Resin, resin composition, and display device using the same

Abstract

According to an embodiment of the present application, there is provided a display device including a resin including a repeating unit represented by formula (1), a resin composition including the resin, and a pixel separation portion formed from the resin composition. The display device is a display device including a first electrode formed on a substrate, a pixel separation portion formed on the first electrode to partially expose the first electrode, and a second electrode provided opposite the first electrode, the pixel separation portion having an absorbance of greater than 0.5 / μm at a wavelength of 550 nm.

Description

Technical Field

[0001] The present invention relates to a resin composition for a pixel separation section and a display device that utilizes the same to achieve clearer image quality. Background Technology

[0002] Flat panel displays widely use liquid crystal displays (LCDs) and organic light-emitting displays (OLEDs). Among them, organic light-emitting displays, in particular, have advantages such as low power consumption, fast response speed, high color saturation, high brightness, and wide viewing angle.

[0003] In the case of the organic light-emitting display device, a polarizing film is used to cut off the light reflected from the panel due to the input of external light. However, when the polarizing film is applied to a flexible device, it has the disadvantage of being unsuitable for use due to insufficient bending performance.

[0004] As a solution to the above problems, methods have been proposed, including not only color filters and black bases, but also methods for forming an inorganic film on the upper substrate to cut off light. However, these methods have limitations in achieving the desired anti-reflective effect, and no specific alternative method to polarizing films has been disclosed.

[0005] In addition, colored light-shielding layers, especially black light-shielding layers, are used in liquid crystal display devices to prevent color interference between red, green and blue color filters and improve image quality. Recently, the use of the above-mentioned colored light-shielding layers has also been studied in organic light-emitting displays to improve image visibility.

[0006] In manufacturing the aforementioned light layer, carbon black and organic pigments are used as black colorants, and because these are used in a dispersed manner, the pigment dispersion is mixed with other compositions to form a pattern.

[0007] At this point, there is an urgent need for research on pigments that can effectively reduce reflectivity around 550nm, which has the greatest impact on visibility, using various types of black or combinations of black pigments.

[0008] Prior technology documents

[0009] [Patent Documents]

[0010] Korean Patent Registration No. 10-1141566 Summary of the Invention

[0011] The problem to be solved

[0012] The object of the present invention is to provide a resin composition capable of improving visibility by increasing absorbance at a wavelength of 550 nm, a pixel separation section manufactured using the resin composition, and a display device including the pixel separation section.

[0013] Problem Solving Methods

[0014] This invention provides a resin comprising repeating units represented by the following chemical formula (1):

[0015] Chemical formula (1)

[0016]

[0017] In the chemical formula (1),

[0018] 1) This indicates the portion where chemical bonds are connected by repeating units;

[0019] 2) R 1 and R 2 Independently, they are hydrogen; deuterium; halogen; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl;

[0020] 3) R 1 and R 2 Each can form a ring with its adjacent base;

[0021] 4) a and b are independent integers from 0 to 4;

[0022] 5) X 1 For single bonds, O, CO, SO2, CR'R”, SiR'R”, chemical formula (A) or chemical formula (B);

[0023] 6) X 2 C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryl groups; or combinations thereof;

[0024] 7) R' and R” are independently hydrogen; deuterium; halogen; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl;

[0025] 8) R' and R” can each form a ring with an adjacent base;

[0026] 9) A 1 and A 2 They are independently represented by chemical formula (C) or chemical formula (D);

[0027] 10) In the polymer chain of a resin comprising repeating units represented by chemical formula (1), the ratio of chemical formula (C) to chemical formula (D) satisfies 1:9 to 9:1;

[0028] Chemical formula (A)

[0029]

[0030] Chemical formula (B)

[0031]

[0032] In the chemical formulas (A) and (B),

[0033] 11-1) Indicates the position of chemical bonds;

[0034] 11-2) X3 is O, S, SO2 or NR';

[0035] 11-3) R' is hydrogen; deuterium; halogen; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl;

[0036] 11-4) R 3 ~R 6 Independently, they are hydrogen; deuterium; halogen; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl;

[0037] 11-5) R 3 ~R 6 Each can form a ring with its adjacent base;

[0038] 11) c~f are independent integers from 0 to 4;

[0039] Chemical formula (C)

[0040]

[0041] Chemical formula (D)

[0042]

[0043] In the chemical formulas (C) and (D),

[0044] 12-1) Indicates the position of chemical bonds;

[0045] 12-2) R 7 ~R 10 Independently, they are hydrogen; deuterium; halogen; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl;

[0046] 12) A 1 and A 2 They are independently represented by chemical formula (E) or chemical formula (F);

[0047] Chemical formula (E)

[0048]

[0049] Chemical formula (F)

[0050]

[0051] In the aforementioned chemical formulas (E) and (F),

[0052] 13-1) Indicates the position of chemical bonds;

[0053] 13-2) R 11 ~R 15 Independently, they are hydrogen; deuterium; halogen; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl;

[0054] 13-3) L1~L3 are independent single bonds, C1~C 30 hydrocarbon group, C6~C 30 arylene or C2~C 30 heterocyclic rings;

[0055] 13-4) g and h are independent integers from 0 to 3; however, g + h = 3;

[0056] 14) The R 1 ~R 15 、R'、R”、X 1 ~X 2 and L 1 ~L 3The rings formed by the combination of adjacent groups can also be selected from deuterium; halogens; and C1~C1 groups. 30 Alkyl or C6~C 30 aryl-substituted or unsubstituted silyl groups; siloxane groups; boron groups; germanium groups; cyano groups; amino groups; nitro groups; C1~C6 groups 30 alkylthio group; C1~C 30 alkoxy group; C6~C 30 arylalkoxy group; C1~C 30 Alkyl groups; C2~C 30 alkenyl group; C2~C 30 alkynyl group; C6~C 30 aryl group; C6~C substituent with deuterium 30 aryl; fluorene; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P. 30 Heterocyclic group; C3~C 30 alicyclic group; C7~C 30 arylalkyl; C8~C 30 aryl alkenyl groups; and combinations thereof constituting one or more substituents of the group, wherein adjacent substituents may form a ring.

[0057] Preferably, the resin according to the invention has a weight average molecular weight of 1,000 to 100,000 g / mol.

[0058] Preferably, the photosensitive resin composition according to the present invention comprises a resin including repeating units represented by the chemical formula (1); a reactive unsaturated compound; an initiator; a pigment; and residual solvent.

[0059] Additionally, preferably, the reactive unsaturated compound comprises 1 to 40 wt% of the total amount of the photosensitive resin composition.

[0060] Furthermore, preferably, the reactive unsaturated compound comprises a compound represented by the following chemical formula (2):

[0061] Chemical formula (2)

[0062]

[0063] In the chemical formula (2), two or more of Z1 to Z4 independently possess the structure of the following chemical formula (G); the remaining Z1 to Z4 are independently hydrogen, deuterium, halogen, methyl, ethyl; methyl hydroxyl; C6 to C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl;

[0064] Chemical formula (G)

[0065]

[0066] In the chemical formula (G),

[0067] 1) t is an integer from 1 to 20;

[0068] 2) L4 is a single bond, C1~C 30 hydrocarbon group, C6~C 30 arylene or C2~C 30 heterocyclic rings;

[0069] 3) Y3 is a wire harness chemical formula (H) or chemical formula (I):

[0070] Chemical formula (H)

[0071]

[0072] Chemical formula (I)

[0073]

[0074] In the chemical formula (H), R 21 Hydrogen, deuterium, halogen, methyl, ethyl; methyl hydroxyl; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl.

[0075] In addition, preferably, the pigment includes at least one of benzofuranones, indolones, lactams, dinaphthalene-based benzophenones, titanium-based organic pigments, and carbon black.

[0076] In addition, preferably, the pigment includes at least two kinds of pigments and dyes.

[0077] Additionally, preferably, the initiator comprises 0.01 to 10% by weight relative to the total amount of the photosensitive resin composition.

[0078] Furthermore, preferably, the initiator comprises a compound represented by the following chemical formula (3):

[0079] Chemical formula (3)

[0080]

[0081] In the chemical formula (3),

[0082] 1) u1~u3 are mutually independent integers that are either 0 or 1;

[0083] 2) L5 and L8 are the following chemical formulas (J);

[0084] 3) L6, L7, and L9 are independently C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C3~C 30 alicyclic group; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; C1~C 20 alkoxycarbonyl; C1~C 30 Hydroxyl group or C6~C 30 Alpha-aryl;

[0085] Chemical formula (J)

[0086]

[0087] In the chemical formula (J), R 31 Hydrogen, deuterium, halogen, methyl, ethyl; methyl hydroxyl; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl.

[0088] Furthermore, preferably, L6, L7, and L9 of the chemical formula (3) are each independently one of the following chemical formulas (K) to (N):

[0089] Chemical formula (K)

[0090]

[0091] Chemical formula (L)

[0092]

[0093] Chemical formula (M)

[0094]

[0095] Chemical formula (N)

[0096]

[0097] In the aforementioned chemical formulas (M) and (N),

[0098] 1) A represents hydrogen; O; S; silyl group; siloxane group; boron group; germanium group; cyano group; nitro group; nitrile group; represented by C1~C1. 30 Alkyl groups, C6~C 30 aryl or C2~C 30 The heterocyclic substituted or unsubstituted amino group; C1~C 30 alkylthio group; C1~C 30 Alkyl groups; C1~C 30 alkoxy group; C6~C 30 arylalkoxy group; C2~C 30 alkenyl group; C2~C 30 alkynyl group; C6~C 30 aryl group; C6~C substituent with deuterium 30 aryl; fluorene; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P. 30 Heterocyclic group; C3~C 30 alicyclic group; C7~C 30 arylalkyl; C8~C 30 aryl alkenyl groups; and combinations thereof;

[0099] 2) R 32 ~R 34 Independently, they are hydrogen; deuterium; halogen; C6~C 30aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl;

[0100] 3) T is S, O or Se.

[0101] Furthermore, the display device according to the present invention includes a first electrode formed on a substrate, a pixel separation portion formed on the first electrode to partially expose the first electrode, and a second electrode disposed relative to the first electrode. Preferably, the pixel separation portion is formed of the photosensitive resin composition according to claim 3.

[0102] Additionally, preferably, the pixel separation portion covers the edge portion of the first electrode.

[0103] Additionally, preferably, the thickness of the pixel separation portion is 0.5 to 10 µm.

[0104] Furthermore, preferably, the optical density of the pixel separation section is greater than 0.5 per 1µm at a wavelength of 550nm.

[0105] Furthermore, preferably, the electronic device according to the present invention includes the display device according to the present invention and a control unit for driving the display device.

[0106] Invention Effects

[0107] According to an embodiment of the present invention, the resin composition forms a pixel separation section by utilizing a resin containing repeating units represented by chemical formula (1), thereby generating less degassing and exhibiting high optical density and low reflectivity near 550 nm, where visibility has the greatest impact.

[0108] Therefore, the visibility of the display device utilizing the resin composition according to the present invention can be improved. Overview of the attached figures

[0109] Figure 1 A schematic diagram illustrating the test results of the display device according to the comparative examples and embodiments of the present invention;

[0110] Figure 2 This is a conceptual diagram of a display device for implementing the present invention.

