Electronic device

Abstract

An electronic device is disclosed. The electronic device includes a display panel; and an input sensor on the display panel, wherein the input sensor is configured to operate in a first mode during which the input sensor detects a first input of a touch from a user or in a second mode during which the input sensor detects a second input from an input device, wherein the input sensor includes a first sensing portion configured to detect the first input and the second input, and a second sensing portion configured to identify the input device.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2020-0128294, filed on October 5, 2020, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0002] Some aspects of embodiments of the present invention relate to an electronic device. Background Technology

[0003] Electronic devices can detect external inputs applied from external sources outside the device. External inputs can be, for example, user input. User inputs can include, for example, touch input from a body part, light, heat, a pen, pressure, or various other types of external inputs. Electronic devices can use electromagnetic resonance (EMR) or active electrostatic discharge (AES) to identify the pen's coordinate information.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background art, and therefore, the information discussed in this background section does not necessarily constitute prior art. Summary of the Invention

[0005] Some aspects of embodiments of the present invention relate to an electronic device, for example, to an electronic device having relatively improved detection reliability.

[0006] Some aspects of embodiments of the present invention include an electronic device with relatively improved detection reliability.

[0007] Some embodiments of the present invention include an electronic device in which an active pen sensing electrode and a touch sensing electrode are separated from each other to reduce noise and increase detection sensitivity.

[0008] According to some embodiments of the present invention, an electronic device includes: a display panel; and an input sensor, wherein the input sensor operates on the display panel in a first mode for detecting a first input from a user's touch or in a second mode for detecting a second input from an input device. The input sensor may include: a first sensing unit for detecting the first input and the second input; and a second sensing unit for identifying the input device.

[0009] According to some embodiments, when the second sensing unit recognizes the input device, the input sensor can operate in a second mode.

[0010] According to some embodiments, the first sensing unit may include: a plurality of first sensing electrodes arranged in a first direction, and each of the plurality of first sensing electrodes extending in a second direction intersecting the first direction; and a plurality of second sensing electrodes arranged in the second direction, and each of the plurality of second sensing electrodes extending in the first direction.

[0011] According to some embodiments, the second sensing unit may include: a plurality of third sensing electrodes, each of the plurality of third sensing electrodes being between two adjacent first sensing electrodes among a plurality of first sensing electrodes and between two adjacent second sensing electrodes among a plurality of second sensing electrodes; and a plurality of bridging electrodes connecting the plurality of third sensing electrodes to each other.

[0012] According to some embodiments, the input sensor may include: an effective region, in which a first sensing unit and a second sensing unit are positioned; and a peripheral region, adjacent to the effective region, in which multiple wiring lines are positioned. The effective region may include: a first region, in which a first sensing electrode and a second sensing electrode are positioned; and a second region, adjacent to the first region, in which multiple dummy electrodes are positioned.

[0013] According to some embodiments, a third sensing electrode may be positioned within a portion of the second region. A dummy electrode may not be positioned within said portion of the second region.

[0014] According to some embodiments, the input sensor may further include an input driving circuit that provides a first signal to a first sensing unit to detect a first input or a second input and provides a second signal to a second sensing unit to identify an input device.

[0015] According to some embodiments, the input sensor can send a second signal to the input device. The second signal can be considered as an uplink signal.

[0016] According to some embodiments, the first signal may include a downlink signal received from an input device to detect a second input.

[0017] According to some embodiments, the first sensing electrode, the second sensing electrode, and the third sensing electrode may be on the same layer. The bridging electrode may be on a different layer than the layer on which the first sensing electrode, the second sensing electrode, and the third sensing electrode are positioned.

[0018] According to some embodiments, the second sensing unit may further include a plurality of auxiliary electrodes on the same layer as the third sensing electrode and on which bridging electrodes are positioned.

[0019] According to some embodiments, the input sensor can provide a signal to multiple auxiliary electrodes whose phase is opposite to that of the signal applied to a third sensing electrode.

[0020] According to some embodiments, multiple auxiliary electrodes may be stacked not only with the third sensing electrode, but also with at least one of the first sensing electrode and the second sensing electrode.

[0021] According to some embodiments, the input sensor may further include: a first wiring line connected to a first sensing electrode; a second wiring line connected to a second sensing electrode; and a third wiring line connected to a third sensing electrode.

[0022] According to some embodiments, the input sensor may also include multiple auxiliary wiring lines that connect multiple auxiliary electrodes to the input drive circuit.

[0023] According to some embodiments of the present invention, an electronic device may include: a display panel; and an input sensor, wherein the input sensor includes a sensing area and a dummy area adjacent to the sensing area on the display panel, the sensing area including a first sensing portion, and the dummy area including a second sensing portion. The first sensing portion may include a first sensing electrode and a second sensing electrode provided with a first signal to detect input from an input device or a user's touch. The second sensing portion may include a third sensing electrode provided with a second signal to identify the input device. The first and second sensing electrodes may intersect each other in a plane. The third sensing electrode may be adjacent to the first and second sensing electrodes.

[0024] According to some embodiments, the input sensor can operate in a first mode that detects a first input from a user's touch or in a second mode that detects a second input from an input device. The second mode can be activated when the input device is recognized by a second signal from a third sensing electrode.

