Mask and mask manufacturing method

Abstract

A mask and a mask manufacturing method are provided. The mask manufacturing method includes: preparing a mask sheet and a frame; stretching the mask sheet and fixing the stretched mask sheet to the frame; and forming a unit opening in the mask sheet fixed to the frame.

Description

[0001] Cross-reference of related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0107990, filed on August 26, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates herein to a mask with improved reliability and a method for manufacturing the mask. Background Technology

[0004] A display panel comprises multiple pixels. Each pixel includes driving elements such as transistors and display elements such as organic light-emitting diodes. Display elements can be formed by stacking electrodes and light-emitting patterns on a substrate.

[0005] A light-emitting pattern is patterned using a mask that defines a through-hole portion, thereby forming a light-emitting pattern in a given area. The light-emitting pattern can be formed in the area exposed by the through-hole portion. The shape of the light-emitting pattern can be controlled according to the shape of the through-hole portion. Summary of the Invention

[0006] This disclosure provides a mask with improved reliability of deposition processes and a method for manufacturing the mask.

[0007] Some embodiments of this disclosure improve the machining accuracy of the unit openings and reduce the dead zone by laser machining the unit openings after stretching and welding the mask sheet.

[0008] According to some embodiments of the present disclosure, the mask and mask manufacturing method improve the processing accuracy of the unit opening by reducing the tension of the stretched mask sheet through initial processing before laser beam processing of the unit opening.

[0009] Some embodiments of this disclosure provide a mask manufacturing method, the method comprising: preparing a mask sheet and a frame; stretching the mask sheet and fixing the stretched mask sheet to the frame; and forming a cell opening in the mask sheet fixed to the frame.

[0010] Forming unit openings may include: forming an initial unit opening in a mask sheet fixed to a frame; and forming unit openings that correspond to the initial unit openings respectively.

[0011] The size of each of the initial cell openings can be approximately 25% to approximately 90% of the size of each of the cell openings.

[0012] The shape of the initial cell opening can be different from the shape of the cell opening.

[0013] Preparing a mask sheet may include forming initial cell openings in the mask sheet, wherein forming cell openings includes forming cell openings that correspond to the initial cell openings respectively.

[0014] During the formation of the cell opening, everything in the initial cell opening can be removed.

[0015] Forming unit openings may include emitting a laser beam onto a mask plate fixed to a frame.

[0016] The inner surface of the defined unit opening of the mask sheet can have a tapered shape.

[0017] The mask manufacturing method may further include: fixing an electrostatic chuck on the mask sheet fixed to the frame between the mask sheet and the forming unit opening.

[0018] Forming a unit opening may include: forming an initial unit opening before forming a unit opening, wherein each unit opening corresponds to an initial unit opening, and wherein the size of each of the unit openings is larger than the size of each of the initial unit openings.

[0019] The mask manufacturing method may further include removing the electrostatic chuck from the mask sheet after forming the cell opening.

[0020] In some embodiments of this disclosure, a mask manufacturing method includes: preparing a mask sheet and a frame; stretching the mask sheet and fixing the stretched mask sheet to the frame; forming slit openings in the mask sheet fixed to the frame; and forming unit openings in the mask sheet fixed to the frame, each of the unit openings being located between corresponding slit openings in the slit openings.

[0021] The number of slit openings can be greater than the number of unit openings.

[0022] The size of each slit opening can be smaller than the size of each unit opening.

[0023] Forming unit openings may include: forming initial unit openings, each of which is disposed between corresponding slit openings in the slit openings; and forming unit openings that are respectively corresponding to the initial unit openings.

[0024] The size of each of the initial element openings can be smaller than the size of each of the element openings, wherein the shape of the initial element opening is different from the shape of the element opening.

[0025] The mask manufacturing method may further include: after the mask sheet is fixed to the frame and before the slit opening is formed, setting an electrostatic chuck on the mask sheet.

[0026] In some embodiments of this disclosure, a mask includes: a frame; and a mask sheet disposed on the frame, wherein slit openings and unit openings located between corresponding slit openings in the slit openings are defined in the mask sheet, wherein the width of each of the slit openings is smaller than the width of each of the unit openings.

[0027] The mask may further include shielding members respectively disposed on the slit opening to shield the slit opening.

