Pressing apparatus and display device

Abstract

The application provides a pressing device and a display device. The pressing device comprises a pressing head component and a supporting component. The pressing head component is configured to apply pressure to a side of a die bonding structure away from an adhesive film. The supporting component is arranged opposite to the pressing head component and comprises a main body and a protruding part. The protruding part is arranged in the same plane as the main body and protrudes from one side of the main body. The main body is configured to apply pressure to a side of an array substrate away from the adhesive film. The protruding part is configured to apply pressure to a side of an extension part away from the die bonding structure. The pressing device applies pressure to the side of the extension part of the adhesive film away from the die bonding structure by arranging the supporting component as the main body and the protruding part, so that the protruding part can support the adhesive film beyond the bonding area of the array substrate, avoiding the adhesive film beyond the bonding area of the array substrate from being in a suspended state.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a pressing device and a display device. Background Technology

[0002] Currently, narrow bezels on display devices such as televisions, mobile phones, and watches are popular due to their high screen-to-body ratio and simple appearance, making narrower bezels a growing trend.

[0003] The display substrate of a display device needs to be connected to external control devices such as driver chips through a lamination process. However, due to the structural design of the lamination equipment, the current lamination process is prone to poor lamination, which affects the reliability of the display substrate. Summary of the Invention

[0004] This application provides a pressing device and a display device. The pressing device sets a support member as a main body and a protrusion. The protrusion applies pressure to the side of the extension of the adhesive film away from the flip-chip packaging structure, thereby enabling the protrusion to support the extension of the adhesive film and preventing the extension of the adhesive film from being suspended.

[0005] This application provides a bonding apparatus for bonding an array substrate, an adhesive film, and a flip-chip package structure. The array substrate includes a bonding region. The adhesive film includes a bonding portion and an extension portion, the bonding portion being fixed to the bonding region of the array substrate, and the extension portion extending beyond the array substrate. The flip-chip package structure is located on the side of the adhesive film facing away from the array substrate. The bonding apparatus includes a pressure head component and a support component. The pressure head component is configured to apply pressure to the side of the flip-chip package structure facing away from the adhesive film. The support component is disposed opposite to the pressure head component and includes a main body portion and a protrusion portion. The protrusion portion is coplanar with the main body portion and protrudes from one side of the main body portion. The main body portion is configured to apply pressure to the side of the array substrate facing away from the adhesive film, and the protrusion portion is configured to apply pressure to the side of the extension portion facing away from the flip-chip package structure.

[0006] In the above solution, by applying pressure to the side of the film extension that is away from the flip-chip packaging structure using the protrusion, the film extension is prevented from being suspended and contamination of the support components and array substrate surfaces caused by the film extension is also avoided. This ensures that subsequent display device manufacturing processes, such as back scribing of the array substrate or bending of the flip-chip packaging structure, are not affected, thereby improving the product yield of the display device.

[0007] In one specific embodiment of the first aspect of this application, the distance between the surface of the protrusion facing the pressure head member and the surface of the main body facing the pressure head member is substantially equal to the thickness of the portion of the array substrate located in the bonding region.

[0008] In the above solution, the surface of the extension facing the support member and the surface of the bonding part facing the support member can be located on the same plane, thus avoiding bending of the adhesive film.

[0009] In one specific embodiment of the first aspect of this application, the first orthographic projection of the surface of the extension pressure head member facing the support member on the plane lies within the second orthographic projection of the protrusion on the plane of the surface of the pressure head member facing the support member.

[0010] In one specific embodiment of the first aspect of this application, the support member is L-shaped.

[0011] In one specific embodiment of the first aspect of this application, the third orthographic projection of the pressure head component on the plane of the support component opposite to the pressure head component is located within the surface of the support component opposite to the pressure head component.

[0012] In one specific embodiment of the first aspect of this application, the surface of the protrusion facing the pressure head component has anti-stick properties.

[0013] In the above solution, adhesive film can be avoided on the surface of the protrusion facing the pressure head component, which is conducive to the separation of the pressure head device and the display device and effectively reduces the risk of damage to the display device or the pressing device.

[0014] In one specific embodiment of the first aspect of this application, the surface of the protrusion facing the pressure head component has an anti-adhesive coating, and the anti-adhesive coating has a surface tension of less than 0.1 N / m.

