Deposition source

Abstract

A deposition source of one embodiment includes a deposition module and a housing that accommodates the deposition module, the deposition module including a first crucible that extends in a first direction and accommodates a deposition material in an inner space, a plurality of nozzles that are disposed on the first crucible and arranged in the first direction, a heating member that accommodates the first crucible, and a radiation heat preventing member that is disposed on an upper surface, an outer side surface, and a lower surface of the heating member, the radiation heat preventing member including a plurality of reflectors and a plurality of pins that respectively connect between adjacent ones of the plurality of reflectors, the plurality of pins being disposed to be staggered with each other in a plane. The deposition source of the present application prevents loss or emission of heat generated in the deposition source toward the outside of the deposition source, and thus provides a deposition source with improved reliability in a high-temperature environment.

Description

Technical Field

[0001] This invention relates to a deposition source, and more specifically to a linear deposition source used in a deposition apparatus. Background Technology

[0002] Display devices may include a light-emitting layer between opposing electrodes. One of the various methods for forming electrodes is a deposition method using a deposition apparatus. The electrodes may include metallic materials, and a deposition apparatus requiring a high-temperature environment may be required to deposit metallic materials on a substrate.

[0003] Point-type deposition sources are used for depositing metallic materials. To deposit material on large-area substrates, multiple point-type deposition sources can be used, each arranged in a configuration of multiple crucibles storing the deposited material. However, point-type deposition sources have a limited capacity for the deposited material and are difficult to operate continuously for extended periods, leading to decreased deposition process efficiency. Furthermore, controlling each point-type deposition source individually complicates the control process. Additionally, a separate film thickness correction plate is required to form a uniform film on the substrate.

[0004] To address the issues of point-type sedimentary sources, linear sedimentary sources extending in one direction can be used. However, extended linear sedimentary sources may exhibit low thermal stability or temperature deviations at high temperatures. Summary of the Invention

[0005] The purpose of this invention is to provide a deposition source that improves deposition efficiency and reliability in high-temperature environments.

[0006] One embodiment provides a deposition source including a deposition module and a housing for receiving the deposition module. The deposition module includes: a first crucible extending along a first direction and receiving a deposited material in an internal space; a plurality of nozzles disposed on the first crucible and arranged along the first direction; a heating element housing the first crucible; and a radiative heat prevention element disposed on an upper surface, an outer surface, and a lower surface of the heating element. The radiative heat prevention element includes a plurality of reflectors and a plurality of pins respectively connecting adjacent reflectors among the plurality of reflectors, the plurality of pins being configured to be offset from each other in a plane.

[0007] Alternatively, the radiant heat prevention component may include a first group and a second group spaced apart from the first group, wherein the first group and the second group respectively include the plurality of reflectors and the plurality of pins.

[0008] Alternatively, one of the plurality of reflectors facing the outer side of the heating element may be combined with the heating element, and another of the plurality of reflectors facing the inner side of the housing may be spaced apart from the housing.

[0009] Alternatively, one of the plurality of reflectors facing the inner side of the housing may be integrated with the housing, and another of the plurality of reflectors facing the outer side of the heating element may be spaced apart from the heating element.

[0010] It may also include: a cooling section disposed on the housing, the cooling section including a cooling pipe through which cooling water flows, and the radiant heat prevention component contacting the cooling section.

[0011] Alternatively, the heating element may include: a heater frame housing the first crucible; and a heater disposed between the heater frame and the first crucible.

[0012] The heater may include: a heating element; an electrode connected to an end of the heating element; and a plate-shaped insulator covering the heating element and the electrode.

[0013] It may be that the device has multiple heaters, the multiple heaters are arranged along the inner side of the heater frame, and the multiple heaters can be controlled independently.

[0014] It may also include: a connecting part disposed outside the housing and electrically connecting the external electrode to the electrode, wherein the electrode is connected to the connecting part through the heater frame and the housing.

[0015] Alternatively, the connecting part may include multiple metal sheets stacked sequentially.

[0016] The connecting part may include multiple metal wires.

[0017] It may also include: a second crucible, having an internal space and disposed between the first crucible and the heating element, wherein the first crucible is disposed in the internal space and housed within the heating element.

[0018] It may also include: a cover that covers the lower surfaces of the plurality of nozzles facing the upper surface of the first crucible, the cover being in contact with the upper surface of the first crucible and comprising the same material as the first crucible.

[0019] The reflector may include at least one of Mo, Ta, W, Al, Au, Ag, Mn, Ti, ZrO2, Al2O3, TiO2, pBN (Pyrolytic Boron Nitride), ALN (Aluminium nitride), SUS (steeluse stainless), and carbon composite.

[0020] It may include multiple deposition modules and multiple housings, with the multiple deposition modules respectively housed in the multiple housings, and the multiple housings arranged along the first direction or a second direction intersecting the first direction.

[0021] One embodiment provides a deposition source including a deposition module and a housing for receiving the deposition module. The deposition module includes: a first crucible extending along a first direction and containing a deposit material in its internal space; a plurality of nozzles disposed on the first crucible and arranged along the first direction; a heater frame housing the first crucible; a heater disposed between the heater frame and the first crucible; and a radiative heat prevention component disposed on an outer surface of the heater frame. The radiative heat prevention component includes a first group and a second group facing and spaced apart from the first group. The first group and the second group each include a plurality of reflectors and a plurality of pins, wherein the plurality of pins respectively connect adjacent reflectors among the plurality of reflectors, and the plurality of pins are configured to be staggered from each other in a plane.

