Near field communication device

Abstract

One example discloses a near-field device comprising: a near-field magnetic antenna comprising a coil configured to receive or transmit a near-field magnetic signal; a near-field electric antenna configured to receive or transmit a near-field electric signal; and a set of electrical components electrically coupled to the near-field magnetic antenna and the near-field electric antenna; wherein at least one of: the coil of the near-field magnetic antenna or a conductive surface of the near-field electric antenna forms a boundary around the set of electrical components.

Description

Technical Field

[0001] This specification relates to systems, methods, apparatus, devices, articles of manufacture, and instructions for use in near-field devices. Background Technology

[0002] This document discusses near-field interactions between one or more near-field devices or conductive surface subjects on a user's body (i.e., on-body devices) and other conductive surfaces and / or other wireless devices (i.e., off-body devices), based on any of the following: near-field electromagnetic induction (NFEMI), where the transmitter and receiver are coupled via magnetic (H) and electric (E) fields; near-field electro-induction (NFEI), where the transmitter and receiver are coupled via electric (E) fields; and near-field magnetic induction (NFMI / NFC), where the transmitter and receiver are coupled via magnetic (H) fields. Although RF wireless communication is achieved by propagating RF plane waves through free space, NFEMI, NFEI, NFMI, and NFC use non-propagating quasi-static E-field and / or H-field signals for communication. Summary of the Invention

[0003] According to an example embodiment, a near-field device includes: a near-field magnetic antenna including a coil configured to receive or transmit near-field magnetic signals; a near-field electric antenna configured to receive or transmit near-field electric signals; and a set of electrical components electrically coupled to the near-field magnetic antenna and the near-field electric antenna; wherein at least one of the following forms a boundary around the set of electrical components: the coil of the near-field magnetic antenna or a conductive surface of the near-field electric antenna.

[0004] In another example embodiment, the coil of the near-field magnetic antenna and the conductive surface of the near-field electric antenna both form the boundary around the set of electrical components.

[0005] In another example embodiment, only the coil of the near-field magnetic antenna forms the boundary around the set of electrical components.

[0006] In another example embodiment, only the conductive surface of the near-field electric antenna forms the boundary around the set of electrical components.

[0007] In another example embodiment, the near-field device is encapsulated using a flexible material.

[0008] In another example embodiment, the flexible material is a dielectric material.

[0009] In another example embodiment, the flexible material hermetically seals the electrical component against the external environment.

[0010] In another example embodiment, the conductive surface of the near-field electric antenna is a first conductive surface; and further includes a second conductive surface, which is included in the near-field electric antenna; and wherein the first conductive surface is attached to the top layer of the flexible material, and the second conductive surface is attached to the bottom layer of the flexible material.

[0011] In another example embodiment, the electrical component forms a plane along the Z-axis of the device; the conductive surface of the near-field electric antenna is a first conductive surface; and a second conductive surface is also included in the near-field electric antenna; and wherein the first conductive surface and the second conductive surface are separated by a distance along the Z-axis based on near-field electrical signals received and / or transmitted by the near-field electric antenna.

[0012] In another example embodiment, the distance is the maximum distance along the Z-axis.

[0013] In another example embodiment, the electrical component forms a plane along the Z-axis of the device; the conductive surface of the near-field electric antenna is a first conductive surface; and a second conductive surface is additionally included in the near-field electric antenna; wherein the first conductive surface forms a plane slightly higher than the electrical component along the Z-axis; and wherein the second conductive surface forms a plane slightly lower than the electrical component along the Z-axis.

[0014] In another example embodiment, the electrical component forms a plane along the Z-axis of the device; the conductive surface of the near-field electric antenna is a first conductive surface; and a second conductive surface is also included in the near-field electric antenna; wherein the first conductive surface, the second conductive surface, and the electrical component are formed in the same plane along the Z-axis.

[0015] In another example embodiment, the near-field device is encapsulated with a flexible material; and the flexible material is configured to be penetrated by another device to create a through-hole.

[0016] In another example embodiment, the flexible material is configured to be penetrated by a hypodermal injection needle.

[0017] In another example embodiment, a through-hole is further included; wherein the through-hole is within the boundary.

