Heat plate and heat dissipating device

Abstract

The application discloses a kind of heat plate and heat sink device.The heat plate includes: first cover plate, with first side, first side is spaced apart with multiple support parts, the gap between multiple support parts is interconnected and forms a heat dissipation cavity;Second cover plate, with second side, second side is oppositely arranged with first side, the edge of second side is sealedly connected with the edge of first side, and second side is provided with multiple capillary grooves, multiple hydrophilic nanoparticles are accumulated in the groove wall of each capillary groove, the gap between multiple nanoparticles is communicated, and the end of support part close to second cover plate is abutted on the groove wall of capillary groove, and each capillary groove is communicated with heat dissipation cavity.The above-mentioned heat plate can improve the capillary pressure of capillary channel as a whole under the premise that the water storage capacity of capillary groove does not change greatly, and the heat dissipation effect is better.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation, and more specifically to a heat dissipation plate and a heat dissipation device. Background Technology

[0002] With the advent of the 5G era, mobile phone chips are processing more and more information, resulting in higher power consumption and heat generation, which places higher demands on mobile phone cooling systems. Ultra-thin vapor chambers (VCs), with their excellent heat dissipation and ultra-thin structure, are gradually becoming the standard configuration for 5G mobile phone cooling systems. A vapor chamber is a vacuum cavity with a microstructure on its inner wall. When heat is conducted from the heat source to the heating end, the liquid working fluid in the vacuum cavity begins to vaporize. The vaporized liquid fills the entire vacuum cavity. When the vaporized liquid reaches the condensation end, it begins to liquefy, releasing the heat accumulated during evaporation. The liquefied liquid then flows back to the heating end through the microstructured capillary channels, and this cycle repeats continuously.

[0003] Currently, the capillary core of the heat spreader is mainly composed of a sintered porous inner wall, a copper mesh, or a composite of a porous inner wall and a copper mesh. In the process of realizing this application, the inventors discovered that the prior art has at least the following problems: the existing capillary channels have a contradiction between capillary force and water storage capacity. In order to improve the capillary force of the capillary channels, it is necessary to reduce the size of the channel (effective meniscus radius). However, when the width of the channel is reduced, a large depth cannot be obtained, which will ultimately greatly reduce the water storage capacity of the channel. Summary of the Invention

[0004] In view of the above, it is necessary to propose a heat spreader and heat dissipation device to solve the above problems.

[0005] One embodiment of this application provides a heat spreader, comprising:

[0006] A first cover plate has a first side, on which a plurality of supporting portions are spaced apart, and the gaps between the plurality of supporting portions are interconnected to form a heat dissipation cavity; and

[0007] The second cover plate has a second side, which is disposed opposite to the first side. The edge of the second side is sealed to the edge of the first side. The second side is provided with a plurality of capillary grooves. A plurality of hydrophilic nanoparticles are deposited in the groove wall of each capillary groove. The gaps between the plurality of nanoparticles are interconnected. The end of the support near the second cover plate abuts against the groove wall of the capillary groove. Each capillary groove is connected to the heat dissipation cavity.

[0008] The capillary groove wall of the above-mentioned heat spreader is filled with multiple hydrophilic nanoparticles. The gaps between the multiple nanoparticles are connected to form new capillary channels. Under the premise of ensuring that the water storage capacity of the capillary groove does not change significantly, the nanoparticles accumulated on the surface of the capillary groove wall can increase the overall capillary pressure of the capillary channels, ensuring that there is enough liquid working fluid to flow smoothly from the first cover plate to the second cover plate when the heat spreader is working, resulting in good heat dissipation effect.

[0009] In some embodiments, a plurality of the nanoparticles are continuously and uniformly stacked on the walls of the capillary channel.

[0010] In this way, the gaps between multiple nanoparticles connect to form new capillary channels. At the same time, the high surface energy of the nanoparticles macroscopically increases the surface tension of the capillary grooves and enhances the capillary pressure of the capillary channels.

[0011] In some embodiments, the nanoparticles form a plurality of dispersed stacked structures, a plurality of granular structures, or a plurality of stacked structures and granular structures coexisting, wherein the plurality of stacked structures or the plurality of granular structures are each discontinuous.

[0012] In this way, each discontinuous stacked structure and each granular structure can form a new capillary channel. The high surface energy of nanoparticles increases the surface tension of the capillary grooves on a macroscopic level, thereby enhancing the capillary pressure of the capillary channels.

[0013] In some embodiments, a plurality of the nanoparticles are stacked in a dotted or mesh-like manner on the wall of the capillary channel.

