Alignment apparatus, substrate transport system and substrate transport method

Abstract

An alignment apparatus, a substrate transport system, a non-transitory storage device, and a substrate transport method are provided. The alignment apparatus includes a rotation support configured to rotate around a center axis, a rotation actuator, an edge sensor, a substrate attitude control unit, and a ring attitude control unit. The rotation support includes a substrate support configured to support a substrate at the same time and a ring support configured to support a focus ring at the same time. The rotation actuator is configured to rotate the rotation support around the center axis. The edge sensor is configured to generate an edge signal that varies according to each of an edge position of the substrate and an edge position of the focus ring. The substrate attitude control unit is configured to control the rotation actuator to adjust an attitude of the substrate to a first target attitude based on the edge signal. The ring attitude control unit is configured to control the rotation actuator to adjust an attitude of the focus ring to a second target attitude based on the edge signal.

Description

Technical Field

[0001] This disclosure relates to an alignment device, a substrate transport system, a non-temporary storage device, and a substrate transport method. Background Technology

[0002] Japanese Unexamined Patent Application Publication No. 2011-181721 discloses an alignment apparatus that includes a line sensor for detecting the edges of a wafer. The alignment apparatus is configured to detect the edges of a silicon wafer and the edges of an adhesive wafer including a glass substrate for supporting the wafer. The alignment apparatus is configured to perform each of the detection of the silicon wafer edge and the detection of the glass substrate edge. Summary of the Invention

[0003] The problem to be solved by the present invention

[0004] This disclosure describes alignment equipment, substrate transport systems, non-temporary storage devices, and substrate transport methods that are useful for saving space.

[0005] Technical solution

[0006] An alignment device according to one aspect of this disclosure includes: a rotating support configured to rotate about a central axis; a rotation actuator; an edge sensor; a substrate posture control unit; and a ring posture control unit. The rotating support includes: a plurality of substrate supports arranged around the central axis and configured to simultaneously support substrates; and a plurality of ring supports arranged around the central axis and configured to simultaneously support a focusing ring. The rotation actuator is configured to rotate the rotating support about the central axis. The edge sensor is configured to generate an edge signal that varies according to each of an edge position of the substrate supported by the substrate supports and an edge position of the focusing ring supported by the ring supports. The substrate posture control unit is configured to control the rotation actuator to adjust the posture of the substrate about the central axis to a first target posture based on the edge signal. The ring posture control unit is configured to control the rotation actuator to adjust the posture of the focusing ring about the central axis to a second target posture based on the edge signal.

[0007] A substrate transport system according to one aspect of this disclosure includes: an alignment device; a transport robot; a first receiving control unit; and a second receiving control unit. The transport robot is configured to transport each of the substrate and the focusing ring by hand. The first receiving control unit is configured to adjust the position of the hand based on the center position of the substrate and control the transport robot such that the hand receives the substrate from the alignment device. The second receiving control unit is configured to adjust the position of the hand based on the center position of the focusing ring and control the transport robot such that the hand receives the focusing ring from the alignment device.

[0008] According to one aspect of this disclosure, a non-temporary storage device stores instructions that, in response to execution by a processing device, cause the processing device to perform the following operations: detecting, using an edge sensor, the edge positions of a substrate supported by a rotating bracket at multiple locations around a central axis. The operation further includes rotating the rotating bracket about the central axis to adjust the posture of the substrate about the central axis to a first target posture based on the edge positions of the substrate detected by the edge sensor. The operation also includes detecting, using the edge sensor, the edge positions of a focusing ring supported by the rotating bracket at multiple locations around the central axis. The operation further includes rotating the rotating bracket about the central axis to adjust the posture of the focusing ring around the central axis to a second target posture based on the edge positions of the focusing ring detected by the edge sensor.

[0009] A substrate transport method according to one aspect of this disclosure includes the following steps: while rotating a rotating bracket supporting the substrate at multiple locations about a central axis, detecting the edge position of the substrate using an edge sensor disposed about the central axis; and generating a substrate edge profile based on the edge position of the substrate detected by the edge sensor, the substrate edge profile indicating the relationship between the rotation angle of the rotating bracket about the central axis and the edge position of the substrate. The method further includes the steps of: calculating the center position of the substrate in the rotating bracket based on the substrate edge profile; adjusting the position of a hand of a transport robot based on the center position of the substrate; and controlling the transport robot such that the hand supports and transports the substrate. The method further includes the steps of: while rotating a rotating bracket supporting a focusing ring at multiple locations about a central axis, detecting the edge position of the focusing ring using the edge sensor, and generating a ring edge profile based on the edge position of the focusing ring detected by the edge sensor, the ring edge profile indicating the relationship between the rotation angle of the rotating bracket about the central axis and the edge position of the focusing ring. The method further includes the following steps: calculating the center position of the focusing ring in the rotating bracket based on the ring edge contour; adjusting the position of the hand based on the center position of the focusing ring; and controlling the conveying robot so that the hand supports and conveys the focusing ring.

[0010] Invention Effects

[0011] According to this disclosure, an alignment device, a substrate transport system, a non-temporary storage device, and a substrate transport method can be provided, which are useful for saving space. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of an exemplary substrate transport system.

[0013] Figure 2 This is a floor plan of an exemplary aligned device.

[0014] Figure 3 This is a perspective view of an exemplary rotating bracket and lifting bracket.

[0015] Figure 4A yes Figure 2 The plan view of the alignment device illustrates an exemplary operation of the supporting substrate.

[0016] Figure 4B yes Figure 2 The plan view of the alignment device illustrates an exemplary operation of supporting the focusing ring.

[0017] Figure 5AThis is a schematic diagram illustrating an exemplary operation for switching the state of a holding substrate.

[0018] Figure 5B This is another schematic diagram illustrating an exemplary operation for switching the state of the holding substrate.

[0019] Figure 6A This is a schematic diagram illustrating an exemplary operation for switching the state of the focus ring.

[0020] Figure 6B This is another schematic diagram illustrating an exemplary operation for switching the state of the focus ring.

[0021] Figure 7A This is a side view of an exemplary edge sensor.

[0022] Figure 7B yes Figure 7A Another side view of the edge sensor shown in the image.

[0023] Figure 8 This is a block diagram illustrating an exemplary functional configuration of the controller.

[0024] Figure 9 This is a graph of an exemplary edge profile.

[0025] Figure 10 This is a block diagram illustrating an exemplary hardware configuration of the controller.

[0026] Figure 11 This is a flowchart illustrating an exemplary conveying process of a workpiece.

[0027] Figure 12 This is a flowchart illustrating an exemplary alignment process for a workpiece. Detailed Implementation

[0028] In the following description, with reference to the illustrations, the same elements or elements having the same function are denoted by the same reference numerals, and redundant descriptions are omitted. In some illustrations, an orthogonal coordinate system defined by the X-axis, Y-axis, and Z-axis is shown. For example, the Z-axis corresponds to the vertical direction, and the X-axis and Y-axis correspond to the horizontal direction.

[0029] substrate delivery system

[0030] Figure 1The exemplary transport system 1 (substrate transport system) shown can be configured to transport workpieces by adjusting at least one of the workpiece's posture and position. Transport system 1 transports at least two types of workpieces individually. The workpiece to be transported by transport system 1 includes a substrate W1 and a focusing ring W2. For example, substrate W1 is a semiconductor wafer having a circular shape. Focusing ring W2 is a tool for performing plasma treatment (etching) on ​​substrate W1. For example, focusing ring W2 is arranged to cover or surround the outer peripheral edge portion of substrate W1 placed on a platform during plasma treatment of substrate W1. The outer diameter of substrate W1 may be smaller than the outer diameter of focusing ring W2. The outer diameter of substrate W1 may be substantially equal to the inner diameter of focusing ring W2. The difference between the outer diameter of substrate W1 and the inner diameter of focusing ring W2 may be smaller than the difference between the outer diameter of substrate W1 and the outer diameter of focusing ring W2.

[0031] A transport system 1 is installed in a substrate processing apparatus that sequentially performs predetermined processing on multiple substrates W1. For example, the transport system 1 individually transports the substrates W1 before processing or the focusing ring W2 before use in the transport chamber of the substrate processing apparatus at different timings. The transport system 1 can adjust the posture and position of the substrates W1 when transporting them, and can adjust the posture and position of the focusing ring W2 when transporting it. The transport system 1 includes a robot device 10 and an alignment device 30.

[0032] Robot equipment

[0033] Robotic device 10 includes, for example, a transfer robot 12 and a robot controller 110. The transfer robot 12 individually carries the substrate W1 or the focusing ring W2 into or out of the alignment device 30. For example, when the workpiece to be transferred is the substrate W1, the transfer robot 12 carries the substrate W1 into or out of the alignment device 30. When the workpiece to be transferred is the focusing ring W2, the transfer robot 12 carries the focusing ring W2 into or out of the alignment device 30.

[0034] The transfer robot 12 includes, for example, a base 18, a lifting unit 22, and a transfer arm 16. The transfer arm 16 includes, for example, a hand 14, a first arm 24, and a second arm 26. The hand 14 individually supports either the substrate W1 or the focusing ring W2. The hand 14 can support each of the substrate W1 and the focusing ring W2 by any holding method. For example, the hand 14 can hold the workpiece by suction, or the hand 14 can clamp the workpiece.

[0035] The base 18 is installed at a predetermined position in the substrate processing equipment (e.g., in a transfer chamber). The base 18 may be fixed to the bottom surface of the substrate processing equipment or to a horizontally movable part of the substrate processing equipment. The lifting unit 22 extends vertically upward from the base 18 and is capable of moving up and down along the vertical axis Ax1.

[0036] The first arm 24 is connected to the upper end of the lifting unit 22. The first arm 24 extends horizontally from the upper end of the lifting unit 22 and is rotatable about axis Ax1. The second arm 26 extends horizontally from the distal end of the first arm 24 and is rotatable about a vertical axis Ax2 passing through the distal end of the first arm 24. The distal end of the second arm 26 is connected to the proximal end of the hand 14. The hand 14 is rotatable about a vertical axis Ax3 passing through the distal end of the second arm 26.

[0037] The transfer arm 16 may include a plurality of actuators (not shown) for moving the hand 14. The plurality of actuators include, for example, actuators for rotating a first arm 24 about axis Ax1, actuators for rotating a second arm 26 about axis Ax2, and actuators for rotating the hand 14 about axis Ax3. For example, the actuators of the transfer arm 16 are actuators that include a power source such as an electric motor. The transfer robot 12 may include a lifting actuator (not shown) that raises and lowers the lifting unit 22 along axis Ax1.

[0038] The position of the hand 14 in the horizontal direction (XY plane in the figure) is changed by controlling the actuators of the first arm 24 and the second arm 26 to rotate respectively. The height position of the hand 14 (position in the Z-axis direction in the figure) is changed by controlling the lifting actuators of the lifting unit 22 to raise and lower it. This configuration of the transfer robot 12 is one embodiment, and the transfer robot 12 can have any configuration as long as the position and orientation (posture) of the hand 14 in the horizontal direction and the height position of the hand 14 can be freely adjusted. As described above, the transfer robot 12 uses the hand 14 to support and transport the substrate W1 or the focusing ring W2.

