Magnetic components and their manufacturing methods

Abstract

This invention provides a magnetic component and a method for manufacturing the same. The magnetic component includes a magnetic core assembly and a winding assembly. The magnetic core assembly includes a first magnetic post. The winding assembly includes a first winding wound around the first magnetic post. The first winding is formed by at least a portion of a substrate, the substrate including a first accommodating space and a first metal layer, at least a portion of the first winding being formed by at least a portion of the first metal layer, wherein at least a portion of the first metal layer is disposed on the four sides of the inner wall of the first accommodating space, and at least a portion of the first magnetic post is disposed within the first accommodating space.

Description

Technical Field

[0001] This invention relates to a magnetic component and its manufacturing method, and more particularly to a magnetic component with low magnetic loss and high dimensional accuracy and its manufacturing method. Background Technology

[0002] As people's demands for intelligent living increase, the need for data processing also increases, with high efficiency and high power density being important indicators for data processing.

[0003] Traditional data centers typically utilize servers for data processing. The server's main circuit board contains data processing chips such as the central processing unit (CPU), chipset, and memory. Additionally, the main circuit board includes the power supply for these chips and other necessary components. As server processing power increases, the number and integration of data processing chips also increase, resulting in the server's internal space being almost entirely occupied by these chips. This also increases the server's power consumption. Therefore, the power supply for these data processing chips needs higher efficiency and power density, while also being smaller in size, to achieve overall server size reduction and make data centers more energy-efficient. To meet the high power density requirements, the power supply's switching frequency needs to be increased, requiring low voltage and high current to support the higher switching frequency. However, currently, when magnetic components are used in power supplies with low voltage and high current, their power density and conversion efficiency remain relatively low. Therefore, magnetic components have become a key factor in developing high-efficiency and high-power-density data centers.

[0004] Please see Figure 1A and Figure 1B ,in Figure 1A This is a three-dimensional structural diagram of a magnetic component in the prior art. Figure 1B for Figure 1A The diagram shows a cross-sectional view of the magnetic component along section A-A'. As shown, the prior art magnetic component 1' is manufactured using a horizontal winding process and includes a substrate 2', a magnetic core 3', and a winding 4'. The winding 4' is formed within the wiring layer 21' of the substrate 2', and the magnetic core 3' is fitted onto the substrate 2', making the magnetic core 3' perpendicular or nearly perpendicular to the substrate 2', and consequently, both the magnetic core 3' and the wiring layer 21' of the substrate 2' are perpendicular or nearly perpendicular. Figure 1B As shown, the wiring layer 21' has a thickness of W and a width of H, where the width H of the wiring layer 21' is greater than 10 times the thickness W, i.e., H > 10W. The winding method of the winding 4' of this magnetic component 1' is called vertical winding. The impedance of the outer portion of the winding 4' away from the magnetic post and the inner portion near the magnetic post will differ due to the inconsistent circumference of the inner and outer rings of the magnetic post, resulting in uneven current distribution.

[0005] Furthermore, the magnetic core 3' of the magnetic component 1' is composed of a U-shaped magnetic post 31' and an I-shaped magnetic post 32'. The U-shaped magnetic post 31' passes through two holes 22' in the substrate 2' and is connected to the I-shaped magnetic post 32'. The U-shaped magnetic post 31' includes two longitudinal magnetic posts 33' and a horizontal connecting part 34', wherein the two longitudinal magnetic posts 33' are located inside the substrate 2', and the horizontal connecting part 34' connects the two longitudinal magnetic posts 33'. The length of the horizontal connecting part 34' is W1, the outer distance between the two longitudinal magnetic posts 33' is W2, the inner distance between the two holes 22' in the substrate 2' is H1, and the outer distance is H2. To improve production efficiency, it is usually manufactured by mold making, and then the end face is finely polished to improve the dimensional accuracy of the magnetic core 3'. Taking the U-shaped magnetic column 31' as an example, its surface is polished after molding. For instance, the left and right sides of the horizontal connecting part 34' can be polished. However, since the U-shaped magnetic column 31' is integrally molded, the horizontal connecting part 34' affects the fine polishing of the outer surface of the longitudinal magnetic column 33', resulting in cumulative tolerances. For example, the outer surfaces of the two longitudinal magnetic columns 33' are recessed within the horizontal connecting part 34', making it impossible to finely polish that surface. Otherwise, polishing the outer surfaces of the longitudinal magnetic columns 33' would damage the horizontal connecting part 34'. Similarly, the inner surfaces of the longitudinal magnetic columns 33' cannot be finely polished, resulting in relatively large dimensional tolerances.

[0006] Please continue reading. Figure 1B The inner distance between the two longitudinal magnetic posts 33' is W3, and the width of each longitudinal magnetic post 33' is W4. When the tolerances for the outer distance W2, the inner distance W3, and the width W4 of each longitudinal magnetic post 33' are all + / - 0.2mm, the size of the hole 22' that can mate with the U-shaped magnetic post 31' is relatively large. That is, the value of the outer distance H2 between the two holes 22' needs to be greater than the maximum value of the outer distance W2 between the two longitudinal magnetic posts 33'. Similarly, the value of the inner distance H1 between the two holes 22' needs to be less than the minimum value of the inner distance W3 between the two longitudinal magnetic posts 33'. In actual wiring, the tolerance of the inner distance W3 between the two longitudinal magnetic posts 33' reduces the distance H1 between the inner distances of the two holes 22', reducing the wiring space and thus making the wiring inflexible. Furthermore, since the winding 4' arranged between the two holes 22' needs to meet a certain width, the conventional magnetic component 1' ensures the width of the winding 4' between the two longitudinal magnetic posts 33' by increasing the outer distance W2 between the two longitudinal magnetic posts 33'. Therefore, the tolerance of the length W1 of the horizontal connecting part 34' and the outer distance W2 between the two longitudinal magnetic posts 33' will accumulate on the inner spacing H1 and the outer spacing H2 of the two holes 22', making the overall size of the substrate 2' too large, thereby reducing the power density of the magnetic component 1'.

[0007] Therefore, developing a manufacturing method for magnetic components that overcomes the above-mentioned shortcomings is an urgent need at present. Summary of the Invention

[0008] One objective of this invention is to provide a magnetic component and its manufacturing method, which are magnetic components with low magnetic loss and high dimensional accuracy.

[0009] To achieve the above objectives, one embodiment of the present invention provides a magnetic component, comprising a magnetic core assembly and a winding assembly. The magnetic core assembly includes a first magnetic post. The winding assembly includes a first winding wound around the first magnetic post. The first winding is formed by at least a portion of a substrate, the substrate including a first accommodating space and a first metal layer, at least a portion of the first winding being formed by at least a portion of the first metal layer, wherein at least a portion of the first metal layer is disposed on the four sides of the inner wall of the first accommodating space, and at least a portion of the first magnetic post is disposed within the first accommodating space.

[0010] To achieve the above objectives, another embodiment of the present invention provides a method for manufacturing a magnetic component. First, a substrate is provided, at least a portion of which constitutes a winding assembly of the magnetic component. The substrate includes a first accommodating space and a first metal layer, wherein at least a portion of the first metal layer constitutes at least a portion of a first winding of the winding assembly, and wherein at least a portion of the first metal layer is disposed on the four sides of the inner wall of the first accommodating space. Next, a magnetic core assembly is provided, comprising a first magnetic post, wherein at least a portion of the first magnetic post is disposed within the first accommodating space, and a first winding is wound around the first magnetic post.

[0011] The beneficial effects of this invention are that the first magnetic post and the second magnetic post of the magnetic component are respectively disposed in the first accommodating space and the second accommodating space of the substrate. In the three-layer winding structure corresponding to any magnetic post, the distance between each winding layer and the magnetic post is approximately equal, which makes the current sharing effect of the magnetic core assembly of the magnetic component of this invention better and the overall magnetic loss of the magnetic component lower. Attached Figure Description

[0012] Figure 1A This is a three-dimensional structural diagram of a magnetic component in the prior art.

[0013] Figure 1B for Figure 1A The diagram shows a cross-sectional view of the magnetic component along section A-A'.

[0014] Figure 2 This is a three-dimensional structural diagram of the magnetic component of the present invention.

[0015] Figure 3 for Figure 2 The diagram shows the exploded structure of the magnetic component.

[0016] Figure 4 for Figure 2 The diagram shows a cross-sectional view of the magnetic component along section A-A'.

[0017] Figure 5 for Figure 2 The diagram shows a cross-sectional view of the magnetic component along the B-B' section.

[0018] Figure 6 for Figure 2 The flowchart shows the manufacturing method of the magnetic component.

[0019] Figure 7A for Figure 2 A schematic diagram of the assembly of the substrate and the magnetic core assembly of the magnetic component shown in the first embodiment.

[0020] Figure 7B for Figure 2 A schematic diagram of the assembly of the substrate and the magnetic core assembly of the magnetic component in a second embodiment.

[0021] Figure 7C for Figure 2 This is a schematic diagram of the assembly of the substrate and the core assembly of the magnetic component in the third embodiment.

[0022] Figure 7D for Figure 2 This is a schematic diagram of the assembly of the substrate and the core assembly of the magnetic component in the fourth embodiment.

[0023] Figure 7E for Figure 2 This is a schematic diagram of the assembly of the substrate and the core assembly of the magnetic component in the fifth embodiment.

[0024] Figure 7F for Figure 2 This is a schematic diagram of the assembly of the substrate and the core assembly of the magnetic component in the sixth embodiment.

[0025] Figures 8A to 8G for Figure 2 A cross-sectional structural schematic diagram of the manufacturing method of the first embodiment of the magnetic component shown.

[0026] Figure 9A for Figure 8C The diagram shows a structural schematic of the bonding method between the top plate of the substrate and the base in the first embodiment.

[0027] Figure 9B for Figure 8C The diagram shows a structural schematic of the bonding method between the top plate of the substrate and the base in the second embodiment.

[0028] Figure 9C for Figure 8CThe diagram shows a structural schematic of the bonding method between the top plate of the substrate and the base in the third embodiment.

[0029] Figure 10 for Figure 2 A cross-sectional structural schematic diagram of the second embodiment of the magnetic component shown.

[0030] Figure 11 for Figure 2 A cross-sectional structural schematic diagram of the third embodiment of the magnetic component shown.

[0031] Figures 12A to 12G for Figure 2 A cross-sectional structural schematic diagram of the manufacturing method of the fourth embodiment of the magnetic component shown.

[0032] Figure 13 for Figure 2 A cross-sectional structural schematic diagram of the fifth embodiment of the magnetic component shown.

[0033] Figures 14A to 14G for Figure 2 A cross-sectional structural schematic diagram of the manufacturing method of the sixth embodiment of the magnetic component shown.

[0034] Figures 15A to 15G for Figure 2 A cross-sectional structural schematic diagram of the manufacturing method of the seventh embodiment of the magnetic component shown.

[0035] Figure 16 for Figure 2 A cross-sectional structural schematic diagram of the eighth embodiment of the magnetic component shown.

[0036] Figure 17 for Figure 2 A cross-sectional structural schematic diagram of the ninth embodiment of the magnetic component shown.

[0037] Figures 18A to 18F for Figure 2 A cross-sectional structural schematic diagram of the manufacturing method of the tenth embodiment of the magnetic component shown.

[0038] Figures 19A to 19F for Figure 2 A cross-sectional structural schematic diagram of the manufacturing method of the eleventh embodiment of the magnetic component shown.

[0039] Figures 20A to 20E for Figure 2 A cross-sectional structural schematic diagram of the manufacturing method of the twelfth embodiment of the magnetic component shown.

[0040] Figure 21A for Figure 20C A top view of the magnetic component shown.

[0041] Figure 21B for Figure 20D A top view of the magnetic component shown.

[0042] Figure 22 for Figure 2 A cross-sectional structural schematic diagram of the thirteenth embodiment of the magnetic component shown.

[0043] Figures 23A to 23F for Figure 2 A cross-sectional structural schematic diagram of the manufacturing method of the fourteenth embodiment of the magnetic component shown.

[0044] Figure 24 for Figure 2 A cross-sectional structural schematic diagram of the substrate of the magnetic component shown in the fifteenth embodiment.

[0045] Figure 25 For the present invention Figure 2 The diagram shows the circuit structure of the power module to which the magnetic component is applied.

[0046] Figure 26 for Figure 8G The top view of the structure of the magnetic component shown.

[0047] Figure 27A for Figure 26 The diagram shows the composition of the primary and secondary windings of the magnetic component.

[0048] Figure 27B for Figure 26 This is a schematic diagram of the primary and secondary windings of the magnetic component from another perspective.

[0049] Figure 28 For the present invention Figure 25 The diagram shows a cross-sectional view of the first embodiment of the power module.

[0050] Figure 29 For the present invention Figure 25 A cross-sectional structural schematic diagram of the second embodiment of the power module shown.

[0051] The attached figures are labeled as follows:

[0052] 1': Magnetic components of the prior art

[0053] 2': substrate

[0054] 21': Wiring layer

[0055] 22': Hole

[0056] 3': Magnetic core

[0057] 31': U-shaped magnetic column

[0058] 32': Type I magnetic column

[0059] 33': Longitudinal magnetic column

[0060] 34': Horizontal connection section

[0061] 4': Winding

[0062] W: Thickness of wiring layer

[0063] H: Width of the wiring layer

[0064] W1: Length of the horizontal connection part

[0065] W2: Distance between the outer sides of the two longitudinal magnetic pillars

[0066] W3: Inner distance between the two longitudinal magnetic pillars

[0067] W4: Width of the vertical magnetic column

[0068] H1: Inner spacing between the two conductive pillars

[0069] H2: Spacing between the outer sides of the two conductive pillars

[0070] 1, 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1i, 1j, 1k, 1m, 1n, 1o: Magnetic components

