Conductive traces in a suspension assembly

Abstract

This application relates to conductive traces in suspension assemblies. More specifically, a camera can include at least one suspension assembly as part of an optical image stabilization system and / or an autofocus system of the camera. The suspension assembly can include an inner frame, an outer frame, and one or more flexure arms. Conductive traces can be deposited at both sides of the suspension assembly. By removing (e.g., using an etching process) one or more portions of the body of the suspension assembly to create one or more cavities, a connection can be created through the suspension assembly for the conductive traces at different sides of the suspension assembly. The remaining portion of the suspension assembly that is surrounded by (and thus isolated from) the cavities can thus form at least a portion of the connection for the conductive traces. The connection can also include one or more filled trenches that connect the conductive traces to the remaining portion of the suspension assembly.

Description

Technical Field

[0001] This disclosure generally relates to suspension components in cameras, and more particularly to techniques for creating conductive traces in suspension components. Background Technology

[0002] The emergence of mobile multi-purpose devices such as smartphones, tablets, or phablets has led to a demand for integrating larger lenses, such as ultra-wide-angle lenses, into the devices' cameras. Some cameras incorporate optical image stabilization (OIS) mechanisms that sense and react to external stimuli / disturbances by adjusting the position of the optical lenses on the X and / or Y axes, attempting to compensate for unwanted lens movement. Furthermore, some cameras incorporate autofocus (AF) mechanisms that adjust the subject's focal length so that the object plane in front of the camera is focused on the image plane that the image sensor is capturing. In some of these AF mechanisms, the optical lens moves as a single rigid body along the camera's optical axis to refocus the camera.

[0003] Furthermore, high image quality is more easily achieved in small-form-factor cameras if lens movement along the optical axis is accompanied by minimal parasitic movement in other degrees of freedom (e.g., on the X and Y axes orthogonal to the camera's optical (Z) axis). Therefore, some small-form-factor cameras, including autofocus mechanisms, can also incorporate optical image stabilization (OIS) mechanisms that sense and react to external stimuli / disturbances by adjusting the position of the optical lens on the X and / or Y axes, in an attempt to compensate for unwanted lens movement. Summary of the Invention

[0004] According to one aspect of this disclosure, a method is provided comprising: forming a camera suspension assembly, wherein the suspension assembly includes one or more flexible arms connecting a moving platform to a stationary platform, and wherein forming the suspension assembly includes: adding a first conductive trace at a first side of a conductive substrate; adding a second conductive trace at a second side of the conductive substrate, wherein the second side is opposite to the first side; and removing one or more portions of the conductive substrate to create one or more cavities, such that the remaining portions of the conductive substrate surrounded by the one or more cavities form at least a portion of a connection between the first conductive trace and the second conductive trace located at the first side and the second side of the conductive substrate, respectively.

[0005] According to one aspect of this disclosure, a camera is provided, comprising: at least one optical lens; an image sensor; and a suspension assembly configured as part of at least one of an optical image stabilization system or an autofocus system of the camera, wherein the suspension assembly includes at least one frame having a conductive substrate, wherein a first conductive trace is located at a first side of the conductive substrate, and a second conductive trace is located at a second side of the conductive substrate opposite to the first side, wherein the conductive substrate is formed of a first material, wherein a first portion of the first material of the conductive substrate is electrically isolated from a second portion of the first material of the conductive substrate via one or more cavities, and wherein the first portion of the first material of the conductive substrate forms at least a portion of a connection between the first conductive trace and the second conductive trace located at the first side and the second side of the conductive substrate, respectively.

[0006] According to one aspect of this disclosure, a method is provided, comprising: depositing a conductive material at a first side of a conductive substrate to form a first conductive trace; depositing the conductive material at a second side of the conductive substrate to form a second conductive trace, wherein the second side is opposite to the first side; and partially etching a body of the conductive substrate to create one or more cavities, such that the remaining portion of the conductive substrate surrounded by the one or more cavities forms at least a portion of a connection between the first conductive trace and the second conductive trace. Attached Figure Description

[0007] Figure 1 An exemplary camera, which may include a suspension assembly with conductive traces, is shown according to some embodiments.

[0008] Figure 2A A top view of an exemplary suspension component according to some implementations is shown.

[0009] Figure 2B A cross-sectional view of the flexible arm and conductive traces of an exemplary suspension assembly according to some embodiments is shown.

[0010] Figures 3A to 3I Exemplary processes for creating conductive traces and connections in a suspended assembly are shown according to some embodiments.

[0011] Figure 4 A schematic diagram of an exemplary device 400, which may include a camera having one or more suspension components, is shown according to some embodiments.

[0012] Figure 5 A schematic block diagram of an exemplary computing device, which may include a camera with one or more suspension components, is shown according to some embodiments.

[0013] This specification includes references to "one embodiment" or "implementation". The use of the phrase "in one embodiment" or "in an embodiment" does not necessarily refer to the same embodiment. Specific features, structures, or characteristics may be combined in any suitable manner consistent with this disclosure.

[0014] The term "comprising" is open-ended. As used in the appended claims, it does not exclude additional structures or steps. Consider the following cited claim: "An apparatus comprising one or more processor units..." Such claims do not exclude the inclusion of additional components (e.g., network interface units, graphics circuitry, etc.).

