Display device comprising an alignment pattern

Abstract

A display device is provided, the display device including: a substrate including a first component area in which a first transmissive portion is disposed, a second component area surrounding the first component area and in which a second transmissive portion is disposed, and a main display area surrounding at least a portion of the second component area; an insulating layer having a first transmissive hole corresponding to the first transmissive portion and a second transmissive hole corresponding to the second transmissive portion, the first transmissive hole and the second transmissive hole exposing an upper surface of the substrate; a plurality of display elements disposed on the insulating layer and corresponding to the first component area, the second component area, and the main display area; and an alignment pattern disposed on the substrate and superposed with the second transmissive hole, and configured to align a component with the second component area.

Description

[0001] This application is based on and claims priority to Korean Patent Application No. 10-2020-0107966, filed on August 26, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] One or more embodiments relate to a display device that includes an alignment pattern. Background Technology

[0003] Recently, the use of display devices has diversified. As display devices become thinner and lighter, their applications have been greatly expanded.

[0004] Various features and / or functions can be added to a display device by increasing the display area. Research has been conducted on developing display devices with component areas capable of performing various functions and displaying images.

[0005] In the component area, the transmissive portion may be equipped with display elements. In this case, light or sound can be transmitted through the transmissive portion to reach the component, or light or sound generated from the component can be transmitted through the transmissive portion and output to the outside. Summary of the Invention

[0006] One or more embodiments of this disclosure provide a display device in which component regions and components are precisely aligned with each other.

[0007] Additional aspects of this disclosure will be set forth in part in the description which follows, and in part will be apparent from the description, or may be learned by practice of embodiments of this disclosure.

[0008] According to one or more embodiments, a display device includes: a substrate including a first component region in which a first transmissive portion is disposed, a second component region surrounding the first component region and in which a second transmissive portion is disposed, and a main display region surrounding at least a portion of the second component region; an insulating layer having a first transmissive aperture corresponding to the first transmissive portion and a second transmissive aperture corresponding to the second transmissive portion, the first transmissive aperture and the second transmissive aperture exposing an upper surface of the substrate; a plurality of display elements disposed on the insulating layer and corresponding to the first component region, the second component region and the main display region; and an alignment pattern disposed on the substrate and superimposed on the second transmissive aperture, and configured to align the components with the second component region.

[0009] According to an embodiment, the insulating layer may include an inorganic insulating layer disposed on a substrate and an organic insulating layer disposed on the inorganic insulating layer, and the inorganic insulating layer may have a first hole exposing the alignment pattern in the second transmission portion.

[0010] According to an embodiment, the organic insulating layer may have a second hole connected to the first hole, and the second hole exposes the alignment pattern.

[0011] According to an embodiment, each of the plurality of display elements may include a pixel electrode and a counter electrode, the counter electrode may have a counter electrode hole connected to a second transmission aperture, and the counter electrode hole may expose an alignment pattern.

[0012] According to an embodiment, the display device may further include a thin-film transistor connected to each of a plurality of display elements. The thin-film transistor includes a semiconductor layer, the semiconductor layer including a channel region and a source region and a drain region disposed on the side of the channel region, wherein the alignment pattern may include the same material as at least one of the source region and the drain region.

[0013] According to an embodiment, the display device may further include: a thin-film transistor connected to each of a plurality of display elements, the thin-film transistor including a semiconductor layer comprising a channel region and a gate electrode superimposed on the channel region; and a storage capacitor including a lower electrode integrally disposed with the gate electrode and an upper electrode disposed on the lower electrode, wherein the alignment pattern may include the same material as one of the lower electrode and the upper electrode.

[0014] According to an embodiment, the display device may further include a thin-film transistor disposed on a substrate. The thin-film transistor includes: a semiconductor layer including a channel region and a source region and a drain region disposed on the side of the channel region; and a source electrode and a drain electrode respectively connected to the source region and the drain region. The insulating layer may include an inorganic insulating layer covering the semiconductor layer and an organic insulating layer disposed on the inorganic insulating layer. The source electrode and the drain electrode may be disposed between the inorganic insulating layer and the organic insulating layer. The alignment pattern may include the same material as one of the source electrode and the drain electrode.

[0015] According to an embodiment, each of the plurality of display elements may include a pixel electrode and a counter electrode, and the alignment pattern may include the same material as the pixel electrode.

[0016] According to an embodiment, the component may include: a lens superimposed on a first component region; and a module in which the lens is disposed, the module being superimposed on a second component region.

[0017] According to an embodiment, the module may include alignment marks superimposed on the alignment pattern.

[0018] According to an embodiment, the component may also include a sensor connected to the module and configured to detect the position of the alignment pattern.

[0019] According to an embodiment, the second transmissive portion may include a plurality of second transmissive portions in the second component region, wherein the insulating layer may have a plurality of second transmissive holes in the plurality of second transmissive portions respectively, and the alignment pattern may be superimposed on at least one of the plurality of second transmissive holes.

[0020] According to one or more embodiments, a display device includes: a substrate including a first component region in which a first transmissive portion is disposed, a second component region surrounding the first component region and in which a second transmissive portion is disposed, and a main display region surrounding at least a portion of the second component region, the second transmissive portion having a second transmittance different from a first transmittance of the first transmissive portion; an insulating layer disposed on the substrate and having a first transmissive aperture corresponding to the first transmissive portion and exposing a first portion of an upper surface of the substrate; and a plurality of display elements disposed on the insulating layer and corresponding to the first component region, the second component region, and the main display region, wherein the insulating layer includes an inorganic insulating layer and an organic insulating layer disposed on the inorganic insulating layer, and at least one of the inorganic insulating layer and the organic insulating layer has a second transmissive aperture exposing a second portion of the upper surface of the substrate in the second transmissive portion.

[0021] According to an embodiment, the inorganic insulating layer can be continuously arranged in the second transmission portion, and the organic insulating layer can have a second transmission hole in the second transmission portion.

[0022] According to an embodiment, the inorganic insulating layer may have a second transmission hole in the second transmission portion, and the organic insulating layer may be continuously arranged in the second transmission portion.

[0023] According to an embodiment, each of the inorganic insulating layer and the organic insulating layer may have a second transmission hole in the second transmission portion, wherein each of the plurality of display elements may include a pixel electrode and a counter electrode, the display device may further include a pixel defining layer covering the edge of the pixel electrode, and the pixel defining layer may have a third hole connected to the first transmission hole and may be continuously arranged in the second transmission portion.

[0024] According to an embodiment, each of the plurality of display elements may include a pixel electrode and a counter electrode, and the counter electrode may have a counter electrode hole connected to a first transmission hole and may be continuously arranged in a second transmission portion.

[0025] According to an embodiment, the display device may further include a component, wherein the component may include a lens superimposed on a first component region and a module in which the lens is disposed, and the module is superimposed on a second component region.

[0026] According to an embodiment, the display device may further include alignment marks superimposed on the second transmissive portion.

[0027] According to an embodiment, the component may further include a sensor connected to the module and configured to detect the position of the second transmission portion by utilizing the difference between the first transmittance of the first transmission portion and the second transmittance of the second transmission portion. Attached Figure Description

[0028] The above and other aspects, features, and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0029] Figure 1A This is a schematic perspective view of a display device according to an embodiment;

[0030] Figure 1B This is a schematic perspective view of a display device according to another embodiment;

[0031] Figure 2A , Figure 2B , Figure 2C and Figure 2D This is a schematic cross-sectional view of a portion of a display device according to an embodiment;

[0032] Figure 3 This is a schematic plan view of the display panel according to an embodiment;

[0033] Figure 4 This is an equivalent circuit diagram of the pixel circuit of the organic light-emitting diode connected to the display device according to an embodiment;

[0034] Figure 5A and Figure 5B This is a plan view of a portion of the display panel and a portion of the components according to an embodiment;

[0035] Figure 6 This is a schematic layout diagram of the pixel arrangement structure in the main display area according to an embodiment;

[0036] Figure 7A , Figure 7B and Figure 7C It is a schematic layout diagram of the pixel arrangement structure in the component area according to various embodiments;

[0037] Figure 8 , Figure 9 , Figure 10 , Figure 11 and Figure 12 This is a schematic cross-sectional view of a portion of a display panel according to various embodiments;

[0038] Figure 13 , Figure 14 , Figure 15 and Figure 16 It is a schematic cross-sectional view of a portion of a display panel according to various embodiments; and

[0039] Figure 17 This is a schematic cross-sectional view of a display panel and components according to another embodiment. Detailed Implementation

[0040] Referring now to various embodiments of this disclosure, examples of which are illustrated in the accompanying drawings, wherein the same reference numerals refer to the same elements throughout this disclosure. In this respect, embodiments disclosed herein may take different forms and should not be construed as limited to the description set forth herein. Therefore, embodiments are described below only with reference to the drawings to explain aspects of this disclosure. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, the expression “at least one of a, b, and c” means only a, only b, only c, both a and b, both a and c, both b and c, all a, b, and c, or any variation thereof.

[0041] This disclosure allows for various modifications and numerous embodiments, some of which will be shown in the accompanying drawings and described in the written description. The effects and features of this disclosure, as well as methods for achieving these effects and features, will be illustrated with reference to the embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the embodiments described below and can be embodied in various forms and configurations without departing from this disclosure.

[0042] One or more embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. Components that are identical or corresponding to each other may be denoted by the same reference numerals, independent of the drawings, and redundant descriptions may be omitted.

[0043] It will be understood that although the terms “first,” “second,” etc., may be used here to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

[0044] Unless the context clearly indicates otherwise, the singular forms such as “a,” “one,” and “the” used herein are intended to include the plural forms as well.

[0045] It will also be understood that the term “comprising” and / or variations thereof as used herein indicates the presence of the stated features or elements, but does not preclude the presence or addition of one or more other features or elements.

[0046] It will also be understood that when a layer, region, or component is referred to as being "on" another layer, region, or component, that layer, region, or component may be directly or indirectly on said other layer, region, or component. That is, for example, one or more intervening layers, regions, or components may exist therein.

[0047] For ease of illustration, the dimensions of the elements in the accompanying drawings may be exaggerated or reduced. Since the dimensions and thicknesses of the elements in the drawings are arbitrarily shown for ease of illustration, this disclosure is not limited to the embodiments disclosed herein.

[0048] When an embodiment can be implemented differently, a particular process sequence can be performed in a different order than that described. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of their description.

[0049] In the following embodiments, it will be understood that when a layer, region, or component is referred to as being "connected to" or "combined to" another layer, region, or component, the layer, region, or component may be directly or indirectly connected to or combined with the other layer, region, or component. That is, for example, intermediary layers, regions, or components may exist. For example, when multiple layers, regions, or elements are referred to as being "electrically connected," the multiple layers, regions, or elements may be directly electrically connected, or the multiple layers, regions, or elements may be indirectly electrically connected, and one or more intermediary portions may exist therein.

[0050] Examples of display devices for displaying images may include, but are not limited to, game consoles, multimedia devices, or portable mobile devices (such as ultra-small personal computers (PCs), laptop computers, and tablet PCs). Display devices can be classified as liquid crystal displays, electrophoretic displays, organic light-emitting displays, inorganic light-emitting displays, field emission displays, surface conduction electron emission displays, quantum dot displays, plasma displays, cathode ray displays, etc. In the following description, organic light-emitting display devices are used as examples of display devices according to embodiments; however, the various types of display devices described above may be used in other embodiments without departing from the scope of this disclosure.

