Die Bonding Machine

CN114334734BActive Publication Date: 2025-08-12SHENZHEN DINGJING TECH CO LTD
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Patent Information

Application Number
CN202111642288.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-12-29
Publication Date
2025-08-12
Estimated Expiration
2041-12-29

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Abstract

The present application relates to a die bonder, comprising: a mounting frame module; a dispensing module, which is mounted on the mounting frame module; a material waiting module, which is mounted on the mounting frame module; a die bonder, which is mounted on the mounting frame module; a material unloading module, which is mounted on the mounting frame module; and a conveying module, which is mounted on the mounting frame module and is capable of driving a carrier through the dispensing module, the material waiting module, the die bonder, and the material unloading module in sequence. The technical solution of the present application effectively solves the problems of low integration and working efficiency of die bonders in the prior art.
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Description

Technical Field

[0001] The present application relates to the technical field of crystal bonding machines, and in particular to a crystal bonding machine. Background Art

[0002] The rapid development of modern electronic information technology has placed increasing demands on electronic products for miniaturization, portability, multi-functionality, high reliability, and low cost. To meet the demands of various electronic products, electronic packaging has gradually emerged from its subordinate position as a post-process in microelectronics manufacturing, becoming relatively independent. A wide variety of packaging technologies have been developed to meet the specific requirements of various electronic products, resulting in the emergence of a large number of new theories, new materials, new processes, new equipment, and new electronic products. Electronic packaging and testing technologies, along with chip design and manufacturing, are driving the development of an information society.

[0003] In existing electronic packaging and testing technologies, die bonders are designed with separate dispensing and die bonding functions. For example, the dispensing mechanism is positioned at a specific location, the die bonding mechanism is positioned at a specific location, and the carrier structure is positioned between the dispensing and die bonding mechanisms. This structure is not conducive to achieving integration and has low efficiency. Summary of the Invention

[0004] The present application provides a die bonding machine to solve the problems of low integration and working efficiency of the die bonding machine in the prior art.

[0005] To achieve the above-mentioned purpose, the present application provides a crystal bonding machine, including: a mounting frame module; a dispensing module, which is arranged on the mounting frame module; a waiting module, which is arranged on the mounting frame module; a crystal bonding module, which is arranged on the mounting frame module; a material unloading module, which is arranged on the mounting frame module; and a conveying module, which is arranged on the mounting frame module and can drive the carrier to pass through the dispensing module, the material waiting module, the crystal bonding module and the material unloading module in sequence.

[0006] Furthermore, the mounting frame module includes a base assembly, a guide rail assembly and a flow channel assembly, the guide rail assembly is fixed on the base assembly, the flow channel assembly is movably arranged on the guide rail assembly, and the carrier plate can be supported on the flow channel assembly.

[0007] Furthermore, the flow channel assembly includes a limiting support frame structure, the limiting support frame structure includes a first limiting support plate and a second limiting support plate, and there is an adjustable predetermined distance between the first limiting support plate and the second limiting support plate to form a flow channel, and the first limiting support plate and the second limiting support plate both extend along the moving direction of the carrier plate.

[0008] Furthermore, the first limiting support plate includes a first limiting plate and a first support plate, the first support plate is located on the side of the first limiting support plate close to the second limiting support plate, the upper surface of the first support plate is lower than the upper surface of the first limiting plate to form a first step surface, and the second limiting support plate includes a second limiting plate and a second support plate, the second support plate is located on the side of the second limiting plate close to the first limiting support plate, the upper surface of the second support plate is lower than the upper surface of the second limiting plate to form a second step surface.

[0009] Furthermore, the flow channel assembly also includes a flow channel driving structure, which is connected to the limiting support frame structure to drive the limiting support frame structure to change the predetermined distance of the flow channel.

[0010] Furthermore, the flow channel driving structure includes a first motor, a screw and two connecting parts. The output shaft of the first motor is connected to the screw, and the two ends of the screw are respectively connected to the two connecting parts through threads. The first limit support plate and the second limit support plate are respectively fixedly connected to the two connecting parts.

