Method for manufacturing a laminate

Abstract

A method for manufacturing a laminate, in which a film-shaped sintering material containing sinterable metal particles and a binder component and having the same shape or substantially the same shape as a semiconductor chip and the same size is provided on a support sheet, the film-shaped sintering material on the support sheet is attached to a substrate, the support sheet is peeled from the substrate and the film-shaped sintering material, the semiconductor chip is attached with the back surface side facing the film-shaped sintering material on the substrate, and the film-shaped sintering material is heated to 200°C or higher, thereby sintering and bonding the semiconductor chip to the substrate.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a laminate.

[0002] This application claims priority based on Japanese Patent Application No. 2019-153524, filed in Japan on August 26, 2019, the contents of which are incorporated herein by reference. Background Technology

[0003] In recent years, with the increasing use of high voltage and high current in automobiles, air conditioners, personal computers, and other applications, the demand for power semiconductor components (power devices) in these devices has been continuously increasing. Power semiconductor components operate under high voltage and high current conditions, and due to this characteristic, heat generation in these components can easily become a problem.

[0004] In the past, heat sinks were sometimes installed around semiconductor devices to dissipate the heat generated by them. However, if the thermal conductivity of the junction between the heat sink and the semiconductor device is poor, it will hinder effective heat dissipation.

[0005] As a bonding material capable of forming the joint with excellent thermal conductivity, a paste-like metal particle composition is known, for example, obtained by mixing heated sinterable metal particles, a polymeric dispersant, and a volatile dispersion medium. This composition is a sintering material that forms a solid metal by sintering, which can constitute the joint.

[0006] However, when using such a paste-like sintering material, although the joint can be formed by applying it to the object to be sintered and then sintering, it is difficult to make the thickness of the coating uniform and to form the joint with high thickness stability.

[0007] Such a problem can be solved by using a film-like sintering material. That is, a film-like sintering material with high thickness stability can be formed in advance, attached to the object to be sintered (e.g., a semiconductor wafer), and sintered, thereby forming the highly stable joint.

[0008] As such a film-like sintering material, for example, a film-like sintering material containing sinterable metal particles and a binder component is disclosed. This film-like sintering material can be used as a film-like sintering material with a support sheet, wherein the support sheet is temporarily attached to one side in a peelable manner, and a release film is provided on the other side. Moreover, the support sheet is provided with an adhesive layer on the entire surface or outer periphery of the substrate film, which is configured in a manner that satisfies specific conditions regarding the average thickness of the end of the film-like sintering material, the area of ​​the release film, and whether there are cuts in the release film (see Patent Document 1). When used after peeling off the release film, this film-like sintering material can form the aforementioned joint with excellent thickness stability and thermal conductivity. Furthermore, this film-like sintering material can suppress damage such as cohesive failure that is usually prone to occur when peeling off the release film.

[0009] Existing technical documents

[0010] Patent documents

[0011] Patent Document 1: Japanese Patent No. 6327630 Summary of the Invention

[0012] The technical problem to be solved by the present invention

[0013] However, the film-like sintering material described in Patent Document 1 is designed to be attached to the entire back side of a semiconductor wafer during use. Therefore, after being attached to the semiconductor wafer, when the semiconductor wafer is diced into semiconductor chips, the film-like sintering material is cut according to the shape and size of the semiconductor chip. The cut film-like sintering material is then sintered to form a bonding portion that connects the semiconductor chip to the substrate. However, since the film-like sintering material, which is rich in sinterable metal particles, is relatively brittle, there are problems such as easy generation of chips during cutting or easy breakage depending on the cutting method. Furthermore, when the semiconductor chip malfunctions, it cannot be used, resulting in waste of the film-like sintering material attached to the semiconductor chip and a reduced yield of the film-like sintering material.

[0014] The purpose of this invention is to provide a method for manufacturing a laminate, which is a method for manufacturing a laminate composed of a semiconductor chip and a substrate laminated via a bonding portion, wherein the bonding portion is formed by sintering a film-like sintering material, which has excellent thickness stability and thermal conductivity, can suppress the breakage of the film-like sintering material, and has a good yield of the film-like sintering material.

[0015] Technical means to solve technical problems

[0016] The present invention provides a method for manufacturing a laminate, comprising: a step of disposing a film-like sintering material on a support sheet, wherein the film-like sintering material contains sinterable metal particles and binder components, and has the same shape or substantially the same shape and size as the semiconductor chip to which it is to be attached; a step of attaching the film-like sintering material on the support sheet to a substrate; a step of peeling the support sheet from the substrate and the film-like sintering material; a step of attaching the back side of the semiconductor chip to the film-like sintering material on the substrate; and a step of sintering the semiconductor chip to the substrate by heating the film-like sintering material to above 200°C.

[0017] In the manufacturing method of the laminate of the present invention, the semiconductor chip can also be sintered and bonded to the substrate by heating the film-like sintering material to above 200°C and simultaneously pressurizing it to above 5 MPa.

[0018] In the manufacturing method of the laminate of the present invention, the substrate can be a ceramic substrate.

[0019] In the manufacturing method of the laminate of the present invention, the support sheet may have a substrate film and an adhesive layer disposed on the entire surface of the substrate film, and the film-shaped sintering material may be disposed on the adhesive layer of the support sheet.

[0020] In the manufacturing method of the laminate of the present invention, the support sheet may have a substrate film and an adhesive layer disposed on the peripheral portion of the substrate film, and the film-shaped sintering material may be disposed on the area of ​​the substrate film of the support sheet where the adhesive layer is not disposed.

[0021] In the manufacturing method of the laminate of the present invention, the adhesive layer may have energy-curable properties.

[0022] In the manufacturing method of the laminate of the present invention, the adhesive layer having energy-curable properties can be irradiated with energy rays to peel the support sheet off the film-like sintered material.

[0023] In the manufacturing method of the laminate of the present invention, the film-like sintering material formed on the release film can be transferred onto the support sheet, thereby placing the film-like sintering material on the support sheet.

[0024] In the manufacturing method of the laminate of the present invention, the film-shaped sintering material can be printed on the release film, thereby forming the film-shaped sintering material on the release film.

[0025] In the manufacturing method of the laminate of the present invention, a die with the same shape or substantially the same shape and the same size as the semiconductor chip to which it is attached can be used for punching to form the film-like sintering material on the release film.

[0026] In the manufacturing method of the laminate of the present invention, the film-shaped sintering material can be printed on the support sheet, thereby setting the film-shaped sintering material on the support sheet.

[0027] In the manufacturing method of the laminate of the present invention, the support sheet can be circular.

[0028] In the manufacturing method of the laminate of the present invention, the support sheet can be wound into a reel shape, and the film-like sintering material can be arranged on the support sheet at constant intervals.

[0029] Invention Effects

[0030] According to the present invention, a method for manufacturing a laminate is provided, which is a method for manufacturing a laminate composed of a semiconductor chip and a substrate laminated via a bonding portion, wherein the bonding portion is formed by sintering a film-like sintering material, which has excellent thickness stability and thermal conductivity, can suppress the breakage of the film-like sintering material, and has a good yield of the film-like sintering material. Attached Figure Description

[0031] Figure 1A A top view illustrating an example of a support sheet used in the manufacturing method of this embodiment.

[0032] Figure 1B for Figure 1A The support plate shown Figure 1A A cross-sectional view at line II in the diagram.

[0033] Figure 2A A top view illustrating another example of the support sheet used in the manufacturing method of this embodiment.

[0034] Figure 2B for Figure 2A The support plate shown Figure 2A A cross-sectional view at line II-II in the diagram.

[0035] Figure 3A A top view illustrating yet another example of the support sheet used in the manufacturing method of this embodiment.

[0036] Figure 3B for Figure 3A The support plate shown Figure 3A A cross-sectional view at line III-III.

[0037] Figure 4A A cross-sectional view illustrating an example of a method for manufacturing a laminate according to the first embodiment.

[0038] Figure 4B A cross-sectional view illustrating an example of a method for manufacturing a laminate according to the first embodiment.

