Display device and electronic device including the display device

Abstract

A display device and an electronic device including the display device are provided. The display device includes: a display panel including folded and non-folded regions adjacent along a first direction; a support layer facing the display panel, with a blocking layer located therebetween; a plurality of openings defined in the support layer and corresponding to the folded regions; a buffer layer facing the display panel, with the support layer located therebetween; and a barrier adhesive layer located between the blocking layer and the support layer, the barrier adhesive layer including a first blocking portion and a second blocking portion, the first blocking portion and the second blocking portion being spaced apart from each other along the first direction, and the plurality of openings in the support layer being located therebetween.

Description

[0001] This application claims priority to and all benefits arising therefrom of Korean Patent Application No. 10-2020-0104062, filed on August 19, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates herein to a display device and an electronic device including the display device, and more particularly, to a foldable display device and an electronic device including the foldable display device. Background Technology

[0003] Electronic devices display various images on a screen and provide information to the outside world. Typically, electronic devices display information within a designated screen. Flexible electronic devices, including foldable flexible display panels, have been developed. Unlike rigid electronic devices, flexible electronic devices can be foldable, rollable, and / or bendable. Flexible electronic devices, which can be varied in shape, can be transported regardless of the size of the designated screen, improving the ease of use. Summary of the Invention

[0004] One or more embodiments provide a display device with improved product reliability and an electronic device including the display device.

[0005] An embodiment provides a display device comprising: a display panel including a folded region and a non-folded region adjacent to the folded region along a first direction; a support layer facing the display panel, and a blocking layer located between the support layer and the display panel; a plurality of openings defined in the support layer and corresponding to the folded region; a buffer layer facing the display panel, and the support layer located between the buffer layer and the display panel; and a blocking adhesive layer located between the blocking layer and the support layer, the blocking adhesive layer including a first blocking portion and a second blocking portion, the first blocking portion and the second blocking portion being spaced apart from each other along the first direction, and the plurality of openings of the support layer being located between the first blocking portion and the second blocking portion.

[0006] In one embodiment, the support layer may face both the folded and unfolded regions. Along a first direction, each of the buffer layer, support layer, and barrier layer may have a width, with the width of the buffer layer being smaller than the width of the support layer, and the width of the barrier layer being smaller than the width of the support layer.

[0007] In an embodiment, the buffer layer may include a first buffer layer and a second buffer layer spaced apart from the first buffer layer, and the gap between the first buffer layer and the second buffer layer may correspond to the foldable area of ​​the display panel.

[0008] In an embodiment, the support layer may have a larger elastic modulus than the buffer layer.

[0009] In an embodiment, the barrier adhesive layer may have a thickness smaller than that of the barrier layer.

[0010] In one embodiment, the barrier layer may include a colored polyimide film.

[0011] In this embodiment, the blocking layer may include a light-shielding material.

[0012] In one embodiment, the support layer may extend further than the barrier layer along the first direction.

[0013] In an embodiment, the buffer layer may have a thickness greater than that of the barrier layer.

[0014] In an embodiment, the display device may further include an upper adhesive layer located between the display panel and the barrier layer and attached to the barrier layer, and the upper adhesive layer may have a thickness greater than that of the barrier adhesive layer.

[0015] In an embodiment, the first distance between the first blocking portion and the second blocking portion may be greater than the second distance between the first sidewall of the first opening closest to the non-folded region among the plurality of openings and the second sidewall of the second opening farthest from the non-folded region among the plurality of openings. The non-folded region may include a plurality of non-folded regions, and the first distance between the first blocking portion and the second blocking portion may be greater than the second distance between the first sidewall of the first opening closest to one of the plurality of non-folded regions and the second sidewall of the second opening farthest from said non-folded region among the plurality of openings.

[0016] In one embodiment, the distance between the first blocking portion and the second blocking portion may be greater than the width of the region in which multiple openings are defined.

[0017] In one embodiment, the non-folding area of ​​the display panel may include a display area. The display device may include: a hole, stacked with the display area and defined in a support layer; and a buffer layer, spaced apart from the hole.

[0018] In one embodiment, the electronic device includes: a display panel including a foldable region; a barrier layer facing the display panel; a support layer facing the display panel, with the barrier layer located between the support layer and the display panel, and the support layer having a first elastic modulus; a plurality of openings defined in the support layer and corresponding to the foldable region; and a buffer layer facing the display panel, with the support layer located between the buffer layer and the display panel, and the buffer layer having a second elastic modulus lower than the first elastic modulus. The buffer layer includes a first buffer layer and a second buffer layer spaced apart from each other at the foldable region of the display panel.

[0019] In an embodiment, the electronic device may further include: a first barrier adhesive layer attached to both the bottom surface of the barrier layer and the top surface of the support layer; and a second barrier adhesive layer attached to the top surface of the barrier layer. The first barrier adhesive layer may include a first blocking portion and a second blocking portion, the first blocking portion and the second blocking portion being spaced apart from each other, and a plurality of openings being located between the first blocking portion and the second blocking portion.

[0020] In an embodiment, the first barrier adhesive layer may have a thickness smaller than that of the second barrier adhesive layer.

[0021] In one embodiment, the distance between the first blocking portion and the second blocking portion may be greater than the width of the region in which multiple openings are defined.

[0022] In an embodiment, the electronic device may further include: a first electronic module superimposed with a first hole defined in the display panel and the support layer; and a second electronic module superimposed with a second hole defined in the support layer. The first hole may have a greater depth than the second hole.

[0023] In one embodiment, the buffer layer may be spaced apart from the first and second holes.

[0024] In an embodiment, the buffer layer may have a thickness greater than that of the barrier layer.

[0025] In an embodiment, the display device includes: a display panel including a folded region and a non-folded region, the display panel being foldable at the folded region, and the non-folded region being adjacent to the folded region along a first direction; a barrier layer facing the display panel; a support layer facing the display panel, with the barrier layer located between the support layer and the display panel; a plurality of openings defined in the support layer, the plurality of openings corresponding to the folded regions of the display panel, and including a first opening closest to the non-folded region and a second opening farthest from the non-folded region; and a barrier adhesive layer located between the barrier layer and the support layer, the barrier adhesive layer including a first blocking portion and a second blocking portion, the first blocking portion and the second blocking portion being spaced apart from each other by a first distance along the first direction at the foldable region. The support layer along the first direction includes: a first sidewall closest to the non-folded region and defining the first opening; a second sidewall farthest from the non-folded region and defining the second opening; and a second distance between the first sidewall and the second sidewall. The first distance between the first blocking portion and the second blocking portion is greater than the second distance between the first sidewall and the second sidewall of the support layer. The non-folded region may include a plurality of non-folded regions. The multiple openings may include a first opening closest to one of the multiple non-folded regions and a second opening furthest from said non-folded region. A first sidewall may be closest to said non-folded region. A second sidewall may be furthest from said non-folded region.

[0026] In an embodiment, the display device may further include: a buffer layer spaced apart from the display panel and a support layer located between the buffer layer and the display panel, and the buffer layer may have an elastic modulus smaller than that of the support layer.

[0027] In an embodiment, the buffer layer may include: a first buffer layer; and a second buffer layer spaced apart from the first buffer layer, wherein the gap between the first buffer layer and the second buffer layer may correspond to the foldable area of ​​the display panel.

[0028] In this embodiment, the non-folding area of ​​the display panel may include the display area. The display device may further include: an aperture superimposed on the display area and defined in a support layer; and a buffer layer spaced apart from the aperture. Attached Figure Description

[0029] The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the invention. In the drawings:

[0030] Figure 1A and Figure 1B This is a perspective view of an embodiment of the electronic device;

[0031] Figure 2 This is an exploded perspective view of an embodiment of the electronic device;

[0032] Figure 3 yes Figure 2 A cross-sectional view of an embodiment of the display module;

[0033] Figure 4 This is a plan view of an embodiment of the display panel;

[0034] Figure 5 yes Figure 4 A cross-sectional view of an embodiment of the display device;

[0035] Figure 6 This is a cross-sectional view of an embodiment of the display device;

[0036] Figure 7 This is an exploded perspective view showing an embodiment of the display device;

[0037] Figure 8 It is shown Figure 7 An enlarged plan view of an embodiment of region AA;

[0038] Figure 9 It is shown Figure 5 An enlarged cross-sectional view of an embodiment of region BB;

[0039] Figure 10 yes Figure 1AA cross-sectional view of an embodiment of the display device;

[0040] Figure 11 yes Figure 1A A cross-sectional view of an embodiment of the display device; and

[0041] Figure 12 This is a rear view of an embodiment of the display device. Detailed Implementation

[0042] The invention will now be described more fully below with reference to the accompanying drawings, in which various embodiments are illustrated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Furthermore, in the drawings, the thickness, proportions, and dimensions of components are exaggerated for clarity. The same reference numerals consistently refer to the same elements.

