Laser device and laser device processing method

Abstract

A laser device and a laser device processing method are provided. Embodiments of the laser device include a laser beam output section, a correction section that corrects a laser beam emitted from the laser beam output section, a laser scanner that scans the laser beam corrected by the correction section, a reflector that reflects the laser beam scanned by the laser scanner to a processing substrate, and a control section that controls the correction section, the control section controlling the correction section according to a scanning condition of the laser scanner.

Description

Technical Field

[0001] This disclosure relates to laser devices and their operating methods. Background Technology

[0002] Many efforts have been made to improve the accuracy of laser devices by adjusting the laser incident angle according to the position of the substrate irradiating the laser.

[0003] US Patent 5,087,987 discloses a color-correcting F-θ lens for infrared light with wavelengths of 780-890 nm. However, the F-θ lens used in the method disclosed in this patent is susceptible to damage by high-output lasers or lasers using ultraviolet light, making it difficult to apply to devices using high-output lasers or ultraviolet light.

[0004] US Patent 5,838,481 discloses the application of F-θ lenses and concave mirrors. However, since laser irradiation scans one-dimensionally along a single direction, multiple identical one-dimensional scans are required to scan the entire two-dimensional area.

[0005] International patent WO2012 / 131015 discloses a mirror that utilizes a monochromatic laser beam whose waveform can be altered. However, this method still involves a one-dimensional scan along the laser irradiation direction, thus requiring multiple one-dimensional scans to fully scan the two-dimensional area.

[0006] According to US Patent Application Publication US 2008 / 0259425, a laser processing apparatus in which the laser beam focusing element is located within a scanning head is disclosed. Although a beam deflection unit is disclosed for adjusting the focus of the laser beam to the scanning mirror and flattening the field curvature, it is difficult to reduce the telecentric error of the laser beam relative to a wide area.

[0007] According to US Patent 8,425,496, although deformable mirrors are used, the use of F-θ lenses makes it difficult to solve chromatic aberration problems and limits their application to large areas. Furthermore, F-θ lenses may be damaged by high-output lasers or lasers utilizing ultraviolet light, making them unsuitable for devices using high-output lasers or ultraviolet light.

[0008] To process large-area substrates, a laser beam with small telecentric error needs to be irradiated onto the substrate surface. While large telecentric lenses can be used to reduce telecentric error, these lenses are expensive and bulky, posing problems in terms of cost and manufacturing processes. Summary of the Invention

[0009] The embodiments are intended to provide a laser device that utilizes a high-energy laser source to adjust the intensity of the laser so that it can be focused onto a wide two-dimensional area, thereby enabling the processing of large-area substrates.

[0010] The purpose of this invention is not limited to the above-described purpose, and it should be understood that various extensions can be made without departing from the spirit and scope of this invention.

[0011] The laser device involved in the embodiment may include: a laser beam output unit; a correction unit for correcting the laser beam emitted from the laser beam output unit; a laser scanner for scanning the laser beam corrected by the correction unit; a reflector for reflecting the laser beam scanned by the laser scanner onto a processing substrate; and a control unit for controlling the correction unit according to the scanning conditions of the laser scanner.

[0012] The correction unit may include a deformable mirror.

[0013] The correction unit may include at least one of a microporous thin film, a piezoelectric element, or a microelectromechanical system.

[0014] The control unit may include a memory that stores shape data of the correction unit according to the scanning angle of the laser scanner.

[0015] The laser scanner may include a first scanner and a second scanner, wherein the first scanner may scan the laser beam along a first direction, and the second scanner may scan the laser beam along a second direction perpendicular to the first direction.

[0016] The laser device may further include a first optical element located between the laser scanner and the reflector, the first optical element being configured to be closer to the laser scanner than the reflector.

[0017] The first optical element may be a spherical lens.

[0018] The reflector can be a spherical mirror.

[0019] The axis of the spherical lens and the axis of the spherical mirror can be parallel to each other.

[0020] When the distance between the laser scanner and the reflector is set to d, and the radius of curvature of the spherical mirror is set to R, the condition R / 2×0.91 can be satisfied. <d<R / 2×1.09。

[0021] The laser device may further include a second optical element located between the laser beam output section and the correction section, the second optical element being a spherical lens.

