Storage device, latching assembly, and storage device assembly comprising a latching assembly

Abstract

The present disclosure provides a storage device, a latch assembly, and a storage device assembly including the latch assembly. The storage device assembly includes a latch assembly and a storage device coupled to the latch assembly, wherein the latch assembly includes a first part, a second part disposed to extend from the first part in a first direction and having an upper surface lower than an upper surface of the first part, and a hook disposed on the upper surface of the second part and having elasticity, a first coupling part bent on the upper surface of the second part is disposed at one end of the hook, a second coupling part bent on the upper surface of the second part is disposed at the other end, and the storage device includes a memory module including a module board and a memory connector disposed on one side of the module board, a first housing disposed above the memory module and having a first fixing hole in which the first coupling part is accommodated and a second fixing hole in which the second coupling part is accommodated, and a second housing disposed below the memory module.

Description

[0001] This application claims priority to and all rights arising therefrom of Korean Patent Application No. 10-2020-0131583, filed on October 13, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a storage device, a latch assembly, and a storage device assembly. Background Technology

[0003] Storage devices, including SSDs (Solid State Drives), are devices that receive and store data from a host computer. Such storage devices are widely used not only in traditional electronic devices (such as desktop PCs, tablet PCs, and laptop PCs) but also in mobility-related electronic devices (such as automobiles, drones, and aircraft).

[0004] Multiple storage devices can be used in such electronic devices, and these multiple storage devices can be attached or detached as needed. Therefore, there is a need for research to improve the attachment and detachment performance of storage devices. Summary of the Invention

[0005] This disclosure provides a storage device assembly with improved attachment and detachment performance.

[0006] This disclosure also provides a storage device with improved attachment and detachment performance.

[0007] This disclosure also provides a latch assembly with improved attachment and disassembly performance.

[0008] According to one aspect of this disclosure, a storage device assembly is provided, the storage device assembly comprising: a latch assembly; and a storage device coupled to the latch assembly, wherein the latch assembly comprises: a first component; a second component configured to extend from the first component in a first direction and having an upper surface lower than the upper surface of the first component; and a hook disposed on the upper surface of the second component and being resilient, a first connecting component bent on the upper surface of the second component disposed at one end of the hook, and a second connecting component bent on the upper surface of the second component disposed at the other end, and the storage device comprising: a memory module including a module plate and a memory connector disposed on one side of the module plate; a first housing configured to be disposed above the memory module and having a first fixing hole and a second fixing hole, the first connecting component being received in the first fixing hole, the second connecting component being received in the second fixing hole; and a second housing disposed below the memory module.

[0009] According to one aspect of this disclosure, a storage device is provided, the storage device comprising: a memory module including a module board and a memory connector disposed on one side of the module board; a first housing disposed above the memory module; and a second housing disposed below the memory module, wherein the first housing includes a top plate, a first side wall and a second side wall, the first side wall extending from a first long side of the top plate along a first direction, the second side wall extending from a second long side of the top plate along the first direction, the top plate including an extension extending beyond one end of the first side wall and one end of the second side wall along a second direction intersecting the first direction, a first fixing hole and a second fixing hole formed in the extension, the first side wall including a first bending member bending along a third direction intersecting the first and second directions, and the second housing including a bottom plate, one end of the bottom plate being spaced apart from the first bending member by a predetermined distance.

[0010] According to one aspect of this disclosure, a latch assembly for coupling to a storage device is provided, the latch assembly comprising: a first component; a second component configured to extend from the first component along a first direction and having an upper surface lower than an upper surface of the first component; and a third component configured to extend from the second component along the first direction and having an upper surface lower than an upper surface of the second component, wherein the third component comprises: a first portion having a first width measured in a second direction intersecting the first direction, and a second portion having a second width measured in the second direction, the first width being smaller than the second width.

[0011] However, the aspects of this disclosure are not limited to those set forth herein. These and other aspects will become more apparent to those skilled in the art upon reference to the following detailed description of the disclosure. Attached Figure Description

[0012] The aspects and features of this disclosure, as well as other aspects and features, will become clearer from the detailed description of exemplary embodiments of this disclosure with reference to the accompanying drawings, in which:

[0013] Figure 1 This is a block diagram illustrating a host storage system according to some embodiments;

[0014] Figure 2 This is a perspective view of a storage component according to some embodiments;

[0015] Figure 3 yes Figure 2 An exploded perspective view of the storage components;

[0016] Figure 4 and Figure 5 yes Figure 3 An exploded perspective view of the storage device;

[0017] Figure 6 This is an enlarged view of the mounting holes of the storage device;

[0018] Figure 7 yes Figure 3 A perspective view of the latch assembly;

[0019] Figure 8 It is along Figure 7 A sectional view taken by line A-A';

[0020] Figure 9 This is a diagram showing the form in which the hook of the latch assembly connects to the fixing hole of the storage device;

[0021] Figure 10 This is a partial perspective view of a host according to some embodiments;

[0022] Figure 11 yes Figure 10 A sectional view;

[0023] Figure 12 This is a partial perspective view of the storage device;

[0024] Figure 13 This is a perspective view of a latching component of a storage component according to some embodiments;

[0025] Figure 14 yes Figure 13 A plan view of the latch assembly;

[0026] Figure 15 This is a diagram illustrating a housing assembly of a storage device according to some embodiments;

[0027] Figure 16 yes Figure 15 Floor plan;

[0028] Figure 17 This is a diagram illustrating the connection state of the latch assembly and the storage device of a storage component according to some embodiments;

[0029] Figure 18 yes Figure 17 A plan view of the latch assembly and storage device;

[0030] Figure 19 This is a perspective view of a latching assembly of a storage component according to some embodiments; and

[0031] Figure 20 This is a diagram illustrating a data center that utilizes storage components according to some embodiments. Detailed Implementation

[0032] In the following description, embodiments based on the technical concept of this disclosure will be described with reference to the accompanying drawings.

[0033] Figure 1 This is a block diagram illustrating a host storage system according to some embodiments.

[0034] The host storage system 10 may include a host 100 and a storage device 200. The storage device 200 may include a storage controller 210 and non-volatile memory (NVM) 220. Furthermore, in some embodiments, the host 100 may include a host controller 110 and host memory 120. The host memory 120 may be used as a buffer for temporarily storing data to be sent to or from the storage device 200.

[0035] Storage device 200 may include a storage medium for storing data in response to a request from host 100. For example, storage device 200 may include at least one of an SSD (Solid State Drive), embedded memory, and removable external memory. If storage device 200 is an SSD, it may be a device compliant with the NVMe (Non-Volatile Memory Fast) standard. If storage device 200 is embedded memory or external memory, it may be a device compliant with the UFS (Universal Flash Memory) standard or the eMMC (Embedded Multimedia Card) standard. Host 100 and storage device 200 may each generate and send packets conforming to their respective standard protocols.

[0036] When the non-volatile memory 220 of storage device 200 includes flash memory, such flash memory may include a 2D NAND memory array or a 3D (or vertical) NAND (VNAND) memory array. As another example, storage device 200 may also include various other types of non-volatile memory. For example, MRAM (Magnetic Random Access Memory (RAM)), spin-torque MRAM, conductive bridged RAM (CBRAM), FeRAM (Ferroelectric RAM), PRAM (Phase Change RAM), resistive memory (resistive RAM), and various other types of memory may be used in storage device 200.

[0037] In some embodiments, the host controller 110 and the host memory 120 may be configured as different semiconductor chips. Alternatively, in some embodiments, the host controller 110 and the host memory 120 may be integrated on the same semiconductor chip. As an example, the host controller 110 may be one of multiple modules disposed in an application processor, and such an application processor may be configured as a system-on-a-chip (SoC). Furthermore, the host memory 120 may be embedded memory disposed in the application processor, or it may be non-volatile memory or a memory module disposed outside the application processor.

[0038] The host controller 110 can manage operations that store data in the buffer area (e.g., record data) in the non-volatile memory 220 or store data in the non-volatile memory 220 (e.g., read data) in the buffer area.

[0039] The storage controller 210 may include a host interface (I / F) 211, a memory interface (I / F) 212, and a CPU (Central Processing Unit) 213. Furthermore, the storage controller 210 may also include a flash translation layer (FTL) 214, a packet manager 215, a buffer memory 216, an ECC (Error Correction Code) engine 217, and an AES (Advanced Encryption Standard) engine 218.

