Cleaning device and method of controlling a cleaning device

Abstract

The application discloses a cleaning device and a control method of the cleaning device. The cleaning device comprises a bearing mechanism and a cleaning mechanism. The bearing mechanism comprises a workbench with a supporting surface for fixing chips. The cleaning mechanism is arranged at the bottom of the workbench and is used for cleaning the chips. The workbench can rotate around a horizontal axis direction so that the supporting surface faces the cleaning mechanism. When the chips are cleaned, the supporting surface is arranged upward, a chip assembly is arranged on the supporting surface of the workbench, the chip assembly is fixed with the workbench, the workbench is rotated around the horizontal axis direction so that the supporting surface faces downward, at this time, the chips face one side of the cleaning mechanism, the cleaning mechanism is started, the cleaning mechanism cleans the chips, and in the cleaning process, powder and cleaning liquid are separated from the chips under the action of gravity. The cleaning effect is ensured, the cleaning time is shortened, the cleaning pressure or the rotating speed of the workbench does not need to be increased, the separation of the chips from the workbench is avoided, and the hidden danger of chip damage is eliminated.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more particularly to a cleaning apparatus. This invention also relates to a control method for the cleaning apparatus. Background Technology

[0002] This section provides only background information relevant to this disclosure and is not necessarily prior art.

[0003] In the semiconductor manufacturing process, wafers need to be separated into multiple individual chips. During the wafer separation process, a drive is usually used to drive a diamond saw blade to cut the wafer to meet the chip size requirements in the semiconductor production process.

[0004] During wafer dicing, powder residue remains on the chip surface. To prevent this powder from affecting semiconductor manufacturing, the chips need to be cleaned. In existing technology, the chip is placed on a cleaning stage that rotates horizontally. High-pressure deionized water and air are used to clean the chip surface. To shorten cleaning time and improve cleaning efficiency, this is usually achieved by increasing the pressure of the deionized water and air or increasing the stage rotation speed. However, increasing the pressure of the deionized water and air or increasing the stage rotation speed can easily cause the chip to separate from the stage and impact the cleaning chamber, resulting in chip damage. Summary of the Invention

[0005] A first aspect of the present invention provides a cleaning apparatus for semiconductor manufacturing, the cleaning apparatus comprising:

[0006] A support mechanism, the support mechanism including a worktable having a support surface for fixing chips;

[0007] A cleaning mechanism is provided at the bottom of the workbench and is used to clean the chip. The workbench is rotatable about a horizontal axis so that the supporting surface faces the cleaning mechanism.

[0008] A second aspect of the present invention provides a control method for a cleaning apparatus, which is implemented using the cleaning apparatus described above, and the control method includes the following steps:

[0009] Activate the retainer to secure the chip's tape to the support surface;

[0010] Activate the card holder to secure the chip frame;

[0011] The first driving mechanism is activated to orient the chip toward the cleaning mechanism;

[0012] Start the supply unit so that the cleaning material is sprayed onto the surface of the chip through the spraying unit;

[0013] Activate the connector to adjust the spraying position of the jetting component on the chip;

[0014] Start the drying unit to dry the cleaned chip. Attached Figure Description

[0015] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0016] Figure 1 A schematic diagram of the cleaning apparatus according to an embodiment of the present invention in a first state (the chip is in an uncleaned state) is shown.

[0017] Figure 2 for Figure 1 The diagram shows the cleaning device in its second state (the chip is in the cleaning state);

[0018] Figure 3 A flowchart illustrating a control method for a cleaning apparatus according to an embodiment of the present invention is shown schematically.

[0019] The attached figures are labeled as follows:

[0020] 100 is a cleaning device;

[0021] 10 represents the load-bearing mechanism;

[0022] 11 is the worktable, 12 is the first driving component, 13 is the first rotating shaft, 14 is the clamping component, and 15 is the third driving component;

[0023] 20 refers to the cleaning unit;

[0024] 21 is the supply component, 22 is the spray component, 23 is the connector, 24 is the first supply pipe, 25 is the second supply pipe, 26 is the third supply pipe, and 27 is the drying component.