[0014] In this way, the gaps between multiple nanoparticles connect to form new capillary channels. At the same time, the high surface energy of the nanoparticles macroscopically increases the surface tension of the capillary grooves and enhances the capillary pressure of the capillary channels.

[0015] In some embodiments, the stacking thickness of the nanoparticles is 0.1 μm-20 μm.

[0016] In this way, not only is the water storage capacity of the capillary tank guaranteed, but the capillary pressure of the capillary channel is also guaranteed.

[0017] In some embodiments, the diameter of each nanoparticle is 2 nm to 5000 nm.

[0018] The surface of particles of this size contains suspended hydroxyl groups or surface-active oxygen atoms. The hydrophilicity of the particle surface makes the surface of the formed capillary channel and the interior of the nanoparticles hydrophilic. At the same time, the high surface energy of the nanoparticles macroscopically increases the surface tension of the capillary groove and enhances the capillary pressure of the capillary channel.

[0019] In some embodiments, the nanoparticles are one or more materials such as titanium dioxide, silicon dioxide, calcium carbonate, zinc oxide, aluminum oxide, cerium carbonate, cerium oxide, cerium fluoride, copper oxide, or cuprous oxide.

[0020] Once this material reaches the nanoscale, its surface will have suspended hydroxyl groups or surface-active oxygen atoms. The hydrophilicity of its particle surface will make the surface of the formed capillary channel and the interior of the nanoparticles hydrophilic. At the same time, the high surface energy of the nanoparticles will macroscopically increase the surface tension of the capillary groove and enhance the capillary pressure of the capillary channel.

[0021] In some embodiments, a plurality of capillary grooves are arranged side by side, and the groove wall between two adjacent capillary grooves is provided with a communication port, and the communication ports on the groove walls of two adjacent capillary grooves are staggered.

[0022] This prevents the liquid working medium in the capillary tank from vaporizing and drying out, thus ensuring timely replenishment.

[0023] In some embodiments, the depth of each capillary groove in the direction perpendicular to the second cover plate is greater than or equal to the width of the capillary groove in the direction parallel to the second cover plate.

[0024] This increases the capillary force of the liquid working medium in the capillary tank, ensuring that the liquefied liquid working medium can flow back into the capillary tank at a relatively fast speed.

[0025] In some embodiments, the width of the capillary groove is 20μm-150μm, and the depth of the capillary groove is 20μm-200μm.

[0026] This increases the capillary force of the liquid working medium in the capillary tank, ensuring that the liquefied liquid working medium can flow back into the capillary tank at a relatively fast speed.

[0027] This application also provides a heat dissipation device, including the heat spreader described above.

[0028] The heat dissipation device described above has multiple hydrophilic nanoparticles deposited in the capillary groove wall of the heat spreader plate. The gaps between the multiple nanoparticles are connected to form new capillary channels. Under the premise of ensuring that the water storage capacity of the capillary groove does not change significantly, the nanoparticles deposited on the surface of the capillary groove wall can increase the overall capillary pressure of the capillary channels, ensuring that there is enough liquid working fluid to flow smoothly from the first cover plate to the second cover plate when the heat spreader plate is working, resulting in a better heat dissipation effect. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the assembly structure of the heat spreader and the chip according to an embodiment of the present invention.

[0030] Figure 2 This is a schematic diagram of the heat spreader in an embodiment of the present invention.

[0031] Figure 3 yes Figure 2 A partial enlarged view of the first embodiment at point III.

[0032] Figure 4 yes Figure 2 A bottom view of multiple support components.

[0033] Figure 5 yes Figure 2 A top view of multiple capillary grooves.

[0034] Figure 6 yes Figure 2 A partial enlarged view of point III in the second embodiment.

[0035] Figure 7 yes Figure 2 A partial enlarged view of point III in the third embodiment.

[0036] Figure 8 yes Figure 2 A partial enlarged view of point III in the fourth embodiment.

[0037] Figure 9 yes Figure 2 A partial enlarged view of section III in the fifth embodiment.

[0038] Explanation of main component symbols

[0039] Heat spreader 100

[0040] Chip 200

[0041] First cover plate 10

[0042] First side 12

[0043] Support section 14

[0044] Heat dissipation cavity 16

[0045] Second cover plate 20

[0046] Second side 22

[0047] Capillary groove 24

[0048] 26 tank walls

[0049] Connector 28

[0050] Nanoparticles 30

[0051] Gap 32 Detailed Implementation

[0052] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0053] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0054] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0055] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0056] The following disclosure provides many different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0057] Please see Figure 1 An embodiment of the present invention provides a heat spreader 100 disposed on one side of the chip 200 for cooling the chip 200. Please refer to [link to relevant documentation]. Figure 2 The heat spreader 100 includes a first cover plate 10 and a second cover plate 20.

