Cleaning machine and cleaning method

Abstract

Embodiments of the present application provide a cleaning machine and a cleaning method, wherein the cleaning machine comprises: a wet cleaning module configured to perform a wet cleaning process on a wafer; a dry cleaning module configured to perform a dry cleaning process on the wafer; a conveying module configured to input the wafer into the wet cleaning module or the dry cleaning module, or configured to output the wafer from the wet cleaning module or the dry cleaning module; a transferring module configured to transfer the wafer from the wet cleaning module to the dry cleaning module, or configured to transfer the wafer from the dry cleaning module to the wet cleaning module; and a processing module configured to extract gas in the transferring module. Embodiments of the present application improve the stability of a semiconductor structure filled with etching defects.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip manufacturing, and in particular to a cleaning machine and a cleaning method. Background Technology

[0002] Currently, in the process of forming semiconductor contact structures, the inability to precisely control the etching time often leads to over-etching, resulting in etching defects. The presence of etching defects greatly affects the conductivity of the formed semiconductor contact structure.

[0003] In related technologies, filling the etch defects requires the combined use of different cleaning processes, such as the combination of dry cleaning and wet cleaning processes. However, when using different cleaning processes to clean semiconductor structures, the waiting time for switching cleaning processes is long, which cannot guarantee the stability of the semiconductor structure formed by filling etch defects.

[0004] This invention improves the stability of semiconductor structures formed by filling etching defects by designing a special machine to reduce the waiting time between different cleaning processes when dry and wet cleaning processes are used in combination. Summary of the Invention

[0005] This invention provides a cleaning machine and a cleaning method to improve the stability of semiconductor structures formed by filling etching defects.

[0006] To address the aforementioned technical problems, embodiments of the present invention provide a cleaning machine, comprising: a wet cleaning module for performing a wet cleaning process on a wafer; a dry cleaning module for performing a dry cleaning process on a wafer; a conveying module for inputting a wafer into the wet cleaning module or the dry cleaning module, or for outputting a wafer from the wet cleaning module or the dry cleaning module; a transfer module for transferring a wafer from the wet cleaning module to the dry cleaning module, or for transferring a wafer from the dry cleaning module to the wet cleaning module; and a processing module for extracting gas from the transfer module.

[0007] Compared with related technologies, by integrating dry cleaning and wet cleaning into one machine, and then using a transfer module to quickly switch between dry cleaning and wet cleaning processes for semiconductor structures, the waiting time between different cleaning processes is reduced, thereby improving the stability of semiconductor structures formed by filling etching defects.

[0008] In addition, the cleaning machine also includes: a first channel connecting the transfer module to the dry cleaning module, and a second channel connecting the transfer module to the wet cleaning module; the transfer module includes: a carrier unit for carrying wafers transferred from the wet cleaning module to the dry cleaning module, or for carrying wafers transferred from the dry cleaning module to the wet cleaning module; a first barrier unit for opening or closing the first channel, opening the first channel when the carrier unit needs to transfer wafers with the dry cleaning module; a second barrier unit for opening or closing the second channel, opening the second channel when the carrier unit needs to transfer wafers with the dry cleaning module; and a control unit for opening or closing the first barrier unit and the second barrier unit.

[0009] Additionally, the transfer module includes a container with a first opening and a second opening. The first opening is used for wafer transfer between the carrier unit and the dry cleaning module, and the second opening is used for wafer transfer between the carrier unit and the wet cleaning module. A first barrier unit includes a first baffle disposed in the first opening; a second barrier unit includes a second baffle disposed in the second opening; a control unit is connected to the first baffle and the second baffle and is used to control the first baffle or the second baffle to open the first opening or the second opening. This embodiment of the invention provides a specific implementation method for a transfer module.

