processing device

Abstract

The present application provides a processing device which easily performs the work of bonding a dicing tape to the back surface of a wafer having a ring-shaped reinforcing portion formed in a convex shape on the back surface corresponding to a remaining area of the outer periphery so as to be integrated with a ring-shaped frame, and easily cuts the reinforcing portion and removes it from the wafer. The processing device includes a wafer carrying-out unit, a wafer stage, a frame carrying-out unit, a frame stage, a tape bonding unit, a tape-and-frame carrying unit, a tape pressing unit, a frame unit carrying-out unit which carries out a frame unit from the wafer stage, a reinforcing portion removing unit, a ring-less unit carrying-out unit, and a frame cassette stage.

Description

Technical Field

[0001] The present invention relates to a processing apparatus for removing a convex reinforcement portion from a wafer having an annular reinforcement portion formed in a convex shape on the back side corresponding to the remaining peripheral region. Background Technology

[0002] The wafer has a device area on its front side divided into multiple devices such as ICs and LSIs by intersecting multiple predetermined dividing lines, and a remaining area around the device area. After the back side of the wafer is ground to the desired thickness, it is divided into individual device chips by a cutting device and a laser processing device. The divided device chips are used in electronic devices such as mobile phones and personal computers.

[0003] To facilitate the transport of the ground wafer, the applicant has proposed the following technique: leaving an annular reinforcement on the back side corresponding to the remaining area on the outer periphery; after performing the prescribed processing, attaching a dicing tape to the back side of the wafer; supporting the wafer with an annular frame; and removing the annular reinforcement from the wafer (see, for example, Patent Document 1).

[0004] Patent Document 1: Japanese Patent Application Publication No. 2010-62375

[0005] However, the following problems exist: it is difficult to attach the dicing tape to the back of the wafer on which the annular reinforcement portion is formed in a convex shape on the back corresponding to the remaining area of ​​the outer periphery, and to integrate it with the annular frame; it is also difficult to cut the annular reinforcement portion and remove it from the wafer, resulting in poor productivity. Summary of the Invention

[0006] Therefore, the object of the present invention is to provide a processing apparatus that facilitates the application of a dicing tape to the back side of a wafer on which an annular reinforcement portion is convexly formed on the back side corresponding to the remaining peripheral area, thereby integrating the dicing tape with an annular frame, and facilitates the cutting and removal of the annular reinforcement portion from the wafer.

[0007] According to the present invention, a processing apparatus is provided for removing a convex reinforcing portion from a wafer on a back surface corresponding to the remaining peripheral region, wherein the processing apparatus comprises: a wafer cassette stage for holding a wafer cassette containing a plurality of wafers; a wafer removal unit for removing the wafer from the wafer cassette held on the wafer cassette stage; a wafer stage for supporting the front side of the wafer removed by the wafer removal unit; a frame storage unit for storing a plurality of annular frames having openings for receiving the wafers; and a frame removal unit for removing the wafer from the wafer cassette. A frame storage unit removes the annular frame; a frame platform supports the annular frame removed by the frame removal unit; a tape-adhesive unit, positioned above the frame platform, adheres a tape to the annular frame; a tape-containing frame transport unit transports the annular frame with the tape attached to it to the wafer stage and positions the opening of the annular frame against the back of the wafer supported by the wafer stage, thus placing the tape-containing frame on the wafer stage; a tape-pressing unit presses the tape containing the frame onto the back of the wafer; and a frame unit removal unit removes the frame from the wafer stage via the tape-pressing unit. The frame unit, formed by pressing the framed strip to the back of the wafer, is removed from the wafer stage; an enhancement removal unit cuts and removes the annular enhancement from the wafer of the frame unit removed by the frame unit removal unit; a ringless unit removal unit removes the ringless unit from the enhancement removal unit; and a frame cassette stage holds the frame cassette containing the ringless unit removed by the ringless unit removal unit, the frame unit removal unit including: a frame unit holding part, which includes a part that holds all or part of the outer periphery of the wafer. The device includes a wafer holding section that partially exposes and holds the wafer, and a frame holding section that holds the annular frame; a transport section that transports the frame holding section to a temporary stage; an imaging section that takes pictures of the outer periphery of the wafer held by the frame holding section; and an illumination section that is positioned opposite the imaging section while holding the wafer. The frame holding section causes the transport section to operate, and the imaging section takes pictures of at least three points on the outer periphery of the wafer to determine the center coordinates of the wafer, so that the center of the wafer is aligned with the center of the temporary stage.

[0008] Preferably, the wafer handling unit includes: a conveying arm; and a hand disposed at the front end of the conveying arm to support the back side of the wafer housed in the wafer cassette and to flip the front and back sides of the wafer. Preferably, the hand is a Bernoulli pad that supports the wafer in a non-contact manner by generating negative pressure through air ejection.

[0009] Preferably, the wafer stage includes: an annular support portion that supports the remaining outer periphery of the wafer and is not in contact with a portion inside the remaining outer periphery; and a frame support portion disposed on the outer periphery of the annular support portion to support the annular frame.

[0010] Preferably, the tape bonding unit includes: a tape support portion for supporting the tape wound before use; a tape take-up portion for taking the used tape; a tape pull-out portion for pulling the tape out of the tape; a crimping portion for crimping the pulled-out tape onto an annular frame; and a cutting portion for cutting the tape protruding to the outer periphery of the annular frame along the annular frame.

[0011] Preferably, the tape pressing unit includes: an upper chamber disposed above the wafer stage; a lower chamber for housing the wafer stage; a lifting mechanism for raising and lowering the upper chamber to create a closed state in contact with the lower chamber and an open state away from the lower chamber; a vacuum section for creating a vacuum in the closed state of the upper and lower chambers; and an atmospheric opening section for opening the upper and lower chambers to the atmosphere. When the tape containing the tape frame is positioned on the back side of the wafer supported by the wafer stage, the lifting mechanism is activated to maintain the closed state and create a vacuum in the upper and lower chambers. The tape containing the tape frame is pressed onto the back side of the wafer using a pressing roller disposed in the upper chamber.

[0012] Preferably, the enhancement removal unit includes: a laser beam irradiation unit that irradiates a laser beam toward the root of the annular enhancement formed on the outer periphery of the wafer to form a cutting groove; a first lifting platform that holds and raises the frame unit temporarily placed on the platform and positions the frame unit at the laser beam irradiation unit; and a separation section that separates the annular enhancement from the cutting groove. The first lifting platform has: a small-diameter wafer holding section smaller than the outer diameter of the wafer, exposing the annular enhancement; a frame support section having a permanent magnet for magnetically attracting the annular frame; and a space that allows laser light leakage between the wafer holding section and the frame. The separation section, which diffuses between the support portions, includes: an ultraviolet irradiation section that irradiates the strip corresponding to the cutting groove with ultraviolet light to reduce the adhesion of the strip; a second lifting platform that exposes the annular reinforcement portion on its outer periphery to attract and hold the inner side of the wafer and support the annular frame; a separator that acts on the outer periphery of the annular reinforcement portion to separate the annular reinforcement portion; and a discarding section that discards the separated annular reinforcement portion. The first lifting platform temporarily places the frame unit with the cutting groove on the temporary platform, which is positioned in the separation section by the temporary platform conveyor. The second lifting platform supports the frame unit temporarily placed on the temporary platform.

[0013] Preferably, the temporary platform has a heater, and the first lifting platform holds the frame unit, which is heated by the heater and is in close contact with the belt at the root of the annular reinforcement, from the temporary platform.

[0014] Preferably, the temporary stage includes: an annular support portion that supports the remaining outer periphery of the wafer and is not in contact with a portion inside the remaining outer periphery; and a frame support portion disposed on the outer periphery of the annular support portion to support the annular frame, the frame support portion including: a strong permanent magnet having a stronger magnetic force than the permanent magnet of the first lifting stage; and a detachment portion that detaches the annular frame magnetically attracted to the strong permanent magnet.

[0015] Preferably, the acyclic unit removal unit includes: a flipping mechanism having a frame holding portion that faces the acyclic unit supported by the second lifting platform and holds the annular frame, the flipping mechanism moving toward the frame box stage and flipping the frame holding portion; an acyclic unit support portion that is flipped by the flipping mechanism and supports the acyclic unit with the wafer face up; and a pushing portion that allows the acyclic unit supported by the acyclic unit support portion to enter the frame box placed on the frame box stage for storage.

[0016] According to the present invention, the imaging unit is used to take pictures of at least three points on the outer periphery of the wafer to determine the center coordinates of the wafer, so that the center of the wafer is aligned with the center of the temporary stage. Therefore, it is easy to attach the dicing tape to the back of the wafer on which the annular reinforcement portion is formed in a convex shape on the back corresponding to the remaining area on the outer periphery and to integrate it with the annular frame. Furthermore, it is easy to cut the annular reinforcement portion and remove it from the wafer, resulting in good productivity. Attached Figure Description

[0017] Figure 1 This is a perspective view of the processing apparatus according to an embodiment of the present invention.

[0018] Figure 2 Through Figure 1 A perspective view of the wafer being processed by the processing apparatus shown.

[0019] Figure 3 yes Figure 1 A three-dimensional view of the wafer cassette, etc. shown.

[0020] Figure 4 yes Figure 1 The image shown is a three-dimensional representation of the hand.

[0021] Figure 5 yes Figure 1 A three-dimensional view of the frame storage units shown.

[0022] Figure 6 (a) is Figure 1 The diagram shown is a perspective view of the frame platform in its lowered position, including the attached units, etc. Figure 6 (b) is Figure 1 The diagram shows a perspective view of the frame platform in its raised position, including the attached units, etc.

[0023] Figure 7 yes Figure 1 The exploded perspective view of the unit with crimping shown.

[0024] Figure 8 This is a cross-sectional view showing the state of the belt being pressed by the pressing rollers at the beginning of the belt bonding process.

[0025] Figure 9 This is a cross-sectional view showing the state of the belt after the pressing roller has finished pressing the belt during the belt pressing process.

[0026] Figure 10 yes Figure 1 A perspective view of the reinforcement removal unit shown.

[0027] Figure 11 (a) is Figure 1 The cross-sectional view of the frame support portion when the strong permanent magnet of the temporary platform is in the raised position. Figure 11 (b) is Figure 1 The cross-sectional view of the frame support of the temporary platform shown, with the strong permanent magnet in the lowered position.

[0028] Figure 12 This is a schematic diagram showing the state of irradiating the root of the wafer with laser light during the enhancement removal process.

[0029] Figure 13 (a) is Figure 1 The diagram shows a perspective view of the first lifting platform of the reinforcement removal unit. Figure 13 (b) is viewed from below. Figure 13 A perspective view of the retaining component shown in (a).

[0030] Figure 14 yes Figure 1 A perspective view of the separation section of the reinforcement removal unit shown.

[0031] Figure 15 This is a schematic diagram showing the state of the enhancement portion being separated from the wafer during the enhancement portion removal process.

[0032] Figure 16 yes Figure 1 A perspective view of the waste portion of the reinforcement removal unit shown.

[0033] Figure 17 yes Figure 1A perspective view of the flipping mechanism of the acyclic unit transfer unit shown.

[0034] Figure 18 yes Figure 1 A perspective view of the acyclic unit support and push-in portion of the acyclic unit transfer unit shown.

[0035] Figure 19 This is a three-dimensional view showing the state of the acyclic unit storage process.

