High current contact device and method for manufacturing a high current contact device

Abstract

The present invention relates to a high-current contact device (10) and a method for manufacturing such a high-current contact device (10), wherein the high-current contact device (10) has at least one first contact element (25) designed for transmitting electrical energy, a circuit carrier (30), at least one first data contact (40) for transmitting data signals, and at least one data interface (60), wherein the first contact element (25) passes through the circuit carrier (30) along a mating axis (110) at a feedthrough (175), wherein the conductor track (145) of the circuit carrier (30) electrically connects the first data contact (40) to the data interface (60), wherein the circuit carrier (30) is designed as an injection-molded circuit carrier, wherein the carrier (115) of the circuit carrier (30) mechanically supports the first data contact (40), the first contact element (25), and the data interface (60).

Description

Technical Field

[0001] This invention relates to high-current contact devices and methods for manufacturing high-current contact devices. Background Technology

[0002] DE102016107401A1 discloses an insert for a plug-in device, comprising contact elements, such as contact pins for conducting current. The contact elements include a contact region and a connection region, in which the contact element contacts a complementary contact element, and in the connection region, conductors are connected. The temperature of at least one contact element is detected in a measuring region located between the contact region and the connection region. Summary of the Invention

[0003] The purpose of this invention is to provide an improved high-current contact device for transmitting electrical energy and an improved method for manufacturing the high-current contact device.

[0004] This objective is achieved through a high-current contact device and a method for manufacturing the high-current contact device.

[0005] It has been recognized that improved high-current contact devices for motor vehicles or charging stations can be provided by means of a high-current contact device having at least one first contact element designed for transmitting electrical energy, a circuit carrier, at least one first data contact for transmitting data signals, and at least one data interface. The first contact element passes through the circuit carrier along a mating axis at a feedthrough. Conductor tracks of the circuit carrier electrically connect the first data contact to the data interface. The circuit carrier is designed as an injection-molded circuit carrier, wherein the carrier of the circuit carrier mechanically supports the first data contact and the data interface.

[0006] The advantage of this design is that, due to the provision of a circuit carrier, the assembly cost for assembling high-current contact devices is significantly reduced, resulting in high-current contact devices that can be assembled particularly quickly and economically. The number of components in high-current contact devices is also particularly small.

[0007] In another embodiment, the high-current contact device has a contact housing defining the interior of the housing. A first data contact, circuit carrier, and first contact element are arranged within the housing. The data interface extends laterally through the contact housing in a plane inclined relative to the mating axis. Therefore, the data interface can be accessed particularly easily from the outside. Furthermore, because the data interface is laterally guided out of the contact housing, it can be easily sealed, and the interior of the housing can be protected from corrosive media entering through the data interface.

[0008] A particularly advantageous feature is that the carrier is made from a single piece of the same material. The carrier has a first part and a second part connected to the first part. The second part is offset from the first part relative to the mating axis. The feedthrough is arranged in the first part, and the data contacts are arranged on the second part. The advantage of this design is that, by using a carrier made from a single piece of the same material and a part offset along the mating axis, the carrier can be flexibly adapted to the geometry of high-current contact devices. Using a carrier made from a single piece of the same material reduces the number of parts and assembly costs.

[0009] A particularly advantageous feature is that the high-current contact device has a second contact element designed for transmitting electrical energy. This second contact element has a different design from the first contact element, wherein the second contact element is arranged on a second portion. The advantage of this design is that, for example, in each case, one free end of the first and second contact elements is arranged in a common plane, even if the first and second contact elements have contact portions designed to have different lengths. Therefore, the carrier can compensate for the different geometric designs of the contact elements, resulting in no need to refurbish existing machine tools used to manufacture the first and second contact elements. Consequently, the preparation cost for manufacturing the high-current contact device is particularly low.

[0010] Particularly advantageous is that, for example, direct current is transmitted through the first contact element and alternating current, especially three-phase alternating current, is transmitted through the second contact element, wherein the current transmitted through the second contact element is, for example, significantly lower than the current transmitted through the first contact element. As a result, for example, the second contact element can be designed to be significantly smaller than the first contact element, and, for example, significantly shorter than the first contact element by means of the contact portion.

[0011] The presence of at least one reinforcing rib on the carrier provides a particularly rigid circuit carrier, wherein the reinforcing rib extends along the mating axis. Due to the reinforcing rib, bending when the first and / or second contact elements and / or data contacts are inserted into the carrier can be kept low, resulting in prevention of mechanical damage to the conductor tracks arranged on the carrier.

[0012] In another embodiment, the high-current contact device has at least one sealing sleeve fixed to the circuit carrier. The sealing sleeve is axially abutted and fed through relative to the mating axis. The sealing sleeve engages around the first contact element in a fluid-tight manner. The sealing sleeve prevents corrosive media from entering laterally through the contact element via the circuit carrier. Corrosion inside the housing is prevented by sealing both sides of the housing interior at the data interface and the first contact element.