[0039] Figure 4C A cross-sectional view illustrating an example of a method for manufacturing a laminate according to the first embodiment.

[0040] Figure 4D A cross-sectional view illustrating an example of a method for manufacturing a laminate according to the first embodiment.

[0041] Figure 4E A cross-sectional view illustrating an example of a method for manufacturing a laminate according to the first embodiment.

[0042] Figure 5 A top view illustrating an example of a film-like sintered material with a support sheet obtained by the manufacturing method of the first embodiment.

[0043] Figure 6 A top view illustrating another example of a film-like sintered material with a support sheet obtained by the manufacturing method of the first embodiment.

[0044] Figure 7 A top view illustrating yet another example of a film-like sintered material with a support sheet obtained by the manufacturing method of the first embodiment.

[0045] Figure 8 A cross-sectional view is shown schematically of an example of a film-like sintered material with a protective film and a support sheet, obtained by the manufacturing method of the first embodiment.

[0046] Figure 9 A cross-sectional view illustrating an example of a film-shaped sintered material with a protective film and support sheet, drawn from a reel.

[0047] Figure 10A A cross-sectional view illustrating an example of a method for manufacturing a laminate according to the second embodiment.

[0048] Figure 10B A cross-sectional view illustrating an example of a method for manufacturing a laminate according to the second embodiment.

[0049] Figure 10C A cross-sectional view illustrating an example of a method for manufacturing a laminate according to the second embodiment.

[0050] Figure 10D A cross-sectional view illustrating an example of a method for manufacturing a laminate according to the second embodiment.

[0051] Figure 10E A cross-sectional view illustrating an example of a method for manufacturing a laminate according to the second embodiment.

[0052] Figure 11 A top view illustrating an example of a film-like sintered material with a support sheet obtained by the manufacturing method of the second embodiment. Detailed Implementation

[0053] <<Methods for Manufacturing Laminated Materials>>

[0054] A method for manufacturing a laminate according to one embodiment of the present invention includes: a step of providing a film-like sintering material on a support sheet, wherein the film-like sintering material contains sinterable metal particles and a binder component, and has the same shape or substantially the same shape and size as the semiconductor chip to which it is to be attached (in this specification, sometimes referred to as "step A"); a step of attaching the film-like sintering material on the support sheet to a substrate (in this specification, sometimes referred to as "step B"); a step of peeling the support sheet from the substrate and the film-like sintering material (in this specification, sometimes referred to as "step C"); a step of attaching the back side of the semiconductor chip to the film-like sintering material on the substrate (in this specification, sometimes referred to as "step D"); and a step of sintering the semiconductor chip to the substrate by heating the film-like sintering material to 200°C or higher (in this specification, sometimes referred to as "step E").

[0055] In the manufacturing method of the laminate in this embodiment, in step A, a film-like sintering material of the same shape or substantially the same shape and size as the semiconductor chip to be attached is applied to a support sheet. Therefore, it is not necessary to cut the film-like sintering material according to the shape and size of the semiconductor chip. Thus, even if the film-like sintering material is brittle, no chips are generated from it, and breakage is suppressed. Furthermore, in step D, the semiconductor chip is attached to the film-like sintering material. Therefore, by avoiding the use of faulty semiconductor chips, it is possible to ensure that fault-free semiconductor chips are attached to the film-like sintering material. Thus, no film-like sintering material is wasted, and the yield of the film-like sintering material becomes good.

[0056] The following section will first describe the support sheet, film-shaped sintering material, semiconductor chip, and substrate used in this embodiment.

[0057] <Supporting sheet>

[0058] The support sheet is not particularly limited as long as it can accommodate the film-like sintering material and can perform the processes B to C described later.

[0059] The shape of the support piece is not particularly limited, and examples include quadrilaterals, circles, etc. Quadrilaterals include squares and rectangles, and further, rectangles include strip-shaped (in other words, long strip quadrilaterals) shapes.

[0060] In this specification, unless otherwise specified, "shape of support sheet" refers to the shape of the support sheet when viewed from above its main surface (e.g., the first surface described later) (i.e., top view shape).

[0061] As a support sheet, for example, a support sheet having a substrate film and an adhesive layer disposed on the entire surface of the substrate film can be cited.

[0062] Figure 1A A top view is shown to schematically illustrate an example of such a support plate. Figure 1B for Figure 1A The support plate shown Figure 1A A cross-sectional view at line II in the diagram.

[0063] The support sheet 11 shown here is quadrilateral in shape and is formed by an adhesive layer 112 having a substrate film 111 and an adhesive layer 112 disposed on the entire surface of one side (sometimes referred to as the "first side") 111a of the substrate film 111.

[0064] The adhesive layer 112, for example in step C described later, is suitable for facilitating the peeling of the support sheet 11 from the film-shaped sintered material.

[0065] When using the support sheet 11, the side of the adhesive layer 112 opposite to the substrate film 111 side (sometimes referred to as the "first side" in this specification) 112a becomes the side opposite to the film-like sintering material in step A described later. One side (sometimes referred to as the "first side" in this specification) 11a of the support sheet 11 is the same as the first side 112a of the adhesive layer 112.

[0066] Figure 2A To illustrate another example of a support plate, a top view is provided. Figure 2B for Figure 2A The support plate shown Figure 2A A cross-sectional view at line II-II in the diagram.

[0067] In addition, Figure 2A In subsequent figures, the same reference numerals as those shown in the figures that have already been described will be assigned the same reference numerals as those in the figures that have already been described, and their detailed descriptions will be omitted.

[0068] The support sheet 31 shown here is strip-shaped and is formed by an adhesive layer 312 having a substrate film 311 and an adhesive layer 312 disposed on the entire surface of one side (sometimes referred to as the "first side") 311a of the substrate film 311.

[0069] Aside from the difference in shape, substrate film 311 is similar to... Figure 1B The substrate film 111 shown is the same, and the adhesive layer 312 is the same except for its shape. Figure 1A and Figure 1B The adhesive layer 112 shown is the same.

[0070] The adhesive layer 312, for example in step C described later, is suitable for facilitating the peeling of the support sheet 31 from the film-shaped sintered material.

[0071] When using the support sheet 31, the side of the adhesive layer 312 opposite to the substrate film 311 side (sometimes referred to as the "first side" in this specification) 312a becomes the side opposite to the film-like sintering material in step A described later. One side (sometimes referred to as the "first side" in this specification) 31a of the support sheet 31 is the same as the first side 312a of the adhesive layer 312.

[0072] As a support sheet, for example, a support sheet having a substrate film and an adhesive layer disposed on the periphery of the substrate film can also be cited.

[0073] Figure 3A A top view is shown to schematically illustrate an example of such a support plate. Figure 3B for Figure 3A The support plate shown Figure 3A A cross-sectional view at line III-III.

[0074] The support sheet 19 shown here is constructed by having a substrate film 111 and an adhesive layer 192 provided on a peripheral portion 1110a of one side (first side) 111a of the substrate film 111.

[0075] The peripheral portion 1110a of the first surface 111a of the substrate film 111 is a narrow region in the first surface 111a corresponding to the outer periphery of the substrate film 111, and the adhesive layer 192 has a strip-shaped form corresponding to the outer periphery. Moreover, the adhesive layer 192 is connected to the peripheral portion 1110a and is configured as a rectangular ring.

[0076] The first surface 19a of the support sheet 19 is the same as the first surface 111a of the substrate film 111.

[0077] Thus, the adhesive layer 192 is suitable, for example, for attaching the support sheet 19 to the support frame to temporarily fix the support sheet 19, and for peeling the support sheet 19 off the support frame in a subsequent process.

[0078] The support sheet preferably has an adhesive layer on its entire surface or periphery of the substrate film; in other words, it is preferred to have an adhesive layer at least on the periphery of the substrate film.

[0079] [Substrate Film]

[0080] Resins can be listed as constituent materials of the substrate film.

