Display device

Abstract

The display device may include: a display panel, including a curved region and a non-curved region adjacent to the curved region; a substrate disposed below the display panel and having a through-hole overlapping the curved region; a conductive portion filling the through-hole; a flexible printed circuit board, including a first surface connected to the conductive portion and a second surface facing the first surface; a first film in contact with the first surface overlapping the non-curved region; and a protective member in contact with the upper surface of the first film. This allows for a reduction in the size of the bezel area of ​​the display device.

Description

Technical Field

[0001] This invention relates to display devices, and more specifically to display devices including curved regions. Background Technology

[0002] To achieve a large screen size on one side of a small portable display device, the transparent area of ​​the window can be made large, while the bezel area can be made small. The bezel area should be large enough that the wiring portions formed at the edges of the display panel or touch-sensing structure inside the display device, as well as the flexible printed circuit board connected to the wiring portions, are not exposed to the outside. Therefore, there are limits to how large the bezel area can be reduced.

[0003] Flexible printed circuit boards (PCBs) can be bent to reduce the size of the bezel area. For example, one end of the PCB can be connected to wiring formed at the edge of the display panel, and the other end can be connected to a driver circuit chip. When the PCB is bent, the driver circuit chip can be located at the bottom of the display panel, thereby further reducing the size of the bezel area. However, when the PCB is bent, the bent portion may become unstable, leading to poor process operability. Cracks may also occur in the circuit wiring within the bent portion. Summary of the Invention

[0004] The purpose of this invention is to provide a display device including a curved region.

[0005] However, the purpose of this invention is not limited to the purpose described above, and various extensions can be made without departing from the spirit and scope of this invention.

[0006] The display device according to various embodiments for achieving the objectives of the present invention described above may include: a display panel including a curved region and a non-curved region adjacent to the curved region; a substrate disposed below the display panel and having a through hole overlapping the curved region; a conductive portion filling the through hole; a flexible printed circuit board including a first surface connected to the conductive portion and a second surface facing the first surface; a first film in contact with the first surface overlapping the non-curved region; and a protective member in contact with the upper surface of the first film.

[0007] In various embodiments, the second surface overlapping the curved region may be exposed to the outside.

[0008] In various embodiments, the flexible printed circuit board overlapping the curved region may have a height difference relative to the substrate.

[0009] In various embodiments, the protective component may include: a heat dissipation component disposed on the first membrane; and a buffer component disposed on the heat dissipation component.

[0010] In various embodiments, the display device may further include a second film disposed between the buffer member and the substrate.

[0011] In various embodiments, the substrate and the flexible printed circuit board may comprise the same material.

[0012] In various embodiments, the substrate and the flexible printed circuit board may comprise plastic.

[0013] In various embodiments, the display device may further include a driving circuit chip that contacts the second surface overlapping the non-curved region.

[0014] In various embodiments, the display device may further include a cover strip that covers the driving circuit chip and extends along the second surface.

[0015] In various embodiments, the display device may further include: a printed circuit board spaced apart from the driving circuit chip and in contact with one end of the second surface.

[0016] In various embodiments, the display device may further include: an optical component disposed on the display panel; and a cover window disposed on the optical component.

[0017] In various embodiments, the cover window may be made of plastic.

[0018] The display device according to various embodiments for achieving the objectives of the present invention described above may include: a display panel including a curved region and a non-curved region adjacent to the curved region; a substrate disposed below the display panel and having a through hole overlapping the curved region; a conductive portion filling the through hole; a flexible printed circuit board including a first surface connected to the conductive portion and a second surface facing the first surface; a first film in contact with the first surface overlapping the non-curved region; and a second film in contact with the upper surface of the first film.

[0019] In various embodiments, the second surface overlapping the curved region may be exposed to the outside.

[0020] In various embodiments, the second film may be disposed between the first film and the substrate.

[0021] (Invention Effects)

[0022] The display devices of various embodiments of the present invention can connect to conductive portions penetrating a substrate without bending the flexible printed circuit board, without applying a bending protective layer to the second surface of the flexible printed circuit board, and without placing spacers between the first film and the protective member. This reduces the size of the bezel area of ​​the display device. Furthermore, it reduces or substantially prevents the generation of cracks in the flexible printed circuit board that overlaps with the bending area.

[0023] However, the effects of the present invention are not limited to those described, and various extensions can be made without departing from the spirit and scope of the present invention. Attached Figure Description

[0024] Figure 1 This is a plan view illustrating a display device according to an embodiment of the present invention.