[0022] The laser device processing method involved in the embodiment may include: a step of determining the direction of a laser scanner based on the position where the laser beam will be incident on the processing substrate; a step of a control unit receiving direction information of the laser scanner and controlling a correction unit based on the direction information of the laser scanner; a step of performing initial correction on the laser beam emitted from the laser beam output unit by the correction unit; a step of scanning the initially corrected laser beam by the laser scanner; a step of incidenting the scanned laser beam onto a reflector; and a step of incidenting the laser beam reflected from the reflector onto the processing substrate.

[0023] The correction unit may include a deformable mirror, and in the step of controlling the correction unit, the shape of the correction unit may be changed according to the direction information of the laser scanner.

[0024] The control unit may include a memory that stores shape data of the correction unit based on the orientation information of the laser scanner, and the control unit may read the shape data of the correction unit from the memory to change the shape of the correction unit.

[0025] The laser scanner may include a first scanner and a second scanner, and the scanning steps may include: scanning the laser beam along a first direction using the first scanner; and scanning the laser beam along a second direction perpendicular to the first direction using the second scanner.

[0026] The laser device processing method may further include: a step of performing secondary correction on the scanned laser beam using the laser scanner, wherein a first optical body located between the laser scanner and the reflector may be used in the secondary correction step.

[0027] The secondary calibration step can be a step of passing the laser beam that has passed through the laser scanner through the spherical lens.

[0028] The reflector is a spherical mirror, and the laser beam reflected from the reflector can be reflected on the surface of the spherical lens.

[0029] The axis of the spherical lens and the axis of the spherical mirror can be configured to be parallel to each other.

[0030] When the distance between the laser scanner and the reflector is set to d, and the radius of curvature of the spherical mirror is set to R, the condition R / 2×0.91 can be satisfied. <d<R / 2×1.09。

[0031] According to the laser devices involved in the various embodiments, a broadband laser source can be adjusted so that a laser of a certain intensity can be incident on a wide two-dimensional area, thereby enabling the processing of large-area substrates.

[0032] The effects of the present invention are not limited to those described above, and it should be understood that various extensions can be made without departing from the spirit and scope of the present invention. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of a laser device according to one embodiment.

[0034] Figure 2 This is a perspective view of a laser device according to one embodiment.

[0035] Figure 3 This is a perspective view of a portion of a laser device according to one embodiment, magnified.

[0036] Figure 4 This is a diagram illustrating the operation of the drive unit of a laser device according to one embodiment.

[0037] Figure 5 This is a perspective view of a portion of a laser device according to one embodiment, magnified.

[0038] Figure 6 This is a sequence diagram illustrating a control method for a laser device according to an embodiment.

[0039] Figure 7a and Figure 7b This is a graph showing the results of an experimental example.

[0040] Figure 8a and Figure 8b This is a graph showing the results of an experimental example.

[0041] Figure 9 This is a graph showing the results of an experimental example.

[0042] Figure 10a and Figure 10b This is a schematic diagram used to illustrate the results of an experimental example.

[0043] Symbol explanation:

[0044] 1: Laser beam output unit; 3: Correction unit; 4, 5: Laser scanner; 6, 9: Optical body; 7: Reflector; 8: Processing substrate; 10: Control unit; 11: Memory. Detailed Implementation

[0045] Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can readily implement them. The present invention can be implemented in various different forms and is not limited to the embodiments described herein.

[0046] To clearly illustrate the invention, irrelevant parts have been omitted, and the same or similar symbols are used for the same constituent elements throughout the specification.

[0047] Furthermore, for ease of explanation, the size and thickness of each component shown in the accompanying drawings are arbitrarily depicted, and therefore the invention is not necessarily limited to the illustrated configuration. The thicknesses are shown enlarged to clearly show each layer and region in the drawings. Additionally, for ease of explanation, the thicknesses of some layers and regions are exaggerated in the accompanying drawings.