[0071] 2: Magnetic core assembly

[0072] 21: First magnetic column

[0073] 22: Second magnetic column

[0074] 23: Third magnetic column

[0075] 24: Fourth Magnetic Pillar

[0076] 3: Substrate

[0077] 301: First side

[0078] 302: Second side

[0079] 303: Third side

[0080] 304: Fourth side

[0081] 305: Third opening

[0082] 306: Fourth opening

[0083] 31: First accommodating space

[0084] 32: Second accommodating space

[0085] 34, 81: First metal layer

[0086] 35: First Opening

[0087] 36: Second opening

[0088] S1-S2: Steps

[0089] L1: Length of substrate 3

[0090] L2: Length of the first magnetic post 21

[0091] L3: Width of the third magnetic post 23

[0092] L4: Width of the fourth magnetic column 24

[0093] W1: Length of the third magnetic post 23

[0094] W2: Width of the first magnetic post 21

[0095] 30a: Base

[0096] 30b: Groove

[0097] 30c: Top plate

[0098] 30d: First through hole

[0099] 30e: Second through hole

[0100] 30f: Bottom surface

[0101] 30g: First lateral wall

[0102] 30h: Second sidewall

[0103] 30y: gap

[0104] 30z: Insulating adhesive

[0105] 34a: First level copper foil

[0106] 341a: First upper horizontal copper foil

[0107] 342a: First lower horizontal copper foil

[0108] 343a: First vertical conductive post

[0109] 34b: Second level copper foil

[0110] 34c: First connecting copper foil

[0111] 34d: Second connecting copper foil

[0112] 34e: Etched hole

[0113] 34f: First transitional level

[0114] 34g: First conductive column

[0115] 34h: Sixth Transition Level

[0116] 34i: Connecting rib

[0117] 37, 82: Second metal layer

[0118] 37a, 81a: Third-level copper foil

[0119] 371a: Conductive post

[0120] 37b, 81b: Fourth level copper foil

[0121] 371b: Conductive post

[0122] 37c, 81c: Third connecting copper foil

[0123] 37d, 81d: Fourth connecting copper foil

[0124] 37e: First insulating material

[0125] 37f: Second insulating material

[0126] 37g: Etched holes

[0127] 38: Third metal layer

[0128] 38a, 82a: Fifth-level copper foil

[0129] 381a: Conductive post

[0130] 38b, 82b: Sixth-level copper foil

[0131] 381b: Conductive post

[0132] 38c, 82c: Fifth connecting copper foil

[0133] 38d, 82d: Sixth connecting copper foil

[0134] 38e: Third insulating material

[0135] 38f: Fourth insulating material

[0136] 38g: Etched holes

[0137] m: First horizontal wiring layer

[0138] n: Second horizontal wiring layer

[0139] o: Third horizontal wiring layer

[0140] p: Fourth horizontal wiring layer

[0141] q: Fifth horizontal routing layer

[0142] r: Sixth horizontal routing layer

[0143] s: Seventh horizontal routing layer

[0144] 21a: Chamfer

[0145] 39: Metal protective layer

[0146] 39a: Surface pattern

[0147] 39b: Graphical Structure

[0148] 40: Seventh level copper foil

[0149] 40a: Fifth transitional level section

[0150] 41a: Second transition level section

[0151] 41b: Third transitional level

[0152] 41c: Second conductive post

[0153] 41d: Fourth transitional level

[0154] 41e: Third conductive post

[0155] 41f: Fourth conductive post

[0156] 41g: Fifth conductive column

[0157] 50a: First mechanical blind hole

[0158] 50b: Second mechanical blind hole

[0159] 51: Third mechanical blind hole

[0160] 50c: First blind hole

[0161] 50d: Second blind hole

[0162] 50e: First back drill hole

[0163] 50f: Second back drill hole

[0164] 50g: Third blind hole

[0165] 60a: Gap

[0166] 61a: Chemical-resistant coating

[0167] 61b: Insulating sheet

[0168] 62a: First common conductive post

[0169] 62b: Second common conductive post

[0170] 63a: Third through hole

[0171] 63b: Fourth through hole

[0172] 80: Waist-shaped groove

[0173] 83: Fourth metal layer

[0174] 83a: Eighth level copper foil

[0175] 83b: Ninth Level Copper Foil

[0176] 83c: Eighth connecting copper foil

[0177] 83d: Ninth connecting copper foil

[0178] 7: Power Module

[0179] Vin+: Positive input terminal

[0180] Vin-: Negative input terminal

[0181] Vo+: Positive output terminal

[0182] Vo-: Negative output terminal

[0183] P: Primary winding

[0184] P1: First end

[0185] P2: Second end

[0186] S1: First secondary winding

[0187] D1: First end

[0188] S2: Second secondary winding

[0189] D2: Second end

[0190] M: Common terminal

[0191] SR1, SR2: Power switches

[0192] A1: First end

[0193] A2: Second end

[0194] B1: First end

[0195] B2: Second end

[0196] C: Capacitor

[0197] D1a: First surface-mount pin

[0198] Va: Second surface-mount pin

[0199] A2a: Third surface-mount pin

[0200] Vb: Fourth surface-mount pin

[0201] D2a: Fifth surface-mount pin

[0202] B2a: Sixth surface-mount pin

[0203] P1a: Seventh surface-mount pin

[0204] P2a: Eighth surface-mount pin

[0205] 71: Circuit board

[0206] 72: Primary-side components

[0207] 73: Secondary-side devices

[0208] 11: Upper surface

[0209] 12: Lower surface Detailed Implementation

[0210] Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can be varied in different ways without departing from the scope of the invention, and the descriptions and illustrations herein are for illustrative purposes only and are not intended to limit the invention.

[0211] Please see Figures 2 to 5 ,in Figure 2 This is a three-dimensional structural diagram of the magnetic component of the present invention. Figure 3 for Figure 2 The diagram shows the exploded structure of the magnetic component. Figure 4 for Figure 2 The diagram shows a cross-sectional view of the magnetic component along section A-A'. Figure 5 for Figure 2 The diagram shows a cross-sectional view of the magnetic component along section B-B'. As shown, the magnetic component 1 includes a magnetic core component 2 and a winding component. The magnetic core component 2 includes a first magnetic post 21 and a second magnetic post 22, which are independently arranged. In this embodiment, the first magnetic post 21 and the second magnetic post 22 are located on opposite sides of the magnetic component 1. The winding component is composed of a substrate 3. The substrate 3 is an integrally formed structure and can be, but is not limited to, a printed circuit board, a ceramic substrate, or a substrate formed by manually winding copper foil. The substrate 3 includes a first accommodating space 31, a second accommodating space 32, and a first metal layer 34. The first accommodating space 31 and the second accommodating space 32 are located within the first metal layer 34, and are located on opposite sides of the substrate 3. The first magnetic post 21 is disposed within the first accommodating space 31, and the second magnetic post 22 is disposed within the second accommodating space 32 (e.g., ...). Figure 4 and Figure 5(As shown). In this embodiment, the winding assembly includes at least a first winding, and the first metal layer 34 may constitute at least a portion of the first winding of the winding assembly.

[0212] In this embodiment, the substrate 3 further includes a first opening 35 and a second opening 36. The first opening 35 is located on a first side 301 of the substrate 3, and the second opening 36 is located on a second side 302 of the substrate 3, wherein the first side 301 and the second side 302 of the substrate 3 are arranged opposite to each other, that is, the first opening 35 and the second opening 36 are arranged opposite to each other. A first accommodating space 31 and a second accommodating space 32 are located between the first opening 35 and the second opening 36, and the first opening 35 is connected to both the first accommodating space 31 and the second accommodating space 32, and the second opening 36 is connected to both the first accommodating space 31 and the second accommodating space 32, that is, the first opening 35, the first accommodating space 31, the second opening 36 and the second accommodating space 32 form a U-shaped space.

[0213] The core assembly 2 also includes a third magnetic post 23 and a fourth magnetic post 24 (e.g., Figure 3 and Figure 5 (As shown). The third magnetic post 23 is located at the first opening 35, and the fourth magnetic post 24 is located at the second opening 36. The first magnetic post 21 and the second magnetic post 22 are respectively located between the third magnetic post 23 and the fourth magnetic post 24. The two ends of the third magnetic post 23 are connected to one end of the first magnetic post 21 and one end of the second magnetic post 22, respectively, and the two ends of the fourth magnetic post 24 are connected to the other ends of the first magnetic post 21 and the other end of the second magnetic post 22, respectively. In this embodiment, the first magnetic post 21, the second magnetic post 22, the third magnetic post 23, and the fourth magnetic post 24 are independently arranged. In some embodiments, the quadrilateral formed by the first magnetic post 21, the second magnetic post 22, the third magnetic post 23, and the fourth magnetic post 24 can be any shape, such as a rectangle, a parallelogram, or a trapezoid, etc.

[0214] Please see Figure 6 This is a flowchart of the manufacturing method of the magnetic component shown in Figure 1. First, step S1 is performed, providing a substrate 3. The substrate 3 is an integrally formed structure and constitutes the winding assembly of the magnetic component 1. The substrate 3 includes a first accommodating space 31, a second accommodating space 32, and a first metal layer 34, wherein the first metal layer 34 constitutes at least a portion of the first winding of the winding assembly. Wherein, as... Figure 5As shown, the width dimensions of the first accommodating space 31 and the second accommodating space 32 are W0, and the distance between the first accommodating space 31 and the second accommodating space 32 is W0'. The actual tolerance of the width dimensions of the first accommodating space 31 and the second accommodating space 32 obtained through processing can be controlled within + / -50um, and the tolerance of the relative position W0' between the first accommodating space 31 and the second accommodating space 32 can also be within + / -50um. Therefore, the dimensional accuracy of the formed first accommodating space 31 and the second accommodating space 32 is very high. Next, step S2 is executed to provide a magnetic core assembly 2. The magnetic core assembly 2 includes a first magnetic post 21 and a second magnetic post 22, wherein the first magnetic post 21 and the second magnetic post 22 are independently arranged, and the first magnetic post 21 and the second magnetic post 22 are respectively arranged in the first accommodating space 31 and the second accommodating space 32, and the first winding is wound on the first magnetic post 21. In step S2, the first magnetic pillar 21 and the second magnetic pillar 22 of the magnetic core assembly 2 can be directly molded to achieve the advantage of easy processing, or the required shapes of the first magnetic pillar 21 and the second magnetic pillar 22 can be directly cut from a magnetic core substrate (not shown) to achieve the advantage of high dimensional accuracy. In order to achieve both the advantages of easy processing and high dimensional accuracy, the first magnetic pillar 21 and the second magnetic pillar 22 can be molded and then finely polished on a machine tool to control the dimensional tolerance within 0um to 50um.

[0215] As can be seen from the above, the first magnetic post 21 and the second magnetic post 22 of the magnetic component 1 of the present invention are independently arranged, and the first magnetic post 21 and the second magnetic post 22 are respectively disposed in the first accommodating space 31 and the second accommodating space 32 of the substrate 3. Therefore, the first magnetic post 21 and the second magnetic post 22 can be polished separately. Since the first magnetic post 21 and the second magnetic post 22 are respectively confined within the substrate 3 by the first accommodating space 31 and the second accommodating space 32, and the first magnetic post 21 and the second magnetic post 22 do not affect each other, the first magnetic post 21 and the second magnetic post 22 only need to be polished separately. The magnetic components are polished to meet the assembly requirements of the corresponding first accommodating space 31 and second accommodating space 32. The positional accuracy of the first magnetic post 21 is completely independent of the positional accuracy of the second magnetic post 22, and the positional accuracy between the first magnetic post 21 and the second magnetic post 22 is entirely determined by the positional accuracy between the first accommodating space 31 and the second accommodating space 32. The dimensional and positional accuracy of the first accommodating space 31 and the second accommodating space 32 formed on the substrate 3 is very high, resulting in high relative positional accuracy between the first magnetic post 21 and the second magnetic post 22. Therefore, the size of the magnetic element 1 achieved by this invention is smaller than that of the magnetic element in the prior art, thereby improving the power density of the module.

[0216] Of course, in some embodiments, the magnetic component 1 may only include a single magnetic post and a single accommodating space, that is, the magnetic component 1 only includes the first magnetic post 21 and does not include the other magnetic posts, and the magnetic component 1 only includes the first accommodating space 31 and does not include the second accommodating space. Its technical features are also similar to those of the magnetic component 1 with multiple magnetic posts and multiple accommodating spaces, so they will not be described in detail here.

[0217] Please see Figure 7A and cooperate Figures 2 to 6 ,in Figure 7A for Figure 2 The diagram shows an assembly schematic of the substrate and core assembly of the magnetic component according to a first embodiment. As shown, the first magnetic post 21, the second magnetic post 22, and the third magnetic post 23 of the core assembly 2 are disposed within the substrate 3 via a first opening 35 on the first side 301 of the substrate 3, while the fourth magnetic post 24 of the core assembly 2 is disposed within the substrate 3 via a second opening 36 on the second side 302 of the substrate 3. The first magnetic post 21 and the second magnetic post 22 are located on the two long sides of the entire substrate 3, i.e., in the first accommodating space 31 and the second accommodating space 32 of the substrate 3, respectively. The first magnetic post 21 and the second magnetic post 22 are approximately parallel, for example, the angle between them is between 0 and 5 degrees. The third magnetic post 23 and the fourth magnetic post 24 are located on the two short sides of the entire substrate 3, i.e., in the first opening 35 and the second opening 36 of the substrate 3, respectively. The third magnetic post 23 and the fourth magnetic post 24 are approximately parallel, for example, the angle between them is between 0 and 5 degrees. In some embodiments, the two sides of the first magnetic pillar 21 can be connected to the third magnetic pillar 23 and the fourth magnetic pillar 24 respectively via an insulating medium (not shown), and the two sides of the second magnetic pillar 22 can be connected to the third magnetic pillar 23 and the fourth magnetic pillar 24 respectively via another insulating medium (not shown). The magnetic component 1 can obtain the required inductance value by adjusting the thickness of the insulating medium. Since the first magnetic pillar 21, the second magnetic pillar 22, the third magnetic pillar 23, and the fourth magnetic pillar 24 in this embodiment are all located within the substrate 3, the insulating medium connecting each magnetic pillar is also located within the substrate 3. To avoid increasing the magnetic loss of the magnetic component 1, the insulating medium can remain in contact with the substrate 3. Furthermore, since the first magnetic pillar 21, the second magnetic pillar 22, the third magnetic pillar 23, and the fourth magnetic pillar 24 are all disposed within the substrate 3, the area of ​​the upper and lower surfaces of the substrate 3 is sufficiently large. Compared to the prior art where the magnetic core is fitted onto the substrate, resulting in limited planar wiring, the technical features of this invention allow for flexible wiring throughout the entire size range of the magnetic component 1. Furthermore, more devices can be placed on the substrate 3 to meet device performance requirements.

[0218] In this embodiment, the length L1 of the substrate 3 is equal to the length L2 of the first magnetic column 21, the width L3 of the third magnetic column 23 plus the width L4 of the fourth magnetic column 24 (i.e., L1 = L2 + L3 + L4), so that the first magnetic column 21 is completely located within the first accommodation space 31, the second magnetic column 22 is completely located within the second accommodation space 32, the third magnetic column 23 is completely located within the first opening 35, and the fourth magnetic column 24 is completely located within the second opening 36. In some other embodiments, the length L1 of the substrate 3 is less than the sum of the length L2 of the first magnetic column 21, the width L3 of the third magnetic column 23, and the width L4 of the fourth magnetic column 24 (i.e., L1 < L2 + L3 + L4), so that the first magnetic column 21 is completely located within the first accommodation space 31, a part of the third magnetic column 23 is located within the first opening 35, another part of the third magnetic column 23 is exposed outside the substrate 3, and a part of the fourth magnetic column 24 is located within the second opening 36, and another part of the fourth magnetic column 24 is exposed outside the substrate 3.

[0219] Please refer to Figure 7B and cooperate with Figures 2 to 6 , where Figure 7B is Figure 2 the assembly schematic diagram of the second embodiment of the substrate of the magnetic component and the magnetic core component as shown. As shown in the figure, the substrate 3 further has a third side 303 and a fourth side 304. The third side 303 and the fourth side 304 are both located between the first side 301 and the second side 302, and the third side 303 and the fourth side 304 are oppositely arranged. In this embodiment, the third side 303 of the substrate 3 may have two third openings 305. The first magnetic column 21 and the second magnetic column 22 are disposed within the substrate 3 through the first opening 35 on the first side 301 of the substrate 3, while the third magnetic column 23 and the fourth magnetic column 24 are respectively disposed within the substrate 3 through the two third openings 305 on the third side 303 of the substrate 3. Therefore, the substrate 3 of this embodiment may only have the first opening 35 and the third opening 305, and does not have the second opening.