[0040] The storage controller 210 may also include a working memory (not shown) to which a flash translation layer (FTL) 214 is loaded, and when the CPU 211 executes the flash translation layer, write and read operations on data in the non-volatile memory can be controlled.

[0041] Host interface 211 can send packets to host 100 and receive packets from host 100. Packets sent from host 100 to host interface 211 may include commands or data to be recorded in non-volatile memory 220, and packets sent from host interface 211 to host 100 may include responses to commands, data read from non-volatile memory 220, etc.

[0042] The memory interface 212 can send data to be recorded in the non-volatile memory 220 to the non-volatile memory 220, or receive data read from the non-volatile memory 220. The memory interface 212 can be implemented in accordance with standard protocols such as Toggle or ONFI (Open NAND Flash Interface).

[0043] The flash translation layer 214 can perform various functions, such as address mapping, wear leveling, and garbage collection. Address mapping is the process of changing a logical address received from the host to a physical address used to actually store data in the non-volatile memory 220. Wear leveling is a technique used to ensure that blocks in the non-volatile memory 220 are used evenly to prevent excessive degradation of specific blocks, and can be implemented, for example, through firmware techniques that balance the erase counts of physical blocks. Garbage collection is a technique used to ensure available capacity in the non-volatile memory 220 by copying valid data from a block to a new block and subsequently erasing the existing block.

[0044] The packet manager 215 can generate packets according to the protocol of the interface discussed with the host 100, or parse various types of information from packets received from the host 100. Furthermore, the buffer memory 216 can temporarily store data to be recorded in or read from the non-volatile memory 220. The buffer memory 216 can be configured to be located inside the storage controller 210, but can also be located outside the storage controller 210.

[0045] ECC engine 217 can perform error detection and correction functions on read data read from non-volatile memory 220. More specifically, ECC engine 217 can generate parity bits for write data to be written to non-volatile memory 220, and the parity bits generated in this way can be stored in non-volatile memory 220 along with the write data. When reading data from non-volatile memory 220, ECC engine 217 can use the parity bits read from non-volatile memory 220 along with the read data to correct errors in the read data and output the error-corrected read data.

[0046] The AES engine 218 can use a symmetric key algorithm to perform at least one of encryption and decryption operations on data input to the storage controller 210.

[0047] Figure 2 This is a perspective view of a storage assembly according to some embodiments. Figure 3 yes Figure 2 An exploded perspective view of the storage components.

[0048] Reference Figure 2 and Figure 3 The storage component (or storage device component) SA1 includes a storage device 200 and a latch assembly 300.

[0049] Storage device 200 may include housing assembly 260. Fixing holes FH1 and FH2 are formed in housing assembly 260, and housing assembly 260 can be joined to latch assembly 300 through fixing holes FH1 and FH2.

[0050] Specifically, a hook (HOK) for connecting to the storage device 200 can be disposed in the latch assembly 300. The hook (HOK) may include a first connecting member FP1 and a second connecting member FP2. For example, when the first connecting member FP1 and the second connecting member FP2 of the hook (HOK) are connected to the first fixing hole FH1 and the second fixing hole FH2 of the housing assembly 260 respectively via a snap-fit, the storage device 200 and the latch assembly 300 can be connected.

[0051] In some embodiments, the illustrated storage device 200 and latch assembly 300 can be attached to the host in a connected state. Figure 1 (100). A more detailed description will be provided later.

[0052] The storage device 200 may have a basic cuboid shape. In the figures, the direction of extension of the long side LS of the rectangular bottom surface is indicated by a first direction X, the direction of extension of the short side SS of the rectangular bottom surface is indicated by a second direction Y, and the thickness direction of the cuboid is indicated by a third direction Z. The planes defined by the two directions may be referred to as the XY plane, the YZ plane, and the ZX plane, respectively. In this context, the bottom surface of the storage device 200 is disposed on the XY plane. Unless otherwise stated herein, the planar shape or appearance of a particular component in a plan view means the shape in which the particular component is disposed in the XY plane.

[0053] For ease of explanation, of the two bottom surfaces of the storage device 200, the surface located on one side in the third direction Z (the upper side in the figure) is referred to as the upper surface, and the surface located on the other side in the third direction Z (the lower side in the figure) is referred to as the lower surface. Furthermore, for other components, based on the third direction Z, the surface on one side will be referred to as the upper surface, and the surface on the other side will be referred to as the lower surface.

[0054] However, in the context of the upper and lower surfaces, the terms "upper" and "lower" merely distinguish the relative positions from each other, and it is clear that even in the case of surfaces referred to as "upper" and "lower," these surfaces can be upside down, or located in the left-right or diagonal direction as the orientation of the storage device 200 changes.

[0055] The appearance of the storage device 200 can follow a standardized or arbitrary shape factor. The dimensions of the cuboid storage device 200 can also be changed according to various standards.

[0056] In some embodiments, the storage device 200 may conform to a long-type dimension standard, in which the length of the long side (width in the first direction X) is 119 mm, the length of the short side (width in the second direction Y) is 36.5 mm, and the height (width in the third direction Z) is 9.5 mm. Furthermore, in some other embodiments, the storage device 200 may conform to a short-type dimension standard, in which the length of the long side (width in the first direction X) is 52 mm, the length of the short side (width in the second direction Y) is 36.5 mm, and the height (width in the third direction Z) is 9.5 mm. Such a dimension standard allows tolerances within 5% of each dimension. For example, such a dimension standard may allow tolerances such as ±0.25 mm, ±0.35 mm, and ±0.45 mm.

[0057] In the following text, reference will be made to Figures 4 to 6 A storage device 200 is described according to some embodiments of a storage component SA1.

[0058] Figure 4 and Figure 5 yes Figure 3 An exploded perspective view of the storage device. Figure 6 This is an enlarged view of the mounting holes for the storage device.

[0059] Reference Figures 4 to 6 The storage device 200 includes a memory module 270 and a housing assembly 260 that houses the memory module 270. The housing assembly 260 can substantially define the appearance of the storage device 200. Except for some areas such as the area where the memory connector MCN is located, the memory module 270 can be covered by the housing assembly 260.

[0060] The memory module 270 may include a module board BDH, a memory connector MCN disposed at at least one end of the module board BDH, and an electronic component CHP disposed on at least one surface of the module board BDH.

[0061] A modular board (BDH) may include one or more insulating layers and wiring layers. A modular board (BDH) may include, for example, a printed circuit board.

[0062] The module board BDH can have a plate-like shape. The module board BDH can be generally arranged on the XY plane. The overall planar shape of the module board BDH can be similar to the planar shape of the storage device 200. For example, when the storage device 200 has a rectangular or similar appearance in a plan view, the module board BDH can also have a rectangular or similar appearance.

[0063] In a plan view, the size of the module board BDH is smaller than that of the storage device 200, but can be approximately the same. For example, the area occupied by the module board BDH can be between 50% and 99% of the area occupied by the storage device 200.

[0064] In the plan view, the module board BDH occupies the central portion of the storage device 200, and each side of the module board BDH may be located inside each corresponding side of the storage device 200. Except for some parts, the housing assembly 260 is disposed in the space between each side of the module board BDH and each side of the storage device 200 to prevent the module board BDH from being exposed to the outside.

[0065] The module board BDH may include one or more module fastening holes MH1 to MH4. In a configuration with multiple module fastening holes MH1 to MH4, each of the module fastening holes MH1 to MH4 may have the same size and shape, but is not limited thereto.

[0066] Module fastening holes MH1 to MH4 penetrate the module plate BDH along the third direction Z (thickness direction). Module fastening holes MH1 to MH4 provide space for fastening components (such as screws, pieces, and bolts) to be inserted. In the following text, although screws are shown as an example of fastening components, it is clear that various components inserted into holes or grooves and connected in parallel can be applied equivalently in a similar manner to screws.

[0067] Module fastening holes MH1 to MH4 can be located at the corners of the module board BDH. Module fastening holes MH1 to MH4 may include a first module fastening hole MH1 located at a first corner, a second module fastening hole MH2 located at a second corner, a third module fastening hole MH3 located at a third corner, and a fourth module fastening hole MH3 located at a fourth corner. However, this disclosure is not limited thereto, and module fastening holes MH1 to MH4 may be omitted at some corners and may be further installed (e.g., located) in areas other than the corners (e.g., the central portion and areas adjacent to the edges).

[0068] In some embodiments, the position of each of the module fastening holes MH1 to MH4 can be designed such that, based on the angle of each corner, the distance separated along the first direction X is the same as the distance separated along the second direction Y, to provide an effective connection. In such an embodiment, if each corner of the module board BDH is located at the apex of a rectangle, the diagram formed by connecting each of the module fastening holes MH1 to MH4 will define a rectangle.