[0081] Examples of resins include, for example, polyethylene such as low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE); polyolefins other than polyethylene such as polypropylene, polybutene, polybutadiene, and polymethylpentene; ethylene copolymers (copolymers having structural units derived from ethylene) such as ethylene-propylene copolymers, ethylene-vinyl acetate copolymers, ethylene-(meth)acrylic acid copolymers, ethylene-(meth)methyl acrylate copolymers, and ethylene-(meth)ethyl acrylate copolymers; polyvinyl chloride; vinyl chloride-vinyl acetate copolymers; polyurethanes; ionomers; polyesters such as polyethylene terephthalate, polybutylene terephthalate, or polyethylene naphthalate, which have heat resistance; and crosslinks of these resins.

[0082] In this specification, "(meth)acrylic acid" refers to the concept that includes both "acrylic acid" and "methacrylic acid". Similarly, similar terms, such as "(meth)acrylate", refer to the concept that includes both "acrylate" and "methacrylate".

[0083] The substrate film can also be a weakly adhesive film made of an adhesive resin. In step A described later, such a substrate film is suitable for situations where a film-like sintering material is placed on it in direct contact with it.

[0084] The substrate film can also be modified through radiation treatment, electrical discharge treatment, etc.

[0085] The substrate film can be composed of one layer (single layer) or multiple layers (two or more layers). When it is composed of multiple layers, these multiple layers can be the same as each other or different from each other. There are no particular restrictions on the combination of these multiple layers.

[0086] In this specification, not limited to the case of a substrate film, "multiple layers may be the same as each other or different from each other" means that "all layers may be the same, all layers may be different, or only some layers may be the same." Furthermore, "multiple layers may be different from each other" means that "at least one of the constituent materials and thicknesses of each layer is different from each other."

[0087] The thickness of the substrate film is not particularly limited; for example, it can be 30–300 μm.

[0088] Here, "thickness of substrate film" refers to the overall thickness of the substrate film. For example, the thickness of a substrate film composed of multiple layers refers to the total thickness of all the layers that make up the substrate film.

[0089] [Adhesive layer]

[0090] Examples of adhesive layers include energy-curable adhesive layers and non-curable adhesive layers with weak adhesion.

[0091] The adhesive layer that is cured by energy rays is cured by irradiation with energy rays, and its adhesive strength is reduced.

[0092] In this specification, "energy rays" refers to energy rays containing energy quanta within electromagnetic waves or charged particle beams. Examples of energy rays include ultraviolet light, radiation, and electron beams. Ultraviolet light can be generated by using high-pressure mercury lamps, fusion lamps, xenon lamps, black light lamps, or LED lamps as ultraviolet light sources. Electron beams can be generated by irradiating electron beams produced by electron beam accelerators, etc.

[0093] In addition, "energy ray curing property" refers to the property of curing by irradiation with energy rays, while "non-curing property" refers to the property of not curing regardless of whether it is heated or irradiated with energy rays.

[0094] As a constituent material of the adhesive layer that is energy-curable, known energy-curable adhesives can be cited.

[0095] Examples of general adhesives that can be used as constituent materials for the non-curing adhesive layer with weak adhesion include rubber adhesives, acrylic adhesives, silicone adhesives, urethane adhesives, vinyl ether adhesives, and adhesives containing thermal expansion components.

[0096] An adhesive layer with an uneven adhesive surface can be used as a weak adhesive layer.

[0097] Non-curing adhesive layers with weak adhesion can be, for example, adhesive layers that exhibit an adhesion of 30–120 mN / 25 mm to SUS sheets (stainless steel sheets) at 23°C.

[0098] The adhesive layer can consist of one layer (single layer) or multiple layers (two or more layers). When it consists of multiple layers, these multiple layers can be the same as each other or different from each other, and there is no particular limitation on the combination of these multiple layers.

[0099] The thickness of the adhesive layer is not particularly limited; for example, it can be 1 to 100 μm.

[0100] Here, "thickness of adhesive layer" refers to the overall thickness of adhesive layer. For example, the thickness of adhesive layer composed of multiple layers refers to the total thickness of all layers that make up adhesive layer.

[0101] <Film-like sintered materials>

[0102] The shape of the film-like sintering material is the same as or substantially the same as the shape of the semiconductor chip to which it is attached, for example, it can be square or rectangular. In this specification, unless otherwise specified, "shape of film-like sintering material" refers to the shape of the film-like sintering material when viewed from above its main surface (e.g., the first surface described later) (i.e., top view shape).

[0103] The size of the film-shaped sintering material is the same as the size of the semiconductor chip to which it is attached.

[0104] The film-like sintered material contains sinterable metal particles and binder components, and may or may not contain other components.

[0105] [Sinterable metal particles]

[0106] The sinterable metal particles bond together to form a sintered body when the film-like sintered material is sintered. Through sintering, components that are in contact with the film-like sintered material are bonded together through the sintered body of the film-like sintered material.

[0107] Sinterable metal particles are particles that contain at least a metallic element. They can be particles composed solely of metallic elements, or particles composed of both metallic and non-metallic elements. Examples of particles composed of both metallic and non-metallic elements include particles of metal oxides.

[0108] The types of metals that make up sinterable metal particles include, for example, silver, gold, copper, iron, nickel, aluminum, silicon, palladium, platinum, and titanium. They can be elemental metals or alloys of two or more metals.

[0109] The metal species constituting a sinterable metal particle can be only one type or two or more types. When there are two or more types, their combination and ratio can be arbitrarily selected.

[0110] For example, the metal oxide can be a composite oxide containing two or more metal elements, such as barium titanate.

[0111] Regarding the particle size of sinterable metal particles, there is no particular limitation as long as the metal particles exhibit sinterability. Starting from the point of excellent sinterability, it can be any range of less than 100 nm, less than 50 nm, and less than 30 nm.

[0112] In this specification, "particle size of metal particles" refers to the diameter of a circle having the same area as the projected area of ​​the metal particle as observed using an electron microscope (equivalent projected area diameter).

[0113] Regarding the particle size of the sinterable metal particles, the particle size calculated for particles with an equivalent projected area diameter of less than 100 nm can be any range from 0.1 to 95 nm, 0.3 to 50 nm, and 0.5 to 30 nm. The metal particles to be observed are defined as more than 100 randomly selected metal particles from a single sheet of sintered film material.

[0114] The sinterable metal particles are preferably nano-sized particles, more preferably silver particles, and even more preferably nano-sized silver particles (silver nanoparticles).

[0115] In this specification, "nano-sized particles" refers to particles with a diameter of less than 100 nm.

[0116] [Adhesive Composition]

[0117] The binder component is used to impart formability and adhesion to the film-shaped sintered material.

[0118] The binder composition can be thermally decomposable, which causes the film-like sintered material to undergo thermal decomposition during sintering.

[0119] The adhesive composition is not particularly limited, but resin is preferred.

[0120] Examples of resins include acrylic resins, polycarbonates, polylactic acid, polymers of cellulose derivatives, etc., with acrylic resins being preferred.

[0121] Examples of acrylic resins include homopolymers of (meth)acrylate compounds, copolymers of two or more (meth)acrylate compounds, and copolymers of (meth)acrylate compounds with other monomers.

[0122] In the acrylic resin, the content of structural units from (meth)acrylate compounds, for example, can be 50 to 100% by mass relative to the total amount of structural units.

[0123] Specific examples of the (meth)acrylate compounds include alkyl (meth)acrylates, hydroxyalkyl (meth)acrylates, phenoxyalkyl (meth)acrylates, alkoxyalkyl (meth)acrylates, polyalkylene glycol (meth)acrylates, cycloalkyl (meth)acrylates, benzyl (meth)acrylates, and tetrahydrofuran (meth)acrylates.

[0124] Preferably, the acrylic resin is methacrylate. By including structural units derived from methacrylate in the binder components, the film-like sintering material can be sintered at a relatively low temperature, resulting in higher bonding strength after sintering.

[0125] In the acrylic resin, the content of structural units derived from methacrylates, for example, can be 50 to 100% by mass relative to the total amount of structural units.