[0051] Figure 1A This is a schematic perspective view of the display device 1 according to an embodiment. Figure 1B This is a schematic perspective view of a display device 1 according to another embodiment.

[0052] Reference Figure 1A The display device 1 may include a display panel 10. The display panel 10 may include a display area DA and a non-display area NDA.

[0053] The display area DA may include a main display area MDA and a component area CA. Both the main display area MDA and the component area CA can correspond to areas where images are displayed, and the component area CA can correspond to areas beneath which components (not shown), such as sensors using visible light, infrared light, or sound, are arranged. According to an embodiment, the component area CA may have a higher light transmittance than the main display area MDA and / or a higher sound transmittance than the main display area MDA. According to an embodiment, when light passes through the component area CA, the light transmittance of the component area CA may be, for example, about 25% or more, or about 30% or more, about 50% or more, about 75% or more, about 80% or more, about 85% or more, or about 90% or more.

[0054] A first pixel group PG1, comprising one or more first pixels, may be arranged in the main display area MDA. The first pixel group PG1 may include multiple display elements, such as multiple organic light-emitting diodes. The display panel 10 may use light emitted from the first pixel group PG1 to provide a first image.

[0055] According to an embodiment, at least a portion of the component region CA can be surrounded by the main display region MDA. As an example, Figure 1A The component area CA is shown to be completely surrounded by the main display area MDA.

[0056] According to an embodiment, the component region CA may have a circular or elliptical shape in a plan view of the display device 1 (e.g., an xy plane defined by the x and y directions). According to another embodiment, the component region CA may have a polygonal shape, such as a rectangle, in the plan view. According to another embodiment, the component region CA may include curved portions. Furthermore, the position and number of component regions CA may be varied without departing from the scope of this disclosure. For example, the display panel 10 may include multiple component regions CA.

[0057] A second pixel group PG2, comprising one or more second pixels, and a transmissive portion TA can be arranged in the component region CA. The second pixel group PG2 can emit light to provide a second image. The second pixel group PG2 may include multiple display elements, such as multiple organic light-emitting diodes. In this case, the first image and the second image may correspond to portions of any image provided by the display device 1 or the display panel 10. Alternatively, the first image and the second image may correspond to images that are independent of each other.

[0058] The transmissive portion TA can transmit light and / or sound output from the corresponding component to the outside or from the outside toward the component. In an embodiment, the display element may not be arranged in the transmissive portion TA. In this case, multiple transmissive portions TA can be arranged spaced apart from each other in the component region CA.

[0059] The non-display area NDA corresponds to an area where no image is provided, and pixel groups may not be arranged in the non-display area NDA. The non-display area NDA may surround at least a portion of the display area DA. According to an embodiment, the non-display area NDA may completely surround the display area DA. Drivers, etc., that provide electrical signals or power to the first pixel group PG1 and the second pixel group PG2 may be arranged in the non-display area NDA. The non-display area NDA may include pads (also referred to as "solder pads" or "solder pads") that can be electrically connected to electronic components, printed circuit boards, etc.

[0060] Reference Figure 1B The component area CA can be at least partially surrounded by the main display area MDA. Figure 1B The diagram shows the component region CA arranged in a strip shape on one side of the main display area MDA. However, in other embodiments, the component region CA may be arranged in a notch shape on one side of the main display area MDA. The following description will focus on the case where the component region CA is completely surrounded by the main display area MDA in a circular shape in the plan view.

[0061] Figure 2A , Figure 2B , Figure 2C and Figure 2D This is a schematic cross-sectional view of a portion of the display device 1 according to an embodiment.

[0062] Reference Figures 2A to 2D The display device 1 may include a display panel 10 and a component COMP arranged to be superimposed on the display panel 10. The display panel 10 may include a main display area MDA and a component area CA superimposed on the component COMP.

[0063] The display panel 10 may include a substrate 100, a display layer DISL, a touch sensing layer TSL, and an optical functional layer OFL disposed on the substrate 100, and a panel protection member PB disposed below the substrate 100. The display layer DISL may include a buffer layer 111, a pixel circuit layer PCL including thin-film transistors such as main thin-film transistors TFTm and auxiliary thin-film transistors TFTa, a display element layer EDL including organic light-emitting diodes as display elements, and other elements such as... Figure 2A The thin-film encapsulation layer TFEL shown is Figure 2B The encapsulation component ENCM of the encapsulation substrate ENS shown in the figure.

[0064] The main display area MDA and the component area CA may be defined on the substrate 100. That is, the substrate 100 may include the main display area MDA and the component area CA. The substrate 100 may include glass or polymeric resin, such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, or cellulose acetate propionate. The substrate 100 including the polymeric resin may be flexible, rollable, or bendable. The substrate 100 may have a multilayer structure, including a matrix layer (not shown) comprising the polymeric resin described above and a barrier layer (not shown).

[0065] The buffer layer 111 may be disposed on the substrate 100 and may reduce or prevent the penetration of foreign matter, moisture, or ambient air from beneath the substrate 100, and may provide a flat surface on the substrate 100. The buffer layer 111 may comprise inorganic materials, organic materials, or organic / inorganic composite materials such as oxides or nitrides, and may have a single-layer structure or a multilayer structure comprising at least one inorganic material and at least one organic material. According to some embodiments, the buffer layer 111 may comprise silicon oxide (SiO2) or silicon nitride (SiN). x ).

[0066] The main sub-pixel Pm may include a main thin-film transistor (TFTm) disposed in the display area DA of the display panel 10 and a main organic light-emitting diode (OLEDm) connected to the main thin-film transistor TFTm, and the auxiliary sub-pixel Pa may include an auxiliary thin-film transistor (TFTa) disposed in the component area CA and an auxiliary organic light-emitting diode (OLEDa) connected to the auxiliary thin-film transistor TFTa. The main sub-pixel Pm may correspond to Figure 1A A portion of the first pixel group PG1, and the auxiliary sub-pixel Pa can correspond to Figure 1A It is part of the second pixel group PG2.

[0067] The transmissive portion TA, where no display element is located, can be arranged within the component area CA. The transmissive portion TA can correspond to the area through which light or signals emitted from the component COMP or incident on the component COMP have been transmitted.

[0068] A bottom metal layer (BML) can be disposed in the component region CA. The bottom metal layer BML can be disposed below the auxiliary thin-film transistor (TFTa). The bottom metal layer BML can prevent external light from reaching the auxiliary thin-film transistor (TFTa). According to some embodiments, a static voltage or signal is applied to the bottom metal layer BML to prevent pixel circuitry (e.g., the pixel circuitry of the auxiliary thin-film transistor (TFTa)) from being damaged by electrostatic discharge. Multiple bottom metal layers BML can be disposed in the component region CA. In some cases, different voltages can be applied to the bottom metal layers BML. According to one embodiment, a bottom metal layer BML having an aperture corresponding to the transmission portion TA can be disposed in the component region CA.

[0069] The display element layer (EDL) can be covered by a thin-film encapsulation layer (TFEL) or a packaging substrate (ENS). The TFEL can include at least one inorganic encapsulation layer and at least one organic encapsulation layer. According to... Figure 2A In the embodiment shown, the thin-film encapsulation layer TFEL may include a first inorganic encapsulation layer 131, an organic encapsulation layer 132, and a second inorganic encapsulation layer 133.

[0070] according to Figure 2B In the embodiment shown, the encapsulation substrate ENS can be arranged facing the substrate 100, and the display element layer EDL is placed between the encapsulation substrate ENS and the substrate 100. A gap may exist between the encapsulation substrate ENS and the display element layer EDL. The encapsulation substrate ENS may include glass. A sealant including glass frit may be disposed between the substrate 100 and the encapsulation substrate ENS, and the sealant may be disposed on... Figure 1A The non-display area NDA of the display panel 10 shown is included. A sealant disposed in the non-display area NDA can surround the display area DA and prevent moisture from penetrating through the side surfaces of the substrate 100. According to some embodiments, Figure 2A TFEL thin film encapsulation layer and Figure 2B The encapsulation substrate ENS and the two can be arranged simultaneously.

[0071] A touch sensing layer (TSL) can sense coordinate information based on external input (e.g., touch events). A TSL may include touch electrodes and touch lines connected to the touch electrodes. A TSL can use various sensing methods (e.g., but not limited to self-capacitance or mutual capacitance methods) to sense external input.

[0072] The touch sensing layer TSL can be disposed on the thin-film encapsulation layer TFEL. Alternatively, the touch sensing layer TSL can be formed separately on a touch substrate (not shown) and bonded to the thin-film encapsulation layer TFEL using an adhesive layer such as an optically clear adhesive (OCA). According to an embodiment, such as... Figures 2A to 2DAs shown, the touch sensing layer TSL can be directly disposed on the thin-film encapsulation layer TFEL. In this case, the adhesive layer may not be disposed between the touch sensing layer TSL and the thin-film encapsulation layer TFEL.

[0073] The optical functional layer OFL may include an anti-reflective layer. The anti-reflective layer can reduce the reflectivity of light (e.g., external light) incident on the display device 1 from the outside.

[0074] According to some embodiments, the optical functional layer OFL may include a polarizing film. The optical functional layer OFL may include an opening OFL_OP corresponding to the transmission portion TA. Therefore, the light transmittance of the transmission portion TA can be significantly improved. The opening OFL_OP corresponding to the transmission portion TA can be filled with a transparent material such as optically transparent resin (OCR).

[0075] According to one embodiment, such as Figure 2C As shown, the optical functional layer OFL may include a filter plate 180 containing a black matrix and one or more color filters. For example, the filter plate 180 may include a substrate layer 181 and a plurality of color filters 182, a black matrix 183 and an outer coating layer 184 disposed on the substrate layer 181.

[0076] The color filter 182 can be arranged based on the color of the light emitted from the corresponding pixel of the display panel 10. For example, the color filter 182 can include a red color filter, a green color filter, or a blue color filter depending on the color of the light emitted from the organic light-emitting diodes OLEDm and OLEDa. The color filter 182 and the black matrix 183 may not be arranged in the transmissive portion TA. For example, the layer including the color filter 182 and the black matrix 183 may include an opening 183OP corresponding to the transmissive portion TA. A portion of the outer coating 184 may at least partially fill the opening 183OP. The outer coating 184 may include an organic material such as resin, and the organic material may be transparent.

[0077] According to some embodiments, component COMP can be attached to the lower part of display panel 10. For example... Figure 2D As shown, the panel protection component PB may include a protective layer PY, a light-blocking layer LBY, a padding layer (buffer layer) CY, and a heat dissipation layer HSY. The protective layer PY may be attached to the lower surface of the substrate 100 and may protect the substrate 100 from external influences. For example, the protective layer PY may absorb physical impacts from the outside or may prevent foreign objects or moisture from penetrating into the display layer DISL. The protective layer PY may be coated on the lower surface of the substrate 100 or may be attached to the lower surface of the substrate 100 in the form of a film.

