Substrate ball mounting fixing device

Abstract

This invention relates to the field of chip packaging technology and discloses a fixing device for substrate ball placement. The substrate ball placement fixing device of this invention includes: a base, a ball placement fixture, and a pressing mechanism. The base has an inner cavity, a connecting joint on its side wall, a rectangular groove on its top surface, and multiple through holes in the rectangular groove. The base also has a vacuum gauge. The ball placement fixture includes: a metal frame and a ball placement mesh plate. The ball placement mesh plate is disposed within the metal frame and has multiple ball placement holes arranged in a matrix. The pressing mechanism is disposed on the base and is used to adhere the ball placement mesh plate to the substrate. In this substrate ball placement fixing device, the substrate is placed in the rectangular groove of the base, and the substrate is adsorbed onto the base by vacuuming. The ball placement fixture is placed on the substrate, with the ball placement points of the substrate exposed through the ball placement holes. The pressing mechanism presses down on the ball placement fixture, fixing the fixture and the substrate, improving ball placement efficiency and preventing ball displacement.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, specifically to a fixing device for substrate ball mounting. Background Technology

[0002] Semiconductor packaging refers to the process of processing tested wafers into individual chips according to product model and functional requirements. The packaging process is as follows: the wafer from the front-end wafer process is diced into small chips, and then the diced chips are mounted onto small islands on the corresponding substrate using conductive silver paste or adhesive tape. Then, ultra-fine metal (gold, silver, copper, aluminum) wires or conductive resin are used to connect the bonding pads of the chip to the corresponding leads on the substrate to form the required circuit.

[0003] Before connecting the substrate to the chip, solder balls are first placed on the ball-placement points of the substrate. The balls on the substrate are then electrically connected to the chip via leads.

[0004] However, currently, when placing balls on the substrate, it is inconvenient to fix the substrate, the ball placement efficiency is low, and it is easy to cause the ball placement position to shift or even the ball to be missing. Summary of the Invention

[0005] The purpose of this invention is to provide a fixing device for substrate ball mounting, so as to solve the problems in the background art mentioned above.

[0006] This invention provides a fixing device for substrate ball planting, comprising: a base, a ball planting fixture, and a pressing mechanism;

[0007] The base is set on the workbench;

[0008] The base has an inner cavity, and the side wall of the base has a connecting joint. The connecting joint communicates with the inner cavity and is used to connect an external vacuum pump.

[0009] The top surface of the base is provided with a rectangular groove, and the base is provided with a plurality of through holes in the rectangular groove. The through holes are connected to the inner cavity, and the rectangular groove is used to place the substrate.

[0010] The base is equipped with a vacuum gauge, which is used to display the pressure value inside the cavity;

[0011] The ball-planting fixture includes: a metal outer frame and a ball-planting mesh plate;

[0012] The ball-planting mesh plate is disposed within the metal outer frame. The ball-planting mesh plate has multiple ball-planting holes arranged in a matrix, corresponding to the ball-planting points on the substrate.

[0013] The ball-planting fixture is used to place the ball-planting mesh on the substrate, and the pressing mechanism is disposed on the base to make the ball-planting mesh adhere to the substrate.

[0014] Based on the above scheme, the substrate ball-planting fixing device of the present invention comprises a base, a ball-planting fixture, and a pressing mechanism. The base has an inner cavity, a connecting joint on its side wall, a rectangular groove on its top surface, multiple through holes in the rectangular groove, and a vacuum gauge. The ball-planting fixture includes a metal frame and a ball-planting mesh plate, with the mesh plate disposed within the metal frame and having multiple ball-planting holes. The pressing mechanism is disposed on the base and used to press down the ball-planting fixture. In this substrate ball-planting fixing device, the substrate is placed in the rectangular groove of the base, and the substrate is adsorbed onto the base by vacuuming. The vacuum gauge is used to observe the change in vacuum level in the inner cavity of the base to prevent the substrate from warping and becoming unstable. The ball-planting fixture is placed on the substrate, with the ball-planting points of the substrate exposed through the ball-planting holes in the mesh plate. The pressing mechanism then presses down on the ball-planting fixture to fix it to the substrate, thus enabling ball-planting at the substrate's ball-planting points, improving ball-planting efficiency, and preventing ball displacement.

