Resin molding device and method for manufacturing resin molded product

Abstract

The resin molding device and the method for manufacturing a resin molded product of the present invention can calculate the friction force between the groove and the plunger with high precision, and is a resin molding device (100) that uses a plunger (421) to extrude a resin material (J) contained in a groove (41a) and inject it into a mold cavity (2a), and includes a calculation unit (71) that calculates the friction force (F) between the groove (41a) and the plunger (421) based on a first load (P1) applied to the plunger (421) when the plunger (421) is moved in an extrusion direction and a second load (P2) applied to the plunger (421) when the plunger (421) is moved to a side opposite to the extrusion direction.

Description

Technical Field

[0001] The present invention relates to a resin molding device and a method for manufacturing a resin molded product. Background Art

[0002] In the past, for example, as shown in Patent Document 1, in a semiconductor resin sealing device in which a plunger is used to pressurize the resin in a groove and inject it into a cavity in a mold to perform resin molding, a load sensor is provided at the bottom of the plunger to measure the sliding resistance when the plunger rises and compare it with a predetermined sliding threshold, thereby determining that the device is abnormal and controlling the device.

[0003] Furthermore, in Patent Document 1, when a strain gauge is used to detect the force applied to the plunger, the sliding resistance of the plunger during its ascent is measured and compared with a predetermined sliding threshold, and the sliding resistance is measured during the processing of the plunger and compared with a predetermined sliding threshold, and the device is determined to be abnormal and controlled.

[0004] [Prior art literature]

[0005] [Patent Document]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 11-260844 Summary of the invention

[0007] [Problems to be solved by the invention]

[0008] However, in the semiconductor resin sealing device, the sliding resistance values ​​detected when the plunger rises and falls respectively include not only the friction force between the groove and the plunger but also other loads applied to the plunger. In other words, in the semiconductor resin sealing device, the friction force between the groove and the plunger cannot be obtained with high accuracy.

[0009] Meanwhile, the inventors of the present application have considered a configuration in which the load of the stopped plunger is measured when the resin material is not contained in the groove, and the load of the plunger when the plunger is moved up and down is measured based on the measured load to measure the frictional force between the groove and the plunger.

[0010] However, in the above structure, it is known that there is a deviation between the friction force obtained based on the load when the plunger is raised and the friction force obtained based on the load when the plunger is lowered. It is believed that the reason for the deviation is that, for example, when the descending plunger is stopped and used as a reference, the plunger is stopped by the upward friction force from the groove. That is, the friction force of the plunger in the stopped state is not zero, so it is believed that the friction force cannot be accurately obtained even if it is used as a reference.

[0011] Therefore, the present invention is made to solve the above-mentioned problems, and a main problem thereof is to obtain the friction force between the groove and the plunger with high accuracy.

[0012] [Technical means to solve the problem]

[0013] That is, the resin molding device of the present invention utilizes a plunger to extrude the resin material contained in the groove and inject it into the mold cavity, and the resin molding device includes a calculation unit, which calculates the friction force between the groove and the plunger based on a first load applied to the plunger when the plunger is moved in an extrusion direction and a second load applied to the plunger when the plunger is moved to a side opposite to the extrusion direction.

[0014] Furthermore, a method for producing a resin molded product according to the present invention is a method for producing a resin molded product using the resin molding apparatus.

[0015] [Effects of the Invention]

[0016] According to the present invention thus constituted, the frictional force between the groove and the plunger can be obtained with high accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram showing the structure of a resin molding device according to one embodiment of the present invention.

[0018] Figure 2 It is a schematic diagram showing the structure of the forming module of the above-mentioned embodiment.

[0019] Figure 3 It is a schematic diagram showing a structure for realizing the friction force measuring function of the above-mentioned embodiment.

[0020] Figure 4 It is a schematic diagram showing a substrate mounting state and a resin material filling state of the molding module according to the embodiment.

[0021] Figure 5 It is a schematic diagram showing the mold clamping state of the molding module according to the above embodiment.

[0022] Figure 6 It is a schematic diagram showing a resin injection state of the molding module according to the embodiment.

[0023] Figure 7 Schematic diagram showing a reference position X of the forming module according to the embodiment.

[0024] Figure 8 It is a schematic diagram showing the peeling state of the forming module of the above-mentioned embodiment.

[0025] Fig. 9 It is a schematic diagram showing the state of the molding module at the start of the mold opening operation according to the above embodiment.

[0026] Fig.10It is a schematic diagram showing a gate breaking operation in the mold opening operation of the molding module according to the embodiment.

[0027] Fig.11 It is a schematic diagram showing a state after a gate is disconnected during a mold opening operation of the molding module according to the embodiment.

[0028] Fig.12 It is a schematic diagram showing the mold opening state of the forming module of the embodiment.

[0029] Fig.13 It is a schematic diagram showing a state in which each suction part of the unloader of the above-mentioned embodiment is in contact with a resin molded product and unnecessary resin.

[0030] Fig.14 This is a schematic diagram showing a state in which unnecessary resin rises and an unnecessary resin adsorption portion shrinks in the above embodiment.

[0031] Fig.15 This is a schematic diagram showing a state in which the unloader of the above-mentioned embodiment absorbs and carries out resin molded products and unnecessary resin.

[0032] Fig.16 Schematic diagrams showing (a) a scraping position and (b) a loading position in the scraping operation of the embodiment.

[0033] Fig.17 It is a schematic diagram showing the measurement intervals of the first load P1 and the second load P2 in the cleaning operation of the above embodiment.

