Wafer dicing machine

Abstract

The application discloses a wafer splitting machine, which comprises a main machine table, a steering machine base is installed on the upper end of the main machine table, the steering machine base comprises a support base, a rotating table is rotatably installed on the upper end of the support base, a driving motor for driving the rotating table to rotate is installed on the support base, an installation table is installed on the rotating table through a leveling assembly, and a wafer loading table for placing chips is fixedly arranged on the upper end of the installation table; a horizontal moving mechanism is installed on the upper end of the main machine table, a main machine rack is fixedly installed on the horizontal moving mechanism, a lifting driving mechanism is installed on the main machine rack, the lifting driving mechanism is used for driving a splitting pressure roller to move up and down, and the horizontal moving mechanism is used for driving the splitting pressure roller to move horizontally; the wafer splitting machine improves the wafer splitting effect, all the dies on the wafer can be independently separated, and there is no edge collapse and edge connection caused by collision and extrusion between adjacent dies.

Description

Technical Field

[0001] This invention relates to the field of wafer dicing technology, and more specifically to a wafer dicing machine. Background Technology

[0002] Dicing is a process in which the front side is grooved along the cutting lines using a laser or grinding wheel, and the back side is squeezed with a rubber wheel to separate the wafer into individual chips. The function of a dicing machine is the latter. Existing dicing machines are not highly automated and do not have a leveling mechanism, which means that not all the chips on the wafer can be separated independently. Furthermore, there are chipping and bridging caused by collisions and squeezing between adjacent chips. Summary of the Invention

[0003] The purpose of this invention is to provide a wafer dicing machine that improves the dicing effect on wafers, so that all the dies on the wafer can be separated independently, and there is no chipping or bridging caused by collision and squeezing between adjacent dies.

[0004] The objective of this invention can be achieved through the following technical solutions:

[0005] A wafer dicing machine includes a main machine base, a steering base is mounted on the upper end of the main machine base, the steering base includes a support base, a rotary table is rotatably mounted on the upper end of the support base, a drive motor for driving the rotary table to rotate is mounted on the support base, a mounting table is mounted on the rotary table through a leveling component, and a wafer carrier for placing chips is fixedly set on the upper end of the mounting table.

[0006] A horizontal moving mechanism is installed at the upper part of the main machine platform. The main machine frame is fixedly installed on the horizontal moving mechanism. A lifting drive mechanism is installed on the main machine frame. The lifting drive mechanism is used to drive the dicing roller to move up and down, and the horizontal moving mechanism is used to drive the dicing roller to move horizontally.

[0007] As a further aspect of the present invention: the leveling assembly includes a sleeve, which is fixedly mounted on the rotating platform. A pressure seat is connected to the upper end of the sleeve, and a baffle is fixedly mounted on the lower end of the sleeve. An adjusting screw is threaded through the baffle, the upper end of the adjusting screw is rotatably connected to the pressure seat, and an adjusting handle is fixedly mounted on the lower end of the adjusting screw.

[0008] As a further embodiment of the present invention: an adjusting spring is fitted around the outer periphery of the adjusting screw, the upper end of the adjusting spring is fixedly connected to the top pressure seat, and the lower end of the adjusting spring is fixedly connected to the baffle.

[0009] As a further aspect of the present invention: a locking bolt is threadedly installed on the mounting platform, and the lower end of the locking bolt presses against the rotating platform.

[0010] As a further aspect of the present invention: the horizontal moving mechanism includes a driving component and a guiding component, which are located on both sides of the steering gear base, and the main frame is fixedly connected to the driving component and the guiding component.

[0011] As a further embodiment of the present invention: the driving assembly includes a fixed base, a lead screw is rotatably mounted inside the fixed base, a servo motor for driving the lead screw to rotate is fixedly mounted on the outside of the fixed base, a threaded seat is threadedly connected to the lead screw, and a movable seat plate is fixedly connected to the threaded seat.

[0012] As a further aspect of the present invention: the guide assembly includes a guide rail, on which a guide slider is slidably connected.