[0078] According to embodiments, the protective layer PY may include a material that blocks ultraviolet (UV) radiation. For example, the protective layer PY may include a matrix resin, a UV absorber, and inorganic particles. The UV absorber and inorganic particles may be dispersed in the matrix resin. The matrix resin may include an acrylate resin, such as a polyurethane acrylate. However, this disclosure is not limited thereto, and without departing from the scope of this disclosure, the protective layer PY may include an optically transparent matrix resin capable of dispersing the UV absorber and inorganic particles.

[0079] For example, UV absorbers may include at least one compound selected from benzotriazole compounds, benzophenone compounds, salicylic acid compounds, salicylate (salt) compounds, cyanoacrylate (salt) compounds, cinnamic acid (salt) compounds, oxaloyl aniline compounds, polystyrene compounds, methylimine compounds, and triazine compounds.

[0080] The light-blocking layer LBY can be disposed beneath the protective layer PY, and the padding layer CY can be disposed beneath the light-blocking layer LBY. The light-blocking layer LBY may include an adhesive between the protective layer PY and the padding layer CY. Additionally, the light-blocking layer LBY can be provided as a black layer capable of absorbing external light. Thus, the light-blocking layer LBY may include various materials capable of absorbing external light.

[0081] The padding layer CY can be attached to the lower surface of the light-blocking layer LBY and can protect the display panel 10 from the outside. The padding layer CY can include an elastic material, such as sponge or rubber.

[0082] The heat dissipation layer HSY can be disposed below the padding layer CY. The heat dissipation layer HSY may include a first heat dissipation layer and a second heat dissipation layer. The first heat dissipation layer includes graphite or carbon nanotubes, and the second heat dissipation layer is capable of shielding electromagnetic waves and includes a thin metal film with excellent thermal conductivity, such as copper, nickel, ferrite, or silver.

[0083] The panel protection component PB may include an opening PB_OP corresponding to the component region CA, and the component COMP may be arranged to at least partially overlap with the opening PB_OP.

[0084] The component COMP can be mounted on the package COMPSP, and the package COMPSP can be attached to the lower surface of the substrate 100 via adhesive members COMPRS. The package COMPSP may include control circuitry electrically connected to the component COMP.

[0085] According to an embodiment, an optically transparent resin OCR can be filled between the component COMP and the lower surface of the substrate 100. The optically transparent resin OCR has optical transparency and can minimize the loss of light incident on the component COMP.

[0086] The adhesive components COMPRS can secure the package COMPSP to the lower surface of the substrate 100. The adhesive components COMPRS may include resin. After the resin is arranged to contact the package COMPSP and the lower surface of the substrate 100, a UV curing operation can be performed. The adhesive components COMPRS may include light-absorbing materials.

[0087] Alternatively, according to some embodiments, such as Figures 2A to 2C As shown, the COMP component can be arranged spaced apart from the display panel 10. In this case, the COMP component can be attached and fixed to the lower cover of the display device 1, etc.

[0088] Component COMP may include electronic elements that use light or sound. For example, electronic elements may include sensors that measure distance (e.g., proximity sensors), biometric sensors that identify parts of a user's body (e.g., fingerprints, irises, faces, etc.), small lights that output light, image sensors that capture images (e.g., cameras), etc. Electronic elements using light can use light of various wavelengths, such as visible light, infrared light, or ultraviolet light. Electronic elements using sound can use ultrasound or sound of various frequency bands.

[0089] According to some embodiments, a component COMP may include sub-components such as a light-emitting portion and a light-receiving portion. The light-emitting portion and the light-receiving portion may have an integrated structure or a physically separate structure, and a pair of light-emitting portions and light-receiving portions may constitute a component COMP.

[0090] Figure 3 This is a schematic plan view of the display panel 10 according to an embodiment.

[0091] Reference Figure 3 The display panel 10 may include a plurality of pixel groups on a substrate 100. The substrate 100 may include a display area DA and a non-display area NDA, and the display area DA may include a main display area MDA and a component area CA. In this embodiment, the component area CA is completely surrounded by the main display area MDA, but it should be noted that this disclosure is not limited thereto.

[0092] One or more first pixel groups PG1 can be arranged in the main display area MDA, and one or more second pixel groups PG2 and the transmissive portion TA can be arranged in the component area CA.

[0093] The first pixel group PG1 can be arranged in two dimensions in the main display area MDA, and the second pixel group PG2 and the transmissive portion TA can be arranged in two dimensions in the component area CA.

[0094] The primary sub-pixel Pm of the first pixel group PG1 (see...) Figure 6) and the auxiliary sub-pixel Pa of the second pixel group PG2 (see Figure 7A Each of the components can use an organic light-emitting diode (OLED) to emit light of a specific color. Each OLED can emit, for example, red, green, or blue light. Each OLED can be connected to a corresponding pixel circuit (not shown) that includes a thin-film transistor and a storage capacitor.

[0095] The non-display area NDA can completely surround the display area DA. Scan drivers (not shown) and / or data drivers (not shown), etc., can be arranged in the non-display area NDA. A pad portion 230 can be arranged in the non-display area NDA. The pad portion 230 can be arranged adjacent to one edge of the substrate 100. The pad portion 230 can be exposed without being covered by an insulating layer (not shown) and can be electrically connected to a flexible printed circuit board (FPCB). The flexible printed circuit board (FPCB) can electrically connect a controller (not shown) to the pad portion 230 and can supply signals and / or power transmitted from the controller. According to some embodiments, the data driver can be arranged on the flexible printed circuit board (FPCB). To transmit signals or voltages from the flexible printed circuit board (FPCB) to the first pixel group PG1 and the second pixel group PG2, the pad portion 230 can be connected to multiple lines (not shown).

[0096] Figure 4 This is an equivalent circuit diagram of the pixel circuit PC of the organic light-emitting diode OLED connected to the display device 1 according to an embodiment.

[0097] Reference Figure 4 Organic light-emitting diodes (OLEDs) can be electrically connected to pixel circuits (PCs). Pixel circuits (PCs) can include driving thin-film transistors (TFTs) T1, switching TFTs T2, and storage capacitors Cst.

[0098] The switching thin-film transistor T2 can be connected to the scan line SL and the data line DL, and can be configured to transmit the data voltage or data signal Dm input from the data line DL to the driving thin-film transistor T1 according to the switching voltage or switching signal Sn input from the scan line SL. The storage capacitor Cst can be connected to the switching thin-film transistor T2 and the driving voltage line PL, and can be configured to store the voltage corresponding to the difference between the voltage transmitted from the switching thin-film transistor T2 and the first power supply voltage ELVDD (also referred to as the driving voltage) supplied to the driving voltage line PL.

[0099] The driving thin-film transistor T1 can be connected to the driving voltage line PL and the storage capacitor Cst, and can be configured to control the driving current flowing from the driving voltage line PL to the organic light-emitting diode (OLED) based on the voltage stored in the storage capacitor Cst. The OLED can emit light with a certain brightness according to the driving current. The counter electrode (e.g., cathode) of the OLED can be configured to receive a second power supply voltage ELVSS.

[0100] although Figure 4 The pixel circuit PC shown includes two thin-film transistors T1 and T2 and a storage capacitor Cst. However, without departing from the scope of this disclosure, the number of thin-film transistors and the number of storage capacitors can be varied depending on the design of the pixel circuit PC. For example, the pixel circuit PC may include three or more thin-film transistors.

[0101] Figure 5A and Figure 5B This is a plan view of a portion of the display panel 10 and a portion of the component COMP according to an embodiment.

[0102] Reference Figure 5A and Figure 5B The display device 1 may include a display panel 10 and a component COMP beneath the display panel 10. The display panel 10 includes pixel groups on a substrate 100. The substrate 100 may include a display area DA and a non-display area NDA, and the display area DA may include a main display area MDA and a component area CA. A first pixel group PG1 may be arranged in the main display area MDA, and a second pixel group PG2 and a transmissive portion TA may be arranged in the component area CA. A plurality of transmissive portions TA may be arranged in the component area CA. The second pixel group PG2 and the transmissive portion TA may be arranged alternately in the x-direction and / or y-direction, and may be arranged in, for example, a grid shape. A plurality of second pixel groups PG2 and a plurality of transmissive portions TA may be arranged in the component area CA.

[0103] In this embodiment, component COMP may include lens COMPL and module COMPM. External light can be incident on component COMP through lens COMPL, and light emitted from component COMP can be transmitted through lens COMPL. Specifically, light transmitted through the transmission portion TA can be incident on lens COMPL of component COMP, and light emitted from component COMP can be transmitted through lens COMPL and transmission portion TA of component COMP.

[0104] The lens COMPL can be arranged within the module COMPM. The module COMPM can surround the lens COMPL. The module COMPM can correspond to the remaining portion of the component COMP connected to the lens COMPL. For example, the module COMPM can include a frame. For example, the frame can have a hollow cylindrical shape. The lens COMPL can be connected to the frame. In this case, light transmitted through the lens COMPL can also be transmitted through the frame. Additionally, the module COMPM can include a charge-coupled device (CCD) sensor. The CCD sensor can include multiple diodes (not shown), and light transmitted through the frame can reach the diodes of the CCD sensor.

[0105] The component area CA may include a first component area CA1 and a second component area CA2. The second component area CA2 may surround the first component area CA1. For example, the second component area CA2 may be arranged between the first component area CA1 and the main display area MDA.

[0106] In this embodiment, the first component region CA1 can be superimposed on the lens COMP. The first component region CA1 can correspond to the region superimposed on the lens COMP. The first component region CA1 can include a first transmissive portion TA1, and light transmitted through the first transmissive portion TA1 can pass through the lens COMP and be transmitted to the component COMP. In addition, the second pixel group PG2 can be arranged in the first component region CA1.

[0107] According to an embodiment, at least a portion of the second component region CA2 may be surrounded by the main display region MDA. For example, the second component region CA2 may be completely surrounded by the main display region MDA.

[0108] The second component region CA2 may be at least partially superimposed on the module COMP. The second component region CA2 may correspond to the portion of component region CA that is not superimposed on the lens COMP. The second component region CA2 may include a second transmissive portion TA2. Additionally, a second pixel group PG2 may be arranged within the second component region CA2. According to some embodiments, the second pixel group PG2 may be superimposed on both the first component region CA1 and the second component region CA2. That is, the second pixel group PG2 within the second pixel group PG2 that is superimposed on the outer periphery of the lens COMP may be superimposed on both the first component region CA1 and the second component region CA2. Similarly, some transmissive portions TA may be superimposed on the outer periphery of the lens COMP, and these transmissive portions TA may be superimposed on both the first component region CA1 and the second component region CA2.

[0109] In this embodiment, a plurality of second transmission portions TA2 can be disposed in the second component region CA2. In this case, alignment patterns AP can be arranged in at least some of the second transmission portions TA2. According to an embodiment, one or more alignment patterns AP can be arranged in the second transmission portions TA2. As an example, Figure 5A and Figure 5B Four alignment patterns AP are shown arranged in the second transmission portion TA2, but in other embodiments, two or three alignment patterns AP may be arranged in the second transmission portion TA2, or five or more alignment patterns AP may be arranged in the second transmission portion TA2.

