Mask inspection apparatus and method

Abstract

A mask inspection apparatus and method are provided. Specifically, a mask inspection method and a mask inspection apparatus for inspecting a deposition mask are provided. The mask inspection method includes providing a deposition mask including a plurality of first openings and a plurality of second openings, each of the first openings having a shape different from a shape of each of the second openings in a plan view; designating a first group and a second group, each group including at least one of the first openings and at least one of the second openings; comparing an image of the first group with an image of the second group; and determining whether the first group and the second group have a defect, an arrangement of the first opening and the second opening in the first group being identical to an arrangement of the first opening and the second opening in the second group.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0079076, filed on June 29, 2020, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Various aspects of the embodiments of this disclosure relate to a mask inspection apparatus and a mask inspection method. Background Technology

[0004] Organic light-emitting diode (OLED) displays are generally attracting attention as the next generation of flat panel displays due to their superior brightness and viewing angle characteristics, and the fact that, unlike liquid crystal displays, they do not require any separate light source. Eliminating the need for any separate light source allows for the manufacture of OLED displays with lightweight and thin designs. OLED displays are also characterized by low power consumption, high brightness, and high response speed.

[0005] OLED displays comprise multiple organic light-emitting diodes (OLEDs), each consisting of an anode, an organic light-emitting layer, and a cathode. In the manufacturing process of OLEDs, a deposition mask is placed on a substrate, and organic material is supplied to the substrate through openings formed in the deposition mask to form the organic light-emitting layer. With technological advancements, display devices are incorporating an increasing number of OLEDs to meet high-resolution requirements.

[0006] The increased number of organic light-emitting diodes (OLEDs) means an increase in the number of openings in the deposition mask used to fabricate the OLED layer. This deposition mask is formed from a material including metals, and due to manufacturing issues, not all of the multiple openings may have the exact shape expected in the pattern. This can lead to defects in the deposition pattern. To avoid these defects, the mask is inspected beforehand. Summary of the Invention

[0007] According to various aspects of embodiments of the present disclosure, mask inspection apparatus and methods are provided that are capable of inspecting any defects in masks with openings of different shapes in a single inspection.

[0008] However, the aspects of this disclosure are not limited to those set forth herein. These and other aspects of the disclosure will become more apparent to those skilled in the art upon reference to the detailed description of the disclosure provided below.

[0009] According to one or more embodiments, a mask inspection method includes: providing a deposition mask including a plurality of first openings and a plurality of second openings, each of the first openings having a shape different in a plan view from each of the second openings; designating a first group and a second group, each group including at least one of the first openings and at least one of the second openings; comparing an image of the first group with an image of the second group; and determining, based on the result of comparing the images of the first group and the second group, whether the first group and the second group have defects, wherein the arrangement of the first openings and the second openings in the first group is the same as the arrangement of the first openings and the second openings in the second group.

[0010] According to one or more embodiments, a mask inspection method includes: providing a deposition mask including a plurality of first openings and a plurality of second openings, each of the first openings having a shape different in a plan view from each of the second openings; preparing a reference image including the first openings of the plurality of first openings and the second openings of the plurality of second openings; designating a plurality of groups, each group including the first openings of the plurality of first openings and the second openings of the plurality of second openings; comparing the images of the groups with the reference image; and determining whether the group has defects based on the result of comparing the images of the group with the reference image, wherein the arrangement of the first openings and second openings in the group is the same as the arrangement of the first openings and second openings in the reference image.

[0011] According to one or more embodiments, a mask inspection apparatus for inspecting a deposition mask, the deposition mask including a plurality of first openings and a plurality of second openings, each of the second openings having a shape different in a plan view from each of the first openings, the mask inspection apparatus comprising: a support stage configured to support the deposition mask; a vision unit spaced apart from the support stage and configured to capture images of the deposition mask; and a controller configured to determine whether the first openings and second openings are defective based on the images captured by the vision unit, wherein the controller designates a first group and a second group, each group including at least one of the first openings and at least one of the second openings, and the controller compares a first image obtained by imaging the first group with a second image obtained by imaging the second group.

[0012] The mask inspection apparatus and method according to the embodiments are capable of inspecting any defects in masks with openings of different shapes in one operation.

[0013] However, the aspects and effects of this disclosure are not limited to those described above, and various other aspects and effects are included in this specification. Attached Figure Description

[0014] The above and other aspects and features of this disclosure will become more apparent from the accompanying drawings, which describe some exemplary embodiments of the present disclosure in more detail, in which:

[0015] Figure 1 This is a schematic side view of a mask inspection device according to an embodiment;

[0016] Figure 2 It is a magnified planar view of a local area of ​​the mask;

[0017] Figure 3 It is along Figure 2 A cross-sectional view taken from line III-III′;

[0018] Figure 4 It is an illustrative representation of the use Figure 2 and Figure 3 A diagram of the deposition process using a deposition mask;

[0019] Figure 5 This is a schematic cross-sectional view of an organic light-emitting display device fabricated using a deposition mask;

[0020] Figure 6 This is a flowchart illustrating a mask inspection method according to an embodiment;

[0021] Figure 7 This is a schematic plan view illustrating a mask inspection method according to an embodiment;

[0022] Figure 8 This is a schematic plan view illustrating a mask inspection method according to another embodiment;

[0023] Figure 9 This is a schematic layout diagram illustrating the pixel arrangement of a display device according to another embodiment;

[0024] Figure 10 This is a schematic plan view illustrating a mask inspection method according to another embodiment;

[0025] Figure 11 This is a schematic layout diagram illustrating the pixel arrangement of a display device according to another embodiment;

[0026] Figure 12 This is a schematic side view of a mask inspection device according to another embodiment; and

[0027] Figure 13 This is a flowchart illustrating a mask inspection method according to another embodiment. Detailed Implementation

[0028] The invention will now be described more fully with reference to the accompanying drawings, in which some exemplary embodiments of the invention are illustrated. However, the invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure is thorough and complete, and that they fully convey the scope of the invention to those skilled in the art.

[0029] It should be understood that when a layer is referred to as being "on" another layer or substrate, it can be directly on that other layer or substrate, or one or more intermediate layers may be present. Throughout the specification, the same reference numerals denote the same parts. In the drawings, the thickness of layers and regions may be exaggerated for clarity.

[0030] Although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, a first element discussed below may be referred to as a second element without departing from the teachings of one or more embodiments. Describing an element as a “first” element does not require or imply the existence of a second element or other elements. The terms “first,” “second,” etc., may also be used herein to distinguish elements of different categories or groups. For the sake of brevity, the terms “first,” “second,” etc., may respectively represent “first type (or first group),” “second type (or second group),” etc.