[0111] Figure Labels

[0112] 1: Substrate

[0113] 2: TFT

[0114] 3: TFT layer

[0115] 4: Flattening layer

[0116] 5: First electrode

[0117] 6: Pixel Separation Section

[0118] 7: How many floors are there?

[0119] 8: Second electrode

[0120] 9: Cone angle Detailed Implementation

[0121] Hereinafter, some embodiments of the present invention will be described in detail with reference to the exemplary accompanying drawings. When assigning reference numerals to the constituent elements of the various drawings, the same reference numerals will be assigned to the same constituent elements as much as possible, even if they are shown in different drawings.

[0122] In describing this invention, detailed descriptions of disclosed functions or structures will be omitted if they are deemed to hinder understanding of the invention. In this specification, terms such as "comprising," "possessing," and "comprise" may include additional parts if "only" is not used. When a singular number is used to represent a constituent element, a plural number may be included unless otherwise expressly stated.

[0123] Furthermore, when describing the constituent elements of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are used only to distinguish the constituent element from other constituent elements and are not intended to limit the nature, order, sequence, or quantity of the constituent elements.

[0124] In describing the relationship between constituent elements, when two or more constituent elements are described as "connected," "combined," or "linked," it can be understood that two or more constituent elements can be directly connected, "combined," or "linked," or "connected" "through" other constituent elements. Here, other constituent elements may include one or more of the constituent elements that are mutually "connected," "combined," or "linked."

[0125] Furthermore, when describing a component such as a layer, membrane, region, or plate as being "on" or "on" other components, it should be understood that this includes not only cases where other components are "directly on" it, but also cases where other components are interspersed within it. Conversely, when describing a component as being "directly on" other parts, it should be understood that there are no other parts in between.

[0126] In describing the temporal flow relationships related to constituent elements, operating methods, or manufacturing methods, for example, when using terms such as "after," "next," "after," or "before" to describe the temporal sequence or flow sequence, discontinuous situations may be included if "immediately" or "directly" is not used.

[0127] Furthermore, when referring to the numerical values ​​or corresponding information of a constituent element, even without other explicit documentation, the numerical values ​​or corresponding information can be interpreted as including the range of errors caused by various factors (e.g., process factors, internal or external impacts, noise, etc.).

[0128] The terms used in this specification and the appended claims, without departing from the spirit and scope of the invention, shall have the following meanings unless otherwise described:

[0129] Unless otherwise stated, the term “halogenated” or “halogen” used in this application includes fluorine (F), chlorine (Cl), bromine (Br) and iodine (I).

[0130] Unless otherwise stated, the term "alkane" or "alkyl" used in this application means having 1 to 60 carbon atoms linked by single bonds, and includes groups with saturated aliphatic functional groups, including straight-chain alkyl, molecular-chain alkyl, cycloalkyl (alicyclic), alkyl-substituted cycloalkyl, and cycloalkyl-substituted alkyl.

[0131] Unless otherwise stated, the term “halogenated alkyl” or “halogenated alkyl” used in this application means an alkyl group in which halogen has been substituted.

[0132] Unless otherwise stated, the terms “alkenyl” or “alkynyl” used in this application each have double and triple bonds, including straight-chain or side-chain chains, and have a number of carbons from 2 to 60, but not limited thereto.

[0133] Unless otherwise stated, the term "cycloalkyl" used in this application means, but is not limiting, an alkyl group forming a ring having 3 to 60 carbon atoms.

[0134] The term “alkoxy” or “alkyloxy” used in this application means an alkyl group bound with an oxygen group, having a carbon number of 1 to 60 unless otherwise specified, but not limited thereto.

[0135] The terms “alkenyloxy”, “alkenyloxy”, “alkenyloxy” or “alkenyloxy” used in this application mean an alkenyl group with an attached oxygen group having a carbon number of 2 to 60, but not limited thereto, unless otherwise specified.

[0136] Unless otherwise specified, the terms "aryl" and "arylene" used in this application each have 6 to 60 carbon atoms, but are not limiting. In this application, aryl or arylene includes monocyclic compounds, cyclic aggregates, various fused-ring compounds, etc. For example, the aryl group may include phenyl, monovalent functional groups of biphenyl, monovalent functional groups of naphthalene, fluorenyl, substituted fluorenyl, and arylene may include fluorenyl or substituted fluorenyl.

[0137] The term "ring assemblies" used in this application means two or more ring classes (monocyclic or fused-ring) directly connected to each other by single or double bonds, wherein the number of rings directly connected to each other is one less than the total number of ring classes contained in the compound. Identical or different ring classes in a ring assembly may be directly connected to each other by single or double bonds.

[0138] In this application, aryl groups include cyclic aggregates, including biphenyls and terphenyls, which are single aromatic rings of benzene linked by single bonds. Additionally, aryl groups also include compounds of monocyclic aromatic rings and fused aromatic rings linked by single bonds, such as compounds of monocyclic aromatic rings of benzene and fused aromatic rings linked by single bonds.

[0139] The term "various fused rings" used in this application means fused ring forms that share at least two atoms, including forms in which two or more hydrocarbon rings are bonded together, and forms in which a heterocycle containing at least one heteroatom is bonded together. These various fused rings can be aromatic rings, heteroaromatic rings, alicyclic rings, or combinations thereof. For example, in the case of aryl groups, they can be naphthyl, phenanthryl, fluorene, etc., but are not limiting.

[0140] The term "spirocyclic compound" used in this application refers to a "spiro union," which means that two rings share a connection consisting of only one atom. In this case, the atom shared by the two rings is called a "spiro atom," and depending on the number of spiro atoms contained in a compound, it is referred to as a "monospirocyclic," "bispirrocyclic," or "trispirrocyclic" compound.

[0141] Unless otherwise specified, the terms "fluoreneyl", "fluorenetriyl", and "fluorenetriyl group" used in this application each mean that in the following structures, R, R', R" and R'" are all functional groups with a monovalent, divalent, or trivalent hydrogen valence. "Substituted fluoreneyl", "substituted fluorenetriyl", or "substituted fluorenetriyl" means that at least one of the substituents R, R', R" and R'" is a substituent other than hydrogen, including cases where R and R' are combined with each other to form a spirocyclic compound with the carbon atom they are bonded to. In this specification, fluoreneyl, fluorenetriyl, and fluorenetriyl may also be referred to as fluoreneyl regardless of their valence (monovalent, divalent, trivalent, etc.).

[0142]

[0143] Furthermore, R, R', R" and R'" can each independently be an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or a heterocyclic group having 2 to 30 carbon atoms. For example, the aryl group can be benzene, biphenyl, naphthalene, anthracene, or phenanthrene, and the heterocyclic group can be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidine, pyrazine, pyrazine, triazine, indole, benzofuran, quinazoline, or quinoxaline. For example, the substituted fluorene and fluoreneyl groups can each be monovalent or divalent functional groups of 9,9-dimethylfluorene, 9,9-diphenylfluorene, and 9,9'-spirocyclodi[9H-fluorene].

[0144] The term "heterocyclic group" used in this application includes not only aromatic rings such as "heteroaryl" or "heteroarylene," but also non-aromatic rings. Unless otherwise specified, it means a ring with 2 to 60 carbon atoms, each including one or more heteroatoms, but is not limited thereto. Unless otherwise specified, the term "heteroatom" used in this application means N, O, S, P, or Si, and "heterocyclic group" means a monocyclic type, ring aggregate, various fused rings, spirocyclic compounds, etc., containing heteroatoms.

[0145] For example, "heterocyclic group" can include compounds containing heteroatomic groups such as SO2 and P=O, in addition to carbon that forms a ring.

[0146]

[0147] The term "ring" used in this application includes monocyclic and polycyclic rings, including not only hydrocarbon rings but also heterocycles containing at least one heteroatom, including aromatic and non-aromatic rings.

[0148] The term "polycyclic" used in this application includes ring assemblies such as biphenyl and terphenyl, fused various rings and spirocyclic compounds, including not only aromatic but also non-aromatic compounds, and not only hydrocarbon rings but also heterocycles containing at least one heteroatom.

[0149] The term "alicyclic" used in this application means cyclic hydrocarbons other than aromatic hydrocarbons, including monocyclic, cyclic aggregates, various fused-ring, spirocyclic compounds, etc., and unless otherwise specified, means a ring with 3 to 60 carbon atoms, but is not limiting. For example, in the case of merging benzene as an aromatic ring and cyclohexane as a non-aromatic ring, it is also considered an alicyclic compound.

[0150] Furthermore, in the case of consecutive prefixes, it means that the substituents are listed in the order they are first described. For example, in the case of arylalkoxy, it means an alkoxy group substituted with an aryl group; in the case of alkoxycarbonyl, it means a carbonyl group substituted with an alkoxy group; and in the case of arcarboxylalkenyl, it means an alkenyl group substituted with an arcarboxyl group, where the arcarboxyl group is a carbonyl group substituted with an aryl group.

[0151] Furthermore, unless otherwise specified, in the term "substituted or unsubstituted" used in this application, "substituted" means selected from deuterium, halogen, amino, nitrile, nitro, C1~C 20 Alkyl, C1~C 20 alkoxy groups, C1~C 20 alkylamine group, C1~C 20 alkylthiophene group, C6~C 20 arylthiophene group, C2~C 20 alkenyl, C2~C 20 alkynyl group, C3~C 20 cycloalkyl, C6~C 20 aryl groups, C6~C groups substituted with deuterium 20 aryl, C8~C 20 Arylalkenyl, silyl, boronyl, germanyl, and C2~C containing a heteroatom selected from the group consisting of O, N, S, Si, and P. 20 The substituent may be selected from the group consisting of heterocyclic groups, or more than one substituent may be used, but is not limited to the substituents mentioned above.

[0152] In this application, the "functional group name" of aryl, arylene, and heterocyclic groups, which are examples of various labels and their substituents, can be written as "the name of the functional group reflecting the valence" or "the name of the initial compound". For example, in the case of "phenanthrene", which is an aryl group, although the name of the group can be written according to the valence, such as "phenanthrene(l)" for a 1-valent group and "extrinsene(l)" for a 2-valent group, it is also written as "phenanthrene" as the name of the initial compound, regardless of the valence.

[0153] Similarly, in the case of pyrimidines, regardless of the valence, it is written as "pyrimidine" or as the "name of the group" with the corresponding valence. For example, in the case of a monovalent group, it is written as pyrimidine(group), and in the case of a divalent group, it is written as pyrimidine(group), etc. Therefore, in this application, when the substituent is written as the name of the initial compound, the n-valence formed by the detachment of hydrogen atoms bonded to the carbon atom and / or heteroatom of the initial compound may be represented as "group".

[0154] Furthermore, in this specification, numbers or letters indicating positions may be omitted when listing compound names or substituent names. For example, pyrido[4,3-d]pyrimidine is listed as pyridopyrimidine, benzofuran[2,3-d]pyrimidine as benzofuranpyrimidine, and 9,9-dimethyl-9H-fluorene as dimethylfluorene, etc. Therefore, both benzene[g]quinoxaline and benzene[f]quinoxaline can be listed as benzenequinoxaline.

