid film forming unit 32a supplies drying liquid to the upper surface of the horizontal substrate W (S3). The drying liquid is supplied to the center of the upper surface of the rotating substrate W and expands radially across the entire upper surface under the action of centrifugal force to form a liquid film. The liquid film of the rinsing liquid is replaced by the liquid film of the drying liquid.

[0057] Next, the second conveying device 31a removes the substrate W from the liquid film forming unit 32a and conveys the removed substrate W to the drying unit 32b.

[0058] Next, drying unit 32b replaces the liquid film formed on the upper surface of the horizontal substrate W with a supercritical fluid, thereby drying the substrate W (S4). By replacing the liquid film of the drying liquid or the like with a supercritical fluid, the appearance of a liquid-gas interface on the uneven pattern of the substrate W can be suppressed. As a result, the generation of surface tension can be suppressed, and the collapse of the uneven pattern can be prevented.

[0059] Finally, the second conveying device 31a removes the substrate W from the drying unit 32b and conveys the removed substrate W to the conveying device 23a. Next, the first conveying device 22a removes the substrate W from the conveying device 23a and stores the removed substrate W in the carrier C.

[0060] Next, refer to Figure 5 The drying unit 32b will be described below. Figure 5 The drying unit 32b shown is positioned on the positive Y-axis side of the conveying module 31. In the description of the drying unit 32b, the feeding direction (in which the substrate W is fed into the drying chamber S) is... Figure 5 The direction in which the substrate W is sent out from the drying chamber S (with the positive Y-axis in the middle) is taken as the front, and the direction of sending out the substrate W is taken as the front (in the middle). Figure 5 (The middle part is the negative Y-axis direction) will be explained later.

[0061] The drying unit 32b includes a pressure vessel 51 that forms a drying chamber S inside the substrate W, a cover 52 that closes a first opening Sa of the drying chamber S, and a support 53 that holds the substrate W horizontally within the drying chamber S. The first opening Sa is the inlet and outlet for the substrate W. The substrate W is fed into the drying chamber S through the first opening Sa, dried in the drying chamber S, and then discharged from the drying chamber S through the first opening Sa.

[0062] Pressure vessel 51 includes, for example, a lower wall 51a, an upper wall 51b, a front wall 51c, a rear wall 51d, and a pair of side walls 51e and 51f (see reference). Figure 6 (etc.), forming a drying chamber S inside it. The drying chamber S is, for example, cuboid in shape. A rectangular first opening Sa is formed in the rear wall 51d, and a rectangular second opening Sb is formed in the front wall 51c.

[0063] The cover 52 is located behind the rear wall 51d. The cover 52 can be in the closed position (see reference). Figure 5 (C) and open locations (e.g., refer to) Figure 5 The cover 52 moves between (B) and (C). The closed position is where the cover 52 closes the first opening Sa. The open position is located behind the closed position and is where the cover 52 opens the first opening Sa.

[0064] However, in Patent Documents 1 and 2, the support 53 is fixed relative to the cover 52 and moves forward and backward together with the cover 52. The support 53 is not fixed to the drying chamber S, and the support 53 and the second conveying device 31a are connected to the substrate W outside the pressure vessel 51. Therefore, a region for the substrate W is provided outside the pressure vessel 51.

[0065] In contrast, in this embodiment, the support 53 is fixed relative to the pressure vessel 51 and does not move forward or backward with the cover 52. The support 53 is fixed to the drying chamber S, and the second conveying device 31a and the support 53 are connected to the substrate W in the drying chamber S. Therefore, the area outside the pressure vessel 51 where the substrate W is connected can be omitted, thus enabling the drying unit 32b to be miniaturized.

[0066] Furthermore, according to this embodiment, the support 53 is fixed to the drying chamber S, and unlike the case where the support 53 moves back and forth relative to the pressure vessel 51, no gaps are generated between the sliding parts. As a result, vibration of the support 53 can be suppressed, vibration of the substrate W can be suppressed, and spillage of the liquid film LF can be suppressed.

[0067] Unlike Patent Documents 1 and 2, the first opening Sa of the drying chamber S is positioned facing the conveying module 31. Even without rotating the second conveying arm of the second conveying device 31a around the vertical axis, the substrate W can be fed into the drying chamber S. This allows the substrate W to be fed into the drying chamber S without rotating it, preventing the drying liquid from splashing off the upper surface of the substrate W.

