Deposition apparatus

Abstract

The present application relates to a deposition apparatus. The deposition apparatus includes a chamber, a support member, a grounding member, and a first fixing member. The chamber includes a lower portion and a sidewall. The support member is located in a space defined by the lower portion and the sidewall of the chamber, and includes a side surface. The grounding member is disposed between the support member and the lower portion of the chamber. The first fixing member includes a first body and a first barrier portion. The first body is located below a first end portion of the grounding member, and includes a side surface. The first barrier portion is located on the side surface of the first body and the side surface of the support member, and extends along the side surface of the support member. The first barrier portion shields the first end portion of the grounding member from being visible.

Description

Technical Field

[0001] The present invention relates to a deposition apparatus (i.e., a deposition device), and more particularly to a deposition apparatus including a grounding member. Background Technology

[0002] Flat panel displays are used as alternatives to cathode ray tube (CRT) displays due to their lightweight and thin profile. Representative examples of such flat panel displays include liquid crystal displays (LCDs) and organic light-emitting diode (OLED) displays.

[0003] In methods for forming components included in such a display device, silicon-based insulating layers, silicon-based semiconductor layers, etc., can be formed using plasma-enhanced chemical vapor deposition (PECVD). For example, after an electric field is formed between the diffuser and the substrate, deposited material can be deposited onto the substrate through a through-hole formed in the dispensing member. A voltage (e.g., an RF voltage) can be applied to the diffuser to form an electric field, and the substrate can be grounded to the chamber using a grounding strip.

[0004] In this plasma-enhanced chemical vapor deposition process, after the process of depositing the material onto the substrate is performed, a cleaning process can be performed to remove byproducts (e.g., silicon) remaining in the chamber. However, during the cleaning process, the gases used in the cleaning process may corrode the grounding strip, and the corroded grounding strip may be damaged or broken. Summary of the Invention

[0005] Some implementations provide a deposition apparatus that includes a grounding member.

[0006] According to some embodiments, the deposition apparatus includes a chamber, a support member, a grounding member, and a first fixing member. The chamber includes a lower portion and sidewalls. The support member is located within a space defined by the lower portion of the chamber and the sidewalls, and includes a first side surface. The grounding member is disposed between the support member and the lower portion of the chamber. The first fixing member includes a first body and a first blocking portion. The first body is located below a first end portion of the grounding member and includes a first side surface. The first blocking portion is located on the first side surface of the first body and on the first side surface of the support member, and extends along the first side surface of the support member. The first blocking portion shields the first end portion of the grounding member from view.

[0007] In an embodiment, the deposition apparatus may further include a first fixing pin that passes through the first body of the first fixing member and the first end portion of the grounding member to fix the first body of the first fixing member and the first end portion of the grounding member to the bottom surface of the support member adjacent to the first side surface of the support member.

[0008] In one embodiment, the first body of the first fixing member may further include an upper surface having a flat top surface portion and a curved surface portion, the flat top surface portion and the curved surface portion of the first body being adjacent to the bottom surface of the support member. The first fixing pin passes through the flat top surface portion of the first body of the first fixing member.

[0009] In one embodiment, the first end portion of the grounding member may contact the upper surface of the first body of the first fixing member, and the first blocking portion may extend beyond the upper surface of the first body to define a space separated from the external shield of the support member by the bottom surface of the support member and the curved surface portion of the first body.

[0010] In an embodiment, the deposition apparatus may further include a second fixing member, the second fixing member including a second body, the second body including a first side surface and located on a second end portion of the grounding member opposite to the first end portion, and the second fixing member may be adjacent to the lower portion of the chamber.

[0011] In an embodiment, the deposition apparatus may further include a second fixing pin that passes through the second body of the second fixing member and the second end portion of the grounding member to fix the second body of the second fixing member and the second end portion of the grounding member to the lower portion of the chamber.

[0012] In one embodiment, the second body of the second fixing member may further include a lower surface having a flat bottom surface portion and a curved surface portion, the flat bottom surface portion and the curved surface portion being adjacent to the lower portion of the chamber.

[0013] In one embodiment, the second fixing member may be located below the first fixing member and has an inverted shape of the first fixing member.

[0014] In one embodiment, the grounding member may have a curved shape between the support member and the lower part of the chamber, and may extend along the curved surface portion of the first fixing member and the curved surface portion of the second fixing member.

[0015] In one embodiment, the deposition apparatus may further include a lifting member that extends through the lower portion of the chamber and that can contact the bottom surface of a support member.

[0016] In an implementation, the shape of the grounding member can be configured to change in response to movement of the lifting member in the direction from the lower portion of the chamber to the support member or in the direction from the support member to the lower portion of the chamber.

[0017] In one embodiment, the second fixing member may further include a second blocking portion located on the first side surface of the second body. The second blocking portion may extend in a direction parallel to the first side surface of the supporting member to shield the second end portion of the grounding member from being visible.

[0018] In one embodiment, the second end portion of the grounding member may contact the second fixing member, and the second blocking portion may be configured to shield the space between the lower portion of the chamber and the curved surface portion of the second body into an invisible state.

[0019] In this embodiment, the support member and the chamber can be electrically connected to each other via a grounding member.

[0020] In an embodiment, the chamber may further include a through opening formed in the lower portion.

[0021] In one embodiment, the deposition apparatus may further include an intake member connected to a through opening formed in the lower portion of the chamber, and the intake member may be configured to intake material located within the chamber.

[0022] In some embodiments, the deposition apparatus may further include a covering member, a storage member, and a dispensing member. The covering member may be disposed on the chamber and may include a through opening. The storage member may be connected to the through opening of the covering member. The dispensing member may be disposed below the through opening and may include multiple openings.

[0023] In this implementation, the covering member and the distributing member can be electrically connected to each other.

[0024] In one implementation, the covering member may be electrically insulated from the chamber.

[0025] In one embodiment, the deposited material stored in the storage member can pass through an opening in the distribution member to be deposited on a substrate located on the support member.

[0026] According to an embodiment of the deposition apparatus of the present invention, the first fixing member may include a first blocking portion and a first body. When the suction member draws in cleaning gas through a through-opening formed in the lower portion of the chamber, the cleaning gas located between the dispensing member and the support member can pass over the top surface of the support member and move along the sidewall of the support member in the direction from the support member to the lower portion of the chamber. In this case, the first blocking portion of the first fixing member can shield a relatively weakened rigid portion of the grounding member, so that the cleaning gas does not contact said portion of the grounding member, and the cleaning gas can pass over the peripheral surface of the first blocking portion of the first fixing member to be drawn into the suction member through the through-opening. Therefore, said portion of the grounding member can be prevented from being corroded by the cleaning gas, and the grounding member can be protected from damage even when performing the cleaning process. In other words, defects in the deposition apparatus caused by the cleaning process can be prevented.