[0043] In this specification, it will also be understood that when a component (or region, layer, portion) is referred to as being associated with another component (such as "on" another component," "connected to," or "attached to" another component), the component may be directly disposed on / directly connected to / directly attached to said other component, or there may be an intermediate third component. Conversely, when a component (or region, layer, portion) is referred to as being associated with another component (such as "directly on" another component," "directly connected to," or "directly attached to" another component), there is no intermediate third component.

[0044] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, “a,” “an,” “the,” and “at least one” do not indicate a limitation of quantity and are intended to include both the singular and the plural. For example, unless the context clearly indicates otherwise, “element” has the same meaning as “at least one element.” “At least one” will not be construed as limited to “a” or “an.” “Or” means “and / or.” The term “and / or” includes any and all combinations of one or more of the associated listed items.

[0045] It will be understood that although terms such as “first” and “second” are used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one component from other components. For example, an element referred to as a “first element” in one embodiment may be referred to as a “second element” in another embodiment without departing from the scope of the appended claims.

[0046] In addition, terms such as "below," "under," "above," and "above" are used to describe the relationships between the components shown in the accompanying drawings. These terms can be relative concepts and are described based on the directions indicated in the drawings.

[0047] The word "includes" or "contains" means that the stated properties, fixed quantities, steps, operations, elements, components, or combinations thereof are present, but does not exclude other properties, fixed quantities, steps, operations, elements, components, or combinations thereof.

[0048] As used herein, “about” or “approximately” includes the stated value and means: within an acceptable deviation of the particular value, taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system), as determined by one of ordinary skill in the art. For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0049] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art. Terms defined in a common dictionary shall be interpreted as having the same meaning as in the relevant technical context, and unless explicitly defined in the specification, terms shall not be interpreted undesirably or excessively as having a formal meaning.

[0050] The embodiments are described herein with reference to cross-sectional views, which are schematic diagrams of idealized embodiments. Thus, variations in the shapes illustrated will be anticipated, for example, due to manufacturing techniques and / or tolerances. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the areas shown herein, but will include, for example, deviations in shape due to manufacturing processes. For example, areas shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, acute angles (sharp corners) shown may be rounded (rounded). Therefore, the areas shown in the figures are schematic in nature, and their shapes are not intended to show the precise shapes of the areas, nor are they intended to limit the scope of the claims.

[0051] In the following description, embodiments of the invention will be illustrated with reference to the accompanying drawings.

[0052] Figure 1A and Figure 1B This is a perspective view of an embodiment of an electronic device ED. Figure 1A The electronic device ED is shown in an unfolded (e.g., unfolded or open) state, and Figure 1B An electronic device ED is shown folded (e.g., in a folded state).

[0053] Reference Figure 1A and Figure 1B A flat electronic device ED may include a display surface DS in a plane parallel to a plane defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. The electronic device ED may display an image IM through the display surface DS.

[0054] The display surface DS may include a display area DA and a non-display area NDA adjacent to the display area DA. The display area DA may be a planar area displaying an image IM, and the non-display area NDA may be a planar area not displaying an image IM. The non-display area NDA may surround the display area DA in a planar view. However, the invention is not limited thereto. In embodiments, for example, the shape and arrangement of the display areas DA and NDA associated with each other may be changed. Various components or layers of the electronic device ED may include display areas DA and NDA corresponding to the display areas DA and NDA described for the electronic device ED. In embodiments, the display areas DA and NDA together may define the front surface of the electronic device ED. The front surface may have a total planar area including, but is not limited to, the planar areas of both the display areas DA and NDA.

[0055] In the following description, the direction intersecting the plane defined by the first direction DR1 and the second direction DR2 is defined as the third direction DR3. The third direction DR3 may intersect the plane defined by the first direction DR1 and the second direction DR2 in a substantially perpendicular manner, but is not limited thereto. In this specification, the expression "viewed in a plane" or "along the thickness direction" may be defined as a view along the third direction DR3. In the following description, the first direction DR1, the second direction DR2, and the third direction DR3 are indicated by the first direction axis to the third direction axis, which are associated with each other, and are respectively denoted by the same reference numerals.

[0056] The electronic device ED may include a foldable region FA and multiple non-foldable regions comprising multiple non-foldable regions. A non-foldable region may be a planar region, meaning that even when the electronic device ED is folded at the foldable region FA, it remains non-foldable or flat at that planar region. The non-foldable regions may include a first non-foldable region NFA1 and a second non-foldable region NFA2. Along a second direction DR2, the foldable region FA may be located between the first non-foldable region NFA1 and the second non-foldable region NFA2. The foldable region FA may be referred to as the first region FA, the first non-foldable region NFA1 may be referred to as the second region NFA1, and the second non-foldable region NFA2 may be referred to as the third region NFA2.

[0057] like Figure 1BAs shown, the foldable region FA can be a planar region where the electronic device ED is foldable relative to a folding axis FX parallel to the first direction DR1. The foldable region FA of the folded electronic device ED has a curvature and a radius of curvature. The folded electronic device ED is such that the first non-foldable region NFA1 and the second non-foldable region NFA2 are positioned facing each other. The electronic device ED can be folded inward or folded to the side so that the portions of the display surface DS facing each other are positioned not facing the outside of the electronic device ED.

[0058] In an embodiment, the electronic device ED can be folded outwards or backwards, such that portions of the display surface DS face away from each other and towards the outside of the electronic device ED. In an embodiment, the electronic device ED can be folded inwards and / or outwards in a repetitive manner. However, the invention is not limited thereto. In an embodiment, the electronic device ED can be only one of being foldable inwards and foldable outwards.

[0059] Multiple sensing areas can be defined in an electronic device (ED). Although in Figure 1A Three sensing regions are illustrated in the example, but the invention is not limited to the number of sensing regions.

[0060] The sensing area may include a first sensing area SA1, a second sensing area SA2, and a third sensing area SA3. In embodiments, for example, the first sensing area SA1 may be superimposed on or correspond to an electronic input module or electronic output module such as a camera module, the second sensing area SA2 may be superimposed on or correspond to an input sensor such as a first brightness sensor, and the third sensing area SA3 may be superimposed on or correspond to an input sensor such as a second brightness sensor. However, the invention is not limited thereto.

[0061] Electronic modules (e.g., camera modules, first brightness sensors, or second brightness sensors) can receive external inputs transmitted through corresponding sensing areas and / or provide outputs to the outside of electronic devices (EDs) through corresponding sensing areas.

[0062] The first sensing area SA1 can be surrounded by the display area DA. The planar area of ​​the display area DA and the planar area of ​​the first sensing area SA1 can together define the total planar area. That is, the first sensing area SA1 is the planar area other than the display area DA within the planar area surrounded by the non-display area NDA, so that the first sensing area SA1 can be a non-display area.

[0063] Each of the second sensing area SA2 and the third sensing area SA3 can be located within the display area DA. The planar areas of the second sensing area SA2 and the third sensing area SA3 can include corresponding areas of the display area DA. That is, the second sensing area SA2 and the third sensing area SA3 can display an image IM, such that the second sensing area SA2 and the third sensing area SA3 can be considered as the display area DA adjacent to the foldable area FA of the display panel DP. Each of the first sensing area SA1, the second sensing area SA2, and the third sensing area SA3 can have a higher transmittance than the display area DA. Furthermore, the first sensing area SA1 can have a higher transmittance than each of the second sensing area SA2 and the third sensing area SA3.

[0064] According to an embodiment, the camera module can be surrounded by a display area DA, and each of the first and second brightness sensors can be superimposed on the display area DA. Therefore, the planar area occupied by the camera module, the first brightness sensor, and the second brightness sensor does not need to be located in the non-display area NDA. As a result, the proportion of the display area DA relative to the total planar area of ​​the front surface of the electronic device ED can be increased.

[0065] Figure 2 This is an exploded perspective view of an embodiment of the electronic device ED.

[0066] Reference Figure 2 The electronic device ED may include a display device DD, an electronic module EM, a power module PSM (e.g., a power supply), and a housing including a first housing EDC1 and a second housing EDC2. Although not shown separately, the electronic device ED may also include mechanical structures for controlling the folding and / or unfolding of the display device DD.

[0067] The display device DD generates an image IM and / or senses external input. The display device DD includes a window module WM (e.g., a window) and a display module DM. The window module WM provides or defines the front surface of the electronic device ED.

[0068] The display module DM may include a display panel DP. Although in Figure 2 The display module DM and the display panel DP are referred to as the same element, but the display module DM can actually be a stacked structure in which multiple components are layered. A detailed description of the stacked structure of the display module DM will be described later.