[0034] Explanation of symbols

[0035] 2: First mold (upper mold)

[0036] 2a: Cavity

[0037] 2b: concave part

[0038] 2c: Runner

[0039] 3: Second mold (lower mold)

[0040] 4: Resin injection part

[0041] 5: Clamping mechanism

[0042] 11: Forming object supply unit

[0043] 12: Resin material supply department

[0044] 13: Transport device (loader)

[0045] 14: Storage

[0046] 15: Transport mechanism (transport device, unloader)

[0047] 15a: Adsorption part for molded products

[0048] 15b: Adsorption section for unnecessary resin

[0049] 41: Slot Block

[0050] 41a: Slot

[0051] 41b: Material removal pool

[0052] 41c: Gate

[0053] 42: Transmission mechanism

[0054] 43: Elastic member

[0055] 61: Ejector pin

[0056] 62: Ejector plate

[0057] 63: Elastic member

[0058] 64: Return pin

[0059] 71: Operation Department

[0060] 72: Adjustment Department

[0061] 73: Judgment Department

[0062] 100: Resin molding device

[0063] 100A: Supply module

[0064] 100B: Forming module

[0065] 100C: Storage module

[0066] 101: Upper die holder

[0067] 102: Upper pressure plate

[0068] 103: Upper mold base plate

[0069] 104: Lower die holder

[0070] 105: Movable pressure plate

[0071] 106: Lower mold base plate

[0072] 151: Base member

[0073] 152: Keep Claw

[0074] 410: Cylindrical member

[0075] 411: Extension

[0076] 421: Plunger

[0077] 422: Plunger drive unit

[0078] a, b: interval

[0079] COM: Control Department

[0080] J: Resin material

[0081] K: Unnecessary resin

[0082] K1: Residue

[0083] P1: First load

[0084] P1 max : Maximum value

[0085] P2: Second load

[0086] P2 min : Minimum

[0087] PS: Force sensor

[0088] W1: Molding object

[0089] W2: Resin molded product (molding object)

[0090] Wx: Electronic parts

[0091] X: Reference position

[0092] Y: Peeling position DETAILED DESCRIPTION

[0093] Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following description.

[0094] As described above, the resin molding device of the present invention utilizes a plunger to extrude the resin material contained in the groove and inject it into the mold cavity, and the resin molding device includes a calculation unit, which calculates the friction force between the groove and the plunger based on a first load applied to the plunger when the plunger is moved in an extrusion direction and a second load applied to the plunger when the plunger is moved to a side opposite to the extrusion direction.

[0095] In the case of the resin molding device, the friction force between the groove and the plunger is calculated based on a first load applied to the plunger when the plunger is moved in the extrusion direction and a second load applied to the plunger when the plunger is moved to the side opposite to the extrusion direction, and the load of the plunger in a stopped state is not used as a reference, so the friction force between the groove and the plunger can be calculated with high accuracy.

[0096] As a specific method of calculating the frictional force, it is considered that the calculation unit calculates the frictional force based on the maximum value of the first load and the minimum value of the second load.

[0097] As a more detailed method of calculating the frictional force, it is considered that the calculation unit calculates the frictional force based on the difference between the maximum value of the first load and the minimum value of the second load.

[0098] In order to control the injection pressure of the resin material with high accuracy, it is desirable to include an adjustment unit that adjusts the force of extruding the resin material by the plunger using the friction force obtained by the calculation unit.

[0099] Preferably, a determination unit is included for determining whether the device can be operated based on a comparison result between the friction force obtained by the calculation unit and a preset reference value.

[0100] With the above configuration, for example, when it is determined that the device cannot be operated, the operation can be stopped at an appropriate timing to perform maintenance.

[0101] The resin molding device may perform a cleaning operation of scraping the resin adhering to the groove to the outside of the groove using the plunger after the resin molding.

[0102] In this case, it is desirable that the calculation unit acquires the first load and the second load during the cleaning operation.

[0103] According to the above structure, by utilizing the existing operation of the resin molding device, it is not necessary to perform separate operations for obtaining the first load and the second load.

[0104] Specifically, the cleaning operation is performed by moving the plunger between a predetermined scraping position and a loading position for storing the resin material.

[0105] In the cleaning operation, the calculation unit acquires the first load when the plunger is moved from the loading position to the scraping position, and acquires the second load when the plunger is moved from the scraping position to the loading position.

[0106] The resin molding device of the present invention is considered to be configured to perform edge gate type transfer molding. Specifically, the resin molding device of the present invention is considered to include: a first mold, which is formed with a mold cavity; a second mold, which is opposite to the first mold and is provided with a resin injection part including the groove and the plunger; and a mold clamping mechanism, which clamps the first mold and the second mold, and the resin injection part includes: a groove block, which is formed with the groove, is configured to be able to advance and retreat relative to the second mold via an elastic member, and includes an extension extending on the mold surface of the second mold; and a transfer mechanism, which includes the plunger, and moves the plunger to inject the resin material from the groove into the mold cavity.

[0107] Ideally, during the mold opening operation of the mold clamping mechanism to open the first mold and the second mold, the transfer mechanism moves the plunger toward the first mold to separate the resin molded product on the mold surface of the second mold from unnecessary resin on the groove block.

[0108] According to the above structure, the unnecessary resin on the groove block is pressed toward the first mold by the plunger, so the resin molded product can be reliably separated from the unnecessary resin without increasing the elastic force of the elastic member that moves the groove block forward and backward. In addition, since there is no need to increase the elastic force of the elastic member, the elastic member is prevented from being enlarged, and thus the molding die or the unnecessary resin is not enlarged.