[0027] Furthermore, since the deposition apparatus according to an embodiment of the present invention includes a first blocking portion integrally formed on the side surface of the support member, the cleaning gas can be completely shielded from said portion of the grounding member.

[0028] Furthermore, the first fixing member may include a first blocking portion and a first body, and the second fixing member may include a second blocking portion and a second body. Therefore, each of the first and second end portions of the grounding member is not subject to corrosion by the cleaning gas. Attached Figure Description

[0029] The embodiments can be understood in more detail from the following description taken in conjunction with the accompanying drawings.

[0030] Figure 1 This is a cross-sectional view showing a deposition apparatus according to an embodiment of the present invention.

[0031] Figure 2 This illustrates an embodiment of the present invention. Figure 1 A cross-sectional view of another section of the deposition apparatus.

[0032] Figure 3 It is used to describe embodiments according to the present invention, including Figure 1 A perspective view of the first and second fixing components and the grounding component in the deposition apparatus.

[0033] Figure 4 This illustrates an embodiment of the present invention. Figure 1 A cross-sectional view of region 'A'.

[0034] Figure 5A and Figure 5B It is used to describe embodiments according to the present invention. Figure 4 The first and second fixing components are shown in a perspective view.

[0035] Figure 6 This is a cross-sectional view showing a deposition apparatus according to an embodiment of the present invention.

[0036] Figure 7 This illustrates an embodiment of the present invention. Figure 6 A cross-sectional view of region 'B'.

[0037] Figure 8 This is a cross-sectional view showing a deposition apparatus according to an embodiment of the present invention.

[0038] Figure 9 This illustrates an embodiment of the present invention. Figure 8 A cross-sectional view of region 'C'.

[0039] Figure 10This is a cross-sectional view showing a deposition apparatus according to an embodiment of the present invention.

[0040] Figure 11 This illustrates an embodiment of the present invention. Figure 10 A cross-sectional view of region 'D'.

[0041] Figure 12 This is a cross-sectional view showing a deposition apparatus according to an embodiment of the present invention.

[0042] Figure 13 This is a cross-sectional view showing a deposition apparatus according to an embodiment of the present invention. Detailed Implementation

[0043] The deposition apparatus according to the embodiments will be described in detail below with reference to the accompanying drawings. In the drawings, the same or similar reference numerals refer to the same or similar elements.

[0044] Figure 1 This is a cross-sectional view showing a deposition apparatus according to an embodiment of the present invention, and Figure 2 It is shown Figure 1 A cross-sectional view of another section of the deposition apparatus. Figure 3 It is used to describe including Figure 1 A perspective view of the first and second fixing components and the grounding component in the deposition apparatus.

[0045] refer to Figure 1 , Figure 2 and Figure 3 The deposition apparatus 100 may include a chamber 210, a support member 250, a first fixing member 300, a second fixing member 400, a first fixing pin 371, a second fixing pin 372, a grounding member 350, a first O-ring 551, a second O-ring 552, an insulating member 560, a suction member 570, a covering member 510, a storage member 290, a dispensing member 530, a lifting member 590, etc. The chamber 210 may include a lower portion 211 and a sidewall 212, and may include a through opening 215 formed in the lower portion 211. The covering member 510 may include a through opening 505, and the dispensing member 530 may include a plurality of openings 535. The support member 250 may include a first side surface 250a, a second side surface 250b, a third side surface 250c, and a fourth side surface 250d, and... Figure 1 The first side surface 250a of the support member 250 is shown in the figure.

[0046] The deposition apparatus 100 may include a plasma-enhanced chemical vapor deposition (PECVD) apparatus. Silicon-based insulating layers, silicon-based semiconductor layers, etc., included in components in a display device can be formed using the PECVD process.

[0047] For example, storage member 290 can store a deposition gas (e.g., a deposition material) including N2O and SiH4. When a voltage V (e.g., an RF voltage) is applied to cover member 510, cover member 510 and distribution member 530 can be electrically connected to each other, and the voltage V applied to cover member 510 can be applied to distribution member 530. Chamber 210 can be grounded. Support member 250 can be electrically connected to chamber 210 via first fixing member 300, second fixing member 400, and grounding member 350, and support member 250 can also be grounded. To electrically isolate the grounded support member 250 from the cover member 510 to which voltage V is applied, insulating member 560 can be inserted between cover member 510 and chamber 210, and thus cover member 510 and chamber 210 are not in contact with each other due to the insulating member 560 between them. Since cover member 510 and chamber 210 are not electrically connected to each other, an electric field can be formed between distribution member 530 and support member 250. After an electric field is formed between the dispensing member 530 and the support member 250, the deposited gas stored in the storage member 290 can pass through the opening 535 of the dispensing member 530, and the deposited gas can be deposited on the substrate 270 disposed on the support member 250 to form a silicon-based insulating layer, a silicon-based semiconductor layer, etc. on the substrate 270. In some embodiments, the interior of the chamber 210 can be heated during the PECVD process.

[0048] However, although the deposition apparatus 100 has been described as including the storage member 290, the configuration of the present invention is not limited thereto. For example, the deposition apparatus 100 may not include the storage member 290, and the deposition apparatus 100 may also include a gas supply line connecting the storage member 290 to a through opening 505 of the cover member 510. Deposition gases including N2O and SiH4 may be supplied to the deposition apparatus 100 via the gas supply line.

[0049] After the process of depositing the deposition material onto the substrate 270 is completed, the substrate 270, disposed on the support member 250, can be moved outside the chamber 210. After moving the substrate 270 outside the chamber 210, a cleaning process can be performed to remove byproducts (e.g., silicon) remaining on the inner surface of the chamber 210 after the PECVD process. Byproducts can also be deposited on various components within the chamber 210, such as the support member 250, the first fixing member 300, the second fixing member 400, the grounding member 350, the distribution member 530, etc. Byproducts may detach from the inner surface of the chamber 210 or from various components within the chamber 210 onto the substrate 270 during the PECVD process, and this can lead to deposition failure due to the byproducts. Therefore, a cleaning process can be performed after the PECVD process (or after at least two PECVD processes, or when a special event occurs during the process, etc.). For example, the storage member 290 can store a cleaning gas including NF3 (or CF) (e.g., a material used to remove the deposited material). The cleaning gas stored in the storage member 290 can diffuse into the interior of the chamber 210 through the opening 535 of the distribution member 530, thereby removing byproducts remaining on the inner surface of the chamber 210 and on the support member 250, the first fixing member 300, the second fixing member 400, the grounding member 350, the distribution member 530, etc. For example, the fluorine (F) in the cleaning gas can react with Si to produce volatile SiF4. For example, the suction member 570 can draw in the cleaning gas and SiF4 located inside the chamber 210 through the through opening 215. In embodiments, the chamber 210, the first fixing member 300, the second fixing member 400, the grounding member 350, etc., may include or be formed of bare aluminum. Since bare aluminum is susceptible to the effects of the cleaning gas, which is a fluorine-based gas, it can be corroded or may lead to particle formation. For example, the fluorine (F) in the cleaning gas can react with Al to produce Al x F y .