[0028] The material of the shielding component can be the same as the material of the mask. Attached Figure Description

[0029] The accompanying drawings are included to provide a further understanding of this disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the disclosure. In the drawings:

[0030] Figure 1 This is a perspective view illustrating a mask according to some embodiments of the present disclosure;

[0031] Figure 2 This is a flowchart illustrating a mask manufacturing method according to some embodiments of the present disclosure;

[0032] Figure 3 This is a flowchart illustrating a mask manufacturing method according to some embodiments of the present disclosure;

[0033] Figures 4A to 4E This is a view illustrating a mask manufacturing method according to some embodiments of the present disclosure;

[0034] Figure 5 This is a flowchart illustrating a mask manufacturing method according to some embodiments of the present disclosure;

[0035] Figures 6A to 6C This is a view illustrating a mask manufacturing method according to some embodiments of the present disclosure;

[0036] Figure 7 This is a flowchart illustrating a mask manufacturing method according to some embodiments of the present disclosure; and

[0037] Figures 8A to 8D This is a view illustrating a mask manufacturing method according to some embodiments of the present disclosure. Detailed Implementation

[0038] Some aspects of embodiments of the present disclosure and their implementation methods can be more readily understood through the detailed description of the embodiments and the accompanying drawings. Hereinafter, embodiments will be described in more detail with reference to the accompanying drawings. However, the described embodiments may be embodied in various different forms and should not be construed as being limited to the embodiments shown herein. Rather, these embodiments are provided as examples so that this disclosure will be comprehensive and complete, and will fully convey aspects of the disclosure to those skilled in the art. Therefore, processes, elements, and techniques that are unnecessary for those skilled in the art to fully understand aspects of the disclosure are not described.

[0039] Unless otherwise stated, the same reference numerals, characters, or combinations thereof denote the same elements throughout the drawings and written description, and therefore their description will not be repeated. Furthermore, portions unrelated to the description of the embodiments may be omitted for clarity.

[0040] In the accompanying drawings, the relative dimensions of elements, layers, and regions may be exaggerated for clarity. Additionally, the use of crosshairs and / or shading in the drawings is generally provided to clearly define the boundaries between adjacent elements. Therefore, unless otherwise specified, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for particular materials, material properties, dimensions, scales, commonalities between elements, or any other characteristics, properties, or attributes of the elements.

[0041] This document describes various embodiments with reference to cross-sectional views illustrating schematic examples and / or intermediate structures. Therefore, variations in the shapes shown in the drawings should be expected due to factors such as manufacturing techniques and / or tolerances. Furthermore, the specific structural or functional descriptions disclosed herein are merely illustrative, intended to describe embodiments according to the concept of this disclosure. Therefore, the embodiments disclosed herein should not be construed as limited to the shapes of the specific areas shown, but rather include shape deviations caused, for example, by manufacturing. Thus, the areas shown in the drawings are schematic in nature, and their shapes are not intended to represent the actual shapes of areas of the device, nor are they intended to be limiting. Additionally, as those skilled in the art will recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of this disclosure.

[0042] In this detailed description, numerous specific details are set forth for illustrative purposes to provide a comprehensive understanding of the various embodiments. However, it will be apparent that the various embodiments can be practiced without these specific details or using one or more equivalent arrangements. In other instances, well-known structures and devices are shown in block diagram form to avoid unnecessarily obscuring the various embodiments.

[0043] For ease of explanation, spatial relative terms such as “below,” “under,” “down,” “below,” “above,” and “above” are used herein to describe the relationship of one element or feature relative to another element(s) as shown in the accompanying drawings. It should be understood that spatial relative terms are intended to encompass different orientations of the device in use or operation, other than those depicted in the drawings. For example, if the device in the drawings is flipped, an element described as “below,” “under,” or “below” other elements or features will be oriented “above” the other elements or features. Thus, the example terms “below” and “below” can encompass both above and below orientations. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein should be interpreted accordingly. Similarly, when a first component is described as being arranged “above” a second component, this means that the first component is arranged above or below the second component, and not limited to being above the second component based on the direction of gravity.

[0044] Furthermore, in this specification, the phrase "in a plane" or "plan view" refers to the target portion viewed from above, and the phrase "in a cross section" refers to the cross section formed by vertically cutting the target portion viewed from the side.

