Display substrate and display device

Abstract

This application discloses a display substrate and a display device. The display substrate includes a base layer and light-emitting diodes (LEDs). A dimming block is disposed on the side of each LED away from the base layer. The dimming block has an incident light surface and an emitted light surface disposed opposite to each other, and a total internal reflection surface disposed around the side of the dimming block. The incident light surface faces the LED, and the emitted light surface is away from the LED. The total internal reflection surface can completely reflect light incident on the total internal reflection surface via the first surface back to the emitted light surface, so that all light emitted by the LED to the incident light surface is emitted from the emitted light surface. The display substrate and display device of this application can increase the light extraction efficiency of LEDs, improve energy efficiency, and also improve crosstalk in color conversion displays.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display substrate and display device that can simultaneously improve light extraction efficiency and light emission efficiency. Background Technology

[0002] MiniLED and MicroLED displays are currently the main development direction of the display industry due to their advantages such as high brightness, wide color gamut, high reliability, long lifespan, fast response speed, and low energy consumption. However, with the increase in panel size and resolution, how to further reduce energy efficiency and improve the brightness of display devices has become an urgent problem to be solved.

[0003] Figure 1 A schematic diagram of an existing display substrate Figure 1 , Figure 2 for Figure 1 The optical path diagram of a light-emitting diode (LED). (Example:) Figure 1 and Figure 2 As shown, in the existing display device 800, crosstalk occurs between adjacent LEDs due to the dispersion of light emitted by the LEDs 810. Especially in MiniLED / MicroLED displays using a color conversion layer to achieve full-color display, the crosstalk caused by the dispersion of LED light emission restricts the development of this display device.

[0004] Figure 3 This is a second embodiment of an existing display substrate. Figure 3 In the display device 900 shown, a color conversion layer 920 is provided on the light-emitting diode 910, and a barrier material 921 is provided in the color conversion layer 920. The barrier material 921 corresponds to the area between the light-emitting diodes 910 to absorb light emitted from the sides of the light-emitting diodes 910. Obviously, adding a barrier material 921 to the color conversion layer 920 can solve the crosstalk phenomenon in the color conversion layer when MiniLED / MicroLED is used, but this also greatly reduces the energy efficiency of the LED.

[0005] Therefore, there is an urgent need to provide a display substrate and a display device to solve the above-mentioned technical problems. Summary of the Invention

[0006] To address the aforementioned technical problems, this application provides a display substrate and a display device that can increase the light extraction efficiency of light-emitting diodes, improve energy efficiency, thereby increasing the brightness of the display device, and also improve the crosstalk problem of color conversion displays.

[0007] To achieve the above objectives, the display substrate and display device described in this application adopt the following technical solutions.

[0008] This application provides a display substrate, including a base layer and a plurality of light-emitting diodes disposed on the base layer. A dimming block is disposed on the side of each light-emitting diode away from the base layer. The dimming block has a light-incident surface, a light-emitting surface and a total reflection surface.

[0009] The light-incident surface faces the light-emitting diode;

[0010] The light-emitting surface is far from the light-emitting diode, and the light-emitting surface is disposed opposite to the light-incident surface;

[0011] The total reflection surface is arranged around the side of the dimming block, and the total reflection surface can reflect all light rays incident on the total reflection surface via the light incident surface to the light emitting surface;

[0012] The orthographic projection of the light-emitting diode on the dimming block falls on the light-incident surface, and all the light emitted by the light-emitting diode to the light-incident surface is emitted from the light-out surface.

[0013] Optionally, in some embodiments of this application, a substrate is provided on the side of each light-emitting diode away from the substrate, and the dimming block is configured from the substrate;

[0014] Alternatively, the dimming block may be made of an encapsulation material and configured to encapsulate the light-emitting diode.

[0015] Optionally, in some embodiments of this application, the substrate is made of sapphire.

[0016] Optionally, in some embodiments of this application, the total internal reflection surface connects the light-incident surface and the light-exit surface, and the total internal reflection surface forms one or more adjacent chamfered surfaces on the side near the light-incident surface;

[0017] Alternatively, the total reflection surface can be an inclined surface connecting the incident surface and the emitting surface.