[0015] "Configured as" refers to various units, circuits, or other components that can be described or stated as being "configured as" to perform one or more tasks. In such a context, "configured as" is used to imply a structure by indicating that the unit / circuit / component includes a structure (e.g., a circuit) that performs this one or more tasks during operation. Thus, a unit / circuit / component is allegedly configured to perform the task even when the specified unit / circuit / component is currently inoperable (e.g., not switched on). Units / circuits / components used with the language "configured as" include hardware—e.g., circuits, memory storing program instructions that can be executed to perform the operation, etc. Referring to a unit / circuit / component as being "configured as" to perform one or more tasks is explicitly intended to not invoke 35 USC § 112(f) for that unit / circuit / component. Furthermore, "configured as" can include general structures (e.g., general circuits) manipulated by software and / or firmware (e.g., FPGAs or general-purpose processors executing software) in a manner capable of performing one or more tasks to be solved. "Configured to" may also include adjusting the manufacturing process (e.g., a semiconductor manufacturing facility) to manufacture equipment (e.g., an integrated circuit) suitable for performing one or more tasks.

[0016] "First," "second," etc. As used herein, these terms serve as labels for the nouns preceding them and do not imply any type of ordering (e.g., spatial, temporal, logical, etc.). For example, a buffer circuit may be described herein as performing write operations on a "first" value and a "second" value. The terms "first" and "second" do not necessarily imply that the first value must be written before the second value.

[0017] "Based on." As used herein, this term describes one or more factors that influence the determination. This term does not exclude additional factors influencing the determination. That is, the determination may be based solely on these factors or at least partially on them. Consider the phrase "A is determined based on B." In this case, B is the factor influencing the determination of A, and such phrases do not exclude the possibility that the determination of A may also be based on C. In other instances, A may be determined solely on B.

[0018] It will also be understood that while the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. For example, without departing from the intended scope, a first contact may be referred to as a second contact, and similarly, a second contact may be referred to as a first contact. Both the first contact and the second contact are contacts, but they are not the same contact.

[0019] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the specification and appended claims, the singular forms “a,” “an,” and “the” are intended to also cover the plural forms unless the context otherwise expressly indicates otherwise. It will also be understood that the term “and / or” as used herein refers to and covers any and all possible combinations of one or more of the items listed in connection with the description. It will also be understood that the terms “comprising” and / or “including” as used in this specification specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0020] As used herein, depending on the context, the term “if” can be interpreted as meaning “when…” or “in response to determination” or “in response to detection.” Similarly, depending on the context, the phrase “if determination…” or “if detection [the stated condition or event]” can be interpreted as meaning “in response to determination…” or “in response to detection [the stated condition or event]” or “in response to detection [the stated condition or event].” Detailed Implementation

[0021] In various embodiments, techniques for creating conductive traces in a camera's suspension assembly are disclosed herein. In some embodiments, the suspension assembly may be part of a camera's autofocus (AF) system and / or optical image stabilization (OIS) system, allowing the camera's optical lenses and image sensor to move relative to each other. For example, a suspension assembly may be included as part of a camera's OIS system, wherein the suspension assembly may include an image sensor inner frame (or moving platform) connected to an outer frame (or static platform) via one or more flexible arms. The image sensor may be mounted to the inner frame, while the outer frame may be fixed relative to the camera housing. Thus, the suspension assembly provides the necessary mechanical stiffness and flexibility to allow the inner frame, together with the image sensor, to move relative to the camera's optical lenses in one or more directions (e.g., along the X and / or Y axes relative to the Z-axis or optical axis of the optical lenses). The movement of the image sensor relative to the optical lenses can be used to achieve OIS functionality. Similarly, the suspension assembly may be used as part of an AF system, for example, for the mobility of an optical lens in one or more directions (e.g., along the Z-axis or optical axis), thereby enabling autofocus functionality.

[0022] In some embodiments, it is desirable to integrate conductive traces with the suspension assembly. For example, conductive traces may be attached to the inner frame, outer frame, and / or flexible arm of the suspension assembly. The combination of conductive traces and the suspension assembly can reduce the space between components within the camera. This can reduce the overall footprint of the camera or provide additional space for other camera components (e.g., additional space for using a larger image sensor). For example, conductive traces may be added to one or both sides of the flexible arm to serve as power delivery channels (e.g., for powering the image sensor) or signal transmission links (e.g., for transmitting signals between the image sensor and an "external" processor). In some embodiments, additive manufacturing processes may be used to add conductive traces. For example, conductive material may be deposited on one or both sides of the inner frame, outer frame, and / or flexible arm to form conductive traces. In some embodiments, the suspension assembly itself (including the inner frame, outer frame, and / or flexible arm) may contain conductive material (e.g., one or more copper alloys). Therefore, the inner frame, outer frame and / or flexure arm of the suspension assembly may also include at least one electrically insulating layer, such as an insulating layer comprising polyamide, Ajinomoto stacked film (ABF) and / or other dielectric materials, thereby providing electrical insulation between the conductive trace and the flexure arm.

[0023] When adding conductive traces on both sides of a suspension assembly (e.g., an inner frame, an outer frame, and / or a flexible arm), it may be necessary to have one or more electrical connections between the conductive traces. Traditionally, electrical connections between conductive traces on different layers (e.g., located on two opposite sides of the flexible arm) can be achieved using vertical interconnect channels (or vias). Typically, a via includes a gasket connected to each layer of the conductive trace. This gasket is also connected via a hole passing through the flexible arm. Because the flexible arm itself can be conductive, the hole must first be isolated from the flexible arm, and then the hole is electroplated with a conductive material (e.g., to form a conductive tube or cylinder). Thus, the gasket, together with the conductive hole, forms a via between the conductive traces. Creating vias can be a time-consuming and costly process, especially in confined wiring spaces, such as through thin foils like flexible arms, where high precision is required. This method of creating connections is not suitable for mass production manufacturing processes.

