Patch device and control method of patch device

Abstract

This invention discloses a chip mounting apparatus and a control method for the apparatus. The mounting apparatus includes a carrier mechanism, a detection mechanism, a cleaning mechanism, and a controller. The carrier mechanism includes a worktable with a contact surface for chip placement. The worktable is rotatable to flip the contact surface. The detection mechanism includes image acquisition elements spaced at intervals on the bottom of the worktable for image acquisition of the contact surface. The cleaning mechanism includes cleaning brushes spaced at intervals on the bottom of the worktable for cleaning the contact surface. The controller is electrically connected to the carrier mechanism, the detection mechanism, and the cleaning mechanism. Through the effective cooperation of the detection mechanism and the cleaning mechanism, foreign objects on the contact surface of the worktable are effectively removed, thereby avoiding the impact of foreign objects on semiconductor manufacturing and improving product yield.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more particularly to a surface mount assembly (SMA) apparatus. This invention also relates to a control method for the SMA apparatus. Background Technology

[0002] This section provides only background information relevant to this disclosure and is not necessarily prior art.

[0003] In the semiconductor manufacturing process, wafers are divided into multiple chips, which are then placed on a substrate and fixed by bonding. During the chip mounting process, if there are foreign objects on the contact surface between the mounting device and the chip, gaps and other problems may be induced during chip bonding, which will reduce the product yield and thus affect the product quality.

[0004] In the prior art, multiple grid slots are set on the contact surface of the chip mounting device to reduce the contact area with the chip, thereby reducing the probability of foreign objects coming into contact with the chip. However, this cannot fundamentally eliminate the impact of foreign objects on the chip. Summary of the Invention

[0005] A first aspect of the present invention provides a mounting apparatus for semiconductor manufacturing, the mounting apparatus comprising:

[0006] The support mechanism includes a worktable with a contact surface for placing chips. The worktable is rotatable to flip the contact surface.

[0007] The testing mechanism includes image acquisition elements, which are spaced apart at the bottom of the worktable and used to acquire images of the contact surface.

[0008] A cleaning mechanism, comprising cleaning brushes spaced apart at the bottom of the workbench, for cleaning the contact surfaces.

[0009] The controller is electrically connected to the carrying mechanism, the detection mechanism and the cleaning mechanism respectively.

[0010] A second aspect of the present invention provides a control method for a patch assembly, which is implemented using a patch assembly as described above, and the control method includes the following steps:

[0011] Obtain the working mode;

[0012] Clean the contact surface according to the first working mode. Once the cleaning operation is completed, issue a contact surface switching command.

[0013] According to the second working mode, image information of the contact surface located at the bottom of the worktable is obtained;

[0014] Determine if there are foreign objects in the image information;

[0015] Clean the contact surface based on the presence of foreign objects in the image information. Once the cleaning operation is complete, issue a contact surface switching command.

[0016] Based on the absence of foreign objects in the image information, a contact surface switching command is issued. Attached Figure Description

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0018] Figure 1 A schematic diagram of the patch device according to an embodiment of the present invention in a first state is shown (the contact surface is in a clean state).

[0019] Figure 2 for Figure 1 The diagram shows the patch device in its second state (the contact surface is in the detection state);

[0020] Figure 3 for Figure 1 A schematic diagram of the support mechanism of the patch device shown;

[0021] Figure 4 for Figure 1 A schematic diagram of the cleaning mechanism of the patch device shown;

[0022] Figure 5 A flowchart illustrating a control method for a patch device according to an embodiment of the present invention is shown schematically.

[0023] The attached figures are labeled as follows:

[0024] 100 is a surface mount device;

[0025] 10 represents the load-bearing mechanism;

[0026] 11 is the worktable, 111 is the contact surface, and 12 is the first drive shaft;

[0027] 20 represents the testing organization, and 21 represents the image acquisition element;

[0028] 30 is the cleaning mechanism, 31 is the cleaning brush, 311 is the second hole, 32 is the second drive shaft, 33 is the second pipeline, 331 is the second main pipe, and 332 is the second branch pipe.