[0045] It will be understood that when a component, layer, region, or part is referred to as being "formed on," "on," "connected to," or "coupled to" another component, layer, region, or part, it can be directly formed on, directly on, directly connected to, or coupled to another component, layer, region, or part, or indirectly formed on, indirectly on, indirectly connected to, or coupled to another component, layer, region, or part, such that one or more intermediary components, layers, regions, or parts may be present. For example, when a layer, region, or part is referred to as being "electrically connected" or "electrically coupled" to another layer, region, or part, it can be directly electrically connected or coupled to another layer, region, or part, or an intermediary layer, region, or part may be present. However, "direct connection / direct coupling" refers to a part being directly connected or coupled to another part without an intermediary part. Similarly, other expressions describing the relationship between components, such as "between," "immediately between," "adjacent to," and "directly adjacent to," can be interpreted in a similar way. Furthermore, it will be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between those two elements or layers, or there can be one or more intervening elements or layers.

[0046] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, the first element, component, region, layer, or part described below may be referred to as the second element, component, region, layer, or part without departing from the spirit and scope of this disclosure.

[0047] In this example, the x-axis, y-axis, and / or z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a general sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other. The same applies to the first, second, and / or third directions.

[0048] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. As used herein, the singular form “a” is intended to include the plural form as well, unless the context clearly indicates otherwise. It will be further understood that, when used in this specification, the terms “comprising,” “having,” and “including” specify the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof.

[0049] As used herein, the terms “substantially,” “approximately,” “approximately,” and similar terms are used as approximate terms rather than terms of degree and are intended to describe the inherent biases of measured or calculated values ​​that will be recognized by one of ordinary skill in the art. Taking into account the measurements discussed and the errors associated with the measured values ​​of a particular quantity (i.e., limitations of the measurement system), “approximately” or “approximately” as used herein includes stated values ​​and means within an acceptable range of deviation from that particular value as determined by one of ordinary skill in the art. For example, “approximately” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value. Furthermore, when describing embodiments of this disclosure, the use of “may” refers to “one or more embodiments of this disclosure.”

[0050] When one or more embodiments can be implemented differently, a particular process can be performed in an order different from the order described. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of their description.

[0051] Furthermore, any numerical range disclosed and / or described herein is intended to include all subranges with the same numerical precision contained within the described range. For example, the range “1.0 to 10.0” is intended to include all subranges between the described minimum value of 1.0 and the described maximum value of 10.0 (inclusive), i.e., a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as, for example, 2.4 to 7.6. Any maximum numerical limit described herein is intended to include all smaller numerical limits included therein, and any minimum numerical limit described in this specification is intended to include all larger numerical limits included therein. Therefore, the applicant reserves the right to amend this specification (including the claims) to expressly describe any subranges contained within the range expressly described herein. All such ranges are intended to be inherently described in this specification such that amendments to expressly describe any such subranges will comply with the requirements of Chinese patent law.

[0052] The electronic or electrical devices and / or any other related devices or components according to embodiments of the present disclosure described herein can be implemented using any suitable hardware, firmware (e.g., application-specific integrated circuits), software, or a combination of software, firmware, and hardware. For example, various components of these devices can be formed on an integrated circuit (IC) chip or on a separate IC chip. Furthermore, various components of these devices can be implemented on flexible printed circuit films, tape-on packages (TCPs), printed circuit boards (PCBs), or formed on a substrate.

[0053] Furthermore, the various components of these devices can be processes or threads that run on one or more processors in one or more computing devices, execute computer program instructions, and interact with other system components to perform the functions described herein. The computer program instructions are stored in memory (e.g., random access memory (RAM)) that can be implemented in a computing device utilizing standard memory devices. The computer program instructions can also be stored in other non-transitory computer-readable media such as CD-ROMs, flash drives, etc. Moreover, those skilled in the art will recognize that the functions of various computing devices can be combined or integrated into a single computing device, or the functions of a particular computing device can be distributed across one or more other computing devices without departing from the spirit and scope of the embodiments of this disclosure.

[0054] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that, unless expressly defined herein, terms such as those defined in common dictionaries shall be interpreted as having the same meaning as they have in the relevant field and / or the context of this specification, and shall not be interpreted in an idealized or overly formal sense.

[0055] Figure 1 This is a perspective view illustrating a mask according to some embodiments of the present disclosure.