[0015] In one feasible solution, the pressing mechanism includes: a frame, a fixed plate, a lead screw, a rotating handle, and multiple pressure bars;

[0016] The base is provided with a fixing frame, and the fixing frame is provided with a sliding groove;

[0017] The frame is slidably disposed in the slide groove via a slide bar, and a fixing nut is provided at the top of the frame;

[0018] The lead screw passes through the fixed frame and engages with the fixed nut. The rotating handle is located at the top of the lead screw, and the rotation of the lead screw is used to drive the frame to rise and fall.

[0019] The fixing plate is set on the frame, and multiple pressure strips are set on the fixing plate at equal intervals. When the frame is lowered, the pressure strips are used to press the ball planting net plate.

[0020] In one feasible solution, the pressing mechanism further includes a spring;

[0021] The fixing plate is slidably mounted on the frame, and the top end of the fixing plate is connected to the frame via the spring. The frame is used to press the metal outer frame when it descends.

[0022] One feasible solution also includes: adjusting bolts;

[0023] The base has threaded holes on its sidewalls, and the adjusting bolts engage with the threaded holes to abut against the metal frame.

[0024] One feasible solution also includes: a fixing screw and an adjusting nut;

[0025] The base is provided with a guide hole at the bottom corner;

[0026] The fixed screw is provided with four screws, which are set on the worktable and inserted into the guide hole respectively;

[0027] The adjusting nut engages with the fixing screw and abuts against the base.

[0028] In one feasible solution, a level is provided on the top surface of the base. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the fixing device for substrate ball planting in an embodiment of the present invention;

[0031] Figure 2 This is a cross-sectional schematic diagram of the fixing device for substrate ball planting in an embodiment of the present invention;

[0032] Figure 3 This is a schematic diagram of the ball-planting fixture in an embodiment of the present invention.

[0033] Numbering on the map:

[0034] 1. Base; 11. Inner cavity; 12. Connecting joint; 13. Through hole; 14. Vacuum gauge; 15. Fixture; 2. Ball planting fixture; 21. Metal outer frame; 22. Ball planting mesh plate; 221. Ball planting hole; 31. Frame body; 311. Sliding bar; 312. Fixing nut; 32. Fixing plate; 33. Lead screw; 34. Rotating handle; 35. Pressure bar; 36. Spring; 4. Base plate; 5. Adjusting bolt; 61. Fixing screw; 62. Adjusting nut. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0037] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0038] The technical solution of the present invention will be described in detail below with reference to specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0039] As described in the background section of this application, before connecting the substrate to the chip, balls are first placed (soldered) at the ball-planting points on the substrate, and the balls on the substrate are electrically connected to the chip through leads.

[0040] The inventors of this application have discovered that, currently, when placing balls on a substrate, it is inconvenient to fix the substrate, the ball placement efficiency is low, and it is easy to cause the ball placement position to shift or even the ball to be missed.

[0041] To address the aforementioned problems, the inventors of this application have proposed a technical solution, the specific embodiments of which are as follows:

[0042] Figure 1 This is a schematic diagram of the fixing device for substrate ball planting in an embodiment of the present invention. Figure 2This is a cross-sectional schematic diagram of the fixing device for substrate ball planting in an embodiment of the present invention. Figure 3 This is a schematic diagram of the ball-planting fixture in an embodiment of the present invention. Figures 1 to 3 As shown, the substrate ball-planting fixing device of this embodiment includes: a base 1, a ball-planting fixture 2, and a pressing mechanism.

[0043] The substrate 4 is a rectangular plate with multiple pads arranged in a matrix on the substrate 4.

[0044] The base 1 is set on the workbench surface.

[0045] The base 1 has an inner cavity 11 inside, and a connecting joint 12 is provided on one side wall of the base 1. The connecting joint 12 is connected to the inner cavity 11 of the base 1.

[0046] The top surface of the base 1 is provided with a rectangular groove, and the base 1 is provided with multiple through holes 13 in the rectangular groove. The through holes 13 of the base 1 are connected to the inner cavity 11.

[0047] A vacuum gauge 14 is provided on the side wall of the base 1. The vacuum gauge 14 is connected to the inner cavity 11 of the base 1 and is used to display the pressure value (vacuum value) inside the inner cavity 11 of the base 1.

[0048] The ball-planting fixture 2 includes: a metal outer frame 21 and a ball-planting mesh plate 22.

[0049] The metal outer frame 21 is a rectangular frame, and the ball planting mesh plate 22 is fixed inside the frame of the metal outer frame 21. The ball planting mesh plate 22 is provided with multiple ball planting holes 221. The multiple ball planting holes 221 are arranged in a matrix on the ball planting mesh plate 22, and the positions of the multiple ball planting holes 221 correspond to the positions of multiple ball planting points on the substrate 4.