[0031] It should be understood that when an element or layer is referred to as being “on,” “connected to,” “coupled to,” or “adjacent to” another element or layer, the element or layer may be directly on, directly connected to, coupled to, or adjacent to the other element or layer, or one or more intermediate elements or layers may be present. Conversely, when an element or layer is referred to as being “directly on,” “directly connected to,” “directly coupled to,” or “immediately adjacent to” another element or layer, no intermediate elements or layers are present. As used herein, the terms “substantially,” “approximately,” and similar terms are used as approximate terms rather than terms of degree and are intended to account for inherent biases in measurements or calculations that will be recognized by one of ordinary skill in the art.

[0032] As used herein, phrases such as “plan view” can refer to a view from the top or from a direction perpendicular to the display area of ​​the display device.

[0033] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” “up,” “bottom,” and “top” are used herein to describe the relationship between one element or feature and another element(s) as shown in the accompanying drawings. It should be understood that, in addition to the orientations depicted in the drawings, the spatial relative terms are also intended to encompass different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as “below” or “under” other elements or features will be oriented as “above” or “on” other elements or features. Thus, the term “below” can include both above and below orientations. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein should be interpreted accordingly.

[0034] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It should be further understood that terms such as those defined in commonly used dictionaries shall be interpreted as having a meaning consistent with their meaning in the relevant field and / or the context of this disclosure, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0035] Some exemplary embodiments will be described in more detail here with reference to the accompanying drawings.

[0036] Figure 1 This is a schematic side view of a mask inspection device according to an embodiment.

[0037] refer to Figure 1 According to the embodiment, the mask inspection device 10 may include a support platform 110, a vision unit 120, a data processing unit 130, a controller 140, and an output unit 150.

[0038] The support stage 110 can provide space for placing the deposition mask 20, which is the target object for inspection. That is, the deposition mask 20 can be placed on the support stage 110. The support stage 110 may include transparent glass or the like to allow light emitted from the light irradiation member 121 to pass through it.

[0039] The support platform 110 can hold the deposition mask 20 in a stretched state, but this disclosure is not limited thereto. In this case, in an embodiment, the support platform 110 may include clamps (not shown) for securing the two ends of the deposition mask 20, and a cylinder or gear and motor for linearly moving the clamps (not shown) to stretch the deposition mask 20. The support platform 110 may further include a mask frame (not shown), and in this case, the deposition mask 20 may be attached to the mask frame (not shown), but this disclosure is not limited thereto.

[0040] In an embodiment, although not shown in the drawings, the mask inspection device 10 may further include a conveying member (not shown), and the support platform 110 may be connected to and conveyed by the conveying member (not shown).

[0041] The vision unit 120 may be arranged above and / or below the deposition mask 20 to capture an image of the surface shape of the deposition mask 20. The vision unit 120 may be spaced apart from the support stage 110 and the deposition mask 20. The vision unit 120 may generate an image by imaging the deposition mask 20 and send the image to the controller 140. In an embodiment, the vision unit 120 may include a light illuminating member 121 and a light receiving member 122.

[0042] The light irradiation component 121 can be arranged below the support stage 110 to emit light toward the support stage 110. The light irradiation component 121 can emit light toward the deposition mask 20 placed on the support stage 110.

[0043] A light receiving member 122 may be arranged above the support stage 110. The light receiving member 122 may face the light irradiation member 121, with the deposition mask 20 between them. The light receiving member 122 may receive light emitted from the light irradiation member 121 to capture an image of the deposition mask 20. That is, at least a portion of the light emitted from the light irradiation member 121 may pass through openings OP1 and OP2 of the deposition mask 20 (see...). Figure 2 and Figure 3 The light reaches the light receiving member 122, so that the light receiving member 122 can capture an image of the deposition mask 20.

[0044] The light receiving component 122 may include, but is not limited to, a charge-coupled device (CCD) sensor. When the light receiving component 122 includes a CCD sensor, the CCD sensor may be a two-dimensional sensor comprising an image capture area in which a plurality of (e.g., a predetermined number) pixels are arranged. For example, the CCD sensor may have an image capture area of ​​2048 × 512 pixels (144 μm × 36 μm in the case of a pixel of 70 nm × 70 nm), but is not limited to this. That is, the CCD sensor may consist of multiple rows (e.g., 512 lines) arranged in one direction, each line consisting of multiple pixels (e.g., 2048 pixels).

[0045] The data processing unit 130 can process information from images captured by the vision unit 120. The data processing unit 130 can convert the image information received from the vision unit 120 into a format suitable for transmission and send the converted image information to the controller 140. In embodiments, the data processing unit 130 can provide the necessary information to the controller 140 via wired or wireless communication.

[0046] The controller 140 can specify opening groups GR1 to GR6, including openings OP1 and OP2 of different shapes, based on data (image information) received from the data processing unit 130 (see...). Figure 2 and Figure 7 The controller 140 may include a comparison unit 141 for comparing data (image information) and a determination unit 142 for determining the presence or absence of any defects based on the comparison results.

[0047] Although not limited to the following, the method by which controller 140 determines whether the deposition mask 20 is defective may include, for example, comparing images obtained by imaging the same pattern at different locations (die-to-die comparison inspection method), or comparing an image obtained by imaging the pattern of the actual mask with a reference image generated based on planning data used in forming the deposition mask 20 (die-to-database comparison inspection method). Methods for inspecting the deposition mask 20 will be described later.

[0048] The controller 140 can take any of a variety of forms. Although not limited to the following, the controller 140 may be provided, for example, as a separately installed terminal, personal computer, laptop computer or PDA, or as a circuit board internally mounted with other components instead of a separate device.

[0049] Output unit 150 can output information determined by controller 140 indicating whether the deposition mask 20 has defects. Output unit 150 can output the openings OP1 and OP2 of the deposition mask 20 (see...). Figure 2 and Figure 3 Information on openings identified as normal and openings identified as defective in the deposition mask 20. The information from output unit 150 may include information indicating openings OP1 and OP2 of the deposition mask 20 (see [link to relevant documentation]). Figure 2 and Figure 3 The coordinate information of the location of the defective opening is determined in the image. Therefore, the user can selectively correct the defective opening to a normal opening, or replace the deposition mask 20 with a new deposition mask and continue the deposition process if the number of defective openings is equal to or greater than a certain number (e.g., a predetermined number).