[0025] Figure 2 It is intercepted along line II′. Figure 1 A cross-sectional view of the display device.

[0026] Figure 3 It is shown in magnification Figure 2 A cross-sectional view of area "A" of the display device.

[0027] Figure 4 This is a cross-sectional view illustrating a display device according to an embodiment of the present invention.

[0028] Figures 5 to 8 This is a cross-sectional view illustrating a method for manufacturing a display device according to an embodiment of the present invention.

[0029] Figure 9 This is a plan view illustrating a display device according to an embodiment of the present invention.

[0030] (Symbol Explanation)

[0031] 100, 101: Display device; BA: Bending area;

[0032] NBA: Non-curved area; DA: Display area;

[0033] PA: Surrounding area; 200: Coverage zone;

[0034] IC: Driver circuit chip; FPCB: Flexible printed circuit board;

[0035] PCB: Printed Circuit Board; S1 / S2: First Surface / Second Surface;

[0036] 210a / 210b: First membrane / Second membrane; 220a: Heat dissipation component;

[0037] 220b: Buffer component; 220: Protective component;

[0038] 230: Substrate; 231a: Through-hole;

[0039] 231b: Conductive part; 240: Display panel;

[0040] 250: Optical components; 260: Adhesive layer;

[0041] 270: Cover window. Detailed Implementation

[0042] Hereinafter, with reference to the accompanying drawings, a display device according to exemplary embodiments of the present invention will be described in detail. In the drawings, the same or similar reference numerals are used for the same or similar constituent elements.

[0043] Figure 1 This is a plan view illustrating a display device according to an embodiment of the present invention.

[0044] Reference Figure 1 An embodiment of the present invention relates to a display device 100 that may include a display area DA for displaying an image and a peripheral area PA that is adjacent to and surrounds the display area DA.

[0045] The display area DA can be configured with multiple pixels PX, including organic light-emitting elements, to generate light according to a driving signal. Each pixel PX can be arranged in a first direction D1 and a second direction D2 orthogonal to the first direction D1. The peripheral area PA can be adjacent to the display area DA and surround the edge of the display area DA. The peripheral area PA can form a circuit structure for driving the pixels PX of the display area DA.

[0046] The display device 100 may include a curved region BA and a non-curved region NBA. The curved region BA may be disposed adjacent to the non-curved region NBA. The curved region BA may be bent along a bending axis.

[0047] The flexible printed circuit board (FPCB) can be disposed in the curved area BA and the non-curved area NBA of the display device 100. The driver circuit chip IC and the printed circuit board PCB can be disposed in the non-curved area NBA of the display device 100. The driver circuit chip IC and the printed circuit board PCB can be disposed spaced apart from each other.

[0048] The flexible printed circuit board (FPCB) can electrically connect the display device 100 to the printed circuit board (PCB). The driver circuit chip (IC) and the printed circuit board (PCB) can provide drive signals to the display device 100. The drive signals can mean various signals that drive the display device 100, such as drive voltage, gate signal, and data signal.

[0049] Figure 2It is intercepted along line II′. Figure 1 A cross-sectional view of the display device.

[0050] Reference Figure 2 The display device 100 may include a cover window 270, an adhesive layer 260, an optical component 250, a display panel 240, a substrate 230, a flexible printed circuit board (FPCB), a first film 210a, a second film 210b, a protective component 220, a driving circuit chip (IC), a printed circuit board (PCB), a cover strip 200, etc.

[0051] Optical components 250 can be configured on the display panel 240. Although not on Figure 2 As shown, however, optical component 250 may include at least one of a phase retardation plate and a polarizing plate. External light incident from outside the cover window 270 becomes linearly polarized light when it passes through the polarizing plate. The linearly polarized incident light is reflected after passing through the phase retardation plate and then incident on the polarizing plate again after passing through the phase retardation plate. The linearly polarized incident light passes through the phase retardation plate and, having a 45° phase difference, becomes circularly polarized light, thus undergoing a phase transformation. As a result, external light, after passing through the phase retardation plate again, cannot pass through the polarizing plate and is mostly lost. For example, light that has passed through the phase retardation plate and become right-handed circularly polarized light is reflected and transformed into left-handed circularly polarized light; the right-handed and left-handed circularly polarized light can disappear through destructive interference. Therefore, the reflectivity of external light to the display device 100 can be reduced.