[0050] In some embodiments, when performing a cleaning process, a voltage V can be applied to the cover member 510, such that the voltage V applied to the cover member 510 can also be applied to the distribution member 530. The chamber 210 can be grounded, and the support member 250 can also be grounded.

[0051] When a cleaning process is performed using a conventional deposition apparatus, the cleaning gas used in the cleaning process can react with the grounding member 350, thereby corroding the grounding member 350. For example, when the support member 250 can be moved by the lifting member 590 in the direction from the chamber 210 to the covering member 510 or from the covering member 510 to the chamber 210, the shape of the grounding member 350 can be changed in relation to conventional fixing members (e.g., only including the first body 320 (see...)). Figure 4 ) without the first blocking part 310 (see Figure 4 Stress concentration occurs on an adjacent portion of the fixed component, causing the rigidity of said portion to be relatively weakened. When the portion with relatively weakened rigidity is corroded by reaction with the cleaning gas used in the cleaning process, the grounding component 350 may be damaged.

[0052] As described above, although the deposition apparatus 100 has been described as having a configuration including the storage member 290, the configuration of the present invention is not limited thereto. For example, the deposition apparatus 100 may not include the storage member 290, and the deposition apparatus 100 may also include a gas supply line connecting the storage member 290 to the through opening 505. Clean gas including NF3 (or CF) may be supplied to the deposition apparatus 100 through the gas supply line.

[0053] According to an embodiment of the deposition apparatus 100 of the present invention, the first fixing member 300 may include a first blocking portion 310 and a first body 320 (see...). Figure 4 When the suction member 570 draws in cleaning gas through the through opening 215 formed in the lower portion 211 of the chamber 210, the cleaning gas located between the distribution member 530 and the support member 250 can pass over the top surface of the support member 250 and move along the sidewall (e.g., the first sidewall) of the support member 250 in the direction from the support member 250 to the lower portion 211 of the chamber 210. The first blocking portion 310 of the first fixing member 300 can shield a relatively weakened rigid portion of the grounding member 350 so that the cleaning gas does not contact (i.e., does not corrode) said portion of the grounding member 350, and the cleaning gas can pass over the peripheral surface of the first blocking portion 310 of the first fixing member 300 to be drawn into the suction member 570 through the through opening 215. Therefore, the first blocking portion 310 can prevent said portion of the grounding member 350 from being corroded by the cleaning gas during the cleaning process, and the grounding member 350 will not be damaged under stress concentration. The cleaning process can be performed on the deposition apparatus 100 without causing corrosion problems.

[0054] Refer again Figures 1 to 3The chamber 210 may include a space defined by a lower portion 211 and a sidewall 212. Support member 250, first fixing member 300, second fixing member 400, grounding member 350, substrate 270, etc., may be located in the space. The chamber 210 may be in a grounded state. The chamber 210 may include metal, alloy, etc. For example, chamber 210 may include gold (Au), silver (Ag), aluminum (Al), tungsten (W), copper (Cu), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), nickel-titanium (Ni-Ti), nickel-aluminum (Ni-Al), copper-zinc-nickel (Cu-Zn-Ni), copper-aluminum-nickel (Cu-Al-Ni), copper-aluminum-manganese (Cu-Al-Mn), titanium-nickel-copper-molybdenum (Ti-Ni-Cu-Mo), cobalt-nickel-gallium:iron (Co-Ni-Ga:Fe), silver-nickel (Ag-Ni), gold-cadmium (Au-Cd), iron-platinum (Fe-Pt), iron-nickel (Fe-Ni), indium-cadmium (In-Cd), etc. In some embodiments, chamber 210 may include stainless steel (SUS). In some embodiments, chamber 210 may include aluminum (e.g., bare aluminum) or may be formed of aluminum (e.g., bare aluminum).

[0055] In other embodiments, the deposition apparatus 100 may further include a chamber cover disposed on the chamber 210 to surround the cover member 510. The chamber cover is not electrically connected to the cover member 510, but may be electrically connected to the chamber 210 to be grounded. The chamber cover may protect the cover member 510. The chamber cover may comprise the same material included in the chamber 210.

[0056] Substrate 270 may include a quartz substrate, a synthetic quartz substrate, a calcium fluoride substrate, a fluorine-doped quartz (F-doped quartz) substrate, a soda-lime glass substrate, a non-alkaline glass substrate, etc. In other embodiments, substrate 270 may be a transparent resin substrate. Examples of transparent resin substrates that can be used as substrate 270 include polyimide substrates. In embodiments, the polyimide substrate may include a first polyimide layer, a barrier film layer, a second polyimide layer, etc., and a rigid glass substrate for supporting the polyimide substrate may be located below the polyimide substrate.

[0057] The support member 250 can be located within the space of the chamber 210. For example... Figure 3As shown, a portion of each of the first blocking portions 310 of the first fixing member 300 may overlap with the first side surface 250a, the second side surface 250b, the third side surface 250c, and the fourth side surface 250d. For example, the first blocking portion 310 may be arranged on each of the first side surface 250a and the fourth side surface 250d in a first direction D1 (or a fifth direction D5 opposite to the first direction D1), and the first blocking portion 310 may be arranged on each of the second side surface 250b and the third side surface 250c in a second direction D2 orthogonal to the first direction D1 (or a sixth direction D6 opposite to the second direction D2). The first side surface 250a and the fourth side surface 250d may face each other, and the second side surface 250b and the third side surface 250c may face each other. The support member 250 may have a plate shape to support the substrate 270. The support member 250 may be in a grounded state. For example, the support member 250 can be electrically connected to the chamber 210 via the first fixing member 300, the grounding member 350, and the second fixing member 400. The support member 250 may include metal, alloy, etc. In some embodiments, the support member 250 may include SUS. In some embodiments, the support member 250 may include Al (e.g., anodized Al) or may be formed of Al (e.g., anodized Al). However, the portion of the support member 250 that contacts the grounding member 350 may include bare Al (unanodized) or may be formed of bare Al (unanodized).

[0058] A cover member 510 may be disposed on chamber 210. The cover member 510 may include a through opening 505. Storage member 290 may be connected through the through opening 505. During the deposition process, a voltage V may be applied to the cover member 510. The cover member 510 may include a metal, alloy, etc. In some embodiments, the cover member 510 may include SUS. In some embodiments, the cover member 510 may include Al (e.g., bare Al) or may be formed of Al (e.g., bare Al).

[0059] Storage member 290 may be disposed on cover member 510 such that storage member 290 can be connected to cover member 510 through through opening 505. Gas can be stored in storage member 290. For example, when deposition apparatus 100 performs a PECVD process, storage member 290 may be filled with deposition gas including N2O and SiH4, and when deposition apparatus 100 performs a cleaning process, storage member 290 may be filled with cleaning gas including NF3. Deposition gas and cleaning gas can move to distribution member 530 through through opening 505 of cover member 510. Storage member 290 may include metal, alloy, etc. In some embodiments, storage member 290 may include SUS.

