Substrate processing apparatus

Abstract

A substrate processing apparatus is provided. The substrate processing apparatus includes a support unit that supports a substrate and a laser unit that irradiates a laser beam to the substrate supported by the support unit, the laser unit including an irradiation member that irradiates the laser beam, a lens that is rotatable disposed on a travel path of the laser beam irradiated by the irradiation member, and a reflection member having an inclined surface for changing the travel path of the laser beam passing through the lens.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0106456, filed with the Korean Intellectual Property Office on August 24, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of the inventive concept described herein relate to a substrate processing apparatus. Background Technology

[0004] Typically, in the manufacturing of flat panel display devices or semiconductors, various processes such as photoresist coating, development, etching, and ashing are performed during the handling of glass substrates or wafers. These processes include wet cleaning processes using chemicals or deionized water and drying processes to remove various contaminants adhering to the substrate by drying the chemicals or deionized water remaining on the substrate surface.

[0005] In recent years, substrate processing apparatuses have shortened process time by supplying processing liquid to the substrate and heating the supplied processing liquid or heating the substrate. An embodiment of the aforementioned substrate processing apparatus is disclosed in Korean Patent Application Publication No. 2019-0037497. According to the patent, a laser irradiation unit is controlled to irradiate a laser beam onto the substrate and move the point on the substrate where the laser irradiates the substrate. In other words, the laser irradiation unit of the substrate processing apparatus in the above patent changes the irradiation position of the laser irradiating the substrate by changing the irradiation direction of the laser beam.

[0006] However, when the position of the laser beam irradiating the substrate changes due to the change in the laser beam irradiation unit, the cables (such as optical fibers) connected to the laser irradiation unit also rotate along with the head direction of the laser irradiation unit. This high-speed, repetitive movement of the cables places a significant burden on the durability of the cables.

[0007] To address the burden caused by the durability of cables and other components, measures such as fixing the laser beam's irradiation position and rotating the substrate can be considered. In this case, the substrate must rotate rapidly to increase heating uniformity. Uniform heating is possible when the substrate is rotated rapidly. However, the substrate's rotation speed is a factor affecting the flow rate of the processing liquid supplied to and flowing on the substrate, or the thickness of the liquid film formed by the processing liquid. In other words, the rapid rotation of the substrate for uniform heating becomes a significant limitation in the development of processes that treat substrates by supplying processing liquid.

[0008] Furthermore, according to the above patent, only the laser irradiation direction of the laser irradiation unit is changed, while the laser beam itself does not rotate. Therefore, according to the above patent, it is difficult to apply the measure of heating the substrate by using a laser beam in a polarized state (e.g., a laser beam in a p-polarized state).

[0009] For example, according to the patent above, such as Figure 1 As shown, when the irradiation direction of the laser beam is changed, and when the laser irradiation unit irradiates a laser beam in a p-polarized state and the irradiation position is changed, the polarization direction of the laser beam faces the same direction. This is because only the irradiation position is changed while maintaining the beam profile of the laser beam. For the substrate, the polarization direction of the laser beam irradiating any point on the substrate faces the center of the substrate, while the polarization direction of the laser beam irradiating another point on the substrate does not face the center of the substrate. In other words, when the measure of heating the substrate using a laser beam in a polarized state is applied to the above patent, the heating conditions at the locations where the laser beam irradiates the substrate are not the same, and precise heating control is difficult. Summary of the Invention

[0010] An embodiment of the present invention provides a substrate processing apparatus that can effectively process substrates.

[0011] An embodiment of the present invention also provides a substrate processing apparatus that can effectively heat a substrate.

[0012] An embodiment of the present invention also provides a substrate processing apparatus that can improve the heating uniformity of the substrate.

[0013] An embodiment of the present invention also provides a substrate processing apparatus that can improve the heating uniformity of a substrate without rotating the substrate.

[0014] Embodiments of the present invention also provide a substrate processing apparatus that can minimize the generation of thickness deviations in liquid films formed on a substrate.

[0015] Embodiments of the present invention also provide a substrate processing apparatus that can minimize the burden on the durability of optical fibers connected to the irradiation member.

[0016] An embodiment of the present invention also provides a substrate processing apparatus that can minimize the reflectivity of a laser beam irradiated onto a substrate.

[0017] The inventive concept is not limited thereto, and other unmentioned aspects of the invention will be clearly understood by those skilled in the art from the following description.

[0018] This disclosure provides a substrate processing apparatus. The substrate processing apparatus includes a support unit and a laser unit. The support unit supports a substrate, and the laser unit irradiates a laser beam onto the substrate supported by the support unit. The laser unit includes an irradiation member that irradiates the laser beam; a lens disposed on the path of the laser beam irradiated by the irradiation member and thus rotatable; and a reflective member having an inclined surface for altering the path of the laser beam passing through the lens.

[0019] According to one embodiment, a pair of lenses can be provided.

[0020] According to one embodiment, the reflecting member can be coupled to either of a pair of lenses.

[0021] According to one embodiment, the reflective member may have a conical shape, the upper end of which is truncated.

[0022] According to one embodiment, the pair of lenses and reflective members can rotate in the same direction and about the same axis of rotation.

[0023] According to one embodiment, each cylindrical lens has the following shape: one surface of the cylindrical lens is a flat planar surface, and the opposite surface of the cylindrical lens is a curved surface.

[0024] According to one embodiment, the substrate processing apparatus may further include a controller, which can control the laser unit to move the reflective member up and down, thereby changing the irradiation position of the laser beam irradiating the substrate.

[0025] According to one embodiment, the irradiation member irradiates a laser beam in a p-polarized state.

[0026] According to one embodiment, the inclined surface of the reflective member may be inclined such that the incident angle of the p-polarized laser beam irradiating the substrate is the Brewster angle.