[0052] A substrate 230 may be disposed below the display panel 240. The substrate 230 may comprise a transparent or opaque material. According to one embodiment, the substrate 230 may comprise a plastic with excellent heat resistance and durability, such as polyimide (PI) or polyethylene terephthalate (PET). However, the invention is not limited thereto, and the substrate 230 may comprise various materials such as glass or metal.

[0053] According to one embodiment, the substrate 230 overlapping the curved region BA may have a through hole 231a. The interior of the through hole 231a may be filled with a conductive portion 231b. The conductive portion 231b may include a conductive material. For example, the conductive material may include a metallic material such as aluminum (Al) or copper (Cu). Optionally, the conductive portion 231b may include coated electrode terminals.

[0054] The flexible printed circuit board (FPCB) may include a first surface S1 connected to the conductive portion 231b and a second surface S2 opposite to the first surface S1.

[0055] According to one embodiment, the second surface S2 overlapping the curved region BA may be exposed to the outside. That is, the curved protective layer may not be applied to the second surface S2 overlapping the curved region BA.

[0056] One end of the second surface S2, which overlaps with the non-curved area NBA, can contact the printed circuit board (PCB). Thus, the flexible printed circuit board (FPCB) can electrically connect the display panel 240 and the PCB. The PCB can output signals to or receive signals from the display panel 240 via the flexible printed circuit board (FPCB).

[0057] The flexible printed circuit board (FPCB) can be flexible. For example, the FPCB may include plastics with excellent heat resistance and durability, such as polyimide and polyethylene terephthalate. According to one embodiment, the FPCB overlapping the curved region BA can form a height difference relative to the substrate 230. That is, since the first film 210a, the protective member 220, and the second film 210b (described later) are disposed between the FPCB overlapping the non-curved region NBA and the substrate 230, the FPCB overlapping the curved region BA can form a height difference relative to the substrate 230.

[0058] The second surface S2, which overlaps with the non-curved area NBA, can contact the driver circuit chip IC. The driver circuit chip IC can provide drive signals to the display device 100. The drive signals can mean various signals that drive the display device 100, such as drive voltage, gate signal, and data signal.

[0059] To protect the driver circuit chip IC, a cover strip 200 may be configured on the second surface S2 overlapping the non-bending area NBA. According to one embodiment, the cover strip 200 may cover the driver circuit chip IC and may extend along the second surface S2 of the flexible printed circuit board (FPCB). Furthermore, the cover strip 200 may extend along a first direction D1, which is perpendicular to the second surface S2. For example, the cover strip 200 may comprise a synthetic resin such as PET.

[0060] The first surface S1, which overlaps with the non-curved region NBA, can contact the first film 210a, and the back surface of the substrate 230, which overlaps with the non-curved region NBA, can contact the second film 210b. The second film 210b can be disposed between the substrate 230 and the buffer member 220b described later. The first film 210a and the second film 210b can be transparent films that allow light to pass through. For example, the first membrane 210a and the second membrane 210b may include polyethylene terephthalate (PET), polyethylene naphthalene (PEN), polypropylene (PP), polycarbonate (PC), polystyrene (PS), polysulfone (PSU), polyethylene (PE), polyphthalamide (PPA), polyethersulfone (PES), polyarylate (PAR), polycarbonate oxide (PCO), modified polyphenylene oxide (MPPO), etc. However, the materials of the first membrane 210a and the second membrane 210b are not limited to these.

[0061] A protective member 220 may be disposed on the first membrane 210a. According to one embodiment, the protective member 220 may contact the upper surface of the first membrane 210a. The protective member 220 may include at least one of a buffer member 220b and a heat dissipation member 220a.

[0062] According to one embodiment, the protective component 220 may include a buffer component 220b and a heat dissipation component 220a. The heat dissipation component 220a may be disposed on the first membrane 210a, and the buffer component 220b may be disposed on the heat dissipation component 220a.

[0063] The heat dissipation component 220a may include at least one of graphite, copper (Cu), and aluminum (Al), which have good heat dissipation properties. However, the material of the heat dissipation component 220a is not limited to these. The heat dissipation component 220a can improve heat dissipation performance and may also have electromagnetic wave shielding or electromagnetic wave absorption properties.

[0064] The cushioning component 220b may include a material with high shock absorption. For example, the cushioning component 220b may be formed from a polymer resin, or it may be a sponge foamed from a rubber liquid, a urethane-based material, or an acrylic-based material. However, the material of the cushioning component 220b is not limited to these.