[0126] The other monomers are not particularly limited as long as they are compounds capable of copolymerizing with the (meth)acrylate compound.

[0127] Other monomers mentioned include, for example, unsaturated carboxylic acids such as (meth)acrylic acid, vinyl benzoic acid, maleic acid, and vinylphthalic acid; vinyl benzyl methyl ether, vinyl glycidyl ether, styrene, α-methylstyrene, butadiene, and isoprene, etc., which are vinyl-containing free radical polymerizable compounds.

[0128] The weight-average molecular weight (Mw) of the resin can be, for example, 1,000 to 1,000,000. By keeping the weight-average molecular weight of the resin within such a range, the sintered film material can have higher strength and better flexibility.

[0129] In addition, unless otherwise specified in this specification, "weight-average molecular weight" refers to the converted value of polystyrene determined by gel permeation chromatography (GPC).

[0130] The glass transition temperature (Tg) of the resin can be, for example, -60 to 50°C. By setting the resin's Tg above the lower limit, it is easier to peel the support sheet off from the sintered film material described later. By setting the resin's Tg below the upper limit, the adhesion between the sintered film material and the semiconductor chip, etc., is further improved.

[0131] When the binder component is thermally decomposable during the firing of the film-like sintering material, the thermal decomposition of the binder component can be confirmed by the mass reduction of the binder component during firing.

[0132] In this embodiment, when the film-like sintering material is sintered, the total amount of binder components may be almost or completely thermally decomposed, or a portion may not be thermally decomposed.

[0133] The mass of the binder component after firing can be, for example, less than 10% by mass, relative to the mass of the binder component before firing.

[0134] Semiconductor Chips

[0135] The semiconductor chip can be a known semiconductor chip.

[0136] The size of a semiconductor chip (e.g., the area of ​​the semiconductor chip when viewed from above the circuit-forming surface) can be, for example, 0.01 to 25 cm². 2 It can also be 0.25–9 cm. 2 .

[0137] <Substrate>

[0138] There are no particular limitations as long as the substrate is the object to which the semiconductor chip is bonded.

[0139] Ceramic substrates are among the preferred substrates.

[0140] Next, the manufacturing method of the laminate of this embodiment will be described in detail with reference to the accompanying drawings.

[0141] In addition, for ease of understanding of the features of the present invention, important parts of the figures used in the following description are sometimes enlarged, and the size proportions of each component are not necessarily the same as the actual figures.

[0142] First, give examples of using Figure 2A and Figure 2B Taking the case of the support sheet 31 shown as an example, the manufacturing method of the laminate (sometimes referred to as the "first embodiment" in this specification) will be described.

[0143] Figures 4A-4E This is a cross-sectional view illustrating an example of a method for manufacturing a laminate according to this embodiment.

[0144] First Implementation Plan

[0145] <Process A>

[0146] like Figure 4A As shown, in process A, a film-like sintering material 12 is disposed on a support sheet 31. In this embodiment, such a support sheet with a film-like sintering material disposed on it is sometimes referred to as a "film-like sintering material with a support sheet". Figure 4A In the figure, the film-like sintered material with support sheet is given reference numeral 3.

[0147] As described above, since the support sheet 31 has an adhesive layer 312, in process A, more specifically, a film-like sintering material 12 is provided on the adhesive layer 312 (first surface 312a of the adhesive layer 312) of the support sheet 31.

[0148] As shown here, in process A, it is preferable to make the film-shaped sintering material 12 directly contact the first surface 31a of the support sheet 31.

[0149] As shown here, in step A, it is preferable to provide multiple (two or more) sheets of film-like sintering material 12 on a single support sheet 31. In this case, the number of film-like sintering material 12 sheets provided on a single support sheet 31 is preferably 10 to 10,000, more preferably 25 to 1,000. By making the number of sheets above or below the lower limit, the manufacturing efficiency of the laminate is further improved. By making the number of sheets below the upper limit, materials of more suitable size can be used as support sheets 31, further improving the operability of step A.

[0150] Figure 5 A top view illustrating an example of a film-like sintered material with a support sheet obtained by the manufacturing method of this embodiment.

[0151] The support sheet 31 and the film-shaped sintering material 3 with the support sheet shown here are strip-shaped. On the first surface 31a of the support sheet 31, a row of two or more film-shaped sintering materials 12 are arranged along the length direction of the support sheet 31.

[0152] On the support sheet 31, all the film-shaped sintered materials 12 are aligned in the same direction, and are arranged at constant intervals along the length direction. Furthermore, in a direction orthogonal to the length direction, the positions of all the film-shaped sintered materials 12 are aligned with each other. Thus, the film-shaped sintered materials 12 are neatly arranged on the support sheet 31. Figure 5 In the figure, reference numeral 12a indicates the side of the film-shaped sintered material 12 opposite to the side of the support sheet 31 (sometimes referred to as the "first side" in this specification).

[0153] Thus, step A, in which the film-like sintering material 12 is arranged at constant intervals on the support sheet 31, is an example of a preferred embodiment. In particular, as described later, the support sheet 31 can be wound into a reel shape, and such a support sheet is suitable for arranging the film-like sintering material 12 at constant intervals.

[0154] Figure 5 The film-shaped sintering material 3 shown is an example of a film-shaped sintering material with a support sheet when the support sheet is strip-shaped. The strip-shaped film-shaped sintering material with a support sheet produced in this embodiment is not limited to this.

[0155] For example, the orientation of one or more film-like sintered materials 12 on the support sheet 31 may be inconsistent. Furthermore, in the length direction, one or more film-like sintered materials 12 may not be arranged at a constant interval, and in the direction orthogonal to the length direction, the arrangement positions of one or more film-like sintered materials 12 may be misaligned.

[0156] The number of columns of the film-like sintering material 12 on the support sheet 31 may not be one (i.e., two or more columns). When the number of columns is two or more, the film-like sintering material 12 can be arranged in a grid pattern on the support sheet 31.

[0157] In process A, as a preferred method for providing the film-like sintering material 12 on the support sheet 31, examples include: printing the film-like sintering material 12 on the support sheet 31 to provide the film-like sintering material 12 on the support sheet 31 (sometimes referred to as "method (A-1)" in this specification); and transferring the film-like sintering material 12 formed on the release film onto the support sheet 31 to provide the film-like sintering material 12 on the support sheet 31 (sometimes referred to as "method (A-2)" in this specification).

[0158] It is known that when a paste composition, which is the raw material for the film-like sintering material 12, is applied to the support sheet 11 using a syringe and then sintered to form a joint, it is difficult to control the amount of the composition applied to make the thickness of the applied composition uniform, and thus it is difficult to form a joint with high thickness stability.

[0159] In contrast, when using methods (A-1) or (A-2) described above, a film-like sintering material 12 with high thickness stability can be provided on the support sheet 31 (more specifically, on the first surface 31a of the support sheet 31). As a result, in step E described later, the thickness stability of the joint formed by the film-like sintering material 12 is also maintained at a high level. In particular, when using method (A-2), since the film-like sintering material 12 with high thickness stability can be formed on the release film in advance, by directly transferring it in this state, a film-like sintering material 12 with even higher thickness stability can be provided on the support sheet 31.

[0160] In this specification, "high thickness stability" refers to the high uniformity of the thickness of the film-formed sintered material and the joint formed by the film-formed sintered material.

[0161] In method (A-2), as a method for forming a film-like sintering material 12 on the release film, examples include: printing the film-like sintering material 12 on the release film to form the film-like sintering material 12 on the release film; and performing a punching process using a die that is the same shape or substantially the same shape and the same size as the semiconductor chip to be attached to form the film-like sintering material 12 on the release film.

[0162] As for the methods of printing the film-like sintering material 12 on the support sheet 31 in method (A-1) and the methods of printing the film-like sintering material 12 on the release film in method (A-2), known printing methods can be listed. More specifically, as for the printing methods mentioned above, examples include letterpress printing methods such as flexographic printing; gravure printing methods such as photogravure printing; offset printing methods such as offset printing; screen printing methods such as screen printing and rotary screen printing; inkjet printing and other printing methods using various printing presses, etc.

