Optical transmitter and optical sensor

Abstract

The application discloses a light emitter and a light sensor. The light emitter comprises a first conductive frame, a plurality of second conductive frames, a shell, and at least one optoelectronic chip. The first conductive frame comprises a die bonding block. The plurality of second conductive frames comprises at least one wire bonding block and is arranged apart from the first conductive frame. The shell covers the first conductive frame and the plurality of second conductive frames. At least part of the top surface of the first conductive frame and at least part of the top surface of any of the second conductive frames are exposed outside the shell to form the die bonding block and the wire bonding block. At least part of the bottom surface of the first conductive frame and at least part of the bottom surface of any of the second conductive frames are exposed outside the shell. The at least one optoelectronic chip is fixed to the die bonding block of the first conductive frame and electrically coupled to the wire bonding block of at least one of the second conductive frames. In this way, by adopting the conductive frame form, the problems of complicated process and insufficient product yield of the existing light sensor are solved.

Description

Technical Field

[0001] This application relates to a light emitter, and more particularly to a light emitter and a light sensor. Background Technology

[0002] Existing optical sensors have a transmitter and a receiver. The transmitter uses a circuit board as a substrate. However, the manufacturing process for this type is cumbersome and has a low yield, affecting product reliability and cost. Therefore, the applicant believes that the above-mentioned defects can be improved. The applicant has devoted itself to research and, by applying scientific principles, has finally proposed a design that effectively improves the aforementioned defects. Summary of the Invention

[0003] The present application provides an optical emitter and an optical sensor that can effectively improve the defects that may occur in existing optical emitters.

[0004] This application also discloses a light emitter, comprising: a first conductive frame including a die-bonding block; a plurality of second conductive frames including at least one wire bonding block, the plurality of second conductive frames being spaced apart from the first conductive frame; a housing covering the first conductive frame and the plurality of second conductive frames, wherein at least a portion of the top surface of the first conductive frame and at least a portion of the top surface of any one of the second conductive frames are exposed outside the housing to form the die-bonding block and the wire bonding block, and at least a portion of the bottom surface of the first conductive frame and at least a portion of the bottom surface of any one of the second conductive frames are exposed outside the housing for external electrical connection; and at least one optoelectronic chip fixed to the die-bonding block of the first conductive frame and electrically coupled to the wire bonding block of at least one of the second conductive frames.

[0005] Optionally, at least a portion of the top surface of the first conductive frame is recessed into the die-bonding block to form a partition groove, so that at least a portion of the top surface of the first conductive frame is divided into multiple sub-blocks by the partition groove; the number of at least one photoelectric chip is further limited to multiple, and the multiple photoelectric chips are respectively fixed to multiple sub-blocks.

[0006] Optionally, the partition groove extends from one of the opposite sides of the die-bonding block to the other, and the partition groove is filled with the housing.

[0007] Optionally, the first conductive frame further includes a first extension block and a second extension block, wherein the die-bonding block extends diagonally to connect the first extension block and the second extension block.

[0008] Optionally, the plurality of second conductive frames include at least one first support and at least one second support, wherein at least one first support is arranged in a first column and adjacent to the die-bonding region and the first extension block, and at least one second support is arranged in a second column and adjacent to the die-bonding region and the second extension block.

[0009] Optionally, the number of at least one first support and the number of at least one second support are each limited to a plurality, and the first column is parallel to the second column.

[0010] Optionally, the first conductive frame includes a third extension block, and at least one first support is located between the first extension block and the third extension block.

[0011] Optionally, at least a portion of the top surface of the first conductive frame is recessed in the die-bonding block to form a T-shaped dividing groove, so that at least a portion of the top surface of the first conductive frame is divided into three sub-blocks by the dividing groove, and one of the three sub-blocks is connected to the first extension block, while the other two of the three sub-blocks are respectively connected to the second extension block and the third extension block.

[0012] Optionally, the first conductive frame further includes a first extension block and a second extension block, the die-bonding block extending diagonally to connect the first extension block and the second extension block, and at least a portion of the bottom of the first conductive frame includes a main welding surface, a first welding surface, and a second welding surface of the same polarity, the main welding surface being located in the die-bonding block, the first welding surface being located in the first extension block, and the second welding surface being located in the second extension block.

[0013] Optionally, the light emitter includes a lens layer disposed on the housing, and the lens layer includes at least one lens portion positioned corresponding to at least one of the photoelectric chips; wherein at least one of the photoelectric chips is located within a projection area formed by the orthographic projection of at least one of the lens portions toward the top surface of the first conductive frame.

[0014] Optionally, the projection area is circular and has a diameter, and at least one of the photoelectric chips has a maximum outer diameter, and the diameter is 110% to 140% of the maximum outer diameter.