[0022] The reflector may include at least one of Mo, Ta, W, Al, Au, Ag, Mn, Ti, ZrO2, Al2O3, TiO2, pBN (Pyrolytic Boron Nitride), ALN (Aluminium nitride), SUS (steel use stainless), and carbon composite.

[0023] The heater may include: a heating element; an electrode connected to an end of the heating element; and a plate-shaped insulator covering the heating element and the electrode.

[0024] It may also include: a second crucible, having an internal space and disposed between the first crucible and the heater frame to form a space separated from the heater frame, wherein the first crucible is disposed in the internal space and the heater is disposed in the space.

[0025] It may also include: a cooling section disposed on the housing, the cooling section including a cooling pipe through which cooling water flows, and the radiant heat prevention component contacting the cooling section.

[0026] (Invention Effects)

[0027] One embodiment of the deposition source has the effect of improving deposition efficiency and increasing the reliability of the deposition source such as lifespan and stability in high-temperature environments. Attached Figure Description

[0028] Figure 1 This is a perspective view of a deposition source according to an embodiment of the present invention.

[0029] Figure 2 This is a cross-sectional view of a deposition source according to an embodiment of the present invention.

[0030] Figure 3a This is a cross-sectional view of a radiant heat prevention component according to an embodiment of the present invention.

[0031] Figure 3b This is a cross-sectional view of a radiant heat prevention component according to an embodiment of the present invention.

[0032] Figure 3c This is a cross-sectional view of a radiant heat prevention component according to an embodiment of the present invention.

[0033] Figure 3d This is a plan view of a radiant heat prevention component according to an embodiment of the present invention.

[0034] Figure 4 This is a partial cross-sectional view of a deposition source according to an embodiment of the present invention.

[0035] Figure 5 This is a cross-sectional view of a portion of a deposition source according to an embodiment of the present invention.

[0036] Figure 6 This is a perspective view of a heating component according to an embodiment of the present invention.

[0037] Figure 7a This is a cross-sectional view of a heating element according to an embodiment of the present invention.

[0038] Figure 7b This is a cross-sectional view of a heating element according to an embodiment of the present invention.

[0039] Figure 8 This is a perspective view of a deposition source according to an embodiment of the present invention.

[0040] Symbol explanation:

[0041] DS: Deposition source; DM: Deposition module; HS: Housing; NZ: Nozzle; CR1: First crucible; CR2: Second crucible; HM: Heating element; RM: Radiant heat prevention element; RF1~RF8: Reflector; PN1~PN6: Pin; S1: First group; S2: Second group; HF: Heater frame; HT: Heater; HE: Heating element; IO: Insulator; EL: Electrode; ELC: Connection part; CO: Cooling part; CO-F: Cooling pipe; CV: Cover. Detailed Implementation

[0042] This invention can have various modifications and forms, with specific embodiments illustrated in the accompanying drawings and described in detail herein. However, this is not intended to limit the invention to the specific disclosed forms, but should be understood to include all modifications, equivalents, and substitutions encompassed within the spirit and technical scope of this invention.

[0043] In this specification, when it is mentioned that a certain component (or region, layer, part, etc.) is located on, connected to or combined with other components, it means that it can be directly configured / connected / combined with other components, or a third component can be configured therein.

[0044] The same symbols refer to the same constituent elements. In addition, the thickness, proportions, and dimensions of the constituent elements in the various figures are exaggerated for the purpose of effectively illustrating the technical content.

[0045] "And / or" includes more than one combination of all possible related components.

[0046] The terms "first," "second," etc., can be used to describe various constituent elements, but the constituent elements described should not be limited to these terms. These terms are used only for the purpose of distinguishing one constituent element from others. For example, without departing from the scope of this invention, a first constituent element can be named a second constituent element, and similarly, a second constituent element can be named a first constituent element. Singular expressions include multiple expressions unless explicitly stated otherwise in the text.

[0047] Additionally, terms such as "below," "on the lower side," "above," and "on the upper side" are used to explain the connection relationships between the components in the diagram. These terms are relative concepts and are explained based on the direction shown in the diagram.

[0048] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) shall have the same meaning as commonly understood by those skilled in the art. Furthermore, terms defined in commonly used dictionaries shall be interpreted as having a meaning consistent with the relevant technical context, and shall not be interpreted as having an idealized or overly formal meaning unless explicitly defined in this application.

[0049] Terms such as “including” or “having” should be understood as referring to the presence of features, figures, steps, operations, constituent elements, components, or combinations thereof as recorded in the instruction manual, and do not preclude the existence or additional possibilities of one or more other features, figures, steps, operations, constituent elements, components, or combinations thereof.

[0050] Hereinafter, with reference to the accompanying drawings, a deposition source according to an embodiment of the present invention will be described.

[0051] Figure 1 This is a perspective view of a deposition source according to an embodiment of the present invention. Figure 2 Is with Figure 1 The cross-sectional view of the sediment source DS is shown, corresponding to the cut-off line I-I'.

[0052] The deposition source DS can be a device included in a deposition apparatus for spraying deposited material. The deposition source DS can be a linear deposition source extending in one direction. In this embodiment, the deposition source DS is illustrated as extending along a first direction DR1. The deposition source DS may include a housing HS and a deposition module DM.