[0010] Additionally, the transfer module includes a container with a first opening and a second opening. The first opening is used for wafer transfer between the carrier unit and the dry cleaning module, and the second opening is used for wafer transfer between the carrier unit and the wet cleaning module. A first barrier unit includes a first baffle elastically connected to one side of the first opening via a hinge. A second barrier unit includes a second baffle elastically connected to one side of the second opening via a hinge. A control unit is connected to the carrier unit. When the carrier unit transfers wafers with the dry cleaning module, the carrier unit moves towards the first opening to open the first baffle. When the carrier unit transfers wafers with the wet cleaning module, the carrier unit moves towards the second opening to open the second baffle. This embodiment of the invention provides another specific implementation method for the transfer module.

[0011] Additionally, the conveying module includes: a first conveying unit, connected to either the wet cleaning module or the dry cleaning module, for inputting wafers into either the wet cleaning module or the dry cleaning module connected to the first conveying unit; and a second conveying unit, connected to the other of the wet cleaning module or the dry cleaning module, for outputting wafers from either the wet cleaning module or the dry cleaning module connected to the second conveying unit. By connecting the wet cleaning module and the dry cleaning module via the first and second conveying units respectively, the wafers enter the machine from one end and exit from the machine from the other end, improving the efficiency of the wafer fabrication process and thus increasing production capacity.

[0012] In addition, the transfer module includes: a first transfer unit for transferring wafers from the wet cleaning module to the dry cleaning module; and a second transfer unit for transferring wafers from the dry cleaning module to the wet cleaning module.

[0013] In addition, the transfer module also includes a third transfer unit, connected to either the transport module or the wet cleaning module or the dry cleaning module, for transferring wafers from the wet cleaning module or the dry cleaning module connected to the third transfer unit to the transport module, so that the transport module can output the wafers from the wet cleaning module or the dry cleaning module. The third transfer unit ensures that the environment of the connected wet cleaning module or dry cleaning module remains unaffected during the wafer's output from the transport module.

[0014] In addition, the wet cleaning module includes: a buffer chamber for placing the wafers to be cleaned; and multiple cleaning chambers connected to the buffer chamber for performing wet cleaning processes on the wafers placed in the cleaning chambers.

[0015] In addition, the dry cleaning module includes: a waiting chamber for placing the wafers to be cleaned; and multiple reaction chambers connected to the waiting chamber for performing dry cleaning processes on the wafers placed in the reaction chambers.

[0016] In addition, the dry cleaning module also includes a processing chamber for annealing the wafers placed inside the processing chamber; the conveying module also includes a cooling device, which is used to cool the wafers before the conveying module outputs them from the cleaning machine.

[0017] This invention also provides a cleaning method applied to the aforementioned cleaning machine, comprising: acquiring a wafer to be cleaned, and a wafer cleaning process; determining, based on the wafer cleaning process, whether the wafer to be cleaned requires a dry cleaning process and a wet cleaning process, and the cleaning sequence of the dry cleaning process and the wet cleaning process; controlling the position of the wafer on the cleaning machine based on the cleaning sequence to complete the cleaning of the wafer; wherein, if the wafer to be cleaned requires a dry cleaning process, the wafer is moved to the dry cleaning module of the cleaning machine to complete the dry cleaning process; if the wafer to be cleaned requires a wet cleaning process, the wafer is moved to the wet cleaning module of the cleaning machine to complete the wet cleaning process.

[0018] Compared to related technologies, integrating dry cleaning and wet cleaning processes into a single machine reduces the waiting time between different cleaning processes for semiconductor structures, thereby improving the stability of semiconductor structures formed by filling etching defects. Attached Figure Description

[0019] One or more embodiments are illustrated by way of example with reference to the accompanying drawings, which are not to be limited in scale unless otherwise stated.