[0036] Label Explanation

[0037] 2: Processing apparatus; 4: Wafer; 4a: Front side of the wafer; 4b: Back side of the wafer; 6: Wafer cassette; 8: Wafer cassette stage; 10: Wafer removal unit; 12: Wafer stage; 20: Remaining peripheral area; 24: Reinforcement section; 56: Annular support section (wafer stage); 58: Frame support section (wafer stage); 64: Annular frame; 64a: Opening; 64': Frame including tape; 66: Frame storage unit; 68: Frame removal unit; 70: Frame stage; 96: Tape; 96R: Tape reel; 98: With adhesive unit; 100: With frame conveying unit; 102: With crimping unit; 104: Tape reel support; 106: With winding unit; 108: With pull-out unit; 110: Crimping unit; 112: Cutting unit; 160: Upper chamber; 162: Lower chamber; 164: Lifting mechanism; 166: Vacuum section; 168: Atmospheric opening section; 192: Frame unit removal unit; 194: Reinforcement removal unit; 196: Loopless unit conveying unit. Output unit; 198: Frame box; 200: Frame box stage; 202: Frame unit holding part; 202a: Wafer holding part; 202b: Frame holding part; 204: Temporary stage; 206: Transfer part; 224: Imaging part; 228: Frame support part; 232: Temporary stage transfer part; 244: Laser beam irradiation unit; 246: First lifting platform; 248: Separation part; 256: Cutting groove; 270: Ultraviolet irradiation part; 272: Second lifting platform; 27 4: Separator; 276: Waste section; 306: Frame holding section; 308: Flipping mechanism; 310: Acyclic unit support section; 312: Push-in section; U: Frame unit; U': Acyclic unit; 400: Illumination section; 402: Strong permanent magnet (temporary stage); 404: Detachment section; 422: Wafer holding section (first lifting stage); 424: Permanent magnet (first lifting stage); 426: Frame support section (first lifting stage); 428: Space (first lifting stage). Detailed Implementation

[0038] Hereinafter, the processing apparatus of a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

[0039] Reference Figure 1As described above, the processing apparatus, generally indicated by reference numeral 2, includes: a wafer cassette stage 8 which holds a wafer cassette 6 for storing a plurality of wafers; a wafer removal unit 10 which removes wafers from the wafer cassette 6 placed on the wafer cassette stage 8; and a wafer stage 12 which supports the front side of the wafers removed by the wafer removal unit 10.

[0040] exist Figure 2 The image shows a wafer 4 being processed by the processing apparatus 2. The front side 4a of the wafer 4 has a device region 18 divided by grid-like predetermined dividing lines 16, which divide multiple devices 14 such as ICs and LSIs, and a remaining peripheral region 20 surrounding the device region 18. Figure 2 For ease of explanation, the boundary 22 between device region 18 and the peripheral remaining region 20 is shown with a double-dotted line, but in reality, the line showing boundary 22 does not exist. On the back side 4b of wafer 4, an annular reinforcement 24 is formed in a convex shape in the peripheral remaining region 20, and the thickness of the peripheral remaining region 20 is greater than the thickness of device region 18. In addition, a notch 26 indicating crystal orientation is formed at the periphery of wafer 4.

[0041] like Figure 3 As shown, multiple wafers 4 are stored in the cassette 6 with their front faces 4a facing upwards and spaced apart in the vertical direction. The wafer cassette stage 8 of this embodiment has a top plate 28 for mounting the cassette 6 and a support plate 30 for supporting the top plate 28. The top plate 28 can be raised and lowered freely, and a lifting unit can be provided to raise and lower the top plate 28 to any desired height.

[0042] Reference Figure 3 Continuing the explanation, the chip removal unit 10 has the following characteristics: Figure 3 The Y-axis movable member 32, indicated by the middle arrow Y, is freely movable in the Y-axis direction, and a Y-axis feed mechanism 34 moves the Y-axis movable member 32 in the Y-axis direction. The Y-axis feed mechanism 34 has a ball screw 36 connected to the lower end of the Y-axis movable member 32 and extending along the Y-axis direction, and a motor 38 that rotates the ball screw 36. The Y-axis feed mechanism 34 converts the rotational motion of the motor 38 into linear motion via the ball screw 36 and transmits it to the Y-axis movable member 32, causing the Y-axis movable member 32 to move along a pair of guide rails 40 extending in the Y-axis direction. Furthermore, Figure 3 The X-axis direction indicated by the middle arrow X is perpendicular to the Y-axis direction. Figure 3 The Z-axis, indicated by the middle arrow Z, is a vertical direction perpendicular to both the X-axis and Y-axis. The XY plane defined by the X-axis and Y-axis is essentially horizontal.

[0043] like Figure 3As shown, the wafer handling unit 10 of this embodiment includes a conveying arm 42 and a hand 44 disposed at the front end of the conveying arm 42, which supports the back side 4b of the wafer 4 housed in the wafer cassette 6, causing the front and back sides of the wafer 4 to flip. The conveying arm 42 is disposed on the upper surface of the Y-axis movable member 32 and is driven by a suitable drive source (not shown) such as an air drive source or an electric drive source. The drive source drives the conveying arm 42 to position the hand 44 at arbitrary positions in each of the X-axis, Y-axis, and Z-axis directions, and causes the hand 44 to flip up and down.

[0044] Reference Figure 4 To illustrate, the preferred embodiment uses a hand 44 to support the Bernoulli pad of the wafer 4 in a non-contact manner by generating negative pressure through air ejection. In this embodiment, the hand 44 is generally C-shaped, and a plurality of air outlets 46 connected to a compressed air supply source (not shown) are formed on one surface of the hand 44. A plurality of guide pins 48 are provided at circumferential intervals along the outer periphery of the hand 44. Each guide pin 48 is configured to move freely in the radial direction of the hand 44.

[0045] like Figure 3 and Figure 4 As shown, after positioning the hand 44 on the back side 4b (lower side) of the wafer 4 placed in the wafer cassette 6 of the wafer stage 8, the wafer removal unit 10 ejects compressed air from the air outlet 46 of the hand 44, generating a negative pressure on one side of the hand 44 through the Bernoulli effect, thereby attracting and supporting the wafer 4 from the back side 4b side in a non-contact manner through the hand 44. The horizontal movement of the wafer 4 attracted and supported by the hand 44 is limited by the guide pins 48. Furthermore, the wafer removal unit 10 moves the Y-axis movable member 32 and the conveying arm 42, thereby removing the wafer 4 attracted and supported by the hand 44 from the wafer cassette 6.

[0046] like Figure 4 As shown, the wafer removal unit 10 of this embodiment has a cut detection mechanism 50 for detecting the position of the cut 26 on the wafer 4. The cut detection mechanism 50 may be configured, for example, to include a light-emitting element 52 and a light-receiving element 54 arranged at intervals between each other in the vertical direction, and a drive source (not shown) for rotating at least one guide pin 48 of the hand 44.

[0047] The light-emitting element 52 and the light-receiving element 54 can be attached to the Y-axis movable member 32 or the transport path by means of a suitable bracket (not shown). Furthermore, when the guide pin 48 is rotated by the aforementioned drive source, the wafer 4, which is attracted and supported by the hand 44, rotates due to the rotation of the guide pin 48. To reliably transmit rotation from the guide pin 48 to the wafer 4, it is preferable that the outer peripheral surface of the guide pin 48, which is rotated by the drive source, is formed of a suitable synthetic rubber.

[0048] With the wafer 4 held in place by the hand 44 and its outer periphery positioned between the light-emitting element 52 and the light-receiving element 54, the cut detection mechanism 50 uses a drive source to rotate the wafer 4 via the guide pin 48, thereby detecting the position of the cut 26. This allows the orientation of the wafer 4 to be adjusted to any desired orientation.

[0049] like Figure 3 As shown, the wafer stage 12 is arranged adjacent to the wafer removal unit 10. The wafer stage 12 of this embodiment includes: an annular support portion 56 that supports the remaining outer periphery region 20 of the wafer 4 and is not in contact with a portion inside the remaining outer periphery region 20; and a frame support portion 58 disposed around the annular support portion 56, supporting the annular frame 64 (described later). Figure 5 The annular support portion 56 is supported by a plurality of suction holes 60 arranged at intervals in the circumferential direction on the upper surface of the annular support portion 56, and each suction hole 60 is connected to a suction unit (not shown). The portion of the wafer stage 12 that is radially inward from the annular support portion 56 becomes a downwardly recessed circular recess 62.

[0050] When the hand 44 is rotated 180° to flip the front and back sides of the wafer 4, placing the wafer 4 on the wafer stage 12 with the front side 4a facing down, the remaining peripheral region 20 of the wafer 4 is supported by the annular support portion 56, and the device region 18 of the wafer 4 is located in the recess 62. Therefore, even when the wafer 4 is placed on the wafer stage 12 with the front side 4a of the device 14 facing down, the device 14 does not contact the wafer stage 12, thus preventing damage to the device 14. In addition, after the wafer stage 12 supports the remaining peripheral region 20 by the annular support portion 56, the suction unit is activated to generate suction force in each suction hole 60, attracting and holding the remaining peripheral region 20, thereby preventing the wafer 4 from shifting position.

[0051] Reference Figure 5 To explain, the processing apparatus 2 also includes: a frame storage unit 66, which stores a plurality of annular frames 64 having openings 64a for storing wafers 4; a frame removal unit 68, which removes the annular frames 64 from the frame storage unit 66; and a frame stage 70, which supports the annular frames 64 removed by the frame removal unit 68.

[0052] like Figure 5 As shown, the frame storage unit 66 of this embodiment includes: a housing 72; a lifting plate 74, which is flexibly disposed within the housing 72; and a lifting unit (not shown) that raises and lowers the lifting plate 74. Figure 5In this housing 72, a Z-axis guide member 78 extending along the Z-axis direction is disposed on the inner side in the X-axis direction. The lifting plate 74 is flexibly supported on the Z-axis guide member 78, and a lifting unit for raising and lowering the lifting plate 74 is disposed inside the Z-axis guide member 78. The lifting unit can, for example, be configured to have a ball screw connected to the lifting plate 74 and extending along the Z-axis direction, and an electric motor for rotating the ball screw. Figure 5 In the housing 72, a door 76 with a handle 76a is provided on the side near the front in the X-axis direction. The door 76 is opened by holding the handle 76a in the frame storage unit 66, thereby allowing the annular frame 64 to be stored inside the housing 72. In addition, an opening 80 is provided at the upper end of the housing 72.

[0053] like Figure 5 As shown, a ring-shaped frame 64 formed of a strong magnetic material is stacked inside the housing 72 on the upper surface of the lifting plate 74 and stored therein. The uppermost ring-shaped frame 64 among the stacked ring-shaped frames 64 is removed from the opening 80 of the housing 72 by the frame removal unit 68. In addition, when the ring-shaped frame 64 is removed from the opening 80, the frame storage unit 66 raises the lifting plate 74 appropriately by the lifting unit, positioning the uppermost ring-shaped frame 64 in a position that can be removed by the frame removal unit 68.

[0054] Reference Figure 5 Continuing the description, the frame removal unit 68 includes: an X-axis guide member 82, fixed to a suitable bracket (not shown), extending along the X-axis direction; an X-axis movable member 84, movably supported on the X-axis guide member 82 in the X-axis direction; an X-axis feed mechanism (not shown) that moves the X-axis movable member 84 in the X-axis direction; a Z-axis movable member 86, movably supported on the X-axis movable member 84 in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 86 in the Z-axis direction. The X-axis feed mechanism of the frame removal unit 68 can be configured to have a ball screw connected to the X-axis movable member 84 and extending along the X-axis direction, and an electric motor that rotates the ball screw. The Z-axis feed mechanism can be configured to have a ball screw connected to the Z-axis movable member 86 and extending along the Z-axis direction, and an electric motor that rotates the ball screw.

[0055] The Z-axis movable member 86 of the frame removal unit 68 has a holding portion 88 for holding the annular frame 64. In this embodiment, the holding portion 88 has a rectangular substrate 90 and a plurality of suction pads 92 provided on the lower surface of the substrate 90, and each suction pad 92 is connected to a suction unit (not shown).

[0056] After the frame removal unit 68 uses the attraction pad 92 of the holding part 88 to attract and hold the uppermost annular frame 64 stored in the frame storage unit 66, the X-axis movable part 84 and the Z-axis movable part 86 are moved, thereby removing the attracted and held uppermost annular frame 64 from the frame storage unit 66.

[0057] like Figure 5 As shown, the frame platform 70 is supported by the Z-axis guide member 94, moving freely between the lowered position (shown by the solid line) and the raised position (shown by the double-dotted line). The Z-axis guide member 94 is equipped with a suitable drive source (e.g., an air-driven or electric-driven source) for moving the frame platform 70 between the lowered and raised positions. In the lowered position, the frame platform 70 receives the annular frame 64, which is moved out via the frame removal unit 68.