[0053] The deposition module DM can be a module that stores and provides deposition material. The deposition module DM heats the stored deposition material and sprays it onto the substrate onto which the deposition film needs to be formed, thereby providing the deposition material. The deposition module DM can be housed inside the housing HS.

[0054] Reference Figure 1 The deposition module DM can include multiple nozzles NZ. Deposited material can be sprayed onto the exterior of the deposition module DM. Deposited material can be sprayed towards a third party, DR3, through the multiple nozzles NZ of the deposition module DM.

[0055] Multiple nozzles (NZ) can be arranged in one direction. Figure 1 A plurality of nozzles NZ arranged in a first direction DR1 are shown. The plurality of nozzles NZ can be arranged with equal spacing between them. However, this is not a limitation, and the spacing between the nozzles can be configured differently depending on the deposited material, the thickness of the deposited film to be formed, the shape of the target substrate, the size of the target substrate, etc.

[0056] exist Figure 1The image shows eight nozzles NZ configured inside the housing HS, but this is merely an example; the number of nozzles NZ included in the deposition source DS can be varied.

[0057] The shell HS can form the shape of the deposition source DS. The shell HS can extend in one direction. Figure 1 The housing HS extending in the first direction DR1 is shown.

[0058] The housing HS can include a main body HS-B with an internal empty space. The main body HS-B can house the deposition module DM in the internal empty space, thereby protecting the deposition module DM. The main body HS-B can expose multiple nozzles NZ upwards.

[0059] The housing HS may also include a top plate HS-T disposed on the main body HS-B and covering a portion of the exposed upper part of the main body HS-B. Figure 1 As an example, a top plate HS-T is shown that is spaced at predetermined intervals along the second direction DR2 to expose the nozzle NZ through the intervals. However, the top plate HS-T is not limited to any particular embodiment as long as it can expose the nozzle NZ while covering a portion of the upper part of the main body HS-B. For example, the top plate HS-T may be formed integrally, covering the upper part of the main body HS-B and overlapping with the nozzle NZ to define the shape of the opening. On the other hand, the top plate HS-T may be omitted.

[0060] Reference Figure 2 The deposition module DM may include a first crucible CR1, multiple nozzles NZ, a heating element HM, and a radiant heat prevention element RM.

[0061] The first crucible CR1 may be a component with an open top and an empty space inside. The first crucible CR1 may hold the deposited material 100 in the empty space inside. The deposited material 100 may be a material that can be vaporized by heat. For example, the deposited material 100 may be an inorganic material or a metallic material.

[0062] The first crucible CR1 can be a linear crucible extending along the first direction DR1. Compared with conventional point-type crucibles, the linear crucible can hold a larger volume of deposited material. Therefore, the deposition apparatus including the deposition source of the present invention can increase the continuous operating time and improve the equipment uptime.

[0063] The first crucible CR1 may include materials that can be used without deformation even at high temperatures. For example, the first crucible CR1 may include metallic materials such as Mo-La (Molybdenum Lanthanum), W, TZM (Titanium-Zirconium-Molybdenum alloy), Ta, or graphite, carbon composition, etc. However, the materials of the first crucible CR1 are not limited to the examples described above.

[0064] Multiple nozzles NZ are disposed on the first crucible CR1. The multiple nozzles NZ can be formed as a single unit. The nozzles NZ can contact the upper surface of the first crucible CR1. The description of the nozzles NZ is equally applicable to [reference needed]. Figure 1 The above explanation.

[0065] The nozzle NZ can include materials that can be used without deformation even at high temperatures. For example, the nozzle NZ can include metallic materials such as Mo-La (Molybdenum Lanthanum), W, TZM (Titanium-Zirconium-Molybdenum alloy), Ta, or graphite, carbon composition, etc. However, the materials of the nozzle NZ are not limited to the examples mentioned above.

[0066] The nozzle NZ may include the same material as the first crucible CR1. However, it is not limited to this; the nozzle NZ may include a different material than the first crucible CR1.

[0067] The heating element HM can house the first crucible CR1 to heat the first crucible CR1. The deposit material 100 housed in the heated first crucible CR1 can evaporate and be deposited on the target substrate. For example, the heating element HM can heat the first crucible CR1 to above 1000 degrees Celsius, specifically above 1200 degrees Celsius. The heating element HM may include a heater frame HF and a heater HT.

[0068] The heater frame HF can be a component with an opening at the top and an empty space inside. A first crucible CR1 can be disposed within the empty space inside the heater frame HF, so that the first crucible CR1 can be housed within the heater frame HF. The heater frame HF can be spaced apart from the first crucible CR1 and surround the sides and lower surface of the first crucible CR1.

[0069] The heater HT can provide heat to heat the first crucible CR1. The heater HT can be configured in the space between the heater frame HF and the first crucible CR1. The heater HT can be supported by the heater frame HF on the inner surface of the heater frame HF.

[0070] The heater HT can be configured on the side and / or lower surface of the first crucible CR1, thereby surrounding the first crucible CR1. Figure 2 A heater HT is shown disposed on the inner side of a heater housing HF. One heater HT or multiple heaters HT may be provided, and the multiple heaters HT may be disposed along the inner side of the heater housing HF.

[0071] The radiant heat prevention component RM can prevent heat from being lost or dissipated to the outside of the deposition source DS. The radiant heat prevention component RM can be configured between the heat-generating component HM and the housing HS.