[0029] 40 is a fixed structure, 41 is the first pipeline, 411 is the first main pipe, and 412 is the first branch pipe;

[0030] 50 is the dust collection mechanism, 51 is the dust collection component, 511 is the third hole, and 52 is the third pipeline. Detailed Implementation

[0031] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0032] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0033] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0034] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "over," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure is flipped, an element described as "below other elements or features" or "below other elements or features" would subsequently be oriented as "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0035] like Figures 1 to 5 As shown, according to an embodiment of the present invention, a chip mounting apparatus 100 is provided for semiconductor manufacturing. The chip mounting apparatus 100 includes a carrier mechanism 10, a detection mechanism 20, a cleaning mechanism 30, and a controller. The carrier mechanism 10 includes a worktable 11, on which a contact surface 111 for chip placement is provided. The worktable 11 is rotatable to flip the contact surface 111. The detection mechanism 20 includes image acquisition elements 21, which are spaced apart at the bottom of the worktable 11 for acquiring images of the contact surface 111. The cleaning mechanism 30 includes cleaning brushes 31, which are spaced apart at the bottom of the worktable 11 for cleaning the contact surface 111. The controller is electrically connected to the carrier mechanism 10, the detection mechanism 20, and the cleaning mechanism 30.

[0036] Before placing a chip, the contact surface 111 of the workbench 11 needs to be checked for foreign objects (debris, dust, powder, etc.). Specifically, the workbench 11 is driven to rotate, causing the contact surface 111 prepared for chip placement to flip to the bottom of the workbench 11. The image acquisition element 21 of the detection mechanism 20 acquires an image of the contact surface 111 and feeds the acquired image information back to the controller. The controller compares the acquired information with preset information. When the comparison result shows that there are no foreign objects on the contact surface 111, the workbench 11 is driven to rotate, causing the contact surface 111 without foreign objects to rotate to the top of the workbench 11 for chip placement. When the comparison result shows that there are foreign objects on the contact surface 111... When a foreign object is present, the cleaning mechanism 30 is activated, and the cleaning brush 31 is used to clean the contact surface 111. After the cleaning operation is completed, the image acquisition element 21 is used to acquire an image of the cleaned contact surface 111 again, and the acquired image information is fed back to the controller. The controller compares the acquired image information again. If the comparison result shows that there is no foreign object, the worktable 11 is driven to rotate, so that the contact surface 111 without foreign object is rotated to the top of the worktable 11 for placing the chip. If the comparison result shows that there is still foreign object, the cleaning and image acquisition steps are repeated. When there is no foreign object on the contact surface 111, the worktable 11 is driven to rotate again, so that the contact surface 111 without foreign object is rotated to the top of the worktable 11 for placing the chip.

[0037] Through the effective cooperation of the detection mechanism 20 and the cleaning mechanism 30, foreign objects on the contact surface 111 of the workbench 11 are effectively removed, thereby avoiding the impact of foreign objects on semiconductor manufacturing and improving the product yield.

[0038] It should be understood that the cleaning mechanism 30 is located at the bottom of the workbench 11. When the contact surface 111 for placing the chip is switched to the bottom of the workbench 11 by the rotation of the workbench 11, the contact surface 111 is correspondingly set with the cleaning brush 31 of the cleaning mechanism 30. When the contact surface 111 needs to be cleaned, the bristles of the cleaning brush 31 come into contact with the contact surface 111, and the cleaning brush 31 moves relative to the contact surface 111. The bristles sweep the contact surface 111, thereby separating foreign objects from the contact surface 111. The separated foreign objects move away from the contact surface 111 under the action of gravity, thus avoiding the situation where foreign objects return to the contact surface 111 and cause secondary contamination of the contact surface 111. This further improves the cleaning effect of the contact surface 111.

[0039] To understand further, such as Figures 1 to 3As shown, the chip mounting apparatus 100 also includes a fixing mechanism 40, which is used to fix the chip onto the contact surface 111. Specifically, the fixing structure cooperates with the worktable 11. When chip mounting is required, the contact surface 111 to be used is first inspected and treated for foreign objects. When it is confirmed that there are no foreign objects on the contact surface 111, the contact surface 111 can be used for chip placement and mounting operations. By setting the fixing structure, the chip is fixed during chip placement, thereby ensuring the chip placement position and thus ensuring the mounting accuracy, which in turn ensures the product yield.