[0013] Of particular advantage is that the sealing sleeve is connected to the circuit carrier in a material-bonded manner, and preferably also in a form-fit manner. Specifically, a two-component injection molding method is suitable here for manufacturing the sealing sleeve and the circuit carrier. The material-bonded connection of the sealing sleeve prevents creep gaps at the sealing sleeve relative to the circuit carrier. It also ensures that the sealing sleeve is reliably secured to the circuit carrier, resulting in preventing undesirable detachment of the sealing sleeve when the first contact element is inserted through the feedthrough of the carrier.

[0014] In another embodiment, at the feedthrough, the carrier has a retaining structure having at least one recess and a web defining the recess, wherein a sealing sleeve closes the recess, and the web is at least embedded in certain regions of the sealing sleeve. The advantage of this design is that the sealing sleeve is mechanically connected to the carrier in a particularly stable manner.

[0015] In another embodiment, the circuitry is arranged on a circuit carrier, wherein the circuitry is designed to identify a piece of information regarding the operating parameters of the high-current contact device. The circuit carrier electrically connects the circuitry to a data interface via another conductor track arranged on the carrier, and is designed to provide information at the data interface. An advantage of this design is that the high-current contact device can also be monitored by an evaluation device connected to the data interface by providing operating parameters, thus allowing, for example, monitoring of moisture ingress into the housing and / or the temperature inside the housing and / or the current transmitted via the first contact element.

[0016] In another embodiment, the circuit has at least one temperature measuring device with at least one temperature sensor, wherein the temperature sensor is designed to measure the temperature of the first contact element as an operating parameter.

[0017] The particularly good thermal connection of the temperature sensor is provided by the fact that the temperature sensor is embedded in a sealed sleeve. The sealed sleeve is thermally conductive and thermally connects the temperature sensor to the first contact element.

[0018] In another embodiment, the sealing sleeve comprises at least one of the following materials: copper, aluminum, alumina, aluminum nitrate, silicon oxide, silicon nitrate, boron nitride, plastic, heat-resistant plastic, silicone resin, and polyurethane.

[0019] Another advantage is that the sealing sleeve is injection molded, and the temperature sensor is attached to the sealing sleeve in a material-bonded manner and is encapsulated by the sealing sleeve. As a result, a particularly good thermal connection between the sealing sleeve and the temperature sensor can be ensured.

[0020] Thanks to the fact that the circuit carrier of high-current contact devices is injection molded, with conductor tracks formed on the carrier and data interfaces fixed to the circuit carrier, high-current contact devices can be manufactured in a particularly simple and cost-effective manner. Therefore, firstly, high-current contact devices can be manufactured with variable geometries, and secondly, the number of parts is reduced, resulting in very few assembly steps. Attached Figure Description

[0021] The invention will now be explained in more detail with reference to the accompanying drawings, in which:

[0022] Figure 1 A first perspective view of a high-current contact device is shown;

[0023] Figure 2 It shows Figure 1 A second perspective view of the high-current contact device shown;

[0024] Figure 3 It shows Figure 1 The third perspective view of the high-current contact device shown;

[0025] Figure 4 It shows the way Figure 1 The high current contact device shown along Figure 1 The sectional view of section AA shown;

[0026] Figure 5 It shows Figure 3 A perspective view of the carrier of the circuit carrier shown.

[0027] Figure 6 It shows Figure 4 A portion of the sectional view shown; and

[0028] Figures 7 to 12 This illustrates the manufacturing process of high-current contact devices. Figures 1 to 6 Part of the high-current contact device shown. Detailed Implementation

[0029] The following diagram shows a reference coordinate system. For example, the coordinate system is designed as a right-handed coordinate system, with an x-axis (vertical direction), a y-axis (horizontal direction), and a z-axis (vertical direction).

[0030] Figure 1 A first perspective view of the high-current contact device 10 is shown.

[0031] The high-current contact device 10 has a contact housing 15, a first contact device 20 with at least one first contact element 25, and a circuit carrier 30 (in Figure 1The high-current contact device 10 may also have a second contact device 50 with at least one second contact element 55. In this embodiment, the first contact device 20 is offset relative to the second contact device 50 in the z-direction. The data contact device 35 is arranged adjacent to the second contact device 50 in the z-direction opposite to the first contact device 20.

[0032] Furthermore, the high-current contact device 10 has at least one laterally arranged data interface 60. The data interface 60 may have a first data contact device 65 and a second data contact device 70, which are located in… Figure 1 The middle part is represented by a dashed line.

[0033] Furthermore, the first contact device 20 may have a third contact element 75. The third contact element 75 may have the same design as the first contact element 25. In this case, for example, the third contact element 75 is offset relative to the first contact element 25 in the y-direction, wherein, for example, the first contact element 25 and the third contact element 75 are arranged in a common xy-plane. In this case, in Figure 1 In this configuration, the first and third contact elements 25 and 75 contact with mating contacts 80 of another high-current contact device 85, which in each case are designed in a manner corresponding to the first and third contact elements 25 and 75. The other high-current contact device 85... Figure 1 It is only shown schematically by dashed lines.