[0072] A radiant heat prevention component RM can be disposed on the upper surface, outer surface, and lower surface of the heating component HM, thereby blocking radiant heat emitted from the heating component HM in the upward, side, and downward directions. The radiant heat prevention component RM may include a first radiant heat prevention part RH1 disposed on the upper surface HF-V of the heater frame HF, a second radiant heat prevention part RH2 disposed on the outer surface HF-O of the heater frame HF, and a third radiant heat prevention part RH3 disposed on the lower surface HF-B of the heater frame HF.

[0073] The radiative heat prevention component RM may include multiple reflectors. At least one of the first radiative heat prevention components RH1 to the third radiative heat prevention component RH3 may include multiple reflectors and multiple pins, with the pins respectively connecting adjacent reflectors among the multiple reflectors. The multiple pins may be configured to be offset from each other in a plane. Detailed description will follow.

[0074] A portion of the first to third radiative heat protection sections RH1 may include a single carbon composite. For example, the second and third radiative heat protection sections RH2 and RH3 may include multiple reflectors, and the first radiative heat protection section RH1 may be a single carbon composite. However, this is not a limitation; each of the first to third radiative heat protection sections RH1 may include multiple reflectors. Carbon composites have excellent heat resistance, thus they are not easily deformed even at high temperatures, and they have low thermal conductivity, thus blocking heat loss.

[0075] The deposition source DS may also include a second crucible CR2. The second crucible CR2 may be disposed between the heating element HM and the first crucible CR1. The second crucible CR2 may have an empty space inside its upper opening. The second crucible CR2 may house the first crucible CR1 within its internal space. The second crucible CR2 may prevent the deposited material 100 that has flowed out due to damage to the first crucible CR1 or has deviated from the evaporation path from flowing into other components.

[0076] The second crucible CR2 can be housed within the internal space of the heater frame HF. The heater frame HF can surround the sides and lower surface of the second crucible CR2. The second crucible CR2 and the heater frame HF can be spaced apart by a predetermined interval to form a separation space, and the heater HT can be disposed within the separation space.

[0077] The second crucible CR2 can cover the exposed upper part of the heater frame HF to protect the heater HT disposed between the second crucible CR2 and the heater frame HF. Deposited material 100 may deviate from the evaporation path and come into contact with the heater HT, which could cause shoot problems and reduce the lifespan of the heater HT. However, the second crucible CR2 can block the flow of deposited material 100 evaporated from the first crucible CR1 into the heater HT, thereby improving the lifespan of the heater HT.

[0078] The second crucible CR2 can include materials that can be used without deformation even at high temperatures. For example, the second crucible CR2 can include metallic materials such as Mo-La (Molybdenum Lanthanum), W, TZM (Titanium-Zirconium-Molybdenum alloy), Ta, or graphite, carbon composition, etc. However, the materials of the second crucible CR2 are not limited to the examples described above.

[0079] On the other hand, although not shown, the heating element HM may also include a temperature sensing unit. The temperature sensing unit can measure the temperature of the first crucible CR1 or the second crucible CR2 by area. The temperature measured by the temperature sensing unit can be used to control the temperature of the heater HT, thereby ensuring uniform temperature across the entire crucible.

[0080] Traditional point deposition sources have limited deposition area. Therefore, to form a deposited film on a large substrate, a deposition source with multiple point deposition sources arranged in a row is required. Multiple point deposition sources need to be controlled individually, making process management difficult. Furthermore, due to deposition deviations between the deposition sources, it is difficult to form a deposited film of uniform thickness.

[0081] The deposition source of the present invention reduces deposition deviation by arranging multiple nozzles on a crucible extending in one direction, making it easy to form a deposition film of uniform thickness even on large substrates. Furthermore, compared to point-type deposition sources, the deposition source of the present invention increases the efficiency of deposited material utilization, thus reducing material costs. Compared to point-type deposition sources, the deposition source of the present invention can hold a larger volume of deposited material, thereby increasing continuous operating time and improving equipment efficiency.

[0082] Figures 3a to 3d This is a cross-sectional view of a radiant heat prevention component according to an embodiment of the present invention. Figures 3a to 3c It is a sectional view observed on the plane defined by the second direction DR2 and the third direction DR3. Figure 3d This is a plan view observed on the plane defined by the first direction DR1 and the third direction DR3. For ease of explanation, a second radiative heat prevention unit RH2, which is part of the radiative heat prevention unit RM, is shown in enlarged form.

[0083] On a flat surface, a reflector can be provided as a thin plate in the shape of a quadrilateral. Multiple reflectors can be arranged facing each other. Multiple reflectors are spaced apart at predetermined intervals and connected by multiple pins. (See reference...) Figures 3a to 3c Reflectors RF1-RF7 or RF1-RF8 can face each other and be spaced apart along the second direction DR2. By spacing the reflectors apart, direct heat transfer between them can be prevented.

[0084] A reflector can block heat loss from the heat-generating component HM and reduce the degree of heat dissipation to the exterior of the radiative heat prevention component RM. Reflectors can include materials with relatively low thermal conductivity and emissivity that can be used at high temperatures. Examples include Mo, Ta, W, Al, Au, Ag, Mn, Ti, ZrO2, Al2O3, TiO2, pBN (Pyrolytic Boron Nitride), ALN (Aluminum Nitride), or SUS (Steel Use Stainless Steel). Reflectors may undergo surface treatments such as polishing to reduce emissivity.