[0058] like Figure 1 and Figure 5 As shown, the processing device 2 includes: a bonding unit 98 (see reference). Figure 1 It is mounted above the frame platform 70, and the strap 96 is attached to the annular frame 64; including the strap frame conveyor unit 100 (see reference). Figure 5 The device transfers the annular frame 64 with tape 96 (hereinafter sometimes referred to as "the frame with tape 64'") to the wafer stage 12, positions the opening 64a of the annular frame 64 on the back surface 4b of the wafer 4 supported by the wafer stage 12, and places the frame with tape 64' on the wafer stage 12; and the tape crimping unit 102 (see reference) Figure 1 It presses the strip 96 containing the frame 64' onto the back side 4b of the chip 4.

[0059] Reference Figure 6 As described above, the tape bonding unit 98 of this embodiment includes: a tape support portion 104 that supports the tape 96R obtained by winding the tape 96 before use; a tape take-up portion 106 that takes up the used tape 96; a tape pull-out portion 108 that pulls the tape 96 out from the tape 96R; a crimping portion 110 that crimps the pulled-out tape 96 onto the annular frame 64; and a cutting portion 112 that cuts the tape 96 protruding to the outer periphery of the annular frame 64 along the annular frame 64.

[0060] like Figure 6 As shown, the tape support portion 104 includes a support roller 114 that is rotatably supported on a suitable bracket (not shown) about an axis extending in the X-axis direction. A tape 96R, which is formed by attaching a release paper 116 for protecting the adhesive surface of the tape 96 to the adhesive surface of the tape 96 and winding it into a cylindrical shape, is supported on the support roller 114.

[0061] The take-up section 106 includes a take-up roller 118 rotatably supported on a suitable bracket (not shown) about an axis extending along the X-axis, and an electric motor (not shown) for rotating the take-up roller 118. Figure 6 As shown, the take-up section 106 rotates the take-up roller 118 via an electric motor, thereby taking up the used tape 96, which has a circular opening 120 that corresponds to the portion attached to the annular frame 64.

[0062] Reference Figure 6 Continuing the description, the tape pull-out section 108 includes: a pull-out roller 122 disposed below the support roller 114 of the tape support section 104; an electric motor (not shown) that rotates the pull-out roller 122; and a driven roller 124 that rotates in conjunction with the rotation of the pull-out roller 122. The tape pull-out section 108 rotates the driven roller 124 together with the pull-out roller 122 via the electric motor, thereby pulling the tape 96 held by the pull-out roller 122 and the driven roller 124 out of the tape 96R.

[0063] The release paper 116 is peeled off from the belt 96 passing between the pull-out roller 122 and the driven roller 124, and the peeled release paper 116 is wound up by the release paper take-up section 126. In this embodiment, the release paper take-up section 126 includes a release paper take-up roller 128 disposed above the driven roller 124 and an electric motor (not shown) for rotating the release paper take-up roller 128. Furthermore, the belt 96 with the release paper 116 peeled off is guided to the take-up roller 118 via a guide roller 130 disposed at a distance from the pull-out roller 122 in the Y-axis direction.

[0064] The crimping section 110 includes a pressing roller 132 that is movably arranged in the Y-axis direction and a Y-axis feed mechanism (not shown) for moving the pressing roller 132 in the Y-axis direction. The Y-axis feed mechanism of the crimping section 110 can be constituted by a suitable drive source (e.g., an air drive source or an electric drive source).

[0065] like Figure 6 As shown, the cutting section 112 includes: a Z-axis guide member 134 fixed to a suitable bracket (not shown) and extending along the Z-axis direction; a Z-axis movable member 136 movably supported on the Z-axis guide member 134 in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 136 in the Z-axis direction. The Z-axis feed mechanism of the cutting section 112 can be configured to have a ball screw connected to the Z-axis movable member 136 and extending along the Z-axis direction, and an electric motor that rotates the ball screw.

[0066] Additionally, the cutting section 112 includes a motor 138 fixed to the lower surface of the front end of the Z-axis movable member 136, and an arm 140 that rotates about an axis extending along the Z-axis direction via the motor 138. First and second hanging plates 142a and 142b are spaced apart from each other on the lower surface of the arm 140. A circular cutter 144 is rotatably supported on the first hanging plate 142a about an axis perpendicular to the Z-axis direction, and a pressing roller 146 is rotatably supported on the second hanging plate 142b about an axis perpendicular to the Z-axis direction.

[0067] The frame platform 70, which received the annular frame 64 from the frame removal unit 68, descended from its lowered position. Figure 6 The position shown in (a) is located in the rising position. Figure 6 Before the position shown in (b), the tape bonding unit 98 pulls out the unused tape 96 via the pull-out roller 122 and the driven roller 124. Furthermore, the frame platform 70 is positioned in the raised position so that the tape 96 can be pressed against the annular frame 64 by the pressing roller 132 of the pressing section 110, so that the annular frame 64 contacts the pressing roller 132 through the tape 96. While pressing the bonding surface of the tape 96 against the annular frame 64 using the pressing roller 132, the pressing roller 132 is rotated and moved in the Y-axis direction. Thus, the tape 96 pulled from the coil 96R by the tape pull-out section 108 can be pressed against the annular frame 64.

[0068] After the tape 96 is pressed onto the annular frame 64, the tape bonding unit 98 lowers the Z-axis movable member 136 of the cutting section 112 via the Z-axis feed mechanism, causing the cutter 144 to press against the tape 96 on the annular frame 64, and the pressing roller 146 presses the annular frame 64 from the tape 96. Next, the arm 140 is rotated by the motor 138, moving the cutter 144 and the pressing roller 146 along the annular frame 64 in a circular motion. This allows the tape 96 protruding from the outer periphery of the annular frame 64 to be cut along the annular frame 64. Furthermore, by pressing the annular frame 64 from the tape 96 using the pressing roller 146, positional shift of the annular frame 64 or the tape 96 is prevented when cutting the tape 96. After the frame table 70 is lowered, the used tape 96, which has a circular opening 120 corresponding to the portion bonded to the annular frame 64, is wound up by the tape winding section 106.

[0069] like Figure 5As shown, the frame-supported conveyor unit 100 includes: a Y-axis guide member 148 fixed to a suitable bracket (not shown) and extending along the Y-axis direction; a Y-axis movable member 150 movably supported on the Y-axis guide member 148 in the Y-axis direction; a Y-axis feed mechanism (not shown) that moves the Y-axis movable member 150 in the Y-axis direction; a Z-axis movable member 152 movably supported on the Y-axis movable member 150 in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 152 in the Z-axis direction. The Y-axis feed mechanism of the frame-supported conveyor unit 100 can be configured to have a ball screw connected to the Y-axis movable member 150 and extending along the Y-axis direction, and an electric motor that rotates the ball screw. The Z-axis feed mechanism can be configured to have a ball screw connected to the Z-axis movable member 152 and extending along the Z-axis direction, and an electric motor that rotates the ball screw.

[0070] The Z-axis movable member 152 of the frame conveying unit 100 has a holding portion 154 for holding the frame 64'. In this embodiment, the holding portion 154 has a rectangular base plate 156 and a plurality of suction pads 158 provided on the lower surface of the base plate 156, each suction pad 158 being connected to a suction unit (not shown).

[0071] The tape-containing frame transport unit 100 uses the suction pads 158 of the holding part 154 to attract and hold the upper surface of the tape-containing frame 64' supported on the frame stage 70 with the adhesive surface of the tape 96 facing down, and moves the Y-axis movable part 150 and the Z-axis movable part 152. In this way, the tape-containing frame 64' attracted and held by the holding part 154 is transported from the frame stage 70 to the wafer stage 12. The opening 64a of the annular frame 64 is positioned on the back side 4b of the wafer 4 supported by the wafer stage 12, and the tape-containing frame 64' is placed on the wafer stage 12.

[0072] Reference Figures 7 to 9 The crimping unit 102 will be described below. Figure 7 As shown, the crimping unit 102 includes: an upper chamber 160 disposed above the wafer stage 12; a lower chamber 162 for housing the wafer stage 12; a lifting mechanism 164 for raising and lowering the upper chamber 160 to create a closed state in contact with the lower chamber 162 and an open state away from the lower chamber 162; a vacuum section 166 for creating a vacuum in the closed state of the upper chamber 160 and the lower chamber 162; and an atmospheric opening section 168 for opening the upper chamber 160 and the lower chamber 162 to the atmosphere.

[0073] like Figure 7As shown, the upper chamber 160 of this embodiment includes a circular top plate 170 and a cylindrical sidewall 172 hanging from the periphery of the top plate 170. A lifting mechanism 164, which can be composed of a suitable actuator such as an air cylinder, is mounted on the upper surface of the top plate 170. Within the storage space defined by the lower surface of the top plate 170 and the inner peripheral surface of the sidewall 172, are arranged: a pressing roller 174 for pressing the belt 96 containing the frame 64' onto the back surface 4b of the wafer 4 supported by the wafer stage 12; a support plate 176 for supporting the pressing roller 174 to be rotatable; and a Y-axis feed mechanism 178 for moving the support plate 176 in the Y-axis direction.

[0074] The Y-axis feed mechanism 178 includes a ball screw 180 connected to a support plate 176 and extending along the Y-axis direction, and a motor 182 that rotates the ball screw 180. Furthermore, the Y-axis feed mechanism 178 converts the rotational motion of the motor 182 into linear motion via the ball screw 180 and transmits it to the support plate 176, causing the support plate 176 to move along a pair of guide rails 184 extending in the Y-axis direction.

[0075] like Figure 7 As shown, the lower chamber 162 has a cylindrical sidewall 186, with the upper part of the sidewall 186 open and the lower part closed. A connection opening 188 is formed on the sidewall 186. A vacuum section 166, which can be constructed by a suitable vacuum pump, is connected to the connection opening 188 via a flow path 190. An atmospheric opening section 168, which can be constructed by a suitable valve that allows the flow path 190 to be opened to the atmosphere, is provided on the flow path 190.

[0076] With the tape 96 containing the tape frame 64' positioned on the back side 4b of the wafer 4 supported by the wafer stage 12, the pressing unit 102 lowers the upper chamber 160 via the lifting mechanism 164, so that the lower end of the side wall 172 of the upper chamber 160 contacts the upper end of the side wall 186 of the lower chamber 162, thus closing the upper chamber 160 and the lower chamber 162, and bringing the pressing roller 174 into contact with the tape frame 64'.

[0077] Next, with the pressure unit 102 in a closed state, the valve constituting the atmospheric opening section 168 is closed, causing the vacuum pump constituting the vacuum section 166 to operate, creating a vacuum inside the upper chamber 160 and the lower chamber 162, and then... Figure 8 and Figure 9 As shown, the pressing roller 174 is rotated and moved in the Y-axis direction by the Y-axis feed mechanism 178, thereby pressing the belt 96 onto the back surface 4b of the wafer 4 to form the frame unit U.

[0078] When the tape 96 is pressed onto the back surface 4b of the wafer 4 by the pressing roller 174, a slight gap is formed between the wafer 4 and the tape 96 at the root of the annular reinforcement 24. However, since the wafer 4 and the tape 96 are pressed together while the upper chamber 160 and the lower chamber 162 are in a vacuum state, the pressure of the slight gap between the wafer 4 and the tape 96 is lower than atmospheric pressure. When the atmospheric opening 168 is opened after the tape 96 is pressed together, the tape 96 is pressed onto the wafer 4 by atmospheric pressure. As a result, the gap between the wafer 4 and the tape 96 at the root of the reinforcement 24 disappears, and the tape 96 adheres tightly to the back surface 4b of the wafer 4 along the root of the reinforcement 24.

[0079] like Figure 1 and Figure 10 As shown, the processing apparatus 2 further includes: a frame unit removal unit 192, which removes a frame unit U formed by pressing a strip 96 containing a frame 64' and the back surface 4b of a wafer 4 from the wafer stage 12 via a pressing unit 102; a reinforcement removal unit 194, which cuts off and removes the annular reinforcement 24 from the wafer 4 of the frame unit U removed by the frame unit removal unit 192; and an annular unit removal unit 196 (see reference). Figure 1 ), which removes the acyclic unit from the reinforcement removal unit 194 after the annular reinforcement 24 has been removed; and the frame box platform 200 (see reference) Figure 1 It places the frame box 198 that houses the acyclic unit moved out by the acyclic unit moving out unit 196.