[0011] Furthermore, the crystal bonding machine also includes a first pressure plate structure and a first top plate structure. The first pressure plate structure is fixedly connected to the limiting support frame, the first top plate structure is arranged on the mounting frame module, the first pressure plate structure is arranged corresponding to the first top plate structure, and the first pressure plate structure cooperates with the dispensing module.

[0012] Furthermore, the first top plate structure includes a second motor, a first cam, a first transmission part and a first top plate. The second motor is connected to the first cam to drive the first cam to rotate. The first cam cooperates with the bottom of the first transmission part. The top of the first transmission part is fixedly connected to the first top plate. The first top plate and the first pressure plate structure have a pressing position close to each other or the first top plate and the first pressure plate structure have a disengagement position far away from each other.

[0013] Furthermore, the first transmission part includes a first matching block and a first connecting plate, and the bottom surface of the first matching block has an arc surface matching with the first cam.

[0014] Furthermore, the first top plate structure also includes a first elastic member, one end of the first elastic member is connected to the base assembly, and a second end of the first elastic member is connected to the first top plate structure so that the first transmission part contacts the first cam.

[0015] Furthermore, the first pressure plate structure includes a first pressure plate and a second elastic member, the second elastic member is arranged on the first pressure plate, and when the first top plate and the first pressure plate structure are in the pressing position, the first top plate and the second elastic member jointly press the carrier plate.

[0016] Furthermore, the second elastic member includes a first elastic piece, and the first elastic piece is fixed on the first pressing plate.

[0017] Furthermore, the first spring plate includes a first connecting plate and a first pressure foot, the first end of the first pressure foot is connected to the side of the first connecting plate, the first pressure plate has a hollow hole, the first connecting plate is connected to the surface of the first pressure plate away from the first top plate structure, and the second end of the first pressure foot passes through the hollow hole.

[0018] Furthermore, the angle between the plane of the first connecting plate and the plane of the first presser foot is greater than 90 degrees and less than 180 degrees, and the second end of the first presser foot has an outward flange, which is connected to the first presser foot through an arc-shaped connecting portion.

[0019] Furthermore, the conveying module includes a third motor, a conveyor belt, a driven wheel and a carrier plate clamping structure. The third motor and the driven wheel are respectively arranged at both ends of the mounting frame module. The conveyor belt cooperates with the third motor and the driven wheel, and the carrier plate clamping structure is arranged on the conveyor belt.

[0020] Furthermore, the carrier plate clamping structure includes a clamping mounting seat, a fixed clamping portion, a movable clamping portion and a clamping drive portion. The clamping mounting seat is installed on the conveyor belt, the fixed clamping portion is fixedly arranged on the clamping mounting seat, the clamping drive portion is arranged on the clamping mounting seat, and the clamping drive portion is connected to the movable clamping portion to drive the movable clamping portion to be close to the fixed clamping portion in a clamping position, or drive the movable clamping portion away from the fixed clamping portion to be in a release position.

[0021] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:

[0022] In the technical solution of the present application, the carrier is transported by the conveying module and sequentially passes through the dispensing module for dispensing, then enters the waiting module for inspection, such as to check whether the dispensing is qualified. After passing through the waiting module, it is driven by the conveying module to enter the die bonding module. After the die bonding module completes the die bonding, it passes through the unloading module. The assembly line operation of this solution completes the dispensing, inspection, and die bonding, thus greatly improving the working efficiency of the die bonding machine. The technical solution of the present application effectively solves the problems of low integration and working efficiency of the die bonding machine in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0025] Figure 1A schematic diagram of the three-dimensional structure of a die bonder according to an embodiment of the present application is shown;

[0026] Figure 2 Shown Figure 1 Schematic diagram of the flow channel structure of the die bonding machine;

[0027] Figure 3 Shown Figure 1 A schematic diagram of the first pressing plate structure of the die bonder;

[0028] Figure 4 Shown Figure 1 Schematic diagram of the flow channel drive structure of the die bonder.