[0025] According to some embodiments, multiple first sensing electrodes may be provided. Each of the multiple first sensing electrodes may extend in a first direction. Multiple second sensing electrodes may be provided. Each of the multiple second sensing electrodes may extend in a second direction. Multiple third sensing electrodes may be provided. Each of the multiple third sensing electrodes may be located between two adjacent first sensing electrodes and between two adjacent second sensing electrodes.

[0026] According to some embodiments, the second sensing unit may further include a bridging electrode on a different layer from the layer on which the third sensing electrode is positioned.

[0027] According to some embodiments, the input sensor may further include an auxiliary electrode that is stacked on the same layer as the third sensing electrode and positioned on the same layer on which the bridging electrode is positioned. Attached Figure Description

[0028] Figure 1A perspective view illustrating an electronic device according to some embodiments of the present invention is shown.

[0029] Figure 2 A simplified block diagram illustrating an input device and electronic apparatus according to some embodiments of the present invention is shown.

[0030] Figure 3 A cross-sectional view of an electronic device illustrating some embodiments of the present invention is shown.

[0031] Figure 4A and Figure 4B A plan view of an electronic device illustrating some embodiments of the present invention is shown.

[0032] Figure 5A It shows Figure 4B A magnified image of part of YY'.

[0033] Figure 5B It shows along Figure 5A A sectional view taken by line A-A'.

[0034] Figure 6A A plan view of an electronic device illustrating some embodiments of the present invention is shown.

[0035] Figure 6B It shows along Figure 6A The sectional view taken by line B-B'.

[0036] Figure 7 A cross-sectional view of an electronic device illustrating some embodiments of the present invention is shown.

[0037] Figure 8 A cross-sectional view of an electronic device illustrating some embodiments of the present invention is shown.

[0038] Figure 9 and Figure 10 A plan view of an electronic device illustrating some embodiments of the present invention is shown. Detailed Implementation

[0039] In this specification, when a component (or region, layer, part, etc.) is referred to as being "on" other components, "connected to" or "integrated into" other components, the component may be directly located on, directly connected to or directly integrated into the other components, or there may be at least one intermediate component between them.

[0040] The same markings denote the same components. Furthermore, in the accompanying drawings, the thickness, proportions, and dimensions of the components are exaggerated for the purpose of effectively explaining the technical content. The term "and / or" includes one or more combinations defined by the relevant components.

[0041] It will be understood that while the terms first, second, etc., may be used herein to describe various components, these components should not be limited by these terms. These terms are used only to distinguish one component from another. For example, a first component may be named a second component without departing from the scope of the invention, and vice versa. Unless the context clearly indicates otherwise, the singular form is intended to include the plural form as well.

[0042] Additionally, the terms "below," "under," "above," and "above" are used herein to describe the relationship between one component and other components shown in the accompanying drawings. Relative terms are intended to cover different orientations other than those depicted in the accompanying drawings.

[0043] It should be understood that the terms “comprising,” “including,” “having,” etc., are used to describe the presence of the stated features, wholes, steps, operations, components, elements, or combinations thereof, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, components, elements, or combinations thereof.

[0044] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art. Furthermore, terms defined in a general dictionary shall be understood to have the same meaning as defined in the context of this art, and shall not be construed as having an idealized or overly formal meaning, unless expressly defined herein.

[0045] Now, some embodiments of the present invention will be described below with reference to the accompanying drawings.

[0046] Figure 1 A perspective view illustrating an electronic device according to some embodiments of the present invention is shown.

[0047] Reference Figure 1 The electronic device 1000 can be a device activated by electronic signals. For example, the electronic device 1000 can be a mobile phone, tablet computer, car navigation system, game console, or wearable device, but is not limited thereto according to embodiments of the present invention. Figure 1 A mobile phone, which is an electronic device 1000, is depicted by way of example.

[0048] Electronic device 1000 can display an image in an effective area 1000A. The effective area 1000A may include a plane (e.g., a main display surface or display surface) defined by a first direction DR1 and a second direction DR2. The thickness direction of electronic device 1000 may be parallel to a third direction DR3 intersecting the first direction DR1 and the second direction DR2. The third direction DR3 may serve as a reference defining the front and rear surfaces (or top and bottom surfaces) of each of the components constituting electronic device 1000.

[0049] The electronic device 1000 can detect inputs applied externally to the electronic device 1000. External inputs can be user inputs (e.g., touch inputs). External inputs can include user body parts, light, heat, pressure, or any other type of input.

[0050] Figure 1 The electronic device 1000 shown can detect input from a user's touch (first input) and input from an input device 2000 (second input). The input device 2000 can include a device other than the user's body. For example, the input device 2000 can be an active or passive pen, a stylus, or an electronic pen. An example using an active pen as the input device 2000 will be described below, but embodiments according to this disclosure are not limited thereto.

[0051] Both the electronic device 1000 and the input device 2000 can perform bidirectional communication. The electronic device 1000 can provide uplink signals to the input device 2000. For example, the uplink signals may include synchronization signals or information about the electronic device 1000, but are not particularly limited thereto according to embodiments of the invention. The input device 2000 can provide downlink signals to the electronic device 1000. The downlink signals may include synchronization signals or information about the state of the input device 2000. For example, the downlink signals may include coordinate information of the input device 2000, battery information of the input device 2000, slope information of the input device 2000, and / or various information stored in the input device 2000, but are not limited thereto according to embodiments of the invention.

[0052] Figure 2 A simplified block diagram illustrating an input device and electronic apparatus according to some embodiments of the present invention is shown.

[0053] Reference Figure 2 The electronic device 1000 may include a display panel 100 and an input sensor 200.