[0069] The display panel DP includes the display area DA (see reference) of the electronic device ED. Figure 1A ) and non-display area NDA (reference) Figure 1AThe display module DM corresponds to the display area DP-DA and the non-display area DP-NDA. The display area DP-DA may include pixels that generate light, emit light, display images IM, etc. In this specification, the phrase "one area corresponds to another area" means that one area is superimposed on another area, and is not limited to the same planar area. The display module DM may include a driver chip DIC disposed in the non-display area DP-NDA. The display module DM may include a flexible circuit film FCB bonded to the display panel DP at the non-display area DP-NDA. The driver chip DIC and the flexible circuit film FCB may be connected to the display panel DP. Electrical signals can be provided to the display panel DP from the outside through the driver chip DIC and / or the flexible circuit film FCB. Conversely, electrical signals can be provided from the display panel DP to the outside through the driver chip DIC and / or the flexible circuit film FCB.

[0070] The driver chip (DIC) may include driving elements for driving the pixels of the display panel (DP), such as data driving circuitry. Although in Figure 2 The diagram illustrates the structure of a driver chip DIC mounted on a display panel DP, but the invention is not limited thereto. In an embodiment, for example, the driver chip DIC may be mounted on a flexible circuit film FCB.

[0071] The electronic module (EM) includes a main controller. The EM may include one or more of the following: a wireless communication module, a camera module, a proximity sensor module, an image input module, a sound input module, a sound output module, a memory, and an external interface module. The EM can be electrically connected to the power supply module (PSM).

[0072] The main controller controls the overall operation of the electronic device ED. In an embodiment, for example, the main controller activates or deactivates the display device DD based on external input from outside the electronic device ED. The main controller can control the operation of the display device DD and other modules within the electronic device ED. The main controller may include a microprocessor.

[0073] The housing houses the display module DM, the electronic module EM, and the power module PSM. Although two housings, including a first housing EDC1 and a second housing EDC2, which are separate from each other, are shown exemplarily, the invention is not limited thereto. Although not shown, the electronic device ED may also include a hinge structure for connecting the first housing EDC1 and the second housing EDC2. The first housing EDC1 and the second housing EDC2 may be integrated into the window module WM. The first housing EDC1 and the second housing EDC2 protect the components housed therein (such as the display module DM, the electronic module EM, and the power module PSM).

[0074] Figure 3 This is a cross-sectional view of an embodiment of the display module DM. Figure 3 It is along Figure 2 A sectional view taken by line I-I'.

[0075] Reference Figure 3 The display module DM may include a display panel DP, an input sensor IS (e.g., an input sensing layer) disposed on the display panel DP, an optical film LF disposed on the input sensor IS, and a lower component LM disposed below the display panel DP. An adhesive layer may be disposed between the above components as needed.

[0076] The display panel (DP) may include a substrate layer, a circuit element layer disposed on the substrate layer, a display element layer disposed on the circuit element layer, and a thin-film encapsulation layer disposed on the display element layer. The substrate layer may include a plastic film. In embodiments, for example, the substrate layer may include polyimide. Essentially, the substrate layer may be combined with [the following description will be provided]. Figure 4 The display panels (DP) in the display panel have the same planar shape.

[0077] The circuit element layer of a display panel (DP) may include organic layers, inorganic layers, semiconductor patterns, conductive patterns, and signal lines (e.g., electrical signal lines). Organic layers, inorganic layers, semiconductor layers, and conductive layers can be formed on a substrate layer using methods such as coating and deposition. Subsequently, the organic layers, inorganic layers, semiconductor layers, and conductive layers can be selectively patterned, for example, through multiple photolithography processes, to provide semiconductor patterns, conductive patterns, and signal lines.

[0078] Semiconductor patterns, conductive patterns, and signal lines can form what will be described later. Figure 4 The display panel DP includes signal lines SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2, and PL, as well as pixel driving circuitry for one or more pixels PX. Pixel driving circuitry may include transistors.

[0079] The display element layer of the display panel DP includes, as described later... Figure 4 The display element is a light-emitting element of pixel PX. The light-emitting element is electrically connected to a transistor. A thin-film encapsulation layer is disposed on the display element layer to seal the display element layer. The thin-film encapsulation layer may include inorganic layers, organic layers, and inorganic layers stacked sequentially. However, the invention is not limited to the stacked structure of the thin-film encapsulation layer.

[0080] The input sensor IS may include a plurality of sensing electrodes (not shown) for sensing external input, conductive traces (not shown) connected to the plurality of sensing electrodes, and an inorganic and / or organic layer for insulating / protecting the plurality of sensing electrodes or conductive traces. Although the input sensor IS may be a capacitive sensor, the invention is not limited thereto.

[0081] When setting up or manufacturing a display panel DP, an input sensor IS can be directly set or formed on the thin-film encapsulation layer of the display panel DP, for example, through a continuous process. In this specification, an input sensor IS integrated with the display panel DP through a continuous process can be defined as an electronic panel. However, the invention is not limited thereto. In embodiments, for example, the input sensor IS can be set or manufactured on a panel separate from the display panel DP, and then attached to the display panel DP, for example, by using an adhesive layer.

[0082] Multiple sensing electrodes of the input sensor IS and the display area DP-DA (reference) Figure 4 Overlay. The conductive traces of the input sensor IS are superimposed on the non-display area DP-NDA (refer to...). Figure 4 Overlay. Conductive traces can pass through curved regions BA (see reference). Figure 4 And extending toward the lower end of the second panel area AA2, such that the conductive traces are configured with multiple [areas including] Figure 4 Multiple pads (or "solder pads") in the display panel DP are adjacent to each other. Here, the conductive traces of the input sensor IS can be adjacent to the signal lines SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2, and PL (refer to) of the circuit element layer of the display panel DP. Figure 4 ) can be set in different layers or on top of each other.

[0083] The conductive traces of the input sensor IS can be Figure 4 The input signal line in the first panel area AA1 is connected to the display panel DP. Although the input signal line is... Figure 4 The signal lines SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2, and PL in the display panel are different, but the input signal lines can be arranged in the same layer or on the same layer as one or more of the signal lines SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2, and PL of the display panel DP. When in the same layer, the components can be corresponding patterns of the same material layer.

[0084] Each of the input signal lines can be connected to the pad PD (see reference). Figure 4 The corresponding pad PD in ) . As a result, the conductive traces of the input sensor IS can be electrically connected to the signal lines SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2 and PL of the circuit element layer of the display panel DP to the same flexible circuit film FCB (refer to Figure 4 ).

[0085] Optical films (LF) can reduce the reflectivity of external light. Optical films (LF) may include retarders and / or polarizers. Optical films (LF) may include polarizing films.

[0086] The optical film LF may include color filters in a color filter layer. The color filters may have a specific arrangement. The arrangement of the color filters can be determined by considering the emission colors of the pixels PX in the display panel DP. Furthermore, the optical film LF may also include a black matrix.

[0087] The optical film LF may include a destructive interference structure. In an embodiment, for example, the destructive interference structure may include a first reflective layer and a second reflective layer disposed in layers that are different from each other. The first reflected light reflected from the first reflective layer and the second reflected light reflected from the second reflective layer can destructively interfere with each other, thus reducing the reflectivity of external light.

[0088] The lower component LM may include various functional components. The lower component LM may include a light-blocking layer that blocks incident light, an impact-absorbing layer that absorbs external impacts, a support layer that supports the display panel DP, and / or a heat dissipation layer that dissipates heat generated from the display panel DP. A detailed description of the stacking structure of the lower component LM will follow later.

[0089] Figure 4 This is a plan view of an embodiment of the display panel DP. Figure 4 The display panel (DP) in the display is either flat or unfolded.

[0090] Reference Figure 4 The display panel DP may include a display area DP-DA and a non-display area DP-NDA adjacent to the display area DP-DA. The display area DP-DA and the non-display area DP-NDA can be distinguished by whether or not pixels PX are included. Pixels PX are disposed in the display area DP-DA. The scan driver unit SDV, the data driver unit, and the transmit driver unit EDV may be disposed in the non-display area DP-NDA. The data driver unit may be a portion of the circuitry within the driver chip DIC.

[0091] The display panel DP also includes a first panel area AA1, a second panel area AA2, and a curved area BA, which are planar areas separated from each other along a second direction DR2. Each of the curved area BA and the second panel area AA2 can be a portion of the non-display area DP-NDA. The display panel DP may sequentially include the first panel area AA1, the curved area BA, and the second panel area AA2 along the second direction DR2.

[0092] First panel area AA1 and Figure 1A The display surface DS corresponds to the first panel area AA1, which may include a first non-folding area NFA10, a second non-folding area NFA20, and a folding area FA0. The first non-folding area NFA10, the second non-folding area NFA20, and the folding area FA0 are respectively associated with... Figure 1A and Figure 1B The first non-foldable region NFA1, the second non-foldable region NFA2, and the foldable region FA correspond to each other. The foldable region FA0 can be referred to as the first region FA0, the first non-foldable region NFA10 can be referred to as the second region NFA10, and the second non-foldable region NFA20 can be referred to as the third region NFA20.