[0015] In one specific embodiment of the first aspect of this application, the protrusion is made of an anti-stick material having a surface tension of less than 0.1 N / m.

[0016] In one specific embodiment of the first aspect of this application, the adhesive force between the protrusion and the extension is less than the adhesive force between the flip-chip package structure and the extension.

[0017] A second aspect of this application provides a display device formed by pressing together the bonding apparatus described in any embodiment of the first aspect. The display device includes an array substrate, an adhesive film, and a flip-chip encapsulation structure. The display substrate includes a bonding region. The adhesive film includes a bonding portion and an extension portion. The bonding portion is fixed to the bonding region of the array substrate, and the extension portion extends beyond the array substrate and is fixed to the side of the flip-chip encapsulation structure facing the adhesive film. The flip-chip encapsulation structure is located on the side of the adhesive film facing away from the array substrate. Attached Figure Description

[0018] Figure 1 The diagram shows a structural schematic of a pressing device used in pressing a display device.

[0019] Figure 2A The diagram shown is a structural schematic of a pressing device provided in an embodiment of this application when pressing a display device.

[0020] Figure 2B As shown Figure 2A A schematic diagram of the pressing device in the illustrated embodiment.

[0021] Figure 2C As shown Figure 2A A schematic diagram of the display device in the illustrated embodiment.

[0022] Figure 3 The diagram shown is a structural schematic of a pressing device provided in another embodiment of this application when pressing a display device.

[0023] Figure 4 The diagram shown is a structural schematic of a pressing device provided in another embodiment of this application when pressing a display device.

[0024] Figure 5 The diagram shown is a structural schematic of a pressing device provided in another embodiment of this application when pressing a display device. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] like Figure 1 As shown, the display device 100 includes an array substrate 110, an adhesive film 120, and a flip-chip encapsulation structure 130. The array substrate 110 includes a bonding region 1. The flip-chip encapsulation structure 130 is located on the side of the adhesive film 120 opposite to the array substrate 110.

[0027] It should be noted that the display device 100 may include a display panel, which includes an opposing display substrate and a cover plate 140. The display substrate includes an array substrate 110 and a display functional layer 150 located on the array substrate 110. Light-emitting devices arranged in an array are disposed in the display functional layer 150. The bonding area 1 may include the area on the array substrate 110 used for bonding the adhesive film 120 and the flip-chip encapsulation structure 130, and may also include other areas on the array substrate 110 extending from the cover plate 140. The bonding area 1 can be divided according to the actual situation.

[0028] For example, the array substrate 110 can be fabricated using techniques such as Low Temperature Poly-Silicon (LTPS). The array substrate 110 may include a substrate and a driving circuit layer. The driving circuit layer may include pixel driving circuits. In each sub-pixel corresponding to a light-emitting device, the pixel driving circuit may include multiple transistors, capacitors, etc., for example, formed in various forms such as 2T1C (i.e., 2 transistors (T) and 1 capacitor (C)), 3T1C, or 7T1C. The pixel driving circuit is connected to the light-emitting device to control the switching state and brightness of the light-emitting device.

[0029] For example, the adhesive film 120 can be an anisotropic conductive film (ACF).

[0030] For example, the flip-chip package structure 130 can be a package structure with flip-chip, such as a chip on film (COF) or a chip on glass (COG). For example, the flip-chip package structure 130 can also be a flexible circuit board with a driver chip.

[0031] For example, the cover plate 140 can be a glass cover plate (Encap Glass) or an acrylic cover plate, etc.

[0032] The bonding apparatus 200 includes a pressure head component 210 and a support component 220. The pressure head component 210 is configured to apply pressure to the side of the flip-chip package structure 130 opposite to the adhesive film 120. The surface of the support component 220 is a plane parallel to the plane of the array substrate 110, and the support component 220 is only used to apply pressure to the side of the array substrate 110 opposite to the adhesive film 120. As the bezel of the display device becomes narrower, the bonding region 1 of the array substrate 110 also becomes narrower, such as the length of the bonding region 1 (along...) Figure 1 The length of the adhesive film 120 (parallel to the X-axis) is 0.3 mm or 0.5 mm, etc. Assuming the required length of the adhesive film 120 to be attached to the array substrate 110 is 0.3 mm, but due to the limitations of the cutting size, the length of the adhesive film 120 is usually greater than 0.3 mm, and therefore it can only be attached beyond the bonding area 1 of the array substrate 110. Since the adhesive film 120 extending beyond the bonding area 1 of the array substrate 110 is in a suspended state, it is very easy to fall onto the support components and the surface of the array substrate 110, causing contamination. In severe cases, it may even affect subsequent display device manufacturing processes, such as the back scribing of the array substrate 110 or the bending of the flip-chip packaging structure 130.