[0040] Furthermore, such as Figures 1 to 3 As shown, the supporting mechanism 10 also includes a first driving member and a first transmission shaft 12. The first driving member is electrically connected to the controller, and the first driving member is connected to the worktable 11 via the first transmission shaft 12. Specifically, the first transmission shaft 12 cooperates with the worktable 11. When the contact surface 111 is needed, the first driving member is activated, driving the rotation of the first transmission shaft 12, which in turn drives the worktable 11 along the horizontal axis (e.g., ...). Figure 1 As mentioned above, in Figure 1 In this process, the worktable 11 rotates (the horizontal direction of the paper is horizontal, and the vertical direction of the paper is vertical). When the worktable 11 rotates to the desired position, the first drive unit stops working, and the contact surface 111 is located at the bottom of the worktable 11. The detection mechanism 20 detects whether there are foreign objects on the contact surface 111. When there are no foreign objects on the contact surface 111, the first drive unit restarts to drive the worktable 11 to rotate, so that the contact surface 111 is located at the top of the worktable 11 for placing the chip. When there are foreign objects on the contact surface 111, through the cooperation of the cleaning mechanism 30 and the detection mechanism 20, after the foreign objects on the contact surface 111 are removed, the first drive unit restarts to drive the worktable 11 to rotate, so that the contact surface 111 is located at the top of the worktable 11 for placing the chip. The structure of flipping the worktable 11 (along the horizontal axis) by using the cooperation of the first drive unit and the first transmission shaft 12 is simple and has low manufacturing cost. In addition, the drive is flexible and rapid, further shortening the cleaning time of the contact surface 111, thereby improving the efficiency of semiconductor manufacturing.

[0041] It should be noted that in this invention, the first driving component is a first stepper motor, and the first transmission shaft 12 is fixedly connected to the worktable 11. The first stepper motor and the first transmission shaft 12 are connected in a transmission manner. When the first stepper motor drives the first transmission shaft 12 to rotate, the first transmission shaft 12 can drive the worktable 11 to rotate, so that the contact surface 111 is located at the bottom of the worktable 11, thereby realizing the operation of the detection mechanism 20 and the cleaning mechanism 30 on the contact surface 111. In addition, the first stepper motor can effectively control the rotation speed and rotation angle of the first transmission shaft 12, thereby realizing precise control of the rotation speed and rotation angle of the worktable 11.

[0042] In other real-time modes, the first driving component is a first hydraulic motor. By using the first hydraulic motor, a stable driving force is provided to the first drive shaft 12 and the worktable 11, ensuring the effective rotation of the worktable 11.

[0043] Furthermore, such as Figures 1 to 3 As shown, the fixing mechanism 40 includes a first vacuuming component (not shown) and a first conduit 41. The first vacuuming component is electrically connected to the controller and is connected to the contact surface 111 via the first conduit 41. Specifically, the first vacuuming component is connected to the contact surface 111. When it is necessary to fix the chip, the chip is placed on the contact surface 111 (after confirming there are no foreign objects). The first vacuuming component is activated, creating a negative pressure between the contact surface 111 and the chip, thereby adsorbing the chip onto the contact surface 111 and fixing the chip. By utilizing the cooperation of the first conduit 41 and the first vacuuming component, the chip placed on the contact surface 111 is effectively fixed, thus avoiding the generation of dust and other foreign objects during the chip fixing process, further preventing the impact of foreign objects on the product, and effectively improving the product yield.

[0044] Furthermore, such as Figures 1 to 3 As shown, the first conduit 41 includes a first main pipe 411 and at least one first branch pipe 412. The first main pipe 411 is located on the first drive shaft 12 and communicates with the first vacuuming component. The first branch pipe 412 is located on the worktable 11. The first main pipe 411 communicates with the first hole of the contact surface 111 through the first branch pipe 412. Specifically, the first main pipe 411 is located inside the first drive shaft 12 and communicates with the first vacuuming component. The first branch pipe 412 is located inside the worktable 11 and communicates with both the first main pipe 411 and the contact surface 111. When it is necessary to fix the chip placed on the contact surface 111, the first vacuuming component is activated. The first vacuuming component communicates with the contact surface 111 through the first main pipe 411 and the first branch pipe 412, and forms a negative pressure between the contact surface 111 and the chip. The negative pressure causes the chip to be adsorbed onto the contact surface 111, thereby fixing the chip. By placing the first main tube 411 inside the first drive shaft 12 and the first branch tube 412 inside the worktable 11, the first tube 41 is concealed, avoiding the influence of other external components on the first tube 41 and thus ensuring the chip's fixation effect. Furthermore, the first hole is formed on the contact surface 111. When there are multiple first branch tubes 412, the number of first holes matches and corresponds to the number of first branch tubes 412, with each first hole spaced apart. By setting multiple first holes and first branch tubes 412, the chip's adsorption capacity is further enhanced, improving the chip's fixation strength and ensuring its position, thereby improving the product's manufacturing precision.

