Wafer debonding method, apparatus and system based on a dicing saw

Abstract

The application relates to a wafer debonding method, device and system based on a scriber, and belongs to the technical field of microelectronic packaging. The method comprises the following steps: acquiring detection data of a placement table, wherein the detection data carries information for judging whether a wafer to be processed is placed on the placement table; processing the detection data; if the detection data is that the wafer to be processed is not placed on the placement table, sending an alarm signal; if the detection data is that the wafer to be processed is placed on the placement table, sending an opening instruction to a preset UV lamp to debond the edge of the wafer to be processed; after the opening instruction is sent to the UV lamp, the energy value of the UV lamp is acquired in real time, and when the energy value reaches a preset edge debonding threshold value, a closing instruction is sent to the UV lamp. The application helps to take the wafer off the UV film.

Description

Technical Field

[0001] This application relates to the field of microelectronic packaging technology, and in particular to a wafer debonding method, equipment and system based on a dicing machine. Background Technology

[0002] A wafer is a silicon chip used to fabricate silicon semiconductor circuits. When a wafer is diced and polished, a UV film is first applied to it. A metal ring is positioned at the outer edge of the UV film to support the UV film and the wafer. The wafer, UV film, and metal ring together form the wafer assembly. Because the UV film has high adhesion, the wafer will not detach or easily scatter during dicing or polishing. After the wafer is processed by the dicing machine, it needs to be removed from the UV film. The usual method for removing the wafer from the UV film is to peel it off from the edge of the wafer. However, the UV film has a certain degree of stickiness, making it somewhat inconvenient to remove the wafer from it. Summary of the Invention

[0003] To address the inconvenience of removing wafers from UV films, this application provides a wafer desizing method, equipment, and system based on a dicing machine.

[0004] In a first aspect, this application provides a wafer de-adhesion method based on a dicing machine, which adopts the following technical solution: the method includes: acquiring detection data of a preset placement stage, wherein the detection data carries information for determining whether there is a wafer to be processed on the placement stage; The detection data is processed. If the detection data indicates that there is no wafer to be processed on the placement stage, an alarm signal is sent. If the detection data indicates that there is a wafer to be processed on the placement stage, an on command is sent to a preset UV lamp to de-solder the edge of the wafer to be processed. After sending an on command to the UV lamp, the energy value of the UV lamp is acquired in real time. When the energy value reaches the preset edge debonding threshold, an off command is sent to the UV lamp.

[0005] Through the above technical solution, after obtaining the detection data of the placement stage, it can be determined whether there is a wafer to be processed on the placement stage. Once it is determined that there is a wafer to be processed on the placement stage, the UV lamp is turned on so that it can irradiate the edge of the wafer to be processed. The UV lamp can irradiate the edge of the wafer to be processed in several ways. For example, the placement stage can be set as a black circular plate, thus blocking the part of the wafer to be processed that does not need to be debonded, so that the edge of the wafer to be processed extends from the edge of the placement stage, thereby realizing the UV lamp debonding the edge of the wafer; or the edge of the wafer can be irradiated by a ring-shaped UV lamp, thereby realizing the debonding of the wafer edge. Then, when the UV intensity reaches the preset edge debonding threshold, the UV lamp is turned off, thus completing the debonding process of the wafer edge. Debonding the edge of the wafer body and the UV film helps to reduce the debonding time and facilitates the subsequent peeling of the UV film from the wafer body, improving the problem of the inconvenience of removing the wafer from the UV film and effectively improving work efficiency.

[0006] Preferably, acquiring the detection data of the preset placement platform includes, Send an start command to the vacuum generator; The air pressure value in the pipe connecting the preset placement stage and the vacuum generator is acquired in real time. The air pressure value is used to determine whether there is a wafer to be processed on the placement stage. If the air pressure value is negative, it means that there is a wafer on the placement stage. If the air pressure value is not negative, it means that there is no wafer on the placement stage.

[0007] With the above technical solution, after the vacuum generator is turned on, the vacuum generator can evacuate the surface of the placement stage. If there is a wafer to be processed on the placement stage, a negative pressure will appear in the pipe connecting the vacuum generator and the surface of the placement stage. Therefore, by detecting whether the air pressure in the pipe is negative, it can be determined whether there is a wafer to be processed on the placement stage.

[0008] Preferably, the step of processing the detection data includes sending an alarm signal if the detection data indicates that there is no wafer to be processed on the placement stage. Send an activation signal to the preset warning light on the placement platform; After processing the detection data, if the detection data indicates that there is no wafer to be processed on the placement stage, an activation signal is sent to the placement stage warning light.