[0018] Optionally, in some embodiments of this application, the chamfered surface or the inclined surface forms a preset angle with the plane containing the light-incident surface, and the preset angle ranges from 20° to 70°.

[0019] Optionally, in some embodiments of this application, the length of one or more of the chamfered surfaces in the thickness direction of the dimming block is 5μm-30μm.

[0020] Optionally, in some embodiments of this application, a filling structure is further provided on the base layer, the refractive index of the filling structure being less than the refractive index of the dimming block, and:

[0021] When the light-incident surface of the dimming block is encapsulated on the upper surface of the light-emitting diode, the filling structure surrounds the side surface of the light-emitting diode and the total reflection surface of the dimming block; or,

[0022] When the light-incident surface of the dimming block wraps around the upper surface and side surface of the light-emitting diode, the total reflection surface surrounds the light-emitting diode, and the filling structure surrounds the total reflection surface.

[0023] In a preferred embodiment, the dimming block is configured from the substrate, the total reflection surface connects the light-incident surface and the light-outcident surface, the total reflection surface forms one or more adjacent chamfered surfaces on the side near the light-incident surface, and the light-incident surface of the dimming block is encapsulated on the upper surface of the light-emitting diode, and the filling structure surrounds the side of the light-emitting diode and one or more adjacent chamfered surfaces.

[0024] In a preferred embodiment, the dimming block is made of an encapsulation material, the total reflection surface connects the light-incident surface and the light-outcident surface, the total reflection surface forms one or more adjacent chamfered surfaces on the side near the light-incident surface, and the light-incident surface of the dimming block is encapsulated on the upper surface of the light-emitting diode, and the filling structure surrounds the side of the light-emitting diode and one or more adjacent chamfered surfaces.

[0025] In a preferred embodiment, the dimming block is made of an encapsulation material, the total reflection surface is an inclined surface connecting the light-incident surface and the light-emitting surface, the light-incident surface of the dimming block wraps the upper surface and side surface of the light-emitting diode, the total reflection surface surrounds the light-emitting diode, and the filling structure surrounds the total reflection surface.

[0026] Optionally, in some embodiments of this application, the display substrate includes a transparent resin layer, the transparent resin layer being disposed on the side of the dimming block away from the base layer;

[0027] Furthermore, the refractive index of the transparent resin layer is different from that of the dimming block.

[0028] Optionally, in some embodiments of this application, the display substrate further includes a color conversion layer disposed on the side of the dimming block away from the base layer.

[0029] Accordingly, this application also provides a display device employing the display substrate described in this application.

[0030] Compared with the prior art, the display substrate and display device described in this application have a dimming block disposed on the side of each light-emitting diode (LED) away from the substrate. Utilizing a total internal reflection surface surrounding the side of the dimming block, the propagation path of light incident on the total internal reflection surface via the incident surface can be altered. This ensures that all light incident on the LED via the incident surface into the dimming block exits through the emitting surface of the dimming block, increasing the proportion of light emitted from the emitting surface, improving light extraction efficiency, enhancing the energy efficiency of the LED, and thus increasing the brightness of the display device. Simultaneously, the dimming block prevents light from the top surface of the LED from striking adjacent LEDs, improving crosstalk in color conversion displays. Furthermore, by configuring the 50-layer substrate of the LED as a dimming block or reusing the dimming block as a packaging structure, the manufacturing process is simplified, avoiding increases in LED manufacturing processes and thickness. Attached Figure Description

[0031] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0032] Figure 1 A schematic diagram of an existing display substrate Figure 1 .

[0033] Figure 2 for Figure 1 Optical path diagram of the light-emitting device.

[0034] Figure 3 A schematic diagram of an existing display substrate Figure 2 .

[0035] Figure 4 This is a schematic diagram of a first embodiment of a display substrate according to one embodiment of this application.

[0036] Figure 5 for Figure 4 A schematic diagram of the first embodiment of a light-emitting diode.

[0037] Figure 6 for Figure 5 Optical path diagram of a light-emitting diode.

[0038] Figure 7 for Figure 5 A 3D view of a light-emitting diode (LED).

[0039] Figure 8 for Figure 5 The light distribution curves of the light-emitting diodes are shown in the diagram. Curve M represents the case where the light-emitting diode is equipped with a dimming block, and curve N represents the case where the light-emitting diode is not equipped with a dimming block.