[0093] Along the first direction DR1, each of the curved region BA and the second panel region AA2 can have a length, such as a length smaller than that of the first panel region AA1. The length can be, but is not limited to, the maximum dimension along the first direction DR1. A bending axis can be defined along the first direction DR1. The display panel DP can be flexible along the bending axis at the curved region BA. A region of the display panel DP having a relatively short length along the bending axis direction can be easily flexible.

[0094] The display panel DP may include multiple pixels PX, multiple scan lines SL1 to SLm, multiple data lines DL1 to DLn, multiple emission lines EL1 to ELm, a first control line CSL1 and a second control line CSL2, a power line PL, and multiple pads PD. Here, the reference numerals "m" and "n" are natural numbers greater than 0. Pixels PX can be connected to corresponding scan lines among scan lines SL1 to SLm, corresponding data lines among data lines DL1 to DLn, and corresponding emission lines among emission lines EL1 to ELm.

[0095] Scan lines SL1 to SLm can all extend along the first direction DR1 and are electrically connected to the scan driver unit SDV. Data lines DL1 to DLn can all extend along the second direction DR2 and pass through the curved area BA, and are electrically connected to the driver chip DIC at the second panel area AA2. Transmit lines EL1 to ELm can all extend along the first direction DR1 and are electrically connected to the transmit driver unit EDV.

[0096] The power line PL may include a portion extending along a first direction DR1 and a portion extending along a second direction DR2. The portions extending along the first direction DR1 and the second direction DR2 may be disposed in or on different layers. The portion extending along the second direction DR2 may extend from the first panel region AA1 through the bending region BA to the second panel region AA2. The power line PL can provide a first voltage to the pixel PX.

[0097] The first control line CSL1 can be connected to the scan drive unit SDV and extends through the bend region BA toward the lower end of the second panel region AA2. The second control line CSL2 can be connected to the transmit drive unit EDV and extends through the bend region BA toward the lower end of the second panel region AA2.

[0098] When viewed from a plane, the pad PD can be positioned adjacent to the lower end of the second panel region AA2 (e.g., the far end of the display panel DP). The driver chip DIC, power line PL, first control line CSL1, and second control line CSL2 can be electrically connected to the corresponding pads within the pad PD. The flexible circuit film FCB outside the display panel DP can be electrically connected to the display panel DP at the pad PD via an anisotropic conductive adhesive layer.

[0099] Figure 5 This is a cross-sectional view of an embodiment of a flat display device DD. Figure 5 It is along Figure 4 The sectional view taken from line II-II'. Figure 6 This is a cross-sectional view of an embodiment of a display device DD that is bent or folded at the bending region BA.

[0100] Figure 5 This illustrates mounting the display device DD onto the electronic device ED (reference). Figure 1A The previous display device DD, and Figure 6 The installation onto the electronic device ED (reference) is shown. Figure 1A The display device DD in )

[0101] Reference Figure 6 When the display device DD is installed on the electronic device ED (refer to...) Figure 1A In this configuration, the first panel area AA1 and the second panel area AA2 of the display panel DP can be positioned on different planes. The second panel area AA2 can be positioned below the first panel area AA1 along the third direction DR3.

[0102] Reference Figure 5 and Figure 6 The window module WM may include a thin-film glass substrate UTG, a plastic film PF disposed on the thin-film glass substrate UTG, a first adhesive layer AL1 that bonds the thin-film glass substrate UTG and the plastic film PF, and a border pattern BP.

[0103] Border pattern BP and Figure 1A The non-display area NDA is overlaid. The border pattern BP can be set on one surface of the thin-film glass substrate UTG or one surface of the plastic film PF. Figure 5 An exemplary illustration shows a border pattern BP disposed on the rear surface of a plastic film PF. However, the invention is not limited thereto. The border pattern BP may be disposed on the top surface of the plastic film PF. The border pattern BP may be a colored light-blocking layer provided by, for example, a coating method. The border pattern BP may include a substrate material and a dye or pigment combined with the substrate material. The border pattern BP may have a closed line shape in a planar view.

[0104] The thin-film glass substrate UTG can have a thickness of about 15 μm to about 45 μm, for example, about 30 μm. The thin-film glass substrate UTG can be chemically strengthened glass. When applying the thin-film glass substrate UTG, wrinkle formation can be minimized despite repeated folding and unfolding of the display device DD. In embodiments, a synthetic resin film can be used instead of the thin-film glass substrate UTG.

[0105] The plastic film PF can have a thickness of about 50 μm to about 80 μm, for example, about 65 μm. The plastic film PF may include polyimide, polycarbonate, polyamide, cellulose triacetate, polymethyl methacrylate, or polyethylene terephthalate. Although not shown separately, at least one of a hard coating, an anti-fingerprint layer, and an anti-reflective layer may be disposed on the top surface of the plastic film PF.

[0106] The first adhesive layer AL1 may be a pressure-sensitive adhesive (“PSA”) or an optically transparent adhesive (“OCA”). The adhesive layers described below may be the same as the first adhesive layer AL1 and include one or more of the adhesive materials described above.

[0107] The first adhesive layer AL1 may have a thickness of about 20 μm to about 50 μm, for example, about 35 μm. The first adhesive layer AL1 may have a thickness capable of covering the border pattern BP. In an embodiment, for example, the border pattern BP may have a thickness of about 3 μm to about 8 μm, and the first adhesive layer AL1 may have a thickness capable of reducing or effectively preventing bubbles from forming around the border pattern BP.

[0108] The first adhesive layer AL1 can be separated from the thin-film glass substrate UTG (e.g., the first adhesive layer AL1 can be removably disposed from the thin-film glass substrate UTG or the first adhesive layer AL1 can be separable from the thin-film glass substrate UTG). Since the plastic film PF has less strength than the thin-film glass substrate UTG, scratches are easily generated in the plastic film PF. The first adhesive layer AL1 and the plastic film PF can be separated together, and then a new plastic film PF can be attached to the thin-film glass substrate UTG.

[0109] On a plane (e.g., along the third direction DR3), the edge UE (e.g., outer edge) of the thin-film glass substrate UTG does not overlap with the border pattern BP. When the above conditions are met, the edge UE of the thin-film glass substrate UTG can be exposed through the border pattern BP, and since the edge UE of the thin-film glass substrate UTG is visually exposed outside the border pattern BP, microcracks arising at the edge UE of the thin-film glass substrate UTG can be inspected by an inspection device. The inspection device may include a microscope. Since the visibility of the edge UE is not obstructed by the border pattern BP, cracks arising from the edge UE of the thin-film glass substrate UTG can be inspected by photographing the edge UE of the thin-film glass substrate UTG from above the top surface of the plastic film PF using the inspection device.

[0110] On a plane, the edges PE of the plastic film PF and the A-E1 of the first adhesive layer AL1 can be aligned with each other. The plastic film PF and the first adhesive layer AL1 can have the same planar area (planar region) and the same planar shape.

[0111] The window module WM and the display module DM can be bonded to each other via a second adhesive layer AL2. The second adhesive layer AL2 may include a pressure-sensitive adhesive or a transparent adhesive (such as an optically clear adhesive). The second adhesive layer AL2 may have a thickness of about 35 μm to about 65 μm, for example, about 50 μm.

[0112] On a planar surface, the edges A-E2 of the second adhesive layer AL2 can be superimposed on the window module WM. In an embodiment, for example, the edges A-E2 of the second adhesive layer AL2 can be superimposed on the thin-film glass substrate UTG. During the process of attaching the window module WM and the display module DM to each other, pressure is applied to the second adhesive layer AL2. The second adhesive layer AL2 can receive pressure and be stretched in a direction parallel to the first direction DR1 and / or the second direction DR2. Here, the second adhesive layer AL2 in the flat display device DD has a planar area smaller than the planar area of ​​the thin-film glass substrate UTG, such that the stretched second adhesive layer AL2 does not protrude far beyond the edge UE of the thin-film glass substrate UTG.

[0113] When the first adhesive layer AL1 and the second adhesive layer AL2 are attached between the layers, in the electronic device ED (reference) Figure 1A During the folding process, buckling or cracking may occur in the thin-film glass substrate UTG because it does not slide or move. However, according to the embodiment, since the second adhesive layer AL2 has a smaller planar area than the planar area of ​​the thin-film glass substrate UTG, the first adhesive layer AL1 and the second adhesive layer AL2 on opposite sides of the thin-film glass substrate UTG may not adhere to each other, and the possibility of foreign matter adhering to the second adhesive layer AL2 can be reduced.

[0114] The display module DM may include an optical film LF, a display panel DP, a panel protective layer PPL, a barrier layer BRL, a support layer PLT, a cover layer SCV, a heat dissipation layer RHL, a cushion layer CUL, an insulating layer INL, a spacer SPC, a step compensation pattern CP, and third adhesive layers AL3 to eleventh adhesive layers AL11. The third adhesive layers AL3 to eleventh adhesive layers AL11 may include pressure-sensitive adhesives or transparent adhesives (such as optically transparent adhesives). In embodiments, some of the above components may be omitted. For example, in embodiments, the step compensation pattern CP and the tenth adhesive layer AL10 and the eleventh adhesive layer AL11 associated with the step compensation pattern CP may be omitted.