[0045] Furthermore, such as Figures 1 to 3 As shown, there are multiple contact surfaces 111, which are spaced apart along the rotation direction of the worktable 11. The number of pipes is the same as the number of contact surfaces 111, and the pipes are arranged correspondingly to the contact surfaces 111. Specifically, the detection mechanism 20 and the cleaning mechanism 30 are both located at the bottom of the worktable 11. Before use, each contact surface 111 passes through the detection mechanism 20 and the cleaning mechanism 30 in sequence as the worktable 111 rotates. The detection mechanism 20 and the cleaning mechanism are used to detect and process foreign objects on each contact surface 111, thereby improving the processing efficiency of the contact surface 111 and thus improving the chip processing capability, effectively improving the production efficiency of the product.

[0046] It should be noted that multiple contact surfaces 111 are arranged at equal intervals along the rotation direction of the worktable 11, and the rotation angle between two adjacent contact surfaces 111 of the worktable 11 is greater than 60°, thereby ensuring the cleaning effect on the contact surfaces 111.

[0047] In this invention, there are four contact surfaces 111. The four contact surfaces 111 are equally spaced along the rotation direction of the worktable 11. The rotation angle between two adjacent contact surfaces 111 is 90°. By setting four contact surfaces 111, foreign object detection and chip mounting can be performed simultaneously, thereby effectively improving the production efficiency of the product and reducing the production cost.

[0048] Furthermore, such as Figures 1 to 4 As shown, the patch assembly 100 also includes a dust collection mechanism 50, which is used to collect foreign objects that separate from the contact surface 111. Specifically, the dust collection mechanism 50 is located at the bottom of the cleaning mechanism 30 and is correspondingly arranged with the brush of the cleaning mechanism 30. When the brush performs a cleaning operation on the cleaning surface, the foreign objects that separate from the contact surface 111 are collected by the dust collection mechanism 50, which avoids the situation where foreign objects fly away and cause secondary contamination of the contact surface 111, and further improves the product yield.

[0049] Furthermore, such as Figure 1 , Figure 2 and Figure 4As shown, the dust collection mechanism 50 includes a second vacuuming component and a second pipeline 33. The second vacuuming component is electrically connected to the controller, and the first vacuuming component is connected to the outer surface of the brush body of the cleaning brush 31 through the second pipeline 33. Specifically, the cleaning brush 31 includes a brush body and bristles. The second vacuuming component is connected to the surface of the brush body through the second pipeline 33. When the bristles clean the contact surface 111, the second vacuuming component is activated, creating a negative pressure on the outer surface of the brush body. Foreign matter on the chip surface separates from the chip under the action of the bristles. Under the action of gravity, the foreign matter moves closer to the outer surface of the brush body and enters the dust collection space through the second pipeline 33 under the action of negative pressure. Through the action of the second vacuuming component and the second pipeline 33, the effective collection of foreign matter is achieved, further preventing the secondary contamination of the contact surface 111 caused by the scattering of foreign matter.

[0050] It should be noted that the dust collection space consists of components such as a dust collection box, and is located outside the second drive shaft 32 and connected to the second main pipe 331. By setting up the dust collection space, foreign objects can be collected and processed in the same way, further avoiding the impact of foreign objects on the chip.

[0051] Furthermore, such as Figures 1 to 4 As shown, the cleaning mechanism 30 also includes a second drive unit (not shown) and a second transmission shaft 32. The second drive unit is electrically connected to the controller and is connected to the cleaning brush 31 via the second transmission shaft 32. Specifically, the second transmission shaft 32 cooperates with the cleaning brush 31. When cleaning of the contact surface 111 is required, the second drive unit is activated, driving the rotation of the second transmission shaft 32, which in turn drives the cleaning brush 31 to rotate. During the rotation, the bristles of the cleaning brush 31 sweep the contact surface 111, separating foreign objects from the contact surface 111, thereby achieving effective cleaning of the contact surface 111. This avoids the impact of foreign objects on the chip mounting process, effectively improving the product yield.