[0110] According to an embodiment, the alignment patterns AP can be arranged symmetrically around the first component region CA1. For example, the alignment patterns AP can be arranged in a second component region CA2, spaced apart from each other in the x and / or y directions, with the first component region CA1 positioned therebetween. Alternatively, according to another embodiment, the alignment patterns AP can form a virtual polygon when their centers are connected to each other. In this case, the center of the polygon can substantially coincide with the center of the first component region CA1. For example, connecting... Figure 5A and Figure 5B The virtual line segments of the virtual polygon aligned with the center of the pattern AP can form a rhombus, and the center of the rhombus can substantially coincide with the center of the first component area CA1.

[0111] Alignment patterns (APs) can have various shapes. For example, an alignment pattern AP can be cross-shaped. As another example, an alignment pattern AP can be polygonal, circular, or elliptical.

[0112] In this embodiment, the transmissive portion TA and the second pixel group PG2 can be arranged in the component region CA, and light or sound can pass through the transmissive portion TA and be incident on the component COMP or emitted from the component COMP through the transmissive portion TA. Additionally, in this embodiment, the alignment pattern AP can be arranged in the second transmissive portion TA2, and the component COMP can be aligned with the component region CA relative to the alignment pattern AP. Specifically, the component COMP can be aligned with the second component region CA2 relative to the alignment pattern AP.

[0113] According to some embodiments, the alignment pattern AP can be arranged in the first transmissive portion TA1 of the first component region CA1. Hereinafter, the case where the alignment pattern AP is arranged in the second transmissive portion TA2 of the second component region CA2 will be described in detail.

[0114] Reference Figure 5AThe component region CA and component COMP can be aligned with each other relative to the outer periphery of lens COMP and the alignment pattern AP arranged in the second transmission section TA2.

[0115] Optionally, refer to Figure 5B The COMPM module may include one or more alignment marks AM. For example, the alignment marks AM may be arranged on the frame of the COMPM module. In this case, similar to the alignment pattern AP, the alignment marks AM may have various shapes. According to an embodiment, the alignment marks AM may be superimposed on the alignment pattern AP. In this case, the component region CA and the component COMP may be aligned with each other relative to the alignment pattern AP and the alignment marks AM of the COMPM module arranged in the second transmission portion TA2.

[0116] The alignment pattern AP arranged in the second transmission section TA2 can be used to precisely align the component region CA and the component COMP. For example, in cases where the component COMP includes a CCD sensor and the component region CA and the component COMP are not precisely aligned with each other, the number of diodes stacked with the transmission section TA may be uneven. In this case, even if the amount of light transmitted through each transmission section TA is uniform, the amount of light reaching a diode for each transmission section TA may be different. In this embodiment, the alignment pattern AP can be arranged in at least one of the second transmission sections TA2 to precisely align the component region CA with the component COMP. Therefore, the same number of diodes can be stacked in each transmission section TA to provide a uniform amount of light reaching one or more diodes in each transmission section TA.

[0117] According to an embodiment, the second pixel group PG2 and the transmissive portion TA are alternately arranged in the component region CA in the x and / or y directions, and diffraction may occur in each transmissive portion TA. In this embodiment, the component region CA and the component COMP are precisely aligned with each other, such that the same number of diodes can be stacked in each transmissive portion TA. Therefore, even if uniform light can pass through each transmissive portion TA to produce diffraction, the same number of diodes stacked in each transmissive portion TA can sense the same diffraction phenomenon. Therefore, because the same number of diodes are stacked in each transmissive portion TA, the diffraction phenomenon can be corrected equally.

[0118] The alignment pattern AP can be a reference point used to align component regions CA and component COMP to minimize diffraction. For example, the relative positions of component regions CA and component COMP can be changed based on the alignment pattern AP, and the relative arrangement of component regions CA and component COMP with respect to the alignment pattern AP can be set to minimize diffraction.

[0119] In addition, when the focal length of the lens COMP changes, the alignment pattern AP can still be used as a reference point to align the component region CA and the component COMP, so as to set the relative position of the component region CA and the component COMP, thereby minimizing the diffraction phenomenon that may be caused by the change in the focal length of the lens COMP.

[0120] Therefore, even if the second pixel group PG2 and the transmissive portion TA are alternately arranged in the component region CA, diffraction phenomena occurring in the transmissive portion TA can be minimized. Furthermore, when the component COMP is a CCD sensor or a camera, image quality degradation of the camera can be minimized.

[0121] According to an embodiment, the alignment pattern AP may comprise the same material as the semiconductor layer or electrode of the thin-film transistor connected to the display element. Alternatively, in the case where the display element is an organic light-emitting diode, the alignment pattern AP may comprise the same material as the pixel electrode. This will be referred to below. Figures 8 to 12 Further detailed description.

[0122] According to another embodiment, similar to the alignment pattern AP, an alignment reference can be set as a reference point in at least one of the second transmissive portions TA2 in the second component region CA2. For example, the stacking structure of the elements constituting at least one of the second transmissive portions TA2 can be different from the stacking structure of the elements constituting the first transmissive portion TA1. Because the transmittance of at least one of the second transmissive portions TA2 is different from that of the first transmissive portion TA1 due to the difference in their stacking structures, at least one of the second transmissive portions TA2 can be used as a reference point like the alignment pattern AP. This will be referred to below. Figures 13 to 16 Description. First, refer to Figure 6 and Figures 7A to 7C Describe in detail the pixel arrangement structure in the main display area MDA and the component area CA.

[0123] Figure 6 This is a schematic layout diagram of the pixel arrangement structure in the main display area MDA according to an embodiment.

[0124] Reference Figure 6 The first pixel group PG1 can be arranged in the main display area MDA. The first pixel group PG1 can correspond to a subpixel assembly in which multiple main subpixels Pm are grouped into a predetermined unit. As used herein, a subpixel can refer to an emitting region as the smallest unit for realizing an image. When an organic light-emitting diode is used as a display element, the emitting region can correspond to an opening in the pixel-defining layer.

[0125] According to an embodiment, the first pixel group PG1 may include 32 principal sub-pixels Pm arranged in a PenTile structure. For example, a first pixel group PG1 may include eight red sub-pixels Pr, sixteen green sub-pixels Pg, and eight blue sub-pixels Pb. The red sub-pixels Pr, green sub-pixels Pg, and blue sub-pixels Pb can represent red, green, and blue, respectively.

[0126] Multiple red subpixels Pr and multiple blue subpixels Pb can be arranged alternately in the first row 1N. Multiple green subpixels Pg can be arranged in the second row 2N adjacent to the first row 1N, spaced apart from each other. Multiple blue subpixels Pb and multiple red subpixels Pr can be arranged alternately in the third row 3N adjacent to the second row 2N. Multiple green subpixels Pg can be arranged in the fourth row 4N adjacent to the third row 3N, spaced apart from each other. This pixel arrangement in the pixel rows can be repeated up to the Nth row. In this case, the blue subpixels Pb and red subpixels Pr can have a larger size than the green subpixels Pg.

[0127] The red subpixels Pr and Pb arranged in the first row 1N and the green subpixels Pg arranged in the second row 2N can be arranged alternately. For example, the red subpixels Pr and Pb can be arranged alternately in the first column 1M, and the green subpixels Pg can be arranged in the second column 2M adjacent to the first column 1M, spaced apart from each other. The blue subpixels Pb and Pr can be arranged alternately in the third column 3M adjacent to the second column 2M. The green subpixels Pg can be arranged in the fourth column 4M adjacent to the third column 3M, spaced apart from each other. This pixel arrangement in the pixel column can be repeated up to the Mth column.

[0128] The pixel arrangement structure can be expressed differently. For example, the red sub-pixel Pr is arranged at the first and third vertices facing each other in the virtual rectangle VS, and the blue sub-pixel Pb is arranged at the second and fourth vertices facing each other. The virtual rectangle VS has a green sub-pixel Pg at its center point. In this case, the virtual rectangle VS can have various shapes, such as rectangles, rhombuses, and squares.

[0129] Figure 6 The pixel arrangement structure or pattern shown is called a PenTile matrix structure or PenTile structure. High resolution can be achieved using a small number of pixels by applying a rendering method where the colors of pixels are represented by sharing the colors of their neighboring pixels.

[0130] although Figure 6The illustration shows the principal sub-pixels Pm arranged in a PenTile matrix structure, but this disclosure is not limited thereto. For example, the principal sub-pixels Pm can be arranged in various shapes such as a stripe structure, a mosaic arrangement structure, or a triangular arrangement structure.

[0131] Figures 7A to 7C This is a schematic layout diagram of the pixel arrangement structure in the component region CA according to various embodiments.

[0132] Reference Figure 7A A second pixel group PG2, including at least one auxiliary sub-pixel Pa, and a transmissive portion TA can be arranged in the component region CA. The second pixel group PG2 and the transmissive portion TA can be arranged alternately in the x-direction and / or y-direction, and can be arranged in, for example, a grid shape. Multiple second pixel groups PG2 and multiple transmissive portions TA can be arranged in the component region CA.

[0133] The second pixel group PG2 can refer to a subpixel component in which multiple auxiliary subpixels Pa are grouped into preset units. For example, as... Figure 7A As shown, a second pixel group PG2 may include eight auxiliary sub-pixels Pa arranged in a PenTile structure. That is, a second pixel group PG2 may include two red sub-pixels Pr, four green sub-pixels Pg, and two blue sub-pixels Pb.

[0134] In the component region CA, basic units U, in which a certain number of second pixel groups PG2 and a certain number of transmissive portions TA are grouped, can be repeatedly arranged in the x and / or y directions. Figure 7A In this context, the basic unit U may include two second pixel groups PG2 grouped in a square shape and two transmissive portions TA arranged around them. The basic unit U may correspond to a division of repeating shapes and does not necessarily imply a break in the structure.

[0135] Reference Figure 6 and Figure 7A The basic unit U' corresponding to the basic unit U of the component area CA can be set in the main display area MDA. The number of main sub-pixels Pm included in the basic unit U' of the main display area MDA can be greater than the number of auxiliary sub-pixels Pa included in the basic unit U of the component area CA. For example, the number of auxiliary sub-pixels Pa included in the basic unit U is 16, and the number of main sub-pixels Pm included in the basic unit U' is 32. Therefore, the ratio of the number of auxiliary sub-pixels Pa to the number of main sub-pixels Pm arranged per unit area can be 1:2.

[0136] like Figure 7AThe arrangement structure of the auxiliary sub-pixels Pa shown is a PenTile structure. A pixel arrangement structure in the component region CA with half the resolution of the main display region MDA can be called a semi-PenTile structure. The number or arrangement of auxiliary sub-pixels Pa included in the second pixel group PG2 can be modified and designed according to the resolution of the component region CA. For example, only one second pixel group PG2 can be included in the basic unit U, and the remaining area of ​​the basic unit U can be set as the transmissive portion TA. In this case, the ratio of the number of auxiliary sub-pixels Pa to the number of main sub-pixels Pm arranged per unit area can be 1:4.