[0054] Display panel 100 can be a component that generates or displays images. Display panel 100 can be an emitting display panel, such as an organic light-emitting display panel, a quantum dot display panel, a micron LED display panel, or a nano LED display panel.

[0055] The input sensor 200 can be positioned on the display panel 100. The input sensor 200 can detect externally applied input. The input sensor 200 can detect not only input from the user's body 3000, but also input from the input device 2000.

[0056] The input area for touch input from the user's body 3000 can have a first width WE1.

[0057] The input sensor 200 can operate in a time-division driving method. For example, the input sensor 200 can be driven alternately and repeatedly in a first mode and a second mode. Input from the user's body 3000 can be detected in the first mode, and input from the input device 2000 can be detected in the second mode.

[0058] When the second mode begins, the input sensor 200 can provide an uplink signal ULS to the input device 2000. When the input device 2000 receives the uplink signal ULS and is synchronized with the electronic device 1000, the input device 2000 can provide a downlink signal DLS to the input sensor 200.

[0059] According to some embodiments, the first sensing unit SP1 of the input sensor 200 can receive the downlink signal DLS and input from the user's body 3000, and the second sensing unit SP2 of the input sensor 200 can send the uplink signal ULS to the input device 2000. Further detailed descriptions will be discussed below.

[0060] Input device 2000 may include a power supply 2100, a memory 2200, a controller 2300, a transmitter 2400, a receiver 2500, and pen electrodes 2600. However, the components of input device 2000 are not limited to those mentioned above. For example, input device 2000 may also include a rotation sensor for detecting rotation, a pressure sensor for detecting pressure, an electrode switch for switching pen electrodes 2600 to a signal transmission mode or a signal reception mode, a haptic feedback component or device, or any other suitable component according to the design of input device 2000.

[0061] The input area for touch input from the pen electrode 2600 may have a second width WE2. According to some embodiments, the second width WE2 for the input area for the pen electrode 2600 may be smaller than the first width WE1 for the input area for the user's body 3000.

[0062] Power supply 2100 may include one of a battery and a high-capacitance capacitor, each of which provides power to input device 2000. Memory 2200 may store information about the functionality of input device 2000. Controller 2300 may control the operation of input device 2000. Each of transmitter 2400 and receiver 2500 may communicate with electronic device 1000 via pen electrode 2600. Transmitter 2400 may be referred to as a signal generator or transmitting circuit, and receiver 2500 may be referred to as a signal receiver or receiving circuit.

[0063] Figure 3 A cross-sectional view of an electronic device illustrating some embodiments of the present invention is shown.

[0064] Reference Figure 3 The display panel 100 may include a substrate layer 110, a circuit layer 120, a light-emitting element layer 130, and an encapsulation layer 140. For ease of description, Figure 3 The encapsulation layer 140 is depicted as being included in the display panel 100, but the encapsulation layer 140 can be considered as a separate component.

[0065] The substrate layer 110 may be a component providing a substrate surface on which the circuit layer 120 is positioned. The substrate layer 110 may be a glass substrate, a metal substrate, or a polymer substrate. However, embodiments of the present invention are not limited thereto, and the substrate layer 110 may be an inorganic layer, an organic layer, or a composite material layer.

[0066] The substrate layer 110 may have a multilayer structure. For example, the substrate layer 110 may include a first synthetic resin layer and silicon dioxide (SiO2) positioned on the first synthetic resin layer. x The first and second synthetic resin layers comprise a silicon oxide layer, an amorphous silicon (a-Si) layer positioned on the silicon oxide layer, and a second synthetic resin layer positioned on the amorphous silicon layer. The silicon oxide layer and the amorphous silicon layer may be referred to as substrate barrier layers. Each of the first and second synthetic resin layers may comprise a polyimide resin. Additionally or optionally, each of the first and second synthetic resin layers may comprise at least one selected from acrylate resins, methacrylate resins, polyisoprene resins, vinyl resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins. In this specification, the term "X-type resin" may refer to a resin including the functional group X.

[0067] Circuit layer 120 can be positioned on substrate layer 110. Circuit layer 120 may include dielectric layers, semiconductor patterns, conductive patterns, signal lines, etc. Coating and deposition processes can be used to form dielectric, semiconductor, and conductive layers on substrate layer 110, and then photolithography processes can be performed multiple times to selectively pattern the dielectric, semiconductor, and conductive layers. Semiconductor patterns, conductive patterns, and signal lines included in circuit layer 120 can then be formed.

[0068] At least one inorganic layer may be formed on the top surface of the substrate layer 110. The inorganic layer may include at least one selected from alumina, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be formed in multiple layers. The multiple inorganic layers may constitute a barrier layer and / or a buffer layer. According to some embodiments, the display panel 100 is shown to include a buffer layer BFL.

[0069] The buffer layer BFL can increase the bonding force between the substrate layer 110 and the semiconductor pattern. The buffer layer BFL may include a silicon oxide layer and a silicon nitride layer, which may be stacked alternately.

[0070] Semiconductor patterns can be positioned on the buffer layer BFL. The semiconductor pattern may include polycrystalline silicon. However, the invention is not limited thereto; the semiconductor pattern may include amorphous silicon or metal oxide.