[0015] Optionally, the distance between the top of at least one of the lens portions and at least one of the photoelectric chips is 220% to 320% of the height of at least one of the photoelectric chips.

[0016] Optionally, the housing surrounds a receiving groove, and at least one of the photoelectric chips is located within the receiving groove; the light emitter includes a filler filling the receiving groove, and at least a portion of at least one of the photoelectric chips is embedded within the filler.

[0017] Optionally, the entire top surface of the first conductive frame and the entire top surface of any one of the second conductive frames are exposed and coplanar with the top surface of the housing, and the light emitter includes a lens layer; the lens layer is disposed on the top surface of the first conductive frame, the top surfaces of the plurality of second conductive frames, and the top surface of the housing, and at least one of the photoelectric chips is embedded in the lens layer.

[0018] This application also discloses an optical sensor, which includes: a light emitter comprising at least a first conductive frame, a plurality of second conductive frames, and at least one photoelectric chip, wherein the plurality of second conductive frames are spaced apart from the first conductive frame, and the photoelectric chip is electrically coupled to the first conductive frame and at least one of the second conductive frames; and at least one light receiver, which is spaced apart from the light emitter, and the shape center of at least one light receiver is separated from the shape center of the light emitter by a configuration distance.

[0019] Optionally, the number of at least one optical receiver is further limited to at least four, and the shape center of any one of the optical receivers is located on a circular configuration path with the shape center of the optical transmitter as the center and the configuration distance as the radius.

[0020] Optionally, the shape centers of any two adjacent optical receivers form a chord length on the circular configuration path, and the plurality of chord lengths formed by at least four optical receivers are all equal.

[0021] In summary, the light emitter and light sensor disclosed in the embodiments of this application solve the problems of cumbersome manufacturing process and insufficient product yield of existing optical sensors by adopting a conductive frame.

[0022] To further understand the features and technical content of this application, please refer to the following detailed description and drawings of this application. However, these descriptions and drawings are only used to illustrate this application and are not intended to limit the scope of protection of this application in any way. Attached Figure Description

[0023] Figure 1 This is a three-dimensional schematic diagram of the light emitter in Embodiment 1 of this application.

[0024] Figure 2 for Figure 1 A three-dimensional diagram from another perspective.

[0025] Figure 3 for Figure 1 A schematic diagram of its breakdown.

[0026] Figure 4 This is a top view of the first conductive frame and the second conductive frame in Embodiment 1 of this application.

[0027] Figure 5 This is a bottom view of the first conductive frame and the second conductive frame in Embodiment 1 of this application.

[0028] Figure 6 for Figure 1 A cross-sectional view along section line VI-VI.

[0029] Figure 7 for Figure 1 A schematic cross-sectional view along section line VII-VII.

[0030] Figure 8 This is a three-dimensional schematic diagram of the light emitter in Embodiment 2 of this application.

[0031] Figure 9 for Figure 8 A top-down view.

[0032] Figure 10 for Figure 8 A cross-sectional view along section line XX.

[0033] Figure 11 This is a three-dimensional schematic diagram of the light emitter in Embodiment 3 of this application.

[0034] Figure 12 for Figure 11 A schematic diagram of its breakdown.

[0035] Figure 13 This is a three-dimensional schematic diagram of the light emitter in Embodiment 4 of this application.

[0036] Figure 14 for Figure 13 A schematic diagram of its breakdown.

[0037] Figure 15 This is a top view of the first conductive frame and the second conductive frame in Embodiment 4 of this application.

[0038] Figure 16 This is a bottom view of the first conductive frame and the second conductive frame in Embodiment 4 of this application.

[0039] Figure 17 for Figure 13 A cross-sectional view along section line XVII-XVII.

[0040] Figure 18This is a three-dimensional schematic diagram of another form of the light emitter in Embodiment 4 of this application.

[0041] Figure 19 for Figure 18 A schematic diagram of its breakdown.

[0042] Figure 20 This is a planar schematic diagram of the reflective optical sensor according to Embodiment 5 of this application.

[0043] Figure 21 This is a planar schematic diagram of another form of the reflective optical sensor according to Embodiment 5 of this application.

[0044] Figure 22 This is a planar schematic diagram of another form of the reflective optical sensor according to Embodiment 5 of this application. Detailed Implementation

[0045] The following specific embodiments illustrate the implementation of the "light emitter and light sensor" disclosed in this application. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, the accompanying drawings are for simple illustration only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this application in detail, but the disclosed content is not intended to limit the scope of protection of this application.

[0046] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0047] [Example 1]

[0048] Please see Figures 1 to 7 As shown, this is an embodiment of this application. Figures 1 to 3 As shown, this embodiment discloses a light emitter 100, which includes a first conductive frame 1, a plurality of second conductive frames 2 located outside (or around) the first conductive frame 1, a housing 3 covering the first conductive frame 1 and the plurality of second conductive frames 2, a plurality of optoelectronic chips 4 (e.g., light-emitting diode chips) mounted on the first conductive frame 1, and a filler 5 formed within the housing 3.