[0039] The robot controller 110 controls the transfer robot 12 (each actuator) to move the hand 14 to the target position, target pose, and target height. The configuration of the robot controller 110 will be described in further detail later.

[0040] Alignment equipment

[0041] When the workpiece to be transported is substrate W1, the alignment device 30 adjusts the posture of substrate W1 received from the transfer robot 12 and detects the center position of substrate W1. When the workpiece to be transported is focusing ring W2, the alignment device 30 adjusts the posture of focusing ring W2 received from the transfer robot 12 and detects the center position of focusing ring W2. After adjusting the horizontal position of the hand 14 of the transfer robot 12 based on the center position of the workpiece (substrate W1 or focusing ring W2) detected by the alignment device 30, the hand 14 receives the workpiece. Performing these two operations adjusts the center position of the workpiece.

[0042] The alignment device 30 includes, for example, a posture adjustment unit 32 and an alignment controller 130. Figure 2As shown, the posture adjustment unit 32 includes a base 34, a rotating bracket 40, a rotating actuator 50, a lifting bracket 60, a lifting actuator 70, and an edge sensor 90. The base 34 is mounted at a predetermined position in the substrate processing equipment (e.g., in a transfer chamber).

[0043] A rotating support 40 is arranged above the base 34 and is rotatable about a central axis Ax4. For example, the central axis Ax4 passes through the base 34 and is set in a vertical line. When the workpiece to be transported is a substrate W1, the rotating support 40 supports the substrate W1 at multiple positions P1 around the central axis Ax4. When the workpiece to be transported is a focusing ring W2, the rotating support 40 supports the focusing ring W2 at multiple positions P2 around the central axis Ax4. The rotating support 40 horizontally supports the substrate W1 and the focusing ring W2.

[0044] For example, the rotating support 40 includes a rotatable portion 49, a plurality of first substrate supports 41 (substrate supports), and a plurality of first ring supports 42 (ring supports). The rotatable portion 49 is configured to rotate about a central axis Ax4. The first substrate supports 41 are disposed in the rotatable portion 49 and support substrates W1 at a plurality of positions P1 around the central axis Ax4. The first ring supports 42 are disposed in the rotatable portion 49 and support focusing rings W2 at a plurality of positions P2 around the central axis Ax4.

[0045] Multiple positions P1 are located on the circumference of the central axis Ax4. These multiple positions P1 can be arranged at equal intervals along the circumference of the central axis Ax4. The diameter of the circumference containing the multiple positions P1 is smaller than the diameter of the substrate W1. Multiple positions P2 are located on the circumference of the central axis Ax4. These multiple positions P2 can be arranged at equal intervals along the circumference of the central axis Ax4. The diameter of the circumference containing the multiple positions P2 is smaller than the outer diameter of the focusing ring W2. The diameter of the circumference containing the multiple positions P2 can be larger than the diameter of the circumference containing the multiple positions P1.

[0046] The rotatable portion 49 includes, for example, a rotating body 43 and a plurality of rotating arms 44. The rotating body 43 is substantially fixed to the center of the upper surface of the base 34 via a rotary actuator 50. The rotating body 43 is formed in a cylindrical shape. The rotating body 43 is configured such that its center substantially coincides with the central axis Ax4. The plurality of rotating arms 44 extend radially in the horizontal direction about the central axis Ax4. For example, the plurality of rotating arms 44 extend radially from the side surface of the rotating body 43. A first substrate support 41 and a first ring support 42 may be disposed at the distal end of the rotating arms 44.

[0047] like Figure 3As shown, the rotating arm 44 includes a proximal end 44a, a connecting portion 44b, a distal end 44c, and a protrusion 44d. The proximal end 44a has one end connected to the rotating body 43 (the end near the central axis Ax4) and extends from the connection point with the rotating body 43 in a direction away from the central axis Ax4. The lower end of the connecting portion 44b is connected to the other end of the proximal end 44a. The connecting portion 44b extends upward from the connection point with the proximal end 44a. One end of the distal end 44c (the end near the central axis Ax4) is connected to the upper end of the connecting portion 44b.

[0048] The distal end portion 44c extends from the connection point with the connecting portion 44b in a direction away from the central axis Ax4. A protrusion 44d is provided on the upper surface of the other end of the distal end portion 44c. The protrusion 44d is formed to protrude upward from the upper surface (exposed upper surface) of the distal end portion 44c. The height of the upper surface of the protrusion 44d is higher than the height of the upper surface of the distal end portion 44c. As described above, a step with a different height position is provided at the outer end of the rotating arm 44. This step can prevent excessive deviation between the center position of the substrate W1 and the central axis Ax4 in the rotating support 40.

[0049] The rotating support 40 includes a plurality of first pads 46 serving as first substrate supports 41 and a plurality of second pads 48 serving as first ring supports 42. The first pads 46 are respectively disposed on the rotating arms 44. The second pads 48 are respectively disposed on the rotating arms 44. The material forming the first pads 46 disposed on each rotating arm 44 includes an elastomer (e.g., rubber). The first pads 46 simultaneously support the substrate W1. With the substrate W1 supported (placed) on the first pads 46, the substrate W1 is held in place by friction between the first pads 46 and the substrate W1. The first pads 46 are disposed on the upper surface of the distal end 44c of the rotating arm 44. The first pads 46 can be formed into a ring shape in a plan view. Since the first pads 46 have the function of supporting the substrate W1, the position of the first pads 46 corresponds to position P1.

[0050] The material forming the second pad 48 disposed on each rotating arm 44 includes an elastomer (e.g., rubber). The second pad 48 also supports the focusing ring W2. With the focusing ring W2 supported (placed) on the second pad 48, the focusing ring W2 is held in place by friction between the second pad 48 and the focusing ring W2. The second pad 48 is disposed on the upper surface of the protrusion 44d of the rotating arm 44. The second pad 48 may be formed into an annular shape in a plan view. Since the second pad 48 has the function of supporting the focusing ring W2, the position of the second pad 48 corresponds to position P2.

[0051] The first pad 46 and the second pad 48 may have the same shape. The first pad 46 and the second pad 48 may be formed of the same material. The first pad 46 is closer to the central axis Ax4 than the second pad 48. In other words, the distance between the second pad 48 and the central axis Ax4 is greater than the distance between the first pad 46 and the central axis Ax4. In this case, the central axis Ax4, the first pad 46, and the second pad 48 are arranged in this order along the radial direction of the circumference of the central axis Ax4. The first substrate support 41 may be closer to the central axis Ax4 than the first ring support 42. In the axial direction of the central axis Ax4, the first ring support 42 may be located at a different height than the first substrate support 41. The axial direction is the direction in which the central axis Ax4 extends. In the axial direction, the first ring support 42 may be higher than the first substrate support 41.

[0052] The thickness (length in the Z-axis direction) of the first pad 46 and the thickness (length in the Z-axis direction) of the second pad 48 can be substantially the same as each other. The height of the upper surface of the second pad 48 can be higher than the height of the upper surface of the first pad 46. In this case, the height of the lower surface (rear surface) of the focusing ring W2 supported by the second pad 48 is higher than the height of the lower surface (rear surface) of the substrate W1 supported by the first pad 46. Therefore, the height of the focusing ring W2 supported by the first ring bracket 42 can be higher than the height of the substrate W1 supported by the first substrate bracket 41.

[0053] Regarding the exemplary rotating support 40 described above, when the workpiece to be transported is a substrate W1, a plurality of first pads 46 support the substrate W1. When the workpiece to be transported is a focusing ring W2, a plurality of second pads 48 support the focusing ring W2. Figure 4A The posture adjustment unit 32 is shown in the state where the first pad 46 (first substrate support 41) supports the substrate W1. Figure 4B The posture adjustment unit 32 is shown with the second pad 48 (first ring support 42) supporting the focusing ring W2. The rotating support 40 can be configured to support the workpiece by means of suction rather than by means of a pad including an elastomer. Figure 2 The rotating bracket 40 shown includes three rotating arms 44, but in other embodiments, the rotating bracket may include two rotating arms 44 or four or more rotating arms 44.

[0054] A rotary actuator 50 rotates a rotary support 40 about a central axis Ax4. For example, the rotary actuator 50 is disposed on the upper surface of the base 34 and supports the rotating body 43 of the rotary support 40. The rotary actuator 50 is, for example, a rotary actuator that rotates the rotating body 43 about the central axis Ax4 by means of a power source including an electric motor. When the rotary actuator 50 rotates the rotary support 40 (rotating body 43), the first substrate support 41 (e.g., the first pad 46) and the first ring support 42 (e.g., the second pad 48) rotate about the central axis Ax4. Therefore, when the substrate W1 is supported by the rotary support 40, the substrate W1 rotates about the central axis Ax4. When the focusing ring W2 is supported by the rotary support 40, the focusing ring W2 rotates about the central axis Ax4.

[0055] The lifting bracket 60 is positioned above the base 34 and is configured to remain stationary even when the rotating bracket 40 rotates. When the workpiece to be transported is a substrate W1, the lifting bracket 60 supports the substrate W1 at multiple locations P3 around the central axis Ax4. When the workpiece to be transported is a focusing ring W2, the lifting bracket 60 supports the focusing ring W2 at multiple locations P4 around the central axis Ax4. The lifting bracket 60 horizontally supports both the substrate W1 and the focusing ring W2, similar to the rotating bracket 40.

[0056] For example, the lifting support 60 includes a liftable portion 69, a plurality of second substrate supports 61, and a plurality of second ring supports 62. The liftable portion 69 is configured to be movable along a central axis Ax4. The second substrate supports 61 are disposed on the liftable portion 69 and support substrates W1 at a plurality of positions P3 around the central axis Ax4. The second ring supports 62 are disposed on the liftable portion 69 and support focusing rings W2 at a plurality of positions P4 around the central axis Ax4.

[0057] Multiple positions P3 are located on the circumference of the central axis Ax4. These multiple positions P3 can be arranged at equal intervals along the circumference of the central axis Ax4. The diameter of the circumference containing the multiple positions P3 is smaller than the diameter of the substrate W1. Multiple positions P4 are located on the circumference of the central axis Ax4. These multiple positions P4 can be arranged at equal intervals along the circumference of the central axis Ax4. The diameter of the circumference containing the multiple positions P4 is smaller than the outer diameter of the focusing ring W2. The diameter of the circumference containing the multiple positions P4 can be larger than the diameter of the circumference containing the multiple positions P3.

[0058] The liftable portion 69 includes, for example, a bottom 63, a plurality of connecting portions 64, and a plurality of end portions 65. The bottom 63 is formed in a plate shape. The bottom 63 is formed so as not to overlap with the rotating body 43 of the rotating support 40 in a plan view. The bottom 63 has ends provided at a plurality of locations around the central axis Ax4. The bottom 63 is formed to extend from one end toward the central axis Ax4 and branch to extend toward two other ends. The distance between each end of the bottom 63 and the central axis Ax4 is greater than half the outer diameter of the focusing ring W2.