[0020] Figures 1 to 3 This is a schematic diagram of the structure of the cleaning machine provided in the first embodiment of the present invention;

[0021] Figure 4 A schematic diagram illustrating an implementation of a transmission module according to a first embodiment of the present invention;

[0022] Figure 5 A schematic diagram illustrating another implementation of the transmission module provided in the first embodiment of the present invention;

[0023] Figure 6 This is a schematic diagram of the conveying module according to the first embodiment of the present invention;

[0024] Figure 7 This is a schematic diagram of the structure of the wet cleaning module provided in the first embodiment of the present invention;

[0025] Figure 8 This is a schematic diagram of the reaction chamber arrangement according to the first embodiment of the present invention;

[0026] Figure 9 This is a schematic diagram of the dry cleaning module provided in the first embodiment of the present invention;

[0027] Figure 10 This is a schematic flowchart of the cleaning method provided in the second embodiment of the present invention. Detailed Implementation

[0028] Currently, filling etch defects requires the combined use of different cleaning processes, such as dry cleaning and wet cleaning. However, when using different cleaning processes to clean semiconductor structures, the waiting time for switching cleaning processes is long, which cannot guarantee the stability of the semiconductor structure formed by filling etch defects.

[0029] To address the aforementioned problems, the first embodiment of the present invention provides a cleaning machine, comprising: a wet cleaning module for performing a wet cleaning process on a wafer; a dry cleaning module for performing a dry cleaning process on a wafer; a conveying module for inputting a wafer into the wet cleaning module or the dry cleaning module, or for outputting a wafer from the wet cleaning module or the dry cleaning module; a transfer module for transferring a wafer from the wet cleaning module to the dry cleaning module, or for transferring a wafer from the dry cleaning module to the wet cleaning module; and a processing module for extracting gas from the transfer module.

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details are presented in the various embodiments of the present invention to facilitate a better understanding of this application. However, the technical solutions claimed in this application can be implemented even without these technical details and various variations and modifications based on the following embodiments. The division of the various embodiments below is for ease of description and should not constitute any limitation on the specific implementation of the present invention. The various embodiments can be combined with and referenced by each other without contradiction.

[0031] Figure 1 The present invention provides a schematic diagram of the structure of a cleaning machine provided in an embodiment of the invention. The cleaning machine of this embodiment will be described in detail below.

[0032] refer to Figure 1 100 cleaning machines, including:

[0033] The wet cleaning module 101 is used to perform a wet cleaning process on the wafer placed therein.

[0034] Specifically, the wet cleaning module 101 is located in an atmospheric environment and is used to perform a wet cleaning process on the wafer using liquid chemicals.

[0035] The dry cleaning module 102 is used to perform a dry cleaning process on the wafer placed therein.

[0036] Specifically, the dry cleaning module 102 is located in a vacuum environment and is used to perform a dry cleaning process on the wafer using plasma-state gas.

[0037] The transfer module 103 is used to transfer the wafer from the wet cleaning module 101 to the dry cleaning module 102, or to transfer the wafer from the dry cleaning module 102 to the wet cleaning module 101.

[0038] Specifically, the transfer module 103 automatically transports the wafer from the wet cleaning module 101 to the dry cleaning module 102, or automatically transports the wafer from the dry cleaning module 102 to the wet cleaning module 101.

[0039] Processing module 104 is used to extract gas from conveying module 103.

[0040] Since the wet cleaning module 101 is in an atmospheric environment and the dry cleaning module 102 is in a vacuum environment, the wet cleaning module 101 and the dry cleaning module 102 located in the cleaning machine 100 are two independent chambers. During the process of the transfer module 103 transporting the wafer, the gas in the transfer module 103 is extracted by the processing module 104 to prevent environmental crosstalk between the wet cleaning module 101 and the dry cleaning module 102.

[0041] In one example, the processing module 104 includes a vacuum pump connected to the transfer module 103. The vacuum pump is used to extract gas from the transfer module 103 so that the transfer module 103 is in a vacuum-like environment, thereby preventing the wet cleaning module 101 from affecting the environment of the dry cleaning module 102.

[0042] The conveying module 105 is used to input wafers into the wet cleaning module 101 or the dry cleaning module 102, or to output wafers from the wet cleaning module 101 or the dry cleaning module 102.

[0043] Specifically, the conveying module 105 is used to input external wafers into the cleaning machine 100 to perform dry cleaning or wet cleaning processes, and to output the processed wafers from the cleaning machine 100.

