Nozzle standby device, liquid processing apparatus, and operation method of liquid processing apparatus

Abstract

Nozzle standby device, liquid processing device, and operation method of liquid processing device. A nozzle stands by in a nozzle housing portion and absorbs solvent at a tip end portion to form a liquid layer, and even if the ejected processing liquid is high in viscosity, the liquid layer of the solvent is formed at the tip end portion. It includes: a nozzle housing portion including an inner peripheral surface formed so as to surround a tip end portion of a nozzle and a discharge port formed so as to oppose a discharge port of the nozzle; and a solvent discharge port opened in the nozzle housing portion to cause the ejected solvent to be guided along the inner peripheral surface of the nozzle housing portion and discharged from the discharge port, the nozzle housing portion having a reduced diameter portion at a position above the discharge port at which the solvent falls in a vortex, the reduced diameter portion including a first inner peripheral surface and a second inner peripheral surface that differ in angle with respect to a center line of the nozzle housing portion, and in a cross section that is cut along the center line of the nozzle housing portion, two straight lines that extend along the respective first inner peripheral surfaces intersect at a point that is located higher than the discharge port of the nozzle when the tip end portion of the nozzle is disposed in the reduced diameter portion.

Description

Technical Field

[0001] This disclosure relates to a nozzle standby device, a liquid treatment device, and a method for operating the liquid treatment device. Background Technology

[0002] Patent Document 1 discloses a nozzle standby device for pausing a nozzle that sprays a processing liquid that will solidify upon drying, and for forming a liquid layer of solvent by drawing in solvent at the tip of the nozzle. The nozzle standby device includes: a nozzle housing having an inner circumferential surface formed to surround the tip of the nozzle, and a discharge port formed opposite to the nozzle outlet; a solvent outlet opening within the nozzle housing, configured such that the sprayed solvent is guided along the inner circumferential surface of the nozzle housing and discharged from the discharge port; and a solvent supply unit that supplies solvent to the solvent outlet at a first flow rate when a liquid layer of solvent is formed at the tip of the nozzle, and after a liquid film is formed by sealing the nozzle outlet with the solvent, supplies solvent to the solvent outlet at a second flow rate, less than the first flow rate, to maintain the nozzle outlet sealed by the solvent.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2019-079886 Summary of the Invention

[0004] The problem the invention aims to solve

[0005] With respect to the technology disclosed herein, when a nozzle for spraying a treatment liquid is in standby in the nozzle housing and a solvent is drawn into the tip of the nozzle to form a liquid layer of solvent, even if the sprayed treatment liquid is of high viscosity, a liquid layer of solvent can be formed at the tip of the nozzle.

[0006] Solution for solving the problem

[0007] One technical solution disclosed herein is a nozzle standby device for spraying a treatment liquid that will solidify upon drying. The nozzle standby device includes: a nozzle receiving portion comprising an inner circumferential surface formed to surround the tip of a nozzle, and an outlet formed opposite to the nozzle's outlet; and a solvent outlet opening within the nozzle receiving portion, the solvent outlet being configured to guide the sprayed solvent along the inner circumferential surface of the nozzle receiving portion and discharge it from the outlet. The nozzle receiving portion has a constricted diameter portion on the upper side of the outlet, at a location where the solvent sprayed from the solvent outlet forms a vortex and falls, with the inner diameter decreasing towards the outlet. This constricted diameter portion includes a first inner circumferential surface and a second inner circumferential surface formed at angles different from the centerline of the nozzle receiving portion. In a cross-section taken along the centerline including the nozzle receiving portion, the intersection of two straight lines extending along the opposing first inner circumferential surfaces is located above the nozzle's outlet when the tip of the nozzle is positioned in the constricted diameter portion.

[0008] The effects of the invention

[0009] According to this disclosure, when a nozzle for spraying a treatment liquid is in standby in the nozzle housing and a solvent is drawn into the tip of the nozzle to form a liquid layer of solvent, even if the sprayed treatment liquid is of high viscosity, a liquid layer of solvent can be formed at the tip of the nozzle. Attached Figure Description

[0010] Figure 1 This is a schematic longitudinal sectional side view showing the structure of the liquid treatment device with a nozzle standby device according to this embodiment.

[0011] Figure 2 This is a schematic perspective view showing the structure of the liquid treatment device equipped with a nozzle standby device according to this embodiment.

[0012] Figure 3 This is a perspective view of the nozzle unit installed in the liquid treatment device.

[0013] Figure 4 It is a partial longitudinal sectional side view showing the coating nozzle and the standby unit located in the nozzle unit.

[0014] Figure 5 This is a cross-sectional view of the nozzle housing section, which is cut in the manner that the solvent outlet is included.

[0015] Figure 6 This is a longitudinal sectional side view showing the nozzle unit and the standby unit.

[0016] Figure 7 It is a partial longitudinal sectional side view showing the coating nozzle and the standby unit located in the nozzle unit.

[0017] Figure 8 This is a longitudinal sectional side view showing the function of the liquid treatment device.

[0018] Figure 9 This is a longitudinal sectional side view showing the function of the liquid treatment device.

[0019] Figure 10 This is an example where the nozzle housing has a different solvent outlet than the outlet.

[0020] Figure 11 This is a diagram showing an example of the location where a solvent jet outlet is formed.

