A micro-system package-based TDICCD stage control system for spacecraft

Abstract

A kind of microsystem package-based TDICCD order control system for spacecraft, including ceramic pin array tube shell, ceramic substrate, die chip, multilayer porcelain dielectric capacitor, metallized cover plate, thick film resistor, multiple passive, active devices with different functions are packaged in a shell, become a single standard packaging product providing multiple functions, with the function of system or subsystem, using unpackaged die chip instead of packaged devices, and integrated through smaller size ceramic substrate, can control multiple spectral bands.

Description

Technical Field

[0001] This invention relates to a TDICCD series control system for spacecraft based on microsystem packaging, belonging to the field of microelectronics technology for aerospace optical remote sensors. Background Technology

[0002] In the field of space remote sensing, time-delay integrated charge-coupled devices (TDICCDs) have been widely used due to their outstanding imaging capabilities and high sensitivity. With the continuous development of remote sensing technology, the functional requirements of TDICCD data processing circuits are becoming increasingly complex, while the demands for size, weight, and cost are decreasing. On the one hand, limited by circuit size and weight, relying solely on traditional PCB boards is gradually failing to meet the requirements of current circuit scale. On the other hand, the cost of circuits composed of a large number of chips is also gradually failing to meet market demands. Therefore, improving the function density ratio of electronic circuits while achieving the same functionality has significant application value. Summary of the Invention

[0003] The technical problem solved by this invention is that the traditional PCB board circuit structure in the current technology can no longer meet the current circuit scale and market demand. Therefore, a TDICCD series control system for spacecraft based on microsystem packaging is proposed.

[0004] The present invention solves the above-mentioned technical problem through the following technical solution:

[0005] A TDICCD series control system for spacecraft based on microsystem packaging includes a ceramic pin array housing, a ceramic substrate, a die chip, a multilayer ceramic dielectric capacitor, a metallized cover plate, and a thick-film resistor, wherein:

[0006] The thick-film resistor is integrated into the ceramic substrate by coating with paste. The ceramic substrate is bonded to the inner cavity of the ceramic pin array housing. The edge of the ceramic substrate is connected to the bonding finger of the ceramic pin array housing by wire bonding. The die chip and the multilayer ceramic dielectric capacitor are bonded to the ceramic substrate by conductive adhesive. The die chip and the ceramic substrate are electrically interconnected by wire bonding. The metallized cover plate encapsulates the ceramic substrate, die chip, multilayer ceramic dielectric capacitor and thick-film resistor in the ceramic pin array housing.

[0007] The chip includes a decoder, an inverter, and an analog switch, all of which receive voltage signals of corresponding amplitudes through an external power interface to operate.

[0008] The decoder receives external input signals, processes the signals through the decoder and inverter, and then outputs the converted output signal through an analog switch.

[0009] The decoder, inverter, and analog switch are all powered by an external power supply signal.

[0010] The decoder receives external input signals, and the analog switch receives external PWM square wave signals and low-level signals. After decoding the input signals, the decoder sends control signals to the analog switch and the inverter. After processing the control signals, the inverter sends the processed signals to the analog switch. The analog switch receives the control signals and the processed signals, performs signal conversion, and outputs the converted output signals to the outside.

[0011] The input signal and power supply signal are input through the edge of the ceramic substrate and fan out from the bottom of the ceramic pin array housing. The stage signal is selected according to the bonding finger of the ceramic pin array housing. The stage signal of the selected stage outputs a low-level signal into the die chip, and the stage signal of the unselected stage outputs a PWM square wave signal.

[0012] The output signal is received by an external focal plane circuit and driven to the corresponding pin of the TDICCD to achieve stage control.

[0013] The series control specifically refers to:

[0014] The input signal type of the input chip is determined based on the level signal of the selected range. The level signal includes five spectral band signals, specifically four multispectral bands and one full-spectral band.

[0015] The advantages of this invention compared to the prior art are:

[0016] (1) The present invention provides a spacecraft TDICCD level control system based on microsystem packaging. As a component of the data processing circuit and the key to whether the TDICCD can work properly, it can increase / decrease the number of exposure lines by switching different levels. It can package multiple passive and active devices with different functions into one housing, becoming a single standard packaged product that provides multiple functions. It has the functions of a system or subsystem, simplifies the structure, improves the reliability and integration of the product, and realizes the miniaturization and weight reduction of the circuit.

[0017] (2) This invention makes full use of the vertical space of the ceramic substrate, adopts high-density interconnect technology and blind buried via wiring technology, and rationally arranges different functional devices, improves the performance of the module circuit, reduces the noise in the circuit, and directly mounts the unpackaged die chip on the ceramic substrate, reducing the materials required for device packaging. Compared with PCBs with the same function, the microsystem package has lower power consumption and smaller size.