[0034] In addition to the second contact element 55, the second contact device 50 may have at least one fourth contact element 90. In this embodiment, the second contact device 50 further has a fifth contact element 95, wherein the second contact element 55 and the fourth contact element 90 are designed to be the same as each other and different from the first and third contact elements 25, 75, and the fifth contact element 95 is designed to be different from the first to fourth contact elements 25, 75, 55, 90.

[0035] In this embodiment, the second contact device 50 is designed, for example, as a five-pole contact device. In this case, the third and fourth contact elements 75, 90 are arranged on a circular track surrounding the fifth contact element 95. The first and second data contacts 40, 45 are arranged in a common xy plane and are also arranged on a circular track surrounding the fifth contact element 95.

[0036] For each contact element 25, 55, 75, 90, 95 and for data contacts 40, 45, the contact housing 15 has an associated contact reservoir 120, which in each case extends through the contact housing 15 along the mating axis 110. The contact reservoir 120 is composed of... Figure 1 The circuit carrier 30 on the rear side of the high-current contact device 10 shown is partially closed.

[0037] In this configuration, the contact housing 15 is designed to mechanically support the contact elements 25, 55, 75, 90, 95 and the data contacts 40, 45 respectively, and to electrically insulate them from each other. In this configuration, the contact elements 25, 55, 75, 90, 95 and their respective associated data contacts 40, 45 can be pressed into their respective associated contact receptacles 120 in certain areas.

[0038] The high-current contact device 10 and another high-current contact device 85 may be designed to be hermetically sealed to prevent moisture, liquids and / or other corrosive media from entering the housing interior 100 of the contact housing 15 (see [link]). Figure 2 ).

[0039] The first and second contact devices 20, 50 can be connected to a high-current cable 105, for example, on the side away from the observer. The high-current cable 105 can be connected to, for example, an energy storage device, a drive motor of a motor vehicle, or a vehicle control unit. The high-current cable 105 can also be connected to a charging station to provide charging current for charging the energy storage device. In this embodiment, Figure 1 The high-current contact device 10 shown is used to connect the charging plug of the charging station to the internal charger of the motor vehicle to charge the energy storage device. For this purpose, the first contact device 20 is designed to transfer electrical energy to the charger, which is present at the first and third contact elements 25, 75 via a DC voltage.

[0040] For example, the first and third contact elements 25, 75 are designed to carry a current of at least 30 to 1000 amps, particularly 50 to 500 amps, over a period of at least 30 seconds. The voltage between the first contact element 25 and the third contact element 75 can be between 48 volts and 500 volts. Therefore, the voltage between the first and third contact elements 25, 75 is significantly different from the conventional 12 or 24-volt networks of motor vehicles.

[0041] The second contact device 50 is also designed for the transmission of electrical energy. In this case, the electrical energy transmitted through the second contact device 50 can exist at the second contact device as alternating current, particularly as three-phase alternating current. Depending on the existing alternating current, the second contact device 50 has a corresponding number of second, fourth, and fifth contact elements 55, 90, and 95. For example... Figure 1As shown, if electrical energy is supplied as three-phase alternating current, the second contact device 50 accordingly has five contact elements 55, 90, 95. In this case, the fifth contact element 95 can be connected to the grounding connection / protective grounding conductor, and the second and fourth contact elements 55, 90 can be connected to an external conductor. AC voltage can be supplied, for example, via a household connection.

[0042] The current transmitted via the second, fourth, and fifth contact elements 55, 90, 95 is significantly lower than the current transmitted via the first and third contact elements 25, 75, for example, in the range of 1 to 32 amps, and particularly in the range of 1 to 16 amps. The AC voltage present between the second, fourth, or fifth contact elements 55, 90, 95 can be as high as approximately 600 volts.

[0043] The data contact device 35 is used for data transmission, and therefore not for transmitting electrical energy to charge the energy storage device or drive the drive motor. Instead, it is used to transmit information to the charging station, such as information about the operating status of the energy storage device or the charging information of the charger. As a result, the electrical energy transmitted through the data contact device is particularly low, not exceeding 0.1 amperes of current transmitted through the data contact device 35.

[0044] In this embodiment, the first contact element 25 extends in a straight line along the mating axis 110. The mating axis 110 is oriented to extend parallel to the x-axis. The second to fifth contact elements 55, 75, 90, 95 and the data contact elements 40, 45 are also designed to extend parallel to the mating axis 110.

[0045] The first to fifth contact elements 25, 55, 75, 90, and 95 are designed, for example, as pin contacts and for electrical contact connection with mating contacts 80, which are designed, for example, as pin contacts.

[0046] Figure 2 It shows Figure 1 A second perspective view of the high-current contact device shown.