[0080] like Figure 10 As shown, the frame unit removal unit 192 of this embodiment includes: a frame unit holding part 202, which includes a wafer holding part 202a that holds the wafer 4 by exposing all or part of the outer periphery of the wafer 4 and a frame holding part 202b that holds the annular frame 64; and a conveying part 206 that conveys the frame unit holding part 202 to the temporary stage 204.

[0081] The wafer holding portion 202a of the frame unit holding portion 202 includes a circular substrate 208 and an adsorption sheet 210 mounted on the lower surface of the substrate 208. A plurality of adsorption holes (not shown) are formed on the lower surface of the adsorption sheet 210, and each adsorption hole is connected to an adsorption unit (not shown). The shape of the adsorption sheet 210 may, for example, be a circle smaller than the diameter of the wafer 4. The frame holding portion 202b includes a plurality of (four in this embodiment) protruding pieces 212 that protrude radially outward from the periphery of the substrate 208 of the wafer holding portion 202a at circumferential intervals, and adsorption pads 214 attached to the lower surface of the protruding pieces 212, each adsorption pad 214 being connected to an adsorption unit (not shown).

[0082] The transport section 206 includes: an X-axis guide member 216 fixed to a suitable bracket (not shown) and extending along the X-axis direction; an X-axis movable member 218 movably supported on the X-axis guide member 216 in the X-axis direction; an X-axis feed mechanism (not shown) that moves the X-axis movable member 218 in the X-axis direction; a Z-axis movable member 220 movably supported on the X-axis movable member 218 in the Z-axis direction; a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 220 in the Z-axis direction; a Y-axis movable member 222 movably supported on the Z-axis movable member 220 in the Y-axis direction; and a Y-axis feed mechanism (not shown) that moves the Y-axis movable member 222 in the Y-axis direction. A substrate 208 of the wafer holding section 202a is connected to the front end of the Y-axis movable member 222. The X-axis, Y-axis, and Z-axis feed mechanisms of the conveying unit 206 can be configured as having ball screws and electric motors that rotate the ball screws.

[0083] The frame unit removal unit 192 further includes: an imaging unit 224 that captures images of the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding unit 202; and an illumination unit 400 disposed at a position opposite to the imaging unit 224 while the wafer 4 is held in place. In this embodiment, the imaging unit 224 is disposed between the wafer stage 12 and the temporary stage 204, and captures images of the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding unit 202 from below the wafer 4.

[0084] The frame unit removal unit 192 operates the transport unit 206 while the wafer 4 is held from the back side 4b (band 96 side) by the suction tabs 210 of the wafer holding part 202a and the annular frame 64 is held by the suction pads 214 of the frame holding part 202b. This removes the frame unit U held by the frame unit holding part 202 from the wafer stage 12. When the suction tabs 210 of the wafer holding part 202a hold the wafer 4, the entire back side 4b of the wafer 4 is not covered by the suction tabs 210; that is, there is a portion on the back side 4b of the wafer 4 that is not held by the suction tabs 210, and all or part of the outer periphery of the wafer 4 is exposed.

[0085] Furthermore, in this embodiment, the frame unit removal unit 192 operates the transport unit 206, and the imaging unit 224 captures images of at least three points on the exposed portion of the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding unit 202 (the portion not covered by the suction plate 210). This measures the coordinates of at least three points on the outer periphery of the wafer 4, and the center coordinates of the wafer 4 are determined based on the measured coordinates. In this embodiment, all or part of the outer periphery of the wafer 4 held by the suction plate 210 is exposed. Therefore, the illumination unit 400 illuminates the exposed portion of the outer periphery of the wafer 4 from above, and the imaging unit 224 captures images of the exposed portion from below. This allows for a clear capture of the wafer 4's outline and precise determination of the wafer 4's center coordinates. Additionally, the frame unit removal unit 192 aligns the center of the wafer 4 with the center of the temporary stage 204 and temporarily places the frame unit U on the temporary stage 204.

[0086] like Figure 10 As shown, the temporary stage 204 and the wafer stage 12 are spaced apart in the X-axis direction. The temporary stage 204 in this embodiment includes: an annular support portion 226 that supports the remaining outer peripheral region 20 of the wafer 4 of the frame unit U, such that the portion inside the remaining outer peripheral region 20 is not in contact; and a frame support portion 228 disposed on the outer periphery of the annular support portion 226 to support the annular frame 64. The frame support portion 228 includes: a strong permanent magnet 402 having a stronger magnetic force than the permanent magnet of the first lifting stage 246 described later; and a detachment portion 404 that detaches the annular frame magnetically attracted to the strong permanent magnet 402.

[0087] like Figure 10 As shown, the strong permanent magnets 402 are spaced apart in the circumferential direction and housed in the upper end of the frame 406 of the frame support portion 228. (Refer to...) Figure 11 To illustrate, the strong permanent magnet 402 of this embodiment has: a cylindrical main portion 402a, which magnetically attracts a ring-shaped frame using its upper end face; and an annular flange portion 402b, which extends radially outward from the lower end of the main portion 402a. Furthermore, the strong permanent magnet 402 in... Figure 11 The rising position shown in (a) is the same as Figure 11 The lowered position shown in (b) allows for free movement along the vertical direction and storage within the storage hole 406a of the frame 406. (Refer to...) Figure 11 Understandably, in the rising position, the upper surface of the strong permanent magnet 402 is on the same plane as the upper surface of the frame 406; in the falling position, the upper surface of the strong permanent magnet 402 is located approximately 5 mm below the upper surface of the frame 406. Furthermore, the frame 406 is formed of a non-magnetic material.

[0088] like Figure 11As shown, a partition wall 408 is provided in the middle of the vertical direction of the storage hole 406a of the frame 406. This partition wall 408 divides the storage hole 406a of the frame 406 into an upper storage chamber 410 for storing the strong permanent magnet 402 and a lower storage chamber 412 for storing the detachment part 404. A through hole 408a is formed in the center of the partition wall 408.

[0089] A protrusion 410a protruding radially inward is formed on the upper end side of the upper storage chamber 410. For example... Figure 11 As shown in (a), when an upward force is applied to the strong permanent magnet 402 from the disengagement portion 404, the upper end of the flange portion 402b of the strong permanent magnet 402 engages with the lower end of the protrusion 410a, thereby positioning the strong permanent magnet 402 in the raised position. On the other hand, when a downward force is applied to the strong permanent magnet 402 from the disengagement portion 404, as... Figure 11 As shown in (b), the lower surface of the strong permanent magnet 402 contacts the upper surface of the partition wall 408, positioning the strong permanent magnet 402 in a descending position. In addition, an upper opening 412a and a lower opening 412b are formed in the lower storage chamber 412 by being spaced apart in the vertical direction.

[0090] Reference Figure 11 Continuing the description, the release part 404 in this embodiment includes: a rod 414 that extends downward from the lower end of the strong permanent magnet 402 through a through hole 408a; a piston 416 that is fixed to the lower end of the rod 414 and disposed in the lower storage chamber 412; a coil spring 418 that is disposed below the piston 416; and a compressed air supply source 413 that is connected to the upper opening 412a of the lower storage chamber 412.

[0091] In the release section 404, compressed air supply from the compressed air supply source 413 to the lower receiving chamber 412 is stopped, and the piston 416 is pushed upward by the coil spring 418. This applies an upward force to the strong permanent magnet 402, causing it to rise relative to the frame 406. The strong permanent magnet 402 is positioned in an upward position where it can magnetically attract the annular frame 64 mounted on the frame support 228. Alternatively, in the release section 404, compressed air supply from the compressed air supply source 413 to the lower receiving chamber 412 presses the piston 416 downward. This applies a downward force to the strong permanent magnet 402, causing it to descend relative to the frame 406. The strong permanent magnet 402 is positioned in a downward position where the annular frame 64 mounted on the frame support 228 can detach from the strong permanent magnet 402. Furthermore, pressing the piston 416 downward expels air from the lower opening 412b.

[0092] like Figure 10As shown, a plurality of suction holes 229 are formed on the upper surface of the annular support portion 226 of the temporary stage 204, arranged at circumferential intervals. Each suction hole 229 is connected to a suction unit (not shown). Furthermore, the annular support portion 226 is configured such that its upper surface is on the same plane as the upper surface of the frame support portion 228 in an elevated position. Figure 10 The position shown) and the upper surface of the annular support 226 are freely movable between a lower position, for example, about 5mm to 10mm below the upper surface of the frame support 228. The lifting unit (not shown) that raises and lowers the annular support 226 can be a suitable actuator such as an air cylinder. The portion radially inward of the annular support 226 is a downwardly recessed circular recess 230. Preferably, the frame support 228 of the temporary stage 204 has a heater (not shown), which heats the belt 96 of the frame unit U temporarily placed on the temporary stage 204, softening the belt 96, and using atmospheric pressure to make the belt 96 adhere more tightly to the root of the annular reinforcement 24.

[0093] The processing apparatus 2 of this embodiment includes a temporary table conveying section 232 that conveys a temporary table 204 in the Y-axis direction. The temporary table conveying section 232 includes: a Y-axis guide member 234 extending in the Y-axis direction; a Y-axis movable member 236 movably supported on the Y-axis guide member 234 in the Y-axis direction; and a Y-axis feed mechanism 238 that moves the Y-axis movable member 236 in the Y-axis direction. The temporary table 204 is fixed to the upper part of the Y-axis movable member 236. The Y-axis feed mechanism 238 includes a ball screw 240 connected to the Y-axis movable member 236 and extending in the Y-axis direction, and a motor 242 that rotates the ball screw 240. Furthermore, the temporary platform conveying unit 232 converts the rotational motion of the motor 242 into linear motion through the ball screw 240 and transmits it to the Y-axis movable component 236, and together with the Y-axis movable component 236, it conveys the temporary platform 204 in the Y-axis direction.

[0094] like Figure 1 and Figure 10 As shown, the enhancement removal unit 194 includes: a laser beam irradiation unit 244, which irradiates a laser beam toward the root of the annular enhancement portion 24 formed on the outer periphery of the wafer 4 to form a cutting groove; a first lifting platform 246 (see reference 244). Figure 1 The frame unit 244 is positioned by holding the frame unit U temporarily placed on the temporary stage 204 and raising and moving the frame unit U in the X-axis direction; and the separation part 248 separates the annular reinforcement part 24 from the cutting groove.

[0095] like Figure 10As shown, the laser beam irradiation unit 244 includes: a housing 250 disposed adjacent to the temporary stage 204 in the X-axis direction; a laser oscillator (not shown) housed in the housing 250 and oscillating laser beams; a concentrator 252 that focuses the laser beams emitted from the laser oscillator to irradiate the root of the annular reinforcement portion 24 formed on the outer periphery of the wafer 4; an attraction nozzle 254 that attracts debris generated when irradiating the wafer 4 with laser beams; and an attraction unit (not shown) connected to the attraction nozzle 254.

[0096] The concentrator 252 extends upward from the upper surface of the housing 250 toward the suction nozzle 254, thereby suppressing debris generated during laser beam irradiation from falling onto the concentrator 252. Additionally, the suction nozzle 254 extends upward from the upper surface of the housing 250 toward the concentrator 252.

[0097] like Figure 12 As shown, the laser beam irradiation unit 244 rotates the frame unit U held by the first lifting platform 246 while irradiating laser beam LB toward the root of the annular reinforcement portion 24 formed on the outer periphery of the wafer 4, thereby forming an annular cutting groove 256 along the root of the reinforcement portion 24 through ablation. In addition, the laser beam irradiation unit 244 attracts the debris generated during the ablation process through the suction nozzle 254.

[0098] like Figure 1 As shown, the first lifting platform 246 is configured to move freely along the X-axis and the Z-axis above the temporary platform 204. (Refer to...) Figure 13 The first lifting platform 246 includes: an X-axis guide member 258 fixed to a suitable bracket (not shown) and extending along the X-axis direction; an X-axis movable member 260 movably supported on the X-axis guide member 258 in the X-axis direction; an X-axis feed mechanism (not shown) that moves the X-axis movable member 260 in the X-axis direction; a Z-axis movable member 262 movably supported on the X-axis movable member 260 in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 262 in the Z-axis direction. The X-axis and Z-axis feed mechanisms of the first lifting platform 246 can be configured as having a ball screw and an electric motor that rotates the ball screw, respectively.