[0059] like Figure 3 As shown, the connecting portion 64 is formed to extend vertically. The lower end of the connecting portion 64 is connected to one end of the bottom 63. The end portion 65 is connected to the upper end of the connecting portion 64. The end portion 65 extends from the connection point with the upper end of the connecting portion 64 toward the central axis Ax4. The second substrate support 61 and the second ring support 62 may be provided on the end portion 65.

[0060] The end portion 65 includes, for example, an upper stepped portion 65a, an inclined portion 65b, and a lower stepped portion 65c. One end of the upper stepped portion 65a is connected to the upper end of the connecting portion 64 and extends toward the central axis Ax4. One end of the inclined portion 65b is connected to the other end of the upper stepped portion 65a. The inclined portion 65b extends obliquely downward in the vertical direction from the connection point with the upper stepped portion 65a, thus approaching the central axis Ax4. One end of the lower stepped portion 65c is connected to the other end of the inclined portion 65b. The lower stepped portion 65c extends toward the central axis Ax4 from the connection point with the inclined portion 65b. The height of the upper surface of the upper stepped portion 65a is higher than the height of the upper surface of the lower stepped portion 65c. In this way, the end portion 65 provides steps with different height positions. This step can prevent excessive deviation between the center position of the substrate W1 and the central axis Ax4 in the lifting bracket 60.

[0061] The lifting support 60 includes a plurality of third pads 66 serving as second substrate supports 61 and a plurality of fourth pads 68 serving as second ring supports 62. The third pads 66 are respectively disposed at the end portions 65. The fourth pads 68 are respectively disposed at the end portions 65. The material forming the third pads 66 disposed at each end portion 65 includes an elastomer (e.g., rubber). The third pads 66 support the rear surface of the substrate W1 near the outer peripheral edge of the substrate W1. When the substrate W1 is supported (placed) on the third pads 66, the substrate W1 is held in place by friction between the third pads 66 and the substrate W1. The third pads 66 are disposed on the upper surface of the lower step portion 65c of the end portion 65. The third pads 66 can be formed into a ring shape in plan view. Since the third pads 66 have the function of supporting the substrate W1, the position of the third pads 66 corresponds to position P3.

[0062] The material forming the fourth pad 68 disposed at each end portion 65 includes an elastomer (e.g., rubber). The fourth pad 68 supports the rear surface of the focusing ring W2 near the outer peripheral edge of the focusing ring W2. With the focusing ring W2 supported (placed) on the fourth pad 68, the focusing ring W2 is held in place by friction between the fourth pad 68 and the focusing ring W2. The fourth pad 68 is disposed on the upper surface of the upper stepped portion 65a of the end portion 65. The fourth pad 68 can be formed into an annular shape in a plan view. Since the fourth pad 68 functions to support the focusing ring W2, its position corresponds to position P4.

[0063] The third pad 66 and the fourth pad 68 may have the same shape. The third pad 66 and the fourth pad 68 may be formed of the same material. The third pad 66 is closer to the central axis Ax4 than the fourth pad 68. In other words, the distance between the fourth pad 68 and the central axis Ax4 is greater than the distance between the third pad 66 and the central axis Ax4. In this case, the central axis Ax4, the third pad 66, and the fourth pad 68 are arranged in this order along the radial direction of the circumference of the central axis Ax4. The second substrate support 61 may be closer to the central axis Ax4 than the second ring support 62. In the axial direction of the central axis Ax4, the second ring support 62 may be located at a different height than the second substrate support 61. In the axial direction, the second ring support 62 may be higher than the second substrate support 61.

[0064] The height of the upper surface of the fourth pad 68 can be higher than the height of the upper surface of the third pad 66. In this case, the height of the lower surface of the focusing ring W2 supported by the fourth pad 68 is higher than the height of the lower surface of the substrate W1 supported by the third pad 66. Therefore, the height of the second ring bracket 62 supporting the focusing ring W2 can be higher than the height of the second substrate bracket 61 supporting the substrate W1.

[0065] In the example lifting bracket 60 described above, the third pads 66 respectively provided on the end portions 65 function as second substrate supports. The fourth pads 68 respectively provided on the end portions 65 function as second ring supports. The lifting bracket 60 can support the workpiece by means of suction rather than by means of pads made of elastomers. Figure 2 The exemplary lifting bracket 60 shown includes three end portions 65, but in other embodiments, the lifting bracket includes two end portions 65 or four or more end portions 65.

[0066] The lifting actuator 70 raises and lowers the lifting bracket 60 (liftable unit 69). For example, the lifting actuator 70 is disposed on the upper surface of the base 34 and supports the bottom 63 of the lifting bracket 60. For example, the lifting actuator 70 is an actuator that moves (lifts) the lifting bracket 60 along the central axis Ax4 by means of a power source including a cylinder. When the lifting actuator 70 moves the lifting bracket 60 up and down, the end portion 65 (the third pad 66 and the fourth pad 68) is moved up and down.

[0067] The lifting actuator 70 moves the lifting bracket 60 along the central axis Ax4 to switch between a state where the rotating bracket 40 supports the substrate W1 (first operating state) and a state where the lifting bracket 60 supports the substrate W1 (second operating state). The lifting actuator 70 also moves the lifting bracket 60 along the central axis Ax4 to switch between a state where the rotating bracket 40 supports the focusing ring W2 (third operating state) and a state where the lifting bracket 60 supports the focusing ring W2 (fourth operating state). For example, the lifting actuator 70 raises and lowers the lifting bracket 60 between a height position where the end portion 65 of the lifting bracket 60 is positioned above the rotating arm 44 (distal end portion 44c) and a height position where the end portion 65 is positioned below the rotating arm 44 (distal end portion 44c).

[0068] Figure 5A The illustration shows a case where the workpiece to be transported is a substrate W1 and the end portion 65 is positioned above the distal end portion 44c. When the end portion 65 is positioned above the distal end portion 44c, the lifting bracket 60 (the third pad 66s on the end portion 65) supports the substrate W1. At this height position, the substrate W1 is transported between the lifting bracket 60 and the transfer robot 12 of the robotic device 10. Figure 5B The illustration shows a case where the workpiece to be transported is a substrate W1 and the end portion 65 is positioned below the distal end portion 44c. When the end portion 65 is positioned below the distal end portion 44c, the rotating bracket 40 (the first pad 46 on the distal end portion 44c) supports the substrate W1.

[0069] Figure 6A The illustration shows a case where the workpiece to be transported is a focusing ring W2, and the end portion 65 is positioned above the distal end portion 44c (protrusion 44d). When the end portion 65 is above the distal end portion 44c, the lifting bracket 60 (the fourth pad 68 on the end portion 65) supports the focusing ring W2. At this height position, the focusing ring W2 is transported between the lifting bracket 60 and the transfer robot 12. Figure 6B The illustration shows a case where the workpiece to be transported is a focusing ring W2 and the end portion 65 is positioned below the distal end portion 44c. When the end portion 65 is positioned below the distal end portion 44c, the rotating support 40 (the second pad 48 on the protrusion 44d) supports the focusing ring W2.

[0070] like Figure 2As shown, an edge sensor 90 is disposed at least at one location on the circumference of the central axis Ax4 to detect the edge position of the substrate W1 supported by a plurality of first pads 46 and the edge position of the focusing ring W2 supported by a plurality of second pads 48. For example, the edge sensor 90 is arranged between adjacent positions P4 (between adjacent positions P3) on the circumference of the central axis Ax4. The edge sensor 90 detects the edge position (as the edge position of the substrate W1 or the focusing ring W2) in the radial direction of the circumference of the central axis Ax4. The edge sensor 90 can generate an edge signal that varies according to each of the edge position of the substrate W1 supported by the first substrate support 41 and the edge position of the focusing ring W2 supported by the first ring support 42. The edge sensor 90 can generate the edge signal by irradiating light into an illumination area extending in the radial direction of the circumference of the central axis Ax4. The distance between the inner end of the illumination area and the central axis Ax4 can be less than half the outer diameter of the substrate W1 or less than half the inner diameter of the focusing ring W2. The distance between the outer end of the irradiation area and the central axis Ax4 can be greater than half the outer diameter of the substrate W1, and also greater than half the inner diameter of the focusing ring W2.

[0071] The edge sensor 90 includes, for example, an illumination unit 92 (illumination section) and a light receiving unit 94 (light receiving section). The illumination unit 92 and the light receiving unit 94 vertically sandwich each of the substrate W1 on the first pad 46 and the focusing ring W2 on the second pad 48. Figure 7A and Figure 7B As shown, the illumination unit 92 can be arranged above each of the substrate W1 and the focusing ring W2, and the light receiving unit 94 can be arranged below each of the substrate W1 and the focusing ring W2. The illumination unit 92 includes a light source that illuminates an illumination area extending radially along a circumference, the center of which coincides with a central axis Ax4. The light receiving unit 94 is arranged opposite (facing) the illumination unit 92. The light receiving unit 94 receives light from the illumination unit 92. The edge sensor 90 can generate an edge signal based on the light received from the illumination unit 92.

[0072] The light receiving unit 94 can be a line sensor 96 having multiple light receiving elements arranged in a row along a radial direction of a circumference centered on the central axis Ax4. For example, the line sensor 96 is a CCD (charge-coupled device) line sensor. Each light receiving element in the line sensor 96 generates a signal (detection signal) based on the amount of incident light. The illumination unit 92 and the light receiving unit 94 are arranged to overlap in plan view with each of the edges of the substrate W1 supported by the rotating support 40 and the focusing ring W2. In this case, a portion of the light emitted from the illumination unit 92 toward the light receiving unit 94 is blocked by each of the substrate W1 and the focusing ring W2. The line sensor 96 can be configured to scan in a direction from the inside to the outside around the central axis Ax4 and generate and output a detection signal based on the amount of light incident on each light receiving element.

[0073] Edge sensor 90 can detect the outer peripheral edge El of substrate W1 as the edge position of substrate W1. For example... Figure 4A As shown, the outer peripheral edge E1 to be detected may include a first indicator Id1. For example, the first indicator Id1 is a notch. The edge sensor 90 can detect the inner peripheral edge E21 of the focusing ring W2 as the edge position of the focusing ring W2. Figure 4B As shown, the inner peripheral edge E21 whose position is to be detected may include a second indicator Id2. For example, the second indicator Id2 is an oriented flat portion. The first indicator Id1 is configured to adjust the orientation of the substrate W1 in the horizontal direction (or orientation about the center position of the substrate W1). The second indicator Id2 is configured to adjust the orientation of the focusing ring W2 in the horizontal direction (or orientation about the center position of the focusing ring W2).