[0068] Position the cover 52 in the open position and the standby position (see reference). Figure 5 The cover 52 rotates between (A) to facilitate the entry of the second conveying device 31a into the drying chamber S. The standby position is a position deviated from the feeding and feeding path of the substrate W. When the substrate W is fed in or out, the cover 52 is in the standby position. As a result, interference between the cover 52 and the substrate W can be avoided.

[0069] like Figure 6 (A) Figure 6 As shown in (C), the support 53 includes a rectifier plate 53a for adjusting the flow of fluid in the drying chamber S and a mounting portion 53b fixed to the upper surface of the rectifier plate 53a. The rectifier plate 53a is fixed to the drying chamber S. The substrate W is mounted on the mounting portion 53b.

[0070] like Figure 6 As shown in (B), the mounting portion 53b forms a gap between the substrate W and the rectifier plate 53a, thereby suppressing contamination of the lower surface of the substrate W. The mounting portion 53b includes, for example, multiple support pins. The multiple support pins support the lower surface of the substrate W, but may also support the periphery of the substrate W.

[0071] When viewed from the first opening Sa of the drying chamber S, the rectifier plate 53a is U-shaped, having a horizontal plate 53a1 mounted on the lower wall 51a of the pressure vessel 51 and a pair of vertical plates 53a2 and 53a3 located at both ends of the horizontal plate 53a1 in the X-axis direction. The pair of vertical plates 53a2 and 53a3 are fixed relative to the side walls 51e and 51f of the pressure vessel 51. For example, threaded holes are provided in the pair of vertical plates 53a2 and 53a3 respectively. Screws 54 are screwed into the threaded holes of the vertical plates 53a2 and 53a3 and the threaded holes of the side walls 51e and 51f to fix the rectifier plate 53a relative to the pressure vessel 51.

[0072] like Figure 6 As shown in (A), in top view, the rectifier plate 53a includes an outlet 53a4 on the outer side of the substrate W supported by the support body 53. The outlet 53a4 is a hole for discharging fluid from the top to the bottom of the rectifier plate 53a. The flow of fluid in the drying chamber S is determined by the position of the outlet 53a4. The outlet 53a4 is provided, for example, in a straight line at the rear end edge of the horizontal plate 53a1. The length of the outlet 53a4 is longer than the diameter of the substrate W.

[0073] Furthermore, when viewed from above, the rectifier plate 53a includes a supply port 53a5 on the outer side of the substrate W supported by the support body 53. The supply port 53a5 is a hole for supplying fluid from below to above the rectifier plate 53a. The flow of fluid in the drying chamber S is determined by the position of the supply port 53a5. For example, multiple supply ports 53a5 are provided at each of the four corners of the horizontal plate 53a1. In addition, the position and number of supply ports 53a5 are not particularly limited. For example, multiple supply ports 53a5 may be arranged in a ring along the periphery of the substrate W.

[0074] like Figure 6 As shown in (C), the pressure vessel 51 includes a discharge port 51g for discharging fluid from the drying chamber S and a supply port 51h for supplying fluid to the drying chamber S. The discharge port 51g and the supply port 51h are formed on the lower wall 51a of the pressure vessel 51. A flow straightener 53a is mounted on the lower wall 51a.

[0075] A first flow path CH1 connecting the outlet 53a4 and the discharge port 51g, and a second flow path CH2 connecting the supply port 53a5 and the supply port 51h are independently formed on the lower surface of the rectifier plate 53a. The first flow path CH1 and the second flow path CH2 are grooves formed on the lower surface of the rectifier plate 53a. Since the first flow path CH1 and the second flow path CH2 are not connected, the discharge of fluid from the drying chamber S and the supply of fluid to the drying chamber S can be carried out separately.

[0076] The supply port 51h is formed, for example, at the center of the lower wall 51a. The second flow path CH2 is formed radially from the center of the rectifier plate 53a toward the four corners. Since the distance from the center of the rectifier plate 53a to the four corners is equal, the fluid can be evenly distributed toward the four corners of the rectifier plate 53a.

[0077] On the other hand, the discharge port 51g is formed behind the supply port 51h. The first flow path CH1 is formed not to be connected to the second flow path CH2, and becomes a straight line in a rectangular shape from the discharge port 51g backward. The discharge outlet 53a4 is arranged behind the discharge port 51g.