[0060] The dispensing member 530 may be disposed below the through opening 505 of the cover member 510. The dispensing member 530 may be spaced apart from the support member 250 in a third direction D3 perpendicular to the first direction D1 and the second direction D2. The dispensing member 530 may include a plurality of openings 535. After the deposited gas or cleaning gas stored in the storage member 290 moves into the dispensing member 530 through the through opening 505 of the cover member 510, the deposited gas or cleaning gas can move through the openings 535 of the dispensing member 530 into the space between the dispensing member 530 and the substrate 270. Since the top surface of the dispensing member 530 can contact the bottom surface of the cover member 510, the dispensing member 530 and the cover member 510 can be electrically connected to each other, such that a voltage V applied to the cover member 510 can be applied to the dispensing member 530. The dispensing member 530 may include a metal, alloy, etc. In some embodiments, the dispensing member 530 may include SUS. In some embodiments, the dispensing member 530 may include Al (e.g., bare Al) or may be formed of Al (e.g., bare Al).

[0061] A first O-ring 551, an insulating member 560, and a second O-ring 552 may be disposed between the sidewall 212 of the chamber 210 and the cover member 510. Each of the first O-ring 551 and the second O-ring 552 may seal the gap between the cover member 510 and the chamber 210 and may prevent gas in the space of the chamber 210 from leaking to the outside. For example, the first O-ring 551 may be located between the sidewall 212 and the insulating member 560, and the second O-ring 552 may be located between the cover member 510 and the insulating member 560. The insulating member 560 may be located between the first O-ring 551 and the second O-ring 552. The insulating member 560 may prevent the cover member 510 from contacting the chamber 210. Since the chamber 210 is grounded and a voltage V is applied to the cover member 510, the insulating member 560 may be disposed between the chamber 210 and the cover member 510 such that the chamber 210 and the cover member 510 are not electrically connected to each other. For example, to seal the gap between the chamber 210 and the cover member 510, the top surface of the cover member 510 can be pressed in a fourth direction D4, opposite to the third direction D3. Since the insulating member 560 is inserted between the sidewall 212 of the chamber 210 and the cover member 510, the sidewall 212 of the chamber 210 and the cover member 510 do not contact each other even when the top surface of the cover member 510 is pressed in the fourth direction D4. Each of the first O-ring 551, the insulating member 560, and the second O-ring 552 may include an insulating material. In some embodiments, each of the first O-ring 551, the insulating member 560, and the second O-ring 552 may be formed of Teflon.

[0062] The suction member 570 can be disposed below the lower portion 211 of the chamber 210, such that the suction member 570 can be connected to the through opening 215 formed in the lower portion 211 of the chamber 210. The suction member 570 can draw in air located in the space of the chamber 210 to maintain the space under vacuum during the PECVD process. During the cleaning process, the suction member 570 can draw in cleaning gas located in the space of the chamber 210. Because the suction member 570 is connected to the through opening 215 formed in the lower portion 211, the cleaning gas located in the space can move in the fourth direction D4 to be drawn into the suction member 570. The suction member 570 may include metal, alloy, etc. In some embodiments, the suction member 570 may include SUS.

[0063] The lifting member 590 can pass through the lower portion 211 of the chamber 210 and can contact the bottom surface of the support member 250. The lifting member 590 can move in a third direction D3 or a fourth direction D4. For example, as... Figure 1 , Figure 2 and Figure 3 As shown, when the lifting member 590 moves in a third direction D3 (e.g., from the lower portion 211 of chamber 210 to the support member 250), the distance between the substrate 270 and the dispensing member 530 can be relatively reduced, and the grounding member 350 can have a smooth curved shape. Alternatively, when the lifting member 590 moves in a fourth direction D4 (e.g., from the support member 250 to the lower portion 211 of chamber 210), the distance between the substrate 270 and the dispensing member 530 can be relatively increased, and the grounding member 350 can have a steep curved shape or an S-shape. Movement of the lifting member 590 in the third direction D3 or the fourth direction D4 can change the shape of the grounding member 350. In some embodiments, the lifting member 590 can be in a grounded state, and the support member 250 can be electrically connected to the lifting member 590. The portion of the support member 250 that contacts the lifting member 590 can include bare Al (unanodized) or can be formed of bare Al (unanodized). The lifting member 590 may include metal, alloy, etc. In some embodiments, the lifting member 590 may include SUS. In some embodiments, the lifting member 590 may include Al (e.g., bare Al) or may be formed of Al (e.g., bare Al).

[0064] Figure 4 It is shown Figure 1 A cross-sectional view of region 'A'. Figure 5A and Figure 5B It is used to describe Figure 4 A perspective view of the first and second fixing members shown. For example, Figure 4 It is used to describe when from Figure 3A cross-sectional view of a first fixing member 300 disposed on the first side surface 250a, a grounding member 350 connected to the first fixing member 300, and a second fixing member 400 connected to the grounding member 350, when viewed from the inside to the outside of the chamber 210 (e.g., the second direction D2).

[0065] refer to Figure 1 , Figure 4 , Figure 5A and Figure 5B The first fixing member 300 may include a first blocking portion 310 and a first body 320, and the second fixing member 400 may include a second body 420. For example... Figure 5A As shown, the first body 320 may include a first side surface 320c, a second side surface 320d facing the first side surface 320c, and an upper surface having a top surface portion 320a and a curved surface portion 320b. In an embodiment, the top surface portion 320a may be a flat top surface. Figure 5B As shown, the second body 420 may include a first side surface 420c, a second side surface 420d facing the first side surface 420c, and a lower surface having a bottom surface portion 420a and a curved surface portion 420b. In an embodiment, the bottom surface portion 420a may be a flat bottom surface.

[0066] A grounding member 350 can be disposed between the support member 250 and the lower portion 211 of the chamber 210. For example, the first end portion of the grounding member 350 can be located between the bottom surface and the top surface portion 320a of the support member 250 and between the bottom surface of the support member 250 and the curved surface portion 320b of the first body 320, and the second end portion of the grounding member 350 opposite to the first end portion can be located between the lower portion 211 of the chamber 210 and the bottom surface portion 420a and between the lower portion 211 of the chamber 210 and the curved surface portion 420b of the second body 420. In an embodiment, the first end portion can contact the top surface portion 320a, and the second end portion can contact the bottom surface portion 420a. Since the first end portion and the second end portion of the grounding member 350 are in contact with the support member 250 and the chamber 210 respectively, the support member 250 can be grounded. Therefore, the support member 250 and the chamber 210 can be electrically connected to each other through the grounding member 350.

[0067] In some embodiments, when the lifting member 590 moves in the fourth direction D4, the grounding member 350 can be pressed inward, and Figure 4 The contact area between the first end portion of the grounding member 350 and the curved surface portion 320b can become relatively small.