[0109] In particular, in the present invention, the friction force between the groove and the plunger can be obtained with high accuracy, so the force of pressing the unnecessary resin by the plunger can be controlled with high accuracy, thereby reliably performing the action of separating the resin molded product from the unnecessary resin using the plunger.

[0110] Ideally, the resin molding device of the present invention includes a conveying mechanism for moving out the unnecessary resin on the slot block after resin molding, the conveying mechanism includes an unnecessary resin adsorption portion for adsorbing the unnecessary resin, and after the conveying mechanism brings the unnecessary resin adsorption portion into contact with the unnecessary resin on the slot block, the transfer mechanism moves the plunger toward the first mold to peel off the unnecessary resin from the slot block, and thereafter, the conveying mechanism uses the unnecessary resin adsorption portion to adsorb the unnecessary resin and move the unnecessary resin out.

[0111] With the above-described structure, after the unnecessary resin adsorption portion is brought into contact with the unnecessary resin on the slot block, the plunger is moved toward the first mold to peel the unnecessary resin from the slot block, and then the unnecessary resin is adsorbed by the unnecessary resin adsorption portion, thereby stably recovering the unnecessary resin on the slot block.

[0112] Specifically, before the unnecessary resin is absorbed by the unnecessary resin absorption part, the unnecessary resin is peeled off from the slot block by the plunger, so even if the contact area between the unnecessary resin and the slot block is increased, the unnecessary resin absorbed by the unnecessary resin absorption part can be reliably recovered from the slot block. In addition, when the unnecessary resin is peeled off from the slot block by the plunger, the unnecessary resin absorption part contacts the unnecessary resin, so that poor absorption caused by the unnecessary resin tilting on the slot block can be prevented. Through the above, the unnecessary resin on the slot block can be stably recovered.

[0113] In particular, in the present invention, the frictional force between the groove and the plunger can be obtained with high accuracy, so the force of pressing the unnecessary resin by the plunger can be controlled with high accuracy, and the operation of peeling the unnecessary resin from the groove block using the plunger can be reliably performed.

[0114] Furthermore, a method for manufacturing a resin molded product using the resin molding apparatus is also one embodiment of the present invention.

[0115] <One embodiment of the present invention>

[0116] Hereinafter, one embodiment of the resin molding device of the present invention will be described with reference to the accompanying drawings. In order to facilitate understanding, any of the following drawings are schematically depicted in an appropriately omitted or exaggerated manner. The same components are marked with the same reference numerals and the description thereof is appropriately omitted.

[0117] <Overall structure of resin molding device>

[0118] The resin molding apparatus 100 of the present embodiment performs resin molding of a molding target object W1 to which an electronic component Wx is connected by transfer molding using a resin material J.

[0119] Here, the molding object W1 includes, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor substrate, a wiring substrate, a lead frame, etc., regardless of whether or not there is wiring. In addition, the resin material J used for resin molding is, for example, a composite material containing a thermosetting resin, and the resin material J is in the form of particles, powder, liquid, sheet, or small pieces. Furthermore, the electronic component Wx connected to the upper surface of the molding object W1 is, for example, a bare chip or a chip sealed with resin.

[0120] Specifically, if Figure 1As shown, the resin molding device 100 includes the following components as constituent elements: a supply module 100A, which supplies a molding object W1 and a resin material J before molding; a molding module 100B, which performs resin molding; and a storage module 100C, which stores a molding object W2 (hereinafter referred to as a resin molded product W2) after molding. Furthermore, the supply module 100A, the molding module 100B, and the storage module 100C are mutually detachable and replaceable relative to other constituent elements. In addition, the molding module 100B can be set to two or three, etc., to increase each constituent element.

[0121] The supply module 100A is provided with the following components: a forming object supply section 11 for supplying a forming object W1; a resin material supply section 12 for supplying a resin material J; and a conveying device 13 (hereinafter referred to as a loader 13) for receiving the forming object W1 from the forming object supply section 11 and conveying it to the forming module 100B, and for receiving the resin material J from the resin material supply section 12 and conveying it to the forming module 100B.

[0122] The loader 13 reciprocates between the supply module 100A and the forming module 100B, and moves along a rail (not shown) provided across the supply module 100A and the forming module 100B.

[0123] like Figure 2 As shown, the forming module 100B includes: a first mold 2 (hereinafter referred to as the upper mold 2), which is one of the forming molds having a mold cavity 2a for injecting a resin material J; a second mold 3 (hereinafter referred to as the lower mold 3), which is another of the forming molds arranged opposite to the upper mold 2 and provided with a resin injection portion 4 for injecting the resin material J into the mold cavity 2a; and a clamping mechanism 5 for clamping the upper mold 2 and the lower mold 3. The upper mold 2 is held by an upper mold holder 101, and the upper mold holder 101 is fixed to an upper platen 102. In addition, the upper mold 2 is mounted on the upper mold holder 101 via an upper mold base plate 103. The lower mold 3 is held by a lower mold holder 104, and the lower mold holder 104 is fixed to a movable platen 105 raised and lowered by the clamping mechanism 5. In addition, the lower mold 3 is mounted on the lower mold holder 104 via a lower mold base plate 106.

[0124] The resin injection unit 4 includes a slot block 41 having a slot 41a for receiving the resin material J and a transfer mechanism 42 including a plunger 421 disposed in the slot 41a. The slot 41a is formed by, for example, a cylindrical member 410. The cylindrical member 410 is inserted into a through hole formed in the slot block 41.