[0078] like Figure 9 and Figure 10 As shown, the drying unit 32b includes a support frame 54 for supporting the pressure vessel 51. The support frame 54 has, for example, a horizontal base plate 54a, multiple columns 54b projecting upwards from the base plate 54a, and horizontal plates 54c fixed to the upper surfaces of the columns 54b. A pair of horizontal plates 54c are provided at an open interval in the X-axis direction. The pressure vessel 51 is fixed on the pair of horizontal plates 54c.

[0079] The drying unit 32b includes a direct-acting mechanism 55 that moves the cover 52 back and forth between a closed position and an open position, and a rotation mechanism 56 that rotates the cover 52 between an open position and a standby position. The rotation mechanism 56 includes, for example, a rotating shaft 56a of the cover 52 and a rotary actuator 56b that rotates the rotating shaft 56a. On the other hand, the direct-acting mechanism 55 includes, for example, a sliding member 55a that holds a bearing of the rotating shaft 56a and a direct-acting actuator 55b that moves the sliding member 55a back and forth.

[0080] The rotation axis 56a of the cover 52 is symmetrically arranged on both sides of the cover 52 in the X-axis direction. The slider 55a is also symmetrically arranged on both sides of the cover 52 in the X-axis direction. The guides 55c of the slider 55a are respectively mounted on a pair of horizontal plates 54c. A rotary actuator 56b is fixed to one side of the slider 55a and can move forward and backward together with the slider 55a. A linear actuator 55b is fixed to one side of the horizontal plate 54c.

[0081] The direct-acting actuator 55b, for example, is a pneumatic cylinder that uses compressed air pressure to press the cover 52 against the pressure vessel 51. A sealing member (not shown) that seals the cover 52 and the pressure vessel 51 can be flattened by the driving force of the direct-acting actuator 55b, preventing the cover 52 from obstructing the movement of the locking key 57 when the locking key 57 (described later) is engaged in the fitting hole 51i of the upper wall 51b of the pressure vessel 51. Alternatively, the direct-acting actuator 55b may also include a motor and a ball screw that converts the rotational motion of the motor into linear motion of the cover 52.

[0082] The drying unit 32b includes a locking key 57 for limiting the retraction of the cover 52 from the closed position to the open position. The locking key 57 is embedded in the fitting hole 51i of the pressure vessel 51 to limit the retraction of the cover 52. Even if fluid is supplied to the drying chamber S and the pressure in the drying chamber S increases, the retraction of the cover 52 can be limited, thus preventing fluid leakage.

[0083] A fitting hole 51i is formed through the lower wall 51a and the upper wall 51b in the Z-axis direction. The lower wall 51a and the upper wall 51b protrude rearward beyond the rear wall 51d. A fitting hole 51i is formed in this protruding portion. Multiple fitting holes 51i are formed at intervals in the X-axis direction. Multiple locking keys 57 are also provided at intervals in the X-axis direction. The multiple locking keys 57 are respectively inserted into both the fitting holes 51i of the lower wall 51a and the fitting holes 51i of the upper wall 51b.

[0084] The number of locking keys 57 is not particularly limited, but for example, there may be three. Unlike the case where there are two locking keys 57, the central part of the cover 52 in the X-axis direction can also be pressed. As a result, it is possible to prevent the central part of the cover 52 in the X-axis direction from bulging out to a position further back than the end in the X-axis direction when the pressure of the drying chamber S rises due to the supply of fluid to the drying chamber S.

[0085] The drying unit 32b includes a thickness gauge 58 for measuring the thickness of a liquid film LF formed on the upper surface of the substrate W. The thickness gauge 58 irradiates the substrate W with a laser through a fitting hole 51i in the pressure vessel 51 (more specifically, the upper wall 51b) to measure the thickness of the liquid film LF. For example, the thickness gauge 58 measures the phase difference between reflected light from the upper surface of the liquid film LF and reflected light from the interface between the liquid film LF and the substrate W, thereby measuring the thickness of the liquid film LF. The coverage state of the liquid film LF over the substrate W can be checked, and it can be confirmed that the uneven pattern of the substrate W is covered by the liquid film LF. It is acceptable as long as the maximum thickness of the liquid film LF is greater than the height difference of the uneven pattern.