[0155] In addition, unless otherwise specified, the chemical formula used in this application shall be applied in the same manner as the definition of substituents as defined by the index of the chemical formula below.

[0156]

[0157] Here, when a is an integer of 0, it means that the substituent R 1 This does not exist; that is, when a is 0, hydrogen atoms are bonded to all carbons forming the benzene ring. In this case, the hydrogen atoms bonded to the carbons can be omitted from the chemical formula or compound description. Furthermore, when a is an integer of 1, one substituent R... 1 When a is an integer of 2 or 3, it can combine with a carbon in the carbon group forming the benzene ring in a similar manner. For example, when a is an integer from 4 to 6, it can combine with a carbon in the benzene ring in a similar manner. When a is an integer greater than 2, R... 1 They can be the same or different.

[0158]

[0159] Unless otherwise stated, in this application, forming a ring means that adjacent bases combine with each other to form a monocyclic ring or a plurality of joined rings. Monocyclic rings and joined polycyclic rings include only hydrocarbon rings, but also heterocyclic rings containing at least one heteroatom, which may include aromatic rings and non-aromatic rings.

[0160] In addition, unless otherwise specified, in this specification, when referring to fused rings, the number in "numerical-fused ring" indicates the number of condensed rings. For example, anthracene, phenanthrene, benzylquinazoline, etc., which are composed of three rings condensed together, can be represented as 3-fused ring.

[0161] In addition, unless otherwise specified, the term "bridged bicyclic compound" used in this application refers to a compound in which two rings share three or more atoms to form a ring. In this case, the shared atoms may include carbon or heteroatoms.

[0162] In this application, organic electronic element means the configuration between a positive electrode and a negative electrode, or may also mean an organic light-emitting diode comprising a positive electrode and a negative electrode and a configuration located between them.

[0163] Furthermore, depending on the context, the display device in this application means organic electrical components, organic light-emitting diodes, and a panel including the aforementioned devices, or it means an electronic device including a panel and circuitry. For example, an electronic device can include lighting devices, solar cells, portable or mobile terminals (e.g., smartphones, tablets, PDAs, electronic dictionaries, PMPs, etc.), navigation terminals, game consoles, various TVs, various computer monitors, etc., but is not limited thereto; any device can be of any form as long as it includes the aforementioned components.

[0164] According to an embodiment of the present invention, a resin composition includes a resin comprising repeating units represented by the following chemical formula (1) and reactive unsaturated compounds, pigments, initiators, dyes, solvents, etc.

[0165] The resin comprising repeating units of the aforementioned chemical formula (1) includes, in its polymer chain, the structures shown in the following chemical formulas (C) and (D). Specifically, the polymer comprising repeating units shown in the aforementioned chemical formula (1) contains chemical formulas (C) and (D) in a ratio of 1:9 to 9:1, thereby possessing a nonlinear structure relative to polymers containing only the structures of the aforementioned chemical formulas (C) or (D).

[0166] Furthermore, the resin, which includes the repeating unit shown in chemical formula (1), also includes a silane compound, thereby improving the adhesion to the substrate. When a photosensitive composition is formed using a resin formed from the repeating unit of chemical formula (1) containing a silane compound, the composition is also well adsorbed onto the substrate after an exposure step or a development step, thereby achieving a high-resolution pixel separation section.

[0167] The following will describe in detail implementation examples of the present invention. However, these are exemplary and not intended to limit the invention, which is defined by the scope of the claims to be described later. The components will now be specifically described.

[0168] (A) Adhesive resin

[0169] An adhesive resin according to an embodiment of the present invention comprises repeating units of the structure shown in the following chemical formula (1):

[0170] Chemical formula (1)

[0171]

[0172] In the chemical formula (1),

[0173] 1) This indicates the portion where chemical bonds are connected by repeating units;

[0174] 2) R 1 and R 2 Independently, they are hydrogen; deuterium; halogen; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl;

[0175] 3) R 1 and R 2 Each can form a ring with its adjacent base;

[0176] 4) a and b are independent integers from 0 to 4;

[0177] 5) X 1It is a single bond, O, CO, SO2, CR'R”, SiR'R”, chemical formula (A) or chemical formula (B); preferably, it is chemical formula (A) or chemical formula (B); more preferably, it is chemical formula (A).

[0178] 6) X 2 Aryl groups of C6 to C30; C2 to C30 aryl groups containing at least one heteroatom selected from O, N, S, Si, and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryl groups; or combinations thereof;

[0179] 7) R' and R” are independently hydrogen; deuterium; halogen; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl;

[0180] 8) R' and R” can each form a ring with an adjacent base;

[0181] 9) A 1 and A 2 They are independently represented by chemical formula (C) or chemical formula (D);

[0182] 10) In the polymer chain of a resin comprising repeating units represented by chemical formula (1), the ratio of chemical formula (C) to chemical formula (D) satisfies 1:9 to 9:1.

[0183] The following is an example of how R' and R” combine to form a ring:

[0184]

[0185] Specific examples of the mentioned chemical formulas (A) and (B) are as follows:

[0186] Chemical formula (A)

[0187]

[0188] Chemical formula (B)

[0189]

[0190] In the chemical formulas (A) and (B),

[0191] 11-1) Indicates the position of chemical bonds;

[0192] 11-2) X3 is O, S, SO2 or NR';

[0193] 11-3) R' is hydrogen; deuterium; halogen; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl;

[0194] 11-4) R 3 ~R 6 Independently, they are hydrogen; deuterium; halogen; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl;

[0195] 11-5) R 3 ~R 6 Each can form a ring with its adjacent base;

[0196] 11) c~f are independent integers from 0 to 4.

[0197] Specific examples of the mentioned chemical formulas (C) and (D) are as follows:

[0198] Chemical formula (C)

[0199]

[0200] Chemical formula (D)

[0201]

[0202] In the chemical formulas (C) and (D),

[0203] 12-1) Indicates the position of chemical bonds;

[0204] 12-2) R 7 ~R 10 Independently, they are hydrogen; deuterium; halogen; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl;

[0205] 12-3) Y 1 and Y 2 They are independently represented by the chemical formula (E) or the chemical formula (F).

[0206] A specific example of the mentioned chemical formula (E) is as follows:

[0207] Chemical formula (E)

[0208]

[0209] Chemical formula (F)

[0210]

[0211] In the aforementioned chemical formulas (E) and (F),

[0212] 13-1) Indicates the position of chemical bonds;

[0213] 13-2) R 11 ~R 15 Independently, they are hydrogen; deuterium; halogen; C6~C 30aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl;

[0214] 13-3)L 1 ~L 3 Independently formed by single bonds, C 1 ~C 30 hydrocarbon group, C 6 ~C 30 aryl or C 2 ~C 30 heterocyclic rings;

[0215] 13-4) g and h are independent integers from 0 to 3; however, g + h = 3;

[0216] 14) The R 1 ~R 15 、R'、R”、X 1 ~X 2 and L 1 ~L 3 The rings formed by the combination of adjacent groups can also be selected from deuterium; halogens; and C1~C1 groups. 30 Alkyl or C6~C 30 aryl-substituted or unsubstituted silyl groups; siloxane groups; boron groups; germanium groups; cyano groups; amino groups; nitro groups; C1~C6 groups 30 alkylthio group; C1~C 30 alkoxy group; C6~C 30 arylalkoxy group; C1~C 30 Alkyl groups; C2~C 30 alkenyl group; C2~C 30 alkynyl group; C6~C 30 aryl group; C6~C substituent with deuterium 30 aryl; fluorene; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P. 30 Heterocyclic group; C3~C 30 alicyclic group; C7~C 30 arylalkyl; C8~C 30 aryl alkenyl groups; and combinations thereof constituting one or more substituents of the group, wherein adjacent substituents may form a ring.

[0217] In the R 1 ~R 15 、R'、R” and X 1 ~X 2 In the case of an aryl group, C6~C is preferred. 30 The aryl group, preferably C6~C 18 Aryl groups, such as benzene, biphenyl, naphthyl, terphenyl, etc.

[0218] In the R 1 ~R 15 、R'、R”、X 1 ~X 2 and L 1 ~L 3 In the case of a heterocyclic group, C2~C is preferred. 30 The heterocyclic group, preferably C2~C 18 Heterocyclic groups, such as dibenzofuran, dibenzothiophene, naphthobenzothiophene, naphthobenzofuran, etc.

[0219] In the R 1 ~R 15 、R'、R” and X 1 ~X 2 In the case of fluorene, 9,9-dimethyl-9H-fluorene, 9,9-diphenyl-9H-fluorene, 9,9'-spirocyclic difluorene, etc. are preferred.

[0220] In the L 1 ~L 3 In the case of valence aryl groups, C6~C is preferred. 30 The aryl group, preferably C6~C 18 arylene compounds, such as benzene, biphenyl, naphthyl, terphenyl, etc.

[0221] In the R 1 ~R 15 When R' and R" are alkyl groups, it is preferred that they are C1-C2. 10 Alkyl groups, such as methyl, t-butyl, etc.

[0222] In the R 1 ~R 15 When R' and R" are alkoxy groups, it is preferred that they are C1~C2. 20 The alkoxy group, more preferably C1~C2, is... 10 Alkyl groups, such as methoxy and t-butoxy.

[0223] The R 1 ~R 15 、R'、R”、X 1 ~X 2 and L1 The rings formed by the bonding of adjacent bases are C6~C 60 Aromatic ring; fluorene group; C2~C2 group containing at least one heteroatom of O, N, S, Si and P. 60 Heterocyclic groups; or C3~C 60 The alicyclic group, for example, when adjacent groups combine to form an aromatic ring, preferably forms a C6~C... 20 The aromatic rings are more effectively formed at C6~C6. 14 Aromatic rings, such as benzene, naphthalene, and phenanthrene.

[0224] In the polymer chain content of the resin comprising the repeating unit shown in the chemical formula (1), preferably, the ratio of chemical formula (E) to chemical formula (F) is 2:0 to 1:1, more preferably 1.5:0.5. If the ratio of chemical formula (F) is higher than the ratio of chemical formula (E), residue may be generated due to excessively high adhesion, and the amount of degassing will increase significantly. When the ratio of chemical formula (E) to chemical formula (F) is 1.5:0.5, the image resolution is optimal, and the amount of degassing is also satisfactory.

[0225] The resin of the present invention has a weight-average molecular weight of 1,000 to 100,000 g / mol, preferably 1,000 to 50,000 g / mol, and more preferably 1,000 to 30,000 g / mol. When the weight-average molecular weight of the resin is within the specified range, there is no residue during the fabrication of the patterned layer, the pattern is well formed, there is no loss of film thickness during development, and a good pattern can be obtained.

[0226] The resin is preferably contained in the amount of the photosensitive resin composition from 1 to 30% by weight, more preferably from 3 to 20% by weight. When the resin is contained in the range described above, excellent photosensitivity, developability, and adhesion can be obtained.

[0227] In addition to the resin, the photosensitive resin composition may also include an acrylic resin. The acrylic resin is a copolymer of a first ethylene unsaturated monomer and a second ethylene unsaturated monomer that can copolymerize therewith, and may be a resin containing one or more repeating acrylic units.