[0068] As described above, when the lifting member 590 moves in the third direction D3 or the fourth direction D4, stress may concentrate on the portion 350a of the grounding member 350 adjacent to the first fixing member 300. In an embodiment, the portion 350a of the grounding member 350 may be located on the curved surface portion 320b of the first fixing member 300. The concentrated stress may cause a relative weakening of the rigidity of the portion 350a. For example, the portion 350a of the grounding member 350 may be a portion overlapping the curved surface portion 320b of the first fixing member 300, and in the cleaning process, the first blocking portion 310 may shield the portion 350a from the cleaning gas. In an embodiment, the portion 350a of the grounding member 350 may be a part of the first end portion of the grounding member 350.

[0069] In conventional deposition apparatuses, the cleaning gas used in the cleaning process can move in the fourth direction D4. Since the first fixed member of a conventional deposition apparatus does not include the first blocking portion 310, the space defined by the curved surface portion 320b and the bottom surface of the support member 250 adjacent to the curved surface portion 320b can be exposed to the cleaning gas moving in the fourth direction D4. For example, some of the cleaning gas moving in the fourth direction D4 can permeate into the space, thereby corroding the grounding member 350. When the cleaning gas corrodes the relatively weakened rigid portion 350a of the grounding member 350, movement of the lifting member 590 can cause damage to portion 350a of the grounding member 350.

[0070] In some embodiments, the first blocking portion 310 may be formed on the first side surface 320c of the first body 320, and the first blocking portion 310 may shield the space defined by the curved surface portion 320b and the bottom surface of the support member 250, such that the space is not exposed to the outside in which the cleaning gas moves in the fourth direction D4, or the space is shielded by the first blocking portion 310 to be invisible. Therefore, the first blocking portion 310 can prevent the cleaning gas from seeping into the space, and the cleaning gas does not corrode the portion 350a of the grounding member 350.

[0071] like Figure 3As shown, the grounding member 350 may have a shape that is bent in the same direction as the planar direction of the side surface of the support member 250. The grounding member 350 does not have a bent shape that protrudes in a direction from the side surface of the support member 250. For example, each of the grounding members 350 may have an inner surface and an outer surface, wherein the inner surface and the outer surface are defined such that the inner surface of each grounding member 350 contacts the top surface portion 320a of the first fixing member 300 (or the bottom surface portion 420a of the second fixing member 400), and the outer surface of each grounding member 350 contacts the bottom surface of the support member 250 (or the lower portion 211 of the chamber 210). The bending shape of each of the grounding members 350 adjacent to the first side surface 250a of the support member 250 is such that its outer surface faces the first direction D1; the bending shape of each of the grounding members 350 adjacent to the second side surface 250b of the support member 250 is such that its outer surface faces the sixth direction D6; the bending shape of each of the grounding members 350 adjacent to the third side surface 250c of the support member 250 is such that its outer surface faces the second direction D2; and the bending shape of each of the grounding members 350 adjacent to the fourth side surface 250d of the support member 250 is such that its outer surface faces the fifth direction D5. The bending shape of each of the grounding members 350 can be determined as described above, such that portion 350a can be shielded by the first blocking portion 310 of the first fixing member 300. In some embodiments, the bending shape of each of the grounding members 350 adjacent to the first side surface 250a is such that the outer surface faces the fifth direction D5, the bending shape of each of the grounding members 350 adjacent to the second side surface 250b is such that the outer surface faces the second direction D2, the bending shape of each of the grounding members 350 adjacent to the third side surface 250c is such that the outer surface faces the sixth direction D6, and the bending shape of each of the grounding members 350 adjacent to the fourth side surface 250d is such that the outer surface faces the first direction D1.

[0072] The grounding member 350 may include metal, alloy, etc. In some embodiments, the grounding member 350 may include SUS. In some embodiments, the grounding member 350 may include Al (e.g., bare Al or multi-bonded Al) or may be formed of Al (e.g., bare Al or multi-bonded Al).

[0073] The first fixing member 300 may be disposed below the first end portion of the grounding member 350 and may overlap at least a portion of the side surface of the support member 250 (e.g., the first side surface 250a, the second side surface 250b, the third side surface 250c, and the fourth side surface 250d). For example, the first body 320 may be located below the first end portion, and the first blocking portion 310 located on the first side surface 320c of the first body 320 may contact at least a portion of the side surface of the support member 250. The first blocking portion 310 may extend in a direction parallel to the side surface of the support member 250 and may overlap with the first end portion (e.g., portion 350a) of the grounding member 350. For example, in Figure 3 In this configuration, each of the portions 350a of the grounding member 350 can be shielded by a corresponding first blocking portion 310, which can be attached to (or in contact with) the side surfaces of the support member 250 (e.g., the first side surface 250a, the second side surface 250b, the third side surface 250c, and the fourth side surface 250d). As described above, the cleaning gas can flow along the side surfaces of the support member 250 to be drawn out by the suction member 570, and therefore the first blocking portion 310 can prevent the cleaning gas flowing along the side surfaces of the support member 250 toward the suction member 570 from diffusing into the portions 350a of the grounding member 350.

[0074] The top surface portion 320a of the first body 320 may be adjacent to the bottom surface of the support member 250, and the curved surface portion 320b may be located in the direction in which the first blocking portion 310 protrudes from the top surface portion 320a. The curved surface portion 320b may be formed on the first body 320 to reduce the stress on the grounding member 350, and the first through opening 305 may be formed in the first body 320 to fix the grounding member 350 to the support member 250 by means of the first fixing pin 371.

[0075] The first fixing member 300 may include metal, alloy, etc. In some embodiments, the first fixing member 300 may include SUS. In some embodiments, the first fixing member 300 may include Al (e.g., bare Al) or may be formed of Al (e.g., bare Al). In some embodiments, the first blocking portion 310 and the first body 320 may be integrally formed. In other embodiments, the first blocking portion 310 may be fixed to the first body 320 by a fixing pin or the like. In some embodiments, the first blocking portion 310 may contact corresponding side surfaces 250a to 250d of the first body 320 and the support member 250.

[0076] A first retaining pin 371 may pass through the first body 320 of the first retaining member 300 and the first end portion of the grounding member 350 to secure the first body 320 of the first retaining member 300 and the first end portion of the grounding member 350 to the bottom surface of the support member 250 adjacent to the side surfaces of the support member 250 (e.g., the first side surface 250a, the second side surface 250b, the third side surface 250c, and the fourth side surface 250d). For example, the first retaining pin 371 may pass through the first through opening 305 of the first retaining member 300 and the grounding member 350 to be immersed in the support member 250. A through opening or groove overlapping the first through opening 305 may be formed at the first end portion of the grounding member 350, and the first retaining pin 371 may pass through the through opening or groove. The first retaining pin 371 may include metal, alloy, etc. In some embodiments, the first retaining pin 371 may include SUS.