[0220] Please refer to Figure 7C and cooperate with Figures 2 to 6 , where Figure 7C is Figure 2The diagram shows an assembly schematic of the substrate and core assembly of the magnetic component in a third embodiment. As shown, the substrate 3 also has a third side 303 and a fourth side 304, both located between the first side 301 and the second side 302, and disposed opposite to each other. In this embodiment, the third side 303 of the substrate 3 may have a third opening 305, and the fourth side 304 of the substrate 3 may have a fourth opening 306. The first magnetic post 21 and the second magnetic post 22 are disposed within the substrate 3 through the first opening 35 of the first side 301 of the substrate 3, while the third magnetic post 23 is disposed within the substrate 3 through the third opening 305 of the third side 303 of the substrate 3, and the fourth magnetic post 24 is disposed within the substrate 3 through the fourth opening 306 of the fourth side 304 of the substrate 3. Therefore, the substrate 3 in this embodiment may only have the first opening 35, the third opening 305, and the fourth opening 306, and may not have the second opening.

[0221] Please see Figure 7D and cooperate Figures 2 to 6 ,in Figure 7D for Figure 2 The diagram shows an assembly schematic of the substrate and core assembly of the magnetic component in a fourth embodiment. In this embodiment, the length L1 of the substrate 3 is equal to the length L2 of the first magnetic post 21, which means that the length L1 of the substrate 3 is equal to the length of the second magnetic post 22. Therefore, in this embodiment, the two sides of the first magnetic post 21 are located on the first side 301 and the second side 302 of the substrate 3, respectively, and the two sides of the second magnetic post 22 are located on the first side 301 and the second side 302 of the substrate 3, respectively, so that the third magnetic post 23 and the fourth magnetic post 24 are located outside the substrate 3. In some embodiments, the two sides of the first magnetic post 21 can be connected to the third magnetic post 23 and the fourth magnetic post 24 via an insulating medium (not shown), respectively, and the two sides of the second magnetic post 22 can be connected to the third magnetic post 23 and the fourth magnetic post 24 via another insulating medium (not shown), wherein the magnetic component 1 can obtain the required inductance value by adjusting the thickness of the insulating medium. Since the third magnetic pillar 23 and the fourth magnetic pillar 24 in this embodiment are located outside the substrate 3, the insulating medium connecting each magnetic pillar is also located outside the substrate 3. Therefore, the amount of insulating medium in this embodiment does not require additional control, making the process more flexible. Furthermore, since the third magnetic pillar 23 and the fourth magnetic pillar 24 in this embodiment are located outside the substrate 3, only the first magnetic pillar 21 and the second magnetic pillar 22 need to be precisely polished to ensure that the first magnetic pillar 21 and the second magnetic pillar 22 of the magnetic core assembly 2 are accurately assembled into the first accommodating space 31 and the second accommodating space 32 of the substrate 3. In other embodiments, the length L1 of the substrate 3 is less than the length of the first magnetic pillar 21. The first magnetic pillar 21 is partially located inside the first accommodating space 31 and partially outside the accommodating space 31. The second magnetic pillar 22 is partially located inside the second accommodating space 32 and partially outside the accommodating space 32.

[0222] Please see Figure 7E and cooperate Figures 2 to 6 ,in Figure 7E for Figure 2 The diagram shows an assembly schematic of the substrate and core assembly of the magnetic component in the fifth embodiment. In this embodiment, the first magnetic post 21 and the third magnetic post 23 are integrally formed to form an L-shaped structure, and the second magnetic post 22 and the fourth magnetic post 24 are also integrally formed to form an L-shaped structure. With this structure, assembly can be completed simply by having the first magnetic post 21 and the third magnetic post 23 correspond to the dimensions of the first accommodating space 31 and the second accommodating space 32, respectively. In this embodiment, after the L-shaped structure formed by the first magnetic post 21 and the third magnetic post 23 is processed by a mold, the dimensional accuracy of the long side of the L-shaped structure formed by the length L2 of the first magnetic post 21 and the width L3 of the third magnetic post 23 needs to be controlled, as well as the dimensional accuracy of the length W1 of the third magnetic post 23 and the width W2 of the first magnetic post 21 needs to be controlled. For example, all sides can be polished using a machine tool to ensure that the long side of the L-shaped structure formed by the length L2 of the first magnetic post 21 and the width L3 of the third magnetic post 23, and the length W1 of the third magnetic post 23, are within a preset accuracy range. Furthermore, by finely polishing the length L2 of the first magnetic post 21, the width W2 of the first magnetic post 21 can be controlled within a preset precision range. In this way, the L-shaped structure formed by the first magnetic post 21 and the third magnetic post 23 can be completely assembled into the substrate 3. Similarly, in the L-shaped structure formed by the second magnetic post 22 and the fourth magnetic post 24, by controlling the dimensional precision of the long side of the L-shaped structure formed by the length L2 of the second magnetic post 22 and the width L4 of the fourth magnetic post 24, and by controlling the dimensional precision of the length W1 of the fourth magnetic post 24 and the width W2 of the second magnetic post 22, the L-shaped structure formed by the second magnetic post 22 and the fourth magnetic post 24 can also be completely assembled into the substrate 3.

[0223] Please see Figure 7F and cooperate Figures 2 to 6 ,in Figure 7F for Figure 2 The diagram shows an assembly schematic of the substrate and core assembly of the magnetic component in the sixth embodiment. In this embodiment, the second side 302 of the substrate 3 is a closed structure. The fourth magnetic post 24 is embedded in the substrate 3 and is adjacent to the second side 302 of the substrate 3, while the first magnetic post 21, the second magnetic post 22 and the third magnetic post 23 are respectively disposed in the substrate 3 through the first opening 35 of the first side 301 of the substrate 3.

[0224] The magnetic component 1 of the present invention utilizes the methods described in the six embodiments above to obtain independent magnetic pillars with high-precision dimensions, namely, a first magnetic pillar 21, a second magnetic pillar 22, a third magnetic pillar 23, and a fourth magnetic pillar 24, which are independently arranged and have high-precision dimensions. Therefore, when the first magnetic pillar 21, the second magnetic pillar 22, the third magnetic pillar 23, and the fourth magnetic pillar 24 of the magnetic component 2 are assembled with the substrate 3, it is only necessary to meet the dimensional assembly accuracy of each magnetic pillar with its corresponding accommodating space. Furthermore, after the first magnetic pillar 21, the second magnetic pillar 22, the third magnetic pillar 23, and the fourth magnetic pillar 24 are assembled with the substrate 3, the relative positional tolerance between the first magnetic pillar 21 and the second magnetic pillar 22 can be completely determined by the first accommodating space 31 and the second accommodating space 32. Therefore, the formation positions of the first accommodating space 31 and the second accommodating space 32 on the substrate 3 only need to consider the assembly method of the first magnetic pillar 21 and the second magnetic pillar 22 with the corresponding first accommodating space 31 and the second accommodating space 32. The dimensional and positional accuracy of forming the first accommodating space 31 and the second accommodating space 32 on the substrate 3 is very high, resulting in a very small relative positional tolerance between the final formed first magnetic pillar 21 and the second magnetic pillar 22. Therefore, the size of the magnetic component 1 achieved by this invention is smaller than that of the magnetic components described in existing solutions, thereby improving the power density of the module. In other words, while keeping the module size unchanged, the reduced size can be allocated to the magnetic core, thereby increasing the cross-sectional area of ​​the magnetic core and effectively reducing magnetic losses. Furthermore, the first magnetic post 21, the second magnetic post 22, the third magnetic post 23, and the fourth magnetic post 24 of the magnetic core assembly 2 of the magnetic component 1 of the present invention can be made of stress-sensitive materials, and a certain gap must be met between the magnetic core assembly 2 and the substrate 3 so that the force exerted by the substrate 3 on the magnetic core assembly 2 during the process or product use is small. Therefore, the magnetic loss of the magnetic core assembly 2 of the magnetic component 1 of the present invention is low, thereby improving the efficiency of the power module in which the magnetic component 1 is used.

[0225] The manufacturing method of substrate 3 will be disclosed below. For ease of understanding, the following embodiments all use the manufacturing of a portion of substrate 3 as an example, such as the portion of substrate 3 that houses the first magnetic post 21. It will be clear that the other portion of substrate 3 that houses the second magnetic post 22 can also be manufactured using the same method, and will not be described in detail here. Please refer to Figures 8A to 8G , it is Figure 2 A cross-sectional structural schematic diagram of the manufacturing method of the first embodiment of the magnetic component shown. First, as... Figure 8A As shown, a base 30a is provided, wherein the base 30a may be constructed of a printed circuit board. Then, as... Figure 8B As shown, a groove 30b is formed in the base 30a, wherein the groove 30b can be formed by machining a groove or laser drilling, etc.

[0226] Then, as Figure 8CAs shown, a top plate 30c is provided on a base 30a and covers a groove 30b, and a first horizontal copper foil 34a is formed on the top plate 30c. The base 30a and the top plate 30c together define a first accommodating space 31, and the top plate 30c is made of insulating material. In this embodiment, the top plate 30c is pressed to the base 30a with insulating adhesive. After high temperature, the insulating adhesive undergoes a cross-linking reaction, bonding the top plate 30c and the base 30a together. The method of bonding the top plate 30c and the base 30a with insulating adhesive will be described later. Figures 9A to 9C Explanation: The materials of the top plate 30c, the insulating adhesive, and the base 30a can all be reinforced fiber composite materials, or the materials of the top plate 30c and the base 30a can be reinforced fiber composite materials, while the material of the insulating adhesive is epoxy resin; this is not a limitation. In this embodiment, the cross-sectional area of ​​the first accommodating space 31 is equivalent to the cross-sectional area of ​​the first magnetic post 21 to be assembled, that is, the cross-sectional area of ​​the first accommodating space 31 and the cross-sectional area of ​​the first magnetic post 21 to be assembled satisfy a certain assembly relationship. For example, the cross-sectional area of ​​the first accommodating space 31 can be designed to be the same size as the cross-sectional area of ​​the first magnetic post 21, while the tolerance control during actual processing increases the cross-sectional size of the first accommodating space 31 and reduces the cross-sectional size of the first magnetic post 21, so that the first magnetic post 21 can be completely assembled in the first accommodating space 31, and the overall space of the substrate 3 can be saved.

[0227] In some embodiments, to prevent the top plate 30c from bending during the pressing of the base 30a, which would compress the area of ​​the first accommodating space 31, the overall thickness of the top plate 30c and the first horizontal copper foil 34a must meet a certain requirement, for example, greater than 0.2 mm. In other embodiments, because the original substrate material forming the top plate 30c and the first horizontal copper foil 34a is relatively thin and cannot meet the actual current flow requirements, the top plate 30c can be pre-treated before bonding to the base 30a. This pre-treatment includes the following three methods. Please refer to... Figure 9A , it is Figure 8C The diagram shows a structural schematic of the bonding method between the top plate of the substrate and the base in the first embodiment. (See attached diagram.) Figure 9A As shown, the top plate 30c is pressed onto the base 30a via insulating adhesive 30z, bonding the top plate 30c and the base 30a together. Copper foil is continuously grown on the surface of the top plate 30c through a metallization process, resulting in a first horizontal copper foil 34a thickness of 0.07 mm and a top plate 30c thickness of 0.13 mm. The overall thickness of the top plate 30c and the first horizontal copper foil 34a reaches 0.2 mm. Therefore, this embodiment simultaneously meets the requirements of the pressing process and the actual current flow requirements. For another pretreatment method, please refer to [link to pretreatment method]. Figure 9B , it is Figure 8C The diagram shows a structural schematic of the bonding method between the top plate of the substrate and the base in the second embodiment. (See diagram for reference.) Figure 9B As shown, the first horizontal copper foil 34a includes a first upper horizontal copper foil 341a, a first lower horizontal copper foil 342a, and a first vertical conductive post 343a. The first upper horizontal copper foil 341a is located on one side of the top plate 30c, and the first lower horizontal copper foil 342a is located on the other side of the top plate 30c. The first lower horizontal copper foil 342a is pressed to the base 30a via insulating adhesive 30z. The first vertical conductive post 343a passes through the top plate 30c to connect between the first upper horizontal copper foil 341a and the first lower horizontal copper foil 342a. The first upper horizontal copper foil 341a and the first lower horizontal copper foil 342a can achieve a parallel connection. Since the thickness of the first upper horizontal copper foil 341a and the first lower horizontal copper foil 342a is 1 oz each, a current carrying capacity of 2 oz can be achieved to meet the current carrying requirements. For the third pretreatment method, please refer to [link / reference]. Figure 9C , it is Figure 8C The diagram shows a structural schematic of the bonding method between the top plate of the substrate and the base in the third embodiment. (See attached diagram.) Figure 9C As shown, the bonding method of the third embodiment is similar to that of the second embodiment, except that the top plate 30c of this embodiment is pressed to the base 30a via insulating adhesive 30z. There is a gap 30y between the first lower horizontal copper foil 342a and the insulating adhesive 30z. The gap 30y is the flow space of the insulating adhesive 30z, so as to avoid some of the insulating adhesive 30z overflowing into the first accommodating space 31 when the top plate 30c and the base 30a are pressed together, thereby reducing the usable space of the first accommodating space 31 and causing difficulties in subsequent assembly.

[0228] The aforementioned metallization process includes electroplating and chemical plating. When the required thickness of the first metal layer 34 is relatively thin, it can be achieved by chemical plating, but the current carrying capacity requirement is relatively small. When the current carrying capacity requirement is large, it can be achieved by electroplating. Of course, before electroplating, a seed layer can be set by chemical plating, sputtering, or vapor deposition to achieve surface conductivity and increase adhesion.

[0229] In practical applications, the terminal load requires lower voltage and higher current, which places higher demands on the current-carrying capacity of the power supply module. To meet this requirement, the copper plating thickness must meet certain specifications, such as 70µm. Figure 9B and 9CThere are several feasible ways to bond the top plate and the base. The first way is to electroplate the first upper horizontal copper foil 341a and the first vertical conductive pillar 343a to the required thickness in one go. However, since the speed of electroplating the surface copper (i.e., electroplating the first upper horizontal copper foil 341a) is usually faster than the speed of electroplating the side wall copper (i.e., electroplating the first vertical conductive pillar 343a), when the thickness of the first vertical conductive pillar 343a reaches 70um, the thickness of the first upper horizontal copper foil 341a will exceed 70um, and the plate thickness will increase. Another feasible implementation method is through-hole plating. This is primarily because the electroplating speed of the surface copper (i.e., the electroplating speed of the first upper horizontal copper foil 341a) is faster than that of the sidewall copper (i.e., the electroplating speed of the first vertical conductive pillar 343a). To address the issue of excessive thickness of the first upper horizontal copper foil 341a, the copper thickness of both the first upper horizontal copper foil 341a and the first vertical conductive pillar 343a can be made less than 70µm during the first electroplating stage. For example, if the thickness of the first upper horizontal copper foil 341a is 40µm, the corresponding thickness of the first vertical conductive pillar 343a will be less than 40µm. Then, a mask is applied to the outer surface of the first upper horizontal copper foil 341a, exposing the through-hole area. Using a metallization process, copper foil continues to grow at the through-hole location, ultimately forming the first vertical conductive pillar 343a with a thickness of 70µm. The thickness of the first upper horizontal copper foil 341a can be achieved through subsequent electroplating processes. This method effectively controls the copper plating thickness. Another feasible approach is to use a via-filling electroplating line. This method allows the growth rate of the first vertical conductive post 343a to be faster than that of the first upper horizontal copper foil 341a. Therefore, the thickness of the first vertical conductive post 343a can reach 70µm in one go, while the thickness of the first upper horizontal copper foil 341a will be less than 70µm. The thickness of the first upper horizontal copper foil 341a can be achieved through subsequent electroplating processes.