[0050] The deposition mask 20 may include two or more openings OP1 and OP2 of different shapes in the plan view. (Reference) Figure 2 and Figure 3 Depth mask 20 is described in more detail.

[0051] Figure 2 It is a magnified planar view of a local area of ​​the mask; and Figure 3 It is along Figure 2 The cross-sectional view taken from line III-III′.

[0052] refer to Figure 2 and Figure 3 In the accompanying drawings, the first direction DR1 indicates the horizontal direction of the deposition mask 20 in a plan view, and the second direction DR2 indicates the vertical direction of the deposition mask 20 in a plan view. Furthermore, the third direction DR3 indicates the thickness direction of the deposition mask 20. The first direction DR1 and the second direction DR2 intersect each other perpendicularly. The third direction DR3 is a direction that intersects the plane containing the first direction DR1 and the second direction DR2, and intersects both the first direction DR1 and the second direction DR2 perpendicularly. However, it should be understood that the directions mentioned in the embodiments refer to relative directions, and the embodiments are not limited to the mentioned directions.

[0053] The deposition mask 20 includes a barrier portion BL and a plurality of openings OP1 and OP2 formed within the barrier portion BL. The barrier portion BL can prevent the penetration of the deposited material. The barrier portion BL may include a barrier member. For example, the barrier member may include any of a metal such as nickel (Ni), nickel alloys, and nickel-cobalt alloys. The barrier member may be provided in the form of a thin metal film, but is not limited thereto.

[0054] Openings OP1 and OP2 are formed inside the barrier portion BL in a shape that penetrates the material layer constituting the barrier portion BL in the thickness direction (third direction DR3). Openings OP1 and OP2 allow deposited material to pass through them, enabling deposition onto the target substrate 330 (see [reference]). Figure 4 A pattern with shapes corresponding to the openings OP1 and OP2 is formed on the surface.

[0055] The deposition mask 20 may have a first surface 20a and a second surface 20b. The first surface 20a and the second surface 20b of the deposition mask 20 may be opposing surfaces. Although not limited to the following, for example, the first surface 20a of the deposition mask 20 may be facing the target substrate 330 (see [link]). Figure 4 The surface of the crucible is the first surface 20a, and the second surface 20b, which is opposite to the first surface 20a, can be the surface facing the crucible.

[0056] The deposition mask 20 may further include a first inner surface S1 and a second inner surface S2. The first inner surface S1 may face the first opening OP1 in the blocking portion BL, and the second inner surface S2 may face the second opening OP2 in the blocking portion BL. That is, the inner wall of the first opening OP1 may include the first inner surface S1, and the inner wall of the second opening OP2 may include the second inner surface S2.

[0057] The deposition mask 20 may further include a first first side BE1, a first second side UE1, a second first side BE2, and a second second side UE2. The first first side BE1 may represent the portion where the first surface 20a of the deposition mask 20 intersects with the first inner surface S1, and the first second side UE1 may represent the portion where the second surface 20b of the deposition mask 20 intersects with the first inner surface S1. The second first side BE2 may represent the portion where the first surface 20a of the deposition mask 20 intersects with the second inner surface S2, and the second second side UE2 may represent the portion where the second surface 20b of the deposition mask 20 intersects with the second inner surface S2.

[0058] In the plan view, the openings OP1 and OP2 of the deposition mask 20 can have different shapes. The deposition mask 20 can include two or more openings OP1 and OP2 with different shapes in the plan view. The deposition mask 20 can include a first opening OP1 and a second opening OP2 with different shapes in the plan view.

[0059] In the plan view, the first first side end BE1 can be surrounded by the first second side end UE1, and the shapes of the first first side end BE1 and the first second side end UE1 can correspond to each other. In the plan view, the second first side end BE2 can be surrounded by the second second side end UE2, and the shapes of the second first side end BE2 and the second second side end UE2 can correspond to each other. That is, in the plan view, the first first side end BE1 and the second first side end BE2 can have different shapes, and the first second side end UE1 and the second second side end UE2 can have different shapes.

[0060] In an embodiment, the first opening OP1 and the second opening OP2 may be spaced apart from each other and arranged alternately along the first direction DR1 and the second direction DR2. That is, in an embodiment, the first opening OP1 and the second opening OP2 may be arranged alternately in a repeating manner along the first direction DR1, and the first opening OP1 and the second opening OP2 may be arranged alternately in a repeating manner along the second direction DR2.

[0061] In one embodiment, at least a portion of the plurality of first openings OP1 can be arranged in a plan view to be rotated within a clockwise range of greater than 0 degrees and less than 360 degrees. In another embodiment, at least a portion of the plurality of first openings OP1 can be arranged (in the figures) to be flipped left and right in a first direction DR1 or up and down in a second direction DR2. Similarly, in one embodiment, at least a portion of the plurality of second openings OP2 can be arranged in a plan view to be rotated within a clockwise range of greater than 0 degrees and less than 360 degrees. In another embodiment, at least a portion of the plurality of second openings OP2 can be arranged (in the figures) to be flipped left and right in a first direction DR1 or up and down in a second direction DR2.

[0062] The deposition mask 20 may further include an opening group GR. In an embodiment, the opening group GR may include a first opening OP1 and a second opening OP2, but this disclosure is not limited thereto. That is, the deposition mask 20 may include repeatedly arranged first openings OP1 and second openings OP2, and may include opening groups GR, each opening group GR including a first opening OP1 and a second opening OP2.

[0063] The opening group GR can be repeatedly arranged along the first direction DR1 and the second direction DR2. In one embodiment, a portion of the opening group GR can be arranged in a plan view to be rotated in a clockwise direction within a range greater than 0 degrees and less than 360 degrees. In another embodiment, a portion of the opening group GR can be arranged (in the figures) to flip left and right in the first direction DR1 or flip up and down in the second direction DR2.

[0064] Despite Figure 2 and Figure 3 The diagram shows example shapes of openings OP1 and OP2 in plan and section views, but their shapes are not limited to these.

[0065] Figure 4 It is an illustrative representation of the use Figure 2 and Figure 3 A diagram of the deposition process using a deposition mask.

[0066] refer to Figure 4 According to an embodiment, the process of depositing electrodes or organic light-emitting layers for an organic light-emitting display device can be performed in a vacuum chamber 300.

[0067] The deposition source 310 can be disposed in the lower part of the vacuum chamber 300. The deposition source 310 can be, for example, a crucible containing the deposition material. According to an embodiment, the deposition mask 20 can be placed on a support structure 320 at the upper part of the vacuum chamber 300 facing the deposition source 310. In an embodiment, a target substrate 330 (e.g., a target substrate 330 for manufacturing an organic light-emitting display device) can be arranged on the deposition mask 20. In an embodiment, the deposition mask 20 and the target substrate 330 can be in direct contact with each other.