[0013] As a further embodiment of the present invention: the lifting drive mechanism includes a fixed plate, a cylinder is fixedly mounted on the fixed plate, a lifting plate is fixedly connected to the output end of the cylinder, two sets of guide rods are slidably connected on the lifting plate, and the splitting pressure roller is connected to the two sets of guide rods through a wheel axle.

[0014] As a further aspect of the present invention: pressure regulating components are fixedly installed at both ends of the lifting plate, and the pressure regulating components are connected to the wheel axle to adjust the pressure of the cleaving pressure roller.

[0015] As a further embodiment of the present invention: the pressure regulating assembly includes a pressure regulating support, an adjusting plate is fixedly provided on the upper end of the pressure regulating support, an adjusting bolt is threadedly connected to the adjusting plate, a pressure regulating sleeve is fixedly provided on the pressure regulating support, the upper end of the pressure regulating sleeve is rotatably connected to the adjusting bolt, a pressure regulating connecting rod is slidably connected to the lower end of the pressure regulating sleeve, the pressure regulating connecting rod is fixedly connected to the wheel axle, and a pressure regulating spring is sleeved on the outer periphery of the pressure regulating connecting rod.

[0016] The beneficial effects of this invention are:

[0017] (1) The horizontal moving mechanism drives the dicing roller to move toward the wafer placed on the wafer stage. The dicing roller rolls and dices the wafer to ensure that all the diced wafers can be separated independently and that there are no chipping or connecting edges caused by collisions and squeezing between adjacent diced wafers.

[0018] (2) The mounting platform is locked by rotating the locking bolts. The level of the mounting platform is adjusted to ensure the flatness of the wafer when it is placed on the wafer carrier, so that the cleaving roller can roll the wafer evenly, improve the cleaving effect of the wafer, and make all the dies on the wafer separate independently, and there is no chipping or connecting edge caused by collision and squeezing between adjacent dies.

[0019] (3) The wafer on the wafer is rolled by the cleaving roller, and the pressure adjustment components on both sides of the lifting plate can adjust the pressure of the cleaving roller, so as to ensure that the wafer is not damaged while being cleaved and rolled. Attached Figure Description

[0020] The invention will now be further described with reference to the accompanying drawings.

[0021] Figure 1 This is a schematic diagram of the main structure of the present invention;

[0022] Figure 2 This is the present invention. Figure 1 Enlarged structural diagram at point A;

[0023] Figure 3 This is a schematic diagram of the horizontal moving mechanism of the present invention;

[0024] Figure 4 This is a schematic diagram of the voltage regulating component of the present invention;

[0025] Figure 5 This is a schematic diagram of the structure of the pressure regulating sleeve of the present invention.

[0026] In the diagram: 1. Main machine base; 2. Steering machine base; 21. Support base; 22. Drive motor; 23. Rotary table; 24. Mounting table; 25. Wafer carrier; 3. Leveling assembly; 31. Sleeve; 32. Baffle; 33. Adjusting screw; 34. Adjusting handle; 35. Adjusting spring; 36. Top pressure seat; 37. Locking bolt; 4. Horizontal moving mechanism; 41. Fixed seat; 42. Lead screw; 43. Servo motor; 44. Threaded seat; 45. Moving seat plate; 46. Guide rail; 47. Guide slider; 5. Main frame; 6. Lifting drive mechanism; 61. Lifting plate; 62. Fixed plate; 63. Cylinder; 64. Guide rod; 7. Wafer pressure roller; 8. Wheel axle; 9. Pressure adjusting assembly; 91. Pressure adjusting support; 92. Adjusting seat plate; 93. Adjusting bolt; 94. Pressure adjusting sleeve; 95. Pressure adjusting connecting rod; 96. Pressure adjusting spring. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Please see Figure 1 As shown, the present invention is a wafer dicing machine, including a main machine base 1, a steering base 2 mounted on the upper end of the main machine base 1, the steering base 2 including a support base 21, a rotary table 23 rotatably mounted on the upper end of the support base 21, a drive motor 22 for driving the rotary table 23 to rotate mounted on the support base 21, a mounting platform 24 mounted on the rotary table 23 through a leveling assembly 3, and a wafer carrier 25 for placing chips fixedly disposed on the upper end of the mounting platform 24.