[0040] Figure 9 for Figure 4 A schematic diagram of a second embodiment of a light-emitting diode.

[0041] Figure 10 This is a schematic diagram of a second embodiment of a display substrate proposed according to one embodiment of this application.

[0042] Figure 11 This is a schematic diagram of a third embodiment of a display substrate according to one embodiment of this application. Detailed Implementation

[0043] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0044] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0045] In order to solve the problem of low light extraction efficiency and energy efficiency of existing display devices, this application provides a display substrate, which includes a base layer 10 and light-emitting diodes 20 arranged in an array on the base layer 10, and a dimming block 30 is provided on the light-emitting side of each light-emitting diode 20.

[0046] Please refer to Figure 4The dimming block 30 has an incident light surface 31, an emitting light surface 32, and a total reflection surface 33. The incident light surface 31 faces the light-emitting diode 20, the emitting light surface 32 is away from the light-emitting diode 20, and the emitting light surface 32 is disposed opposite to the incident light surface 31. The total reflection surface 33 is disposed around the side of the dimming block 30. The total reflection surface 33 can completely reflect the light incident on the total reflection surface 33 via the incident light surface 31 to the emitting light surface 32.

[0047] Please continue to refer to this. Figure 4 The orthogonal projection of the light-emitting diode 20 onto the dimming block 30 falls on the light-incident surface 31, and all the light emitted by the light-emitting diode 20 to the light-incident surface 31 is emitted from the light-exit surface 32.

[0048] Please refer to Figure 6 In the solution of this application, when the light from the light-emitting diode 20 is incident on the dimming block 30 via the light-incident surface 31, the light incident on its surface by the total reflection surface 33 is totally reflected to the light-emitting surface 32, thereby changing the propagation direction of the light incident on the side of the dimming block 30, so that no light is emitted from the side of the dimming block 30, and all the light incident on the dimming block 30 via the light-incident area is emitted from the light-emitting surface 32, ultimately increasing the proportion of light emitted from the light-emitting surface 32 of the dimming block 30, and obtaining a low-energy-consumption and high-luminous-efficiency light-emitting diode.

[0049] Please refer to Figure 8 Curve M shows the case where the dimming block 30 is provided on the light-emitting side of the LED 20, while curve N shows the case where the dimming block 30 is not provided on the light-emitting side of the LED 20. Clearly, the dimming block 30 can increase the proportion of the LED 20 and improve the light emission intensity of the LED, which is beneficial for obtaining a low-energy-consumption, high-luminous-efficiency LED.

[0050] Specifically, the light-emitting diode is a micro light-emitting diode, such as, but not limited to, Micro LED or Mini LED. It should be understood that the light-emitting diode described in this application is not limited to micro light-emitting diodes, and some embodiments may also be applicable to other micro-semiconductor devices designed in such a way as to perform predetermined electronic functions (e.g., diodes, transistors, integrated circuits) or photonic functions (LEDs, lasers) in a controlled manner. Furthermore, this application does not limit the specific structure of the micro light-emitting diode. For example, with regard to Micro LEDs, the light-emitting diode can be a same-side electrode structure or a vertical electrode structure.

[0051] Furthermore, this application does not limit the type of light emitted by the light-emitting diode. Specifically, the light-emitting diode can be one of a red light-emitting diode, a green light-emitting diode, or a blue light-emitting diode.

[0052] In practical applications, the light-emitting diode can be used directly as a light-emitting unit to achieve the display effect, or it can be combined with a color conversion layer to achieve full-color display.

[0053] like Figure 5 As shown, the light-emitting diode 20 can emit light. This application does not limit the specific structure or type of the light-emitting diode 20.

[0054] For example, the light-emitting diode 20 includes an epitaxial layer, a first electrode, and a second electrode. The epitaxial layer includes a first semiconductor layer, a multiple quantum well layer, a second semiconductor layer, and a diffusion layer. The first electrode and the multiple quantum well layer are disposed on the first semiconductor layer at a distance; the second semiconductor layer is disposed on the multiple quantum well layer and covers the multiple quantum well layer, and the second electrode is disposed on the multiple quantum well layer.

[0055] In specific implementation, the first electrode is an N electrode or a P electrode, and the second electrode is correspondingly a P electrode or an N electrode.