[0044] refer to Figure 2 In this embodiment, the cleaning machine 100 further includes: a first channel 113 connecting the conveying module 103 to the dry cleaning module 102, and a second channel 133 connecting the conveying module 103 to the wet cleaning module 101. The first channel 113 is used for wafer transfer between the conveying module 103 and the dry cleaning module 102, and the second channel 133 is used for wafer transfer between the conveying module 103 and the wet cleaning module 101.

[0045] Specifically, the transmission module 103 includes: a carrying unit 163, a first blocking unit 123, a second blocking unit 143, and a control unit 153.

[0046] The carrier unit 163 is used to carry wafers transferred from the wet cleaning module 101 to the dry cleaning module 102, or to carry wafers transferred from the dry cleaning module 102 to the wet cleaning module 101. The first barrier unit 123 is used to open or close the first channel 113; when the carrier unit 163 needs to transfer wafers with the dry cleaning module 102, the first channel 113 is opened. The second barrier unit 143 is used to open or close the second channel 133; when the carrier unit 163 needs to transfer wafers with the wet cleaning module 101, the second channel 133 is opened. The control unit 153 is used to open or close the first barrier unit 123 and the second barrier unit 143.

[0047] In one example, when it is detected that a wafer needs to be transferred from the wet cleaning module 101 to the dry cleaning module 102, the control unit 153 opens the second barrier unit 143, and the wafer is transferred from the wet cleaning module 101 to the carrier unit 163 of the transfer module 103 through the second channel 133. The control unit 153 then closes the second barrier unit 143. The transfer module 103 is then evacuated to ensure that it is in a vacuum-like environment when transferring wafers with the dry cleaning module 102. The control unit 153 then opens the first barrier unit 123, and the wafer is transferred from the transfer module 103 to the dry cleaning module 102 through the first channel 113. The control unit 153 then closes the first barrier unit 123.

[0048] In another example, when it is detected that a wafer needs to be transferred from the dry cleaning module 102 to the wet cleaning module 101, the transfer module 103 is evacuated to ensure that it is in a vacuum-like environment when transferring the wafer with the dry cleaning module 102; the control unit 153 opens the first barrier unit 123, and the wafer is transferred from the dry cleaning module 102 to the carrier unit 163 of the transfer module 103 through the first channel 113; the control unit 153 closes the first barrier unit 123; the control unit 153 opens the second barrier unit 143, and the wafer is transferred from the transfer module 103 to the wet cleaning module 101 through the second channel 133; the control unit 153 closes the second barrier unit 143.

[0049] Furthermore, this embodiment provides two implementation methods for the legend module, as detailed below:

[0050] refer to Figure 4 The first type: The transfer module 103 includes a container with a first opening 201 and a second opening 202. The first opening 201 is used for wafer transfer between the carrier unit 163 and the dry cleaning module 102, and the second opening 202 is used for wafer transfer between the carrier unit 163 and the wet cleaning module 101.

[0051] The first barrier unit includes a first baffle 211 disposed in the first opening 201, and the second barrier unit includes a second baffle 212 disposed in the second opening 202.

[0052] The control unit 153 is connected to the first baffle 211 and the second baffle 212, and is used to control the first baffle 211 or 212 to open the first opening 201 or the second opening 202.

[0053] In this implementation method, the control unit 153 directly controls the first baffle 211 and the second baffle 212 to open or close the first opening 201 for wafer transfer between the transfer module 103 and the dry cleaning module 102, or to open or close the second opening 202 for wafer transfer between the transfer module 103 and the wet cleaning module 101.

[0054] refer to Figure 5 The second type: The transfer module 103 includes a container with a first opening 201 and a second opening 202. The first opening 201 is used for wafer transfer between the carrier unit 163 and the dry cleaning module 102, and the second opening 202 is used for wafer transfer between the carrier unit 163 and the wet cleaning module 101.

[0055] The first barrier unit includes a first baffle 211 that is elastically connected to one side of the first opening 201 via a hinge, and the second barrier unit includes a second baffle 212 that is elastically connected to one side of the second opening 202 via a hinge.