[0029] A horizontal moving mechanism 4 is installed on the upper end of the main machine base 1. A main machine frame 5 is fixedly installed on the horizontal moving mechanism 4. A lifting drive mechanism 6 is installed on the main machine frame 5. The lifting drive mechanism 6 is used to drive the dicing roller 7 to move up and down. The horizontal moving mechanism 4 is used to drive the dicing roller 7 to move horizontally.

[0030] When the wafer is being cleaved, the lifting drive mechanism 6 moves the cleaving roller 7 downwards, and then the horizontal moving mechanism 4 moves the cleaving roller 7 toward the wafer placed on the wafer stage 25. The cleaving roller 7 rolls and cleaves the wafer. After the wafer is rolled and cleaved in one direction, the drive motor 22 drives the rotary table 23 to rotate. After the rotary table 23 rotates 90 degrees, the horizontal moving mechanism 4 moves the cleaving roller 7 in the horizontal direction, so that the cleaving roller 7 rolls and cleaves the wafer in the other direction. This ensures that all the dies on the cleaved wafer can be separated independently, and that there is no chipping or bridging caused by collisions and squeezing between adjacent dies.

[0031] Please see Figure 2 As shown, the leveling assembly 3 includes a sleeve 31, which is fixedly mounted on the rotary table 23. A pressure seat 36 is connected to the upper end of the sleeve 31, and a baffle 32 is fixedly mounted to the lower end of the sleeve 31. An adjusting screw 33 is threadedly connected to the baffle 32. The upper end of the adjusting screw 33 is rotatably connected to the pressure seat 36, and an adjusting handle 34 is fixedly mounted to the lower end of the adjusting screw 33. An adjusting spring 35 is fitted around the outer periphery of the adjusting screw 33. The upper end of the adjusting spring 35 is fixedly connected to the pressure seat 36, and the lower end of the adjusting spring 35 is fixedly connected to the baffle 32. A locking bolt 37 is threadedly mounted on the mounting platform 24, and the lower end of the locking bolt 37 presses against the rotary table 23.

[0032] The mounting platform 24 is placed above the rotary table 23. The adjusting screw 33 is rotated by turning the adjusting handle 34. The relative position between the adjusting screw 33 and the baffle 32 is changed by rotating the adjusting screw 33, thereby driving the top pressure seat 36 to move up and down. The leveling components 3 are arranged in a ring array with multiple sets. The mounting platform 24 is placed on the top pressure seat 36. The level of the mounting platform 24 is adjusted by rotating the adjusting bolt 33. A level is also installed on the mounting platform 24 to measure its level. After the level of the mounting platform 24 is adjusted, the mounting platform 24 is locked by rotating the locking bolt 37. The adjustment of the level of the mounting platform 24 ensures the flatness of the wafer when it is placed on the wafer carrier 25, so that the cleaving roller 7 can roll the wafer evenly, improve the cleaving effect of the wafer, and make all the dies on the wafer separate independently, without collision and squeezing between adjacent dies causing edge chipping and bridging.

[0033] Please see Figure 1 and Figure 3As shown, the horizontal moving mechanism 4 includes a drive assembly and a guide assembly, which are located on opposite sides of the steering gear base 2. The main frame 5 is fixedly connected to the drive assembly and the guide assembly. The drive assembly includes a fixed base 41, within which a lead screw 42 is rotatably mounted. A servo motor 43 for driving the lead screw 42 is fixedly mounted on the outside of the fixed base 41. A threaded seat 44 is threaded onto the lead screw 42, and a movable seat plate 45 is fixedly connected to the threaded seat 44. The guide assembly includes a guide rail 46, on which a guide slider 47 is slidably connected.