[0137] Reference Figure 7B The pixel arrangement structure of the component region CA can be set in an S-stripe structure. In this embodiment, each of the auxiliary sub-pixels Pa included in a second pixel group PG2 can include a total of three auxiliary sub-pixels Pa, namely, a red sub-pixel Pr, a green sub-pixel Pg, and a blue sub-pixel Pb.

[0138] Red subpixels Pr and green subpixels Pg can be arranged alternately in the first column 1I, and blue subpixels Pb can be arranged in the second column 2I adjacent to the first column 1I. Red subpixels Pr and green subpixels Pg can be rectangular in shape with their longer sides in the x-direction, and blue subpixels Pb can be rectangular in shape with their longer sides in the y-direction. The length of blue subpixel Pb in the y-direction can be equal to or greater than the sum of the lengths of red subpixels Pr and green subpixels Pg in the y-direction.

[0139] In this embodiment, the area occupied by a second pixel group PG2 in the basic unit U can be about one-quarter of the area of ​​the basic unit U. Figure 7B The illustration shows that the basic unit U includes only one second pixel group PG2, but in another embodiment, the basic unit U may include two or more second pixel groups PG2. Furthermore, the area of ​​the auxiliary sub-pixels Pa included in the second pixel group PG2 and / or the position of the second pixel group PG2 within the basic unit U can be varied.

[0140] Reference Figure 7C The pixel arrangement structure of the component region CA can be set as a stripe structure. Each of the auxiliary sub-pixels Pa included in a second pixel group PG2 can include a red sub-pixel Pr, a green sub-pixel Pg, and a blue sub-pixel Pb. The red sub-pixel Pr, green sub-pixel Pg, and blue sub-pixel Pb can be arranged side by side in the x-direction. Each of the red sub-pixel Pr, green sub-pixel Pg, and blue sub-pixel Pb can have a long side in the y-direction.

[0141] Optionally, with Figure 7C The pixel arrangement shown is different; the red sub-pixel Pr, green sub-pixel Pg, and blue sub-pixel Pb can be arranged side-by-side in the y-direction. In this case, each of the red sub-pixel Pr, green sub-pixel Pg, and blue sub-pixel Pb can have a long side in the x-direction.

[0142] According to some embodiments, a first pixel group PG1 and a second pixel group PG2 with different pixel arrangement structures can be arranged in the main display area MDA and the component area CA, respectively. For example, refer to the above Figures 7A to 7C The described pixel arrangement structure can be applied to a first pixel group PG1 and a second pixel group PG2. For example, the principal sub-pixels Pm of the first pixel group PG1 can be arranged in a PenTile structure, and the auxiliary sub-pixels Pa of the second pixel group PG2 can be arranged in a stripe structure. At least one of the first pixel group PG1 and the second pixel group PG2 can be arranged as described above. Figure 5A The alignment pattern AP described is used as a reference point to align component regions CA and component COMP with each other.

[0143] Figures 8 to 12 This is a schematic cross-sectional view of a portion of the display panel 10 according to various embodiments. Figure 8 This is a schematic cross-sectional view of the main display area MDA and the component area CA. Figures 9 to 12 This is a schematic cross-sectional view of the first component region CA1 and the second component region CA2. In the second transmission portion TA2, an alignment pattern AP can be arranged within the second transmission portion TA2 located in the second component region CA2.

[0144] Reference Figure 8 The display panel 10 may include a main display area MDA and a component area CA. A main sub-pixel Pm may be arranged in the main display area MDA, and an auxiliary sub-pixel Pa may be arranged in the component area CA. A first transmissive portion TA1 may be arranged in the first component area CA1, and a second transmissive portion TA2 may be arranged in the second component area CA2.

[0145] A main pixel circuit PCm, including a main thin-film transistor (TFTm) and a main storage capacitor Cstm, and a main organic light-emitting diode (OLEDm) serving as a display element connected to the main pixel circuit PCm, can be arranged in the main display area MDA. An auxiliary pixel circuit PCa, including an auxiliary thin-film transistor (TFTa) and an auxiliary storage capacitor Csta, and an auxiliary organic light-emitting diode (OLEDa) serving as a display element connected to the auxiliary pixel circuit PCa, can be arranged in the component area CA.

[0146] The structure in which the components included in the display panel 10 are stacked will be described below. The display panel 10 can be provided by stacking a substrate 100, a buffer layer 111, a pixel circuit layer PCL, and a display element layer EDL.

[0147] The substrate 100 may comprise glass or a polymeric resin, such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, or cellulose acetate propionate. The substrate 100 comprising the polymeric resin may be flexible, rollable, or bendable. The substrate 100 may have a multilayer structure comprising a matrix layer (not shown) containing the polymeric resin described above and a barrier layer (not shown).

[0148] A buffer layer 111 may be disposed on a substrate 100 and may reduce or prevent the penetration of foreign matter, moisture, or ambient air from beneath the substrate 100, and may provide a flat surface on the substrate 100. The buffer layer 111 may comprise inorganic materials (such as oxides or nitrides), organic materials, or organic-inorganic composite materials, and may have a single-layer structure or a multilayer structure comprising at least one inorganic material and at least one organic material. A barrier layer (not shown) may be further included between the substrate 100 and the buffer layer 111 to prevent the penetration of ambient air. According to some embodiments, the buffer layer 111 may comprise silicon oxide (SiO2) or silicon nitride (SiN). x The buffer layer 111 may have a structure in which a first buffer layer 111a and a second buffer layer 111b are stacked.

[0149] In the component region CA, the bottom metal layer BML can be disposed between the first buffer layer 111a and the second buffer layer 111b. According to another embodiment, the bottom metal layer BML can be disposed between the substrate 100 and the first buffer layer 111a. The bottom metal layer BML can be disposed below the auxiliary pixel circuit PCa to prevent the characteristics of the auxiliary thin-film transistor TFTa from being degraded by light emitted from the component. Furthermore, the bottom metal layer BML can prevent light emitted from or guided to the component from diffracting through the narrow gaps between the lines connected to the auxiliary pixel circuit PCa. The bottom metal layer BML may not be disposed in the first transmissive portion TA1.

[0150] Additionally, the bottom metal layer (BML) can be connected to the line GCL disposed on another layer via contact holes. The bottom metal layer (BML) can be configured to receive static voltage or signals from the line GCL. For example, the bottom metal layer (BML) can be configured to receive a first power supply voltage ELVDD or a scan signal. Because the bottom metal layer (BML) receives a constant voltage or signal, the probability of electrostatic discharge can be significantly reduced. The bottom metal layer (BML) can include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu). The bottom metal layer (BML) can include a single layer or multiple layers comprising the materials described above.

[0151] The pixel circuit layer PCL can be disposed on the buffer layer 111 and can include a main pixel circuit PCm, an auxiliary pixel circuit PCa, and an insulating layer IL. The insulating layer IL can include an inorganic insulating layer IIL and an organic insulating layer 117. The inorganic insulating layer IIL can include a first gate insulating layer 112, a second gate insulating layer 113, and an interlayer insulating layer 115. The main pixel circuit PCm can include a main thin-film transistor TFTm and a main storage capacitor Cstm, and the auxiliary pixel circuit PCa can include an auxiliary thin-film transistor TFTa and an auxiliary storage capacitor Csta.

[0152] The main thin-film transistor (TFTm) and the auxiliary thin-film transistor (TFTa) can be disposed on the buffer layer 111. The main thin-film transistor (TFTm) may include a first semiconductor layer A1, a first gate electrode G1, a first source electrode S1, and a first drain electrode D1, and the auxiliary thin-film transistor (TFTa) may include a second semiconductor layer A2, a second gate electrode G2, a second source electrode S2, and a second drain electrode D2. The main thin-film transistor (TFTm) can be connected to and drive the main organic light-emitting diode (OLEDm). The auxiliary thin-film transistor (TFTa) can be connected to and drive the auxiliary organic light-emitting diode (OLEDa).

[0153] The first semiconductor layer A1 and the second semiconductor layer A2 can be disposed on the buffer layer 111. According to one embodiment, the first semiconductor layer A1 and the second semiconductor layer A2 may comprise polycrystalline silicon. According to another embodiment, the first semiconductor layer A1 and the second semiconductor layer A2 may comprise amorphous silicon. According to yet another embodiment, the first semiconductor layer A1 and the second semiconductor layer A2 may comprise an oxide of at least one material selected from indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The first semiconductor layer A1 and the second semiconductor layer A2 may comprise a channel region C, a source region S, and a drain region D doped with impurities.

[0154] The second semiconductor layer A2 may be stacked with the bottom metal layer BML, and the second buffer layer 111b may be disposed between the second semiconductor layer A2 and the bottom metal layer BML. According to an embodiment, the width of the second semiconductor layer A2 may be smaller than the width of the bottom metal layer BML. In this case, the second semiconductor layer A2 may be stacked integrally with the bottom metal layer BML in a direction perpendicular to the substrate 100.

[0155] The first gate insulating layer 112 may cover the first semiconductor layer A1 and the second semiconductor layer A2. The first gate insulating layer 112 may include an inorganic insulating material, such as silicon oxide (SiO2) or silicon nitride (SiN). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) x Zinc oxide (ZnO) x The gate insulating layer 112 may be ZnO and / or ZnO2. The first gate insulating layer 112 may include a single layer or multiple layers comprising the inorganic insulating material described above.

[0156] The first gate electrode G1 and the second gate electrode G2 can be disposed above the first gate insulating layer 112, and stacked with the first semiconductor layer A1 and the second semiconductor layer A2, respectively. The first gate electrode G1 and the second gate electrode G2 may include molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may include a single layer or multiple layers. For example, the first gate electrode G1 and the second gate electrode G2 may include a single Mo layer.

[0157] The second gate insulating layer 113 may cover the first gate electrode G1 and the second gate electrode G2. The second gate insulating layer 113 may include an inorganic insulating material, such as silicon oxide (SiO2) or silicon nitride (SiN). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO)x Zinc oxide (ZnO) x The gate insulating layer 113 may be ZnO and / or ZnO2. The second gate insulating layer 113 may include a single layer or multiple layers comprising the inorganic insulating material described above.

[0158] The first upper electrode CE2 of the main storage capacitor Cstm and the second upper electrode CE2' of the auxiliary storage capacitor Csta can be arranged above the second gate insulating layer 113.

[0159] In the main display area MDA, the first upper electrode CE2 can be stacked with the first gate electrode G1. The first gate electrode G1 and the first upper electrode CE2, which are stacked together and with the second gate insulating layer 113 disposed therebetween, can constitute the main storage capacitor Cstm. The first gate electrode G1 can correspond to the first lower electrode CE1 of the main storage capacitor Cstm. For example, the first gate electrode G1 can be integrally disposed with the first lower electrode CE1 of the main storage capacitor Cstm.

[0160] In the component region CA, the second upper electrode CE2' may be stacked with the second gate electrode G2. The second gate electrode G2 and the second upper electrode CE2', which are stacked together and with the second gate insulating layer 113 disposed therebetween, may constitute an auxiliary storage capacitor Csta. The second gate electrode G2 may correspond to the second lower electrode CE1' of the auxiliary storage capacitor Csta. For example, the second gate electrode G2 may be integrally disposed with the second lower electrode CE1' of the auxiliary storage capacitor Csta.