[0048] Furthermore, when layers, films, regions, plates, etc., are located on or above other parts, this includes not only cases where they are directly located on other parts, but also cases where other parts are interspersed between them. Conversely, when a part is directly located on other parts, it means that there are no other parts in between. In addition, being located on or above the part that serves as a reference means being located below or below the part that serves as a reference, and does not necessarily mean being located on or above the part in the direction of gravity.

[0049] Furthermore, when a certain component is included in a part of the specification, unless otherwise stated otherwise, it means that other components are not excluded, but may be included.

[0050] Furthermore, throughout the instruction manual, "on a plane" refers to the view of the object from above, while "on a cross section" refers to the view of a vertically cut section of the object from the side.

[0051] Furthermore, throughout the specification, “connection” does not only mean that two or more constituent elements are directly connected, but also that two or more constituent elements are indirectly connected through other constituent elements, including not only physical connections but also electrical connections, or that although they are referred to by different names according to their location or function, they are formed as one unit.

[0052] Reference Figure 1 This describes a laser device according to one embodiment. Figure 1 This is a schematic diagram of a laser device according to one embodiment.

[0053] Reference Figure 1The laser device involved in the embodiment includes a laser beam output unit 1, a correction unit 3 in which a laser beam 2 output from the laser beam output unit 1 is incident on and reflected, a laser scanner (4, 5) in which the laser beam reflected from the correction unit 3 is incident on and scanned, a first optical body 6 in which the laser beam passing through the laser scanner (4, 5) is incident on, a reflector 7 in which the laser beam passing through the first optical body 6 is incident on and reflected, a second optical body 9 located in front of the laser beam output unit 1, and a control unit 10.

[0054] The laser beam output unit 1 can provide laser pulses. The duration of the laser pulse can be less than 40 ps, ​​and the wavelength of the laser beam is about 400 nm or less, preferably about 360 nm or less. The bandwidth of the laser beam can be greater than 0.05 nm.

[0055] The correction unit 3 can be a deformable mirror.

[0056] The correction unit 3 may include at least one of a micro-membrane, a piezo-electric element, and a microelectromechanical system (MEMS).

[0057] The correction unit 3 can be deformed into a preset shape by the control unit 10.

[0058] The control unit 10 includes a memory 11, in which data on the shape of the correction unit 3 can be stored based on the position of the processing substrate 8.

[0059] The control unit 10 receives scanning information of the laser beam from the laser scanner (4, 5) and reads data about the shape of the correction unit 3 according to the angle of the laser scanner (4, 5) from the memory 11, thereby controlling the correction unit 3.

[0060] When the control unit 10 receives the angles of the laser scanners (4, 5) that are not stored in the memory 11, it can use the data of two adjacent angles and perform an interpolation method.

[0061] It can be corrected and utilized.

[0062] The laser scanners (4, 5) may include a first scanner 4 and a second scanner 5 (hereinafter, the first scanner 4 and the second scanner 5 are sometimes collectively referred to as laser scanners 4 and 5). The first scanner 4 can scan the laser beam incident from the correction unit 3 along a first direction x, and the second scanner 5 scans the laser beam incident from the correction unit 3 along a second direction y that forms a predetermined angle with the first direction x, thereby transmitting the light to the first optical body 6. The second direction y may be perpendicular to the first direction x.

[0063] The first scanner 4 and the second scanner 5 can be mirrors that can provide beam deflection in a predetermined direction to the incident laser beam, so that the incident laser beam is deflected in the predetermined direction, thereby scanning the laser beam in the predetermined direction.

[0064] The reflector 7 can be a spherical mirror.

[0065] The interval (hereinafter denoted by d) between the laser scanners 4 and 5 and the reflector 7 can be almost the same as half (1 / 2) of the radius of curvature (hereinafter denoted by R) of the reflector 7. More specifically, when the radius of curvature of the reflector 7 is R, the interval d between the laser scanners 4 and 5 and the reflector 7 can satisfy R / 2 × 0.91. <d<R / 2×1.09。

[0066] The incident angle (also known as the telecentric angle, hereinafter referred to as a) of the laser beam incident on the reflector 7 can be more than 10 degrees, and more specifically, more than 45 degrees.