[0034] The horizontal moving mechanism 4 is used to drive the dicing roller 7 to move horizontally, thereby ensuring that all the grains on the wafer are rolled and diced. When the wafer needs to be diced, the servo motor 43 drives the lead screw 42 to rotate. Through the principle of lead screw transmission, the threaded seat 44 and the moving seat plate 45 move back and forth on the fixed seat 41, thereby driving the main frame 5 to move horizontally. The other side of the main frame 5 is connected to the guide slider 47, which is slidably connected to the guide rail 46. The cooperation between the guide slider 47 and the guide rail 46 improves the stability of the main frame 5 during horizontal movement. The servo motor 43 is used for the power drive of horizontal movement to ensure the stability during the drive process and the control during the drive.

[0035] Please see Figure 1 As shown, the lifting drive mechanism 6 includes a fixed plate 62, on which a cylinder 63 is fixedly mounted. A lifting plate 61 is fixedly connected to the output end of the cylinder 63. Two sets of guide rods 64 are slidably connected to the lifting plate 61. The dicing roller 7 is connected to the two sets of guide rods 64 via a wheel axle 8. Pressure regulating components 9 are fixedly mounted at both ends of the lifting plate 61. These components are connected to the wheel axle 8 and are used to adjust the pressure of the dicing roller 7.

[0036] The cylinder 63 drives the lifting plate 61 to move up and down, thereby driving the dicing roller 7 to move up and down. The dicing roller 7 rolls the wafer on the wafer. The pressure regulating components 9 on both sides of the lifting plate 61 can adjust the pressure of the dicing roller 7, thereby ensuring that the wafer is not damaged while being diced and rolled.

[0037] Please see Figure 1 , Figure 4 and Figure 5 As shown, the pressure regulating assembly 9 includes a pressure regulating support 91, an adjusting seat plate 92 is fixedly installed on the upper end of the pressure regulating support 91, an adjusting bolt 93 is threadedly connected to the adjusting seat plate 92, a pressure regulating sleeve 94 is fixedly installed on the pressure regulating support 91, the upper end of the pressure regulating sleeve 94 is rotatably connected to the adjusting bolt 93, a pressure regulating connecting rod 95 is slidably connected to the lower end of the pressure regulating sleeve 94, the pressure regulating connecting rod 95 is fixedly connected to the wheel axle 8, and a pressure regulating spring 96 is sleeved on the outer periphery of the pressure regulating connecting rod 95.

[0038] The working principle of this invention is as follows: When dicing wafers, the wafer with the back film attached is placed face down and film-attached side up in the center of the stage. After the laser beam and the dicing groove are aligned, the lifting drive mechanism 6 drives the dicing roller 7 downward. The cylinder 63 drives the lifting plate 61 to move up and down, thereby moving the dicing roller 7 up and down. The dicing roller 7 rolls the wafer on the wafer. The pressure adjustment components 9 on both sides of the lifting plate 61 can adjust the pressure of the dicing roller 7. The servo motor 43 drives the lead screw 42 to rotate. Through the lead screw transmission principle, the threaded seat 44 and the moving seat plate 45 reciprocate on the fixed seat 41, thereby driving the main frame 5 to move horizontally. The other side of the frame 5 is connected to the guide slider 47, which is slidably connected to the guide rail 46. The cooperation between the guide slider 47 and the guide rail 46 improves the stability of the main frame 5 when moving horizontally. The horizontal movement is driven by the servo motor 43. The wafer is rolled and cleaved by the cleaving roller 7. After the wafer in one direction is rolled and cleaved, the drive motor 22 drives the rotary table 23 to rotate. After the rotary table 23 rotates 90 degrees, the horizontal movement mechanism 4 drives the cleaving roller 7 to move horizontally, so that the cleaving roller 7 rolls and cleaves the wafer in the other direction. This ensures that all the grains on the cleaved wafer can be separated independently, and there is no chipping or bridging caused by collision and squeezing between adjacent grains.