[0161] The first upper electrode CE2 and the second upper electrode CE2' may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), and may include a single layer or multiple layers containing the materials described above.

[0162] The interlayer insulating layer 115 may cover the first upper electrode CE2 and the second upper electrode CE2'. The interlayer insulating layer 115 may include silicon oxide (SiO2) or silicon nitride (SiN). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) x Zinc oxide (ZnO) x The interlayer insulation layer 115 may be a single layer or multiple layers comprising the inorganic insulating material described above.

[0163] The inorganic insulating layer IIL may include a first aperture H1 corresponding to the first transmissive portion TA1. The first aperture H1 may expose a portion of the upper surface of the buffer layer 111 or the substrate 100. The first aperture H1 may be stacked with the first gate insulating layer 112 formed to correspond to the opening of the first transmissive portion TA1, the second gate insulating layer 113 formed to correspond to the opening of the first transmissive portion TA1, and the interlayer insulating layer 115 formed to correspond to the opening of the first transmissive portion TA1. These openings may be formed separately by separate processes or simultaneously by the same process. When these openings are formed by separate processes, the inner surface of the first aperture H1 may not be smooth and may have steps such as a staircase shape.

[0164] Alternatively, the inorganic insulating layer IIL may have a groove instead of exposing the first hole H1 of the buffer layer 111. Alternatively, the inorganic insulating layer IIL may have neither the first hole H1 corresponding to the first transmissive portion TA1 nor the groove corresponding to the first transmissive portion TA1.

[0165] The first source electrode S1, the second source electrode S2, the first drain electrode D1, and the second drain electrode D2 can be disposed on the interlayer insulating layer 115. The first source electrode S1 and the first drain electrode D1 can be connected to the source region S and the drain region D of the first semiconductor layer A1, respectively, and the second source electrode S2 and the second drain electrode D2 can be connected to the source region S and the drain region D of the second semiconductor layer A2, respectively. In this case, the first source electrode S1 and the first drain electrode D1 can be connected to the source region S and the drain region D of the first semiconductor layer A1 through contact holes provided in the inorganic insulating layer 115, and the second source electrode S2 and the second drain electrode D2 can be connected to the source region S and the drain region D of the second semiconductor layer A2 through contact holes provided in the inorganic insulating layer 115, respectively.

[0166] Each of the first source electrode S1, the second source electrode S2, the first drain electrode D1, and the second drain electrode D2 may include a conductive material such as molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti), and may include a single layer or multiple layers comprising the materials described above. For example, each of the first source electrode S1, the second source electrode S2, the first drain electrode D1, and the second drain electrode D2 may have a Ti / Al / Ti multilayer structure.

[0167] The organic insulating layer 117 may cover the first source electrode S1 and the second source electrode S2, as well as the first drain electrode D1 and the second drain electrode D2. The organic insulating layer 117 may have a flat upper surface, and the first pixel electrode 121 and the second pixel electrode 121' disposed above the organic insulating layer 117 may also be formed to have a flat upper surface.

[0168] The organic insulating layer 117 may comprise organic or inorganic materials and may have a single-layer or multi-layer structure. The organic insulating layer 117 may comprise general-purpose polymers (e.g., benzocyclobutene (BCB), polyimide (PI), hexamethyldisiloxane (HMDSO), polymethyl methacrylate (PMMA), or polystyrene (PS)), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, or vinyl alcohol polymers.

[0169] The organic insulating layer 117 may have a second hole H2 corresponding to the first transmissive portion TA1. The second hole H2 may be stacked with the first hole H1 of the inorganic insulating layer IIL. Figure 8 This shows that the second hole H2 is larger than the first hole H1. According to another embodiment, the organic insulating layer 117 may cover the edge of the first hole H1 of the inorganic insulating layer 111, and the area of ​​the second hole H2 may be smaller than the area of ​​the first hole H1.

[0170] The organic insulating layer 117 may have a via exposing one of the first source electrode S1 and the first drain electrode D1 of the main thin-film transistor TFTm. The first pixel electrode 121 may be arranged to contact either the first source electrode S1 or the first drain electrode D1 through the via, and the first pixel electrode 121 may be electrically connected to the main thin-film transistor TFTm. Additionally, the organic insulating layer 117 may have another via exposing one of the second source electrode S2 and the second drain electrode D2 of the auxiliary thin-film transistor TFTa. The second pixel electrode 121' may be arranged to contact either the second source electrode S2 or the second drain electrode D2 through the via, and the second pixel electrode 121' may be electrically connected to the auxiliary thin-film transistor TFTa.

[0171] The first pixel electrode 121 and the second pixel electrode 121' may include conductive oxides, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). The first pixel electrode 121 and the second pixel electrode 121' may include a reflective layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or any mixture thereof. For example, each of the first pixel electrode 121 and the second pixel electrode 121' may have a structure comprising one or more layers of ITO, IZO, ZnO, or In2O3 above / below the reflective layer described above. For example, each of the first pixel electrode 121 and the second pixel electrode 121' may have an ITO / Ag / ITO stacked structure.

[0172] The pixel defining layer 119 may cover the edges of the first pixel electrode 121 and the second pixel electrode 121' disposed on the organic insulating layer 117, and may include a first opening OP1 and a second opening OP2 that respectively expose the central portions of the first pixel electrode 121 and the second pixel electrode 121'. The first opening OP1 and the second opening OP2 respectively define the size and shape of the emission regions of the organic light-emitting diodes OLEDm and OLEDa, or the emission regions of the sub-pixels Pm and Pa.

[0173] The pixel defining layer 119 can prevent electric arcing or the like from occurring at the edges of the first pixel electrode 121 and the second pixel electrode 121' by increasing the distance between the edges of the first pixel electrode 121 and the second pixel electrode 121' and the portions of the counter electrode 123 on the first pixel electrode 121 and the second pixel electrode 121'. The pixel defining layer 119 may include organic insulating materials such as PI, polyamide, acrylic resin, BCB, HMDSO and phenolic resin, and can be formed by spin coating.

[0174] The pixel-defining layer 119 may have a third hole H3 corresponding to the first transmissive portion TA1. The third hole H3 may be stacked with the first hole H1 of the inorganic insulating layer 111 and the second hole H2 of the organic insulating layer 117. The transmittance of the first transmissive portion TA1 can be improved by using the first hole H1, the second hole H2, and the third hole H3. Although Figure 8 The buffer layer 111 is shown to be continuously arranged to correspond to the first transmission portion TA1, but in other embodiments, the buffer layer 111 may have holes corresponding to the first transmission portion TA1.

[0175] In the first opening OP1 and the second opening OP2 of the pixel defining layer 119, the first emitting layer 122b and the second emitting layer 122b' can be arranged to correspond to the first pixel electrode 121 and the second pixel electrode 121', respectively. The first emitting layer 122b and the second emitting layer 122b' can include high molecular weight materials or low molecular weight materials, and can emit red light, green light, blue light or white light.

[0176] The organic functional layer 122e may be disposed above and / or below the first emission layer 122b and the second emission layer 122b'. The organic functional layer 122e may include the first functional layer 122a and / or the second functional layer 122c. In some embodiments, the first functional layer 122a or the second functional layer 122c may be omitted.

[0177] The first functional layer 122a may be disposed below the first emission layer 122b and the second emission layer 122b'. The first functional layer 122a may comprise a single layer or multiple layers containing organic material. The first functional layer 122a may comprise a single-layer hole transport layer (HTL). Alternatively, the first functional layer 122a may comprise a hole injection layer (HIL) and an HTL. The first functional layer 122a may be integrally formed to correspond to the main organic light-emitting diode OLEDm included in the main display area MDA and the auxiliary organic light-emitting diode OLEDa included in the component area CA.

[0178] The second functional layer 122c may be disposed above the first emission layer 122b and the second emission layer 122b'. The second functional layer 122c may comprise a single layer or multiple layers containing organic material. The second functional layer 122c may comprise an electron transport layer (ETL) and / or an electron injection layer (EIL). The second functional layer 122c may be integrally formed to correspond to the main organic light-emitting diode OLEDm included in the main display region MDA and the auxiliary organic light-emitting diode OLEDa included in the component region CA.

[0179] Counter electrode 123 may be disposed above the second functional layer 122c. Counter electrode 123 may comprise a conductive material having a work function. For example, counter electrode 123 may comprise a (semi-)transparent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or any alloy thereof. Alternatively, counter electrode 123 may comprise a layer such as ITO, IZO, ZnO, or In2O3 on the (semi-)transparent layer comprising the materials described above. Counter electrode 123 may be integrally formed to correspond to the main organic light-emitting diode OLEDm included in the main display region MDA and the auxiliary organic light-emitting diode OLEDa included in the component region CA.

[0180] In the main display area MDA, the layer from the first pixel electrode 121 to the counter electrode 123 can form a main organic light-emitting diode (OLEDm). In the component area CA, the layer from the second pixel electrode 121' to the counter electrode 123 can form an auxiliary organic light-emitting diode (OLEDa).

[0181] The organic functional layer 122e and the counter electrode 123 may include a functional layer aperture 122eH and a counter electrode aperture 123H, respectively corresponding to the first transmissive portion TA1. According to an embodiment, the size of the functional layer aperture 122eH may be smaller than the size of the counter electrode aperture 123H. According to another embodiment, the size of the functional layer aperture 122eH may be substantially equal to the size of the counter electrode aperture 123H.

[0182] Because of the counter electrode aperture 123H, the counter electrode 123 may not be arranged in the first transmission portion TA1. Therefore, the transmittance of the first transmission portion TA1 can be significantly increased. The counter electrode 123 having the counter electrode aperture 123H can be formed by various methods. According to an embodiment, after forming the material for the counter electrode 123 on the substrate 100, the portion corresponding to the first transmission portion TA1 can be removed by laser lift-off to form the counter electrode aperture 123H of the counter electrode 123. According to another embodiment, the counter electrode 123 having the counter electrode aperture 123H can be formed by metal self-patterning (MSP). According to another embodiment, the counter electrode 123 having the counter electrode aperture 123H can be formed by a process of depositing the counter electrode 123 using a fine metal mask (FMM). In addition, the organic functional layer 122e having the functional layer aperture 122eH can also be formed using laser lift-off, MSP, or FMM.

[0183] In the first transmission portion TA1, the first transmission hole ILH1 of the insulating layer IL may include a first hole H1 of the inorganic insulating layer IL and a second hole H2 of the organic insulating layer 117 stacked with the first hole H1. The first transmission hole ILH1 may expose the upper surface of the substrate 100 or the upper surface of the buffer layer 111, and may be connected to the third hole H3 of the pixel defining layer 119. In addition, the third hole H3 may be connected to the functional layer hole 122eH of the organic functional layer 122e and the counter electrode hole 123H of the counter electrode 123.

[0184] In this embodiment, the second transmission portion TA2 can be arranged in the second component region CA2. Similar to the first transmission portion TA1, the insulating layer IL can include a second transmission aperture ILH2 in the second transmission portion TA2. The second transmission aperture ILH2 can be stacked with the second transmission portion TA2 and can expose the upper surface of the substrate 100 or the upper surface of the buffer layer 111. Specifically, similar to the first transmission portion TA1, the inorganic insulating layer IL can have a first aperture H1 in the second transmission portion TA2, and the organic insulating layer 117 can have a second aperture H2 corresponding to the second transmission portion TA2. That is, in the second transmission portion TA2, the second transmission aperture ILH2 of the insulating layer IL can include the first aperture H1 of the inorganic insulating layer IL and the second aperture H2 of the organic insulating layer 117 stacked with the first aperture H1.