[0050] The pressing mechanism is mounted on the base 1 and located above the base 1. The pressing mechanism is used to press down the ball-planting fixture 2, so that the ball-planting mesh plate 22 of the ball-planting fixture 2 adheres to and abuts against the base plate 4.

[0051] In this embodiment, during the ball placement process, the substrate is placed in a rectangular groove of the base. A vacuum is drawn to adhere the substrate to the base, and the change in vacuum value within the base cavity is observed using a vacuum gauge to prevent ball leakage due to substrate warping. A ball placement fixture covers the substrate, with ball placement holes on the ball placement mesh located at the ball placement points on the substrate. This ensures the ball placement points protrude from the holes in the mesh. A pressing mechanism maintains the mesh against the substrate, securing the fixture and substrate. Balls can then be placed at the substrate's ball placement points.

[0052] As can be seen from the above, the substrate ball-planting fixing device of this embodiment includes a base, a ball-planting fixture, and a pressing mechanism. The base has an inner cavity, a connecting joint on its side wall, a rectangular groove on its top surface, multiple through holes in the rectangular groove, and a vacuum gauge. The ball-planting fixture includes a metal frame and a ball-planting mesh plate, which is disposed within the metal frame and has multiple ball-planting holes. The pressing mechanism is disposed on the base and is used to press down the ball-planting fixture. The present invention relates to a substrate ball-planting fixing device. The substrate is placed in a rectangular groove of a base. The substrate is adsorbed onto the base by vacuuming, and the change in vacuum level in the inner cavity of the base is observed by a vacuum gauge to prevent the substrate from being unstable due to warping. A ball-planting fixture is placed on the substrate, and the ball-planting points of the substrate are exposed from the ball-planting holes of the ball-planting mesh. The ball-planting fixture is then pressed down by a pressing mechanism to fix the ball-planting fixture and the substrate. This allows for ball-planting at the ball-planting points of the substrate, improving the ball-planting efficiency and preventing ball displacement.

[0053] Optionally, the substrate ball-planting fixing device in this embodiment includes a pressing mechanism comprising: a frame 31, a fixing plate 32, a lead screw 33, a rotating handle 34, and a pressure bar 35.

[0054] The base 1 has a fixed frame 15 on its top, and vertical grooves are provided on both sides of the fixed frame 15.

[0055] The frame 31 has slide bars 311 on both sides, and the slide bars 311 of the frame 31 are slidably set in the slide groove of the fixed frame 15. The top of the frame 31 has a fixing nut 312.

[0056] The lead screw 33 is mounted on the fixed frame 15. The bottom end of the lead screw 33 is engaged with the fixed nut 312 of the frame 31. The rotating handle 34 is located at the top of the lead screw 33. When the lead screw 33 rotates, it drives the frame 31 to rise and fall.

[0057] The fixing plate 32 is set on the frame 31.

[0058] Multiple pressure strips 35 are provided, and the multiple pressure strips 35 are equally spaced on the fixing plate 32. The distance between two adjacent pressure strips 35 corresponds to the distance between two adjacent rows of planting holes 221 on the planting net plate 22.

[0059] In this embodiment, when the frame 31 descends under the drive of the lead screw 33, the pressure strip 35 is used to press the ball-planting mesh plate 22 of the ball-planting fixture 2, so that the ball-planting mesh plate 22 and the substrate 4 are in close contact and abut against each other, fixing the ball-planting mesh plate 22 and the substrate 4 on the base 1, and the pressure strip 35 abuts against the gap between two adjacent rows of ball-planting holes 221 on the ball-planting mesh plate 22, so that the ball-planting points of the substrate are fully exposed, so as to plant balls on the substrate.

[0060] Furthermore, the pressing mechanism of the substrate ball-planting fixing device in this embodiment also includes a spring 36.

[0061] There are multiple springs 36.

[0062] The frame 31 is provided with a guide groove.

[0063] The two sides of the fixing plate 32 are slidably set in the guide groove of the frame 31, and the top of the fixing plate 32 is connected to the frame 31 by multiple springs 36.

[0064] In this embodiment, when the lead screw 33 drives the frame 31 to descend, the pressure strip 35 first contacts and holds the ball planting mesh plate 22, and then the lead screw 33 continues to rotate, so that the frame 31 continues to descend and presses the metal outer frame 21 of the ball planting fixture 2, making the ball planting fixture 2 more stable.

[0065] Optionally, the substrate ball-planting fixing device in this embodiment further includes: adjusting bolt 5.