[0021] Figure 12 This is a diagram showing an example of the configuration of the coating nozzles during pre-spraying. Detailed Implementation

[0022] In the manufacturing processes of semiconductor devices, there is a process in which a resist solution is coated onto a substrate to form a resist pattern. In this process, for example, a semiconductor wafer (hereinafter referred to as "wafer") held in a rotating chuck is rotated while the resist solution is sprayed from a nozzle toward approximately the center of the wafer.

[0023] The resist solution contains components of an organic resist film and a solvent for that component. The resist solution is prone to drying upon contact with the atmosphere, and its concentration may change due to drying. Therefore, when not using a nozzle, an air layer and a solvent layer (a liquid layer of solvent) are formed outside the resist layer inside the nozzle tip to prevent the resist solution inside the nozzle from drying out. This method is performed, for example, by: after virtually distributing the resist solution inside the nozzle, suction is applied to the nozzle to form an air layer; then, the nozzle tip is immersed in the solvent, and suction is applied to the nozzle. In this method, when an air layer is formed at the nozzle tip, the resist solution adhering to the inner wall of the nozzle concentrates at the nozzle outlet, forming a thin film of resist solution at the nozzle outlet. Thus, if a thin film of resist solution is formed at the nozzle outlet, when the nozzle tip is immersed in the solvent and the solvent comes into contact with the thin film of resist solution, the solvent is easily introduced into the nozzle.

[0024] Furthermore, when using a high-viscosity resist, such as the resist film used in 3D NAND flash memory, the resist adhering to the inner wall of the nozzle is difficult to concentrate at the nozzle exit when the aforementioned air layer is formed. Therefore, compared to the conventional use of low-viscosity resists, it is difficult to form a resist film at the nozzle exit. As a result, since no resist film forms at the nozzle exit, even if the nozzle tip is immersed in solvent and suction is applied inside the nozzle, the solvent is difficult to introduce into the nozzle. In other words, in conventional nozzle standby devices, when the resist is of high viscosity, it is difficult to form a solvent layer at the nozzle tip.

[0025] Therefore, with the technology disclosed herein, when the nozzle for spraying the treatment liquid is in standby in the nozzle housing and a solvent is drawn into the tip of the nozzle to form a liquid layer of solvent, even if the sprayed treatment liquid is of high viscosity, a liquid layer of solvent can be formed at the tip of the nozzle.

[0026] Hereinafter, the operation method of the nozzle standby device and liquid treatment device of this embodiment will be described with reference to the accompanying drawings. Furthermore, in this specification and the accompanying drawings, elements having substantially the same functional structure are labeled with the same reference numerals, thereby omitting repeated descriptions.

[0027] Figure 1 and Figure 2 These are a schematic longitudinal sectional side view and a perspective view showing the structure of the liquid treatment device 1 equipped with a nozzle standby device according to this embodiment. Figure 3 This is a perspective view of the nozzle unit installed in the liquid treatment device. Figure 4 It is a partial longitudinal sectional side view showing the coating nozzle and the standby unit located in the nozzle unit. Figure 5 This is a cross-sectional view of the nozzle housing section, which is cut in the manner that the solvent outlet is included. Figure 6 This is a longitudinal sectional side view showing the nozzle unit and the standby unit.

[0028] like Figure 1 and Figure 2 As shown, the liquid handling apparatus 1 includes a rotating chuck 2, which serves as a substrate holding part, to hold the wafer W horizontally by adsorbing the central portion of the back side of the wafer W. The rotating chuck 2 is configured to rotate freely and move freely up and down about a vertical axis by means of a drive mechanism 22 equipped with an actuator such as a motor, using a drive shaft 21. Around the rotating chuck 2, a cup 23 with an opening 231 on its upper side is provided to surround the wafer W on the rotating chuck 2. The cup 23 catches and recovers liquid that spills or falls from the wafer W.

[0029] Additionally, the liquid treatment apparatus 1 includes a nozzle unit 3. The nozzle unit 3 is configured to spray coating liquid from the coating nozzle 41 to approximately the center of the wafer surface held in the rotating chuck 2. Figure 3 As shown, in this nozzle unit 3, multiple (e.g., 10) coating nozzles 41 for spraying the treatment liquid and, for example, a solvent nozzle 42 for spraying the solvent of the treatment liquid are fixed together in the support 31. The treatment liquid will solidify upon drying; for example, high-viscosity (e.g., 50cp to 1000cp) resists used in the manufacture of three-dimensional NAND flash memory can be cited. Alternatively, the treatment liquid can be pigment resist (OCCF), water-soluble resist, etc. Solvents include, for example, diluents such as PGMEA and OK73, and water. Furthermore, hereafter, the coating nozzle 41 and solvent nozzle 42 will sometimes be omitted and referred to as nozzles 41 and 42.

[0030] The coating nozzle 41 and the solvent nozzle 42 are positioned along the transverse direction of the liquid treatment device 1. Figure 2 The coating nozzle 41 is fixed to the support 31 in a straight line (in the Y direction). The coating nozzle 41 includes: a base portion 43 connected to the support 31; a cylindrical portion 44 extending vertically downward from the base portion 43; and a generally conical tip portion 45, the diameter of which gradually decreases downward from the cylindrical portion 44. A flow path 46 for the treatment liquid extending vertically is formed inside the base portion 43, the cylindrical portion 44, and the tip portion 45. The flow path 46 opens at the tip side below the nozzle, serving as a spray outlet 47 for the treatment liquid. The spray outlet 47 is, for example, circular when viewed from above. The solvent nozzle 42 is configured similarly to the coating nozzle 41.

