Methods for peeling electronic components and ultrasonic vibration devices for their application

Abstract

This invention relates to a method for peeling off electronic components and an ultrasonic vibration device using the same. The peeling method includes: placing an electronic component board having multiple electronic components on the adhesive surface of a first adhesive film, with a cutting line between adjacent electronic components; cutting along the cutting line; performing a de-adhesive treatment on the first adhesive film to reduce the viscosity between the first adhesive film and the multiple electronic components; and vibrating the back side of the first adhesive film using an ultrasonic vibrator to peel off the multiple electronic components from the first adhesive film, wherein the back side of the first adhesive film is the back side of the adhesive surface. According to the peeling method and ultrasonic vibration device of the present invention, the ultrasonic vibrator vibrates the back side of the adhesive film, without directly contacting the electronic components, effectively peeling the electronic components from the adhesive surface of the film without causing compression or adhesive breakage, thus ensuring the integrity of the electronic components.

Description

Technical Field

[0001] This invention relates primarily to the field of electronic component manufacturing, and more particularly to a method for peeling off electronic components and an ultrasonic vibration device using the same. Background Technology

[0002] Surface mount LEDs (LEDs) are widely used in electronics, decoration, and lighting due to their small size and ease of use. In the manufacturing process of surface mount LEDs, die bonding is typically performed on a single adhesive film to form an LED board containing multiple LEDs. This board is then cut to obtain individual LEDs. To peel the LEDs off the adhesive film, tools such as die-peeling jigs are often used. However, using such tools can cause the LEDs to be squeezed or stuck within the jig, potentially leading to cracking of the LED board or damage to the adhesive film. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a method for peeling off electronic components without direct contact and without damage, and an ultrasonic vibration device for using the same.

[0004] The present invention provides a method for peeling off electronic components to solve the above-mentioned technical problems. The method comprises: placing an electronic component board having multiple electronic components on the adhesive surface of a first adhesive film, with cutting lines between adjacent electronic components; cutting along the cutting lines; performing a de-adhesive treatment on the first adhesive film to reduce the viscosity between the first adhesive film and the multiple electronic components; and vibrating the back side of the first adhesive film using an ultrasonic vibrator to peel off the multiple electronic components from the first adhesive film, wherein the back side of the first adhesive film is the back side of the adhesive surface.

[0005] In one embodiment of the present invention, cutting along the cutting line includes: not cutting the first adhesive film.

[0006] In one embodiment of the present invention, the plurality of electronic components are disposed on a substrate, and cutting along the cutting line includes cutting the substrate.

[0007] In one embodiment of the present invention, the first adhesive film is a UV adhesive film, and the de-adhesion treatment of the first adhesive film includes: irradiating the first adhesive film with ultraviolet light.

[0008] In one embodiment of the present invention, the energy range of the ultraviolet light is 800-1600 mJ / cm. 2 .

[0009] In one embodiment of the present invention, the vibration frequency of the ultrasonic transducer is 100Hz-20kHz.

[0010] In one embodiment of the present invention, the ultrasonic vibrator is set to stop working after a first preset time, and to resume working after a second preset time.

[0011] In one embodiment of the present invention, a receiving device is used to receive electronic components peeled off from the first adhesive film.

[0012] In one embodiment of the present invention, before cutting along the cutting line, the method further includes: placing a first adhesive film on which the plurality of electronic components are disposed on a second adhesive film of the cutting frame, and cutting along the cutting line includes: not cutting the second adhesive film.

[0013] In one embodiment of the present invention, the ultrasonic vibrator includes a vibrating head with an inclined surface, and vibrating the back side of the first adhesive film with the ultrasonic vibrator includes: the inclined surface contacting the back side of the first adhesive film.

[0014] To address the aforementioned technical problems, this invention also proposes an ultrasonic vibration device for peeling electronic components off an adhesive film. The device comprises: a housing having an opening facing the side; an ultrasonic vibrator disposed inside the housing, the ultrasonic vibrator having a sloping vibrating head; and a controller disposed outside the housing and connected to the ultrasonic vibrator, the controller being used to set the vibration parameters of the ultrasonic vibrator.