[0018] In another example embodiment, the through hole is centered within the boundary.

[0019] In another example embodiment, the electrical components are physically supported by a rigid substrate, and the near-field magnetic antenna and the near-field electric antenna are physically supported only by the flexible material.

[0020] In another example embodiment, the electrical components include a near-field antenna tuning circuit and a transceiver.

[0021] In another example embodiment, the coil of the near-field magnetic antenna or the conductive surface of the near-field electric antenna has a planar topology; and the planar topology includes: a circle, a rectangle, a polygon, an ellipse, or a rhombus.

[0022] In another example embodiment, a voltage boosting coil is further included, which is electrically coupled to the near-field electric antenna and configured to boost the voltage from the electrical components transmitted to the near-field electric antenna in transmit mode; and wherein the voltage boosting coil is electrically coupled to both the near-field electric antenna and the near-field magnetic antenna at the near-field antenna signal feed connection.

[0023] In another example embodiment, the voltage boosting coil is included within the boundary surrounding the set of electrical components.

[0024] In another example embodiment, the device is embedded in at least one of the following: an eye mask, a glucose sensor, a wearable device, a smartwatch, a smartwatch case, a wireless mobile device, an earplug, a hearing aid, headphones, an activity tracker, or a heart rate monitor.

[0025] In another example embodiment, the boundary is a continuous boundary.

[0026] The foregoing discussion is not intended to represent every example embodiment or implementation within the scope of the present or future claims. The following figures and detailed descriptions further illustrate various example embodiments.

[0027] The various exemplary embodiments can be more fully understood by considering the following specific implementations in conjunction with the accompanying drawings. Attached Figure Description

[0028] Figure 1 This is an example of a near-field wireless system.

[0029] Figure 2A This is an example of a near-field antenna architecture.

[0030] Figure 2B It is an example near-field device circuit that includes a near-field antenna, support circuitry, and is configured to receive non-propagating quasi-static near-field signals.

[0031] Figure 3A This is a top view of an example hardware implementation of a near-field wireless device.

[0032] Figure 3B yes Figure 3A Example side view of a near-field wireless device.

[0033] Figure 3C yes Figure 3A Example bottom view of a near-field wireless device.

[0034] While this disclosure allows for various modifications and alternatives, details of this disclosure have been shown by way of example in the accompanying drawings and will be described in detail. However, it should be understood that other embodiments beyond the specific embodiments described are also possible. All modifications, equivalents, and alternative embodiments falling within the spirit and scope of the appended claims are also covered. Detailed Implementation

[0035] In various example embodiments, the first near-field antenna includes a near-field inductive antenna (e.g., an NFEI antenna or an NFEMI antenna) and is configured for in-body communication. The second near-field antenna includes a near-field magnetic inductive antenna (e.g., an NFC antenna) and is configured for external communication.

[0036] For example, the on-body sensor in the first near-field wireless device can be configured to transmit sensor readings to a second on-body near-field wireless device, which collects the sensor readings and any other user information. A third external wireless device can be a smartphone / NFC reader that powers the second on-body near-field wireless device that collects the sensor readings, thereby causing the second on-body near-field wireless device to transmit the collected sensor readings to the smartphone / NFC reader.

[0037] Note that while the exemplary embodiments discussed herein refer to the user’s body, on the body and outside the body, in alternative embodiments of the near-field device 100, the body is broadly defined herein to include at least: a human body, an animal body, a living body, a body structure of an inanimate object, a robot, a vehicle, a docking system, a physical coupling system, a workbench on an assembly line, etc.

[0038] H-field antennas (i.e., magnetic antennas) are primarily sensitive to magnetic fields and / or primarily induce magnetic fields when driven by current. Any E-field component from an H-field antenna is greatly reduced (e.g., from -20 dB to -60 dB, by a factor of 0.1 to 0.0008 (10% to 0.08%), depending on the antenna design).

[0039] The small loop antenna is an example H-field antenna and includes a loop antenna whose size is much smaller than the wavelength it uses. The small loop antenna does not resonate at the NFEMI carrier frequency, but is instead tuned to resonance via an external reactance. In some example embodiments, the current in the small loop antenna has the same value at every location in the loop.