[0018] (3) The present invention embeds the thick film resistor into the substrate stack, which improves the module integration. The die chip area on the substrate surface accounts for more than one-fifth of the substrate area, which significantly reduces the trace length and shortens the signal transmission delay time. The ceramic pin array shell integrates the multi-chip module ceramic substrate and the airtight cavity into one, achieving higher packaging density. Compared with the metal shell, it is lighter and has better performance.

[0019] (4) The present invention provides a spacecraft TDICCD series control system based on microsystem encapsulation. The number of integrated spectral bands and the number of series signals corresponding to each spectral band can be compatible with various types of spacecraft TDICCDs. It has strong versatility under different application backgrounds and realizes the integration of different types of TDICCD series control systems.

[0020] (5) The present invention directly connects the die chip and the ceramic substrate through micro-assembly technology, which has a larger relative heat dissipation area compared with the traditional PCB welding process, improves the thermal conductivity of the system, and reduces the thermal management volume limitation and cost of the package.

[0021] (6) The present invention adopts microsystem-based packaging technology. After completing the basic functional test, the stage control system is sealed to avoid contact between the internal active and passive devices and the external environment as much as possible. This reduces the pollution and corrosion of the internal components by water vapor, impurities and various chemicals, reduces the risk of system failure and greatly improves reliability. Attached Figure Description

[0022] Figure 1 A schematic diagram of the composition of a spacecraft-based TDICCD series control module based on microsystem packaging, provided for the invention;

[0023] Figure 2 A basic circuit diagram of a spacecraft TDICCD series control module based on microsystem packaging provided for the invention; Detailed Implementation

[0024] A TDICCD series control system for spacecraft based on microsystem packaging fully utilizes the vertical space of the ceramic substrate, employs high-density interconnect technology and blind / buried via wiring technology, and rationally arranges different functional devices to improve the performance of the module circuit. Simultaneously, it implements the TDICCD delay integration function through a die chip. The specific structure is as follows:

[0025] The device includes a ceramic pin array housing, a ceramic substrate, a die chip, a multilayer ceramic dielectric capacitor, a metallized cover plate, and a thick-film resistor. The thick-film resistor is integrated into the ceramic substrate by coating with paste. The ceramic substrate is bonded to the inner cavity of the ceramic pin array housing. The edge of the ceramic substrate is connected to the bonding fingers of the ceramic pin array housing by wire bonding. The die chip and the multilayer ceramic dielectric capacitor are bonded to the ceramic substrate by conductive adhesive. The die chip and the ceramic substrate are electrically interconnected by wire bonding. The metallized cover plate encapsulates the ceramic substrate, die chip, multilayer ceramic dielectric capacitor, and thick-film resistor in the ceramic pin array housing.

[0026] The chip includes decoders, inverters, and analog switches, all of which receive voltage signals of corresponding amplitude through an external power interface to operate.

[0027] The decoder receives external input signals, processes the signals through the decoder and inverter, and then outputs the converted output signal through an analog switch.

[0028] The decoder, inverter, and analog switch are all powered by an external power supply signal;

[0029] The decoder receives external input signals, and the analog switch receives external PWM square wave signals and low-level signals. After decoding the input signals, the decoder sends control signals to the analog switch and the inverter. After processing the control signals, the inverter sends the processed signals to the analog switch. The analog switch receives the control signals and the processed signals, performs signal conversion, and outputs the converted output signal to the outside.

[0030] Input signals and power supply signals are input through the edge of the ceramic substrate and fan out from the bottom of the ceramic pin array housing. The stage signal is selected according to the bonding finger of the ceramic pin array housing. The stage signal of the selected stage outputs a low-level signal into the die chip, and the stage signal of the unselected stage outputs a PWM square wave signal.

[0031] The output signal is received by the external focal plane circuit and driven to the corresponding pin of the TDICCD to achieve stage control;

[0032] The specific steps of series control are as follows:

[0033] The input signal type of the input chip is determined based on the level signal of the selected range. The level signal includes five spectral band signals, specifically four multispectral bands and one full-spectral band.

[0034] The following is a further explanation based on specific embodiments:

[0035] In the current embodiment, the level control system is a crucial circuit for realizing the delay integration function of the TDICCD. Its principle is to use analog switches to convert the TDICCD level signal between low level and PWM square wave to control the number of exposure lines. For a certain spacecraft-grade TDICCD, which includes one full-spectrum band and four multispectral bands (the full-spectrum band containing eight levels and the multispectral bands containing six levels), a five-band, 32-level level control module was designed. Unpackaged chips were used instead of packaged devices, and integration was achieved through a smaller ceramic substrate. The signal is ultimately fanned out through the casing, reducing the module's size, weight, and power consumption.