[0071] Figure 3 Only a portion of the semiconductor pattern is depicted; the semiconductor pattern can also be positioned in other areas. The semiconductor pattern can be specifically arranged on top of a pixel. The semiconductor pattern can have different electrical properties based on whether it is doped. The semiconductor pattern can include a first region with high conductivity and a second region with low conductivity. The first region can be doped with N-type or P-type impurities. A P-type transistor can include a doped region implanted with P-type impurities, and an N-type transistor can include a doped region implanted with N-type impurities. The second region can be an undoped region, or it can be implanted with impurities at a lower concentration than the impurities implanted in the first region.

[0072] The first region can have a higher conductivity than the second region and can be essentially used as an electrode and signal line. The second region can essentially correspond to the active region (or channel) of a transistor. For example, a portion of the semiconductor pattern can be the active region of a transistor, another portion of the semiconductor pattern can be the source or drain of a transistor, and yet another portion of the semiconductor pattern can be a connecting electrode or a connecting signal line.

[0073] Each pixel can have an equivalent circuit including seven transistors, a capacitor, and a light-emitting element, and the equivalent circuit of a pixel can be changed into various shapes. Figure 3A pixel comprising a transistor 100PC and a light-emitting element 100PE is depicted by way of example.

[0074] The source SC1, active region A1, and drain D1 of transistor 100PC can be formed from a semiconductor pattern. When viewed in cross-section, the source SC1 and drain D1 can extend from the active region A1 in opposite directions. Figure 3 The connection signal line SCL, formed by a semiconductor pattern, is partially shown. According to some embodiments, when viewed in a plan view, the connection signal line SCL may be electrically connected to the drain D1 of transistor 100PC.

[0075] The first dielectric layer 10 may be formed on the buffer layer BFL. The first dielectric layer 10 may be stacked commonly with multiple pixels and may cover a semiconductor pattern. The first dielectric layer 10 may be one or more inorganic and organic layers, and may have a single-layer or multi-layer structure. The first dielectric layer 10 may include at least one selected from aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. According to some embodiments, the first dielectric layer 10 may be a single-layer silicon oxide layer. Similar to the first dielectric layer 10, other dielectric layers of the circuit layer 120 may be one or more inorganic and organic layers, and may have a single-layer or multi-layer structure. Inorganic layers may include at least one of the materials mentioned above, but are not limited thereto by embodiments of the present invention.

[0076] The gate G1 of transistor 100PC can be positioned on the first dielectric layer 10. The gate G1 can be part of a metal pattern. The gate G1 can be stacked with the active region A1. When the semiconductor pattern is doped, the gate G1 can be used as a mask.

[0077] The second dielectric layer 20 may be positioned on the first dielectric layer 10 and may cover the gate G1. The second dielectric layer 20 may be stacked commonly with multiple pixels. The second dielectric layer 20 may be one or more inorganic and organic layers, and may have a single-layer or multi-layer structure. According to some embodiments, the second dielectric layer 20 may be a single-layer silicon oxide layer.

[0078] The third dielectric layer 30 may be formed on the second dielectric layer 20, and according to some embodiments, it may be a single layer of silicon oxide.

[0079] The first connection electrode CNE1 can be positioned on the third dielectric layer 30. The first connection electrode CNE1 can be connected to the connection signal line SCL through the contact hole CNT-1 that penetrates the first dielectric layer 10, the second dielectric layer 20 and the third dielectric layer 30.

[0080] The fourth dielectric layer 40 can be positioned on the third dielectric layer 30. The fourth dielectric layer 40 can be a single layer of silicon oxide. The fifth dielectric layer 50 can be positioned on the fourth dielectric layer 40. The fifth dielectric layer 50 can be an organic layer.

[0081] The second connection electrode CNE2 can be formed on the fifth dielectric layer 50. The second connection electrode CNE2 can be bonded to the first connection electrode CNE1 through the contact hole CNT-2 that penetrates the fourth dielectric layer 40 and the fifth dielectric layer 50.

[0082] A sixth dielectric layer 60 may be formed on the fifth dielectric layer 50 and may cover the second connection electrode CNE2. The sixth dielectric layer 60 may be an organic layer. A light-emitting element layer 130 may be positioned on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element 100PE. For example, the light-emitting element layer 130 may include organic light-emitting materials, quantum dots, quantum rods, micron-LEDs, or nano-LEDs. The light-emitting element 100PE may include a first electrode AE, an emitting layer EL, and a second electrode CE.

[0083] The first electrode AE ​​can be positioned on the sixth dielectric layer 60. The first electrode AE ​​can be connected to the second connecting electrode CNE2 through the contact hole CNT-3 penetrating the sixth dielectric layer 60.

[0084] A pixel defining layer 70 may be positioned on a sixth dielectric layer 60 and may cover a portion of the first electrode AE. An opening 70-OP may be defined in the pixel defining layer 70. The opening 70-OP of the pixel defining layer 70 may expose at least a portion of the first electrode AE. According to some embodiments, a light-emitting region PXA may be defined corresponding to a portion of the first electrode AE, said portion of the first electrode AE ​​being exposed through the opening 70-OP. A non-light-emitting region NPXA may surround the light-emitting region PXA.

[0085] An emitting layer EL can be formed on a first electrode AE. The emitting layer EL can be positioned within an opening 70-OP. For example, the emitting layer EL can be formed on each of the pixels. When multiple emitting layer ELs are formed on corresponding pixels, the emitting layer ELs can all emit light having at least one selected from blue, red, and green. However, the invention is not limited thereto, and emitting layer ELs commonly connected to multiple pixels can be provided. In this case, the emitting layer EL can provide blue light or white light.