[0047] The circuit carrier 30 is disposed within the housing interior 100 of the contact housing 15. In this embodiment, the circuit carrier 30 is designed as an injection-molded circuit carrier, commonly referred to as a molded integrated device (MID). The circuit carrier 30 has a carrier 115. The carrier 115 comprises an electrically insulating material. The electrically insulating material may in particular be polypropylene, polyethylene, and / or heat-resistant plastics.

[0048] exist Figure 2At the first end 135 away from the observer, a first data contact device 65 and a second data contact device 70 are mechanically connected to the carrier 115. The data contact devices 65 and 70 are laterally guided through the contact housing 15 in a plane perpendicular to the mating axis 110 and are capable of external contact via a data connection device 140 designed in a manner corresponding to the first and / or second data contact devices 65 and 70. For example, the first and second data contact devices 65 and 70 are designed in a sealed manner, resulting in the prevention of fluid or liquid between the contact housing 15 and the data contact devices 65 and 70 from entering the housing interior 100.

[0049] exist Figure 2 On one side of the first to fifth contact elements 25, 55, 75, 90, and 95 facing the observer, the corresponding contact elements 25, 55, 75, 90, and 95 can be electrically connected (e.g., crimped) to the electrical conductor of the high-current cable 105. Data contacts 40 and 45 can be... Figure 2 The side shown is connected (e.g., crimped) to the data cable (e.g., twisted pair cable).

[0050] Figure 3 A perspective view of the high-current contact device 10 is shown, wherein, for clarity, in Figure 3 The diagram of the contact housing 15 is omitted.

[0051] The circuit carrier 30 has one or more exemplary conductor tracks 145, 150, 155, 160, 252, which are arranged, for example, on the first end side 135 of the carrier 115. In this case, for example, the first conductor track 145 connects the first data contact 40 to the first data contact device 65. In addition, the second conductor track 150 electrically connects the first data contact device 65 to the second data contact 45.

[0052] At least one circuit 165 may be arranged on the circuit carrier 30. Circuit 165 is electrically connected to the second data contact 70, for example, via a third conductor rail 155 and a fourth conductor rail 160. Circuit 165 is designed to identify a piece of information regarding the operating parameters of the high-current contact 10. By means of the third and fourth conductor rails 155, 160, circuit 165 is designed to provide information regarding the operating parameters of the high-current contact 10 at the second data contact 70.

[0053] exist Figure 3At the second end 240 away from the observer, the carrier 115, for example, lacks conductor tracks 145, 150, 155, and 160. Conductor tracks 145, 150, 155, and 160 are made, for example, of conductive and / or non-conductive chemically modified copper and / or aluminum and / or aluminum nitrate and / or silicon oxide and / or silicon nitrate and / or boron nitride and / or ferrous and / or non-ferrous metals. The circuit carrier 30 may also be designed to have multiple layers, such that conductor tracks 145, 150, 155, and 160 are designed to extend partially within the carrier 115.

[0054] Operating parameters may include, for example, the temperature of the high-current contact 10 and / or the current transmitted via the high-current contact 10 and / or the electrical power of the first contact 20 and / or the second contact 50. Functions such as the polarity of contact elements 25, 55, 75, 90, 95 may also be checked, and corresponding information may be provided at the second data contact 70 via circuit 165.

[0055] In the carrier 115, a corresponding feedthrough 175 is arranged for each contact element 25, 55, 75, 90, 95 and data contact 40, 45. The feedthrough 175 is designed as a hole. The associated contact element 25, 55, 75, 90, 95 or the respective associated data contact 40, 45 passes through the feedthrough 175 along the mating axis 110. In this case, the feedthrough 175 opens at the contact housing 120 at the second end side 240. The contact elements 25, 55, 75, 90, 95 and data contacts 40, 45 extend out of the carrier 115 on both sides.

[0056] The carrier 115 of the circuit carrier 30 is made of a single piece of the same material. Particularly advantageously, the carrier 115 has a first portion 180, a second portion 185, and a connecting portion 190. The first portion 180 and the second portion 185 extend in different yz planes offset along the x-direction. For example, Figure 3 The first part 180 is arranged to be offset from the second part 185 in the x-direction away from the observer. The first part 180 and the second part 185 are designed to be substantially flat.

[0057] A connecting portion 190 is disposed between the first portion 180 and the second portion 185, and connects the first portion 180 to the second portion 185. The connecting portion 190 is designed to be inclined relative to the first portion 180 and the second portion 185.

[0058] Furthermore, the carrier 115 may have at least one reinforcing rib 195. The reinforcing rib 195 is disposed on the first portion 180, for example, between the first contact element 25 and the third contact element 75. In this case, for example, the reinforcing rib 195 extends in the xz plane. The collar 200 may also be disposed circumferentially on the first portion 180, wherein the collar 200 extends out of the first portion 180 in the x-direction and is disposed on the side facing the second portion 185.

