Wafer-type sensor unit and data acquisition method using wafer-type sensor unit

Abstract

The present inventive concept provides a wafer type sensor unit and a data acquisition method using the wafer type sensor unit. The wafer type sensor unit acquires data about a wind direction and a wind speed of an air flow during processing, the wafer type sensor unit being supported by a support unit of a substrate processing apparatus. The unit includes a wafer-like circuit board and a hot wire anemometer sensor placed away from an upper surface of the circuit board.

Description

[0001] Cross-reference of related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0124236, filed with the Korean Intellectual Property Office on September 24, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of the inventive concept described herein relate to a wafer-type sensor unit and a data acquisition method using the wafer-type sensor unit. More specifically, the embodiments of the inventive concept described herein relate to a wafer-type sensor unit capable of measuring airflow in a vertical direction. Background Technology

[0004] In semiconductor manufacturing, airflow direction and velocity are closely related to particle distribution and temperature. A significant challenge is uniformly controlling airflow direction and velocity by measuring the airflow reaching the wafer. Since no conventional commercial product can measure airflow at the wafer surface, a method is employed that uses a commercially available anemometer and fixture installed at a location within the device to measure wind speed and then estimate the airflow within the device. However, this method of using commercial anemometers to analyze airflow presents difficulties.

[0005] Conventional methods are prone to high errors in measurement results due to human error (such as the angle or height of anemometers installed directly by a person). Furthermore, disassembling and installing auxiliary fixtures is difficult when measuring wind speed, depending on the equipment's structure. Another problem is the inability to measure vertical wind speed using conventional methods. Additionally, the structure of the anemometer and fixture can become an obstacle to airflow on the wafer, and variations in distance from the wafer can introduce measurement errors. Summary of the Invention

[0006] The present invention provides a wafer-type sensor unit to improve the method of airflow analysis in semiconductor processes.

[0007] The technical objectives of this invention are not limited to those described above, and other unmentioned technical objectives will become apparent to those skilled in the art from the following description.

[0008] In an embodiment of the present invention, a wafer-type sensor unit is provided for acquiring data on wind direction and wind speed of airflow during processing, the wafer-type sensor unit being supported by a support unit of a substrate processing apparatus.

[0009] The wafer-type sensor unit may include: a wafer-shaped circuit board; and a hot-wire anemometer, which is positioned away from the upper surface of the circuit board.

[0010] In one embodiment, multiple hot-wire anemometers are provided, and these multiple hot-wire anemometers can be placed away from the center of the circuit board.

[0011] In one embodiment, multiple hot-wire anemometers are arranged in a circular shape concentric with the center of the circuit board.

[0012] In one embodiment, multiple hot-wire anemometers are placed 0.55 mm or more away from the upper surface of the circuit board.

[0013] In one embodiment, multiple hot-wire anemometers can be placed at the same distance from the upper surface of the circuit board.

[0014] In one embodiment, a spacer may also be included for separating the circuit board from the hot-wire anemometer.

[0015] In one embodiment, the spacer member is configured as an insulator.

[0016] In one embodiment, the wafer-type sensor unit may further include electronic devices mounted on the bottom surface of the circuit board.

[0017] In one embodiment, the electronic device may further include a power unit and a signal processing unit that processes signals from the circuit board.

[0018] In another embodiment of the present invention, a wafer-type sensor unit is provided for acquiring data on wind direction and wind speed of airflow during processing, the wafer-type sensor unit being supported by a support unit of a substrate processing apparatus.

[0019] The wafer-type sensor unit may include a wafer-shaped circuit board; an electronic device mounted on the upper surface of the circuit board and coated with a coating, wherein the height of the coating above the upper surface of the circuit board is constant; and a hot-wire anemometer placed away from the upper surface of the coating.

[0020] In another embodiment of the present invention, a data acquisition method is provided that uses a wafer-type sensor unit from another embodiment of the present invention to acquire data on wind direction and wind speed during processing.

[0021] The above method may include measuring wind speed at each location where a hot-wire anemometer is placed; and using the measurements from the hot-wire anemometer to determine wind speed deflection.

[0022] In one embodiment, measuring wind speed at each location where a hot-wire anemometer is placed includes measuring wind speed in a direction perpendicular to the surface of the circuit board at each location where the hot-wire anemometer is placed.

[0023] Compared to conventional airflow analysis methods, the present invention can improve the accuracy of measurements.