[0068] When the deposition source 310 evaporates the deposition material onto the deposition mask 20 inside the vacuum chamber 300, the deposition material can be deposited onto the target substrate 330 through openings OP1 and OP2 formed in the deposition mask 20 according to the shape of the pattern (see...). Figure 2 and Figure 3 On the exposed parts.

[0069] Figure 5 This is a schematic cross-sectional view of an organic light-emitting display device fabricated using a deposition mask.

[0070] refer to Figure 5 The display device 400 may include a substrate 401. The substrate 401 may support components stacked on it. The substrate 401 may be an insulating substrate. In some embodiments, the substrate 401 may include a transparent material.

[0071] A buffer layer 405 may be disposed on a substrate 401. The buffer layer 405 may be disposed on the surface of the substrate 401 to protect the thin film transistor (TFT) and the light-emitting element (EMD) from the effects of moisture passing through the substrate 401, which is susceptible to moisture penetration.

[0072] A thin-film transistor (TFT) can be disposed on the buffer layer 405 as a driving element. The TFT may include a semiconductor layer 410, a source electrode 451, a drain electrode 452, and a gate electrode 430.

[0073] The semiconductor layer 410 of the thin-film transistor (TFT) can be disposed on the buffer layer 405. In embodiments, the semiconductor layer 410 may include polycrystalline silicon, monocrystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, or oxide semiconductor.

[0074] The first insulating layer 421 may be disposed on the semiconductor layer 410. The first insulating layer 421 may be formed of an inorganic layer.

[0075] The gate electrode 430 may be disposed on the first insulating layer 421. The gate electrode 430 may overlap with the semiconductor layer 410. In embodiments, the gate electrode 430 may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0076] The second insulating layer 422 can be disposed on the gate electrode 430. The second insulating layer 422 can be formed of an inorganic layer.

[0077] The source electrode 451 (or drain electrode) and drain electrode 452 (or source electrode) of the thin-film transistor (TFT) can be disposed on the second insulating layer 422. The source electrode 451 and drain electrode 452 can be connected to the semiconductor layer 410 through contact holes penetrating the second insulating layer 422 and the first insulating layer 421.

[0078] The third insulating layer 423 can be disposed on the source electrode 451 and the drain electrode 452. The third insulating layer 423 can be a passivation layer protecting the underlying thin-film transistor (TFT). The third insulating layer 423 can be formed of an inorganic layer.

[0079] The via layer VIA can be disposed on the third insulating layer 423. The via layer VIA can be a planarization layer used to planarize the steps caused by the thin-film transistor (TFT). The via layer VIA can include an organic insulating material.

[0080] The light-emitting element (EMD) can be disposed on the via layer (VIA). The EMD may include a pixel electrode (PXE), a light-emitting layer (EML), and a common electrode (CME).

[0081] The pixel electrode PXE can be disposed on the via layer VIA. The pixel electrode PXE can be the first electrode (e.g., the anode electrode) of the light-emitting element EMD. The pixel electrode PXE can be connected to the drain electrode 452 (or source electrode) of the thin-film transistor TFT through contact holes penetrating the via layer VIA.

[0082] A pixel defining layer (PDL) may be disposed on the pixel electrode (PXE). The PDL may include openings for exposing the pixel electrode (PXE). The PDL may comprise an organic insulating material.

[0083] The emissive layer (EML) can be disposed on the pixel electrode (PXE) exposed by the pixel defining layer (PDL). The EML may include an organic material layer. The organic material layer of the EML may include an organic emissive layer, and may further include a hole injection / transport layer and / or an electron injection / transport layer.

[0084] A common electrode CME can be disposed on the light-emitting layer EML. The common electrode CME can be the second electrode (e.g., cathode electrode) of the light-emitting element EMD. In an embodiment, the common electrode CME can be formed commonly for each pixel.

[0085] Although the light-emitting element EMD of each pixel or sub-pixel can be arranged in different shapes in the planar view, if the deposition mask 20 has a corresponding shape, the light-emitting element EMD of each pixel or sub-pixel can be deposited at once as parts of a common layer.

[0086] Furthermore, even when the deposition mask 20 includes two or more openings OP1 and OP2 that have different shapes from each other in the plan view, the mask inspection device 10 according to the embodiment (see Figure 1 It can also inspect for any defects in the deposition mask 20. The mask inspection method according to embodiments is further described herein.

[0087] Figure 6 This is a flowchart illustrating a mask inspection method according to an embodiment; and Figure 7 This is a schematic plan view illustrating a mask inspection method according to an embodiment.

[0088] refer to Figure 1 , Figure 6 and Figure 7 First, prepare or provide a deposition mask 20 with openings OP1 and OP2 of different shapes (S10).

[0089] Deposition mask 20 can be compared with reference Figure 2 and Figure 3 The deposition mask 20 described is essentially the same and is placed in conjunction with... Figure 1 The location corresponds to an area (e.g., a predetermined area) on the support platform 110 of the mask inspection equipment 10. The deposition mask 20 can be moved during the process of the mask inspection equipment 10 inspecting the deposition mask 20. The deposition mask 20 can be moved independently of the support platform 110 by means of a component, or fixed to the support platform 110 to move together with the support platform 110.

[0090] Next, the inspection area IA (S20) of the deposition mask 20 is specified.

[0091] The inspection area IA may include multiple openings OP1 and OP2. In an embodiment, the openings OP1 and OP2 within the inspection area IA may be arranged repeatedly in a pattern (e.g., a predetermined pattern). In an embodiment, the first opening OP1 and the second opening OP2 may be arranged alternately along a first direction DR1, and the first opening OP1 and the second opening OP2 may be arranged alternately along a second direction DR2. Although not limited to the following, the shapes of adjacent openings among the openings OP1 and OP2 arranged within the inspection area IA may be different. That is, the first opening OP1 and the second opening OP2 with different shapes may be arranged alternately and may be arranged adjacent to each other.

[0092] The inspection area IA may include at least a portion of the area that can be imaged by the vision unit 120 in a single operation. That is, when the vision unit 120 includes a CCD sensor, the inspection area IA may include at least a portion of the image capture area that can be imaged by the CCD sensor.

[0093] Although twelve openings OP1 and OP2 are shown arranged within the inspection area IA, the number of openings OP1 and OP2 arranged within the inspection area IA may be greater than or less than twelve. In this embodiment, the task S20 of designating the inspection area IA may be omitted.