[0228] (B) Reactive unsaturated compounds

[0229] According to an embodiment of the present invention, a photosensitive resin composition comprises a reactive unsaturated compound with the structure of the following chemical formula (2):

[0230] Chemical formula (2)

[0231]

[0232] In the chemical formula (2), two or more of Z1 to Z4 independently possess the structure of the following chemical formula (G); the remaining Z1 to Z4 are independently hydrogen, deuterium, halogen, methyl, ethyl; methyl hydroxyl; C6 to C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl.

[0233] A specific example of the mentioned chemical formula (G) is as follows:

[0234] Chemical formula (G)

[0235]

[0236] In the chemical formula (G),

[0237] 1) t is an integer from 1 to 20;

[0238] 2) L4 is a single bond, C1~C 30 hydrocarbon group, C6~C 30 arylene or C2~C 30 heterocyclic rings;

[0239] 3) Y3 is the chemical formula (H) or chemical formula (I) of the wire harness.

[0240] A specific example of the mentioned chemical formula (H) or chemical formula (I) is as follows:

[0241] Chemical formula (H)

[0242]

[0243] Chemical formula (I)

[0244]

[0245] In the chemical formula (H), R 21 Hydrogen, deuterium, halogen, methyl, ethyl; methyl hydroxyl; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl.

[0246] Multiple acrylic compounds with the structure of chemical formula (2) can be used alone or in combination of two or more. For example, a functionalized ester of methacrylic acid with two ethylene unsaturated double bonds can be used.

[0247] In this specification, "methacrylic acid" may refer to methacrylate, acrylate, or a mixture of methacrylate and acrylate.

[0248] Because the reactive unsaturated compound possesses the ethylene unsaturated double bond, it undergoes sufficient polymerization during exposure in the pattern forming process, thereby forming patterns with good heat resistance, light resistance, and chemical resistance.

[0249] Specific examples of the reactive unsaturated compound are selected from one or more of ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, and trimethylolpropane triacrylate, but are not limited thereto.

[0250] Commercially available products of the reactive unsaturated compounds include, for example, the following:

[0251] Examples of the difunctional esters of methacrylic acid include: Aronix M-210, M-240, M-6200, etc. from Toa Synthetic Chemicals Co., Ltd.; KAYARAD HDDA, HX-220, R-604, etc. from Nippon Kayaku Co., Ltd.; and V-260, V-312, V-335 HP, etc. from Osaka Organic Chemicals Co., Ltd.

[0252] Examples of the trifunctional esters of methacrylic acid include: Aronix M-309, M-400, M-405, M-450, M-7100, M-8030, and M-8060 from Toa Synthetic Chemicals Co., Ltd.; KAYARAD TMPTA, DPCA-20, DPCA-60, and DPCA-120 from Nippon Kayaku Co., Ltd.; and V-295, V-300, and V-360 from Osaka Organic Chemicals Co., Ltd.

[0253] The Chanhe River can be used alone or in combination with two or more other types.

[0254] To impart better developability, the reactive unsaturated compound may be treated with an acid anhydride before use. The reactive unsaturated compound may comprise 1 to 40% by weight, for example, 1 to 20% by weight, relative to the total amount of the photosensitive resin composition. When the reactive unsaturated compound is contained within this range, it results in good reliability and sufficient curing upon exposure during the patterning process, good heat resistance, light resistance, and chemical resistance of the pattern, as well as high resolution and adhesion.

[0255] (C) Initiator

[0256] According to an embodiment of the photosensitive resin composition of the present invention, an initiator having the structure of the following chemical formula (3) is included:

[0257] Chemical formula (3)

[0258]

[0259] In the chemical formula (3),

[0260] 1) u1~u3 are mutually independent integers that are either 0 or 1;

[0261] 2) L5 and L8 are the following chemical formulas (J);

[0262] 3) L6, L7, and L9 are independently C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C3~C 30 alicyclic group; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; C1~C 20 alkoxycarbonyl; C1~C 30 Hydroxyl group or C6~C 30 Alpha-aryl compounds.

[0263] A specific example of the mentioned chemical formula (J) is as follows:

[0264] Chemical formula (J)

[0265]

[0266] In the chemical formula (J), R 31 Hydrogen, deuterium, halogen, methyl, ethyl; methyl hydroxyl; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl.

[0267] Furthermore, more preferably, L6, L7 and L9 of the chemical formula (3) are each one of the following chemical formulas (K) to (N).

[0268] A specific example of the mentioned chemical formulas (K) to (L) is as follows:

[0269] Chemical formula (K)

[0270]

[0271] Chemical formula (L)

[0272]

[0273] Chemical formula (M)

[0274]

[0275] Chemical formula (N)

[0276]

[0277] In the aforementioned chemical formulas (M) and (N),

[0278] 1) A represents hydrogen; O; S; silyl group; siloxane group; boron group; germanium group; cyano group; nitro group; nitrile group; represented by C1~C1. 30 Alkyl groups, C6~C 30 aryl or C2~C 30 The heterocyclic substituted or unsubstituted amino group; C1~C 30 alkylthio group; C1~C 30 Alkyl groups; C1~C 30 alkoxy group; C6~C 30 arylalkoxy group; C2~C 30 alkenyl group; C2~C 30alkynyl group; C6~C 30 aryl group; C6~C substituent with deuterium 30 aryl; fluorene; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P. 30 Heterocyclic group; C3~C 30 alicyclic group; C7~C 30 arylalkyl; C8~C 30 aryl alkenyl groups; and combinations thereof;

[0279] 2) R 32 ~R 34 Independently, they are hydrogen; deuterium; halogen; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl;

[0280] 3) T is S, O or Se.

[0281] According to an embodiment of the present invention, the photosensitive resin composition may be used alone or in combination with two or more of the oxime ester compounds of the chemical formula (3).

[0282] The initiator that can be used in combination with the oxime ester compound is an initiator for photosensitive resin compositions, such as acetophenone compounds, benzophenone compounds, thioxanone compounds, benzoin compounds, triazine compounds, etc.

[0283] Examples of acetophenone compounds include: 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylphenylacetone, pt-butanetrichloroacetophenone, pt-butanedichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)benzene)-2-morpholinopropanol-1-propanone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butane-1-propanone, etc.

[0284] Examples of benzophenone compounds include: benzophenone, benzoyl benzoic acid, benzoyl benzoic acid methyl, 4-benzyl benzophenone, hydroxybenzophenone, benzoyl acrylate, 4,4'-di(dimethylamino)benzophenone, 4,4'-di(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

[0285] Examples of the thioxanthone compounds include: thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, etc.

[0286] Examples of benzoin-like compounds include: benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, etc.

[0287] Examples of the triazine compounds include: 2,4,6-trichloro-s-triazine, 2-benzyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxybenzene)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis( Trichloromethyl)-S-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-S-triazine, bis(trichloromethyl)-6-styryl-S-triazine, 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-S-triazine, 2-(4-methoxynaphtho-1-yl)-4,6-s(trichloromethyl)-S-triazine, 2-4-trichloromethyl(piperyl)-6-triazine, 2-4-trichloromethyl(4'-methoxystyryl)-6-triazine, etc.

[0288] In addition to the compounds mentioned above, the initiator may also be carbazole compounds, diketone compounds, sulfonium borate compounds, diazo compounds, imidazole compounds, non-imidazole compounds, etc.

[0289] The initiator is a free radical polymerization initiator, and peroxide compounds, azobisisobutyronitrile compounds, etc. can be used.

[0290] Examples of the peroxide compounds mentioned include: ketone peroxides such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methyl cyclohexanone peroxide, and acetylacetone peroxide; diacyl peroxides such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, and di-3,5,5-trimethylhexanoyl peroxide; hydroperoxides such as 2,4,4-trimethylpentyl-2-hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide, and t-butyl hydroperoxide; and diisopropylbenzene peroxide, 2,5-dimethyl-2,5-di... Dialkyl peroxides such as (t-butylperoxy)hexane, 1,3-bis(t-butoxyisopropyl)benzene, and t-butylperoxypentanoate n-butyl ester; alkyl peresters such as 2,4,4-trimethylpentylperoxyphenoxyacetic acid, α-diisopropylbenzeneperoxyneodecanic acid, t-butylperoxybenzoate, and di-t-butylperoxytrimethyl adipate; percarbonates such as di-3-methoxybutylperoxybicarbonate, di-2-ethylhexylperoxybicarbonate, di-4-t-butylcyclohexylperoxybicarbonate, diisopropylperoxybicarbonate, acetylcyclohexylsulfonyl peroxide, and t-butylperoxyaryl ester.

[0291] Examples of the azobisisobutyronitrile compounds include: 1,1'-azobisisobutyronitrile cyclohexane-1-carboxylonitrile, 2,2'-azobis(2,4-dimethylpentanonitrile), 2,2'-azobis(methylisobutyric acid), 2,2'-azobis(4-methoxy-2,4-dimethylpentanonitrile), α,α'-azobis(isobutyl nitrite), and 4,4'-azobis(4-cyanopentanoic acid), etc.

[0292] The initiator can be used together with a photosensitizer that, after absorbing light and becoming excited, transfers its energy to undergo a chemical reaction. Examples of such photosensitizers include tetraethylene glycol di-3-mercaptopropionate, pentaerythritol tetra-3-mercaptopropionate, and dipentaerythritol tetra-3-mercaptopropionate.

[0293] The initiator may be contained in 0.01 to 10% by weight, for example, 0.1 to 5% by weight, relative to the total amount of the photosensitive resin composition. When the initiator is contained in the range described above, it ensures sufficient and reliable curing upon exposure during the patterning process, good heat resistance, light resistance, and chemical resistance of the pattern, high resolution and adhesion, and prevents transmittance reduction caused by unreacted initiator.

[0294] (D) Pigment

[0295] To ensure that the pattern has an absorbance greater than 0.5 / µm at a wavelength of 550nm, pigments and dyes can be used independently or together. Both organic and inorganic pigments can be used.

[0296] The pigment can be used alone as black pigment or mixed with red pigment, green pigment, blue pigment, yellow pigment, etc. to produce black.

[0297] Examples of the black pigments mentioned include: benzofuranone black, lactam black, aniline black, dinaphthalene-containing benzene black, titanium black, carbon black, etc. The pigments can be used alone or in mixtures of two or more, and are not limited to the examples mentioned above.

[0298] To effectively cut off light in the light-blocking layer, the aforementioned black pigment can be used. When using the black pigment, it can be used in conjunction with color correctors such as anthraquinone pigments, dinaphthalene-phthalocyanine pigments, phthalocyanine pigments, and azo pigments.

[0299] Examples of the red pigments mentioned include: CI red pigment 254, CI red pigment 255, CI red pigment 264, CI red pigment 270, CI red pigment 272, CI red pigment 177, CI red pigment 89, etc.

[0300] Examples of the green pigments mentioned include halogen-substituted copper phthalocyanine pigments such as CI green pigment 36 and CI green pigment 7.

[0301] Examples of the blue pigments mentioned include: CI blue pigment 15:6, CI blue pigment 15, CI blue pigment 15:1, CI blue pigment 15:2, CI blue pigment 15:3, CI blue pigment 15:4, CI blue pigment 15:5, CI blue pigment 16, etc., copper phthalocyanine pigments.