[0031] The coating nozzle 41 and solvent nozzle 42 are supported by a common support 31, configured to move freely between a processing position (supplying processing liquid, etc. to the wafer W on the rotary chuck 2) and a standby position (accommodated in the standby unit 5, described later) using a moving mechanism 32. Figure 2 As shown, the moving mechanism 32 includes: a horizontal moving part 34, which moves along the lateral ( Figure 2 The guide 33 extends in the Y direction and moves; and the arm 35 moves inward from the horizontal moving part 34 (in the Y direction). Figure 2 The arm 35 extends to the X-direction (positive side) and has a support 31 at the top. The arm 35 is raised and lowered freely by a lifting mechanism (not shown) with actuators such as cylinders, thereby allowing adjustment of the height of nozzles 41 and 42.

[0032] For example, such as Figure 1 As shown, each coating nozzle 41 is connected to a different processing liquid supply source 100. The processing liquid supply source 100 stores, for example, different types of resists, the same type of resists but with different viscosities, such as a resist for a three-dimensional NAND flash memory film.

[0033] The processing liquid supply path 101 between each coating nozzle 41 and the processing liquid supply source 100 corresponding to the coating nozzle 41 is provided, for example, with a back suction valve SV as a solvent suction mechanism and a flow adjustment unit 102.

[0034] The backflow valve SV is used to retract the tip of the remaining treatment liquid in the flow path 46 of the coating nozzle 41 towards the treatment liquid supply path 101 when the spraying of the treatment liquid from the corresponding coating nozzle 41 stops. The backflow valve SV includes, for example, a bellows with an internal suction chamber communicating with the treatment liquid supply path 101. The backflow valve SV is configured such that by extending the bellows, a negative pressure is created in the suction chamber, thereby drawing the treatment liquid from the coating nozzle 41 towards the treatment liquid supply path 101. Furthermore, the backflow valve SV is provided with a needle-shaped member, which allows adjustment of the retraction distance of the tip of the treatment liquid by changing the maximum volume of the suction chamber.

[0035] The flow adjustment unit 102 is used to adjust the flow rate of the treatment fluid. The flow adjustment unit 102 includes an on / off valve, a mass flow controller, etc.

[0036] Solvent nozzle 42 is connected to solvent supply source 110 containing solvent. A flow adjustment unit 112 is provided in the solvent supply path 111 between solvent nozzle 42 and solvent supply source 110. The flow adjustment unit 112 is used to adjust the flow rate of solvent and includes an on / off valve, a mass flow controller, etc.

[0037] The back suction valve SV and the flow adjustment units 102 and 112 are controlled by the control unit U, which will be described later.

[0038] Moreover, such as Figure 1 and Figure 2 As shown, the liquid treatment device 1 includes a standby unit 5, which serves as a nozzle standby device. The standby unit 5 is, for example, located on the outer surface of the cup 23. Figure 6 As shown, the standby unit 5 is provided with a number of cylindrical nozzle receiving portions 51 corresponding to the number of nozzles (11 in the example of the attached figure), which individually house the coating nozzle 41 and the solvent nozzle 42. These nozzle receiving portions 51 are located, for example, along the transverse direction ( Figure 6 The Y-direction) are arranged in a straight line.

[0039] The nozzle receiving portion 51 for the coating nozzle 41 is similarly constructed, see reference. Figure 4 This describes the nozzle housing 51. Figure 4 It shows Figure 6The leftmost nozzle receiving section 51. The portion of the nozzle receiving section 51 that houses the cylindrical portion 44 and the top end portion 45 of the coating nozzle 41 is, for example, cylindrical. The lower part of the nozzle receiving section 51 is configured as a tapered section 52, where the inner diameter decreases towards the bottom. Furthermore, the lower end of the nozzle receiving section 51 communicates with a drain chamber 54 shared by the nozzle receiving sections 51 via a drain outlet 53. Liquid flowing into the drain chamber 54 is discharged out of the liquid treatment apparatus 1 via a discharge path 55.

[0040] When the nozzle unit 3 is in the standby position housed within the standby unit 5, for example... Figure 4 and Figure 6 As shown, the tip 45 of each coating nozzle 41 is located in the reduced diameter portion 52 of the nozzle receiving portion 51. The inner circumferential surface of this reduced diameter portion 52 corresponds to the inner circumferential surface surrounding the tip of the coating nozzle 41. Furthermore, the discharge port 53 is located below the discharge ports 47 of each nozzle 41, opposite to the discharge ports 47 of each nozzle 41. The discharge port 53 is configured to be circular when viewed from above, and is formed to be larger than the outer diameter of the coating nozzle 41 at the portion corresponding to the discharge port 47 of the coating nozzle 41. For example, the portion with the smallest inner diameter between the reduced diameter portion 52 and the discharge chamber 54 corresponds to the discharge port 53.

