Wire bonding system for substrates

Abstract

The present application relates to chip packaging technical field, disclose a kind of for substrate wire bonding system.The wire bonding system for substrate of the present application, comprising: machine table, magazine, baffle and controller, magazine is placed in machine table, baffle is hinged on machine table, baffle is equipped with grounding inductor, machine table is equipped with insulator, machine table and grounding inductor are electrically connected with controller respectively.The wire bonding system for substrate of the present application, baffle is hinged on machine table, baffle covers the opening of one side of magazine when closing, grounding inductor detects insulator, sends detection signal to controller, and controller controls machine table normal work;When baffle is opened, grounding inductor cannot detect insulator (no signal), controller issues alarm, at this time, machine table does not work, prevent the substrate in magazine from sliding out of magazine and damaging, improve the degree of automation of machine table, also prevent the damage of product caused by operator's negligence not closing baffle.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and more specifically to a wire bonding system for a substrate. Background Technology

[0002] Semiconductor packaging refers to the process of processing tested wafers into individual chips according to product model and functional requirements. The packaging process is as follows: the wafer from the front-end wafer process is diced into small chips, and then the diced chips are mounted onto small islands on the corresponding substrate using conductive silver paste or adhesive tape. Then, ultra-fine metal (gold, silver, copper, aluminum) wires or conductive resin are used to connect the bonding pads of the chips to the corresponding leads on the substrate, thus forming the required circuit.

[0003] The wire bonding between the chip and the substrate is completed automatically by the machine. After the wire bonding is completed, the substrate is sent into the substrate placement box (material box) by the machine's robotic arm.

[0004] However, currently, when the machine is working, the substrate placed in the material box will slide out of the material box due to the vibration of the machine, thus causing damage to the substrate. Summary of the Invention

[0005] The purpose of this invention is to provide a wire bonding system for a substrate to solve the problems mentioned in the background art.

[0006] This invention provides a wire bonding system for a substrate, comprising: a machine, a material box, a baffle, and a controller;

[0007] The material box is rectangular frame-shaped, with openings on the front and rear sides, and multiple sets of placement slots corresponding to the left and right side walls.

[0008] The material box is placed inside the machine.

[0009] The baffle is hinged to the machine base and is used to block the opening of the material box when closed;

[0010] The baffle is equipped with a grounding sensor, and the machine base is equipped with an insulator;

[0011] The machine and the grounding sensor are electrically connected to the controller. The grounding sensor is used to send a position signal to the controller when it detects the insulator. When the controller receives the position signal, it controls the machine to wire bond and controls the board after wire bonding to be sent into the material box.

[0012] Based on the above scheme, the wire bonding system for substrates of the present invention comprises a machine, a material box, a baffle, and a controller. The material box has openings on its front and rear sides, and multiple sets of placement slots are correspondingly provided on its left and right side walls. The baffle is hinged to the machine and is equipped with a grounding sensor. The machine is equipped with an insulator, and the machine and the grounding sensor are electrically connected to the controller. In the wire bonding system for substrates of the present invention, the baffle is hinged to the machine and located at the opening on one side of the material box. When the baffle is closed, it blocks one side opening of the material box. At this time, the grounding sensor detects the insulator of the machine and sends a detection signal to the controller. The controller controls the machine to work normally, that is, the machine wire bonds the substrate and the chip, and sends the wire-bonded substrate into the material box from the other side opening. When the baffle is open, the grounding sensor does not detect the insulator (no signal), the controller issues an alarm, and the machine stops working to prevent the substrate in the material box from sliding out of the material box and being damaged. This improves the automation level of the machine and also prevents product damage caused by operator negligence in not closing the baffle.

[0013] One feasible solution also includes: a tension spring;

[0014] A connecting plate is provided on one side of the baffle, and the connecting plate is hinged to the machine base and the baffle respectively;

[0015] The two ends of the tension spring are respectively disposed on the machine base and the baffle.

[0016] One feasible solution also includes: a clamping mechanism;

[0017] The clamping mechanism includes: an upper clamping block, a lower clamping block, a lead screw, and a drive motor;

[0018] The drive motor is mounted on the machine base and electrically connected to the controller;

[0019] The lead screw is rotatably mounted on the machine base and connected to the drive motor, which drives the lead screw to rotate.

[0020] The upper clamping block and the lower clamping block are slidably disposed on the machine base and respectively mesh with the lead screw. When the lead screw rotates, it is used to drive the upper clamping block and the lower clamping block to move closer and further away from each other. When the upper clamping block and the lower clamping block move closer to each other, they are used to clamp the material box.