[0056] This application does not limit the specific materials of the first and second semiconductor layers. The first semiconductor layer can be N-type GaN, P-type GaN, or other GaAs or GaP materials, etc. Correspondingly, the second semiconductor layer can be P-type GaN, N-type GaN, or other GaAs or GaP materials, etc. In this embodiment, for ease of explanation, the first semiconductor layer may optionally be N-type GaN and the second semiconductor layer may optionally be P-type GaN.

[0057] Specifically, the plurality of light-emitting diodes 20 are independent of each other and arranged in a matrix. The plurality of light-emitting diodes 20 include at least one of red light-emitting diodes, green light-emitting diodes, and blue light-emitting diodes.

[0058] The plurality of light-emitting diodes 20 are arranged independently of each other. In some embodiments, black or white varnish is filled between adjacent light-emitting diodes 20 to prevent optical crosstalk between adjacent light-emitting diodes caused by side emission of light from the light-emitting diodes 20.

[0059] Please refer to Figures 4 to 7 As shown, the dimming block 30 is disposed on the side of the light-emitting diode 20 away from the substrate 10, and the dimming block 30 has a light-incident surface 31 and a light-exit surface 32 opposite to each other along its thickness direction, as well as a total reflection surface 33 disposed around the side of the dimming block 30.

[0060] Please refer to Figure 4 and Figure 5 The light-incident surface 31 faces the light-emitting diode 20, and the light-incident surface 31 corresponds to the light-emitting diode 20. In other words, the orthogonal projection of the light-emitting diode 20 onto the dimming block 30 falls entirely within the area of ​​the light-incident surface 31. More specifically, the outer edge of the light-incident surface 31 surrounds the periphery of the orthogonal projection of the light-emitting diode 20 onto the dimming block 30, or in other words, the outer edge of the light-incident surface 31 coincides with the edge of the upper surface of the light-emitting diode 20.

[0061] Please refer to Figure 4 , Figure 9 and Figure 10 The light-incident surface 31 of the dimming block 30 covers the upper surface of the light-emitting diode 20.

[0062] exist Figure 11 In this configuration, the light-incident surface 31 of the dimming block 30 covers the upper surface and side surface of the light-emitting diode 20. Alternatively, an opening that can be closed by the base layer 10 is formed on the light-incident surface 31 of the dimming block 30, and the light-emitting diode 20 is located within this opening. Clearly, the light emitted from the side and top surfaces of the light-emitting diode 20 can then exit through the light-emitting surface 32 of the dimming block 30.

[0063] In terms of light emission, the light emitted from both the side and top surfaces of the LED 20 can be emitted through the light-emitting surface 32 of the dimming block 30. At this time, the light emitted from both the side and top surfaces of the LED 20 is emitted through the light-emitting surface 32 of the dimming block 30, greatly increasing the energy efficiency and light extraction efficiency of the LED 20, and fundamentally solving the crosstalk problem. Furthermore, in terms of packaging, in this embodiment, the entire top and side surfaces of the LED 20 are sealed by the dimming block 30, resulting in a significantly better sealing effect.

[0064] Please refer to Figure 4 The total reflection surface 33 is arranged around the side of the dimming block 30, and the total reflection surface 33 can completely reflect the light incident from the light incident surface 31 to the light emitting surface 32.

[0065] Please refer to Figure 5 , Figure 9 and Figure 11 This application provides two different implementations of the total reflection surface. Figure 5 and Figure 9 In the process, the total reflection surface 33a connects the light-incident surface 31 and the light-exiting surface 32, and the total reflection surface 33a forms one or more adjacent chamfered surfaces 331 on the side near the light-incident surface 31.

[0066] And in Figure 11 In this embodiment, the total internal reflection surface 33b is an inclined surface connecting the light-incident surface 31 and the light-emitting surface 32. The inclined surface is a sloping plane, in which case the dimming block 30 has an overall inverted trapezoidal structure. In other embodiments, the inclined surface can also be a convex arc surface.

[0067] Specifically, the chamfered surface 331 or the inclined surface forms a preset angle α with the plane containing the light-incident surface 31. By setting the preset angle α, the chamfered surface can achieve the effect of total reflection of light incident from the light-incident surface 31 onto its surface to the light-exiting surface 32. Preferably, the preset angle α is in the range of 20°-70°.

