Haptic feedback system

Abstract

The present disclosure provides a haptic feedback system. The haptic feedback system includes a sensing unit, a haptic feedback module, and a circuit assembly. The sensing unit is configured to sense a contact of an object. The haptic feedback module is configured to deliver a contact force to the sensing unit. The circuit assembly is electrically connected to the haptic feedback module and the sensing unit.

Description

Technical Field

[0001] This invention relates to a tactile feedback system, and more particularly to a tactile feedback system installed on an electronic device. Background Technology

[0002] In recent years, with the rapid development of the technology industry, electronic devices such as mobile phones, tablet computers, notebook computers, and smartphones have become increasingly common and are developing towards convenient, multifunctional, and aesthetically pleasing designs to provide users with more choices.

[0003] Electronic devices typically have buttons on their casing to control them, such as power or volume control for a speaker. However, when a user presses a button, they have no way of knowing whether they have pressed it deeply enough to complete the action. Summary of the Invention

[0004] The purpose of this invention is to provide a haptic feedback system to solve at least one of the above-mentioned problems.

[0005] In view of the aforementioned known problems, one embodiment of the present invention provides a haptic feedback system, including a sensing unit, a haptic feedback module, and a circuit component. The sensing unit is used to sense the contact of an object, the haptic feedback module is used to transmit a contact force to the sensing unit, and the circuit component is electrically connected to the haptic feedback module and the sensing unit.

[0006] In one embodiment, the aforementioned haptic feedback module includes a fixed portion, a movable portion, and a driving mechanism electrically connected to the aforementioned circuit assembly to drive the movable portion to move relative to the aforementioned fixed portion. The aforementioned sensing unit transmits a sensing signal to the aforementioned circuit assembly, and the aforementioned circuit assembly transmits a driving signal to the aforementioned driving mechanism based on the sensing signal, thereby driving the movable portion to move relative to the aforementioned fixed portion and contact the aforementioned sensing unit.

[0007] In one embodiment, the aforementioned fixed portion has an opening, and when the aforementioned movable portion moves relative to the aforementioned fixed portion, the aforementioned movable portion passes through the aforementioned opening and contacts the aforementioned sensing unit.

[0008] In one embodiment, the aforementioned fixing part includes a housing and a base. The housing includes a top and at least one sidewall connected to each other, wherein the aforementioned opening is formed on the aforementioned top. The aforementioned base is connected to the aforementioned housing, and the aforementioned movable part is disposed between the aforementioned housing and the aforementioned base. The aforementioned movable part has at least one stop portion protruding towards the housing, and when the aforementioned movable part moves relative to the aforementioned fixing part to a limit position, the aforementioned stop portion contacts the aforementioned top to limit the aforementioned movable part at the aforementioned limit position.

[0009] In one embodiment, the aforementioned top is located between the aforementioned stop portion and the aforementioned sensing unit.

[0010] In one embodiment, the aforementioned sensing unit is fixed to the aforementioned top.

[0011] In one embodiment, the aforementioned sensing unit has a pressure sensor, and when the aforementioned pressure sensor senses a pressure from the aforementioned object that is greater than a threshold, the aforementioned circuit component transmits the aforementioned driving signal to the aforementioned driving mechanism to drive the aforementioned movable part to move relative to the aforementioned fixed part and contact the aforementioned sensing unit.

[0012] In one embodiment, the aforementioned sensing unit has a piezo switch, and when the aforementioned piezo switch is triggered by pressure from the aforementioned object, the aforementioned circuit component transmits the aforementioned drive signal to the aforementioned drive mechanism to drive the aforementioned movable part to move relative to the aforementioned fixed part and contact the aforementioned sensing unit.

[0013] In one embodiment, the aforementioned sensing unit has a fingerprint sensor, and when the aforementioned fingerprint sensor confirms that a fingerprint of the aforementioned object is correct, the aforementioned circuit component transmits the aforementioned driving signal to the aforementioned driving mechanism to drive the aforementioned movable part to move relative to the aforementioned fixed part and contact the aforementioned sensing unit.

[0014] In one embodiment, the aforementioned fingerprint reader is a capacitive fingerprint sensor.