[0041] Additionally, a solvent outlet 56 for supplying solvent is provided on the lower side wall (e.g., the side wall of the narrowed diameter portion 52) of the nozzle receiving portion 51 for the coating nozzle 41. The solvent outlet 56 is configured, for example, to spray solvent in a manner that allows the solvent to flow along the inner circumferential surface of the narrowed diameter portion 52. Specifically, for example, as... Figure 5 As shown, the solvent outlet 56 is arranged along the tangential direction of the constriction section 52. Therefore, the solvent ejected from the solvent outlet 56 is guided along the inner circumferential surface of the nozzle receiving section 51 and discharged from the outlet 53. In other words, according to the above structure, in the constriction section 52, the solvent ejected from the solvent outlet 56 falls in a vortex.

[0042] Here, the structure of the reduced diameter section 52 will be described in more detail. For example... Figure 4 As shown, the reduced diameter portion 52 in this embodiment includes a first inner circumferential surface 52a, a second inner circumferential surface 52b, and a third inner circumferential surface 52c as an inner circumferential surface.

[0043] The first inner circumferential surface 52a is a surface whose inner diameter decreases from the wall surface of the nozzle receiving portion 51 opposite to the cylindrical portion 44 of the coating nozzle 41 toward the discharge port 53. The first inner circumferential surface 52a has a shape like the side of a truncated cone and is an inclined surface relative to the center line C of the nozzle receiving portion 51. Furthermore, the center line C of the nozzle receiving portion 51 in this specification refers to the line passing through the center of the circle of the inner circumferential surface 51a of the nozzle receiving portion 51 opposite to the cylindrical portion 44 of the coating nozzle 41.

[0044] The second inner circumferential surface 52b is a surface extending from the lower end of the first inner circumferential surface 52a toward the outlet 53. In this embodiment, the second inner circumferential surface 52b has an inner diameter at its upper end equal to the inner diameter at the lower end of the first inner circumferential surface 52a, and its inner diameter remains unchanged from the first inner circumferential surface 52a toward the outlet 53. In other words, the second inner circumferential surface 52b in this embodiment extends parallel to the centerline C of the nozzle receiving portion 51 and is not inclined relative to the centerline C. Furthermore, the second inner circumferential surface 52b is not limited to the shape described in this embodiment; for example, it may be a surface inclined relative to the centerline C of the nozzle receiving portion 51, and its inner diameter decreases from the lower end of the first inner circumferential surface 52a toward the outlet 53. That is, the first inner circumferential surface 52a and the second inner circumferential surface 52b can be formed with different angles relative to the centerline C of the nozzle receiving portion.

[0045] Figure 7 Is with Figure 4 The same cross-sectional view shows a section cut along the centerline C, including the nozzle receiving portion 51. For the first inner circumferential surface 52a, the intersection point P of two straight lines extending along the opposing first inner circumferential surfaces 52a, shown in this cross-section, is located above the outlet 47 of the coating nozzle 41 when the coating nozzle 41 is positioned in the narrowing portion 52. Due to the first inner circumferential surface 52a being inclined relative to the centerline C of the nozzle receiving portion 51, as described later, solvent ejected from the solvent outlet 56 is difficult to expel, and solvent tends to accumulate in the narrowing portion 52 during solvent expulsion. Furthermore, the angle formed by the opposing first inner circumferential surfaces 52a, shown in the cross-section cut along the centerline C, including the nozzle receiving portion 51, is preferably, for example, 120 to 180 degrees. Additionally, the first inner circumferential surface 52a is preferably formed such that the intersection point P is located in the region inside the second inner circumferential surface 52b, as in this embodiment. If the first inner circumferential surface 52a is formed such that the intersection point P is located in the region inside the second inner circumferential surface 52b, then during the process of the solvent sprayed from the solvent spray outlet 56 being discharged from the outlet 53, the solvent can more easily accumulate in the constricted section 52.

[0046] The third inner circumferential surface 52c is a surface extending from the lower end of the second inner circumferential surface 52b toward the outlet 53. This third inner circumferential surface 52c is formed such that its inner diameter decreases from the lower end of the second inner circumferential surface 52b toward the outlet 53. This third inner circumferential surface 52c obstructs the flow of solvent from the second inner circumferential surface 52b toward the outlet 53, making it difficult for the solvent ejected from the solvent spray outlet 56 to be discharged from the outlet 53. Therefore, during the process of solvent ejected from the solvent spray outlet 56 being discharged from the outlet 53, it is easier for the solvent to accumulate in the narrowed section 52. Furthermore, the third inner circumferential surface 52c may not be formed as an inner circumferential surface of the narrowed section 52, but from the viewpoint of making it easier for the solvent to accumulate in the narrowed section 52 as described above, it is preferable to form the third inner circumferential surface 52c. Furthermore, when a third inner circumferential surface 52c is formed, it is preferable that the angles formed by the opposing first inner circumferential surfaces 52a and the opposing third inner circumferential surfaces 52c are equal in a cross-section shown along the centerline C, which includes the centerline C of the nozzle receiving portion 51. This allows the solvent to more easily accumulate in the constricted diameter portion 52 as it exits from the solvent outlet 56 and exits through the discharge outlet 53. Furthermore, when the third inner circumferential surface 52c is not formed, it is preferable that the second inner circumferential surface 52b is formed such that its inner diameter decreases from the lower end of the first inner circumferential surface 52a towards the discharge outlet 53.