[0115] An optical film LF is disposed in the first panel area AA1. The optical film LF covers at least the display area DP-DA (see reference). Figure 2 The second adhesive layer AL2 bonds the optical film LF to the window module WM, and the third adhesive layer AL3 bonds the optical film LF to the display panel DP. Although in Figure 5 and Figure 6 Only the display panel DP is shown, but as Figure 3 As shown, the input sensor IS can also be positioned between the display panel DP and the third adhesive layer AL3.

[0116] A panel protective layer (PPL) can be disposed beneath the display panel (DP). The PPL protects the lower portion of the display panel (DP). The PPL may comprise a flexible plastic material. The PPL reduces or effectively prevents scratches on the rear surface of the display panel (DP) during the manufacturing process. The PPL may be a colored polyimide film. In an embodiment, for example, the PPL may be an opaque yellow film. However, the invention is not limited thereto.

[0117] In this embodiment, the panel protective layer PPL may not be provided in the curved region BA (e.g., it can be excluded from the curved region BA). The panel protective layer PPL may include a first panel protective layer PPL-1 protecting the first panel region AA1 of the display panel DP and a second panel protective layer PPL-2 protecting the second panel region AA2.

[0118] In a display device DD that bends at the bending region BA, the second panel protective layer PPL-2 can be disposed together with the second panel region AA2 of the display panel DP below the first panel protective layer PPL-1 and the first panel region AA1. Since the panel protective layer PPL is not disposed in the bending region BA, the display device DD can be easily bent at the bending region BA.

[0119] The fourth adhesive layer AL4 bonds the panel protective layer PPL and the display panel DP together. The fourth adhesive layer AL4 may include a first portion AL4-1 corresponding to the first panel protective layer PPL-1 and a second portion AL4-2 corresponding to the second panel protective layer PPL-2. The first portion AL4-1 bonds the first panel protective layer PPL-1 to the first panel area AA1 of the display panel DP, and the second portion AL4-2 bonds the second panel protective layer PPL-2 to the second panel area AA2 of the display panel DP.

[0120] The barrier layer BRL can be disposed below the panel protective layer PPL. The fifth adhesive layer AL5 can be disposed between the panel protective layer PPL and the barrier layer BRL to bond the barrier layer BRL to the panel protective layer PPL. The fifth adhesive layer AL5 can be attached to the top surface of the barrier layer BRL. Therefore, the fifth adhesive layer AL5 can be referred to as the upper adhesive layer.

[0121] A barrier layer (BRL) increases resistance to compressive forces caused by external pressure. Therefore, the barrier layer (BRL) can reduce or effectively prevent display panel (DP) deformation. The barrier layer (BRL) can comprise flexible plastic materials such as polyimide or polyethylene terephthalate.

[0122] Furthermore, the blocking layer BRL can absorb light incident from outside the display device DD. The blocking layer BRL may include a light-shielding material or a colored film with low light transmittance. In an embodiment, for example, the blocking layer BRL may be a black plastic film (e.g., a black polyimide film). When the display module DM is viewed from above the window module WM (e.g., in the direction opposite to the third direction DR3), the components disposed below the blocking layer BRL are not visible from the outside of the display module DM.

[0123] A support layer PLT is disposed below the barrier layer BRL. The support layer PLT faces both the folded region FA0 and the non-folded regions NFA10 and NFA20. The support layer PLT may comprise a material having an elastic modulus of about 60 gigapascals (GPa) or greater. The support layer PLT may comprise a metallic material such as stainless steel. Although the support layer PLT may, by way of example, comprise SUS 304, the invention is not limited thereto. In embodiments, for example, the support layer PLT may comprise various metallic materials. The support layer PLT may support the display panel DP. Furthermore, the support layer PLT may improve the heat dissipation performance of the display device DD.

[0124] The opening OP can be configured as multiple, including multiple opening OPs defined in a portion of the support layer PLT corresponding to the folded region FA0. The support layer PLT can have improved flexibility through the opening OPs.

[0125] The barrier layer BRL can have a planar area smaller than that of the support layer PLT. This planar area can be in a flat or unfolded display device DD and is defined in a plane defined by a first direction DR1 and a second direction DR2 that intersect each other. On the plane, the barrier layer BRL can be superimposed on a portion of the support layer PLT. Another portion of the support layer PLT may not be superimposed on the barrier layer BRL. That is, the support layer PLT extends further than the barrier layer BRL.

[0126] A sixth adhesive layer AL6 may be disposed between the barrier layer BRL and the support layer PLT. The sixth adhesive layer AL6 can bond the barrier layer BRL and the support layer PLT together. The sixth adhesive layer AL6 (hereinafter referred to as the barrier adhesive layer) may include a first barrier portion AL6-1 and a second barrier portion AL6-2 spaced apart from each other. The first barrier portion AL6-1 and the second barrier portion AL6-2 are separated from each other at the folded region FA0.

[0127] The first blocking portion AL6-1 and the second blocking portion AL6-2 may be spaced apart from each other, and a plurality of openings OP are located between them. In a planar plane, the blocking adhesive layer AL6 may not overlap with the plurality of openings OP. Furthermore, in a planar plane, the inner edge of the blocking adhesive layer AL6 may be spaced apart from the plurality of openings OP.

[0128] The first blocking portion AL6-1 can be stacked with the second region NFA10, and the second blocking portion AL6-2 can be stacked with the third region NFA20. Furthermore, each of the first blocking portion AL6-1 and the second blocking portion AL6-2 may not be stacked with the first region FA0. Because the blocking adhesive layer AL6 is not correspondingly provided with the first region FA0, the support layer PLT can have improved flexibility.

[0129] In the region superimposed on or corresponding to the first region FA0, the barrier layer BRL can be spaced apart from the support layer PLT along the third direction DR3. That is, a first space ES can be defined between the support layer PLT and the barrier layer BRL in the region superimposed on the first region FA0. Air can be provided in the first space ES.

[0130] Because the first space ES is confined to the deployed electronic device ED (refer to...) Figure 1A Between the support layer PLT and the barrier layer BRL in the ), the multiple openings OP defined in the support layer PLT can be from the electronic device ED (see reference). Figure 1A The external features are unrecognizable.

[0131] Furthermore, since the barrier layer BRL includes a light-shielding material, or a colored film with low light transmittance is used as the barrier layer BRL, the color difference of the support layer PLT will not be identifiable from the outside of the electronic device ED. In an embodiment, for example, the color difference between a first support region of the support layer PLT that defines a plurality of openings OP and a second support region of the support layer PLT that does not define a plurality of openings OP will not be identifiable from the outside of the electronic device ED. The first support region may be stacked with a first region FA0, and the second support region may be stacked with a second region NFA10 and a third region NFA20.

[0132] The barrier adhesive layer AL6 may have a thickness smaller than that of the fifth adhesive layer AL5, and the thickness of the barrier adhesive layer AL6 may be smaller than that of the barrier layer BRL. In an embodiment, for example, the fifth adhesive layer AL5 may have a thickness of about 25 μm, and the barrier adhesive layer AL6 may have a thickness of about 16 μm.

[0133] As the thickness of the barrier adhesive layer AL6 decreases, the step portion caused by the barrier adhesive layer AL6 can be reduced. Although by the electronic device ED (reference) Figure 1A The shape deformation of the stacked structure caused by folding and unfolding decreases as the stepped portion decreases, but the identification of multiple openings (OPs) increases with repeated folding operations, or the delamination of the barrier adhesive layer AL6 increases. Conversely, although multiple openings (OPs) may not be identified as the thickness of the barrier adhesive layer AL6 increases, and the reliability of the adhesive force of the barrier adhesive layer AL6 can increase with repeated folding operations, the stepped portion increases. Therefore, considering folding reliability, adhesive reliability, and the possibility of identifying multiple openings (OPs), the thickness of the barrier adhesive layer AL6 can be selected within an appropriate range.

[0134] A seventh adhesive layer AL7 (hereinafter referred to as the first cover adhesive layer) may be disposed below the support layer PLT, and a cover layer SCV may be disposed below the first cover adhesive layer AL7. The support layer PLT and the cover layer SCV may be bonded to each other through the first cover adhesive layer AL7. The cover layer SCV may be disposed or manufactured in a sheet shape and attached to the support layer PLT.

[0135] The first cover adhesive layer AL7 and the cover layer SCV can cover multiple openings OP defined in the support layer PLT. Therefore, the cover layer SCV can reduce or effectively prevent the introduction of foreign matter into the multiple openings OP. The cover layer SCV can have a lower elastic modulus than the support layer PLT. In embodiments, for example, the cover layer SCV can comprise thermoplastic polyurethane, rubber, or silicone. However, the invention is not limited thereto.