[0015] In one embodiment, the aforementioned driving mechanism drives the aforementioned movable part to move relative to the aforementioned fixed part and transmits a vibration signal to the aforementioned sensing unit.

[0016] In one embodiment, the aforementioned movable part has an upper protrusion, and when the aforementioned movable part moves relative to the aforementioned fixed part, the aforementioned upper protrusion passes through the aforementioned opening and contacts the aforementioned sensing unit.

[0017] In one embodiment, the aforementioned haptic feedback system further includes a base plate disposed below the aforementioned circuit assembly, and the aforementioned circuit assembly includes a circuit board and a processor, wherein the aforementioned processor is disposed on the aforementioned circuit board, and the aforementioned circuit board has an opening, wherein when the aforementioned driving mechanism drives the aforementioned movable part to move relative to the aforementioned fixed part, the aforementioned movable part passes through the aforementioned opening and contacts the aforementioned base plate.

[0018] In one embodiment, the aforementioned movable part has a lower protrusion, and when the aforementioned movable part moves relative to the aforementioned fixed part, the aforementioned lower protrusion passes through the aforementioned opening and contacts the aforementioned base plate.

[0019] In one embodiment, the aforementioned haptic feedback module further includes a magnet and a magnetic field sensing element. The magnet is disposed on the aforementioned movable part, and the aforementioned magnetic field sensing element is disposed on the aforementioned fixed part to sense the position of the aforementioned magnet.

[0020] In one embodiment, the aforementioned sensing unit includes a protection element, a sensing element, and a circuit element, wherein the sensing element is disposed between the aforementioned protection element and the aforementioned circuit element, and the aforementioned circuit element is electrically connected to the aforementioned sensing element and the aforementioned circuit assembly.

[0021] In one embodiment, the aforementioned driving mechanism has a shape memory alloy element (SMA) that connects the aforementioned movable part and the aforementioned fixed part, and is electrically connected to the aforementioned circuit assembly.

[0022] In one embodiment, the aforementioned movable part has a hook, and the aforementioned shape memory alloy element extends through the aforementioned hook.

[0023] In one embodiment, the aforementioned drive mechanism has a piezoelectric element that connects the aforementioned movable part and the aforementioned fixed part, and is electrically connected to the aforementioned circuit assembly.

[0024] In one embodiment, the aforementioned piezoelectric element passes through the aforementioned movable portion.

[0025] The beneficial effect of this disclosure is that the haptic feedback system can serve as a power switch for the electronic device, and when the user touches or presses the haptic feedback system with their finger, the haptic feedback system can generate a vibration signal (e.g., a sine wave vibration signal) to produce a haptic feedback effect. Attached Figure Description

[0026] Figure 1 A schematic diagram illustrating an embodiment of the electronic device of the present invention.

[0027] Figure 2 express Figure 1A schematic diagram of the haptic feedback system.

[0028] Figure 3 express Figure 2 An exploded view of a haptic feedback system in a computer.

[0029] Figure 4 express Figure 3 An exploded view of the haptic feedback module in the image.

[0030] Figure 5 express Figure 4 A three-dimensional diagram of the activity section.

[0031] Figure 6 express Figure 2 A cross-sectional view of the haptic feedback system in the image.

[0032] Figure 7 A schematic diagram illustrating a haptic feedback system according to another embodiment of the present invention.

[0033] Figure 8 express Figure 7 An exploded view of a haptic feedback system in a computer.

[0034] Figure 9 express Figure 8 An exploded view of the haptic feedback module in the image.

[0035] Figure 10 express Figure 9 Exploded view of the moving part, the fixed part, and a shape memory alloy element.

[0036] Figure 11 express Figure 10 A three-dimensional diagram of the activity section.

[0037] Figure 12 A schematic diagram illustrating a haptic feedback system according to another embodiment of the present invention.

[0038] Figure 13 express Figure 12 An exploded view of a haptic feedback system in a computer.

[0039] Figure 14 express Figure 13 An exploded view of the haptic feedback module in the image.

[0040] Figure 15 express Figure 14 A three-dimensional view of the assembled moving parts, piezoelectric elements, guide rods, metal parts, and conductive terminals.