[0047] like Figure 6 As shown, solvent outlets 56 are connected to solvent supply sources 57 storing solvent. A flow adjustment unit 59 is provided in the solvent supply path 58 between each solvent outlet 56 and the solvent supply source 57. The flow adjustment unit 59 is used to adjust the flow rate of the solvent ejected from each solvent outlet 56, and includes an on / off valve, a mass flow controller, etc. Each flow adjustment unit 59 is controlled by the control unit U, described later. As described later, when a liquid layer of solvent is formed in the coating nozzle 41, the solvent supply unit, including the solvent supply source 57, the solvent supply path 58, and the flow adjustment unit 59, supplies solvent to the solvent outlets 56 in a manner that ejects solvent from the solvent outlets 56 at a predetermined flow rate.

[0048] In addition, the nozzle receiving portion 51 corresponding to the solvent nozzle 42 is constructed in the same way as the nozzle receiving portion 51 corresponding to the coating nozzle 41, except that it does not have a solvent outlet 56.

[0049] The coating nozzles 41 and solvent nozzles 42 of the nozzle unit 3 are arranged, for example, on a straight line passing through the rotation center of the wafer W. In addition, each nozzle receiving part 51 of the standby unit 5 is also arranged on a straight line passing through the rotation center of the wafer W.

[0050] The liquid processing apparatus 1 configured as described above includes a control unit U. The control unit U is, for example, a computer equipped with a CPU, memory, etc., and has a program storage unit (not shown). The program storage unit stores a program that controls the backflow valve SV, flow adjustment units 102, 112, 59, etc., to control the wafer processing described later. Alternatively, the program can be stored on a storage medium readable by a computer and loaded from that storage medium into the control unit U. Part or all of the program can also be implemented using dedicated hardware (circuit board).

[0051] Next, refer to Figure 8 and Figure 9 For wafer processing using liquid treatment apparatus 1, the case of coating processing using a coating nozzle 41 (hereinafter referred to as "coating nozzle 41A") of nozzle unit 3 and including resist solution will be described as an example.

[0052] First, the surface of the wafer W held in the rotary chuck 2 is pre-wetted with solvent sprayed from the solvent nozzle 42. Specifically, the rotary chuck 2 is raised above the cup 23, thereby transferring the wafer W from the wafer transport mechanism (not shown) to the rotary chuck 2. Next, the nozzle unit 3 is moved to a position where the solvent nozzle 42 supplies solvent to the center of rotation of the wafer W held in the rotary chuck 2, and a diluent is supplied as the solvent. Then, the wafer W is rotated using the rotary chuck 2, and under the action of centrifugal force, the diluent diffuses to the periphery.

[0053] Next, a resist with a viscosity of, for example, 50 cp to 1000 cp is sprayed onto the surface of the wafer W held in the rotary chuck 2 using the coating nozzle 41A to perform a coating process. Specifically, after the pre-wetting process, the rotation of the rotary chuck 2 is stopped, and the nozzle unit 3 is moved to a position where the coating nozzle 41A supplies the resist to the center of rotation of the wafer W held in the rotary chuck 2, and sprays the resist. Then, the wafer W is rotated using the rotary chuck 2, and under the action of centrifugal force, the resist diffuses from the center of the wafer W to the periphery. The wafer W coated with the resist is then transferred to the wafer transport mechanism.

[0054] Furthermore, after the coating process is completed, if no coating liquid is sprayed out within a specified time, the nozzle unit 3 is moved to a position opposite to the standby unit 5 and then lowered, so that the tips of each coating nozzle 41 are respectively housed in their corresponding nozzle housing 51, and the nozzle is in a standby position. In this state, the resist liquid 71 inside the tip of the flow path 46 of the coating nozzle 41A is sprayed into the nozzle housing 51 using virtual dispensing (see reference). Figure 8 (a)). The corrosion resist 71 is discharged to the discharge chamber 54 via the discharge port 53 of the nozzle receiving part 51.

[0055] Next, a first suction is performed using the back suction valve SV installed in the treatment liquid supply path 101 of the coating nozzle 41A. Thus, as... Figure 8 As shown in (b), the surface of the resist 71 in the flow path 46 of the coating nozzle 41A recedes from the treatment liquid supply path 101 and rises from the top of the coating nozzle 41A. For example, the surface of the resist 71 in the coating nozzle 41A rises by about 1 mm to 3 mm from the top of the nozzle.

[0056] Next, as Figure 8 As shown in (c), a second suction is performed using the back suction valve SV, and solvent 72 is ejected from the solvent outlet 56 into the nozzle receiving portion 51 at a predetermined flow rate, forming a liquid layer of solvent (solvent layer 83) at the top of the flow path 46 of the coating nozzle 41A. The solvent 72 ejected from the solvent outlet 56 flows along the inner circumferential surface of the constricted portion 52 of the nozzle receiving portion 51, falls as a vortex, and is discharged from the outlet 53.