[0024] Therefore, the techniques disclosed herein can use different processes to create connections between conductive traces on different sides of the suspension assembly (e.g., a first conductive trace on a first side and a second conductive trace on a second side opposite to the first side). The techniques may include removing (e.g., by etching) one or more portions of the suspension assembly, for example, located at specific locations between the conductive traces, thereby creating one or more cavities. The remaining portion of the suspension assembly surrounded (and thus insulated) by the cavities (e.g., in the shape of a cylinder, hourglass, rectangular prism, or other shape) (which may contain the conductive material of the suspension assembly, e.g., one or more copper alloys) can serve as a “bus” between the conductive traces (insulated by the cavities). In some embodiments, the cavities surrounding the bus may also be filled with one or more dielectric materials to further protect and / or insulate the bus. Furthermore, when the suspension assembly includes an insulating layer located between the flexible arm and the conductive trace, the techniques disclosed herein may also include, for example, creating one or more trenches through the insulating layer on both sides of the suspension assembly at locations corresponding to the bus. Conductive material can be added (e.g., using an additive manufacturing process) to fill the trenches, thereby connecting the filled trenches to the busbars (surrounded by the cavity), thus forming an electrical connection between conductive traces located on different sides of the suspension assembly. In some embodiments, the formation of conductive traces and the filling of the trenches can be achieved as part of the same additive manufacturing process (at the flexure arm). Therefore, the technology disclosed in this invention provides a more efficient manufacturing process that saves time and costs compared to conventional through-hole-based methods. Furthermore, the technology disclosed in this invention provides improved precision and quality control.

[0025] Figure 1 An exemplary camera, which may include a suspension assembly with conductive traces, is shown according to some embodiments. Figure 1In the example shown, camera 100 may include an optical lens 102 encapsulated within a lens assembly 104 in a lens carrier 106. In some embodiments, camera 100 may include an image sensor 108 for generating image data (e.g., represented by electrical signals) based on light captured by and transmitted from the optical lens 102. In some embodiments, camera 100 may include an axial motion voice coil motor 110. The axial motion voice coil motor 110 may include a suspension assembly having one or more flexible arms 112 for movably mounting the optical lens carrier 104 to a base 114, wherein the base 114 may be mechanically secured to a housing 138 of camera 100. In some embodiments, the axial motion voice coil motor 110 may include one or more magnets 116 mounted to the base 114, and one or more focusing coils 118 fixedly mounted to the lens carrier 106 and mounted to the base 114 via the flexible arms 112. In some implementations, the focusing coil 118 may have a dynamic current (e.g., Lorentz force) that can interact with the magnetic field of the magnet 116. Using the flexure arm 112, the dynamic current can allow the lens assembly 104, which includes the optical lens 102, to move relative to the image sensor 108, for example, along the optical axis or Z-axis of the optical lens 102, thus enabling the camera 100 to autofocus (AF) function.

[0026] In some embodiments, camera 100 may further include a lateral motion voice coil motor 120. The lateral motion voice coil motor 120 may include an image sensor frame 122 (which may be a moving platform), a suspension assembly including one or more flexible arms 124 for mechanically connecting the image sensor frame 122 to an image sensor outer frame 126 (which may be a stationary platform), and one or more optical image stabilization (OIS) coils 132 movably mounted to the image sensor frame 122 (e.g., via flexible printed circuit 134). In some embodiments, the OIS coils 132 may be positioned within the magnetic field of magnet 116, thus generating a force (e.g., Lorentz force). In some embodiments, camera 100 may include a support surface end stop 136 mounted to base 114 for limiting movement of the image sensor frame 122 (and image sensor 108) along the optical axis (e.g., Z-axis) of optical lens 102. Therefore, by means of the flexible arm 124, the power caused by the OIS coil 132 can move the image sensor inner frame 122 together with the image sensor 108 relative to the optical lens 102 in one or more directions (e.g., along the X and / or Y axes) orthogonal to the optical axis (e.g., the Z axis) of the optical lens 102, thereby realizing the OIS function of the camera 100.

[0027] In some implementations, in addition to serving as a mechanical connection, the conductive traces may be integrated with the AF suspension assembly and / or OIS suspension assembly of the camera 100. For illustrative purposes, using the flexible arms of the AF suspension assembly and / or OIS suspension assembly as an example, conductive traces may be attached to the flexible arm 112 of (axial motion voice coil motor 110) and / or the flexible arm 124 of (lateral motion voice coil motor 120) for the purpose of power transfer and / or signal transmission. For example, one or more conductive traces 130a and 130b may be added to one or both sides of the flexible arm 124 for (1) delivering electrical energy from a power source to the image sensor 108 (and / or OIS coil 132), and / or (2) transmitting signals between the image sensor 108 and a processor, wherein the power source and / or processor may be located inside or outside the camera 100. In some embodiments, the AF suspension assembly and / or OIS suspension assembly (e.g., flexible arms 112 and / or 124) may be made of metal (e.g., one or more copper alloys) to provide the required mechanical stiffness, and thus at least one insulating layer (e.g., an insulating layer comprising polyamide, ABF, and / or other dielectric materials) may exist between the flexible arms 112 and / or 124 and the conductive traces to which they are attached (e.g., conductive traces 130a and 130b), thereby providing insulation between the AF suspension assembly and / or OIS suspension assembly and the attached conductive traces. In some embodiments, one or more connections may be present through the body of the AF suspension assembly and / or OIS suspension assembly for connecting conductive traces at different sides of the suspension assembly. Figure 1 As shown, for example, camera 100 may include a connection 131 passing through inner frame 122, for example, at or near one or more conductor pads, thereby connecting conductive traces 130a and 130b located on different sides of the OIS suspension assembly.