[0125] The slot block 41 is elastically supported by the elastic member 43 so as to be able to rise and fall relative to the lower mold 3. That is, the slot block 41 is provided so as to be able to rise and fall relative to the lower mold 3 via the elastic member 43. In addition, the elastic member 43 is provided on the lower side of the slot block 41.

[0126] In addition, at the upper end of the groove block 41, there is formed an extension portion 411 extending from the mold surface which is the upper surface of the lower mold 3. Furthermore, on the upper surface of the groove block 41, there are formed a material removal pool portion 41b and a gate portion 41c which serve as a resin flow path for introducing the resin material J injected from the groove 41a into the mold cavity 2a. In addition, when the upper mold 2 and the lower mold 3 are closed, the upper surface of the extension portion 411 contacts the upper mold 2, and the lower surface sandwiches the molding object W1 between the mold surface of the lower mold 3.

[0127] The transfer mechanism 42 moves the plunger 421 to inject the resin material J from the groove 41a into the cavity 2a when the upper mold 2 and the lower mold 3 are clamped. Specifically, the transfer mechanism 42 includes a plunger 421 for pressure-feeding the resin material J heated and melted in the groove 41a, and a plunger driving unit 422 for driving the plunger 421.

[0128] The upper mold 2 is formed with a cavity 2a, which accommodates the electronic component Wx of the molding object W1 and is injected with molten resin material J. In addition, the upper mold 2 is formed with a recessed portion 2b in the portion facing the slot block 41, and a runner portion 2c is formed to connect the ejection pool portion 41b and the gate portion 41c of the slot block 41 with the cavity 2a. Furthermore, although not shown in the figure, an exhaust port is formed in the upper mold 2 on the side opposite to the slot block 41. In addition, the runner portion 2c may be omitted, and the ejection pool portion 41b may be directly connected to the cavity 2a via the gate portion 41c.

[0129] In addition, a plurality of ejector pins 61 are provided in the upper mold 2, and the plurality of ejector pins 61 are used to demold the molded object W2 after resin molding from the upper mold 2. These ejector pins 61 are provided to penetrate the required parts of the upper mold 2 and can be raised and lowered relative to the upper mold 2, and are fixed to the ejector plate 62 provided on the upper side of the upper mold 2. The ejector plate 62 is provided on the upper pressing plate 102 or the like via an elastic member 63, and includes a return pin 64. When the mold is closed, the return pin 64 contacts the outside of the loading area of ​​the molded object W1 in the lower mold 3, thereby raising the ejector plate 62 relative to the upper mold 2. As a result, when the mold is closed, the ejector pin 61 is in a state of being retracted into the mold surface of the upper mold 2. On the other hand, when the mold is opened, as the lower mold 3 descends, the ejector plate 62 descends relative to the upper mold 2, and the ejector pin 61 uses the elastic force of the elastic member 63 to demold the resin molded product W2 from the upper mold 2.

[0130] When the upper mold 2 and the lower mold 3 are clamped by the clamping mechanism 5, the resin flow path including the material removal pool 41b, the gate portion 41c, the recessed portion 2b and the runner portion 2c connects the groove 41a with the cavity 2a (see Figure 4). In addition, when the upper mold 2 and the lower mold 3 are molded together, the groove side end of the molding object W1 is sandwiched between the lower surface of the extension 411 of the groove block 41 and the mold surface of the lower mold 3. When the molten resin material J is injected into the mold cavity 2a by the plunger 421 in this state, the electronic component Wx of the molding object W1 is sealed with resin.

[0131] like Figure 1 As shown, the storage module 100C is provided with a storage section 14 for storing the resin molded product W2 and a conveying device 15 (hereinafter referred to as an unloader 15 ) for receiving the resin molded product W2 from the molding module 100B and conveying it to the storage section 14 .

[0132] The unloader 15 reciprocates between the forming module 100B and the storage module 100C, and moves along a rail (not shown) provided across the forming module 100B and the storage module 100C.

[0133] <Friction force measurement function between groove 41a and plunger 421>

[0134] Furthermore, the resin molding apparatus 100 of the present embodiment has a function of measuring the frictional force (sliding resistance value) generated between the groove 41a and the plunger 421. The frictional force calculation and measurement function is performed by, for example, the control unit COM provided in the supply module 100A.

[0135] Specifically, in the resin molding device 100, as Figure 3 As shown, a force sensor PS for measuring the load applied to the plunger 421 is provided, and the friction force F between the groove 41 a and the plunger 421 is calculated using the load obtained by the force sensor PS.

[0136] In this embodiment, a force sensor PS is provided between the plunger 421 and the plunger driving unit 422. As the force sensor, for example, a tension-compression load sensor may be used. Alternatively, a weight sensor, a load sensor, etc. may be used as the force sensor PS.

[0137] Furthermore, the control unit COM includes a calculation unit 71 that calculates the friction force F between the groove 41 a and the plunger 421 in a state where the resin material J is not accommodated in the groove 41 a .

[0138] The calculation unit 71 obtains from the force sensor PS a first load P1 applied to the plunger 421 when the plunger 421 is moved in the extrusion direction (when the plunger 421 rises), and a second load P2 applied to the plunger 421 when the plunger 421 is moved to the side opposite to the extrusion direction (when the plunger 421 descends), and calculates the friction force F between the groove 41a and the plunger 421 based on the obtained first load P1 and second load P2.

[0139] Specifically, the calculation unit 71 calculates the maximum value P1 of the first load P1 based on the maximum value P1 of the first load P1. max and the minimum value P2 of the second load P2 min To calculate the friction force F.

[0140] Here, the maximum value P1 of the first load P1 max It is calculated from the friction force (F) and the load other than the friction force (L) (P1 max =F+L). Here, since the plunger 421 is raised, the friction force has a positive value.