[0049] To facilitate understanding of the light emitter 100 in this embodiment, the distribution of the first conductive frame 1 and the plurality of second conductive frames 2 and their correspondence with the housing 3 will be explained first, and then the detailed structural features of the first conductive frame 1 and the plurality of second conductive frames 2 will be introduced.

[0050] like Figures 3 to 5 As shown, the first conductive frame 1 in this embodiment is a single-piece structure integrally formed, and the first conductive frame 1 includes a die-bonding block 14, a first extension block 11, a second extension block 12, and a third extension block 13. In this embodiment, the die-bonding block 14 is generally rectangular, and the first extension block 11, the second extension block 12, and the third extension block 13 are formed by extending from the three corners of the die-bonding block 14, respectively.

[0051] In other words, the first extension block 11 and the second extension block 12 are respectively located on opposite sides of the die-bonding block 14 (e.g.: Figure 4 The die-bonding block 14 extends from the upper and lower sides of the die-bonding block 14, and the first extension block 11 and the third extension block 13 are located on the same side of the die-bonding block 14 (e.g., the upper side of the die-bonding block 14). Further, the first extension block 11 and the second extension block 12 are connected to two diagonally opposite corners of the die-bonding block 14, while the second extension block 12 and the third extension block 13 are connected to two adjacent corners of the die-bonding block 14.

[0052] The plurality of second conductive frames 2 are respectively located on the opposite sides of the die-bonding block 14 (e.g.: Figure 4 The die-bonding block 14 is arranged at intervals on its upper and lower sides. For ease of explanation, the plurality of second conductive frames 2 can be distinguished as at least one first support 2a and at least one second support 2b respectively adjacent to the opposite sides of the die-bonding block 14.

[0053] More specifically, at least one first support 2a, the first extension block 11, and the third extension block 13 are adjacent to the upper side of the die-bonding block 14 and arranged in a first column (that is, the third extension block 13 is disposed on the first column), and at least one first support 2a is located between the first extension block 11 and the third extension block 13, while at least one second support 2b and the second extension block 12 are adjacent to the lower side of the die-bonding block 14 and arranged in a second column. In this embodiment, the number of at least one first support 2a is one, the number of at least one second support 2b is multiple (e.g., two), and the first column is parallel to the second column, but this application is not limited thereto.

[0054] Furthermore, the first extension block 11, the second extension block 12, the third extension block 13, and each of the second conductive frames 2 each include at least two broken arms 111, 121, 131, and 21. Specifically, at least two of the broken arms 111, 121, 131, and 21 of each of the first extension block 11, the second extension block 12, and at least one second conductive frame 2 (e.g., the first support 2a and a second support 2b) are positioned at an acute angle.

[0055] Accordingly, during the manufacturing process of the plurality of light emitters 100, the first conductive frame 1 and the plurality of second conductive frames 2 of any one of the light emitters 100 can be connected to the first conductive frame 1 and the plurality of second conductive frames 2 of the other adjacent light emitters 100 through the plurality of broken arms 111, 121, 131, 21 (not shown), thereby effectively improving the stability during the injection molding of the housing 3 and avoiding the generation of island effect.

[0056] The housing 3 encloses the first conductive frame 1 and the plurality of second conductive frames 2, and surrounds them to form a receiving groove 31. The bottom surface 10b and at least a portion of the top surface 10a of the first conductive frame 1, and the bottom surface 20b and at least a portion of the top surface 20a of any one of the second conductive frames 2 are exposed outside the housing 3 (e.g., ...). Figure 2 , Figure 3 , Figure 6 and Figure 7 The end faces of each of the severed arms 111, 121, 131, and 21 are exposed and coplanar with the housing 3. In other words, as... Figure 2 and Figure 3 As shown, at least a portion of the top surface 10a of the first conductive frame 1 and at least a portion of the top surface 20a of any of the second conductive frames 2 are located at the bottom of the receiving groove 31, while the bottom surface 10b of the first conductive frame 1 and the bottom surface 20b of any of the second conductive frames 2 are coplanar with the bottom surface 30b of the housing 3.

[0057] Furthermore, in this embodiment, the first conductive frame 1 and any one of the second conductive frames 2 have their entire bottom surfaces 10b and 20b exposed outside the housing 3, but this application is not limited thereto. For example, in other embodiments not shown in this application, the first conductive frame 1 and any one of the second conductive frames 2 may each have at least a portion of their bottom surfaces 10b and 20b exposed outside the housing 3.