[0028] Figure 2A A top view of an exemplary suspension assembly according to some embodiments is shown. In the illustrated example, suspension assembly 200 may include an inner frame 204 and an outer frame 206, both connected by one or more flexible arms 208. In some embodiments, the flexible arms 208 may be arranged along the periphery of the inner frame 204. In some embodiments, the inner frame 204 and / or the outer frame 206 may each include one or more conductor pads 210 and 212, such as... Figure 2AAs shown, the conductor pad can be used as an electrical connection point. For example, in some embodiments, the image sensor 202 may be located on a surface mounted to the inner frame 202 using the conductor pad 210. As described above, conductive traces may be integrated with the suspension assembly 200. For example, one or more conductive traces (e.g., together with the flexible arm 208) may be routed from the conductor pad 212 (of the outer frame 206) to the conductor pad 210 (of the inner frame 210) on one or both sides of the suspension assembly 200. As described above, the suspension assembly 200 may be made of metal (which may be conductive) to provide the necessary mechanical strength. In some embodiments, the suspension assembly 200 may be used to implement various AF functions and / or OIS functions of the camera. For example, a lateral voice coil motor (e.g., Figure 1 The transverse voice coil motor 120 in the inner frame 204 can generate power to move the inner frame 204 together with the image sensor 202 relative to the outer frame 206 in one or more directions (e.g., along the X-axis and / or Y-axis). Therefore, the inner frame 204 can be regarded as a moving platform because it can be moved relative to the outer frame 206, which can be regarded as a stationary platform.

[0029] Figure 2B This is a cross-sectional view of the flexible arm and conductive traces of an exemplary suspension assembly according to some embodiments. Note that, according to Figure 2A The instructions in Figure 2B Multiple flexible arms may exist in the sectional view. For illustrative purposes, in... Figure 2B Only a single flexural arm 208 is shown in the image. (As shown...) Figure 2B As shown, conductive traces may be present on both sides of the flexible arm 208. For example, a first conductive trace 210a may be added on the first side of the flexible arm 208, while a second conductive trace 210b may be added on the second side of the flexible arm 208, wherein the second side of the flexible arm 208 is opposite to the first side. Note that conductive traces 210a and 210b may have the same or different sizes and / or shapes. Additionally, in some embodiments, conductive traces 210a and 210b may contain the same or different conductive materials. In some embodiments, conductive traces 210a and 210b may be used for different purposes. For example, conductive trace 210a may be a larger trace for delivering electrical energy, while conductive trace 210b may be a thinner trace for transmitting signals. Furthermore, in some embodiments, instead of having conductive traces on both sides of the flexible arm 208 (e.g., Figure 2BAs shown, multiple conductive traces can be placed on the same side of the flexible arm 208. For example, multiple conductive traces can be placed side by side on one side of the flexible arm 208. In another example, multiple conductive traces can be stacked on top of each other on one side of the flexible arm 208. In some embodiments, the various arrangements described above can be used in combination. For example, one side of the flexible arm 208 may have one or more conductive traces placed side by side, while the other side of the flexible arm 208 may have one or more conductive traces stacked on top of each other.

[0030] As described above, the flexible arm 208 may comprise a metal, such as one or more copper alloys, to provide the required mechanical stiffness. Therefore, the flexible arm 208 may be conductive. Accordingly, at least one insulating layer 212 (comprising one or more dielectric materials, such as polyamide, ABF, etc.) may be present to provide electrical insulation between the conductive traces 210a to 210b and the flexible arm 208, such as... Figure 2B As shown. In some embodiments, at least one seed layer 214 may be present between the insulating layer 212 and the conductive traces 210a to 210b. The seed layer 214 may contain a conductive material (e.g., copper and / or other conductive materials) to facilitate the addition of the conductive traces 210a to 210b to the flexible arm 208, for example, in an additive deposition process. In some embodiments, at least one cover layer 222 (e.g., an insulating layer) may be provided to cover the conductive traces 210a to 210b together with the flexible arm 208 to provide further protection. Note that, although not shown, the inner frame 204 and / or outer frame 206 of the suspension assembly 200 may include a similar structure. For example, one or more conductive traces may be present on one or both sides of the inner frame 204 and / or outer frame 206, separated by one or more insulating layers 212 and / or one or more seed layers 214. Furthermore, in some embodiments, one or more connections may exist through the inner frame 204 and / or outer frame 206, which may be insulated by one or more cavities, to serve as electrical connections for connecting corresponding conductive traces located on different sides of the suspension assembly 200, as follows: Figures 3A to 3I As shown.