[0033] In view of the above, at least one embodiment of this application provides a pressing apparatus and a display apparatus, which can at least solve the above-mentioned problems. The pressing apparatus includes a pressing head component and a supporting component. The pressing head component is configured to apply pressure to the side of the flip-chip package structure opposite to the adhesive film. The supporting component is disposed opposite to the pressing head component and includes a main body portion and a protrusion portion. The protrusion portion is coplanar with the main body portion and protrudes from one side of the main body portion. The main body portion is configured to apply pressure to the side of the array substrate opposite to the adhesive film, and the protrusion portion is configured to apply pressure to the side of the extension portion opposite to the flip-chip package structure. In this bonding apparatus, a support component including a main body and a protrusion is provided. The protrusion applies pressure to the side of the extension of the adhesive film away from the flip-chip packaging structure, thereby enabling the protrusion to support the extension of the adhesive film (i.e., the adhesive film that extends beyond the bonding area of ​​the array substrate). This prevents the extension of the adhesive film from being suspended and also prevents the extension of the adhesive film from contaminating the support component and the surface of the array substrate. This ensures that subsequent display device manufacturing processes, such as back scribing of the array substrate or bending of the flip-chip packaging structure, are not affected, thus improving the product yield of the display device.

[0034] The pressing apparatus and display apparatus according to at least one embodiment of the present application will now be described with reference to the accompanying drawings. Furthermore, in these drawings, a Cartesian coordinate system is established with reference to the array substrate of the display apparatus to aid in explaining the positional relationships of the various structures in the display apparatus and the pressing apparatus. In this Cartesian coordinate system, the Y-axis is perpendicular to the plane of the array substrate. Additionally, in the embodiments of the present application, "length" is defined in a direction parallel to the X-axis; for example, the difference in the straight-line distance between the two farthest endpoints of the object in a direction parallel to the X-axis is the length of the object. "Thickness" is defined with reference to the array substrate; for example, for an object located on one side of the array substrate, the difference in the vertical distance from the farthest end of the object to the array substrate and the vertical distance from the closest end of the object to the substrate is the thickness of the object.

[0035] In at least one embodiment of this application, such as Figures 2A to 5As shown, the bonding apparatus 300 is used to bond an array substrate 110, an adhesive film 120, and a flip-chip package structure 130. The adhesive film 120 includes a bonding portion 121 and an extension portion 122. The bonding portion 121 is fixed to the bonding area 1 of the array substrate 110, and the extension portion 122 extends beyond the array substrate 110. The bonding apparatus 300 includes a pressure head component 310 and a support component 320. The pressure head component 310 is configured to apply pressure to the side of the flip-chip package structure 130 opposite to the adhesive film 120. The support component 320 is disposed opposite to the pressure head component 310 and includes a main body portion 321 and a protrusion portion 322. The protrusion portion 322 is coplanar with the main body portion 321 and protrudes from one side of the main body portion 321. The main body 321 is configured to apply pressure to the side of the array substrate 110 away from the adhesive film 120, and the protrusion 322 is configured to apply pressure to the side of the extension 122 away from the flip-chip packaging structure 130.

[0036] The protrusion 322 and the main body 321 are coplanar, meaning the protrusion 322 and the main body 321 have the same plane, which can be parallel to the plane of the array substrate 110. The support member 320 and the pressure head member 310 are arranged opposite each other, either in a fixed manner, for example, the positions of the support member 320 and the pressure head member 310 are opposite and fixed, or in a movable manner, for example, after moving the support member 320 or the pressure head member 310, the support member 320 and the pressure head member 310 are arranged face to face. In this way, by setting the support component in the pressing device as a main body and a protrusion, the protrusion applies pressure to the side of the extension of the adhesive film away from the flip-chip packaging structure, thereby enabling the protrusion to support the extension of the adhesive film and preventing the extension of the adhesive film from being suspended. This avoids contamination of the support component and the surface of the array substrate caused by the extension of the adhesive film being suspended, and thus ensures that subsequent display device manufacturing processes, such as back scribing of the array substrate or bending of the flip-chip packaging structure, are not affected, thereby improving the product yield of the display device.