[0141] In addition, the minimum value P2 of the second load P2 min It is calculated from the friction force (-F) and the load other than the friction force (L) (P2 min =-F+L). Here, since the plunger 421 is lowered, the friction force is a negative value.

[0142] Then, the calculation unit 71 calculates the maximum value P1 of the first load P1 based on the following formula [1]. max The minimum value P2 of the second load P2 min The difference (P1 max -P2 min ) to calculate the friction force F.

[0143] P1 max -P2 min =(F+L)-(-F+L)=2F

[0144] F=(P1 max -P2 min ) / 2[1]

[0145] The above-described configuration allows the friction force F to be obtained. The timing for obtaining the first load P1 and the second load P2 and the timing for obtaining the friction force F will be described later.

[0146] Furthermore, the control unit COM includes an adjustment unit 72 that adjusts the force of extruding the resin material J by the plunger 421 using the friction force F obtained by the calculation unit 71 .

[0147] The adjustment unit 72 uses the friction force F obtained by the calculation unit 71 to control the plunger drive unit 422 so as to achieve a preset injection pressure. In this way, the injection pressure of the resin material J can be controlled to a desired value regardless of the friction force F. For example, when the injection pressure setting value is set to P set In the case of friction F, the actual injection pressure becomes P setTherefore, the adjustment unit 72 controls the plunger drive unit 422 to make the force of the plunger 421 squeezed out to P, taking into account the friction force F. set +F.

[0148] Furthermore, the control unit COM includes a determination unit 73 that determines whether the device operation is possible based on a comparison result between the friction force F obtained by the calculation unit 71 and a preset reference value.

[0149] The determination unit 73 compares the friction force F obtained by the calculation unit 71 with a preset reference value, and if the friction force F is equal to or greater than the reference value, for example, issues an alarm to prompt maintenance or stops the resin molding apparatus 100 .

[0150] <Operation of resin molding device 100>

[0151] Reference Figures 4 to 15 The operation of the resin molding device 100 will be briefly described. Figures 4 to 15 Only one side (left side) of the slot block 41 is shown, and the other side (right side) is omitted, but the state of the other side in each figure is the same as the state of one side. Figures 4 to 16 The force sensor PS is not shown in the figure. The following operations are performed by, for example, the control unit COM provided in the supply module 100A controlling each unit.

[0152] like Figure 4 As shown in FIG. 1 , in the state where the upper mold 2 and the lower mold 3 are opened, the loader 13 conveys the molding object W1 before molding, and transfers it to the lower mold 3 and places it. At this time, the upper mold 2 and the lower mold 3 are heated to a temperature at which the resin material J can be melted and hardened. Thereafter, the resin material J is conveyed by the loader 13 and accommodated in the groove 41a of the groove block 41.

[0153] In the above state, when the lower mold 3 is raised by the mold clamping mechanism 5, Figure 5 As shown in FIG. 1 , the groove block 41 contacts the upper mold 2 and descends relative to the lower mold 3, and the lower surface of the protruding portion 411 contacts the groove side end of the molding object W1. In addition, the lower surface of the upper mold 2 contacts the outer peripheral portion of the molding object W1 that the protruding portion 411 does not contact. In this way, the upper mold 2 and the lower mold 3 are molded together. After the mold is closed, when the transmission mechanism 42 uses the plunger driving unit 422 to raise the plunger 421, as shown in FIG. Figure 6 As shown, the molten resin material J in the groove 41a passes through the resin passage and is injected into the cavity 2a. Then, after a predetermined molding time has passed and the resin material J is hardened in the cavity 2a, the mold clamping mechanism 5 opens the upper mold 2 and the lower mold 3.

[0154] Here, the resin molding device 100 of this embodiment performs an operation (gate disconnection operation) of separating the resin molded product W2 from the unnecessary resin K during the mold opening operation of the mold clamping mechanism 5 to open the upper mold 2 and the lower mold 3. The unnecessary resin K is the resin that remains on the groove block 41 and hardens.

[0155] For example, just before the molding time is about to pass (before the start of the mold opening action), Figure 7 As shown in FIG. 1 , the transmission mechanism 42 reduces the force of the plunger 421 pressing the unnecessary resin K to a force of a predetermined value (e.g., a relatively small force that can maintain the contact state between the plunger 421 and the unnecessary resin K without peeling off). Here, the friction force F between the groove 41a and the plunger 421 is obtained with high accuracy by the calculation unit 71, so that the force of the plunger 421 pressing the unnecessary resin K can be controlled with high accuracy. In addition, the force of the plunger 421 pressing is measured by the force sensor PS.

[0156] Then, the control unit COM stores the position of the plunger 421 when the force becomes the predetermined value as the reference position X (refer to Figure 7 The reference position X is a position that serves as a reference for the gate disconnection operation described later and the demolding / recovery of the unnecessary resin K. The reference position X is not limited to the position of the plunger 421, and may be the position of other components such as the drive shaft (transmission shaft) of the plunger drive unit 422 connected to the plunger 421.

[0157] Then, before the mold opening operation begins, Figure 8 As shown in FIG. 1 , the transmission mechanism 42 causes the plunger 421 to descend to the side opposite to the upper mold 2 and to descend to a predetermined peeling position Y. By lowering the plunger 421 to the peeling position Y, the upper surface of the plunger 421 and the lower surface of the unnecessary resin K are peeled off. After the peeling action, the transmission mechanism 42 causes the plunger 421 to rise to the reference position X. At this time, the upper surface of the plunger 421 contacts the lower surface of the unnecessary resin K ( Figure 7 status).