[0027] According to one embodiment, the substrate processing apparatus may further include a controller, and the controller controls the laser unit to move the reflective member upward or downward such that the incident angle of the laser beam is the Brewster angle.

[0028] This disclosure provides a substrate processing apparatus. The substrate processing apparatus includes a support unit that supports a substrate; a processing liquid nozzle that supplies processing liquid to the substrate supported by the support unit; and a laser unit that irradiates a laser beam onto an upper surface of the substrate supported by the support unit. The laser unit includes an irradiation member that irradiates the laser beam; a cylindrical lens that rotates the laser beam; and a reflecting member that reflects the laser beam passing through the cylindrical lens in a direction facing the upper surface of the substrate supported by the support unit.

[0029] According to one embodiment, the plurality of cylindrical lenses can be configured to be rotatable.

[0030] According to one embodiment, the reflecting member may have a conical shape, the upper end of which is truncated, and the truncated upper end is coupled to either of the cylindrical lenses.

[0031] According to one embodiment, the cylindrical lens and the reflecting member can rotate in the same direction and around the same axis of rotation.

[0032] According to one embodiment, the travel path of the laser beam input to the cylindrical lens and the reflecting member can be spaced apart from the axis of rotation and can be parallel to the axis of rotation.

[0033] According to one embodiment, the irradiation member can irradiate a laser beam in a P-polarized state.

[0034] According to one embodiment, the inclined surface of the reflective member that reflects the laser beam may be inclined such that the incident angle of the laser beam in the p-polarized state that irradiates the substrate is the Brewster angle.

[0035] According to one embodiment, the substrate processing apparatus may further include a controller, and the controller controls the laser unit to move the reflective member upward or downward such that the incident angle of the laser beam is the Brewster angle.

[0036] This disclosure provides a substrate processing apparatus. The substrate processing apparatus includes a support unit supporting a substrate; and a laser unit irradiating a p-polarized laser beam onto the substrate supported by the support unit; the laser unit includes an irradiation member, a pair of cylindrical lenses, and a reflecting member. The irradiation member irradiates the p-polarized laser beam, and the pair of cylindrical lenses are disposed along the path of the p-polarized laser beam irradiated by the irradiation unit. The pair of cylindrical lenses are rotatable and have the following shape: one surface of the cylindrical lens is a flat planar surface, and the opposite surface of the cylindrical lens is a curved surface. The reflecting member has a conical shape and an inclined surface, the upper end of the conical shape being truncated and coupled to either of the pair of cylindrical lenses, and the inclined surface reflecting the p-polarized laser beam passing through the cylindrical lenses.

[0037] According to one embodiment, the pair of cylindrical lenses and the reflecting member can rotate in the same direction and around the same axis of rotation, and the travel path of the laser beam input to the cylindrical lenses and the emitting member can be spaced apart from the axis of rotation and parallel to the axis of rotation. Attached Figure Description

[0038] Referring to the following figures, the above and other objects and features will become apparent from the following description, wherein, unless otherwise stated, the same reference numerals refer to the same parts throughout the figures, and wherein:

[0039] Figure 1 This is a view showing the polarization direction of a p-polarized laser beam irradiated onto a substrate when a conventional laser unit irradiates the substrate with a laser beam;

[0040] Figure 2 A view showing a substrate processing apparatus according to an embodiment of the present invention;

[0041] Figure 3 To show Figure 2 A view of an embodiment of the process chamber;

[0042] Figure 4 To show Figure 3 A view of the laser unit;

[0043] Figure 5 To show Figure 4 A view of a cylindrical lens;

[0044] Figure 6 To show Figure 4 A view of the reflective component;

[0045] Figure 7 To show Figure 3A view showing the state of the laser beam being irradiated by the laser unit;

[0046] Figure 8 To show that will be by Figure 3 A view showing the state in which the laser beam irradiated by the laser unit is transmitted to the substrate.

[0047] Figure 9 A conceptual diagram illustrating the travel of the laser beam when the cylindrical lens and reflecting component of the laser unit are rotated to 0 degrees;

[0048] Figure 10 This is a view showing the laser beam delivered to the substrate from the top when the cylindrical lens and reflective component of the laser unit are rotated to 0 degrees;

[0049] Figure 11 This is a conceptual diagram illustrating the travel of the laser beam when the cylindrical lens and reflective components of the laser unit are rotated to 45 degrees.

[0050] Figure 12 This is a view showing the laser beam delivered to the substrate from the top when the cylindrical lens and reflective component of the laser unit are rotated to 45 degrees;

[0051] Figure 13 This is a conceptual diagram illustrating the travel of the laser beam when the cylindrical lens and reflecting components of the laser unit are rotated to 90 degrees.

[0052] Figure 14 This is a view showing the laser beam delivered to the substrate from the top when the cylindrical lens and reflective component of the laser unit are rotated to 90 degrees;

[0053] Figure 15 A conceptual diagram illustrating the travel of the laser beam when the cylindrical lens and reflective components of the laser unit are rotated to 135 degrees;

[0054] Figure 16 This is a view showing the laser beam delivered to the substrate from the top when the cylindrical lens and reflective component of the laser unit are rotated to 135 degrees;

[0055] Figure 17 A view illustrating an embodiment of substrate surface reflectivity based on polarization state and incident angle of laser beam;

[0056] Figure 18 A view illustrating the polarization direction of a p-polarized laser beam irradiated onto a substrate when the laser unit irradiates the substrate according to the present invention; and

[0057] Figure 19 This is a view showing the state in which a laser unit irradiates a laser beam onto a substrate according to the present invention. Detailed Implementation

[0058] In the following description, exemplary embodiments of the inventive concept will be described in detail with reference to the accompanying drawings, enabling those skilled in the art to readily implement the inventive concept. However, the inventive concept can be implemented in various different forms and is not limited to any particular embodiment. Furthermore, in the description of embodiments of the inventive concept, detailed descriptions of known functions or configurations will be omitted where such obscurity unnecessarily clarifies the essence of the inventive concept. Additionally, throughout the drawings, the same reference numerals are used to indicate the performance of similar functions and operations.