[0029] The above drawings include the following reference numerals:

[0030] 10. Mounting frame module; 11. Base assembly; 12. Guide rail assembly; 13. Flow channel assembly; 131. Positioning support frame structure; 132. Flow channel drive structure; 20. Glue dispensing module; 30. Waiting module; 40. Crystal bonding module; 50. Unloading module; 60. Conveying module; 70. First pressure plate structure; 71. First pressure plate; 72. Second elastic member; 80. First top plate structure. DETAILED DESCRIPTION

[0031] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0032] like Figures 1 to 4 As shown, a die bonder according to this embodiment includes: a mounting frame module 10, a glue dispensing module 20, a material waiting module 30, a die bonding module 40, a material unloading module 50, and a conveying module 60. The glue dispensing module 20 is mounted on the mounting frame module 10. The material waiting module 30 is mounted on the mounting frame module 10. The die bonding module 40 is mounted on the mounting frame module 10. The material unloading module 50 is mounted on the mounting frame module 10. The conveying module 60 is mounted on the mounting frame module 10 and can drive the carrier through the glue dispensing module 20, the material waiting module 30, the die bonding module 40, and the material unloading module 50 in sequence.

[0033] In the technical solution of this embodiment, the carrier is transported by the conveying module 60 and sequentially passes through the dispensing module 20 for dispensing, and then enters the waiting module 30 for inspection, for example, to check whether the dispensing is qualified. After passing through the waiting module 30, it enters the crystal bonding module 40 under the drive of the conveying module 60. After the crystal bonding module completes the crystal bonding work, it passes through the unloading module 50. The operation of the assembly line of this solution completes the dispensing, inspection, and crystal bonding, which greatly improves the working efficiency of the crystal bonding machine. The technical solution of this embodiment effectively solves the problems of integration and low working efficiency of the crystal bonding machine in the prior art. The carrier includes a carrier body and an object on the carrier body.

[0034] like Figure 1 and Figure 2 As shown, in the technical solution of this embodiment, the mounting frame module 10 includes a base assembly 11, a guide rail assembly 12 and a flow channel assembly 13. The guide rail assembly 12 is fixed on the base assembly 11, the flow channel assembly 13 is movably arranged on the guide rail assembly 12, and the carrier plate can be supported on the flow channel assembly 13. The flow channel assembly 13 moves on the guide rail assembly 12 and can adapt to carrier plates of different sizes and models. Such a crystal bonding machine is more versatile. It should be noted that the extension direction of the guide rail assembly 12 is perpendicular to the extension direction of the flow channel assembly 13. The crystal bonding machine of this embodiment also includes a guide structure, which is fixed on the mounting frame module 10. The flow channel assembly 13 cooperates with the guide structure so that the flow channel assembly 13 moves more smoothly when adjusting the width of the flow channel. The guide rail assembly includes a plurality of guide rail assemblies, each guide rail assembly is adapted to the limiting support frame structure 131, and is located at the bottom of the limiting support frame structure 131.

[0035] like Figure 2 As shown, in the technical solution of this embodiment, the flow channel assembly 13 includes a limiting support frame structure 131, and the limiting support frame structure 131 includes a first limiting support plate and a second limiting support plate. The first limiting support plate and the second limiting support plate have an adjustable predetermined distance between them to form a flow channel, and the first limiting support plate and the second limiting support plate both extend along the moving direction of the carrier plate. The limiting structure includes a first limiting support plate and a second limiting support plate. By adjusting the distance between the first limiting support plate and the second limiting support plate, it is possible to adapt to carrier plates of different sizes. Such a structure has a low manufacturing cost and is easy to operate. It should be noted that the guide structure: multiple guide rods, the first limiting support plate and the second limiting support plate both pass through each guide rod, and the extension direction of each guide rod is parallel to the guide rail assembly 12.