[0015] In one embodiment of the present invention, when performing the peeling of electronic components on the adhesive film, the controller sets the vibration frequency of the ultrasonic transducer to 100Hz-20kHz.

[0016] In one embodiment of the present invention, when performing the peeling of electronic components on the adhesive film, the controller sets the ultrasonic vibrator to stop after a first preset time and to resume operation after a second preset time.

[0017] In one embodiment of the invention, when performing the peeling of electronic components on the adhesive film, the inclined surface of the vibrating head contacts the back side of the adhesive film.

[0018] The electronic component peeling method and ultrasonic vibration device of the present invention use an ultrasonic vibrator to vibrate the back of the adhesive film without directly contacting the electronic component. This effectively peels the electronic component from the adhesive surface of the film without causing compression or damage to the adhesive, thus ensuring the integrity of the electronic component. Operators do not need to directly contact the electronic component, ensuring that the electronic component is not contaminated. Attached Figure Description

[0019] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings, wherein:

[0020] Figure 1 This is an exemplary process of an electronic component stripping method according to an embodiment of the present invention;

[0021] Figure 2A and 2B One of the schematic diagrams of the peeling method according to another embodiment of the present invention;

[0022] Figure 3 This is a second schematic diagram of the peeling method according to an embodiment of the present invention;

[0023] Figure 4A and Figure 4B This is a schematic diagram of the state of an electronic component before and after being stripped, according to an embodiment of the present invention;

[0024] Figure 5A and 5B This is one of the process schematic diagrams of a peeling method according to another embodiment of the present invention;

[0025] Figure 6 This is a second schematic diagram of the peeling method according to another embodiment of the present invention;

[0026] Figure 7 This is a schematic diagram of the ultrasonic vibration device in a peeling method according to an embodiment of the present invention;

[0027] Figure 8 This is a schematic diagram of the vibrating head of the ultrasonic transducer in a stripping method according to an embodiment of the present invention. Detailed Implementation

[0028] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0029] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the invention is not limited to the specific embodiments disclosed below.

[0030] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not specifically singular and may include plural forms. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0031] In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0032] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application. In addition, although the terminology used in this application is selected from commonly known and used terms, some terms mentioned in this application's specification may have been chosen by the applicant according to his or her judgment, and their detailed meanings are explained in the relevant sections of this description. Moreover, this application should be understood not only through the actual terms used, but also through the meaning implied by each term.

[0033] Hereinafter, embodiments of the present invention will be described based on the accompanying drawings. However, the embodiments shown below are examples of light-emitting elements and manufacturing methods thereof used to embody the technical concept of the present invention, and the light-emitting device and manufacturing method thereof of the present invention are not specifically defined as follows. Furthermore, in order to facilitate understanding of the scope of the claims, the components shown in the "Claims" and "Summary of the Invention" columns are assigned numbers corresponding to the components shown in the embodiments. However, the components shown in the claims are not intended to be specific to the components of the embodiments. In particular, the dimensions, materials, shapes, and relative arrangements of the constituent components described in the embodiments are not intended to limit the scope of the present invention unless specifically stated otherwise, but are merely illustrative examples.

[0034] However, the dimensions or positional relationships of the components shown in the accompanying drawings are sometimes exaggerated for clarity. Therefore, in the following description, detailed descriptions of the same names and symbols, representing the same or homogeneous components, are appropriately omitted. Furthermore, the elements constituting the present invention can be multiple elements composed of the same components, thus allowing one component to function as multiple elements; conversely, multiple components can share the function of one component. Additionally, the content described in some embodiments and implementations can be applied to other embodiments and implementations. Furthermore, in this specification, "upper" is not limited to the case of being formed in contact with an upper surface, but also includes the case of being formed separately on top, and also includes the meaning of an interlayer between layers.