[0163] <Process B>

[0164] Process B is performed after process A.

[0165] like Figure 4B As shown, in process B, the film-like sintering material 12 on the support sheet 31 is attached to the substrate 8.

[0166] By bringing the first surface 12a of the film-shaped sintering material 12 into contact with the substrate 8, the film-shaped sintering material 12 can be attached to the substrate 8.

[0167] Figure 4B Arrow G in the figure indicates the direction of movement when the film-shaped sintered material 12 is attached to the substrate 8.

[0168] Additionally, this section shows a portion of the film-formed sintered material 12 in process B, before it has been fully attached to the substrate 8.

[0169] As described below, the strip-shaped support sheet 31 is suitable for storage by being made into a reel shape in the following manner: one (one) of the support sheet 31 is wound up so that a protective film is further provided on the first surface 12a of the film-like sintered material 12. Thus, when using the support sheet 31 made into a reel shape, after the support sheet 31 is pulled out of the reel shape, the protective film is peeled off from the first surface 12a of the film-like sintered material 12, and the first surface 12a is brought into contact with the substrate 8, thereby attaching the film-like sintered material 12 on the support sheet 31 to the substrate 8.

[0170] The method for storing the support sheet will be explained in detail later.

[0171] As shown here, in step B, it is preferable to attach some or all of the film-like sintering material 12 on the support sheet 31 to the substrate 8 in a manner with a time difference between each other. For example, the film-like sintering material 12 can be attached from one end of the film-like sintering material 12 closest to the support sheet 31 (i.e., Figure 4B In the middle, the film-like sintered material 12 disposed on the far left is connected to the film-like sintered material 12 disposed at the other end closest to the support sheet 31 (i.e., Figure 4B In step B, the film-shaped sintering material 12 on the support sheet 31 is sequentially attached to the substrate 8 in the direction of the film-shaped sintering material 12 furthest from the leftmost one. Although all the film-shaped sintering materials 12 on the support sheet 31 can be attached to the substrate 8 simultaneously or almost simultaneously in step B, it is advantageous to attach the film-shaped sintering materials 12 to the substrate 8 by setting a time difference as described above, from the point of view that it is easier to perform the operation of the strip-shaped film-shaped sintering material 3 with the support sheet.

[0172] <Process C>

[0173] Process C is performed after process B.

[0174] like Figure 4C As shown, in step C, the support sheet 31 is peeled off from the substrate 8 and the film-like sintered material 12. During the peeling of the support sheet 31, the film-like sintered material 12 and the substrate 8 remain in an integrated state of mutual adhesion. In this embodiment, this configuration having a substrate and a film-like sintered material disposed on the surface (circuit forming surface) of the substrate is sometimes referred to as a "substrate with film-like sintered material." Figure 4C In the figure, the substrate with the film-like sintered material is given reference numeral 80. Figure 4C Arrow P in the figure indicates the peeling direction of support piece 31.

[0175] Additionally, this section shows a portion of the support sheet 31 in process C, before it has been completely peeled off from the substrate 80 with the film-like sintered material.

[0176] By applying force to the support sheet 31 in a direction away from the film-shaped sintering material 12, the support sheet 31 can be peeled off from the substrate 80 with the film-shaped sintering material.

[0177] As shown here, in step C, it is preferable to peel part or all of the support sheet 31 from the substrate 80 with the film-like sintering material in a manner with a time difference between each other. For example, the support sheet 31 is peeled off from one end of the support sheet 31 (i.e., Figure 4C In the middle, from the left end of the support piece 31 to the other end of the support piece 31 (i.e., Figure 4CIn step C, the support sheet 31 is peeled off from the substrate 80 with the film-like sintered material in sequence, in the direction of (not the left end of the support sheet 31). In step C, all areas of the support sheet 31 can be peeled off from the substrate 80 with the film-like sintered material simultaneously or almost simultaneously. However, from the point that it is easier to operate the strip support sheet 31, it is advantageous to set a time difference as described above to peel the support sheet 31 off from the substrate 80 with the film-like sintered material.

[0178] As described above, the support sheet 31 includes a substrate film 311 and an adhesive layer 312. When the adhesive layer 312 has energy-curable properties, in step C, it is preferable to irradiate the adhesive layer 312 with energy rays and peel the support sheet 31 (more specifically, the cured adhesive layer 312) from the film-like sintering material 12. At this time, the adhesive layer 312 is cured by irradiating with energy rays, thereby reducing the adhesion between the cured adhesive layer 312 and the film-like sintering material 12, making it easier to peel the support sheet 31 from the substrate 80 with the film-like sintering material.

[0179] In this embodiment, the support sheet 31 of step C can be peeled off from the substrate 80 with the film-fired material after all the film-fired materials 12 on the support sheet 31 in step B have been attached to the substrate 8, or the support sheet 31 of step C can be peeled off from the substrate 80 with the film-fired material before all the film-fired materials 12 on the support sheet 31 in step B have been attached to the substrate 8. In the latter case, the manufacturing time of the laminate, which is the target object, can be shortened.

[0180] <Process D>

[0181] Process D is performed after process C.

[0182] like Figure 4D As shown, in process D, the back side 9b of the semiconductor chip 9 is attached to the film-like sintered material 12 on the substrate 8 (in other words, the film-like sintered material 12 in the substrate 80 with the film-like sintered material). Figure 4D Arrow M in the figure indicates the direction of movement when attaching the semiconductor chip 9 to the film sintering material 12 (the substrate 80 with the film sintering material).

[0183] Additionally, this section shows a portion of the semiconductor chip 9 in process D, before the attachment of the semiconductor chip 9 to the substrate 80 with the film-like sintering material is completed.

[0184] Figure 4DIn the accompanying drawings, reference numeral 12b denotes the side of the film-formed material 12 opposite to the first side 12a (sometimes referred to as the "second side" in this specification), which is sometimes also the attachment side of the semiconductor chip 9. Here, the second side 12b of the film-formed material 12 is attached to the back side 9b of the semiconductor chip 9.

[0185] For example, a known method, such as using a collet to fix and move the semiconductor chip, can be used to attach the semiconductor chip 9 to a substrate 80 with a film-like sintering material.

[0186] In process D, since the semiconductor chip 9 is attached to the substrate 80 with the film-like sintering material, it is possible to ensure that fault-free semiconductor chips 9 are attached to the substrate 80 with the film-like sintering material by avoiding the use of faulty semiconductor chips. Therefore, the film-like sintering material 12 and the substrate 80 with the film-like sintering material are not wasted, and the yield of the film-like sintering material 12 and the substrate 80 with the film-like sintering material becomes good.

[0187] <Process E>

[0188] Process E is performed after process D.

[0189] like Figure 4E As shown, in process E, the semiconductor chip 9 is sintered and bonded to the substrate 8 by heating the film-like sintering material 12 to above 200°C.

[0190] By performing step E, a bonding portion 12' is formed by firing the film-shaped sintering material 12, and a laminate 801 composed of a semiconductor chip 9 and a substrate 8 is obtained by stacking the bonding portion 12'.

[0191] In step E, there is no particular upper limit to the heating temperature of the film-shaped sintering material 12. For example, from the point of suppressing damage to the wiring formed on the surface of the semiconductor chip 9 due to heating, the heating temperature of the film-shaped sintering material 12 is preferably 500°C or lower. On the other hand, by setting the heating temperature above the lower limit, the degree of sintering of the film-shaped sintering material 12 is further improved.

[0192] In step E, the heating time of the film-shaped sintering material 12 can be appropriately selected considering the type of the film-shaped sintering material 12 and the heating temperature, but is preferably 1 to 60 minutes. By setting the heating time above the lower limit, the degree of sintering of the film-shaped sintering material 12 is further improved. By setting the heating time below the upper limit, overheating can be suppressed.