[0058] The first cover plate 10 has a first side 12, and a plurality of support portions 14 are provided at intervals on the first side 12. Please refer to [link / reference]. Figure 3 The gaps between the multiple support portions 14 are interconnected to form a heat dissipation cavity 16. The second cover plate 20 has a second side 22, which is disposed opposite to the first side 12, and the edge of the second side 22 is sealed to the edge of the first side 12. The second side 22 is provided with multiple capillary grooves 24, and multiple hydrophilic nanoparticles 30 are deposited in the groove wall of each capillary groove 24. The gaps 32 between the multiple nanoparticles 30 are interconnected. The end of the support portion 14 near the second cover plate 20 abuts against the groove wall 26 of the capillary groove 24, and each capillary groove 24 is connected to the heat dissipation cavity 16. In this embodiment, the edge of the second side 22 and the edge of the first side 12 are sealed together by welding (diffusion welding).

[0059] In this embodiment, the first side 12 is provided with a protruding structure, which surrounds the outside of the support portion 14 and is sealed to the edge of the second side 22.

[0060] It is understood that before use, a liquid working medium needs to be injected into the heat spreader 100. This liquid working medium includes, but is not limited to, water, alcohol or other media.

[0061] The capillary groove 24 of the heat spreader 100 has multiple hydrophilic nanoparticles 30 deposited in its walls. The gaps 32 between the multiple nanoparticles 30 are connected to form new capillary channels. Under the premise that the water storage capacity of the capillary groove 24 does not change significantly, the nanoparticles 30 deposited on the surface of the capillary groove 24 can increase the overall capillary pressure of the capillary channels, ensuring that the heat spreader 100 has enough liquid working fluid to flow smoothly from the first cover plate 10 to the second cover plate 20 during operation, resulting in better heat dissipation.

[0062] The first cover plate 10 is generally plate-shaped. The thickness of both the first cover plate 10 and the second cover plate 20 is 20μm-200μm. This allows for a thinner and lighter heat spreader 100 while meeting the required strength. However, when the thickness of both the first cover plate 10 and the second cover plate 20 is less than 20μm, the overall thickness of the heat spreader 100 is relatively thin, making processing more difficult, and the strength of the heat spreader 100 cannot meet the requirements, making it prone to deformation during use. When the thickness of both the first cover plate 10 and the second cover plate 20 is greater than 200μm, the overall thickness of the heat spreader 100 is relatively large, which is not conducive to achieving the current thinner and lighter requirements. In this embodiment, the thicknesses of the first cover plate 10 and the second cover plate 20 are equal.

[0063] Please see Figure 4 The support portion 14 is generally a columnar structure. The cross-section of the support portion 14 can be rectangular, circular, elliptical, or triangular, etc. The length, width, or diameter of the cross-section of the support portion 14 is 20μm-150μm; the height of the support portion 14 is 20μm-150μm. This ensures the strength of the support portion. However, when the height of the support portion 14 is less than 20μm, the volume of the heat dissipation cavity 16 is small, the heat dissipation space is small, the thermal resistance of the vaporized liquid working fluid is large, and the diffusion rate is slow, resulting in poor heat dissipation. When the height of the support portion 14 is greater than 150μm, the overall thickness of the heat spreader 100 is large, which is not conducive to achieving the current requirements for thinness and lightness.

[0064] The gap between each support 14 and its adjacent support 14 is 0.1mm-2mm. This results in low thermal resistance and rapid diffusion of the vaporized liquid working fluid upon reaching the heat dissipation cavity, allowing it to quickly contact and liquefy cooler areas (e.g., the support 14), leading to rapid liquid return. However, when the gap between each support 14 and its adjacent support 14 is less than 0.1mm, the vaporized liquid working fluid has high thermal resistance and slow diffusion, resulting in poor heat dissipation. When the gap between each support 14 and its adjacent support 14 is greater than 2mm, the number of support 14 is insufficient, hindering the liquefaction and reflux of the vaporized liquid working fluid.

[0065] The second cover plate 20 is generally plate-shaped. The capillary grooves 24 are obtained by etching on the second side 22. See also... Figure 5Multiple capillary grooves 24 are arranged side by side. The groove wall 26 between two adjacent capillary grooves 24 is provided with a connecting port 28. The connecting ports 28 on the groove wall 26 of two adjacent capillary grooves 24 are staggered. On two adjacent groove walls 26, one groove wall 26 is provided with N connecting ports 28, and the other groove wall 26 is provided with N+1 connecting ports 28, where N is an integer, and the arrangement is cyclical. For example, if there are 12 groove walls 26, the number and arrangement of the connecting ports 28 on the 12 groove walls 26 are 3, 4, 3, 4, 3, 4, 3, 4, 3, 4, 3, 4.