[0057] Thus, since the first inner circumferential surface 52a forms the aforementioned intersection point P (refer to...) Figure 7 Located above the nozzle outlet 47 of the coating nozzle 41A, the solvent 72 is difficult to discharge from the outlet 53 as it spirals down the inner circumferential surface of the nozzle receiving portion 51. Consequently, the solvent 72 tends to temporarily accumulate in the narrowing portion 52. When the resist 71 has a high viscosity, it is difficult to form a thin film of resist 71 that promotes the formation of the solvent layer 83 at the nozzle outlet 47 of the coating nozzle 41A. However, according to the standby unit 5 of this embodiment, the solvent 72 tends to accumulate in the narrowing portion 52. Therefore, it is possible to maintain the state where the nozzle outlet 47 of the coating nozzle 41A located in the narrowing portion 52 is temporarily blocked by the solvent 72 accumulated in the narrowing portion 52. Therefore, even if a thin film of resist 71 is not formed at the nozzle outlet 47 of the coating nozzle 41A, the solvent 72 is easily introduced into the flow path 46. Therefore, even if the resist has a high viscosity, a solvent layer 83 can be formed in the flow path 46 of the coating nozzle 41A. Furthermore, in conventional standby units, since the aforementioned intersection point P is located below the second inner circumferential surface 52b, solvent 72 is difficult to accumulate in the constricted diameter portion 52. That is, solvent 72 easily exits from the discharge port 53, making it difficult to maintain the state where the spray port 47 of the coating nozzle 41A is blocked by solvent 72. Therefore, in conventional standby units, if a thin film of resist 71 is not formed at the tip of the coating nozzle 41A, it is difficult to form a solvent layer 83.

[0058] As mentioned above, such as Figure 8As shown in (d), within the flow path 46 of the coating nozzle 41A, a treatment liquid layer 81, an air layer 82, and a solvent layer 83 are formed sequentially from the treatment liquid supply path 101 side. Thus, the treatment liquid (resist) inside the tip of the coating nozzle 41A is isolated from the atmosphere by the air layer 82 and the solvent layer 83, thereby preventing the treatment liquid from drying out.

[0059] For example, the back suction valve SV can be used to draw the solvent layer 83 within the coating nozzle 41A up by approximately 5 mm to 15 mm from the top of the coating nozzle 41A. Alternatively, with the solvent 72 stopped from being ejected from the solvent outlet 56, the back suction valve SV can be used to draw the flow path 46 within the coating nozzle 41A, thus forming an air layer (not shown) inside the top of the coating nozzle 41A outside the solvent layer 83. In this way, by forming an air layer inside the coating nozzle 41A at a position closer to the top of the solvent layer 83, it is possible to prevent the intake of solvent 72 droplets into the top of the coating nozzle 41A.

[0060] With the solvent layer 83 formed as described above, each coating nozzle 41 of the nozzle unit 3 is in standby position within the standby unit 5.

[0061] Next, we will explain the case where a coating process for wafer W is performed using a nozzle unit 3 with a processing liquid layer 81, an air layer 82, and a solvent layer 83 formed at the top of each coating nozzle 41, taking the case of using one coating nozzle 41A of the nozzle unit 3 as an example.

[0062] First, the solvent layer 83 is discharged from the self-coating nozzle 41A. That is, the coating nozzle 41A is positioned in the standby position of the standby unit 5, and a predetermined amount of resist 71 is sprayed from the nozzle 41A. After the solvent layer 83 at the tip of the nozzle is discharged, the resist 71 is drawn back in. At this time, in order to reduce the amount of waste resist 71, the supply amount of resist 71 used solely for discharging the solvent layer 83 can be determined in advance through experiments. For example, the liquid level of the resist 71 can be lowered by, for example, by about 2 mm, thereby discharging the solvent layer 83.

[0063] Next, the nozzle unit 3 is moved to the processing position where the coating nozzle 41A supplies coating liquid to the wafer W, and the resist is supplied to the wafer W from the coating nozzle 41A, and the coating process is performed using the method described above. Then, after the coating process is completed, if no coating liquid is sprayed out for more than a specified time, the used coating nozzle 41A is housed in the nozzle housing 51 of the standby unit 5. As described above, inside the coating nozzle 41A, a processing liquid layer 81, an air layer 82, and a solvent layer 83 are formed sequentially from the processing liquid supply path 101 side.

[0064] Subsequently, when coating is performed using another coating nozzle 41 (hereinafter referred to as "coating nozzle B") different from the coating nozzle 41A described above, the solvent layer 83 of the coating nozzle 41B is discharged in the same manner as that of the coating nozzle 41A. Next, the wafer W is coated with a resist solution as a processing liquid using the coating nozzle 41B. Then, the nozzle unit 3 is positioned in the standby position of the standby unit 5 to perform processing to form a processing liquid layer 81, an air layer 82, and a solvent layer 83 inside the tip of the coating nozzle 41B.

[0065] Furthermore, the process of discharging the solvent from the coating nozzle 41A, the subsequent prescribed coating process, the next process of forming a treatment liquid layer 81, an air layer 82, and a solvent layer 83 inside the tip of the coating nozzle 41A, and the next coating process using other coating nozzles 41B, etc., are all performed based on the program stored in the control unit U.

[0066] As described above, the standby unit 5 constituting the nozzle standby device of this embodiment includes a nozzle receiving portion 51 and a solvent outlet 56. Furthermore, the nozzle receiving portion 51 has a reduced diameter portion 52, which has a first inner circumferential surface 52a and a second inner circumferential surface 52b, with the inner diameter decreasing towards the outlet 53. Moreover, in a cross-section taken along the centerline C including the nozzle receiving portion 51, the intersection point P of two straight lines extending along the opposing first inner circumferential surfaces 52a is located above the outlet 47 of the coating nozzle 41 when the tip portion 45 of the coating nozzle 41 is positioned in the reduced diameter portion 52. According to this standby unit 5, when solvent ejected from the solvent outlet 56 is discharged from the outlet 53, solvent tends to accumulate in the reduced diameter portion 52. This facilitates the introduction of solvent into the flow path 46 of the coating nozzle 41. Therefore, according to the standby unit 5 of this embodiment, when the coating nozzle 41 for spraying the resist liquid 71 is in standby in the nozzle receiving part 51 and the solvent is drawn into the tip part 45 of the coating nozzle 41 to form a liquid layer of solvent, even if the sprayed resist liquid 71 is of high viscosity, a liquid layer of solvent can be formed at the tip part 45 of the coating nozzle 41.