[0302] Examples of the yellow pigments mentioned include: isoindoline pigments such as CI yellow pigment 139, quinoline yellow pigments such as CI yellow pigment 138, and nickel complex pigments such as CI yellow pigment 150.

[0303] To disperse the pigment in the photosensitive resin composition, a dispersant may be used concurrently. Specifically, the pigment may be pre-treated with a dispersant, or the dispersant may be added together with the pigment during the manufacture of the photosensitive resin composition. The dispersant may be a nonionic dispersant, anionic dispersant, cationic dispersant, etc.

[0304] Specific examples of the dispersants include: polyethylene glycols and their esters, polyoxyethylene, polyol ester epoxy alkyl byproducts, alcohol epoxy alkyl byproducts, sulfonates, sulfonates, carboxylic esters, carboxylates, alkylamide epoxy alkyl byproducts, alkylamines, etc., which can be used alone or in combination of two or more.

[0305] Commercially available dispersants include, for example: BYK's DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, and DISPERBYK-2001; BASF's EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, and EFKA-450; and Zeneka's Solsperse. 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, etc., or Ajinomoto's PB711, PB821, etc.

[0306] The dispersant may be contained in the amount of the photosensitive resin composition from 0.1% to 15% by weight. When the dispersant is contained in the range described above, the photosensitive resin composition exhibits good dispersibility, and therefore good stability, developability, and patternability when manufacturing a light-shielding layer.

[0307] The pigment can be used after pretreatment with water-soluble inorganic salts and wetting agents. As described above, pretreatment of the pigment can refine its primary particle size. The pretreatment may include: a step of kneading the pigment together with water-soluble inorganic salts and a wetting agent, and a step of filtering and washing the pigment obtained in the kneading step. The kneading can be carried out at a temperature of 40°C to 100°C, and the filtering and washing can be performed after washing away the inorganic salts with water or the like.

[0308] The water-soluble inorganic salts include, for example, sodium chloride and potassium chloride, but are not limited thereto.

[0309] The wetting agent acts as a medium to ensure that the pigment and the water-soluble organic salt are mixed evenly and that the pigment is easy to pulverize. Examples of wetting agents include: ethylene glycol monoethyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, and other diol monoalkyl ethers; alcohols such as ethanol, isopropanol, butanol, n-hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, and glycerol polyethylene glycol. These can be used alone or in combination of two or more.

[0310] The pigments obtained through the kneading step can have an average particle size of 20 nm to 110 nm. When the average particle size of the pigment is within this range, it exhibits good heat resistance and lightfastness, and can effectively form fine patterns.

[0311] In addition, specific examples of the dyes mentioned include: CI solvent dyes such as CI solvent yellow 4, 14, 15, 16, 21, 23, 24, 38, 56, 62, 63, 68, 79, 82, 93, 94, 98, 99, 151, 162, 163, etc.; and CI solvent red 8, 45, 49, 89, 111, 122, 125, 130, 132, 146, 179, etc. Red dyes; CI solvent orange dyes 2, 7, 11, 15, 26, 41, 45, 56, 6, etc.; CI solvent blue dyes 5, 35, 36, 37, 44, 59, 67, 70, etc.; CI solvent violet dyes 8, 9, 13, 14, 36, 37, 47, 49, etc.; CI solvent green dyes 1, 3, 4, 5, 7, 28, 29, 32, 33, 34, 35, etc.

[0312] Among the CI solvent dyes, the preferred ones are CI Solvent Yellow 14, 16, 21, 56, 151, 79, 93, which have good solubility in organic solvents; CI Solvent Red 8, 49, 89, 111, 122, 132, 146, 179; CI Solvent Orange 41, 45, 62; CI Solvent Blue 35, 36, 44, 45, 70; and CI Solvent Violet 13. Especially preferred are Solvent Yellow 21, 79; CI Solvent Red 8, 122, 132; and CI Solvent Orange 45, 62.

[0313] In addition, as CI acid dyes, there are CI Acid Yellows 1, 3, 7, 9, 11, 17, 23, 25, 29, 34, 36, 38, 40, 42, 54, 65, 72, 73, 76, 79, 98, 99, 111, 112, 113, 114, 116, 119, 123, 128, 134, 135, 138, 139, 140, 144, 150, 155, 157, 160, 161, 163, 168, 169, 172, 177, 178, 179, 184, 190, 193, 196, 197, 199, 202, 203, 204, 205, 207, 212, and 214. Yellow dyes including 220, 221, 228, 230, 232, 235, 238, 240, 242, 243, and 251; and Acid Red CI 1, 4, 8, 14, 17, 18, 26, 27, 29, 31, 34, 35, 37, 42, 44, 50, 51, 52, 57, 66, 73, 80, 87, 88, 91, 92, 94, 97, 103, 111, 114, 129, 133, 134, 138, 143, 145, 150, 151, 158, 176, 182, 183, 198, 206, 211, 215, 216, 217, 227, 228, 249, and 252. Red dyes including 257, 258, 260, 261, 266, 268, 270, 274, 277, 280, 281, 195, 308, 312, 315, 316, 339, 341, 345, 346, 349, 382, ​​383, 394, 401, 412, 417, 418, 422, 426, etc.; Acid Orange (CI) dyes including 6, 7, 8, 10, 12, 26, 50, 51, 52, 56, 62, 63, 64, 74, 75, 94, 95, 107, 108, 169, 173, etc.; Acid Blue (CI) dyes including 1, 7, 9, 15, 18, 23, 25, 27, 29, 40, 42, etc. Blue dyes including 45, 51, 62, 70, 74, 80, 83, 86, 87, 90, 92, 96, 103, 112, 113, 120, 129, 138, 147, 150, 158, 171, 182, 192, 210, 242, 243, 256, 259, 267, 278, 280, 285, 290, 296, 315, 324:1, 335, 340; purple dyes including CI Acid Violet 6B, 7, 9, 17, 19, 66; and green dyes including CI Acid Green 1, 3, 5, 9, 16, 25, 27, 50, 58, 63, 65, 80, 104, 105, 106, 109.

[0314] The preferred acid dyes are CI Acid Yellow 42, CI Acid Red 92, CI Acid Blue 80 and 90, CI Acid Violet 66, and CI Acid Green 27, which have good solubility in the solvent.

[0315] In addition, as direct CI dyes, there are CI Direct Yellows 2, 33, 34, 35, 38, 39, 43, 47, 50, 54, 58, 68, 69, 70, 71, 86, 93, 94, 95, 98, 102, 108, 109, 129, 136, 138, 141, etc.; and CI Direct Reds 79, 82, 83, 84, 91, 92, 96, 97, 98, 99, 105, 106, 107, 172, 173, 176, 177, 179, 181, 182, 184, 204, 2 Red dyes including 07, 211, 213, 218, 220, 221, 222, 232, 233, 234, 241, 243, 246, and 250; Direct Orange (CI) dyes including 34, 39, 41, 46, 50, 52, 56, 57, 61, 64, 65, 68, 70, 96, 97, 106, and 107; Direct Blue (CI) dyes including 38, 44, 57, 70, 77, 80, 81, 84, 85, 86, 90, 93, 94, 95, 97, 98, 99, 100, 101, 106, and 107. 108, 109, 113, 114, 115, 117, 119, 137, 149, 150, 153, 155, 156, 158, 159, 160, 161, 162, 163, 164, 166, 167, 170, 171, 172, 173, 188, 189, 190, 192, 193, 194, 196, 198, 199, 200, 207, 209, 210, 212, 213, 214, 222, 228, 229, 237, 238, 242, 24 Blue dyes such as 3, 244, 245, 247, 248, 250, 251, 252, 256, 257, 259, 260, 268, 274, 275, and 293; purple dyes such as CI direct violet 47, 52, 54, 59, 60, 65, 66, 79, 80, 81, 82, 84, 89, 90, 93, 95, 96, 103, and 104; and green dyes such as CI direct green 25, 27, 31, 32, 34, 37, 63, 65, 66, 67, 68, 69, 72, 77, 79, and 82.

[0316] In addition, as CI Mordant dyes, there are yellow dyes such as CI Mordant Yellow 5, 8, 10, 16, 20, 26, 30, 31, 33, 42, 43, 45, 56, 61, 62, and 65; and red dyes such as CI Mordant Red 1, 2, 3, 4, 9, 11, 12, 14, 17, 18, 19, 22, 23, 24, 25, 26, 30, 32, 33, 36, 37, 38, 39, 41, 43, 45, 46, 48, 53, 56, 63, 71, 74, 85, 86, 88, 90, 94, and 95. Mordant orange dyes 3, 4, 5, 8, 12, 13, 14, 20, 21, 23, 24, 28, 29, 32, 34, 35, 36, 37, 42, 43, 47, 48, etc.; CI Mordant blue dyes 1, 2, 3, 7, 8, 9, 12, 13, 15, 16, 19, 20, 21, 22, 23, 24, 26, 30, 31, 32, 39, 40, 41, 43, 44, 48, 49, 53, 61, 74, 77, 83, 84, etc.; CI Mordant purple dyes 1, 2, 4, 5, 7, 14, 22, 24, 30, 31, 32, 37, 40, 41, 44, 45, 47, 48, 53, 58, etc.; CI Mordant green dyes 1, 3, 4, 5, 10, 15, 19, 26, 29, 33, 34, 35, 41, 43, 53, etc.

[0317] In this invention, the dyes can be used individually or in combination of two or more.

[0318] The pigments and dyes may comprise 5 to 40% by weight relative to the total amount of the photosensitive resin composition, more specifically 8 to 30% by weight. When the pigments are contained within the range described, they exhibit an absorbance greater than 0.5 / µm at a wavelength of 550 nm, resulting in good pattern curing and adhesion.

[0319] (F) Solvent

[0320] The solvent may be a substance that is compatible with the adhesive resin, the reactive unsaturated compound, the pigment and the initiator, but reacts with them.

[0321] Examples of solvents include: alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, isopentyl ether, methyl phenyl ether, and tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; acetic acid solvents such as methyl acetic acid, ethyl acetic acid, and diethyl acetic acid; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, and diethylene glycol diethyl ether; and propylene glycol methyl ether acetate. Propylene glycol alkyl ether acetates such as propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-dipentanone, and 2-heptanone; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; lactate esters such as methyl lactate and ethyl lactate; oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, and butyl oxyacetate; methoxyacetic acid methyl ester and methoxy... Ethyl acetate, methoxyethyl acetate, methyl ethoxyacetate, ethyl ethoxyacetate, and other alkyl alkoxyacetic acid esters; methyl 3-oxypropionate, ethyl 3-oxypropionate, and other alkyl 3-oxypropionate esters; methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, and other alkyl 3-alkoxypropionate esters; methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, and other alkyl 2-oxypropionate esters; methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, etc. Esters, such as methyl 2-ethoxypropionate and other alkyl 2-alkoxypropionates; alkyl 2-oxo-2-methylpropionates such as methyl 2-oxo-2-methylpropionate and ethyl 2-oxo-2-methylpropionate; monooxymonocarboxylic acid alkyl esters of alkyl 2-alkoxy-2-methylpropionates such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate, and methyl 2-hydroxy-3-methylbutyrate; keto esters such as ethyl pyruvate, etc.