[0069] In some other embodiments, each of the module mounting holes MH1 to MH4 can be modified from the aforementioned positions depending on the wiring design of the module board BDH, chip layout, location of the memory connector MCN, etc. For example, as shown in the figures, when the memory connector MCN is located on the first short side SS1 and is configured to be generally biased towards the second long side LS2, which is farther from the first long side LS1 than the first long side LS1, the fourth module mounting hole MH4 can be positioned further away from the first short side SS1 in the first direction X than the first module mounting hole MH1. In this case, the straight line connecting the first module mounting hole MH1 and the fourth module mounting hole MH4 can be inclined at a first angle θ1 relative to the second direction Y.

[0070] When the second module mounting hole MH2 and the third module mounting hole MH3 are located near the second short side SS2 on which the memory connector MCN is not positioned, the spacing distance between the second module mounting hole MH2 and the third module mounting hole MH3 and the second short side SS2 in the first direction X can be the same. However, by designing the spacing distance of the second module mounting hole MH2 to be larger than the spacing distance of the third module mounting hole MH3, the spacing distance deviation between the module mounting holes MH1 to MH4 in the first direction X can be mitigated. In this case, the straight line connecting the second module mounting hole MH2 and the third module mounting hole MH3 can be inclined with respect to the second direction Y at a second angle θ2. The second angle θ2 can have the same sign as the first angle θ1. The second angle θ2 can have a smaller absolute value than the first angle θ1, but is not limited thereto. In some embodiments, the pattern obtained by connecting each of the module mounting holes MH1 to MH4 can define a trapezoid.

[0071] In a plan view, the module fastening holes MH1 to MH4 can have a closed curve shape (such as a circular shape). In this case, in a plan view, the module fastening holes MH1 to MH4 are completely surrounded by the module plate BDH. In some embodiments, some of the module fastening holes MH1 to MH4 can open towards the edge (e.g., the long edge) of the module plate BDH. That is, because the module fastening holes MH1 to MH4 are set closer to the edge of the module plate BDH, and the edge of the module plate BDH is set within the virtual circle formed by the module fastening holes MH1 to MH4, the module fastening holes MH1 to MH4 do not complete a circular closed curve shape and can open horizontally towards the edge of the module plate BDH. Furthermore, in this case, the width of the opening towards the edge of the module plate BDH can be smaller than the diameter of the virtual circular shape.

[0072] The memory connector MCN can be located at one end of the module board BDH. Although the accompanying drawings show the memory connector MCN connected to the first short side SS1 of the module board BDH and protruding outward from the first short side SS1 of the module board BDH along the first direction X, this disclosure is not limited thereto. The memory connector MCN can be located on the other side of the module board BDH or can be located on multiple sides of the module board BDH.

[0073] In some embodiments, the width of the memory connector MCN in the second direction Y may be smaller than the width of the module board BDH in the second direction Y. Furthermore, the memory connector MCN may be spaced apart from the extensions of the first long side LS1 and / or the second long side LS2 of the module board BDH. The memory connector MCN may be generally offset towards the second long side LS2, which is farther from the first long side LS1. That is, the distance between the memory connector MCN and the extension of the first long side LS1 of the module board BDH may be greater than the distance between the memory connector MCN and the extension of the second long side LS2 of the module board BDH. However, the embodiments are not limited to this, and the memory connector MCN may be located at a distance equal to that from the long side of the module board BDH.

[0074] The memory connector MCN is connected to the module board BDH. The memory connector MCN can be configured as a component separate from and attached to the module board BDH, but embodiments are not limited thereto, and in other embodiments, the memory connector MCN can be integrally formed with the module board BDH. When the memory connector MCN is integrally formed with the module board BDH, the memory connector MCN can be located in a protruding area of ​​the module board BDH formed by an outward protrusion of a portion of the module board BDH.

[0075] The memory connector MCN may include multiple connection terminals EL. These connection terminals EL may be spaced apart from each other along a second direction Y. Each connection terminal EL of the memory connector MCN can be connected to a corresponding host connector. Figure 11 Each connection terminal of the HCO) Figure 11 176). Information on the memory connector MCN and host connector will be provided later. Figure 11 A detailed explanation of the connections between HCO3 and HCO3.

[0076] Each connection terminal EL of the memory connector MCN can be connected to the wiring of the module board BDH. If the memory connector MCN is integrally formed with the module board BDH, the connection terminals EL of the memory connector MCN can be formed on the same layer using the same material as the wiring of the module board BDH. Each connection terminal EL can have the shape of a pad (or "solder pad") electrode, which has a width wider than the wiring of the module board BDH. Multiple connection terminals EL can be exposed to the outside while being at least partially not covered by an insulating layer.

[0077] Multiple connection terminals EL can be disposed on the upper surface or the lower surface of the memory connector MCN. In some cases, multiple connection terminals EL can be disposed on both the upper and lower surfaces of the memory connector MCN. Furthermore, the memory connector MCN comprises multiple layers separated along the thickness direction, and multiple connection terminals EL can be disposed on at least one surface of each layer.

[0078] The dimensions, shape, and location of the memory connector MCN, as well as the arrangement of the connection terminals EL, can conform to defined standards. For example, the dimensions, shape, and location of the memory connector MCN, and the arrangement of the connection terminals EL, can correspond to standards such as E1.S, M.2, and NF2.

[0079] The electronic component CHP is disposed on the upper and / or lower surface of the module board BDH. The electronic component CHP may be manufactured as a separate chip from the module board BDH and mounted on the module board BDH.

[0080] The electronic component CHP may include semiconductor components. Semiconductor components may include memory (such as NAND flash memory or DRAM (Dynamic Random Access Memory)) and a memory controller that controls the memory. In some embodiments, Figure 1 The storage controller 210, host interface 211, memory interface 212, CPU 213, buffer memory 216, etc., shown are manufactured in the form of electronic components (CHPs) and mounted on the module board BDH. In some embodiments, the electronic components (CHPs) may also include capacitor elements. Each electronic component (CHP) can be connected to the wiring of the module board BDH to perform electrical operation. Multiple electronic components (CHPs) may be spaced apart from each other. Horizontal gaps may be defined in the spacing space between the individual electronic components (CHPs). The horizontal gaps may be filled with air or the like.

[0081] The housing assembly 260 generally has a cuboid shape with an empty interior. The memory module 270 is housed inside the housing assembly 260. The housing assembly 260 can be used as a housing.

[0082] In terms of appearance, the housing assembly 260 may include a top surface, a bottom surface, and side surfaces. The top and bottom surfaces of the housing assembly 260 may form the top and bottom surfaces of the storage device 200, and each of the side surfaces may form the side surfaces of the storage device 200. At a location corresponding to one of the side surfaces of the storage device 200, the housing assembly 260 may include a connector opening (COP) that exposes the memory connector MCN in a first direction X.

[0083] The housing assembly 260 can be provided by assembling multiple components. Specifically, the housing assembly 260 may include a first housing 261 located at the top and a second housing 262 located at the bottom. The first housing 261 and the second housing 262 may be fastened together to define a space that is at least partially sealed. The memory module 270 may be accommodated in the sealed space.

[0084] The first outer shell 261 and the second outer shell 262 are each made of a metal such as stainless steel, aluminum (Al), copper (Cu), titanium (Ti), nickel (Ni) or an alloy containing them, or may be made of polymer materials, carbon-based materials or composite materials thereof.

[0085] In some embodiments, the first housing 261 and the second housing 262 may comprise a thermal interface material (TIM), a phase change material (PCM), or an encapsulated PCM (ePCM). Such a material may be mixed with the constituent materials of the first housing 261 and the second housing 262, and may also be coated on the inner surfaces (the lower surface in the case of the first housing 261, and the upper surface in the case of the second housing 262) or on both surfaces. Furthermore, the material may be made of another film or the like and adhered to the inner surfaces or both surfaces of the first housing 261 and the second housing 262.

[0086] Thermal interface materials, etc., can help the first housing 261 and the second housing 262 absorb, store, and spread heat. This can correspondingly increase the heat capacity of the housing assembly 260 and the storage device 200 including the housing assembly 260. In some embodiments, the materials of the first housing 261 and the second housing 262 may be the same or different.

[0087] The first housing 261 includes a top plate CVU as a top cover and a first side wall ESW1 and a second side wall ESW2 as side covers.