[0009] With the above technical solution, when there are no wafers to be processed on the placement stage, the placement stage warning light will light up, thereby alerting the staff and making it easier for them to understand the status of the placement stage.

[0010] Preferably, the step of processing the detection data, and sending an alarm signal if the detection data indicates that there is no wafer to be processed on the placement stage, further includes: Send an activation command to the preset alarm.

[0011] With the above technical solution, when there are no wafers to be processed on the placement table, the alarm bell can sound continuously for a certain period of time, which helps to inform the staff that there are no wafers to be processed on the placement table at this time, making it easier for the staff to understand the status of the placement table.

[0012] Preferably, the image is acquired by a camera preset on the workbench; The image is analyzed using the OpenCV algorithm to extract the distance data between the center of the wafer body and the edge of the worktable surface. There are four distance data points, which are divided into two groups. The distance data points in the same group are opposite in direction and located on the same straight line. The distance data points in different groups are perpendicular to each other. If the judgment results of the two groups of distance data are the same, it means that the position of the wafer body has not shifted. Then the desoldering process of the wafer body continues. If any set of distance data results in a different value, it indicates that the position of the wafer body has shifted. In this case, a shutdown signal is sent to the vacuum generator, and the real-time acquisition of the air pressure value in the pipeline is stopped. After sending a shutdown signal to the vacuum generator and stopping the real-time acquisition of the air pressure value under the placement platform, the average value of the two distance values ​​in the same group of distance data is calculated, and the distance data in the same group whose distance value is greater than the corresponding average value is selected. The direction of the selected distance data is used as the offset direction, and the difference between the distance value of the selected distance data and the corresponding average value is used as the offset data and sent to the preset robot arm. After sending the offset data and offset direction to the robotic arm, an open signal is sent to the vacuum generator, and the air pressure value in the pipeline continues to be acquired in real time.

[0013] The above technical solution acquires image information through a camera, calculates the offset data of the wafer to be processed based on the image information, and then transmits the acquired offset direction and offset amount to the fine-tuning robot. This allows the fine-tuning robot to adjust the position of the wafer to be processed, which helps to prevent the edge of the wafer to be processed from being blocked by the placement stage and thus not being able to be irradiated by the UV lamp due to the positional offset, thereby helping to improve the desoldering quality.

[0014] Preferably, if the detection data indicates that the wafer to be processed is placed on the placement stage, after sending an on command to a preset UV lamp, the method further includes: After sending an on command to the preset UV lamp, the timer starts, and after the preset pre-inspection time, the energy value calculated by the UV energy detector is obtained. The energy value is compared with a preset damage threshold; If the preset damage threshold cannot be reached, a shutdown command is sent to the UV lamp, and a startup command is sent to the preset UV warning lamp. If the preset damage threshold is reached, no action will be taken.

[0015] The above technical solution can determine whether a UV lamp is damaged, and notify staff by turning on the UV warning light after a UV lamp is damaged. This helps to prevent unprocessed wafers from failing to achieve the desizing effect for an extended period of time due to UV lamp damage.

[0016] Preferably, if the detection data indicates that the wafer to be processed is placed on the placement stage, then sending an on command to the preset UV lamp, in addition to: Send an opening command to the preset nitrogen electronic valve on the preset nitrogen tank to release nitrogen around the wafer to be processed; When the energy value calculated by the real-time UV energy acquisition tester reaches the preset edge degumming threshold, a closing command is sent to the electronic valve.

[0017] By sending an opening command to the nitrogen electronic valve, the nitrogen tank can release relatively stable nitrogen gas onto the placement platform, which helps to increase the nitrogen content in the air, reduce the oxygen content in the air, and thus help to reduce ozone generation.

[0018] Preferably, if the detection data indicates that the wafer to be processed is placed on the placement stage, then while sending an on command to the preset UV lamp, the method also includes: Send an on signal to the heating element to heat the environment surrounding the wafer to be processed; Real-time acquisition of the temperature value around the wafer to be processed; The temperature value is processed, and when the temperature value exceeds the preset temperature threshold, a shutdown signal is sent to the heating element; When the temperature value is lower than the preset temperature threshold, an open signal is sent to the heating element; When the energy value reaches the preset edge debonding threshold, a shutdown command is sent to the heating element, and the real-time acquisition of the heating element's temperature value is stopped.

[0019] The above technical solution allows the heating element to be turned on simultaneously with the UV lamp, thereby heating the UV film on the wafer to be processed. The UV film is stretched by the metal ring under heat, which helps to prevent the UV film from loosening or wrinkling, thus avoiding inaccurate wafer positioning. This, in turn, helps to accurately position the wafer and improve the quality of desizing.