[0074] The alignment controller 130 controls the posture adjustment unit 32 to adjust the posture of the substrate W1 and calculates the center position of the substrate W1 when the workpiece to be transported is the substrate W1. The alignment controller 130 also controls the posture adjustment unit 32 to adjust the posture of the focusing ring W2 and calculates the center position of the focusing ring W2 when the workpiece to be transported is the focusing ring W2. The alignment controller 130 can detect each of the edge positions of the substrate W1 and the focusing ring W2 based on workpiece information and edge signals. An embodiment of the configuration of the alignment controller 130 and the robot controller 110 of the robot device 10 will be described below.

[0075] like Figure 8As shown, the alignment controller 130 may include, as a functional configuration (hereinafter referred to as "functional modules"), a workpiece information acquisition unit 132, a first switching control unit 134, a first edge position acquisition unit 136, a first contour generation unit 138, a first position calculation unit 142, a substrate posture control unit 144, a second switching control unit 145, a second edge position acquisition unit 146, a second contour generation unit 148, a second position calculation unit 152, and a ring posture control unit 154. The processes performed by each of these functional modules correspond to the processes performed by the alignment controller 130.

[0076] The workpiece information acquisition unit 132 acquires workpiece information about the workpiece to be transported. The alignment controller 130 acquires workpiece information from an external source. The workpiece information acquisition unit 132 acquires workpiece information from, for example, a main controller included in a substrate processing device. The workpiece information may include type information indicating the type of workpiece and target posture information indicating the target posture of the workpiece. The type information indicates whether the workpiece to be transported is substrate W1 or focusing ring W2. The target posture information may include information indicating the target position of the first indicator Id1 and the second indicator Id2 in the circumferential direction around the central axis Ax4 (as the target posture of the workpiece).

[0077] When the workpiece to be transported is substrate W1, the first switching control unit 134 controls the lifting actuator 70 to switch between the state where the rotating support 40 supports substrate W1 and the state where the lifting support 60 supports substrate W1. For example, when the second substrate support 61 of the lifting support 60 supports substrate W1, the first switching control unit 134 controls the lifting actuator 70 to lower substrate support 61 below the first substrate support 41 of the rotating support 40, thereby switching to the state where the first substrate support 41 supports substrate W1. When the first substrate support 41 supports substrate W1, the first switching control unit 134 controls the lifting actuator 70 to raise the second substrate support 61 above the first substrate support 41, thereby switching to the state where the second substrate support 61 supports substrate W1.

[0078] When the workpiece to be transported is a substrate W1, the first edge position acquisition unit 136 acquires the detection result of the edge position (position of the outer peripheral edge E1) of the substrate W1. For example, while the rotary actuator 50 rotates the rotary support 40 (substrate W1) around the central axis Ax4, the first edge position acquisition unit 136 acquires the detection result of the position of the outer peripheral edge E1 at a predetermined rotation angle around the central axis Ax4 from the edge sensor 90. For example, the first edge position acquisition unit 136 controls the rotary actuator 50 to rotate the substrate W1 around the central axis Ax4 one or more times. The first edge position acquisition unit 136 acquires the edge position by identifying the position of the light receiving element, at which the change in signal intensity is equal to or greater than a predetermined value of the detection signal acquired by the edge sensor 90 scanning from the inside to the outside along the radial direction of the circumference centered on the central axis Ax4. When scanning radially from the inside to the outside, the first edge position acquisition unit 136 can detect the edge position of the substrate W1 by identifying a first transition from a position where light is blocked by the substrate W1 to a position where light is not blocked by the substrate W1. When scanning radially from the outside to the inside, the first edge position acquisition unit 136 can detect the edge position of the substrate W1 by identifying a third transition (first transition) from a position where light is not blocked by the substrate W1 to a position where light is blocked by the substrate W1.

[0079] As the rotary actuator 50 rotates the rotary support 40, the first contour generation unit 138 generates a substrate edge contour based on the edge position of the substrate W1 detected by the edge sensor 90. The substrate edge contour indicates the relationship between the rotation angle of the rotary support 40 about the central axis Ax4 and the edge position of the substrate W1. Figure 9 The edge contour of the substrate is shown. Figure 9 In the graph shown, the horizontal axis represents the rotation angle, and the vertical axis represents the edge position (the position of the outer peripheral edge E1). For example... Figure 9 As shown, in the substrate edge profile, due to the deviation between the center position of substrate W1 and the central axis Ax4, the edge position can change in a curved shape overall with respect to the rotation angle. The presence of the first indicator Id1 may cause a portion of the curve at the edge position to exhibit a trend different from the overall trend.

[0080] The first position calculation unit 142 calculates the center position of the substrate W1 in the rotating support 40 based on the substrate edge profile. The center position of the substrate W1 in the rotating support 40 is the center position of the substrate W1 supported by the first support 41 (e.g., the first pad 46) of the rotating support 40. The first position calculation unit 142 can calculate the center position of the substrate W1 using various methods. For example, the first position calculation unit 142 calculates the center position in the following steps. First, the first position calculation unit 142 calculates the change in edge position with respect to each predetermined rotation angle. The first position calculation unit 142 assumes that the region including the area where the rotation angle changes by an angle equal to or greater than a predetermined value is the area where the first indicator Id1 exists. Figure 9 In the embodiment shown, it is assumed that the region between rotation angles θ1 and θ2 is the region where the first indicator Id1 exists.

[0081] Then, the first position calculation unit 142 extracts multiple edge positions arranged at equal angular intervals as representative points from the first edge contour after excluding the area where the assumed substrate indicator Id1 is located. Using the multiple representative points, the first position calculation unit 142 calculates the center position (geometric center position) of the substrate edge contour after excluding the assumed area where the first indicator Id1 is located. The calculated center position of the substrate edge contour corresponds to the center position of the substrate W1 in the rotating support 40.

[0082] The substrate posture control unit 144 controls the rotary actuator 50 to adjust the posture of the substrate W1 about the central axis Ax4 to a target posture (first target posture) based on the edge position of the substrate W1 detected by the edge sensor 90. The substrate posture control unit 144 can detect the first indicator Id1 based on the edge signal. The substrate posture control unit 144 can detect the first indicator Id1 based on the aforementioned substrate edge profile indicating the position of the outer peripheral edge E2 of the substrate W1 detected by the edge sensor 90 (e.g., detecting the position of the first indicator Id1 in the circumferential direction about the central axis Ax4).

[0083] The substrate posture control unit 144 can detect the first indicator Id1 using various methods. For example, the substrate posture control unit 144 obtains the difference between the substrate edge profile and the theoretical value of the edge position of the substrate W1 (the edge position when the substrate indicator Id1 is assumed to be absent). The theoretical value of the edge position of the substrate W1 is obtained based on the calculation result of the center position of the substrate W1 in the rotating support 40. Then, the substrate posture control unit 144 determines the area where the first indicator Id1 exists by identifying areas where the difference is equal to or greater than a predetermined value. Thereafter, the substrate posture control unit 144 performs parabolic approximation, etc., on the first edge profile of the area where the first indicator Id1 exists, and calculates the rotation angle of the deepest part (the position closest to the center) as the angular position of the first indicator Id1. Figure 9 In the embodiment shown, the rotation angle θ3 is calculated as the angular position of the first indicator Id1.

[0084] After detecting the first indicator Id1, the substrate posture control unit 144 controls the rotary actuator 50 to adjust the first indicator Id1 to a target position (first target position) corresponding to the target posture of the substrate W1. For example, the substrate posture control unit 144 controls the rotary actuator 50 to make the position (angular position) of the first indicator Id1 in the circumferential direction around the central axis Ax4 close to the target position indicated by the target posture information.

[0085] When the workpiece to be transported is the focusing ring W2, the second switching control unit 145 controls the lifting actuator 70 to switch between the state where the rotating bracket 40 supports the focusing ring W2 and the state where the lifting bracket 60 supports the focusing ring W2. For example, when the second ring bracket 62 of the lifting bracket 60 supports the focusing ring W2, the second switching control unit 145 controls the lifting actuator 70 to lower the second ring bracket 62 below the first ring bracket 42 of the rotating bracket 40, to switch to the state where the ring bracket 42 supports the focusing ring W2. When the first ring bracket 42 supports the focusing ring W2, the second switching control unit 145 controls the lifting actuator 70 to raise the second ring bracket 62 above the first ring bracket 42, to switch to the state where the second ring bracket 62 supports the focusing ring W2.

[0086] When the workpiece to be transported is the focusing ring W2, the second edge position acquisition unit 146 acquires the detection result of the edge position of the focusing ring W2 (e.g., the position of the inner peripheral edge E21). While the rotary actuator 50 rotates the rotating support 40 (focusing ring W2) about the central axis Ax4, the second edge position acquisition unit 146 can acquire the detection result of the position of the inner peripheral edge E21 from the edge sensor 90 for each predetermined rotation angle about the central axis Ax4. For example, the second edge position acquisition unit 146 controls the rotary actuator 50 to rotate the focusing ring W2 about the central axis Ax4 one or more times. The second edge position acquisition unit 146 acquires the edge position by identifying the position of a light-receiving element at which the change in signal intensity is equal to or greater than a predetermined value of the detection signal acquired by the edge sensor 90 scanning from the inside to the outside along the radial direction of the circumference centered on the central axis Ax4. When scanning radially from the inside to the outside, the second edge position acquisition unit 146 can detect the edge position of the focusing ring W2 by identifying a second transition from a position where light is not blocked by the focusing ring W2 to a position where light is blocked by the focusing ring W2. This second transition is the opposite of the first transition identified to detect the edge position of the substrate W1. When scanning radially from the outside to the inside, the second edge position acquisition unit 146 can detect the edge position of the focusing ring W2 by identifying a fourth transition (the second transition) from a position where light is blocked by the focusing ring W2 to a position where light is not blocked by the focusing ring W2. This fourth transition is the opposite of the third transition identified to detect the edge position of the substrate W1.

[0087] As the rotary actuator 50 rotates the rotary support 40, the second contour generation unit 148 generates a ring edge contour based on the edge position of the focusing ring W2 detected by the edge sensor 90. The ring edge contour indicates the relationship between the rotation angle of the rotary support 40 about the central axis Ax4 and the edge position of the focusing ring W2. Similar to the substrate edge contour, the edge position in the ring edge contour can vary in a curved shape overall due to the deviation between the center position of the focusing ring W2 and the central axis Ax4. The presence of the second indicator Id2 may cause a portion of the curve of the edge position to exhibit a trend different from the overall trend.

[0088] The second position calculation unit 152 calculates the center position of the focusing ring W2 within the rotating support 40 based on the ring edge profile. The center position of the focusing ring W2 within the rotating support 40 is the center position of the focusing ring W2 supported by the first ring support 42 (e.g., the second pad 48) of the rotating support 40. The second position calculation unit 152 can calculate the center position of the focusing ring W2 using various methods. For example, the second position calculation unit 152 can calculate the center position of the focusing ring W2 in a manner similar to how the first position calculation unit 142 calculates the center position of the substrate W1.