[0052] It should be noted that in this invention, the second driving component is a second stepper motor, and the second transmission shaft 32 is fixedly connected to the brush body of the cleaning brush 31. The second stepper motor is connected to the second transmission shaft 32 for transmission. When the second stepper motor drives the second transmission shaft 32 to rotate, the second transmission shaft 32 can drive the cleaning brush 31 to rotate, thereby realizing the cleaning operation on the contact surface 111. In addition, the second stepper motor can effectively control the rotation speed and rotation angle of the second transmission shaft 32, thereby achieving precise control of the rotation speed and rotation angle of the cleaning brush 31.

[0053] In other real-time modes, the second driving component is a second hydraulic motor. By using the second hydraulic motor, a stable driving force is provided to the second drive shaft 32 and the cleaning brush 31, ensuring the effective rotation of the cleaning brush 31.

[0054] Furthermore, such as Figure 4 As shown, the second pipeline 33 includes a second main pipe 331 and a second branch pipe 332. The second main pipe 331 is located on the second drive shaft 32 and communicates with the second vacuuming component. The second branch pipe 332 is located on the brush body. The second main pipe 331 communicates with the second hole 311 on the outer surface of the brush body through the second branch pipe 332. Specifically, the second main pipe 331 is located inside the second drive shaft 32 and communicates with the second vacuuming component. The second branch pipe 332 is located inside the brush body of the cleaning brush 31. The second branch pipe 332 communicates with both the second main pipe 331 and the outer surface of the brush body. When the contact surface 111 needs to be cleaned, the second vacuuming component is activated. The second vacuuming component communicates with the outer surface of the brush body through the second main pipe 331, the second branch pipe 332, and the second hole 311. Foreign matter separated by the bristles of the cleaning brush 31 enters the dust collection space through the second hole 311, the second branch pipe 332, and the second main pipe 331. By placing the second main pipe 331 inside the second drive shaft 32 and the second branch pipe 332 inside the worktable 11, the second pipe 33 is concealed, avoiding the influence of other external components on the second pipe 33 and thus ensuring the collection effect of foreign objects. Furthermore, in this invention, there are multiple second holes 311, spaced apart along the axial direction of the brush body, which improves the adsorption capacity for foreign objects, further enhancing the cleaning effect of the contact surface 111 and preventing foreign objects from affecting the chip, thereby improving product quality.

[0055] Furthermore, such as Figure 1 and Figure 2As shown, the dust collection mechanism 50 also includes a dust collection component 51 and a third pipe 52. The dust collection components 51 are spaced apart at the bottom of the cleaning brush 31, and are correspondingly arranged with the cleaning brush 31. Each dust collection component 51 has at least one third hole 511 on the side facing the cleaning brush 31. The third pipe 52 cooperates with the second dust collection component 51, and the second vacuuming component communicates with the third hole 511 through the third pipe 52. Specifically, the dust collection component 51 is arranged along the axial direction of the cleaning brush 31. When there are multiple third holes 511, they are spaced apart along the length of the dust collection component 51. The third pipe 52 is located inside the dust collection component 51 and communicates with the third hole 511. The second vacuuming component communicates with the third hole 511 through the third pipe 52. When cleaning the contact surface 111, the cleaning brush 31 rotates under the action of the second drive component and the second transmission shaft 32, and the bristles of the cleaning brush 31 contact the contact surface 111. The cleaning process separates foreign objects from the contact surface 111. Under the influence of gravity, the separated foreign objects move towards the cleaning brush 31 and the dust collection component 51. Under the action of the second vacuum component, foreign objects near the cleaning brush 31 enter the dust collection space through the second hole 311 and the third pipe 52, while foreign objects near the dust collection component 51 enter the dust collection space through the third hole 511 and the third pipe 52. This achieves the unified collection of foreign objects, avoids the impact of foreign objects scattering on the chip, and improves the quality of the product.

[0056] Furthermore, the detection mechanism 20 also includes a third driving component (not shown). The third driving component and the image acquisition element 21 are electrically connected to the controller, and the third driving component is drively connected to the image acquisition element 21 to drive the movement of the image acquisition element 21. Specifically, the image acquisition element 21 moves towards or away from the contact surface 111 to be detected via the third driving component, thereby enabling the image acquisition element 21 to successfully acquire images of the contact surface 111, thus providing the controller with accurate image signals, resulting in higher judgment accuracy and more precise control, thereby improving the manufacturing quality of the semiconductor.

