脱模膜和半导体封装的制造方法
By incorporating a substrate layer, an adhesive layer, and a conductive layer into the release film, and especially by using polyester copolymers containing butylene and alkylene oxide structures, the problem of electrostatic damage during peeling of the release film is solved, and it exhibits excellent elongation at low temperatures, making it suitable for semiconductor packaging manufacturing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- RESONAC CORP
- Filing Date
- 2019-09-05
- Publication Date
- 2026-07-17
AI Technical Summary
Existing release films are prone to becoming charged when peeled off after the sealing process, which can cause electrostatic damage to electronic components. Furthermore, they lack elongation at low temperatures, making it difficult to meet the needs of various packaging applications.
The release film comprises a substrate layer, an adhesive layer, and a conductive layer. The substrate layer is composed of a polyester copolymer containing butylene and alkylene oxide structures. The conductive layer is disposed between the substrate layer and the adhesive layer to ensure an elongation of greater than or equal to 1000% at 150°C, thereby suppressing electrostatic damage and improving elongation.
It effectively suppresses electrostatic damage, ensures excellent elongation at low temperatures, is suitable for manufacturing various packages, and is not prone to discharge during peeling.
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