[0058] Furthermore, the area of ​​at least a portion of the top surface 10a of the first conductive frame 1 exposed outside the housing 3 is greater than the area of ​​the bottom surface 10b of the first conductive frame 1, and the area of ​​at least a portion of the top surface 20a of any second conductive frame 2 exposed outside the housing 3 is greater than the area of ​​the bottom surface 20b of any second conductive frame 2.

[0059] by Figure 5 To explain, when the total area of ​​the first conductive frame 1 and the plurality of second conductive frames 2 is 1, the area not covered by the housing 3 (i.e., the welding area) accounts for 55-65%. In other words, the area of ​​the first conductive frame 1 and the plurality of second conductive frames 2 covered by the housing 3 accounts for 35-45%, thereby effectively increasing the area of ​​the first conductive frame 1 and the plurality of second conductive frames 2 bonded to the housing 3, and thus improving the bonding strength between them.

[0060] In addition, such as Figures 3 to 5 As shown, the first conductive frame 1 in this embodiment is approximately "y" shaped, and the die-bonding block 14 is fixed to the center of the housing 3, thereby laterally spanning the housing 3 (e.g.: Figure 3 The die-bonding block 14 extends from the left rear side to the right front side of the housing 3, while the first extension block 11, the second extension block 12, and the third extension block 13 are respectively fixed to the three corners of the housing 3, so that the first conductive frame 1 can cross the housing 3 diagonally (e.g.: Figure 3 and Figure 4 The first conductive frame 1 extends from the upper left corner to the lower right corner of the housing 3, thereby improving the overall structural stability.

[0061] At least a portion of the top surface 10a of the first conductive frame 1 is recessed into the die-bonding block 14 to form a partition groove 141, such that at least a portion of the top surface 10a of the first conductive frame 1 is divided into a plurality of sub-blocks 142a, 142b by the partition groove 141. The partition groove 141 extends from one of the opposite sides of the die-bonding block 14 to the other, and the partition groove 141 is filled with the housing 3. Furthermore, the first extension block 11 has a first wire bonding area 113 exposed in the receiving groove 31, and each second conductive frame 2 has a wire bonding area 22 exposed in the receiving groove 31.

[0062] In this embodiment, the dividing groove 141 of the first conductive frame 1 is approximately T-shaped, so that at least a portion of the top surface 10a of the first conductive frame 1 is divided into three sub-blocks 142a and 142b by the dividing groove 141. One of the three sub-blocks 142a and 142b (e.g., sub-block 142a) is connected to the first extension block 11, while the other two of the three sub-blocks 142a and 142b (e.g., sub-block 142b) are respectively connected to the second extension block 12 and the third extension block 13. Further, the area of ​​the sub-block 142a connected to the first extension block 11 is larger than the area of ​​any one of the other sub-blocks 142b, and also larger than the sum of the areas of the other two sub-blocks 142b.

[0063] Accordingly, the light emitter 100 can carry multiple optoelectronic chips 4 of different sizes or functions through multiple sub-blocks 142a, 142b with different areas, thereby expanding the application range of the light emitter 100, but this application is not limited thereto. Furthermore, the partition groove 141 can not only effectively improve the bonding between the first conductive frame 1 and the housing 3, but also reduce the mutual overflow interference of multiple die-attach colloids (not shown) used to fix multiple optoelectronic chips 4 onto multiple sub-blocks 142a, 142b respectively.

[0064] The bottom surface 10b of the first conductive frame 1 includes a main welding surface 143, a first welding surface 112, a second welding surface 122, and a third welding surface 132 of the same polarity. The main welding surface 143 is located below the die-bonding block 14, the first welding surface 112 is located in the first extension block 11, the second welding surface 122 is located in the second extension block 12, and the third welding surface 132 is located in the third extension block 13. Furthermore, the bottom surface 20b of each second conductive frame 2 is defined as a welding area 23.

[0065] Multiple photoelectric chips 4 are located within the receiving groove 31 and embedded in the filler 5. These multiple photoelectric chips 4 are fixed to the die-bonding block 14 of the first conductive frame 1 and electrically coupled to the first conductive frame 1 and multiple second conductive frames 2. Further, the multiple photoelectric chips 4 are respectively fixed to multiple sub-blocks 142a and 142b and wire-connected to the first wire bonding area 113 and multiple wire bonding areas 22. Specifically, the photoelectric chip 4 fixed to the larger sub-block 142a is simultaneously wire-connected to the first wire bonding area 113 and one wire bonding area 22, while the other two photoelectric chips 4 are wire-connected to the other two wire bonding areas 22 respectively. More specifically, in this embodiment, the optoelectronic chip 4 includes a green light-emitting diode chip, a red light-emitting diode chip, and an infrared light-emitting diode chip; wherein, the green light-emitting diode chip is fixed to the sub-block 142a and wire-connected to the first wire bonding area 113 and one of the wire bonding areas 22, and the red light-emitting diode chip and the infrared light-emitting diode chip are respectively fixed to two of the sub-blocks 142b and wire-connected to the other two wire bonding areas 22 respectively.