[0068] Please refer to Figures 4 to 9 Along the thickness direction of the dimming block 30, the length of one or more of the chamfered surfaces 331 ranges from 5μm to 30μm.

[0069] Please refer to Figure 4 The light-emitting surface 32 is far away from the light-emitting diode 20, and the light-emitting surface 32 is arranged opposite to the light-incident surface 31.

[0070] In this embodiment, the light-emitting surface 32 is a plane. In other embodiments, the light-emitting surface 32 may be configured as other shapes, such as an arcuate convex surface, and this application does not impose any specific limitations on it.

[0071] The structure and implementation of the dimming block 30 have been described above. However, it should be noted that... Figure 5 , Figure 9 , Figure 10 and Figure 11 These are all illustrative embodiments of the dimming block 30 in this application, and the implementation of the dimming block 30 in this application is not limited to these. In specific implementations, provided that the total reflection surface can reflect all the light incident from the light-incident surface 31 to the light-emitting surface 32, the arrangement of the dimming block 30 can be adjusted according to the specific structure of the dimming block 30 and the display substrate 100.

[0072] The specific configuration of the dimming block 30 in the display substrate 100 will be further described below.

[0073] Please refer to Figures 5 to 11 This application embodiment provides a case where the dimming block 30 is configured with a functional film layer in the display substrate 100. However, it should also be noted that... Figures 5 to 11This is merely an illustrative configuration of the dimming block 30. The configuration of the dimming block 30 in this application is not limited to this. For example, the dimming block 30 may also be a film structure additionally added to the light-emitting diode 20.

[0074] First, please refer to Figures 5 to 9 The light-emitting diode 20 has a substrate 50 on the side away from the base layer 10, and the dimming block 30 is configured from the substrate 50.

[0075] exist Figures 5 to 9 In this embodiment, the substrate 50 is disposed on the light-emitting side of the light-emitting diode 20, and the substrate 50 is configured as the dimming block 30. The substrate 50 is a growth substrate (or, in other words, the original substrate) used to fabricate the light-emitting diode. The growth substrate can be understood as the substrate 50 on which the layers of the light-emitting diode 20 are manufactured or grown, rather than another temporary substrate 50 on which the light-emitting diode has been transferred. That is, the dimming block 30 can be configured from the growth substrate of the light-emitting diode 20.

[0076] In a preferred embodiment, the substrate 50 is a sapphire substrate.

[0077] For example, for the light-emitting diode 20 of a Mini LED, it is generally not necessary to peel off the growth substrate used to grow the epitaxial layer. In this case, after cutting, the total reflection surface 33 can be formed on the substrate 50 corresponding to the individual formed light-emitting diode 20 using the ICP (Inductively Coupled Plasma) process.

[0078] Obviously, by directly configuring the substrate 50 as the dimming block 30, the size of the light-emitting diode 20 will not increase, nor will the manufacturing process of the light-emitting diode 20 be affected, and it is also beneficial to reduce the manufacturing process.

[0079] In this case, the total reflection surface 33 can be formed directly on the substrate 50 of a single formed light-emitting diode 20 using an etching process. By adjusting the etching process parameters, the substrate 50 can be precisely etched to achieve the preparation of the total reflection surface 33, thereby achieving the purpose of arranging the substrate 50 as the dimming block 30.

[0080] Please continue to refer to this. Figure 4 and Figure 9Considering the actual growth process of the light-emitting diode 20 and the difficulty of etching the substrate 50, the dimming block 30 is stacked and covered on the upper surface of the light-emitting diode 20 through its light-incident surface 31, and the total reflection surface 33 of the dimming block 30 is configured as the total reflection surface 33a. At this time, it is only necessary to adjust the size of the substrate 50 during the cutting process, and after the cutting is completed, one or more chamfered surfaces 331 can be etched on the substrate 50 corresponding to the single formed light-emitting diode 20 using the etching process.

[0081] Specifically, the substrate 50 can be configured as an encapsulation substrate, meaning that the substrate 50 can be used to encapsulate the light-emitting diode 20. This also means that the dimming block 30 configured from the substrate 50 can also be reused to encapsulate the light-emitting diode 20.