[0031] Figures 3A to 3I Exemplary processes for creating conductive traces and connections in a suspended assembly are shown according to some embodiments. Figures 3A to 3C A top view and two corresponding cross-sectional views are shown of an exemplary process following the formation of conductive traces and trenches on both sides of the suspension assembly. For illustrative purposes, Figures 3A to 3I The frame of the suspension component is shown (e.g., Figure 2AA reduced-size view of a portion of the inner frame 204 (e.g., the area within the inner frame adjacent to one or more conductor pads (e.g., conductor pad 210 of the inner frame 204)). In other words, cavities (e.g., cavities 380, 385, and 390) used as connections for conductive traces (e.g., conductive traces 310a-b, 315a-b, and 320a-b) at different sides of the frame can be formed entirely within the frame (e.g., although some sections of the boundary may not be shown in the following figures for illustrative purposes, the cavity may be enclosed within the boundaries on all four sides of the rectangular frame), or the cavity may be formed in areas at one or more edges of the frame. In some embodiments, conductive traces (e.g., conductive traces 310a to 310b, 315a to 315b, and 320a to 320b) can be added using an additive manufacturing process on both sides of a substrate 305 that may be conductive (e.g., copper alloy sheet). The frame can be formed directly using the substrate 305. In some embodiments, the substrate 305 (or frame) may be covered with at least one insulating layer 325 (e.g., an insulating layer comprising polyamide, ABF, etc.), such as Figures 3B to 3C As shown. To form conductive traces 310 to 320 on the substrate 305 (or frame), a seed layer 330 can first be applied to coat the insulating layer 325 from outside the insulating layer 325, as shown. Figures 3B to 3C As shown. Then, a dry film photoresist (DFR) can be applied (positive or negative) to cover the seed layer 330. The DFR can then be exposed (e.g., infrared (UV) light) by a patterned photomask that defines the size and shape of the conductive traces. The exposed area of ​​the DFR can be eliminated, resulting in the exposure of a patterned DFR layer of the seed layer 330 located at the bottom of the pattern. Note that the above process can be applied to one or both sides of the substrate 305 (or frame). Then, an electroforming process can be performed to deposit metal (e.g., copper, nickel alloy, etc.) onto the exposed seed layer 330 by applying a voltage between the anode and the seed layer 330, thereby forming conductive traces, such as conductive traces 310a to 310b, 315a to 315b, and 320a to 320b, on both sides of the substrate 305. Figures 3A to 3C As shown. One or more similar processes can be used, for example, before, during, or after the formation of conductive traces 310 to 320, to create and fill trenches to form filled trenches 340a to 340b, 345a to 345b, and 350a to 350b at the conductor pads 342, 347, and 352 of the substrate 305 (or frame), thereby connecting conductive traces 310 to 320 to the substrate 305. In Figures 3A to 3CIn the diagram, filled trenches 340 to 350 are shown as circles (e.g., like filled holes). In some embodiments, filled trenches 340 to 350 may have other different shapes, such as rectangular prisms, triangular prisms, etc. Additionally, filled trenches 340 to 350 may have the same or different sizes and / or shapes from one another. Finally, the remaining DFR material can be stripped or removed, and the remaining seed layer 330 (not covered by conductive traces 310 to 320) can be etched to isolate conductive traces 310a (and 310b), 315a (and 315b), and 320a (and 320b) from one another. Conductive traces 310 to 320 and trenches 340 to 350 of various sizes, shapes, and / or materials can be created by controlling photolithography and / or deposition processes. Note that the materials of the substrate 305, the conductive traces 310 to 320 and / or the filled trenches 342, 347 and 352 may be the same or different from each other.

[0032] Figures 3D to 3F A top view and two corresponding cross-sectional views are shown of an exemplary process following the initial removal of material from substrate 305 according to some embodiments. In some embodiments, one or more portions of substrate 305 may be initially removed after conductive traces 310 to 320 have been formed on both sides of substrate 305. For example, as Figure 3D As shown in the top view, according to some embodiments, a cavity 333 may be created by removing material from the substrate 305 in the region surrounding the conductive traces 310 to 320. Alternatively, in some embodiments, one or more portions of the substrate 305 may be removed to create one or more cavities 335 within the body of the substrate 305. In some embodiments, the cavity 335 may be created at locations corresponding to the filled trenches 340, 345, and 350. For example, as... Figure 3E As shown, the cavity 335 can be constructed such that the remaining portion of the substrate 305 surrounded by the cavity 335 can be created at a location between the filled trenches 345a to 345b, and similar busbars can be created at similar locations corresponding to the filled trenches 345a to 345b and 350a to 350b. Figures 3G to 3I Compared to the final removal, the initial removal can be a relatively coarse removal process requiring lower precision. In some embodiments, a photolithography process can be used to determine the location of the portions removed to create cavities 333 and 335, and an etching process can be used to remove or wash away the removed portions of substrate 305 with an etchant to achieve partial removal of material from substrate 305.