[0067] The first optical element 6 and the second optical element 9 can be spherical lenses, and the first optical element 6 may include two spherical lenses. The two spherical lenses allow at least one of the laser beams that have passed through the first scanner 4 and the second scanner 5 to pass through.

[0068] The first optical element 6 refracts the laser beam and prevents unnecessary and widespread diffusion of the laser beam, thereby preventing chromatic aberration. The first optical element 6 allows the laser beam to be incident on the reflector 7, which acts as a spherical lens. For example, one spherical lens of the first optical element 6 refracts the laser beam scanned by the first scanner 4, and the remaining spherical lens of the first optical element 6 refracts the laser beam scanned by the second scanner 5.

[0069] The optical axis of the first optical element 6 may be parallel to the direction in which it is tilted relative to the laser scanners 4 and 5. The optical axis of the first optical element 6 may be coaxial with the reflector 7.

[0070] The second optical element 9 can be located between the laser beam output section 1 and the correction section 3, and can prevent unnecessary and widespread diffusion of the laser beam 2 output from the laser beam output section 1, thereby preventing chromatic aberration.

[0071] Assuming the optical power of the second optical body 9 is fa and the optical power of the first optical body 6 is fb, it can satisfy 0.1 <-fb / fa < 5, or more specifically, 0.5 <-fb / fa < 0.9.

[0072] The first optical body 6 and the second optical body 9 may be glass comprising at least one of fused silica, calcium fluoride, and magnesium fluoride. The first optical body 6 and the second optical body 9 may not be damaged by short-wavelength laser beams (e.g., laser beams in the ultraviolet region).

[0073] The field of view of the laser device involved in this embodiment can be greater than 460mm×460mm, the spot size of the laser device can be less than 32μm, and the telecentric angle of the laser beam can be less than 1.5 degrees.

[0074] The following is for reference Figure 1 as well as Figures 2 to 5 More specifically, an embodiment of the laser device is described. Figure 2 This is a perspective view of a laser device according to one embodiment. Figure 3 This is a magnified perspective view of a portion of a laser device according to one embodiment. Figure 4 This is a diagram illustrating the operation of the drive unit of a laser device according to one embodiment, and Figure 5 This is a perspective view of a portion of a laser device according to one embodiment, magnified.

[0075] First, refer to Figure 1 as well as Figure 2 The laser beam 2 output from the laser beam output unit 1, after being corrected by the correction unit 3, is scanned by laser scanners 4 and 5 in two different directions on a plane, and then reflected by the reflector 7, thereby illuminating the processing substrate 8. At this time, the laser beam radiated from the laser scanners 4 and 5 can be corrected for chromatic aberration by the first optical body 6 before entering the reflector 7. Furthermore, the laser beam 2 output from the laser beam output unit 1 can be corrected for chromatic aberration by the second optical body 9 before entering the correction unit 3.

[0076] like Figure 2 As shown, the laser beams reflected by the reflector 7 and incident on the processing substrate 8 can be incident almost perpendicular to the surface of the processing substrate 8 regardless of position. Since each laser beam is corrected by the correction unit 3, the laser incident area is narrow and it is incident in the form of an energy spot with energy concentrated in a narrow area, which can be used to form fine patterns, etc.

[0077] and Figure 1 and Figure 2 Refer to together Figure 3 At this time, the laser beam 2 output from the laser beam output unit 1 is incident on the correction unit 3, and after being corrected by the correction unit 3, it is incident on the laser scanners 4 and 5. At this time, the laser beam 2 output from the laser beam output unit 1 can be input to the correction unit 3 after the chromatic aberration is corrected by the second optical body 9.

[0078] The correction unit 3 corrects aberrations in the scanning angles used by the laser scanners 4 and 5.

[0079] As described above, the control unit 10 receives angle information for scanning of the laser scanners 4 and 5, and reads data from the memory 11 about the shape of the correction unit 3 according to the angle of the laser scanners 4 and 5, thereby controlling the correction unit 3.