[0025] 30 is the chip, 31 is the frame, and 32 is the tape. Detailed Implementation

[0026] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0027] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0028] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0029] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "over," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure is flipped, an element described as "below other elements or features" or "below other elements or features" would subsequently be oriented as "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0030] like Figures 1 to 3As shown, according to an embodiment of the present invention, a cleaning apparatus 100 is provided for semiconductor manufacturing. The cleaning apparatus 100 includes a support mechanism 10 and a cleaning mechanism 20. The support mechanism 10 includes a worktable 11 with a supporting surface for fixing a chip 30. The cleaning mechanism 20 is disposed at the bottom of the worktable 11 and is used for cleaning the chip 30. The worktable 11 is rotatable about a horizontal axis (e.g., ...). Figure 2 As shown, Figure 2 The horizontal axis of the paper is the X-axis, and the vertical axis is the Y-axis. The rotation of the worktable 11 around the X-axis is equivalent to the rotation of the worktable 11 around the horizontal axis, so that the supporting surface faces the cleaning mechanism 20. Specifically, after the wafer is separated into individual chips 30, the chips 30 are placed in the wafer frame 31 with adhesive tape 32. The chips 30 and the adhesive tape 32 cooperate to form a chip assembly. When the chips 30 need to be cleaned, the supporting surface faces upwards (e.g., ...). Figure 1 As shown, the worktable 11 is positioned on one side above the paper. The chip assembly is placed on the support surface of the worktable 11. After the chip assembly is fixed to the worktable 11, the worktable 11 is rotated around the horizontal axis so that the support surface faces downwards (e.g., ...). Figure 1 As shown, the workbench 11 is located on the side below the paper. At this time, the chip 30 faces the side of the cleaning mechanism 20. The cleaning mechanism 20 is started and cleans the chip 30. During the cleaning process, the powder and cleaning liquid will separate from the chip 30 under the action of gravity. While ensuring the cleaning effect, the cleaning time is shortened. In addition, there is no need to increase the cleaning pressure or the rotation speed of the workbench 11, which avoids the separation of the chip 30 from the workbench 11 and eliminates the risk of damage to the chip 30.

[0031] It should be understood that the cleaning mechanism 20 sprays the cleaning fluid onto the surface of the chip 30. Since the chip 30 is positioned facing the cleaning mechanism 20, the cleaning fluid causes the powder to separate from the chip 30. The cleaning fluid carrying the powder separates from the chip 30 under the action of gravity, thereby achieving the cleaning of the chip 30.

[0032] It should be noted that when cleaning the chip 30, the surface of the chip 30 only needs to be within the spray range of the cleaning mechanism 20, that is, the chip 30 rotates vertically with the worktable 11 until the cleaning material can fall along the surface of the chip 30 under the action of gravity (rotation angle greater than 90°).

[0033] In other embodiments, the cleaning mechanisms 20 are spaced apart and positioned to the side of the support mechanism 10. When the chip 30 rotates with the worktable 11, the chip 30 is angled to the horizontal (rotation angle less than or equal to 90°), and the cleaning material from the cleaning mechanism 20 is sprayed toward the chip 30, thereby achieving effective cleaning of the chip 30. By positioning the cleaning mechanisms 20 to the side of the support mechanism 10, the rotation stroke of the worktable 11 is shortened, further reducing the cleaning time.

[0034] To understand further, such as Figure 1 and Figure 2 As shown, the supporting mechanism 10 also includes a first driving member 12 and a first rotating shaft 13. The first driving member 12 is connected to the worktable 11 via the first rotating shaft 13 to drive the worktable 11 to rotate around the horizontal axis. Specifically, the first rotating shaft 13 cooperates with the worktable 11. When the chip 30 needs to be cleaned, the chip 30 is fixed on the support surface of the worktable 11. The first driving member 12 is activated, driving the rotation of the first rotating shaft 13, which in turn drives the worktable 11 to rotate around the horizontal axis. When the worktable 11 rotates to the desired position, the first driving member 12 stops working, and the cleaning mechanism 20 performs the cleaning operation on the chip 30. After the cleaning operation is completed, the first driving member 12 drives the worktable 11 to reset again via the first rotating shaft 13. The structure of flipping (rotating around the horizontal axis) of the worktable 11 by using the cooperation of the first driving member 12 and the first rotating shaft 13 is simple and has low manufacturing cost. In addition, the drive is flexible and rapid, further shortening the cleaning time of the chip 30, thereby improving the efficiency of semiconductor manufacturing.