[0039] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A wafer dicing machine, characterized in that, The main machine base (1) is equipped with a steering base (2) at the upper end of the main machine base (1). The steering base (2) includes a support base (21). A rotary table (23) is rotatably mounted on the upper end of the support base (21). A drive motor (22) for driving the rotary table (23) to rotate is mounted on the support base (21). A mounting platform (24) is mounted on the rotary table (23) through a leveling assembly (3). A wafer carrier (25) for placing chips is fixedly set on the upper end of the mounting platform (24). A horizontal moving mechanism (4) is installed on the upper end of the main machine base (1). A main frame (5) is fixedly installed on the horizontal moving mechanism (4). A lifting drive mechanism (6) is installed on the main frame (5). The lifting drive mechanism (6) is used to drive the splitting pressure roller (7) to move up and down. The horizontal moving mechanism (4) is used to drive the splitting pressure roller (7) to move horizontally. The leveling component (3) includes a sleeve (31), which is fixedly mounted on the rotary table (23). The upper end of the sleeve (31) is connected to a top pressure seat (36), and the lower end of the sleeve (31) is fixedly mounted with a baffle (32). An adjusting screw (33) is threaded through the baffle (32). The upper end of the adjusting screw (33) is rotatably connected to the top pressure seat (36), and the lower end of the adjusting screw (33) is fixedly mounted with an adjusting handle (34). An adjusting spring (35) is fitted around the outer periphery of the adjusting screw (33). The upper end of the adjusting spring (35) is fixedly connected to the top pressure seat (36), and the lower end of the adjusting spring (35) is fixedly connected to the baffle (32). The lifting drive mechanism (6) includes a lifting plate (61), and pressure regulating components (9) are fixedly installed at both ends of the lifting plate (61). The pressure regulating components (9) are connected to the wheel axle (8) and are used to adjust the pressure of the splitting pressure wheel (7).

2. A wafer dicing machine according to claim 1, characterized in that, The mounting platform (24) is threaded with a locking bolt (37), and the lower end of the locking bolt (37) presses against the rotating platform (23).

3. A wafer dicing machine according to claim 1, characterized in that, The horizontal moving mechanism (4) includes a drive assembly and a guide assembly, which are located on both sides of the steering base (2), and the main frame (5) is fixedly connected to the drive assembly and the guide assembly.

4. A wafer dicing machine according to claim 3, characterized in that, The drive assembly includes a fixed base (41), a lead screw (42) is rotatably mounted inside the fixed base (41), a servo motor (43) for driving the lead screw (42) to rotate is fixedly mounted on the outside of the fixed base (41), a threaded seat (44) is threadedly connected to the lead screw (42), and a movable seat plate (45) is fixedly connected to the threaded seat (44).

5. A wafer dicing machine according to claim 4, characterized in that, The guide assembly includes a guide rail (46) on which a guide slider (47) is slidably connected.

6. A wafer dicing machine according to claim 1, characterized in that, The lifting drive mechanism (6) includes a fixed plate (62), on which a cylinder (63) is fixedly installed. The output end of the cylinder (63) is fixedly connected to a lifting plate (61). Two sets of guide rods (64) are slidably connected on the lifting plate (61). The splitting pressure roller (7) is connected to the two sets of guide rods (64) through a wheel axle (8).

7. A wafer dicing machine according to claim 1, characterized in that, The pressure regulating assembly (9) includes a pressure regulating support (91), an adjusting seat plate (92) is fixedly installed on the upper end of the pressure regulating support (91), an adjusting bolt (93) is threadedly connected to the adjusting seat plate (92), a pressure regulating sleeve (94) is fixedly installed on the pressure regulating support (91), the upper end of the pressure regulating sleeve (94) is rotatably connected to the adjusting bolt (93), a pressure regulating connecting rod (95) is slidably connected to the lower end of the pressure regulating sleeve (94), the pressure regulating connecting rod (95) is fixedly connected to the wheel axle (8), and a pressure regulating spring (96) is sleeved on the outer periphery of the pressure regulating connecting rod (95).

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