[0065] Cover window 270 may be disposed on optical component 250. Cover window 270 may contact optical component 250 via adhesive layer 260. For example, adhesive layer 260 may include optically transparent adhesive film (OCA), photocurable resin, or thermocurable resin. However, the material of adhesive layer 260 is not limited to these, and adhesive layer 260 may also include optical resin (OCR).

[0066] The cover window 270 may include a glass substrate, a sapphire substrate, a plastic substrate, etc. The cover window 270 may have a multi-layer or single-layer structure. For example, the cover window 270 may include multiple plastic films bonded together by an adhesive. As an example, the cover window 270 may include a glass substrate and plastic films bonded to the glass substrate by adhesive components.

[0067] In the prior art, a flexible printed circuit board (FPCB) attached to the upper surface of a display panel 240 is bent. A bending protective layer is coated on the second surface S2 of the FPCB that overlaps with the bending region BA, and a spacer is disposed between the first film 210a and the protective member 220. In this case, the stress applied to the bending region BA of the flexible printed circuit board FPCB increases, thereby making the flexible printed circuit board FPCB vulnerable to cracking.

[0068] An embodiment of the present invention relates to a display device 100 in which the second surface S2 of the flexible printed circuit board (FPCB) overlapping the bending region BA is exposed to the outside, no spacer is disposed between the first film 210a and the protective member 220, and the flexible printed circuit board (FPCB) is brought into contact with the conductive portion 231b penetrating the substrate 230 without bending the FPCB, thereby connecting the flexible printed circuit board (FPCB) to the display panel 240. This reduces the size of the bezel area of ​​the display device 100. Furthermore, it reduces or substantially prevents the formation of cracks in the flexible printed circuit board (FPCB) overlapping the bending region BA.

[0069] Figure 3 It is shown in magnification Figure 2 A cross-sectional view of area "A" of the display device.

[0070] Reference Figure 3The display device 100 may include a display panel 240 and a substrate 230, etc. The display panel 240 may include a buffer layer 310, a thin-film transistor (TFT), a via layer 370, a lower electrode 380, a pixel definition film 390, an upper electrode 420, a light-emitting layer 410, a first inorganic thin-film encapsulation layer 431, an organic thin-film encapsulation layer 432, a second inorganic thin-film encapsulation layer 433, etc. The thin-film transistor (TFT) may include an active layer 320, a gate insulating layer 330, a gate electrode 340, an interlayer insulating layer 350, a source electrode 360a, and a drain electrode 360b.

[0071] The substrate 230 may comprise a transparent or opaque material. For example, as the display panel 240 has a polygonal planar shape, the substrate 230 may also have the same polygonal planar shape. The substrate 230 may also be made of a transparent resin substrate. For example, a polyimide substrate may be used as a transparent resin substrate for the substrate 230.

[0072] A buffer layer 310 may be disposed on the substrate 230. The buffer layer 310 prevents metal atoms or impurities from diffusing from the substrate 230 into the thin-film transistor (TFT). Furthermore, the buffer layer 310 can regulate the heat transfer rate during the crystallization process for forming the active layer 320, thereby obtaining a substantially uniform active layer 320. Additionally, the buffer layer 310 can improve the surface flatness of the substrate 230 in cases of surface inhomogeneity. As an example, two or more buffer layers may be disposed on the substrate 230. For example, the buffer layer 310 may comprise an organic or inorganic material.

[0073] An active layer 320 may be disposed on the buffer layer 310. The active layer 320 may include oxide semiconductors, inorganic semiconductors, polysilicon, or organic semiconductors, etc. Although not explicitly stated... Figure 3 As shown in the figure, the active layer 320 may have a source region and a drain region.

[0074] A gate insulating layer 330 may be disposed on the buffer layer 310. The gate insulating layer 330 may sufficiently cover the active layer 320 on the substrate 230 and may not generate any height differences around the active layer 320, and may have a substantially flat upper surface on the substrate 230. Alternatively, the gate insulating layer 330 may also cover the active layer 320 on the substrate 230 and be disposed along the contour of the active layer 320 with a uniform thickness.