[0158] Then, if Fig. 9 As shown, the mold clamping mechanism 5 starts the descent of the lower mold 3 and starts the mold opening action. When the mold clamping mechanism 5 starts the mold opening action and the clamping force is reduced to a specified value (different from the specified value in the transmission mechanism 42), as shown in FIG. Fig.10 As shown, the transmission mechanism 42 causes the plunger 421 to rise toward the upper mold 2. As a result, the unnecessary resin K on the groove block 41 is pressed toward the upper mold 2 by the plunger 421. Furthermore, the clamping force is measured by a force sensor (including a weight sensor, a load sensor, etc.) such as a load sensor (not shown) provided on the clamping shaft of the mold clamping mechanism 5.

[0159] In addition, when the transmission mechanism 42 causes the plunger 421 to rise to the upper mold 2, as shown in FIG. Fig.10 As shown, the slot block 41 is subjected to the restoring force, i.e., the elastic force, of the compressed elastic member 43 and rises from the lower mold 3 to the upper mold 2. That is, in the mold opening operation, while the slot block 41 is subjected to the elastic force of the elastic member 43 and rises from the lower mold 3 to the upper mold 2, the transmission mechanism 42 causes the plunger 421 to rise from the lower mold 3 to the upper mold 2.

[0160] Furthermore, during the mold opening operation, the timing at which the groove block 41 starts to rise from the lower mold 3 to the upper mold 2 due to the elastic force of the elastic member 43 and the timing at which the plunger 421 starts to rise from the lower mold 3 to the upper mold 2 using the transmission mechanism 42 may be the same or different.

[0161] By utilizing the rise of the plunger 421 of the transmission mechanism 42 and the rise of the slot block 41 utilizing the elastic force of the elastic member 43, as shown in FIG. Fig.11 As shown, the resin molded product W2 on the mold surface of the lower mold 3 is separated from the unnecessary resin K on the groove block 41 (gate disconnection).

[0162] At this time, the resin molded product W2 on the lower mold 3 is pressed toward the mold surface of the lower mold 3 by the ejector pin 61 provided on the upper mold 2, and the lower surface of the resin molded product W2 is in close contact with the mold surface of the lower mold 3 (refer to Fig.10 The ejector pin 61 functions as a pressing member for pressing the resin molded product W2 against the mold surface of the lower mold 3 when separating the resin molded product W2 from the unnecessary resin K. Since the resin molded product W2 is pressed against the mold surface of the lower mold 3 by the pressing member as described above, shear stress is easily applied between the resin molded product W2 and the unnecessary resin K, and the gate is easily disconnected.

[0163] Here, the ejector pin 61 as the pressing member presses the resin molded product W2 against the mold surface of the lower mold 3 at least until the resin molded product W2 is separated from the unnecessary resin K. In other words, during the mold opening operation, while the ejector pin 61 is pressing the resin molded product W2, the separation of the resin molded product W2 from the unnecessary resin K is completed by the rise of the groove block 41 and the rise of the plunger 421.

[0164] In the gate cutoff, the unnecessary resin K is sandwiched between the upper surface of the slot block 41 pressed upward by the elastic force of the elastic member 43 and the lower surface of the upper mold 2 (see Fig.10 and Fig.11 ). That is, the groove block 41 is in a state of sandwiching unnecessary resin K between the upper mold 2 and the groove block 41 by the elastic force of the elastic member 43 during a predetermined period from the start of the mold opening operation. The so-called predetermined period is at least a period until the gate is disconnected and the lower mold 3 is lowered to the initial state (the state before being pressed and compressed by the upper mold 2) of the elastic member 43.

[0165] Then, after a predetermined period of time, the lower mold 3 is further lowered by the mold clamping mechanism 5. Fig.12 As shown, the groove block 41 peels the unnecessary resin K from the upper mold 2 while retaining the unnecessary resin K. Here, the groove block 41 is formed with a material removal pool 41b and a gate 41c, and the contact area between the groove block 41 and the unnecessary resin K is larger than the contact area between the upper mold 2 and the unnecessary resin K, so that the unnecessary resin K is not peeled off from the groove block 41, but is peeled off from the upper mold 2. As a result, an ejector pin for contacting with the unnecessary resin K and peeling the unnecessary resin K from the upper mold 2 is not required.

[0166] Furthermore, as the transfer mechanism 42 raises the plunger 421 toward the upper die 2 , the extension portion 411 of the slot block 41 changes from a state where the resin molded product W2 is sandwiched between the die surface of the lower die 3 to a state where the extension portion 411 is not in contact with the resin molded product W2 .

[0167] In addition to the gate disconnection, the transmission mechanism 42 causes the plunger 421 to rise toward the upper mold 2 until the elastic member 43 on the lower side of the slot block 41 returns to the initial state before the mold is closed (see Fig.12 ). Thus, in the next resin molding, when the molding object W1 is placed on the lower side of the protruding portion 411, the protruding portion 411 does not become an obstacle.

[0168] After the mold opening operation as described above is performed and the resin molded product W2 and the unnecessary resin K are separated, the resin molded product W2 and the unnecessary resin K are carried out by the unloader 15 .