[0089] The ring posture control unit 154 controls the rotary actuator 50 to adjust the posture of the focusing ring W2 about the central axis Ax4 to a target posture (second target posture) based on the edge position of the focusing ring W2 detected by the edge sensor 90. The ring posture control unit 154 can detect the second indicator Id2 based on the edge signal. The ring posture control unit 154 can detect the second indicator Id2 based on, for example, the aforementioned ring edge profile indicating the position of the inner peripheral edge E21 of the focusing ring W2 detected by the edge sensor 90. The ring posture control unit 154 can calculate the position of the second indicator Id2 in the circumferential direction about the central axis Ax4. The ring posture control unit 154 can detect the second indicator Id2 using various methods. For example, the ring posture control unit 154 can detect the second indicator Id2 in a similar manner to how the first posture controller 144 detects the first indicator Id1.

[0090] After detecting the second indicator Id2, the ring posture control unit 154 controls the rotary actuator 50 to adjust the second indicator Id2 to the target position (second target position) corresponding to the target posture of the focusing ring W2. The ring posture control unit 154 controls the rotary actuator 50 to make the position (angular position) of the second indicator Id2 in the circumferential direction around the central axis Ax4 close to the target position indicated by the target posture information.

[0091] The robot controller 110 includes a workpiece information acquisition unit 112, a first delivery control unit 116, a first receiving control unit 118, a second delivery control unit 122, and a second receiving control unit 124 as functional modules. The processes performed by these functional modules correspond to the processes performed by the robot controller 110.

[0092] Similar to the workpiece information acquisition unit 132 of the alignment controller 130 described above, the workpiece information acquisition unit 112 acquires workpiece information about the workpiece to be transported from outside the robot controller 110. The workpiece information acquisition unit 112 acquires workpiece information from, for example, a main controller provided in a substrate processing device. One of the workpiece information acquisition unit 112 and the workpiece information acquisition unit 132 can acquire workpiece information from the main controller and output the workpiece information to the other. For example, the workpiece information acquisition unit 112 can acquire workpiece information from the main controller and output the workpiece information to the workpiece information acquisition unit 132.

[0093] The substrate delivery control unit 116 controls the transfer robot 12 to deliver substrate W1 from the hand 14 of the transfer robot 12 to the alignment device 30 when the workpiece to be transported is substrate W1. For example, the first delivery control unit 116 controls the transfer robot 12 so that the hand 14 holds the substrate W1 before processing. Then, the first delivery control unit 116 controls each actuator of the transfer robot 12 so that the substrate W1 is placed from the hand 14 onto the lifting support 60 with the second substrate support 61 of the lifting support 60 positioned above the first substrate support 41 of the rotating support 40 in the alignment device 30. The first delivery control unit 116 can control each actuator of the transfer robot 12 such that the relative position of the hand 14 with respect to the lifting support 60 remains substantially constant among a plurality of substrates W1 transported sequentially as each substrate W1 is transported from the hand 14 to the lifting support 60.

[0094] The substrate receiving control unit 118 adjusts the position of the hand 14 based on the calculated center position of the substrate W1 and controls the transfer robot 12 so that when the workpiece to be transported is the substrate W1, the hand 14 supports and transports the received substrate W1. For example, the first receiving control unit 118 adjusts the position of the hand 14 in the horizontal direction according to the deviation between the calculated center position of the substrate W1 and the central axis Ax4, so that the difference between the center position of the substrate W1 and the reference position of the hand 14 is close to zero. When the hand 14 holds the substrate W1 in an ideal state, the reference position of the hand 14 coincides with the center position of the substrate W1.

[0095] The position of hand 14 to be adjusted is the relative position between the lifting bracket 60 and hand 14 when hand 14 receives substrate W1 from lifting bracket 60 (or just before). During the operation of transferring substrate W1 between rotating bracket 40 and lifting bracket 60, the center position of substrate W1 remains unchanged because lifting bracket 60 moves along the central axis Ax4. The center position of substrate W1 in lifting bracket 60 corresponds to (or substantially coincides with) the center position of substrate W1 in rotating bracket 40. With the position of hand 14 already adjusted, for example, the first receiving control unit 118 can control each actuator of transfer robot 12 so that hand 14 lifts substrate W1 supported by lifting bracket 60.

[0096] The center position of the substrate W1 can be calculated before adjusting the posture of the substrate W1 (e.g., before the position of the first indicator Id1 in the circumferential direction is adjusted to the target position). After the position of the first indicator Id1 in the circumferential direction is adjusted to the target position, the center position of the substrate W1 may also change. The first receiving control unit 118 can correct the center position calculated before the posture adjustment based on the amount of rotation related to the posture adjustment. The first receiving control unit 118 can adjust the position of the hand 14 based on the corrected center position of the substrate W1.

[0097] The second delivery control unit 122 controls the transfer robot 12 so that when the workpiece to be transferred is a focus ring W2, the focus ring W2 is delivered from the hand 14 of the transfer robot 12 to the alignment device 30. For example, the second delivery control unit 122 controls the transfer robot 12 so that the hand 14 holds the focus ring W2 before use. Then, the second delivery control unit 122 controls each actuator of the transfer robot 12 so that the focus ring W2 is placed from the hand 14 onto the lifting bracket 60 with the lifting bracket 60 positioned above the rotating bracket 40 in the alignment device 30. When the focus ring W2 is transferred from the hand 14 to the lifting bracket 60 (or just before the focus ring W2 is transferred), the second delivery control unit 122 can control the actuators of the transfer robot 12 so that the relative position of the hand 14 with respect to the lifting bracket 60 remains substantially constant during repeated transfer operations.

[0098] The second receiving control unit 124 adjusts the position of the hand 14 based on the calculated center position of the focusing ring W2, and controls the transfer robot 12 so that when the workpiece to be transferred is the focusing ring W2, the hand 14 supports and transports the received focusing ring W2. For example, the second receiving control unit 124 adjusts the horizontal position of the hand 14 according to the deviation between the calculated center axis Ax4 and the center position of the focusing ring W2, so that when the hand 14 holds the focusing ring W2, the difference between the center position of the focusing ring W2 and the reference position of the hand 14 is close to zero. When the holding state of the focusing ring W2 held by the hand 14 is ideal, the reference position of the hand 14 coincides with the center position of the focusing ring W2.

[0099] The position of hand 14 to be adjusted is the relative position between the lifting bracket 60 and hand 14 when hand 14 receives the focusing ring W2 from the lifting bracket 60 (or just before). During the operation of transferring the focusing ring W2 between the rotating bracket 40 and the lifting bracket 60, the center position of the focusing ring W2 does not change because the lifting bracket 60 moves in the direction along the central axis Ax4. The center position of the focusing ring W2 in the lifting bracket 60 corresponds to (or substantially coincides with) the center position of the focusing ring W2 in the rotating bracket 40. The second receiving control unit 124 can control each actuator of the transfer robot 12 so that hand 14 lifts the focusing ring W2 supported by the lifting bracket 60 with the hand 14 in the adjusted position.

[0100] The center position of the focus ring W2 can be calculated before adjusting the posture of the focus ring W2 (e.g., before the position of the second indicator Id2 in the circumferential direction is adjusted to the target position). After the position (angular position) of the second indicator Id2 in the circumferential direction is adjusted to the target position, the center position of the focus ring W2 may also change. The second receiving control unit 124 can correct the center position calculated before the posture adjustment based on the amount of rotation associated with the posture adjustment. The second receiving controller 124 can adjust the position of the hand 14 based on the corrected center position of the focus ring W2.

[0101] like Figure 10 As shown, the alignment controller 130 includes circuitry 230. Circuitry 230 includes at least one processor 232, memory 234, storage 236, communication port 238, and input / output port 242. Memory 236 is a non-volatile computer-readable storage medium (e.g., flash memory). Memory 236 stores programs and data for controlling the posture adjustment unit 32 to adjust the posture of each of the substrate W1 and the focusing ring W2 and to calculate the center position of each of the substrate W1 and the focusing ring W2.

[0102] Memory 234 temporarily stores programs loaded from memory 236, operation results of processor 232, etc. Processor 232 works with memory 234 to execute programs to configure the functional modules of alignment controller 130. Memory 236 can be a non-temporary memory device with instructions stored thereon, which, in response to execution by processor 232 (processing device), causes processor 232 to operate; these operations can be performed by functional modules. Input / output port 242 responds to instructions from processor 232, inputting and outputting electrical signals to and from rotary actuator 50, lifting actuator 70, edge sensor 90, etc. Communication port 238 responds to commands from processor 232 to communicate with robot controller 110 wirelessly or via wired means.

[0103] The robot controller 110 includes circuitry 210. Circuitry 210 includes at least one processor 212, memory 214, storage 216, communication port 218, and driver 222. Memory 216 is a non-volatile computer-readable storage medium (e.g., flash memory). Memory 216 stores programs and data for controlling the transfer robot 12 to transport each of the substrate W1 and focusing ring W2 between the transfer robot 12 and the posture adjustment unit 32.

[0104] Memory 214 temporarily stores programs loaded from memory 216, operation results of processor 212, etc. Processor 212 configures the functional modules of robot controller 110 by executing programs in cooperation with memory 214. Driver 222 outputs driving force to each actuator of the transfer robot 12 in response to commands from processor 212. Communication port 218 communicates with alignment controller 130 wirelessly or via wired means in response to commands from processor 212.

[0105] It should be noted that the robot controller 110 and the alignment controller 130 are not necessarily limited to those with corresponding functions configured by a program. For example, at least a portion of the functions of the robot controller 110 and the alignment controller 130 can be configured by dedicated logic circuitry or a specific-path integrated circuit (ASIC) integrating dedicated logic circuitry. The robot controller 110 (circuit 210) and the alignment controller 130 (circuit 230) can be housed in different housings or in the same housing. The robot controller 110 and the alignment controller 130 constitute the controller system (control system) in the conveying system 1. The conveying system 1 may include a single controller (single circuit) having the same functions as the robot controller 110 and the alignment controller 130, rather than including both the robot controller 110 and the alignment controller 130. In this case, the functional module included in a controller for controlling the posture adjustment unit 32 and the posture adjustment unit 32 constitute the alignment device.

[0106] Conveying method

[0107] Next, an exemplary substrate transport method or transport process performed by the robot controller 110 and the alignment controller 130 will be described. This transport process includes an alignment process (alignment method) performed by the alignment controller 130. The alignment process included in the transport process includes detecting the edge position of the substrate W1 supported by the rotating bracket 40 at position P1 around the central axis Ax4 using an edge sensor 90 disposed at at least one position around the central axis Ax4, and rotating the rotating bracket 40 around the central axis Ax4 to adjust the posture of the substrate W1 around the central axis Ax4 to a first target posture based on the edge position of the substrate W1 detected by the edge sensor 90. The alignment process further includes detecting the edge position of the focusing ring W2 supported by the rotating bracket 40 at position P2 around the central axis Ax4 using an edge sensor 90, and rotating the rotating bracket 40 around the central axis Ax4 to adjust the posture of the focusing ring W2 around the central axis Ax4 to a second target posture based on the edge position of the focusing ring W2 detected by the edge sensor 90.