[0088] The top plate CVU is positioned on the XY plane. The top plate CVU can have a uniform thickness.

[0089] In the plan view, the top plate CVU can have a basic rectangular shape. The planar shape of the top plate CVU can be substantially the same as the planar shape of the storage device 200. The lengths of the long and short sides of the storage device 200 can be determined independently of the lengths of the long and short sides of the top plate CVU.

[0090] The top plate CVU can cover not only the module board BDH of the memory module 270, but also the memory connector MCN of the memory module 270. The first short side SS1 of the top plate CVU can be aligned with the end of the memory connector MCN, or it can be located outside the end of the memory connector MCN.

[0091] The first sidewall ESW1 and the second sidewall ESW2 can be connected to the top plate CVU and integrally formed. The first sidewall ESW1 can be bent from the first long side LS1 of the top plate CVU and extend Z along the third side, and the second sidewall ESW2 can be bent from the second long side LS2 of the top plate CVU and extend Z along the third side. There may be no sidewall on the first short side SS1 of the top plate CVU, thereby defining the connector opening COP.

[0092] Although the first sidewall ESW1 and the second sidewall ESW2 may have the same thickness and the same thickness as the top plate CVU, the embodiments are not limited thereto.

[0093] The first sidewall ESW1 and the second sidewall ESW2 can have heights corresponding to the height of the storage device 200. The heights of the first sidewall ESW1 and the second sidewall ESW2 can be generally the same.

[0094] The first housing 261 may include a connecting groove CPG spatially connected to the module fastening holes MH1 to MH4 and fastened by module screws 130. The number of connecting grooves CPG in the first housing 261 may be the same as the number of module fastening holes MH1 to MH4. The connecting grooves CPG in the first housing 261 may overlap with the corresponding module fastening holes MH1 to MH4. Although the planar shape of the connecting grooves CPG in the first housing 261 may be the same as the planar shape of the module fastening holes MH1 to MH4, the embodiment is not limited thereto.

[0095] The top plate CVU of the first housing 261 includes an extension EXP that extends along a first direction X beyond one end of the first sidewall ESW1 and one end of the second sidewall ESW2. Due to this extension EXP, the top plate CVU can also extend along the first direction X beyond the first sidewall ESW1 and the second sidewall ESW2.

[0096] The extension EXP can be formed for use with the aforementioned latch assembly ( Figure 3 The 300) connection is made of fixing holes FH1 and FH2.

[0097] Reference Figure 6 Fixed holes FH1 and FH2 may include a through hole TRH and an extension hole ENH. The through hole TRH is located at the center of the third direction Z, and the extension hole ENH is located above and around the through hole TRH. The through hole TRH and the extension hole ENH may be spatially connected to each other. In other words, the through hole TRH and the extension hole ENH may be coaxial, and the through hole TRH is located at the center of the extension hole ENH and therefore at the center of the fixed hole.

[0098] In a plan view, both the through hole (TRH) and the extension hole (ENH) can be circular. The extension hole (ENH) has a larger inner diameter than the through hole (TRH), and in a plan view, the through hole (TRH) can be located inside the extension hole (ENH). The planar shapes of the through hole (TRH) and the extension hole (ENH) can be concentric.

[0099] In some embodiments, the inner diameter DA1 of the through hole TRH can be 2.6 mm to 2.8 mm. The depth D1 of the through hole TRH can be 0.9 mm to 1.1 mm. In some embodiments, the inner diameter DA2 of the extension hole ENH can be 4.6 mm to 4.8 mm. Furthermore, the depth D2 of the extension hole ENH can be 1.1 mm to 1.3 mm.

[0100] At the boundary between the through-hole TRH and the extension hole ENH, the extension hole ENH may include a bottom surface BF disposed on the XY plane (i.e., a connecting portion that connects the inner wall of the through-hole TRH to the inner wall of the extension hole ENH). The bottom surface BF of the extension hole ENH can be used as a mounting surface for a latch assembly. Figure 3 300) hook ( Figure 3 The placement surface of (HOK).

[0101] The mounting holes FH1 and FH2 with this structure facilitate easy attachment and removal of the storage device 200 and the latch assembly. Figure 3 300). As mentioned above, because of the hook that penetrates the through-hole TRH ( Figure 3 The connecting parts of the HOK are well positioned on the bottom surface BF of the extension hole ENH, thus improving the ease of attachment and disassembly, as well as the reliability of the connection. A more detailed description will be provided later.

[0102] The first housing 261 may also include at least one clamping hole CLH penetrating the top plate CVU. When connected to the host connector, which will be described later... Figure 10 When HCO is used, the clamping hole CLH provides a way to insert the host connector ( Figure 10 HCO) hook ( Figure 10The space of 171). The clamping hole CLH can be set adjacent to the first short side SS1 of the top plate CVU.

[0103] The clamping hole CLH can be disposed at a position overlapping with the memory connector MCN. In a plan view, the clamping hole CLH can have a rectangular shape with a long side in the second direction Y. In one embodiment, the width of the clamping hole CLH in the second direction Y can be 4.0 mm, and the width of the clamping hole CLH in the first direction X can be 2.5 mm.

[0104] The number of clamping holes CLH can be matched with the host connector, which will be described later. Figure 10 HCO) hook ( Figure 10 The quantity corresponds to 171. If the host connector ( Figure 10 HCO3) includes two hooks ( Figure 10 If 171), then the number of clamping holes CLH can also be two. However, this is only an example, and in some embodiments, the number of clamping holes CLH and the number of hooks can be one or more than two. Multiple clamping holes CLH can be arranged along the second direction Y.

[0105] In some embodiments, one clamping hole CLH can be configured to be spaced 7.25 mm from the second long side LS2 of the top plate CVU, and the other clamping hole CLH can be configured to be spaced 16.25 mm from the first long side LS1 of the top plate CVU. The spacing between the clamping holes CLH can be 5.0 mm.

[0106] The second housing 262 includes a base plate CVB that serves as a bottom cover.

[0107] The base plate CVB is disposed on the XY plane. Although the base plate CVB can have the same thickness as the top plate CVU, the embodiment is not limited to this.

[0108] The base plate CVB may have a smaller area than the top plate CVU. The base plate CVB covers the entire module board BDH of the memory module 270 from below, but may not cover and expose the memory connector MCN. The first short side SS1 of the base plate CVB is located inside the first short side SS1 of the top plate CVU and may be located inside the end of the memory connector MCN. Although the first short side SS1 of the top plate CVU may be aligned with the first short side SS1 of the module board BDH, the embodiment is not limited to this.

[0109] The second housing 262 may include connection holes CPH, which are spatially connected to module fastening holes MH1 to MH4 and fastened by module screws 130. The number of connection holes CPH in the second housing 262 may be the same as the number of module fastening holes MH1 to MH4. The connection holes CPH in the second housing 262 may overlap with the corresponding module fastening holes MH1 to MH4 and the corresponding connection slots CPG in the first housing 261. Although the planar shape of the connection holes CPH in the second housing 262 may be the same as the planar shape of the module fastening holes MH1 to MH4, the embodiment is not limited thereto.

[0110] The first housing 261, the memory module 270, and the second housing 262 can be fastened together by a module screw 130 comprising a screw body and a screw head. The module screw 130 passes sequentially through the connection hole CPH and module fastening holes MH1 to MH4 of the second housing 262 from its lower surface and is inserted into the connection groove CPG of the first housing 261 to connect the first housing 261, the memory module 270, and the second housing 262 together. A helix rotating in the same direction can be provided on the inner wall of the connection hole CPH, the module fastening holes MH1 to MH4, and / or the connection groove CPG of the first housing 261 to facilitate the connection caused by the module screw 130. In the fastened storage device 200, the head of the module screw 130 can be located below the second housing 262 and can also be located inside the connection hole CPH of the second housing 262.

[0111] In the following text, reference will be made to Figure 7 and Figure 8 Describes a latching assembly 300 of a storage assembly SA1 according to some embodiments.

[0112] Figure 7 yes Figure 3 A perspective view of the latch assembly. Figure 8 It is along Figure 7 A sectional view taken by line A-A'.

[0113] Reference Figure 7 and Figure 8 The latch assembly 300 includes a first component P1 and a second component P2.

[0114] The second component P2 can be configured to extend from the first component P1 along the first direction X. As shown, the upper surface of the second component P2 can be lower than the upper surface of the first component P1. That is, the first component P1 and the second component P2 can form a stepped shape and be connected to each other.