[0086] The fitting hole 51i of the pressure vessel 51 is located near the first opening Sa of the drying chamber S. A film thickness gauge 58 irradiates the substrate W with a laser through the fitting hole 51i, thus enabling the measurement of the liquid film LF thickness before the substrate W is fully placed in the drying chamber S. Therefore, the coverage of the liquid film LF over the substrate W can be checked before the liquid film LF is replaced by a supercritical fluid. Since the drying liquid is a highly volatile organic solvent, it is effective to measure the film thickness of the liquid film LF before the entire substrate W is placed in the drying chamber S.

[0087] The thickness gauge 58 measures the thickness of the liquid film LF during the process of feeding the substrate W into the drying chamber S using the second conveying device 31a. Alternatively, the thickness gauge 58 can repeatedly measure the film thickness while changing the measurement point using the second conveying device 31a. This allows for measurement of the liquid film LF at multiple points, enabling a comprehensive inspection of the upper surface of the substrate W.

[0088] Drying unit 32b includes a locking key 57 in the locked position (see reference). Figure 9 (B) and lock / unlock position (see reference) Figure 10 The lifting mechanism 59 moves up and down between (B)). The locking position is the position where the locking key 57 restricts the retraction of the cover 52, and is the position where the locking key 57 is inserted into the mating holes 51i of both the lower wall 51a and the upper wall 51b. The locking release position is the position where the locking key 57 allows the cover 52 to retract, and is the position where the locking key 57 is pulled downward from the mating hole 51i of the upper wall 51b. In order to prevent interference between the locking key 57 and the substrate W, the locking release position is set below the feeding and feeding path of the substrate W.

[0089] The lifting mechanism 59 includes, for example, a lifting platform 59a that carries a plurality of locking keys 57 and a direct-acting actuator 59b that raises and lowers the lifting platform 59a. The lifting platform 59a has a horizontal surface 59a1 on which the locking keys 57 are carried. The direct-acting actuator 59b is, for example, a pneumatic cylinder that raises and lowers the plurality of locking keys 57 by raising and lowering the lifting platform 59a. The direct-acting actuator 59b may also include a motor and a ball screw that converts the rotational motion of the motor into linear motion of the lifting platform 59a.

[0090] like Figure 11 As shown, the drying unit 32b may also include a rolling element 60 that is rotatably held in place by the locking key 57. The rolling element 60 is, for example, a ball, held so as to be rotatable about the center of the ball. The rolling element 60 may also be a roller.

[0091] When the lifting mechanism 59 raises the locking key 57 from the unlocked position to the locked position, the rolling element 60 rolls in contact with the cover 52 or the pressure vessel 51. The rolling element 60 can reduce frictional resistance and suppress the generation of particles caused by friction.

[0092] Unlike Patent Document 2, the rolling element 60 also has multiple components on the lower surface 57a of the locking key 57, which roll in contact with the horizontal surface 59a1 of the lifting mechanism 59. When the locking key 57 is raised, it can move horizontally inside the fitting hole 51i, thereby reducing frictional resistance.

[0093] The locking key 57 can also be raised or lowered with its rear surface 57b vertically upright. This is because, as described in Patent Document 2, when the locking key 57 is raised with its rear surface 57b tilted forward, the corner 57c of the upper surface of the locking key 57 may collide with the rear surface 52a of the cover 52.

[0094] Unlike Patent Document 2, the rolling elements 60 are provided in a plurality of spaced-apart configurations on the rear surface 57b of the locking key 57 in the Z-axis direction. Compared to the case of only one element, friction between the locking key 57 and the pressure vessel 51 can be suppressed. This is particularly effective when the rear surface 57b of the locking key 57 is vertically upright.

[0095] Alternatively, the locking key 57 may have an inclined surface 57d on its front surface that slopes downwards and forwards from the top, and a vertical surface 57e extending downwards from the bottom of the inclined surface 57d. By forming the inclined surface 57d, the corner 57c of the front end of the upper surface of the locking key 57 can be prevented from colliding with the rear surface 52a of the cover 52.

[0096] The rolling element 60 is also provided on the inclined surface 57d of the locking key 57, and rolls in contact with the rear surface 52a of the cover 52. The rear surface 52a of the cover 52 is opposite to the inclined surface 57d of the locking key 57, and is inclined from the top towards the bottom and then towards the front.