[0036] like Figure 2As shown, in the technical solution of this embodiment, the first limiting support plate includes a first limiting plate and a first support plate, the first support plate is located on the side of the first limiting support plate close to the second limiting support plate, and the upper surface of the first support plate is lower than the upper surface of the first limiting plate to form a first step surface, and the second limiting support plate includes a second limiting plate and a second support plate, the second support plate is located on the side of the second limiting plate close to the first limiting support plate, and the upper surface of the second support plate is lower than the upper surface of the second limiting plate to form a second step surface. The cooperation of the first step surface and the second step surface can achieve support for the carrier plate, thereby achieving an upward support force for the carrier plate and reducing the force on the conveying module 60. The side surface of the first limiting plate and the side surface of the second limiting plate cooperate to prevent the carrier plate from deviating from the flow channel, so that the carrier plate can move better along the predetermined track. The first limiting support plate and the second limiting support plate of this embodiment have a simple structure and are easy to operate. It should be noted that the heights of the first step surface and the second step surface are the same. The first limiting plate includes a first limiting plate segment, a second limiting plate segment, a third limiting plate segment, and a fourth limiting plate segment, and the second limiting plate includes a fifth limiting plate segment, a sixth limiting plate segment, a seventh limiting plate segment, and an eighth limiting plate segment. The first support plate includes a first support plate segment, a second support plate segment, a third supporting plate segment, and a fourth support plate segment, and the second support plate includes a fifth support plate segment, a sixth support plate segment, a seventh supporting plate segment, and an eighth support plate segment. The first limiting plate segment and the first support plate segment are connected together, the second limiting plate segment and the second support plate segment are connected together, the third limiting plate segment and the third support plate segment are connected together, and so on. The first limiting plate section, the first support plate section, the fifth limiting plate section and the fifth support plate section have the same length and are all arranged corresponding to the dispensing module 20; the second limiting plate section, the second support plate section, the sixth limiting plate section and the sixth support plate section have the same length and are arranged corresponding to the waiting module 30; the third limiting plate section, the third support plate section, the seventh limiting plate section and the seventh support plate section have the same length and are arranged corresponding to the crystal bonding module 40; the fourth limiting plate section, the fourth support plate section, the eighth limiting plate section and the eighth support plate section have the same length and are arranged corresponding to the blanking module 50.

[0037] like Figure 2 and Figure 4 As shown, in the technical solution of this embodiment, the flow channel assembly 13 further includes a flow channel driving structure 132, which is connected to the limit support frame structure 131 to drive the limit support frame structure 131 to change the predetermined distance of the flow channel. The above structure is easy to set and operate.

[0038] like Figure 2 and Figure 4As shown, in the technical solution of this embodiment, the flow channel drive structure 132 includes a first motor, a screw and two connecting parts. The output shaft of the first motor is connected to the screw, and the two ends of the screw are respectively connected to the two connecting parts by threads. The first limit support plate and the second limit support plate are respectively fixedly connected to the two connecting parts. The flow channel drive structure 132 of the above structure has a low processing cost and the applied force is relatively balanced. Specifically, the two ends of the screw connected to the two connecting parts have the same thread, so that the force exerted by the screw on the two connecting parts is relatively balanced, and the two connecting parts can be moved synchronously and simultaneously. The two connecting parts respectively drive the first limit support plate and the second limit support plate to move synchronously and simultaneously. When the size of the carrier plate changes and the width of the flow channel needs to be adjusted, the first limit plate and the second limit plate on both sides of the carrier plate are simultaneously and synchronously moved toward the carrier plate, thereby improving the working accuracy in terms of both force and movement distance.

[0039] like Figure 1 and Figure 3 As shown, in the technical solution of this embodiment, the die bonder also includes a first pressure plate structure 70 and a first top plate structure 80. The first pressure plate structure 70 is fixedly connected to the limit support frame. The first top plate structure 80 is arranged on the mounting frame module 10. The first pressure plate structure 70 and the first top plate structure 80 are arranged correspondingly. The first pressure plate structure 70 cooperates with the dispensing module 20. By fixing the carrier plate with the first pressure plate structure 70 and the first top plate structure 80, the carrier plate can be limited and fixed in multiple directions, which further ensures the accuracy of the carrier plate during operation. The second pressure plate structure and the second top plate structure are arranged at positions corresponding to the die bond module 40.