[0075] The gate insulating layer 330 may include silicon compounds, metal oxides, etc. For example, the gate insulating layer 330 may include silicon oxide (SiO), silicon nitride (SiN), silicon nitride (SiON), silicon carbon oxide (SiOC), silicon carbon nitride (SiCN), aluminum oxide (AlO), aluminum nitride (AlN), tantalum oxide (TaO), hafnium oxide (HfO), zirconium oxide (ZrO), titanium oxide (TiO), etc. According to other exemplary embodiments, the gate insulating layer 330 may also have a multilayer structure comprising multiple insulating layers. For example, each of the insulating layers may have a different thickness and may comprise different materials.

[0076] A gate electrode 340 may be disposed on the gate insulating layer 330. The gate electrode 340 may be configured to overlap with the active layer 320. The gate electrode 340 may include metals, alloys, metal nitrides, conductive metal oxides, transparent conductive materials, etc. For example, the gate electrode 340 may include Au, Ag, Al, W, Cu, Pt, Ni, Ti, Pd, Mg, Ca, Li, Cr, Ta, Mo, Sc, Nd, Ir, aluminum-containing alloys, AlN, silver-containing alloys, WN, copper-containing alloys, molybdenum-containing alloys, TiN, CrN, TaN, SrRuO, ZnO, ITO, SnO, InO, GaO, IZO, etc. These materials may be used individually or in combination with each other. According to other exemplary embodiments, the gate electrode 340 may include a multilayer structure containing multiple metal layers. For example, each of the metal layers may have a different thickness and may include different materials.

[0077] An interlayer insulating layer 350 may be disposed on the gate insulating layer 330. The interlayer insulating layer 350 may sufficiently cover the gate electrode 340 and may have a substantially flat upper surface without creating a height difference around the gate electrode 340. Optionally, the interlayer insulating layer 350 may also cover the gate electrode 340 on the gate insulating layer 330 and be disposed along the contour of the gate electrode 340 with a uniform thickness. According to other exemplary embodiments, the interlayer insulating layer 350 may also have a multilayer structure comprising multiple insulating layers. For example, the insulating layers may have different thicknesses or comprise different materials.

[0078] A source electrode 360a and a drain electrode 360b may be disposed on the interlayer insulating layer 350. The source electrode 360a and the drain electrode 360b may respectively contact the source region and the drain region of the active layer 320 through contact holes formed by removing a portion of the gate insulating layer 330 and the interlayer insulating layer 350. The source electrode 360a and the drain electrode 360b may respectively comprise metals, alloys, metal nitrides, conductive metal oxides, transparent conductive materials, etc. These materials may be used individually or in combination with each other. According to other exemplary embodiments, the source electrode 360a and the drain electrode 360b may also have a multilayer structure comprising multiple metal layers. For example, each of the metal layers may have different thicknesses or comprise different materials.

[0079] Therefore, a thin-film transistor (TFT) including an active layer 320, a gate insulating layer 330, a gate electrode 340, an interlayer insulating layer 350, a source electrode 360a, and a drain electrode 360b can be disposed on the substrate 230.

[0080] A via layer 370 may be disposed on the interlayer insulating layer 350. The via layer 370 may sufficiently cover the source electrode 360a and the drain electrode 360b. The via layer 370 may be disposed with a relatively thick thickness, in which case the via layer 370 may have a substantially flat upper surface, and in order to achieve the flat upper surface of the via layer 370 as described above, a planarization process may be added to the via layer 370. Alternatively, the via layer 370 may also be disposed on the interlayer insulating layer 350 with a uniform thickness along the contours of the source electrode 360a and the drain electrode 360b.

[0081] The via layer 370 may include organic or inorganic materials. According to one embodiment, the via layer 370 may include organic materials. For example, the via layer 370 may include polyacryl-based resin, polyimide-based resin, polyamide-based resin, siloxane-based resin, acrylic-based resin, epoxy-based resin, etc.

[0082] A lower electrode 380 may be disposed on the via layer 370. The lower electrode 380 may contact the drain electrode 360b by removing a portion of the contact hole formed by the via layer 370. The lower electrode 380 may comprise a metal, alloy, metal nitride, conductive metal oxide, transparent conductive material, etc. These materials may be used individually or in combination with each other.

[0083] A pixel definition film 390 may be disposed on the via layer 370. The pixel definition film 390 may cover both sides of the lower electrode 380, and expose a portion of the upper surface of the lower electrode 380. The pixel definition film 390 may comprise an organic or inorganic material. According to one embodiment, the pixel definition film 390 may comprise an organic material.