[0185] The pixel defining layer 119 may have a third hole H3 disposed in the second transmissive portion TA2, and the third hole H3 may be connected to the second transmissive hole ILH2. That is, the second transmissive hole ILH2 and the third hole H3 may be connected to each other.

[0186] The organic functional layer 122e and the counter electrode 123 may each include a functional layer hole 122eH and a counter electrode hole 123H in the second transmission section TA2. The functional layer hole 122eH and the counter electrode hole 123H may be connected to the second transmission hole ILH2 and the third hole H3 in the second transmission section TA2.

[0187] In this embodiment, the alignment pattern AP can be disposed on the substrate 100 superimposed on the second transmission aperture ILH2. The alignment pattern AP can be disposed on at least one of the second transmission portions TA2 disposed in the second component region CA2, and can be superimposed on the second transmission aperture ILH2. The second component region CA2 can have a plurality of second transmission portions TA2 and a plurality of second transmission apertures ILH2. In this case, the second transmission apertures ILH2 can be disposed in the second transmission portions TA2 respectively. At least one of the second transmission apertures ILH2 can be superimposed on the alignment pattern AP, and the alignment pattern AP may not be disposed in the other second transmission apertures ILH2.

[0188] The alignment pattern AP can be exposed through the second transmission aperture ILH2. Specifically, the first aperture H1 of the inorganic insulating layer IL, the second aperture H2 of the organic insulating layer 117, the third aperture H3 of the pixel defining layer 119, the functional layer aperture 122eH of the organic functional layer 122e, and the counter electrode aperture 123H of the counter electrode 123 can expose the alignment pattern AP in the second transmission portion TA2.

[0189] Reference Figure 8 The alignment pattern AP may include the same material as at least one of the source region S and drain region D of the first semiconductor layer A1 and the second semiconductor layer A2. For example, the alignment pattern AP may include polycrystalline silicon. As another example, the alignment pattern AP may include amorphous silicon. As yet another example, the alignment pattern AP may include an oxide selected from at least one material selected from indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The alignment pattern AP may be doped similarly to the source region S or the drain region D. In this case, the transmittance of the second transmission portion TA2 may be lower than the transmittance of the first transmission portion TA1.

[0190] The alignment pattern AP can be formed simultaneously with the first semiconductor layer A1 and the second semiconductor layer A2. In this case, the alignment pattern AP can be formed in the second component region CA2 without additional processing.

[0191] Reference Figure 9The alignment pattern AP may include the same material as the second gate electrode G2. According to an embodiment, the second gate electrode G2 is integrally disposed with the second lower electrode CE1', and the alignment pattern AP may include the same material as the second lower electrode CE1'. For example, the alignment pattern AP may include molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may include a single layer or multiple layers. For example, the alignment pattern AP may include a single Mo layer.

[0192] The alignment pattern AP can be formed simultaneously with the second gate electrode G2. In this case, the alignment pattern AP can be formed in the second component region CA2 without additional processing.

[0193] Reference Figure 10 The alignment pattern AP may include the same material as the second upper electrode CE2'. For example, the alignment pattern AP may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), and may include a single layer or multiple layers containing the materials described above.

[0194] The alignment pattern AP can be formed simultaneously with the second upper electrode CE2'. In this case, the alignment pattern AP can be formed in the second component region CA2 without additional processing.

[0195] Reference Figure 11 The alignment pattern AP may include the same material as one of the second source electrode S2 and the second drain electrode D2. The alignment pattern AP may include a conductive material comprising molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and may comprise a single layer or multiple layers comprising the materials described above. For example, the alignment pattern AP may have a Ti / Al / Ti multilayer structure.

[0196] The alignment pattern AP can be formed simultaneously with at least one of the second source electrode S2 and the second drain electrode D2. In this case, the alignment pattern AP can be formed in the second component region CA2 without additional processing.

[0197] Reference Figure 12The alignment pattern AP may include the same material as the second pixel electrode 121'. The alignment pattern AP may include conductive oxides such as ITO, IZO, ZnO, In2O3, IGO, or AZO. The alignment pattern AP may include a reflective layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or any mixture thereof. For example, the alignment pattern AP may have a structure comprising one or more layers of ITO, IZO, ZnO, or In2O3 above and / or below the reflective layer. For example, the alignment pattern AP may have an ITO / Ag / ITO stacked structure. When the alignment pattern AP includes a reflective layer, the transmittance of the second transmissive portion TA2 may be lower than the transmittance of the first transmissive portion TA1.

[0198] The alignment pattern AP can be formed simultaneously with the second pixel electrode 121'. In this case, the alignment pattern AP can be formed in the second component region CA2 without additional processing.

[0199] Figures 13 to 16 This is a schematic cross-sectional view of a portion of a display panel 10 according to various embodiments. Figures 13 to 16 In, with Figure 8 In the accompanying drawings, the same reference numerals indicate the same components, and redundant descriptions will be omitted.

[0200] Reference Figures 13 to 16 The display panel 10 may include: a substrate 100 including a first component region CA1, a second component region CA2 and a main display region MDA; an insulating layer IL disposed on the substrate 100; and an organic light-emitting diode (e.g., an auxiliary organic light-emitting diode OLEDa) as a display element disposed on the insulating layer IL.

[0201] A first transmission portion TA1 may be disposed in a first component region CA1. In the first transmission portion TA1, the insulating layer IL may have a first transmission hole ILH1 exposing the upper surface of the substrate 100 or the buffer layer 111. The first transmission hole ILH1 may include a first hole H1 of the inorganic insulating layer IL in the first transmission portion TA1 and a second hole H2 of the organic insulating layer 117 in the first transmission portion TA1. In this case, the first hole H1 and the second hole H2 may be connected to each other.

[0202] An auxiliary organic light-emitting diode (OLEDa) corresponding to the auxiliary sub-pixel Pa can be disposed in the first component region CA1. The auxiliary OLEDa may include a second pixel electrode 121', a second emitting layer 122b', and a counter electrode 123. A pixel defining layer 119 may cover the edge of the second pixel electrode 121', and the size and shape of the auxiliary sub-pixel Pa may correspond to a second opening OP2 of the pixel defining layer 119 that exposes the central portion of the second pixel electrode 121'. The pixel defining layer 119 may have a third hole H3 in a first transmissive portion TA1, and the third hole H3 may be connected to a first transmissive hole ILH1.

[0203] According to an embodiment, the organic functional layer 122e and the counter electrode 123 may extend to the first transmission portion TA1, and the organic functional layer 122e and the counter electrode 123 may include a functional layer aperture 122eH and a counter electrode aperture 123H respectively connected to the first transmission aperture ILH1. In this case, the organic functional layer 122e and the counter electrode 123 may extend to the inner surface of the first transmission aperture ILH1. In this case, the size of the functional layer aperture 122eH and the size of the counter electrode aperture 123H may be smaller than the size of the first transmission aperture ILH1. The size of the first transmission aperture ILH1 may correspond to the distance between the side surfaces of the first gate insulating layer 112 facing each other in the first transmission portion TA1. The size of the functional layer aperture 122eH and the size of the counter electrode aperture 123H may respectively correspond to the distance between the side surfaces of the organic functional layer 122e facing each other in the first transmission portion TA1 and the distance between the side surfaces of the counter electrode 123 facing each other in the first transmission portion TA1. According to another embodiment, the size of the functional layer hole 122eH and the counter electrode hole 123H can be larger than the size of the first transmission hole ILH1.

[0204] According to one embodiment, the size of the functional layer aperture 122eH can be substantially the same as the size of the counter electrode aperture 123H. According to another embodiment, the size of the functional layer aperture 122eH can be different from the size of the counter electrode aperture 123H.

[0205] In this embodiment, at least one of the inorganic insulating layer 1IL and the organic insulating layer 117 may have a second transmission hole ILH2 that exposes the upper surface of the substrate 100 or the buffer layer 111 in the second transmission portion TA2.

[0206] Reference Figure 13Similar to the first transmission portion TA1, the inorganic insulating layer 117 can have a first hole H1 in the second transmission portion TA2. Alternatively, similar to the first transmission portion TA1, the organic insulating layer 117 can have a second hole H2 in the second transmission portion TA2. In this case, the second transmission hole 117 can include both the first hole H1 and the second hole H2 in the second transmission portion TA2.

[0207] Additionally, similar to the first transmissive portion TA1, the pixel defining layer 119 may have a third aperture H3 in the second transmissive portion TA2. In this case, the third aperture H3 in the second transmissive portion TA2 may be connected to the second transmissive aperture ILH2.

[0208] In this embodiment, the organic functional layer 122e and the counter electrode 123 can be continuously arranged in the second transmission portion TA2. Specifically, a plurality of second transmission portions TA2 can be arranged in the second component region CA2. In this case, the organic functional layer 122e and the counter electrode 123 can be continuously arranged in at least one of the second transmission portions TA2. Therefore, at least one of the second transmission portions TA2 can have a transmittance different from that of the first transmission portion TA1. In this case, at least one of the second transmission portions TA2 can be used as an alignment reference (or "alignment mark") AR. The second transmission portion TA2 having a transmittance different from that of the first transmission portion TA1 can be formed without additional processes.

[0209] Reference Figure 14 The inorganic insulating layer IIL can be continuously arranged in the second transmission portion TA2. In this case, the inorganic insulating layer IIL may not have a first hole H1 in the second transmission portion TA2. The organic insulating layer 117 may have a second hole H2 in both the first transmission portion TA1 and the second transmission portion TA2. In this case, the second hole H2 in the second transmission portion TA2 may be referred to as the second transmission hole ILH2-1, and the second transmission hole ILH2-1 may be connected to the third hole H3.

[0210] In this embodiment, a plurality of second transmissive portions TA2 can be arranged in the second component region CA2. An inorganic insulating layer IIL can be continuously arranged in at least one of the second transmissive portions TA2. At least one of the second transmissive portions TA2 can have a transmittance different from that of the first transmissive portion TA1. In this case, at least one of the second transmissive portions TA2 can be used as an alignment reference AR. The second transmissive portions TA2 having a transmittance different from that of the first transmissive portion TA1 can be formed without additional processing.

[0211] Reference Figure 15The inorganic insulating layer 117 may have a first hole H1 in the first transmission portion TA1 and the second transmission portion TA2, respectively. The first hole H1 in the second transmission portion TA2 may be referred to as the second transmission hole ILH2-2. The organic insulating layer 117 may be continuously arranged in the second transmission portion TA2. The organic insulating layer 117 may cover the first hole H1 of the second transmission portion TA2 to form a first groove Gv1 with a concave shape. The first groove Gv1 may be connected to the third hole H3 of the pixel defining layer 119 in the second transmission portion TA2.