[0077] In some embodiments, the first retaining pin 371 may pass through a portion of the top surface of the support member 250 that overlaps with the first through opening 305 to extend into the first body 320. The first retaining pin 371 may pass through the support member 250 to be immersed in the first body 320 of the first retaining member 300. When the first retaining pin 371 is immersed in the support member 250 and the first body 320, threads may be formed in the support member 250 and the first body 320.

[0078] The second fixing member 400 may be disposed on the second end portion of the grounding member 350 opposite to the first end portion. For example, the second body 420 may be located on the second end portion. In an embodiment, the bottom surface portion 420a of the second body 420 may be adjacent to the lower portion 211 of the chamber 210, and the curved surface portion 420b may be located in the direction in which the first blocking portion 310 protrudes. The curved surface portion 420b may be formed on the second body 420 to reduce the stress on the grounding member 350, and the second through opening 405 may be formed in the second body 420 to fix the grounding member 350 to the lower portion 211 of the chamber 210 by the second fixing pin 372. In some embodiments, the second fixing member 400 may be located below the first fixing member 300, and the first body 320 of the first fixing member 300 and the second body 420 of the second fixing member 400 may be arranged symmetrically in a direction parallel to the top surface of the support member 250. For example, the second fixing member 400 may have an inverted shape of the first fixing member 300. In some embodiments, due to the curved surface portion 320b of the first fixing member 300 and the curved surface portion 420b of the second fixing member 400, the grounding member 350 may have a curved shape (e.g., a bent shape) between the support member 250 and the lower portion 211 of the chamber 210. The second fixing member 400 may include metal, alloy, etc. In some embodiments, the second fixing member 400 may include SUS. In some embodiments, the second fixing member 400 may include Al (e.g., bare Al) or may be formed of Al (e.g., bare Al).

[0079] The second retaining pin 372 can pass through the second body 420 of the second retaining member 400 and the second end portion of the grounding member 350 to secure the second body 420 of the second retaining member 400 and the second end portion of the grounding member 350 to the lower portion 211 of the chamber 210. For example, the second retaining pin 372 can pass through the second through opening 405 of the second retaining member 400 and the grounding member 350 to be immersed in the lower portion 211 of the chamber 210. A through opening or groove overlapping the second through opening 405 can be formed at the second end portion of the grounding member 350, and the second retaining pin 372 can pass through the through opening or groove. The second retaining pin 372 can include metal, alloy, etc. In some embodiments, the second retaining pin 372 can include SUS.

[0080] However, although the first end portion of the grounding member 350 according to the invention has been shown in contact with the support member 250 (or although the second end portion of the grounding member 350 according to the invention has been shown in direct contact with the lower portion 211 of the chamber 210), the configuration of the invention is not limited thereto. For example, a strip comprising bare A1 can be inserted between the first end portion of the grounding member 350 and the support member 250 (or between the second end portion of the grounding member 350 and the lower portion 211 of the chamber 210).

[0081] Therefore, it can provide Figures 1 to 5B The deposition apparatus 100 shown.

[0082] Figure 6 This is a cross-sectional view showing a deposition apparatus according to an embodiment of the present invention, and Figure 7 It is shown Figure 6 A cross-sectional view of region 'B'. Besides the first fixing member 300, which includes the first blocking portion 315 and the first body 320. Figure 6 and Figure 7 The deposition apparatus 600 shown may have the same characteristics as the reference. Figures 1 to 5B The configuration of the described deposition apparatus 100 is substantially the same or similar. Figure 6 and Figure 7 In the text, omissions and references will be used. Figures 1 to 5B Redundant descriptions of components that are essentially the same or similar to the components being described.

[0083] refer to Figure 6 and Figure 7 The deposition apparatus 600 may include a chamber 210, a support member 250, a first fixing member 300, a second fixing member 400, a first fixing pin 371, a second fixing pin 372, a grounding member 350, a first O-ring 551, a second O-ring 552, an insulating member 560, a suction member 570, a covering member 510, a storage member 290, a dispensing member 530, a lifting member 590, etc. In an embodiment, the chamber 210 may include a lower portion 211 and a side wall 212, and the support member 250 may include a first side surface 250a, a second side surface 250b, a third side surface 250c, and a fourth side surface 250d. Figure 6 The support member 250 shown corresponds to the first side surface 250a. The first fixing member 300 may include a first blocking portion 315 and a first body 320, and the second fixing member 400 may include a second body 420. Figure 5A As shown, the first body 320 may include a first side surface 320c, a second side surface 320d facing the first side surface 320c, and an upper surface having a top surface portion 320a and a curved surface portion 320b. In an embodiment, the top surface portion 320a may be a flat top surface. Figure 5B As shown, the second body 420 may include a first side surface 420c, a second side surface 420d facing the first side surface 420c, and a lower surface having a bottom surface portion 420a and a curved surface portion 420b. In an embodiment, the bottom surface portion 420a may be a flat bottom surface.

[0084] When with Figures 1 to 5B When comparing the first blocking part 310, Figure 6 and Figure 7 The first blocking portion 315 may include a first blocking portion 315 overlapping at least a portion of the first side surface 250a, a first blocking portion 315 overlapping at least a portion of the second side surface 250b, a first blocking portion 315 overlapping at least a portion of the third side surface 250c, and a first blocking portion 315 overlapping at least a portion of the fourth side surface 250d. For example, the deposition apparatus 100 may include a plurality of first blocking portions 310 on the side surface of the support member 250, and the deposition apparatus 600 may include a first blocking portion 315 (i.e., a single blocking portion) integrally formed on the side surface of the support member 250. The single blocking portion may extend along the side surface of the support member 250 to shield the portion 350a of the grounding member 350 adjacent to the side surface of the support member 250 from being visible.

[0085] Since the deposition apparatus 600 according to an embodiment of the present invention includes a first blocking portion 315 integrally formed on the side surface of the support member 250, the cleaning gas can be completely shielded from the portion 350a of the grounding member 350, and the grounding member 350 can be used without being damaged by corrosion (e.g., breakage) even when performing the cleaning process.

[0086] Figure 8 This is a cross-sectional view showing a deposition apparatus according to an embodiment of the present invention, and Figure 9 It is shown Figure 8 A cross-sectional view of region 'C'. Besides the second fixing member 400, which includes the second blocking portion 410 and the second body 420. Figure 8 and Figure 9 The deposition apparatus 700 shown may have the same characteristics as the reference. Figures 1 to 5B The configuration of the described deposition apparatus 100 is substantially the same or similar. Figure 8 and Figure 9 In the text, omissions and references will be used. Figures 1 to 5B Redundant descriptions of components that are essentially the same or similar to the components being described.