[0169] like Fig.13 As shown, the unloader 15 includes a suction portion 15a for molded products and a suction portion 15b for unnecessary resin. The suction portion 15a for molded products and the suction portion 15b for unnecessary resin both include suction pads made of resin, and in particular, the suction portion 15b for unnecessary resin is, for example, a bellows type, and has better elasticity than the suction portion 15a for molded products. In addition, the suction portion 15a for molded products and the suction portion 15b for unnecessary resin are arranged on the base member 151 and are connected to a suction source not shown in the figure. Furthermore, at least the suction portion 15a for molded products is configured to be movable in the left-right direction and the up-down direction relative to the base member 151. In addition, the unloader 15 is provided with a retaining claw 152, and the retaining claw 152 is used to retain the resin molded product W2 adsorbed by the suction portion 15a for molded products.

[0170] After the mold opening operation is completed, the unloader 15 is moved between the upper mold 2 and the lower mold 3. Fig.13As shown, the molded product adsorption portion 15a is brought into contact with the upper surface of the resin molded product W2, and the unnecessary resin adsorption portion 15b is brought into contact with the upper surface of the unnecessary resin K.

[0171] In the above state, Fig.14 As shown, the transfer mechanism 42 causes the plunger 421 to rise and lift the unnecessary resin K from the groove block 41. Here, in the case where the unnecessary resin K remains in the residual portion K1 in the groove 41a, the residual portion K1 rises to a degree that does not hinder the recovery of the unnecessary resin K. As a result, the unnecessary resin K is demolded from the groove block 41 and is in close contact with the unnecessary resin adsorption portion 15b. At this time, the unnecessary resin adsorption portion 15b is in a state of elastic deformation and contraction. Here, the friction force F between the groove 41a and the plunger 421 is obtained with high precision by using the calculation unit 71, so that the force of pressing the unnecessary resin K by the plunger 421 can be controlled with high precision.

[0172] After the unnecessary resin suction unit 15b is set to the contracted state, suction of the unnecessary resin suction unit 15b is started, and the unnecessary resin suction unit 15b is made to suction the unnecessary resin K. Also, suction of the molded product suction unit 15a is started, and the molded product suction unit 15a is made to suction the resin molded product W2.

[0173] Then, if Fig.15 As shown in FIG. 1 , the molded product suction portion 15a sucking the resin molded product W2 is moved in a direction away from the groove block 41, so that the resin molded product W2 is moved outside the extension portion 411. Thereafter, the unloader 15 is raised and withdrawn from the upper mold 2 and the lower mold 3. Thus, the unloader 15 is used to carry out the resin molded product W2 and unnecessary resin K.

[0174] Here, the unloader 15 may include a cleaning mechanism (not shown) for cleaning the upper mold 2 and the lower mold 3. The cleaning mechanism may include a rotating brush and a suction unit that sucks and discharges dust.

[0175] In this case, the unloader 15 sucking the resin molded product W2 and the unnecessary resin K stays between the upper mold 2 and the lower mold 3 and performs a cleaning operation. In the cleaning operation, the control unit COM performs a friction force calculation function.

[0176] Here, first, the transfer mechanism 42 performs the action of scraping out the resin adhering to the groove 41a. Fig.16 As shown, the transmission mechanism 42 raises the plunger 421 to a predetermined scraping position. Here, the predetermined scraping position is, for example, a position where the upper surface of the plunger 421 is located above the opening position of the groove 41a.

[0177] Then, the transfer mechanism 42 is lowered from the predetermined scraping position to the loading position for receiving the resin material J. Fig.17 As shown, in the descending operation (section a) of descending the plunger 421 from the scraping position to the loading position, the calculation unit 71 obtains the second load P2 from the force sensor PS such as a load cell.

[0178] Thereafter, the transfer mechanism 42 again raises the plunger 421 to a predetermined pulling-out position. Thus, the resin adhering to the groove is pulled out of the groove 41a. Fig.17 As shown, in the ascending operation (section b) of the plunger 421 from the loading position to the extraction position, the calculation unit 71 obtains the first load P1 from the force sensor PS such as a load cell.

[0179] Thereafter, the upper die 2, the lower die 3, the slot block 41, and the plunger 421 are cleaned by the cleaning mechanism provided in the unloader 15. In addition, the calculation unit 71 uses the minimum value P2 of the second load P2 obtained in the interval a. min And the maximum value P1 of the first load obtained in interval b max , the friction force F is calculated using the formula [1].

[0180] Furthermore, during the cleaning operation, the descending operation from the scraping position to the loading position and the ascending operation from the loading position to the scraping position may be performed multiple times, respectively.

[0181] Alternatively, when the plunger 421 is lowered and raised multiple times, the second load P2 may be obtained during the lowering action (interval a), and the first load P1 may be obtained during the raising action (interval b). In this case, the minimum value P2 of the plurality of second loads P2 obtained may be considered. min The maximum value P1 of the plurality of first loads P1 obtained is averaged. max The friction force F is calculated by averaging the values ​​and using the above formula [1]. Alternatively, the minimum value P2 of the second load P2 may be used. min and a maximum value P1 of the first load P1 max The friction force F is calculated according to the formula [1], and the multiple friction forces F obtained thereby are averaged. In addition, it is also possible to determine whether to further move the plunger 421 up and down when the friction force F obtained by one up and down movement is greater than a predetermined value.

[0182] After the cleaning operation is completed, the unloader 15 withdraws from the upper mold 2 and the lower mold 3 to carry out the resin molded product W2 and unnecessary resin K.

[0183] In the cleaning operation, the friction force F calculated by the calculation unit 71 is sent to the adjustment unit 72. The adjustment unit 72 controls the plunger drive unit 422 using the calculated friction force F in the next resin molding so that the injection pressure of the resin material J becomes a predetermined set value.

[0184] Furthermore, the friction force F calculated by the calculation unit 71 during the cleaning operation is sent to the determination unit 73. Then, the determination unit 73 compares the calculated friction force F with a preset reference value, and if the friction force is greater than the reference value, for example, an alarm is issued to prompt maintenance, or the resin molding device 100 is stopped.