[0115] The hook (HOK) can be disposed on the upper surface of the second component P2. In some embodiments, the hook (HOK) can be fixed to the upper surface of the second component P2 using a fixing screw (FSC), but the embodiments are not limited thereto. In some embodiments, the hook (HOK) can also be fixed to the upper surface of the second component P2 using, for example, an adhesive.

[0116] Although the accompanying drawings illustrate the use of a single fixing screw FSC to secure the hook HOK to the upper surface of the second component P2, the embodiments are not limited thereto. In some embodiments, multiple fixing screws FSC may be used, and the number of fixing screws FSC used to secure the hook HOK to the upper surface of the second component P2 may be modified and implemented differently.

[0117] The hook can be elastic. Here, "elastic" means that when external pressure is applied to the hook, a resilience force is applied to resist the external pressure. In other words, the hook resists external pressure. In some embodiments, although the hook is made of stainless steel and can be manufactured by pressing, die casting, injection molding, etc., the embodiments are not limited to these methods.

[0118] As described above, the hook (HOK) may have a first connecting member FP1 and a second connecting member FP2. The first connecting member FP1 may be formed at a first end of the hook (HOK), and the second connecting member FP2 may be formed at a second end of the hook (HOK). The first end may be opposite to the second end (i.e., the first end and the second end may be on opposite sides of the hook (HOK). The first connecting member FP1 may be bent (e.g., along the Z direction) on the upper surface of the second member FP2, and the second connecting member FP2 may be bent (e.g., along the Z direction) on the upper surface of the second member FP2. In other words, the first connecting member FP1 may be bent away from the upper surface of the second member FP2, and the second connecting member FP2 may be bent away from the upper surface of the second member FP2.

[0119] When storage device ( Figure 3 200) and latch assembly ( Figure 3 When the 300) connection is made, the first connecting component FP1 can be inserted into and accommodated inside the first fixing hole FH1, and the second connecting component FP2 can be inserted into and accommodated inside the second fixing hole FH2.

[0120] The first connecting component FP1 may include a first extension EX11, a second extension EX12, and a third extension EX13. The first extension EX11 bends and extends from the body of the hook HOK along a third direction Z. The second extension EX12 bends and extends from the first extension EX11 along a second direction -Y. The third extension EX13 bends and extends from the second extension EX12 along a second direction +Y. The second connecting component FP2 may include a fourth extension EX21, a fifth extension EX22, and a sixth extension EX23. The fourth extension EX21 bends and extends from the body of the hook HOK along a third direction Z. The fifth extension EX22 bends and extends from the fourth extension EX21 along a second direction +Y. The sixth extension EX23 bends and extends from the fifth extension EX22 along a second direction -Y.

[0121] When storage device ( Figure 3 200) and latch assembly ( Figure 3 When the 300) is connected, the shape of the first connecting member FP1 and the second connecting member FP2 will improve the storage device ( Figure 3 200) and latch assembly ( Figure 3 Reliability of the connection between 300).

[0122] In some embodiments, the thickness T of the hook HOK can be between 0.1 mm and 0.5 mm. Therefore, the thickness T of the first connecting member FP1 and the second connecting member FP2 can also be between 0.1 mm and 0.5 mm. In other words, the metal thickness T of the hook HOK can be between 0.1 mm and 0.5 mm, and in some embodiments, the metal thickness T of the hook HOK can be substantially uniform throughout the hook HOK, such that the metal thickness T of the first connecting member FP1 and the metal thickness T of the second connecting member FP2 can also be between 0.1 mm and 0.5 mm. A more detailed description will be provided later.

[0123] Figure 9 This is a diagram showing the form in which the hook of the latch assembly is inserted into and received into the fixing hole of the storage device. Figure 9 The second fixing hole FH2 and the second connecting component FP2 are shown by way of example.

[0124] Reference Figure 9 The second fixing hole FH2 may include a through hole TRH and an extension hole ENH. The second connecting member FP2 may include a fourth extension EX21 to a sixth extension EX23. Since the second fixing hole FH2 and the second connecting member FP2 have been sufficiently described above, a repeated detailed explanation will not be provided.

[0125] When the storage device 200 is connected to the latch assembly 300, the second connecting member FP2 can penetrate the through hole TRH. In addition, the extension hole ENH can accommodate one end of the second connecting member FP2 (e.g., one end of the sixth extension EX23).

[0126] Specifically, the fourth extension EX21 penetrates the through hole TRH, the fifth extension EX22 extends from the fourth extension EX21 toward the inner wall of the extension hole ENH, and the sixth extension EX23 extends from the fifth extension EX22 toward the center of the extension hole ENH.

[0127] In some embodiments, as shown, a fifth extension EX22, which bends and extends from the fourth extension EX21 along the second direction +Y, may contact the inner wall of the through hole TRH. Furthermore, in some embodiments, the fifth extension EX22 may also contact the lower surface of the extension hole ENH.

[0128] Although only the second fixing hole FH2 and the second connecting component FP2 are shown in the accompanying drawings, the interpretation can be applied equally to the first fixing hole FH1 and the first connecting component FP1.

[0129] As described above, because the hook (HOK) is elastic, the fifth extension EX22 and the sixth extension EX23 can penetrate the through hole TRH while a force is applied to the fifth extension EX22 and the sixth extension EX23 in the second direction -Y, and the second extension EX12 and the third extension EX13 can penetrate the through hole TRH on the opposite side while a force is applied to the second extension EX12 and the third extension EX13 in the second direction +Y. Then, because the fifth extension EX22 elastically applies a force to the inner wall of the through hole TRH and / or the lower surface of the extension hole ENH in the second direction +Y, and the second extension EX22 elastically applies a force to the inner wall of the through hole TRH on the other side and / or the lower surface of the extension hole ENH in the second direction -Y, the latch assembly 300 and the storage device 200 can be securely fixed. Therefore, the reliability of the connection between the storage device 200 and the latch assembly 300 can be improved.

[0130] On the other hand, when removing the latch assembly 300 from the storage device 200, if a force is applied along the second direction -Y to the fifth extension EX22 and the sixth extension EX23, and a force is applied along the second direction +Y to the second extension EX12 and the third extension EX13, then because the fifth extension EX22 and the sixth extension EX23 can pass through the through hole TRH and the second extension EX12 and the third extension EX13 can pass through the through hole TRH on opposite sides, the latch assembly 300 can be easily removed from the storage device 200. Therefore, compared to a configuration that uses screws or the like for attaching and detaching the storage device 200 and the latch assembly 300, attachment and detachment can be performed more easily.

[0131] In some embodiments, the thickness T of the hook HOK can be between 0.1 mm and 0.5 mm. In this embodiment, by keeping the thickness T of the hook HOK at 0.1 mm or greater, the appropriate elasticity of the hook HOK required for attachment and disassembly can be maintained. Furthermore, in this embodiment, by keeping the thickness T of the hook HOK at 0.5 mm or less, when the storage device 200 is attached to the latch assembly 300, excessive lifting of the lower surface of the storage device 200 from the upper surface of the latch assembly 300 can be prevented in advance.

[0132] In the following text, reference will be made to Figures 10 to 12 The description describes attaching the storage device 200 and the latch assembly 300 to the host computer. Figure 1 The process of (100).

[0133] Figure 10 This is a partial perspective view of a host according to some embodiments. Figure 11 yes Figure 10 A sectional view. Figure 12 It is a partial perspective view of the storage device.

[0134] Reference Figures 10 to 12 host ( Figure 1 The 100) may include the host connector HCO and the system board SBD.

[0135] The System Board (SBD) may include a printed circuit board (PCB). A Host Connector (HCO) may be attached to the SBD. Although the accompanying drawings show the Host Connector (HCO) being attached to the SBD using screws, the method of attaching the Host Connector (HCO) is not limited to the illustrated method. The Host Connector (HCO) and the SBD may be electrically connected.

[0136] The host connector HCO may include a connector body HB, a plurality of connection terminals 176 mounted inside the connector body HB, and a latch 170 mounted on the upper surface of the connector body HB.

[0137] The connector body HB may include a body and a body cover. A connector hole COH for accommodating the memory connector MCN is located on the front of the body. The body and body cover may be separate components that are then fastened together, or they may be integrally formed to define a slot as described above by defining certain areas with spaced intervals.