[0097] Next, refer to Figure 12 The details of S4 will be explained. It is implemented under the control of control device 4. Figure 12 The steps S41 to S45 are shown.

[0098] First, the second conveying device 31a horizontally holds the substrate W with the liquid film LF formed on it and feeds the substrate W into the drying chamber S inside the pressure vessel 51 (S41). During this process, the film thickness gauge 58 measures the film thickness of the liquid film LF. It is possible to confirm whether the uneven pattern of the substrate W is covered by the liquid film LF.

[0099] Next, the support 53 fixed to the drying chamber S receives the substrate W from the second conveying device 31a and horizontally supports the received substrate W. Then, the second conveying device 31a withdraws from the first opening Sa of the drying chamber S to the outside.

[0100] Next, the rotating mechanism 56 rotates the cover 52 from the standby position to the open position. Then, the direct-acting mechanism 55 moves the cover 52 from the open position to the closed position. As a result, the cover 52 closes the first opening Sa of the drying chamber S.

[0101] Next, the lifting mechanism 59 raises the locking key 57 from the unlocked position to the locked position. The locking key 57 presses against the cover 52 from the rear, restricting the cover 52 from moving backward. This can suppress fluid leakage in S42, which will be described later.

[0102] Next, supply unit 32c supplies fluids such as CO2 to drying chamber S, causing the pressure in drying chamber S to rise (S42). At this time, as... Figure 7 As shown in (B), fluid is supplied to the drying chamber S from the supply port 51h of the lower wall 51a. The fluid is ejected upwards from the supply port 53a5 of the rectifier plate 53a. Viewed from above, as... Figure 7 As shown in (A), multiple supply ports 53a5 are formed at each of the four corners of the rectifier plate 53a, and fluid flows from the outside of the substrate W towards the inside. A flow forms above the substrate from the periphery towards the center. Therefore, it is possible to suppress the liquid film LF from spilling onto the outside of the substrate W due to the fluid flow. Viewed from above, the supply ports 53a5 are positioned on the outside of the substrate W, so even if fluid is ejected directly upwards from the supply ports 53a5, the substrate W will not be shaken. During the period when the pressure in the drying chamber S is increased, fluid does not exit from the drying chamber S but accumulates in the drying chamber S. The pressure in the drying chamber S is increased to a set pressure above the critical pressure.

[0103] Next, the supply unit 32c supplies fluid to the drying chamber S, and the discharge unit (not shown) discharges fluid from the drying chamber S, while maintaining the pressure in the drying chamber S at a set pressure, and purging the drying liquid dissolved in the supercritical fluid (S43). At this time, as Figure 8 As shown in (B), fluid is supplied to the drying chamber S from the nozzle 61a of the second cover 61. The second cover 61 closes the second opening Sb of the drying chamber S and is positioned opposite to the cover 52. Figure 8 As shown in (A), the second cover 61 has multiple nozzles 61a spaced apart in the X-axis direction, forming a curtain-like airflow above the substrate W. The fluid dissolves the drying liquid in the liquid film LF as it passes over the substrate W. After passing over the substrate W, the fluid containing the dissolved drying liquid is discharged to the outside of the drying chamber S via the outlet 53a4 of the rectifier plate 53a. As a result, the liquid film LF is replaced with a supercritical fluid.

[0104] Next, the supply unit 32c stops supplying fluid to the drying chamber S, and the discharge unit (not shown) discharges fluid from the drying chamber S, reducing the pressure in the drying chamber S (S44). To shorten the decompression time, the discharge unit may also include a vacuum pump or an ejector, etc., reducing the pressure in the drying chamber S to approximately atmospheric pressure.

[0105] Next, the lifting mechanism 59 lowers the locking key 57 from the locked position to the unlocked position.

[0106] Next, the direct-acting mechanism 55 moves the cover 52 from the closed position to the open position. Then, the rotating mechanism 56 rotates the cover 52 from the open position to the standby position.

[0107] Next, the second conveying device 31a enters the drying chamber S inside the pressure vessel 51, receives the substrate W from the support 53, and delivers the received substrate W (S45).