[0059] The expression “comprising” certain elements may mean that another element may be further included without exclusion, unless there is a particularly contradictory description. The terms “comprising” and “having” are used to indicate the presence of the features, numbers, steps, operations, elements, components, or combinations thereof described in the specification, and may be understood to mean that one or more other features, numbers, steps, operations, elements, components, or combinations thereof may be added.

[0060] Unless otherwise stated, singular terms may include plural forms. Furthermore, in the accompanying drawings, the shape and size of elements may be exaggerated for clearer description.

[0061] In the following text, reference will be made to Figures 2 to 19 Description of embodiments of the present invention.

[0062] Figure 2 This is a view illustrating a substrate processing apparatus according to an embodiment of the present invention. (Refer to...) Figure 2 The substrate processing apparatus 1 includes an indexing module 10 and a process execution module 20. The indexing module 10 includes a plurality of loading ports 120 and a supply frame 140. The loading ports 120, the supply frame 140, and the process execution module 20 can be arranged sequentially in a row. Hereinafter, the direction in which the loading ports 120, the supply frame 140, and the process execution module 20 are arranged is referred to as the first direction 12, the direction perpendicular to the first direction 12 when viewed from above is referred to as the second direction 14, and the direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as the third direction 16.

[0063] The carrier 18, in which the substrate "W" is received, is located at the loading port 120. Multiple loading ports 120 are provided, and these ports are arranged in a row along the second direction 14. However, the number of loading ports 120 can vary depending on factors such as the process efficiency of the process execution module 20 or the available floor space. Multiple slots (not shown) are formed in the carrier 18 for receiving the substrate "W" when it is arranged parallel to the ground. A front-opening unified pod (FOUP) can be used as the carrier 18.

[0064] The process execution module 20 includes a buffer unit 220, a supply chamber 240, and a plurality of process chambers 260. The supply chamber 240 is configured such that its longitudinal direction is parallel to a first direction 12. Process chambers 260 are arranged on opposite sides of the supply chamber 240. The process chambers 260 are arranged on opposite sides of the supply chamber 240 to be symmetrical with respect to the supply chamber 240. A plurality of process chambers 260 are arranged on one side of the supply chamber 240. Some process chambers 260 are arranged along the longitudinal direction of the supply chamber 240. Furthermore, some process chambers 260 are stacked on top of each other. That is, process chambers having an "A" × "B" array can be arranged on one side of the supply chamber 240. In this document, "A" represents the number of process chambers 260 arranged in rows along the first direction 12, and "B" represents the number of process chambers 260 arranged in rows along the third direction 16. When four or six process chambers 260 are arranged on one side of the supply chamber 240, the process chambers 260 can be arranged in a 2×2 or 3×2 array. The number of process chambers 260 can be changed. Unlike the above description, the process chambers 260 can be arranged only on one side of the supply chamber 240. Furthermore, the process chambers 260 can be arranged on one side or the opposite side of the supply chamber 240 to form a single layer.

[0065] A buffer unit 220 is disposed between the supply frame 140 and the supply chamber 240. The buffer unit 220 provides a space in which the substrate "W" remains before being transferred between the supply chamber 240 and the supply frame 140. Multiple slots (not shown) are provided inside the buffer unit 220, in which the substrate "W" is positioned. The multiple slots (not shown) can be configured to be spaced apart from each other along a third direction 16. The surfaces of the buffer unit 220 facing the supply frame 140 and the surfaces facing the supply chamber 240 are open.

[0066] The supply frame 140 transfers substrate "W" between the carrier 130, which is located at the transfer port 120, and the buffer unit 220. An index track 142 and an indexing robot 144 are disposed within the supply frame 140. The index track 142 is configured such that its longitudinal direction is parallel to a second direction 14. The indexing robot 144 is mounted on the index track 142 and moves linearly along the cable guide 142 in the second direction 14. The indexing robot 144 has a base 144a, a body 144b, and a plurality of indexing arms 144c. The base 144a is mounted to be movable along the index track 142. The body 144b is coupled to the base 144a. The body 144b is configured to be movable along a third third direction 16 on the base 144a. The body 144b is configured to be rotatable on the base 144a. Index arms 144c are coupled to the body 144b and configured to be movable upward and downward relative to the body 144b. Multiple index arms 144c are configured to be driven individually. The index arms 144c are arranged in a stacked manner to be spaced apart from each other along a third direction. Several index arms 144c are used when the substrate "W" is transferred to the carrier 130 in the process execution module 20, and several index arms 144c can be used when the substrate "W" is transferred from the carrier 130 to the process execution module 20. This structure prevents particles generated by the substrate "W" before processing from adhering to the substrate "W" after processing during the process of the indexing robot 144 carrying the substrate "W" in and out.

[0067] The supply chamber 240 transfers substrates "W" between the buffer unit 220 and the process chamber 260, and between multiple process chambers 260. A guide rail 242 and a main robot 244 are disposed in the supply chamber 240. The guide rail 242 is configured such that its longitudinal direction is parallel to a first direction 12. The main robot 244 is mounted on the guide rail 242 and moves linearly along the guide rail 242 along the first direction 12. The main robot 244 has a base 244a, a body 244b, and multiple main arms 244c. The base 244a is mounted to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is configured to be movable on the base 244a along a third direction 16. The body 244b is configured to be rotatable on the base 244a. The main arm 244c is coupled to the body 244b and configured to be forward or backward movable relative to the body 244b. Multiple main arms 244c are configured to be driven individually. The main arms 244c are arranged in a stacked manner to be spaced apart from each other along a third direction 16.