[0084] A light-emitting layer 410 may be disposed on the pixel definition film 390 and the lower electrode 380. The light-emitting layer 410 may be formed using at least one of a light-emitting material capable of emitting red light, green light, and blue light. The light-emitting layer 410 may include a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron injection layer, etc. For example, the light-emitting layer 410 may include a low-molecular-weight organic compound or a high-molecular-weight organic compound.

[0085] An upper electrode 420 may be disposed on the light-emitting layer 410 and the pixel defining film 390. The upper electrode 420 may include metals, alloys, metal nitrides, conductive metal oxides, transparent conductive materials, etc. These materials may be used individually or in combination with each other.

[0086] A first inorganic thin-film encapsulation layer 431 may be disposed on the upper electrode 420. The first inorganic thin-film encapsulation layer 431 may cover the upper electrode 420 and is disposed along the contour of the upper electrode 420 with a uniform thickness. The first inorganic thin-film encapsulation layer 431 can prevent the light-emitting layer 410 from deterioration caused by the penetration of moisture, oxygen, etc. In addition, the first inorganic thin-film encapsulation layer 431 can also perform the function of protecting the display panel 240 from external impacts. The first inorganic thin-film encapsulation layer 431 may include a flexible inorganic material.

[0087] An organic thin-film encapsulation layer 432 may be disposed on the first inorganic thin-film encapsulation layer 431. The organic thin-film encapsulation layer 432 can improve the flatness of the display panel 240 and protect the display panel 240. The organic thin-film encapsulation layer 432 may include a flexible organic material.

[0088] A second inorganic thin-film encapsulation layer 433 may be disposed on the organic thin-film encapsulation layer 432. The second inorganic thin-film encapsulation layer 433 may cover the organic thin-film encapsulation layer 432 and is disposed along the contour of the organic thin-film encapsulation layer 432 with a uniform thickness. The second inorganic thin-film encapsulation layer 433, together with the first inorganic thin-film encapsulation layer 431, may prevent the light-emitting layer 410 from deterioration caused by the penetration of moisture, oxygen, etc. In addition, the second inorganic thin-film encapsulation layer 433 may also perform the function of protecting the display panel 240 from external impacts together with the first inorganic thin-film encapsulation layer 431 and the organic thin-film encapsulation layer 432. The second inorganic thin-film encapsulation layer 433 may include a flexible inorganic material.

[0089] Thus, a display panel 240 comprising a thin-film transistor TFT, a via layer 370, a lower electrode 380, a pixel definition film 390, a light-emitting layer 410, an upper electrode 420, a first inorganic thin-film encapsulation layer 431, an organic thin-film encapsulation layer 432, and a second inorganic thin-film encapsulation layer 433 can be disposed on a substrate 230.

[0090] Figure 4 This is a cross-sectional view illustrating a display device according to an embodiment of the present invention.

[0091] Reference Figure 4 The display device 101 may include a cover window 270, an adhesive layer 260, optical components 250, a display panel 240, a substrate 230, a flexible printed circuit board (FPCB), a first film 210a, a second film 210b, a driver circuit chip (IC), a printed circuit board (PCB), a cover strip 200, etc. However, except that the display device 101 does not include a protective component 220, it may be similar to the referenced... Figure 2 The display device 100 described herein is substantially the same. The following description mainly focuses on the part excluding the protective component 220.

[0092] The first surface S1 of the flexible printed circuit board (FPCB) overlapping the non-curved area NBA can contact the first film 210a. According to one embodiment, the upper surface of the first film 210a can contact the second film 210b. That is, no space may be provided between the first film 210a and the second film 210b. Figure 2 The protective component 220 is shown. This reduces the height difference between the flexible printed circuit board (FPCB) and the substrate 230 that overlap with the bending region BA, and reduces or substantially prevents the formation of cracks in the flexible printed circuit board (FPCB).

[0093] Figures 5 to 8 This is a cross-sectional view illustrating a method for manufacturing a display device according to an embodiment of the present invention.

[0094] Reference Figure 5 A display panel 240 can be formed on a substrate 230. According to one embodiment, a portion of the substrate 230 overlapping the curved region BA can be removed in a third direction D3 to form a through-hole 231a. A conductive portion 231b can be formed inside the through-hole 231a. For example, the conductive portion 231b can be formed using a conductive material. For example, the conductive material may include metallic materials such as aluminum (Al) or copper (Cu). Alternatively, the conductive portion 231b can be formed using coated electrode terminals.