[0035] Flowcharts are used in this application to illustrate the operations performed by the system according to embodiments of this application. It should be understood that the preceding or following operations are not necessarily performed in exact order. Instead, various steps can be processed in reverse order or simultaneously. Furthermore, other operations may be added to these processes, or one or more steps may be removed from these processes.

[0036] Figure 1 This is an exemplary process of an electronic component stripping method according to an embodiment of the present invention. Figure 2A , 2B and Figure 3 This is a schematic diagram of the peeling method in this embodiment. Therefore, the following is combined with... Figure 2A , 2B and Figure 3 This describes the peeling method of this embodiment. (See reference...) Figure 1 As shown, the peeling method of this embodiment includes the following steps:

[0037] Step 110: Place an electronic component board with multiple electronic components on the adhesive surface of a first adhesive film, with cutting lines between adjacent electronic components.

[0038] Figure 2A and 2B This diagram shows the electronic components before they were stripped. Figure 2A This is a top view schematic diagram of a first adhesive film 220 comprising multiple electronic component boards 210. Figure 2B yes Figure 2A A cross-sectional view along line AA'.

[0039] refer to Figure 2A As shown, the first adhesive film 220 is rectangular, and multiple rectangular electronic component boards 210 are disposed on the first adhesive film 220. The multiple electronic component boards 210 are arranged neatly in rows and columns, and there is a certain spacing between adjacent electronic component boards 210. Figure 2A As shown, the first adhesive film 220 has eight electronic component boards 210 arranged in four rows and two columns. Each electronic component board 210 may have multiple electronic components (not shown), which may be, for example, active components, passive components, light-emitting diodes (LEDs), laser diodes (LDs), sensors, memory components, or integrated circuits (ICs). The electronic components may include chips, substrates / supports, wires, and encapsulants. The LEDs and LDs may emit white light, ultraviolet light, blue light, blue-green light, green light, yellow-green light, yellow light, orange light, red light, infrared light, or far-infrared light. The sensors may sense white light, ultraviolet light, blue light, blue-green light, green light, yellow-green light, yellow light, orange light, red light, infrared light, or far-infrared light.

[0040] Understandable. Figure 2A This is for illustrative purposes only and is not intended to limit the size and shape of the first adhesive film 220, nor to limit the size, shape, number, and arrangement of the electronic component boards 210 on the first adhesive film 220, or the size, number, and arrangement of the electronic components on the electronic component boards 210. Different electronic component boards 210 located on the same first adhesive film 220 may also have different sizes and shapes.

[0041] In this step, multiple electronic components are disposed on the adhesive surface of a first adhesive film 220. It should be noted that the adhesive surface of the first adhesive film 220 refers to the side of the first adhesive film 220 that has adhesive properties, and the multiple electronic components are adhered to this adhesive surface. In some embodiments, the first adhesive film 220 is a single-sided adhesive film. The other side opposite to this adhesive surface, i.e., the back side of the adhesive surface, is not adhesive.

[0042] In this step, according to the production process, multiple electronic components are formed on an electronic component board 210. Therefore, this step can be carried out by attaching multiple electronic component boards 210 to the adhesive surface of the first adhesive film 220. In some embodiments, multiple electronic components can also be directly attached to the adhesive surface of the first adhesive film 220.

[0043] In embodiments of the present invention, a cutting line is provided between adjacent electronic components. The purpose of the cutting line is to allow the cutting machine to cut along the cutting line in subsequent cutting steps, thereby separating each electronic component. The cutting line can be a straight line or a curve. The present invention does not limit the line width of the cutting line. It is understood that the cutting action along the cutting line will not affect the electronic component itself, that is, it will not affect the physical properties of the electronic component.

[0044] In some embodiments, before cutting the electronic components, the method further includes: placing a first adhesive film 220, on which a plurality of electronic components are disposed, on a cutting frame. (See reference) Figure 2A As shown, the cutting frame may include a frame 230. In this embodiment, the frame 230 is a rectangular frame structure, and the frame 230 supports the following: Figure 2A The diagram shows 8 electronic component boards 210 arranged in 4 rows and 2 columns. This invention does not limit the shape and size of the cutting frame 230 or the number of electronic component boards 210 it can support.