[0068] Process chamber 260 performs a cleaning process on substrate "W". Process chamber 260 may have different structures depending on the type of cleaning process. Alternatively, process chamber 260 may have the same structure. Optionally, process chamber 260 may be divided into multiple groups, with process chambers 260 belonging to the same group having the same structure, and process chambers 260 belonging to different groups having different structures.

[0069] Figure 3 To show Figure 2 A view of an embodiment of the process chamber. (Refer to...) Figure 3 The process chamber 260 includes a bowl-shaped object 320, a support unit 340, a lifting unit 360, a liquid processing nozzle 380, a laser irradiation unit 390, and a controller (not shown).

[0070] As described below, a controller (not shown) controls the elements of the process chamber 260 to operate the components of the process chamber 260.

[0071] The bowl-shaped object 320 has a processing space, in which an internal processing substrate "W" is located. The bowl-shaped object 320 has an open-top container shape. The bowl-shaped object 320 has an inner recovery container 322, an intermediate recovery container 324, and an outer recovery container 326. The recovery containers 322, 324, and 326 recover different liquids from the processing liquid used in the process. When viewed from the top, the inner recovery container 322 is configured to have an annular shape surrounding the support unit 340. The intermediate recovery container 324 is configured to have an annular shape surrounding the inner recovery container 322. The outer recovery container is configured to have an annular shape surrounding the intermediate recovery container 324. The internal space 322a of the inner recovery container 322, the space 324a between the inner recovery container 322 and the intermediate recovery container 324, and the space 326a between the intermediate recovery container 324 and the outer recovery container 326 serve as inlets through which processing liquid is introduced into the inner recovery container 322, the intermediate recovery container 324, and the outer recovery container 326. According to one embodiment, the inlet can be located at different heights. Recovery lines 322b, 324b, and 326b are connected to the underside of the bottom surfaces of recovery containers 322, 324, and 326. Processed liquid introduced into recovery containers 322, 324, and 326 can be provided via recovery lines 322b, 324b, and 326b to an external processed liquid recycling system (not shown) for reuse.

[0072] During the process, support unit 340 supports and rotates the substrate "W". Support unit 340 includes a rotary chuck 342, a plurality of support pins 344, a plurality of chuck pins 346, and a support shaft 348. Rotary chuck 342 has an upper surface that is substantially circular when viewed from above. The outer surface of rotary chuck 342 is stepped. The diameter of the bottom surface of rotary chuck 342 may be smaller than the diameter of the upper surface of rotary chuck 342. The outer surface of rotary chuck 342 has a first inclined surface 341, a horizontal surface 343, and a second inclined surface 345. The first inclined surface 341 extends downward from the upper surface of rotary chuck 342. The horizontal surface 343 extends inward from the lower end of the first inclined surface 341. The second inclined surface 345 extends downward from the inner end of the horizontal surface 343. The first inclined surface 341 and the second inclined surface 345 face a downward inclined direction as they approach the central axis of the body.

[0073] Multiple support pins 344 are provided. The support pins 344 can be arranged to be spaced apart from each other at the edge of the upper surface of the rotary chuck 342 and protrude upward from the rotary chuck 342. The support pins 344 are arranged in combination to have a generally annular shape. The support pins 344 support the edge of the rear surface of the substrate "W" such that the substrate "W" is spaced apart from the upper surface of the rotary chuck 342 at a predetermined distance.

[0074] Multiple chuck pins 346 are provided. The chuck pins 346 are arranged further away from the center of the rotary chuck 342 than the support pins 344. The chuck pins 346 are configured to project upwards from the rotary chuck 342. The chuck pins 346 support the side of the substrate "W" such that the substrate "W" does not laterally separate from its proper position when the support unit 340 is rotated. The chuck pins 346 are configured to move linearly between a standby position and a supported position along the radial direction of the rotary chuck 342. The standby position is a position further away from the center of the rotary chuck 342 than the supported position. When the substrate "W" is loaded onto or unloaded from the support unit 340, the chuck pins 346 are in the standby position, and when a process is performed on the substrate "W", the chuck pins 346 are in the supported position. The chuck pins 346 contact the side of the substrate "W" in the supported position.

[0075] A support shaft 348 supports a rotating chuck 342, making the rotating chuck rotatable. The support shaft 348 is located below the rotating chuck 342. The support shaft 348 includes a rotating shaft 347 and a fixed shaft 349. The rotating shaft 347 is provided as an inner shaft, and the fixed shaft 349 is provided as an outer shaft. The rotating shaft 347 is configured such that its longitudinal direction faces a third direction. The rotating shaft 347 is fixedly coupled to the bottom surface of the rotating chuck 342. The rotating shaft 347 can be rotated by a drive member 350. The rotating chuck 342 is configured to rotate together with the rotating shaft 347. The fixed shaft 349 has a hollow cylindrical shape surrounding the rotating shaft 347. The fixed shaft 349 is configured to have a diameter larger than the diameter of the rotating shaft 347. The inner surface of the fixed shaft 349 is located at a position spaced apart from the rotating shaft 347. The fixed shaft 349 remains fixed while the rotating shaft rotates.

[0076] The lifting unit 360 moves the bowl-shaped object 320 upward and downward. As the bowl-shaped object 320 moves upward and downward, the relative height between the bowl-shaped object 320 and the support unit 340 changes. The lifting unit 360 has a bracket 362, a moving shaft 364, and a driver 366. The bracket 362 is mounted on the outer wall of the bowl-shaped object 320 and is coupled to the moving shaft 364, which moves upward and downward, by the driver 366. Lowering the bowl-shaped object 320 causes the support unit 340 to protrude above the bowl-shaped object 320 when the substrate "W" is positioned on or lifted from the support unit 340. During the process, the height of the bowl-shaped object 320 is adjusted according to the type of processing liquid supplied to the substrate "W" so that the processing liquid is introduced into preset recovery containers 322, 324, and 326. Selectively, the lifting unit 360 can move the support unit 340 upward and downward.