[0040] E-field antennas (i.e., electric antennas) are primarily sensitive to electric fields and / or primarily induce electric fields when driven by voltage. Any H-field component from an E-field antenna is greatly reduced (e.g., from -20 dB to -60 dB, by a factor of 0.1 to 0.0008 (10% to 0.08%), depending on the antenna design).

[0041] The short-loaded dipole antenna is an example E-field antenna and includes a short dipole much smaller than the NFEMI carrier frequency, and in some example embodiments has additional capacitive surfaces at both ends.

[0042] The quasi-static characteristics of these fields are a result of the combination of NFEMI antenna size and its carrier frequency. Most of the near-field energy is stored in the form of magnetic and electric fields, while a small amount of RF energy inevitably propagates in free space. Small antenna geometry minimizes the radiated waves in free space.

[0043] In some applications, the various parts of the near-field device may be enclosed in a conductive housing or blocked by a conductive housing, which can reduce normal near-field communication because the conductive housing forms a Faraday cage.

[0044] Figure 1 This is an example of a near-field wireless system 100. The example near-field wireless system 100 includes a near-field antenna 102, a tuning circuit 104, a controller 108, and a transceiver circuit 112.

[0045] The controller 108 is configured to monitor and maintain the operating resonant frequency of the system 100 and the operating bandwidth / quality factor of the near-field signal (e.g., NFEI or NFEMI) carried by the near-field antenna. The controller 108 is configured to adjust the tuning parameters when the operating resonant frequency differs from the preselected resonant frequency and / or the operating bandwidth differs from the preselected bandwidth.

[0046] Tuning circuit 104 is configured to adjust the resonant frequency of system 100 using a group of capacitors (C group) and adjust the bandwidth using a group of resistors (R group) in response to a signal from controller 108. In some examples, the C group and R group are discretely approximately 130 pF and 5000 ohms, respectively, to support the desired resonant frequency (e.g., 10.6 MHz) and bandwidth (e.g., 400 kHz). Controller 108 is configured to use tuning circuit 104 to adjust (e.g., increment / decrement) the C group and R group values.

[0047] In some example embodiments, transceiver circuitry 112 is configured to inject test signals (e.g., three test signals) into tuning circuitry 104 and antenna 102. Controller 108 is then configured to: first monitor the loading of near-field antenna 102, and adjust tuning parameters if the loading differs from a pre-selected loading.

[0048] Figure 2A This is a first example of a near-field antenna architecture 200. Antenna 200 includes a short-loaded dipole portion 220 with two conductive loading plates 225, 230 and a small loop antenna 205.

[0049] The small loop antenna includes at least two coupled coils 215 and 217. The first coil 215 has an inductance L1, and the second coil 217 has an inductance L2. Both coils 215 and 217 can be connected at a connection point 250 to form an inductance larger than that of the first coil 215 and the second coil 217.

[0050] Both coils 215 and 217 can be wound around a ferrite core 210 (e.g., Figure 2A As shown ) Winded hollow coils, or they can be in the form of a planar structure.

[0051] In the form of ferrite core 210, coils 215 and 217 can be wound around core 210 in an alternating manner, or wound around each other on top, that is, the second coil 217 is wound around core 210 first, and then the first coil 215 is wound around core 210 immediately after the second coil 217.

[0052] Connection point 245 couples one end of the first coil 215 to the first feed connection 235 and the first plate of the miniature loaded dipole 225. Connection point 250 couples the other end of the first coil 215 to one end of the second coil 217 and the second feed connection 240. Connection point 255 couples the other end of the second coil 217 to the second plate 230 of the miniature loaded dipole 220.

[0053] Figure 2B This is an example near-field circuit 270 based on example near-field antenna architecture 200, support circuitry 272, and configured to receive non-propagating quasi-static near-field signals. Near-field circuitry 270 is configured (e.g., in receive mode) to receive non-propagating quasi-static near-field signals. It should be noted that near-field antenna 200 can also be coupled to transmitter circuitry (not shown) for bidirectional communication.