[0108] like Figure 11As shown, the robot controller 110 first executes step S01. In step S01, for example, the workpiece information acquisition unit 112 and the workpiece information acquisition unit 132 acquire workpiece information from an external source. In step S01 and subsequent steps, when the workpiece type indicated by the workpiece information is substrate W1, processing of substrate W1 is performed, and when the workpiece type is focusing ring W2, processing of focusing ring W2 is performed. The operation when the workpiece type is substrate W1 will be described first below.

[0109] Next, the robot controller 110 executes step S02. In step S02, for example, the first delivery control unit 116 controls the transfer robot 12 to transport the substrate W1 into the alignment device 30. For example, after holding the substrate W1 in the hand 14 before processing, the first delivery control unit 116 controls the actuator of the transfer robot 12 so that the substrate W1 is delivered (placed) from the hand 14 to the lifting support 60.

[0110] Next, the alignment controller 130 performs step S03. In step S03, the alignment controller 130 aligns the substrate W1. Figure 12 This is a flowchart illustrating the alignment process in step S03.

[0111] exist Figure 12 In the alignment process shown, the alignment controller 130 first executes step S11. In step S11, for example, the first switching control unit 134 controls the lifting actuator 70, causing the second substrate support 61 of the lifting bracket 60 supporting the substrate W1 to be lowered below the first substrate support 41 of the rotating bracket 40. Therefore, the substrate W1 is transferred from the lifting bracket 60 to the rotating bracket 40.

[0112] Next, the alignment controller 130 executes steps S12 and S13. In step S12, for example, the first edge position acquisition unit 136 controls the rotary actuator 50 to begin rotating the rotating support 40 supporting the substrate W1 about the central axis Ax4. As a result, the substrate W1 begins to rotate about the central axis Ax4. In step S13, for example, the first edge position acquisition unit 136 waits until the rotation angle of the substrate W1 reaches a predetermined detection angle. This detection angle is predetermined based on the number of detection points, at which the edge position of the substrate W1 is detected.

[0113] Next, the alignment controller 130 executes steps S14 and S15. For example, in step S14, the first edge position acquisition unit 136 acquires the detection result of the position of the outer peripheral edge E1 of the substrate W1 at the detection angle from the edge sensor 90. In step S15, the first edge position acquisition unit 136 determines whether the rotating bracket 40 has rotated by a preset angle or a larger angle. This preset angle is set, for example, one or more rotations (360° or more). In this case, the position of the edge is detected throughout the entire circumference of the substrate W1.

[0114] In step S15, when it is determined that the rotating support 40 has not rotated by a preset angle or a larger angle (step S15: No), the process returns to step S13, and steps S13 to S15 are repeated. Therefore, for each detection angle (for each rotation angle), the position of the outer peripheral edge E1 of the substrate W1 is detected. On the other hand, in step S15, when it is determined that the rotating part 40 has rotated by a preset angle or a larger angle (step S15: Yes), the alignment controller 130 executes step S16. In step S16, for example, the first edge position acquisition unit 136 controls the rotation actuator 50 to stop the rotation of the rotating support 40 supporting the substrate W1 about the central axis Ax4. As a result, the rotation of the substrate W1 about the central axis Ax4 stops.

[0115] Next, the alignment controller 130 performs step S17. In step S17, for example, the first contour generation unit 138 generates a substrate edge contour indicating the relationship between the rotation angle of the rotating support 40 about the central axis Ax4 and the edge position of the substrate W1 based on the edge position of the substrate W1 obtained by performing steps S12 to S15.

[0116] Next, the alignment controller 130 executes steps S18 and S19. In step S18, for example, the first position calculation unit 142 calculates the center position of the substrate W1 in the rotating support 40 based on the substrate edge profile obtained in step S17. In step S19, for example, the substrate posture control unit 144 calculates the angular position (position in the circumferential direction around the central axis Ax4) of the first indicator Id1 set on the outer peripheral edge E1 of the substrate W1 based on the first edge profile obtained in step S17.

[0117] Next, the alignment controller 130 executes steps S20 and S21. In step S20, for example, the substrate posture control unit 144 controls the rotary actuator 50 to rotate the rotary support 40 (substrate W1) so as to adjust the angular position of the first indicator Id1 calculated in step S19 to the target position corresponding to the target orientation of the substrate W1. In step S21, for example, the first switching control unit 134 controls the lifting actuator 70 so that the second substrate support 61 of the lifting support 60 is raised above the first substrate support 41 of the rotary support 40 supporting the substrate W1. As a result, the substrate W1, whose posture has been adjusted to the target posture, is transferred from the rotary support 40 to the lifting support 60 while maintaining the posture adjusted in step S20. Therefore, the alignment process of the substrate W1 in step S03 is completed.

[0118] Next, the robot controller 110 executes step S04. In step S04, for example, the first receiving control unit 118 adjusts the position of the hand 14 based on the center position of the substrate W1 calculated in step S18, and controls the transfer robot 12 so that the hand 14 receives the substrate W1 from the alignment device 30. For example, the first receiving control unit 118 corrects the center position calculated in step S18 according to the rotation amount used for posture adjustment in step S20. Then, based on the corrected center position, the first receiving control unit 118 adjusts the position of the hand 14 in the horizontal direction by means of each actuator of the transfer arm 16 so that the holding state of the substrate W1 is close to the ideal state when the hand 14 receives the substrate W1. After the hand 14 receives the substrate W1, the first receiving control unit 118 controls the transfer robot 12 so that the hand 14 supports the substrate W1 and transports the substrate W1 to a predetermined position. When the substrate W1 is transported to the predetermined position, the adjustment of the center position of the substrate W1 can be completed. Therefore, the transfer process of one substrate W1 (one workpiece) is completed.

[0119] When the workpiece type is a focusing ring W2, the processing is performed in a manner similar to steps S02 to S04 and S11 to S21 described above. In step S02, for example, the second delivery control unit 122 controls the transfer robot 12 to transport the focusing ring W2 into the alignment device 30. For example, the second delivery control unit 122 controls the actuator of the transfer robot 12 such that the focusing ring W2 before use is held by the hand 14 and then delivered (placed) from the hand 14 to the lifting bracket 60.

[0120] In step S03, the alignment controller 130 performs the alignment process for the focus ring W2. In step S11, which includes the alignment process in step S03, for example, the second switching control unit 145 controls the lifting actuator 70, causing the second ring support 62 of the lifting bracket 60 supporting the focus ring W2 to lower below the first ring support 42 of the rotating bracket 40. Therefore, the focus ring W2 is transferred from the lifting bracket 60 to the rotating bracket 40.

[0121] In step S12, for example, the second edge position acquisition unit 146 controls the rotary actuator 50 to begin rotating the rotating bracket 40 supporting the focusing ring W2 about the central axis Ax4. Therefore, the focusing ring W2 begins to rotate about the central axis Ax4. In step S13, the second edge position acquisition unit 146 waits until the rotation angle of the rotating bracket 40 reaches a predetermined detection angle. The detection angle is predetermined based on the number of detection points, and the edge position of the focusing ring W2 is detected at each detection point.

[0122] In step S14, for example, the second edge position acquisition unit 146 acquires the detection result of the position of the inner peripheral edge E21 of the focusing ring W2 at each detection angle from the edge sensor 90. By executing steps S12 to S15, the position of the inner peripheral edge E21 of the focusing ring W2 is detected for each detection angle (for each rotation angle). In step S16, for example, the second edge position acquisition unit 146 controls the rotary actuator 50 to stop the rotation of the rotating support 40 supporting the focusing ring W2 about the central axis Ax4. As a result, the rotation of the focusing ring W2 about the central axis Ax4 stops.

[0123] In step S17, for example, the second contour generation unit 148 generates a ring edge contour indicating the relationship between the rotation angle of the rotating support 40 about the central axis Ax4 and the edge position of the focusing ring W2, based on the edge position of the focusing ring W2 obtained by executing steps S12 to S15. In step S18, for example, the second position calculation unit 152 calculates the center position of the focusing ring W2 in the rotating support 40 based on the ring edge contour obtained in step S17. In step S19, for example, the ring posture control unit 154 calculates the angular position (position in the circumferential direction about the central axis Ax4) of the second indicator Id2 set on the inner peripheral edge E21 of the focusing ring W2, based on the ring edge contour obtained in step S17.

[0124] In step S20, for example, the ring posture control unit 154 controls the rotary actuator 50 to rotate the rotary support 40 (focusing ring W2), thereby adjusting the angular position of the second indicator Id2 calculated in step S19 to a target position corresponding to the target posture of the focusing ring W2. In step S21, for example, the second switching control unit 145 controls the lifting actuator 70, causing the second ring support 62 of the lifting support 60 to rise above the first ring support 42 of the rotary support 40 supporting the focusing ring W2. Therefore, while the focusing ring W2 maintains the posture adjusted in step S20, the focusing ring W2, whose posture has been adjusted to the target posture, is transferred from the rotary support 40 to the lifting support 60.

[0125] For example, in step S04, the second receiving control unit 124 adjusts the position of the hand 14 based on the center position of the focusing ring W2 calculated in step S18, and controls the transfer robot 12 so that the hand 14 receives the focusing ring W2 from the alignment device 30. For example, in step S20, the second receiving control unit 124 corrects the center position calculated in step S18 according to the amount of rotation used for posture adjustment. Then, based on the corrected center position, the second receiving control unit 124 adjusts the position of the hand 14 in the horizontal direction by means of each actuator of the transfer arm 16 so that when the hand 14 receives the focusing ring W2, the holding state of the focusing ring W2 is close to the ideal state. After the hand 14 receives the focusing ring W2, the second receiving control unit 124 controls the transfer robot 12 so that the hand 14 supports the focusing ring W2 and transports the focusing ring W2 to a predetermined position. When the focusing ring W2 is transported to the predetermined position, the adjustment of the center position of the focusing ring W2 can be completed.

[0126] The robot controller 110 and the alignment controller 130 repeatedly perform the above steps S01 to S04 on multiple workpieces. For example, the robot controller 110 and the alignment controller 130 may alternate between a first step including steps S01 to S04 for multiple substrates W1 and a second step including steps S01 to S04 for a single focusing ring W2.

[0127] The above-described series of processes is one embodiment and can be modified appropriately. In the above-described series of processes, the robot controller 110 and the alignment controller 130 can execute one step and the next step in parallel, or they can execute each step in a different order than in the above embodiment. The robot controller 110 and the alignment controller 130 can omit any step and can perform a process different from the above embodiment in any step.

[0128] In the above series of processes, both the posture of substrate W1 and the center position of substrate W1 are adjusted. However, the posture of substrate W1 can be adjusted without adjusting the center position of substrate W1. Similarly, the posture of focusing ring W2 and the center position of focusing ring W2 are adjusted in the above series of processes. However, the posture of focusing ring W2 can be adjusted without adjusting its center position. The center position of focusing ring W2 can be adjusted without adjusting its posture. The substrate W1 and focusing ring W2 may differ in the aspects to be adjusted.