[0035] It should be noted that in this invention, the first driving component 12 is a first stepper motor, and the first rotating shaft 13 is fixedly connected to the worktable 11. The first stepper motor is connected to the first rotating shaft 13 in a transmission manner. When the first stepper motor drives the first rotating shaft 13 to rotate, the first rotating shaft 13 can drive the worktable 11 to rotate, so that the supporting surface is set towards the side of the cleaning mechanism 20, so that the cleaning mechanism 20 can perform cleaning operations on the chip 30 located on the supporting surface. In addition, the first stepper motor can effectively control the rotation speed and rotation angle of the first rotating shaft 13, thereby achieving precise control of the rotation speed and rotation angle of the worktable 11, further ensuring the cleaning effect of the chip 30, and ensuring the product yield.

[0036] In other real-time modes, the first drive element 12 is a first hydraulic motor. By using the first hydraulic motor, a stable driving force is provided to the first rotating shaft 13 and the worktable 11, ensuring the effective rotation of the worktable 11.

[0037] Furthermore, such as Figure 1 and Figure 2As shown, the supporting mechanism 10 also includes a retaining member 14, which is connected to the worktable 11 and is used to cooperate with the frame 31 of the chip 30. Specifically, the wafer is separated into multiple chips 30, and the chips 30 are placed in the frame 31 with adhesive tape 32. When cleaning the chips 30, the frame 31 is placed on the supporting surface of the worktable 11, and the chips 30 are fixed by the cooperation of the retaining member 14 and the frame 31. When the chips 30 need to be cleaned, the worktable 11 is flipped (rotated about the horizontal axis) to one side of the cleaning mechanism 20, the cleaning mechanism 20 is activated, and the cleaning material is sprayed onto the surface of the chips 30, thereby cleaning the chips 30. By fixing the frame 31 with the retaining member 14, the placement position of the chips 30 is ensured, thereby ensuring the cleaning effect of the chips 30. In addition, by using the cooperation of the retaining member 14 and the frame 31, the separation of the chips 30 from the worktable 11 during the cleaning process is prevented, thereby avoiding damage to the chips 30.

[0038] Furthermore, such as Figure 1 and Figure 2 As shown, the supporting mechanism 10 includes a second driving member (not shown), which is connected to the holding member 14 in a transmission manner. Specifically, when it is necessary to fix the chip 30, the chip 30 with the frame 31 is placed on the supporting surface, and the second driving member is activated, causing the holding member 14 to engage with the frame 31, thereby fixing the chip 30. When it is necessary to remove the chip 30, the second driving member drives the holding member 14 in the opposite direction, causing the holding member 14 to separate from the frame 31, thereby removing the chip 30. The method of using the second driving member to drive the holding member 14 is simple in structure and convenient in operation, thereby shortening the time of cleaning the chip 30 and improving the cleaning efficiency of the chip 30.

[0039] It should be noted that in this invention, the retaining member 14 is a limiting ring, the second driving member is a second stepper motor, the limiting ring is connected to the second stepper motor, and the opening diameter of the limiting ring is smaller than the maximum diameter of the frame 31 (the frame 31 is a non-standard circle with a small diameter position). When it is necessary to fix the chip 30, the second stepper motor drives the limiting ring, which increases the gap between the limiting ring and the support member. The chip 30 with the frame 31 is placed on the support surface of the worktable 11 through the opening position of the limiting ring. The second stepper motor drives the limiting ring to move closer to the frame 31, thereby clamping the frame 31 between the worktable 11 and the limiting ring, thus achieving the fixation of the chip 30.

[0040] In other embodiments, the second driving component is a second hydraulic motor, and the holding component 14 is a hook. The hook is rotatably mounted on the worktable 11 and is connected to the second hydraulic motor for transmission. When it is necessary to fix the chip 30, the chip 30 with the frame 31 is placed on the supporting surface, and the second hydraulic motor drives the hook to flip, so that the hook portion of the hook catches the edge of the frame 31, thereby fixing the chip 30. When it is necessary to release the chip 30, the second hydraulic motor drives the hook in the opposite direction, so that the hook portion of the hook separates from the frame 31. The high strength of the cooperation between the hook and the second hydraulic motor further improves the stability of the chip 30 fixation.