[0085] For multiple pins connecting spaced-out reflectors, they can be configured to be staggered. By staggering the pins, the heat conduction path can become more complex compared to a side-by-side configuration. Figures 3a to 3cFor ease of explanation, a simplified heat conduction path is shown. A more complex heat conduction path can reduce the amount of heat transferred between reflectors.

[0086] There can be more than one pin connecting a reflector to its adjacent reflectors. For example, there can be more than two pins connecting the Nth reflector to the (N+1)th reflector.

[0087] Figure 3a and Figure 3b As an example, seven reflectors RF1 to RF7 are shown connected by multiple pins PN1 to PN6.

[0088] Reference Figure 3a and Figure 3b The first pin PN1 connecting the first reflector RF1 and the second reflector RF2, and the second pin PN2 connecting the second reflector RF2 and the third reflector RF3, are configured to be offset from each other in the second direction DR2. The third pin PN3 connecting the third reflector RF3 and the fourth reflector RF4 is configured to be offset from the first pin PN1 and the second pin PN2. As described above, the first pins PN1 to the sixth pin PN6 can be configured to be offset from each other. Therefore, by configuring the first pins to the (N-1)th pins connecting the first reflector to the Nth reflector to be offset from each other, the heat conduction path can be made more complex.

[0089] The second radiative heat prevention unit RH2, comprising multiple reflectors, can be coupled to the heater frame HF while being spaced apart from the housing HS, or it can be coupled to the housing HS while being spaced apart from the heater frame HF. The reflectors can be coupled to the heater frame HF or the housing HS via couplings CM. Multiple couplings CM can be provided to fix portions adjacent to the edges of the reflectors to the heater frame HF or the housing HS.

[0090] Reference Figure 3a The first reflector RF1, facing the outer surface HF-O of the heater frame HF, can be connected to the heater frame HF via a connector CM. Heat dissipated from the heating element HM can be transferred to the reflector via the connector CM. The connector CM and the first pin PN1 can be configured to be staggered from each other. By using multiple pins staggered from the connector CM, the heat conduction path can be made complex, which can reduce the thermal conductivity.

[0091] The seventh reflector RF7, which faces the inner side HS-I of the housing HS, and the housing HS can be spaced apart by a predetermined distance. By separating the reflector from the housing HS, it is possible to prevent heat transferred to the seventh reflector RF7 from being directly transferred to the housing HS, and to allow only radiative heat to be transferred to the housing HS.

[0092] Reference Figure 3b The seventh reflector RF7, facing the inner surface HS-I of the housing HS, can be attached to the housing HS via a connector CM. The connector CM and the sixth pin PN6 can be configured to be staggered, thus complicating the heat conduction path.

[0093] The first reflector RF1, which faces the outer surface HF-O of the heater housing HF, and the heater housing HF can be separated by a predetermined distance. By separating it from the heater housing HF, heat can be prevented from being directly transferred from the heater housing HF to the first reflector RF1, and only radiative heat can be transferred to the first reflector RF1.

[0094] Reference Figure 3c Some of the multiple reflectors may be spaced apart instead of connected by pins. Figure 3c As an example, eight reflectors RF1 to RF8 and multiple first pins PN1' to sixth pins PN6' are shown.

[0095] Reflectors that are connected to each other among multiple reflectors can be defined as a group. The first reflector RF1 to the fourth reflector RF4, connected via the first pin PN1' to the third pin PN3', can be defined as the first group S1. The fifth reflector RF5 to the eighth reflector RF8, connected via the fourth pin PN4' to the sixth pin PN6', can be defined as the second group S2.

[0096] The pins in each group can be configured in a staggered manner. The first pin PN1' to the third pin PN3' in the first group S1 can be configured in a staggered manner. The fourth pin PN4' to the sixth pin PN6' in the second group S2 can be configured in a staggered manner.

[0097] The first group S1 and the second group S2 are not connected by pins, but can be spaced apart from each other by a predetermined interval. The fourth reflector RF4 of the first group S1 and the fifth reflector RF5 of the second group S2 are not connected by pins, but can face each other and be spaced apart. The spacing between the first group S1 and the second group S2 can be greater than the spacing between multiple reflectors included in the group.

[0098] By staggering the multiple pins within each group, the heat conduction path can become complex, and the spacing between groups can block direct heat transfer between them. This reduces the amount of heat transferred between the multiple reflectors, effectively preventing heat loss and dissipation.

[0099] The first group S1 can be fixed by engaging with the heater frame HF through the first connector CM1. The second group S2 can be fixed by engaging with the housing HS through the second connector CM2.

[0100] Figures 3a to 3c A second radiative heat prevention unit RH2, comprising multiple reflectors and multiple pins, is shown, but it is not limited thereto; the same structure can also be applied to the first radiative heat prevention unit RH1 and the third radiative heat prevention unit RH3. For example, the multiple reflectors included in the first radiative heat prevention unit RH1 and the third radiative heat prevention unit RH3 can face each other and be spaced apart along a third direction DR3, and the multiple pins connecting adjacent reflectors can be configured to be staggered.

[0101] Figure 3d A simplified illustration shows the view from the plane defined by the first direction DR1 and the third direction DR3. Figure 3a This is an example of one embodiment of the second radiative heat prevention unit RH2 shown. Figure 3d As an example, the seventh reflector RF7, which is adjacent to the inner side HS-I of the housing HS, is observed on a plane. For ease of explanation, the first pin PN1 to the sixth pin PN6 are shown.