[0230] Please refer to the previous document. Figure 8DA second horizontal copper foil 34b is formed on the base 30a, and the second horizontal copper foil 34b and the first horizontal copper foil 34a are located on opposite sides of the first accommodating space 31. In addition, the base 30a also has a plurality of first through holes 30d, each of which penetrates the top plate 30c and the base 30a and is located between the first horizontal copper foil 34a and the second horizontal copper foil 34b. A first connecting copper foil 34c and a second connecting copper foil 34d are formed in the corresponding first through hole 30d to pass through the top plate 30c and the base 30a. The first connecting copper foil 34c is connected between one end of the first horizontal copper foil 34a and one end of the second horizontal copper foil 34b. The second connecting copper foil 34d is connected between the other end of the first horizontal copper foil 34a and the other end of the second horizontal copper foil 34b. The first connecting copper foil 34c, the second connecting copper foil 34d, the first horizontal copper foil 34a and the second horizontal copper foil 34b constitute a first metal layer 34. The portion of the base 30a and the portion of the top plate 30c covered by the first metal layer 34 are defined as a first insulating layer. In this step, in order to simultaneously ensure engineering stability and avoid the first through hole 30d being too close to the first receiving space 31, so as to prevent the glass fiber in the insulating material from being pulled along the drilling direction during drilling and causing the magnetic core to break, and also to avoid the tolerances generated during the mechanical drilling process, the shortest distance between the first through hole 30d and the first receiving space 31 must be greater than 0.2mm.

[0231] Then, as Figure 8E As shown, etch holes 34e are formed on the first horizontal copper foil 34a by chemical etching.

[0232] Then, as Figure 8F As shown, a third horizontal copper foil 37a and a first insulating material 37e are formed on the top plate 30c and the first horizontal copper foil 34a, wherein the first insulating material 37e is located between the third horizontal copper foil 37a and the first horizontal copper foil 34a. A fourth horizontal copper foil 37b and a second insulating material 37f are formed on the base 30a and the second horizontal copper foil 34b, wherein the second insulating material 37f is located between the fourth horizontal copper foil 37b and the second horizontal copper foil 34b, and between the fourth horizontal copper foil 37b and the base 30a. In this embodiment, the third horizontal copper foil 37a and the fourth horizontal copper foil 37b are located on opposite sides of the first accommodating space 31.

[0233] In addition, the base 30a also has a plurality of second through holes 30e, each second through hole 30e penetrating the top plate 30c and the base 30a, and each second through hole 30e is located between the third horizontal copper foil 37a and the fourth horizontal copper foil 37b. A third connecting copper foil 37c and a fourth connecting copper foil 37d are formed in the corresponding second through holes 30e and pass through the top plate 30c and the base 30a. The third connecting copper foil 37c is connected between one end of the third horizontal copper foil 37a and one end of the fourth horizontal copper foil 37b, and the fourth connecting copper foil 37d is connected between the other end of the third horizontal copper foil 37a and the other end of the fourth horizontal copper foil 37b. The third connecting copper foil 37c, the fourth connecting copper foil 37d, the third horizontal copper foil 37a and the fourth horizontal copper foil 37b constitute a second metal layer 37. The first insulating material 37e, the second insulating material 37f, part of the base 30a and part of the top plate 30c covered by the second metal layer 37 are defined as the second insulating layer. Then, as Figure 8F As shown, there are multiple conductive posts 371a between the third horizontal copper foil 37a and the first horizontal copper foil 34a. Each conductive post 371a is connected to the first horizontal copper foil 34a by passing through a first insulating material 37e. There are multiple conductive posts 371b between the fourth horizontal copper foil 37b and the second horizontal copper foil 34b. Each conductive post 371b is connected to the second horizontal copper foil 34b by passing through a second insulating material 37f.

[0234] In addition, a fifth horizontal copper foil 38a, a sixth horizontal copper foil 38b, a fifth connecting copper foil 38c, a sixth connecting copper foil 38d, a third insulating material 38e, and a fourth insulating material 38f are formed outside the second metal layer 37, wherein the third insulating material 38e is located between the fifth horizontal copper foil 38a and the third horizontal copper foil 37a, and the fourth insulating material 38f is located between the sixth horizontal copper foil 38b and the fourth horizontal copper foil 37b. The fifth connecting copper foil 38c is connected between one side of the fifth horizontal copper foil 38a and one side of the sixth horizontal copper foil 38b, and the sixth connecting copper foil 38d is connected between the other side of the fifth horizontal copper foil 38a and the other side of the sixth horizontal copper foil 38b. The fifth horizontal copper foil 38a, the sixth horizontal copper foil 38b, the fifth connecting copper foil 38c, and the sixth connecting copper foil 38d constitute the third metal layer 38, wherein the third insulating material 38e, the fourth insulating material 38f, part of the base 30a, and part of the top plate 30c covered by the third metal layer 38 are defined as the third insulating layer. Next, as... Figure 8F As shown, there are multiple conductive posts 381a between the fifth-level copper foil 38a and the third-level copper foil 37a. Each conductive post 381a is connected to the third-level copper foil 37a by passing through a third insulating material 38e. Similarly, there are multiple conductive posts 381b between the sixth-level copper foil 38b and the fourth-level copper foil 37b. Each conductive post 381b is connected to the fourth-level copper foil 37b by passing through a fourth insulating material 38f. Figure 8FThe structure then constitutes substrate 3. Next, as... Figure 8G As shown, the first magnetic post 21 is disposed within the first accommodating space 31 of the substrate 3 to constitute a portion of the magnetic component 1, and is formed by... Figure 8G It can be seen that the first magnetic post 21 is surrounded by the first horizontal copper foil 34a, the first connecting copper foil 34c, the second horizontal copper foil 34b, and the second connecting copper foil 34d.

[0235] Please continue reading. Figure 8G In this embodiment, the plane containing the first horizontal copper foil 34a constitutes the first horizontal wiring layer m, and the plane containing the second horizontal copper foil 34b constitutes the second horizontal wiring layer n, wherein the first horizontal wiring layer m and the second horizontal wiring layer n are located on opposite sides of the first magnetic pillar 21. The plane containing the third horizontal copper foil 37a constitutes the third horizontal wiring layer o, and the plane containing the fourth horizontal copper foil 37b constitutes the fourth horizontal wiring layer p, wherein the third horizontal wiring layer o and the fourth horizontal wiring layer p are located on opposite sides of the first magnetic pillar 21, and the third horizontal wiring layer o is located outside the first horizontal wiring layer m, and the fourth horizontal wiring layer p is located outside the second horizontal wiring layer n. The plane containing the fifth horizontal copper foil 38a constitutes the fifth horizontal wiring layer q, and the plane containing the sixth horizontal copper foil 38b constitutes the sixth horizontal wiring layer r, wherein the fifth horizontal wiring layer q and the sixth horizontal wiring layer r are located on opposite sides of the first magnetic pillar 21, and the fifth horizontal wiring layer q is located outside the third horizontal wiring layer o, and the sixth horizontal wiring layer r is located outside the fourth horizontal wiring layer p.

[0236] In this embodiment, the first winding of the magnetic component 1 is composed of a portion of a fifth horizontal copper foil 38a, a fifth connecting copper foil 38c, a portion of a sixth horizontal copper foil 38b, a conductive post 381a, a portion of a third horizontal copper foil 37a, a conductive post 371a, a portion of a first horizontal copper foil 34a, a second connecting copper foil 34d, a portion of a second horizontal copper foil 34b, a conductive post 371b, and a portion of a fourth horizontal copper foil 37b and a conductive post 381b. The second winding of the magnetic component 1 is composed of a portion of a third horizontal copper foil 37a, a third connecting copper foil 37c, a portion of a fourth horizontal copper foil 37b, and a fourth connecting copper foil 37d. The connection relationship of the third winding of the magnetic component 1 is the same as that of the first winding. In some embodiments, since the second winding is located between the first and third windings, the second horizontal wiring layer n can be connected to the third horizontal wiring layer o through conductive posts, that is, connected to the surface layer of the magnetic component 1 to form a pad (not shown). The following explanation will elaborate on the connection method of each copper foil segment contained in each winding layer based on the topology.

[0237] In some embodiments, the first winding is entirely composed of the first metal layer 34, the second winding is entirely composed of the second metal layer 37, and the third winding is entirely composed of the third metal layer 38. In some embodiments, the magnetic component 1 may include only the first winding, or the magnetic component 1 may include only the first winding and the second winding. In some embodiments, the first winding is composed of a portion of the first metal layer 34 and a portion of the second metal layer 37, and the second winding is composed of a portion of the first metal layer 34 and a portion of the second metal layer 37. Both the second and third windings are wound around the first magnetic post 21. In some embodiments, the first winding is composed of a portion of the first metal layer 34 and a portion of the third metal layer 38, and the third winding is composed of a further portion of the first metal layer 34 and a further portion of the third metal layer 38, wherein the first windings are connected by conductive posts, and the third windings are connected by another conductive post.

[0238] Please see Figure 10 , it is Figure 2 A cross-sectional structural schematic diagram of the second embodiment of the magnetic component is shown. (See diagram below.) Figure 10 As shown, this embodiment is similar to Figure 8G The first embodiment differs only in that, in this embodiment, at least one edge of the first magnetic post 21 is provided with a chamfer 21a, which is adjacent to the corner of the first metal layer 34, so that when the top plate 30c is pressed against the base 30a via insulating adhesive, part of the insulating adhesive (e.g. Figure 10 When the two quarter-black circles in the middle flow into the first accommodating space 31, the insulating adhesive is prevented from contacting the first magnetic post 21.

[0239] In some embodiments, because mechanical drilling can easily cause deformation of the first accommodating space 31 during actual processing, resulting in a large dimensional tolerance in the formed first accommodating space 31, in some embodiments, a transition horizontal portion and a conductive post connecting to the first connecting copper foil 34c and the second connecting copper foil 34d can be pre-formed on the base 30a to reduce the possibility of deformation caused by mechanical drilling. Please refer to [link to previous embodiments]. Figure 11 , it is Figure 2 A cross-sectional structural schematic diagram of the third embodiment of the magnetic component is shown. (See attached diagram.) Figure 11 As shown, this embodiment is similar to Figure 8GIn the first embodiment, the only difference is that the substrate 3 further includes a seventh horizontal wiring layer s, which is located between the first horizontal wiring layer m and the second horizontal wiring layer n, and is adjacent to the top plate 30c. Furthermore, in this embodiment, in addition to the first horizontal copper foil 34a, the second horizontal copper foil 34b, the first connecting copper foil 34c, and the second connecting copper foil 34d, the first metal layer 34 also includes two first transition horizontal portions 34f. These two first transition horizontal portions 34f are located in the seventh horizontal wiring layer s and are respectively located between the base 30a and the top plate 30c. In some embodiments, the two first transition horizontal portions 34f are further located on opposite sides of the first magnetic post 21. The two first transition horizontal portions 34f are respectively connected to both ends of the first horizontal copper foil 34a through corresponding first conductive posts 34g, and are respectively connected to the first connecting copper foil 34c and the second connecting copper foil 34d.

[0240] Please see Figures 12A to 12G , it is Figure 2 A cross-sectional structural schematic diagram of the manufacturing method of the substrate of the magnetic component shown in the fourth embodiment. First, as... Figure 12A As shown, a base 30a is provided, and a groove 30b is formed in the base 30a. The base 30a can be made of a printed circuit board, and the groove 30b can be formed by machining milling or laser drilling. In this embodiment, the groove 30b can be formed by controlled depth drilling, and the depth-to-width ratio of the groove 30b can be less than 1 to achieve good copper plating quality and thickness. Next, as... Figure 12B As shown, a second horizontal copper foil 34b, a first connecting copper foil 34c, and a second connecting copper foil 34d are formed on the inner wall of the groove 30b. These components are respectively disposed on multiple sides of the inner wall of the first accommodating space 31. The two ends of the second horizontal copper foil 34b are connected to one end of the first connecting copper foil 34c and one end of the second connecting copper foil 34d, respectively. Furthermore, two first transition horizontal portions 34f are formed outside the groove 30b. One of the two first transition horizontal portions 34f is connected to the other end of the first connecting copper foil 34c, and the other first transition horizontal portion 34f is connected to the other end of the second connecting copper foil 34d.

[0241] Then, as Figure 12CAs shown, a top plate 30c is provided on a base 30a to cover a groove 30b, and two first transition horizontal portions 34f are respectively located between the top plate 30c and the base 30a. Among them, the base 30a and the top plate 30c jointly define a first accommodation space 31, and a second horizontal copper foil 34b, a first connection copper foil 34c, and a second connection copper foil 34d are located on the inner wall of the first accommodation space 31. And in this step, a first horizontal copper foil 34a is formed on the top plate 30c. Therefore, the first horizontal copper foil 34a, the second horizontal copper foil 34b, the first connection copper foil 34c, and the second connection copper foil 34d are respectively disposed on multiple sides of the inner wall of the first accommodation space 31.

[0242] Next, as Figure 12D shown, both ends of the first horizontal copper foil 34a are respectively connected to the corresponding first transition horizontal portions 34f through first conductive posts 34g. Among them, the first connection copper foil 34c, the second connection copper foil 34d, the second horizontal copper foil 34b, two first transition horizontal portions 34f, the first horizontal copper foil 34a, and two first conductive posts 34g constitute a first metal layer 34. Only part of the first metal layer 34 is disposed on the inner wall of the first accommodation space 31. And in this embodiment, part of the first metal layer 34 is disposed on multiple sides of the inner wall of the first accommodation space 31. And in this step, etching holes 34e are formed on the first horizontal copper foil 34a by chemical etching. And Figures 12E to 12G the manufacturing method of Figure 8F and Figure 8G is similar to the manufacturing methods of

[0243] and will not be elaborated here.

[0243] As can be seen from the above, in the foregoing embodiment (as Figure 8E shown), the width dimension of the first metal layer 34 of the magnetic component 1 adjacent to one side of the first accommodation space 31 is W1'. The magnetic component 1c of this embodiment directly forms the first connection copper foil 34c and the second connection copper foil 34d in the first accommodation space 31. The width dimension of the formed first metal layer 34 adjacent to one side of the first accommodation space 31 is W1". As Figure 12D shown. Among them, W1' is the width dimension required for the mechanical through-hole process, and W1" is the width dimension required for the laser blind-hole process. Since the size of the laser blind hole is smaller than that of the mechanical through hole itself, and the blind-hole drilling accuracy is higher than that of the mechanical through hole, so W1" < W1'. Similarly, the width of the first metal layer 34 on the other side of the first accommodation space 31 will also be correspondingly reduced, and the size of the finally formed entire module is further reduced compared with the foregoing embodiment, so that the power density of the magnetic component 1c is further improved. In addition, since the width dimension of the magnetic component 1c is reduced, the current path can be shortened, so that the winding loss will be correspondingly reduced and the efficiency is improved.