[0212] In this embodiment, multiple second transmissive portions TA2 can be arranged in the second component region CA2. An organic insulating layer 117 can be continuously arranged in at least one of the second transmissive portions TA2. The second transmissive portions TA2 can have a transmittance different from that of the first transmissive portion TA1. The second transmissive portions TA2 can be used as an alignment reference AR. The second transmissive portions TA2 having a transmittance different from that of the first transmissive portion TA1 can be formed without additional processing.

[0213] Reference Figure 16 The inorganic insulating layer 117 may have a first hole H1 in the first transmission portion TA1 and the second transmission portion TA2, respectively. Additionally, the organic insulating layer 117 may have a second hole H2 in both the first transmission portion TA1 and the second transmission portion TA2. In this case, the first hole H1 and the second hole H2 in the second transmission portion TA2 may be referred to as the second transmission hole ILH2.

[0214] In this embodiment, the pixel defining layer 119 can be continuously arranged in the second transmissive portion TA2. Specifically, the pixel defining layer 119 can have a third hole H3 connected to the first transmissive aperture ILH1 in the first transmissive portion TA1, and can be continuously arranged in the second transmissive portion TA2. The pixel defining layer 119 can cover the second transmissive aperture ILH2 to form a second groove Gv2 with a concave shape.

[0215] In this embodiment, a plurality of second transmissive portions TA2 can be arranged in the second component region CA2. The pixel defining layer 119 can be continuously arranged in at least one of the second transmissive portions TA2. Therefore, the second transmissive portions TA2 can have a transmittance different from that of the first transmissive portion TA1. The second transmissive portions TA2 can be used as an alignment reference AR. Some of the second transmissive portions TA2 having a transmittance different from that of the first transmissive portion TA1 can be formed without additional processing.

[0216] Figure 17 This is a schematic cross-sectional view of the display panel 10 and component COMP according to another embodiment.

[0217] Reference Figure 17 The display panel 10 may include a component region CA superimposed on the component COMP. An auxiliary sub-pixel Pa, implemented as an auxiliary organic light-emitting diode OLEDa, may be arranged in the component region CA. The component region CA may include a first component region CA1 and a second component region CA2.

[0218] In this embodiment, the first transmission portion TA1 can be arranged in the first component region CA1, and the second transmission portion TA2 can be arranged in the second component region CA2.

[0219] According to an embodiment, a plurality of second transmission portions TA2 may be disposed in the second component region CA2. In this case, the above reference... Figures 8 to 12 The alignment pattern AP described can be arranged in some of the second transmission sections TA2. Alternatively, as shown above... Figures 13 to 16 Some of the second transmission section TA2 described can be used as alignment reference AR.

[0220] The COMP component can be arranged below the display panel 10. According to an embodiment, the COMP component may include a lens COMPL, a module COMPM, and sensors COMPS.

[0221] External light can pass through the lens COMP and be incident on the component COMP, and light emitted from the component COMP can be transmitted through the lens COMP. The lens COMP can be superimposed on the first component region CA1. In this case, the component region CA superimposed on the lens COMP can correspond to the first component region CA1.

[0222] The module COMPM may correspond to the remaining portion of component COMP connected to lens COMP. For example, module COMPM may include a frame. Module COMPM may be superimposed on the second component region CA2.

[0223] In this embodiment, the sensor COMPS can be connected to the module COMPM. The sensor COMPS can detect the position of the alignment pattern AP. For example, the sensor COMPS can include an infrared light emitting portion and / or an infrared light receiving portion. The infrared light emitting portion of the sensor COMPS can emit infrared light towards the alignment pattern AP, and the infrared light receiving portion of the sensor COMPS can receive the infrared light reflected from the alignment pattern AP. Therefore, the sensor COMPS can detect the position of the alignment pattern AP.

[0224] According to another embodiment, the sensor COMPS can detect the position of the alignment reference AR. For example, the sensor COMPS can detect the position of the second transmission portion TA2, which is set as the alignment reference AR, based on the difference between the transmittance of the first transmission portion TA1 and the transmittance of the second transmission portion TA2. Alternatively, the sensor COMPS can detect the position of the alignment reference AR based on the difference between the transmittance of the second transmission portion TA2, which is not set as the alignment reference AR, and the transmittance of the second transmission portion TA2, which is set as the alignment reference AR. Because the transmittance or reflectance of the second transmission portion TA2, which is set as the alignment base illumination AR, is different from the transmittance or reflectance of the first transmission portion TA1, the position of the second transmission portion TA2, which is set as the alignment reference AR, can be detected.

[0225] Therefore, if the component area CA and component COMP of the display panel 10 are not precisely aligned with each other, the component area CA and component COMP can be aligned with each other using the position of the alignment reference AR or alignment pattern AP detected by the sensor COMPS. If component COMP is a camera with camera shake correction function, the position of the camera can be corrected using the position of the alignment pattern AP or alignment reference AR.

[0226] As described above, an alignment pattern AP can be provided disposed on the substrate 100 and superimposed on the second transmission aperture ILH2 to ensure precise alignment of component COMP with component region CA.

[0227] Furthermore, the stacking structure of the elements constituting at least one of the second transmission portions TA2 may differ from the stacking structure of the elements constituting the first transmission portion TA1, and the light transmittance of at least one of the second transmission portions TA2 may differ from the light transmittance of the first transmission portion TA1. Therefore, at least one of the second transmission portions TA2 can be used as an alignment reference AR, and the component COMP can be precisely aligned with the component region CA.

[0228] It should be understood that the embodiments described herein should be considered descriptive only and not for limiting purposes. The description of features or aspects within each embodiment should be considered applicable to other embodiments. Although one or more embodiments have been described with reference to figures, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure, including the claims.

Claims

1. A display device, the display device comprising: The substrate includes a first component region in which a first transmissive portion is disposed, a second component region surrounding the first component region and in which a second transmissive portion is disposed, and a main display region surrounding at least a portion of the second component region; An insulating layer having a first transmission hole corresponding to the first transmission portion and a second transmission hole corresponding to the second transmission portion, the first transmission hole and the second transmission hole exposing the upper surface of the substrate; Multiple display elements are arranged on the insulating layer and correspond to the first component area, the second component area and the main display area; A component, disposed beneath the substrate and superimposed on the first component region and the second component region, the component comprising electronic components that use light or sound; as well as The alignment pattern is arranged on the substrate and superimposed with the second transmission aperture, and is configured to align the component with the second component region.

2. The display device according to claim 1, wherein The insulating layer includes an inorganic insulating layer disposed on the substrate and an organic insulating layer disposed on the inorganic insulating layer, and The inorganic insulating layer has a first hole that exposes the alignment pattern in the second transmissive portion.

3. The display device according to claim 2, wherein, The organic insulating layer has a second hole connected to the first hole, and The second hole exposes the alignment pattern.

4. The display device according to claim 1, wherein, Each of the plurality of display elements includes a pixel electrode and a counter electrode. The counter electrode has a counter electrode hole connected to the second transmission hole, and The electrode hole exposes the alignment pattern.

5. The display device of claim 1, further comprising a thin-film transistor connected to each of the plurality of display elements, the thin-film transistor comprising a semiconductor layer, the semiconductor layer comprising a channel region and a source region and a drain region disposed on a side of the channel region. in, The alignment pattern comprises the same material as at least one of the source region and the drain region.

6. The display device according to claim 1, further comprising: A thin-film transistor connected to each of the plurality of display elements, the thin-film transistor including a semiconductor layer comprising a channel region and a gate electrode superimposed on the channel region; as well as The storage capacitor includes a lower electrode integrally disposed with the gate electrode and an upper electrode disposed on the lower electrode. The alignment pattern comprises the same material as one of the lower electrode and the upper electrode.

7. The display device according to claim 1, further comprising a thin-film transistor disposed on the substrate, the thin-film transistor comprising: A semiconductor layer, including a channel region and a source region and a drain region disposed on the side of the channel region; And source and drain electrodes, respectively connected to the source region and the drain region. The insulating layer comprises an inorganic insulating layer covering the semiconductor layer and an organic insulating layer disposed on the inorganic insulating layer. The source electrode and the drain electrode are arranged between the inorganic insulating layer and the organic insulating layer, and The alignment pattern comprises the same material as one of the source electrode and the drain electrode.

8. The display device according to claim 1, wherein, Each of the plurality of display elements includes a pixel electrode and a counter electrode, and The alignment pattern comprises the same material as the pixel electrode.

9. The display device according to claim 1, in, The components include: Lens, stacked with the first component region; and The module, in which the lens is arranged, is superimposed on the second component region.

10. The display device according to claim 9, wherein, The module includes alignment marks that are superimposed on the alignment pattern.

11. The display device according to claim 9, wherein, The component also includes a sensor connected to the module and configured to detect the position of the alignment pattern.

12. The display device according to claim 1, wherein, The second transmission portion includes a plurality of second transmission portions in the second component region. The insulating layer has multiple second transmission holes in each of the multiple second transmission portions, and The alignment pattern is superimposed on at least one of the plurality of second transmission holes.

13. A display device, the display device comprising: The substrate includes a first component region in which a first transmissive portion is disposed, a second component region surrounding the first component region and in which a second transmissive portion is disposed, and a main display region surrounding at least a portion of the second component region, wherein the second transmissive portion has a second transmittance different from the first transmittance of the first transmissive portion. An insulating layer is disposed on the substrate and has a first transmission hole corresponding to the first transmission portion and exposing a first portion of the upper surface of the substrate; Multiple display elements are arranged on the insulating layer and correspond to the first component area, the second component area and the main display area; as well as A component, disposed beneath the substrate and stacked with the first component region and the second component region, includes electronic components that utilize light or sound. The insulating layer comprises an inorganic insulating layer and an organic insulating layer disposed on the inorganic insulating layer, and At least one of the inorganic insulating layer and the organic insulating layer has a second transmission hole, which exposes a second portion of the upper surface of the substrate in the second transmission portion.

14. The display device according to claim 13, wherein, The inorganic insulating layer is continuously arranged in the second transmission portion, and The organic insulating layer has the second transmission hole in the second transmission portion.

15. The display device according to claim 13, wherein, The inorganic insulating layer has the second transmission hole in the second transmission portion, and The organic insulating layer is continuously arranged in the second transmissive portion.

16. The display device according to claim 13, wherein, Each of the inorganic insulating layer and the organic insulating layer has a second transmission hole in the second transmission portion. Each of the plurality of display elements includes a pixel electrode and a counter electrode. The display device further includes a pixel defining layer that covers the edge of the pixel electrode, and The pixel defining layer has a third hole connected to the first transmission hole and is continuously arranged in the second transmission portion.

17. The display device according to claim 13, wherein, Each of the plurality of display elements includes a pixel electrode and a counter electrode, and The counter electrode has a counter electrode hole connected to the first transmission hole and is continuously arranged in the second transmission portion.

18. The display device according to claim 13, in, The components include: Lens, stacked with the first component region; and The module, in which the lens is arranged, is superimposed on the second component region.

19. The display device according to claim 18, further comprising an alignment mark superimposed on the second transmissive portion.

20. The display device according to claim 18, wherein, The component also includes a sensor connected to the module and configured to detect the position of the second transmission portion by utilizing the difference between the first transmittance of the first transmission portion and the second transmittance of the second transmission portion.

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