[0024] The present invention is effective in terms of user convenience and PM automation. Attached Figure Description

[0025] Referring to the following figures, the above and other objects and features will become apparent from the following description, wherein, unless otherwise stated, the same reference numerals refer to the same parts throughout the figures, and in the figures:

[0026] Figures 1A to 1B A view illustrating a wafer-type sensor unit according to an embodiment of the present invention.

[0027] Figures 2A to 2B This is a view illustrating a wafer-type sensor unit according to another embodiment of the concept of the present invention.

[0028] Figures 3A to 3B This is a view illustrating the layout structure of a hot-wire anemometer in a wafer-type sensor unit according to an embodiment of the present invention.

[0029] Figure 4 This is a view showing the effect of airflow on a vertical slab.

[0030] Figures 5A to 5B This is a view illustrating the layout of a hot-wire anemometer in a wafer-type sensor unit according to another embodiment of the invention.

[0031] Figures 6 to 9 A graph illustrating the measurement results of wind speed using a wafer-type sensor unit according to an embodiment of the present invention. Detailed Implementation

[0032] The inventive concept can be modified in various ways and can take many forms, and specific embodiments of the inventive concept will be shown and described in detail in the accompanying drawings. However, the embodiments of the inventive concept are not intended to limit the specific forms disclosed, and it should be understood that the inventive concept includes all variations, equivalents, and substitutions contained within the spirit and technical scope of the inventive concept. In the description of the inventive concept, detailed descriptions of related known technologies will be omitted where such obscurity is unnecessarily made unclear about the essence of the inventive concept.

[0033] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the inventive concept. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that, as used in this specification, the terms “comprising” and / or “including” specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Furthermore, the term “exemplary” is intended to refer to an embodiment or illustration.

[0034] It should be understood that although the terms "first," "second," "third," etc., may be used herein to describe different elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms unless otherwise stated. These terms are used only to distinguish one element, component, region, layer, and / or segment from another. Therefore, the first element, first component, first region, first layer, or first segment discussed below may be referred to as a second element, second component, second region, second layer, or second segment without departing from the teachings of the inventive concept.

[0035] In the instructions, unless otherwise specified, the singular form includes the plural form. Furthermore, for clarity, the shape or size of elements in the diagrams may be exaggerated.

[0036] Although not defined, all terms used herein (including technical or scientific terms) may have the same meaning as commonly accepted in the art to which the inventive concept pertains. Terms defined in general dictionaries may be interpreted as having the same meaning as expressed in related technologies and / or the disclosure of this application, and even if not explicitly defined herein, terms defined in general dictionaries shall not be conceptual nor construed as overly formal. The terms used herein are provided to describe embodiments and not to limit the inventive concept. In the specification, the singular form includes the plural form unless specifically mentioned. The expression “include” and its various inflections, such as “including”, used in the specification do not exclude the presence or addition of one or more components, substances, elements, steps, operations, and / or devices.

[0037] The terms “unit,” “component,” etc., can be used to refer to a unit that performs at least one function or operation. For example, such terms may refer to software or hardware elements, such as FPGAs or ASICs. However, these terms are not limited to software or hardware. “Unit,” “component,” etc., can be configured to be included within an addressable storage medium or to operate one or more processors.

[0038] For example, "units" and "components" can include constituent elements (e.g., software elements, object-oriented software elements, class elements, and task elements), processes, functions, attributes, programs, subroutines, program code segments, drivers, firmware, microcode circuits, data, databases, data structures, tables, arrays, and variables. The elements and functions provided in "units" and "components" can be divided into elements and "units" or "components," or they can be combined with other additional elements.

[0039] According to the wafer sensor unit 1 of the embodiment of the present invention, by placing the hot-wire anemometer 20 away from the upper surface of the circuit board 10, the airflow on the upper surface of the circuit board 10 can be measured at a desired location. Furthermore, by mounting the hot-wire anemometer 20 with a minimal number of hot wires and wiring 50 on the upper surface of the circuit board 10, and by integrating electronic devices 40 such as signal processing units and power units in the lower part of the circuit board, factors affecting the airflow above the circuit board can be minimized.

[0040] Figures 1A to 1B A wafer-type sensor unit 1 according to an embodiment of the present invention is shown.

[0041] In an embodiment of the present invention, the wafer-type sensor unit 1 may include a circuit board 10, a hot-wire anemometer 20, and electronic equipment 40. The wafer-type sensor unit 1 according to the embodiment may be supported by a support unit of a substrate processing apparatus and acquire data regarding the direction and speed of the airflow during processing.