[0193] In process E, pressure can be applied while heating the film-like sintering material 12. This further improves the bonding strength between the semiconductor chip 9 and the substrate 8, as well as the strength of the bonding portion 12' itself.

[0194] At this time, the pressure of the film-shaped sintering material 12 can be applied from the substrate 8 side, from the semiconductor chip 9 side, or from both sides of the substrate 8 side and the semiconductor chip 9 side.

[0195] The pressure applied to the film-like sintered material 12 is not particularly limited, but is preferably 5 MPa or higher. By setting the pressure within this range, the effect obtained by applying pressure is further improved.

[0196] That is, in process E, the semiconductor chip 9 and the substrate 8 can also be sintered together by heating the film-like sintering material 12 to above 200°C and simultaneously pressurizing it to above 5MPa.

[0197] In step E, there is no particular upper limit to the pressure at which the film-like sintering material 12 is heated and simultaneously pressurized. For example, the pressure is preferably 50 MPa or less, starting from the point of suppressing damage to the substrate 8, especially a ceramic substrate 8.

[0198] In this embodiment, since the joint 12' is formed of the film-formed material 12, it has excellent thickness stability and thermal conductivity. Furthermore, since the film-formed material 12 has the same or substantially the same shape and size as the semiconductor chip 9, it is not necessary to cut the film-formed material 12 according to the shape and size of the semiconductor chip 9. Even if the film-formed material 12 is brittle, no chips will be generated from it, thus suppressing breakage of the film-formed material 12 and forming a break-free joint 12'.

[0199] The laminate 801 is suitable for constituting power semiconductor elements (power devices).

[0200] The manufacturing method of this embodiment is not limited to the manufacturing method described herein. Some components may be changed or deleted without departing from the spirit of the invention, or other components may be added to the manufacturing method described herein. More specifically, as described below.

[0201] This concludes the description of the manufacturing method of the laminate when the support sheet is strip-shaped. However, the support sheet used in this embodiment can also be a quadrilateral shape other than a strip. Figure 6 A top view illustrating an example of a film-like sintered material with a support sheet in this case.

[0202] The support sheet 11 and the film-shaped sintering material 1 with the support sheet shown here are quadrilateral in shape, and on the first surface 11a of the support sheet 11, there are 5 rows and 7 rows of film-shaped sintering material 12 in two orthogonal directions, totaling 35 pieces.

[0203] Furthermore, on the support sheet 11, all the film-shaped sintering materials 12 are oriented in the same direction, and in the two mutually orthogonal directions, the film-shaped sintering materials 12 are neatly arranged such that the adjacent positions of the film-shaped sintering materials 12 are aligned with each other. That is, the film-shaped sintering materials 12 are arranged in a grid pattern on the support sheet 11.

[0204] Thus, process A, in which the film-like sintered material 12 is arranged in a grid pattern on the support sheet 11, is an example of a preferred embodiment.

[0205] Aside from the fact that the number of columns of the film-shaped sintering material 12, the number of film-shaped sintering material 12 sheets in each column, and the total number of film-shaped sintering material 12 sheets may differ, Figure 6 The arrangement of the film-shaped sintering material 12 on the support sheet 11 is the same as that on the support sheet 31.

[0206] exist Figure 6 In this process, although the film-like sintering material 12 is arranged in a grid pattern on the support sheet 11, the arrangement of the film-like sintering material 12 on the support sheet 11 is not limited to this. For example, the orientation of one or more film-like sintering materials 12 may be inconsistent, and for one or more film-like sintering materials 12, the arrangement positions of adjacent film-like sintering materials 12 in the two mutually orthogonal directions may not be aligned with each other.

[0207] exist Figure 6 In this embodiment, the number of film-like sintered material 12 disposed on the support sheet 11 is 35, but the number of sheets is not limited to this. For example, the number of sheets can also be 5 to 10,000.

[0208] The manufacturing method of the laminate using support sheet 11 is the same as the manufacturing method of the laminate described above, except that support sheet 11 is used instead of support sheet 31.

[0209] The support plate used in this embodiment can also be circular in shape. Figure 7 A top view illustrating an example of a film-like sintered material with a support sheet in this case.

[0210] The support sheet 21 and the film-shaped sintering material 2 with the support sheet shown here are circular in shape. On the first surface 21a of the support sheet 21, there are 4 to 8 rows and 3 to 9 rows of film-shaped sintering material 12 in two orthogonal directions, totaling 56 pieces.

[0211] Aside from the differences in the number of columns of the film-like sintered material 12, the number of film-like sintered material 12 sheets in each column, and the total number of film-like sintered material 12 sheets, Figure 7The arrangement of the film-shaped sintering material 12 on the support sheet 21 is the same as that on the support sheet 11.

[0212] The adhesive layer 212 in the support sheet 21 is the same as the adhesive layer 112 in the support sheet 11, except that it is circular. The substrate film (not shown) in the support sheet 21 is the same as the substrate film 111 in the support sheet 11, except that it is circular.

[0213] The side of the adhesive layer 212 opposite to the substrate film side (sometimes referred to as the "first side" in this specification) 212a is the same as the first side 21a of the support sheet 21.

[0214] Figure 7 The film-shaped sintering material 2 with a support plate shown is an example of a film-shaped sintering material with a support plate when the support plate is circular. The circular film-shaped sintering material with a support plate produced in this embodiment is not limited to the film-shaped sintering material with a support plate shown here.

[0215] For example, in a circular film-like sintered material with a support sheet, the orientation, arrangement position and number of columns of the film-like sintered material on the support sheet, the number of film-like sintered material sheets in each column, and the total number of film-like sintered material sheets can be arbitrarily set according to the purpose.

[0216] The manufacturing method of the laminate using support sheet 21 is the same as the manufacturing method of the laminate described above, except that support sheet 21 is used instead of support sheet 31.

[0217] In this embodiment, when using the support sheet 11, in any one or two of steps A and B, the support sheet 11 can be temporarily fixed to the support frame by attaching the peripheral portion of the adhesive layer 112 (more specifically, the first surface 112a of the adhesive layer 112) in the support sheet 11 to the support frame (not shown). At this time, the upper part of the peripheral portion of the first surface 112a of the adhesive layer 112 is left open so as not to obstruct the attachment of the adhesive layer 112 to the support frame. Here, as with the peripheral portion 1110a of the first surface 111a of the substrate film 111 described above, the peripheral portion of the first surface 112a of the adhesive layer 112 refers to the narrow area in the first surface 112a of the adhesive layer 112 that corresponds to the outer periphery of the adhesive layer 112.

[0218] The same applies when using the support sheet 21. That is, in this embodiment, when using the support sheet 21, in any one or two of steps A and B, the support sheet 21 can be temporarily fixed to the support frame by attaching the peripheral portion of the adhesive layer 212 (more specifically, the first surface 212a of the adhesive layer 212) of the support sheet 21 to the support frame (not shown). At this time, the upper part of the peripheral portion of the first surface 212a of the adhesive layer 212 is left open so as not to obstruct the attachment of the adhesive layer 212 to the support frame. Here, as with the adhesive layer 112 described above, the peripheral portion of the first surface 212a of the adhesive layer 212 refers to the narrow area in the first surface 212a of the adhesive layer 212 that corresponds to the outer periphery of the adhesive layer 212.

[0219] In this embodiment, the film-shaped sintered material with support sheet obtained by performing step A is suitable for preservation.

[0220] For example, a film-fired material with a support sheet that further has a protective film on the first side is particularly suitable for preservation.

[0221] That is, the manufacturing method of this embodiment may further include, between step A and step B: a step of attaching a protective film to the side (first side) of the film-like sintering material opposite to the side of the support sheet (in this specification, sometimes referred to as "step F1"); a step of storing the support sheet and the film-like sintering material (film-like sintering material with support sheet) after the protective film has been attached (in this specification, sometimes referred to as "step F2"); and a step of peeling the protective film off the film-like sintering material (stored film-like sintering material with support sheet) on the support sheet after the protective film has been attached and stored (in this specification, sometimes referred to as "step F3").