[0037] For example, in some embodiments of this application, the protrusion 322 faces the surface S of the pressure head component 310. 322 The surface S of the main body 321 facing the pressure head component 310 321 The spacing D between them is approximately equal to the thickness T of the portion of the array substrate 110 located in the bonding region 1. D can be exactly equal to T, or slightly less than or slightly greater than T, and a certain error is allowed between D and T.

[0038] If D and T are basically equal, the surface of the extension 122 facing the support member 320 and the surface of the bonding part 121 facing the support member 320 can be located on the same plane, which avoids the film bending and also helps to prevent the flip-chip packaging structure from bending or being damaged due to the film bending during the pressing process.

[0039] In at least one embodiment of the pressing device provided in this application, the extension 122 extends on the surface of the pressure head member 310 facing the support member 320. 310 The first orthographic projection on the plane of the protrusion 322 is located on the surface S of the pressure head component 310 facing the support component 320. 310 The first orthographic projection of the extension on the plane facing the support member is located within the second orthographic projection of the protrusion on the plane facing the support member. This ensures that the protrusion can support the entire extension. Furthermore, when pressure is applied to the side of the extension away from the flip-chip package structure by the protrusion, the entire extension can be fixed to the flip-chip package structure, further reducing the risk that the extension will be suspended after being pressed by the pressing device.

[0040] refer to Figure 2A and Figure 2B The surface S of the protrusion 322 facing the pressure head component 310 322 The area can be larger than the surface S of the extension 122 facing the protrusion 322. 122 The area of ​​the first orthographic projection can be smaller than the area of ​​the second orthographic projection. (Reference) Figures 3 to 5 The surface S of the protrusion 322 facing the pressure head component 310 322 The area can also be equal to the surface S of the extension 122 facing the protrusion 322. 122 The area of ​​the first orthographic projection can be equal to the area of ​​the second orthographic projection.

[0041] In at least one embodiment of the pressing device provided in this application, the support member 320 is L-shaped. (See reference...) Figures 3 to 5The support member 320 is L-shaped, with the protrusion 322 flush with one side of the main body 321, forming a step on the surface of the support member 320 facing the pressure head member 310. The upper step surface of the protrusion 322 facing the pressure head member 310 forms the upper step surface, which supports the extension 122. The lower step surface of the main body 321 facing the pressure head member 310 forms the lower step surface, which supports the main body 321. Thus, by setting the support member to be L-shaped, the support member can be adapted to the structure of the array substrate and the adhesive film to be pressed. The surface of the support member facing the pressure head member simultaneously supports the extensions of both the array substrate and the adhesive film, preventing the extensions of the adhesive film from being suspended and making the structure of the support member more compact.

[0042] In at least one embodiment of the pressing apparatus provided in this application, the pressing head component 310 is located on the surface S of the support component 320 opposite to the pressing head component 310. 320 The third orthographic projection on the plane is located on the surface S of the support member 320 opposite to the pressure head member 310. 320 Within. Thus, by setting the third orthographic projection of the pressure head component on the plane of the support component opposite to the pressure head component to be within the surface of the support component opposite to the pressure head component, the support component can provide sufficient pressure to the display device when the display device is pressed using the pressing device, making the position of the display device more stable, and thus helping to press the display device more tightly.

[0043] For example, refer to Figure 2A and Figure 2B The surface S of the pressure head component 310 facing the support component 320 310 The area can be smaller than the surface S of the support member 320 away from the pressure head member 310. 320 Correspondingly, the projected area of ​​the third orthographic projection can be smaller than the surface S of the support member 320 away from the pressure head member 310. 320 The area. For example, the surface S of the pressure head component 310 facing the support component 320. 310 The area can also be equal to the surface S of the support component 320 away from the pressure head component 310. 320 The area of ​​the third orthographic projection is equal to the surface S of the support member 320 away from the pressure head member 310. 320 The area.

[0044] It should be noted that the pressure head component 310 is located on the surface S of the support component 320 opposite to the pressure head component 310. 320 The projected area of ​​the third orthographic projection on the plane can also be larger than the surface S of the support member 320 away from the pressure head member 310. 320 (refer to Figure 4 or Figure 5 The pressure head component 310 is located on the surface of the support component 320 opposite to the pressure head component 310. 320 The third orthographic projection on the plane can also be relative to the surface S of the support member 320 that is opposite to the pressure head member 310. 320 Partial overlap is acceptable, as long as the pressing device can press the array substrate 110, the adhesive film 120 and the flip-chip encapsulation structure 130 tightly together.