[0040] like Figure 1 、 Figure 3 and Figure 4 As shown, in the technical solution of this embodiment, the first top plate structure 80 includes a second motor, a first cam, a first transmission part, and a first top plate. The second motor is connected to the first cam to drive the first cam to rotate. The first cam cooperates with the bottom of the first transmission part. The top of the first transmission part is fixedly connected to the first top plate. The first top plate and the first pressure plate structure 70 have a mutually close pressing position or a mutually separated disengaged position. The structure of the first cam ensures that the first top plate exerts a relatively gentle force when pressing the carrier plate. Similarly, when the first top plate moves from the pressing position to the disengaged position, it also moves smoothly.

[0041] like Figure 4As shown, in the technical solution of this embodiment, the first transmission portion includes a first mating block and a first connecting plate. The bottom surface of the first mating block has an arcuate surface that mates with the first cam. This arcuate surface on the bottom surface of the first mating block mates with the first cam, resulting in a relatively large contact surface between the first mating block and the first cam, thereby ensuring a more stable fit between the first mating block and the first cam. In addition, the arcuate surface of the first mating block also ensures that the first transmission portion moves at the desired speed.

[0042] In the technical solution of this embodiment, the first top plate structure 80 also includes a first elastic member, one end of which is connected to the base assembly 11, and the second end of the first elastic member is connected to the first top plate structure 80 so that the first transmission part is in contact with the first cam. The provision of the first elastic member ensures that the first cam and the first matching block can exert a force against each other under the action of an external force, that is, the first transmission part always maintains a downward force under the action of the spring force. The first elastic member includes two springs, which are symmetrically located on both sides of the first cam to ensure that the force between the first transmission part and the first cam is balanced and uniform. Specifically, the two springs are in a stretched state.

[0043] like Figure 3 As shown, in the technical solution of this embodiment, the first pressure plate structure 70 includes a first pressure plate 71 and a second elastic member 72. The second elastic member 72 is disposed on the first pressure plate 71. When the first top plate and the first pressure plate structure 70 are in the pressing position, the first top plate and the second elastic member 72 jointly press the carrier plate. The provision of the second elastic member 72 prevents the carrier plate from being rigidly pressed when the first top plate structure 80 and the first pressure plate structure 70 jointly press the carrier plate. Instead, the carrier plate has a buffering force, which ensures that the carrier plate is not easily damaged.

[0044] like Figure 3 As shown, in the technical solution of this embodiment, the second elastic member 72 includes a first elastic piece, and the first elastic piece is fixed on the first pressing plate 71. The above structure is compact and easy to use.

[0045] like Figure 3 As shown, in the technical solution of this embodiment, the first spring plate includes a first connecting plate and a first presser foot. The first end of the first presser foot is connected to the side of the first connecting plate. The first presser plate 71 has a hollow hole. The first connecting plate is connected to the surface of the first presser plate 71 away from the first top plate structure 80, and the second end of the first presser foot passes through the hollow hole. This structure is compact and has low processing costs. Specifically, the first connecting plate and the first presser foot are integrally formed.

[0046] like Figure 3As shown, in the technical scheme of the present embodiment, the angle between the plane of the first connecting plate and the plane of the first presser foot is greater than 90 degrees and less than 180 degrees, and the second end of the first presser foot has an outward flange, and the flange is connected to the first presser foot by an arc connecting portion. The angle between the plane of the first connecting plate and the plane of the first presser foot is greater than 90 degrees and less than 180 degrees, which ensures the convenience of use of the first elastic fragment. For example, when the first elastic fragment moves downward, the angle between the plane of the first connecting plate and the plane of the first presser foot increases, which can achieve the force and elastic force on the carrier plate. The second elastic fragment includes a second connecting plate and two second presser feet, and the two second presser feet are relatively arranged on both sides of the second connecting plate. The first connecting plate and the second connecting plate have the same structure, and the first presser foot and the second presser foot have the same structure. When there are multiple hollow holes, adjacent hollow holes have a connecting bridge, and the second connecting plate is connected on the connecting bridge. Both ends of the second connecting plate have the second presser foot, so that both sides of the second connecting plate can form elastic pressure on the carrier plate. The first elastic fragment is used for the position of the hollow holes at both ends, and the second elastic fragment is used for the position of the connecting bridge in the middle of two adjacent hollow holes.