[0041] Figure 16 This diagram illustrates the electrical connection of a piezoelectric element to a circuit board via conductive terminals.

[0042] The attached figures are labeled as follows:

[0043] 100: Electronic devices

[0044] 10:Ontology

[0045] 20: Monitor

[0046] 30: Haptic Feedback System

[0047] 31: Sensing Unit

[0048] 311: Protective Components

[0049] 312: Sensing element

[0050] 3121: Capacitive fingerprint reader

[0051] 3122: Border

[0052] 313: Circuit elements

[0053] 32: Haptic Feedback Module

[0054] 321: Outer shell

[0055] 3211: Opening

[0056] 322: Activities Department

[0057] 323: Base

[0058] 3231: Opening

[0059] 324: Bracket

[0060] 33: Circuit components

[0061] 331: Circuit Board

[0062] 332: Processor

[0063] C: Coil

[0064] FS: Reed

[0065] HM: Magnet

[0066] HS: Magnetic field sensing element

[0067] L: Conductive terminal

[0068] M: Magnetic element

[0069] P1: Upper bump

[0070] P2: Stopping part

[0071] P3: Lower bump

[0072] P4: Stopping part

[0073] 30': Haptic feedback system

[0074] 34: Haptic Feedback Module

[0075] 341: Outer shell

[0076] 3411: Opening

[0077] 342: Activities Department

[0078] 3421: Hook

[0079] 343: Base

[0080] 3431: Opening

[0081] W: Shape memory alloy components

[0082] 30”: Haptic Feedback System

[0083] 35: Haptic Feedback Module

[0084] 351: Outer shell

[0085] 3511: Opening

[0086] 352: Activities Department

[0087] 353: Base

[0088] 3531: Opening

[0089] G: Guide rod

[0090] PZ: Piezoelectric element

[0091] R: Metal parts Detailed Implementation

[0092] The following describes a haptic feedback system according to embodiments of the present invention. However, it will be readily apparent that the embodiments of the present invention provide many suitable inventive concepts and can be implemented in a wide range of specific contexts. The specific embodiments disclosed are merely illustrative of the use of the invention in particular ways and are not intended to limit the scope of the invention.

[0093] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein.

[0094] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used in the embodiments are for illustrative purposes and not for limiting the present invention.

[0095] Please refer to both at the beginning. Figures 1-3 ,in Figure 1 A schematic diagram illustrating an embodiment of the electronic device 100 of the present invention. Figure 2 express Figure 1 A schematic diagram of the haptic feedback system 30 in the image. Figure 3 express Figure 2 An exploded view of the haptic feedback system 30 in the image.

[0096] like Figures 1-3 As shown, the electronic device 100 in this embodiment is, for example, a laptop computer, which includes a main body 10, a display 20 and a haptic feedback system 30, wherein the display 20 is connected to the main body 10 and the haptic feedback system 30 is disposed on the main body 10.

[0097] It should be noted that the aforementioned haptic feedback system 30 can be used as a power switch for the electronic device 100, and when the user touches or presses the haptic feedback system 30 with their finger, the haptic feedback system 30 can generate a vibration signal (such as a sine wave vibration signal) to produce a haptic feedback effect.

[0098] Specifically, the aforementioned haptic feedback system 30 includes a sensing unit 31, a haptic feedback module 32, and a circuit assembly 33 stacked along the Z-axis. The sensing unit 31 can sense the contact of external objects (such as fingers), and the haptic feedback module 32 can transmit a contact force to the sensing unit 31, thereby generating a haptic feedback effect. The circuit assembly 33 has a circuit board 331 and a processor 332, wherein the processor 332 is disposed on the circuit board 331 and can be electrically connected to the haptic feedback module 32 and the sensing unit 31 through the circuit board 331.

[0099] from Figure 3As can be seen from the above, the sensing unit 31 of this embodiment includes a protection element 311, a sensing element 312 and a circuit element 313, wherein the sensing element 312 is disposed between the protection element 311 and the circuit element 313; for example, the aforementioned circuit element 313 may be a flexible circuit board (FPC), which is disposed below the sensing element 312 and electrically connected to the sensing element 312 and the circuit board 331.