[0045] Figure 2B This is a schematic cross-sectional view of a first adhesive film including an electronic component board, the cross-section being viewed along... Figure 2A The direction of line AA' shown. Combined with... Figure 2A and Figure 2BAs shown, the edge of the frame 230 is located between the electronic component board 210 and the first adhesive film 220. Essentially, the first adhesive film 220 serves as the bottom surface of the frame 230, and the electronic component board 210 is adhered to the first adhesive film 220 rather than the frame 230. Figure 2B As shown, the electronic component board 210 is located above the first adhesive film 220. When the entire first adhesive film 220 is flipped up and down, and the electronic component board 210 is located below the first adhesive film 220, the electronic component board 210 will not fall off the first adhesive film 220 due to gravity, and the multiple electronic components on the electronic component board 210 will not fall off either.

[0046] exist Figure 2B In the illustrated embodiment, the upper surface of the electronic component board 210 is flush with the upper surface of the frame 230's edge. In other embodiments, the upper surface of the electronic component board 210 may be lower or higher than the upper surface of the frame 230's edge.

[0047] Step 120: Cut along the cutting line.

[0048] The purpose of this cutting step is to separate each electronic component.

[0049] In some embodiments, this step includes: not cutting the first adhesive film. For example... Figure 2B As shown, the first adhesive film 220 is cut to a certain thickness, but not completely severed. Therefore, after this step, the multiple electronic components on the electronic component board 210 remain in their original positions and their positions do not change due to the cutting. This invention does not limit the depth of cutting the first adhesive film 220.

[0050] In some embodiments, this step includes cutting through half the thickness of the first adhesive film 220.

[0051] In some embodiments, multiple electronic components on the electronic component board 210 are disposed on a single substrate. This step of cutting along the dicing line further includes cutting the substrate. According to these embodiments, after cutting, the multiple electronic components are interconnected only by the remaining uncut thickness of the first adhesive film 220.

[0052] Step 130: De-adhesive treatment is performed on the first adhesive film to reduce the viscosity between the first adhesive film and multiple electronic components.

[0053] In this step, a degumming process can be performed on the specific material of the first adhesive film to reduce the viscosity of the adhesive surface. This step reduces the viscosity of the adhesive surface of the first adhesive film, but when... Figure 2B When the first adhesive film 220 shown is flipped, the electronic components on the electronic component board 210 will not fall off under the action of gravity.

[0054] In some embodiments, the first adhesive film 220 is an ultraviolet (UV) adhesive film. In these embodiments, de-adhesive treatment of the first adhesive film includes irradiating the first adhesive film with ultraviolet light to reduce the adhesion between the electronic board component 210 and the first adhesive film 220. In some embodiments, the energy range of the ultraviolet light is 800-1600 mJ / cm². 2 .

[0055] For first films made of other materials, the viscosity of the first film can be reduced by appropriate methods such as heating or light exposure.

[0056] Step 140: Use an ultrasonic vibrator to vibrate the back side of the first adhesive film, causing multiple electronic components to peel off from the first adhesive film. The back side of the first adhesive film is the back side of the adhesive surface, that is, the back side is opposite to the adhesive surface.

[0057] Figure 3 This is a second schematic diagram of the peeling method according to an embodiment of the present invention. (See reference) Figure 3 As shown, Figure 2B The frame 230 shown is flipped together with the first adhesive film 220 so that the electronic component board 210 on the first adhesive film 220 faces downward; the ultrasonic vibrator 310 contacts the back side 220b of the first adhesive film 220, so that the vibration generated by the ultrasonic vibrator 310 is transmitted to the first adhesive film 220, and multiple electronic components 320 are peeled off from the adhesive surface 220a of the first adhesive film 220 under the action of vibration.