[0021] In one feasible solution, the upper clamping block and the lower clamping block are provided with sponge pads, which are used to abut against the material box.

[0022] In one feasible solution, a stop bar is provided on one side of the material box;

[0023] The two ends of the stop bar are hinged to the material box via rotating arms and are located at one side opening of the material box. The stop bar is used to block the opening of the material box.

[0024] In one feasible solution, the baffle is provided on both sides of the material box.

[0025] One feasible solution also includes: a proximity sensor;

[0026] The proximity sensor is mounted on the material box and electrically connected to the controller. The proximity sensor is used to send a position signal to the controller when it senses that the rotating arm has reached a preset position.

[0027] In one feasible solution, the side wall of the material box is provided with a receiving groove for the insertion of the stop bar.

[0028] One feasible solution also includes: a counting mechanism;

[0029] The counting mechanism includes: a camera and a counter;

[0030] The camera is mounted on the machine platform;

[0031] The counter is electrically connected to both the camera and the controller, and is used to record the number of times the substrate enters the material box. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of a wire bonding system for a substrate in an embodiment of the present invention;

[0034] Figure 2 This is a schematic diagram showing the state of the baffle when it is closed in an embodiment of the present invention;

[0035] Figure 3 This is a schematic diagram of the material box in an embodiment of the present invention;

[0036] Figure 4 As described in the embodiments of the present invention Figure 3 Enlarged view of point A in the image.

[0037] Numbering on the map:

[0038] 1. Machine base; 11. Insulator; 2. Material box; 21. Placement slot; 22. Stop bar; 23. Rotary arm; 24. Proximity sensor; 25. Receiving slot; 3. Baffle; 301. Connecting plate; 31. Grounding sensor; 4. Tension spring; 5. Clamping mechanism; 501. Sponge pad; 51. Upper clamping block; 52. Lower clamping block; 53. Lead screw. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0041] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0042] The technical solution of the present invention will be described in detail below with reference to specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0043] As described in the background section of this application, the wire bonding (wire bonding) between the chip and the substrate is automatically completed by the machine, and the substrate after wire bonding is fed into the substrate placement box (material box) by the machine's robotic arm.

[0044] The inventors of this application have discovered that, currently, when the machine is in operation, the substrate placed in the material box will slide out of the material box due to the vibration of the machine, thereby causing damage to the substrate.

[0045] To address the aforementioned problems, the inventors of this application have proposed a technical solution, the specific embodiments of which are as follows:

[0046] Figure 1 This is a schematic diagram of a wire bonding system for a substrate according to an embodiment of the present invention. Figure 2 This is a schematic diagram showing the state of the baffle when it is closed in an embodiment of the present invention. Figure 3 This is a schematic diagram of the material box in an embodiment of the present invention. Figure 4 As described in the embodiments of the present invention Figure 3 A magnified view of point A in the image. (See image below.) Figures 1 to 4 As shown, the wire bonding system for substrates in this embodiment includes: a machine base 1, a material box 2, a baffle 3, and a controller.

[0047] The material box 2 is rectangular in shape, with openings on both the front and rear sides. Multiple sets of placement slots 21 are provided on the left and right sides of the material box 2. Each set of placement slots 21 is used to horizontally place a substrate.

[0048] Material box 2 is fed into machine 1 through the feeding mechanism of machine 1.

[0049] The baffle 3 is rotatably hinged to the machine base 1 and located at the opening on one side of the material box 2. When the baffle 3 is closed, it blocks the opening on one side of the material box 2 to prevent the substrate inside the material box 2 from sliding out of the material box 2.

[0050] A grounding sensor 31 is provided at the bottom of the baffle 3, and an insulator 11 is provided on the machine base 1. When the baffle 3 is closed, the grounding sensor 31 on the baffle 3 corresponds to the position of the insulator 11 on the machine base 1.

[0051] The machine 1 and the grounding inductor 31 are electrically connected to the controller (not shown in the figure).

[0052] In this embodiment, the baffle is rotatably mounted on the machine. When the baffle is closed, the grounding sensor detects the insulator of the machine and sends a detection signal to the controller. The controller controls the machine to work normally, that is, the machine wire-lays the substrate and the chip and sends the wire-laying substrate into the material box from the opening on the other side of the material box. When the baffle is open, the grounding sensor does not detect the insulator of the machine (no signal), the controller issues an alarm, and the machine does not work at this time to prevent the substrate in the material box from sliding out of the material box due to vibration.