[0045] In the pressing device provided in at least one embodiment of this application, the surface S of the protrusion 322 facing the pressure head member 310 322 It has anti-adhesive properties. Adhesive films have a certain degree of adhesion; if the extended portion of the adhesive film adheres to the array substrate or the support component of the pressing device, it will hinder the separation of the pressing device from the array substrate, and may even damage the display device or the pressing device during the separation process. In at least one embodiment of this application, by providing an anti-adhesive surface for the protrusion facing the pressing head component, adhesive film adhesion to the surface of the protrusion facing the pressing head component can be avoided, thus facilitating the separation of the pressing head device from the array substrate and effectively reducing the risk of damage to the array substrate or the pressing device.

[0046] The following describes how the surface of the protrusion 322 facing the pressure head component has anti-stick properties through several specific embodiments.

[0047] For example, in some embodiments of this application, reference is made to Figure 4 The surface of the protrusion 322 facing the pressure head component 310 has an anti-adhesion coating 3221, and the anti-adhesion coating 3221 has a surface tension of less than 0.1 N / m. This makes the surface of the protrusion facing the pressure head component a low-energy surface, making it difficult for adhesive film to adhere to the surface of the protrusion facing the pressure head component, or even if it is forcibly adhered, it will not adhere firmly. This facilitates the separation of the pressure head device from the array substrate and effectively reduces the risk of damage to the array substrate or the pressing device. Furthermore, since the anti-adhesion coating can be formed on the surface constituting the protrusion facing the pressure head component using simple methods such as electrostatic spraying or plasma spraying, the fabrication method of the support component can be simplified.

[0048] Anti-adhesive coating 3221 is any coating with anti-adhesive function, as long as it can prevent adhesion to adhesive films. Anti-adhesive coating 3221 can be a coating made of film-forming substances and anti-adhesive materials.

[0049] It should be noted that solid surfaces are generally classified into two main categories based on their ease of wetting: high-energy surfaces and low-energy surfaces. Surfaces with a surface tension below 0.1 N / m are generally referred to as high-energy surfaces, while surfaces with a surface tension above 0.1 N / m are referred to as low-energy surfaces.

[0050] For example, in other embodiments of this application, reference is made to Figure 5 The protrusion 322 is made of an anti-adhesive material 3222, which has a surface tension of less than 0.1 N / m. This ensures that the surface of the protrusion facing the pressure head component, as well as the two surfaces adjacent to it, are low-energy surfaces. Consequently, the adhesive film is difficult to adhere to any surface of the protrusion, or even if it is managed to adhere, it will not adhere firmly. This facilitates the separation of the pressure head device from the array substrate, effectively reducing the risk of damage to the array substrate or the pressing device.

[0051] The anti-stick material 3222 is a material with anti-sticking function, including but not limited to silicone compounds, polytetrafluoroethylene, or other materials with low surface tension. The anti-stick material 3222 can be evenly distributed within the protrusion 322.

[0052] In one specific embodiment of this application, the adhesive force between the protrusion 322 and the extension 122 is less than the adhesive force between the flip-chip package structure 130 and the extension 122. Thus, when the pressing device separates from the extension, the extension can be easily separated from the protrusion, avoiding damage to the array substrate or flip-chip package structure caused by difficulty in separating the pressing device from the extension of the adhesive film.

[0053] At least one embodiment of this application also provides a display device, which is derived from any of the above embodiments, such as based on... Figures 2A to 5 The components are formed by pressing together using the pressing device in the illustrated embodiment. For example, see specific reference. Figures 2C to 5 The display device, excluding the lamination device, includes an array substrate 110, an adhesive film 120, and a flip-chip encapsulation structure 130. The array substrate 110 includes a bonding region 1. The adhesive film 120 includes a bonding portion 121 and an extension portion 122. The bonding portion 121 is fixed to the bonding region 1 of the array substrate 110, and the extension portion 122 extends beyond the array substrate 110 and is fixed to the side of the flip-chip encapsulation structure 130 facing the adhesive film 120. The flip-chip encapsulation structure 130 is located on the side of the adhesive film 120 opposite to the array substrate 110.