[0138] The connector hole COH is located on the front of the main body. The horizontal width of the connector hole COH (e.g., width in the second direction Y) is equal to or greater than the horizontal width of the memory connector MCN of the storage device 200 (e.g., width in the second direction Y) to provide space to accommodate the memory connector MCN. A plurality of connection terminals 176 may be disposed inside the connector hole COH of the storage device 200. When the memory connector MCN of the storage device 200 is inserted into the connector hole COH, the connection terminals EL of the memory connector MCN and the connection terminals 176 of the host connector HCO are electrically connected to each other to interconnect the storage device 200 and the host. Although at least some or all of the side surfaces, top surfaces, and bottom surfaces of the memory connector MCN inserted into the connector hole COH may be in contact with the inner wall of the connector hole COH for complete hermeticity, the embodiment is not limited thereto.

[0139] The latch 170 may include a latch body 170_BD and one or more hooks 171 disposed at an end of the latch body 170_BD. The number and size of the hooks 171 may correspond to the number and size of the clamping holes CLH of the storage device 200.

[0140] In the plan view, hook 171 may protrude outward from the end of latch body 170_BD. In the sectional view, the outer surface of hook 171 may have an inwardly sloping surface towards the tip. The sloping surface may be a straight line or a convex curve.

[0141] In a sectional view, the inner surface of hook 171 can be a straight line or a concave curve. The absolute value of the angle formed by the inner surface of hook 171 and the hook body can be larger than the absolute value of the angle formed by the outer surface of hook 171 and the hook body.

[0142] The latch 170 can be coupled to the connector body HB via a joint 172. The joint 172 can be configured to include a spring. Because the spring has a restoring force, even if the latch 170 is lifted by an external force, the latch 170 can be lowered to its original position when the external force is removed. The storage device 200 can be coupled to the host connector HCO such that the hook 171 is fitted into the clamping hole CLH of the storage device 200 from top to bottom (e.g., from the +Z direction to the -Z direction) via the joint 172.

[0143] In the following text, reference will be made to Figures 13 to 18 The storage component is described according to some other embodiments. In the following text, a repetition of the above explanation will not be provided, and the differences will be described primarily.

[0144] First, refer to Figure 13 and Figure 14 Describe the latch assembly.

[0145] Figure 13 This is a perspective view of a latching component of a storage component according to some embodiments. Figure 14 yes Figure 13 A plan view of the latch assembly.

[0146] Reference Figure 13 and Figure 14 The latch assembly 300a may also include a third component P3.

[0147] The third component P3 can be configured to extend from the second component P2 along the first direction X. As shown, the upper surface of the third component P3 can be lower than the upper surface of the second component P2. That is, the first component P1, the second component P2, and the third component P3 can form a stepped shape and be connected to each other.

[0148] The third component P3 may include a first portion PO1 and a second portion PO2. The first portion PO1 may extend from the second component P2 along a first direction X, and the second portion PO2 may extend from the first portion PO1 along the first direction X. That is, the first portion PO1 may be positioned closer to the second component P2 than the second portion PO2.

[0149] When measured in the second direction Y, the first part PO1 and the second part PO2 can have different widths from each other.

[0150] Specifically, the width W1 of the first part PO1 in the second direction Y can be smaller than the width W2 of the second part PO2 in the second direction Y. Therefore, the groove G1 can be formed by the sidewalls of the second part P2, the second part PO2, and the first part PO1.

[0151] On the other hand, when measured in the first direction X, the first part PO1 and the second part PO2 can have different thicknesses from each other.

[0152] Specifically, the thickness TH1 of the first portion PO1 in the first direction X can be, for example, 0.5 mm to 0.7 mm, and the thickness TH2 of the second portion PO2 in the first direction X can be, for example, 0.8 mm to 1.2 mm. The thicknesses TH1 of the first portion PO1 and TH2 of the second portion PO2 in the first direction X are configured in such a way that the latch assembly 300a is connected to the storage device. Figure 15 Improved connection reliability (200a). A more detailed description will be provided later.

[0153] Next, we will refer to Figure 15 and Figure 16 Describe the storage device.

[0154] Figure 15 This is a diagram illustrating the housing assembly of a storage device according to some embodiments. Figure 16 yes Figure 15 Floor plan.

[0155] Reference Figure 15 and Figure 16 The storage device 200a includes a first housing 261 and a second housing 262.

[0156] As described above, the first sidewall ESW1 bends from the first long side LS1 of the top plate CVU of the first housing 261 and extends in the third direction Z. The second sidewall ESW2 bends from the second long side LS2 of the top plate CVU of the first housing 261 and extends in the third direction Z.

[0157] In this embodiment, the first sidewall ESW1 includes a first bending member FPP1 that bends along the second direction Y, and the second sidewall ESW2 includes a second bending member FPP2 that bends along the second direction Y.

[0158] The base plate CVB of the second housing 262 is disposed at a distance DDA from the first bending member FPP1 and the second bending member FPP2. This distance can be predetermined. That is, the base plate CVB of the second housing 262 does not contact the first bending member FPP1 and the second bending member FPP2, but is set to be spaced apart by the distance DDA. Therefore, a groove G2 can be formed by the first bending member FPP1, the first sidewall ESW1 and the base plate CVB, and a groove G3 can be formed by the second bending member FPP2, the second sidewall ESW2 and the base plate CVB. The above-mentioned latch assembly ( Figure 14 Part 2 of 300a) Figure 14 PO2 can be inserted and accommodated in slots G2 and G3.

[0159] In some embodiments, the thickness TH3 of the first bending member FPP1 in the first direction X can be, for example, 0.5 mm to 0.7 mm. Furthermore, although not described in detail, the thickness of the second bending member FPP2 in the first direction X can also be, for example, 0.5 mm to 0.7 mm.

[0160] Furthermore, in some embodiments, the distance DDA separating the base plate CVB from the first bending member FPP1 and the second bending member FPP2 can be, for example, 0.8 mm to 1.2 mm.

[0161] The thickness TH3 of the first bending member FPP1 and the second bending member FPP2 in the first direction X, and the spacing DDA between the base plate CVB and the first bending member FPP1 and the second bending member FPP2, are arranged in such a way that they can be connected to the latch assembly in the storage device 200a. Figure 13 (300a) Increases connection reliability. A more detailed description will be provided later.

[0162] Next, we will refer to Figure 17 and Figure 18 The connection between latch assembly 300a and storage device 200a in a storage assembly according to some other embodiments is described.

[0163] Figure 17 This is a diagram illustrating the state of connection between the latch assembly and the storage device of a storage component according to some embodiments. Figure 18 yes Figure 17 Plan view of the latch assembly and storage device.

[0164] Reference Figure 17 and Figure 18 The latch assembly 300a and the storage device 200a can be connected to form the storage assembly SA2.

[0165] Because the first curved member FPP1 and the second curved member FPP2, which are some sidewalls of the storage device 200a, are inserted into and accommodated in the groove G1 formed on the sidewall of the first part PO1 of the latch assembly 300a, and the second part PO2 of the latch assembly 300a is inserted into and accommodated in the grooves G2 and G3 respectively between the base plate CVB and the first curved member FPP1 and between the base plate CVB and the second curved member FPP2, the latch assembly 300a and the storage device 200a can be connected.

[0166] Reference Figures 13 to 18 In some embodiments, because the thickness TH1 of the first portion PO1 in the first direction X and the thickness TH3 of the first bent member FPP1 and the second bent member FPP2 in the first direction X are similarly formed, and the thickness TH2 of the second portion PO2 in the first direction X and the spacing DDA between the base plate CVB and the first bent member FPP1 and the second bent member FPP2 are similarly formed, the latch assembly 300a and the storage device 200a can be connected in a transition fit.

[0167] Furthermore, in some embodiments, because the thickness TH1 of the first portion PO1 in the first direction X is formed to be smaller than the thickness TH3 of the first bending member FPP1 and the second bending member FPP2 in the first direction X, and the spacing DDA between the base plate CVB and the first bending member FPP1 and the second bending member FPP2 is formed to be smaller than the thickness TH2 of the second portion PO2 in the first direction X, the latch assembly 300a and the storage device 200a can be connected in the form of an interference fit.

[0168] Furthermore, in some embodiments, because the thickness TH1 of the first portion PO1 in the first direction X is formed to be greater than the thickness TH3 of the first bending member FPP1 and the second bending member FPP2 in the first direction X, and the spacing DDA between the base plate CVB and the first bending member FPP1 and the second bending member FPP2 is formed to be greater than the thickness TH2 of the second portion PO2 in the first direction X, the latch assembly 300a and the storage device 200a can be connected in a clearance fit manner.