[0020] Secondly, this application provides a wafer de-adhesion device based on a dicing machine, which adopts the following technical solution: it includes a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executed as any of the wafer de-adhesion methods based on the dicing machine described above.

[0021] The above technical solution allows for the issuance of an alarm signal when no wafer is detected on the placement table, notifying staff to place the wafer on the table. When a wafer is detected on the placement table, a UV lamp is activated to irradiate and de-adhesive onto the wafer. Once the UV lamp's energy reaches a preset edge de-adhesive threshold, it is deactivated, thus achieving the de-adhesive removal process at the wafer edge. De-adhesive removal between the VU film edge and the wafer reduces the adhesion between the wafer edge and the UV film, facilitating separation and making it easier to peel the UV film off the wafer. This addresses the inconvenience of removing the wafer from the UV film and effectively improves work efficiency.

[0022] Thirdly, this application provides a wafer de-adhesive system based on a dicing machine, employing the following technical solution: The system includes: Vacuum generator: used to create a vacuum on the surface of the placement platform; Vacuum sensor: Used to acquire detection data carrying information for determining whether a wafer to be processed is placed on the placement stage; UV lamp: Used to irradiate and remove adhesive from the edges of wafers to be treated; UV energy detector: used to detect the ultraviolet intensity of the UV lamp and calculate the energy value; The input terminals of the wafer de-resining equipment based on the dicing machine described above are respectively connected to the vacuum sensor and the UV energy detector, and the output terminals of the de-resining equipment are respectively connected to the vacuum generator and the UV lamp.

[0023] Through the above technical solution, the system uses a vacuum generator and vacuum sensors to detect whether there is a wafer to be processed on the placement stage. After detecting that there is a wafer to be processed on the placement stage, the edge of the wafer is irradiated with a UV lamp to de-adhesive the wafer. The UV lamp is switched on and off by measuring the energy value calculated by the UV energy detector to see if it reaches the edge de-adhesive threshold, thereby completing the de-adhesive process of the wafer edge. De-adhesive treatment of the wafer helps to reduce the adhesion between the wafer edge and the UV film, allowing the wafer edge to separate from the UV film. This makes it easier to peel the UV film off the wafer body, improving the inconvenience of removing the wafer from the UV film and effectively improving work efficiency.

[0024] In summary, this application includes at least one of the following beneficial technical effects: 1. After acquiring the detection data of the placement stage, it can be determined whether there is a wafer to be processed on the placement stage. Once it is confirmed that there is a wafer to be processed on the placement stage, the UV lamp is turned on so that it can irradiate the wafer to be processed, thereby achieving the debonding of the wafer. The UV lamp can irradiate the edge of the wafer to be processed in several ways. For example, the placement stage can be set as a black circular plate, thereby blocking the part of the wafer to be processed that does not need to be debonded, so that the edge of the wafer to be processed extends from the edge of the placement stage, thereby achieving the debonding of the wafer edge by the UV lamp; or the edge of the wafer can be irradiated by a ring-shaped UV lamp, thereby achieving the debonding of the wafer edge; then, when the energy value of the UV lamp reaches the preset edge debonding threshold, the UV lamp is turned off, thus completing the debonding process of the wafer. After debonding the wafer edge and the UV film, it helps to reduce the adhesion between the wafer edge and the UV film, so that the wafer edge and the UV film can be separated, making it easier to peel the UV film off the wafer body, improving the inconvenience of removing the wafer from the UV film, and effectively improving work efficiency; 2. While turning on the UV lamp, turn on the heating element to heat the UV film on the wafer to be processed. The UV film will tighten under the tension of the metal ring when heated, which helps to prevent the UV film from loosening or wrinkling, which would cause inaccurate wafer positioning. This helps to accurately position the wafer and improve the quality of desizing. 3. Open the nitrogen electronic valve to allow the nitrogen canister to release nitrogen onto the placement platform. This helps increase the nitrogen content in the air and decrease the oxygen content, thereby helping to reduce the generation of ozone, which can have a certain impact on depolymerization. Attached Figure Description

[0025] Figure 1 This is a structural block diagram of a wafer de-adhesive system based on a dicing machine, as described in an embodiment of this application.

[0026] Figure 2This is a schematic diagram of a wafer desizing device based on a dicing machine, as described in an embodiment of this application.

[0027] Figure 3 This is another schematic diagram of a wafer desizing device based on a dicing machine in an embodiment of this application.

[0028] Figure 4 This is a schematic flowchart of a wafer deresisting method based on a dicing machine in an embodiment of this application.