[0067] Furthermore, in the standby unit 5 of this embodiment, since solvent 72 tends to accumulate in the narrowed section 52, continuously supplying solvent 72 from the solvent outlet 56 may lead to excessive accumulation of solvent in the nozzle receiving section 51. Therefore, as Figure 10 As shown, preferably, a separate solvent outlet 60, different from the outlet 53, is provided in a region above the solvent spray outlet 56 to drain excess solvent. The solvent outlet 60 is connected to the discharge path 55 into which the processed liquid and solvent discharged from the outlet 53 flow (see reference). Figure 6The solvent 72 is discharged to the outside of the liquid treatment device 1 via the discharge path 55. If the solvent discharge port 60 is provided in this way, solvent 72 that has excessively accumulated in the nozzle receiving portion 51 and overflowed can be discharged from the nozzle receiving portion 51, thus suppressing the rise of the solvent 72's liquid level. Therefore, it is possible to prevent solvent 72 from adhering to the side of the coating nozzle 41.

[0068] Furthermore, in the above example, the solvent outlet 56 is formed on the first inner circumferential surface 52a, but the formation position of the solvent outlet 56 is not particularly limited and can be arbitrarily selected, as long as it can achieve the desired effect. Figure 5 That would create a vortex effect, causing the solvent to fall. For example, as... Figure 11 As shown, the solvent outlet 56 can also be formed above the first inner circumferential surface 52a, that is, above the narrowed diameter portion 52. Thus, if the solvent outlet 56 is formed above the narrowed diameter portion 52, the formation area of ​​the vortex in the vertical direction (Z-axis direction) can be increased, and the vortex can be easily maintained before the solvent is discharged from the outlet 53. Therefore, when solvent is drawn in from the tip 45 of the coating nozzle 41 to form a liquid solvent layer, the solvent easily accumulates in the narrowed diameter portion 52, and a liquid solvent layer can be easily formed in the flow path 46 of the coating nozzle 41.

[0069] Additionally, in the examples above, such as Figure 8 As shown in (a), during the pre-spraying of the treatment liquid before the solvent is drawn into the tip 45 of the coating nozzle 41 to form a liquid layer of solvent, only the treatment liquid is sprayed out. Figure 8 In example (a), the solvent is resist 71. Furthermore, if the viscosity of the treatment fluid is high, it may be difficult for the treatment fluid to drain from the outlet 53, and the treatment fluid may adhere to the wall of the nozzle housing 51, causing blockage within the nozzle housing 51. Such blockage may, for example, contaminate the tip 45 of the coating nozzle 41 waiting in the nozzle housing 51. Therefore, during the pre-spraying process described above, it is preferable to simultaneously spray the treatment fluid from the coating nozzle 41 and the solvent from the solvent outlet 56. This dilutes the high-viscosity treatment fluid with the solvent, thereby promoting the discharge of the treatment fluid from the outlet 53.

[0070] Furthermore, in the above example, the nozzle unit 3 can move between the processing position and the standby position, but the nozzle unit 3 is preferably configured to also be able to move between the processing position, the standby position, and the pre-spray standby position. For example... Figure 12As shown, the pre-discharge standby position refers to the position where the tip portion 45 of each coating nozzle 41 is housed in the nozzle housing portion 51 when the nozzle outlet 47 is positioned above the solvent outlet 56. In this example, for instance, the control unit U controls the movement of the coating nozzle 41 so that the tip portion 45 of the coating nozzle 41 is positioned above the solvent outlet 56. During pre-discharge, it is preferable that the nozzle unit 3 moves to the aforementioned pre-discharge standby position. Therefore, due to the processing liquid diluted by the solvent 72 ( Figure 12 In the example, the resist 71) will not adhere to the coating nozzle 41, thus preventing the tip 45 of the coating nozzle 41 from being contaminated.

[0071] Furthermore, while the above examples illustrate a nozzle unit 3 with multiple coating nozzles 41, the number of coating nozzles 41 is not limited to the examples described above, and can also be applied to structures including a single coating nozzle. Moreover, the nozzle standby device of this disclosure can be applied to liquid processing apparatuses for substrates other than semiconductor wafers, such as FPD (flat panel display) substrates.

[0072] It should be considered that the embodiments disclosed herein are illustrative in all respects and are not restrictive. The above embodiments may also be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims.

Claims

1. A nozzle standby device for suspending a nozzle used to spray a treatment liquid that will solidify upon drying, wherein, The nozzle standby device includes: A nozzle receiving portion includes an inner peripheral surface formed to surround the tip of the nozzle, and a discharge port formed opposite to the nozzle's outlet; and A solvent outlet is provided, opening within the nozzle housing. This solvent outlet is configured to guide the ejected solvent along the inner circumferential surface of the nozzle housing and discharge it from the outlet. The nozzle housing has a constricted section on the upper side of the outlet, at the portion where the solvent ejected from the solvent outlet forms a vortex and falls, with its inner diameter decreasing towards the outlet. This constricted section includes a first inner circumferential surface and a second inner circumferential surface formed at angles different from each other relative to the centerline of the nozzle housing. In a cross-section cut along the centerline including the nozzle receiving portion, the intersection of two straight lines extending along the respective first inner circumferential surfaces is located above the nozzle outlet when the nozzle tip is positioned in the constricted portion, so that the solvent is easily accumulated in the constricted portion as the solvent ejected from the solvent outlet is discharged from the outlet.