[0222] The protective film is used to protect the film-like sintering material in the film-like sintering material with the support sheet. Examples of protective films include those similar to the previously listed release films.

[0223] Figure 8 A cross-sectional view illustrating an example of a support-supported film-shaped sintering material with a protective film when using support sheet 31.

[0224] The film-shaped firing material 3 with support sheet shown here has a protective film 7 on the first surface 12a of the film-shaped firing material 12. The protective film 7 is not particularly limited in shape and size as long as it can cover all the first surfaces 12a of the film-shaped firing material 12 in the film-shaped firing material 3 with support sheet. For example, from the point of improving the operability of the film-shaped firing material 3 with support sheet in the state with protective film 7, the shape (top view shape) of the protective film 7 can be the same as the shape (top view shape) of the support sheet 31.

[0225] When the shape of the support sheet is not strip-shaped like support sheet 31, but is, for example, quadrilateral like support sheet 11, or circular like support sheet 21, the film-shaped sintering material with the support sheet and the protective film has the same structure as the film-shaped sintering material 3 with the support sheet and the protective film, except for the shape of the support sheet.

[0226] A film-shaped sintered material with a protective film and a support sheet in the shape of a quadrilateral or a circle (e.g., film-shaped sintered material 1 or film-shaped sintered material 2 with a support sheet) can be preserved, for example, by overlapping multiple pieces of the film-shaped sintered material with a support sheet along its thickness direction.

[0227] Furthermore, such a film-shaped sintered material with a support sheet can be preserved, for example, by winding a piece of such film-shaped sintered material with a support sheet into a roller.

[0228] For example, a film-shaped sintered material with a protective film and a support strip in the shape of a strip (e.g., film-shaped sintered material 3 with a support strip) is particularly suitable for preservation by winding a piece (a strip) of the film-shaped sintered material with a support strip into a reel.

[0229] That is, when the support sheet is strip-shaped, step F2 can be a process of winding the support sheet and the film-shaped sintering material (film-shaped sintering material with support sheet) after the protective film is attached into a reel and storing them. Furthermore, step F3 can be a process of pulling the support sheet and the film-shaped sintering material (the stored film-shaped sintering material with support sheet) with the protective film attached and after storage from the reel, and then peeling the protective film off the film-shaped sintering material.

[0230] Figure 9 A cross-sectional view is shown schematically of an example of a roll-shaped sintered material with a protective film and a support sheet, drawn from a reel. The roll-shaped sintered material 3 with a protective film and a support sheet is shown being drawn out.

[0231] The film-shaped sintering material 3 with the support sheet is wound into a reel shape with the exposed surface of the protective film 7 facing the radial inner side of the reel, the exposed surface of the support sheet 11 (second surface 11b) facing the radial outer side of the reel, and the support sheet 11 is wound to the outer side (in other words, the protective film 7 is wound to the inner side).

[0232] The structure obtained by attaching multiple quadrilateral or circular support sheets of a film-shaped sintered material (e.g., film-shaped sintered material 1 or film-shaped sintered material 2 with support sheets) along the length of a strip of protective film (e.g., protective film 7) is the same as the aforementioned film-shaped sintered material with support sheets in the shape of a strip. It is particularly suitable for storage by winding one strip of the composite film into a reel. At this time, the strip of composite film is wound into a reel with the exposed surface of the protective film facing the radially inner side of the reel, the exposed surface (second side) of the support sheet facing the radially outer side of the reel, and the support sheet is rolled to the outer side (in other words, the protective film is rolled to the inner side).

[0233] Multiple sheets of film-shaped sintering material with support sheets attached to a strip of protective film can be arranged in one row or two or more rows along the length of the protective film.

[0234] Furthermore, it is preferable to arrange these multiple sheet-like sintered materials with support plates arranged in a row in a manner that separates them from each other.

[0235] When using a strip composite film, step F1 can be a process of attaching multiple support sheets (i.e., multiple sheets of film-shaped sintered material with support sheets) to a strip protective film in a row through the side (first side) of the film-shaped sintered material opposite to the support sheet side. Furthermore, step F2 can be a process of winding the strip protective film with the multiple support sheets (multiple sheets of film-shaped sintered material with support sheets) attached to it into a reel and storing it. Moreover, step F3 can be a process of pulling the strip protective film with the multiple support sheets (multiple sheets of film-shaped sintered material with support sheets) attached to it and storing it from the reel, and then peeling the strip protective film off the multiple sheets of film-shaped sintered material.

[0236] Regardless of the shape of the support sheet, processes F1, F2, and F3 are performed sequentially.

[0237] The application of the protective film to the film-shaped sintering material in step F1 (application of the film-shaped sintering material to the protective film), the preservation of the film-shaped sintering material with support sheet in step F2, and the peeling of the protective film from the preserved film-shaped sintering material with support sheet in step F3 can all be carried out by known methods.

[0238] Then, give examples of using Figure 3A and Figure 3B Taking the support sheet 19 shown as an example, the manufacturing method of the laminate (sometimes referred to as the "second embodiment" in this specification) will be described.

[0239] Figures 10A to 10E This is a cross-sectional view illustrating an example of a method for manufacturing a laminate according to this embodiment.

[0240] Second Implementation Plan

[0241] <Process A>

[0242] like Figure 10A As shown, in process A, a film-like sintering material 12 is placed on the support sheet 19 to produce a film-like sintering material 6 with a support sheet.

[0243] As described above, in the support sheet 19, an adhesive layer 192 is provided on the peripheral portion 1110a of the first surface 111a of the substrate film 111. Moreover, in process A, more specifically, a film-like sintering material 12 is provided on the area of ​​the substrate film 111 (the first surface 111a of the substrate film 111) of the support sheet 19 where the adhesive layer 192 is not provided.

[0244] As described above, except for the object on which the film-like sintering material 12 is set, process A in the second embodiment is the same as process A in the first embodiment.

[0245] For example, in step A of the second embodiment, as shown here, it is preferable to make the film-shaped sintering material 12 directly contact the first surface 19a of the support sheet 19.

[0246] Figure 11 A top view illustrating an example of a film-shaped sintered material 6 with a support sheet obtained by the manufacturing method of the second embodiment.

[0247] The support sheet 19 shown here is quadrilateral in shape, and the film-like sintering material 12 is arranged in the same configuration as the film-like sintering material 1 with the support sheet, in a grid pattern on the first surface 19a of the support sheet 19. All the film-like sintering materials 12 on the support sheet 19 are positioned closer to the inside of the adhesive layer 192 (in other words, on the centroid side of the support sheet 19).

[0248] The first surface 19a of the support sheet 19 is the same as the first surface 111a of the substrate film 111.

[0249] <Process B>

[0250] Process B is performed after process A.

[0251] like Figure 10B As shown, in process B, the film-like sintering material 12 on the support sheet 19 is attached to the substrate 8.

[0252] As described above, except for the difference in the film-like sintering material with support sheet, step B in the second embodiment is the same as step B in the first embodiment.

[0253] However, unlike support sheet 31, support sheet 19 is sometimes suitable for roll-up storage and sometimes not. Therefore, unlike the case of using film-like sintering material 3 with support sheet, when using film-like sintering material 6 with support sheet, it is sometimes preferable to attach some or all of the film-like sintering material 12 on support sheet 19 to substrate 8 with a time difference between them, and sometimes it is preferable to attach all of the film-like sintering material 12 on support sheet 19 to substrate 8 simultaneously or almost simultaneously. The method of attaching film-like sintering material 12 can be selected, for example, according to the configuration of film-like sintering material 12 on support sheet 19.

[0254] In the second embodiment, in any one or both of steps A and B, the support sheet 19 can be temporarily fixed to the support frame by attaching the adhesive layer 192 in the support sheet 19 to the support frame (not shown). At this time, the upper part of the first surface 192a of the adhesive layer 192 is left open so as not to hinder the adhesion of the adhesive layer 192 to the support frame.