[0033] Figures 3G to 3I The diagram shows a top view and two corresponding cross-sectional views of the suspension assembly after a connection of conductive traces has been created across the body of the suspension assembly to connect the two sides of the suspension assembly, according to some embodiments. Figure 3G and Figure 3I As shown, in some embodiments, one or more portions of the substrate 305 may be further removed, such that the cavity 333 may be oriented, for example, toward... Figure 3I The cavity extends to the left and right sides. Similarly, in some embodiments, the cavity 335 can be oriented towards... Figure 3H The top and bottom and / or right and left sides of the substrate 305 are increased, thereby isolating the remaining portions 380, 385, and 390 (e.g., busbars) of the substrate 305 from the rest of the body of the substrate 305. Note that in some embodiments, the remaining portions 380, 385, and 390 may be connected to the filled trenches 340, 345, and 350, respectively. Thus, the remaining portions 380 to 390 (surrounded and insulated by cavities 333 and 335) together with the filled trenches 340 to 350 may form conductive traces 310a to 310b, 315a to 315b, and 320a to 320b for respectively connecting to different sides of the substrate 305 (e.g., frame). In some embodiments, cavities 333 and / or 335 may be filled with one or more dielectric materials (not shown) to further protect the remaining portions 380 to 390 (busbars) and / or insulate them. Note that in Figures 3H to 3I In some cross-sectional views, the remaining portions 380 to 390 (e.g., the busbars) are shown as including an hourglass shape. In some embodiments, the remaining portions 380 to 390 (busbars) can be created in various sizes and shapes. Figures 3D to 3F Compared with the initial removal in, Figures 3G to 3I The final removal in the process may require high precision to create cavities 333 and / or 335 for insulating the remaining portions 380 to 390 from the remainder of the body of the substrate 305 (e.g., the inner frame). In some embodiments, Figures 3D to 3F Initial removal and Figures 3G to 3I The final removal in the process does not have to be a separate step, but can be combined in the same steps.

[0034] Figure 4A schematic diagram of an exemplary device 400, which may include a camera that may include one or more suspension components, is shown according to some embodiments. In some embodiments, device 400 may be a mobile device and / or a multi-functional device. In various embodiments, device 400 may be any of a variety of types of devices, including but not limited to: personal computer systems, desktop computers, laptops, notebook computers, tablet computers, all-in-one computers, tablet computers or netbooks, mainframe computers, handheld computers, workstations, network computers, cameras, set-top boxes, mobile devices, augmented reality (AR) and / or virtual reality (VR), consumer devices, video game controllers, handheld video game devices, application servers, storage devices, televisions, video recording devices, peripheral devices (such as switches, modems, routers), or any type of computing or electronic device in general.

[0035] In some embodiments, device 400 may include a display system 402 (e.g., including a display and / or a touch-sensitive surface) and / or one or more cameras 404. In some non-limiting embodiments, the display system 402 and / or one or more forward-facing cameras 404a may be provided on the front side of device 400, for example as... Figure 4 As indicated. Additionally or alternatively, one or more rear-facing cameras 404b may be provided on the rear side of the device 400. In some embodiments including multiple cameras 404, some or all of the cameras may be identical or similar to each other. Additionally or alternatively, some or all of the cameras may be different from each other. In various embodiments, the position and / or arrangement of the cameras 404 may differ from... Figure 4 Those indicated in the text.

[0036] In addition, device 400 may include memory 406 (e.g., including operating system 408 and / or application / program instructions 410), one or more processors and / or controllers 412 (e.g., including CPU, memory controller, display controller, and / or camera controller, etc.), and / or one or more sensors 416 (e.g., orientation sensor, proximity sensor, and / or position sensor, etc.). In some embodiments, device 400 may communicate with one or more other devices and / or services (such as computing device 418, cloud service 420, etc.) via one or more networks 422. For example, device 400 may include a network interface (e.g., network interface 510) that enables device 400 to transmit data to network 422 and to receive data from the network. Additionally or alternatively, device 400 may be able to communicate wirelessly with other devices using any of a variety of communication standards, protocols, and / or technologies.

[0037] Figure 5 The illustration may include, for example, as referenced in this article. Figures 1 to 4 A schematic block diagram of an exemplary computing device (referred to as computing system 500) having a camera with one or more suspension components. Furthermore, computer system 500 may implement methods for controlling camera operation and / or for performing image processing on images captured by the camera. In some embodiments, (referencing herein) Figure 4 The device 400 described herein may additionally or alternatively include some or all of the functional components of the computing system 500 described herein.

[0038] Computer system 500 may be configured to perform any or all of the implementation schemes described above. In different implementation schemes, computer system 500 may be any of a variety of types of devices, including but not limited to: personal computer systems, desktop computers, laptops, notebook computers, tablet computers, all-in-one computers, tablet computers or netbooks, mainframe computers, handheld computers, workstations, network computers, cameras, set-top boxes, mobile devices, augmented reality (AR) and / or virtual reality (VR), consumer devices, video game controllers, handheld video game devices, application servers, storage devices, televisions, video recording devices, peripheral devices (such as switches, modems, routers), or any type of computing or electronic device in general.

[0039] In the illustrated implementation, computer system 500 includes one or more processors 502 coupled to system memory 504 via input / output (I / O) interface 506. Computer system 500 also includes one or more cameras 508 coupled to I / O interface 506. Computer system 500 also includes a network interface 510 coupled to I / O interface 506 and one or more input / output devices 512, such as cursor control device 514, keyboard 516, and display 518. In some cases, it is conceivable that an implementation may be carried out using a single instance of computer system 500, while in other implementations, multiple such systems or multiple nodes constituting computer system 500 may be configured to host different parts or instances of the implementation. For example, in one implementation, some elements may be implemented via one or more nodes of computer system 500 that are different from those implementing other elements.

[0040] In various embodiments, computer system 500 may be a single-processor system including one processor 502, or a multiprocessor system including several processors 502 (e.g., two, four, eight, or another suitable number). Processor 502 may be any suitable processor capable of executing instructions. For example, in various embodiments, processor 502 may be a general-purpose or embedded processor implementing any of a variety of instruction set architectures (ISAs) (such as x86, PowerPC, SPARC, or MIPS ISA or any other suitable ISA). In a multiprocessor system, each of processors 502 may, but does not necessarily, implement the same ISA.