[0036] The basic circuit structure within the system is as follows: Figure 2 As shown, the decoder, inverter, and analog switch are supplied with the voltage required for operation by an external power supply, and a low-level signal is sent to the analog switch. The input signal and PWM square wave signal are generated by an external signal processing circuit. After receiving the input signal, the decoder sends control signals to the inverter and analog switch. After receiving the control signals sent by the decoder and inverter, the analog switch completes the output of 32 levels of signal.

[0037] The location of different components in the system, such as Figure 1 As shown, the system includes a ceramic pin array housing 1, a ceramic substrate 2, a die chip 3, a multilayer ceramic dielectric capacitor 4, a metallized cover plate 5, and a thick-film resistor 6. The ceramic pin array housing 1, ceramic substrate 2, and die chip 3 are all bonded together with insulating adhesive. The windowed area of ​​the die chip 3 is bonded to the bonding fingers of the ceramic substrate 2 via gold wire bonding. The multilayer ceramic dielectric capacitor 4 is bonded to the ceramic substrate 2 with conductive adhesive. The input / output signals and power supply signals at the edge of the ceramic substrate 2 are connected to the bonding fingers around the perimeter of the ceramic pin array housing 1 via gold wire bonding. All signals are ultimately fanned out from the bottom of the ceramic pin array housing 1. The selected level outputs a low-level signal, while the unselected level outputs a PWM square wave. The output signals are received by an external focal plane circuit, driven, and applied to the corresponding pins of the TDICCD to achieve level control.

[0038] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present invention by utilizing the methods and techniques disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the protection scope of the technical solutions of the present invention.

[0039] The contents not described in detail in this specification are common knowledge to those skilled in the art.

Claims

1. A TDICCD series control system for spacecraft based on microsystem encapsulation, characterized in that: This includes ceramic pin array housings, ceramic substrates, die chips, multilayer ceramic dielectric capacitors, metallized cover plates, and thick-film resistors, among which: The thick-film resistor is integrated into the ceramic substrate by coating with paste. The ceramic substrate is bonded to the inner cavity of the ceramic pin array housing. The edge of the ceramic substrate is connected to the bonding finger of the ceramic pin array housing by wire bonding. The die chip and the multilayer ceramic dielectric capacitor are bonded to the ceramic substrate by conductive adhesive. The die chip and the ceramic substrate are electrically interconnected by wire bonding. The metallized cover plate encapsulates the ceramic substrate, die chip, multilayer ceramic dielectric capacitor and thick-film resistor in the ceramic pin array housing. The chip includes a decoder, an inverter, and an analog switch, all of which receive voltage signals of corresponding amplitude through an external power interface to operate. The decoder receives an external input signal, processes the signal through the decoder and inverter, and then outputs the converted signal through an analog switch. Specifically: the decoder receives an external input signal, the analog switch receives an external PWM square wave signal and a low-level signal, the decoder decodes the input signal and sends a control signal to the analog switch and inverter, the inverter processes the control signal and sends the processed signal to the analog switch, the analog switch receives the control signal and the processed signal, performs signal conversion, and outputs the converted signal to the outside. The input signal and power supply signal are input through the edge of the ceramic substrate and fan out from the bottom of the ceramic pin array housing. The stage signal is selected according to the bonding finger of the ceramic pin array housing. The stage signal of the selected stage outputs a low-level signal into the die chip, and the stage signal of the unselected stage outputs a PWM square wave signal. The series signal includes five spectral bands, specifically four multispectral bands and one full-spectral band; The area of ​​the die chip on the surface of the substrate accounts for more than one-fifth of the substrate area; By packaging multiple passive and active devices with different functions into a single housing, a single standard packaged product can be created that provides multiple functions, possesses the functions of a system or subsystem, simplifies the structure, improves the reliability and integration of the product, and achieves the miniaturization and weight reduction of the circuit.

2. The TDICCD series control system for spacecraft based on microsystem encapsulation according to claim 1, characterized in that: The decoder, inverter, and analog switch are all powered by an external power supply signal.

3. The TDICCD series control system for spacecraft based on microsystem encapsulation according to claim 1, characterized in that: The output signal is received by an external focal plane circuit and driven to the corresponding pin of the TDICCD to achieve stage control.

4. The TDICCD series control system for spacecraft based on microsystem encapsulation according to claim 3, characterized in that: The level control specifically involves determining the input signal type of the input chip based on the level signal of the selected level.

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