[0056] The control unit 153 is connected to the carrier unit 163. When the carrier unit 163 and the dry cleaning module 102 are transferring wafers, the carrier unit 163 moves toward the first opening 201 to open the first baffle 211. When the carrier unit 163 and the wet cleaning module 101 continue transferring wafers, the carrier unit 163 moves toward the second opening 202 to open the second baffle 212.

[0057] In this implementation method, the control unit 153 directly controls the movement of the carrier unit 163, thereby indirectly controlling the first baffle 211 and the second baffle 212 to open or close the first opening 201 for wafer transfer between the transfer module 103 and the dry cleaning module 102, or to open or close the second opening 202 for wafer transfer between the transfer module 103 and the wet cleaning module 101.

[0058] Additionally, refer to Figure 6 In this embodiment, the transfer module 103 is divided into a first transfer unit 301 and a second transfer unit 302. The first transfer unit 301 is used to transfer the wafer from the wet cleaning module 101 to the dry cleaning module 102, and the second transfer unit 302 is used to transfer the wafer from the dry cleaning module 102 to the wet cleaning module 101. By using the separate first transfer unit 301 and second transfer unit 302, wafer transfer from the dry cleaning module 102 to the wet cleaning module 101 and wafer transfer from the wet cleaning module 101 to the dry cleaning module 102 are respectively realized, avoiding conflicts in the wafer transfer process.

[0059] Specifically, the first side 311 of the first conveying unit 301 is connected to the wet cleaning module 101, and the second side 321 is connected to the dry cleaning module 102; the first side 322 of the second conveying unit 302 is connected to the wet cleaning module 101, and the second side 312 is connected to the dry cleaning module 102.

[0060] In a specific example, the first transfer unit 301 includes multiple first transfer sub-units, and the second transfer unit 302 includes multiple second transfer sub-units. The multiple first transfer sub-units are all used to transfer wafers from the wet cleaning module 101 to the dry cleaning module 102; the multiple second transfer sub-units are all used to transfer wafers from the dry cleaning module 102 to the wet cleaning module 101. By using multiple parallel first and second transfer sub-units, the conversion efficiency of wafers between the wet cleaning module 101 and the dry cleaning module 102 in the cleaning machine 100 is improved.

[0061] It should be noted that in this embodiment, the first conveying unit 301 and the second conveying unit 302 are arranged vertically. The vertical arrangement of the first conveying unit 301 and the second conveying unit 302 is used to save space in the cleaning machine 100. In other embodiments, the first conveying unit and the second conveying unit can be arranged in parallel or separately.

[0062] refer to Figure 3 In this embodiment, the conveying module 105 includes: a first conveying unit 115 and a second conveying unit 125.

[0063] The first conveying unit 115 is connected to either the wet cleaning module 101 or the dry cleaning module 102, and is used to input the wafer into the wet cleaning module 101 or the dry cleaning module 102 connected to the first conveying unit 115.

[0064] The second conveying unit 125 is connected to the other of the wet cleaning module 101 or the dry cleaning module 102, and is used to input the wafer book into the wet cleaning module 101 or the dry cleaning module 102 connected to the second conveying unit 125.

[0065] In this embodiment, the first conveying unit 115 is connected to the dry cleaning module 102 and the second conveying unit 125 is connected to the wet cleaning module 101 as an example for detailed description. It should be noted that in other embodiments, the first conveying unit can be connected to the wet cleaning module and the second conveying unit can be connected to the dry cleaning module.

[0066] Input and output are achieved through a first conveying unit 115 and a second conveying unit 125 connecting the dry cleaning module 102 and the wet cleaning module 101. If the wafer needs to perform wet cleaning and dry cleaning processes sequentially, the wafer enters the dry cleaning module 102 from the first conveying unit 115 for dry cleaning, then switches to the wet cleaning module 101 for wet cleaning, and can then be directly output from the second conveying unit 125. This avoids the need for the wafer to go to either the dry cleaning module 102 or the wet cleaning module 101 connected to the conveying unit for output when using a single conveying unit, thus improving the efficiency of the wafer manufacturing process and increasing production capacity.