[0108] Next, refer to Figure 13 and Figure 14 The substrate processing apparatus 1 of the first modified example will be described below. Hereinafter, the differences between this modified example and the above-described embodiment will be mainly explained. Figure 13 and Figure 14 As shown, in addition to the liquid film forming unit 32a, the drying unit 32b and the supply unit 32c, the processing module 32 of this modified example also includes an inspection unit 32d.

[0109] The inspection unit 32d inspects the coverage state of the liquid film LF covering the substrate W. The inspection unit 32d may include, for example, a weight gauge, which measures the weight of the substrate W to confirm whether the uneven pattern of the substrate W is covered by the liquid film LF. The inspection unit 32d may also include a film thickness gauge.

[0110] Even if the drying unit 32b does not include the film thickness gauge 58, as long as the processing module 32 includes the inspection unit 32d, the coverage state of the liquid film LF covering the substrate W can be inspected before supercritical drying. However, both the inspection unit 32d and the film thickness gauge 58 can also be used.

[0111] The formation of the liquid film LF, the inspection of the coverage state, and the drying of the substrate W are performed sequentially. Therefore, as... Figure 13 As shown, in a top view, the liquid film forming unit 32a, inspection unit 32d, and drying unit 32b included in the same processing module 32 are arranged in a row along the length of the rectangular transport module 31. During the transport of the substrate W from the liquid film forming unit 32a to the drying unit 32b, an inspection of the coverage state can be performed, thus shortening the transport path of the substrate W.

[0112] It could also be, such as Figure 14 As shown, the processing module 32 also includes a cleaning unit 32e. The cleaning unit 32e irradiates the substrate W with ultraviolet light to remove organic matter and other substances adhering to the substrate W. The ultraviolet irradiation is performed after the substrate W has dried, and is used to remove residues from the drying liquid or supercritical fluid.

[0113] like Figure 14 As shown, the installation area of ​​the processing module 32 can be reduced by stacking the cleaning unit 32e and the inspection unit 32d in the vertical direction. Either the cleaning unit 32e or the inspection unit 32d can be configured on top.

[0114] The processing module 32 includes one liquid film forming unit 32a, one drying unit 32b, one supply unit 32c, one inspection unit 32d, and one cleaning unit 32e. However, the type, number, and configuration of the units constituting the processing module 32 are not particularly limited. For example, the processing module 32 of this modified example includes both the inspection unit 32d and the cleaning unit 32e, but it may also include only one of them.

[0115] When the processing module 32 includes a cleaning unit 32e, in a top view, the liquid film forming unit 32a, the cleaning unit 32e, and the drying unit 32b included in the same processing module 32 are arranged in a row along the length of the rectangular transport module 31. The substrate W can be cleaned midway through transporting it from the drying unit 32b to the transport device 23a, thus shortening the transport path of the substrate W.

[0116] Next, refer to Figure 15 and Figure 16 The substrate processing apparatus 1 of the second modification will be described. Hereinafter, the differences between this modification and the above-described embodiments will be mainly explained. Figure 15 As shown, the substrate processing apparatus 1 of this modified example includes a second processing module 33 in addition to the transport module 31 and the processing module 32.

[0117] like Figure 15 As shown, the second processing module 33, when viewed from above, is surrounded on three sides by the conveying module 31 and two processing modules 32, 32 symmetrically arranged on both sides of the conveying module 31 in the Y-axis direction. The second processing module 33 includes an inspection unit 33a.

[0118] Inspection unit 33a inspects the coverage state of the liquid film LF covering the substrate W. Inspection unit 33a may include, for example, a weight gauge, which measures the weight of the substrate W to confirm whether the uneven pattern of the substrate W is covered by the liquid film LF. Inspection unit 33a may also include a film thickness gauge.

[0119] Even if the drying unit 32b does not include the film thickness gauge 58, as long as the second processing module 33 includes the inspection unit 33a, the coverage state of the liquid film LF covering the substrate W can be inspected before supercritical drying. However, both the inspection unit 33a and the film thickness gauge 58 can also be used.

[0120] Processing module 32 includes multiple sets (e.g., two sets) of liquid film forming units 32a, drying units 32b, and supply units 32c, and the second processing module 33 also includes multiple sets (e.g., two) of inspection units 33a. Figure 16 As shown, as long as multiple inspection units 33a are stacked in the vertical direction, the installation area of ​​the processing module 32 can be reduced.