[0094] Next, some groups of the repeated openings OP1 and OP2 will be grouped into opening groups GR1 to GR6 (S30).

[0095] Openings OP1 and OP2 arranged within the inspection area IA can be grouped by at least two adjacent openings OP1 and OP2 to form each opening group GR. Adjacent first openings OP1 and second openings OP2 can, for example, be grouped into corresponding groups GR1 to GR6, but are not limited thereto. In embodiments, opening groups GR1 to GR6 may include the same number of openings OP1 and OP2, and may include the same number of first openings OP1 and the same number of second openings OP2. Furthermore, openings OP1 and OP2 belonging to the corresponding opening groups GR1 to GR6 can be substantially identical in arrangement (or deployment).

[0096] In this embodiment, the opening groups GR1 to GR6 can be repeatedly arranged within the inspection area IA. That is, the opening groups GR1 to GR6 can be repeatedly arranged within the inspection area IA along the first direction DR1 and the second direction DR2.

[0097] In an embodiment, opening groups GR1 to GR6 can each be the smallest repeating unit within the inspection area IA. The inspection area IA can have a first opening OP1 and a second opening OP2 disposed therein, and the first opening OP1 and the second opening OP2 can be arranged in a repeating manner. In this case, opening groups GR1 to GR6 can each include one first opening OP1 and one second opening OP2, and opening groups GR1 to GR6 can be arranged in a repeating manner within the inspection area IA. The total number of openings OP1 and OP2 belonging to each of opening groups GR1 to GR6 can be equal to the sum of the number of first openings OP1 and the number of second openings OP2 included in each of opening groups GR1 to GR6.

[0098] The shapes of openings OP1 and OP2 arranged within the inspection area IA can be different, and the shapes of opening groups GR1 to GR6 arranged within the inspection area IA can be identical. That is, opening groups GR1 to GR6 can all include the first opening OP1 and the second opening OP2 in the same manner, and some opening groups GR2 and GR5 among opening groups GR1 to GR6 can be arranged in a state of being rotated by an angle (e.g., a predetermined angle) in the horizontal direction (or about an axis extending in the thickness direction (third direction DR3)). Although some opening groups GR2 and GR5 are shown rotated 180 degrees in the figures, the rotation angle is not limited to this.

[0099] In this embodiment, each of the opening groups GR1 to GR6 is the smallest repeating unit within the inspection area IA, and can also be the smallest unit for inspecting any defects in the openings OP1 and OP2 of the deposition mask 20. That is, the first opening OP1 and the second opening OP2, which have different shapes, are grouped into each of the opening groups GR1 to GR6 to inspect any defects in the openings according to one unit of each of the opening groups GR1 to GR6. This can help to inspect any defects in the openings of the deposition mask 20 even if the openings OP1 and OP2 of the deposition mask 20 have different shapes.

[0100] Next, the opening groups GR1 to GR6 arranged in the inspection area IA are imaged and compared (S40), and it is determined whether the imaging results fall within the threshold range (S50). As a result, it is determined whether the openings OP1 and OP2 arranged in the deposition mask 20 are normal or defective.

[0101] Opening groups GR1 to GR6 arranged within the inspection area IA are imaged by the vision unit 120 for comparison. The comparison of opening groups GR1 to GR6 can be performed by comparing the images obtained from imaging opening groups GR1 to GR6 with each other. By comparing the areas of opening groups GR1 to GR6, opening groups GR1 to GR6 that include defective openings can be identified.

[0102] When the vision unit 120 captures an image of the aperture groups GR1 to GR6 using a CCD sensor, the pixels of the CCD sensor can be arranged within the apertures OP1 and OP2 of the aperture groups GR1 to GR6 in the captured image. The pixels of the CCD sensor of the vision unit 120 can be arranged at regular intervals, so that the area of ​​the apertures OP1 and OP2 of the aperture groups GR1 to GR6 can be compared using the number of pixels of the CCD sensor arranged in the apertures OP1 and OP2.

[0103] The pixels of the CCD sensor can be located at the first side ends BE1 and BE2 of each opening OP1 and OP2 and / or the second side ends UE1 and UE2 of each opening OP1 and OP2. That is, when determining whether opening OP1 and OP2 are defective, at least one of the pixels of the CCD sensor located at the first side ends BE1 and BE2 of each opening OP1 and OP2 and the pixels of the CCD sensor located at the second side ends UE1 and UE2 of each opening OP1 and OP2 can be used as a defect determination criterion.

[0104] In the various opening groups GR1 to GR6 arranged within the inspection area IA, the qualified openings OP1 and OP2 can include pixels of the CCD sensor whose number falls within a specific range (e.g., a predetermined range), while the defective openings OP1 and OP2 can include pixels of the CCD sensor whose number falls outside that specific range (e.g., the predetermined range). That is, the openings OP1 and OP2 of the various opening groups GR1 to GR6 arranged within the inspection area IA can be compared by opening group to determine that openings OP1 and OP2 including pixels of the CCD sensor whose number falls within the specific range (e.g., the predetermined range) are qualified (normal), and openings OP1 and OP2 including pixels of the CCD sensor whose number falls outside that specific range (e.g., the predetermined range) are defective.

[0105] It is also possible to identify opening groups GR1 to GR6 that include defective openings by comparing the shapes of openings OP1 and OP2 in each opening group GR1 to GR6.

[0106] The pixels of the CCD sensor can be arranged according to the edge shapes of openings OP1 and OP2 in the respective opening groups GR1 to GR6 arranged within the inspection area IA. Based on the number of pixels of the CCD sensor arranged on each edge, the lengths of the edges of openings OP1 and OP2 in the respective opening groups GR1 to GR6 can be compared with each other, and the shapes of openings OP1 and OP2 in the respective opening groups GR1 to GR6 can be compared with each other. The edges of openings OP1 and OP2 can correspond to at least one of the first side ends BE1 and BE2 and / or the second side ends UE1 and UE2 of openings OP1 and OP2.

[0107] For example, the lengths of the edges extending in the first direction DR1 and the second opening OP2 of each opening group GR1 to GR6, the lengths of their edges extending in the second direction DR2, and / or the lengths of their edges extending in a direction inclined relative to the first direction DR1 and the second direction DR2 can be compared with each other. The shapes of the first opening OP1 and the second opening OP2 of each opening group GR1 to GR6 can be compared with each other based on length and the like.