[0095] Optical components 250 may be formed on the display panel 240. Although not on Figure 5As shown, however, the optical component 250 can contact the upper surface of the display panel 240 via an adhesive. For example, the adhesive may include an optically transparent adhesive film (OCA), a photocurable resin, or a thermocurable resin.

[0096] Reference Figure 6 A second film 210b may be formed below the substrate 230 that overlaps with the non-curved region NBA. Specifically, the second film 210b may be in contact with the back side of the substrate 230. For example, the second film 210b may include polyethylene terephthalate, polyethylene naphthalate, polypropylene, polycarbonate, polystyrene, etc.

[0097] A protective member 220 may be formed below the second membrane 210b. Specifically, the protective member 220 may contact the back surface of the second membrane 210b. The protective member 220 may include at least one of a buffer member 220b and a heat dissipation member 220a. According to one embodiment, the protective member 220 may include a buffer member 220b and a heat dissipation member 220a.

[0098] Reference Figure 7 The second surface S2 of the flexible printed circuit board (FPCB) overlapping the non-bent area NBA can contact the driver circuit chip IC. According to one embodiment, the flexible printed circuit board (FPCB) may include polyimide, etc.

[0099] One end of the second side S2 of the flexible printed circuit board (FPCB) overlapping the non-curved region NBA can contact the printed circuit board (PCB). A first film 210a can be formed on the first side S1 of the flexible printed circuit board (FPCB) overlapping the non-curved region NBA. For example, the first film 210a may include polyethylene terephthalate, polyethylene naphthalate, polypropylene, polycarbonate, polystyrene, etc.

[0100] The first surface S1 of the flexible printed circuit board FPCB, which is combined with the driver circuit chip IC and the printed circuit board PCB, can be connected to the conductive portion 231b of the substrate 230. As a result, the flexible printed circuit board FPCB overlapping with the bending region BA can form a height difference with respect to the substrate 230, and the upper surface of the first film 210a can contact the protective member 220.

[0101] Reference Figure 8The upper surface of the optical component 250 can contact the cover window 270. Specifically, the cover window 270 can contact the upper surface of the optical component 250 through an adhesive layer 260. For example, the adhesive layer 260 may include an optically transparent adhesive film (OCA), a photocurable resin, or a thermocurable resin. The cover window 270 overlapping the curved region BA may be in a shape that is curved in the opposite direction to the third direction D3. For example, the cover window 270 may include a glass substrate, a sapphire substrate, a plastic substrate, etc.

[0102] To protect the driver circuit chip IC, a cover strip 200 covering the driver circuit chip IC can be formed on the second surface S2 of the flexible printed circuit board (FPCB). Specifically, the cover strip 200 can be formed to cover the driver circuit chip IC and extend along the second surface S2. According to one embodiment, the cover strip 200 can be formed to extend in a first direction D1, which is perpendicular to the second surface S2. For example, the cover strip 200 may include a synthetic resin such as PET.

[0103] After the upper surface of the optical component 250 comes into contact with the cover window 270, the optical component 250, display panel 240, substrate 230 and flexible printed circuit board FPCB that overlap with the curved area BA can be bent along the curved surface of the cover window 270.

[0104] Therefore, it is possible to manufacture Figure 2 The display device 100 shown.

[0105] Figure 9 This is a plan view illustrating a display device according to an embodiment of the present invention.

[0106] Reference Figure 9 According to one embodiment of the present invention, the display device 102 may have a structure that can be bent with reference to four bending axes BX1, BX2, BX3, BX4.

[0107] The display device 102 may include a display area DA and a peripheral area PA that is adjacent to and surrounds the display area DA. The display area DA may include a first display area DA1, a second display area DA2, a third display area DA3, and a fourth display area DA4.

[0108] According to one embodiment, a portion of the display area DA may be bent to have a side display area. A first display area DA1, a second display area DA2, and a third display area DA3 may correspond to the side display area, and a fourth display area DA4 may correspond to the front surface display area.

[0109] According to one embodiment, the first display area DA1 may be located in the first direction D1, the second display area DA2 may be located in the opposite direction to the first direction D1, the third display area DA3 may be located in the second direction D2, and the fourth display area DA4 may be located on the front surface.

[0110] Each display area DA1, DA2, DA3, DA4 is configured with an array of pixels PX including organic light-emitting elements, thereby generating light according to a driving signal.

[0111] According to one embodiment, the display device 102 can be bent in a first direction D1 with a first bending axis BX1 as the center, can be bent in a direction opposite to the first direction D1 with a second bending axis BX2 as the center, can be bent in a second direction D2 with a third bending axis BX3 as the center, and can be bent in a direction opposite to the second direction D2 with a fourth bending axis BX4 as the center.