[0054] A coil 215 in a near-field antenna 200, having an inductance (L1) and a resistor (R3), forms a magnetic (H-field) antenna 271. Two loading plates 225 and 230 in the dipole section 220 form an electric (E-field) antenna 220. The two loading plates 225 and 230 are conductive structures. A coil 217 with an inductance (L2) increases / raises the transmit voltage of the electric antenna 220 received from a transmitter power amplifier (not shown) coupled to feed connections 235, 240.

[0055] Support circuitry 272 includes tuning circuitry 274, LNA 276 (low-noise amplifier), communication signal interface 278, and controller 280. In other example embodiments, support circuitry 272 includes a transmitter power amplifier (not shown).

[0056] Tuning circuit 274 is coupled to a first feed point 235 and a second feed point 240. Tuning circuit 274 includes a first variable tuning capacitor bank (C1), a second variable tuning capacitor bank (C2), a first variable tuning resistor bank (R1), and a second variable tuning resistor bank (R2). The capacitor banks and resistor banks are coupled to a reference potential 288 (e.g., ground potential). The capacitor banks are coupled to controller 280 via control line 282, and the resistor banks are coupled to controller 280 via control line 284.

[0057] The controller 280 adjusts the first and second capacitor groups (C1) and (C2) to adjust the resonant frequency of the magnetic antenna 271 and the electric antenna 220 (e.g., to 10.6 MHz). The controller 280 adjusts the first and second resistor groups (R1) and (R2) to adjust the bandwidth of the magnetic antenna 271 and the electric antenna 220 (e.g., to 400 kHz) such that the bandwidth is sufficient to allow the reception of non-propagating quasi-static near-field signals from the antennas 271 and 220.

[0058] The capacitor banks (C1) and (C2) are tuned equally from the controller 280 using control line 282, and the resistor banks (R1) and (R2) are tuned equally from the controller 280 using control line 284.

[0059] LNA 276 is coupled between tuning circuit 274 and communication signal interface 278. When near-field circuit 270 is receiving a non-propagating quasi-static near-field signal, an induced voltage 286 (Vlna) exists across the differential input of LNA 276. LNA 276 amplifies the received near-field signal, which is then further processed by additional radio / RFIC / baseband circuitry (not shown) coupled to communication signal interface 278. LNA 276 is also coupled to reference potential 288.

[0060] Since the inputs to LNA 276 are all coupled to antennas 271 and 220, the configuration of near-field circuit 270 is considered balanced. This balanced circuit configuration helps suppress interference signals entering the two input lines of LNA 276 with the same amplitude and phase. In other examples, unbalanced circuitry may be used.

[0061] During operation, a voltage is induced in the electric (E-field) antenna 220 by the received near-field electrical signal. This voltage generates a current that flows through the E-field antenna 220.

[0062] The discussion now concerns wearable sensor devices with topologies that can be implemented differently to minimize the overall device height and / or volume while maximizing near-field signal strength. Such implementations / designs minimize obstruction to the user and / or body surface, which would be a problem for larger near-field devices.

[0063] In some implementations, a first device (i.e., a wearable glucose sensor) is attached to a human user suitable for measuring bodily parameters and transmits these parameters across the user to a second device via near-field electro- and magnetic induction (NFEMI). The second device (e.g., an insulin pump) influences the user's medical condition.

[0064] Figure 3A This is an example top view of a hardware implementation of a near-field wireless device 300. The device 300 includes a substrate 302, an optional via 304, an electrical component 306, a magnetic (H-field) antenna coil 308, a voltage boosting coil 310, an electric (E-field) antenna formed by a first conductive surface 312 and a second conductive surface 314, and a flexible material 316 (e.g., a dielectric material).

[0065] Although device 300 is shown as circular, device 300 may have any shape depending on its application.

[0066] In some example embodiments, the substrate 302 is rigid and positioned close to the bottom side of the sensor, and is configured to mount the electrical and mechanical components required for the functionality of the device 300. The substrate 302 may be, for example, a printed circuit board made of FR4 material, which has, for example, a thickness of 1 mm and a dielectric constant of 4.4.