[0080] Figure 4 An example of the shape of the correction unit 3, based on the scanning angle of laser scanners 4 and 5, is shown. (Refer to...) Figure 4 The shape of the correction unit 3 is preset according to the scanning angle of the laser scanners 4 and 5, and its preset value is stored in the memory 11 of the control unit 10.

[0081] The correction unit 3 may be a deformable mirror, and may include at least one of a micro-membrane, a piezo-electric element, or a microelectromechanical system (MEMS).

[0082] The correction unit 3 can be deformed into a preset shape by the control unit 10.

[0083] At this time, the control unit 10 can use the data of two adjacent angles to make corrections by interpolation when it receives the angles of the laser scanners 4 and 5 that are not stored in the memory 11.

[0084] As described above, the laser beam 2 output from the laser beam output unit 1 is corrected for aberrations in the correction unit 3 according to the scanning positions of the laser scanners 4 and 5 before being incident on the laser scanners 4 and 5, thereby reducing the energy spot size of the laser beam. For example, when the scanning area of ​​the laser scanners 4 and 5 is approximately 460 mm × 460 mm, the size of the energy spot of the laser beam can be approximately 32 μm.

[0085] and Figure 1 and Figure 2 Refer to together Figure 5 At that time, the laser beam, after being corrected by the correction unit 3, is scanned by the laser scanners 4 and 5, and then the first optical body 6 corrects the chromatic aberration before it is incident on the reflector 7.

[0086] The first optical element 6 may be a spherical lens, and the first optical element 6 may include two spherical lenses 6a and 6b.

[0087] The first optical body 6 can refract the laser beams scanned by the laser scanners 4 and 5, and can prevent unnecessary wide diffusion of the laser beams, thereby functioning to prevent chromatic aberration. The first optical body 6 allows the laser beams to enter the reflector 7 which is a spherical lens. For example, one spherical lens of the first optical body 6 can refract the laser beam scanned by the first scanner 4, and the remaining one spherical lens of the first optical body 6 can refract the laser beam scanned by the second scanner 5.

[0088] referring to Figure 1 part (b) and Figure 5 , the optical axis of the first optical body 6 may be coaxial with the reflector 7.

[0089] The laser beam reflected by the reflector 7 and incident on the processing substrate 8 may have a telecentric angle of less than about 5 degrees, more specifically, may have a telecentric angle of less than about 1.5 degrees.

[0090] The telecentric angle a is expressed by the formula a=d / (R / 2). d is the distance between the laser scanners 4, 5 and the reflector 7, and R is the radius of curvature of the reflector 7.

[0091] As described above, when the radius of curvature of the reflector 7 is R, the distance d between the laser scanners 4, 5 and the reflector 7 satisfies R / 2×0.91<d<R / 2×1.09, so that the telecentric angle a of the laser beam reflected by the reflector 7 and incident on the processing substrate 8 can be less than 1.5 degrees.

[0092] The first optical body 6 may be a spherical lens with a size of less than 50 mm. In addition, the first optical body 6 may be glass containing at least one of fused silica, calcium fluoride, and magnesium fluoride.

[0093] As described above, the wavelength of the laser beam 2 output from the laser beam output unit 1 may be about 400 nm or less, preferably less than about 360 nm, and the first optical body 6 may be glass containing at least one of fused silica, calcium fluoride, and magnesium fluoride, whereby damage caused by the first optical body 6 and the laser beam can be prevented.

[0094] The size of the reflector 7 may be 500mm×500mm, and the first optical body 6 may be arranged adjacent to the laser scanners 4 and 5, so that the aberration of the laser beam incident on the large-sized reflector 7 can be corrected using the small-sized first optical body 6.

[0095] According to the embodiment, a laser beam with a short wavelength and high energy can be used, which includes a correction unit that can be controlled by a control unit and corrects aberration based on the incident angle of the laser beam, and the aberration is further corrected by the optical body, so that it can be adjusted to allow a laser with an intensity that can be focused on a wide two-dimensional area to enter, thereby performing processing such as forming a fine pattern on a large-area substrate.

[0096] and Figures 1 to 5 Refer to together Figure 6 The processing method of a laser device according to one embodiment will be described. Figure 6 This is a sequence diagram illustrating a control method for a laser device according to an embodiment.