[0086] The second electrode CE can be positioned on the emitter layer EL. The second electrode CE can be formed on multiple pixels while having a single monolithic shape. The second electrode CE can be supplied with a common voltage and can be referred to as a common electrode.

[0087] According to some embodiments, a hole control layer can be located between the first electrode AE ​​and the emitter layer EL. The hole control layer can be commonly formed in the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer may include a hole transport layer and may also include a hole injection layer. An electron control layer can be located between the emitter layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may also include an electron injection layer. An aperture mask can be used to form the hole control layer and the electron control layer commonly formed on multiple pixels.

[0088] The encapsulation layer 140 may be formed on the light-emitting element layer 130. The encapsulation layer 140 may include inorganic layers, organic layers and inorganic layers stacked in sequence, but there are no limitations on the constituent layers of the encapsulation layer 140.

[0089] The inorganic layer protects the light-emitting element layer 130 from moisture and oxygen, while the organic layer protects it from foreign substances such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylamide-based organic layer, but is not limited to this according to embodiments of the present invention.

[0090] The input sensor 200 can be formed on the display panel 100 using a continuous process. In this case, it can be said that the input sensor 200 is directly disposed on the display panel 100. The phrase "directly disposed on" can mean that a third component is not positioned between the input sensor 200 and the display panel 100. For example, an adhesive member may not be separately disposed between the input sensor 200 and the display panel 100. In this case, the thickness of the electronic device 1000 can be reduced.

[0091] The input sensor 200 may include a substrate dielectric layer 201, a first conductive layer 202, a sensing dielectric layer 203, a second conductive layer 204, and a cover dielectric layer 205.

[0092] The substrate dielectric layer 201 may be an inorganic layer comprising one of silicon nitride, silicon oxynitride, and silicon oxide. Optionally, the substrate dielectric layer 201 may be an organic layer comprising an epoxy resin, an acrylic resin, or an imide resin. The substrate dielectric layer 201 may have a monolayer structure or a multilayer structure stacked along the third direction DR3.

[0093] Each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure or a multi-layer structure stacked along the third direction DR3.

[0094] The single-layer conductive layer may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). Additionally or optionally, the transparent conductive layer may include metal nanowires, graphene, or a conductive polymer such as PEDOT.

[0095] The multilayer conductive layer may include a metal layer. The metal layer may include, for example, a three-layer structure of titanium / aluminum / titanium. The multilayer conductive layer may include at least one metal layer and at least one transparent conductive layer.

[0096] One or both of the sensing dielectric layer 203 and the covering dielectric layer 205 may include an inorganic layer. The inorganic layer may include one or more of alumina, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0097] Parasitic capacitance Cb can occur between the input sensor 200 and the second electrode CE. A decrease in the distance between the input sensor 200 and the second electrode CE will cause an increase in parasitic capacitance Cb. Parasitic capacitance Cb increases in structures such as those according to some embodiments of the invention, where the input sensor 200 is directly disposed on the encapsulation layer 140. For example, approximately 500 pF may be given as parasitic capacitance Cb between the second electrode CE and one or more sensing electrodes of the input sensor 200. For example, the parasitic capacitance Cb between the first sensing unit SP1 and the second electrode CE may be equal to or greater than approximately 500 pF. When parasitic capacitance Cb is large, the presence of noise is likely to increase the probability of errors occurring in the display panel screen.

[0098] Reference Figure 2 and Figure 3 Some embodiments of the present invention may disclose an electronic device 1000 in which a first sensing unit SP1 is separate from a second sensing unit SP2 that provides an uplink signal ULS for identifying the input device 2000. When the second sensing unit SP2 and the second electrode CE are designed to have a parasitic capacitance Cb therebetween that is smaller than the parasitic capacitance Cb between the first sensing unit SP1 and the second electrode CE, noise can be relatively reduced and screen errors can be prevented. For example, the parasitic capacitance Cb between the second sensing unit SP2 and the second electrode CE may be equal to or greater than about 200 pF, but embodiments of the present invention are not limited thereto.

[0099] Figure 4A and Figure 4B A plan view of an electronic device illustrating some embodiments of the present invention is shown.

[0100] Figure 4AA plan view illustrating an input sensor 200 according to some embodiments of the present invention is shown. Figure 4B It shows Figure 4A A simplified enlarged plan view of part XX'. Figure 5A It shows Figure 4B A magnified image of part of YY'.

[0101] Reference Figures 4A to 5A The input sensor 200 may include a first input that detects a touch from a user and an input from an input device (see...). Figure 2 The first sensing unit SP1 of the second input of the input device 2000 may also include a second sensing unit SP2 that identifies the input device 2000 before detecting the second input from the input device 2000.

[0102] When the second sensing unit SP2 recognizes the input device 2000, the input sensor 200 can operate in a second mode. During operation in the second mode, the input sensor 200 can use the first sensing unit SP1 to detect a second input from the input device 2000.

[0103] According to some embodiments, in addition to the first sensing unit SP1 and the second sensing unit SP2, the input sensor 200 may include multiple wiring lines and an input drive circuit 300. The multiple wiring lines can connect the input drive circuit 300 to the first sensing unit SP1 and the second sensing unit SP2.

[0104] The input drive circuit 300 can provide signals to the input sensor 200 for detecting the first input and the second input, and can process the input signals corresponding to the first input and the second input detected in the input sensor 200.