[0066] The depth of each capillary groove 24 in the direction perpendicular to the second cover plate 20 is greater than or equal to the width of the capillary groove 24 in the direction parallel to the second cover plate 20. In this way, the capillary force of the liquid working medium in the capillary groove 24 can be increased, ensuring that the liquefied liquid working medium can flow back into the capillary groove 24 at a faster speed.

[0067] The width of the capillary groove 24 is 20μm-150μm. This results in low thermal resistance and rapid diffusion of the vaporized liquid working fluid, allowing it to quickly contact and liquefy cooler areas (e.g., the support portion, the groove wall), leading to fast liquid return. However, when the width of the capillary groove 24 is less than 20μm, etching becomes more difficult and costly; when the width of the capillary groove 24 is greater than 150μm, it hinders the return of the liquefied liquid working fluid.

[0068] The depth of the capillary groove 24 is 20μm-200μm. This ensures the strength of the groove wall. However, when the depth of the capillary groove 24 is less than 20μm, it can hold less liquid working fluid, which is not conducive to heat dissipation; when the depth of the capillary groove 24 is greater than 200μm, the overall thickness of the heat spreader 100 is large, which is not conducive to achieving the current requirements for thinness and lightness.

[0069] The first cover plate 10 and the second cover plate 20 are both made of oxygen-free copper, copper alloy, or stainless steel. These materials have good thermal conductivity, allowing the liquid working fluid to quickly absorb heat and vaporize. The vaporized liquid working fluid can then quickly liquefy upon contact with these materials, resulting in high heat dissipation efficiency.

[0070] The area coverage of nanoparticles 30 on the wall of capillary groove 24 is 30% to 100%, that is, the wall of capillary groove 24 can be a continuous nanoparticle stacking structure or a locally continuous nanoparticle stacking structure.

[0071] Please continue reading Figure 3 In the first embodiment of this application, a plurality of nanoparticles 30 are continuously and uniformly stacked on the wall of the capillary groove 24.

[0072] In this way, the gaps 32 between multiple nanoparticles 30 are connected to form new capillary channels. At the same time, the high surface energy of the nanoparticles 30 increases the surface tension of the capillary groove 24 macroscopically, thereby increasing the capillary pressure of the capillary channels.

[0073] Please see Figure 6 In the second embodiment of this application, a plurality of nanoparticles 30 are uniformly stacked in a dotted or mesh-like manner on the wall of the capillary groove 24.

[0074] In this way, the gaps 32 between multiple nanoparticles 30 are connected to form new capillary channels. At the same time, the high surface energy of the nanoparticles 30 increases the surface tension of the capillary groove 24 macroscopically, thereby increasing the capillary pressure of the capillary channels.

[0075] Please see Figure 7 In the third embodiment of this application, multiple nanoparticles 30 form multiple dispersed stacked structures on the wall of the capillary groove 24, and the multiple stacked structures are discontinuous among themselves.

[0076] Understandably, the stacked structure is composed of multiple single-layer nanoparticles stacked together. The stacked shape can be triangular, rectangular, or trapezoidal. In this embodiment, it is triangular.

[0077] Please see Figure 8 In the fourth embodiment of this application, multiple nanoparticles 30 form multiple dispersed granular structures on the wall of the capillary groove 24, and the multiple granular structures are discontinuous among themselves.

[0078] Understandably, the granular structure consists of single-layer nanoparticles.

[0079] Please see Figure 9 In the fifth embodiment of this application, multiple nanoparticles 30 form multiple dispersed stacked structures and multiple granular structures on the wall of the capillary groove 24, and the multiple stacked structures and multiple granular structures are discontinuous among themselves.

[0080] In this way, each discontinuous stacked structure and each granular structure can form a new capillary channel. The high surface energy of the nanoparticles macroscopically increases the surface tension of the capillary groove 24 and enhances the capillary pressure of the capillary channel.