[0102] Multiple pins can be arranged offset from each other on the plane defining the reflector. For example, multiple pins can be arranged on the plane so that they do not overlap, and the greater the degree of offset, the more complex the heat conduction path. The shape in which multiple pins are arranged on the plane is not limited to... Figure 3d The situation is illustrated. For example, multiple pins that are relatively adjacent along the second direction DR2 may not overlap each other in the plane, and multiple pins that are relatively spaced apart along the second direction DR2 may partially overlap in the plane. As an example, the first pin PN1 and the second pin PN2 may not overlap in the plane, and the first pin PN1 and the fourth pin PN4 may partially overlap in the plane.

[0103] The number of reflectors is not limited to Figures 3a to 3d The illustrated embodiment. The number of reflectors can vary depending on the process temperature; generally, the higher the process temperature, the more reflectors the deposition source can include. For example, the radiative heat prevention component RM of a deposition source DS used in processes above 1200 degrees Celsius can include more than seven reflectors.

[0104] Embodiments of the present invention reduce the amount of heat transferred by maximally blocking direct heat transfer between the heating element HM, the radiant heat prevention element RM, and the housing HS, and by transferring heat through radiation. Furthermore, the radiant heat prevention element RM of the present invention complicates the heat conduction path, thereby effectively preventing heat dissipation and loss.

[0105] By reducing the amount of heat dissipated, the temperature rise outside the deposition source DS can be reduced, and damage to the target substrate disposed on the deposition source DS due to high temperatures can be prevented. This allows for a reduction in the distance between the deposition source DS and the target substrate, thereby improving deposition efficiency. Furthermore, by preventing heat loss, it is not necessary to continuously apply high energy to the heater HT to provide heat at a specific temperature, thus extending the lifespan of the heater HT.

[0106] Figure 4 This is a partial cross-sectional view of the upper part of a deposition source according to an embodiment of the present invention. The deposition source DS may also include a cooling section CO. The cooling section CO may be disposed on the housing HS to cool the heat transferred from the heat-generating component HM to the outside of the deposition source DS.

[0107] The cooling section CO may include cooling pipes CO-F and a cooling bracket covering the outer surface of the cooling pipes CO-F. Refrigerant or cooling water may circulate inside the cooling pipes CO-F.

[0108] The cooling section CO can be disposed on the upper surface HS-BU of the main body HS-B of the housing HS. The cooling section CO can be configured to surround the upper part of the main body HS-B along the opening of the upper surface HS-BU of the main body HS-B. The cooling section CO can cool the heat radiated towards the upper part of the deposition source DS and can reduce the amount of heat transferred to the target substrate disposed on the deposition source DS.

[0109] The radiant heat prevention component RM can come into contact with the cooling unit CO. Figure 4 As a simple example, a first radiative heat prevention section RH1 is shown, comprising multiple reflectors RF and multiple pins staggered between the multiple reflectors RF and in contact with a cooling section CO. The contact between the first radiative heat prevention section RH1 and the cooling section CO effectively reduces the temperature on the first radiative heat prevention section RH1. The cooling section CO cools the heat of the first radiative heat prevention section RH1 adjacent to the target substrate, thereby preventing damage to the target substrate due to high temperatures.

[0110] Although not illustrated, the deposition source DS may also include cooling pipes housed inside the main body HS-B of the housing HS or disposed on the side of the main body HS-B. The cooling pipes can cool heat radiated toward the side of the deposition source DS.

[0111] Figure 5 This is a cross-sectional view of a portion of a deposition source according to an embodiment of the present invention. The deposition source DS may further include a cover CV disposed between a plurality of nozzles NZ and a first crucible CR1. The cover CV may cover a portion of the lower part of the plurality of nozzles NZ. The lower surface of the cover CV may contact the upper surface of the first crucible CR1.

[0112] The cover CV and the first crucible CR1 can be joined by a fastening part BN. The cover CV and the first crucible CR1 can each have a defined connection hole. The fastening part BN can fasten the cover CV and the first crucible CR1 through the connection holes. The fastening part BN can include conventional fastening structures such as bolts and nuts.

[0113] The cap body CV may contain the same material as the first crucible CR1. For example, the cap body CV may contain metallic materials such as Mo-La (Molybdenum Lanthanum), W, TZM (Titanium-Zirconium-Molybdenum alloy), Ta, or graphite, carbon composition, etc.

[0114] The first crucible CR1 and the lid CV, exposed to a high-temperature environment, may repeatedly expand and contract thermally with continued use. By using the same material for both the first crucible CR1 and the lid CV, the differences in the degree of thermal expansion of each component can be reduced. If the fastener BN is used to fasten each component containing materials with significantly different degrees of thermal expansion, the fastener BN may be subjected to varying stresses due to the repeated thermal expansion and contraction of each component. This could easily damage the fastener BN. However, by fastening each component containing the same material, the stress caused by differences in thermal expansion can be reduced, thereby extending the lifespan of the fastener BN.

[0115] The fastener BN can include materials that can be used without deformation even at high temperatures. For example, the fastener BN can include Mo, Ta, TZM (Titanium-Zirconium-Molybdenum alloy), W, AlN (Aluminiumnitride), carbon composition, etc.

[0116] Figure 6 This is a perspective view of a heating element according to an embodiment of the present invention. The above description applies equally to each component of the heating element HM.