[0066] It should be noted that the number of photoelectric chips 4 is described as multiple in this embodiment, but this application is not limited thereto. For example, in other embodiments not shown in this application, the number of photoelectric chips 4 may be at least one, and at least one of the photoelectric chips 4 is fixed to the die-bonding block 14 of the first conductive frame 1 (e.g., at least one of the sub-blocks 142a, 142b) and electrically coupled to the first conductive frame 1 and at least one of the second conductive frames 2.

[0067] Accordingly, the light emitter 100 uses a larger-sized first conductive frame 1 to support multiple optoelectronic chips 4, thereby effectively improving the heat dissipation of the multiple optoelectronic chips 4. Furthermore, since the main welding surface 143, the first welding surface 112, the second welding surface 122, and the third welding surface 132 of the first conductive frame 1 have the same polarity, each of the second conductive frames 2 is electrically coupled to only one optoelectronic chip 4, thus enabling the function of individually activating the corresponding optoelectronic chip 4.

[0068] [Example 2] Please see Figures 8 to 10 As shown, this is Embodiment Two of this application. Since this embodiment is similar to Embodiment One described above, the similarities between this embodiment and Embodiment One will not be repeated (e.g., the first conductive frame 1, the plurality of second conductive frames 2, the housing 3, and the plurality of photoelectric chips 4). The differences between this embodiment and the above embodiments are roughly explained as follows: In this embodiment, the height of the housing 3 and the height of the photoelectric chip 4 are approximately equal. The light emitter 100 includes a lens layer 6 disposed on the housing 3, and the lens layer 6 and the filler 5 are integrally formed as a single piece (that is, the filler 5 is located within the receiving groove 31, and the portion located above the housing 3 is referred to as the lens layer 6). However, this application is not limited to this. For example, in other embodiments not shown in this application, the lens layer 6 and the filler 5 may also be two independent components connected to each other.

[0069] The lens layer 6 includes a base layer 61 located on the housing 3 and a plurality of lens portions 62 connected to the base layer 61, and the positions of the plurality of lens portions 62 respectively correspond to the plurality of photoelectric chips 4. Each photoelectric chip 4 is located within a projection area formed by the orthographic projection of the corresponding lens portion 62 onto the top surface 10a of the first conductive frame 1; that is, in this embodiment, each photoelectric chip 4 is located directly below the corresponding lens portion 62.

[0070] Furthermore, in order to enable any of the lens portions 62 to effectively improve the luminous efficiency of the corresponding photoelectric chip 4, each lens portion 62 and the corresponding photoelectric chip 4 are preferably configured in the following manner, but this application is not limited thereto. In any of the lens portions 62 and the corresponding photoelectric chip 4, the projection area is circular and has a diameter D62, the top light-emitting surface 41 of the photoelectric chip 4 has a maximum outer diameter D41, and the diameter D62 is 110% to 140% of the maximum outer diameter D41. Moreover, the distance H62 between the top of any of the lens portions 62 and the corresponding photoelectric chip 4 is 220% to 320% of the height H4 of the corresponding photoelectric chip 4.

[0071] It should be noted that the number of photoelectric chips 4 is described as multiple in this embodiment, but this application is not limited thereto. For example, in other embodiments not shown in this application, the number of photoelectric chips 4 may be at least one, and the lens layer 6 includes at least one lens portion 62 with a position corresponding to at least one of the photoelectric chips 4.

[0072] Accordingly, in this embodiment, the light emitter 100 is designed with a housing 3 of the same height as the photoelectric chip 4 and a lens layer 6, so that when the height of the back-end product using the light emitter 100 is limited, the light emission efficiency of the light emitter 100 in this embodiment can be better demonstrated.

[0073] [Example 3] Please see Figure 11 and Figure 12 As shown, this is Embodiment 3 of this application. Since this embodiment is similar to Embodiment 2 described above, the similarities between this embodiment and Embodiment 2 will not be repeated (e.g., the first conductive frame 1, the plurality of second conductive frames 2, the lens layer 6, and the plurality of photoelectric chips 4). The differences between this embodiment and the above embodiments are roughly explained as follows: In this embodiment, the entire top surface 10a of the first conductive frame 1 and the entire top surface 20a of any one of the second conductive frames 2 are exposed and coplanar with the top surface 30a of the housing 3, and the bottom surface 10b of the first conductive frame 1 and the bottom surface 20b of any one of the second conductive frames 2 are exposed and coplanar with the bottom surface 30b of the housing 3 (as in Embodiments 1 and 2). Accordingly, the first conductive frame 1, the plurality of second conductive frames 2, and the housing 3 in this embodiment constitute a flat plate structure (that is, the housing 3 does not have the receiving groove 31, and the light emitter 100 omits the filler 5), in order to reduce the volume and height occupied by the light emitter 100.