[0053] As can be seen from the above, the wire bonding system for substrates in this embodiment includes a machine, a material box, a baffle, and a controller. The material box has openings on its front and rear sides, and multiple placement slots are provided on its left and right side walls. The baffle is hinged to the machine and has a grounding sensor. The machine has an insulator, and the machine and the grounding sensor are electrically connected to the controller. In this wire bonding system for substrates, the baffle is hinged to the machine and located at the opening on one side of the material box. When the baffle is closed, it blocks one opening of the material box. At this time, the grounding sensor detects the insulator of the machine and sends a detection signal to the controller. The controller controls the machine to work normally, that is, the machine wire bonds the substrate and the chip, and sends the wire-bonded substrate into the material box from the other opening. When the baffle is open, the grounding sensor cannot detect the insulator (no signal), the controller issues an alarm, and the machine stops working to prevent the substrate from sliding out of the material box and being damaged. This improves the automation level of the machine and also prevents product damage caused by operator negligence in not closing the baffle.

[0054] Optional, such as Figure 1 As shown, the wire bonding system for the substrate in this embodiment also includes a tension spring 4.

[0055] A connecting plate 301 is provided on one side of the baffle 3. The baffle 3 is hinged to one side of the connecting plate 301, and the other side of the connecting plate 301 is hinged to the fixed plate of the machine base 1.

[0056] One end of the tension spring 4 is fixed to the machine base 1, and the other end of the tension spring 4 is fixed to the baffle 3. When the baffle 3 is opened and closed, it is kept in the open and closed state by the pull of the tension spring 4.

[0057] Optionally, the wire bonding system for the substrate in this embodiment further includes a clamping mechanism 5.

[0058] The clamping mechanism 5 includes: an upper clamping block 51, a lower clamping block 52, a lead screw 53, and a drive motor.

[0059] The drive motor (not shown in the figure) is mounted on machine base 1. The drive motor is electrically connected to the controller, and the controller controls the start and stop of the drive motor.

[0060] The lead screw 53 is vertically set and rotatably mounted on the machine base 1. One end of the lead screw 53 is connected to the drive motor, which drives the lead screw 53 to rotate.

[0061] The machine base 1 is equipped with a slide rail. The upper clamping block 51 and the lower clamping block 52 are slidably mounted on the slide rail of the machine base 1 via sliders. The upper clamping block 51 and the lower clamping block 52 are respectively engaged with the lead screw 53. When the lead screw 53 rotates, it drives the upper clamping block 51 and the lower clamping block 52 to move closer and / or further away from each other. When the upper clamping block 51 and the lower clamping block 52 move closer to each other, they clamp the material box 2 placed on the machine base 1 from the upper and lower sides to prevent the material box 2 from moving on the machine base 1 when the machine base 1 is working.

[0062] Furthermore, in the wire bonding system for the substrate in this embodiment, the bottom of the upper clamping block 51 and the top of the lower clamping block 52 are provided with sponge pads 501. When the upper clamping block 51 and the lower clamping block 52 clamp the material box 2, the sponge pads 501 on the upper clamping block 51 and the lower clamping block 52 contact and abut against the material box 2 to better protect the material box.

[0063] Optional, such as Figure 1 , Figure 3 , Figure 4 As shown, in this embodiment, the wire bonding system for the substrate has a baffle 22 on one side of the material box 2.

[0064] The upper and lower ends of the baffle 22 are rotatably mounted on the material box 2 via the rotating arm 23, and the baffle 22 is located at the opening of the material box 2 near the baffle 3. When the baffle 22 is closed, it blocks the opening of the material box 2. The baffle 22 and the baffle 3 provide double protection for the material box, preventing the substrate inside the material box 2 from sliding out of the material box, and more effectively protecting the substrate inside the material box.

[0065] Furthermore, in the wire bonding system for the substrate in this embodiment, there are baffles 22 at the openings on both sides of the material box 2. After the material box 2 is placed into the machine 1, the baffle 22 on the side closest to the baffle 3 can be turned to the closed state, which facilitates the placement of the material box in the machine.

[0066] Furthermore, the wire bonding system for the substrate in this embodiment also includes a proximity sensor 24.

[0067] A proximity sensor 24 is mounted on the material box 2 and electrically connected to the controller. When the stop lever 22 is closed, the proximity sensor 24 detects the rotating arm 23 and sends a signal indicating that the stop lever 22 is in position to the controller, which then controls the machine 1 to operate normally. When the stop lever 22 is open, the proximity sensor 24 does not detect the rotating arm 23 (no signal), and the controller issues an alarm to remind the operator to close the stop lever. At this time, the machine does not operate to prevent the substrate inside the material box from sliding out of the material box.