[0067] In a specific example, the first conveying unit 115 includes multiple first conveying sub-units, and the second conveying unit 125 includes multiple second conveying sub-units. The multiple first conveying sub-units are all used to input wafers into the wet cleaning module 101 or the dry cleaning module 102 connected to the first conveying unit 115. The multiple second conveying sub-units are all used to output wafers from the wet cleaning module 101 or the dry cleaning module 102 connected to the second conveying unit 125. By using multiple parallel first and second conveying sub-units, the efficiency of the wafer input and output cleaning machine 100 is improved.

[0068] It should be noted that, in this embodiment, the transmission module 103 further includes a third transmission unit. The third transmission unit connects the transmission module 105 to either the wet cleaning module 101 or the dry cleaning module 102, and transports the wafers from the wet cleaning module 101 or the dry cleaning module 102 connected to the third transmission unit to the transmission module 105, so that the transmission module 105 can output the wafers from the wet cleaning module 101 or the dry cleaning module 102. The indirect connection between the transmission module 105 and the wet cleaning module 101 or the dry cleaning module 102 is achieved through the third transmission unit, thereby avoiding environmental crosstalk between the external environment and the wet cleaning module 101 or the dry cleaning module 102.

[0069] refer to Figure 7 In this embodiment, the wet cleaning module 101 includes a buffer chamber 111 and a plurality of cleaning chambers 121.

[0070] The buffer chamber 111 is used to hold the wafers to be cleaned, and multiple cleaning chambers 121 connected to the buffer chamber 111 are used to perform wet cleaning processes on the wafers placed in the cleaning chambers 121. By executing the wet cleaning process in parallel through multiple cleaning chambers 121, the efficiency of wet cleaning of wafers is improved.

[0071] refer to Figure 8In this embodiment, the cleaning chambers 121 located at the same top view position are arranged vertically. The upper cleaning chamber 131 and the lower cleaning chamber 141 arranged vertically are used to save space in the cleaning machine 100. Moreover, within the same space of the cleaning machine 100, more cleaning chambers 121 can be set up to improve the efficiency of wet cleaning of wafers.

[0072] refer to Figure 9 In this embodiment, the dry cleaning module 102 includes a waiting chamber 112 and multiple reaction chambers 122.

[0073] The waiting chamber 112 is used to place the wafers to be cleaned. Multiple reaction chambers 122 connected to the waiting chamber 112 are used to perform dry cleaning processes on the wafers placed in the reaction chambers 122. By executing the dry cleaning process in parallel through multiple reaction chambers 122, the efficiency of dry cleaning of wafers is improved.

[0074] In this embodiment, the dry cleaning module 102 further includes a processing chamber 132 for annealing the wafer placed in the processing chamber 132.

[0075] Annealing can reduce the hardness of wafers, improve their machinability, eliminate residual stress, stabilize wafer dimensions, and reduce wafer deformation and cracking tendency.

[0076] Accordingly, the conveying module 105 also includes a cooling device, which is used to cool the wafers before the conveying module 105 outputs the wafers from the cleaning machine 100.

[0077] In one example, the cooling device is implemented by setting cooling pipes in the carrier equipment that carries the wafer, and the wafer is cooled by passing coolant through the cooling pipes.

[0078] Compared to related technologies, by integrating dry cleaning and wet cleaning into one machine, and then using a transfer module to quickly switch between dry and wet cleaning processes for semiconductor structures, the waiting time between different cleaning processes is reduced, thereby improving the stability of semiconductor structures formed by filling etching defects.

[0079] It is worth mentioning that all modules involved in this embodiment are logical modules. In practical applications, a logical unit can be a physical unit, a part of a physical unit, or a combination of multiple physical units. Furthermore, to highlight the innovative aspects of this invention, this embodiment does not introduce units that are not closely related to solving the technical problem proposed by this invention; however, this does not mean that other units are absent from this embodiment.

[0080] The second embodiment of the present invention relates to a cleaning method.