[0074] Furthermore, the lens layer 6 is disposed on the top surface 10a of the first conductive frame 1, the top surface 20a of the plurality of second conductive frames 2, and the top surface 30a of the housing 3, and the plurality of photoelectric chips 4 are embedded within the lens layer 6.

[0075] It should be noted that the number of photoelectric chips 4 is described as multiple in this embodiment, but this application is not limited thereto. For example, in other embodiments not shown in this application, the number of photoelectric chips 4 may be at least one, and at least one photoelectric chip 4 may be embedded within the lens layer 6.

[0076] [Example 4] Please see Figures 13 to 19 As shown, this is Embodiment 4 of this application. Since this embodiment is similar to Embodiment 2 described above, the similarities between this embodiment and Embodiment 2 will not be repeated (e.g., the housing 3, the filler 5, and the lens layer 6). The differences between this embodiment and the above embodiments are roughly explained as follows: like Figures 13 to 17 As shown, in this embodiment, the light emitter 100 includes four photoelectric chips 4, and the remaining structure of the light emitter 100 is adjusted accordingly to the number of photoelectric chips 4. For example, in this embodiment, the light emitter 100 is equivalent to replacing the third extension block 13 in Embodiment 1 with a first support 2a.

[0077] More specifically, such as Figures 14 to 16As shown, the first conductive frame 1 includes a die-bonding block 14, a first extension block 11, and a second extension block 12. In this embodiment, the die-bonding block 14 is generally rectangular, and the first extension block 11 and the second extension block 12 extend from opposite sides of the die-bonding block 14 (e.g., ...). Figure 15 The first extension block 11 and the second extension block 12 are preferably connected at two diagonally opposite corners of the die-bonding block 14.

[0078] Accordingly, the die-bonding block 14 of the first conductive frame 1 is fixed at the center of the housing 3, thereby laterally spanning the housing 3 (e.g.: Figure 14 The die-bonding block 14 extends from the left rear side to the right front side of the housing 3, while the first extension block 11 and the second extension block 12 are respectively fixed to two corners of the housing 3 located diagonally opposite each other, so that the first conductive frame 1 can cross the housing 3 diagonally (e.g.: Figure 14 and Figure 15 The first conductive frame 1 extends from the upper left corner to the lower right corner of the housing 3, thereby improving the overall structural stability.

[0079] Each of the second conductive frames 2 includes a plurality of first supports 2a and a plurality of second supports 2b respectively adjacent to opposite sides of the die-bonding block 14. The plurality of first supports 2a and the first extension block 11 are arranged in a first column, and the plurality of second supports 2b and the second extension block 12 are arranged in a second column, with the first column parallel to the second column. In this embodiment, the number of the plurality of first supports 2a and the number of the plurality of second supports 2b are each described as two, but this application is not limited thereto.

[0080] The first conductive frame 1 has a cross-shaped dividing groove 141 recessed in the die-bonding block 14 exposed in the receiving groove 31, so that the die-bonding block 14 exposed in the receiving groove 31 is divided into four sub-blocks 142a, 142b by the dividing groove 141. The dividing groove 141 extends from one of the opposite sides of the die-bonding block 14 to the other side, and the dividing groove 141 is filled with the housing 3.

[0081] Furthermore, each of the sub-blocks 142a and 142b has approximately the same area, and two of the four sub-blocks 142a and 142b are connected to the first extension block 11, while the other two of the four sub-blocks 142a and 142b are connected to the second extension block 12. Additionally, as... Figure 15As shown, the first extension block 11 has a first bonding area 113 exposed in the receiving groove 31, and the second extension block 12 has a second bonding area 123 exposed in the receiving groove 31, while each of the second conductive frames 2 has a bonding area 22 exposed in the receiving groove 31.

[0082] Multiple photoelectric chips 4 are respectively fixed to multiple sub-blocks 142a, 142b, and wire-connected to the first wire bonding area 113, the second wire bonding area 123, and multiple wire bonding areas 22. For example... Figure 14 and Figure 15 As shown, the four optoelectronic chips 4 in this embodiment include two green light-emitting diode chips, one red light-emitting diode chip, and one infrared light-emitting diode chip; wherein, the two green light-emitting diode chips are respectively fixed to two slightly larger sub-blocks 142a, and respectively wired to the first wire bonding area 113 and the second wire bonding area 123, and also respectively wired to two adjacent wire bonding areas 22; the red light-emitting diode chip and the infrared light-emitting diode chip are respectively fixed to two slightly smaller sub-blocks 142b, and respectively wired to the other two wire bonding areas 22.