[0056] refer to Figure 1 A mask MK can be used in processes for depositing material. In some embodiments of this disclosure, the mask MK may include a frame FR and a mask sheet MS.

[0057] The top surface of each component is parallel to the plane defined by the first direction DR1 and the second direction DR2. The thickness direction of each component is indicated by the third direction DR3. The upper side (or upper portion) and lower side (or lower portion) of each component are distinguished from each other by the third direction DR3. However, the directions indicated as the first to third directions DR1, DR2 and DR3 are relative concepts and can therefore be changed to other directions.

[0058] When viewed in a plan view, the frame FR can have a ring shape. That is, an opening area can be provided in the region including the center of the frame FR. The opening area can be a hole extending from the top surface of the frame FR to the bottom surface of the frame FR.

[0059] As an example of the shape of frame FR Figure 1 The rectangular ring shape is shown (see also) Figure 4A However, the shape of the frame FR is not limited to this. For example, the frame FR can have various shapes, such as circular rings and polygonal rings other than rectangular rings. Figure 1 The diagram schematically illustrates a frame FR positioned below a mask sheet MS to support the mask sheet MS, but embodiments of this disclosure are not limited thereto. The frame FR may be positioned below the mask sheet MS to support the mask sheet MS, and may allow the mask sheet MS to extend in a first direction DR1 and a second direction DR2.

[0060] According to some embodiments, the mask sheet MS may include a plurality of cell openings CA arranged in a first direction DR1 and a second direction DR2. In some embodiments, the cell openings CA are shown such that there are two rows or two columns spaced apart from each other in the second direction DR2, each row including five cell openings CA spaced apart from each other in the first direction DR1, but this is only shown as an example. The mask sheet MS may include more cell openings CA. Furthermore, the cell openings CA may be arranged in only one of the first direction DR1 and the second direction DR2, and are not limited to any one embodiment.

[0061] According to some embodiments, a mask sheet MS may have a plate shape extending in a first direction DR1 and a second direction DR2. The mask sheet MS may include a plurality of unit openings CA arranged in the first direction DR1 and the second direction DR2, and may have an integral plate shape such that the unit openings CA are connected to each other. The mask sheet MS includes a plurality of unit openings CA and an extension region for surrounding each of the unit openings CA, wherein the unit openings CA are connected to each other through the extension regions. Therefore, the mask sheet MS may have an integral plate shape. According to some embodiments, the mask sheet MS may not have a rod shape extending in either the first direction DR1 or the second direction DR2, but may have a plate shape extending in both the first direction DR1 and the second direction DR2. However, embodiments of the present disclosure are not limited thereto, and mask sheets MS according to other embodiments of the present disclosure may have a rod shape, wherein each of the plurality of mask sheets extends in either the first direction DR1 or the second direction DR2, and wherein the mask sheets are spaced apart in the other direction.

[0062] In some embodiments, the mask sheet MS and the frame FR may comprise the same material. For example, the mask sheet MS and the frame FR may comprise an alloy of iron (Fe) and nickel (Ni). In some embodiments, the mask sheet MS and the frame FR may comprise nickel and iron, and may further comprise cobalt (Co). In this case, each of the mask sheet MS and the frame FR may comprise about 5% cobalt (Co).

[0063] Figure 2 This is a flowchart illustrating a mask manufacturing method according to some embodiments of the present disclosure. Figure 3 This is a flowchart illustrating a mask manufacturing method according to some embodiments of the present disclosure. Figures 4A to 4E This is a view illustrating a mask manufacturing method according to some embodiments of the present disclosure, and also illustrates a method according to... Figure 2 and Figure 3 The mask manufacturing method for the flowchart.

[0064] refer to Figure 2 A mask manufacturing method may include preparing a frame and an initial mask sheet. The initial mask sheet may have a plate shape for forming the mask sheet. An initial mask sheet refers to a mask sheet in which cell openings have not yet been formed. For ease of description, the term "initial mask sheet" is used to distinguish it from a mask sheet that includes cell openings.

[0065] A mask manufacturing method according to some embodiments of the present disclosure may include stretching an initial mask sheet to mount it onto a frame (S100). The initial mask sheet may be stretched to the size of the frame, such that the initial mask sheet is fixed to the frame.