[0029] Figure 5 This is a schematic diagram of the overall process of UV lamp irradiation and gel dissolution in the embodiments of this application.

[0030] Figure 6 This is a schematic diagram of the overall process of heating and degumming in the embodiments of this application.

[0031] Explanation of reference numerals in the attached diagram: 1. Worktable; 11. Through hole; 2. Placement stage; 21. UV film; 22. Wafer body; 23. Metal ring; 24. UV lamp; 25. Vacuum generator; 26. Vacuum sensor; 27. UV energy detector; 30. Motherboard; 31. Memory; 32. Processor. Detailed Implementation

[0032] The present application will be further described in detail below with reference to the accompanying drawings.

[0033] This application discloses a wafer de-adhesive system based on a dicing machine, such as... Figure 1 The wafer de-resist system based on the dicing machine includes a worktable 1 on the dicing machine and a vacuum generator 25, a vacuum sensor 26, a UV lamp 24, a UV energy detector 27 and a wafer de-resist device based on the dicing machine, wherein the de-resist device includes a motherboard 30, on which a memory 31 and a processor 32 are integrated.

[0034] Reference Figure 2 A support plate is provided inside the workbench 1, and a through hole 11 is opened on the support plate. A UV lamp 24 is set on the inner surface of the workbench 1 and below the support plate, and the UV lamp 24 is located below the through hole 11. A placement platform 2 is set on the UV lamp 24 and inside the through hole 11, and a gap is left between the edge of the placement platform 2 and the edge of the through hole 11. An adsorption hole is opened on the placement platform 2, and several adsorption grooves are opened on the upper surface of the placement platform 2. The adsorption grooves are arranged in a horizontal direction, one end of the adsorption groove extends to the adsorption hole, and the other end of the adsorption groove is closed. The placement platform 2 is used to place the wafer to be processed for depolymerization by the depolymerization device. The wafer to be processed includes a wafer body 22, a UV film 21, and a metal ring 23, wherein the metal ring 23 is connected to the edge of the UV film 21, and the wafer body 22 is adhered to the UV film 21.

[0035] When removing the adhesive from the wafer to be processed, the edges of the wafer body 22 can be removed in various ways. For example, the first method: refer to... Figure 2 The metal ring 23 of the wafer to be processed is placed on a carrier plate, and the UV film 21 is placed on the placement stage 2, covering the gap between the placement stage 2 and the through hole 11. The wafer body 22 is attached to the side of the UV film 21 away from the placement stage 2, and the wafer body 22 is located directly above the placement stage 2. The edge of the wafer body 22 extends from the placement stage 2. The placement stage 2 is a black circular plate. Black can absorb ultraviolet light, so during debonding, the placement stage 2 can cover the parts of the wafer body 22 that do not need to be debonded and absorb ultraviolet light, so that the UV lamp 24 only irradiates the parts of the wafer body 22 that need to be debonded. Second method: combined Figure 3 When de-adhesive is removed from the wafer to be processed, a ring-shaped UV lamp 24 can be placed below the gap between the through-hole 11 and the placement stage 2, so that the UV lamp 24 de-adhesive is removed from the edge of the wafer body 22. The placement stage 2 can be a circular plate of any material, which helps to achieve de-adhesive removal from the edge of the wafer body 22. The following description uses the first method: Reference Figure 1 and Figure 2 One end of the vacuum generator 25 is connected to the through-hole of the placement stage 2 via a pipe, and the vacuum generator 25 is used to evacuate the adsorption tank on the upper surface of the placement stage 2. The vacuum sensor 26 is located on the pipe, and the vacuum sensor 26 is used to detect the air pressure value in the pipe and send the air pressure value to the processor 32 so that the processor 32 can determine whether there is a wafer to be processed on the placement stage 2. The UV lamp 24 is used to irradiate the edge of the wafer body 22 extending from the gap between the placement stage 2 and the through-hole 11 to de-adhesive, so that after the edge of the wafer body 22 is de-adhesive, the UV film can be peeled off from the wafer body 22, or the UV film can be separated from the wafer body 22 by inserting a separation piece from the gap between the edge of the wafer body 22 and the UV film 21 between the UV film 21 and the wafer body 22 and rotating the wafer body 22 and the UV film 21. Below each UV lamp 24 is a corresponding UV energy detector, and each UV energy detector 27 is used to detect the ultraviolet intensity of the corresponding UV lamp 24 and calculate the energy value based on the ultraviolet intensity for processing by the processor 32. The memory 31 is used to store the desizing program of the wafer to be processed. When the processor 32 runs the desizing program of the wafer to be processed, it executes the following steps of the desizing method.