[0108] That is, whether openings OP1 and OP2 are defective can be determined by comparing the shapes of openings OP1 and OP2 in each of the opening groups GR1 to GR6 in the inspection area IA. In this case, openings OP1 and OP2 with shapes falling within the threshold range can be determined to be qualified (normal), and openings OP1 and OP2 with shapes falling outside the threshold range can be determined to be defective.

[0109] In an embodiment, it is possible to consider rotating some of the opening groups GR1 to GR6 in the horizontal direction and comparing the openings OP1 and OP2 of each opening group GR1 to GR6 with each other. For example, some opening groups GR2 and GR5 in opening groups GR1 to GR6 may be arranged in a state rotated 180 degrees in the horizontal direction compared to the remaining opening groups GR1, GR3, GR4, and GR6. Furthermore, when comparing the openings OP1 and OP2 of each opening group GR1 to GR6, the comparison of openings OP1 and OP2 can be performed by considering a 180-degree horizontal rotation of opening groups GR2 and GR5. That is, the openings OP1 and OP2 of each opening group GR1 to GR6 can be compared with each other while opening groups GR2 and GR5 are rotated 180 degrees in the opposite direction of rotation. In this way, even if some of the opening groups GR1 to GR6 are rotated by a specific angle (e.g., a predetermined angle) in the horizontal direction, it is possible to more accurately determine whether the openings OP1 and OP2 of each opening group GR1 to GR6 are defective.

[0110] In an embodiment, when comparing the area and / or shape of openings OP1 and OP2 in each opening group GR1 to GR6, the inspector can first use the naked eye, based on images captured by the vision unit 120, to compare the area and / or shape of openings OP1 and OP2 in each opening group GR1 to GR6 with each other. Defect determination can be based on the comparison results. That is, the inspector can first use the naked eye to inspect defective openings in adjacent opening groups GR1 to GR6 that have an area and / or shape different from other openings. However, this disclosure is not limited to this, and in embodiments, the defective product inspection process using the inspector's naked eye can be omitted.

[0111] Although the above description is for the case where openings OP1 and OP2 of different shapes are first grouped at task S30 and the groups are imaged and compared at task S40, the order is not limited to this. It is also possible to first capture an image of the inspection area IA at task S40, group the openings OP1 and OP2 of different shapes on the captured image at task S30, compare them at task S50 and determine defects.

[0112] Although it has been described that openings OP1 and OP2 of the respective opening groups GR1 to GR6 within the inspection area IA are compared with each other to determine defective openings, this disclosure is not limited thereto. Defective opening determination can be performed by comparing openings OP1 and OP2 of the respective opening groups GR1 to GR6 with a reference image generated based on planned data used in forming the deposition mask 20. In this case, the mask inspection method may further include the step of acquiring the reference image, and the arrangement (or deployment) of openings OP1 and OP2 of the respective opening groups GR1 to GR6 may be substantially the same as the arrangement (or deployment) of openings included in the reference image.

[0113] This document will describe some other example embodiments. In the following embodiments, the description of components that are the same as those in the above embodiments may be omitted or simplified, and the differences will be mainly described.

[0114] Figure 8 This is a schematic plan view illustrating a mask inspection method according to another embodiment.

[0115] refer to Figure 8 The mask inspection method according to another embodiment and Figure 7 The mask inspection method of the embodiment differs in that each of the opening groups GR1_1, GR2_1, GR3_1, GR4_1, GR5_1 and GR6_1 includes three openings OP1_1, OP2_1 and OP3_1 with different shapes.

[0116] More specifically, the deposition mask 20_1 according to the embodiment may include an inspection area, and a plurality of opening groups GR1_1, GR2_1, GR3_1, GR4_1, GR5_1 and GR6_1 may be arranged in the inspection area. Each opening group GR1_1, GR2_1, GR3_1, GR4_1, GR5_1 and GR6_1 may each include three openings OP1_1, OP2_1 and OP3_1 of different shapes.

[0117] In this embodiment, opening groups GR1_1, GR2_1, GR3_1, GR4_1, GR5_1, and GR6_1 can be repeatedly arranged both outside and inside the inspection area, and openings OP1_1, OP2_1, and OP3_1 of each opening group GR1_1, GR2_1, GR3_1, GR4_1, GR5_1, and GR6_1 can be repeatedly arranged. Openings OP1_1, OP2_1, and OP3_1 can be arranged adjacent to each other.

[0118] Even in this case, any defects in the deposition mask 20_1 can be inspected, although the openings OP1_1, OP2_1 and OP3_1 arranged in the deposition mask 20_1 have different shapes in the plan view.

[0119] Figure 9 This is a schematic layout diagram illustrating the pixel arrangement of a display device according to another embodiment. Figure 9 It shows that it can be used Figure 8 An example of a display device 400_1 manufactured using a deposition mask 20_1.

[0120] refer to Figure 9 The display device 400_1 may include a plurality of pixels PX (e.g., pixels PX1_1, PX2_1, PX3_1, PX4_1, PX5_1, and PX6_1). A pixel PX represents the smallest repeating unit used for display. To achieve full-color display, each pixel PX may include a plurality of sub-pixels PXS1, PXS2, and PXS3 that emit different colors. In an embodiment, for example, each pixel PX may include a first sub-pixel PXS1 responsible for emitting red light, a second sub-pixel PXS2 responsible for emitting green light, and a third sub-pixel PXS3 responsible for emitting blue light. In an embodiment, each pixel PX may be provided with a first sub-pixel PXS1, a second sub-pixel PXS2, and a third sub-pixel PXS3. In a planar view, the shapes of the first sub-pixel PXS1, the second sub-pixel PXS2, and the third sub-pixel PXS3 may be different. Even in this case, the light-emitting elements EMD (see [reference]) commonly arranged on the sub-pixels PXS1, PXS2, and PXS3 can be deposited at once. Figure 5 The public layer on ).

[0121] Figure 10 This is a schematic plan view illustrating a mask inspection method according to another embodiment.

[0122] refer to Figure 10 The mask inspection method according to another embodiment and according to Figure 7 The mask inspection method of the embodiment differs in that each of the opening groups GR1_2, GR2_2 and GR3_2 includes openings OP1_2, OP2_2, OP4_2 and OP5_2 belonging to different regions.