[0099] A downwardly extending support shaft 264 is rotatably supported on the lower front surface of the Z-axis movable component 262. A motor 266 is mounted on the upper front surface of the Z-axis movable component 262 to rotate the support shaft 264 about an axis extending along the Z-axis direction. A circular retaining member 420 is fixed to the lower end of the support shaft 264.

[0100] like Figure 13As shown in (b), the holding member 420 has: a small-diameter wafer holding portion 422, which is smaller than the outer diameter of the wafer 4, exposing the annular reinforcement portion 24; a frame support portion 426, which has a permanent magnet 424 for magnetically adsorbing the annular frame 64; and a space 428, which allows the leakage of laser light to diffuse between the wafer holding portion 422 and the frame support portion 426.

[0101] Reference Figure 13 (b) Continuing the description, the wafer holding portion 422 is disposed at the center of the lower surface of the holding member 420, and the diameter of the wafer holding portion 422 is slightly smaller than the diameter of the device region 18 of the wafer 4 (the portion inside the annular reinforcement portion 24). A circular suction chuck 430 made of porous material is provided at the lower end of the wafer holding portion 422, and the suction chuck 430 is connected to the suction unit (not shown).

[0102] A frame support portion 426 is disposed on the outer periphery of the holding member 420. A plurality of permanent magnets 424 (four in this embodiment) are spaced apart circumferentially at the lower end of the frame support portion 426. The magnetic force of these permanent magnets 424 is weaker than that of the strong permanent magnet 402 of the temporary stage 204. Furthermore, an upwardly recessed annular recess is formed between the wafer holding portion 422 on the lower surface of the holding member 420 and the frame support portion 426, creating a space 428 through which laser light leakage diffuses.

[0103] The first lifting platform 246 uses the permanent magnet 424 of the frame support 426 to hold the annular frame 64 of the frame unit U, which is obtained by heating the belt 96 through the heater of the frame support 228 of the temporary stage 204 and making the belt 96 stick tightly to the root of the annular reinforcement 24. The wafer 4 is attracted and held by the adsorption chuck 430 of the wafer holding part 422. Then, the Z-axis movable part 262 and the X-axis movable part 260 are moved, so that the frame unit U held by the holding part 420 rises and moves in the X-axis direction to be positioned in the laser beam irradiation unit 244.

[0104] Furthermore, when holding the frame unit U using the holding member 420 of the first lifting platform 246, the strong permanent magnet 402 of the frame support 228 of the temporary platform 204 is prepositioned in the lowering position, thereby causing the strong permanent magnet 402 to leave the annular frame 64. For the annular frame 64 placed on the temporary platform 204, the magnetic force exerted by the permanent magnet 424 of the first lifting platform 246 that is in contact with the annular frame 64 is stronger than the magnetic force exerted by the strong permanent magnet 402 of the temporary platform 204.

[0105] Furthermore, when the first lifting platform 246 irradiates the wafer 4 with laser beam LB through the laser beam irradiation unit 244, the motor 266 is activated, causing the frame unit U held by the holding member 420 to rotate. Additionally, the first lifting platform 246 moves the frame unit U, which has a cutting groove 256 formed at the root of the reinforcement 24, in the X-axis and Z-axis directions and temporarily places it on the temporary stage 204. Furthermore, since debris adheres to the outer periphery of the wafer 4 due to the irradiation of the laser beam LB, when transferring the frame unit U from the first lifting platform 246 to the temporary stage 204, it is preferable to activate only the strong permanent magnet 402 to stop the temporary stage 204 from attracting the annular support 226. This prevents debris from adhering to the attraction hole 229 of the annular support 226. Furthermore, from the viewpoint of preventing debris from adhering to the attraction hole 229, it is preferable to pre-position the annular support 226 in the lowered position.

[0106] like Figure 1 As shown, the separation section 248 is arranged at a distance from the first lifting platform 246 in the Y-axis direction within the movable range of the temporary platform 204. (Refer to...) Figure 14 and Figure 16 As explained, the separation section 248 includes: an ultraviolet irradiation section 270 (see reference). Figure 14 ), which irradiates the strip 96 corresponding to the cutting groove 256 with ultraviolet light, thereby reducing the adhesion of the strip 96; the second lifting platform 272 (refer to Figure 14 This allows the annular reinforcement 24 to be exposed on the outer periphery, attracting and holding the inner side of the wafer 4, and supporting the annular frame 64; separator 274 (see reference) Figure 14 ), which acts on the outer periphery of the annular reinforcement 24 to separate the annular reinforcement 24; and the discarded part 276 (see Figure 16 ), which discards the separated annular reinforcement 24.

[0107] like Figure 14 As shown, the separation section 248 of this embodiment includes: a Z-axis guide member 278, which is fixed to a suitable bracket (not shown) and extends along the Z-axis direction; a Z-axis movable member 280, which is movably supported on the Z-axis guide member 278 in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 280 in the Z-axis direction. The Z-axis feed mechanism may be configured to have a ball screw connected to the Z-axis movable member 280 and extending along the Z-axis direction, and an electric motor that rotates the ball screw.

[0108] A support plate 282 is supported on the lower front surface of the Z-axis movable member 280, and a support shaft 286 is rotatably supported thereon. The second lifting platform 272 is connected to the support shaft 286. A motor 284 is mounted on the upper front surface of the Z-axis movable member 280 to rotate the second lifting platform 272 together with the support shaft 286. In this embodiment, a pair of ultraviolet irradiation sections 270 are provided on the support plate 282 at intervals in the Y-axis direction.

[0109] The second lifting platform 272 is circular, and its diameter is slightly smaller than that of the device region 18 of the wafer 4 (the portion inside the annular reinforcement 24). Multiple suction holes (not shown) are formed on the lower surface of the second lifting platform 272, and each suction hole is connected to a suction unit.

[0110] Additionally, the aforementioned separator 274 is mounted on the support plate 282. The separator 274 comprises: a pair of movable plates 288 spaced apart and movably disposed on the lower surface of the support plate 282 along its length; and a pair of feed units 290 that move the pair of movable plates 288. The pair of feed units 290 may each be configured with a suitable actuator, such as an air cylinder or an electric cylinder.

[0111] Separator 274 includes: a pair of clamping rollers 292a and 292b, spaced apart vertically and supported on each movable piece 288; and a Z-axis feed mechanism 294 that moves the upper clamping roller 292a in the Z-axis direction. The Z-axis feed mechanism 294 can be configured with a suitable actuator such as an air cylinder or an electric cylinder. Each clamping roller 292a and 292b is rotatably supported on the movable piece 288 about an axis extending along the Y-axis direction. A pressing roller 298 is mounted on the upper clamping roller 292a via a support shaft 296.

[0112] Reference Figure 16 As described, the waste section 276 includes: a belt conveyor 300 for conveying the separated annular reinforcements 24; and a dust collection box 302 for receiving the annular reinforcements 24 conveyed by the belt conveyor 300. The belt conveyor 300 is positioned at a substantially horizontally extending recycling location by means of a suitable actuator (not shown). Figure 16 The position shown by the solid line) and the standby position that is essentially vertically extended ( Figure 16 (The position indicated by the double-dotted line). Figure 16In the dust collection box 302, a door 304 with a handle 304a is provided on the side near the front in the X-axis direction. Inside the dust collection box 302, a crusher (not shown) is installed to crush the collected annular reinforcing parts 24. By holding the handle 304a in the dust collection box 302, the door 304 can be opened, thereby allowing the crushed debris from the annular reinforcing parts 24 collected in the dust collection box 302 to be removed.

[0113] When the temporary placement table 204, on which the frame unit U, in which the cutting groove 256 is formed at the root of the reinforcing section 24, is positioned below the separating section 248 by the temporary placement table conveying section 232, as Figure 15 As shown, the separation section 248 attracts and holds the back side 4b of the wafer 4 of the frame unit U via the second lifting platform 272, and the annular frame 64 is clamped by the clamping rollers 292a and 292b of the separator 274. Ultraviolet light is then irradiated from a pair of ultraviolet irradiation sections 270 to reduce the adhesive force of the tape 96 adhered to the annular reinforcement 24. The annular reinforcement 24 is pressed downwards by the pressing roller 298, while the frame unit U, support shaft 286, and second lifting platform 272 are rotated relative to the separator 274 by the motor 284, thereby separating the annular reinforcement 24 from the frame unit U. The separated reinforcement 24 is transported to the dust collection box 302 by the belt conveyor 300 for recycling. Alternatively, the separator 274 can be rotated relative to the frame unit U during the separation of the reinforcement 24.

[0114] like Figure 1 As shown, the acyclic unit removal unit 196 and the reinforcement removal unit 194 are arranged adjacent to each other. (Refer to...) Figure 17 and Figure 18 As explained, the ringless unit transfer unit 196 of this embodiment includes: a flipping mechanism 308 (see reference 196). Figure 17 It has a frame holding part 306 that faces the ringless unit supported by the second lifting platform 272 and holds the annular frame 64. The flipping mechanism 308 moves toward the frame box platform 200 and flips the frame holding part 306; the ringless unit support part 310 (see reference) Figure 18 ), which supports the ringless unit with the front side 4a of the wafer 4 facing upwards, which is flipped by the flipping mechanism 308; and the push-in part 312 (see Figure 18 This allows the acyclic unit supported by the acyclic unit support 310 to enter the frame box 198 placed on the frame box platform 200 for storage.

[0115] like Figure 17As shown, the flipping mechanism 308 includes: a Y-axis guide member 314 extending along the Y-axis direction; a Y-axis movable member 316 movably supported on the Y-axis guide member 314 in the Y-axis direction; a Y-axis feed mechanism (not shown) that moves the Y-axis movable member 316 in the Y-axis direction; an arm 318 movably supported on the Y-axis movable member 316 in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the arm 318 in the Z-axis direction. The Y-axis and Z-axis feed mechanisms of the flipping mechanism 308 can be configured as having a ball screw and an electric motor that rotates the ball screw, respectively.

[0116] The frame holding portion 306 is supported on the arm 318 and can be rotated up and down freely, and a motor 320 is installed to rotate the frame holding portion 306 up and down. The frame holding portion 306 in this embodiment includes: a base plate 324, which is rotatably supported on the arm 318 by means of a pair of rotating shafts 322; and a plurality of suction pads 326, which are attached to one surface of the base plate 324, each suction pad 326 being connected to a suction unit (not shown). Additionally, one of the rotating shafts 322 is connected to the motor 320.

[0117] The flipping mechanism 308, with the suction pad 326 facing upwards, uses the suction pad 326 to attract and hold the lower surface of the annular frame 64 of the acyclic unit U' supported by the second lifting platform 272, and receives the acyclic unit U' from the second lifting platform 272. Additionally, the flipping mechanism 308 uses the motor 320 to flip the frame holding part 306 so that the front surface 4a of the wafer 4 faces upwards, and then moves the Y-axis movable member 316, thereby moving the acyclic unit U' held by the frame holding part 306 toward the frame box stage 200.

[0118] like Figure 18 As shown, the ringless unit support 310 of this embodiment includes: a pair of support plates 328, which are supported by suitable brackets (not shown) to be movable in the X-axis direction; and a spacing adjustment unit (not shown) that adjusts the spacing of the pair of support plates 328 in the X-axis direction. The spacing adjustment unit may be composed of a suitable actuator such as an air cylinder or an electric cylinder.

[0119] Heaters (not shown) are mounted on a pair of support plates 328 that support the acyclic unit U'. When the pair of support plates 328 are narrowly spaced, the pair of support plates 328 heat the belt 96 of the acyclic unit U' through the heaters, thereby causing the slack and wrinkles in the belt 96 caused by the removal of the reinforcement 24 to stretch.