[0036] The following section provides a detailed explanation of the specific implementation of the wafer desizing method based on a dicing machine, using a wafer desizing system based on a dicing machine as an example.

[0037] like Figure 4 As shown, this application provides a wafer de-adhesive method based on a dicing machine, comprising: S100: Acquire detection data of placement stage 2. The detection data carries information for determining whether there is a wafer to be processed on placement stage 2.

[0038] Combination Figure 2 In practice, the processor 32 first sends an open command to the vacuum generator 25, causing the vacuum generator 25 to evacuate the surface of the placement stage 2 through the pipe; then the processor 32 acquires the detection data of the vacuum sensor 26 in real time. The detection data of the vacuum sensor 26 includes the device number of the vacuum sensor 26, the air pressure value and the message check code, wherein the air pressure value is used to determine whether there is a wafer to be processed on the placement stage 2.

[0039] Specifically, when a wafer to be processed is placed on the placement stage 2, the vacuum generator 25 evacuates the adsorption tank on the surface of the placement stage 2 through the pipeline. The wafer to be processed will be adsorbed on the placement stage 2, and the air pressure in the pipeline will become negative. Therefore, the air pressure value in the detection data of the vacuum sensor 26 can be used to determine whether there is a wafer to be processed on the placement stage 2.

[0040] S200: Process the detection data. If the detection data indicates that there is no wafer to be processed on the placement stage 2, send an alarm signal. If the detection data indicates that there is a wafer to be processed on the placement stage 2, send an open command to the UV lamp 24 to remove the adhesive from the edge of the wafer to be processed.

[0041] In implementation, the processor 32 verifies, parses, and processes the detection data acquired by the vacuum sensor 26. The processor 32 first performs verification calculations on the detection data from the vacuum sensor 26 according to its internally preset message verification algorithm. This message verification algorithm is typically a CRC checksum algorithm, which verifies the accuracy of the detection data transmitted by the sensor. After calculating the verification result, it compares the result with the message checksum. If the verification result differs from the message checksum in the detection data, it indicates that the detection data from the vacuum sensor 26 is incorrect, and the data is discarded. If the verification result matches the message checksum in the detection data, it indicates that the detection data from the vacuum sensor 26 is correct, and the air pressure value is then parsed from the detection data according to message rules.

[0042] In practice, after the processor 32 analyzes the air pressure value, it begins to compare the air pressure value with the normal atmospheric pressure. When the detected value of the vacuum sensor 26 is not negative, it indicates that there is no wafer to be processed on the placement stage 2. Then, it sends an open command to the placement stage warning light to turn on the placement stage warning light so that the staff can check the status of the workbench 1 by checking the placement stage warning light. When the detected value of the vacuum sensor 26 is negative, it indicates that there is a wafer to be processed on the placement stage 2. Then, it sends a close command to the placement stage warning light and sends an open signal to the UV lamp 24 to irradiate the edge of the wafer to be processed.

[0043] Optionally, in the same embodiment, since the staff may not be in front of the workbench 1 in real time, it may be easy for the staff to not see whether the warning light of the placement table is lit. Therefore, an alarm bell is set on the workbench 1 to remind the staff. When the detection value of the vacuum sensor 26 is not negative pressure, the processor 32 sends an instruction to the alarm bell to turn on, so that the alarm bell can sound continuously for a certain period of time, thereby helping to inform the staff that there is no wafer to be processed on the placement table 2 at this time.

[0044] S300, after sending an on command to UV lamp 24, obtains the energy value of UV lamp 24 in real time. When the energy value reaches the preset edge debonding threshold, it sends an off command to UV lamp 24.

[0045] refer to Figure 5 The flowchart of the UV lamp 24 debonding process is shown. In implementation, after the UV lamp 24 is turned on, the UV energy detector 27 detects the ultraviolet intensity of the corresponding UV lamp 24. The UV energy detector 27 can calculate the energy value of the UV lamp 24 using an accumulation algorithm, and the energy value increases over time. While the UV energy detector 27 detects the ultraviolet intensity of the corresponding UV lamp 24, the processor 32 acquires the energy value calculated by each UV energy detector 27 in real time and compares the energy value with a preset edge debonding threshold. If the measured value of any one of the UV energy detectors 27 does not reach the preset edge debonding threshold, the UV lamp 24 continues to debond the wafer body 22, and the energy value calculated by the UV energy detector 27 continues to be acquired in real time. When all the measured values ​​of all the UV energy detectors 27 reach the preset edge debonding threshold, a shutdown signal is sent to the UV lamp 24, and the acquisition of the energy value calculated by the UV energy detector 27 in real time is stopped, thus completing the debonding process of the UV film 21 and the wafer body 22.