[0123] More specifically, the deposition mask 20_2 according to this embodiment may include two regions AR1_2 and AR2_2 with different opening arrangement patterns. The first region AR1_2 may include first to third openings OP1_2, OP2_2 and OP3_2, and in a plan view, the shapes of the first to third openings OP1_2, OP2_2 and OP3_2 may be different. The second region AR2_2 may include fourth to sixth openings OP4_2, OP5_2 and OP6_2, and in a plan view, the shapes and / or sizes of the fourth to sixth openings OP4_2, OP5_2 and OP6_2 may be different. In addition, the shapes and / or sizes of the first to third openings OP1_2, OP2_2 and OP3_2 and the fourth to sixth openings OP4_2, OP5_2 and OP6_2 may be different.

[0124] The arrangement pattern of the first to third openings OP1_2, OP2_2, and OP3_2 in the first region AR1_2 can be different from the arrangement pattern of the fourth to sixth openings OP4_2, OP5_2, and OP6_2 in the second region AR2_2. Furthermore, although described later, the function of the first to third openings OP1_2, OP2_2, and OP3_2 in the first region AR1_2 can be substantially the same as the function of the corresponding fourth to sixth openings OP4_2, OP5_2, and OP6_2 in the second region AR2_2. That is, the first opening OP1_2 of the first region AR1_2 and the fourth opening OP4_2 of the second region AR2_2, which have different shapes and / or sizes, can be used to form pixels emitting the same color (e.g., red) light. The second opening OP2_2 of the first region AR1_2 and the fifth opening OP5_2 of the second region AR2_2, which have different shapes and / or sizes, can be used to form pixels emitting the same color (e.g., blue) light. The third opening OP3_2 of the first region AR1_2 and the sixth opening OP6_2 of the second region AR2_2, which have different shapes and / or sizes, can be used to form pixels that emit light of the same color (e.g., green).

[0125] Around the boundary between the first region AR1_2 and the second region AR2_2, the opening groups GR1_2, GR2_2, and GR3_2 may each include at least one of the first to third openings OP1_2, OP2_2, and OP3_2, and at least one of the fourth to sixth openings OP4_2, OP5_2, and OP6_2. For example, around this boundary, the opening groups GR1_2, GR2_2, and GR3_2 may each include the first opening OP1_2 and the second opening OP2_2 of the first region AR1_2, and the fourth opening OP4_2 and the fifth opening OP5_2 of the second region AR2_2.

[0126] In this case, any defects in openings OP1_2, OP2_2, OP4_2, and OP5_2 included in each of the opening groups GR1_2, GR2_2, and GR3_2 can be checked by comparing them with each other. Additionally, the checks on the first to third openings OP1_2, OP2_2, and OP3_2 in the first region AR1_2 and the fourth to sixth openings OP4_2, OP5_2, and OP6_2 in the second region AR2_2 can be performed before or after the above checks. In an embodiment, the checks in the first region AR1_2 and the second region AR2_2 can be performed using the same checking method described above.

[0127] Because each of the opening groups GR1_2, GR2_2, and GR3_2, which serve as the smallest mask inspection unit, includes at least a portion of the openings OP1_2, OP2_2, OP3_2, OP4_2, OP5_2, and OP6_2 included in each region AR1_2 and AR2_2 around the boundary between regions AR1_2 and AR2_2, any defects in the deposition mask 20_2 can be inspected more precisely, even if the deposition mask 20_2 includes multiple regions AR1_2 and AR2_2 with different opening arrangement patterns. That is, during the inspection of the first region AR1_2 and the inspection of the second region AR2_2, even if some openings OP1_2, OP2_2, OP4_2, and OP5_2 adjacent to the boundary between the first region AR1_2 and the second region AR2_2 do not belong to any group, any defects in them can be inspected using the method described above.

[0128] In this case, even if the openings OP1_2, OP2_2, OP3_2, OP4_2, OP5_2 and OP6_2 arranged in the deposition mask 20_2 have different shapes in the plan view and belong to two different regions AR1_2 and AR2_2, any defects in the deposition mask 20_2 can be inspected.

[0129] Figure 11This is a schematic layout diagram illustrating the pixel arrangement of a display device according to another embodiment. Figure 11 It shows that it can be used Figure 10 An example of a display device 400_2 manufactured using a deposition mask 20_2.

[0130] refer to Figure 11 The display device 400_2 can be divided into a first display area and a second display area depending on whether it includes a light-transmitting portion TA. For example, the display device 400_2 may include a dedicated display area DPA_D as the first display area and a light-transmitting display area DPA_T as the second display area. The dedicated display area DPA_D can be combined with... Figure 10 The first region AR1_2 corresponds to this, and the light-transmitting display region DPA_T can be associated with... Figure 10 The second region AR2_2 corresponds to this.

[0131] The dedicated display area DPA_D and the light-transmitting display area DPA_T each include multiple pixels PX_R, PX_B, and PX_G containing corresponding emitting areas, and display images by emitting light from the emitting areas of pixels PX_R, PX_B, and PX_G. In addition to the pixels PX_R, PX_B, and PX_G containing emitting areas, the light-transmitting display area DPA_T also includes multiple light-transmitting portions TA. The dedicated display area DPA_D does not include the light-transmitting portions TA. The light-transmitting portions TA of the light-transmitting display area DPA_T are areas that do not emit light themselves but allow light to pass through them in the thickness direction.

[0132] The light-transmitting portion TA of the light-transmitting display area DPA_T can be used for any of a variety of purposes. In an embodiment, the light-transmitting portion TA of the light-transmitting display area DPA_T can be used as a channel for light sensing, but is not limited thereto. In an embodiment, although not shown, a light-sensing component (not shown) can be arranged below the light-transmitting portion TA. The light-sensing component (not shown) can be a device that receives light to obtain information or performs a specific function. Examples of light-sensing components can include a camera containing a photoelectric conversion element, an infrared proximity sensor, an iris recognition sensor, and a fingerprint sensor. In an embodiment, when displaying video or an image, the light-transmitting display area DPA_T can be used as a channel for light from the outside to reach the light-sensing component (not shown).

[0133] Figure 12 This is a schematic side view of a mask inspection device according to another embodiment; and, Figure 13 This is a flowchart illustrating a mask inspection method according to another embodiment.

[0134] refer to Figure 12 and Figure 13 According to another embodiment, the mask inspection device 10_3 and according to Figure 1 The mask inspection device 10 of the embodiment differs in that it further includes a foreign object detection unit 143_3, and the mask inspection method according to this embodiment is different from that according to... Figure 6 and Figure 7 The mask inspection method in the embodiment differs in that it further includes a task S60_3 to determine whether a foreign object exists.

[0135] More specifically, the mask inspection apparatus 10_3 according to the embodiment may further include a foreign matter detection unit 143_3 for determining whether there is a foreign matter on the deposition mask 20. The presence of foreign matter may be determined by a controller 140_3, and the controller 140_3 may further include the foreign matter detection unit 143_3.