[0077] Processing liquid nozzle 380 sprays processing liquid onto substrate "W". Processing liquid nozzle 380 can spray processing liquid heated to a preset temperature onto substrate "W" to increase the processing efficiency of substrate "W". Multiple processing liquid nozzles 380 can be provided. Processing liquid nozzles 380 can supply different types of liquids.

[0078] The processing liquid nozzle 380 can be configured such that its position is changeable. Each processing liquid nozzle 380 can be moved to a process position and a standby position. In this document, the process position is the position where the processing liquid nozzle 380 is spaced upwards and downwards from the support unit 340 and faces the support unit 340, and the standby position is the position where the processing liquid nozzle 380 is offset from the process position. According to one embodiment, the processing liquid can be a chemical, a rinsing liquid, or an organic solvent. The chemical can be phosphoric acid (H3PO4). The rinsing liquid can be pure water. The organic solvent can be isopropanol (IPA) liquid.

[0079] The laser unit 390 can irradiate a laser beam "L" onto the substrate "W" supported by the support unit 340. The laser unit 390 can heat the substrate "W" by irradiating it with the laser beam "L". For example, the laser unit 390 can perform SiN stripping, etching, etc. by irradiating the substrate "W" with the laser beam "L". In addition, the laser unit 390 can heat the outer peripheral area of ​​the substrate "W".

[0080] Figure 4 To show Figure 3 A view of the laser unit. (Refer to...) Figure 4 The laser unit 390 may include an irradiation member 391, a transmission member 392, a housing 393, cylindrical lenses 394a and 394b, and a reflection member 395.

[0081] The irradiation member 391 can generate and irradiate a laser beam "L". The irradiation member 391 can change the wavelength of the laser beam "L". For example, the irradiation member 391 can change the wavelength of the laser beam "L" so that the laser beam "L" has a wavelength with a high absorption rate for the substrate "W". For example, when the substrate "W" is a wafer formed of a material including Si, the irradiation member 391 can generate and irradiate a beam with a high absorption rate for Si.

[0082] The laser beam "L" irradiated by the irradiation member 391 can be transmitted to cylindrical lenses 394a and 394b (described below) via the transmission member 392. The transmission member 392 can transmit the laser beam "L" to the cylindrical lenses 394a and 394b. One end of the transmission member 392 can be connected to the irradiation member 391, and the opposite end of the transmission member 392 can be connected to the housing 393, as described below. The transmission member 392 can be a container with one and the opposite ends open. In contrast, the transmission member 392 can be an optical fiber.

[0083] The housing 393 may have a space in which cylindrical lenses 394a and 394b (described below) are housed. The housing 393 may have a container shape. Mechanisms (not shown) for fixing the cylindrical lenses 394a and 394b (described below) and the reflecting member 395, and for rotating the cylindrical lenses 394a and 394b and the reflecting member 395, may be mounted in the housing 393. Furthermore, the housing 393 may be independent of the rotation of the pair of cylindrical lenses 394a and 394b (described below) and the reflecting member 395. For example, even if the cylindrical lenses 394a and 394b and the reflecting member 395 are rotated, the housing 393 may be fixed without rotation.

[0084] Cylindrical lenses 394a and 394b can be positioned along the travel path of the laser beam "L" illuminated by the irradiation member 391. Furthermore, cylindrical lenses 394a and 394b can be rotatable in one direction via a rotation driver (not shown) disposed in the housing 393. Therefore, cylindrical lenses 394a and 394b can rotate the laser beam "L" input to them. Multiple cylindrical lenses 394a and 394b can be provided. For example, a pair of cylindrical lenses 394a and 394b can be provided. This pair of cylindrical lenses 394a and 394b can rotate in the same direction around the same rotation axis RA. Furthermore, as... Figure 5 As shown, each cylindrical lens 394a and 394b can have the following shape: one surface of the cylindrical lens has a flat planar surface, and the opposing surfaces of the cylindrical lenses have curved surfaces. (Refer to again...) Figure 4 The planar surface of either 394a or the planar surface of the other 394b of the pair of cylindrical lenses 394a and 394b can face each other. However, this disclosure is not limited thereto; the curved surface of either 394a or the planar surface of the other 394b of the pair of cylindrical lenses 394a and 394b can face each other. For example, the curved surfaces of the cylindrical lenses 394a and 394b can face each other.

[0085] The reflecting member 395 may have an inclined surface that alters the travel path of the laser beam "L" passing through the cylindrical lenses 394a and 394b. The reflecting member 395 can reflect the laser beam "L" passing through the cylindrical lenses 394a and 394b in a direction facing the upper surface of the substrate "W" supported by the support unit 340. Furthermore, the reflecting member 395 has a conical shape with its upper end truncated, such as... Figure 6 As shown in the image. Refer again. Figure 4 The truncated upper end of the reflecting member 395 can be coupled to either of the cylindrical lenses 394a and 394b. For example, the truncated upper end of the reflecting member 395 can be coupled to the opposite surface of either of the cylindrical lenses 394a and 394b, which has a curved surface.

[0086] Furthermore, the reflecting member 395 can rotate together with the pair of cylindrical lenses 394a and 394b. For example, the reflecting member 395 can rotate in the same direction as the rotation direction of the cylindrical lenses 394a and 394b, and around the same axis of rotation RA. Moreover, the rotational speed of the cylindrical lenses 394a and 394b can be the same as the rotational speed of the reflecting member 395.