[0041] System memory 504 may be configured to store program instructions 520 accessible via processor 502. In various embodiments, system memory 504 may be implemented using any suitable memory technology, such as static random access memory (SRAM), synchronous dynamic RAM (SDRAM), non-volatile / flash memory, or any other type of memory. Furthermore, existing camera control data 522 in memory 504 may include any of the aforementioned information or data structures. In some embodiments, program instructions 520 and / or data 522 may be received, transmitted, or stored on a different type of computer-accessible medium or similar medium separate from system memory 504 or computer system 500. In various embodiments, some or all of the functions described herein may be implemented via such computer system 500.

[0042] In one embodiment, I / O interface 506 may be configured to coordinate I / O communication between processor 502, system memory 504, and any peripheral devices (including network interface 510 or other peripheral device interfaces, such as input / output devices 512) within the device. In some embodiments, I / O interface 506 may perform any necessary protocol, timing, or other data conversions to convert data signals from one component (e.g., system memory 504) into a format suitable for use by another component (e.g., processor 502). In some embodiments, I / O interface 506 may include support for devices attached, for example, via various types of peripheral bus (e.g., variants of the Peripheral Component Interconnect (PCI) bus standard or the Universal Serial Bus (USB) standard). In some embodiments, the functionality of I / O interface 506 may be divided among two or more separate components, such as a north bridge and a south bridge. Furthermore, in some embodiments, some or all of the functionality of I / O interface 506 (such as an interface to system memory 504) may be directly incorporated into processor 502.

[0043] Network interface 510 may be configured to allow data exchange between computer system 500 and other devices (e.g., bearers or agent devices) attached to network 524, or between nodes of computer system 500. In various embodiments, network 524 may include one or more networks, including but not limited to local area networks (LANs) (e.g., Ethernet or enterprise networks), wide area networks (WANs) (e.g., the Internet), wireless data networks, some other electronic data network, or some combination thereof. In various embodiments, network interface 510 may support communication via wired or wireless general-purpose data networks (such as any suitable type of Ethernet network), for example; via telecommunications / telephone networks (such as analog voice networks or digital fiber optic communication networks); via storage area networks (such as Fibre Channel SANs), or via any other suitable type of network and / or protocol.

[0044] In some implementations, input / output device 512 may include one or more display terminals, keyboards, keypads, touchpads, scanning devices, voice or optical recognition devices, or any other device suitable for inputting or accessing data by one or more computer systems 500. Multiple input / output devices 512 may be present in the computer system 500 or distributed across various nodes of the computer system 500. In some implementations, similar input / output devices may be separate from the computer system 500 and may interact with one or more nodes of the computer system 500 via wired or wireless connections (such as through network interface 510).

[0045] Those skilled in the art will understand that computer system 500 is merely illustrative and not intended to limit the scope of embodiments. Specifically, computer systems and devices may include any combination of hardware or software capable of performing the indicated functions, including computers, network devices, internet devices, personal digital assistants, wireless telephones, pagers, etc. Computer system 500 may also be connected to other devices not shown, or conversely, may operate as a stand-alone system. Furthermore, the functionality provided by the illustrated components may, in some embodiments, be combined into fewer components or distributed across additional components. Similarly, in some embodiments, the functionality of some of the illustrated components may not be provided, and / or other additional functions may be available.

[0046] Those skilled in the art will also recognize that while various items are shown as being stored in memory or on storage devices during use, these items, or portions thereof, may be transferred between memory and other storage devices for memory management and data integrity purposes. Alternatively, in other embodiments, some or all of these software components may be executed in memory on another device and communicate with the illustrated computer system via inter-computer communication. Some or all of the system components or data structures may also be stored (e.g., as instructions or structured data) on a computer-accessible medium or portable article of manufacture for reading by a suitable drive, various examples of which are described above. In some embodiments, instructions stored on a computer-accessible medium separate from computer system 500 may be transmitted to computer system 500 via a transmission medium or signal (such as electrical, electromagnetic, or digital signals transmitted via communication media such as networks and / or wireless links). Various embodiments may also include receiving, transmitting, or storing instructions and / or data implemented according to the above description on a computer-accessible medium. Generally, computer-accessible media can include non-transitory computer-readable storage media or memory media, such as magnetic or optical media, like discs or DVD / CD-ROMs, and volatile or non-volatile media, such as RAM (e.g., SDRAM, DDR, RDRAM, SRAM, etc.), ROM, etc. In some embodiments, computer-accessible media can include transmission media or signals, such as electrical signals, electromagnetic signals, or digital signals transmitted via communication media such as networks and / or wireless links.

[0047] In various implementations, the methods described herein can be implemented in software, hardware, or a combination thereof. Furthermore, the order of the blocks of the method can be changed, and various elements can be added, reordered, combined, omitted, modified, etc. Various modifications and changes will be apparent to those skilled in the art who benefit from this disclosure. The various implementations described herein are intended to be illustrative and not restrictive. Many variations, modifications, additions, and improvements are possible. Thus, multiple examples may be provided for a component described herein as a single example. The boundaries between various components, operations, and data repositories are somewhat arbitrary, and specific operations are shown in the context of a particular exemplary configuration. Other allocations of functionality are contemplated, which may fall within the scope of the appended claims. Finally, the structures and functions of discrete components presented in exemplary configurations can be implemented as combined structures or components. These and other variations, modifications, additions, and improvements may fall within the scope of the implementations as defined in the following claims.