[0120] Reference Figure 18Continuing the description, the push-in portion 312 of this embodiment includes: a Y-axis guide member 330 extending along the Y-axis direction; a Y-axis movable member 332 movably supported on the Y-axis guide member 330 in the Y-axis direction; and a Y-axis feed mechanism (not shown) that moves the Y-axis movable member 332 in the Y-axis direction. The Y-axis movable member 332 has: a base 334 supported on the Y-axis guide member 330; a support column 336 extending upward from the upper surface of the base 334; and a pressing piece 338 attached to the upper end of the support column 336. The Y-axis feed mechanism of the push-in portion 312 can be configured to have a ball screw connected to the Y-axis movable member 332 and extending along the Y-axis direction, and an electric motor for rotating the ball screw.

[0121] like Figure 19 As shown, the acyclic unit support 310 expands the gap between a pair of support plates 328 by the gap adjustment unit before receiving the acyclic unit U', and then receives the acyclic unit U' held by the suction pad 326. Furthermore, the push-in part 312 moves the Y-axis movable member 332 in the Y-axis direction by the Y-axis feed mechanism, thereby causing the acyclic unit U' supported by the acyclic unit support 310 to enter the frame box 198 placed on the frame box stage 200 for storage by the pressing piece 338.

[0122] exist Figure 1 and Figure 19 The frame box 198 shown contains multiple acyclic cells U' spaced vertically with the front side 4a of the wafer 4 facing upwards. For example... Figure 18 and Figure 19 As shown, the frame box platform 200 includes: a mounting section 340 for mounting the frame box 198; and a lifting section 342 for raising and lowering the mounting section 340 to a position at any height. The lifting section 342 may be configured to have a ball screw connected to the mounting section 340 and extending along the Z-axis direction, and an electric motor for rotating the ball screw.

[0123] Next, the following processing method will be described: Using the processing apparatus 2 as described above, the dicing tape 96 is attached to the back surface 4b of the wafer 4, on which a ring-shaped reinforcement portion 24 is formed in a convex shape on the back surface 4b corresponding to the outer peripheral remaining area 20, and becomes integral with the ring frame 64, and the ring-shaped reinforcement portion 24 is cut off and removed from the wafer 4.

[0124] In this embodiment, firstly as follows Figure 1 and Figure 3 As shown, a wafer cassette 6 containing multiple wafers 4 is placed on a wafer cassette stage 8. Multiple wafers 4 are stored in the cassette 6 with their front side 4a facing upwards and spaced apart in the vertical direction.

[0125] In addition, such as Figure 1and Figure 5 As shown, a frame storage process is performed in which multiple annular frames 64, each having an opening 64a for receiving wafers 4, are stored in a frame storage unit 66. The frame storage process can be performed before or after the wafer cassette loading process.

[0126] In the frame storage process, after the lifting plate 74 of the frame storage unit 66 is lowered to any position, the handle 76a is grasped to open the door 76, and multiple ring-shaped frames 64 are stacked on the upper surface of the lifting plate 74 for storage. In addition, the height of the lifting plate 74 is appropriately adjusted so that the uppermost ring-shaped frame 64 is positioned so that it can be moved out by the frame removal unit 68.

[0127] After the wafer cassette placement process and the frame storage process are performed, a wafer removal process is performed to remove the wafer 4 from the wafer cassette 6 placed on the wafer cassette stage 8.

[0128] Reference Figure 3 To explain, in the wafer unloading process, the Y-axis feed mechanism 34 of the wafer unloading unit 10 is first activated to position the Y-axis movable part 32 near the wafer cassette stage 8. Next, the transfer arm 42 is driven to position the hand 44, with the air nozzle 46 facing upwards, on the back side 4b (lower side) of the wafer 4 inside the wafer cassette 6. When positioning the hand 44 on the back side 4b of the wafer 4, a gap is pre-established between the back side 4b of the wafer 4 and the hand 44, and each guide pin 48 is positioned radially outwards.

[0129] Next, compressed air is ejected from the air outlet 46 of the hand 44, creating a negative pressure on one side of the hand 44 through the Bernoulli effect. The hand 44 then draws and supports the wafer 4 from the back side 4b in a non-contact manner. Next, each guide pin 48 is moved radially inward, restricting the horizontal movement of the wafer 4 supported by the hand 44. Then, the Y-axis movable member 32 and the conveying arm 42 of the wafer removal unit 10 are moved to remove the wafer 4 supported by the hand 44 from the wafer cassette 6.

[0130] After the wafer removal process, it is preferable to perform a cut detection process to detect the position of the cut 26 on the wafer 4. In the cut detection process, such as... Figure 4 As shown, the outer periphery of the wafer 4, which is attracted and supported by the hand 44, is positioned between the light-emitting element 52 and the light-receiving element 54 of the cut detection mechanism 50. Next, using a drive source, the wafer 4 is rotated via the guide pin 48, thereby detecting the position of the cut 26 on the wafer 4. This allows the orientation of the wafer 4 to be adjusted to any desired orientation.

[0131] After the cut detection process is performed, a wafer support process is performed in which the front side 4a of the wafer 4 moved out by the wafer removal unit 10 is supported by the wafer stage 12.

[0132] Reference Figure 3 To explain, in the wafer support process, the handle 44 of the wafer removal unit 10 is first flipped up and down so that the front surface 4a of the wafer 4 faces downwards. Next, the Y-axis movable component 32 and the conveying arm 42 of the wafer removal unit 10 are moved so that the remaining peripheral area 20 of the front surface 4a of the wafer 4, which is attracted and supported by the handle 44, comes into contact with the annular support portion 56 of the wafer stage 12. At this time, the device area 18 of the front surface 4a of the wafer 4 is positioned in the recess 62 of the wafer stage 12, so the device 14 and the wafer stage 12 do not contact each other, preventing damage to the device 14.

[0133] Next, the suction unit of the wafer stage 12 is activated, generating suction at each suction hole 60, thereby attracting and holding the remaining peripheral area 20 of the front side 4a of the wafer 4. Then, the suction support of the hand 44 on the wafer 4 is released, and the hand 44 is removed from the wafer stage 12. In this way, the wafer 4 is transferred from the wafer removal unit 10 to the wafer stage 12. The wafer 4 transferred to the wafer stage 12 is attracted and held by each suction hole 60, so the position of the wafer 4 will not shift.

[0134] In addition, after the wafer cassette placement process and the frame storage process are performed, a frame removal process is performed in parallel with the wafer removal process and the wafer support process to remove the annular frame 64 from the frame storage unit 66.

[0135] Reference Figure 5 To explain, in the frame removal process, firstly, the X-axis movable member 84 and the Z-axis movable member 86 of the frame removal unit 68 are moved, causing the suction pad 92 of the holding part 88 to contact the upper surface of the uppermost annular frame 64 stored in the frame storage unit 66. Next, the suction unit of the frame removal unit 68 is activated, generating an attraction force on the suction pad 92, thereby using the suction pad 92 to attract and hold the uppermost annular frame 64. Then, the X-axis movable member 84 and the Z-axis movable member 86 of the frame removal unit 68 are moved, removing the uppermost annular frame 64 attracted and held by the suction pad 92 of the holding part 88 from the frame storage unit 66.

[0136] After the frame removal process is carried out, a frame support process is carried out, in which the annular frame 64 removed by the frame removal unit 68 is supported by the frame platform 70.

[0137] Reference Figure 5Continuing the explanation, in the frame support process, firstly, the X-axis movable part 84 and the Z-axis movable part 86 of the frame removal unit 68 are moved, so that the annular frame 64 held by the suction pad 92 comes into contact with the upper surface of the frame platform 70. At this time, the frame platform 70 is pre-positioned in the lowering position ( Figure 5 (The position is shown by the solid line in the middle). Next, the attraction of the suction pad 92 of the frame removal unit 68 is released, and the annular frame 64 is placed on the frame table 70. Then, the X-axis movable member 84 and the Z-axis movable member 86 of the frame removal unit 68 are moved so that the holding part 88 moves away from the top of the frame table 70.

[0138] After the frame support process is performed, the tape 96 is attached to the annular frame 64.

[0139] Reference Figure 6 To explain, in the pasting process, first, the frame platform 70 is lowered from the lower position ( Figure 6 The position shown in (a) is moved to the rising position where the tape 96 can be attached to the ring frame 64. Figure 6 Before the position shown in (b), the tape 96 is pre-pulled out from the roll 96R and the tape 96 with the release paper 116 peeled off is positioned above the frame table 70. In addition, the adhesive side of the tape 96 located above the frame table 70 is facing down.

[0140] Next, the frame platform 70 is raised so that the tape 96 can be pressed against the annular frame 64 from above by the pressing roller 132 of the pressing section 110 with the adhesive unit 98. Meanwhile, the pressing roller 132 is rotated in the Y-axis direction while pressing the adhesive surface of the tape 96 against the annular frame 64 using the pressing roller 132. Thus, the tape 96 pulled from the coil tape 96R by the tape pull-out section 108 can be pressed onto the annular frame 64.

[0141] Next, the cutter 144 and the pressing roller 146 of the cutting section 112 with the adhesive unit 98 are lowered, pressing the cutter 144 onto the strip 96 on the annular frame 64, and the pressing roller 146 presses the annular frame 64 from the strip 96. Then, the arm 140 is rotated by the motor 138, causing the cutter 144 and the pressing roller 146 to move in a circular motion along the annular frame 64. This allows the strip 96, which protrudes from the outer periphery of the annular frame 64, to be cut along the annular frame 64. Furthermore, by pressing the annular frame 64 from the strip 96 using the pressing roller 146, positional shift of the annular frame 64 and the strip 96 is prevented when cutting the strip 96. Finally, the used strip 96, which has a circular opening 120, is wound up by the strip winding section 106.

[0142] After the tape bonding process is performed, the tape-containing frame transfer process is performed: the annular frame 64 with the tape 96 bonded is transferred to the wafer stage 12, the opening 64a of the annular frame 64 is positioned on the back side 4b of the wafer 4 supported by the wafer stage 12, and the tape-containing frame 64' is placed on the wafer stage 12.

[0143] In the process involving the frame conveying, the frame table 70 is first moved from the rising position to the falling position. Next, the frame conveying unit 100 (refer to...) is... Figure 5 The Y-axis movable component 150 and Z-axis movable component 152 of the conveyor unit 100 move, causing each suction pad 158 of the holding portion 154 of the conveyor unit 100 to move with the frame 64' (see reference) supported on the frame platform 70 with the adhesive surface of the belt 96 facing downwards. Figure 7 The upper surface of the ) is in contact.

[0144] Next, the suction unit of the conveyor unit 100 containing the strap frame is activated to generate an attractive force on the suction pad 158, thereby attracting and holding the upper surface of the strap frame 64' using the suction pad 158. Then, the Y-axis movable part 150 and the Z-axis movable part 152 of the conveyor unit 100 containing the strap frame are moved to remove the strap frame 64' attracted and held by the suction pad 158 from the frame table 70.

[0145] Next, the tape-containing frame 64', held by the suction pad 158 of the tape-containing frame transfer unit 100, is transferred to the wafer stage 12, as follows. Figure 7 As shown, the opening 64a of the frame 64 is positioned on the back surface 4b of the wafer 4 supported by the wafer stage 12, so that the tape-containing frame 64' contacts the frame support portion 58 of the wafer stage 12. At this time, the adhesive surface of the tape 96 of the tape-containing frame 64' faces downward, and the back surface 4b of the wafer 4 faces upward and is opposite to the adhesive surface of the tape 96.

[0146] Next, the attraction of the suction pad 158 of the tape-frame transport unit 100 is released, and the tape-frame 64' is placed on the frame support portion 58 of the wafer stage 12. Then, the Y-axis movable member 150 and the Z-axis movable member 152 of the tape-frame transport unit 100 are moved, so that the holding portion 154 moves away from above the wafer stage 12.

[0147] After the conveying process including the tape frame is performed, a tape pressing process is performed to press the tape 96 including the tape frame 64' onto the back side 4b of the wafer 4.