[0068] Furthermore, in the wire bonding system for the substrate in this embodiment, the side wall of the material box 2 is provided with a receiving groove 25. When the stop bar 22 is opened, the stop bar 22 is embedded in the receiving groove 25 of the material box 2 to prevent the stop bar from being damaged by external force.

[0069] Furthermore, the wire bonding system for the substrate in this embodiment also includes a counting mechanism.

[0070] The counting mechanism includes a camera and a counter.

[0071] The camera (not shown in the figure) is installed on the machine 1, at the opening on the side of the material box 2 away from the baffle 3.

[0072] The counter (not shown in the diagram) is electrically connected to both the camera and the controller.

[0073] In this embodiment, the machine performs wire bonding on the substrate and chip, and then sends the wire-bonded substrate into the material box. The camera detects the substrate entering the material box and sends a signal to the counter. The counter records the number of times the machine sends the substrate into the material box and sends a signal to the controller. When the number of substrates in the material box reaches a preset value (the material box is full), the controller issues an alarm and stops the machine to remind the operator to remove the full material box.

[0074] In this invention, unless otherwise explicitly specified and limited, the first feature being "on" or "under" the second feature can mean that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact through an intermediate medium.

[0075] Furthermore, "above," "on top of," and "above" the first feature in relation to the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "under," and "beneath" the first feature in relation to the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0076] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wire bonding system for a substrate, characterized in that, include: Machine base, material box, baffle and controller; The material box is rectangular frame-shaped, with openings on the front and rear sides, and multiple sets of placement slots corresponding to the left and right side walls. The material box is placed inside the machine. The baffle is hinged to the machine base and is used to block the opening of the material box when closed; The baffle is equipped with a grounding sensor, and the machine base is equipped with an insulator; The machine and the grounding sensor are electrically connected to the controller. The grounding sensor sends a position signal to the controller when it detects the insulator. When the controller receives the position signal, it controls the machine to wire-lay the substrate and sends the wire-laying substrate into the material box. When the baffle is open, the grounding sensor cannot detect the insulator of the machine, the controller issues an alarm, and the machine stops working to prevent the substrate in the material box from sliding out of the material box due to vibration.

2. The wire bonding system for a substrate according to claim 1, characterized in that, Also includes: Tension spring; A connecting plate is provided on one side of the baffle, and the connecting plate is hinged to the machine base and the baffle respectively; The two ends of the tension spring are respectively disposed on the machine base and the baffle.

3. The wire bonding system for a substrate according to claim 1, characterized in that, Also includes: Clamping mechanism; The clamping mechanism includes: an upper clamping block, a lower clamping block, a lead screw, and a drive motor; The drive motor is mounted on the machine base and electrically connected to the controller; The lead screw is rotatably mounted on the machine base and connected to the drive motor, which drives the lead screw to rotate. The upper clamping block and the lower clamping block are slidably disposed on the machine base and respectively mesh with the lead screw. When the lead screw rotates, it is used to drive the upper clamping block and the lower clamping block to move closer and further away from each other. When the upper clamping block and the lower clamping block move closer to each other, they are used to clamp the material box.

4. The wire bonding system for a substrate according to claim 3, characterized in that, The upper clamping block and the lower clamping block are provided with sponge pads, which are used to support the material box.

5. The wire bonding system for a substrate according to claim 1, characterized in that, A stop bar is provided on one side of the material box; The two ends of the stop bar are hinged to the material box via rotating arms and are located at one side opening of the material box. The stop bar is used to block the opening of the material box.

6. The wire bonding system for a substrate according to claim 5, characterized in that, The baffle is provided on both sides of the material box.

7. The wire bonding system for a substrate according to claim 6, characterized in that, Also includes: Proximity sensor; The proximity sensor is mounted on the material box and electrically connected to the controller. The proximity sensor is used to send a position signal to the controller when it senses that the rotating arm has reached a preset position.

8. The wire bonding system for a substrate according to claim 6, characterized in that, The side wall of the material box is provided with a receiving groove for the insertion of the stop bar.

9. The wire bonding system for a substrate according to claim 1, characterized in that, Also includes: Counting mechanism; The counting mechanism includes: a camera and a counter; The camera is mounted on the machine platform; The counter is electrically connected to both the camera and the controller, and is used to record the number of times the substrate enters the material box.

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