[0112] Although not in Figure 9 As shown in detail, however, the portion of the fourth bending axis BX4 of the display device 102 may correspond to... Figure 1 The curved area BA of the display device 100 shown. That is, the peripheral area PA located on the lower side of the display device 102 can be... Figure 1 The configuration shown includes a portion of the flexible printed circuit board (FPCB), the driver circuit chip (IC), and the printed circuit board (PCB) of the display device 100.

[0113] In summary, although the invention has been described with reference to exemplary embodiments, those skilled in the art will understand that various modifications and alterations can be made to the invention without departing from the spirit and scope of the invention as set forth in the claims.

[0114] (Industry availability)

[0115] This invention is applicable to display devices and various electronic devices utilizing them. For example, it is applicable to mobile phones, smartphones, video phones, smart tablets, smartwatches, tablet PCs, vehicle navigation systems, televisions, computer displays, laptops, etc.

[0116] The invention has been described above with reference to exemplary embodiments thereof. However, those skilled in the art should understand that various modifications and alterations may be made to the invention without departing from the spirit and scope of the invention as set forth in the claims.

Claims

1. A display device, comprising: The display panel includes a curved area and a non-curved area adjacent to the curved area; A substrate is disposed below the display panel and has a through hole that overlaps with the curved area; The conductive part is filled with the through hole; A flexible printed circuit board includes a first side connected to the conductive portion and a second side facing the first side; The first membrane is in contact with the first surface that overlaps the non-curved region; as well as The protective component contacts the upper surface of the first membrane. In this configuration, the flexible printed circuit board is in direct contact with one end of the conductive portion that penetrates the substrate, and the other end of the conductive portion is in direct contact with the display panel. The display panel and the substrate are in close contact with each other without any gaps, and in the curved region, the substrate and the display panel bend downward together. The first film and the protective member extend to and terminate at the boundary between the curved region and the non-curved region, such that the flexible printed circuit board overlapping the curved region has a height difference relative to the substrate, and the height difference is maximized at the boundary.

2. The display device according to claim 1, characterized in that, The second surface, which overlaps with the curved region, is exposed to the outside.

3. The display device according to claim 1, characterized in that, The protective component includes: A heat dissipation component is disposed on the first membrane; and A buffer component is disposed on the heat dissipation component.

4. The display device according to claim 3, wherein Also includes: The second membrane is disposed between the buffer member and the substrate.

5. The display device according to claim 1, characterized in that, The substrate and the flexible printed circuit board comprise the same material.

6. The display device according to claim 5, characterized in that, The substrate and the flexible printed circuit board comprise plastic.

7. The display device according to claim 1, wherein Also includes: The driving circuit chip contacts the second surface that overlaps the non-curved region.

8. The display device according to claim 7, wherein Also includes: A covering strip covers the drive circuit chip and extends along the second surface.

9. The display device of claim 8, wherein, Also includes: The printed circuit board is spaced apart from the driving circuit chip and is in contact with one end of the second surface.

10. The display device according to claim 1, wherein Also includes: Optical components are disposed on the display panel; as well as A cover window is disposed on the optical component.

11. The display device according to claim 10, characterized in that, The cover window is made of plastic.

12. A display device, comprising: The display panel includes a curved area and a non-curved area adjacent to the curved area; A substrate is disposed below the display panel and has a through hole that overlaps with the curved area; The conductive part is filled with the through hole; A flexible printed circuit board includes a first side connected to the conductive portion and a second side facing the first side; The first membrane is in contact with the first surface that overlaps the non-curved region; as well as The second membrane is in contact with the upper surface of the first membrane. In this configuration, the flexible printed circuit board is in direct contact with one end of the conductive portion that penetrates the substrate, and the other end of the conductive portion is in direct contact with the display panel. The display panel and the substrate are in close contact with each other without any gaps, and in the curved region, the substrate and the display panel bend downward together. The first film and the second film extend to and terminate at the boundary between the curved region and the non-curved region, such that the flexible printed circuit board overlapping the curved region forms a height difference relative to the substrate, and the height difference is maximized at the boundary.

13. The display device according to claim 12, characterized in that, The second surface, which overlaps with the curved region, is exposed to the outside.

14. The display device according to claim 12, characterized in that, The second membrane is disposed between the first membrane and the substrate.

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