[0082] Specifically, a filling structure 40 is provided on the base layer 10. The filling structure 40 cooperates with the substrate 50 to encapsulate the light-emitting diode 20. The specific configuration of the filling structure 40 is described below and will not be repeated here.

[0083] Next, please refer to Figure 10 and Figure 11 The dimming block 30 is made of encapsulation material, and the dimming block 30 is configured to encapsulate the light-emitting diode 20.

[0084] For smaller light-emitting diodes 20, such as Micro LEDs, the growth substrate is typically thicker and needs to be peeled off. In this case, the encapsulation layer of the display substrate 100 can be configured as the dimming block 30, that is, the dimming block 30 is reused as an encapsulation structure. In this case, the dimming block 30 has both dimming and encapsulation functions.

[0085] Please refer to Figures 10 to 11 This application also provides two embodiments regarding the reuse of the dimming block 30 as an encapsulation structure. To ensure the encapsulation effect, a filling structure 40 is provided on the base layer 10. The filling structure 40 cooperates with the dimming block 30 to encapsulate the light-emitting diode 20. That is, the filling structure 40 and the dimming block 30 are used to achieve encapsulation, and no additional encapsulation layer is required. This design does not affect the panel thickness and is beneficial for achieving a thinner display substrate.

[0086] Please continue to refer to this. Figure 10 The dimming block 30 is stacked on the light-emitting diode 20 through its light-incident surface 31. At this time, the dimming block 30 only covers the upper surface of the light-emitting diode 20, and the dimming block 30 is configured with a total reflection surface 33a.

[0087] Please continue to refer to this. Figure 10 The filling structure 40 surrounds the side of the light-emitting diode 20 and the total reflection surface 33a of the dimming block 30. Preferably, the filling structure 40 surrounds one or more of the chamfered surfaces 331.

[0088] Please refer to Figure 11 In this embodiment, the light-incident surface 31 of the dimming block 30 covers the upper surface and side surface of the light-emitting diode 20. An opening that can be closed by the base layer 10 is formed on the light-incident surface 31 of the dimming block 30, and the light-emitting diode 20 is located in the opening.

[0089] Please continue to refer to this. Figure 11 At this time, the dimming block 30 is configured with a total reflective surface 33b, which surrounds the periphery of the dimming block 30 and the periphery of the total reflective surface of the filling structure 40.

[0090] In terms of packaging effect, in this embodiment, the top and side surfaces of the entire LED 20 are sealed by the dimming block 30, and the entire LED 20 is also sealed by the filling structure 40, resulting in a significantly better sealing effect.

[0091] Specifically, the refractive index of the dimming block 30 is greater than that of the filling structure 40. It is understood that when light travels from an optically denser medium to an optically less dense medium (i.e., from a medium with a higher refractive index to a medium with a lower refractive index), if the angle of incidence of the light at the interface between the optically denser and optically less dense media is greater than the critical angle for total internal reflection, the light will undergo total internal reflection at the interface and return to the optically denser medium, unable to travel to the optically less dense medium.

[0092] In a preferred embodiment, the refractive index of the dimming block 30 is greater than 1.5, and the refractive index of the filling structure 40 is in the range of 1 to 1.2.

[0093] Specifically, the filling structure 40 is made of an encapsulation material. The filling structure 40 isolates the internal structure of the light-emitting diode 20 from the air, thus protecting the internal structure of the light-emitting diode 20. The encapsulation material can be silicone, which can be cured at high temperatures to form a tight bond with the light-emitting diode 20.

[0094] Of course, the encapsulation material can also be any other suitable material, as long as it has fluidity before encapsulation and high light transmittance after curing. Depending on the encapsulation material, the curing method can also include cooling curing, light curing, curing with a hardener, etc.

[0095] Please refer to Figure 10 and Figure 11In the specific preparation process: first, a filling structure 40 is prepared on the base layer 10, and the filling structure 40 is arranged around the light-emitting diode 20; then, encapsulation material is filled between the light-emitting diode 20 and the filling structure 40 to obtain the dimming block 30. That is to say, the structure and pattern of the dimming block 30 can be obtained by means of the dimming structure 40.