[0058] Figure 3 It is not used to limit the specific location of the first adhesive film 220 in step 140. Figure 3 The first adhesive film 220 is placed horizontally with the adhesive surface 220a of the electronic component board 210 facing downwards, so that the electronic components can fall under the influence of gravity. In other embodiments, the first adhesive film 220 can be placed in any orientation, such as vertically or at an angle.

[0059] According to the peeling method of the present invention, the ultrasonic vibration energy generated by the ultrasonic transducer causes the electronic component to peel off from the first adhesive film. Since the ultrasonic transducer does not directly contact the electronic component, it avoids squeezing the electronic component or causing damage to the adhesive film, thus ensuring the integrity of the electronic component.

[0060] In some embodiments, the peeling method of the present invention further includes using a receiving device to receive the electronic components peeled from the first adhesive film. Figure 3 In the illustrated embodiment, the receiving device 330 is located below the first adhesive film 220, and the peeled electronic components 320 fall into the receiving device 330 under the influence of gravity. Preferably, the receiving device 330 is a groove-shaped device with side plates to prevent electronic components from falling out.

[0061] In some embodiments, the vibration frequency range of the ultrasonic transducer is 100Hz-20kHz.

[0062] In some embodiments, the ultrasonic vibrator is set to stop operating after a first preset time, and to resume operation after a second preset time. For example, the first preset time is 3 seconds, and the second preset time is 0.6 seconds. The second preset time is shorter than the first preset time.

[0063] In some embodiments, the ultrasonic transducer in the peeling method of the present invention is fixed in position, and the first adhesive film is located below the ultrasonic transducer. The operator moves the first adhesive film so that the back of the first adhesive film at all locations of electronic components is in full contact with the ultrasonic transducer, thereby peeling off all electronic components. The operation of moving the first adhesive film can be performed manually or by appropriate equipment, and the present invention is not limited in this regard. In embodiments using equipment, the movement trajectory of the first adhesive film can be controlled by software.

[0064] In other embodiments, the first adhesive film in the peeling method of the present invention is fixed in position. By moving the ultrasonic vibrator, the back side of the first adhesive film at all locations of electronic components is brought into full contact with the ultrasonic vibrator, thereby peeling off all electronic components. The movement of the ultrasonic vibrator can be done manually or by appropriate equipment, and the present invention does not limit this. For embodiments using equipment, the movement trajectory of the ultrasonic vibrator can be controlled by software.

[0065] In other embodiments, the positions of the ultrasonic vibrator and the first adhesive film in the peeling method of the present invention can be non-fixed, thereby allowing for more flexible movement between them.

[0066] Figure 4A and Figure 4B This is a schematic diagram showing the state of an electronic component before and after being peeled off, according to an embodiment of the present invention. (Reference) Figure 4A As shown, electronic component 410 is a light-emitting diode (LED), comprising a substrate 411, an LED chip 412, and an encapsulant 417. Pads 413 and 414 are provided on the substrate 411. The LED chip 412 is mounted on pad 413 using silver paste 415. The LED chip 412 is connected to pad 414 via leads 416. The encapsulant 417 covers the substrate 411 and the component thereon. Electronic component 410 is disposed on a first adhesive film 220. Figure 4A As shown, the substrate 411 on the electronic component 410 is in contact with the first adhesive film 220. The first adhesive film 220, together with the electronic component 410, is surrounded by the frame 230.

[0067] In one embodiment, the LED chip can be a vertical chip, with its bottom electrode electrically connected to the substrate via silver paste, and its top electrode electrically connected to the substrate via leads. In another embodiment, the LED chip can be a horizontal chip, with its top two electrodes electrically connected to the substrate via two leads. In yet another embodiment, the LED chip can be a flip-chip chip, with its bottom two electrodes electrically connected to the substrate via solder.

[0068] Figure 4A The electronic component 410 shown is an electronic component that has already been cut.

[0069] exist Figure 4A In the process, an ultrasonic vibrator 310 contacts the back side of the first adhesive film 220, so that the vibration is transmitted to the electronic component 410.

[0070] refer to Figure 4B As shown, after vibration, the electronic component 410 is peeled off from the first adhesive film 220.