[0054] For example, the process of pressing the array substrate 110, the adhesive film 120 and the flip-chip encapsulation structure 130 using a pressing device can be as follows: the array substrate 110 is supported by the main body 321 of the support member 320 in the pressing device; one side of the adhesive film 120 is attached to the array substrate 110 and the protrusion 322; the flip-chip encapsulation structure 130 is attached to the other side of the adhesive film 120; then the pressing head member 310 is brought closer to the support member 320 to press the flip-chip encapsulation structure 130, the adhesive film 120 and the array substrate 110 together; further steps can be performed to form the final display device.

[0055] The display device in the embodiments of this application can be any product or component with display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, or navigator.

[0056] The display device in the embodiments of this application is based on any of the above embodiments, such as those based on Figures 2A to 5 The pressing device in the illustrated embodiment is used for pressing, which can prevent the extension of the adhesive film from falling onto the surface of the array substrate facing the protrusion and causing contamination. This helps to ensure that subsequent display device manufacturing processes, such as back scribing of the array substrate or bending of the flip-chip packaging structure, are not affected, and thus allows various components of the display device, such as the array substrate and the flip-chip packaging structure, to maintain good performance.

[0057] It should be noted that, for clarity, the entire structure of the display device described above is not presented. Those skilled in the art can configure other structures to achieve the necessary functions of the display panel, depending on the specific application scenario.

[0058] It should also be noted that the combination of the technical features in this case is not limited to the combination methods described in the claims of this case or the combination methods described in the specific embodiments. All the technical features described in this case can be freely combined or combined in any way, unless they contradict each other.

[0059] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications or equivalent substitutions made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A lamination apparatus for laminating an array substrate, an adhesive film, and a flip-chip package structure, wherein the array substrate includes a bonding region, the adhesive film includes a bonding portion and an extension portion, the bonding portion is fixed to the bonding region of the array substrate, the extension portion extends beyond the array substrate, and the flip-chip package structure is located on the side of the adhesive film opposite to the array substrate, characterized in that, The pressing device includes: A pressure head component configured to apply pressure to the side of the flip-chip package structure opposite to the adhesive film; and A support member is disposed opposite to the pressure head member and includes a main body and a protrusion. The protrusion is coplanar with the main body and protrudes from one side of the main body. The distance between the surface of the protrusion facing the pressure head member and the surface of the main body facing the pressure head member is substantially equal to the thickness of the portion of the array substrate located in the bonding area. The main body is configured to apply pressure to the side of the array substrate opposite to the adhesive film, and the protrusion is configured to apply pressure to the side of the extension opposite to the flip-chip packaging structure.

2. The pressing device according to claim 1, characterized in that, The first orthographic projection of the extension on the plane of the surface of the pressure head component facing the support component lies within the second orthographic projection of the protrusion on the plane of the surface of the pressure head component facing the support component.

3. The pressing device according to claim 1, characterized in that, The support component is L-shaped.

4. The pressing device according to claim 1, characterized in that, The third orthographic projection of the pressure head component on the plane of the support component opposite to the pressure head component lies within the surface of the support component opposite to the pressure head component.

5. The pressing device according to any one of claims 1-4, characterized in that, The surface of the protrusion facing the pressure head component has anti-stick properties.

6. The pressing device according to claim 5, characterized in that, The surface of the protrusion facing the pressure head component has an anti-stick coating, and The anti-stick coating has a surface tension of less than 0.1 N / m.

7. The pressing device according to claim 5, characterized in that, The protrusion is made of an anti-stick material, and The anti-stick material has a surface tension of less than 0.1 N / m.

8. The pressing device according to any one of claims 1-4, characterized in that, The adhesive force between the protrusion and the extension is less than the adhesive force between the flip-chip package structure and the extension.

9. A display device, characterized in that, The display device is formed by pressing together the pressing device according to any one of claims 1 to 8, and The display device includes an array substrate, an adhesive film, and a flip-chip encapsulation structure. The array substrate includes a bonding area, and the adhesive film includes a bonding portion and an extension portion. The bonding portion is fixed to the bonding area of ​​the array substrate, and the extension portion extends beyond the array substrate and is fixed to the side of the flip-chip encapsulation structure facing the adhesive film. The flip-chip encapsulation structure is located on the side of the adhesive film away from the array substrate.

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