[0041] Furthermore, such as Figure 1 and Figure 2 As shown, the supporting mechanism 10 also includes a fixing member (not shown), which is disposed on the supporting surface and is used to cooperate with the tape 32 of the chip 30. Specifically, when cleaning the chip 30, the chip 30 with the frame 31 is placed on the supporting surface of the worktable 11. The fixing member cooperates with the tape 32 located on the frame 31, and the retaining member 14 cooperates with the frame 31 to fix the chip 30. By setting the fixing member and the retaining member 14, the fixed position of the chip 30 is improved, thereby effectively improving the stability of the chip 30 and avoiding displacement or falling off during the cleaning process, ensuring the cleaning effect of the chip 30 and preventing damage to the chip 30.

[0042] Furthermore, the fixing component is a vacuum suction cup. Specifically, the vacuum suction cup is set on the worktable 11, and the suction port of the vacuum suction cup is located on the support surface. When the chip 30 needs to be fixed, the chip 30 with the frame 31 is placed on the support surface of the worktable 11, and the adhesive tape 32 of the frame 31 is set to correspond with the suction port. The vacuum suction cup is activated to adsorb the adhesive tape 32, so that the adhesive tape 32 is tightly attached to the support surface, which further improves the stability of the chip 30.

[0043] It should be understood that the bonding between chip 30 and tape 32 has high strength and stability, which can effectively resist the impact of cleaning materials on chip 30 during the cleaning process.

[0044] In other embodiments, the fixing member is an adhesive member, which is bonded to the adhesive layer to fix the chip 30. The bonding method between the adhesive member and the adhesive layer is simple and effectively reduces the manufacturing cost of the cleaning device 100.

[0045] Furthermore, such as Figure 1 and Figure 2As shown, the cleaning mechanism 20 includes a supply component 21, a spray component 22, and a connecting component 23. The supply component 21 provides cleaning material, and the spray component 22 is disposed at the bottom of the worktable 11. The supply component 21 is connected to the spray component 22 via the connecting component 23. Specifically, the spray components 22 are spaced apart at the bottom of the worktable 11, and the spray component 22, connecting component 23, and supply component 21 are connected sequentially. When the chip 30 needs to be cleaned, the chip 30 is fixed on the support surface of the worktable 11. The first drive component 12 rotates the worktable 11 (rotates around the horizontal axis) via the first rotating shaft 13, so that the chip 30 faces the spray mechanism. The supply component 21 is activated, and the cleaning material enters the spray component 22 to clean the chip 30. The powder on the chip 30 is carried away from the surface of the chip 30 by the information material. The cleaning material carrying the powder is quickly separated from the chip 30 under the action of gravity, thereby realizing the rapid cleaning of the chip 30.

[0046] It should be noted that the spraying element 22 is connected to the supply element 21. The supply element 21 is the spraying element 22 through which sufficient cleaning material is supplied. In this invention, the spraying element 22 is a nozzle, and the spraying pressure of the nozzle is adjustable. By adjusting the nozzle to a suitable pressure, the spraying pressure of the cleaning material supplied by the supply element 21 can be increased when it passes through the nozzle, thereby increasing the spraying speed of the cleaning material and further improving the cleaning speed of the chip 30.

[0047] Furthermore, such as Figure 1 and Figure 2 As shown, the connector 23 is a movable structure used to adjust the position of the spraying component 22. Specifically, one end of the connector 23 is connected to the supply component 21, and the other end of the connector 23 is connected to the spraying component 22. By adjusting the angle and length of the connector 23, the position of the spraying component 22 can be adjusted, thereby improving the cleaning effect of the chip 30.

[0048] It should be noted that the connector 23 consists of an arm (not shown) and a pipeline (not shown). The pipeline is mounted on the arm, the spraying component 22 is mounted on the movable end of the arm and connected to one end of the pipeline, and the supply component 21 is mounted on the arm and connected to the other end of the pipeline. The arm is a robotic arm with multiple degrees of freedom and a telescopic structure. During the cleaning process of the chip 30, the position of the spraying component 22 is adjusted by adjusting the posture of the robotic arm, thereby adjusting the cleaning position of the chip 30. This ensures a uniform cleaning effect on the chip 30, further guaranteeing the cleaning effect and ensuring the product yield.