[0169] When such a method is used, the latch assembly 300a can be easily attached to and easily removed from the storage device 200a. Therefore, attachment and removal can be performed more easily than, for example, using screws to attach and remove the storage device 200a and the latch assembly 300a.

[0170] In some embodiments, the thickness TH2 of the second portion PO2 in the first direction X can be, for example, 0.8 mm to 1.2 mm. In this embodiment, by maintaining the thickness TH2 of the second portion PO2 in the first direction X at 0.8 mm or greater, it is possible to prevent the second portion PO2 of the latch assembly 300a from being damaged when the latch assembly 300a and the storage device 200a are connected. That is, the connection reliability can be improved.

[0171] Furthermore, in this embodiment, by maintaining the thickness TH2 of the second portion PO2 in the first direction X to 1.2 mm or less, the mounting properties of the memory module 270 disposed inside the housing assembly 260 can be maintained.

[0172] In the following text, reference will be made to Figure 19 Describes a storage component according to some other embodiments.

[0173] Figure 19 This is a perspective view of a latching assembly of a storage component according to some embodiments. The differences from the embodiments described above will be primarily described below.

[0174] Reference Figure 19The storage component SA3 may include a latch component 300b.

[0175] The latch assembly 300b may include a first component P1, a second component P2, and a third component P3.

[0176] The second component P2 can be configured to extend from the first component P1 along the first direction X. As shown, the upper surface of the second component P2 can be lower than the upper surface of the first component P1.

[0177] The third component P3 can be configured to extend from the second component P2 along the first direction X. As shown, the upper surface of the third component P3 can be lower than the upper surface of the second component P2. That is, the first component P1, the second component P2, and the third component P3 can form a stepped shape and be connected to each other.

[0178] The hook HOK can be disposed on the upper surface of the second component P2. Furthermore, the third component P3 may include the first part PO1 and the second part PO2. That is, the latch assembly 300b according to this embodiment may include all the connection structures described in the above embodiments.

[0179] The latch assembly 300b can be coupled to, for example... Figure 15 The storage device 200a is shown in the figure. The first connecting part FP1 and the second connecting part FP2 of the latch assembly 300b are connected to the fixing holes FH1 and FH2 of the storage device 200a. The first bending part FPP1 and the second bending part FPP2, which are some side walls of the storage device 200a, are connected to the grooves formed on the side wall of the first part PO1. The second part PO2 of the latch assembly 300b can be connected to the space between the base plate CVB and the first bending part FPP1 and the second bending part FPP2.

[0180] Figure 20 This is a diagram illustrating a data center that utilizes storage components according to some embodiments.

[0181] Reference Figure 20 Data center 3000 is a facility that collects various types of data and provides services, and may also be referred to as a data storage center. Data center 3000 can be a system used for search engine and database operations, and can be a computing system used by a company (such as a bank or government agency). Data center 3000 may include application servers 3100 to 3100n and storage servers 3200 to 3200m. The number of application servers 3100 to 3100n and the number of storage servers 3200 to 3200m may be selected differently depending on the embodiment, and the number of application servers 3100 to 3100n and the number of storage servers 3200 to 3200m may differ from each other.

[0182] Application server (application server 1) 3100 may include processor 3110 and memory 3120, and storage server (storage server 1) 3200 may include processor 3210 and memory 3220. Taking storage server 3200 as an example, processor 3210 can control the overall operation of storage server 3200, access memory 3220, and execute commands and / or data loaded into memory 3220. Memory 3220 may be DDR SDRAM (Double Data Rate Synchronous DRAM), HBM (High Bandwidth Memory), HMC (Hybrid Memory Cube), DIMM (Dual In-line Memory Module), Optane DIMM, or NVM DIMM (Non-Volatile DIMM). According to embodiments, the number of processors 3210 and the number of memories 3220 included in storage server 3200 can be selected differently.

[0183] In one embodiment, processor 3210 and memory 3220 may provide a processor-memory pair. In one embodiment, the number of processors 3210 and the number of memories 3220 may differ from each other. Processor 3210 may include a single-core processor or a multi-core processor. The description of storage server 3200 can be similarly applied to application server 3100. According to an embodiment, application server 3100 may not include storage device 3150. Storage server 3200 may include one or more storage devices 3250. The number of storage devices 3250 included in storage server 3200 may be selected differently depending on the embodiment.

[0184] The aforementioned storage component can be attached to or removed from the storage server 3200, which is the host, in the form of a single storage device 3250.

[0185] Application servers 3100 to 3100n and storage servers 3200 to 3200m can communicate with each other via NICs 3140 to 3140n and 3240 to 3240m through network 3300. Network 3300 can be implemented using FC (Fibre Channel), Ethernet, etc. In this case, FC is used as a medium for relatively high-speed data transmission, and high-performance / high-availability optical switches can be used. Depending on the access method of network 3300, storage servers 3200 to 3200m can be configured as file storage devices, block storage devices, or object storage devices.

[0186] In one embodiment, network 3300 may be a storage-only network (such as a SAN (Storage Area Network)). For example, the SAN may be an FC-SAN implemented using an FC network and according to FCP (FC protocol). In another example, the SAN may be an IP-SAN implemented using a TCP / IP network and according to the iSCSI (SCSI over TCP / IP or Internet SCSI) protocol. In another embodiment, network 3300 may be a general-purpose network (such as a TCP / IP network). For example, network 3300 may be implemented according to protocols such as FCoE (FC over Ethernet), NAS (Network Attached Storage), and NVMe-oF (NVMe over Fibre).

[0187] The following text will primarily describe application server 3100 and storage server 3200. The description of application server 3100 can also be applied to another application server (application server N) 3100n, and the description of storage server 3200 can also be applied to another storage server (storage server M) 3200m.

[0188] Application server 3100 can store data requested by users or clients in one of storage servers 3200 to 3200m via network 3300. Furthermore, application server 3100 can retrieve data requested by users or clients from one of storage servers 3200 to 3200m via network 3300. For example, application server 3100 can be implemented using a web server or a DBMS (Database Management System).

[0189] Application server 3100 can access memory 3120n or storage device 3150n included in another application server 3100n via network 3300, or access memory 3220 to 3220m or storage device 3250 to 3250m included in storage servers 3200 to 3200m via network 3300. Therefore, application server 3100 can perform various operations on data stored in application servers 3100 to 3100n and / or storage servers 3200 to 3200m. For example, application server 3100 can execute commands for moving or copying data between application servers 3100 to 3100n and / or storage servers 3200 to 3200m. At this time, data can be moved from storage devices 3250 to 3250m of storage servers 3200 to 3200m to storage devices 3220 to 3220m of application servers 3100 to 3100n via storage devices 3250 to 3250m of storage servers 3200 to 3200m, or directly from storage devices 3250 to 3250m of storage servers 3200 to 3200m to storage devices 3120 to 3120n of application servers 3100 to 3100n. Data moved via network 3300 can be encrypted for security and privacy purposes.

[0190] Taking storage server 3200 as an example, interface (I / F) 3254 can provide physical connections between processor 3210 and controller (CTRL) 3251, as well as physical connections between NIC 3240 and controller 3251. For example, interface 3254 can be implemented via DAS (Direct Attached Storage) method, where storage device 3250 is directly connected using a dedicated cable. For example, interface 3254 can be implemented using various interface methods such as ATA (Advanced Technology Attachment), SATA (Serial ATA), e-SATA (External SATA), SCSI (Small Computer System Interface), SAS (Serial Attached SCSI), PCI (Peripheral Component Interconnect), PCIe (PCI Fast), NVMe (NVM Fast), IEEE 1394, USB (Universal Serial Bus), SD (Secure Digital) card, MMC (Multimedia Card), eMMC (Embedded Multimedia Card), UFS (Universal Flash Memory), eUFS (Embedded Universal Flash Memory), and CF (Compact Flash Memory) card interfaces.

[0191] Storage server 3200 may also include switch 3230 and NIC 3240. Switch 3230 selectively connects processor 3210 and storage device 3250 according to the control of processor 3210, or selectively connects NIC 3240 and storage device 3250. Similarly, storage server 3200m and application servers 3100 to 3100n may also include switches 3230m, 3130 to 3130n, respectively.

[0192] In one embodiment, NIC 3240 may include a network interface card, network adapter, etc. NIC 3240 can connect to network 3300 via a wired interface, wireless interface, Bluetooth interface, optical interface, etc. NIC 3240 may include internal memory, DSP (Digital Signal Processor), host bus interface, etc., and can connect to processor 3210 and / or switch 3230, etc., via the host bus interface. The host bus interface may also be implemented as one of the examples of interface 3254 described above. In one embodiment, NIC 3240 may also be integrated with at least one of processor 3210, switch 3230, and storage device 3250.