[0097] First, the scanning direction of the laser scanners 4 and 5 is determined according to the position of the processing substrate 8 to be incident on the laser beam (S10).

[0098] The scanning direction of laser scanners 4 and 5 can be changed according to the position of the laser beam to be irradiated in the area of ​​the processing substrate 8 to be processed.

[0099] If the scanning direction of laser scanners 4 and 5 is determined, the control unit 10 receives the scanning direction data (S20).

[0100] After the control unit 10 receives the scanning direction data of the laser scanners 4 and 5, it reads the data of the correction unit 3 stored in the memory 11, and generates data by interpolation when needed, and then uses the data of the control unit 10 to control the correction unit 3 (S30).

[0101] More specifically, the control unit 10 deforms the shape of the mirror of the correction unit 3 into a preset shape. As described above, the shape of the correction unit 3 is preset according to the scanning position of the laser scanners 4 and 5, and its preset value is stored in the memory 11 of the control unit 10. The correction unit 3 may be a deformable mirror, and the correction unit 3 may include at least one of a micro-membrane, a piezo-electric element, or a microelectromechanical system (MEMS), and can be deformed into a predetermined shape by the control unit 10.

[0102] Therefore, the control unit 10 controls the correction unit 3 to deform its shape, and then emits a laser beam 2 from the laser beam output unit 1. After the laser beam 2 emitted from the laser beam output unit 1 enters the correction unit 3, it undergoes initial correction (S40). The correction unit 3 corrects aberrations based on the scanning angles used by the laser scanners 4 and 5.

[0103] The laser beam, which has undergone initial calibration by the calibration unit 3, is incident on the laser scanners 4 and 5 and is scanned.

[0104] At this time, before the laser beam 2 output from the laser beam output unit 1 is initially corrected by the correction unit 3, the chromatic aberration can be corrected by the second optical body 9 before being input to the correction unit 3. The second optical body 9 can be a spherical lens.

[0105] For the laser beam that is scanned by the laser scanners 4 and 5 after the initial calibration by the calibration unit 3, a second calibration is performed by the first optical body 6 (S50).

[0106] The laser beam is corrected a second time by the first optical body 6, thereby correcting the chromatic aberration.

[0107] The first optical element 6 may be a spherical lens, and may include two spherical lenses 6a and 6b. For example, one spherical lens 6a of the first optical element 6 allows the laser beam scanned by the first scanner 4 to pass through, and the remaining spherical lens 6b of the first optical element 6 allows the laser beam scanned by the second scanner 5 to pass through, thereby enabling secondary correction.

[0108] The laser beam, which has undergone secondary correction through the first optical body 6, is incident on the reflector 7 (S60).

[0109] The reflector 7 can be a spherical mirror.

[0110] The first optical body 6 may include two spherical lenses 6a and 6b, and the axes of the spherical lenses 6a and 6b may be parallel to the axis of the spherical mirror that serves as the reflector 7.

[0111] The first optical element 6 refracts the laser beam scanned by the laser scanners 4 and 5, preventing unnecessary widespread diffusion of the laser beam and thus preventing chromatic aberration. The first optical element 6 allows the laser beam to be incident on the reflector 7, which acts as a spherical lens.

[0112] The first optical element 6 may be a spherical lens with a size of less than 50 mm. Furthermore, the first optical element 6 may be a glass comprising at least one of fused silica, calcium fluoride, and magnesium fluoride.

[0113] As described above, the wavelength of the laser beam 2 output from the laser beam output unit 1 can be about 400 nm or less, preferably about 360 nm or less, and the first optical body 6 can be a glass including at least one of molten silica, calcium fluoride, and magnesium fluoride, thereby preventing damage to the first optical body 6 and the laser beam.

[0114] The size of the reflector 7 can be 500mm×500mm, and the first optical body 6 is arranged adjacent to the laser scanners 4 and 5, so that the aberration of the laser beam incident on the large reflector 7 can be corrected by using the small-sized first optical body 6.

[0115] The laser beam reflected from the reflector 7 is incident on the processing substrate 8 (S70).