[0087] refer to Figure 8 and Figure 9The deposition apparatus 700 may include a chamber 210, a support member 250, a first fixing member 300, a second fixing member 400, a first fixing pin 371, a second fixing pin 372, a grounding member 350, a first O-ring 551, a second O-ring 552, an insulating member 560, a suction member 570, a covering member 510, a storage member 290, a dispensing member 530, a lifting member 590, etc. The chamber 210 may include a lower portion 211 and a side wall 212. The support member 250 may include a first side surface 250a, a second side surface 250b, a third side surface 250c, and a fourth side surface 250d. Figure 8 The support member 250 shown corresponds to the first side surface 250a. The first fixing member 300 may include a first blocking portion 310 and a first body 320, and the second fixing member 400 may include a second blocking portion 410 and a second body 420. Figure 5A As shown, the first body 320 may include a first side surface 320c, a second side surface 320d facing the first side surface 320c, and an upper surface having a top surface portion 320a and a curved surface portion 320b. In an embodiment, the top surface portion 320a may be a flat top surface. Figure 5B As shown, the second body 420 may include a first side surface 420c, a second side surface 420d facing the first side surface 420c, and a lower surface having a bottom surface portion 420a and a curved surface portion 420b. In an embodiment, the bottom surface portion 420a may be a flat bottom surface. The grounding member 350 may include a first portion 350a and a second portion 350b, where the first portion 350a is part of a first end portion and the second portion 350b is part of a second end portion.

[0088] The second fixing member 400 may be disposed on the second portion 350b of the grounding member 350. For example, the second body 420 may be located on the second portion 350b, and the second blocking portion 410 may be located on the first side surface 420c of the second body 420. In some embodiments, the second blocking portion 410 may extend in a direction parallel to the side surface of the support member 250 or in a direction parallel to the first blocking portion 310, and may overlap with the second portion 350b of the grounding member 350. For example, the second blocking portion 410 may be formed on the first side surface 420c of the second body 420, and the second blocking portion 410 may shield the space defined by the lower portion 211 of the chamber 210 and the curved surface portion 420b, so that the space is not exposed to the outside. In some embodiments, the second blocking portion 410 and the second body 420 may be integrally formed. In other embodiments, the second blocking portion 410 may be fixed to the second body 420 by means of a fixing pin or the like.

[0089] For example, the support member 250 can be moved in a third direction D3 or a fourth direction D4 by the lifting member 590. This movement of the lifting member 590 can change the shape of the grounding member 350, and as the shape of the grounding member 350 changes, stress can be concentrated on the first portion 350a and the second portion 350b of the grounding member 350 adjacent to the first fixing member 300 and the second fixing member 400, respectively, so that the rigidity of each of the first portion 350a and the second portion 350b can be relatively weakened.

[0090] According to an embodiment of the deposition apparatus 700 of the present invention, the first fixing member 300 may include a first blocking portion 310 and a first body 320, and the second fixing member 400 may include a second blocking portion 410 and a second body 420. When the suction member 570 draws in clean gas through the through opening 215 formed in the lower portion 211 of the chamber 210, the clean gas located between the dispensing member 530 and the support member 250 can pass through the top surface of the support member 250 and move along the side wall (e.g., the first side wall) of the support member 250 in the direction from the support member 250 to the lower portion 211 of the chamber 210. The first blocking portion 310 of the first fixing member 300 and the second blocking portion 410 of the second fixing member 400 can respectively shield the grounding member 350 with relatively weakened rigidity, specifically the first portion 350a and the second portion 350b, so that the cleaning gas does not contact each of the first portion 350a and the second portion 350b of the grounding member 350, and the cleaning gas can be drawn into the suction member 570 through the through opening 215 via the peripheral surfaces of the first blocking portion 310 of the first fixing member 300 and the second blocking portion 410 of the second fixing member 400. Therefore, each of the first portion 350a and the second portion 350b of the grounding member 350 can be prevented from being corroded by the cleaning gas, and the grounding member 350 can be used without damage (e.g., breakage) even when performing the cleaning process. In other words, defects in the deposition apparatus 700 caused by the cleaning process can be prevented.

[0091] Figure 10 This is a cross-sectional view showing a deposition apparatus according to an embodiment of the present invention, and Figure 11 It is shown Figure 10 A cross-sectional view of region 'D'. Besides the first fixing member 300 including the first blocking portion 315 and the first body 320, and the second fixing member 400 including the second blocking portion 415 and the second body 420, Figure 10 and Figure 11 The deposition apparatus 800 shown may have the same characteristics as the reference. Figure 8 and Figure 9 The configuration of the described deposition apparatus 700 is substantially the same or similar. Figure 10and Figure 11 In the text, omissions and references will be used. Figure 8 and Figure 9 Redundant descriptions of components that are essentially the same or similar to the components being described.

[0092] refer to Figure 10 and Figure 11 The deposition apparatus 800 may include a chamber 210, a support member 250, a first fixing member 300, a second fixing member 400, a first fixing pin 371, a second fixing pin 372, a grounding member 350, a first O-ring 551, a second O-ring 552, an insulating member 560, a suction member 570, a covering member 510, a storage member 290, a dispensing member 530, a lifting member 590, etc. In an embodiment, the chamber 210 may include a lower portion 211 and a sidewall 212, and the support member 250 may include a first side surface 250a, a second side surface 250b, a third side surface 250c, and a fourth side surface 250d. Figure 10 The support member 250 shown corresponds to the first side surface 250a. The first fixing member 300 may include a first blocking portion 315 and a first body 320, and the second fixing member 400 may include a second blocking portion 415 and a second body 420. Figure 5A As shown, the first body 320 may include a first side surface 320c, a second side surface 320d facing the first side surface 320c, and an upper surface having a top surface portion 320a and a curved surface portion 320b. In an embodiment, the top surface portion 320a may be a flat top surface. Figure 5B As shown, the second body 420 may include a first side surface 420c, a second side surface 420d facing the first side surface 420c, and a lower surface having a bottom surface portion 420a and a curved surface portion 420b. In an embodiment, the bottom surface portion 420a may be a flat bottom surface.

[0093] When with Figure 8 and Figure 9 When comparing the second blocking part 410, Figure 10 and Figure 11The second blocking portion 415 may include a second blocking portion 415 disposed below a first blocking portion 315 overlapping at least a portion of the first side surface 250a, a second blocking portion 415 disposed below a first blocking portion 315 overlapping at least a portion of the second side surface 250b, a second blocking portion 415 disposed below a first blocking portion 315 overlapping at least a portion of the third side surface 250c, and a second blocking portion 415 disposed below a first blocking portion 315 overlapping at least a portion of the fourth side surface 250d. For example, the deposition apparatus 800 may include a plurality of second blocking portions 410 below the side surface of the support member 250, and the deposition apparatus 800 may include second blocking portions 415 integrally formed below the side surface of the support member 250.