[0066] A mask manufacturing method according to some embodiments of the present disclosure may include fixing an initial mask sheet to a frame (S200). The initial mask sheet may be fixed to the frame in a stretched state by a welding process.

[0067] A mask manufacturing method according to some embodiments of the present disclosure may include forming a plurality of unit openings in an initial mask sheet that is welded and fixed to a frame (S300). The mask sheet can be provided by forming a plurality of unit openings in the initial mask sheet.

[0068] refer to Figure 3 This forms multiple unit openings (S300, see...) Figure 2 This may include forming a plurality of initial cell openings in the initial mask (S310) and forming a plurality of cell openings corresponding to the plurality of initial cell openings (S320). Here, the plurality of initial cell openings may be temporary openings pre-formed at the locations where cell openings are to be formed before forming cell openings.

[0069] In other embodiments, the initial cell openings can be formed during the preparation of the initial mask sheet. That is, the initial cell openings can be formed before the initial mask sheet is stretched and secured to the frame. Because precise fabrication of the initial mask sheet is not required, it is not necessary to form the initial cell openings after stretching and securing the initial mask sheet to the frame.

[0070] refer to Figures 4A to 4E , will describe in detail according to Figure 2 and Figure 3 Mask manufacturing methods in some embodiments. Figures 4A to 4E This is a view showing, in sequence, some embodiments of the mask manufacturing method of this disclosure.

[0071] Figure 4A The preparation of the initial mask sheet P-MS and frame FR is shown. Figure 4A In this process, an initial mask P-MS and a frame FR are prepared. The dimensions of the initial mask P-MS in the first direction DR1 and the second direction DR2 are smaller than the dimensions of the frame FR in the first direction DR1 and the second direction DR2, respectively. The thickness of the initial mask P-MS and the frame FR in the third direction DR3 is not limited to those shown in the figures, but for example, the thickness of the initial mask P-MS can be the same as the thickness of the frame FR.

[0072] Figure 4B The stretching of the initial mask sheet P-MS is shown. Figure 4B In this process, the initial mask P-MS can be stretched to the size of the frame FR in both the first direction DR1 and the second direction DR2, so that the initial mask P-MS is fixed to the frame FR.

[0073] Figure 4C The initial mask sheet P-MS is shown being fixed to the frame FR to form the initial cell opening. Figure 4D The diagram shows the formation of cell openings that correspond to the initial cell openings.

[0074] exist Figure 4C and Figure 4D In the initial process, the stretched initial mask sheet P-MS can be placed on the frame FR and welded to the frame FR via welding member AD. The initial mask P-MK, formed by fixing the initial mask sheet P-MS to the frame FR by welding, is in a state in which the cell openings CA for the deposition process have not yet been formed. In the subsequent process, after the mask sheet MS is manufactured by forming the cell openings CA in the initial mask sheet P-MS, the mask sheet MS can be formed together with the frame FR to form the mask MK.

[0075] In some embodiments, laser beam LS1 can be emitted onto the initial mask P-MS to form the initial cell opening P-CA. After forming the initial cell opening P-CA, the corresponding cell opening CA can be formed. The cell opening CA can be formed by emitting laser beam LS2. The embodiments only illustrate the case where the initial cell opening P-CA and the cell opening CA are formed by emitting laser beams LS1 and LS2, but the initial cell opening P-CA and the cell opening CA can be formed by another process such as etching. In some embodiments, laser beams LS1 and LS2 can be emitted from the side of the third-direction DR3 that is closer to the frame FR than the initial mask P-MS.

[0076] The dimension of each of the initial unit openings P-CA is smaller than the dimension of each of the unit openings CA. For example, the dimension of each of the initial unit openings P-CA can be approximately 25% to approximately 90% of the dimension of each of the unit openings CA. Each of the initial unit openings P-CA can have various dimensions within a range that does not affect the machining of the unit opening CA. The inner diameter of the initial unit opening P-CA can be approximately 100 μm to approximately 1 mm smaller than the inner diameter of the corresponding unit opening CA. That is, the inner diameter difference LT1 between the initial unit opening P-CA and the unit opening CA can be approximately 100 μm to approximately 1 mm.