[0116] At this time, for the laser beam incident on the processing substrate 8, after being subjected to primary correction by the correction unit 3 and secondary correction by the first optical body 6, the laser beam is reflected by the reflector 7, so that the laser beam incident on the processing substrate 8 can have a telecentric angle of approximately less than 5 degrees, and more specifically, can have a telecentric angle of less than 1.5 degrees.

[0117] The telecentric angle a is represented by the formula a = d / (R / 2). d is the distance between the laser scanners 4, 5 and the reflector 7, and R is the radius of curvature of the reflector 7.

[0118] As described above, when the radius of curvature of the reflector 7 is R, the distance d between the laser scanners 4, 5 and the reflector 7 can satisfy R / 2×0.91 < d < R / 2×1.09, so that the telecentric angle a of the laser beam reflected from the reflector 7 and incident on the processing substrate 8 can be less than 1.5 degrees.

[0119] According to the processing method of the laser apparatus related to the embodiment, according to the embodiment, a high-energy laser beam with a short wavelength is used, and the method includes the step of performing primary correction by a correction unit that can be controlled by a control unit and corrects aberrations based on the incident angle of the laser beam, and the step of performing secondary correction to further correct aberrations by an optical body, so that the laser with energy concentrated in a narrow area can be adjusted to be incident on a wide two-dimensional area, whereby processing such as forming a fine pattern on a large-area substrate can be performed.

[0120] Hereinafter, referring to Figure 7a and Figure 7b , Figure 8a and Figure 8b , Figure 9 as well as Figure 10a and Figure 10b , an experimental example will be described.

[0121] Figure 7a and Figure 7b are diagrams showing results related to one experimental example, Figure 8a and Figure 8b are diagrams showing results related to one experimental example, Figure 9 is a graph showing the results of one experimental example, and Figure 10a and Figure 10b are diagrams showing results related to one experimental example.

[0122] In this experimental example, for the first case including the correction unit 3 like the laser apparatus related to the embodiment and the second case not including the correction unit 3, the laser spot according to the position was measured, and in Figure 7a and Figure 7b , Figure 8a and Figure 8b , Figure 9 as well as Figure 10a and Figure 10b the results are shown.

[0123] Figure 7a and Figure 7b It is a chart showing the laser energy spot based on its location. Figure 8a and Figure 8b This is a photograph showing the simulation results of the laser energy distribution. Figure 9 It is a graph showing the results of an experimental example, and Figure 10a and Figure 10b These are microscope images showing measurements of a laser beam.

[0124] Figure 7a , Figure 8a , Figure 10a The result of the first case is shown, and Figure 7b , Figure 8b , Figure 10b The result of the second case is shown. Figure 9 This is a graph showing the energy distribution of the laser beam measured in the first case.

[0125] and Figure 7a , Figure 8a , Figure 10a Refer to together Figure 7b , Figure 8b , Figure 10b In contrast to the second case which does not include the correction unit 3, in the first case which includes the correction unit 3 as in the laser device described in the embodiment, it is known that a high-energy laser beam is irradiated into a narrow area.

[0126] More specifically, refer to Figure 9 It can be seen that in the first case, the energy is concentrated in the range of -16μm to +16μm, so the size of the spot where the laser beam's energy is concentrated is 32μm.

[0127] Conversely, in the second case, the size of the energy-concentrated spot is greater than 2 mm.

[0128] As described above, according to the second case, the energy is distributed in a uniform area, thereby improving the aberration of the laser beam. However, the energy of the laser beam is distributed in a relatively wide area, so it is known that the laser beam with concentrated energy that can form fine patterns is difficult to incident on the processing substrate.

[0129] However, based on the first case where the laser beam is initially calibrated by the calibration unit and then calibrated a second time by the optical body, as in this embodiment, not only is the chromatic aberration of the laser beam corrected, but the size of the laser spot where the energy of the laser beam is concentrated is relatively small, for example, 32 μm. Thus, a laser beam with energy concentrated in a narrow region is incident on the processing substrate. Therefore, according to the laser device and laser device processing method described in the embodiment, energy is concentrated in a narrow region to form fine patterns on the processing substrate, and a laser beam with improved chromatic aberration can be incident.