[0121] Next, refer to Figure 17 A first variation of the flow during pressurization (step S42) and purging (step S43) will be described. The second cover 61 includes a discharge port 61b and supply ports 61c and 61d. The discharge port 61b supplies fluid during pressurization and discharges fluid during purging. The supply ports 61c and 61d supply fluid during purging.

[0122] As described above, the supply and discharge port 61b not only supplies fluid during pressurization but also discharges fluid during purging. During purging, the vapor of the drying liquid enters the supply and discharge port 61b, but this vapor is propelled by fluids such as CO2. As a result, the supply and discharge port 61b can be kept clean. Therefore, during the next pressurization, the dispersion of components of the drying liquid from the supply and discharge port 61b into the drying chamber S can be suppressed, and the generation of particulate matter can be inhibited.

[0123] The supply port 61c is located above the upper surface of the substrate W supported by the mounting portion 53b. During purging, the supply port 61c forms an airflow above the substrate W. After the fluid dissolves the drying liquid of the liquid film LF as it passes above the substrate W, it is discharged to the outside of the drying chamber S. As a result, the liquid film LF is replaced with a supercritical fluid.

[0124] Furthermore, the supply port 61d is located above the upper surface of the rectifier plate 53a and below the lower surface of the substrate W supported by the mounting portion 53b. During purging, the supply port 61d creates airflow between the substrate W and the rectifier plate 53a. As a result, it is possible to prevent airflow from entering the substrate W. Figure 17 The formation of the circulating flow is shown by the dashed line in (B). Therefore, the vapor circulation of the drying liquid can be suppressed around the substrate W, and the generation of particles can be suppressed.

[0125] The supply and discharge port 61b is located below the upper surface of the rectifier plate. During purging, the supply and discharge port 61b forms an airflow in the opposite direction to that of the supply ports 61c and 61d. During purging, the fluid is drawn into the supply and discharge port 61b after being ejected from the supply ports 61c and 61d.

[0126] Next, refer to Figure 18 A second variation of the flow during pressurization (step S42) and purging (step S43) will be described. The second cover 61 includes a supply port 61e and discharge ports 61f and 61g. The supply port 61e supplies fluid during pressurization and also supplies fluid during purging. The discharge ports 61f and 61g discharge fluid during purging.

[0127] As described above, the supply port 61e supplies fluid not only during pressurization but also during purging. Therefore, during purging, it is possible to prevent the vapor of the drying liquid from entering the supply port 61e, keeping the supply port 61e clean. Consequently, during the next pressurization, it is possible to suppress the dispersion of drying liquid components from the supply port 61e into the drying chamber S, thus suppressing the generation of particulate matter.

[0128] The supply port 61e is located below the upper surface of the rectifier plate. During purging, the supply port 61e generates an airflow in the opposite direction to the discharge ports 61f and 61g. During purging, the fluid is drawn into the discharge ports 61f and 61g after being ejected from the supply port 61e.

[0129] The discharge port 61f is located above the upper surface of the substrate supported by the mounting portion 53b. During purging, the discharge port 61f creates an airflow above the substrate W. After dissolving the drying liquid in the liquid film LF as it passes above the substrate W, the fluid is discharged to the outside of the drying chamber S. As a result, the liquid film LF is replaced with a supercritical fluid.

[0130] Furthermore, the discharge port 61g is located above the upper surface of the rectifier plate 53a and below the lower surface of the substrate W supported by the mounting portion 53b. During purging, the discharge port 61g creates airflow between the substrate W and the rectifier plate 53a. As a result, it is possible to prevent airflow from entering the substrate W. Figure 18 The formation of the circulating flow is shown by the dashed line in (B). Therefore, the vapor circulation of the drying liquid can be suppressed around the substrate W, and the generation of particles can be suppressed.

[0131] The embodiments of the substrate processing apparatus and substrate processing method of this disclosure have been described above, but this disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations can be made within the scope of the claims. These also fall within the protection scope of this disclosure.

Claims

1. A substrate processing apparatus that uses a supercritical fluid to dry a substrate, wherein, The substrate processing apparatus includes: A pressure vessel that forms a drying chamber inside and has an opening; A cover, located outside the drying chamber, is used to seal the opening of the pressure vessel; A support body, fixed to the pressure vessel, supports the substrate within the drying chamber, and A conveying device that transfers the substrate to the support body through the opening of the pressure vessel; the substrate processing device further includes: A direct-acting mechanism that causes the cover to move forward and backward between a closed position where the cover closes the opening and an open position where the cover opens the opening; and A rotating mechanism that rotates the cover between an open position and a standby position, the standby position being a position deviated from the feeding and feeding path of the substrate by the conveying device.