[0042] In one embodiment, the circuit board 10 may be a PCB substrate. The circuit board 10 may be wafer-shaped. The circuit board 10 may be formed to a size and shape that matches the wafer. Electronic devices 40 may be placed on the bottom surface of the circuit board 10. Electronic devices 40 that may be included in the wafer-type sensor unit 1 may include power units, signal processing units, sensor units, etc. In one embodiment, electronic devices 40 that may be included in the wafer-type sensor unit 1 may further include wiring 50 for connecting electronic devices 40 to each other, microcontroller units (MCUs), etc.

[0043] In one embodiment, the power unit may include a battery for providing operating power. In one embodiment, the sensor unit may include a sensor for sensing one of various environmental conditions. In one embodiment, the sensor unit may include a temperature sensor, a pressure sensor, etc. The signal processing unit may perform signal processing on the information received from the sensor unit. The signal processing unit may include other components, such as a communication unit for transmitting information.

[0044] In one embodiment, the electronic device 40 placed on the bottom surface of the circuit board 10 may have a coated surface. In another embodiment, the electronic device 40 placed on the bottom surface of the circuit board 10 may be protected by a film and / or covered by a cover.

[0045] The coating on the bottom surface of the wafer-type sensor unit 1 can be a cover and / or a case to protect the electronic device 40 from external environmental influences. To minimize weight, a PI, film, or Teflon cover can be used; coatings such as epoxy resin, PI, or acrylic can also be used.

[0046] In an embodiment of the present invention, the hot-wire anemometer 20 can be disposed above the upper surface of the circuit board 10. Multiple hot-wire anemometers 20 can be disposed. The hot-wire anemometer 20 can be positioned away from the upper surface of the circuit board 10 so that the airflow velocity can be measured in a direction perpendicular to the surface of the circuit board.

[0047] In another embodiment of the present invention, the hot-wire anemometer 20 can be configured in various ways, such as linear, elliptical / oval, coiled, etc. In another embodiment of the present invention, the hot-wire anemometer 20 can have only one hot wire, or it can be integrated into a PCB or film. In an embodiment of the present invention, the hot-wire anemometer 20 can measure wind speed using changes in the temperature of the hot wire.

[0048] An exemplary embodiment of the present invention can measure airflow in a region close to a wafer using a hot-wire anemometer. When the hot-wire anemometer 20 is used in an embodiment of the present invention, the hot-wire anemometer uses a wire with a microwidth, thus making it small, efficient, and structurally optimized.

[0049] By minimizing the configuration by making the sensor smaller, an ultrasonic method can be used instead of the hot-wire anemometer 20. However, in the ultrasonic method, two ultrasonic sensors facing each other must be installed or a reflector is required. Furthermore, in the ultrasonic method, it is difficult to measure edge areas with large airflow. The hot-wire anemometer 20 is preferred.

[0050] In one embodiment, the method using the hot-wire anemometer 20 can measure the wind speed based on the degree to which the heated wire is cooled by the wind speed. The voltage may change depending on the cooling of the heated wire by the wind speed, and the wind speed can be measured based on the voltage change of a reference value.

[0051] Therefore, in one embodiment, the hot-wire anemometer 20 can be positioned away from the surface of the circuit board 10 to measure the wind speed in a direction perpendicular to the surface of the circuit board 10. In one embodiment, the wind speed deviation can be determined by arranging a plurality of hot-wire anemometers 20 in a circle concentric with the circuit board 10.

[0052] In addition, according to Figures 1A to 1B In this implementation scheme, the electronic device 40 is placed on the bottom surface of the circuit board 10, and only the hot-wire anemometer 20 and wiring 50, used for heat transfer and connection, are exposed on the upper surface of the circuit board 10. Therefore, the electronic device 40 itself cannot obstruct the airflow on the upper side of the circuit board 10, thereby achieving more accurate airflow measurement.

[0053] Figures 2A to 2B A wafer-type sensor unit 1 according to another embodiment of the present invention is shown.

[0054] For ease of explanation, the terms will be omitted. Figure 1A and Figure 1B The same elements in the embodiments and implementations are described, and will be mainly described below. Figures 2A to 2B and Figures 1A to 1B Differences between implementation plans.