[0057] It should be noted that the third driving component is a robotic arm, which has multiple free ends and a telescopic structure. The position of the image acquisition element 21 is adjusted through the robotic arm, making the image acquisition effect more effective.

[0058] like Figures 1 to 5 As shown, the present invention also provides a control method for a patch assembly 100, which is implemented using the patch assembly 100 as described above. The control method for the patch assembly 100 includes the following steps:

[0059] Obtain the working mode. Specifically, the operator selects the mode of the patch device 100 according to the actual situation. There are two working modes. The first working mode is to clean each contact surface 111 on the workbench 11 before putting it into use. The second working mode is to use the detection mechanism 20 to detect the contact surface 111. Contact surfaces 111 that pass the detection do not need to be cleaned and can be put into use directly. Contact surfaces 111 that fail the detection are put into use after being cleaned and qualified.

[0060] It is important to understand that the choice between the first and second working modes depends on the specific circumstances. When time is tight and the task is urgent, the first working mode is used to ensure production efficiency. When the production task is relatively relaxed, the second working mode is used to ensure that the contact surface 111 has good cleanliness and further improve the product yield.

[0061] The contact surface is cleaned according to the first working mode. After the cleaning operation is completed, a contact surface 111 switching command is issued. Specifically, when the controller obtains the first working mode, the first drive unit drives the worktable 11 to rotate through the first transmission shaft 12, so that the contact surface 111 to be used passes through the cleaning mechanism 30 in sequence. When the contact surface 111 passes through the cleaning mechanism, the cleaning mechanism 30 and the dust collection mechanism 50 are activated. The cleaning brush 31 of the cleaning mechanism 30 will clean the contact surface 111, and the separated foreign objects are collected by the dust collection mechanism 50. After the contact surface 111 is cleaned, the controller issues a contact surface 111 switching command. The first drive unit receives the contact surface 111 switching command and drives the worktable 11 to rotate again through the first transmission shaft 12, so that the cleaned contact surface 111 can be used for chip placement operation.

[0062] According to the second working mode, image information of the contact surface 111 located at the bottom of the workbench 11 is acquired. Specifically, when the controller acquires the second working mode, the first driving member drives the workbench 11 to rotate through the first transmission shaft 12, so that the contact surface 111 to be used passes through the cleaning mechanism 30 in sequence. The image acquisition element 21 of the detection mechanism 20 acquires images of the contact surface 111 to be used and feeds back the acquired image information to the controller. The controller uses the acquired image information to perform specific operations to determine whether there are foreign objects on the contact surface 111.

[0063] The system determines whether there are foreign objects in the image information. Specifically, during the process of determining whether there are foreign objects on the contact surface 111, the controller compares the received image information with preset image information and performs specific operations based on the comparison results, thereby ensuring the accuracy of the determination.

[0064] Cleaning is performed on the contact surface based on the presence of foreign objects in the image information. Once the cleaning operation is complete, a contact surface 111 switching command is issued. Specifically, when the controller compares the received image information with the preset image information and finds that there is a foreign object on the contact surface 111, the controller activates the cleaning mechanism 30 and the dust collection mechanism 50. The cleaning brush 31 of the cleaning mechanism 30 is used to clean the contact surface 111. After the cleaning operation is completed, the image acquisition element 21 is used to acquire an image of the cleaned contact surface 111 again and feeds the acquired image information back to the controller. The controller compares the acquired image information again. If the comparison result shows that there is no foreign object, the controller issues a contact surface 111 switching command. The first drive unit receives the contact surface 111 switching command and drives the worktable 11 to rotate again through the first transmission shaft 12, so that the cleaned contact surface 111 can be used for chip placement. If the comparison result shows that there is still a foreign object, the cleaning and image acquisition steps are repeated. If there is no foreign object on the contact surface 111, the controller issues a contact surface 111 switching command. The first drive unit receives the contact surface 111 switching command and drives the worktable 11 to rotate again through the first transmission shaft 12, so that the cleaned contact surface 111 can be used for chip placement.

[0065] It should be noted that the controller has a pre-stored number of times the detection mechanism 20 can detect a contact surface 111. When the number of times the detection mechanism 20 can detect a contact surface 111 exceeds the preset number of detections, the controller issues an alarm command, and the alarm component (speaker, etc.) of the patch device 100 emits an alarm signal, thereby reminding the operator to check the equipment condition to avoid damage to the equipment caused by infinite cycles.