[0100] In this embodiment, the aforementioned sensing element 312 includes a capacitive fingerprint sensor 3121 and a frame 3122 surrounding the capacitive fingerprint sensor 3121, and the protective element 311 is a glass substrate covering the sensing element 312.

[0101] When a user wants to turn on the power of the electronic device 100, they can place their finger on the protective element 311. At this time, the capacitive fingerprint reader 3121 can perform fingerprint recognition. When the fingerprint reader 3121 confirms that the fingerprint is correct, it can transmit a sensing signal to the processor 332 on the circuit board 331 via the circuit element 313. The processor 332 can transmit a drive signal to a drive mechanism inside the haptic feedback module 32 according to the sensing signal, so as to drive a movable part inside the haptic feedback module 32 to move upward and contact the circuit element 313 at the bottom of the sensing unit 31, thereby transmitting a contact force to the sensing unit 31 and allowing the user to feel haptic feedback.

[0102] Please refer to the following as well. Figure 4 , Figure 5 and Figure 6 ,in Figure 4 express Figure 3 An exploded view of the haptic feedback module 32 in the middle. Figure 5 express Figure 4 A three-dimensional view of the activity section 322 in the middle. Figure 6 express Figure 2 A cross-sectional view of the haptic feedback system 30 in the image.

[0103] like Figure 4 and Figure 5 As shown, the haptic feedback module 32 mainly includes a housing 321, a movable part 322, a base 323, and a bracket 324. The housing 321 is fixed on the base 323 and together they form a fixed part. The movable part 322 is disposed between the housing 321 and the base 323 and is connected to the housing 321 by a spring FS, so that the movable part 322 can move up and down relative to the housing 321 and the base 323 along the Z-axis.

[0104] Furthermore, the aforementioned bracket 324 is disposed on the base 323, and at least one magnetic element M (e.g., a magnet) is fixed between the base 323 and the bracket 324; on the other hand, at least one coil C is disposed on the movable part 322 and corresponds to the aforementioned magnetic element M, wherein the aforementioned coil C can be electrically connected to the metal conductor on the base 323 through the conductive terminal L or the wire, and can also be electrically connected to the circuit board 331 below through the metal conductor.

[0105] It should be understood that when current is passed through the coil C, the coil C and the magnetic element M (driving mechanism) can generate an electromagnetic driving force to force the movable part 322 to displace relative to the fixed part along the Z-axis. An opening 3211 is formed on the aforementioned housing 321, and an opening 3231 is formed on the base 323. When the movable part 322 moves upward relative to the fixed part, it passes through the opening 3211 and contacts the circuit element 313 of the sensing unit 31 to transmit a contact force to the sensing unit 31.

[0106] Similarly, when the movable part 322 moves downward relative to the fixed part, the movable part 322 will pass through the opening 3231 on the base 323 and contact a bottom plate (not shown) located below the base 323, thereby generating a vibration signal and providing a good tactile feedback effect.

[0107] Specifically, from Figure 4 , Figure 5 and Figure 6 As can be seen, an upper protrusion P1 and at least one stop P2 protruding toward the outer shell 321 are formed on the top side of the aforementioned movable part 322, and a lower protrusion P3 and at least one stop P4 are formed on the bottom side of the movable part 322.

[0108] It should be understood that the housing 321 of this embodiment has an interconnected top and at least one side wall, wherein the top is perpendicular to the Z-axis and the side wall is parallel to the Z-axis; when the movable part 322 moves upward relative to the fixed part, the aforementioned upper protrusion P1 will pass through the opening 3211 and contact the circuit element 313 in the sensing unit 31; however, when the movable part 322 moves upward relative to the fixed part to a limit position, the stop part P2 will contact the top of the housing 321 to limit the movable part 322 to the aforementioned limit position, thereby preventing the upper protrusion P1 and the circuit element 313 from being damaged due to excessive collision.

[0109] The sensing unit 31 can be fixed to the top of the housing 321, and the top of the housing 321 is located between the stop part P2 and the sensing unit 31 in the Z-axis direction.