[0083] Furthermore, in this embodiment, the lens layer 6 and the filler 5 can be as follows: Figure 13 and Figure 14 The diagram shows a single-piece, integrally formed structure; alternatively, the lens layer 6 and the filler 5 can also be as shown... Figure 18 and Figure 19 The diagram shows two independent components connected to each other. For example, the filler 5 can be a reflective adhesive material, which is disposed around the plurality of photoelectric chips 4 and exposes the top surface of the plurality of photoelectric chips 4. In this embodiment, the lens layer 6 contains four lens portions 62, each corresponding to one of the four photoelectric chips 4.

[0084] It should be further noted that the number of photoelectric chips 4 is described as multiple in this embodiment, but this application is not limited to this. For example, in other embodiments not shown in this application, the number of photoelectric chips 4 may be at least one, and the lens layer 6 includes at least one lens portion 62 with a position corresponding to at least one of the photoelectric chips 4. Furthermore, Figure 18 and Figure 19 The number and type of the photoelectric chip 4 can also be adjusted according to design requirements to the three photoelectric chips 4 described in Embodiment 1, with their top surfaces exposed outside the filler 5.

[0085] [Example 5] Please see Figures 20 to 22As shown, this is Embodiment 5 of this application. Since this embodiment is similar to Embodiments 1 to 4 described above, the similarities between this embodiment and Embodiments 1 to 4 will not be repeated. The differences between this embodiment and Embodiments 1 to 4 are roughly explained as follows: like Figure 20 and Figure 21 As shown, this embodiment discloses a light sensor 1000, particularly a reflective light sensor 1000, which includes a carrier 300 (e.g., a circuit board), and a light emitter 100 and a plurality of light receivers 200 disposed on the carrier 300. The light emitter 100 in this embodiment is generally similar to that in embodiments one to four above, and therefore will not be described again here. Each of the light receivers 200 is used to receive light emitted from the light emitter 100 and reflected. The light receiver 200 may include a photodiode chip.

[0086] More specifically, a plurality of optical receivers 200 are arranged at intervals from the optical transmitter 100, and the shape center of each optical receiver 200 is separated from the shape center of the optical transmitter 100 by a configuration distance D200. The configuration distances D200 corresponding to the plurality of optical receivers 200 are all equal, thereby effectively improving the signal-to-noise ratio (SNR) of the reflective optical sensor 1000.

[0087] In this embodiment, the number of the plurality of optical receivers 200 is further limited to at least four, and the shape center of any one of the optical receivers 200 is located on a circular configuration path C with the shape center of the optical transmitter 100 as the center and the configuration distance D200 as the radius. Furthermore, the shape centers of any two adjacent optical receivers 200 form a chord length C1 on the circular configuration path C, and the plurality of chord lengths C1 formed by at least four optical receivers 200 are all equal.

[0088] It should be noted that the number of optical receivers 200 is also described as multiple in this embodiment, but this application is not limited to this. For example, such as Figure 22 As shown, the number of light receivers 200 can be two. Alternatively, in other embodiments not shown in this application, the number of light receivers 200 can be at least one, and the shape center of at least one light receiver 200 is separated from the shape center of the light emitter 100 by the configuration distance D200, for receiving light emitted from and reflected by the light emitter 100.

[0089] [Technical Effects of the Embodiments in this Application] In summary, the light emitter and light sensor disclosed in this application solve the problems of cumbersome manufacturing processes and low product yield of existing optical sensors by employing a conductive frame. The light emitter disclosed in this application uses a first conductive frame combined with multiple second conductive frames as the conductive structure of the light emitter. The first extension block and the second extension block of the first conductive frame extend from opposite sides of the die-bonding block, allowing the first conductive frame to be stably connected to the housing. Furthermore, the die-bonding block of the first conductive frame is fixed at the center of the housing, thereby laterally spanning the housing, while the first extension block and the second extension block are respectively fixed at two diagonally opposite corners of the housing, allowing the first conductive frame to diagonally span the housing, thus improving the overall structural stability.

[0090] The content disclosed above is only a preferred and feasible embodiment of this application and is not intended to limit the patent scope of this application. Therefore, all equivalent technical changes made using the content of this application specification and drawings are included in the patent scope of this application.