[0117] The heating element HM may include multiple heaters HT according to one embodiment. Multiple heaters HT1 to HT4 may be arranged along the inner side HF-I of the heater frame HF. The multiple heaters HT1 to HT4 may be configured to surround the first crucible CR1 (see reference). Figure 2 The surrounding area of ​​).

[0118] Figure 6Four heaters HT1 to HT4 are shown as an example. The first heater HT1 to the fourth heater HT4 can be independent heaters arranged along the inner side HF-I of the heater frame HF. For example, the first heater HT1 can be configured such that one side of it is adjacent to the second heater HT2, and the other side of it is adjacent to the fourth heater HT4. The first heater HT1 and the third heater HT3 can sandwich the first crucible CR1 (see reference DR1) in the first direction DR1. Figure 2 They are separated by space.

[0119] The multiple heaters HT1 to HT4 can have shapes corresponding to the shape of the inner surface HF-I of the heater housing HF. For example, they can be plate-shaped heaters that are bent like the first heater HT1, or they can be plate-shaped heaters that are flat like the second heater HT2.

[0120] Multiple heaters HT1 to HT4 can be controlled independently. For example, heaters HT1 to HT4 can be controlled to have different temperatures, which can reduce temperature deviation within the heating element HM and ensure uniform heating. The number and location of the heaters are not limited. Figure 6 The example shown can vary depending on the structure of the heating element HM and the size of the crucible.

[0121] Figure 7a and Figure 7b This is a cross-sectional view of a heating element according to an embodiment of the present invention. Figure 7a and Figure 7b A portion of the heating element HM is shown in magnification. Figure 7a and Figure 7b The diagram shows a substantially identical configuration, differing only in the shape of the connection portion ELC. The heater HT may include a heating element HE, an insulator IO, and electrodes EL.

[0122] The heating element HE can be a heating coil, or any heating means that can generate heat, and is not limited to any particular shape. The heating element HE can include heat-resistant metallic materials. For example, the heating element HE can include Ta, Mo, W, etc., but is not limited to the examples described above.

[0123] Electrode EL can be connected to the end of heating element HE to transfer externally applied energy to heating element HE. Electrode EL can be exposed on the exterior of the lower surface of housing HS, passing through the lower surface of heater frame HF and housing HS. Electrode EL can include metallic material.

[0124] An insulator IO can cover the outer surfaces of the heating element HE and the electrode EL. The insulator IO can be plate-shaped, and the heating element HE and the electrode EL can be disposed inside the insulator IO. The insulator IO can protect the heating element HE and the electrode EL. The insulator IO can prevent deposited material 100 from flowing into the heater HT due to detachment from the evaporation path. Figure 2 The resulting shoot problem.

[0125] The insulator IO can include materials that are non-reactive to the heating element HE and the electrode EL at high temperatures. For example, the insulator IO can include BN (Boron Nitride), pBN (Pyrolytic Boron Nitride), ALN (Aluminium Nitride), etc., but is not limited to the examples described above.

[0126] The deposition source DS may also include a connection portion ELC that electrically connects the electrode EL of the heater HT to the external electrode EE. The connection portion ELC may include a metallic material. For example, the connection portion ELC may include materials with low resistivity such as Ni and Cu, but is not limited to the examples described.

[0127] The metallic material contained in the heating element HE can expand slightly due to heat. Assuming that the connecting part ELC is rigidly connected to the electrode EL and the external electrode EE, stress may accumulate in the heating element HE as it is used continuously in a high-temperature environment, which may lead to damage to the heating element HE.

[0128] In cases of deformation, the connecting portion ELC in one embodiment can have a flexible structure to prevent damage to the heating element HE and thus extend the life of the heater HT. The connecting portion ELC in one embodiment can be as follows: Figure 7a As shown, it includes multiple metal sheets MP1, or it can be as follows: Figure 7b As shown, it includes multiple thin wires (MP2).

[0129] Reference Figure 7a Multiple metal sheets MP1 can be stacked sequentially along one direction. The number of metal sheets MP1 is not limited to any particular embodiment. The thickness of the metal sheets MP1 can be thin. For example, the thickness of the metal sheets MP1 can be less than 0.2 mm.

[0130] Figure 7a For ease of illustration, one of a plurality of metal sheets MP1 is shown. The metal sheet MP1 may be a plate shape in which a portion protrudes in one direction, but is not limited to any particular embodiment as long as it has the shape of a thin plate.

[0131] Reference Figure 7bMultiple lines MP2 can be connected to each other at one end connected to electrode EL and the other end connected to external electrode EE, but their centers are far apart from each other.

[0132] Figure 8 This is a perspective view of a deposition source according to an embodiment of the present invention. Figure 8 For ease of illustration, the deposition source DS and the substrate SUB to which the deposition material will be deposited are shown.

[0133] The substrate (SUB) can be the substrate of a display device. The deposited material can include metallic or inorganic materials. The deposited material is deposited on the substrate to form components such as electrodes.

[0134] The object substrate SUB may have two sides extending in a first direction DR1 and two sides extending in a second direction DR2. In a plane viewed from a third direction, the object substrate SUB may be quadrilateral in shape.

[0135] Reference Figure 8 The target substrate SUB can be disposed on the deposition source DS. The deposition source DS can spray deposited material onto DR3, and the deposited material can form a film on the target substrate SUB.

[0136] The target substrate SUB can be spaced apart from the deposition source DS and moved in one direction. For example, the target substrate SUB can be moved along the second direction DR2 on a fixed deposition source DS while depositing material on one side.