[0110] Similarly, when the movable part 322 moves downward relative to the fixed part, the aforementioned lower protrusion P3 will pass through the opening 3231 on the base 323 and contact the bottom plate (not shown) located below the base 323; however, when the movable part 322 moves downward relative to the fixed part to another extreme position, the stop part P4 will contact the base 323 to avoid damage to the mechanism due to excessive collision between the lower protrusion P3 and the bottom plate.

[0111] In addition, from Figure 4 and Figure 6 As can be seen, a magnet HM is provided on the active part 322, and a magnetic field sensing element HS is provided on the base 323. Figure 6 ( ), used to sense the position of the aforementioned magnet HM, thereby knowing the positional change of the movable part 322 relative to the fixed part.

[0112] In one embodiment, the aforementioned capacitive fingerprint reader 3121 may also be replaced by a pressure sensor or a piezo switch. When the pressure sensor senses that the pressure from the external object is greater than a threshold or is triggered, the processor 332 on the circuit board 331 will send a drive signal to a drive mechanism inside the haptic feedback module 32 to drive the moving part 322 to move relative to the fixed part and contact the sensing unit 31.

[0113] Please refer to the following as well. Figures 7-11 ,in Figure 7 This is a schematic diagram illustrating a haptic feedback system 30' according to another embodiment of the present invention. Figure 8 express Figure 7 An exploded view of the haptic feedback system in the image at 30'. Figure 9 express Figure 8 An exploded view of the haptic feedback module 34 in the middle. Figure 10 express Figure 9 An exploded view of the movable part 342, the fixed part 343, and a shape memory alloy element W. Figure 11 express Figure 10 A three-dimensional view of the active section 342.

[0114] like Figures 7-11 As shown, the haptic feedback system 30' in this embodiment and Figures 1-6 The main difference of the haptic feedback system 30 in this embodiment is that the haptic feedback system 30' includes a haptic feedback module 34, wherein the haptic feedback module 34 has a housing 341, a movable part 342 and a base 343, wherein the housing 341 is fixed on the base 343 and together they form a fixed part, and the movable part 342 is movably disposed between the housing 341 and the base 343 and can move relative to the base 343 along the Z-axis direction.

[0115] Specifically, a shape memory alloy element W (SMA) connects the aforementioned base 343 and the movable part 342, wherein a hook 3421 is formed on one side of the movable part 342, and the shape memory alloy element W extends through the hook 3421, so that the movable part 342 can be suspended in the base 343.

[0116] It should be understood that the shape memory alloy element W can be electrically connected to the circuit board 331 below through the conductive terminal L, and when a current is passed into the shape memory alloy element W, the shape memory alloy element W can extend or contract to change its length, thereby serving as a drive mechanism to drive the movable part 342 to move relative to the base 343 in the Z-axis direction.

[0117] from Figures 7-11 As can be seen, an upper protrusion P1 and multiple stop portions P2 are formed on the top side of the aforementioned movable part 342, and a lower protrusion P3 and multiple stop portions P4 are formed on the bottom side of the movable part 342.

[0118] It should be understood that when the movable part 342 moves upward relative to the fixed part, the aforementioned upper protrusion P1 will pass through the opening 3411 of the housing 341 and contact the circuit element 313 in the sensing unit 31; however, when the movable part 342 moves upward relative to the fixed part to a limit position, the stop part P2 will contact the top of the housing 341 to limit the movable part 342 to the aforementioned limit position, thereby preventing the upper protrusion P1 and the circuit element 313 from being damaged due to excessive collision.

[0119] Similarly, when the movable part 342 moves downward relative to the fixed part, the aforementioned lower protrusion P3 will pass through the opening 3431 of the base 343 and contact the bottom plate (not shown) located below the base 343; however, when the movable part 342 moves downward relative to the fixed part to another extreme position, the stop part P4 will contact the base 343 to avoid damage to the mechanism due to excessive collision between the lower protrusion P3 and the bottom plate.