[0322] In addition, high-boiling-point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformaniline, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, phenethyl ether, dodecyl ether, acetylacetone, isophorone, hexanoic acid, octanoic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenylacetic acid cellosol can also be used.

[0323] Considering compatibility and reactivity, the solvent may be ethylene glycol ethers such as ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; and propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate.

[0324] The solvent may be included as a balance relative to the total amount of the photosensitive resin composition, specifically 50 to 90% by weight. When the solvent is included in this range, the processability of the patterned layer is good because the photosensitive resin composition has appropriate properties.

[0325] Additionally, further embodiments of the present invention may provide a display device.

[0326] The display device according to the present invention includes a first electrode formed on a substrate, a pixel separation portion formed on the first electrode to partially expose the first electrode, and a second electrode disposed relative to the first electrode, wherein the pixel separation portion is formed of a photosensitive resin composition having a polymer essential component having the structural unit shown in the chemical formula (1) as the main component.

[0327] In the display device according to an embodiment of the present invention, the content of the photosensitive resin composition is the same as that of the photosensitive resin composition described above according to an embodiment of the present invention, and therefore will not be repeated here.

[0328] The polymer of the photosensitive resin composition can be formed, for example, by coating the photosensitive resin composition onto a TFT substrate and curing the coated photosensitive resin composition.

[0329] The pixel separation section, containing the polymerized reactants of the photosensitive resin composition, can possess excellent resolution and a high cone angle.

[0330] The display device includes a plurality of pixels, and the pixel separation portion may be a layer that distinguishes the plurality of pixels.

[0331] For example, the pixels of the display device include light-emitting elements, which may be organic light-emitting elements (see reference). Figure 2 The organic light-emitting element can, for example, have a TFT layer 3 containing TFTs 2 formed on a substrate 1, and after forming a planarization layer thereon, a first electrode 5, a pixel separation portion 6, a plurality of layers 7, and a second electrode 8 are sequentially laminated. As an example, the pixel separation portion 6 is located on the first electrode, and the pixel separation portion may have an opening on the first electrode. The plurality of layers are provided within the opening and on the first electrode, and the second electrode is provided on the plurality of layers. Since the light-emitting area of ​​a pixel depends on the opening area of ​​the pixel separation portion, the pixel separation portion may be a pixel definition layer.

[0332] In addition, the pixel separation section can serve as a light-shielding layer to block light.

[0333] The pixel separation section according to the present invention may have a high taper angle 9. For example, the tilt angle of the pattern layer according to an embodiment of the present invention may be 20 degrees to 40 degrees. The tilt angle may be the tilt angle between the point where the tilt begins and the direction parallel to the display surface.

[0334] The pixel separation portion, which serves as the pixel definition layer, has an opening, while the inclined portion connecting the opening and the non-opening portion has an angle.

[0335] According to an embodiment of the present invention, the pixel separation section includes a polymerization reactant of the aforementioned photosensitive resin composition, which can form a pattern layer without residue. During the pattern formation process, a high cone angle can be achieved by suppressing melt flow.

[0336] Therefore, the pixel separation section with a high cone angle can shorten the length of the inclined section and the distance between the openings, thereby allowing for denser pixels and enabling the display device to have a high resolution.

[0337] Furthermore, preferably, the pixel separation portion according to the present invention is formed to cover the edge portion of the first electrode, and the thickness of the pixel separation portion is 0.5 to 10 µm.

[0338] In another implementation, the aforementioned photosensitive resin composition can be patterned on the organic light-emitting element electrode to form pixel separation portions.

[0339] The following describes specific examples and embodiments of synthesis according to the present invention, but the examples and embodiments of synthesis according to the present invention are not limited thereto.

[0340] (Synthesis example 1)

[0341] (Preparation of Compound 1-1)

[0342] 20 g of 9,9'-bisphenol fluorene (Sigma-Aldrich), 8.67 g of glycidyl chloride (Sigma-Aldrich), 30 g of anhydrous potassium carbonate, and 100 ml of dimethylformamide were added to a 300 ml three-necked round-bottom flask equipped with a distillation tube. The mixture was heated to 80 °C and reacted for 4 hours. The temperature was then lowered to 25 °C and the reaction solution was filtered. The filtrate was then stirred with 1000 ml of water, filtered, and the precipitated powder was added dropwise. After washing, the mixture was dried under pressure at 40 °C to obtain compound 1-1 (25 g). The purity of the obtained powder was analyzed by HPLC, and the results showed a purity of 98%.

[0343] <Compound 1-1>

[0344]

[0345] (Synthesis example 2)

[0346] (Preparation of compounds 2-1 to 2-3)

[0347] 25 g (54 mmol) of compound 1-1 obtained in Synthesis Example 1, 8 g of acrylic acid (Ōi Kakin), 0.2 g of benzyltriethylammonium chloride (Ōi Kakin), 0.2 g of hydroquinone (Ōi Kakin), and 52 g of toluene (Sigma-Aldrich) were added to a 300 ml three-necked round-bottom flask equipped with a distillation tube and stirred at 110 °C for 6 hours. After the reaction was completed, the toluene was distilled under reduced pressure to obtain the product. 500 g of silica gel 60 (230-400 mesh, Merck) was packed into a 220 mm diameter glass column, followed by 20 g of the product. The product was separated using 10 L of a solvent containing hexane and ethyl acetate in a 4:1 volume ratio to isolate compounds 2-1 to 2-3.

[0348] <Compound 2-1>

[0349]

[0350] <Compound 2-2>

[0351]

[0352] <Compounds 2-3>

[0353]

[0354] (Synthetic Examples 3 to 9)

[0355] (Manufacturing of polymers 1-1 to 1-7)

[0356] As shown in Table 1 below, compounds 2-1, 2-2, and 2-3 obtained in Synthesis Example 2 were each added to a 50 ml three-necked round-bottom flask equipped with a distillation tube. 0.1 g of tetraethylammonium bromide (Ōi Kakin), 0.03 g of hydroquinone (Ōi Kakin), and 8.05 g of propylene glycol methyl ether acetate (Sigma-Aldrich) were added to the same flask. 1.22 g of biphenyltetracarboxylic acid dianhydride (Mitsubishi Gas) and 0.38 g of tetrahydrophthalic acid (Sigma-Aldrich) were then added, and the mixture was stirred at 110 °C for 6 hours. After the reaction was complete, the reaction solution was recovered, yielding polymers 1-1 to 1-7, containing repeating units such as compounds 2-1, 2-2, and 2-3, in a form containing 45% solids. The weight-average molecular weight (Mw) of the synthesized polymers was analyzed using silica gel filter chromatography (Agilent Technologies).

[0357] Table 1

[0358]

[0359] (Synthesis Example 10)

[0360] (Preparation of compound 3-1)

[0361] In a three-necked flask equipped with a distillation tube connected to cooling water, 20 g (0.147 mol) of trichlorosilane (Gelest) and 17.51 ​​g (0.147 mol) of 6-chloro-1-hexene (Aldrich) were dissolved in 200 ml of ethyl acetate. 0.02 g of a platinum (O)-1,3-diethylene-1,1,3,3-tetramethyldisiloxane solution (2 wt% in xylene / Aldrich) was added, nitrogen gas was introduced, and the mixture was heated to 75°C and reacted for 5 hours. The solution was then filtered through a 0.1 µm Teflon membrane to remove the platinum catalyst. Subsequently, 15.6 g (0.487 mol) of methanol was added dropwise over 30 minutes at room temperature. The mixture was then heated again to 50°C and reacted for another 2 hours. The reaction solution was then distilled under reduced pressure to remove the solvent. 24 g (0.1 mol) of 6-Chlorohexyltrimethoxysilane obtained above, 8 g (0.15 mol) of sodium methoxide (Aldrich), 187 ml (0.15 mol) of hydrogen sulfide THF solution (0.8 M concentration), and 100 ml of methanol were added to an autoclave and reacted at 100 °C for 2 hours. After cooling the reaction solution, 100 ml of hydrogen chloride in methanol (1.25 M concentration) was added dropwise over 30 minutes at room temperature. After filtering to remove the generated salt, compound 3-1 (23 g) was obtained by vacuum distillation.

[0362] <Compound 3-1>

[0363]

[0364] (Synthesis Example 11)

[0365] (Preparation of compound 3-2)

[0366] In Synthesis Example 10, except that 23.7 g (0.147 mol) of 9-Chloro-1-nonene (AK Scientific) was used instead of 6-chloro-1-hexene, compound 3-2 (24 g) could be synthesized by the same method as in Synthesis Example 10 to obtain compound 3-2.

[0367] <Compound 3-2>

[0368]

[0369] (Synthesis Example 12)

[0370] (Preparation of compound 3-3)

[0371] In Synthesis Example 10, except that 30 g (0.147 mol) of 12-Chloro-1-dodecene (Atomax Chemicals) was used instead of 6-chloro-1-hexene, compound 3-3 (26 g) was synthesized by the same method as in Synthesis Example 10 to obtain compound 3-3.

[0372] <Compound 3-3>

[0373]

[0374] (Synthesis Example 13)

[0375] (Preparation of compounds 3-4)

[0376] In Synthesis Example 10, except that 22.4 g (0.487 mol) of ethanol (Aldrich) was used instead of methanol after the removal of platinum, compounds 3-4 (24 g) could be synthesized by the same method as in Synthesis Example 10 to obtain compounds 3-4.

[0377] <Compounds 3-4>

[0378]

[0379] (Synthesis Example 14)

[0380] (Preparation of compounds 3-5)

[0381] In Synthesis Example 10, except that 36 g (0.487 mol) of n-butanol (Aldrich) was used instead of methanol after platinum removal, compounds 3-5 (27 g) could be synthesized by the same method as in Synthesis Example 10 to obtain compounds 3-5.

[0382] <Compounds 3-5>

[0383]

[0384] (Synthesis Example 15)

[0385] (Preparation of compounds 3-6)

[0386] In Synthesis Example 10, except that 18 g (0.147 mol) of methyldichlorosilane was used instead of trichlorosilane, compounds 3-6 (22 g) could be synthesized by the same method as in Synthesis Example 10 to obtain compounds 3-6.

[0387] <Compounds 3-6>

[0388]

[0389] (Synthesis Example 16)

[0390] (Manufacturing of polymer 2-1)

[0391] Add 6.36 g (34 mmol) of KBM 803 [3-(Trimethoxysilyl)-1-propanethiol] (Shinetsu Corporation) as compound 3-7 to 360 g of a solution of polymer 1-1 prepared in Synthesis Example 3, heat to 60 °C and stir for 4 hours to obtain Cardo-type adhesive resin polymer 2-1, which is a silane alternative to compound 3-7.

[0392] <Compounds 3-7>

[0393]

[0394] (Synthetic Examples 17 to 22)

[0395] (Manufacturing of polymers 2-2 to 2-7)

[0396] Except that in Synthesis Example 16, the solution of polymer 1-1 was replaced by polymers 1-2 to 1-7 as described in Table 2 below, Cardo-type adhesive resin polymers 2-2 to 2-7 were prepared in the same manner as in Synthesis Example 16.

[0397] The weight average molecular weights of polymers 2-1 to 2-7 synthesized in Synthesis Examples 16 to 22 are shown in Table 2 below.