[0066] Based on the absence of foreign objects in the image information, a switching command for contact surface 111 is issued. Specifically, when the controller compares the received image information with the preset image information and finds that there are no foreign objects on contact surface 111, the controller issues a switching command for contact surface 111. The first drive unit receives the switching command and drives the worktable 11 to rotate again via the first transmission shaft 12, so that the cleaned contact surface 111 can be used for chip mounting operations without the need to start the cleaning mechanism 30 and the dust collection mechanism 50, thereby saving energy and improving the cleaning efficiency of contact surface 111.

[0067] According to the control method of the chip mounting device of the present invention, foreign objects on the worktable contact surface are effectively removed through the effective cooperation of the detection mechanism and the cleaning mechanism, thereby avoiding the impact of foreign objects on semiconductor manufacturing and improving the product yield.

[0068] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A surface mount device for semiconductor manufacturing, characterized in that, The patch assembly includes: The support mechanism includes a worktable with a contact surface for placing chips. The worktable is rotatable to flip the contact surface. The testing mechanism includes image acquisition elements, which are spaced apart at the bottom of the worktable and used to acquire images of the contact surface. A cleaning mechanism, comprising cleaning brushes spaced apart at the bottom of the workbench, for cleaning the contact surfaces; A controller, which is electrically connected to the carrying mechanism, the detection mechanism, and the cleaning mechanism, respectively. The chip mounting device further includes a fixing mechanism for fixing the chip on the contact surface; The supporting mechanism further includes: A first driving element, which is electrically connected to the controller; A first drive shaft, the first driving component is connected to the worktable via the first drive shaft; The fixing mechanism includes: A first vacuum pumping component is electrically connected to the controller. The first pipeline connects the first vacuuming component to the contact surface through the first pipeline. The first pipeline includes: The first main tube is located on the first drive shaft and is connected to the first vacuuming component; At least one first branch pipe is provided on the workbench, and the first main pipe communicates with the first hole of the contact surface through the first branch pipe.

2. The patch assembly according to claim 1, characterized in that, The number of contact surfaces is multiple, and each contact surface is spaced apart along the rotation direction of the worktable. The number of pipes is the same as the number of contact surfaces, and the pipes are arranged corresponding to the contact surfaces.

3. The patch mounting device according to claim 1, characterized in that, The patch assembly also includes a dust collection mechanism for collecting foreign objects that separate from the contact surface.

4. The patch assembly device according to claim 3, characterized in that, The dust collection mechanism includes: The second vacuuming component is electrically connected to the controller. The second conduit connects the first vacuuming component to the outer surface of the cleaning brush body.

5. The patch assembly according to claim 4, characterized in that, The cleaning facility also includes: A second driving element, which is electrically connected to the controller; The second drive shaft connects the second drive component to the cleaning brush via the second drive shaft.

6. The patch assembly according to claim 5, characterized in that, The second pipeline includes: The second main pipe is located on the second drive shaft and is connected to the second vacuum component; The second branch pipe is disposed on the brush body, and the second main pipe communicates with the second hole on the outer surface of the brush body through the second branch pipe.

7. The patch assembly according to claim 4, characterized in that, The dust collection mechanism also includes: A dust collection component is provided at intervals at the bottom of the cleaning brush and is correspondingly arranged with respect to the cleaning brush. The dust collection component has at least one third hole on the side facing the cleaning brush. The third pipeline is used in conjunction with the dust collection component, and the second vacuuming component is connected to the third hole through the third pipeline.

8. The patch assembly according to any one of claims 1 to 7, characterized in that, The detection mechanism further includes a third driving component, which is electrically connected to the controller along with the image acquisition element. The third driving component is drively connected to the image acquisition element and is used to drive the movement of the image acquisition element.

9. A method for controlling a surface mount device, wherein the method is implemented using a surface mount device as described in any one of claims 1 to 8, characterized in that, The control method for the patch device includes the following steps: Obtain the working mode; Clean the contact surface according to the first working mode. Once the cleaning operation is completed, issue a contact surface switching command. According to the second working mode, image information of the contact surface located at the bottom of the worktable is obtained; Determine if there are foreign objects in the image information; Clean the contact surface based on the presence of foreign objects in the image information. Once the cleaning operation is complete, issue a contact surface switching command. Based on the absence of foreign objects in the image information, a contact surface switching command is issued.

Images