[0066] The left and right sidewalls and front and rear sidewalls of the base 1 are provided with threaded holes, and the base 1 is provided with two threaded holes on both sides of each sidewall. The threaded holes of the base 1 are connected to the rectangular groove of the base.

[0067] The adjusting bolt 5 engages with the threaded hole of the base 1 and extends into the rectangular groove of the base 1.

[0068] In this embodiment, the substrate is placed in the rectangular groove of the base, and the ball-planting fixture covers the substrate. The adjusting bolt is rotated so that it contacts and abuts against the side wall of the metal frame of the ball-planting fixture to adjust the position of the ball-planting fixture so that the ball-planting holes of the ball-planting mesh are aligned with the ball-planting points of the substrate, ensuring that the ball-planting points of the substrate are fully exposed for ball-planting.

[0069] Optionally, the substrate ball-planting fixing device in this embodiment further includes: a fixing screw 61 and an adjusting nut 62.

[0070] Guide holes are provided at the four corners of the bottom of the base 1.

[0071] There are four fixing screws 61, which are set on the worktable and the top ends of the four fixing screws 61 are respectively inserted into the four guide holes of the base 1.

[0072] The adjusting nut 62 is engaged with the fixed screw 61, and the top surface of the adjusting nut 62 abuts against the bottom surface of the base 1.

[0073] In this embodiment, rotating the adjusting nut can raise and lower the base to accommodate substrates of different thicknesses.

[0074] Furthermore, in this embodiment, the base 1 of the substrate ball-planting fixing device is equipped with a level.

[0075] A level (not shown in the figure) is embedded in the mounting groove of the base 1 to indicate the flatness of the base.

[0076] In this invention, unless otherwise explicitly specified and limited, the first feature being "on" or "under" the second feature can mean that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact through an intermediate medium.

[0077] Furthermore, "above," "on top of," and "above" the first feature in relation to the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "under," and "beneath" the first feature in relation to the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0078] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A fixing device for mounting balls on a substrate, characterized in that, include: Base, ball-planting fixture, and pressing mechanism; The base is set on the workbench; The base has an inner cavity, and the side wall of the base has a connecting joint. The connecting joint communicates with the inner cavity and is used to connect an external vacuum pump. The top surface of the base is provided with a rectangular groove, and the base is provided with a plurality of through holes in the rectangular groove. The through holes are connected to the inner cavity, and the rectangular groove is used to place the substrate. The base is equipped with a vacuum gauge, which is used to display the pressure value inside the cavity; The ball-planting fixture includes: a metal outer frame and a ball-planting mesh plate; The ball-planting mesh plate is disposed within the metal outer frame. The ball-planting mesh plate has multiple ball-planting holes arranged in a matrix, corresponding to the ball-planting points on the substrate. The ball-planting fixture is used to place the ball-planting mesh on the substrate, and the pressing mechanism is disposed on the base to make the ball-planting mesh adhere to the substrate. The pressing mechanism includes: a frame, a fixed plate, a lead screw, a rotating handle, and multiple pressure bars; The base is provided with a fixing frame, and the fixing frame is provided with a sliding groove; The frame is slidably disposed in the slide groove via a slide bar, and a fixing nut is provided at the top of the frame; The lead screw passes through the fixed frame and engages with the fixed nut. The rotating handle is located at the top of the lead screw, and the rotation of the lead screw is used to drive the frame to rise and fall. The fixing plate is disposed on the frame, and multiple pressure strips are disposed on the fixing plate at equal intervals. When the frame is lowered, the pressure strips are used to press the ball planting net plate.

2. The fixing device for substrate ball planting according to claim 1, characterized in that, The pressing mechanism further includes: a spring; The fixing plate is slidably mounted on the frame, and the top end of the fixing plate is connected to the frame via the spring. The frame is used to press the metal outer frame when it descends.

3. The fixing device for substrate ball planting according to claim 1, characterized in that, Also includes: Adjusting bolt; The base has threaded holes on its sidewalls, and the adjusting bolts engage with the threaded holes to abut against the metal frame.

4. The fixing device for substrate ball mounting according to any one of claims 1 to 3, characterized in that, Also includes: Fixed screw and adjusting nut; A guide hole is provided at the bottom corner of the base; The fixed screw is provided with four screws, which are set on the worktable and inserted into the guide hole respectively; The adjusting nut engages with the fixing screw and abuts against the base.

5. The fixing device for substrate ball planting according to claim 4, characterized in that, The top surface of the base is horizontal.

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