[0148] Reference Figures 7 to 9To explain, in the belt crimping process, the upper chamber 160 is first lowered by the lifting mechanism 164 of the belt crimping unit 102, causing the lower end of the side wall 172 of the upper chamber 160 to contact the upper end of the side wall 186 of the lower chamber 162. This closes the upper and lower chambers 160, and brings the pressing roller 174 into contact with the belt-containing frame 64'. Thus, as... Figure 8 As shown, the upper end of the annular reinforcing part 24 of the wafer 4 is attached to the adhesive surface of the strip 96 containing the frame 64'.

[0149] Next, with the atmospheric opening 168 of the crimping unit 102 closed, the vacuum section 166 is activated, creating a vacuum inside the upper chamber 160 and the lower chamber 162. Then, as... Figure 8 and Figure 9 As shown, the pressing roller 174 of the pressing unit 102 is rotated and moved in the Y-axis direction, thereby pressing the strip 96 onto the back surface 4b of the wafer 4. This generates a frame unit U formed by pressing the back surface 4b of the wafer 4 and the strip 96 together. Next, the atmospheric opening 168 is opened, and atmospheric pressure is used to press the strip 96 tightly against the back surface 4b of the wafer 4 along the root of the annular reinforcement 24. Furthermore, the upper chamber 160 is raised by the lifting mechanism 164. Additionally, the interiors of the upper chamber 160 and the lower chamber 162 are made into a vacuum, thereby eliminating the attraction of the wafer stage 12 on the wafer 4. However, when the upper chamber 160 and the lower chamber 162 are closed, the upper end of the annular reinforcement 24 of the wafer 4 is adhered to the bonding surface of the strip 96 containing the strip frame 64', thus preventing the wafer 4 from shifting position during the strip pressing process.

[0150] After the crimping process is performed, a frame unit removal process is performed to remove the frame unit U from the wafer stage 12. The frame unit U is obtained by crimping the strip 96 containing the strip frame 64' and the back surface 4b of the wafer 4.

[0151] Reference Figure 5 To explain, in the frame unit removal process, the conveying part 206 of the frame unit removal unit 192 is first activated, so that the lower surface of the adsorption sheet 210 of the wafer holding part 202a of the frame unit holding part 202 contacts the strip 96 on the back side 4b of the wafer 4, and the suction pad 214 of the frame holding part 202b contacts the annular frame 64.

[0152] Next, an attraction force is generated on the suction plate 210 of the wafer holding section 202a and the attraction pad 214 of the frame holding section 202b. With all or part of the outer periphery of the wafer 4 exposed, the wafer 4 is attracted and held from the back side 4b side (band 96 side) by the suction plate 210 of the wafer holding section 202a, and the annular frame 64 is attracted and held by the attraction pad 214 of the frame holding section 202b. Then, the attraction and holding of the wafer stage 12 on the wafer 4 is released. Then, the transfer section 206 is activated to remove the frame unit U held by the frame unit holding section 202 from the wafer stage 12.

[0153] After the frame unit removal process is performed, a temporary placement process is performed to align the center of the wafer 4 with the center of the temporary placement stage 204 and temporarily place the frame unit U on the temporary placement stage 204.

[0154] Reference Figure 10 To explain, in the temporary placement process, the frame unit U held by the frame unit holding part 202 is first positioned above the imaging part 224. Next, the conveying part 206 of the frame unit removal unit 192 is activated, and the imaging part 224 captures images of at least three exposed portions of the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding part 202. While the imaging part 224 captures images of the wafer 4 from below, the illumination part 400 illuminates the wafer 4 from above. This allows the coordinates of at least three points on the outer periphery of the wafer 4 to be measured. Then, based on the measured coordinates of the three points, the center coordinates of the wafer 4 are determined. Because the wafer 4, held by the suction plate 210 of the wafer holding part 202a, is exposed in whole or in part, and the exposed portions of the outer periphery of the wafer 4 are illuminated from above by the illumination part 400, and the exposed portions of the outer periphery of the wafer 4 are captured from below by the imaging part 224, the outline of the wafer 4 can be clearly captured, and the center coordinates of the wafer 4 can be accurately determined.

[0155] Next, the transport unit 206 is activated to position the center of the wafer 4 at the center of the annular support portion 226 of the temporary stage 204. The remaining peripheral area 20 of the front surface 4a of the wafer 4 is brought into contact with the upper surface of the annular support portion 226 of the temporary stage 204, and the lower surface of the annular frame 64 is brought into contact with the upper surface of the frame support portion 228 of the temporary stage 204. The annular frame 64 is held in place by the magnetic force of the strong permanent magnet 402. At this time, the strong permanent magnet 402 and the annular support portion 226 are pre-positioned in the raised position. Next, the attraction unit of the temporary stage 204 is activated to generate attraction at each attraction hole 229, thereby attracting and holding the remaining peripheral area 20 of the front surface 4a of the wafer 4. Furthermore, at this time, the front surface 4a of the wafer 4 faces downwards, but the device region 18 is located in the recess 230 of the temporary stage 204, so the device 14 and the temporary stage 204 do not contact each other, preventing damage to the device 14.

[0156] Next, the wafer holding part 202a releases its attraction to the wafer 4, and the frame holding part 202b releases its attraction to the annular frame 64, transferring the frame unit U from the frame unit removal unit 192 to the temporary stage 204. Then, the heater of the frame support part 228 is activated, heating the strip 96 of the frame unit U temporarily placed on the temporary stage 204. This softens the strip 96, causing it to adhere tightly to the root of the annular reinforcement part 24 of the wafer 4.

[0157] After the temporary placement process is performed, an enhancement removal process is performed to cut off the annular enhancement portion 24 from the wafer 4 of the frame unit U that has been moved out through the frame unit removal unit 192.

[0158] Reference Figure 1 , Figure 10 and Figure 13To explain, in the reinforcement removal process, firstly, the X-axis movable member 260 and Z-axis movable member 262 of the first lifting platform 246 of the reinforcement removal unit 194 are moved, causing the lower surface of the permanent magnet 424 of the holding member 420 of the first lifting platform 246 to contact the upper surface of the annular frame 64 of the frame unit U temporarily placed on the temporary stage 204. The annular frame 64 is held by the magnetic force of the permanent magnet 424, and the lower surface of the adsorption chuck 430 contacts the back side 4b (band 96 side) of the wafer 4, holding the wafer 4 by the attractive force of the adsorption chuck 430. Next, the strong permanent magnet 402 of the temporary stage 204 is positioned in the lowered position, and the attractive force of the annular support 226 is released. Then, the first lifting platform 246, which holds the frame unit U by attraction, is raised. As described above, the magnetic force of the permanent magnet 424 of the holding component 420 is less than the magnetic force of the strong permanent magnet 402 of the temporary stage 204. When the strong permanent magnet 402 is positioned in the lowering position, the strong permanent magnet 402 leaves the annular frame 64. Therefore, the magnetic force of the strong permanent magnet 402 acting on the annular frame 64 is weakened, which makes it easier for the frame unit U to detach from the temporary stage 204.

[0159] Next, the X-axis movable component 260 and Z-axis movable component 262 of the first lifting platform 246 are moved, such as... Figure 12 As shown, the frame unit U held by the holding member 420 of the first lifting platform 2 is positioned above the laser beam irradiation unit 244. Next, the focusing point of the laser beam LB is positioned at the root of the annular reinforcement portion 24 of the wafer 4 of the frame unit U.

[0160] Next, while rotating the holding member 420 and the frame unit U via the motor 266 of the first lifting platform 246, a laser beam LB is irradiated at the root of the annular reinforcement 24 of the wafer 4. This allows for ablation of the root of the annular reinforcement 24 of the wafer 4 to form an annular cutting groove 256. Light leakage through the wafer 4 and the laser beam LB diffuses in the space 428 between the wafer holding member 422 and the frame support member 426, thus reducing the adverse effects on the device 14 of the wafer 4 caused by the aforementioned light leakage. Furthermore, while irradiating the wafer 4 with the laser beam LB, the suction unit of the laser beam irradiation unit 244 is activated to generate an attraction force at the suction nozzle 254, which then attracts debris generated during the ablation process.

[0161] Next, the X-axis movable member 260 and Z-axis movable member 262 of the first lifting platform 246 are moved, so that the lower surface of the annular frame 64 of the frame unit U held by the holding member 420 contacts the upper surface of the frame support portion 228 of the temporary stage 204, thereby holding the annular frame 64 by the magnetic force of the strong permanent magnet 402 positioned in the raised position. At this time, in order to prevent debris attached to the outer periphery of the wafer 4 from adhering to the suction hole 229, it is preferable to pre-position the annular support portion 226 in the lowered position so as not to generate an attraction force in the suction hole 229 of the annular support portion 226. Next, after releasing the attraction force of the suction chuck 430 of the first lifting platform 246, the holding member 420 is raised. As described above, the magnetic force of the permanent magnet 424 of the holding member 420 is weaker than the magnetic force of the strong permanent magnet 402 of the temporary stage 204, so the annular frame 64 is transferred from the permanent magnet 424 to the strong permanent magnet 402. Furthermore, when the holding member 420 is raised, the frame unit U remains on the temporary platform 204 and moves away from the holding member 420 of the first lifting platform 246. In this way, the frame unit U is transferred from the first lifting platform 246 to the temporary platform 204.

[0162] Next, the temporary platform 204, which received the frame unit U, is positioned below the separation section 248 of the reinforcement removal unit 194 via the temporary platform transport section 232 (see reference). Figure 10 Additionally, the belt conveyor 300 of the waste section 276 is pre-positioned in a standby position. Next, the second lifting platform 272 of the separation section 248 is lowered, bringing its lower surface into contact with the belt 96 on the back side 4b of the wafer 4. Then, an attractive force is generated on the lower surface of the second lifting platform 272, using the second lifting platform 272 to attract and hold the back side 4b of the wafer 4 of the frame unit U.

[0163] Next, after positioning the strong permanent magnet 402 of the temporary stage 204 in the lowered position, the second lifting stage 272, which attracts and holds the chip 4 of the frame unit U, is raised. Then, after moving the temporary stage 204 below the first lifting stage 246, as... Figure 15 As shown, the pair of feed units 290 and the Z-axis feed mechanism 294 of the separator 274 are activated to clamp the annular frame 64 in the vertical direction using the upper and lower clamping rollers 292a and 292b. In addition, the belt conveyor 300 of the waste section 276 is positioned from the standby position to the recycling position.

[0164] Next, ultraviolet light is irradiated from a pair of ultraviolet irradiation sections 270 to reduce the adhesive force of the tape 96 adhered to the annular reinforcement 24. While the annular reinforcement 24 is pressed downwards by the pressing roller 298, the frame unit U, support shaft 286, and second lifting platform 272 are rotated relative to the separator 274 by the motor 284. This allows the annular reinforcement 24 to be separated from the frame unit U. The reinforcement 24 falling from the frame unit U is then transported to the dust collection box 302 via the belt conveyor 300 for recycling. Alternatively, the separator 274 can be rotated relative to the frame unit U during the separation of the reinforcement 24.

[0165] After the reinforcement removal process is performed, a process is performed to remove the acyclic unit U' from the reinforcement removal unit 194, which has had the ring-shaped reinforcement 24 removed.

[0166] In the acyclic unit removal process, the belt conveyor 300 of the waste section 276 of the reinforcement removal unit 194 is first positioned from the recycling position to the standby position. Next, the flipping mechanism 308 of the acyclic unit removal unit 196 (see reference...) Figure 17 The frame holding part 306 is positioned below the ringless unit U' attracted and held by the second lifting platform 272.

[0167] Next, with the suction pad 326 of the frame holding part 306 facing upward, the arm 318 is raised, so that the suction pad 326 of the frame holding part 306 contacts the lower surface side of the annular frame 64 of the acyclic unit U' supported by the second lifting platform 272 with the front face 4a facing downward.

[0168] Next, the attraction pad 326 in the frame holding section 306 generates an attraction force, which is used to attract and hold the annular frame 64 of the acyclic unit U'. Then, the attraction and holding of the acyclic unit U' by the second lifting platform 272 is released. As a result, the acyclic unit U' is transferred from the second lifting platform 272 of the reinforcement removal unit 194 to the frame holding section 306 of the acyclic unit removal unit 196.

[0169] After the acyclic unit removal process is implemented, an acyclic unit storage process is implemented to store the acyclic unit U' that has been moved out by the acyclic unit removal unit 196.