[0046] Optionally, in the same embodiment, if the edge of the wafer body 22 shifts onto the placement stage 2 when the wafer to be processed is placed, causing the edge of the wafer body 22 to be blocked by the placement stage 2, it is easy for the edge of the wafer body 22 to be unable to be illuminated by the UV lamp 24. Therefore, a fine-tuning robot and a camera are also provided on the worktable 1. The camera is used to acquire an image of the top surface of the worktable, and the fine-tuning robot is used to fine-tune the position of the wafer to be processed.

[0047] Based on the structural design of the fine-tuning robot and camera, the processor 32, after acquiring the image captured by the camera, can extract the edge data of the wafer body 22 and the upper surface of the worktable 1 from the image using machine vision image detection technology based on the OpenCV algorithm. Specifically, the outline of the wafer body 22 is first located in the image based on the edge data of the wafer body 22, and the center distance of the outline of the wafer body 22 is calculated. Then, the center point position data of the wafer body 22 is calculated. The distance data between the center position data of the wafer body 22 and the edge data of the worktable is calculated using the edge data of the worktable. Since OpenCV is a common algorithm for image processing and computer vision image detection, it will not be elaborated here. After calculating the distance data between the center of the wafer body 22 and the edge of the upper surface of the worktable 1, it is determined whether the position of the wafer body 22 is deviated. Then, the fine-tuning robot is controlled to fine-tune the position of the wafer to be processed.

[0048] Specifically, four distance data points are calculated, each containing a direction and a distance value. The four distance data points are grouped into pairs, with the directions in the distance data points within the same group being opposite and located on the same straight line, while the directions in the distance data points in different groups are perpendicular to each other.

[0049] Specifically, the above-mentioned determination of whether the position of the wafer body 22 is deviated includes: after calculating four distance data, judging whether the two distance values ​​of each set of distance data are the same. If the judgment results of the two sets of distance data are the same, it means that the position of the wafer body 22 has not shifted, and then the wafer body 22 continues the desoldering process; if the judgment results of any set of distance data are different, it means that the position of the wafer body 22 has shifted, and then the fine-tuning robot is controlled to fine-tune the position of the wafer to be processed.

[0050] Specifically, the aforementioned control and fine-tuning of the robot arm to fine-tune the position of the wafer to be processed includes: sending a shutdown signal to the vacuum generator 25 and stopping the real-time acquisition of the detection value of the vacuum sensor 26, allowing the wafer to be processed to be moved on the placement stage 2. Next, the average of two distance values ​​in the same set of distance data is calculated, and two sets of offset data for the wafer to be processed are calculated based on the average value. Each set of offset data includes the offset direction and offset amount. Taking one set of distance data as an example, the distance data in this set of distance data that is larger than the corresponding average value is selected. An offset direction is determined based on the direction of the selected distance data, and the difference between the selected distance data and the average value is used as the offset data corresponding to that offset direction. For example, if the center of the circle is 20cm from the upper edge of the worktable 1 and 16cm from the lower edge of the worktable 1, with an average value of 18cm, then the distance from the center of the circle to the upper edge of the worktable 1 is larger than the average value. Therefore, the offset direction of this set of distance data is upward, and the offset data is 2cm.

[0051] After obtaining the offset data of the wafer to be processed, the processor 32 sends two sets of offset data of the wafer to the fine-tuning robot, which then adjusts the position of the wafer. After the position of the wafer is adjusted, the processor 32 sends an open signal to the vacuum generator 25, causing the vacuum generator 25 to adsorb the wafer onto the placement stage 2 for debonding. The processor 32 also continues to acquire the detection value of the vacuum sensor 26 in real time to monitor whether there is a wafer to be processed on the placement stage 2.

[0052] Optionally, in the same embodiment, considering that the wafer to be processed cannot be debonded if the UV lamp 24 is damaged, the UV lamp 24 is also checked after the processor 32 sends an open command to the UV lamp 24.

[0053] Specifically, in combination Figure 5The above-mentioned inspection of UV lamp 24 includes: after the processor 32 sends an on command to the UV lamp 24, it starts timing, and after a preset pre-inspection time, it acquires the energy values ​​calculated by all UV energy detectors 27; then, it processes each energy value, comparing each calculated energy value with a preset damage threshold. If the energy value calculated by a UV energy detector 27 reaches the preset damage threshold, it means that the UV lamp 24 corresponding to that UV energy detector 27 can be used normally, so no processing is done, and the UV lamp 24 continues to irradiate and desolder the wafer to be processed; if the energy value calculated by a UV energy detector 27 does not reach the preset damage threshold, it means that the UV lamp 24 corresponding to that UV energy detector 27 is damaged, so an off command is sent to the corresponding UV lamp 24, and an on signal is sent to the UV warning light to notify the staff to replace the UV lamp 24.