[0071] Figure 4A and 4B The electronic component 410 shown may represent a plurality of electronic components disposed on the first adhesive film 220.

[0072] Figure 5A , 5B and Figure 6 This is a schematic diagram of a peeling method according to another embodiment of the present invention. In this embodiment, the peeling method of the present invention further includes, before cutting the electronic components, placing a first adhesive film on a second adhesive film of a cutting frame, on which multiple electronic components are disposed. Figure 5A This is a top view of the first adhesive film 520, which includes multiple electronic component boards 510. Figure 5B yes Figure 5A A cross-sectional view along line BB'.

[0073] refer to Figure 5A As shown, the first adhesive film 520 of this embodiment includes a plurality of electronic component boards 510. Figure 5A The first adhesive film 520 and the electronic component board 510 shown are... Figure 2A The first adhesive film 220 shown is similar to the electronic component board 210, and the relevant descriptions can be used for illustration. Figure 5A This will not be elaborated upon here.

[0074] and Figure 2A and 2B Compared to the embodiments shown, Figure 5A and 5BThe cutting frame of the illustrated embodiment includes a second adhesive film 531 in addition to the frame 530. (See reference...) Figure 5B As shown, the second adhesive film 531 is located on the bottom surface of the frame 530, and can serve as the bottom surface of the frame 530. Therefore, the first adhesive film 520 is located above the second adhesive film 531. In this embodiment, the first adhesive film 520 can be a double-sided adhesive, with one side bonded to the electronic component board 510 and the other side bonded to the second adhesive film 531. In some embodiments, the first adhesive film 520 is a single-sided adhesive, with the adhesive side bonded to the electronic component board 510. The second adhesive film 531 is an adhesive film coated with 320 glue.

[0075] refer to Figure 5B As shown, each electronic component board 510 has an independent first adhesive film 520 underneath. This embodiment indicates that each electronic component board 510 is originally independently attached to a first adhesive film 520, and it can also indicate that the first adhesive film 520 is cut during the cutting step.

[0076] exist Figure 5A and 5B In the embodiment shown, the cutting step further includes: not cutting the second adhesive film.

[0077] In some embodiments, the second adhesive film is not cut at all. In other embodiments, the second adhesive film may be cut to a certain thickness. Therefore, even after cutting, multiple electronic components are still interconnected through the second adhesive film 531.

[0078] exist Figure 5B In the illustrated embodiment, the upper surface of the electronic component board 510 is higher than the upper surface of the frame 530. In other embodiments, the upper surface of the electronic component board 510 may be lower than or flush with the upper surface of the frame 530.

[0079] Figure 6 This is a second schematic diagram of the peeling method according to another embodiment of the present invention. (See reference) Figure 6 As shown, Figure 5B The frame 530 and the second adhesive film 531 are flipped so that the adhesive surface 520a of the first adhesive film 520 faces downward and the back surface 520b faces upward. An ultrasonic transducer 310 contacts the back surface of the second adhesive film 531, thereby transmitting the vibration generated by the ultrasonic transducer 310 to the first adhesive film 520. Under the action of vibration, multiple electronic components 320 are peeled off from the adhesive surface 520a of the first adhesive film 520. In this embodiment, the back surface of the second adhesive film 531 is vibrated, thereby vibrating the back surface 520b of the first adhesive film 520.

[0080] Figure 7 This is a schematic diagram of an ultrasonic vibration device according to an embodiment of the present invention. (Reference) Figure 7As shown, the ultrasonic vibration device 700 includes an ultrasonic vibrator 710, a controller 720, and a housing 701, wherein the housing 701 has an opening facing the side. Figure 7 As shown, the side 702 of the housing 701 facing the observer is open, exposing the ultrasonic transducer 710 located inside. The ultrasonic transducer 710 is located inside the housing 701, while the controller 720 is located outside the housing 701. The ultrasonic transducer 710 is connected to the controller 720, and the controller 720 can be used to set and adjust parameters such as the energy and frequency of the ultrasonic transducer. In this embodiment, the position of the ultrasonic transducer 710 is fixed.