[0136] Task S60_3, which determines whether there is a foreign object, can be performed on opening groups GR1 to GR6 (see...). Figure 7 The task of imaging and comparison follows S40. It can also be based on the aperture groups GR1 to GR6 (see [link to image processing]) imaged by the vision unit 120. Figure 7 Image information can be used to determine the presence of foreign objects. Although not limited to the following, the light reflectivity, surface roughness, or shape of each opening group GR1 to GR6 can be considered to determine the presence of foreign objects.

[0137] In task S60_3, which determines whether a foreign object is present, if a foreign object is found, it can be removed (S61_3). Methods for removing the foreign object include, for example, cleaning, but are not limited to this. After removing the foreign object in task S61_3, the process for opening groups GR1 to GR6 (see...) can be repeated. Figure 7 Imaging and comparison (S40).

[0138] At task S60_3, which determines whether there is a foreign object, if no foreign object is found, then determine the opening groups GR1 to GR6 (see...). Figure 7 Whether the imaging result of each of them is within the threshold range (S50).

[0139] Even in this case, even with the openings OP1 and OP2 arranged in the deposition mask 20 (see...) Figure 7 Different shapes in the plan view can also be used to inspect for any defects in the deposition mask 20. In addition, further inspection for any foreign matter can reduce defects on the deposition mask 20.

[0140] Although some exemplary embodiments have been described herein, those skilled in the art will understand that many variations and modifications can be made to the exemplary embodiments without substantially departing from the principles of this disclosure. Therefore, embodiments of the disclosed invention are provided in a general and descriptive sense rather than for purposes of limitation.

Claims

1. A mask inspection method, comprising: A deposition mask is provided comprising a plurality of first openings and a plurality of second openings, each of the plurality of first openings having a shape different in a plan view from each of the plurality of second openings, wherein the deposition mask comprises a first surface and a second surface opposite to the first surface, and in the plan view, a second side end of each of the plurality of first openings located on the second surface surrounds a first side end of a corresponding first opening located on the first surface, and a second side end of each of the plurality of second openings located on the second surface surrounds a first side end of a corresponding second opening located on the first surface; A first group and a second group are designated, each group including at least one of the plurality of first openings and at least one of the plurality of second openings; Compare the images in the first group with the images in the second group; as well as Based on the comparison between the images in the first group and the images in the second group, it is determined whether the first group and the second group have defects. The arrangement of the first opening and the second opening in the first group is the same as the arrangement of the first opening and the second opening in the second group after rotation in the plan view.

2. The mask inspection method according to claim 1, wherein, The comparison between the images of the first group and the images of the second group includes comparing the area of ​​the first group with the area of ​​the second group.

3. The mask inspection method according to claim 2, further comprising: Prior to the comparison between the images of the first group and the images of the second group, the first group and the second group are imaged using a vision unit to obtain the images of the first group and the images of the second group, the vision unit including a charge-coupled device sensor including a plurality of pixels.

4. The mask inspection method according to claim 3, wherein, The comparison of the area of ​​the first group with the area of ​​the second group includes comparing the number of a portion of the plurality of pixels of the charge-coupled device sensor arranged in the first group with the number of another portion of the plurality of pixels of the charge-coupled device sensor arranged in the second group.

5. The mask inspection method according to claim 1, wherein, The comparison between the images of the first group and the images of the second group includes: comparing the shape of the first group with the shape of the second group.

6. The mask inspection method according to claim 5, further comprising: Imaging of the first and second groups is performed using a vision unit, the vision unit including a charge-coupled device (CCD) sensor comprising multiple pixels. The comparison of the shape of the first group with the shape of the second group includes: comparing the shape of a portion of the pixels of the charge-coupled device sensor arranged in the first group with the shape of another portion of the pixels of the charge-coupled device sensor arranged in the second group.

7. The mask inspection method according to claim 6, wherein, The comparison of the images in the first group with the images in the second group further includes: rotating either the images in the first group or the images in the second group in the horizontal direction.

8. The mask inspection method according to claim 5, wherein, The comparison of the images in the first group with the images in the second group further includes: comparing them using the naked eye of an inspector.

9. A mask inspection apparatus for inspecting a deposition mask, the deposition mask including a plurality of first openings and a plurality of second openings, each of the plurality of second openings having a shape different in a plan view from each of the plurality of first openings, the mask inspection apparatus comprising: A support stage configured to support the deposition mask; A vision unit, spaced apart from the support stage and configured to capture an image of the deposition mask; as well as The controller is configured to determine whether the plurality of first openings and the plurality of second openings are defective based on the images captured by the vision unit. The controller designates a first group and a second group, each group including at least one of the plurality of first openings and at least one of the plurality of second openings, wherein the arrangement of the first and second openings in the first group is the same as the arrangement of the first and second openings in the second group rotated in the plan view, and the controller compares a first image obtained by imaging the first group with a second image obtained by imaging the rotated second group. The deposition mask includes a first surface and a second surface opposite to the first surface. In the plan view, the second side end of each of the plurality of first openings located on the second surface surrounds the first side end of the corresponding first opening located on the first surface, and the second side end of each of the plurality of second openings located on the second surface surrounds the first side end of the corresponding second opening located on the first surface.

10. The mask inspection device according to claim 9, wherein, The controller includes a comparison unit configured to compare the area of ​​the first group with the area of ​​the second group.

11. The mask inspection apparatus according to claim 10, wherein, The visual unit includes: A light irradiation component is configured to emit light toward the deposition mask; and A light receiving component is configured to receive at least a portion of the light emitted from the light irradiation component and includes a charge-coupled device sensor comprising a plurality of pixels.

12. The mask inspection device according to claim 11, wherein, The comparison unit compares the number of a portion of the plurality of pixels of the charge-coupled device sensor arranged in the first group with the number of another portion of the plurality of pixels of the charge-coupled device sensor arranged in the second group.

13. The mask inspection device according to claim 10, wherein, The comparison unit compares the shapes of the first group in the plan view with the shapes of the second group in the plan view.

14. The mask inspection device according to claim 9, wherein, The controller further includes a foreign object detection unit configured to determine whether there are foreign objects on the deposition mask.

15. The mask inspection apparatus according to claim 9, further comprising: The output unit is configured to output information about the defect determination performed by the controller.

16. The mask inspection apparatus according to claim 15, further comprising: The data processing unit is configured to process information from the image captured by the vision unit and provide the processed information to the controller.

Images