[0047] In the technical solution of this embodiment, the unloading module 50 includes an anti-static push rod, which pushes the carrier plate away from the flow channel assembly and can also prevent static electricity from damaging the carrier plate.

[0048] like Figure 1 As shown, in the technical solution of this embodiment, the conveying module 60 includes a third motor, a conveyor belt, a driven wheel, and a carrier clamping structure. The third motor and driven wheel are respectively arranged at both ends of the mounting frame module 10. The conveyor belt cooperates with the third motor and driven wheel, and the carrier clamping structure is arranged on the conveyor belt. The conveyor belt can ensure a large span of the conveying module 60. The technical solution of this embodiment can be multiple carrier clamping structures. Multiple carrier clamping structures improve efficiency. For example, the dispensing module 20 and the die bonding module 40 can operate simultaneously and move different carriers at the same time. The second top plate structure includes a fourth motor, a second cam, a second transmission unit, and a second top plate.

[0049] In the technical solution of this embodiment, the carrier plate clamping structure includes a clamping mount, a fixed clamping portion, a movable clamping portion, and a clamping drive portion. The clamping mount is mounted on the conveyor belt, the fixed clamping portion is fixedly mounted on the clamping mount, and the clamping drive portion is mounted on the clamping mount. The clamping drive portion is connected to the movable clamping portion to drive the movable clamping portion toward the fixed clamping portion to a clamped position, or to drive the movable clamping portion away from the fixed clamping portion to a released position. The carrier plate clamping structure is made of PEEK (polyetheretherketone) material at the location where it mates with the carrier plate. This structure of the carrier plate clamping structure is easy to operate. The movable clamping portion can be connected to a pneumatic cylinder, a hydraulic cylinder, or an electric push rod.

[0050] It should be noted that the die bonder of this embodiment has multiple cameras. For example, a camera (which can also be a camera as needed) is installed at the material preparation module 30 to monitor the dispensing results. Both the dispensing module 20 and the die bond module are equipped with cameras to monitor both dispensing and bonding. This embodiment also has a mobile camera that can be moved to the required location for monitoring.

[0051] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0052] The foregoing description is intended only to provide specific embodiments of the present invention, which will enable those skilled in the art to understand and implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not intended to be limited to the embodiments shown herein, but is intended to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A die bonding machine, characterized in that: include: Mounting frame module (10); a glue dispensing module (20), the glue dispensing module (20) being arranged on the mounting frame module (10); a material waiting module (30), the material waiting module (30) being arranged on the mounting frame module (10); a crystal bonding module (40), the crystal bonding module (40) being arranged on the mounting frame module (10); a blanking module (50), the blanking module (50) being arranged on the mounting frame module (10); a conveying module (60), the conveying module (60) being arranged on the mounting frame module (10) and capable of driving the carrier to sequentially pass through the dispensing module (20), the material waiting module (30), the crystal bonding module (40) and the material unloading module (50); The mounting frame module (10) comprises a base assembly (11), a guide rail assembly (12) and a flow channel assembly (13); the guide rail assembly (12) is fixed to the base assembly (11); the flow channel assembly (13) is movably arranged on the guide rail assembly (12); and the carrier plate can be supported on the flow channel assembly (13); The flow channel assembly (13) comprises a position-limiting support frame structure (131), the position-limiting support frame structure (131) comprising a first position-limiting support plate and a second position-limiting support plate, an adjustable predetermined distance being provided between the first position-limiting support plate and the second position-limiting support plate to form a flow channel, and the first position-limiting support plate and the second position-limiting support plate both extending along a moving direction of the carrier plate; The crystal bonding machine further comprises a first pressing plate structure (70) and a first top plate structure (80), wherein the first pressing plate structure (70) is fixedly connected to the position-limiting support frame, the first top plate structure (80) is arranged on the mounting frame module (10), the first pressing plate structure (70) and the first top plate structure (80) are arranged correspondingly, and the first pressing plate structure (70) cooperates with the dispensing module (20); The first top plate structure (80) includes a second motor, a first cam, a first transmission part and a first top plate, the second motor is connected to the first cam to drive the first cam to rotate, the first cam is matched with the bottom of the first transmission part, the top of the first transmission part is fixedly connected to the first top plate, the first top plate and the first pressure plate structure (70) have a mutually close pressing position or the first top plate and the first pressure plate structure (70) have a mutually separated disengaged position; The first top plate structure (80) further includes a first elastic member, one end of the first elastic member is connected to the base assembly (11), and a second end of the first elastic member is connected to the first top plate structure (80) so that the first transmission part contacts the first cam.