[0054] Optionally, in the same embodiment, considering that oxygen in the air will turn into ozone under the irradiation of UV lamp 24, and ozone is not conducive to desoldering, a nitrogen cylinder and a nitrogen electronic valve are also provided on the workbench 1. When the processor 32 sends an open signal to UV lamp 24, it also sends an open signal to nitrogen electronic valve, so that the nitrogen cylinder releases more stable nitrogen gas above the wafer body 22, thereby increasing the nitrogen content in the air around the wafer body 22, which helps to reduce the oxygen content in the air and reduce the generation of ozone.

[0055] Optionally, in the same embodiment, considering that a loose or wrinkled UV film 21 may lead to inaccurate positioning of the wafer body 22, a heating element and a temperature sensor are also provided on the worktable 1. The heating element is located above the wafer to be processed, and the temperature sensor is located around the wafer to be processed, allowing the temperature sensor to measure the temperature of the air surrounding the wafer body 22. Simultaneously with sending an on command to the UV lamp 24, the processor 32 sends an on command to the heating element, causing the heating element to heat the UV film 21. The UV film 21, under the tension of the metal ring 23, becomes taut when heated, thus aiding in precise positioning of the wafer body 22 and improving the quality of desoldering. The aforementioned heating element can be a heating lamp or an electric heating tube, etc. In this embodiment, the heating element is a heating lamp.

[0056] In implementation, such as Figure 6As shown, after the heating lamp is turned on, the processor 32 acquires the temperature value of the heating lamp measured by the temperature sensor in real time, processes the temperature value, and compares the temperature value with a temperature threshold. If the temperature value exceeds the preset temperature threshold, a shutdown command is sent to the heating lamp; if the temperature value is lower than the preset temperature threshold, a turn-on command is sent to the heating lamp. When the energy value acquired by the UV energy detector 27 exceeds the preset edge debonding threshold, the processor 32 sends a shutdown command to the heating lamp and stops acquiring the temperature value of the heating lamp measured by the temperature sensor in real time.

[0057] The wafer debonding method based on a dicing machine disclosed in this application can turn on the UV lamp 24 and the baking lamp after detecting that a wafer to be processed is placed on the placement stage 2. The UV lamp 24 irradiates the edge of the wafer body 22 to debond the UV film 21. After debonding the UV film 21 and the wafer body 22, the adhesion between the UV film 21 and the wafer body 22 is reduced. The UV film 21 is stretched by the metal ring 23 under heat, which helps to prevent the UV film 21 from loosening or wrinkling, thus avoiding inaccurate positioning of the wafer body 22. This helps to accurately position the wafer body 22 and improve the debonding quality. While the UV lamp 24 debonds the wafer body 22, nitrogen gas is released, thereby increasing the concentration of nitrogen in the air and decreasing the concentration of oxygen in the air, which helps to reduce ozone generation and thus improve the debonding effect.

[0058] This specific embodiment is merely an explanation of the present invention and is not intended to limit the invention. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A wafer deresisting method based on a dicing machine, characterized in that, Acquire detection data for a preset placement stage (2), wherein the detection data carries information for determining whether a wafer to be processed is placed on the placement stage (2); The detection data is processed. If the detection data indicates that there is no wafer to be processed on the placement stage (2), an alarm signal is sent. If the detection data indicates that there is a wafer to be processed on the placement stage (2), an open command is sent to the preset UV lamp (24) to de-adhere the edge of the wafer to be processed. After sending an on command to the UV lamp (24), the energy value of the UV lamp (24) is obtained in real time. When the energy value reaches the preset edge degumming threshold, an off command is sent to the UV lamp (24). The acquisition of detection data on the preset placement stage (2) includes: sending an opening command to the preset vacuum generator (25); and acquiring the air pressure value in the preset pipe connecting the placement stage (2) and the vacuum generator (25) in real time. The air pressure value is used to determine whether there is a wafer to be processed on the placement stage (2). If the air pressure value is negative, it means that there is a wafer to be processed on the detection placement stage (2). If the air pressure value is not negative, it means that there is no wafer to be processed on the detection placement stage (2). Before sending an on command to the preset UV lamp (24) if the detection data indicates that the wafer to be processed is placed on the placement stage (2), the method further includes: Acquire images captured by a preset camera on the workbench (1); The image is parsed using the OpenCV algorithm to extract the distance data between the center of the wafer body (22) on the wafer to be processed and the edge of the upper surface of the worktable (1). There are four distance data points, which are divided into two groups. The directions of the distance data points in the same group are opposite and located on the same straight line. The directions of the distance data points in different groups are perpendicular to each other. If the judgment results of the two groups of distance data points are the same, it means that the position of the wafer body (22) has not shifted. Then the desoldering process of the wafer body (22) continues. If any set of distance data results are different, it indicates that the position of the wafer body (22) has shifted, and a shutdown signal is sent to the vacuum generator (25), and the real-time acquisition of the gas pressure value in the pipeline is stopped; After sending a shutdown signal to the vacuum generator (25) and stopping the real-time acquisition of the air pressure value below the placement platform (2), the average value of two distance values ​​in the same group of distance data is calculated, and a distance data whose distance value is greater than the corresponding average value in the same group of distance data is selected. The direction of the selected distance data is used as the offset direction, and the difference between the distance value of the selected distance data and the corresponding average value is used as the offset data and sent to the preset robot arm. After sending the offset data and the offset direction to the robotic arm, an open signal is sent to the vacuum generator (25), and the air pressure value in the pipeline is continuously monitored in real time.