[0049] Furthermore, such as Figure 1 and Figure 2As shown, the cleaning mechanism 20 also includes a first supply pipe 24, and the supply component 21 is connected to the first supply source through the first supply pipe 24. Specifically, the first supply source delivers the first cleaning material to the supply component 21 through the first supply pipe 24. When the first cleaning material is needed to clean the chip 30, the supply component 21 delivers the first cleaning material to the spraying component 22, and the spraying component 22 sprays the first cleaning material onto the surface of the chip 30 to achieve cleaning of the chip 30 by the first cleaning material.

[0050] It should be noted that in this invention, the first cleaning material is deionized water. By supplying deionized water, the requirements for cleaning materials during the cleaning process are met, thereby further ensuring the cleaning effect on the chip 30.

[0051] Specifically, such as Figure 1 and Figure 2 As shown, the cleaning mechanism 20 also includes a second supply pipe 25, and the supply component 21 is connected to the second supply source through the second supply pipe 25. The second supply source delivers the second cleaning material to the supply component 21 through the second supply pipe 25. When the second cleaning material is required for cleaning the chip 30, the supply component 21 delivers the second cleaning material to the spraying component 22, and the spraying component 22 sprays the second cleaning material onto the surface of the chip 30 to achieve cleaning of the chip 30 by the second cleaning material.

[0052] It should be noted that in this invention, the second cleaning material is a chemical agent. By supplying the chemical agent, the requirements for cleaning materials during the cleaning process are met, thereby further ensuring the cleaning effect on the chip 30.

[0053] Specifically, such as Figure 1 and Figure 2 As shown, the cleaning mechanism 20 also includes a third supply pipe 26, through which the supply component 21 is connected to a third supply source. The third supply source delivers the third cleaning material to the supply component 21 via the third supply pipe 26. When the third cleaning material is required for cleaning the chip 30, the supply component 21 delivers the third cleaning material to the spraying component 22, which then sprays the third cleaning material onto the surface of the chip 30 to achieve cleaning of the chip 30 by the third cleaning material.

[0054] It should be noted that in this invention, the third cleaning material is air. By supplying air, the requirements for the cleaning material during the cleaning process are met, thereby further ensuring the cleaning effect on the chip 30.

[0055] In addition, the first supply pipe 24, the second supply pipe 25 and the third supply pipe 26 respectively deliver different cleaning materials into the supply member 21. The cleaning materials can be mixed in the supply member 21 to further improve the cleaning effect. For example, the first supply pipe 24 supplies deionized water, the second supply pipe 25 supplies chemical agents, and the third supply pipe 26 supplies air. The supply member 21 can mix the chemical agents with air, so that the chemical agents contain air. When the chemical agents containing air are sprayed onto the surface of the chip 30 by the spray member 22, bubbles are formed on the surface of the chip 30. The bursting of the bubbles can further improve the cleaning effect on the chip 30.

[0056] Furthermore, such as Figure 1 and Figure 2 As shown, the cleaning mechanism 20 also includes a drying element 27, which is used to dry the chip 30. Specifically, the drying elements 27 are spaced apart at the bottom of the worktable 11. After the cleaning mechanism 20 finishes cleaning the chip 30, the drying elements 27 are activated to quickly dry the surface of the chip 30. After drying, the chip 30 is flipped and reset. By setting the drying elements 27, the cleaning time of the chip 30 is further shortened. In addition, it also avoids secondary contamination of the chip 30 (the chip 30 is prone to dust and other foreign matter if it is damp for a long time), further ensuring the cleaning effect of the chip 30 and further guaranteeing the product yield.

[0057] It should be noted that the drying component 27 includes a nozzle and an air source. The nozzle has an adjustable pressure structure, and the air source is connected to the nozzle. When the chip 30 needs to be dried, the nozzle is adjusted to a suitable pressure and started. High-pressure gas is blown onto the surface of the chip 30 to achieve rapid drying of the chip 30, which further improves the cleaning effect of the chip 30 and effectively enhances the cleaning effect of the chip 30.

[0058] In addition, the gas source is equipped with a heating element. By activating the heating element, the gas (air, etc.) passing through the heating element is heated to a higher temperature. The heated gas then dries the chip 30 through the nozzle, further shortening the drying time and improving the cleaning efficiency of the chip 30.