2. The substrate processing apparatus according to claim 1, wherein, The rotating mechanism includes a rotating shaft of the cover and a rotary actuator that rotates the rotating shaft.

3. The substrate processing apparatus according to claim 2, wherein, The direct-acting mechanism includes a sliding member that holds the bearing of the rotating shaft and a direct-acting actuator that moves the sliding member forward and backward.

4. The substrate processing apparatus according to claim 2, wherein, The rotation axis is symmetrically arranged on both sides of the cover along the axis of the rotation axis.

5. The substrate processing apparatus according to claim 3, wherein, The sliders are symmetrically arranged on both sides of the cover along the axis of rotation.

6. The substrate processing apparatus according to claim 3, wherein, The rotary actuator is fixed to the sliding member and can move forward and backward together with the sliding member.

7. The substrate processing apparatus according to claim 3, wherein, The direct-acting actuator is a pneumatic cylinder that uses the pressure of compressed air to press the cover against the pressure vessel.

8. The substrate processing apparatus according to claim 1, wherein, The pressure vessel has a fitting hole, and the substrate processing device further includes a locking key that is embedded in the fitting hole to restrict the cover from retracting from the closed position toward the open position.

9. The substrate processing apparatus according to claim 8, wherein, The number of locking keys is three.

10. The substrate processing apparatus according to claim 8, wherein, The substrate processing apparatus includes a lifting mechanism that moves the locking key up and down between a locked position and a unlocked position.

11. The substrate processing apparatus according to claim 10, wherein, The locking release position is set at a position that does not interfere with the feeding and feeding path of the substrate by the conveying device.

12. The substrate processing apparatus according to claim 8, wherein, The locking key has a scroll body that can be held in place by scrolling.

13. The substrate processing apparatus according to claim 12, wherein, The locking key has an inclined surface on the front surface facing the cover, which slopes downwards and forwards, and the rolling element is provided on the inclined surface.

14. The substrate processing apparatus according to claim 13, wherein, The locking key has a rear surface on the side opposite to the front surface, and a plurality of the rolling elements are provided on the rear surface.

15. The substrate processing apparatus according to claim 12, wherein, The locking key has a lower surface on which a plurality of the rolling elements are disposed.

16. A substrate processing method, comprising: The conveying device holds the substrate with a liquid film formed on it, enters the pressure vessel through the opening of the pressure vessel in which a drying chamber is formed inside, transfers the substrate to the support fixed to the pressure vessel, and exits it from the opening to the outside. The cover located outside the drying chamber moves from an open position along a straight line to a closed position, thereby closing the opening; Inside the pressure vessel, the liquid film is replaced with a supercritical fluid to dry the substrate; The cover retracts from the closed position to the open position, thereby opening the opening; The cover rotates from the open position to the standby position, remaining in standby mode at a position deviating from the feeding / exit path of the conveying device; and The conveying device enters the pressure vessel through the opening, receives the dried substrate, holds the substrate, and exits it from the opening of the pressure vessel to the outside.

17. A substrate processing method, comprising: The conveying device holds a substrate with a liquid film formed on it, enters the pressure vessel through the opening of the pressure vessel forming a drying chamber inside, transfers the substrate to a support fixed to the pressure vessel, and exits it from the opening of the pressure vessel to the outside. The cover located outside the drying chamber moves from an open position along a straight line to a closed position, thereby closing the opening; The locking key is embedded in the fitting hole of the pressure vessel to restrict the cover from retracting; Inside the pressure vessel, the liquid film is replaced with a supercritical fluid to dry the substrate; Pull the locking key out of the fitting hole of the pressure vessel to allow the cover to move; The cover retracts from the closed position to the open position, thereby opening the opening; The cover rotates from the open position to the standby position, remaining in standby mode at a location deviating from the feeding / exit path of the conveying device; and The conveying device enters the pressure vessel through the opening, receives the dried substrate, holds the substrate, and exits it from the opening of the pressure vessel to the outside.

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