[0244] In this embodiment, since the second horizontal copper foil 34b, the first connecting copper foil 34c, and the second connecting copper foil 34d are disposed on the inner wall of the first accommodating space 31, it can be understood that only a portion of the first metal layer 34 is disposed on the inner wall of the first accommodating space 31. In other embodiments, only a portion of the second horizontal copper foil 34b, the first connecting copper foil 34c, and the second connecting copper foil 34d may be disposed on the inner wall of the first accommodating space 31. For example, only the first connecting copper foil 34c and the second connecting copper foil 34d may be disposed on the inner wall of the first accommodating space 31, or only the first connecting copper foil 34c may be disposed on the inner wall of the first accommodating space 31, or only a portion of the first connecting copper foil 34c may be disposed on the inner wall of the first accommodating space 31. Therefore, this will not be elaborated further.

[0245] In some embodiments, the surface of the first metal layer 34 can be coated, dipped, electrophoretically coated, electrostatically sprayed, chemical vapor deposition, physical vapor deposition, sputtering, vapor deposition, or printed to form a thin insulating layer (not shown). The thickness of this insulating layer needs to be less than half the thickness of the second insulating layer. The second insulating layer is composed of a first insulating material 37e, a second insulating material 37f, a portion of the base 30a, and a portion of the top plate 30c, all covered by the second metal layer 37. This can prevent the first metal layer 34 from being oxidized and also meet the insulation conditions between the first metal layer 34 and the first magnetic post 21.

[0246] Please see Figure 13 , it is Figure 2 A cross-sectional structural schematic diagram of the fifth embodiment of the magnetic component is shown. (See attached diagram.) Figure 13 As shown, the magnetic component 1d in this embodiment is similar to the magnetic component 1c in the fourth embodiment, except that in the magnetic component 1d of this embodiment, the hole for accommodating the first conductive post 34g is a mechanically formed blind hole, wherein the mechanical method can be controlled depth drilling or controlled depth milling, etc. Furthermore, after the mechanical blind hole is formed, the first conductive post 34g is further formed through a metallization process.

[0247] Please see Figures 14A to 14G , it is Figure 2 A cross-sectional structural schematic diagram of the manufacturing method of the sixth embodiment of the magnetic component shown. First, as... Figure 14A As shown, a base 30a is provided, and a groove 30b is formed in the base 30a, and this step is similar to... Figure 12A Therefore, I will not elaborate further here. Next, as... Figure 14B As shown, a second horizontal copper foil 34b, a first connecting copper foil 34c, and a second connecting copper foil 34d are formed on the inner wall of the groove 30b, and two first transition horizontal portions 34f are formed outside the groove 30b. This step is similar to... Figure 12B Therefore, I will not elaborate further here.

[0248] Then, as Figure 14C As shown, a metal protective layer 39 is formed on the second horizontal copper foil 34b, the first connecting copper foil 34c, the second connecting copper foil 34d, and the two first transition horizontal portions 34f. In this embodiment, since tin is inexpensive and reacts very slowly in strong oxidizing solvents, resulting in excellent protective effects, the metal protective layer 39 can be made of tin. Of course, the metal protective layer 39 can also be made of tin alloy, gold, or gold alloy materials, and is not limited thereto. Furthermore, in this embodiment, in order to perform the subsequent pattern definition of the first metal layer 34 surrounding the first accommodating space 31, the metal protective layer 39 can be formed by electroplating or chemical plating techniques, which makes the surface conformability of the metal protective layer 39 better, avoids the bubbles generated when using organic materials as a protective layer, and achieves the protective layer effect without removing the organic materials. In other embodiments, the thickness of the metal protective layer 39 can be adjusted according to the different protective capabilities of the materials used in the metal protective layer 39. For example, if the metal protective layer 39 is made of tin or a tin alloy, the thickness of the metal protective layer 39 can be between 1 μm and 20 μm. Alternatively, if the metal protective layer 39 is made of gold or a gold alloy, the thickness of the metal protective layer 39 can be between 0.1 μm and 2 μm.

[0249] Then, as Figure 14D As shown, a portion of the metal protective layer 39 is removed using direct writing technology to form a surface pattern 39a, exposing a portion of the second horizontal copper foil 34b of the first metal layer 34. In this embodiment, the direct writing technology can be laser direct writing technology, characterized by using a focused beam, electron beam, or ion beam to directly define the pattern. It requires no mask, offers flexible production, and can produce a series of products according to different application needs, thereby greatly improving the time to market. Furthermore, due to the use of direct writing technology, the sample and its surface state can be accurately located using optical recognition technology before the direct writing process. Based on this, the direct writing path for each sample can be optimized individually, increasing yield, reducing requirements on upstream processes, and thus improving product competitiveness. In addition, in this embodiment, since the metal protective layer 39 is disposed on the first metal layer 34, the first metal layer 34 can provide excellent thermal insulation during the laser direct writing process, preventing any impact on the magnetic pillar.

[0250] Then, as Figure 14E As shown, the second horizontal copper foil 34b of the first metal layer 34 exposed in the surface pattern 39a is etched to form a pattern structure 39b, and the exposed part of the base 30a, wherein the second horizontal copper foil 34b of the first metal layer 34 is divided into two parts by the pattern structure 39b, that is, the part representing the first metal layer 34 located on the inner wall of the first accommodating space 31 is segmented.

[0251] Then, as Figure 14F As shown, the remaining metal protective layer 39 is removed. In some embodiments, the removal of the metal protective layer 39 can be chosen based on its material. For example, if the metal protective layer 39 is made of tin, it can be removed using an etching solution after etching the relevant patterns onto the covering first metal layer 34. Of course, if the metal protective layer 39 is made of gold, it can be retained. Since the metal protective layer 39 made of gold is extremely thin, the edges can be removed using processes such as water jetting, sandblasting, or ultrasonic cleaning. In other embodiments, the first metal layer 34 can be mechanically divided. Figure 14G The manufacturing method is similar to Figures 12C to 12G The manufacturing method is not described in detail here.

[0252] Please see Figures 15A to 15G , it is Figure 2 A cross-sectional structural schematic diagram of the manufacturing method of the seventh embodiment of the magnetic component shown. First, as... Figure 15A As shown, a base 30a is provided, and a groove 30b is formed in the base 30a, and this step is similar to... Figure 12A Therefore, I will not elaborate further here. Next, as... Figure 15B As shown, a second horizontal copper foil 34b, a first connecting copper foil 34c, and a second connecting copper foil 34d are formed on the inner wall of the groove 30b. The two ends of the second horizontal copper foil 34b are respectively connected to one end of the first connecting copper foil 34c and one end of the second connecting copper foil 34d. Furthermore, two first transition horizontal portions 34f are formed outside the groove 30b. One of the two first transition horizontal portions 34f is connected to the other end of the first connecting copper foil 34c, and the other first transition horizontal portion 34f is connected to the other end of the second connecting copper foil 34d. Furthermore, in this step, a fifth connecting copper foil 38c, a sixth connecting copper foil 38d, a seventh horizontal copper foil 40, and two second transition horizontal portions 41a are formed on the outside of the base 30a. The fifth connecting copper foil 38c and the sixth connecting copper foil 38d are located on opposite sides of the base 30a, and the two ends of the seventh horizontal copper foil 40 are respectively connected to one end of the fifth connecting copper foil 38c and one end of the sixth connecting copper foil 38d. One of the two second transition horizontal portions 41a is connected to the other end of the fifth connecting copper foil 38c, and the other of the two second transition horizontal portions 41a is connected to the other end of the sixth connecting copper foil 38d. Figure 15BIn the process, a mask can be added to the bottom surface of the base 30a, and then a metal wiring layer is formed on the side, top surface and inner wall of the groove 30b of the base 30a by a metallization process. Since the bottom surface of the base 30a is covered with a mask, copper foil will not continue to grow. That is, only the base copper of the base 30a is retained, and the connection of the wiring layer is blocked by etching to form the required fifth connecting copper foil 38c, sixth connecting copper foil 38d, seventh horizontal copper foil 40 and second transition horizontal part 41a.

[0253] Then, as Figure 15C As shown, a top plate 30c is provided on the base 30a and covers the groove 30b, and also covers two first transition horizontal portions 34f and two second transition horizontal portions 41a, wherein the top plate 30c and the base 30a together define a first accommodating space 31. In this step, a first horizontal copper foil 34a is formed on the top plate 30c, and the two ends of the first horizontal copper foil 34a are respectively connected to the corresponding first transition horizontal portions 34f through first conductive posts 34g. The first connecting copper foil 34c, the second connecting copper foil 34d, the second horizontal copper foil 34b, the two first transition horizontal portions 34f, the first horizontal copper foil 34a and the two first conductive posts 34g constitute a first metal layer 34. In this step, two third transition horizontal sections 41b are formed on the top plate 30c. One of the two third transition horizontal sections 41b is connected to the corresponding second transition horizontal section 41a via a second conductive post 41c, and the other of the two third transition horizontal sections 41b is connected to the corresponding second transition horizontal section 41a via another second conductive post 41c. The second horizontal copper foil 34b, the first connecting copper foil 34c, and the second connecting copper foil 34d are located on the inner wall of the first accommodating space 31.

[0254] Then, as Figure 15DAs shown, a third horizontal copper foil 37a and a first insulating material 37e are formed on the top plate 30c and the first horizontal copper foil 34a, wherein the first insulating material 37e is located between the third horizontal copper foil 37a and the first horizontal copper foil 34a. Furthermore, the base 30a also has a plurality of second through holes 30e, each second through hole 30e penetrating the top plate 30c and the base 30a, and located between the third horizontal copper foil 37a and the seventh horizontal copper foil 40. A third connecting copper foil 37c and a fourth connecting copper foil 37d are formed within the corresponding second through holes 30e and pass through the top plate 30c and the base 30a, wherein the third connecting copper foil 37c is connected between one end of the third horizontal copper foil 37a and one end of the seventh horizontal copper foil 40, and the fourth connecting copper foil 37d is connected between the other end of the third horizontal copper foil 37a and the other end of the seventh horizontal copper foil 40. There are multiple conductive posts 371a between the third horizontal copper foil 37a and the first horizontal copper foil 34a. Each conductive post 371a is connected to the first horizontal copper foil 34a by passing through a first insulating material 37e. There are multiple conductive posts 371b between the fourth horizontal copper foil 37b and the second horizontal copper foil 34b. Each conductive post 371b is connected to the second horizontal copper foil 34b by passing through a second insulating material 37f.

[0255] Then, as Figure 15E As shown, the two ends of the third horizontal copper foil 37a are divided by etching, forming two fourth transition horizontal portions 41d at both ends of the third horizontal copper foil 37a. The two fourth transition horizontal portions 41d are respectively connected to the corresponding third transition horizontal portions 41b through third conductive posts 41e. In addition, the seventh horizontal copper foil 40 is divided into a fourth horizontal copper foil 37b and two fifth transition horizontal portions 40a by etching. One of the two fifth transition horizontal portions 40a is connected to the fifth connecting copper foil 38c, and the other of the two fifth transition horizontal portions 40a is connected to the sixth connecting copper foil 38d. The fourth horizontal copper foil 37b is located between the two fifth transition horizontal portions 40a. The third connecting copper foil 37c, the fourth connecting copper foil 37d, the third horizontal copper foil 37a, and the fourth horizontal copper foil 37b constitute the second metal layer 37.

[0256] Then, as Figure 15FAs shown, a fifth horizontal copper foil 38a and a third insulating material 38e are formed on a third horizontal copper foil 37a and two fourth transition horizontal portions 41d. A portion of the third insulating material 38e is located between the fifth horizontal copper foil 38a and the third horizontal copper foil 37a, while the remaining portion is located between the fifth horizontal copper foil 38a and the two fourth transition horizontal portions 41d. The fifth horizontal copper foil 38a is connected to the corresponding fourth transition horizontal portion 41d via two fourth conductive posts 41f. In this step, a sixth horizontal copper foil 38b and a second insulating material 37f are formed on a fourth horizontal copper foil 37b and two fifth transition horizontal portions 40a. A portion of the second insulating material 37f is located between the sixth horizontal copper foil 38b and the fourth horizontal copper foil 37b, while the remaining portion is located between the sixth horizontal copper foil 38b and the two fifth transition horizontal portions 40a. The sixth horizontal copper foil 38b is connected to the corresponding fifth transition horizontal portion 40a via two fifth conductive posts 41g. The third metal layer 38 is formed by the fifth horizontal copper foil 38a, the sixth horizontal copper foil 38b, the fifth connecting copper foil 38c, the sixth connecting copper foil 38d, two fifth transition horizontal portions 40a, two second transition horizontal portions 41a, two third transition horizontal portions 41b, two second conductive pillars 41c, two fourth transition horizontal portions 41d, two third conductive pillars 41e, two fourth conductive pillars 41f, and two fifth conductive pillars 41g. In this embodiment, since a portion of the first metal layer 34 and a portion of the third metal layer 38 can be formed simultaneously in a single electroplating process, both manufacturing time and manufacturing cost are reduced.

[0257] In addition, by Figure 15F It is known that one end of each of the two second transition level sections 41a, one of the two third transition level sections 41b, one of the two fourth transition level sections 41d, and one end of the fifth level copper foil 38a are connected by a first conductive part, wherein the first conductive part is composed of one of the two second conductive posts 41c, one of the two third conductive posts 41e, and one of the two fourth conductive posts 41f. One of the two fifth transition level sections 40a is connected to the sixth level copper foil 38b by a second conductive part, wherein the second conductive part is composed of one of the two fifth conductive posts 41g. The other end of the other two second transition level sections 41a, the other two third transition level sections 41b, the other two fourth transition level sections 41d, and the fifth level copper foil 38a are connected by a third conductive part, wherein the third conductive part is composed of the other two second conductive posts 41c, the other two third conductive posts 41e, and the other two fourth conductive posts 41f. The other of the two fifth transition levels 40a is connected to the sixth level copper foil 38b via a fourth conductive part, wherein the fourth conductive part is composed of the other of the two fifth conductive posts 41g.

[0258] Then, as Figure 15G As shown, the first magnetic pillar 21 is disposed within the first accommodating space 31 of the substrate 3 to constitute a portion of the magnetic component 1f. Furthermore, in this embodiment, the plane containing the first horizontal copper foil 34a and the two third transition horizontal portions 41b constitutes a first horizontal wiring layer m, with the first horizontal copper foil 34a located between the two third transition horizontal portions 41b. The plane containing the second horizontal copper foil 34b constitutes a second horizontal wiring layer n, wherein the first horizontal wiring layer m and the second horizontal wiring layer n are located on opposite sides of the first magnetic pillar 21. The plane containing the third horizontal copper foil 37a and the two fourth transition horizontal portions 41d constitutes a third horizontal wiring layer o, with the third horizontal copper foil 37a located between the two fourth transition horizontal portions 41d. The plane containing the fourth horizontal copper foil 37b and the two fifth transition horizontal portions 40a constitutes the fourth horizontal wiring layer p. The fourth horizontal copper foil 37b is located between the two fifth transition horizontal portions 40a. The third horizontal wiring layer o and the fourth horizontal wiring layer p are located on opposite sides of the first magnetic pillar 21, with the third horizontal wiring layer o located outside the first horizontal wiring layer m and the fourth horizontal wiring layer p located outside the second horizontal wiring layer n. The plane containing the fifth horizontal copper foil 38a constitutes the fifth horizontal wiring layer q, and the plane containing the sixth horizontal copper foil 38b constitutes the sixth horizontal wiring layer r. The fifth horizontal wiring layer q and the sixth horizontal wiring layer r are located on opposite sides of the first magnetic pillar 21, with the fifth horizontal wiring layer q located outside the third horizontal wiring layer o and the sixth horizontal wiring layer r located outside the fourth horizontal wiring layer p. Furthermore, the plane containing the two second transition horizontal sections 41a and the two first transition horizontal sections 34f constitutes a seventh horizontal wiring layer s. The seventh horizontal wiring layer s is located between the first horizontal wiring layer m and the second horizontal wiring layer n, and is adjacent to the top plate 30c. The two first transition horizontal sections 34f are located between the two second transition horizontal sections 41a.