2. The nozzle standby device according to claim 1, wherein, The solvent outlet is formed above the narrowed section.

3. The nozzle standby device according to claim 1 or 2, wherein, The intersection point is located in the region inside the second inner circumferential surface.

4. The nozzle standby device according to claim 1 or 2, wherein, The reduced diameter portion includes a third inner circumferential surface, which is formed such that the inner diameter decreases from the second inner circumferential surface toward the outlet.

5. The nozzle standby device according to claim 4, wherein, In a cross-section formed by cutting along the centerline including the nozzle receiving portion, the angles formed by the opposing first inner circumferential surfaces are equal to the angles formed by the opposing third inner circumferential surfaces.

6. The nozzle standby device according to claim 1 or 2, wherein, A different solvent outlet is provided in the nozzle housing portion above the solvent outlet.

7. The nozzle standby device according to claim 1 or 2, wherein, The nozzle standby device includes a control unit configured to control the following: when pre-spraying the treatment liquid before drawing in solvent at the tip of the nozzle to form a liquid layer of solvent, simultaneously spraying the treatment liquid from the nozzle within the nozzle housing and spraying the solvent from the solvent outlet.

8. The nozzle standby device according to claim 7, wherein, The control unit is configured to control the movement of the nozzle so that, during the pre-discharge, the tip of the nozzle is positioned above the solvent outlet.

9. A liquid treatment device, wherein, The liquid treatment device includes: A substrate holding section that holds a substrate; The nozzle sprays the processing liquid, which has been dried and solidified, onto the surface of the substrate held in the substrate holding portion. The nozzle standby device according to any one of claims 1 to 8; and The suction mechanism draws in solvent by suctioning the flow path upstream of the nozzle in the nozzle standby device.

10. A method for operating a liquid treatment device, wherein, The operation method of this liquid treatment device includes the following steps: The nozzle sprays the processing liquid, which has been dried and solidified, onto the surface of the substrate held in the substrate holding part. The nozzle is placed in a nozzle receiving portion, which includes an inner circumferential surface formed to surround the tip of the nozzle and has an outlet formed opposite to the nozzle's outlet. The treatment liquid is ejected from the nozzle outlet of the nozzle that is waiting in the nozzle receiving section, and the treatment liquid is discharged from the outlet opposite to the nozzle outlet. as well as Solvent is ejected from the solvent outlet that opens within the nozzle housing. The ejected solvent is guided along the inner circumferential surface of the nozzle housing, thereby forming a liquid layer of solvent within the nozzle. The nozzle housing has a constricted section on the upper side of the outlet, at the portion where the solvent ejected from the solvent outlet forms a vortex and falls, with its inner diameter decreasing towards the outlet. This constricted section includes a first inner circumferential surface and a second inner circumferential surface formed at angles different from each other relative to the centerline of the nozzle housing. In the process of forming the liquid layer of solvent, the nozzle is configured such that, in a cross-section formed by cutting along the centerline in a manner that includes the centerline of the nozzle receiving portion, the intersection of two straight lines extending along the opposing first inner circumferential surfaces is located above the nozzle outlet, so that the solvent is easily accumulated in the constricted portion as the solvent sprayed from the solvent outlet is discharged from the outlet.

11. The method of operating the liquid treatment apparatus according to claim 10, wherein, The solvent is sprayed out in the region above the narrowed section.

12. The method of operating the liquid treatment apparatus according to claim 10 or 11, wherein, In the process of forming a liquid layer of solvent, the nozzle is configured such that the intersection point is located in the region inside the second inner circumferential surface.

13. The method of operating the liquid treatment apparatus according to claim 10 or 11, wherein, In the process of forming the liquid layer of solvent, the solvent is made difficult to flow between the second inner circumferential surface and the outlet.

14. The method of operating the liquid treatment apparatus according to claim 13, wherein, The reduced diameter portion has a third inner circumferential surface, which is formed such that the inner diameter decreases towards the outlet from the second inner circumferential surface. In a cross-section formed by cutting along the centerline including the nozzle receiving portion, the angles formed by the opposing first inner circumferential surfaces are equal to the angles formed by the opposing third inner circumferential surfaces.

15. The method of operating the liquid treatment apparatus according to claim 10 or 11, wherein, At a location above the solvent outlet in the nozzle housing, the sprayed solvent that has excessively accumulated in the nozzle housing is discharged.

16. The method of operating the liquid treatment apparatus according to claim 10 or 11, wherein, In the process of discharging the treatment liquid, the treatment liquid is sprayed out from the nozzle and the solvent is sprayed out from the solvent outlet simultaneously.

17. The method of operating the liquid treatment apparatus according to claim 16, wherein, In the process of discharging the treatment liquid, the tip of the nozzle is prevented from contacting the treatment liquid accumulated in the constricted section and sprayed out of the nozzle, as well as the solvent sprayed out of the solvent outlet.

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