[0059] The reinforcing rib 195 terminates at the collar 200 on one side and at the connecting portion 190 on the other side. The collar 200 and the reinforcing rib 195 reinforce the carrier 115 in the first portion 180 and at the connecting portion 190. As a result, when the high-current contact device 10 is inserted into another high-current contact device 85, the engagement force can be supported particularly well, and deformation of the carrier 115 can be prevented.

[0060] Furthermore, the carrier 115 may have a first notch 205 on the second portion 185. The first notch 205 is designed as a recess in the second portion 185 and connects to the side surface 201 of the carrier. The side surface 201 extends substantially in the xz direction, for example. The first notch 205 accommodates and is shaped accordingly for the first data contact device 65. The first notch 205 extends, for example, in the x direction to the side facing the contact reservoir 120.

[0061] The first and second conductor tracks 145, 150 are also introduced from the data contacts 40, 45 via the second portion 185 into the first recess 205, wherein the first and second conductor tracks 145, 150 are electrically connected in the first recess 205 through the first data contact device 65.

[0062] Following the side surface 201 of the carrier 115, the carrier 115 has a second recess 210. The second recess 210 is arranged vertically at the bend between the second portion 185 and the connecting portion 190, and extends in the x-direction facing the contact reservoir 120. The second recess 210 accommodates the second data contact device 70 and is designed in a manner corresponding to the second data contact device 70.

[0063] Due to the first and second recesses 205, 210, the data contact devices 65, 70 can be positioned in an optimal manner and are particularly easy to access from one side of the contact housing.

[0064] The high-current contact device 10 has a corresponding sealing sleeve 230 for each contact element 25, 55, 75, 90, 95 and for each data contact 40, 45. The sealing sleeve 230 comprises a flexible matrix material. The matrix material may include, for example, silicone resin and / or polyurethane and / or plastic. The sealing sleeve 230 is material-bonded to a carrier 115 at a first end side 135. The carrier 115 and the sealing sleeve 230 are preferably manufactured using a two-component injection molding method.

[0065] Circuit 165 may include a temperature measuring device 170. Temperature measuring device 170 may include at least one first temperature sensor 235. The first temperature sensor 235 is arranged at a distance from the first contact element 25, physically in the region adjacent to the feedthrough 175 through which the first contact element 25 passes. For example, the first temperature sensor 235 may be embedded in a sealing sleeve 230. The sealing sleeve 230 preferably comprises particulate filler material in a matrix material, including, for example, copper and / or aluminum and / or silver. The sealing sleeve 230 has a thermal conductivity of about 0.3 W / (m·K) to 2 W / (m·K), particularly 0.3 W / (m·K) to 1.7 W / (m·K). The sealing sleeve 230 thermally connects the first temperature sensor 235 to the first contact element 25. The first temperature sensor 235 is electrically connected to the second data contact device 70 via a third conductor rail 155 and a fourth conductor rail 160.

[0066] Because the circuit carrier 30 is designed as an injection-molded circuit carrier, the third and fourth conductor tracks 155, 160 are introduced into the second recess 210 on the first end side 135 via the first portion 180 and the connecting portion 190. The second data contact device 70 contacts the third and fourth conductor tracks 155, 160. The second data contact device 70 is also mechanically connected to the carrier 115 in the second recess 210.

[0067] Conductor tracks 145, 150, 155, and 160 extend along the contour of carrier 115. In this case, the injection molding design of circuit carrier 30 allows conductor tracks 145, 150, 155, and 160 to not only be designed in a plane as in the case of a conventional printed circuit board, but also to follow the contour of carrier 115. As a result, circuit carrier 30 has a particularly flat and compact design.

[0068] Furthermore, the temperature measuring device 170 may have a second temperature sensor 245 and / or a third temperature sensor 250. The explanation provided in the case of the first temperature sensor 235 applies similarly to the second and third temperature sensors 245, 250. The second temperature sensor 245 may, for example, be arranged in the region of the second contact device 50 on the second portion 185 of the carrier 115, and may be thermally connected to the second, fourth, and fifth contact elements 55, 90, 95.

[0069] The third temperature sensor 250 can, for example, be arranged in the region 275 at the feedthrough 175 through which the third contact element 75 passes, and can be thermally coupled to the third contact element 75. A sealing sleeve 230 on the third contact element 75 can also be arranged on the carrier 115, particularly injection molded to the carrier 115, such that the sealing sleeve 230 completely surrounds the third temperature sensor 250 on its circumferential side. As a result, the third temperature sensor 250 is embedded in the sealing sleeve 230, just as the first temperature sensor 235 is embedded in its corresponding sealing sleeve 230. Consequently, the third temperature sensor 250 is particularly well thermally coupled to the third contact element 75.

[0070] The second temperature sensor 245 is also electrically connected to the first data contact device 65 via a conductor rail, the conductor rail being in... Figure 3 The middle is covered. In a similar manner, the third temperature sensor 250 can be transmitted via a method not covered in the middle. Figure 3 The other conductor rails 252 shown are electrically connected to the second data contact device 70.