[0120] In addition, from Figure 10 and Figure 11 As can be seen, at least one magnet HM is provided on the movable part 342. In addition, a magnetic field sensing element (not shown) can be provided on the base 343 to sense the position of the aforementioned magnet HM, thereby knowing the position change of the movable part 342 relative to the fixed part.

[0121] Please refer to the following as well. Figures 12-16 ,in Figure 12 A schematic diagram illustrating a haptic feedback system 30” according to another embodiment of the present invention. Figure 13 express Figure 12An exploded view of the haptic feedback system in the image. Figure 14 express Figure 13 An exploded view of the haptic feedback module 35 in the image. Figure 15 express Figure 14 A perspective view of the assembled movable part 352, piezoelectric element PZ, guide rod G, metal part R, and conductive terminal L. Figure 16 This diagram shows the piezoelectric element PZ electrically connected to the circuit board 331 via the conductive terminal L.

[0122] like Figures 12-16 As shown, the haptic feedback system 30” in this embodiment and Figures 1-6 The main difference of the haptic feedback system 30 in this embodiment is that the haptic feedback system 30 in this embodiment includes a haptic feedback module 35, wherein the haptic feedback module 35 has a housing 351, a movable part 352 and a base 353, wherein the housing 351 is fixed on the base 353 and together they form a fixed part, and the movable part 352 is movably disposed between the housing 351 and the base 353 and can move relative to the base 353 along the Z-axis direction.

[0123] Specifically, a long strip-shaped piezoelectric element PZ passes through the movable part 352 and is connected to the aforementioned base 353. In addition, at least one guide rod G is provided on the movable part 352 to guide the movable part 352 to move relative to the base 353 along the Z-axis direction.

[0124] On the other hand, a metal part R is provided on the bottom side of the movable part 352, through which the piezoelectric element PZ can be electrically connected to the conductive terminal L, and the piezoelectric element PZ can be electrically connected to the circuit board 331 below through the conductive terminal L. When a current is passed into the piezoelectric element PZ, the piezoelectric element PZ can extend or contract to change its length, thereby serving as a drive mechanism to drive the movable part 352 to move relative to the base 353 in the Z-axis direction.

[0125] Specifically, from Figures 14-16 As can be seen, an upper protrusion P1 is formed on the top side of the aforementioned movable part 352, and a lower protrusion P3 is formed on the bottom side of the movable part 352.

[0126] It should be understood that when the movable part 352 moves upward relative to the fixed part, the aforementioned upper protrusion P1 will pass through the opening 3511 of the housing 351 and contact the circuit element 313 in the sensing unit 31 to transmit a contact force to the sensing unit 31.

[0127] Similarly, when the movable part 352 moves downward relative to the fixed part, the aforementioned lower protrusion P3 will pass through the opening 3531 of the base 353 and contact the bottom plate (not shown) located below the base 353, thereby generating a vibration signal and providing a good tactile feedback effect.

[0128] In addition, from Figure 16 As can be seen, a magnet HM is provided on the movable part 352, and a magnetic field sensing element (not shown) can be provided on the base 353 to sense the position of the aforementioned magnet HM, thereby knowing the position change of the movable part 352 relative to the fixed part.

[0129] While the embodiments and advantages of the present invention have been disclosed above, it should be understood that those skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. Furthermore, the scope of protection of the present invention is not limited to the processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps described in the specific embodiments of the specification. Any processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps currently or in the future that can be developed from the disclosure of this invention can be used according to the present invention, as long as they can perform substantially the same function or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of the present invention includes the aforementioned processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present invention also includes combinations of the various claims and embodiments.

[0130] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A haptic feedback system, comprising: A sensing unit for sensing the contact of an object includes a protective element, a sensing element, and a circuit element, wherein the sensing element is disposed between the protective element and the circuit element. A haptic feedback module for transmitting a contact force to the sensing unit, wherein the haptic feedback module includes a fixed part, a movable part, and a drive mechanism, the movable part being movable relative to the fixed part to drive the movable part to move relative to the fixed part; and A circuit assembly electrically connects a drive mechanism, the haptic feedback module, and the sensing unit, wherein the circuit element is electrically connected to the sensing element and the circuit assembly, the sensing unit transmits a sensing signal to the circuit assembly, and the circuit assembly transmits a drive signal to the drive mechanism according to the sensing signal, so as to drive the movable part to move relative to the fixed part and contact the sensing unit.