[0055] according to Figures 2A to 2B The electronic device 40 can be placed on the upper surface of the circuit board 10 instead of the bottom surface. In one embodiment, the electronic device 40 may include a signal processing unit and a power unit, a sensor unit, etc. Figures 1A to 1B The implementation plan. Figures 2A to 2B In one embodiment, the electronic device 40 may include a signal processing unit and a power unit, and the electronic device 40 may be coated with a coating. In another embodiment, the height of the coating from the upper surface of the circuit board 10 is constant. The height of the coating on the electronic device 40 mounted on the circuit board 10 may be constant over the entire area of ​​the circuit board 10. Figures 2A to 2B In one implementation, multiple hot-wire anemometers 20 are disposed on the upper surface of the coating of the electronic device 40, such that all hot-wire anemometers 20 can be placed at the same height.

[0056] Reference Figures 2A to 2B The hot-wire anemometer 20 can be placed at a certain distance from the upper surface of the coating of the electronic device 40.

[0057] according to Figures 2A to 2B In this implementation scheme, the electronic device 40 is positioned on the upper side of the circuit board 10, thus... Figures 1A to 1B Compared to the embodiment where the electronic device 40 is disposed on the bottom side of the circuit board 10, the wafer-type sensor unit 1 of this embodiment has a relatively flat bottom side. Therefore, according to Figures 2A to 2B In the proposed implementation, it would be advantageous to use a robotic arm to transport the wafer-type sensor unit 1, which supports the relatively flat bottom side of the wafer-type sensor unit 1 and transports the wafer-type sensor unit.

[0058] Furthermore, the hot-wire anemometer 20 is positioned at a certain distance above the coating of the coating electronics 40, therefore, as Figures 1A to 1B As shown, the electronic device 40 can reliably measure airflow without affecting it.

[0059] Figures 3A to 3B This is a top view illustrating the layout structure of a hot-wire anemometer 20 of a wafer-type sensor unit 1 according to an embodiment of the present invention. The hot-wire anemometer 20 is arranged in a circular shape concentric with the circuit board 10. In other words, the hot-wire anemometer 20 is arranged on an imaginary circle concentric with the circuit board 10 and having a diameter smaller than that of the circuit board 10. The hot-wire anemometer 20 can be arranged in various ways, for example, taking into account orientation (e.g., longitudinal direction), on an imaginary circle concentric with the circuit board 10. The longitudinal direction of the hot-wire anemometer 20 can be arranged to form a tangent with the imaginary concentric circle (see...). Figure 3A ) and / or radially arranged on an imaginary concentric circle with circuit board 10 (see Figure 3B The hot-wire anemometers 20 are spaced equidistant from each other. They can also be of the same size.

[0060] according to Figure 3A In the implementation scheme, the hot-wire anemometer 20 is arranged in a circular shape concentric with the circuit board 10, and is equidistant from each other and has the same size.

[0061] according to Figure 3A In one implementation scheme, wind speed deviation can be determined using hot-wire anemometers 20 that are evenly spaced from each other on concentric circles with respect to the circuit board. The hot-wire anemometers 20 can be arranged to form multiple concentric circles with respect to the circuit board 10 (see...). Figure 3B ).

[0062] according to Figure 3BIn one embodiment, multiple hot-wire anemometers 20 are arranged to form concentric circles relative to the circuit board 10 and further arranged radially relative to the circuit board 10. In other words, the multiple hot-wire anemometers 20 are arranged to form multiple concentric circles with respect to the circuit board 10, and within each concentric circle, the multiple hot-wire anemometers 20 are arranged with their longitudinal direction radially oriented. A single hot-wire anemometer 20 may be further arranged directly above the center of the circuit board 10. In some embodiments, the number of multiple hot-wire anemometers 20 in each concentric circle may increase from the center to the edge of the circuit board 10. Figure 3B In the implementation scheme, wind speed can be measured at different locations on the circuit board 10.

[0063] According to some embodiments providing multiple hot-wire anemometers 20, wind speed deviation can be determined by measuring the wind speed at each location where the hot-wire anemometers are placed and using the measurements from each location. The measurement performed at each location of the hot-wire anemometers 20 can be a measurement of the wind speed in a direction perpendicular to the surface of the circuit board.

[0064] When the measurements of the hot-wire anemometer 20 are the same at every location, it can be determined that the airflow is uniformly flowing in all directions.

[0065] On the other hand, the direction of airflow can be determined when some measurements by some of the multiple hot-wire anemometers 20 arranged in a circular shape concentric with the circuit board differ from other measurements by the remaining hot-wire anemometers.

[0066] Figure 4 This is a view showing the effect of airflow perpendicular to the top surface of a circuit board or wafer.