[0067] In some example embodiments, the through-hole 304 (e.g., channel, hole, pipe, etc.) is located approximately in the center of the device 300, but in other example embodiments, it may be offset. The through-hole 304 can be used to allow mechanical devices to pass through the device 300 for potentially measuring user / body surface parameters (e.g., glucose) and applying materials (e.g., insulin) as needed, depending on the application of the device 300.

[0068] Electrical component 306 is located on top of substrate 302, and in some example embodiments, electrical component 306 includes near-field NFEMI radio circuitry. Electrical component 306 includes a communication unit and other necessary electrical and mechanical components. In some example embodiments, it includes tuning circuitry 274 and support circuitry 272 (e.g., transmitter, receiver, or transceiver communication circuitry).

[0069] A magnetic (H-field) antenna coil 308 is attached at a first location on the top layer of flexible material 316. The topology (i.e., geometry) of coil 308 is at least one of the following: a three-dimensional spiral, a planar spiral, or a three-dimensional spiral.

[0070] The voltage-boosting coil 310 is attached to the second side of the top layer of the flexible material 316 and has the function of boosting the voltage in the transmission mode for the electric antenna. Although shown below the magnetic (H-field) antenna coil 308, the voltage-boosting coil 310 may be in the same plane as the magnetic (H-field) antenna coil 308 in other embodiments or staggered in different positions depending on the manufacturing design of the device 300. By arranging the first conductive surface 312 and the second conductive surface 314 along the Z-axis with the same plane as the electrical component 306 as the center, a flatter and more compact device 300 along the Z-axis can be achieved.

[0071] The electric (E-field) antenna is formed by a first conductive surface 312 and a second conductive surface 314. In some example embodiments, the first conductive surface 312 is attached to or very close to the top layer of the flexible material 316, and the second conductive surface 314 is attached to or very close to the bottom layer of the flexible material 316 at a maximum distance apart, thereby maximizing the near-field electrical signal.

[0072] The conductive surfaces 312 and 314 together form a capacitor, and in receiving mode, they guide voltage into the support circuit 272, and in transmitting mode, they receive voltage from the support circuit 272 to be converted into a near-field electrical signal by the conductive surfaces 312 and 314. Compared with the first conductive surface 312, the second conductive surface 314 is closer to the main body positioning.

[0073] In some example embodiments, in order to minimize the overall height of the device 300, one or more of the near-field antenna components 308, 310, 312, 314 are physically configured to surround the substrate 302, the via 304, and the electrical component 306.

[0074] In other example embodiments, one or more of the near-field antenna components 308, 310, 312, and 314 are physically configured to form boundaries (e.g., surround, spiral around, enclose, fence, demarcate, etc.) around the substrate 302, the via 304, and the electrical component 306, in order to maximize the overall near-field signal strength of the device 300 given the total volume of the device 300. In this way, all non-antenna components will be inside the near-field antenna structure. In some example embodiments, the boundaries are substantially or completely continuous (e.g., solid conductive plates); however, in other example embodiments, the boundaries may have gaps (e.g., gaps between individual windings of a spiral coil, or gaps between two halves of a single conductive plate).

[0075] In some example embodiments, one or more of the near-field antenna components 308, 310, 312, 314 still form a continuous ring portion, but only surround a portion of the substrate 302 and / or the electrical component 306.

[0076] The flexible material 316 (e.g., a dielectric) may be formed from one or more layers and encapsulate the device 300. If multiple layers are present, these layers are attached to each other such that electrical connections can be arranged to integrate the electric and magnetic antennas, as well as the tuning circuitry and communication unit, within the electrical component 306.

[0077] In some example embodiments, the flexible material 316 is a gel-like dielectric material that not only hermetically seals / encapsulates all or parts of the device 300, but also better conforms to the user / body surface of the wearer of the device 300.

[0078] In some example embodiments, the flexible material 316 is surrounded by a plastic shell / outer shell. The flexible material 316 and the plastic shell / outer shell, alone or together, enable the device 300 to be waterproof / impermeable to liquids, even in example embodiments where the flexible material 316 is penetrated to form a through-hole / hole 304.