Claims

1. A light emitter, characterized in that, The light emitter includes: A first conductive frame, which is a single-piece structure integrally formed and includes a die-bonding block; A plurality of second conductive frames, each comprising at least one wire bonding block, wherein the plurality of second conductive frames are spaced apart from the first conductive frame; A housing encloses a first conductive frame and a plurality of second conductive frames, wherein at least a portion of the top surface of the first conductive frame and at least a portion of the top surface of any one of the second conductive frames are exposed outside the housing to form the die-bonding block and the wire bonding block, and at least a portion of the bottom surface of the first conductive frame and at least a portion of the bottom surface of any one of the second conductive frames are exposed outside the housing for external electrical connection; and At least one optoelectronic chip is fixed to the die-bonding block of the first conductive frame and electrically coupled to at least one wire bonding block of the second conductive frame; The first conductive frame further includes a first extension block and a second extension block. The die-bonding block extends diagonally to connect the first extension block and the second extension block. The first extension block and the second extension block are respectively fixed at two corners of the housing located diagonally opposite each other.

2. The light emitter according to claim 1, characterized in that, The plurality of second conductive frames include at least one first support and at least one second support, the at least one first support being arranged in a first column and adjacent to the die bond block and the first extension block, and the at least one second support being arranged in a second column and adjacent to the die bond block and the second extension block.

3. The light emitter according to claim 2, characterized in that, The number of at least one first support and the number of at least one second support are each limited to a plurality, and the first column is parallel to the second column.

4. The light emitter according to claim 2, characterized in that, The first conductive frame includes a third extension block, and at least one of the first supports is located between the first extension block and the third extension block.

5. The light emitter according to claim 4, characterized in that, At least a portion of the top surface of the first conductive frame is recessed in the die-bonding block to form a T-shaped dividing groove, so that at least a portion of the top surface of the first conductive frame is divided into three sub-blocks by the dividing groove, and one of the three sub-blocks is connected to the first extension block, while the other two of the three sub-blocks are respectively connected to the second extension block and the third extension block.

6. The light emitter according to claim 1, characterized in that, At least a portion of the bottom portion of the first conductive frame contains a main welding surface, a first welding surface, and a second welding surface of the same polarity, the main welding surface being located in the die-bonding block, the first welding surface being located in the first extension block, and the second welding surface being located in the second extension block.

7. The light emitter according to claim 1, characterized in that, The light emitter includes a lens layer disposed on the housing, and the lens layer includes at least one lens portion positioned corresponding to at least one of the photoelectric chips; wherein at least one of the photoelectric chips is located within a projection area formed by the orthographic projection of at least one of the lens portions toward the top surface of the first conductive frame.

8. The light emitter according to claim 7, characterized in that, The projection area is circular and has a diameter, and at least one of the photoelectric chips has a maximum outer diameter, and the diameter is 110% to 140% of the maximum outer diameter.

9. The light emitter according to claim 8, characterized in that, A distance between the top of at least one of the lens portions and at least one of the photoelectric chips is 220% to 320% of the height of at least one of the photoelectric chips.

10. The light emitter according to claim 1, characterized in that, The housing surrounds and forms a receiving groove, and at least one of the photoelectric chips is located in the receiving groove; the light emitter includes a filler that fills the receiving groove, and at least a portion of at least one of the photoelectric chips is embedded in the filler.

11. The light emitter according to claim 1, characterized in that, The entire top surface of the first conductive frame and the entire top surface of any of the second conductive frames are exposed and coplanar with the top surface of the housing, and the light emitter includes a lens layer; the lens layer is disposed on the top surface of the first conductive frame, the top surfaces of the plurality of second conductive frames, and the top surface of the housing, and at least one of the photoelectric chips is embedded in the lens layer.

12. The light emitter according to claim 1, characterized in that, At least a portion of the top surface of the first conductive frame is recessed in the die-bonding block to form a partition groove, so that at least a portion of the top surface of the first conductive frame is divided into multiple sub-blocks by the partition groove; the number of at least one photoelectric chip is multiple and is respectively fixed to multiple sub-blocks.

13. The light emitter according to claim 12, characterized in that, The partition groove extends from one of the opposite sides of the die-bonding block to the other, and the partition groove is filled with the shell.

14. An optical sensor, characterized in that, The optical sensor includes: A light emitter according to any one of claims 1-13, comprising at least a first conductive frame, a plurality of second conductive frames, and a plurality of photoelectric chips, wherein the first conductive frame is a single-piece integral structure, the plurality of second conductive frames are spaced apart from the first conductive frame, and the plurality of photoelectric chips are respectively electrically coupled to the first conductive frame and the plurality of second conductive frames; and At least one optical receiver is disposed at a distance from the optical transmitter, and the shape center of at least one optical receiver is separated from the shape center of the optical transmitter by a configuration distance.

15. The optical sensor according to claim 14, characterized in that, The number of at least one optical receiver is further limited to at least four, and the shape center of any one of the optical receivers is located on a circular configuration path with the shape center of the optical transmitter as the center and the configuration distance as the radius.

16. The optical sensor according to claim 15, characterized in that, The shape centers of any two adjacent optical receivers form a chord length on the circular configuration path, and the plurality of chord lengths formed by at least four optical receivers are all equal.

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