一种硅片处理设备

By designing a silicon wafer processing equipment, including a wet processing station, a wafer guiding station, and a high-temperature station, the automated transport and processing of silicon wafers is realized, solving the problems of silicon wafer fragmentation and contamination caused by mechanical wafer guiding, and improving the processing efficiency and reliability of silicon wafers.

CN114284186BActive Publication Date: 2026-07-17SHANGHAI JUNQIAN ZHIZAO TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANGHAI JUNQIAN ZHIZAO TECH CO LTD
Filing Date
2022-01-13
Publication Date
2026-07-17

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Abstract

本发明提供了一种硅片处理设备，包括湿法站、导片站和高温站。所述湿法站用于对硼扩散后的硅片处理；所述导片站设于所述湿法站和所述高温站之间，与所述湿法站和所述高温站均连通；所述导片站内设有隔板，所述隔板将所述导片站分隔成装载室和等候室，所述装载室靠近所述湿法站，所述等候室靠近所述高温站，所述隔板上设有第一传送门，所述第一传送门用于将所述硅片从所述装载室输送至等候室；所述高温站与所述导片站之间设有第二传送门，所述第二传送门用于将所述硅片从所述等候室输送至高温站内；所述高温站用于对所述硅片制备多晶硅层。本发明缩短生产制程的时间，提高了硅片被处理后的可靠性。
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