[0077] During the formation of the unit opening CA, the entire initial unit opening P-CA can be removed. That is, the initial unit opening P-CA can be a temporary opening provided to form the unit opening CA at the location CA-L where the unit opening CA is to be formed. The initial unit opening P-CA can reduce the tension applied to the initial mask P-MS. Specifically, since the initial unit opening P-CA is formed before the formation of the unit opening CA, the tension applied to the initial mask P-MS is reduced during the formation of the unit opening CA, and therefore the degree of deformation occurring during the processing of the unit opening CA can be reduced.

[0078] In some embodiments, the shape of the initial unit opening P-CA may differ from the shape of the unit opening CA. For example, the unit opening CA may be rectangular, and the initial unit opening P-CA may be circular. Furthermore, multiple initial unit openings P-CA may be provided to correspond to a single unit opening CA. For example, two or more initial unit openings P-CA may be formed at each of the locations CA-L where the unit opening CA is formed.

[0079] exist Figure 4E In the process, after forming the unit openings CA corresponding to the initial unit openings P-CA, and fixing the initial mask sheet P-MS to the frame FR, a mask sheet MS is provided, and the mask sheet MS can form a mask MK together with the frame FR.

[0080] Figure 5 This is a flowchart illustrating a mask manufacturing method according to some embodiments of the present disclosure. Figures 6A to 6C This is a view illustrating a mask manufacturing method according to some embodiments of the present disclosure, and illustrating a method according to... Figure 5 The mask manufacturing method for the flowchart.

[0081] refer to Figure 5 The mask manufacturing method may include stretching an initial mask sheet and welding the initial mask sheet to a frame (S510). (The remaining text appears to be incomplete and requires further context.) Figure 2 The description is the same as the repeated description.

[0082] A mask manufacturing method according to some embodiments may include forming a plurality of slit openings in an initial mask sheet (S520). The plurality of slit openings can reduce the tension applied to the initial mask sheet. Therefore, deformation of these unit openings that might otherwise occur during the formation of subsequently formed unit openings can be reduced or prevented.

[0083] A mask manufacturing method according to some embodiments may include forming a plurality of unit openings, each adjacent to a plurality of slit openings (S530). The plurality of unit openings may be formed adjacent to the slit openings, respectively. Because the unit openings are formed adjacent to the slit openings, the degree of deformation of the unit openings can be reduced during the formation of the unit openings.

[0084] Figures 6A to 6C It is shown in sequence. Figure 5 A view of the mask manufacturing method. (Reference) Figures 6A to 6C A detailed description will be provided based on the relevant information. Figure 5 Some corresponding embodiments of mask manufacturing methods.

[0085] Figure 6A The formation of a slit opening in the initial mask sheet P-MS is shown. Figure 6B The diagram shows the formation of cell openings adjacent to the slit openings in the initial mask sheet P-MS. Figure 6C The state in which a mask comprising multiple slit openings and unit openings is formed is shown.

[0086] exist Figures 6A to 6C In this design, multiple slit openings SA, separated from each other, can be arranged in a first direction DR1. In the figures, ten slit openings SA are shown, such that in each of the two columns arranged in a second direction DR2, five slit openings SA are arranged in the first direction DR1. However, this disclosure is not limited to this, and the number of slit openings SA can be determined differently. Slit openings SA can be formed by emitting a laser beam LS onto an initial slit opening P-SA. However, this disclosure is not limited to this, and they can be formed by various methods such as etching processes. Unit openings CA can be formed between slit openings SA. Slit openings SA and unit openings CA can be formed alternately in the first direction DR1. Unit openings CA can be formed by emitting a laser beam LS onto a location CA-L between slit openings SA where unit openings CA are to be formed. A laser beam LS can be emitted from the side of a third direction DR3 that is closer to the frame FR than the initial mask P-MS.

[0087] The accompanying drawings illustrate ten slit openings SA and ten element openings CA, but this disclosure is not limited thereto. The number of slit openings SA can be greater than the number of element openings CA. The size of each slit opening SA can be smaller than the size of each element opening CA. For example, the width WT2 of a slit opening SA in the first direction DR1 can be smaller than the width of an element opening CA in the first direction DR1. The number of slit openings SA and the width or size of the slit openings SA can affect the amount of deformation of the element openings CA during formation.

[0088] Typically, when V is the deformation of the element opening CA, the deformation can be expressed as V = (F × L) / (E × A). Here, F can be the tension applied to the initial mask P-MS, E can be the elastic modulus, L can be the length WT1 of the initial mask P-MS in the first direction DR1, and A can be the area of ​​the cross-section of the initial mask P-MS in the first direction DR1.