[0398] Table 2

[0399]

[0400] (Synthesis example 23)

[0401] (Manufacturing of polymer 3-1)

[0402] Add 8.1 g (34 mmol) of 6-(Trimethoxysilyl)-1-hexanethiol (compound 3-1) to 360 g of a solution of polymer 1-1 prepared in Synthesis Example 3, heat to 60°C and stir for 4 hours to obtain Cardo-type adhesive resin polymer 3-1, which is a silane alternative to compound 3-1.

[0403] (Synthesis Examples 24 to 29)

[0404] (Manufacturing of polymers 3-2 to 3-7)

[0405] Except that in Synthesis Example 23, the solution of polymer 1-1 was replaced by polymers 1-2 to 1-7 as described in Table 3 below, Cardo-type adhesive resin polymers 3-2 to 3-7 were manufactured in the same manner as in Synthesis Example 23.

[0406] The weight-average molecular weights of polymers 3-1 to 3-7 synthesized in Synthesis Examples 23 to 29 are shown in Table 3 below.

[0407] Table 3

[0408]

[0409] (Synthesis Example 30)

[0410] (Manufacturing of Polymer 4-1)

[0411] Add 9.53 g (34 mmol) of 6-(Triethoxysilyl)-1-hexanethiol (compound 3-4) to 360 g of a solution of polymer 1-1 prepared in Synthesis Example 3, heat to 60°C and stir for 4 hours to obtain Cardo-type adhesive resin polymer 4-1, which is a silane alternative to compound 3-4.

[0412] (Synthetic Examples 31 to 36)

[0413] (Manufacturing of polymers 4-2 to 4-7)

[0414] Except that in Synthesis Example 30, the solution of polymer 1-1 was replaced by polymers 1-2 to 1-7 as described in Table 4 below, Cardo-type adhesive resin polymers 4-2 to 4-7 were manufactured in the same manner as in Synthesis Example 30.

[0415] The weight average molecular weights of polymers 4-1 to 4-7 synthesized in Synthesis Examples 30 to 36 are shown in Table 3 below.

[0416] Table 4

[0417]

[0418] (Synthesis Example 37)

[0419] (Preparation of compound 4-1)

[0420] 20 g of pentaerythritol (Sigma-Aldrich), 42.77 g of acrylic acid (Sigma-Aldrich), and 100 g of toluene were added together into a 300 ml three-necked round-bottom flask equipped with a distillation tube and a separation tube. After adding 1 g of sulfuric acid, the mixture was heated to 110 °C and reacted for 8 hours. Then, the temperature was lowered to 25 °C. The reaction solution was washed three times with 200 ml of 10 wt% Na2CO3 aqueous solution and once with 200 ml of water. The upper organic solution was then dried under reduced pressure at 40 °C to obtain compound 4-1 (50 g).

[0421] <Compound 4-1>

[0422]

[0423] (Synthesis Example 38)

[0424] (Preparation of compound 5-1)

[0425] In a 300 mL three-necked round-bottom flask under N2 atmosphere, 10 g of 1-methoxynaphthalene (TCI) and 12.7 g of 3-oxo-3-phenylpropanoyl chloride were added along with 120 mL of dichloroethane. After stirring and dissolving, the mixture was cooled to 5 °C. 9.27 g of aluminum trichloride (Aldrich) was slowly added over 30 minutes, followed by stirring for 1 hour. The mixture was then heated to room temperature and stirred for 2 hours. 100 mL of 1N HCl aqueous solution was added to the reaction mixture, and after stirring, the mixture was filtered through a filter. Several layers were observed, and the mixture was washed three times with 100 mL of distilled water. The solution was then distilled under reduced pressure, and 13.4 g of compound 5-1 was obtained by silica gel column chromatography.

[0426] <Compound 5-1>

[0427]

[0428] (Synthesis Example 39)

[0429] (Preparation of compound 5-2)

[0430] 10 g of compound 5-1 obtained in Synthesis Example 38 and 27.8 g of N,N-dimethylformamide (Aldrich) were dissolved in a 100 mL three-necked round-bottom flask under a nitrogen atmosphere. After cooling to 5°C, 5.5 g of 35 wt% HCl aqueous solution and 8 g of isobutyl acetate (Aldrich) were added dropwise to the reactor over 30 minutes, and the reaction was allowed to proceed for 10 hours. After the reaction, the mixture was washed five times with 100 mL of distilled water, and then distilled under reduced pressure. The resulting product was separated using a silica gel column chromatography to obtain 5.48 g of compound 5-2.

[0431] <Compound 5-2>

[0432]

[0433] (Synthesis Example 40)

[0434] (Preparation of compound 5-3)

[0435] In a 100 mL three-necked round-bottom flask under N2 atmosphere, 5 g of compound 5-2 obtained in Synthesis Example 39 and 1.4 g of acetyl chloride were dissolved together with 50 mL of dichloroethane. The flask was cooled to 5 °C, and 1.8 g of triethylamine was added dropwise over 30 minutes. The mixture was then heated to room temperature and stirred for 2 hours. After washing three times with 100 mL of distilled water, the mixture was distilled under reduced pressure, and 4.5 g of compound 5-3 was obtained by silica gel column chromatography.

[0436] <Compound 5-3>

[0437]

[0438] (Manufacturing Example 1)

[0439] (Preparation of black pigment dispersion)

[0440] A dispersion can be obtained by dispersing 15g of black pigment (BASF, Irgaphor® Black S0100CF), 8.5g of Disperbyk 163 (BYK), 5.5g of V259ME (Nippon Steel Chemical), 71g of propylene glycol methyl ether acetate, and 100g of zirconia beads with a diameter of 0.5mm (Toray) for 10 hours using a paint mixer (Asada).

[0441] (Examples 1 to 10)

[0442] The following combinations are used to manufacture photosensitive liquids.

[0443] Table 5

[0444]

[0445] (Comparative Examples 1 to 7)

[0446] The following combinations are used to manufacture photosensitive liquids.

[0447] Table 6

[0448]

[0449] The method for manufacturing the light-shielding layer using the combined liquids according to Tables 3 and 4 is as follows (photolithography steps):

[0450] (1) Coating and film formation steps

[0451] Using a spin coater, a thickness of 1.5µm was applied to a 10cm layer after washing. After coating the aforementioned black photosensitive resin composition onto a 10cm ITO / Ag substrate, the solvent is removed by heating at 100°C for 1 minute to form a coating film.

[0452] (2) Exposure steps

[0453] To form the desired pattern on the obtained coating, a photochemical irradiation with rays ranging from 190 nm to 500 nm is performed after inserting a mask of a specified shape. An MA-6 exposure machine is used, with an exposure dose of 100 mJ / cm². 2 .

[0454] (3) Development step

[0455] Following the exposure step, the image is developed by dipping the image in AZEM's AX 300 MIF developer at 25°C for 1 minute. The unexposed portion is then washed away with water to remove it, thus retaining the exposed portion to form the image pattern.

[0456] (4) Post-processing steps

[0457] To obtain patterns with good heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength, and storage safety, the developed image pattern is post-baked in an oven at 230°C for 30 minutes.

[0458] (5) Degassing measurement

[0459] Following steps (1), (2), (3), and (4) above, the photosensitive compositions of Examples 1 to 10 and Comparative Examples 1 to 5 were coated onto a glass substrate and then cut into 1cm x 3cm pieces, with 6 samples prepared for each. Using JAI's JTD-505Ⅲ, the samples were degassed at 250°C for 30 minutes. Toluene identification samples (100, 500, and 1,000 ppm) were measured using a Shimadzu QP2020 GC / MS, and calibration curves were established to measure the amount of degassed samples.

[0460] The amount of degassing generated by the pattern thus obtained and the maximum resolution of the pattern formed on the substrate (the smallest pattern size on the substrate) are shown in Tables 7 and 8.

[0461] Table 7

[0462]

[0463] Table 8

[0464]

[0465] As shown in Table 7, in Examples 1 to 5 where polymers 1-1 to 1-5 without silane substituents were used as adhesive resins, a tendency for lower degassing was observed compared to Examples 6 to 10 where polymers 2-1 to 2-5 containing silane substituents were used as adhesive resins.

[0466] Furthermore, in Examples 6 to 10, the lowest size pattern on the substrate tends to be smaller compared to Examples 1 to 5. This is because when using a silane-substituted adhesive resin, the adhesion to the substrate is improved, resulting in increased degassing after the PR process, although the resolution of the final pattern is improved.

[0467] Comparative Examples 1 to 4 in Table 8 also exhibit similar tendencies to Examples 1 to 10. In Comparative Examples 3 and 4, which use polymers 2-6 and 2-7 with substituted silane substituents, compared to Comparative Examples 1 and 2, which use polymers 1-6 and 1-7 without substituted silane substituents, it can be confirmed that the resolution is improved and the amount of degassing is increased due to the smaller size of the lowest-sized pattern on the substrate.

[0468] Comparing Examples 1 to 10 in Table 7 with Comparative Examples 1 to 4 in Table 8, in the case of polymers 1-6, 1-7, 2-6, and 2-7 used in Comparative Examples 1 to 4, the polymer backbone is polymerized to form a monomer, which, according to the structure of the monomer, has a linear shape relative to polymers 1-1 to 1-5 and polymers 2-1 to 2-5.

[0469] In contrast, in the cases of polymers 1-1 to 1-5 and polymers 2-1 to 2-5 used in Examples 1 to 10, since the polymer backbone is polymerized with three monomers having different structures, it has a network structure compared to polymers 1-6, 1-7, 2-6 and 2-7.

[0470] Polymers 1-1 to 1-5 and polymers 2-1 to 2-5, due to their structural characteristics, exhibit more effective intermolecular bonding with their surrounding compounds, making them more suitable for photolithography. Therefore, compared to Comparative Examples 1 to 4, Examples 1 to 10 show higher resolution and lower degassing during the development process.

[0471] In addition, in Comparative Example 5 of Table 8, when acrylic adhesive (SR-6100) was used as the adhesive resin, it was confirmed that the resolution and degassing characteristics were not significantly reduced compared to Examples 1 to 10 and Comparative Examples 1 to 4.

[0472] (Example 11)

[0473] (Fabrication of blue organic light-emitting elements)

[0474] After patterning the pixel separation portion on an ITO substrate using a 20µm x 20µm hole pattern photomask with the same method as the photolithography step described in Table 5, an organic light-emitting element was manufactured as follows:

[0475] First, using hole patterning, a N1-(naphthalen-2-yl)-N4,N4-bis(4-(naphthalen-2-yl(phenyl)amino)phenyl)-N1-phenylbenzene-1,4-diamine film with a thickness of 60 nm is vacuum deposited on the observable ITO layer (anode) as a hole injection layer.

[0476] On the hole injection layer, a hole transport layer is formed by vacuum deposition of 4,4-bis[N-(1-naphthyl)-N-phenylamino]biphenyl with a thickness of 60 nm.

[0477] On the hole transport layer, 9,10-bis(2-naphthyl)anthracene is used as the host and BD-052X (Idemitsu Kosan) is used as the dopant, with a weight doping ratio of 93:7 for host and dopant, thereby depositing a 30 nm thick light-emitting layer.