[0105] According to some embodiments, the input driving circuit 300 can apply a first signal to the first sensing unit SP1 and a second signal to the second sensing unit SP2. The input sensor 200 can detect the first input and the second input by applying the first signal to the first sensing unit SP1. The first signal may include a downlink signal (see...). Figure 2 The input sensor 200 can use a downlink signal DLS to detect a second input from the input device 2000. The input sensor 200 can identify the input device 2000 by applying a second signal to the second sensing unit SP2. The second signal may include an uplink signal (see DLS). Figure 2The input sensor 200 can provide a second signal or an uplink signal ULS to the input device 2000. When the input device 2000 receives the second signal, the input device 2000 can synchronize with the input sensor 200, and the input sensor 200 can receive a downlink signal DLS from the input device 2000, thereby detecting the second input and operating in a second mode.

[0106] The first sensing unit SP1 may include a first sensing electrode SE1 and a second sensing electrode SE2.

[0107] Multiple first sensing electrodes SE1 can be configured, and these electrodes can be arranged along the second direction DR2. Each of the first sensing electrodes SE1 can extend along a first direction DR1 that intersects the second direction DR2. For example, each of the first sensing electrodes SE1 may include multiple unit electrodes extending along the first direction DR1. Each first sensing electrode SE1 may include a first connecting electrode CE1. The first connecting electrode CE1 can connect the multiple unit electrodes to each other.

[0108] Multiple second sensing electrodes SE2 can be configured, and these electrodes can be arranged along a first direction DR1. Each of the second sensing electrodes SE2 can extend along a second direction DR2. Each of the second sensing electrodes SE2 can include multiple unit electrodes extending along the second direction DR2. Each second sensing electrode SE2 can include a second connecting electrode CE2. The second connecting electrode CE2 can connect the multiple unit electrodes to each other. According to some embodiments, the second connecting electrode CE2 can be positioned on a layer different from the layer on which the first sensing electrode SE1, the second sensing electrode SE2, and the first connecting electrode CE1 are positioned.

[0109] The second sensing unit SP2 may include a third sensing electrode SE3 and a bridging electrode BE. The third sensing electrode SE3 may be positioned between two adjacent first sensing electrodes SE1 of a plurality of first sensing electrodes SE1. The third sensing electrode SE3 may also be positioned between two adjacent second sensing electrodes SE2 of a plurality of second sensing electrodes SE2. For example, the third sensing electrode SE3 may include at least one first portion 1P positioned between two adjacent first sensing electrodes SE1 of a plurality of first sensing electrodes SE1, and may further include a second portion 2P positioned between two adjacent second sensing electrodes SE2 of a plurality of second sensing electrodes SE2. Figure 5A A third sensing electrode SE3 comprising two first portions 1P and two second portions 2P is depicted, but embodiments according to the present invention are not limited thereto. The two first portions 1P can be electrically connected to each other via a bridging electrode BE. The two second portions 2P can also be electrically connected to each other via a bridging electrode BE.

[0110] At least one first portion 1P may extend in the first direction DR1 and may include multiple unit electrodes. At least one second portion 2P may extend in the second direction DR2 and may include multiple unit electrodes. Multiple bridging electrodes BE may each include multiple unit electrodes contained in a third sensing electrode SE3. The third sensing electrode SE3 may transmit the uplink signal ULS to the input device 2000.

[0111] The multiple wiring lines may include a first wiring line SL1, a second wiring line SL2, and a third wiring line SL3. The first wiring line SL1 can connect the first sensing electrode SE1 to the input driving circuit 300, the second wiring line SL2 can connect the second sensing electrode SE2 to the input driving circuit 300, and the third wiring line SL3 can connect the third sensing electrode SE3 to the input driving circuit 300.

[0112] Reference Figure 4A and Figure 4B The first wiring line SL1 and the first sensing electrode SE1 can be connected on the left and right sides of the input sensor 200 in the first direction DR1. The second wiring line SL2 and the second sensing electrode SE2 can be connected on the lower side of the input sensor 200 in the second direction DR2. In this case, the third wiring line SL3 and the third sensing electrode SE3 can be connected on the upper side of the input sensor 200 in the second direction DR2. The third wiring line SL3 can be connected to the third sensing electrode SE3 located in the second region DA, which will be discussed below.

[0113] According to some embodiments, the effective area AA and the peripheral area PA can be defined on the input sensor 200. The first sensing unit SP1 and the second sensing unit SP2 can be located at the effective area AA. Multiple wiring lines can be located at the peripheral area PA.

[0114] The effective region AA may include a first region EA and a second region DA. A first sensing electrode SE1 and a second sensing electrode SE2 may be located in the first region EA. A third sensing electrode SE3 and a dummy electrode DE may be located in the second region DA. In the effective region AA, the second region DA may correspond to a dummy region other than the first region EA, where the first sensing electrode SE1 and the second sensing electrode SE2 are located. For example, the third sensing electrode SE3 may be located in a dummy region. The third sensing electrode SE3 may replace some of the dummy electrodes DE located in the second region DA or a dummy region. For example, in the second region DA, the third sensing electrode SE3 may be located in region DA2, other than region DA1, where the dummy electrode DE is located.

[0115] Figure 5B It shows along Figure 5A A partial sectional view taken by line A-A'.