[0255] When the adhesive layer 192 has energy-curable properties, it is preferable to irradiate the adhesive layer 192 with energy rays before peeling the support sheet 19 fixed to the support frame from the support frame. At this time, by irradiating the adhesive layer 192 with energy rays to cure it, the adhesion between the cured adhesive layer 192 and the support frame is reduced, so the support sheet 19 can be peeled from the support frame more easily.

[0256] <Process C>

[0257] Process C is performed after process B.

[0258] like Figure 10C As shown, in process C, the support sheet 19 is peeled off from the substrate 8 and the film-like sintering material 12 (i.e., the substrate 80 with the film-like sintering material). When peeling off the support sheet 19, the film-like sintering material 12 and the substrate 8 remain in an integrated state of being attached to each other.

[0259] Additionally, this section shows a portion of the support sheet 19 in process C, where the peeling from the substrate 80 with the film-like sintered material has not yet been completed.

[0260] As described above, except for the difference in the film-like sintering material with support sheet, step C in the second embodiment is the same as step C in the first embodiment.

[0261] However, in the second embodiment, since the film-shaped sintering material 12 is in contact with the substrate film 111 instead of the adhesive layer 192, even though the adhesive layer 192 has energy-curable properties, it cannot be cured by irradiating the adhesive layer 192 with energy rays so that the support sheet 19 can be more easily peeled off from the substrate 80 with the film-shaped sintering material.

[0262] <Process D, Process E>

[0263] Process D is performed after process C, and process E is performed after process D.

[0264] like Figure 10D As shown, in process D, the back side 9b of the semiconductor chip 9 is attached to the film-like sintered material 12 on the substrate 8 (in other words, the film-like sintered material 12 in the substrate 80 with the film-like sintered material). At this time, the second side 12b of the film-like sintered material 12 is bonded to the back side 9b of the semiconductor chip 9. Figure 4D Similarly, this section shows a portion of the semiconductor chip 9 in process D, before the attachment of the chip to the substrate 80 with the film-like sintering material is completed.

[0265] Moreover, such as Figure 10E As shown, in process E, the semiconductor chip 9 is sintered and bonded to the substrate 8 by heating the film-like sintering material 12 to above 200°C.

[0266] By performing step E, the film-shaped sintering material 12 is sintered to form a bonding portion 12', thereby obtaining a laminate 801 composed of a semiconductor chip 9 and a substrate 8 stacked via the bonding portion 12'.

[0267] The second embodiment is the same as the first embodiment, and a substrate 80 with a film-like sintered material is obtained through the above-described process C. Therefore, process D in the second embodiment is the same as process D in the first embodiment, and process E in the second embodiment is the same as process E in the first embodiment.

[0268] In the second embodiment, since the joint 12' is also formed of the film-formed material 12, it has excellent thickness stability and thermal conductivity. Furthermore, since the film-formed material 12 has the same or substantially the same shape and size as the semiconductor chip 9, it is not necessary to cut the film-formed material 12 according to the shape and size of the semiconductor chip 9. Even if the film-formed material 12 is brittle, no chips will be generated from it, thus suppressing breakage of the film-formed material 12 and forming a break-free joint 12'.

[0269] The manufacturing method of the second embodiment is not limited to the manufacturing method described herein. Some components may be changed or deleted, or other components may be added to the manufacturing method described herein, without departing from the spirit of the invention. More specifically, as described below.

[0270] The second embodiment is the same as the first embodiment, and the shape of the support sheet can be, for example, circular or strip-shaped, in addition to a quadrilateral shape. However, in either case, as mentioned above, all the film-like sintering material on the support sheet is disposed on the inner side of the adhesive layer (in other words, on the centroid side of the support sheet).

[0271] In the second embodiment, the film-shaped sintered material with support sheets obtained by performing step A is also suitable for preservation.

[0272] For example, a film-fired material with a support sheet that further has a protective film on the first surface of the film-fired material is particularly suitable for preservation.

[0273] That is, the manufacturing method of the second embodiment may also include, between step A and step B: a step of attaching a protective film to the side (first side) of the film-like sintering material opposite to the side of the support sheet (step F1); a step of storing the support sheet and the film-like sintering material (film-like sintering material with support sheet) after the protective film is attached (step F2); and a step of peeling the protective film off the film-like sintering material (stored film-like sintering material with support sheet) on the support sheet after the protective film is attached and stored (step F3).

[0274] Except for the different support sheet used, the processes F1, F2 and F3 in the second embodiment are the same as those in the first embodiment.

[0275] In step F1 of the second embodiment, a protective film may be attached or not attached not only to the first side of the film-shaped sintering material, but also to the first side of the adhesive layer (e.g., the first side 192a of the adhesive layer 192).

[0276] The film-shaped sintered material with a protective film and a support sheet in the second embodiment (e.g., film-shaped sintered material 6 with a support sheet) can be preserved using the same method as the film-shaped sintered material with a protective film and a support sheet in the first embodiment (e.g., film-shaped sintered materials 1 to 3 with support sheets).

[0277] Industrial applicability

[0278] This invention can be used in the manufacture of power semiconductor elements (power devices).

[0279] Explanation of reference numerals in the attached figures

[0280] 1, 2, 3, 6: Film-like sintering material with support sheets; 11, 19, 21, 31: Support sheets; 11a, 19a, 21a, 31a: First side of the support sheet; 111, 311: Substrate film; 111a, 311a: First side of the substrate film; 112, 212, 192, 312: Adhesive layer; 112a, 212a, 192a, 312a: First side of the adhesive layer; 12: Film-like sintering material; 12a: First side of the film-like sintering material; 12b: Second side of the film-like sintering material 12; 12': Bonding portion; 8: Substrate; 9: Semiconductor chip; 9b: Back side of semiconductor chip 9; 80: Substrate with film-like sintering material; 801: Laminate.

Claims

1. A method for manufacturing a laminate, comprising: The process of setting a film-like sintering material on a support sheet, wherein the film-like sintering material contains sinterable metal particles and binder components, and has the same shape and size as the semiconductor chip to which it is attached; The process of attaching the film-like sintered material on the support sheet to the substrate; The process of peeling the support sheet from the substrate and the film-like sintering material; The process of attaching the back side of the semiconductor chip to the film-like sintered material on the substrate; and The process of sintering the semiconductor chip to the substrate by heating the film-like sintering material to above 200°C. The laminate is a laminate formed by laminating the semiconductor chip and the substrate via bonding portions, wherein the bonding portions are formed by a sintered body of the film-like sintered material. The process of placing a film-shaped sintered material of the same shape and size as the semiconductor chip to be attached onto the support sheet is as follows: (1) A process of transferring the film-like sintering material formed on the release film onto the support sheet, thereby setting the film-like sintering material on the support sheet; or (2) The process of printing the film-like sintering material on the support sheet, thereby setting the film-like sintering material on the support sheet. The process of forming the film-like sintering material on the release film is as follows: The process of printing the film-like sintering material onto the release film, thereby forming the film-like sintering material on the release film; or The process of forming the film-like sintering material on the release film by using a die of the same shape and size as the semiconductor chip to be attached. The support sheet has a substrate film and an adhesive layer disposed on the entire surface of the substrate film, and the film-shaped sintering material is disposed on the adhesive layer of the support sheet.

2. The method for manufacturing a laminate according to claim 1, wherein, The semiconductor chip is sintered and bonded to the substrate by heating the film-like sintering material to above 200°C and simultaneously applying pressure to above 5 MPa.

3. The method for manufacturing a laminate according to claim 1 or 2, wherein, The substrate is a ceramic substrate.

4. The method for manufacturing a laminate according to claim 1, wherein, The adhesive layer has energy-curable properties.

5. The method for manufacturing a laminate according to claim 1, wherein, The adhesive layer is irradiated with energy rays, thereby peeling the support sheet off the film-shaped sintered material.

6. The method for manufacturing a laminate according to claim 1 or 2, wherein, The support plate is circular.

7. The method for manufacturing a laminate according to claim 1 or 2, wherein, The support sheet can be wound into a reel shape, and the film-like sintering material is arranged on the support sheet at constant intervals.

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