[0067] refer to Figure 4 In the implementation scheme, when the air flows vertically, the problem is that the velocity near the top surface of the circuit board and near the top surface of the wafer is measured to be 0.

[0068] More specifically, when the hot-wire anemometer 20 is fixed to the circuit board instead of being placed separately, a potential problem is that measuring airflow flowing downwards perpendicular to the top surface at a speed of 0 m / s is outside the measurement range. Therefore, in order to measure airflow flowing downwards perpendicular to both the top surface of the circuit board and the top surface of the wafer, as... Figures 1A to 1B and Figures 2A to 2B ,as well as Figures 5A to 5B The hot wire can be placed away from the top surface of the circuit board 10, so that micro-airflow can be measured.

[0069] Figures 5A to 5BA schematic cross-sectional view illustrating the layout of a hot-wire anemometer 20 in a wafer-type sensor unit 1 according to another embodiment of the present invention.

[0070] Reference Figures 5A to 5B The hot-wire anemometer 20 can be placed at a constant distance from the upper surface of the circuit board 10. The constant distance between the hot-wire anemometer and the upper surface of the circuit board can be a few millimeters or a few centimeters.

[0071] The reason why the hot-wire anemometers 20 are placed at a constant height is explained below.

[0072] The hot-wire anemometer 20 measures wind speed based on the temperature change caused by the airflow. However, if the hot wire is in contact with the circuit board 10, its thermal characteristics may be affected by the circuit board 10, making accurate measurements difficult. Therefore, according to embodiments of the present invention, the hot-wire anemometer 20 can be placed away from the upper surface of the circuit board 10. In one embodiment, the distance between the hot-wire anemometer 20 and the upper surface of the circuit board 10 or the coating of the electronic device 40 can vary depending on the intensity of the airflow or the sensitivity of the sensor. The distance between the hot-wire anemometer 20 and the upper surface of the circuit board 10 or the coating of the electronic device may affect the measurement; therefore, all hot-wire anemometers 20 can be placed at the same height to ensure uniform measurement of the airflow.

[0073] In one embodiment, the hot-wire anemometer 20 can be placed separately from the circuit board 10 in the form of pins and fixed to the circuit board 10 by wiring (see [link]). Figure 5A ).

[0074] In another embodiment of the present invention, a spacer 30 may be provided between the hot-wire anemometer 20 and the circuit board 10 (see...). Figure 5B Therefore, the hot-wire anemometer 20 is spaced apart from the circuit board 10. In other words, the spacer 30 is disposed on the circuit board 10, while the hot-wire anemometer 20 is disposed on the spacer plate. In one embodiment, the spacer 30 may be configured as an insulator. By configuring the spacer 30 as an insulator, heat loss in the hot-wire anemometer 20 can be minimized.

[0075] Figures 6 to 9 The results of wind speed measurement using a wafer-type sensor unit 1 according to an embodiment of the present invention are shown.

[0076] Figure 6 The results of wind speed measurement using wafer-type sensor unit 1 are shown under conditions where wind speed is provided differently depending on the strength of the disc filter unit.

[0077] according to Figure 6The wind speed output increases proportionally to the strength (0-200Pa) of the fan filter unit. Figure 6 In the implementation scheme, the wind speed output of the wafer-type sensor unit 1 at the edge region can be 2.0 to 2.8. The wind speed output of the wafer-type sensor unit 1 at the center can be 0.2 to 0.4.

[0078] Figure 7 The measurement results of wind speed vary depending on the orientation of the hot-wire anemometer 20 are shown.

[0079] Reference Figure 7 Compared to the results from a hot-wire anemometer positioned at the initial 0° direction, the measurement results from a hot-wire anemometer 20 positioned at the 180° direction showed a decrease of approximately 6%. (Refer to...) Figure 7 The wind speed is measured according to the different orientations of the hot-wire anemometer 20, thus enabling the detection of the airflow direction.

[0080] Figure 8 The results from the hot-wire anemometer are shown, where the measured wind speed varies depending on the sensor's location.

[0081] exist Figure 8 In this method, one sensor is fixed to the edge area, while the position of another sensor is moved from the center area to the edge area. Wind speed is then measured using these sensors. (See reference...) Figure 8 It appears that the measured wind speed differences may be caused by height differences between sensors due to insulation loss. Furthermore, the wind speed on the surface of wafer-type sensor unit 1 is strongest at the edge region, then at the center region, and finally in the intermediate region between the edge and center regions.

[0082] Figure 9 The measurement results are shown by varying the distance between the sensor and the upper surface of the circuit board.