[0059] Furthermore, such as Figure 1 and Figure 2 As shown, the supporting mechanism 10 also includes a third driving member 15, which is connected to the worktable 11 for driving the worktable 11 to rotate in the horizontal direction (e.g., Figure 2 As shown, Figure 2The horizontal axis of the paper is the X-axis, and the vertical axis is the Y-axis. The rotation of the worktable 11 around the Y-axis is equivalent to the rotation of the worktable 11 around the vertical axis. Specifically, when cleaning the chip 30, the chip 30 is fixed on the support surface of the worktable 11. The first driving member 12 rotates the worktable 11 through the first rotating shaft 13, so that the chip 30 is positioned towards the cleaning mechanism 20. The cleaning mechanism 20 is activated, and the spraying member 22 sprays the cleaning material supplied by the supply member 21 onto the surface of the chip 30 to achieve cleaning of the chip 30. During the cleaning process of the chip 30, the third driving member 15 drives the worktable 11 to rotate around the vertical axis, so that the cleaning material is sprayed more evenly on the chip 30, thereby further improving the cleaning effect and shortening the cleaning time. After cleaning is completed, the drying member 27 dries the cleaned chip 30. At this time, the third driving member 15 still drives the worktable 11 to rotate around the vertical axis, thereby further improving the drying efficiency of the chip 30 and shortening the cleaning time of the chip 30.

[0060] It should be noted that the third driving component 15 is a motor. The structure of the worktable 11 driven by the motor is stable and can effectively ensure the rotation of the chip 30 during the cleaning and drying process, thereby effectively improving the cleaning efficiency of the chip 30.

[0061] like Figures 1 to 3 As shown, the present invention also proposes a control method for a cleaning device 100, which is implemented using the cleaning device 100 as described above. The control method for the cleaning device 100 includes the following steps:

[0062] The fixing device is activated to secure the tape 32 of the chip 30 to the supporting surface. Specifically, the chip 30 with a frame 31 (the chip 30 is located inside the frame 31 and is connected and fixed to the frame 31 by tape 32) is placed on the supporting surface of the worktable 11 by a gripping component such as a robotic arm, and the tape 32 of the frame 31 is pressed against the supporting surface. The fixing device is activated to tightly adhere the tape 32 to the supporting surface and fix it relatively horizontally, thereby ensuring that the chip 30 is positioned on the supporting surface and preventing the chip 30 from shifting and affecting the cleaning effect.

[0063] The retaining member 14 is activated to fix the frame 31 of the chip 30. Specifically, after the tape 32 of the frame 31 is fixed to the supporting surface by the fastener, the retaining member 14 is activated. The retaining member 14 engages with the edge of the frame 31 and clamps the frame 31 between the retaining member 14 and the supporting surface, thereby fixing the frame 31 and thus fixing the chip 30. This further improves the fixing strength of the chip 30 and enhances the cleaning effect of the chip 30.

[0064] The first driving component 12 is activated to orient the chip 30 toward the cleaning mechanism 20. Specifically, the first driving component 12 drives the first rotating shaft 13 to rotate, which in turn causes the worktable 11 to rotate around the horizontal axis, so that the chip 30 faces one side of the cleaning mechanism 20. At this time, the chip 30 is located at the bottom of the worktable 11 or at an angle to the horizontal plane. By rotating the chip 30, the powder on the chip 30 can be initially separated from the chip 30 under the action of gravity, thereby effectively improving the cleaning efficiency of the chip 30.

[0065] The supply unit 21 is activated so that the cleaning material is sprayed onto the surface of the chip 30 through the spraying unit 22. Specifically, the supply unit 21 supplies the cleaning material to the spraying unit 22, and the cleaning material is sprayed onto the surface of the chip 30 through the spraying unit 22. The cleaning material separates the powder on the surface of the chip 30 from the chip 30. Since the chip 30 is located at the bottom of the worktable 11 or at an angle to the horizontal, the cleaning material carrying the powder separates from the chip 30 under the action of gravity, thereby avoiding secondary contamination of the chip 30 and further improving the cleaning effect of the chip 30, thus ensuring the yield rate of the product.