[0081] When peeling off electronic components, the operator places the adhesive film to be peeled, back side up, under the ultrasonic vibrator 710, ensuring the vibrator 710 is in contact with the back of the film. By adjusting the position of the film, the electronic component is completely peeled off. The housing 701 provides an area for peeling off electronic components. The side of the housing 701 has an open opening, allowing the operator to place the adhesive film, including the electronic component, under the ultrasonic vibrator 710 to perform the peeling operation. The housing 701 also serves to prevent the peeled electronic components from falling to the ground.

[0082] Figure 7 It is not used to limit the specific shape of the housing 701 or the size or number of openings.

[0083] In some embodiments, the ultrasonic vibrator includes a vibrating head with an inclined surface, and contacting the back side of the first adhesive film with the ultrasonic vibrator includes: the inclined surface contacting the back side of the first adhesive film.

[0084] Figure 8 This is a schematic diagram of the vibrating head of the ultrasonic vibrator in an ultrasonic vibration device according to an embodiment of the present invention. (Reference) Figure 8 As shown, the ultrasonic transducer 800 has a beveled head 810. The present invention does not limit the angle of this bevel. According to this embodiment, the contact area between the transducer 810 and the back of the adhesive film can be increased, thereby improving the peeling efficiency of electronic components.

[0085] Figure 8 The image also shows the ultrasonic transducer 800 fixed in... Figure 7 The top plate of the housing 701 shown has a fixing plate 811 and several fasteners 812. This part is not the focus of the present invention and will not be discussed further here.

[0086] The peeling method of the present invention can be used Figure 7 and Figure 8 The ultrasonic vibration device shown is used to perform this action.

[0087] In some embodiments, when using the ultrasonic vibration device of the present invention to peel off electronic components on the adhesive film, the controller 720 sets the vibration frequency of the ultrasonic vibrator 710 to 100Hz-20kHz.

[0088] In some embodiments, when using the ultrasonic vibration device of the present invention to peel off electronic components from an adhesive film, the controller 720 sets the ultrasonic vibrator 710 to stop operating after a first preset time, and to resume operation after a second preset time. For example, the first preset time is 3 seconds, and the second preset time is 0.6 seconds. The second preset time is shorter than the first preset time.

[0089] In some embodiments, when using the ultrasonic vibration device of the present invention to peel off electronic components from an adhesive film, the inclined surface of the vibrating head 810 contacts the back side of the adhesive film.

[0090] The ultrasonic vibration device of the present invention peels off electronic components from the adhesive film without causing compression or damage to the adhesive, thus ensuring the integrity of the electronic components; the operator does not need to directly contact the electronic components, ensuring that the electronic components are not contaminated.

[0091] While the foregoing disclosure has discussed various examples of embodiments of the invention that are currently considered useful, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments. Rather, the claims are intended to cover all modifications and equivalent combinations that conform to the spirit and scope of the embodiments of the invention. For example, although the system components described above can be implemented by hardware devices, they can also be implemented solely by software solutions, such as installing the described system on existing servers or mobile devices.

[0092] Similarly, it should be noted that, in order to simplify the description of this invention and thus aid in the understanding of one or more embodiments, the foregoing description of the embodiments of this invention sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the invention requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiment disclosed above.

[0093] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of the invention are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0094] Although the present invention has been described with reference to specific embodiments, those skilled in the art should recognize that the above embodiments are merely illustrative of the invention, and various equivalent changes or substitutions can be made without departing from the spirit of the invention. Therefore, any changes or modifications to the above embodiments within the essential spirit of the invention will fall within the scope of the claims of this application.