[0259] Please see Figure 16 , it is Figure 2 A cross-sectional structural schematic diagram of the eighth embodiment of the magnetic component shown. (As shown) Figure 16 As shown, the magnetic component 1g in this embodiment is similar to... Figure 8G The difference between the magnetic component 1 and the one in this embodiment is that the substrate 3 of the magnetic component 1g is connected between the fifth horizontal copper foil 38a and the first horizontal copper foil 34a via a first mechanical blind hole 50a, and is connected between the sixth horizontal copper foil 38b and the second horizontal copper foil 34b via a second mechanical blind hole 50b. The substrate 3 connected by mechanical blind holes can be made thicker, thus having a wider range of applications.

[0260] Please see Figure 17 , it is Figure 2 A cross-sectional structural schematic diagram of the ninth embodiment of the magnetic component is shown. (See diagram below.) Figure 17 As shown, the magnetic component 1h in this embodiment is similar to... Figure 12G The difference between the magnetic component 1c and the magnetic component 1h in this embodiment lies only in that the substrate 3 of the magnetic component 1h is connected between the fifth horizontal copper foil 38a and the first horizontal copper foil 34a via a first mechanical blind hole 50a, and between the sixth horizontal copper foil 38b and the second horizontal copper foil 34b via a second mechanical blind hole 50b. Furthermore, it is connected between the first horizontal copper foil 34a and the corresponding first transition horizontal portion 34f via a third mechanical blind hole 51. The substrate 3 connected by mechanical blind holes can be made thicker, thus having a wider range of applications.

[0261] Please see Figures 18A to 18F , it is Figure 2 A cross-sectional structural schematic diagram of the manufacturing method of the tenth embodiment of the magnetic component shown. First, as... Figure 18A As shown, a top plate 30c and a base 30a are provided, wherein the base 30a includes a bottom surface 30f, a first side wall 30g and a second side wall 30h, and the first side wall 30g and the second side wall 30h are located between the top plate 30c and the bottom surface 30f. In this step, two first transition horizontal sections 34f, two sixth transition horizontal sections 34h, a first connecting copper foil 34c, and a second connecting copper foil 34d are formed. One of the two first transition horizontal sections 34f is located between the top plate 30c and the first side wall 30g, and the other of the two first transition horizontal sections 34f is located between the top plate 30c and the second side wall 30h. One of the two sixth transition horizontal sections 34h is located between the bottom surface 30f and the first side wall 30g, and the other of the two sixth transition horizontal sections 34h is located between the bottom surface 30f and the second side wall 30h. The first connecting copper foil 34c is located on the inner wall of the first side wall 30g and is connected between one of the two first transition horizontal sections 34f and one of the two sixth transition horizontal sections 34h. The second connecting copper foil 34d is located on the inner wall of the second side wall 30h and is connected between the other of the two first transition horizontal sections 34f and the other of the two sixth transition horizontal sections 34h.

[0262] In addition, please continue to refer to Figure 18AA first horizontal copper foil 34a and a third horizontal copper foil 37a are formed on both sides of the top plate 30c, wherein the first horizontal copper foil 34a is located between the top plate 30c and the two first transition horizontal portions 34f. A second horizontal copper foil 34b and a fourth horizontal copper foil 37b are formed on both sides of the bottom surface 30f, wherein the second horizontal copper foil 34b is located between the bottom surface 30f and the two sixth transition horizontal portions 34h. In this embodiment, the top plate 30c, the bottom surface 30f, the first sidewall 30g, and the second sidewall 30h can be bonded together by pressing with an insulating medium (not shown) to form an integral structure, defining the first accommodating space 31. The first sidewall 30g and the second sidewall 30h are provided on the continuous structure by a connecting rib 34i to ensure that the first sidewall 30g and the second sidewall 30h are an integral structure.

[0263] Then, as Figure 18B As shown, a plurality of second through holes 30e, a plurality of first blind holes 50c, and a plurality of second blind holes 50d are formed. Each second through hole 30e is connected between a third horizontal copper foil 37a and a fourth horizontal copper foil 37b. Each first blind hole 50c is connected between the third horizontal copper foil 37a, the first horizontal copper foil 34a, and the corresponding first transition horizontal portion 34f. Each second blind hole 50d is connected between the fourth horizontal copper foil 37b, the second horizontal copper foil 34b, and the corresponding sixth transition horizontal portion 34h. Furthermore, in this step, conductive posts can be provided within the plurality of second through holes 30e, and conductive posts can also be provided within the plurality of first blind holes 50c and the plurality of second blind holes 50d.

[0264] Then, as Figure 18C As shown, a back-drilling process is used to remove conductive pillars in a plurality of first blind holes 50c to form a plurality of first back-drilled holes 50e, which are used to disconnect the electrical connection between the third horizontal copper foil 37a and the first horizontal copper foil 34a; and a back-drilling process is used to remove conductive pillars in a plurality of second blind holes 50d to form a plurality of second back-drilled holes 50f, which are used to disconnect the electrical connection between the fourth horizontal copper foil 37b and the second horizontal copper foil 34b. The first horizontal copper foil 34a, the second horizontal copper foil 34b, the first transition horizontal portion 34f, the sixth transition horizontal portion 34h, the first connecting copper foil 34c, and the second connecting copper foil 34d constitute the first metal layer 34, and the conductive pillars in the third horizontal copper foil 37a, the fourth horizontal copper foil 37b, and the plurality of second through holes 30e constitute the second metal layer 37. In this embodiment, the multiple first back-drilled holes 50e and multiple second back-drilled holes 50f can be further filled using a plugging process. This plugging process includes resin plugging or green oil plugging, etc., and the first back-drilled holes 50e and second back-drilled holes 50f are mechanically blind hole structures. A certain level of precision must be ensured during back drilling, for example, controlling the precision within + / - 50µm. Next, as... Figure 18DAs shown, etched holes 37g are formed from third-level copper foil 37a and fourth-level copper foil 37b through a metallization process. Figure 18E and Figure 18F The manufacturing method is similar to Figure 8F and Figure 8G The manufacturing method is not described in detail here.

[0265] In this embodiment, the first metal layer 34 and the second metal layer 37 are formed simultaneously through the first back-drilled hole 50e and the second back-drilled hole 50f, greatly reducing the process path and lowering costs. Furthermore, the first back-drilled hole 50e and the second back-drilled hole 50f are mechanical through holes or mechanical blind holes. Compared to the laser-drilled hole structure process of HDI (High Density Interconnector) boards, this structure uses a conventional printed circuit board process with a very mature production line, further reducing costs. In this embodiment, the first metal layer 34 is disposed on the four sides of the inner wall of the first accommodating space 31, compared to... Figure 17 As shown in the structure, in this embodiment, the thickness of the substrate above the first magnetic post 21 is significantly reduced. If the overall height of the magnetic component remains unchanged, the reduced size can be attributed to the height of the magnetic post, increasing the cross-sectional area of ​​the magnetic post, thereby reducing magnetic loss and significantly improving efficiency.

[0266] In some cases, in the first to tenth embodiments described above, only the first metal layer 34 and the second metal layer 37 may be provided on the substrate 3, without the third metal layer.

[0267] Please see Figures 19A to 19F , it is Figure 2 A cross-sectional structural schematic diagram of the manufacturing method of the eleventh embodiment of the magnetic component shown. First, as... Figure 19A As shown, a base 30a is provided, and a groove 30b is formed in the base 30a, wherein a second horizontal copper foil 34b, a first connecting copper foil 34c and a second connecting copper foil 34d are formed on the inner wall of the groove 30b.

[0268] Then, as Figure 19BAs shown, a top plate 30c, a chemical-resistant plating layer 61a, a first horizontal copper foil 34a, and a third horizontal copper foil 37a are provided. The third horizontal copper foil 37a is located on the first side of the top plate 30c, and the chemical-resistant plating layer 61a and the first horizontal copper foil 34a are located on the second side of the top plate 30c. The chemical-resistant plating layer 61a divides the first horizontal copper foil 34a into two parts. Next, the top plate 30c and the base 30a are pressed together to form a first accommodating space 31. The first horizontal copper foil 34a, the second horizontal copper foil 34b, the first connecting copper foil 34c, the second connecting copper foil 34d, and the chemical-resistant plating layer 61a are located within the first accommodating space 31. A gap 60a is formed between a portion of the first horizontal copper foil 34a and the first connecting copper foil 34c, and a gap 60a is also formed between another portion of the first horizontal copper foil 34a and the second connecting copper foil 34d. In this embodiment, the anti-coating layer 61a is used to prevent excess copper from being plated onto the first horizontal copper foil 34a during the copper plating process, that is, to ensure that the first horizontal copper foil 34a consists of two separate left and right parts at the position of the anti-coating layer 61a.

[0269] Then, as Figure 19C As shown in the left figure, a plurality of second through holes 30e are formed in the base 30a using a drilling process, and each second through hole 30e further penetrates the top plate 30c and the third horizontal copper foil 37a, wherein the drilling process can be mechanical drilling. In some embodiments, a third blind hole 50g can be formed in the top plate 30c and the third horizontal copper foil 37a using a drilling process, and a fourth blind hole 50h can also be formed in the base 30a, wherein the drilling process can be laser drilling. Figure 19C The right image is a schematic diagram of the cross-sectional structure along section C-C' of the left image, as shown below. Figure 19C As shown in the right figure, the substrate 3 also has a waist-shaped groove 80, which in some embodiments may be connected to the first accommodating space 31.

[0270] Then, as Figure 19DAs shown, a fourth horizontal copper foil 37b is formed on the base 30a, wherein the fourth horizontal copper foil 37b and the third horizontal copper foil 37a are located on opposite sides of the first accommodating space 31. Furthermore, a third connecting copper foil 37c and a fourth connecting copper foil 37d are formed in corresponding second through holes 30e, such that the third connecting copper foil 37c is connected between one end of the third horizontal copper foil 37a and one end of the fourth horizontal copper foil 37b, and the fourth connecting copper foil 37d is connected between the other end of the third horizontal copper foil 37a and the other end of the fourth horizontal copper foil 37b. Furthermore, in this step, the gaps 60a are all filled with copper foil, so that the first horizontal copper foil 34a is connected to the first connecting copper foil 34c, and the first horizontal copper foil 34a is connected to the second connecting copper foil 34d. The first connecting copper foil 34c, the second connecting copper foil 34d, the first horizontal copper foil 34a and the second horizontal copper foil 34b constitute the first metal layer 34, and the third connecting copper foil 37c, the fourth connecting copper foil 37d, the third horizontal copper foil 37a and the fourth horizontal copper foil 37b constitute the second metal layer 37. In this embodiment, the first metal layer 34 is completely disposed on the inner wall of the first accommodating space 31. Since the anti-chemical plating layer 61a is disposed, seed copper will not be plated at the location where the anti-chemical plating layer 61a is disposed during the metallization process in this step, and the electroplating process will not form connecting copper foil at that location.

[0271] Then, as Figure 19E As shown, a fifth horizontal copper foil 38a, a sixth horizontal copper foil 38b, a fifth connecting copper foil 38c, a sixth connecting copper foil 38d, a third insulating material 38e, and a fourth insulating material 38f are formed outside the second metal layer 37. The third insulating material 38e is located between the fifth horizontal copper foil 38a and the third horizontal copper foil 37a, and the fourth insulating material 38f is located between the sixth horizontal copper foil 38b and the fourth horizontal copper foil 37b. The fifth connecting copper foil 38c is connected between one side of the fifth horizontal copper foil 38a and one side of the sixth horizontal copper foil 38b, and the sixth connecting copper foil 38d is connected between the other side of the fifth horizontal copper foil 38a and the other side of the sixth horizontal copper foil 38b. The fifth horizontal copper foil 38a, the sixth horizontal copper foil 38b, the fifth connecting copper foil 38c, and the sixth connecting copper foil 38d constitute the third metal layer 38. In this step, the third metal layer 38 is formed by drilling and metallization processes. The first metal layer 34 and the second metal layer 37 are connected by conductive pillars, and the second metal layer 37 and the third metal layer 38 are also connected by conductive pillars. The conductive pillars are formed by mechanical drilling or laser drilling. In some embodiments, the fifth connecting copper foil 38c and the sixth connecting copper foil 38d are formed by separating the conductive pillars shared by two adjacent substrates 3 during continuous lamination processing.

[0272] Then, as Figure 19FAs shown, a first magnetic post 21 is placed into a first accommodating space 31 to form a magnetic component 1j. In some embodiments, the magnetic component 1j may only include a first metal layer 34 and a third metal layer 38, without the second metal layer 37. In other embodiments, the magnetic component 1j may also only include a first metal layer 34, without the second metal layer 37 and the third metal layer 38.

[0273] In this embodiment, since the first metal layer 34 of the magnetic component 1j is entirely formed on the inner wall of the first accommodating space 31, no additional metal components are needed to connect it to other metal layers, such as a transition horizontal portion, nor is an additional insulating layer needed to disconnect it from other metal layers. Therefore, the width and height of the first metal layer 34 of the magnetic component 1j in this embodiment are shorter, and the overall size of the magnetic component 1j is further reduced, thus increasing the power density of the magnetic component 1j. If the size of the magnetic component 1j is fixed, the optimized size can be transferred to the magnetic core, thereby increasing the size of the magnetic core and effectively reducing the loss of the magnetic core, thereby improving the efficiency of the magnetic component 1j.

[0274] It should be specifically noted that although the first metal layer 34 is completely located on the inner wall of the first accommodating space 31, the plane where the first horizontal copper foil 34a of the first metal layer 34 is located can still constitute the first horizontal wiring layer, and the plane where the second horizontal copper foil 34b of the first metal layer 34 is located can still constitute the second horizontal wiring layer.

[0275] Please see Figures 20A to 20E , it is Figure 2 A cross-sectional structural schematic diagram of the manufacturing method of the twelfth embodiment of the magnetic component shown. First, as... Figure 20A As shown, a base 30a is provided, and a groove 30b is formed in the base 30a, wherein a second horizontal copper foil 34b, a first connecting copper foil 34c and a second connecting copper foil 34d are formed on the inner wall of the groove 30b.

[0276] Then, as Figure 20B As shown, Figure 20B The manufacturing method is similar to Figure 19B In the manufacturing method of this embodiment, the substrate 3 further includes two insulating sheets 61b. One of the two insulating sheets 61b is located between one end of the top plate 30c and the base 30a, and the other insulating sheet 61b is located between the other end of the top plate 30c and the base 30a.

[0277] Then, as Figure 20CAs shown, a fourth horizontal copper foil 37b is formed on the base 30a, wherein the third horizontal copper foil 37a and the fourth horizontal copper foil 37b are located on opposite sides of the first magnetic post 21. In this step, a first common conductive post 62a and a second common conductive post 62b are formed. The first common conductive post 62a is connected between one end of the third horizontal copper foil 37a and one end of the fourth horizontal copper foil 37b, and one of the two insulating sheets 61b is passed through it. The second common conductive post 62b is connected between the other end of the third horizontal copper foil 37a and the other end of the fourth horizontal copper foil 37b, and the other insulating sheet 61b is passed through it.