[0081] It should be noted that in the porous structure formed by the nanoparticles 30 on the wall of the capillary groove 24, there are minute gaps between the nanoparticles 30, and these gaps are interconnected. According to the capillary pressure formula, ΔP = 2σcoθ / r, where σ is the surface tension; θ is the solid-liquid contact angle; and r is the hydraulic diameter of the liquid flow space. Although the gaps 32 between the nanoparticles 30 are not equal, the hydraulic diameter of the liquid flow space formed by these continuous gaps is 1-2 orders of magnitude smaller than the size of the capillary groove 24 of the heat exchanger 100. Therefore, the capillary pressure of its porous surface structure is much greater than that of the capillary groove 24 of the heat exchanger 100. During operation, the liquid working fluid can fill the microstructure of the capillary groove 24 and then fill the porous structure above the wall of the capillary groove 24. When the capillary pressure of the large structure of the capillary channel 24 is insufficient to make the liquid working medium flow from the second cover plate 20 to the first cover plate 10, the porous structure of the capillary channel 24 wall can be filled with the liquid working medium. Through the hydrogen bonding between the liquid working medium (such as water), the liquid working medium can continue to flow in the large structure of the channel.

[0082] In some embodiments, the stacking thickness of the nanoparticles 30 is 0.1 μm-20 μm. This ensures not only the water storage capacity of the capillary groove 24 but also the capillary pressure of the capillary channel.

[0083] In some embodiments, the diameter of each nanoparticle 30 is 2nm-5000nm. The surface of particles of this size has suspended hydroxyl groups or surface-active oxygen atoms. The hydrophilicity of the particle surface makes the surface of the formed capillary channel and the interior of the nanoparticle 30 hydrophilic. At the same time, the high surface energy of the nanoparticle 30 macroscopically increases the surface tension of the capillary groove 24 and enhances the capillary pressure of the capillary channel.

[0084] Nanoparticles 30 are one or more materials such as titanium dioxide, silicon dioxide, calcium carbonate, zinc oxide, aluminum oxide, cerium carbonate, cerium oxide, cerium fluoride, copper oxide, or cuprous oxide. When such materials reach the nanoscale, their surfaces will have suspended hydroxyl groups or surface-active oxygen atoms. The hydrophilicity of the particle surface will make the surface of the formed capillary channel and the interior of the nanoparticles 30 hydrophilic. Simultaneously, the high surface energy of the nanoparticles 30 macroscopically increases the surface tension of the capillary groove 24, thereby enhancing the capillary pressure of the capillary channel.

[0085] Embodiments of this application also propose a heat dissipation device (not shown), including the heat spreader 100 described above.

[0086] In the heat dissipation device described above, the capillary groove 24 of the heat dissipation plate 100 has multiple hydrophilic nanoparticles 30 deposited in its groove wall. The gaps 32 between the multiple nanoparticles 30 are connected to form new capillary channels. Under the premise of ensuring that the water storage capacity of the capillary groove 24 does not change significantly, the nanoparticles 30 deposited on the surface of the capillary groove 24 can increase the overall capillary pressure of the capillary channels, ensuring that the heat dissipation plate 100 has enough liquid working fluid to flow smoothly from the first cover plate 10 to the second cover plate 20 when it is working, resulting in a better heat dissipation effect.

[0087] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be incorporated into the present invention.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A heat spreader, characterized in that, include: A first cover plate has a first side, and a plurality of support portions are spaced apart on the first side, with the gaps between the plurality of support portions communicating with each other to form a heat dissipation cavity. and The second cover plate has a second side, which is disposed opposite to the first side. The edge of the second side is sealed to the edge of the first side. The second side is provided with a plurality of capillary grooves. A plurality of hydrophilic nanoparticles are deposited in the groove wall of each capillary groove. The gaps between the plurality of nanoparticles are connected. The end of the support near the second cover plate abuts against the second side. Each capillary groove is connected to the heat dissipation cavity. Multiple capillary grooves are arranged side by side, and the groove wall between two adjacent capillary grooves is provided with a communication port, and the communication ports on the groove wall of two adjacent capillary grooves are staggered. The depth of each capillary groove in the direction perpendicular to the second cover plate is greater than or equal to the width of the capillary groove in the direction parallel to the second cover plate. The nanoparticles form multiple dispersed stacked structures, and each of the multiple stacked structures is discontinuous.

2. The heat spreader as described in claim 1, characterized in that, The stacking thickness of the nanoparticles is 0.1 μm-20 μm.

3. The heat spreader as described in claim 1, characterized in that, Each of the nanoparticles has a diameter of 2nm-5000nm.

4. The heat spreader as described in claim 1, characterized in that, The nanoparticles are one or more of the following materials: titanium dioxide, silicon dioxide, calcium carbonate, zinc oxide, aluminum oxide, cerium carbonate, cerium oxide, cerium fluoride, copper oxide, or cuprous oxide.

5. The heat spreader as described in claim 1, characterized in that, The width of the capillary groove is 20μm-150μm, and the depth of the capillary groove is 20μm-200μm.

6. A heat dissipation device, characterized in that, Includes the heat spreader as described in any one of claims 1-5.

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