[0089] In some embodiments of this disclosure, when "a" is the width WT2 of each of the slit openings SA in the first direction DR1, and "x" is the number of slit openings SA, according to some embodiments of this disclosure, the deformation amount V' of the unit opening CA formed adjacent to the slit opening SA can be expressed as V' = (F × (L - xa)) / (E × A). That is, as the number x of slit openings SA increases and the width a of the slit opening SA in the first direction DR1 increases, the deformation amount of the unit opening CA can decrease.

[0090] In some embodiments, forming a cell opening CA may include forming an initial cell opening between a plurality of slit openings SA. That is, an initial cell opening is formed between a plurality of slit openings SA, and then cell openings CA corresponding to the initial cell openings may be formed, such as in Figures 2 to 4E In the embodiments described, the initial element opening, together with the slit opening SA, can reduce the amount of deformation of the element opening CA during its formation. Unlike the slit opening SA, the initial element opening can be removed simultaneously with the formation of the element opening CA.

[0091] Furthermore, the mask manufacturing method may further include: setting an electrostatic chuck on the initial mask sheet P-MS fixed to the frame FR before forming the slit opening SA. The electrostatic chuck can reduce the deformation of the element opening CA. (Refer to...) Figures 8A to 8D A detailed description of the electrostatic chuck is provided.

[0092] According to some embodiments of this disclosure, shielding members may be disposed on the slit openings SA of the mask MK. During the deposition process, the shielding members shield the slit openings SA against the deposition source. The shielding members may comprise the same metal as the mask sheet MS. That is, the shielding members may comprise an alloy of iron (Fe) and nickel (Ni).

[0093] Figure 7 This is a flowchart illustrating a mask manufacturing method according to some embodiments of the present disclosure. Figures 8A to 8D This is a view illustrating a mask manufacturing method according to some embodiments of the present disclosure, and illustrating a method according to... Figure 7 The mask manufacturing method for the flowchart.

[0094] exist Figure 7In some embodiments, a mask manufacturing method may include stretching an initial mask sheet and welding and fixing the initial mask sheet to a frame (S710). In some embodiments, a mask manufacturing method may include disposing an electrostatic chuck on the initial mask sheet (S720). The electrostatic chuck may serve to prevent tension changes in the initial mask sheet, which is in a stretched state and fixed to the frame.

[0095] The mask manufacturing method according to some embodiments may include forming a plurality of initial cell openings in an initial mask sheet (S730). Therefore, its repeated description will be omitted.

[0096] A mask manufacturing method according to some embodiments may include forming a plurality of cell openings, each corresponding to a plurality of initial cell openings (S740). After providing the plurality of cell openings to form a mask sheet, an electrostatic chuck may be removed from the mask sheet.

[0097] Figures 8A to 8D It is shown in sequence. Figure 7 A cross-sectional view of the mask manufacturing method. (Reference) Figures 8A to 8D , will describe in detail according to Figure 7 Mask manufacturing methods in some embodiments.

[0098] Figure 8A The diagram shows the state in which the electrostatic chuck ESC is set on the initial mask plate P-MS fixed to the frame FR. Figure 8A In the process, with the electrostatic chuck ESC set, the laser beam LS1 is emitted onto the initial mask P-MS, and therefore, as... Figure 8B As shown, an initial unit opening P-CA can be formed. Unit openings CA can be formed to correspond to the initial unit opening P-CA. The unit openings CA can be formed by emitting a laser beam LS2 onto the periphery of the initial unit opening P-CA. An electrostatic chuck ESC can reduce the amount of deformation of the unit openings CA due to tension during their formation. The electrostatic force generated in the electrostatic chuck ESC can reduce the tension applied to both the initial unit opening P-CA and the unit openings CA, and can reduce their deformation.

[0099] The difference LT1 between the width of each of the cell openings CA in the first direction DR1 and the width of each of the initial cell openings P-CA in the first direction DR1 can be approximately 100 μm or greater. After forming the cell openings CA, the electrostatic chuck ESC can be removed.