[0136] An eighth adhesive layer AL8 (hereinafter referred to as the second cover adhesive layer) may be disposed below the cover layer SCV. The second cover adhesive layer AL8 may include a first cover portion AL8-1 and a second cover portion AL8-2. The first cover portion AL8-1 and the second cover portion AL8-2 may be spaced apart from each other. In a plane, the first cover portion AL8-1 and the second cover portion AL8-2 may be spaced apart from each other, and a plurality of openings OP are between them. The first cover portion AL8-1 and the second cover portion AL8-2 may not overlap each other in the first region FA0 (e.g., they may be disconnected from each other at the folded region FA0).

[0137] The heat dissipation layer RHL can be disposed below the second cover adhesive layer AL8. The heat dissipation layer RHL can be a sheet with high thermal conductivity. The heat dissipation layer RHL can include metal or metal alloy (e.g., copper, copper alloy) or graphite.

[0138] The heat dissipation layer RHL may include a first heat dissipation layer RHL-1 and a second heat dissipation layer RHL-2. The first heat dissipation layer RHL-1 and the second heat dissipation layer RHL-2 may be spaced apart from each other by a gap GP. Along the second direction DR2, the gap GP may be from about 0.4 mm to about 2.4 mm. However, the invention is not limited thereto. The gap GP may be provided corresponding to the folded area FA0.

[0139] The first heat dissipation layer RHL-1 can be bonded to the cover layer SCV through the first cover portion AL8-1, and the second heat dissipation layer RHL-2 can be bonded to the cover layer SCV through the second cover portion AL8-2. In a planar plane, the first heat dissipation layer RHL-1 can be superimposed with a portion of the first region FA0 and the second region NFA10, and the second heat dissipation layer RHL-2 can be superimposed with another portion of the first region FA0 and the third region NFA20.

[0140] On a planar surface, a portion of the first heat dissipation layer RHL-1 may be superimposed on a portion of a plurality of open OPs, and a portion of the second heat dissipation layer RHL-2 may be superimposed on another portion of the plurality of open OPs. The first heat dissipation layer RHL-1 and the second heat dissipation layer RHL-2 can be used to support the support layer PLT. In an embodiment, for example, the region of the support layer PLT defining the plurality of open OPs can be supported by the first heat dissipation layer RHL-1 and the second heat dissipation layer RHL-2. Therefore, the first heat dissipation layer RHL-1 and the second heat dissipation layer RHL-2 can be referred to as the first lower support layer and the second lower support layer, respectively.

[0141] The ninth adhesive layer AL9 can be disposed below the heat dissipation layer RHL. The ninth adhesive layer AL9 may include a first portion AL9-1 corresponding to the first heat dissipation layer RHL-1 and a second portion AL9-2 corresponding to the second heat dissipation layer RHL-2. The first portion AL9-1 and the second portion AL9-2 may be spaced apart from each other by a gap GP.

[0142] The buffer layer CUL can be disposed below the ninth adhesive layer AL9. Although the buffer layer CUL can have a thickness of approximately 75 μm, the invention is not limited thereto. The buffer layer CUL can protect the display panel DP by absorbing external impacts. The buffer layer CUL can have an elastic modulus lower than that of the support layer PLT. The buffer layer CUL may include a foam sheet with elasticity. The buffer layer CUL may include sponge or polyurethane.

[0143] The buffer layer CUL may include a first buffer layer CUL-1 corresponding to the first portion AL9-1 and a second buffer layer CUL-2 corresponding to the second portion AL9-2. The first buffer layer CUL-1 and the second buffer layer CUL-2 may be spaced apart from each other by a gap GP. In the plane, the gap GP between the first buffer layer CUL-1 and the second buffer layer CUL-2 may be superimposed on the first region FA0. In the plane, the first buffer layer CUL-1 may be superimposed on a portion of the first region FA0 and the second region NFA10, and the second buffer layer CUL-2 may be superimposed on another portion of the first region FA0 and the third region NFA20.

[0144] In the comparative example, when the buffer layer CUL is disposed between the support layer PLT and the display panel DP, the shape of the buffer layer CUL deforms when the display panel DP is pressed, thus making the display panel DP prone to deformation. However, according to one or more embodiments, the buffer layer CUL faces the display panel DP, with the support layer PLT between them. Therefore, when the display panel DP is pressed, the deformation of the display panel DP can be reduced compared to the comparative example. Furthermore, since the buffer layer CUL is disposed below the heat dissipation layer RHL, the shock absorption performance of the buffer layer CUL can be improved.

[0145] An insulating layer INL can be disposed below a buffer layer CUL. The insulating layer INL may include a first insulating layer INL-1 corresponding to the first buffer layer CUL-1 and a second insulating layer INL-2 corresponding to the second buffer layer CUL-2. Figure 5 In this structure, the insulating layer INL comprises insulating tape. The insulating layer INL can reduce or effectively prevent the introduction of static electricity. Although Figure 5Not shown, but the flexible circuit film FCB can be provided correspondingly to the insulating layer INL in a folded or bent electronic device ED. The insulating layer INL can reduce or effectively prevent electrical interference from other components disposed on the insulating layer INL to the flexible circuit film FCB.

[0146] The first surface of the step compensation pattern CP can be bonded to the support layer PLT via the tenth adhesive layer AL10. The eleventh adhesive layer AL11 is disposed on the second surface opposite to the first surface of the step compensation pattern CP. This can be implemented in the display device DD (refer to...). Figure 2 ) and electronic devices ED (refer to Figure 2 When the other component is bonded, the eleventh adhesive layer AL11 is used.

[0147] Reference Figure 6 The display device DD, which bends at the curved area BA, causes the second panel area AA2 to be positioned below the first panel area AA1. Therefore, the driver chip DIC (refer to...) Figure 5 The first panel area AA1 and the second panel area AA2 can be located below each other. That is, the first panel area AA1 and the second panel area AA2 can be located in different planes or on different reference surfaces. The curved area BA can be curved protrudingly in the transverse direction in the cross-section. The curved area BA can define the curved end of the display device DD. The curved display device DD has a curvature and a radius of curvature at the curved area BA. The radius of curvature can be from about 0.1 mm to about 0.5 mm.

[0148] A bending protective layer BPL is disposed at least in the bending region BA. The bending protective layer BPL may be stacked with the bending region BA, the first panel region AA1, and the second panel region AA2. In addition to the bending region BA, the bending protective layer BPL may also be disposed in a portion of the first panel region AA1 and a portion of the second panel region AA2.

[0149] The bend protection layer (BPL) can be bendable along with the bend region (BA). The BPL protects the bend region (BA) from external impacts and controls the neutral plane of the bend region (BA). The BPL controls the stress in the bend region (BA), bringing the neutral plane closer to the signal line located within the bend region (BA).

[0150] The first surface of the second panel protective layer PPL-2 is attached to the second portion AL4-2 of the fourth adhesive layer AL4, and the second surface of the second panel protective layer PPL-2 is attached to the spacer SPC. Although in Figure 5 and Figure 6 The diagram shows a single-layer spacer SPC, but the spacer SPC can have a multi-layer structure in which a substrate layer is disposed between two adhesive layers. The substrate layer may include graphite with heat-dissipating properties.

[0151] Figure 7 This is an exploded perspective view showing an embodiment of some components of the display device DD. Figure 8 It is shown Figure 7 An enlarged plan view of an embodiment of region AA. Figure 7 An example is shown of a barrier adhesive layer AL6 and a support layer PLT.

[0152] Reference Figure 7 and Figure 8 The support layer PLT may include the first region FA0 (refer to...) Figure 5 The corresponding foldable region PLT-F and the second region NFA10 (refer to) Figure 5 The second region PLT-1 and the third region NFA20 (see reference) correspond to the second region PLT-1 and the third region NFA20. Figure 5 The corresponding third region is PLT-2. Multiple openings (OPs) can be confined within the foldable region PLT-F.

[0153] Multiple open sections (OPs) can be arranged in a pattern spaced apart from each other. Multiple open sections (OPs) can be arranged in a grid. Each of the multiple open sections (OPs) can extend completely through the thickness of the support layer PLT from the top surface to the rear surface. When multiple open sections (OPs) are defined within the foldable region PLT-F, the planar area of ​​the foldable region PLT-F can be reduced, thereby reducing the strength of the foldable region PLT-F. Therefore, the foldable region PLT-F can have greater flexibility compared to a support layer PLT that does not contain multiple open sections (OPs).