[0071] If a current of at least 10 amperes, preferably at least 50 amperes, is transmitted via the first contact device 20, the first contact device 20 becomes hot. The thermal connection of the first and third contact elements 25, 75 via their respective associated sealing sleeves 230 enables the first and third temperature sensors 235, 250 to measure the respective temperatures of the associated first and third contact elements 25, 75 and provide a corresponding temperature information at the second data contact device 70.

[0072] When controlling, for example, the charging process, especially the fast charging process, temperature information about the temperatures of the first and third contact elements 25, 75 provided at the second data contact device 70 can be used. Since the temperatures of the first and third contact elements 25, 75 are monitored, overheating of the first and third contact elements 25, 75 can be prevented, as can overheating of the first portion 180 of the carrier 115 arranged adjacent to the first and third contact elements 25, 75.

[0073] The temperature of the second contact device 50 is also measured, and a corresponding temperature information is provided at the first data contact device 65. In particular, this temperature information can be used to prevent the second contact device 50 from overheating during power transmission.

[0074] Figure 4 It shows the way Figure 1 The high current contact device 10 shown along Figure 1 The cross-sectional view of section AA shown.

[0075] Each contact element 25, 55, 75, 90, 95 and each data contact 40, 45 has its own contact portion 215, sealing portion 220, and connecting portion 225. The sealing portion 220 is arranged between the contact portion 215 and the connecting portion 225 in an axial direction relative to the mating axis 110. Through the contact portion 215, the contact elements 25, 55, 75, 90, 95 provide electrical contact to the corresponding mating contact 80 or data contact 40, 45. The sealing portion 220 directly abuts the contact portion 215 in the axial direction relative to the mating axis 110. The sealing portion 220 can be designed, for example, as a cylinder. Figure 4 On the rear part of the side furthest from the center, the connecting portion 225 is adjacent to the sealing portion 220, wherein contact elements 25, 55, 75, 90, 95 are connected via the connecting portion 225 to the respective associated electrical conductors of the high-current cable 105 or data contacts 40, 45. Data contacts 40, 45 are connected to the data cable at the connecting portion 225, not the high-current cable 105.

[0076] The sealing sleeve 230 seals the respective associated contact elements 25, 55, 75, 90, 95 or their respective associated data contacts 40, 45 on the sealing portion 220 in a fluid-tight manner. The sealing sleeve 230 abuts against the inner circumferential side of the sealing area 232 of the contact reservoir 120 via its outer circumferential side 231. The sealing sleeve 230 thus prevents moisture and / or fluid from entering the housing interior 100, thereby preventing corrosion of the high-current contact device 10.

[0077] The first contact device 20 is arranged in the first portion 180. The second contact device 50 and the data contact device 35 are arranged in the second portion 185. Due to the inclined extending connection portion 190, for example, a physical offset of the first contact device 20 relative to the second contact device 50 and the data contact device 35 can be produced in the longitudinal direction. As a result, in each case, one free end of the contact elements 25, 55, 75, 90, 95 and the data contacts 40, 45 is substantially arranged in a common yz plane 251. As a result, for example, the first and third contact elements 25, 75 can be designed to be generally longer in the longitudinal direction than the second, fourth and / or fifth contact elements 55, 90, 95 and / or the data contacts 40, 45. This has the advantage that the first and third contact elements 25, 75 can have extended contact portions 215 to transmit particularly high currents between the first and third contact elements 25, 75 and the associated mating contacts 80, respectively.

[0078] Figure 5 It shows Figure 3 The perspective view of the carrier 115 of the circuit carrier 30 shown.

[0079] exist Figure 5For clarity, the diagrams of contact devices 20, 50, data contact device 35, and sealing sleeve 230 are omitted.

[0080] For example, the carrier 115 has a retaining structure 255 adjacent to the feed passage 175. The retaining structure 255 may be arranged on each or only some of the feed passages 175. The retaining structure 255 is arranged circumferentially on the feed passages 175 about the mating axis 110. The retaining structure 255 may have a plurality of recesses 260 arranged circumferentially relative to the mating axis 110. The second temperature sensor 245 may be arranged on the first end side 135, centrally located between the three feed passages 175 through which the second, fourth, and fifth contact elements 25, 90, 95 pass. The recesses 260 are designed as channel openings and are designed as part of a ring. The recesses 260 are interrupted by a web 265, which in each case extends radially into the feed passage 175, wherein the first or third temperature sensor 235, 250 is arranged on one of the webs 265.

[0081] Figure 6 It shows Figure 4 A portion of the cross-sectional view shown.

[0082] At feedthrough 175, retaining structure 255 has a corresponding groove 266 formed circumferentially on the second end side 240. Grooves 266 connect grooves 260 to each other circumferentially on the side facing the second end side 240. If the sealing sleeve 230 is injection molded to the carrier 115 in a two-component injection molding method, the recesses 260 and grooves 266 are filled with the matrix material (and possibly filler material) of the sealing sleeve 230 that still needs to be cured. The retaining structure 255 has the advantage that the sealing sleeve 230 is connected to the carrier 115 in a material-bonded manner by a particularly large surface area. The sealing sleeve 230 is also connected to the carrier 115 via grooves 266 in a form-fit manner by an undercut on the web 265. As a result, the sealing sleeve 230 is prevented from being undesirably torn from the carrier 115 when the respective associated contact elements 25, 55, 75, 90, 95 or data contacts 40, 45 are inserted into the associated feedthrough 175.