[0087] Figure 7 To show the position Figure 3 A view showing the state of the laser beam being irradiated by the laser unit. Figure 8 To show that it is in the state of being by Figure 3 A view showing the state in which the laser beam irradiated by the laser unit is transmitted to the substrate. (Refer to...) Figure 7 and Figure 8 The laser beam "L" generated and irradiated by the irradiation member 391 can be transmitted to the pair of cylindrical lenses 394a and 394b and the reflecting member 395. For example, the laser beam "L" generated and irradiated by the irradiation member 391 can be transmitted to the reflecting member 395 via the pair of cylindrical lenses 394a and 394b, and the laser beam "L" transmitted to the reflecting member 395 can be reflected by the inclined surface of the reflecting member 395 and transmitted to the upper surface of the substrate "W". Furthermore, the travel path of the laser beam "L" input to the pair of cylindrical lenses 394a and 394b and the reflecting member 395 can be spaced apart from the rotation axis RA and can be parallel to the rotation axis RA. For example, when viewed from above, the laser beam "L" can be input to a position of the pair of cylindrical lenses 394a and 394b and the reflecting member 395 that is off-center from the center of the pair of cylindrical lenses 394a and 394b and the reflecting member 395.

[0088] The path of the laser beam "L" traveling downwards from the top can be reflected by the reflective member 395 and changed to a downward-sloping direction. For example, when viewed from the top, the laser unit 390 can irradiate the laser beam "L" with the laser beam "L" located at the center of the substrate "W". Then, the laser beam "L" input to the substrate "W" can be input to the substrate "W" in the central region of the substrate "W" in the direction facing the outer peripheral region of the substrate "W".

[0089] Furthermore, the reflective member 395 can have a conical shape with its upper end truncated, as described above. Therefore, the inclined surface of the reflective member 395 can be deflected. Thus, when viewed from above, the point where the laser beam "L" illuminates the substrate "W" can have a substantially arcuate shape. The inclined surface of the reflective member 395 can be deflected such that the curvature and radius of curvature of the arcuate shape are the same as the curvature and radius of curvature of the edge of the substrate "W".

[0090] Furthermore, as described above, the pair of cylindrical lenses 394a and 394b and the reflecting member 395 can rotate in the same direction and around the same axis of rotation RA. Therefore, the laser beam "L" passing through the pair of cylindrical lenses 394a and 394b and reflected by the reflecting member 395 can also rotate together. Thus, when viewed from above, the point where the laser beam "L" illuminates the substrate "W" can have an annular shape. When viewed from above, the center of the annulus formed by the point where the laser beam "L" illuminates the substrate "W" can be the same as the center of the substrate "W". Furthermore, the inclined surface of the reflecting member 395 can be deflected such that the curvature and radius of curvature of the annulus are the same as the curvature and radius of curvature of the edge of the substrate "W".

[0091] According to an embodiment of the present invention, the irradiation member 391, the transmission member 392, and the housing 393 are fixed, and the pair of cylindrical lenses 394a and 394b and the reflecting member 395 are rotated. That is, without rotating the entire laser unit 390, the laser beam "L" can be rotated by rotating the pair of cylindrical lenses 394a and 394b and the reflecting member 395. Therefore, the durability burden on the transmission member 392 (which may be an optical fiber) can be minimized.

[0092] Furthermore, when the laser beam "L" rotates, heating uniformity of the substrate "W" can be achieved without rotating the substrate "W". That is, according to the embodiment of the present invention, heating uniformity of the substrate "W" can be achieved solely by rotating the cylindrical lenses 394a and 394b and the reflecting member 395. Therefore, the support unit 340 can freely change the rotation speed of the substrate "W", such that the flow rate of the processing liquid flowing on the substrate "W" or the thickness of the liquid film formed by the processing liquid can be a desired flow rate and a desired thickness.

[0093] Figures 9 to 16 The diagram shows the path of the laser beam "L" when viewed from above, and the laser beam "L" delivered to the substrate "W" based on the angle of rotation of the cylindrical lenses 394a and 394b and the reflecting member. (Reference) Figures 9 to 16 As can be seen, because a pair of cylindrical lenses 394a and 394b are used, when cylindrical lenses 394a and 394b rotate one cycle, the laser beam "L" rotates two cycles. For example, Figure 9 The diagram shows the travel of the laser beam “L” when the cylindrical lenses 394a and 394b are rotated by 0 degrees. Figure 10 The laser beam "L" transmitted to the substrate "W" is shown when the cylindrical lenses 394a and 394b are rotated by 0 degrees. Furthermore, Figure 11 The diagram shows the travel of the laser beam “L” when cylindrical lenses 394a and 394b are rotated 45 degrees. Figure 12The image shows the laser beam "L" delivered to the substrate "W" when cylindrical lenses 394a and 394b are rotated 45 degrees. (Comparison) Figure 10 and Figure 12 It can be seen that when cylindrical lenses 394a and 394b are rotated by 45 degrees, the illumination position of the laser beam "L" can be considered to have rotated by 90 degrees. Similarly, referring to... Figure 13 and Figure 14 When cylindrical lenses 394a and 394b are rotated 90 degrees, it can be determined that the illumination position of the laser beam "L" has rotated 180 degrees. Further, referring to... Figure 15 and Figure 16 When cylindrical lenses 394a and 394b rotate 135 degrees, it can be determined that the illumination position of the laser beam "L" has rotated 270 degrees. This is because a pair of cylindrical lenses 394a and 394b are used.

[0094] In other words, according to the embodiment of the present invention, the rotational speed of the laser beam "L" is twice the rotational speed of the cylindrical lenses 394a and 394b. Furthermore, as the rotational speed of the laser beam "L" irradiating the substrate "W" increases, the heating uniformity of the substrate "W" can be increased. That is, according to the present invention, even if the cylindrical lenses 394a and 394b rotate at a low RPM, the laser beam "L" can rotate rapidly, thereby achieving more reliably uniform heating of the substrate "W".