[0116] Reference Figure 5B The second sensing electrode SE2 can be positioned on the same layer as the layer on which the third sensing electrode SE3 is positioned. The bridging electrode BE can be positioned on a different layer than the layer on which the third sensing electrode SE3 is positioned. The third sensing electrode SE3 can be connected to the bridging electrode BE through the contact hole CNT. The third sensing electrodes SE3 can be electrically connected to each other through the bridging electrode BE.

[0117] like Figure 5B As shown, the bridging electrode BE can be positioned on the substrate dielectric layer 201. For example, the bridging electrode BE can be included in the first conductive layer (see example...). Figure 3 In element 202). The second sensing electrode SE2 and the third sensing electrode SE3 can be positioned on the sensing dielectric layer 203 and can be included in the second conductive layer (see element 202). Figure 3 In 204), the dielectric layer 205 can cover the second conductive layer 204.

[0118] Electronic device 1000 may include, for example Figure 5B The polarizing layer POL and window WM are shown in the diagram. The polarizing layer POL can be omitted. An adhesive component can be disposed between the window WM and the polarizing layer POL.

[0119] Figure 6A A plan view of an electronic device illustrating some embodiments of the present invention is shown. Figure 6B It shows along Figure 6A A partial sectional view taken by line B-B'.

[0120] Figure 6A It is shown Figure 4B A magnified image of part of YY'. Figure 6B It is along Figure 6A The partial cross section cut by line B-B'.

[0121] Reference Figure 6A and Figure 6B The third sensing electrode SE3 may include a single first portion 1P and a single second portion 2P that intersect each other. The third sensing electrode SE3 is related to the second electrode (see...). Figure 3 The first sensing electrode SE1 and the second sensing electrode SE2 may have a parasitic capacitance of about 200 pF between them and the second electrode CE. Conversely, each of the first sensing electrode SE1 and the second sensing electrode SE2 may have a parasitic capacitance of about 500 pF between them and the second electrode CE.

[0122] Figure 7 A cross-sectional view of an electronic device illustrating some embodiments of the present invention is shown.

[0123] Reference Figure 7 The second sensing unit SP2 of the input sensor 200 may include a plurality of auxiliary electrodes AU. The plurality of auxiliary electrodes AU may be located on a different layer than the layer on which the third sensing electrode SE3 is located. According to some embodiments, the auxiliary electrodes AU may be located on the same layer as the layer on which the bridging electrode BE is located. For example, the auxiliary electrodes AU may be located on the substrate dielectric layer 201.

[0124] The auxiliary electrode AU can be stacked on the third sensing electrode SE3 on the third direction DR3.

[0125] According to some embodiments, the signal applied to the auxiliary electrode AU may have a phase opposite to that of the signal applied to the third sensing electrode SE3. For example, the signal of the auxiliary electrode AU may correspond to the inverted signal of the third sensing electrode SE3.

[0126] Therefore, when simultaneously applied to the second electrode (see...) Figure 3 When the CE (Electrical Device) supplies signals to the third sensing electrode SE3 and to the auxiliary electrode AU, the two signals can cancel each other out to reduce input device (see...) Figure 2 (2000) and input sensor (see ) Figure 2 The noise between 200 and 200. According to some embodiments, each of the auxiliary electrodes AU can be supplied with ground or DC power and can therefore be used as a ground.

[0127] For example, the auxiliary electrode AU can reduce the uplink signal supplied to the input device 2000 by the third sensing electrode SE3 when the input device 2000 is affected (see...). Figure 2 The effect of noise that occurs when the ULS is identified.

[0128] Figure 8 A cross-sectional view of an electronic device illustrating some embodiments of the present invention is shown.

[0129] Reference Figure 8 The auxiliary electrode AU can be arranged to be stacked not only with the third sensing electrode SE3, but also with the second sensing electrode SE2 (and / or the first sensing electrode SE1).

[0130] According to some embodiments, because the auxiliary electrode AU is arranged to overlap not only with the third sensing electrode SE3, but also with the first sensing electrode SE1 and / or the second sensing electrode SE2, it is possible to reduce noise when the input sensor 200 uses the first sensing electrode SE1 and the second sensing electrode SE2 to detect external input.

[0131] Figure 9 and Figure 10A plan view of an electronic device illustrating some embodiments of the present invention is shown. Figure 9 and Figure 10 Multiple wiring lines are shown according to some embodiments of the present invention.

[0132] Reference Figure 9 The first wiring line SL1 and the first sensing electrode SE1 can be connected on the left and right sides of the input sensor 200 in the first direction DR1. Similarly, the third wiring line SL3 and the third sensing electrode (see...) can be connected on the left and right sides of the input sensor 200 in the first direction DR1. Figure 5A The second wiring line SL2 and the second sensing electrode SE2 can be connected on the lower side of the input sensor 200 in the second direction DR2.

[0133] Reference Figure 10 The input sensor 200 may include connections to auxiliary electrodes (see...). Figure 7 Multiple auxiliary wiring lines AL of the input sensor 200 (AU). The auxiliary wiring lines AL and the auxiliary electrodes AU can be connected on the left and right sides of the input sensor 200 in the first direction DR1. According to some embodiments, the auxiliary wiring lines AL and the auxiliary electrodes AU can be connected on the upper or lower side of the input sensor 200 in the second direction DR2.

[0134] According to the present invention, the sensing electrodes for an active pen can be disposed separately from the touch sensing electrodes, thereby increasing touch sensitivity and reducing any noise generated by using an active pen.