Claims

1. A method for removing electronic components, characterized in that, include: An electronic component board with multiple electronic components is mounted on the adhesive surface of a first adhesive film. Adjacent electronic components are separated by cutting lines. The electronic component board is mounted on the frame of a cutting frame via the first adhesive film. The edge of the frame is located between the electronic component board and the first adhesive film. The first adhesive film with the multiple electronic components is mounted on a second adhesive film of the cutting frame. The second adhesive film is located on the bottom surface of the frame of the cutting frame. The first adhesive film and the second adhesive film are bonded together. The multiple electronic components on the electronic component board are mounted on a substrate. The second adhesive film is an adhesive film with applied glue. Cut along the cutting line, wherein the first adhesive film is not cut through, but half the thickness of the first adhesive film is cut through, the second adhesive film is not cut through, and the substrate is cut through; The first adhesive film is subjected to a debonding process to reduce the viscosity between the first adhesive film and the plurality of electronic components. The first adhesive film is a UV adhesive film, and the debonding process includes irradiating the first adhesive film with ultraviolet light, wherein the energy range of the ultraviolet light is 800-1600 mJ / mJ. When the assembly of the frame, the second adhesive film, the first adhesive film and the electronic components is flipped over, the electronic components on the electronic component board will not fall off under the action of gravity. as well as An ultrasonic vibrator contacts the back side of a first adhesive film to vibrate the back side of the first adhesive film. The vibration generated by the ultrasonic vibrator is transmitted to the first adhesive film, causing the plurality of electronic components to peel off from the first adhesive film. The back side of the first adhesive film is the back side of the adhesive surface. The ultrasonic vibrator includes a vibrating head with an inclined surface. Vibrating the back side of the first adhesive film with the ultrasonic vibrator includes: the inclined surface contacting the back side of the first adhesive film; the vibration frequency of the ultrasonic vibrator is 100Hz-20kHz; the ultrasonic vibrator stops after a first preset time and resumes operation after a second preset time, the second preset time being less than the first preset time; the position of the ultrasonic vibrator is fixed; the first adhesive film is located below the ultrasonic vibrator; the operator moves the first adhesive film to ensure that the back side of the first adhesive film at all locations of the electronic components is in full contact with the ultrasonic vibrator. An electronic component peeled off from the first adhesive film is received by a receiving device, wherein the receiving device is a groove-shaped device with side plates and is located below the first adhesive film. The peeled electronic component falls into the receiving device under the influence of gravity.

2. The method for stripping electronic components as described in claim 1, characterized in that, The plurality of electronic components are disposed on a substrate, and cutting along the cutting line includes cutting the substrate.

3. The method for stripping electronic components as described in claim 1, characterized in that, A receiving device is used to receive the electronic components peeled off from the first adhesive film.

4. The method for stripping electronic components as described in claim 1, characterized in that, The upper surface of the electronic component board is flush with, lower than or higher than the upper surface of the frame's edge.

5. The method for stripping electronic components as described in claim 1, characterized in that, The first adhesive film is a single-sided adhesive film, the adhesive side of the first adhesive film is sticky, and the back side of the first adhesive film is not sticky.

6. The method for stripping electronic components as described in claim 1, characterized in that, The cutting line can be a straight line or a curve.

7. The method for stripping electronic components as described in claim 1, characterized in that, The first preset time is 3 seconds, and the second preset time is 0.6 seconds.

8. The method for stripping electronic components as described in claim 1, characterized in that, The electronic components include chips, substrates / supports, wires, and encapsulants.

9. An ultrasonic vibration device for peeling electronic components off an adhesive film, characterized in that, The apparatus is used to perform the stripping method for electronic components according to any one of claims 1 to 8, the apparatus comprising: A housing having an opening facing the side; An ultrasonic vibrator is disposed inside the housing, the ultrasonic vibrator having a beveled vibrating head; and A controller is located outside the housing and connected to the ultrasonic transducer. The controller is used to set the vibration parameters of the ultrasonic transducer. When performing the peeling of electronic components on the adhesive film, the inclined surface of the vibrating head contacts the back of the adhesive film. The controller sets the vibration frequency of the ultrasonic transducer to 100Hz-20kHz. The controller sets the ultrasonic transducer to stop after a first preset time and to start working again after a second preset time.

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