[0130] The embodiments of the present invention have been described in detail above, but the scope of the present invention is not limited thereto. Various modifications and improvements made by those skilled in the art using the basic concepts of the present invention as defined in the claims also fall within the scope of the present invention.

Claims

1. A laser device, comprising: Laser beam output section; The correction unit corrects the laser beam emitted from the laser beam output unit; A laser scanner scans the laser beam that has been corrected by the correction unit; A reflector that reflects the laser beam scanned by the laser scanner onto the processing substrate; and Control unit, controls the correction unit. The control unit controls the correction unit according to the scanning conditions of the laser scanner. The reflector is a spherical mirror. When the interval between the laser scanner and the reflector is set as d, and the radius of curvature of the spherical mirror is set as R, the following condition is satisfied: R / 2 × 0.91 < d < R / 2 × 1.

09.

2. The laser device as claimed in claim 1, wherein, The correction unit includes a deformable mirror.

3. The laser device as described in claim 2, wherein, The correction unit includes at least one of a microporous thin film, a piezoelectric element, and a microelectromechanical system.

4. The laser device as claimed in claim 1, wherein, The control unit includes a memory. The memory stores shape data of the correction section based on the scanning angle of the laser scanner.

5. The laser device as claimed in claim 1, wherein, The laser scanner includes a first scanner and a second scanner. The first scanner scans the laser beam along a first direction. The second scanner scans the laser beam along a second direction perpendicular to the first direction.

6. The laser device as claimed in claim 1, further comprising: A first optical element is located between the laser scanner and the reflector. The first optical body is configured to be closer to the laser scanner than the reflector.

7. The laser device as claimed in claim 6, wherein, The first optical element is a spherical lens.

8. The laser device as claimed in claim 7, wherein, The axis of the spherical lens is parallel to the axis of the spherical mirror.

9. The laser device as claimed in claim 1, further comprising: The second optical element is located between the laser beam output section and the correction section. The second optical element is a spherical lens.

10. A laser device processing method, comprising: The step of determining the direction of the laser scanner based on the position where the laser beam will be incident on the processing substrate; The control unit receives the direction information of the laser scanner and controls the steps of the correction unit based on the direction information of the laser scanner; The step of performing initial calibration on the laser beam emitted from the laser beam output unit through the calibration unit; The step of scanning the laser beam that has undergone the initial calibration using the laser scanner; The step of directing the scanned laser beam onto the reflector; as well as The step of directing the laser beam reflected from the reflector onto the processing substrate. The reflector is a spherical mirror. When the interval between the laser scanner and the reflector is set as d, and the radius of curvature of the spherical mirror is set as R, the following condition is satisfied: R / 2 × 0.91 < d < R / 2 × 1.

09.

11. The laser device processing method as described in claim 10, wherein, The correction unit includes a deformable mirror. In the step of controlling the correction unit, the shape of the correction unit is changed according to the direction information of the laser scanner.

12. The laser device processing method as described in claim 11, wherein, The control unit includes a memory. The memory stores the shape data of the correction section based on the orientation information of the laser scanner. The control unit reads the shape data of the correction unit from the memory to change the shape of the correction unit.

13. The laser device processing method as described in claim 10, wherein, The laser scanner includes a first scanner and a second scanner. The steps involved in performing a scan include: The steps of scanning the laser beam along a first direction using the first scanner; and The step of scanning the laser beam along a second direction perpendicular to the first direction using the second scanner.

14. The laser device processing method as described in claim 10, further comprising: The step of performing secondary calibration on the scanned laser beam using the laser scanner. The second calibration step utilizes a first optical element located between the laser scanner and the reflector.

15. The laser device processing method as described in claim 14, wherein, The secondary calibration step involves passing the laser beam that has passed through the laser scanner through the spherical lens.

16. The laser device processing method as described in claim 15, wherein, The laser beam reflected from the reflector is reflected on the surface of the spherical lens.

17. The laser device processing method as described in claim 16, wherein, The axis of the spherical lens is arranged parallel to the axis of the spherical mirror.

Images