[0081] The cleaning method includes: acquiring a wafer to be cleaned, and the wafer cleaning process; determining, based on the wafer cleaning process, whether the wafer to be cleaned needs to undergo dry cleaning and wet cleaning processes, and the cleaning sequence of the dry and wet cleaning processes; controlling the position of the wafer on the cleaning machine based on the cleaning sequence to complete the wafer cleaning; wherein, if the wafer to be cleaned needs to undergo a dry cleaning process, the wafer is moved to the dry cleaning module of the cleaning machine to complete the dry cleaning process; if the wafer to be cleaned needs to undergo a wet cleaning process, the wafer is moved to the wet cleaning module of the cleaning machine to complete the wet cleaning process.

[0082] The cleaning method provided in this embodiment will be described in detail below with reference to the accompanying drawings. The parts that are the same as or corresponding to those in the first embodiment will not be described in detail below.

[0083] refer to Figure 10 Cleaning methods include:

[0084] Step 401: Obtain the wafer to be cleaned and the wafer cleaning process.

[0085] Specifically, the process involves inputting the wafer to be cleaned into the cleaning machine and obtaining the cleaning process of the wafer.

[0086] Step 402: Determine whether a wet cleaning process is required; Step 403: Determine whether a dry cleaning process is required.

[0087] Specifically, the determination of whether a wafer to be cleaned requires a dry cleaning process or a wet cleaning process is based on the wafer cleaning process.

[0088] Step 404: Determine the cleaning sequence.

[0089] As can be seen from step 403, the wafer to be cleaned may be a single-step dry cleaning process, a single-step wet cleaning process, or a combination of dry and wet cleaning processes. If the wafer to be cleaned requires both dry and wet cleaning processes, then the execution order of the dry and wet cleaning processes must be determined.

[0090] Step 405: Perform the cleaning process.

[0091] Based on the acquired cleaning sequence, the position of the wafer on the cleaning machine is controlled to complete the cleaning of the wafer.

[0092] Specifically, if the wafer to be cleaned requires a dry cleaning process, the wafer is moved to the dry cleaning module of the cleaning machine to complete the dry cleaning process; if the wafer to be cleaned requires a wet cleaning process, the wafer is moved to the wet cleaning module of the cleaning machine to complete the wet cleaning process.

[0093] Compared with related technologies, by integrating dry cleaning and wet cleaning processes into a single machine, the waiting time between different cleaning processes for semiconductor structures is reduced, thereby improving the stability of semiconductor structures formed to fill etching defects.

[0094] Since the first embodiment corresponds to this embodiment, this embodiment can be implemented in conjunction with the first embodiment. The relevant technical details mentioned in the first embodiment remain valid in this embodiment, and the technical effects achievable in the first embodiment can also be achieved in this embodiment. To reduce repetition, they will not be repeated here. Correspondingly, the relevant technical details mentioned in this embodiment can also be applied to the first embodiment.

[0095] The various steps described above are only for clarity. In practice, they can be combined into one step or some steps can be broken down into multiple steps. As long as they include the same logical relationship, they are all within the scope of protection of this patent. Adding insignificant modifications or introducing insignificant designs to the process, but without changing the core design of the process, are also within the scope of protection of this patent.

[0096] Those skilled in the art will understand that the above embodiments are specific embodiments for implementing the present invention, and in practical applications, various changes in form and detail may be made without departing from the spirit and scope of the present invention.

Claims

1. A cleaning machine, characterized in that, include: The wet cleaning module is used to perform wet cleaning processes on wafers; The dry cleaning module is used to perform dry cleaning processes on wafers; The conveying module is used to input wafers into the wet cleaning module or the dry cleaning module, or to output wafers from the wet cleaning module or the dry cleaning module. A transfer module is used to transfer wafers from the wet cleaning module to the dry cleaning module, or to transfer wafers from the dry cleaning module to the wet cleaning module. The processing module is used to extract gas from the delivery module; Also includes: The first channel connecting the conveying module to the dry cleaning module, and the second channel connecting the conveying module to the wet cleaning module; The transfer module includes: a carrier unit, used to carry wafers transferred from the wet cleaning module to the dry cleaning module, or used to carry wafers transferred from the dry cleaning module to the wet cleaning module; The first barrier unit is used to open or close the first channel. When the carrier unit needs to transfer wafers with the dry cleaning module, the first channel is opened. The second barrier unit is used to open or close the second channel. When the carrier unit needs to transfer wafers with the dry cleaning module, the second channel is opened. A control unit is used to open or close the first blocking unit and the second blocking unit.