[0100] Figure 8D It is along Figure 1 The cross-sectional view taken from line I-I'. (Reference) Figures 8A to 8DIn some embodiments of this disclosure, the inner surface SS of the defining unit opening CA of the mask MS may have a tapered shape. The tapered shape formed by emitting the laser beam LS2 helps the deposition material to be deposited efficiently on the substrate. Therefore, shading can be reduced, and the area of ​​the dead zone on the substrate can be reduced. In other embodiments, the inner surface SS of the defining unit opening CA of the mask MS has a tapered shape and defines a slit opening SA (see...). Figure 6C The inner surface of the mask sheet MS may have a different shape than the inner surface SS of the defining unit opening CA of the mask sheet MS. That is, in some embodiments, the inner surface of the defining slit opening SA of the mask sheet MS may or may not have a tapered shape.

[0101] The embodiments of this disclosure improve machining accuracy and reduce shading by performing stretching and welding processes first, followed by machining processes.

[0102] Masks manufactured using mask manufacturing methods according to some embodiments of the present disclosure can improve the accuracy of cell positioning on the mask and can reduce or prevent shadowing during the deposition process. Display panels formed using masks according to some embodiments of the present disclosure can have reduced dead zones and can prevent defects in the display panel.

[0103] Embodiments have been described in the accompanying drawings and specification. While specific terminology has been used, it is not intended to limit the meaning or scope of the disclosure as described in the claims, but merely to illustrate some embodiments of the disclosure. Therefore, those skilled in the art will understand that various modifications and other equivalent embodiments are also possible. Consequently, the true scope of protection of this invention should be determined by the technical scope of the appended claims (including their functional equivalents).

Claims

1. A mask manufacturing method, comprising: Prepare the mask and frame; Stretch the mask sheet and fix the stretched mask sheet to the frame; as well as A unit opening is formed in the mask piece fixed to the frame. The formation of the unit opening includes: An initial unit opening is formed in the mask sheet fixed to the frame; and Forming the unit openings respectively corresponding to the initial unit openings, and The shape of the initial unit opening is different from the shape of the unit opening.

2. The mask manufacturing method according to claim 1, wherein, The size of each of the initial unit openings is 25% to 90% of the size of each of the unit openings.

3. The mask manufacturing method according to claim 1, wherein, During the formation of the cell opening, everything in the initial cell opening is removed.

4. The mask manufacturing method according to claim 1, wherein, Forming the unit opening includes emitting a laser beam onto the mask sheet fixed to the frame.

5. The mask manufacturing method according to claim 4, wherein, The inner surface of the mask sheet defining the unit opening has a tapered shape.

6. The mask manufacturing method according to claim 1, further comprising: An electrostatic chuck is positioned on the mask sheet fixed to the frame between fixing the mask sheet to the frame and forming the unit opening.

7. The mask manufacturing method according to claim 6, wherein, Forming the cell opening includes: forming an initial cell opening before forming the cell opening. Wherein, the unit openings correspond to the initial unit openings respectively, and, The size of each of the unit openings is larger than the size of each of the initial unit openings.

8. The mask manufacturing method according to claim 7, further comprising: After the unit opening is formed, the electrostatic chuck is removed from the mask.

9. A method for manufacturing a mask, comprising: Prepare the mask and frame; Stretch the mask sheet and fix the stretched mask sheet to the frame; A slit opening is formed in the mask sheet fixed to the frame; as well as Unit openings are formed in the mask sheet fixed to the frame, each of the unit openings being located between corresponding slit openings in the slit openings. The formation of the unit opening includes: Forming initial unit openings, each of the initial unit openings being disposed between corresponding slit openings in the slit openings; and Forming the unit openings respectively corresponding to the initial unit openings, and The shape of the initial unit opening is different from the shape of the unit opening.

10. The mask manufacturing method according to claim 9, wherein, The number of slit openings is greater than the number of unit openings.

11. The mask manufacturing method according to claim 9, wherein, The size of each of the slit openings is smaller than the size of each of the unit openings.

12. The mask manufacturing method according to claim 9, wherein, The size of each of the initial unit openings is smaller than the size of each of the unit openings.

13. The mask manufacturing method according to any one of claims 9 to 12, further comprising: After the mask is secured to the frame and before the slit opening is formed, an electrostatic chuck is placed on the mask.

14. A mask manufactured by any one of claims 1 to 13 using a mask manufacturing method.

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