2. The die bonder according to claim 1, wherein: The first limiting support plate includes a first limiting plate and a first support plate, the first support plate is located on a side of the first limiting support plate close to the second limiting support plate, the upper surface of the first support plate is lower than the upper surface of the first limiting plate to form a first step surface, the second limiting support plate includes a second limiting plate and a second support plate, the second support plate is located on a side of the second limiting plate close to the first limiting support plate, the upper surface of the second support plate is lower than the upper surface of the second limiting plate to form a second step surface.

3. The die bonder according to claim 1, wherein: The flow channel assembly (13) further comprises a flow channel driving structure (132), wherein the flow channel driving structure (132) is connected to the position-limiting support frame structure (131) to drive the position-limiting support frame structure (131) to change the predetermined distance of the flow channel.

4. The die bonder according to claim 3, characterized in that: The flow channel driving structure (132) comprises a first motor, a screw and two connecting parts, the output shaft of the first motor is connected to the screw, the two ends of the screw are respectively connected to the two connecting parts through threads, and the first limiting support plate and the second limiting support plate are respectively fixedly connected to the two connecting parts.

5. The die bonder according to claim 1, wherein: The first transmission part includes a first matching block and a first connecting plate. The bottom surface of the first matching block has an arc surface matching with the first cam.

6. The die bonder according to claim 1, wherein: The first pressing plate structure (70) comprises a first pressing plate (71) and a second elastic member (72), wherein the second elastic member (72) is arranged on the first pressing plate (71), and when the first top plate and the first pressing plate structure (70) are in the pressing position, the first top plate and the second elastic member (72) jointly press the carrier plate.

7. The die bonder according to claim 6, wherein: The second elastic member (72) comprises a first elastic piece, and the first elastic piece is fixed on the first pressing plate (71).

8. The die bonder according to claim 7, wherein: The first elastic piece includes a first connecting plate and a first presser foot, wherein the first end of the first presser foot is connected to the side of the first connecting plate, the first presser plate (71) has a hollow hole, the first connecting plate is connected to the surface of the first presser plate (71) away from the first top plate structure (80), and the second end of the first presser foot passes through the hollow hole.

9. The die bonder according to claim 8, characterized in that: The angle between the plane of the first connecting plate and the plane of the first presser foot is greater than 90 degrees and less than 180 degrees. The second end of the first presser foot has an outward flange, and the flange is connected to the first presser foot through an arc-shaped connecting portion.

10. The die bonder according to any one of claims 1 to 9, characterized in that: The conveying module (60) comprises a third motor, a conveyor belt, a driven wheel and a carrier plate clamping structure, the third motor and the driven wheel are respectively arranged at two ends of the mounting frame module (10), the conveyor belt cooperates with the third motor and the driven wheel, and the carrier plate clamping structure is arranged on the conveyor belt.

11. The die bonder according to claim 10, characterized in that: The carrier plate clamping structure includes a clamping mounting seat, a fixed clamping part, a movable clamping part and a clamping drive part. The clamping mounting seat is installed on the conveyor belt, the fixed clamping part is fixedly set on the clamping mounting seat, and the clamping drive part is set on the clamping mounting seat. The clamping drive part is connected to the movable clamping part to drive the movable clamping part to approach the fixed clamping part to be in a clamping position, or drive the movable clamping part away from the fixed clamping part to be in a release position.

Citation Information

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