[0083] Reference Figure 9 For the same wind speed, the wind speed output varies depending on the sensor's height. Figure 9 Even with a 0.5mm gap between the hot-wire anemometer 20 and the circuit board 10, wind speed can be easily measured. Therefore, by adjusting the gap between the hot-wire anemometer 20 and the circuit board 10, the wind speed of the wafer-type sensor unit 1 can be measured under various conditions.

[0084] The effects of this invention are not limited to those described above, and those skilled in the art will clearly understand any unmentioned effects from the specification and drawings. Although preferred embodiments of the invention have been illustrated and described to date, the invention is not limited to the specific embodiments described above, and it should be noted that those skilled in the art can implement the invention in various ways without departing from the spirit of the invention claimed in the claims, and modifications should not be interpreted separately from the technical spirit or prospect of the invention.

Claims

1. A wafer-type sensor unit for acquiring data on wind direction and wind speed during processing, the wafer-type sensor unit being supported by a support unit of a substrate processing apparatus. The wafer-type sensor unit includes: Wafer-shaped circuit board; and Multiple hot-wire anemometers are placed away from the upper surface of the circuit board, wherein the multiple hot-wire anemometers are placed at a predetermined distance from the upper surface of the circuit board. The predetermined distance is 0.55 mm or greater.

2. The wafer-type sensor unit according to claim 1, wherein, The plurality of hot-wire anemometers are placed away from the center of the circuit board.

3. The wafer-type sensor unit according to claim 2, wherein, The plurality of hot-wire anemometers are arranged in a circular shape concentric with the center of the circuit board.

4. The wafer-type sensor unit according to claim 2, wherein, The plurality of hot-wire anemometers are placed at the same distance from the upper surface of the circuit board.

5. The wafer-type sensor unit according to any one of claims 1 to 4, wherein the wafer-type sensor unit further comprises a spacer member for separating the circuit board from the plurality of hot-wire anemometers.

6. The wafer-type sensor unit according to claim 5, wherein, The spacer member is configured as an insulator.

7. The wafer-type sensor unit according to claim 5, wherein, The wafer-type sensor unit also includes electronic devices mounted on the bottom surface of the circuit board.

8. The wafer-type sensor unit according to claim 7, wherein, The electronic device further includes: Power unit; and A signal processing unit that processes the signals of the circuit board.

9. A wafer-type sensor unit for acquiring data on wind direction and wind speed of airflow during processing, the wafer-type sensor unit being supported by a support unit of a substrate processing apparatus, the wafer-type sensor unit comprising: Wafer-shaped circuit board; and An electronic device, wherein the electronic device is mounted on the upper surface of the circuit board and coated with a coating, wherein the height of the coating above the upper surface of the circuit board is constant; and Multiple hot-wire anemometers are placed away from the upper surface of the coating, wherein the multiple hot-wire anemometers are placed at a predetermined distance from the upper surface of the circuit board. Each of the plurality of hot-wire anemometers includes a portion parallel to the circuit board, one end of the portion parallel to the circuit board being a free end, and the free end being placed at a predetermined distance from the upper surface of the circuit board. The predetermined distance is 0.55 mm or greater.

10. The wafer-type sensor unit according to claim 9, wherein, The multiple hot-wire anemometers are placed away from the center of the circuit board.

11. The wafer-type sensor unit according to claim 10, wherein, The plurality of hot-wire anemometers are arranged in a circular shape concentric with the center of the circuit board.

12. The wafer-type sensor unit according to claim 10, wherein, The plurality of hot-wire anemometers are placed at the same distance from the upper surface of the circuit board.

13. The wafer-type sensor unit according to any one of claims 9 to 12, wherein the wafer-type sensor unit further comprises a spacer member for separating the circuit board from the plurality of hot-wire anemometers.

14. The wafer-type sensor unit according to claim 13, wherein, The spacer member is configured as an insulator.

15. A data acquisition method, the data acquisition method using a wafer-type sensor unit according to claim 1 or 9 to acquire data on wind direction and wind speed of airflow during processing, the method comprising: Wind speed is measured at each location where the plurality of hot-wire anemometers are placed; and The wind speed deviation is determined using measurements from the plurality of hot-wire anemometers.

16. The data acquisition method according to claim 15, wherein, Measuring wind speed at each location where the plurality of hot-wire anemometers are placed includes measuring wind speed in a direction perpendicular to the surface of the circuit board at each location where the plurality of hot-wire anemometers are placed.

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