[0135] Several embodiments have been described in the specification and drawings. While specific terminology is used herein, it is for descriptive purposes only and not to limit the technical meaning or scope of the invention as disclosed in the claims. Therefore, those skilled in the art will understand that various modifications and equivalent embodiments can be made to this invention. In summary, the true technical scope of the embodiments of the invention to be protected should be determined by the technical concept of the appended claims and their equivalents.

Claims

1. An electronic device, the electronic device comprising: Display panel; as well as An input sensor, located on the display panel, is configured to operate in a first mode or a second mode. In the first mode, the input sensor detects a first input from a user's touch; in the second mode, the input sensor detects a second input from an input device. The input sensor includes: a first sensing unit configured to detect the first input and the second input; and a second sensing unit configured to identify the input device. The first sensing unit includes: a plurality of first sensing electrodes arranged along a first direction and extending in a second direction intersecting the first direction; and a plurality of second sensing electrodes arranged along the second direction and extending in the first direction. The second sensing unit includes a plurality of third sensing electrodes, located between two adjacent first sensing electrodes and between two adjacent second sensing electrodes among the plurality of second sensing electrodes.

2. The electronic device according to claim 1, wherein, The input sensor is configured to operate in the second mode in response to the second sensing unit recognizing the input device.

3. The electronic device according to claim 1, wherein, The second sensing unit also includes: Multiple bridging electrodes connect the multiple third sensing electrodes to each other.

4. The electronic device according to claim 1, wherein, The input sensor includes: An effective area, wherein the first sensing unit and the second sensing unit are positioned; and The peripheral area is adjacent to the effective area and contains multiple wiring lines. The effective area includes: a first area, in which the plurality of first sensing electrodes and the plurality of second sensing electrodes are located; and a second area, adjacent to the first area, in which a plurality of dummy electrodes are located.

5. The electronic device according to claim 4, wherein, The plurality of third sensing electrodes are located in a portion of the second region, and the plurality of dummy electrodes are not located in the portion of the second region.

6. The electronic device according to claim 1, wherein, The input sensor further includes an input driving circuit configured to provide a first signal to the first sensing unit to detect the first input or the second input and configured to provide a second signal to the second sensing unit to identify the input device.

7. The electronic device according to claim 6, wherein, The input sensor is configured to send the second signal to the input device, the second signal serving as an uplink signal.

8. The electronic device according to claim 6, wherein, The first signal includes a downlink signal received from the input device to detect the second input.

9. The electronic device according to claim 3, wherein, The plurality of first sensing electrodes, the plurality of second sensing electrodes, and the plurality of third sensing electrodes are located on the same layer, and The plurality of bridging electrodes are located on layers different from the layers on which the plurality of first sensing electrodes, the plurality of second sensing electrodes and the plurality of third sensing electrodes are positioned.

10. The electronic device according to claim 3, wherein, The second sensing unit also includes a plurality of auxiliary electrodes stacked on the plurality of third sensing electrodes and located on the same layer on which the plurality of bridging electrodes are positioned.

11. The electronic device according to claim 10, wherein, The input sensor is configured to provide the plurality of auxiliary electrodes with a signal whose phase is opposite to that of the signal applied to the plurality of third sensing electrodes.

12. The electronic device according to claim 10, wherein, The plurality of auxiliary electrodes are stacked not only with the plurality of third sensing electrodes, but also with at least one of the plurality of first sensing electrodes and the plurality of second sensing electrodes.

13. The electronic device according to claim 1, wherein, The input sensor also includes: A first wiring line is connected to the plurality of first sensing electrodes; A second wiring line is connected to the plurality of second sensing electrodes; and The third wiring line is connected to the plurality of third sensing electrodes.

14. The electronic device according to claim 10, wherein, The input sensor also includes multiple auxiliary wiring lines that connect the plurality of auxiliary electrodes to the input drive circuit.

15. An electronic device, the electronic device comprising: Display panel; as well as An input sensor is located on the display panel. The input sensor includes a sensing area and a dummy area adjacent to the sensing area. The sensing area includes a first sensing part, and the dummy area includes a second sensing part. The first sensing unit includes a first sensing electrode and a second sensing electrode configured to receive a first signal to detect input from an input device or a user's touch. The second sensing unit includes a third sensing electrode configured to receive a second signal to identify the input device. The first sensing electrode and the second sensing electrode intersect each other on a plane. Wherein, the third sensing electrode is adjacent to the first sensing electrode and the second sensing electrode, and The first sensing electrode is configured as a plurality of electrodes, wherein the plurality of first sensing electrodes extend in a first direction; the second sensing electrode is configured as a plurality of electrodes, wherein the plurality of second sensing electrodes extend in a second direction; and the third sensing electrode is configured as a plurality of electrodes, wherein each of the plurality of third sensing electrodes is located between two adjacent first sensing electrodes and between two adjacent second sensing electrodes.

16. The electronic device according to claim 15, wherein, The input sensor is configured to operate in a first mode to detect a first input from the user's touch, or in a second mode to detect a second input from the input device. The second mode is activated in response to the input device being identified by the second signal from the third sensing electrode.

17. The electronic device according to claim 15, wherein, The second sensing unit also includes a bridging electrode located on a layer different from the layer on which the third sensing electrode is positioned.

18. The electronic device according to claim 17, wherein, The input sensor also includes an auxiliary electrode that is stacked on at least the third sensing electrode and located on the same layer as the layer on which the bridging electrode is positioned.

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