[0094] Figure 12 This is a cross-sectional view showing a deposition apparatus according to an embodiment of the present invention. Except for the support member 255, Figure 12 The deposition apparatus 900 shown may have the same characteristics as the reference. Figures 1 to 5B The configuration of the described deposition apparatus 100 is substantially the same or similar. Figure 12 In the text, omissions and references will be used. Figures 1 to 5B Redundant descriptions of components that are substantially the same or similar to those described.

[0095] refer to Figure 12 The deposition apparatus 900 may include a chamber 210, a support member 255, a first fixing member 300, a second fixing member 400, a first fixing pin 371, a second fixing pin 372, a grounding member 350, a first O-ring 551, a second O-ring 552, an insulating member 560, a suction member 570, a covering member 510, a storage member 290, a dispensing member 530, a lifting member 590, etc. In an embodiment, the chamber 210 may include a lower portion 211 and a sidewall 212. The first fixing member 300 may include a first body 320, and the second fixing member 400 may include a second body 420.

[0096] When with Figures 1 to 5B When comparing the support member 250 and the first fixing member 300, Figure 12 The support member 255 may have a protrusion extending from the periphery of the support member 255 in the fourth direction D4, and the first fixing member 300 does not include the first blocking portion 310. The protrusion of the support member 255 may serve as the first blocking portion 310 of the first fixing member 300.

[0097] Figure 13 This is a cross-sectional view showing a deposition apparatus according to an embodiment of the present invention. Except for the position of the first fixing member 300, Figure 13The deposition apparatus 1000 shown may have the same characteristics as the reference. Figures 1 to 5B The configuration of the described deposition apparatus 100 is substantially the same or similar. Figure 13 In the text, omissions and references will be used. Figures 1 to 5B Redundant descriptions of components that are essentially the same or similar to the components being described.

[0098] refer to Figure 13 The deposition apparatus 1000 may include a chamber 210, a support member 250, a first fixing member 300, a second fixing member 400, a first fixing pin 371, a second fixing pin 372, a grounding member 350, a first O-ring 551, a second O-ring 552, an insulating member 560, a suction member 570, a covering member 510, a storage member 290, a dispensing member 530, a lifting member 590, etc. In an embodiment, the chamber 210 may include a lower portion 211 and a side wall 212. The first fixing member 300 may include a first blocking portion 310 and a first body 320, and the second fixing member 400 may include a second body 420.

[0099] When with Figures 1 to 5B When comparing the first fixed member 300, Figure 13 The outer surface of the first fixing member 300 (e.g., the outer surface of the first blocking portion 310) can be aligned with the side surface of the support member 250, such that no step is formed between the side surface of the support member 250 and the outer surface of the first fixing member 300. Without such a step, the cleaning gas can easily move to the lower portion 211 of the chamber 210 and can be drawn into the suction member 570.

[0100] The concept of this invention can be applied to various deposition apparatuses that include grounding components. For example, the concept of this invention can be applied to many deposition apparatuses, such as deposition apparatuses for depositing silicon-based insulating layers, deposition apparatuses for depositing silicon-based semiconductor layers, etc.

[0101] The above description is for illustrative purposes only and should not be construed as restrictive. Although several embodiments have been described, those skilled in the art will readily understand that many modifications may be made to some embodiments without substantially departing from the novel teachings and features of the inventive concept. Therefore, all such modifications are intended to be included within the scope of the inventive concept as defined in the claims. It should therefore be understood that the above description is for various embodiments and should not be construed as limiting oneself to the specific embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are intended to be included within the scope of the appended claims.

Claims

1. A deposition apparatus, comprising: The chamber includes the lower part and the side walls; A support member is located in the space defined by the lower portion of the chamber and the sidewall of the chamber, and includes a first side surface; A grounding member is disposed between the support member and the lower portion of the chamber; as well as The first fixing component includes: A first body, located below the first end portion of the grounding member, and including a first side surface, and The first blocking portion is located on the first side surface of the first body and the first side surface of the supporting member. The first blocking portion extends along the first side surface of the support member and shields the first end portion of the grounding member from being visible.

2. The deposition apparatus according to claim 1, further comprising: A first fixing pin passes through the first body of the first fixing member and the first end portion of the grounding member to fix the first body of the first fixing member and the first end portion of the grounding member to the bottom surface of the support member adjacent to the first side surface of the support member.

3. The deposition apparatus according to claim 2, wherein The first body of the first fixing member further includes an upper surface having a flat top surface portion and a curved surface portion, the flat top surface portion and the curved surface portion of the first body being adjacent to the bottom surface of the supporting member. The first fixing pin passes through the flat top surface portion of the first body of the first fixing member.

4. The deposition apparatus according to claim 3, in, The first end portion of the grounding member contacts the upper surface of the first body of the first fixing member, and The first blocking portion extends beyond the upper surface of the first body to define a space separated from the external shielding of the support member by the bottom surface of the support member and the curved surface portion of the first body.

5. The deposition apparatus according to claim 3, further comprising: The second fixing component includes the second body. The second body includes a first side surface, and The second body is located on the second end portion of the grounding member opposite to the first end portion and is adjacent to the lower portion of the chamber.

6. The deposition apparatus according to claim 5, further comprising: A second fixing pin passes through the second body of the second fixing member and the second end portion of the grounding member to fix the second body of the second fixing member and the second end portion of the grounding member to the lower portion of the chamber.

7. The deposition apparatus according to claim 5, in, The second fixing member is located below the first fixing member and has an inverted shape of the first fixing member.

8. The deposition apparatus according to claim 5, in, The second body of the second fixing member further includes a lower surface having a flat bottom surface portion and a curved surface portion, the flat bottom surface portion and the curved surface portion of the second body being adjacent to the lower portion of the chamber. Wherein, the grounding member has a curved shape between the support member and the lower portion of the chamber, and The grounding member extends along the curved surface portion of the first fixing member and the curved surface portion of the second fixing member.

9. The deposition apparatus according to claim 8, further comprising: The lifting member passes through the lower portion of the chamber. Wherein, the lifting member contacts the bottom surface of the supporting member, and The shape of the grounding member is configured to change in response to movement of the lifting member in the direction from the lower portion of the chamber to the supporting member or in the direction from the supporting member to the lower portion of the chamber.

10. The deposition apparatus according to claim 1, in, The supporting member and the chamber are electrically connected to each other through the grounding member.

11. The deposition apparatus according to claim 1, in, The chamber also includes a through opening formed in the lower portion. The deposition apparatus further includes an suction member connected to the through opening formed in the lower portion of the chamber, and The inhalation member is configured to inhale material located within the cavity.

12. The deposition apparatus according to claim 1, further comprising: A covering member is disposed on the chamber and includes a through opening; A storage component connected to the through opening of the covering component; as well as A distribution component is disposed below the through opening and includes multiple openings.

13. The deposition apparatus according to claim 12, in, The covering member and the distributing member are electrically connected to each other. Wherein, the covering member is electrically insulated from the cavity, and The deposited material stored in the storage member passes through the plurality of openings in the distribution member to be deposited on the substrate located on the support member.

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