[0066] In addition, during the cleaning process of chip 30, the third drive unit 15 is activated, causing the worktable 11 to rotate around the vertical axis, which further improves the uniformity of cleaning material cleaning and further enhances the cleaning effect of chip 30.

[0067] The connector 23 is activated to adjust the spraying position of the sprayer 22 on the chip 30. Specifically, during the process of the sprayer 22 spraying cleaning material onto the surface of the chip 30, the connector 23 is activated. By adjusting its angle and length, the position of the sprayer 22 is adjusted, and the connector 23 is in a dynamic adjustment state. That is, during the process of the sprayer 22 spraying cleaning material, the connector 23 is constantly in a position adjustment state, thereby achieving uniform spraying of cleaning material onto the chip 30, thereby improving the cleaning effect of the chip 30 and ensuring the product yield.

[0068] The drying unit 27 is activated to dry the cleaned chip 30. Specifically, after the cleaning material has finished cleaning the chip 30, the drying unit 27 is activated, using high-pressure air to blow away dust from the surface of the chip 30, thereby achieving rapid drying of the chip 30 and avoiding secondary contamination caused by dust accumulation due to moisture, thus ensuring the cleaning effect of the chip 30. In addition, during the drying process, the third drive unit 15 drives the worktable 11 to rotate around the vertical axis, thereby achieving uniform drying of the chip 30 by the drying unit 27, and further ensuring the drying effect of the chip 30.

[0069] According to the control method of the cleaning device 100 of the present invention, during the cleaning process, the powder and cleaning liquid will separate from the chip 30 under the action of gravity, which shortens the cleaning time while ensuring the cleaning effect. In addition, there is no need to increase the cleaning pressure or the rotation speed of the worktable 11, thus avoiding the separation of the chip 30 from the worktable 11 and eliminating the potential for damage to the chip 30.

[0070] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A cleaning apparatus for semiconductor manufacturing, characterized in that, The cleaning device includes: A support mechanism, the support mechanism including a worktable having a support surface for fixing chips; A cleaning mechanism is disposed at the bottom of the workbench and is used to clean the chip. The workbench is rotatable about a horizontal axis so that the supporting surface faces the cleaning mechanism. The supporting mechanism also includes: First driving component; The first rotating shaft and the first driving component are connected to the worktable via the first rotating shaft to drive the worktable to rotate in the vertical direction; A retaining element, which is connected to the worktable and is used to cooperate with the frame of the chip; The bearing mechanism includes a second driving member, which is connected to the holding member in a transmission manner; The supporting mechanism also includes a fixing member disposed on the supporting surface for engaging with the tape of the chip; The third driving component is connected to the worktable in a transmission manner and is used to drive the worktable to rotate around the vertical axis. The fixing component is a vacuum suction cup; The clamping component is a limiting ring, and the second driving component is a motor, which is used to adjust the limiting ring to clamp or loosen the frame.

2. The cleaning device according to claim 1, characterized in that, The cleaning mechanism includes: A supply component for providing cleaning material; A spraying component, wherein the spraying component is disposed at the bottom of the worktable; A connector, through which the supply component is connected to the injection component.

3. The cleaning device according to claim 2, characterized in that, The connector is a movable structure used to adjust the position of the spraying component.

4. The cleaning device according to claim 2, characterized in that, The cleaning mechanism further includes a first supply pipe, and the supply component is connected to a first supply source through the first supply pipe; And / or the cleaning mechanism further includes a second supply pipe, through which the supply component is connected to a second supply source; And / or the cleaning mechanism may further include a third supply pipe, through which the supply component is connected to a third supply source.

5. The cleaning device according to claim 2, characterized in that, The cleaning mechanism also includes a drying component for drying the chip.

6. A method for controlling a cleaning apparatus, wherein the method is implemented using a cleaning apparatus as described in any one of claims 1 to 5, characterized in that, The control method for the cleaning device includes the following steps: Activate the retainer to secure the chip's tape to the support surface; Activate the card holder to secure the chip frame; The first driving mechanism is activated to orient the chip toward the cleaning mechanism; Start the supply unit so that the cleaning material is sprayed onto the surface of the chip through the spraying unit; Activate the connector to adjust the spraying position of the jetting component on the chip; Start the drying unit to dry the cleaned chip.

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