[0185] <Effects of the present embodiment>

[0186] According to the resin molding device 100 of this embodiment, the friction force F between the groove 41a and the plunger 412 is calculated based on the first load P1 applied to the plunger 421 when the plunger 421 rises and the second load P2 applied to the plunger 421 when the plunger 421 descends, and the load of the plunger in a stopped state is not used as a reference. Therefore, the friction force between the groove 41a and the plunger 421 can be calculated with high precision.

[0187] Furthermore, since the first load P1 and the second load P2 are obtained in the cleaning operation after resin molding, the existing operation of the resin molding apparatus 100 can be utilized, and there is no need to perform an additional operation for obtaining the first load P1 and the second load P2.

[0188] <Other Modified Embodiments>

[0189] Furthermore, the present invention is not limited to the above-described embodiments.

[0190] In the above embodiment, the first load P1 and the second load P2 are acquired during the cleaning operation to calculate the friction force F, but the following structure may be adopted: the first load P1 and the second load P2 are acquired at a time other than the cleaning operation to calculate the friction force F. For example, the plunger 421 may be raised and lowered to acquire the first load P1 and the second load P2 to calculate the friction force F before the resin material J is accommodated in the groove 41 a.

[0191] The range for raising and lowering the plunger 421 is not limited to between the scraping position and the loading position as in the above embodiment, and can be appropriately set, for example, between the injection completion position where the injection of the resin material J is completed and the loading position.

[0192] Furthermore, the calculation unit 71 of the above embodiment uses the maximum value P1 of the first load P1 max and the minimum value P2 of the second load P2 min to find the friction force F, but the maximum value P1 in the first load P1 can also be usedmax The minimum value P2 among the values ​​other than the second load P2 min The friction force F may be obtained by using a value other than . Alternatively, the friction force F may be obtained by using an average value of the first load P1 in section a and an average value of the second load P2 in section b.

[0193] The resin molding apparatus of the above-described embodiment performs edge gate type transfer molding by including the projection 411 in the groove block 41 , but may also perform side edge gate type transfer molding.

[0194] The resin molding apparatus of the present invention is not limited to ordinary transfer molding, and may be any structure as long as it includes a transfer mechanism.

[0195] In addition, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

Claims

1. A resin molding device, which uses a plunger to extrude a resin material contained in a groove and inject it into a mold cavity, and the resin molding device includes a computing unit, The calculation unit calculates the friction force between the groove and the plunger based on a first load applied to the plunger when the plunger is moved in an extrusion direction and a second load applied to the plunger when the plunger is moved in a direction opposite to the extrusion direction. The calculation unit calculates the friction force based on a maximum value of the first load and a minimum value of the second load.

2. A resin molding device, which uses a plunger to extrude the resin material contained in the groove and inject it into the mold cavity, and the resin molding device includes a computing unit, The calculation unit calculates the friction force between the groove and the plunger based on a first load applied to the plunger when the plunger is moved in an extrusion direction and a second load applied to the plunger when the plunger is moved in a direction opposite to the extrusion direction. The calculation unit calculates the friction force based on a difference between a maximum value of the first load and a minimum value of the second load. 3 . The resin molding device according to claim 1 , further comprising an adjustment unit that uses the friction force obtained by the calculation unit to adjust a force for extruding the resin material by the plunger. 4 . The resin molding device according to claim 1 , further comprising a determination unit for determining whether the device can be operated based on a comparison result between the friction force obtained by the calculation unit and a preset reference value.

5. The resin molding device according to claim 1 or 2, wherein: A cleaning operation is performed by using the plunger to scrape the resin adhering to the groove to the outside of the groove, The calculation unit acquires the first load and the second load during the cleaning operation.

6. The resin molding device according to claim 5, wherein: The cleaning operation is performed by moving the plunger between a predetermined scraping position and a loading position for accommodating the resin material. The calculation unit acquires the first load when the plunger is moved from the loading position to the picking-out position, and acquires the second load when the plunger is moved from the picking-out position to the loading position.

7. The resin molding device according to claim 1 or 2, comprising: A first mold, formed with the mold cavity; a second mold, facing the first mold and provided with a resin injection portion including the groove and the plunger; as well as A mold clamping mechanism is used to clamp the first mold and the second mold. The resin injection part includes: a slot block having the slot formed therein, being arranged to be able to advance and retreat relative to the second die via an elastic member, and including a protruding portion protruding on a die surface of the second die; as well as The transfer mechanism includes the plunger and moves the plunger to inject the resin material from the groove into the cavity.

8. The resin molding device according to claim 7, wherein: During the mold opening operation in which the mold clamping mechanism opens the first mold and the second mold, the transfer mechanism moves the plunger toward the first mold to separate the resin molded product on the mold surface of the second mold from unnecessary resin on the groove block.

9. The resin molding device according to claim 7, comprising a conveying mechanism for carrying out unnecessary resin on the tank block after the resin molding. The conveying mechanism includes an unnecessary resin adsorption portion for adsorbing the unnecessary resin. After the conveying mechanism brings the unnecessary resin adsorption portion into contact with the unnecessary resin on the slot block, the transfer mechanism moves the plunger toward the first mold to peel the unnecessary resin from the slot block, and then the conveying mechanism uses the unnecessary resin adsorption portion to adsorb the unnecessary resin and carry the unnecessary resin out.

10. A method for producing a resin molded product, using the resin molding apparatus according to any one of claims 1 to 9.

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