[0095] Figure 17 This is a view illustrating an embodiment of the substrate surface reflectivity based on the polarization state and the incident angle of the laser beam. Further, Figure 17 The surface reflectivity of substrate "W" is shown, based on the incident angle Ai of laser beam "L" on substrate "W" when the polarization state of laser beam "L" is s-polarized (S-pol, SP). Further, Figure 17 The diagram shows the surface reflectivity (Ref) of substrate "W" based on the incident angle Ai of laser beam "L" to substrate "W" when the polarization state of laser beam "L" is p-polarized (P-pol, PP). As the surface reflectivity of substrate "W" increases, laser beam "L" is lost without being used to heat substrate "W". In other words, to increase the heating efficiency of substrate "W", the surface reflectivity Ref of substrate "W" must decrease.

[0096] Reference Figure 17It can be seen that by appropriately adjusting the incident angle Ai to the substrate "W", the reflectivity of the p-polarized laser beam "L" used on the substrate "W" is lower than that of the s-polarized laser beam "L". In particular, there exists an angle in the p-polarized laser beam "L" that corresponds to 0% reflectivity of the substrate "W", and this angle corresponds to the Brewster angle (or polarization angle).

[0097] As described above, when using a conventional laser unit, it is difficult to apply a p-polarized laser beam to the substrate. When only the irradiation direction of the laser beam is changed without rotating the beam itself, the irradiation position is changed while maintaining the beam profile. Therefore, the polarization direction of the laser beam irradiating any point on the substrate faces the center of the substrate, while the polarization direction of the laser beam irradiating another point on the substrate does not face the center. In other words, when applying a p-polarized laser to a conventional laser unit, the heating conditions at the locations where the laser beam irradiates the substrate are different, making it difficult to heat the substrate uniformly.

[0098] However, according to the embodiment conceived in this invention, the laser beam "L" rotates along with the cylindrical lenses 394a and 149b. Therefore, the beam profile of the laser beam "L" also rotates. Thus, as... Figure 18 As shown, when the irradiation member 391 irradiates a laser beam "L" in a p-polarized state, the polarization direction of the laser beam "L" irradiating any point on the substrate "W" is symmetrical with respect to the center of the substrate "W" to the polarization direction of the laser beam "L" irradiating other points on the substrate "W". In other words, when the laser unit 390 of this invention heats the substrate "W" using a laser beam "L" in a p-polarized state, the substrate "W" can be heated uniformly under the same heating conditions even if the position of the substrate "W" irradiated by the laser beam "L" is changed. That is, this invention can utilize a laser beam "L" in a p-polarized state. As mentioned above, the reflectivity of a laser beam "L" in a p-polarized state to the substrate "W" is generally low. Therefore, according to the embodiments of this invention, the heating efficiency of the substrate can be increased.

[0099] Furthermore, embodiments in which the laser beam "L" in a p-polarized state is irradiated by the aforementioned irradiation member 391 may include embodiments in which the laser beam "L" in a p-polarized state is generated by the irradiation member 391, or embodiments in which the laser beam "L" in a non-polarized state is generated by the irradiation member 391, and embodiments in which the non-polarized laser beam "L" is input to the cylindrical lenses 394a and 394b after passing through the polarizing lenses mounted at the front ends of the cylindrical lenses 394a and 394b.

[0100] Furthermore, as described above, the reflectivity of the laser beam "L" irradiating the substrate "W" can be changed according to the incident angle Ai of the laser beam "L" input to the substrate "W". In particular, when the incident angle Ai of the laser beam "L" is equivalent to the Brewster angle, the theoretical reflectivity is equivalent to 0%.

[0101] The controller (not shown) of this invention can control the laser unit 390. For example, such as Figure 19 As shown, the controller can change the position of the laser unit 390. For example, the controller can change the incident angle Ai of the laser beam "L" illuminating the substrate "W" by moving the pair of cylindrical lenses 394a and 394b and the reflecting member 395 of the laser unit 390 up and down. Furthermore, by moving the pair of cylindrical lenses 394a and 394b and the reflecting member 395 up and down, the controller can set the incident angle Ai of the laser beam "L" to the Brewster angle. Moreover, the inclined surface of the reflecting member 395 of the present invention can be tilted, such that the incident angle Ai of the laser beam "L" illuminating the substrate "W" at a p-polarization angle becomes the Brewster angle. That is, the incident angle Ai of the laser beam "L" can be adjusted according to the distance between the reflecting member 395 and the substrate "W" and / or the change in the angle of the inclined surface of the reflecting member 395.

[0102] For example, by moving a pair of cylindrical lenses 394a and 394b and the reflective member 395 of the laser unit 390 upward and downward, the controller can change the irradiation position of the laser beam "L" irradiating the substrate "W". As described above, an annular shape is formed at the point where the laser beam "L" irradiates the substrate "W", the annular shape having a center substantially the same as the center of the substrate "W", and the diameter of the annular shape can be changed when the cylindrical lenses 394a and 394b and the reflective member 395 move upward and downward.

[0103] According to the embodiments conceived in this invention, the substrate can be processed effectively.

[0104] Furthermore, according to the embodiments conceived in this invention, the substrate can be heated effectively.

[0105] Furthermore, according to the embodiments conceived in this invention, the heating uniformity of the substrate can be increased.

[0106] Furthermore, according to the embodiments conceived in this invention, the heating uniformity of the substrate can be increased without rotating the substrate.

[0107] Furthermore, according to embodiments conceived in this invention, the generation of thickness deviations in the liquid film formed on the substrate can be minimized.

[0108] Furthermore, according to embodiments conceived in this invention, the lifetime burden on the optical fiber connected to the irradiation component can be minimized.