[0137] Figure 8 The illustration shows a scenario where the target substrate SUB is moved for deposition, but it is not limited to this; the deposition source DS could also be moved. With the target substrate SUB fixed, the deposition source DS could move along the second direction DR2 while depositing material on one side of the target substrate SUB.

[0138] The deposition source DS may include multiple deposition modules DM and housings HS. A deposition module DM may be housed within a corresponding housing HS. A housing HS housing a deposition module DM can be defined as a module MO. The descriptions of each deposition module DM and each housing HS are equally applicable to the above descriptions.

[0139] The first housing HS1, which houses the first deposition module DM1, can be defined as the first module MO1. The second housing HS2, which houses the second deposition module DM2, can be defined as the second module MO2. Similarly, the Nth housing, which houses the Nth deposition module, can be defined as the Nth module.

[0140] Figure 8 Four modules MO1 to MO4 are shown as an example. The number of modules is not limited to the example shown and can vary depending on the area of ​​the substrate SUB.

[0141] Multiple modules MO1 to MO4 can be arranged side-by-side. (See reference...) Figure 8 The first module MO1 and the second module MO2 are arranged side by side along the second direction DR2, and the first module MO1 and the third module MO3 are arranged side by side along the first direction DR1. The fourth module MO4 can be arranged side by side with the third module MO3 along the second direction DR2, and can be arranged side by side with the second module MO2 along the first direction DR1.

[0142] If the first direction DR1 is defined as a row and the second direction DR2 is defined as a column, then Figure 8 Multiple modules MO1 to MO4 are shown arranged in a 2x2 grid. However, the arrangement of the multiple modules can vary depending on the shape or area of ​​the substrate SUB and is not limited to any particular embodiment. For example, the multiple modules can also be arranged in a 1x2 grid, a 2x1 grid, or a 3x2 grid.

[0143] The length of the deposition source DS, which includes multiple modules, in the first direction DR1 can be equal to or greater than the length of the target substrate SUB in the first direction DR1. The deposition source DS of the present invention can be configured differently for each module according to the target substrate SUB, and compared with configuring a point-type deposition source on a large substrate, it is easier to form a uniform deposition film.

[0144] In one embodiment of the present invention, the deposition source extends in one direction, thereby enabling the deposition of a film of uniform thickness on a large substrate and improving deposition efficiency. The deposition source is protected from contamination and damage caused by the deposited material by an insulator covering the heating element of the heater.

[0145] An embodiment of the present invention includes a radiative heat prevention component that complicates the heat conduction path and reduces the amount of heat transferred through contact, thereby effectively preventing heat loss and heat dissipation.

[0146] The preferred embodiments of the present invention have been described above with reference to the examples. However, those skilled in the art or those with ordinary knowledge in the art should understand that various modifications and changes can be made to the present invention without departing from the spirit and technical scope of the invention as described in the claims.

[0147] Therefore, the scope of the present invention is not limited by the details described in the specification, but should be determined solely by the claims.

Claims

1. A sediment source, comprising: Deposition module; as well as The housing contains the deposition module. The deposition module includes: The first crucible extends along a first direction and contains the deposited material in its internal space; Multiple nozzles are disposed on the first crucible and arranged along the first direction; Heating element, housing the first crucible; and A radiant heat prevention component is disposed on the upper surface, outer surface, and lower surface of the heat-generating component. The radiant heat prevention component includes a plurality of reflectors and a plurality of pins respectively connecting adjacent reflectors among the plurality of reflectors. The plurality of pins are configured to be staggered from each other in a plane. The heating component includes: a heater frame housing the first crucible; and a heater disposed between the heater frame and the first crucible, the heater including: a heating element; an electrode connected to the end of the heating element; and a plate-shaped insulator covering the heating element and the electrode. The deposition source further includes: a connection portion disposed outside the housing and electrically connecting an external electrode to the electrode, the electrode being connected to the connection portion via the heater frame and the housing, the connection portion comprising a plurality of metal sheets or a plurality of metal wires.

2. The sediment source according to claim 1, wherein, The radiant heat prevention components include a first group and a second group spaced apart from the first group. The first group and the second group respectively include the plurality of reflectors and the plurality of pins.

3. The sediment source according to claim 1, wherein, One of the plurality of reflectors, which faces the outer side of the heating element, is coupled to the heating element, while another of the plurality of reflectors, which faces the inner side of the housing, is spaced apart from the housing.

4. The sediment source according to claim 1, wherein, One of the plurality of reflectors, which faces the inner side of the housing, is integrated with the housing, and another of the plurality of reflectors, which faces the outer side of the heating element, is spaced apart from the heating element.

5. The sediment source according to claim 1, further comprising: A cooling unit is disposed on the housing. The cooling section includes cooling pipes through which cooling water flows. The radiant heat prevention component is in contact with the cooling part.

6. The sediment source according to claim 1, wherein, Equipped with multiple of the aforementioned heaters, Multiple heaters are arranged along the inner side of the heater frame, and each heater can be controlled independently.

7. The sediment source according to claim 1, further comprising: A cover body that covers the lower surfaces of the plurality of nozzles facing the upper surface of the first crucible. The cover is in contact with the upper surface of the first crucible and comprises the same material as the first crucible.

8. The sediment source according to claim 1, wherein, It includes multiple deposition modules and multiple housings. The plurality of deposition modules are respectively housed in the plurality of housings. A plurality of the housings are arranged along the first direction or a second direction intersecting the first direction.

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