[0079] The flexible material 316 can be penetrated by a medical needle (e.g., for insulin administration) or a tubing / cannula to form a through-hole 304, through which the medical needle or tubing / cannula can be placed if the through-hole 304 already exists. In other example embodiments, the through-hole 304 is present and / or not required, and the near-field antenna and electrical components 306 are completely embedded within the flexible material 316.

[0080] In some example embodiments, the through-hole 304 (e.g., channel, hole, pipe, etc.) is located approximately in the center of the device 300, but in other example embodiments, it may be offset. The through-hole 304 can be used to allow mechanical devices to pass through the device 300 for potentially measuring user / body surface parameters (e.g., glucose) and applying materials (e.g., insulin) as needed, depending on the application of the device 300.

[0081] Figure 3B yes Figure 3A An example side view of the near-field wireless device 300. In the side view, the second conductive surface 314 can be seen positioned in a plane slightly below the plane of the electrical component 306 along the Z-axis. The first conductive surface 312 can also be seen positioned in a plane slightly above the plane of the electrical component 306 along the Z-axis.

[0082] In some example embodiments, the first conductive surface 312 and the second conductive surface 314 are separated at the maximum distance along the Z-axis to better maximize the near-field electric (E-field) signal.

[0083] Although the first conductive surface 312 is shown on a plane slightly above the electrical component 306 along the Z-axis, and the second conductive surface 314 is shown on a plane slightly below the electrical component 306 along the Z-axis, in other example embodiments, either or both of the first conductive surface 312 and the second conductive surface 314 are centered along the Z-axis on the same plane as the electrical component 306.

[0084] By placing the first conductive surface 312 and the second conductive surface 314 along the Z-axis with the same plane as the electrical component 306 as the center, a flatter and more compact device 300 along the Z-axis can be achieved.

[0085] Figure 3C yes Figure 3A An example bottom view of the near-field wireless device 300. In some example embodiments, the flexible material 316 on the bottom side of the device 300 is very thin (e.g., 1 mm) to enable better capacitive coupling with the user / subject wearing the near-field device 300. The flexible material 316 may be an FR4 sheet with a dielectric constant of 4.4 and a thickness of 0.2 mm. Other materials may also be used, as long as they have dielectric properties.

[0086] Applications of device 300 include: wearables for wireless body networks that require a small / low form factor; medical applications, such as wearable glucose monitoring systems where glucose sensors measure blood glucose levels at locations on the body and transmit this information using NFEMI to an insulin pump also worn on or close to the user's body, and may additionally include NFC circuitry as a backup to save such medical information when the device 300's battery discharges.

[0087] Unless a specific order is explicitly stated, the various instructions and / or operational steps discussed in the foregoing figures can be performed in any order. Furthermore, those skilled in the art will recognize that while some example sets of instructions / steps have been discussed, the material in this specification can be combined in various ways to produce other examples, and should be understood within the context provided by this specific embodiment.

[0088] In some example embodiments, these instructions / steps are implemented as functional and software instructions. In other embodiments, the instructions may be implemented using logic gates, application-specific chips, firmware, and other hardware forms.

[0089] When instructions are implemented as a set of executable instructions in a non-transitory computer-readable or computer-usable medium, these instructions are implemented on a computer or machine on which the executable instructions are programmed and controlled. The instructions are loaded for execution on a processor (e.g., one or more CPUs). The processor includes a microprocessor, microcontroller, processor module or subsystem (including one or more microprocessors or microcontrollers) or other control or computing device. A processor may refer to a single component or multiple components. The computer-readable or computer-usable storage medium is considered part of an article (or article of manufacture). An article or article of manufacture may refer to any single component or multiple components manufactured. Non-transitory machine or computer-usable medium as defined herein does not include signals, but such media may be capable of receiving and processing information from signals and / or other transient media.

[0090] It will be readily understood that components of the embodiments generally described herein and illustrated in the accompanying drawings can be arranged and designed in a variety of different configurations. Therefore, the more detailed descriptions of the various embodiments illustrated below are not intended to limit the scope of this disclosure, but merely to illustrate various embodiments. While various aspects of the embodiments are presented in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0091] The invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The described embodiments are to be regarded in all respects as illustrative rather than restrictive. Therefore, the scope of the invention is indicated by the appended claims, and not by the specific embodiments described therein. All variations that appear within the meaning and scope of the equivalents of the claims are covered by the scope of the claims.