[0083] Figures 7 to 12 The following cases are shown after each manufacturing step. Figures 1 to 6 The cross-section of the high-current contact device 10 shown.

[0084] First manufacturing step (see Figure 7 ), using injection molding to manufacture carrier 115. Here, with Figures 1 to 6 Conversely, in the design shown, retaining structure 255 can also be axially pushed out at feedthrough 175 along mating axis 110.

[0085] A second manufacturing step, preferably following the first manufacturing step (see...). Figure 8 The first end side 135 is surface-treated in at least certain areas, for example by laser treatment. The treatment is performed such that a track 270 is formed on the first end side 135. The track 270 defines the later contours of the conductor tracks 145, 150, 155, 160, 252 and the fixing area 275 for fixing the temperature sensors 235, 245, 250.

[0086] The third manufacturing step following the second manufacturing step (see...) Figure 9 The carrier 115 is electroplated, wherein the metal to be deposited to form conductor tracks 145, 150, 155, 160, 252 is deposited on the tracks 270 and the fixed area 275 manufactured in the second manufacturing step.

[0087] The fourth manufacturing step, which follows the third manufacturing step (see...). Figure 10 The components of circuit 165 are positioned and soldered to the corresponding conductor tracks 145, 150, 155, 160, 252, for example by reflow soldering. Data contacts 65, 70 are also positioned and soldered to the fixed area 275.

[0088] The fifth manufacturing step following the fourth manufacturing step (see...) Figure 11 The sealing sleeves 230 are injection molded onto the carrier 115 and cured using a two-component injection molding method. Here, the shapes are designed such that the individual sealing sleeves 230 are arranged adjacent to each other at a certain distance in the y-direction without contacting each other. This has the advantage of low material consumption for manufacturing the sealing sleeves 230, and the form used to manufacture the sealing sleeves 230 can be well integrated between the individual sealing sleeves 230.

[0089] Furthermore, when the carrier 115 is injection molded onto the second end side 240, the reinforcing structure 280 can be formed as follows: Figures 1 to 6 The design is shown. The reinforcing structure 280 is used to reduce bending during the assembly of the data contact devices 65 and 70, resulting in reduced deformation of the conductor tracks 145, 150, 155, 160, and 252. Therefore, damage to the conductor tracks 145, 150, 155, 160, and 252 can be prevented.

[0090] Figures 1 to 12 The illustrated design offers the advantage of significantly reducing the number of components used in the high-current contact device 10. A reliable and simple seal is ensured within the housing 100 of the contact housing 15 via a sealing sleeve 230 at each data contact 40, 45 and / or contact element 25, 55, 75, 90, 95. Particularly for data contacts 40, 45, it also prevents the complex manual assembly required for cable feeding through the seal.

[0091] Figures 1 to 12 The high-current contact device 10 shown is also particularly suitable for fully automated manufacturing and wiring. Because the circuit carrier 30 is incorporated into the housing 100, assembly costs are low, resulting in exceptionally short assembly times. Overall, assembly time is reduced by more than 50% compared to known high-current contact devices.