[0170] In the acyclic cell storage process, the flipping mechanism 308 of the acyclic cell removal unit 196 is first flipped up and down, causing the acyclic cell U' held by the frame holding part 306 to flip up and down. As a result, the acyclic cell U' is located below the frame holding part 306, with the front side 4a of the wafer 4 facing upwards.

[0171] Next, the Y-axis movable part 316 and arm 318 of the flipping mechanism 308 are moved, causing the acyclic unit U' to contact the upper surfaces of the pair of support plates 328 of the acyclic unit support 310. At this time, the gap between the pair of support plates 328 is narrowed by the spacing adjustment unit, and the pair of support plates 328 are pressed tightly against each other. Next, the frame holding part 306 releases the attraction holding of the acyclic unit U', and the acyclic unit U' is placed on the pair of support plates 328. Next, the heaters mounted on each support plate 328 are activated to heat the belt 96 of the acyclic unit U', thereby stretching the slack and wrinkles in the belt 96 caused by the removal of the reinforcement part 24. Then, the frame holding part 306 is used again to attract and hold the acyclic unit U' and raise the acyclic unit U'.

[0172] Next, after the spacing between the pair of support plates 328 is expanded by the spacing adjustment unit, the ringless unit U' is placed on the upper surface of the support plate 328. And, as... Figure 19 As shown, the ringless unit U' supported by the ringless unit support 310 is pushed by the pressing piece 338 of the push-in part 312, so that the ringless unit U' enters the frame box 198 placed on the frame box platform 200 for storage.

[0173] As described above, in the processing apparatus 2 of this embodiment, it is easy to attach the dicing tape 96 to the back surface 4b of the wafer 4, on which a ring-shaped reinforcement portion 24 is formed in a convex shape on the back surface 4b corresponding to the outer peripheral remaining area 20, and to integrate it with the ring-shaped frame 64. Furthermore, it is easy to cut the ring-shaped reinforcement portion 24 and remove it from the wafer 4, resulting in good productivity.

Claims

1. A processing apparatus for removing a convex reinforcement portion from a wafer on a back surface corresponding to a peripheral remaining region, wherein... The processing device has the following features: A wafer cassette stage, which holds wafer cassettes containing multiple wafers; A wafer removal unit removes the wafer from the wafer cassette placed on the wafer cassette stage; A wafer stage that supports the front side of the wafer being moved out by the wafer handling unit; A frame storage unit that stores multiple annular frames with openings for storing the wafer. A frame removal unit that removes the annular frame from the frame storage unit; A frame platform that supports the annular frame that is moved out through the frame moving unit; A tape-adhesive unit is positioned above the frame platform to adhere the tape to the annular frame. The included frame conveying unit conveys the annular frame with the attached tape to the wafer stage and positions the opening of the annular frame on the back side of the wafer supported by the wafer stage, thereby placing the frame with tape on the wafer stage. A crimping unit is used to crimp the strip containing the strip frame onto the back side of the wafer; The frame unit removal unit removes the frame unit, which is obtained by pressing the belt containing the frame to the back of the wafer, from the wafer stage via the belt pressing unit; The enhancement removal unit cuts off the annular enhancement portion from the wafer of the frame unit that has been moved out of the frame unit by the frame unit removal unit; A ringless unit removal unit removes the ringless unit from the reinforcement removal unit; as well as The frame box platform holds the frame boxes that house the acyclic units moved out by the acyclic unit. The frame unit's output unit includes: A frame unit holding part includes a wafer holding part that holds the wafer by exposing all or part of the outer periphery of the wafer and a frame holding part that holds the annular frame. The transport section moves the frame unit holding section to the temporary storage table; The imaging unit, which captures images of the outer periphery of the wafer of the frame unit held by the frame unit holding unit; and The illumination unit is positioned opposite the imaging unit, which holds the chip in place. The frame unit transfer unit operates the transfer unit while holding the wafer in the frame unit using the wafer holding part and holding the annular frame in the frame unit using the frame holding part. The imaging part takes pictures of at least three points on the outer periphery of the wafer to determine the center coordinates of the wafer, so that the center of the wafer is consistent with the center of the temporary stage.

2. The processing apparatus according to claim 1, wherein, The chip removal unit includes: Conveyor arm; and The hand, located at the front end of the conveying arm, supports the back of the wafer stored in the wafer cassette and flips the front and back of the wafer.

3. The processing apparatus according to claim 2, wherein, The hand is a Bernoulli pad that supports the wafer in a non-contact manner by generating negative pressure through the ejection of air.

4. The processing apparatus according to claim 1, wherein, The wafer stage includes: An annular support portion that supports the remaining outer periphery of the wafer, and is not in contact with a portion further inward than the remaining outer periphery; and A frame support portion is disposed on the outer periphery of the annular support portion to support the annular frame.

5. The processing apparatus according to claim 1, wherein, This adhesive unit contains: A tape support section that supports the tape obtained by winding the tape before use; The belt winding section winds up the belt after it has been used up; The belt pull-out section pulls the belt out of the reel; The crimping part crimps the pulled-out strip onto the annular frame; as well as The cutting section cuts off the strip that extends outward from the outer periphery of the annular frame along the annular frame.

6. A processing apparatus for removing a convex reinforcement portion from a wafer on a back surface corresponding to a peripheral remaining region, wherein... The processing device has the following features: A wafer cassette stage, which holds wafer cassettes containing multiple wafers; A wafer removal unit removes the wafer from the wafer cassette placed on the wafer cassette stage; A wafer stage that supports the front side of the wafer being moved out by the wafer handling unit; A frame storage unit that stores multiple annular frames with openings for storing the wafer. A frame removal unit that removes the annular frame from the frame storage unit; A frame platform that supports the annular frame that is moved out through the frame moving unit; A tape-adhesive unit is positioned above the frame platform to adhere the tape to the annular frame. The included frame conveying unit conveys the annular frame with the attached tape to the wafer stage and positions the opening of the annular frame on the back side of the wafer supported by the wafer stage, thereby placing the frame with tape on the wafer stage. A crimping unit is used to crimp the strip containing the strip frame onto the back side of the wafer; The frame unit removal unit removes the frame unit, which is obtained by pressing the belt containing the frame to the back of the wafer, from the wafer stage via the belt pressing unit; The enhancement removal unit cuts off the annular enhancement portion from the wafer of the frame unit that has been moved out of the frame unit by the frame unit removal unit; A ringless unit removal unit removes the ringless unit from the reinforcement removal unit; as well as The frame box platform holds the frame boxes that house the acyclic units moved out by the acyclic unit. The frame unit's output unit includes: A frame unit holding part includes a wafer holding part that holds the wafer by exposing all or part of the outer periphery of the wafer and a frame holding part that holds the annular frame. The transport section moves the frame unit holding section to the temporary storage table; The imaging unit, which captures images of the outer periphery of the wafer of the frame unit held by the frame unit holding unit; and The illumination unit is positioned opposite the imaging unit, which holds the chip in place. The frame unit's mover unit activates the conveyor unit, which uses the imaging unit to capture images of at least three points on the outer periphery of the wafer, determining the wafer's center coordinates and aligning the wafer's center with the center of the temporary stage. The crimping unit includes: The upper chamber is located above the wafer stage; The lower chamber houses the wafer stage; A lifting mechanism that raises and lowers the upper chamber to create a closed state in contact with the lower chamber and an open state away from the lower chamber; A vacuum section, which, in its closed state, creates a vacuum in the upper and lower chambers; and An atmospheric opening section that allows both the upper and lower chambers to be open to the atmosphere. With the belt containing the frame positioned on the back side of the wafer supported by the wafer stage, the lifting mechanism is activated to maintain the closed state and to create a vacuum in the upper and lower chambers. The belt containing the frame is then pressed onto the back side of the wafer using a pressing roller located in the upper chamber.

7. A processing apparatus for removing a convex reinforcement portion from a wafer on a back surface corresponding to a peripheral remaining region, wherein... The processing device has the following features: A wafer cassette stage, which holds wafer cassettes containing multiple wafers; A wafer removal unit removes the wafer from the wafer cassette placed on the wafer cassette stage; A wafer stage that supports the front side of the wafer being moved out by the wafer handling unit; A frame storage unit that stores multiple annular frames with openings for storing the wafer. A frame removal unit that removes the annular frame from the frame storage unit; A frame platform that supports the annular frame that is moved out through the frame moving unit; A tape-adhesive unit is positioned above the frame platform to adhere the tape to the annular frame. The included frame conveying unit conveys the annular frame with the attached tape to the wafer stage and positions the opening of the annular frame on the back side of the wafer supported by the wafer stage, thereby placing the frame with tape on the wafer stage. A crimping unit is used to crimp the strip containing the strip frame onto the back side of the wafer; The frame unit removal unit removes the frame unit, which is obtained by pressing the belt containing the frame to the back of the wafer, from the wafer stage via the belt pressing unit; The enhancement removal unit cuts off the annular enhancement portion from the wafer of the frame unit that has been moved out of the frame unit by the frame unit removal unit; A ringless unit removal unit removes the ringless unit from the reinforcement removal unit; as well as The frame box platform holds the frame boxes that house the acyclic units moved out by the acyclic unit. The frame unit's output unit includes: A frame unit holding part includes a wafer holding part that holds the wafer by exposing all or part of the outer periphery of the wafer and a frame holding part that holds the annular frame. The transport section moves the frame unit holding section to the temporary storage table; The imaging unit, which captures images of the outer periphery of the wafer of the frame unit held by the frame unit holding unit; and The illumination unit is positioned opposite the imaging unit, which holds the chip in place. The frame unit's mover unit activates the conveyor unit, which uses the imaging unit to capture images of at least three points on the outer periphery of the wafer, determining the wafer's center coordinates and aligning the wafer's center with the center of the temporary stage. The enhancement removal unit includes: A laser beam irradiation unit irradiates a laser beam toward the root of the annular reinforcement formed on the outer periphery of the wafer to form a cutting groove; A first lifting platform holds and raises the frame unit temporarily placed on the platform, and positions the frame unit at the laser beam irradiation unit; and A separating section that separates the annular reinforcing section from the cutting groove. The first lifting platform has: A small-diameter wafer holding portion, smaller than the outer diameter of the wafer, exposes the annular reinforcement portion; The frame support has a permanent magnet that magnetically attracts the annular frame; as well as The space allows the leaked laser light to diffuse between the wafer holding portion and the frame support portion. The separation section includes: The ultraviolet irradiation section irradiates the strip corresponding to the cutting groove with ultraviolet light, thereby reducing the adhesive strength of the strip. The second lifting platform exposes the annular reinforcement on the outer periphery to attract and hold the inner side of the wafer, and supports the annular frame. A separator that acts on the outer periphery of the annular reinforcement to separate the annular reinforcement; and The discard section discards the separated annular reinforcing portion. The first lifting platform temporarily places the frame unit with the cutting groove on the temporary platform, which is positioned at the separation section by the temporary platform conveying part, and the second lifting platform supports the frame unit temporarily placed on the temporary platform.

8. The processing apparatus according to claim 7, wherein, The temporary platform has a heater, and the first lifting platform holds the frame unit, which is attached to the root of the annular reinforcement, by heating the belt through the heater.

9. The processing apparatus according to claim 8, wherein, The temporary storage station includes: An annular support portion that supports the remaining outer periphery of the wafer while remaining in contact with a portion inside the remaining outer periphery; and A frame support portion, disposed on the outer periphery of the annular support portion, supports the annular frame. The frame support includes: A strong permanent magnet, having a stronger magnetic force than the permanent magnet of the first lifting platform; and The detachment section allows the annular frame, which is magnetically attached to the strong permanent magnet, to detach.

10. The processing apparatus according to claim 7, wherein, The acyclic unit for moving out includes: A flipping mechanism having a frame holding portion that faces the ringless unit supported by the second lifting platform and holds the annular frame, the flipping mechanism moving toward the frame box platform and flipping the frame holding portion. A ringless unit support portion, which is flipped by the flipping mechanism and supports the ringless unit of the wafer with its front side facing upwards; and The push-in part allows the acyclic unit supported by the acyclic unit support part to enter the frame box placed on the frame box platform for storage.

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