[0478] On the light-emitting layer, ((1,1'-bisphenyl)-4-olate)bis(2-methyl-8-quinolinolate)alumium) is vacuum-deposited at a thickness of 10 nm as a hole-blocking layer.

[0479] On the hole blocking layer, Tris(8-quinolinol) aluminum is deposited as an electron transport layer with a thickness of 40 nm.

[0480] Subsequently, LiF, a 0.2 nm thick alkali halide metal, was deposited as the electron injection layer, followed by Al, a 150 nm thick layer, as the cathode, thus completing the fabrication of the organic light-emitting element.

[0481] (Comparative Example 8)

[0482] (Fabrication of blue organic light-emitting elements)

[0483] In Example 11, the organic light-emitting element was fabricated in the same manner as in Example 11, except that the photosensitive composition of Comparative Example 6 in Table 6 was used instead of the photosensitive composition of Example 6.

[0484] (Comparative Example 9)

[0485] (Fabrication of blue organic light-emitting elements)

[0486] In Example 11, the organic light-emitting element was fabricated in the same manner as in Example 11, except that the photosensitive composition of Comparative Example 7 in Table 6 was used instead of the photosensitive composition of Example 6.

[0487] The optical density and reflectance of the pixel separation portion of the organic light-emitting elements manufactured as described in Examples 11 and Comparative Examples 8 to 9 were measured using a UV / Vis Lambda 365 (Perkin Elmer). The measured values ​​are recorded in Table 9. Furthermore, a forward bias DC voltage was applied to the organic light-emitting elements of Examples 11 and Comparative Example 8, such as... Figure 1 As shown, visibility is compared in the field.

[0488] Table 9

[0489]

[0490] As shown in Example 11 of Table 9, the pixel separation section formed using the composition containing the black pigment dispersion of Manufacturing Example 1 exhibits an optical density of 1.1 per µm in the 550 nm wavelength region, where human visibility is optimal, and a reflectance of 3.4% in the 550 nm wavelength region. In contrast, the pixel separation sections of Comparative Examples 8 and 9 formed using compositions not containing the black pigment dispersion of Manufacturing Example 1 exhibit a transparent color and, due to reflection from the lower electrode, exhibit a reflectance more than 20 times that of the pixel separation section of Example 11.

[0491] A forward bias DC voltage of 6.0V was applied to the organic electroluminescent elements of Example 11 and Comparative Example 8 manufactured as described above, such as... Figure 1 As shown, visibility was compared in the field. The results of comparing the luminescence of the elements under the same voltage showed that the outdoor visibility of the organic electroluminescent element of Example 11, which uses the composition containing the black pigment dispersion of Manufacturing Example 1 to form a black pixel separation part, was better than that of the organic electroluminescent element of Comparative Example 8.

[0492] The above description is only used to illustrate the present invention by way of example. Those skilled in the art can make various modifications to the present invention without departing from the spirit and scope of the present invention.

[0493] Therefore, the embodiments disclosed in this specification are illustrative of the invention and not intended to limit it. The spirit and scope of the invention are not limited by these embodiments. The scope of protection of this invention should be interpreted by the claims, and all technologies falling within the same scope should be covered by the claims of this invention.

Claims

1. A photosensitive resin composition, comprising: A resin comprising repeating units as shown in chemical formula (1); a reactive unsaturated compound comprising compounds as shown in chemical formula (2); an initiator; a pigment; and a residual solvent, wherein the pigment is a black pigment used alone or a pigment that exhibits black by mixing red, green, blue, and yellow pigments. The photosensitive resin composition comprises 1 to 30% by weight of the resin and 1 to 40% by weight of the reactive unsaturated compound relative to the total amount of the photosensitive resin composition. Chemical formula (1) In the chemical formula (1), 1) This indicates the portion where chemical bonds are connected by repeating units; 2) R 1 and R 2 Independently, they are hydrogen; deuterium; or C1~C 20 Alkyl groups; 3) R 1 and R 2 Each can form a ring with its adjacent base; 4) a and b are independent integers from 0 to 4; 5) X 1 It is CR'R", SiR'R", or chemical formula (A); 6) X 2 C6~C 30 Aryl groups; C2~C containing Si 30 Heterocyclic groups; or C6~C 30 Fused ring groups of alicyclic and aromatic rings; 7) R' and R” are independently C6~C 30 Aryl groups; C2~C containing Si 30 Heterocyclic groups; or C6~C 30 Fused ring groups of alicyclic and aromatic rings; 8) R' and R” can each form a ring with an adjacent base; 9) A 1 and A 2 They are independently of each other, and are chemical formula (C) or chemical formula (D), wherein both chemical formula (C) and chemical formula (D) are present in the polymer chain of the resin comprising repeating units represented by chemical formula (1), and within the polymer chain of the resin comprising repeating units represented by chemical formula (1), the ratio of chemical formula (C) and chemical formula (D) satisfies 1:9 to 9:

1. Chemical formula (A) In the chemical formula (A), 10-1) Indicates the position of chemical bonds; 10-2) R 3 ~R 4 Independently, they are hydrogen; deuterium; C2~C containing Si. 30 Heterocyclic groups; or C6~C 30 Fused ring groups of alicyclic and aromatic rings; 10-3) c~d are independent integers from 0 to 4; Chemical formula (C) Chemical formula (D) In the above chemical formulas (C) and (D), 11-1) Indicates the position of chemical bonds; 11-2) R 7 ~R 10 Independently, they are hydrogen; deuterium; C2~C containing Si. 30 Heterocyclic groups; or C1~C 20 Alkyl groups; 11-3) Y 1 and Y 2 They are independently represented by chemical formula (E) or chemical formula (F); Chemical formula (E) Chemical formula (F) In the above chemical formulas (E) and (F), 12-1) Indicates the position of chemical bonds; 12-2) R 11 ~R 15 Independently, they are hydrogen; deuterium; C2~C containing Si. 30 Heterocyclic groups; or C1~C 20 Alkyl groups; 12-3)L 1 ~L 3 Each is independently a single bond or C1~C 30 The alkylene group; 12-4) g and h are independent integers from 0 to 3; however, g + h = 3; 13) The R 1 ~R 4 R 7 ~R 15 、R'、R”、X 1 ~X 2 and L 1 ~L 3 The ring formed by the combination of adjacent groups can also be selected from deuterium; using C1~C 30 Alkyl-substituted or unsubstituted silyl groups; C1~C 30 Alkyl groups; and C2~C groups containing Si. 30 The heterocyclic group constitutes one or more substituents of the group, and a ring may be formed between adjacent substituents; and Chemical formula (2) In the above chemical formula (2), two or more of Z1 to Z4 independently possess the structure of the following chemical formula (G); and the remaining Z1 to Z4 are independently hydrogen; methyl hydroxyl; C2 to C3 containing at least one heteroatom of O, N, S and P. 30 Heterocyclic groups; C1~C 20 alkoxy; carbonyl; ether; or C1~C 20 alkoxycarbonyl; Chemical formula (G) In the above chemical formula (G), 1) Indicates the position of chemical bonds; 2) t is an integer from 1 to 20; 3) L4 is a single bond or C1~C 30 The alkylene group; 4) Y3 has the following chemical formula (H) or chemical formula (I): Chemical formula (H) Chemical formula (I) In the above chemical formulas (H) and (I), Indicates the position of chemical bonds; and R 21 Hydrogen, deuterium, and C2~C containing Si 30 Heterocyclic groups; or C1~C 20 Alkyl groups.

2. The photosensitive resin composition according to claim 1, characterized in that: The resin has a weight average molecular weight of 1,000 to 100,000 g / mol.

3. The photosensitive resin composition according to claim 1, characterized in that: The pigments include at least one of benzofuranones, indolones, lactams, dinaphthalene-based benzophenones, titanium-based organic pigments, and carbon black.

4. The photosensitive resin composition according to claim 1, characterized in that: The photosensitive resin composition contains 0.01 to 10% by weight of the initiator relative to the total amount of the photosensitive resin composition.

5. The photosensitive resin composition according to claim 1, characterized in that: The initiator comprises a compound represented by the following chemical formula (3): Chemical formula (3) In the above chemical formula (3), 1) u1~u3 are mutually independent integers that are either 0 or 1; 2) L5 and L8 are the following chemical formulas (J); 3) L6, L7, and L9 are independently C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C3~C 30 alicyclic group; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; carbonyl group; ether group; C1~C 20 alkoxycarbonyl; C1~C 30 Hydroxyl group or C6~C 30 Alpha-aryl; Chemical formula (J) In the chemical formula (J), Indicates the position of chemical bonds; and R 31 Hydrogen; deuterium; halogen; methyl hydroxyl; C6~C 30 aryl group; C2~C containing at least one heteroatom selected from O, N, S, Si and P. 30 Heterocyclic group; C6~C 30 Fused ring groups of alicyclic and aromatic rings; C1~C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; carbonyl group; ether group; or C1~C 20 alkoxycarbonyl.

6. The photosensitive resin composition according to claim 5, characterized in that: L6, L7, and L9 of the chemical formula (3) are each independently one of the following chemical formulas (K) to (N): Chemical formula (K) Chemical formula (L) Chemical formula (M) Chemical formula (N) In the chemical formulas (K) to (N), 1) A represents hydrogen; O; S; silyl group; siloxane group; boron group; germanium group; cyano group; nitro group; nitrile group; represented by C1~C1. 30 Alkyl groups, C6~C 30 aryl or C2~C 30 The heterocyclic substituted or unsubstituted amino group; C1~C 30 alkylthio group; C1~C 30 Alkyl groups; C1~C 30 alkoxy group; C6~C 30 arylalkoxy group; C2~C 30 alkenyl group; C2~C 30 alkynyl group; C6~C 30 aryl group; C6~C substituent with deuterium 30 aryl group; C2~C2-C2 containing at least one heteroatom selected from the group consisting of O, N, S, Si and P. 30 Heterocyclic group; C3~C 30 alicyclic group; C7~C 30 arylalkyl; C8~C 30 aryl alkenyl groups; or combinations thereof; 2) R 32 ~R 34 Independently, they are hydrogen; deuterium; halogen; C6~C 30 Aryl groups; C2-C30 heterocyclic groups containing at least one heteroatom selected from O, N, S, Si, and P; C6-C30 fused-ring groups of alicyclic and aromatic rings; C1-C 20 Alkyl groups; C2~C 20 alkenyl group; C2~C 20 alkynyl group; C1~C 20 alkoxy group; C6~C 30 aryloxy group; carbonyl group; ether group; or C1~C20 alkoxycarbonyl group; 3) T is S, O, or Se. 4) Indicates the position of chemical bonds.

7. A display device comprising a first electrode formed on a substrate, a pixel separation portion formed on the first electrode to partially expose the first electrode, and a second electrode disposed relative to the first electrode, characterized in that: The pixel separation section is formed from the photosensitive resin composition according to claim 1.

8. The display device according to claim 7, characterized in that: The pixel separation section covers the edge portion of the first electrode.

9. The display device according to claim 7, characterized in that: The thickness of the pixel separation section is 0.5 to 10 µm.

10. The display device according to claim 7, characterized in that: The optical density of the pixel separation section is greater than 0.5 per 1µm at a wavelength of 550nm.

11. An electronic device comprising a display device according to claim 7 and a control unit for driving the display device.

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