[0154] The first distance GP1 between the first blocking portion AL6-1 and the second blocking portion AL6-2 can be larger than the first width PLW of the foldable region PLT-F, in which a plurality of openings OP are defined. The first distance GP1 and the first width PLW can be distances along the second direction DR2. When the first distance GP1 is equal to or less than the first width PLW, at least one of the first blocking portion AL6-1 and the second blocking portion AL6-2 will overlap with the plurality of openings OP due to process errors generated during the process of attaching the first blocking portion AL6-1 and the second blocking portion AL6-2 to the support layer PLT. In the case where at least one of the first blocking portion AL6-1 and the second blocking portion AL6-2 overlaps with the plurality of openings OP, the plurality of openings OP will be identifiable from the outside of the display device DD. According to an embodiment, each of the first distance GP1 and the first width PLW can be equal to or greater than a value determined taking into account process errors. Therefore, the first blocking portion AL6-1 and the second blocking portion AL6-2 will not overlap with the plurality of openings OP. As a result, the phenomenon of the plurality of openings OP being identifiable from the outside will not occur.

[0155] The second width AL1W of the first blocking part AL6-1 along the second direction DR2 can be smaller than the third width PL1W of the second region PLT-1 along the second direction DR2, and the fourth width AL2W of the second blocking part AL6-2 along the second direction DR2 can be smaller than the fifth width PL2W of the third region PLT-2 along the second direction DR2.

[0156] Figure 9 It is shown Figure 5 An enlarged cross-sectional view of an embodiment of region BB in the diagram.

[0157] Reference Figure 5 and Figure 9 The plurality of openings OP corresponding to the folded region FA0 of the display panel DP may include a first opening OP1 closest to the non-folded region (e.g., the first non-folded region NFA10) and a second opening OP2 furthest from the non-folded region. The support layer PLT, along the second direction DR2, includes a first sidewall OP1S closest to the non-folded region and defining the first opening OP1, a second sidewall OP2S furthest from the non-folded region and defining the second opening OP2, and a second distance DT0 between the first sidewall OP1S and the second sidewall OP2S. That is, at the folded region FA0, the support layer PLT includes a first sidewall OP1S and a second sidewall OP2S, which are spaced apart from each other along the second direction DR2, and the plurality of openings OP are between them.

[0158] Reference Figure 5 and Figure 9 The first distance GP1 between the first blocking portion AL6-1 and the second blocking portion AL6-2 can be greater than the second distance DT0 between the first sidewall OP1S of the support layer PLT at the first opening OP1 closest to the second region NFA10 among the plurality of openings OP, and the second sidewall OP2S of the support layer PLT at the second opening OP2 closest to the third region NFA20 among the plurality of openings OP. In an embodiment, for example, the first distance GP1 can be about 1 mm or more greater than the second distance DT0. However, the invention is not limited thereto.

[0159] The second distance DT0 between the first sidewall OP1S and the second sidewall OP2S can be equal to or less than 1 / 2. Figure 7 The first width PLW of the foldable region PLT-F in the middle.

[0160] The third distance GP2 between the first covering part AL8-1 and the second covering part AL8-2 can be greater than the foldable area PLT-F (refer to...). Figure 7The first width PLW is larger. Furthermore, the third distance GP2 can be larger than the second distance DT0. In an embodiment, for example, the second distance DT0 can be approximately 8.65 mm, and each of the first distance GP1 and the third distance GP2 can be approximately 9.65 mm. The difference between the first distance GP1 and the second distance DT0 can be substantially equal to the difference between the third distance GP2 and the second distance DT0. The expression "substantially equal" can indicate features that are equal within the range of process tolerances.

[0161] In the region superimposed with the first region FA0, the space EST can be defined between the barrier layer BRL and the first cover adhesive layer AL7. The space EST can be divided into a first space ES and a plurality of second spaces ES0, including a plurality of second spaces ES0. The first space ES can be defined by the barrier layer BRL, the top surface of the support layer PLT, the first barrier portion AL6-1 and the second barrier portion AL6-2, and the second spaces ES0 can be defined by a plurality of openings OP.

[0162] Figure 10 It is along Figure 1A A cross-sectional view of an embodiment of the display device DD, taken by line III-III'. Figure 11 It is along Figure 1A A cross-sectional view of an embodiment of the display device DD, taken by line IV-IV'.

[0163] Reference Figure 10 This limits the display device DD (refer to) Figure 2 The eleventh adhesive layer AL11 extends into the first hole HL1 of the second adhesive layer AL2. The bottom surface UTG-B of the thin-film glass substrate UTG can define the bottom of the first hole HL1. The first hole HL1 can open to the outside of the electronic device ED and in a direction away from the thin-film glass substrate UTG.

[0164] The first electronic module CM1 can be stacked or correspond to the first hole HL1, or it can be inserted into the first hole HL1 from outside the support layer PLT. The first electronic module CM1 can be a camera module. The first electronic module CM1 can acquire images through the first sensing area SA1. The first hole HL1 can be defined to extend through the display panel DP in addition to passing through the lower member LM. Therefore, the first sensing area SA1 may not display the image IM, but is not limited thereto. In an embodiment, the first hole HL1 accommodating the first electronic module CM1 may not pass through the display panel DP, so that the first sensing area SA1 can display the image IM.

[0165] On a plane, a light-blocking pattern BP-C, superimposed on the boundary of the first sensing area SA1 and the portion of the display area DA adjacent to the first sensing area SA1, can be disposed between the plastic film PF and the first adhesive layer AL1. The light-blocking pattern BP-C can have a circular shape. The shape of the light-blocking pattern BP-C can correspond to the shape of the boundary of the first sensing area SA1 and the portion of the display area DA adjacent to the first sensing area SA1.

[0166] Reference Figure 11 This limits the display device DD (refer to) Figure 2 The eleventh adhesive layer AL11 extends into the second hole HL2 of the fifth adhesive layer AL5. The bottom surface PPL-B of the panel protective layer PPL can define the bottom of the second hole HL2. The second electronic module CM2 can be inserted into the second hole HL2 from outside the support layer PLT. The second electronic module CM2 can be a brightness sensor.

[0167] The first hole HL1 corresponds to the first sensing area SA1 and extends through both the display panel DP and the support layer PLT to have depth. The second hole HL2 corresponds to the second sensing area SA2 and extends through the support layer PLT to have depth. (See reference...) Figure 10 and Figure 11 The first depth DT1 of the first hole HL1 can be greater than the second depth DT2 of the second hole HL2. (Refer to the display device DD) Figure 2 The number of components superimposed on the first sensing area SA1 can be greater than that of the display device DD (refer to...). Figure 2 The first sensing region SA1 has fewer components superimposed on the second sensing region SA2. Therefore, the first sensing region SA1 can have a higher light transmittance than the second sensing region SA2. At each of the first aperture HL1 and the second aperture HL2, the support layer PLT includes sidewalls facing each other along the second direction DR2 to define the first aperture HL1 and the second aperture HL2, respectively.

[0168] Figure 12 This is a rear view of an embodiment of the display device DD.

[0169] Figure 12 The rear surface of the support layer PLT is shown. A cover layer SCV, a heat dissipation layer RHL, a buffer layer CUL, and an insulating layer INL are sequentially stacked on the rear surface of the support layer PLT. This stacked structure is disposed on a portion of the rear surface of the support layer PLT. The cover layer SCV, heat dissipation layer RHL, buffer layer CUL, and insulating layer INL may be spaced apart from the first hole HL1 and the second hole HL2.

[0170] The cover layer SCV is stacked with the foldable region PLT-F. Although in Figure 12The planar area of ​​the components gradually decreases in the order of the cover layer SCV, the heat dissipation layer RHL, the buffer layer CUL, and the insulating layer INL, but the invention is not limited thereto. The spacer SPC is spaced apart from the stacked structure. The eleventh adhesive layer AL11 may be disposed outside the stacked structure and along the edge of the support layer PLT.

[0171] As described above, the barrier layer BRL can be disposed between the display panel DP and the support layer PLT. The first space ES can be defined between the barrier layer BRL and the support layer PLT, in which a plurality of openings OP are defined. Therefore, the plurality of openings OP will not be visible from the outside of the electronic device ED. Furthermore, since the barrier layer BRL includes a light-shielding material, the color difference of the support layer PLT will not be visible from the outside of the electronic device ED.

[0172] Furthermore, as described above, the buffer layer CUL can be spaced apart from the display panel DP, with the support layer PLT positioned between them. Therefore, when the display panel DP is pressed, the shape deformation of the display panel DP can be reduced significantly compared to a comparative example where the buffer layer CUL is positioned between the support layer PLT and the display panel DP. Additionally, the buffer layer CUL can be positioned below the heat dissipation layer RHL and firmly supported by it. Therefore, the buffer layer CUL can have improved shock absorption performance.

[0173] Although embodiments have been described, it is understood that the invention should not be limited to these embodiments, but rather that various changes and modifications can be made by those skilled in the art within the spirit and scope of the claimed invention. Therefore, the actual scope of protection of the invention should be determined by the technical scope of the appended claims.