2. The method according to claim 1, characterized in that, The process of processing the detection data includes sending an alarm signal if the detection data indicates that there is no wafer to be processed on the placement stage (2). This includes: Send an activation signal to the preset warning light on the placement platform; After processing the detection data, if the detection data indicates that there is no wafer to be processed on the placement stage (2), an activation signal is sent to the placement stage warning light.

3. The method according to claim 2, characterized in that, The process of processing the detection data, including sending an alarm signal if the detection data indicates that there is no wafer to be processed on the placement stage (2), further includes: Send an activation command to the preset alarm.

4. The method according to claim 1, characterized in that, If the detection data indicates that the wafer to be processed is placed on the placement stage (2), after sending an on command to the preset UV lamp (24), the method further includes: After sending an on command to the preset UV lamp (24), the timing begins. After the preset pre-inspection time, the energy value calculated by the UV energy detector (27) is obtained. The energy value is compared with a preset damage threshold; If the preset damage threshold cannot be reached, a shutdown command is sent to the UV lamp (24), and a startup command is sent to the preset UV warning lamp. If the preset damage threshold is reached, no action will be taken.

5. The method according to claim 1, characterized in that, If the detection data indicates that the wafer to be processed is placed on the placement stage (2), the method further includes sending an on command to the preset UV lamp (24) while simultaneously: Send an opening command to the preset nitrogen electronic valve on the preset nitrogen tank to release nitrogen around the wafer to be processed; During the process of acquiring the energy value of the UV lamp (24) in real time, when the energy value calculated by the tester reaches the preset edge debonding threshold, a shut-off command is sent to the electronic valve.

6. The method according to claim 1, characterized in that, If the detection data indicates that the wafer to be processed is placed on the placement stage (2), the method further includes sending an on command to the preset UV lamp (24) while simultaneously: Send an on signal to the heating element to heat the environment surrounding the wafer to be processed; Real-time acquisition of the temperature value around the wafer to be processed; The temperature value is processed, and when the temperature value exceeds the preset temperature threshold, a shutdown signal is sent to the heating element; When the temperature value is lower than the preset temperature threshold, an open signal is sent to the heating element; When the energy value reaches the preset edge debonding threshold, a shutdown command is sent to the heating element, and the real-time acquisition of the heating element's temperature value is stopped.

7. A wafer debinding device based on a dicing machine, characterized in that, include: The processor (32) and memory (31) contain a computer program that can be loaded by the processor (32) and executed as any of the wafer de-adhesion methods based on a dicing machine as described in claims 1 to 6.

8. A wafer de-resist system based on a dicing machine, characterized in that, The system performs a wafer de-adhesion method based on a dicing machine as described in any one of claims 1 to 6, the system comprising: Vacuum generator (25): used to evacuate the surface of the placement platform (2); Vacuum sensor (26): used to acquire detection data carrying information for determining whether a wafer to be processed is placed on the placement stage (2); UV lamp (24): used to irradiate and depolymerize the edges of the wafer to be treated; UV energy detector (27): used to detect the ultraviolet intensity of the UV lamp (24) and calculate the energy value; The wafer de-resisting device based on a dicing machine as described in claim 7, wherein the input end of the wafer de-resisting device is connected to the vacuum sensor (26) and the UV energy detector (27) respectively, and the output end of the de-resisting device is connected to the vacuum generator (25) and the UV lamp (24) respectively.

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