[0278] Then, as Figure 20D As shown, a mechanical segmentation process is used to cut the first common conductive post 62a and the second common conductive post 62b, respectively, so that the first common conductive post 62a is divided into the third connecting copper foil 37c and the fifth connecting copper foil 38c, and the second common conductive post 62b is divided into the fourth connecting copper foil 37d and the sixth connecting copper foil 38d. Furthermore, in this step, both ends of the third horizontal copper foil 37a are cut to form two fourth transition horizontal portions 41d, and both ends of the fourth horizontal copper foil 37b are cut to form two fifth transition horizontal portions 40a. The first horizontal copper foil 34a, the second horizontal copper foil 34b, the first connecting copper foil 34c, and the second connecting copper foil 34d constitute the first metal layer 34, while the third connecting copper foil 37c, the fourth connecting copper foil 37d, the third horizontal copper foil 37a, and the fourth horizontal copper foil 37b constitute the second metal layer 37.

[0279] Then, as Figure 20E As shown, a fifth horizontal copper foil 38a and a third insulating material 38e are formed on a third horizontal copper foil 37a, wherein the third insulating material 38e is located between the fifth horizontal copper foil 38a and the third horizontal copper foil 37a. The two ends of the fifth horizontal copper foil 38a are respectively connected to two fourth transition horizontal portions 41d through corresponding fourth conductive posts 41f. A sixth horizontal copper foil 38b and a fourth insulating material 38f are formed on a fourth horizontal copper foil 37b, wherein the fourth insulating material 38f is located between the sixth horizontal copper foil 38b and the fourth horizontal copper foil 37b. The two ends of the sixth horizontal copper foil 38b are respectively connected to two fifth transition horizontal portions 40a through corresponding fifth conductive posts 41g. The fifth horizontal copper foil 38a, the sixth horizontal copper foil 38b, the fifth connecting copper foil 38c, the sixth connecting copper foil 38d, the two fifth transition horizontal portions 40a, the two fourth transition horizontal portions 41d, the two fourth conductive posts 41f, and the two fifth conductive posts 41g constitute a third metal layer 38. In this step, the first magnetic post 21 is disposed within the first accommodating space 31 of the substrate 3 to constitute a portion of the magnetic component 1k. In this embodiment, the first common conductive post 62a and the second common conductive post 62b are cut using a mechanical segmentation process. Figure 20C and Figure 20D The top view can be as follows: Figure 21A and Figure 21B As shown.

[0280] In this embodiment, the third connecting copper foil 37c and the fourth connecting copper foil 37d of the second metal layer 37 are constructed with sidewall copper. Therefore, the width of the second metal layer 37 of the magnetic component 1k in this embodiment can be relatively small, and the process is a mature mass production process. Using continuous lamination processing would facilitate large-scale production. Furthermore, since the third connecting copper foil 37c and the fourth connecting copper foil 37d of the second metal layer 37, and the fifth connecting copper foil 38c and the sixth connecting copper foil 38d of the third metal layer 38 are formed by electroplating in one step and then mechanically divided later, both time and cost are reduced. In this embodiment, the first metal layer 34 is disposed on the four sides of the inner wall of the first accommodating space 31.

[0281] Please see Figure 22 , it is Figure 2 A cross-sectional structural schematic diagram of the thirteenth embodiment of the magnetic component shown. (As...) Figure 22 As shown, the substrate 3 of the magnetic component 1m in this embodiment is similar to... Figure 20E The substrate 3 of the magnetic component 1k shown differs only in that the substrate 3 of the magnetic component 1m in this embodiment does not have the same characteristics as... Figures 20A to 20E Instead of the two fourth transition horizontal portions 41d and two fifth transition horizontal portions 40a shown, the two ends of the fifth horizontal copper foil 38a are directly connected to one end of the fifth connecting copper foil 38c and one end of the sixth connecting copper foil 38d, respectively, and the two ends of the sixth horizontal copper foil 38b are directly connected to the other ends of the fifth connecting copper foil 38c and the other ends of the sixth connecting copper foil 38d, respectively. Since the substrate 3 of the magnetic component 1m in this embodiment does not have two fourth transition horizontal portions and two fifth transition horizontal portions, the overall size of the substrate 3 is smaller. In some embodiments, the two fourth transition horizontal portions and two fifth transition horizontal portions can be removed by milling.

[0282] Please see Figures 23A to 23F , it is Figure 2 This is a cross-sectional structural schematic diagram of the fourteenth embodiment of the substrate of the magnetic component shown, illustrating a manufacturing method. First, as... Figure 23A As shown, a top plate 30c, a base 30a, a third horizontal copper foil 37a, and a chemical-resistant plating layer 61a are provided. The top plate 30c is located on the base 30a, and the base 30a and the top plate 30c together define a first accommodating space 31. The third horizontal copper foil 37a and the chemical-resistant plating layer 61a are located on opposite sides of the top plate 30c, and the chemical-resistant plating layer 61a is located within the first accommodating space 31.

[0283] Then, as Figure 23BAs shown, a fourth horizontal copper foil 37b is formed on the base 30a, and the fourth horizontal copper foil 37b and the third horizontal copper foil 37a are located on opposite sides of the first accommodating space 31. Furthermore, the base 30a also has a plurality of first through holes 30d, each of which penetrates the top plate 30c and the base 30a, and is located between the third horizontal copper foil 37a and the fourth horizontal copper foil 37b. A third connecting copper foil 37c and a fourth connecting copper foil 37d are formed within the corresponding first through holes 30d and pass through the top plate 30c and the base 30a. The two ends of the third connecting copper foil 37c are respectively connected between one end of the third horizontal copper foil 37a and one end of the fourth horizontal copper foil 37b, and the two ends of the fourth connecting copper foil 37d are respectively connected between the other ends of the third horizontal copper foil 37a and the other ends of the fourth horizontal copper foil 37b. The third horizontal copper foil 37a, the fourth horizontal copper foil 37b, the third connecting copper foil 37c, and the fourth connecting copper foil 37d constitute the second metal layer 37. Then, as Figure 23C As shown, etched holes 37g are formed on the third-level copper foil 37a and the fourth-level copper foil 37b by a metallization process.

[0284] Then, as Figure 23DAs shown, a third insulating material 38e is formed on a third horizontal copper foil 37a, and a fourth insulating material 38f is formed on a fourth horizontal copper foil 37b. Next, a plurality of third through holes 63a and a plurality of fourth through holes 63b are formed, each third through hole 63a penetrating the third insulating material 38e and the top plate 30c, and each fourth through hole 63b penetrating the fourth insulating material 38f and the base 30a. Next, a first horizontal copper foil 34a, a second horizontal copper foil 34b, a first connecting copper foil 34c, and a second connecting copper foil 34d are formed on the inner wall of the first accommodating space 31 through a plurality of third through holes 63a and a plurality of fourth through holes 63b. The two ends of the first horizontal copper foil 34a are respectively connected to one end of the first connecting copper foil 34c and one end of the second connecting copper foil 34d. The two ends of the second horizontal copper foil 34b are respectively connected to the other end of the first connecting copper foil 34c and the other end of the second connecting copper foil 34d. The first horizontal copper foil 34a, the second horizontal copper foil 34b, the first connecting copper foil 34c, and the second connecting copper foil 34d constitute a first metal layer 34. A portion of the inner wall of the first accommodating space 31 is protected by a chemical-resistant plating layer 61a and is not plated with the first metal layer 34. In this step, a fifth horizontal copper foil 38a is formed on the third insulating material 38e, a sixth horizontal copper foil 38b is formed on the fourth insulating material 38f, and a fifth connecting copper foil 38c and a sixth connecting copper foil 38d are formed. The fifth connecting copper foil 38c is connected between one side of the fifth horizontal copper foil 38a and one side of the sixth horizontal copper foil 38b, and the sixth connecting copper foil 38d is connected between the other side of the fifth horizontal copper foil 38a and the other side of the sixth horizontal copper foil 38b. The fifth horizontal copper foil 38a, the sixth horizontal copper foil 38b, the fifth connecting copper foil 38c, and the sixth connecting copper foil 38d constitute the third metal layer 38. Then, as... Figure 23E As shown, etched holes 38g are formed on the fifth-level copper foil 38a and the sixth-level copper foil 38b using a metallization process. Then, as... Figure 23F As shown, a first magnetic post 21 is disposed within the first accommodating space 31 of the substrate 3 to constitute a portion of the magnetic component 1n. In this embodiment, a first metal layer 34 is disposed on the four sides of the inner wall of the first accommodating space 31.

[0285] As can be seen from the above, the magnetic component 1n of this embodiment forms both the first metal layer 34 and the third metal layer 38 through a single electroplating process, significantly reducing manufacturing time and cost. In some embodiments, if a certain copper layer thickness is required, it can be achieved using... Figures 23A to 23F The substrate 3 shown is bonded Figure 19A In this manner, the second horizontal copper foil 34b, the first connecting copper foil 34c, and the second connecting copper foil 34d are pre-formed on the inner wall to achieve a certain copper thickness. After subsequent metallization processes, the copper foil at this position will be further thickened to meet the current flow requirements.

[0286] Please see Figure 24 , it is Figure 2 A cross-sectional structural schematic diagram of the fifteenth embodiment of the substrate of the magnetic component shown. (See attached diagram.) Figure 24 As shown, the substrate 3 of the magnetic component 1o in this embodiment includes a first metal layer 81 and a second metal layer 82. The first metal layer 81 in this embodiment includes a third connecting copper foil 81c, a fourth connecting copper foil 81d, a third horizontal copper foil 81a, and a fourth horizontal copper foil 81b. The third connecting copper foil 81c, the fourth connecting copper foil 81d, the third horizontal copper foil 81a, and the fourth horizontal copper foil 81b of the first metal layer 81 in this embodiment are respectively similar to... Figure 19F The third connecting copper foil 37c, fourth connecting copper foil 37d, third horizontal copper foil 37a, and fourth horizontal copper foil 37b of the second metal layer 37 of the magnetic component 1j shown herein will not be described in detail here. The second metal layer 82 of this embodiment includes a fifth horizontal copper foil 82a, a sixth horizontal copper foil 82b, a fifth connecting copper foil 82c, and a sixth connecting copper foil 82d, which are respectively similar to... Figure 19F The fifth horizontal copper foil 38a, sixth horizontal copper foil 38b, fifth connecting copper foil 38c, and sixth connecting copper foil 38d of the third metal layer 38 of the magnetic component 1j shown are not described in detail here. In addition, the magnetic component 1o in this embodiment also includes a fourth metal layer 83, which is attached to the first magnetic post 21. The fourth metal layer 83 includes an eighth horizontal copper foil 83a, a ninth horizontal copper foil 83b, an eighth connecting copper foil 83c, and a ninth connecting copper foil 83d. The eighth horizontal copper foil 83a and the ninth horizontal copper foil 83b are located on opposite sides of the first magnetic post 21, and the eighth connecting copper foil 83c and the ninth connecting copper foil 83d are located on the other opposite sides of the first magnetic post 21. The eighth connecting copper foil 83c is connected between one side of the eighth horizontal copper foil 83a and one side of the ninth horizontal copper foil 83b, and the ninth connecting copper foil 83d is connected between the other side of the eighth horizontal copper foil 83a and the other side of the ninth horizontal copper foil 83b. It should be noted that the fourth metal layer 83 is only partially attached to the first magnetic post 21. As can be seen from the figure, there is a gap between the two segments of the fifth horizontal copper foil 83a.

[0287] For the magnetic components 1 to 1n in the above embodiments, the magnetic pillars can be bare magnetic pillars, or a fourth insulating layer can be formed on the surface of the magnetic pillars. For example, the fourth insulating layer can be formed on the surface of the magnetic pillars by spraying, impregnation, electrophoresis, electrostatic spraying, chemical vapor deposition, physical vapor deposition, sputtering, evaporation, or printing. The fourth insulating layer can provide excellent insulation and meet electrical insulation requirements. It should be further noted that the fourth insulating layer can completely cover the magnetic pillar or partially cover it. Figure 5As shown, the magnetic core in the magnetic assembly is formed by connecting the first magnetic post, the third magnetic post, the second magnetic post, and the fourth magnetic post end to end. In order to obtain the required inductance value, insulating adhesive with glass beads needs to be placed at the overlapping surfaces of the first magnetic post and the third magnetic post, as well as the first magnetic post and the fourth magnetic post. The required inductance value is achieved by adjusting the size of the glass beads. Therefore, instead of placing a fourth insulating layer at the overlapping surface of the magnetic posts, an insulating adhesive with glass beads can be placed.

[0288] In this embodiment, the fourth metal layer 83 of the magnetic component 1o is attached to the first magnetic post 21 without the need for additional metal components to connect with other metal layers, such as a transition horizontal portion. If there is an insulation requirement between the fourth metal layer 83 and the first magnetic post 21, an extremely thin insulating layer (not shown) can be provided between them. For example, this insulating layer can be formed on the surface of the magnetic post by spraying, impregnation, electrophoresis, electrostatic spraying, chemical vapor deposition, physical vapor deposition, sputtering, evaporation, or printing. The thickness of the insulating layer can be controlled to within 20 μm. Therefore, the width and height of the fourth metal layer 83 of the magnetic component 1o in this embodiment are relatively short, thus further reducing the overall size of the magnetic component 1o and improving the power density of the magnetic component 1o. If the size of the magnetic component 1o is fixed, the optimized size can be transferred to the magnetic core, thereby increasing the size of the magnetic core and effectively reducing the core loss, thereby improving the efficiency of the magnetic component 1o.

[0289] It should be noted that all the above features can be achieved through combinations of different embodiments, thereby achieving a smaller module size and thus improving the power density of the module.

[0290] Please see Figure 25 This is the present invention. Figure 2 The diagram shows the circuit structure of the power module to which the magnetic component is applied. The following will demonstrate this. Figure 8GThe magnetic component 1 shown is used in the power module for illustration. Of course, other magnetic components can also be used in the power module, which will not be described in detail here. As shown in the figure, the power module 7 of this embodiment is connected between the input terminal (including the positive input terminal Vin+ and the negative input terminal Vin-) and the output terminal (including the positive output terminal Vo+ and the negative output terminal Vo-). The power module 7 includes a magnetic component and electronic components. The magnetic component includes a primary winding P, a first secondary winding S1 and a second secondary winding S2. The electronic components include two power switches SR1 and SR2 and a capacitor C. The first end P1 and the second end P2 of the primary winding P are respectively connected to the positive input terminal Vin+ and the negative input terminal Vin-. The first terminal D1 of the first secondary winding S1 is connected to the first terminal A1 of the power switch SR1. The second terminal of the first secondary winding S1 is connected to the first terminal of the second secondary winding S2 to form a common terminal M. The second terminal D2 of the second secondary winding S2 is connected to the first terminal B1 of the power switch SR2. The common terminal M is connected to the positive output terminal Vo+. The second terminals A2 and B2 of the power switches SR1 and SR2 are connected and connected to the negative output terminal Vo-. The capacitor C is connected between the positive output terminal Vo+ and the negative output terminal Vo-. In some embodiments, the first secondary winding S1 may be composed of the first metal layer 34 of the magnetic component 1, the second secondary winding S2 may be composed of the second metal layer 37 of the magnetic component 1, and the primary winding P may be composed of the third metal layer 38 of the magnetic component 1. In other embodiments, the primary winding P, the first secondary winding S1 and the second secondary winding S2 are respectively composed of a first metal layer 34, a second metal layer 37 and a third metal layer 38 of a magnetic component 1 with different compositions.