[0129] Although the alignment device 30 uses pads or suction to hold the substrate W1 or the focusing ring W2, the alignment device (rotary support) can be configured to hold the substrate W1 and the focusing ring W2 by clamping. In this case, the rotary support 40 can clamp the workpiece so that the center position of the workpiece is close to the central axis Ax4 when clamping the workpiece to be transported.

[0130] Although the edge sensor 90 described above detects the position of the inner peripheral edge E21 of the focusing ring W2 as the edge position of the focusing ring W2, in other embodiments, the edge sensor 90 can detect the position of the outer peripheral edge E22 of the focusing ring W2 as the edge position of the focusing ring W2. In this case, the second indicator Id2 can be disposed on the outer peripheral edge E22.

[0131] Furthermore, unlike at least some of the embodiments described above, the height of the first substrate support 41 can substantially coincide with the height of the first ring support 42. The height of the second substrate support 61 can substantially coincide with the height of the second ring support 62.

[0132] As described in some of the embodiments above, the alignment device 30 may include a rotating support 40 configured to rotate about a central axis Ax4. The rotating support 40 includes a first substrate support 41 and a first ring support 42. The first substrate support 41 surrounds the central axis Ax4 and is configured to simultaneously support a substrate W1. The first ring support 42 surrounds the central axis Ax4 and is configured to simultaneously support a focusing ring W2. Furthermore, the alignment device 30 may include: a rotary actuator 50 configured to rotate the rotating support 40 about the central axis Ax4; and an edge sensor 90 configured to detect the edge position of the substrate W1 supported by the first substrate support 41 and the edge position of the focusing ring W2 supported by the ring support 42. Additionally, the alignment device 30 may also include a substrate posture control unit 144 and a ring posture control unit 154. The substrate posture control unit 144 may be configured to control the rotary actuator 50 to adjust the posture of the substrate W1 about the central axis Ax4 to a first target posture based on the edge position of the substrate W1 detected by the edge sensor 90. Furthermore, the ring posture control unit 154 can be configured to control the rotary actuator 50 to adjust the posture of the focusing ring W2 about the central axis Ax4 to a second target posture based on the edge position of the focusing ring W2 detected by the edge sensor 90.

[0133] In the alignment device 30, the orientation of the substrate W1 and the orientation of the focusing ring W2 are adjusted separately. Since the orientations of the substrate W1 and the focusing ring W2 can be adjusted by a single device, this is useful for saving space.

[0134] The edge position of substrate W1 detected by edge sensor 90 may include the position of the outer peripheral edge E1 of substrate W1. The edge position of focusing ring W2 detected by edge sensor 90 may include the position of the inner peripheral edge E21 of focusing ring W2. The inner diameter of focusing ring W2 tends to be substantially the same as the outer diameter of substrate W1. Therefore, compared to detecting the position of the outer peripheral edge E22 of focusing ring W2, the detection range of edge sensor 90 can be reduced. Therefore, it is useful for realizing device sharing and simplifying alignment devices.

[0135] The outer peripheral edge E1 of the substrate W1 may include a first indicator Id1. The inner peripheral edge E21 of the focusing ring W2 may include a second indicator Id2. The substrate posture control unit 144 may be configured to detect the first indicator Id1 based on the edge position of the substrate W1 detected by the edge sensor 90, and control the rotary actuator 50 to adjust the position of the first indicator Id1 to a first target position corresponding to a first target posture. The ring posture control unit 154 may be configured to detect the second indicator Id2 based on the edge position of the focusing ring W2 detected by the edge sensor 90, and control the rotary actuator 50 to adjust the position of the second indicator Id2 to a second target position corresponding to a second target posture. In this case, each of the first indicator Id1 and the second indicator Id2 is used to adjust the posture of the workpiece. Therefore, it is advantageous to adjust the posture of the substrate W1 and the focusing ring W2 more accurately.

[0136] The distance between each of the first ring supports 42 and the central axis Ax4 can be greater than the distance between each of the first substrate supports 41 and the central axis Ax4. The height of the first ring supports 42 is higher than the height of the first substrate supports 41. In this case, the rotating support 40 can be divided into a portion for supporting the substrate W1 and a portion for supporting the focusing ring W2. Therefore, it is useful for reducing the influence of one workpiece on another workpiece (e.g., particle adhesion).

[0137] The alignment device 30 may further include a lifting support 60 and a lifting actuator 70. The lifting support 60 may include: a second substrate support 61, configured to simultaneously support substrate W1 around a central axis Ax4; and a second ring support 62, configured to simultaneously support a focusing ring W2 around the central axis Ax4. The lifting actuator 70 may be configured to move the lifting support 60 along the central axis Ax4 to switch between a state where the rotating support 40 supports substrate W1 and a state where the lifting support 60 supports substrate W1. The lifting actuator 60 may be further configured to move the lifting support 60 along the central axis Ax4 to switch between a state where the rotating support 40 supports focusing ring W2 and a state where the lifting support 60 supports focusing ring W2. In this case, although the orientation of the rotating support 40 about the central axis Ax4 can be changed by means of rotation of the actuator 50, the orientation of the lifting support 60 about the central axis Ax4 may be constant. Therefore, by transferring the workpiece to be adjusted to and from the transfer robot 12 via the lifting bracket 60, the transfer to and from the transfer robot 12 is facilitated. This is therefore useful for simplifying the transport operation of the transfer robot 12.

[0138] The distance between each second ring support 62 and the central axis Ax4 is greater than the distance between each second substrate support 61 and the central axis Ax4. The height of the second ring support 62 is higher than the height of the second substrate support 61. In this case, the lifting support 60 can be divided into a portion supporting the substrate W1 and a portion supporting the focusing ring W2. Therefore, it is useful for reducing the influence of one workpiece on another (e.g., particle adhesion).

[0139] The alignment device 30 may further include a first contour generation unit 138 and a second contour generation unit 148. The first contour generation unit 138 may be configured to generate a substrate edge contour based on the edge position of the substrate W1 detected by the edge sensor 90 while the rotating support 40 is rotated by the rotary actuator 50. The substrate edge contour indicates the relationship between the rotation angle of the rotating support 40 about the central axis Ax4 and the edge position of the substrate W1. The second contour generation unit 148 may be configured to generate a ring edge contour based on the edge position of the focusing ring W2 detected by the edge sensor 90 while the rotating support 40 is rotated by the rotary actuator 50. The ring edge contour indicates the relationship between the rotation angle of the rotating support 40 about the central axis Ax4 and the edge position of the focusing ring W2. Furthermore, the alignment device 30 may include: a first position calculation unit 142 configured to calculate the center position of the substrate W1 in the rotating support 40 based on the substrate edge contour; and a second position calculation unit 152 configured to calculate the center position of the focusing ring W2 in the rotating support 40 based on the ring edge contour. In this configuration, the center positions of substrate W1 and focusing ring W2 are calculated by the alignment device 30. Therefore, the portion of the processing required to adjust the center positions of substrate W1 and focusing ring W2 can be performed by a single device. This is therefore useful for saving space in devices used to adjust the orientation and position of substrate W1 and focusing ring W2.

[0140] In some embodiments described above, the transport system 1 may include: an alignment device 30; a transport robot 12 configured to transport a substrate W1 and a focus ring W2 using its hand 14; and a first receiving control unit 118 configured to adjust the position of the hand 14 based on a calculation of the center position of the substrate W1 and to control the transport robot 12 so that the hand 14 receives the substrate W1 from the alignment device 30. Furthermore, the transport system 1 may include a second receiving control unit 124 configured to adjust the position of the hand 14 based on a calculation of the center position of the focus ring W2 and to control the transport robot 12 so that the hand 14 receives the focus ring W2 from the alignment device 30. As described above, since the posture and center position of the substrate W1 and the focus ring W2 can be adjusted by a single system, space saving is advantageous.

[0141] Furthermore, at least some of the methods in the above exemplary substrate transport method include: while a rotating support 40 supporting substrate W1 at multiple locations P1 rotates about a central axis Ax4, an edge sensor 90 detects the edge position of substrate W1 about a predetermined central axis Ax4; and generating a substrate edge profile based on the edge position of substrate W1 detected by the edge sensor 90, the substrate edge profile indicating the relationship between the rotation angle of the rotating support 40 about the central axis Ax4 and the edge position of substrate W1. Additionally, the substrate transport method may include: calculating the center position of substrate W1 in the rotating support 40 based on the substrate edge profile; adjusting the position of hand 14 based on the calculated center position of substrate W1; controlling the transport robot 12 such that hand 14 supports and transports substrate W1; and detecting the edge position of focusing ring W2 by edge sensor 90 while the rotating support 40 supporting focusing ring W2 at multiple locations P2 rotates about the central axis Ax4. Furthermore, the substrate transport method may include: generating a ring edge profile based on the edge position of the focusing ring W2 detected by the edge sensor 90, the ring edge profile indicating the relationship between the rotation angle of the rotating support 40 about the central axis Ax4 and the edge position of the focusing ring W2; calculating the center position of the focusing ring W2 in the rotating support based on the ring edge profile; adjusting the position of the hand 14 based on the calculated center position of the focusing ring W2; and controlling the transport robot 12 such that the hand 14 supports and transports the focusing ring W2. In some exemplary transport methods, a common rotating support and an edge sensor are used to adjust the center positions of the substrate W1 and the focusing ring W2, respectively. As mentioned above, since the center positions of the substrate W1 and the focusing ring W2 can be adjusted by a single system, it is useful for saving space.

Claims

1. An alignment device, the alignment device comprising: A rotating support, configured to rotate about a central axis, comprising: Multiple substrate supports, the multiple substrate supports being arranged around the central axis and configured to simultaneously support substrates; and Multiple ring supports, which are arranged around the central axis and configured to simultaneously support the focusing ring; A rotary actuator configured to rotate the rotary support about the central axis; An edge sensor configured to generate an edge signal that varies according to each of the edge position of the substrate supported by the substrate support and the edge position of the focusing ring supported by the ring support; A substrate posture control unit, configured to control the rotation actuator to adjust the posture of the substrate about the central axis to a first target posture based on the edge signal; and A ring-shaped attitude control unit is configured to control the rotary actuator to adjust the focused attitude around the central axis to a second target attitude based on the edge signal. The alignment device further includes: The lifting bracket includes: A plurality of second substrate supports, the plurality of second substrate supports being arranged around the central axis and configured to simultaneously support the substrate; and A plurality of second ring supports, which are arranged around the central axis and configured to simultaneously support the focusing ring. The plurality of second ring supports are located at different heights from the plurality of second base plate supports in the axial direction of the central axis.

2. The alignment device according to claim 1, wherein, The edge position of the substrate is the position of the outer peripheral edge of the substrate; and Wherein, the edge position of the focusing ring is the position of the inner peripheral edge of the focusing ring.