2. The haptic feedback system of claim 1, wherein the fixed portion has an opening, and when the movable portion moves relative to the fixed portion, the movable portion passes through the opening and contacts the sensing unit.

3. The haptic feedback system as claimed in claim 2, wherein the fixing part comprises: An enclosure includes an interconnected top and at least one sidewall, wherein the opening is formed on the top; as well as A base is connected to the housing, and the movable part is disposed between the housing and the base; The movable part has at least one stop portion protruding towards the outer shell, and when the movable part moves relative to the fixed part to a limit position, the stop portion contacts the top to limit the movable part to the limit position.

4. The haptic feedback system of claim 3, wherein the top is located between the stop and the sensing unit.

5. The haptic feedback system of claim 4, wherein the sensing unit is fixed to the top.

6. The haptic feedback system of claim 1, wherein the sensing unit has a pressure sensor, and when the pressure sensor senses a pressure from the object greater than a threshold, the circuit assembly transmits the drive signal to the drive mechanism to drive the movable part to move relative to the fixed part and contact the sensing unit.

7. The haptic feedback system of claim 1, wherein the sensing unit has a piezoelectric switch, and when the piezoelectric switch is triggered by pressure from the object, the circuit assembly transmits the drive signal to the drive mechanism to drive the movable part to move relative to the fixed part and contact the sensing unit.

8. The haptic feedback system of claim 1, wherein the sensing unit has a fingerprint reader, and when the fingerprint reader confirms that a fingerprint of the object is correct, the circuit assembly transmits the drive signal to the drive mechanism to drive the movable part to move relative to the fixed part and contact the sensing unit.

9. The haptic feedback system of claim 8, wherein the fingerprint reader is a capacitive fingerprint reader.

10. The haptic feedback system of claim 1, wherein the drive mechanism drives the movable part to move relative to the fixed part and transmits a vibration signal to the sensing unit.

11. The haptic feedback system of claim 1, wherein the movable part has an upper protrusion, and when the movable part moves relative to the fixed part, the upper protrusion passes through the opening and contacts the sensing unit.

12. The haptic feedback system of claim 1, wherein the haptic feedback system further includes a base plate disposed below the circuit assembly, and the circuit assembly includes a circuit board and a processor, wherein the processor is disposed on the circuit board, and the circuit board has an opening, wherein when the driving mechanism drives the movable part to move relative to the fixed part, the movable part passes through the opening and contacts the base plate.

13. The haptic feedback system of claim 12, wherein the movable part has a lower protrusion, and when the movable part moves relative to the fixed part, the lower protrusion passes through the opening and contacts the base plate.

14. The haptic feedback system as claimed in claim 1, wherein the haptic feedback module further includes a magnet and a magnetic field sensing element, the magnet being disposed on the movable part and the magnetic field sensing element being disposed on the fixed part for sensing the position of the magnet.

15. The haptic feedback system of claim 1, wherein the drive mechanism has a piezoelectric element connected to the movable part and the fixed part, and is electrically connected to the circuit assembly.

16. The haptic feedback system of claim 15, wherein the piezoelectric element passes through the movable portion.

17. A haptic feedback system, comprising: A sensing unit for sensing the contact of an object; A haptic feedback module for transmitting a contact force to the sensing unit, wherein the haptic feedback module includes a fixed part, a movable part, and a drive mechanism, the movable part being movable relative to the fixed part to drive the movable part to move relative to the fixed part; and A circuit assembly electrically connects the drive mechanism, the haptic feedback module, and the sensing unit, wherein the sensing unit transmits a sensing signal to the circuit assembly, and the circuit assembly transmits a drive signal to the drive mechanism according to the sensing signal, so as to drive the movable part to move relative to the fixed part and contact the sensing unit. The drive mechanism has a shape memory alloy element that connects the moving part and the fixed part, and is electrically connected to the circuit assembly.

18. The haptic feedback system of claim 17, wherein the movable part has a latch, and the shape memory alloy element extends through the latch.

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