2. The cleaning machine according to claim 1, characterized in that, The transfer module includes a container with a first opening and a second opening, the first opening being used for wafer transfer between the carrier unit and the dry cleaning module, and the second opening being used for wafer transfer between the carrier unit and the wet cleaning module. The first barrier unit includes a first baffle disposed in the first opening; The second barrier unit includes a second baffle disposed in the second opening; The control unit is connected to the first baffle and the second baffle, and is used to control the first baffle or the second baffle to open the first opening or the second opening.

3. The cleaning machine according to claim 1, characterized in that, The transfer module includes a container with a first opening and a second opening, the first opening being used for wafer transfer between the carrier unit and the dry cleaning module, and the second opening being used for wafer transfer between the carrier unit and the wet cleaning module. The first barrier unit includes a first baffle that is elastically connected to one side of the first opening via a hinge; The second barrier unit includes a second baffle that is hinged to one side of the second opening; The control unit is connected to the carrier unit. When the carrier unit performs wafer transfer with the dry cleaning module, the carrier unit moves toward the first opening to open the first baffle. When the carrier unit performs wafer transfer with the wet cleaning module, the carrier unit moves toward the second opening to open the second baffle.

4. The cleaning machine according to claim 1, characterized in that, The conveying module includes: The first conveying unit is connected to either the wet cleaning module or the dry cleaning module, and is used to input the wafer into the wet cleaning module or the dry cleaning module connected to the first conveying unit. The second conveying unit is connected to the other of the wet cleaning module or the dry cleaning module, and is used to output the wafers from the wet cleaning module or the dry cleaning module to which the second conveying unit is connected.

5. The cleaning machine according to claim 1, characterized in that, The transmission module includes: The first transfer unit is used to transfer the wafer from the wet cleaning module to the dry cleaning module; The second transfer unit is used to transfer the wafer from the dry cleaning module to the wet cleaning module.

6. The cleaning machine according to claim 5, characterized in that, The conveying module further includes a third conveying unit, which connects the conveying module and either the wet cleaning module or the dry cleaning module, for conveying the wafers in the wet cleaning module or the dry cleaning module connected to the third conveying unit to the conveying module, so that the conveying module can output the wafers in the wet cleaning module or the dry cleaning module.

7. The cleaning machine according to claim 1, characterized in that, The wet cleaning module includes: A buffer chamber is used to hold the wafers to be cleaned; Multiple cleaning chambers connected to the buffer chamber are used for wet cleaning processes on wafers placed in the cleaning chambers.

8. The cleaning machine according to claim 1, characterized in that, The dry cleaning module includes: Waiting room, used to hold wafers to be cleaned; Multiple reaction chambers connected to the waiting chamber are used for dry cleaning processes on wafers placed in the reaction chambers.

9. The cleaning machine according to claim 8, characterized in that, include: The dry cleaning module further includes a processing chamber for annealing wafers placed inside the processing chamber; The conveying module also includes a cooling device, which is used to cool the wafer before it is output from the cleaning machine.

10. A cleaning method, applied to the cleaning machine according to any one of claims 1 to 9, characterized in that, include: Obtain the wafer to be cleaned, and the wafer cleaning process; Based on the wafer cleaning process, determine whether the wafer to be cleaned needs to undergo dry cleaning and wet cleaning processes, and the cleaning sequence of the dry cleaning and wet cleaning processes. Based on the cleaning sequence, the position of the wafer on the cleaning machine is controlled to complete the cleaning of the wafer; If the wafer to be cleaned needs to undergo the dry cleaning process, the wafer is moved to the dry cleaning module of the cleaning machine to complete the dry cleaning process of the wafer. If the wafer to be cleaned requires the wet cleaning process, the wafer is moved to the wet cleaning module of the cleaning machine to complete the wet cleaning process.

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