[0109] Furthermore, according to embodiments conceived in this invention, the reflectivity of the laser beam irradiated onto the substrate can be minimized.

[0110] The effects of this invention are not limited to those described above, and those skilled in the art will clearly understand any effects not mentioned from the specification and drawings.

[0111] The above detailed description illustrates the inventive concept. Furthermore, the foregoing description outlines exemplary embodiments of the inventive concept, and the inventive concept can be used in various other combinations, variations, and environments. That is, the inventive concept can be modified and altered without departing from the scope of the inventive concept disclosed in the specification, the equivalent scope of the written disclosure, and / or the technical or knowledge scope of those skilled in the art. The written embodiments describe the optimal state for realizing the technical spirit of the inventive concept, and various necessary changes can be made in the specific field of application and purpose of the inventive concept. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept to the disclosed embodiments. Furthermore, it should be understood that the appended claims include other embodiments.

Claims

1. A substrate processing apparatus, the substrate processing apparatus comprising: A support unit, wherein the support unit is configured as a support base plate; as well as A laser unit configured to irradiate a laser beam onto the substrate supported by the support unit. The laser unit includes: An irradiation member configured to irradiate the laser beam; A cylindrical lens, positioned along the path of the laser beam illuminated by the illuminating member, the cylindrical lens being configured to rotate about its rotation axis; and A reflective member having an inclined surface for altering the travel path of the laser beam passing through the cylindrical lens; The laser beam input to the cylindrical lens and the reflecting member travels along a path that is spaced apart from and parallel to the axis of rotation.

2. The substrate processing apparatus according to claim 1, wherein, Set a pair of cylindrical lenses.

3. The substrate processing apparatus according to claim 2, wherein, The reflecting member is coupled to either of the pair of cylindrical lenses.

4. The substrate processing apparatus according to claim 3, wherein, The reflective member has a conical shape, and the upper end of the conical shape is truncated.

5. The substrate processing apparatus according to claim 4, wherein, The pair of cylindrical lenses and the reflecting member rotate in the same direction and around the same axis of rotation.

6. The substrate processing apparatus according to claim 2, wherein, Each of the cylindrical lenses has the following shape: one surface of the cylindrical lens is a flat planar surface, and the opposite surface of the cylindrical lens is a curved surface.

7. The substrate processing apparatus according to any one of claims 1 to 6, further comprising: Controller The controller controls the laser unit to move the reflective member up and down, thereby changing the irradiation position of the laser beam irradiating the substrate.

8. The substrate processing apparatus according to any one of claims 1 to 6, wherein, The irradiation component irradiates a laser beam in a p-polarized state.

9. The substrate processing apparatus according to claim 8, wherein, The inclined surface of the reflective member is inclined such that the incident angle of the laser beam in the p-polarized state that irradiates the substrate is the Brewster angle.

10. The substrate processing apparatus according to claim 8, further comprising: Controller The controller controls the laser unit to move the reflective member up and down, such that the incident angle of the laser beam irradiating the substrate is the Brewster angle.

11. A substrate processing apparatus, the substrate processing apparatus comprising: Support unit, the support unit supports the base plate; A processing liquid nozzle is configured to supply processing liquid to the substrate supported by the support unit; as well as A laser unit configured to irradiate a laser beam onto the upper surface of the substrate supported by the support unit; as well as The laser unit includes: An irradiation member configured to irradiate the laser beam; A cylindrical lens configured to rotate the laser beam, the cylindrical lens being configured to rotate about a rotation axis of the cylindrical lens; and A reflective member configured to reflect the laser beam passing through the cylindrical lens in a direction facing the upper surface of the substrate supported by the support unit. The laser beam input to the cylindrical lens and the reflecting member travels along a path that is spaced apart from and parallel to the axis of rotation.

12. The substrate processing apparatus according to claim 11, wherein, Multiple cylindrical lenses are configured to be rotatable.

13. The substrate processing apparatus according to claim 12, wherein, The reflecting member has a conical shape, the upper end of which is truncated and coupled to any of the cylindrical lenses.

14. The substrate processing apparatus according to claim 12, wherein, The cylindrical lens and the reflecting member rotate in the same direction and around the same axis of rotation.

15. The substrate processing apparatus according to any one of claims 11 to 14, wherein, The irradiation component irradiates a laser beam in a p-polarized state.

16. The substrate processing apparatus according to claim 15, wherein, The inclined surface of the reflective member that reflects the laser beam is inclined, such that the incident angle of the laser beam in the p-polarized state that irradiates the substrate is the Brewster angle.

17. The substrate processing apparatus according to claim 15, further comprising: Controller The controller controls the laser unit to move the reflective member up and down, such that the incident angle of the laser beam is the Brewster angle.

18. A substrate processing apparatus, the substrate processing apparatus comprising: Support unit, the support unit supports the base plate; A laser unit configured to irradiate a p-polarized laser beam onto a substrate supported by the support unit; as well as The laser unit includes: An irradiation member configured to irradiate the laser beam in the p-polarized state; A pair of cylindrical lenses are disposed along the travel path of the laser beam, which is in the p-polarized state and is illuminated by the irradiation member. The pair of cylindrical lenses are rotatable and have the following shape: one surface of each cylindrical lens is a flat planar surface, and the opposite surface of each cylindrical lens is a curved surface; and A reflecting member having a conical shape and an inclined surface, the upper end of the conical shape being truncated and coupled to either of the pair of cylindrical lenses, the inclined surface reflecting the laser beam in the p-polarized state passing through the cylindrical lenses.

19. The substrate processing apparatus according to claim 18, wherein, The pair of cylindrical lenses and the reflecting member rotate in the same direction and about the same axis of rotation. The laser beam input to the cylindrical lens and the reflecting member travels along a path that is spaced apart from and parallel to the axis of rotation.

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