Claims

1. A display device, the display device comprising: A display panel includes: a folding region, wherein the display panel is foldable at the folding region; and a non-folding region adjacent to the folding region along a first direction; A barrier layer facing the display panel; A support layer faces the display panel, and the blocking layer is located between the support layer and the display panel; Multiple openings are defined in the support layer and correspond to the folded area of ​​the display panel; A buffer layer faces the display panel, and the support layer is located between the buffer layer and the display panel; A barrier adhesive layer is located between the barrier layer and the support layer. The barrier adhesive layer includes a first barrier portion and a second barrier portion, which are spaced apart from each other along the first direction. The plurality of openings of the support layer are located between the first barrier portion and the second barrier portion. A first cover adhesive layer is disposed beneath the support layer; and A cover layer is disposed beneath the first cover adhesive layer. in: The empty space is defined between the barrier layer and the first cover adhesive layer, and the empty space is divided into a first empty space and a plurality of second empty spaces. The first empty space is defined by the barrier layer, the top surface of the support layer, the first barrier portion, and the second barrier portion. The spaces of the plurality of second voids are respectively defined by the plurality of openings, and The first adhesive layer and the cover layer cover the empty space.

2. The display device according to claim 1, wherein, The supporting layer covers both the folded area and the non-folded area, and Along the first direction: Each of the buffer layer, the support layer, and the barrier layer has a width. The width of the buffer layer is smaller than the width of the support layer, and The width of the barrier layer is smaller than the width of the support layer.

3. The display device according to claim 1, wherein, The buffer layer includes a first buffer layer and a second buffer layer, the first buffer layer and the second buffer layer being spaced apart from each other along the first direction, and The gap between the first buffer layer and the second buffer layer corresponds to the folded area of ​​the display panel.

4. The display device according to claim 1, wherein, Each of the support layer and the buffer layer has an elastic modulus, and The elastic modulus of the support layer is greater than that of the buffer layer.

5. The display device according to claim 1, wherein, The barrier adhesive layer and each of the barrier layers have a thickness, and The thickness of the barrier adhesive layer is smaller than the thickness of the barrier layer.

6. The display device according to claim 1, wherein, The barrier layer comprises a colored polyimide film.

7. The display device according to claim 1, wherein, The barrier layer includes a light-blocking material.

8. The display device according to claim 1, wherein, Along the first direction, the support layer extends further than the barrier layer.

9. The display device according to claim 1, wherein, Each of the buffer layer and the barrier layer has a thickness, and The thickness of the buffer layer is greater than the thickness of the barrier layer.

10. The display device according to claim 1, further comprising: The upper adhesive layer is located between the display panel and the barrier layer. in, The upper adhesive layer attaches the display panel to the barrier layer. Each of the upper adhesive layer and the barrier adhesive layer has a thickness, and The thickness of the upper adhesive layer is greater than the thickness of the barrier adhesive layer.

11. The display device according to claim 1, wherein, The first blocking portion and the second blocking portion are spaced apart from each other by a first distance along the first direction. Along the first direction, the plurality of openings corresponding to the folded area of ​​the display panel include a first opening closest to the non-folded area and a second opening furthest from the non-folded area. The support layer, along the first direction, includes: a first sidewall, closest to the non-folded region and defining the first opening; a second sidewall, furthest from the non-folded region and defining the second opening; and a second distance located between the first sidewall and the second sidewall. The first distance between the first blocking portion and the second blocking portion is greater than the second distance between the first sidewall and the second sidewall of the support layer.

12. The display device according to claim 1, wherein, Along the first direction: The first blocking part and the second blocking part are spaced apart from each other. The distance between the first blocking portion and the second blocking portion is greater than the width of the region in which the plurality of openings are defined.

13. The display device according to claim 1, wherein, The non-folding area of ​​the display panel includes the display area. The display device further includes: a hole corresponding to the display area and extending through the support layer, and Along the first direction, the buffer layer is spaced apart from the holes extending through the support layer.

14. An electronic device, the electronic device comprising: A display panel includes a foldable area, wherein the display panel is foldable at the foldable area; A barrier layer facing the display panel; A support layer faces the display panel, and the blocking layer is located between the support layer and the display panel, and the support layer has a first elastic modulus; A first barrier adhesive layer is located between the barrier layer and the support layer, and the first barrier adhesive layer includes a first barrier portion and a second barrier portion spaced apart from each other; Multiple openings are defined in the support layer and correspond to the foldable area of ​​the display panel; A buffer layer facing the display panel, and a support layer located between the buffer layer and the display panel, the buffer layer having a second elastic modulus lower than the first elastic modulus of the support layer, and comprising: a first buffer layer and a second buffer layer, spaced apart from each other at the foldable region of the display panel; A first cover adhesive layer is disposed beneath the support layer; and A cover layer is disposed between the first cover adhesive layer and the buffer layer. in: The empty space is defined between the barrier layer and the first cover adhesive layer, and the empty space is divided into a first empty space and a plurality of second empty spaces. The first empty space is defined by the barrier layer, the top surface of the support layer, the first barrier portion, and the second barrier portion. The spaces of the plurality of second voids are respectively defined by the plurality of openings, and The first adhesive layer and the cover layer cover the empty space.

15. The electronic device of claim 14, further comprising: A second barrier adhesive layer is located between the barrier layer and the display panel. The first blocking portion and the second blocking portion are spaced apart from each other by the plurality of openings located between them.

16. The electronic device according to claim 15, wherein, Each of the first barrier adhesive layer and the second barrier adhesive layer has a thickness, and The thickness of the first barrier adhesive layer is smaller than the thickness of the second barrier adhesive layer.

17. The electronic device according to claim 15, wherein, The first blocking portion and the second blocking portion are spaced apart from each other along a first direction. At the foldable region, the support layer includes a first sidewall and a second sidewall, the first sidewall and the second sidewall being spaced apart from each other along the first direction, and the plurality of openings being located between the first sidewall and the second sidewall. The first sidewall and the second sidewall are spaced apart from each other by a width along the first direction, and The distance between the first blocking portion and the second blocking portion is greater than the width between the first sidewall and the second sidewall of the support layer.

18. The electronic device according to claim 14, wherein, The display panel further includes: a display area adjacent to the foldable area; and a non-display area adjacent to both the display area and the foldable area. The electronic device also includes: The first hole corresponds to the non-display area and extends through both the display panel and the support layer to have depth. The second hole corresponds to the display area and extends through the support layer to have depth. A first electronic module extends from the outside of the support layer into the first hole; and The second electronic module extends from the outside of the support layer into the second hole. The depth of the first hole is greater than the depth of the second hole.

19. The electronic device according to claim 18, wherein, At each of the first and second holes, the support layer includes sidewalls facing each other along a first direction to define the first hole and the second hole, respectively. Along the first direction, the buffer layer is spaced apart from each of the first hole and the second hole.

20. The electronic device according to claim 14, wherein, Each of the buffer layer and the barrier layer has a thickness, and The thickness of the buffer layer is greater than the thickness of the barrier layer.

21. A display device, the display device comprising: A display panel includes: a folding region, wherein the display panel is foldable at the folding region; and a non-folding region adjacent to the folding region along a first direction; A barrier layer facing the display panel; A support layer faces the display panel, and the blocking layer is located between the support layer and the display panel; Multiple openings are defined in the support layer, the multiple openings correspond to the folded area of ​​the display panel, and include a first opening closest to the non-folded area and a second opening farthest from the non-folded area; A barrier adhesive layer is located between the barrier layer and the support layer. The barrier adhesive layer includes a first barrier portion and a second barrier portion, and the first barrier portion and the second barrier portion are spaced apart from each other by a first distance along the first direction at the folded area. A first cover adhesive layer is disposed beneath the support layer; and A cover layer is disposed beneath the first cover adhesive layer. in, The support layer along the first direction includes: a first sidewall, closest to the non-folded region and defining the first opening; a second sidewall, furthest from the non-folded region and defining the second opening; and a second distance between the first sidewall and the second sidewall. The first distance between the first blocking portion and the second blocking portion is greater than the second distance between the first sidewall and the second sidewall of the support layer. The empty space is defined between the barrier layer and the first cover adhesive layer, and the empty space is divided into a first empty space and a plurality of second empty spaces. The first empty space is defined by the barrier layer, the top surface of the support layer, the first barrier portion, and the second barrier portion. The spaces of the plurality of second voids are respectively defined by the plurality of openings, and The first adhesive layer and the cover layer cover the empty space.

22. The display device according to claim 21, further comprising: A buffer layer faces the display panel, and the support layer is located between the buffer layer and the display panel. in, Each of the buffer layer and the support layer has an elastic modulus, and The elastic modulus of the buffer layer is smaller than that of the support layer.

23. The display device according to claim 22, wherein, The buffer layer includes a first buffer layer and a second buffer layer spaced apart from each other along the first direction, and The gap between the first buffer layer and the second buffer layer corresponds to the folded area of ​​the display panel.

24. The display device according to claim 23, wherein, The non-folding area of ​​the display panel includes the display area. The display device further includes: The hole corresponds to the display area and extends through the support layer. Along the first direction, the buffer layer is spaced apart from the hole.

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