3. The alignment device according to claim 2, wherein, The outer peripheral edge of the substrate includes a first indicator; The inner peripheral edge of the focusing ring includes a second indicator; The substrate posture control unit is configured to detect the first indicator based on the edge signal; The substrate posture control unit is configured to control the rotary actuator to adjust the position of the first indicator to a first target position corresponding to the first target posture; The ring posture control unit is configured to detect the second indicator based on the edge signal; and The ring posture control unit is configured to control the rotation actuator to adjust the position of the second indicator to a second target position corresponding to the second target posture.

4. The alignment device according to any one of claims 1 to 3, wherein, The substrate support is configured to support the rear surface of the substrate; and The ring support is configured to support the rear surface of the focusing ring.

5. The alignment device according to any one of claims 1 to 3, wherein, The distance between each ring support and the central axis is greater than the distance between each base plate support and the central axis.

6. The alignment device according to claim 5, wherein, In the axial direction of the central axis, the ring support is located at a different height from the base plate support.

7. The alignment device according to claim 6, wherein, In the axial direction, the ring support is higher than the substrate support.

8. The alignment device according to any one of claims 1 to 3, wherein the alignment device further comprises: A first contour generation unit is configured to generate a substrate edge contour based on the edge position of the substrate detected by the edge sensor while the rotating bracket is rotated by the rotary actuator. The substrate edge contour indicates the relationship between the rotation angle of the rotating bracket about the central axis and the edge position of the substrate. A second contour generation unit is configured to generate a ring edge contour based on the edge position of the focusing ring detected by the edge sensor while the rotating bracket is rotated by the rotary actuator. The ring edge contour indicates the relationship between the rotation angle of the rotating bracket about the central axis and the edge position of the focusing ring. A first position calculation unit is configured to calculate the center position of the substrate in the rotating bracket based on the edge contour of the substrate. as well as A second position calculation unit is configured to calculate the center position of the focusing ring in the rotating bracket based on the ring edge profile.

9. An alignment device, the alignment device comprising: A rotating support, configured to rotate about a central axis, comprising: Multiple substrate supports, the multiple substrate supports being arranged around the central axis and configured to simultaneously support substrates; and Multiple ring supports, which are arranged around the central axis and configured to simultaneously support the focusing ring; A rotary actuator configured to rotate the rotary support about the central axis; An edge sensor configured to generate an edge signal that varies according to each of the edge position of the substrate supported by the substrate support and the edge position of the focusing ring supported by the ring support; A substrate posture control unit, configured to control the rotation actuator to adjust the posture of the substrate about the central axis to a first target posture based on the edge signal; and A ring-shaped attitude control unit is configured to control the rotary actuator to adjust the focused attitude around the central axis to a second target attitude based on the edge signal. Wherein, the edge position of the substrate is the position of the outer peripheral edge of the substrate. Wherein, the edge position of the focusing ring is the position of the inner peripheral edge of the focusing ring. Wherein, the difference between the outer diameter of the substrate and the inner diameter of the focusing ring is smaller than the difference between the outer diameter of the substrate and the outer diameter of the focusing ring; The edge sensor is configured to generate the edge signal by irradiating light into an illumination area extending in a radial direction around the circumference of the central axis. Wherein, the distance between the inner end of the irradiation area and the central axis is less than half the outer diameter of the substrate, and also less than half the inner diameter of the focusing ring; and The distance between the outer end of the irradiation area and the central axis is greater than half the outer diameter of the substrate and also greater than half the inner diameter of the focusing ring.

10. The alignment device according to claim 9, wherein, The edge sensor includes: An irradiation unit, configured to irradiate light onto the irradiation area; and A light receiving unit is arranged to face the irradiation unit and configured to receive light from the irradiation unit.

11. The alignment device according to claim 10, in, The edge sensor is configured to generate the edge signal based on light received from the irradiation unit; The alignment device further includes: A workpiece information acquisition unit is configured to acquire workpiece information indicating whether the workpiece is the substrate or the focusing ring; A first edge position acquisition unit is configured to detect the edge position of the substrate based on the workpiece information and the edge signal; and The second edge position acquisition unit is configured to detect the edge position of the focusing ring based on the workpiece information and the edge signal.

12. The alignment device according to claim 11, wherein, The first edge position acquisition unit is configured to detect the edge position of the substrate by scanning the substrate in a scanning direction to identify a first transition from the point where the light is blocked by the substrate to the point where the light is not blocked by the substrate; and The second edge position acquisition unit is configured to detect the edge position of the focusing ring by scanning the focusing ring in the scanning direction, so as to identify a second transition from the point where the light is not blocked by the focusing ring to the point where the light is blocked by the focusing ring, the second transition being the opposite of the first transition.

13. The alignment device according to claim 11, wherein, The first edge position acquisition unit is configured to detect the edge position of the substrate by scanning the substrate in a scanning direction to identify a first transition from the point where the light is not blocked by the substrate to the point where the light is blocked by the substrate; and The second edge position acquisition unit is configured to detect the edge position of the focusing ring by scanning the focusing ring in the scanning direction, so as to identify a second transition from the point where the light is blocked by the focusing ring to the point where the light is not blocked by the focusing ring, the second transition being the opposite of the first transition.

14. An alignment device, the alignment device comprising: A rotating support, configured to rotate about a central axis, comprising: Multiple substrate supports, the multiple substrate supports being arranged around the central axis and configured to simultaneously support substrates; and Multiple ring supports, which are arranged around the central axis and configured to simultaneously support the focusing ring; A rotary actuator configured to rotate the rotary support about the central axis; An edge sensor configured to generate an edge signal that varies according to each of the edge position of the substrate supported by the substrate support and the edge position of the focusing ring supported by the ring support; A substrate posture control unit is configured to control the rotation actuator to adjust the posture of the substrate about the central axis to a first target posture based on the edge signal. A ring posture control unit, configured to control the rotational actuator to adjust the focused posture around the central axis to a second target posture based on the edge signal; The lifting bracket includes: A plurality of second substrate supports, the plurality of second substrate supports being arranged around the central axis and configured to simultaneously support the substrate; and A plurality of second ring supports, the plurality of second ring supports being arranged around the central axis and configured to simultaneously support the focusing ring; as well as A lifting actuator is configured to move the lifting support along the central axis to switch between a first operating state in which the rotating support supports the substrate and a second operating state in which the lifting support supports the substrate; and The lifting actuator is further configured to move the lifting bracket along the central axis to switch between a third operating state in which the rotating bracket supports the focusing ring and a fourth operating state in which the lifting bracket supports the focusing ring.

15. The alignment device according to claim 14, wherein, The distance between each second ring bracket and the central axis is greater than the distance between each second base plate bracket and the central axis.

16. The alignment device according to claim 15, wherein, In the axial direction of the central axis, the second ring support is higher than the second base plate support.

17. A substrate transport system, the substrate transport system comprising: Alignment equipment; A transfer robot configured to manually transport each of the substrate and the focusing ring; A first receiving control unit, wherein the transfer robot is configured to adjust the position of the hand based on the center position of the substrate, and to control the transfer robot such that the hand receives the substrate from the alignment device; as well as A second receiving control unit is configured to adjust the position of the hand based on the center position of the focusing ring and to control the transfer robot so that the hand receives the focusing ring from the alignment device. The alignment device includes: A rotating support, configured to rotate about a central axis, comprising: Multiple substrate supports, the multiple substrate supports being arranged around the central axis and configured to simultaneously support substrates; and Multiple ring supports, which are arranged around the central axis and configured to simultaneously support the focusing ring; A rotary actuator configured to rotate the rotary support about the central axis; An edge sensor configured to generate an edge signal that varies according to each of the edge position of the substrate supported by the substrate support and the edge position of the focusing ring supported by the ring support; A substrate posture control unit is configured to control the rotation actuator to adjust the posture of the substrate about the central axis to a first target posture based on the edge signal. A ring-shaped attitude control unit is configured to control the rotary actuator to adjust the focused attitude around the central axis to a second target attitude based on the edge signal. A first contour generation unit is configured to generate a substrate edge contour based on the edge position of the substrate detected by the edge sensor while the rotating bracket is rotated by the rotary actuator. The substrate edge contour indicates the relationship between the rotation angle of the rotating bracket about the central axis and the edge position of the substrate. A second contour generation unit is configured to generate a ring edge contour based on the edge position of the focusing ring detected by the edge sensor while the rotating bracket is rotated by the rotary actuator. The ring edge contour indicates the relationship between the rotation angle of the rotating bracket about the central axis and the edge position of the focusing ring. A first position calculation unit is configured to calculate the center position of the substrate in the rotating support based on the edge contour of the substrate; and A second position calculation unit is configured to calculate the center position of the focusing ring in the rotating bracket based on the ring edge profile.

18. The substrate transport system according to claim 17, wherein, The alignment device further includes: The lifting bracket includes: A plurality of second substrate supports, the plurality of second substrate supports being arranged around the central axis and configured to simultaneously support the substrate; and A plurality of second ring supports, the plurality of second ring supports being arranged around the central axis and configured to simultaneously support the focusing ring; A lifting actuator is configured to move the lifting bracket along the central axis to switch between a first operating state in which the rotating bracket supports the substrate and a second operating state in which the lifting bracket supports the substrate, wherein the lifting actuator is further configured to move the lifting bracket along the central axis to switch between a third operating state in which the rotating bracket supports the focusing ring and a fourth operating state in which the lifting bracket supports the focusing ring. A first switching control unit, configured to control the lifting actuator such that the substrate, whose posture has been adjusted to the first target posture, is supported by the lifting bracket; and A second switching control unit is configured to control the lifting actuator such that the focusing ring, whose posture has been adjusted to the second target posture, is supported by the lifting bracket. The first receiving control unit is configured to control the conveying robot so that the hand receives the substrate from the lifting bracket; The second receiving control unit is configured to control the transfer robot so that the hand receives the focusing ring from the lifting support.

19. A substrate transport method, the substrate transport method comprising: While the rotating bracket supporting the substrate at multiple locations around the central axis rotates, the edge position of the substrate is detected by an edge sensor arranged around the central axis. A substrate edge profile is generated based on the edge position of the substrate detected by the edge sensor, and the substrate edge profile indicates the relationship between the rotation angle of the rotating bracket about the central axis and the edge position of the substrate. The center position of the substrate in the rotating bracket is calculated based on the edge contour of the substrate. Based on the center position of the substrate, the position of the hand of the transfer robot is adjusted, and the transfer robot is controlled so that the hand receives the substrate from the alignment device; Control the conveying robot so that the hand supports and conveys the substrate; While the rotating bracket supporting the focusing ring rotates at multiple locations around the central axis, the edge sensor detects the edge position of the focusing ring. A ring edge profile is generated based on the edge position of the focusing ring detected by the edge sensor. The ring edge profile indicates the relationship between the rotation angle of the rotating bracket about the central axis and the edge position of the focusing ring. The center position of the focusing ring in the rotating bracket is calculated based on the ring edge profile. The position of the hand is adjusted based on the center position of the focusing ring, and the transfer robot is controlled so that the hand receives the focusing ring from the alignment device; as well as Control the delivery robot so that the hand supports and delivers the focusing ring.

Images