[0092] References to features, advantages, or similar language throughout this specification do not imply that all features and advantages achievable through the invention should be included in or in any single embodiment of the invention. In fact, language relating to features and advantages should be understood to mean that a specific feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the invention. Therefore, discussions of features and advantages, as well as similar language throughout this specification, may refer to, but do not necessarily refer to the same embodiment.

[0093] Furthermore, the features, advantages, and characteristics described herein can be combined in one or more embodiments in any suitable manner. In view of the description herein, those skilled in the art will recognize that the invention can be practiced without one or more of the specific features or advantages of a particular embodiment. In other instances, additional features and advantages that may not be present in all embodiments of the invention can be identified in certain embodiments.

[0094] Throughout this specification, references to "an embodiment," "embodiment," or similar language mean that a particular feature, structure, or characteristic described in connection with the indicated embodiment is included in at least one embodiment of the invention. Therefore, the phrases "in one embodiment," "in an embodiment," and similar language throughout this specification may, but not necessarily all, refer to the same embodiment.

Claims

1. A near-field device, characterized in that, include: A near-field magnetic antenna, comprising a coil configured to receive or transmit near-field magnetic signals; A near-field electrical antenna, configured to receive or transmit near-field electrical signals; as well as A set of electrical components electrically coupled to the near-field magnetic antenna and the near-field electric antenna; At least one of the following forms the boundary around the set of electrical components: the coil of the near-field magnetic antenna or the conductive surface of the near-field electric antenna; The electrical component forms a plane along the Z-axis of the device; The conductive surface of the near-field electric antenna is a first conductive surface; It also includes a second conductive surface, which is incorporated in the near-field electric antenna; The first conductive surface is formed as a plane slightly higher than the electrical component along the Z-axis; and The second conductive surface is formed as a plane slightly lower than the electrical component along the Z-axis; It also includes a through hole, which is located within the boundary; The electrical components are physically supported by a rigid substrate, while the near-field magnetic antenna and the near-field electric antenna are physically supported only by flexible materials. Additionally, a voltage boosting coil is included, which is electrically coupled to the near-field electric antenna and configured to boost the voltage from the electrical components transmitted to the near-field electric antenna in transmit mode; and The voltage boosting coil is electrically coupled to both the near-field electric antenna and the near-field magnetic antenna at the near-field antenna signal feed connection.

2. The apparatus according to claim 1: Its features are, The coil of the near-field magnetic antenna and the conductive surface of the near-field electric antenna together form the boundary around the set of electrical components.

3. The apparatus according to claim 1: Its features are, Only the coil of the near-field magnetic antenna or the conductive surface of the near-field antenna forms the boundary around the set of electrical components.

4. The apparatus according to claim 1: Its features are, The near-field device is encapsulated using a flexible material.

5. The apparatus according to claim 4: Its features are, The flexible material airtightly seals the electrical components from the external environment.

6. The apparatus according to claim 4: Its features are, The conductive surface of the near-field electric antenna is a first conductive surface; It also includes a second conductive surface, which is incorporated in the near-field electric antenna; and The first conductive surface is attached to the top layer of the flexible material, and the second conductive surface is attached to the bottom layer of the flexible material.

7. The apparatus according to claim 1: Its features are, The electrical component forms a plane along the Z-axis of the device; The conductive surface of the near-field electric antenna is a first conductive surface; It also includes a second conductive surface, which is incorporated in the near-field electric antenna; and The first conductive surface and the second conductive surface are separated along the Z-axis based on the near-field electrical signal received and / or transmitted by the near-field electrical antenna.

8. The apparatus according to claim 1: Its features are, The electrical component forms a plane along the Z-axis of the device; The conductive surface of the near-field electric antenna is a first conductive surface; It also includes a second conductive surface, which is incorporated in the near-field electric antenna; and The first conductive surface, the second conductive surface, and the electrical component are formed in the same plane along the Z-axis.

9. The apparatus according to claim 1: Its features are, The near-field device is encapsulated using a flexible material; and The flexible material is configured to be penetrated by another device to create a through-hole.

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