Claims

1. A method comprising: A camera mounting assembly is formed, wherein the mounting assembly includes one or more flexible arms connecting a moving platform to a stationary platform, and wherein forming the mounting assembly includes: A first conductive trace is added on the first side of the conductive substrate; A second conductive trace is added to a second side of the conductive substrate, wherein the second side is opposite to the first side; and One or more portions of the conductive substrate are removed to create one or more cavities, such that the remaining portions of the conductive substrate surrounded by the one or more cavities form at least a portion of the connection between the first conductive trace and the second conductive trace located on the first side and the second side of the conductive substrate, respectively.

2. The method of claim 1, wherein the conductive substrate comprises at least one insulating layer located between the first conductive trace and the conductive substrate and between the second conductive trace and the conductive substrate, and wherein forming the suspension assembly further comprises: A first trench is created at the first side of the conductive substrate through the first conductive trace and the at least one insulating layer between the conductive substrate; A second trench is created at the second side of the conductive substrate through the at least one insulating layer between the first conductive trace and the conductive substrate; as well as A conductive material is added to the first trench and the second trench, the conductive material connecting the first conductive trace and the second conductive trace to the conductive substrate.

3. The method according to claim 2, wherein the at least one layer comprises a polyamide or Ajinomoto stacked film (ABF) insulating layer.

4. The method of claim 1, wherein adding the first conductive trace and the second conductive trace at the first side and the second side of the conductive substrate respectively comprises depositing conductive material using an additive manufacturing process to form the first conductive trace and the second conductive trace at the first side and the second side of the conductive substrate respectively.

5. The method of claim 4, wherein the additive manufacturing process includes using a photoresist process to create a pattern through a dry film photoresist layer on the conductive substrate, and depositing the conductive material according to the pattern to form the first conductive trace and the second conductive trace.

6. The method of claim 1, wherein the conductive substrate comprises a copper alloy.

7. The method of claim 1, wherein the first conductive trace and the second conductive trace comprise copper.

8. The method of claim 1, wherein removing one or more portions of the conductive substrate comprises removing one or more portions of the conductive substrate using an etching process.

9. The method of claim 1, wherein the suspension assembly connects the moving platform of the image sensor of the camera to the stationary platform, such that the moving platform can move with the image sensor in one or more directions relative to at least one optical lens of the camera.

10. A camera, comprising: At least one optical lens; Image sensor; and A suspension assembly configured as part of at least one of the camera's optical image stabilization system or autofocus system. The suspension assembly includes at least one frame having a conductive substrate, wherein a first conductive trace is located on a first side of the conductive substrate, and a second conductive trace is located on a second side of the conductive substrate opposite to the first side, wherein the conductive substrate is formed of a first material, wherein a first portion of the first material of the conductive substrate is electrically isolated from a second portion of the first material of the conductive substrate through one or more cavities, and wherein the first portion of the first material of the conductive substrate forms at least a portion of the connection between the first conductive trace and the second conductive trace located on the first side and the second side of the conductive substrate, respectively.

11. The camera of claim 10, wherein the conductive substrate includes at least one insulating layer located between the first conductive trace and the conductive substrate and between the second conductive trace and the conductive substrate, and wherein the at least one frame of the suspension assembly includes: A first trench passes through at least one insulating layer between the first conductive trace and the conductive substrate at the first side of the conductive substrate. and A second trench extends at a second side of the conductive substrate through the at least one insulating layer between the first conductive trace and the conductive substrate. The first trench and the second trench are filled with a conductive material, which connects the first conductive trace and the second conductive trace to the conductive substrate.

12. The camera of claim 11, wherein the at least one insulating layer comprises a polyamide or ABF insulating layer.

13. The camera of claim 10, wherein the first conductive trace and the second conductive trace are added at the first and second sides of the conductive substrate according to an additive manufacturing process.

14. The camera of claim 13, wherein the additive manufacturing process includes creating a pattern through a dry film photoresist layer of the conductive substrate using a photolithography process, and depositing a conductive material according to the pattern to form the first conductive trace and the second conductive trace.

15. The camera of claim 10, wherein the conductive substrate comprises a copper alloy.

16. The camera of claim 10, wherein the first conductive trace and the second conductive trace comprise copper.

17. The camera of claim 10, wherein the one or more cavities are created by removing one or more portions of the conductive substrate using an etching process.

18. The camera of claim 10, wherein the image sensor of the camera is mounted to at least one frame of the suspension assembly, and wherein the at least one frame is configured to move with the image sensor relative to the at least one lens of the camera in one or more directions.

19. A method comprising: A first conductive trace is formed by depositing a conductive material on a first side of a conductive substrate; The conductive material is deposited on a second side of the conductive substrate to form a second conductive trace, wherein the second side is opposite to the first side; Partial etching of the body of the conductive substrate creates one or more cavities, such that the remaining portion of the conductive substrate surrounded by the one or more cavities forms at least a portion of the connection between the first conductive trace and the second conductive trace.

20. The method of claim 19, further comprising: A first trench is created at the first side of the conductive substrate through at least one insulating layer between the first conductive trace and the conductive substrate. A second trench is created at the second side of the conductive substrate through the at least one insulating layer between the first conductive trace and the conductive substrate; as well as Another conductive material is deposited into the first trench and the second trench, the other conductive material connecting the first conductive trace and the second conductive trace to the conductive substrate.

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