[0193] In storage servers 3200 to 3200m or application servers 3100 to 3100n, the processor sends commands to storage devices 3150 to 3150n and 3250 to 3250m or memories 3120 to 3120n and 3220 to 3220m to program or read data. The data may be data in which errors have been corrected by an ECC (Error Correction Code) engine. The data is data that has undergone Data Bus Inversion (DBI) or Data Masking (DM) processing and may include CRC (Cyclic Redundancy Check) information. The data may be encrypted for security and privacy.

[0194] Storage devices 3150 to 3150n and 3250 to 3250m can send control signals and command / address signals to NAND flash memory 3252 to 3252m in response to a read command received from the processor. Therefore, when data is read from NAND flash memory 3252 to 3252m, the RE (Read Enable) signal is input as a data output control signal and can be used to output data to the DQ bus. The DQS (Data Strobe) signal can be generated using the RE signal. Command and address signals can be latched into the page buffer based on the rising or falling edge of the WE (Write Enable) signal.

[0195] Controller 3251 can generally control the operation of storage device 3250. In one embodiment, controller 3251 may include SRAM (Static Random Access Memory). Controller 3251 can write data to NAND flash memory 3252 in response to a write command, or read data from NAND flash memory 3252 in response to a read command. For example, write and / or read commands may be provided from processor 3210 in storage server 3200, processor 3210m in another storage server 3200m, or processors 3110 and 3110n in application servers 3100 and 3100n. DRAM 3253 can temporarily store (buffer) data to be written to or read from NAND flash memory 3252. In addition, DRAM 3253 can store metadata. Here, metadata is generated by controller 3251 to manage user data and data in NAND flash memory 3252. Storage device 3250 may include a security element (SE) for security or privacy. Similarly, the DRAM 3253m, controller 3251m, and NIC 3254m in storage server 3200m can be similar to the DRAM 3253, controller 3251, and NIC 3254 in storage server 3200.

[0196] In closing, those skilled in the art will understand that various variations and modifications can be made to the preferred embodiments without substantially departing from the principles of this disclosure. Therefore, the disclosed preferred embodiments are used in a general and descriptive sense only and not for limiting purposes.

Claims

1. A storage device assembly, comprising: Latch assembly; as well as Storage device, connected to latch assembly, The latch assembly includes: First component; The second component is configured to extend from the first component along a first direction and have an upper surface lower than the upper surface of the first component; and A hook is provided on the upper surface of the second component and is elastic. A first connecting component that bends away from the upper surface of the second component is provided at one end of the hook, and a second connecting component that bends away from the upper surface of the second component is provided at the other end of the hook. The storage device includes: The memory module includes a module board and a memory connector disposed on one side of the module board; A first housing, disposed above the memory module, includes a first mounting hole and a second mounting hole. In a configuration where the memory device is coupled to a latching assembly, the first mounting hole is configured to receive a first connecting member, and the second mounting hole is configured to receive a second connecting member; and The second outer casing is located below the memory module. The first fixing hole and the second fixing hole overlap with the upper surface of the second component of the latch assembly.

2. The storage device assembly according to claim 1, wherein, The first fixing hole includes: A first through-hole having a first inner diameter, through which a first connecting member penetrates in a configuration in which the storage device is connected to a latch assembly; and A first extension hole is disposed above the first through hole, spatially interconnected with the first through hole, and having a second inner diameter larger than the first inner diameter. In a configuration where the storage device is coupled to a latch assembly, the first extension hole accommodates one end of the first connecting member within the first extension hole.

3. The storage device assembly according to claim 2, wherein, The first connecting component includes: The first extension extends along the direction of penetrating the first through hole in a configuration in which the storage device is connected to the latch assembly; The second extension, in a configuration where the storage device is coupled to the latch assembly, extends from the first extension toward the inner wall of the first extension hole; and The third extension extends from the second extension toward the center of the first extension hole in a configuration in which the storage device is connected to the latch assembly.

4. The storage device assembly according to claim 3, wherein, In a configuration where the storage device is connected to the latch assembly, the second extension contacts the inner wall of the first through-hole.

5. The storage device assembly according to claim 1, wherein, The thickness of the hook is 0.1mm to 0.5mm.

6. The storage device assembly of claim 1, wherein, The first fixing hole includes: The first through hole has an inner diameter of 2.6 mm to 2.8 mm and a depth of 0.9 mm to 1.1 mm; and A first extension hole is disposed above the first through hole, spatially interconnected with the first through hole, and has an inner diameter of 4.6 mm to 4.8 mm and a depth of 1.1 mm to 1.3 mm.

7. The storage device assembly according to any one of claims 1 to 6, wherein, The first outer casing includes: A top plate, a first side wall, and a second side wall. The first side wall extends from the first long side of the top plate along a second direction intersecting the first direction, and the second side wall extends from the second long side of the top plate along the second direction. The top plate includes an extension that extends in a first direction beyond the first and second sidewalls, and The first fixing hole and the second fixing hole are formed in the extension.

8. The storage device assembly according to any one of claims 1 to 6, wherein, The latch assembly also includes: The third component is configured to extend from the second component along a first direction and have an upper surface that is lower than the upper surface of the second component. The sidewall of the third component includes a groove, and A portion of the sidewall of the first housing is received in a slot in a configuration in which the storage device is coupled to the latch assembly.

9. The storage device assembly of claim 8, wherein, The first outer casing includes: A top plate, a first side wall, and a second side wall. The first side wall extends from the first long side of the top plate along a second direction intersecting the first direction, and the second side wall extends from the second long side of the top plate along the second direction. The first sidewall includes a bending member that bends along a third direction intersecting the first and second directions, and The curved component is accommodated in a slot of the latch assembly in a configuration where the storage device is connected to the latch assembly.

10. The storage device assembly of claim 9, wherein, The second housing includes a base plate, and One end of the base plate is set to be spaced apart from the curved component.

11. The storage device assembly of claim 10, wherein, The spacing is 0.8 mm to 1.2 mm.

12. A storage device, comprising: The memory module includes a module board and a memory connector disposed on one side of the module board; The first outer casing is positioned above the memory module; as well as The second outer casing is located below the memory module. The first outer shell includes a top plate, a first side wall, and a second side wall. The first side wall extends from a first long side of the top plate along a first direction, and the second side wall extends from a second long side of the top plate along the first direction. The top plate includes an extension that extends along a second direction intersecting the first direction beyond one end of the first sidewall and one end of the second sidewall. The first fixing hole and the second fixing hole are formed in the extension. The first sidewall includes a first bending member, which bends along a third direction intersecting the first and second directions. The second outer casing includes a base plate. One end of the base plate is configured to be spaced apart from the first bending member along the second direction, and The extension of the top plate extends beyond one end of the bottom plate in the second direction.

13. The storage device according to claim 12, wherein, The second sidewall includes a second curved member, which bends along a third direction and faces the first curved member. One end of the base plate of the second housing is configured to be spaced apart from the second curved member by the specified distance.

14. The storage device according to claim 13, wherein, The spacing is 0.8 mm to 1.2 mm.

15. A latch assembly coupled to a storage device, comprising: First component; The second component is configured to extend from the first component along a first direction and have an upper surface that is lower than the upper surface of the first component; as well as The third component is configured to extend from the second component along a first direction and have an upper surface that is lower than the upper surface of the second component. The third component includes: The first portion has a first width measured in a second direction intersecting the first direction; and The second part has a second width measured in the second direction. The first width is smaller than the second width. The third component also includes a groove formed by the sidewalls of the second component, the second part, and the first part.

16. The latch assembly of claim 15, wherein, The first part is positioned closer to the second component than the second part.

17. The latch assembly of claim 16, wherein, The thickness of the second part, measured in the first direction, is 0.8 mm to 1.2 mm.

18. The latch assembly according to any one of claims 15 to 17, further comprising: A hook is provided on the upper surface of the second component and is elastic. A first connecting component that bends away from the upper surface of the second component is provided at one end of the hook, and a second connecting component that bends away from the upper surface of the second component is provided at the other end of the hook.

19. The latch assembly of claim 18, wherein, The first connecting component includes: The first extension extends on the upper surface of the second component; The second extension bends and extends from the first extension; and The third extension bends and extends from the second extension.

20. The latch assembly of claim 19, wherein, The thickness of the hook is 0.1mm to 0.5mm.

Images