[0092] List of reference numerals

[0093] 10 High-current contact device

[0094] 15 Contact housing

[0095] 20 First contact device

[0096] 25 First contact element

[0097] 30 Circuit Carrier

[0098] 35 Data contact device

[0099] 40 First Data Contact

[0100] 45 Second Data Contact

[0101] 50 Second contact device

[0102] 55 Second contact element

[0103] 60 Data Interface

[0104] 65 First data contact device

[0105] 70 Second data contact device

[0106] 75 Third contact element

[0107] 80 mating contacts

[0108] 85 Another high-current contact device

[0109] 90 Fourth contact element

[0110] 95 Fifth contact element

[0111] 100 Inside the casing

[0112] 105 High Current Cable

[0113] 110 Matching axis

[0114] 115 Carrier

[0115] 120 Contact Receptacle

[0116] 135 First end face

[0117] 140 Data Connection Device

[0118] 145 First Conductor Orbit

[0119] 150 Second Conductor Track

[0120] 155 Third Conductor Track

[0121] 160 Fourth Conductor Orbit

[0122] 165 circuit

[0123] 170 Temperature measuring device

[0124] 175 Feedthrough

[0125] 180 Part One

[0126] 185 Part Two

[0127] 190 Connection Part

[0128] 195 Reinforcing Ribs

[0129] 200 rings

[0130] 201 (carrier's) first side surface

[0131] 205 First notch

[0132] 210 Second notch

[0133] 215 Contact Part

[0134] 220 Sealing section

[0135] 225 Connection part

[0136] 230 Sealing Sleeve

[0137] 231 Outer circumference

[0138] 232 Sealed area

[0139] 235 First Temperature Sensor

[0140] 240 Second end side

[0141] 245 Second Temperature Sensor

[0142] 250 Third Temperature Sensor

[0143] 251 Public Floor Plan

[0144] 252 Another conductor track

[0145] 255 Maintain Structure

[0146] 260 recess

[0147] 265 Web

[0148] 266 Grooves

[0149] 270 orbits

[0150] 275 Fastening Area

[0151] 280 Reinforced Structure

Claims

1. A high-current contact device (10) for use in motor vehicles or charging stations, -in, The high-current contact device (10) has at least one first contact element (25) designed for transmitting electrical energy, a circuit carrier (30), at least one first data contact (40) for transmitting data signals, and at least one data interface (60). -In this case, the first contact element (25) passes through the circuit carrier (30) along the mating axis (110) at the feedthrough (175). -In this embodiment, the conductor track (145) of the circuit carrier (30) electrically connects the first data contact (40) to the data interface (60). -The carrier (115) of the circuit carrier (30) is injection molded and mechanically supports the first data contact (40), the conductor track (145), and the data interface (60). -Having at least one sealing sleeve (230), -The sealing sleeve (230) is fixed to the circuit carrier (30) and axially adjacent to the feedthrough (175) relative to the mating axis (110). - wherein the sealing sleeve (230) engages around the first contact element (25) in a fluid-tight manner. -Wherein, at the feedthrough (175), the carrier (115) has a retaining structure (255) having at least one recess (260) and a web (265) defining the recess (260). - wherein the sealing sleeve (230) closes the recess (260), and the web (265) is embedded in at least some areas of the sealing sleeve (230).

2. The high-current contact device (10) according to claim 1, -A contact housing (15) that defines the interior (100) of the housing. -in, The first data contact (40), the circuit carrier (30), and the first contact element (25) are arranged inside the housing (100). -The data interface (60) passes laterally through the contact housing (15) in a plane inclined relative to the mating axis (110).

3. The high-current contact device (10) according to any one of the preceding claims, -The carrier (115) is a single piece made of the same material. -in, The carrier (115) has a first portion (180) and a second portion (185) connected to the first portion (180). - wherein the second part (185) is arranged offset from the first part (180) relative to the mating axis (110), - wherein the feedthrough (175) is arranged in the first part (180) and the first data contact (40) is arranged on the second part (185).

4. The high-current contact device (10) according to claim 3, - It has a second contact element (55) designed for transmitting electrical energy. -in, The second contact element (55) has a different design from the first contact element. -The second contact element (55) is arranged on the second part (185).

5. The high-current contact device (10) according to claim 1 or 2, -The carrier (115) has at least one reinforcing rib (195). -in, The reinforcing rib (195) extends along the mating axis (110).

6. The high-current contact device (10) according to claim 1 or 2, -in, The sealing sleeve (230) is connected to the circuit carrier (30) by means of material bonding.

7. The high-current contact device (10) according to claim 1 or 2, -in, The circuit (165) is arranged on the circuit carrier (30). -The circuit (165) is designed to identify a piece of information regarding the operating parameters of the high-current contact device (10). - wherein the circuit carrier (30) electrically connects the circuit (165) to the data interface (60) via another conductor track (155, 160) and is designed to provide the information at the data interface (60).

8. The high-current contact device (10) according to claim 7, -The circuit (165) includes at least one temperature measuring device (170) with at least one temperature sensor (235, 245, 250). -in, The temperature sensors (235, 245, 250) are designed to measure the temperature of the first contact element (25) as an operating parameter.

9. The high-current contact device (10) according to claim 8, -The temperature sensors (235, 245, 250) are embedded in the sealing sleeve (230). -in, The sealing sleeve (230) is designed to conduct heat and thermally connects the temperature sensors (235, 245, 250) to the first contact element (25).

10. The high-current contact device (10) according to claim 9, -in, The sealing sleeve (230) includes at least one of the following materials: copper, aluminum, alumina, aluminum nitrate, silicon oxide, silicon nitrate, boron nitride, plastic, heat-resistant plastic, silicone resin, and polyurethane.

11. The high-current contact device (10) according to claim 9, -in, The sealing sleeve (230) is injection molded, and the temperature sensors (235, 245, 250) are connected to the sealing sleeve (230) in a material-bonded manner.

12. The high-current contact device (10) according to claim 6, wherein, The sealing sleeve (230) is also connected to the circuit carrier (30) in a form-fit manner.

13. A method for manufacturing a high-current contact device (10) according to any one of the preceding claims, -Among them, the carrier (115) of the circuit carrier (30) of the high current contact device (10) is injection molded. -Among them, conductor tracks (145, 150, 155, 160) are formed on the carrier (115), -in, The data interface (60) is fixed to the circuit carrier (30).

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