[0096] Furthermore, the display substrate 100 also includes a transparent resin layer, which is disposed on the side of the light-emitting diode 20 away from the base layer 10 and fills the spaces between adjacent light-emitting diodes 20.

[0097] Specifically, the refractive index of the transparent resin layer is different from that of the dimming block 30, and the surface of the transparent resin layer away from the dimming block 30 is a plane, that is, the light-emitting side surface of the transparent resin layer is a plane. This enables more precise control of light efficiency and also provides reliability for the light-emitting diode.

[0098] The shape of the aforementioned transparent resin layer can be achieved using various adhesion molding methods such as compression molding and injection molding. Besides the adhesion molding method, the shape depends on the viscosity of the coated resin material and the encapsulation shape.

[0099] Furthermore, the display substrate 100 also includes a color conversion layer, which is disposed on the side of the light-emitting diode 20 away from the base layer 10. In a preferred embodiment, the color conversion layer is disposed on the side of the transparent resin material layer away from the light-emitting diode 20.

[0100] In a preferred embodiment, the color conversion layer is a quantum dot color conversion layer.

[0101] Based on the same concept, this application also provides a display device, which includes the display substrate 100 of this application. The display device provided in the embodiments of this application can be a mobile phone, or any electronic product with display function, including but not limited to the following categories: television, laptop, desktop monitor, tablet computer, digital camera, smart bracelet, smart glasses, vehicle display, medical device, industrial control equipment, touch interactive terminal, etc., and the embodiments of this application do not make any special limitations on these.

[0102] The display substrate and display substrate provided in the embodiments of this application have been described in detail. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display substrate, characterized in that, It includes a base layer and a plurality of light-emitting diodes disposed on the base layer. The light-emitting diodes are miniature light-emitting diodes. A dimming block is disposed on the side of each light-emitting diode away from the base layer. The dimming block has a light-incident surface, a light-exit surface and a total reflection surface. The light-incident surface faces the light-emitting diode, and the light-incident surface covers the upper surface of the light-emitting diode; The light-emitting surface is far from the light-emitting diode, and the light-emitting surface is disposed opposite to the light-incident surface; The total reflection surface is arranged around the side of the dimming block, and the total reflection surface can reflect all light rays incident on the total reflection surface via the light incident surface to the light emitting surface; The orthographic projection of the light-emitting diode on the dimming block falls on the light-incident surface, and all the light emitted by the light-emitting diode to the light-incident surface is emitted from the light-out surface; A growth substrate is provided on the side of each light-emitting diode away from the substrate, and the dimming block is configured from the growth substrate; or, the dimming block is made of encapsulation material, and the light-incident surface of the dimming block wraps the upper surface and side surface of the light-emitting diode, and the dimming block is configured to encapsulate the light-emitting diode.

2. The display substrate as described in claim 1, characterized in that, The substrate is made of sapphire.

3. The display substrate as described in claim 1, characterized in that, The total reflection surface connects the light-incident surface and the light-outcident surface, and the total reflection surface forms one or more adjacent chamfered surfaces on the side near the light-incident surface; Alternatively, the total reflection surface can be an inclined surface connecting the incident surface and the emitting surface.

4. The display substrate as described in claim 3, characterized in that, The chamfered surface or the inclined surface forms a preset angle with the plane containing the light-incident surface, and the preset angle ranges from 20° to 70°.

5. The display substrate as described in claim 3, characterized in that, In the thickness direction of the dimming block, the length of one or more of the chamfered surfaces is 5μm-30μm.

6. The display substrate as described in claim 1, characterized in that, A filling structure is also provided on the base layer, the refractive index of the filling structure being less than the refractive index of the dimming block, and: When the light-incident surface of the dimming block wraps around the upper surface and side surface of the light-emitting diode, the total reflection surface surrounds the light-emitting diode, and the filling structure surrounds the total reflection surface.

7. The display substrate as described in claim 1, characterized in that, The display substrate includes a transparent resin layer, which is disposed on the side of the dimming block away from the base layer; Furthermore, the refractive index of the transparent resin layer is different from that of the dimming block.

8. The display substrate as described in claim 1, characterized in that, The display substrate further includes a color conversion layer, which is disposed on the side of the dimming block away from the base layer.

9. A display device, characterized in that, The display substrate described in any one of claims 1 to 8 is used.

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