[0291] Please see Figure 26 , 27A and 27B and in conjunction Figure 25 ,in Figure 26 for Figure 8G The diagram shows a top view of the magnetic component. Figure 27A for Figure 26 The diagram shows the composition of the primary and secondary windings of the magnetic component. Figure 27B for Figure 26 This is a schematic diagram of the primary and secondary windings of the magnetic component from another perspective. (See diagram below.) Figure 26 As shown, the upper surface 11 of the magnetic component 1 includes a first surface-mount pin D1a, a third surface-mount pin A2a, a fifth surface-mount pin D2a, a sixth surface-mount pin B2a, a seventh surface-mount pin P1a, and an eighth surface-mount pin P2a, wherein the first surface-mount pin D1a is used to form Figure 25 The first terminal D1 of the first secondary winding S1 and the first terminal A1 of the power switch SR1, and the third surface-mount pin A2a are used to form Figure 25The second terminal A2 and the fifth surface-mount pin D2a of the power switch SR1 are used to construct Figure 25 The second terminal D2 of the second secondary winding S2 and the first terminal B1 of the power switch SR2, and the sixth surface-mount pin B2a are used to form Figure 25 The second terminal B2, the seventh surface-mount pin P1a, and the eighth surface-mount pin P2a of the power switch SR2 are respectively used to construct Figure 25 The primary winding P has a first end P1 and a second end P2. The lower surface 12 of the magnetic component 1 includes a second surface-mount pin Va and a fourth surface-mount pin Vb (e.g., ...). Figure 27A and 27B As shown), the second surface-mount pin Va is used to construct Figure 25 The positive output terminal Vo+ and the fourth surface-mount pin Vb are used to construct... Figure 25 The negative output terminal Vo-.

[0292] like Figure 27A As shown, part of the first metal layer (e.g.) Figure 27A The solid line portion of the first metal layer 34) and a portion of the third metal layer (such as Figure 27A The portion of the third metal layer 38 (with the solid line in the middle) constitutes the first secondary winding S1 (i.e., the second winding), which is wound flat around the first magnetic post 21. One end of a portion of the first metal layer 34 is connected to the first surface-mount pin D1a, the other end of a portion of the first metal layer 34 is connected to the second surface-mount pin Va, one end of a portion of the third metal layer 38 is connected to the third surface-mount pin A2a, and the other end of a portion of the third metal layer 38 is connected to the fourth surface-mount pin Vb. And as... Figure 27B As shown, the other part of the first metal layer (such as Figure 27B The solid line portion of the first metal layer 34) and the remaining portion of the third metal layer (such as... Figure 27B The portion of the third metal layer 38 (with the solid line in the middle) constitutes the second secondary winding S2 (i.e., the third winding), which is wound flat around the first magnetic post 21. One end of another portion of the first metal layer 34 is connected to the fifth surface-mount pin D2a, and the other end of another portion of the first metal layer 34 is connected to the second surface-mount pin Va. One end of another portion of the third metal layer 38 is connected to the sixth surface-mount pin B2a, and the other end of another portion of the third metal layer 38 is connected to the fourth surface-mount pin Vb. In some embodiments, Figure 27A and Figure 27B The second metal layer 37 constitutes Figure 26The primary winding P and the second metal layer 37 are respectively connected to the seventh surface-mount pin P1a and the eighth surface-mount pin P2a. The staggered arrangement of the first secondary winding S1 and the second secondary winding S2 improves the symmetry between them, thus significantly improving the current sharing effect of the current flowing through the power switches SR1 and SR2 during circuit operation.

[0293] Please see Figure 28 and cooperate Figure 25 , 26 27A and 27B, of which Figure 28 For the present invention Figure 25 The diagram shows a cross-sectional view of the first embodiment of the power module. In this embodiment, the magnetic component of the power module 7 is composed of… Figure 8G The magnetic component 1 is used as an example; of course, other magnetic components can also be used to construct a power module in the same way. In addition to the magnetic component 1, the power module 7 of this embodiment also includes a circuit board 71, a primary-side device 72, a secondary-side device 73, and power switches SR1 and SR2, wherein the primary-side device 72 and the secondary-side device 73 are both passive devices. The circuit board 71 is disposed on the magnetic component 1. The primary-side device 72, the secondary-side device 73, and the power switches SR1 and SR2 are disposed on the circuit board 71. One end of the power switch SR1 is electrically connected to the first surface-mount pin D1a via the circuit board 71, one end of the power switch SR2 is electrically connected to the fifth surface-mount pin D2a via the circuit board 71, and the other end of the power switch SR1 is electrically connected to the other end of the power switch SR2 via the circuit board 71. This invention is not limited to the above description; the number of power switches can be equivalently achieved by connecting multiple power switches in parallel according to their power rating. In some embodiments, the power module 7 may not have a circuit board 71, but instead directly houses the primary-side device 72 and the secondary-side device 73 within the first accommodating space 31, such as... Figure 29 As shown, this is done to achieve a shorter current loop.

[0294] It should be noted that the power module described above is not limited to LLC converters, but is also applicable to any circuit containing a transformer module, such as flyback converters and full-bridge circuits. Furthermore, the multiple output terminals of the power switch and magnetic components are directly connected, resulting in low connection losses; the primary and secondary circuits of the magnetic components are directly coupled together, resulting in low winding AC impedance and low AC losses, but this invention is not limited thereto.

[0295] In summary, the first and second magnetic pillars of the magnetic component of the present invention are respectively disposed in the first and second accommodating spaces of the substrate 3. In the three-layer winding structure corresponding to any magnetic pillar, the distance between each winding layer and the magnetic pillar is approximately equal, which makes the current sharing effect of the magnetic core assembly of the magnetic component of the present invention better and the overall magnetic loss of the magnetic component lower. Furthermore, since the first and second magnetic pillars of the magnetic component of the present invention are independently arranged and respectively disposed in the first and second accommodating spaces of the substrate, the first and second magnetic pillars can be polished separately. Since the first and second magnetic pillars are respectively confined within the substrate by the first and second accommodating spaces and do not affect each other, the first and second magnetic pillars only need to be polished to meet the assembly relationship with the corresponding first and second accommodating spaces. The positional accuracy of the first magnetic pillar is completely independent of the positional accuracy of the second magnetic pillar, and the positional accuracy between the first and second magnetic pillars is entirely determined by the positional accuracy between the first and second accommodating spaces. Therefore, the dimensional accuracy of the magnetic core assembly of the magnetic component of the present invention is very high, resulting in lower loss of the magnetic component and a smaller overall size of the magnetic component.

Claims

1. A magnetic component comprising: A magnetic core assembly, comprising a first magnetic post; and A winding assembly includes a first winding wound on the first magnetic post; in, The first winding is formed by at least a portion of a substrate, the substrate including a first accommodating space and a first metal layer, the first winding being formed by at least a portion of the first metal layer, wherein the first metal layer formed on the substrate is directly disposed on the four sides of the inner wall of the first accommodating space, and the first magnetic post is disposed within the first accommodating space.

2. The magnetic component as claimed in claim 1, wherein the magnetic core component further includes a second magnetic post, the substrate further includes a second accommodating space, at least a portion of the second magnetic post is disposed within the second accommodating space, and the first magnetic post and the second magnetic post are disposed independently of each other.

3. The magnetic component as claimed in claim 1, wherein the substrate is a one-piece molded structure.

4. The magnetic component as claimed in claim 2, wherein the magnetic core component further comprises a third magnetic post and a fourth magnetic post, wherein the first magnetic post and the second magnetic post are both located between the third magnetic post and the fourth magnetic post, the two ends of the third magnetic post are respectively connected to one end of the first magnetic post and one end of the second magnetic post, and the two ends of the fourth magnetic post are respectively connected to the other end of the first magnetic post and the other end of the second magnetic post.

5. The magnetic component of claim 4, wherein the substrate further includes a first opening and a second opening, the first opening and the second opening being located on a first side and a second side of the substrate respectively, the first accommodating space and the second accommodating space being located between the first opening and the second opening, and the first opening communicating with the first accommodating space and the second accommodating space respectively, the second opening communicating with the first accommodating space and the second accommodating space respectively, at least a portion of the third magnetic post being disposed in the first opening, and at least a portion of the fourth magnetic post being disposed in the second opening.

6. The magnetic component as claimed in claim 4, wherein the third magnetic post and the fourth magnetic post are disposed outside the substrate.

7. The magnetic component as claimed in claim 4, wherein the first magnetic post, the second magnetic post, the third magnetic post, and the fourth magnetic post are independently arranged.

8. The magnetic component as claimed in claim 4, wherein the first magnetic post and the third magnetic post are integrally formed, and the second magnetic post and the fourth magnetic post are integrally formed.

9. The magnetic component of claim 4, wherein the substrate further includes a first opening located on a first side of the substrate, the first opening being connected to the first accommodating space and the second accommodating space respectively, the third magnetic post being at least partially disposed within the first opening, a second side of the substrate having a closed structure, and the fourth magnetic post being embedded in the second side of the substrate.

10. The magnetic component of claim 1, wherein the substrate includes a first horizontal wiring layer and a second horizontal wiring layer, the first horizontal wiring layer and the second horizontal wiring layer being located on opposite sides of the first magnetic pillar, the first metal layer including a first horizontal copper foil, a second horizontal copper foil, a first connecting copper foil and a second connecting copper foil, the first horizontal copper foil, the first connecting copper foil, the second horizontal copper foil and the second connecting copper foil being connected and surrounding the first magnetic pillar, wherein the first connecting copper foil and the second connecting copper foil are both located between the first horizontal copper foil and the second horizontal copper foil, and the first horizontal copper foil is located in the first horizontal wiring layer, the second horizontal copper foil is located in the second horizontal wiring layer, and the first horizontal copper foil, the first connecting copper foil, the second horizontal copper foil and the second connecting copper foil are respectively disposed on the four sides of the inner wall of the first accommodating space.

11. The magnetic component of claim 10, wherein the first winding is entirely composed of the first metal layer.

12. The magnetic component of claim 10, wherein the substrate comprises a third horizontal wiring layer, a fourth horizontal wiring layer and a second metal layer, the third horizontal wiring layer and the fourth horizontal wiring layer being located on opposite sides of the first magnetic pillar, the third horizontal wiring layer being located outside the first horizontal wiring layer and the fourth horizontal wiring layer being located outside the second horizontal wiring layer, the second metal layer comprising a third horizontal copper foil, a fourth horizontal copper foil, a third connecting copper foil and a fourth connecting copper foil, the third horizontal copper foil, the third connecting copper foil, the fourth horizontal copper foil and the fourth connecting copper foil being connected and surrounding the first magnetic pillar, wherein the third connecting copper foil and the fourth connecting copper foil are respectively located between the third horizontal copper foil and the fourth horizontal copper foil, the third horizontal copper foil being located in the third horizontal wiring layer and the fourth horizontal copper foil being located in the fourth horizontal wiring layer.

13. The magnetic component of claim 12, wherein the magnetic component further comprises a second winding wound around the first magnetic post, the first winding being entirely composed of the first metal layer, and the second winding being entirely composed of the second metal layer.

14. The magnetic component of claim 12, wherein the magnetic component further comprises a second winding wound around the first magnetic post, the first winding being composed of at least a portion of the first metal layer and at least a portion of the second metal layer, and the second winding being composed of at least a portion of the first metal layer and at least a portion of the second metal layer.

15. The magnetic component of claim 12, wherein the substrate comprises a fifth horizontal wiring layer, a sixth horizontal wiring layer and a third metal layer, the fifth horizontal wiring layer and the sixth horizontal wiring layer being located on opposite sides of the first magnetic pillar, the fifth horizontal wiring layer being located outside the third horizontal wiring layer, the sixth horizontal wiring layer being located outside the fourth horizontal wiring layer, the third metal layer comprising a fifth horizontal copper foil, a sixth horizontal copper foil, a fifth connecting copper foil and a sixth connecting copper foil, the fifth horizontal copper foil, the fifth connecting copper foil, the sixth horizontal copper foil and the sixth connecting copper foil being connected and surrounding the first magnetic pillar, wherein the fifth connecting copper foil and the sixth connecting copper foil are both located between the fifth horizontal copper foil and the sixth horizontal copper foil, and the third metal layer is located outside the second metal layer, the fifth horizontal copper foil is located on the fifth horizontal wiring layer, and the sixth horizontal copper foil is located on the sixth horizontal wiring layer.

16. The magnetic component of claim 15, wherein the magnetic component further comprises a second winding and a third winding, the second winding and the third winding being wound on the first magnetic post, the first winding being composed of the first metal layer, the second winding being composed of the first metal layer, and the third winding being composed of the third metal layer.

17. The magnetic component of claim 15, wherein the magnetic component further comprises a second winding and a third winding, both the second winding and the third winding being wound on the first magnetic post, the second winding being composed of the second metal layer, the first winding being composed of at least a portion of the first metal layer and at least a portion of the third metal layer, the first windings being connected to each other by a conductive post, and the third winding being composed of a further portion of the first metal layer and a further portion of the third metal layer, the third windings being connected to each other by a conductive post.

18. The magnetic component of claim 1, wherein the portion of the first metal layer located on the inner wall of the first accommodating space is segmented.

19. The magnetic component of claim 18, wherein a chemical-resistant coating is provided between at least two segments of the first metal layer.

20. The magnetic assembly of claim 1, wherein the edge of the first magnetic post has a chamfer, the chamfer being adjacent to a corner of the first metal layer.

21. The magnetic component of claim 1, wherein the magnetic component further comprises a circuit board and at least one power switch disposed on the circuit board and electrically connected to the first winding.

22. The magnetic component of claim 1, wherein the magnetic component further comprises at least one passive device disposed within the first accommodating space.

23. The magnetic component of claim 1, wherein the magnetic component further comprises a fourth metal layer attached to a portion of the first magnetic post.

24. The magnetic component of claim 1, wherein the magnetic component further comprises a fourth insulating layer attached to the first magnetic post.

25. A method for manufacturing a magnetic component, comprising the following steps: (a) A substrate is provided, at least a portion of which constitutes a winding assembly of the magnetic component, the substrate including a first accommodating space and a first metal layer, wherein at least a portion of the first metal layer constitutes at least a portion of a first winding of the winding assembly, wherein the first metal layer, at least a portion formed on the substrate, is directly disposed on the four sides of the inner wall of the first accommodating space; and (b) A magnetic core assembly is provided, the magnetic core assembly including a first magnetic post, wherein at least a portion of the first magnetic post is disposed within the first accommodating space, and the first winding is wound on the first magnetic post.

26. The manufacturing method of claim 25, wherein step (a) comprises the following steps: (c1) A base is provided, the base having a groove and forming a second horizontal copper foil, a first connecting copper foil and a second connecting copper foil in the groove; (c2) A top plate is provided, and a third horizontal copper foil is formed on a first side of the top plate, a chemical-resistant plating layer and a first horizontal copper foil are formed on a second side of the top plate, the top plate is disposed on the base and covers the groove, wherein the base and the top plate together define the first receiving space, wherein the first horizontal copper foil, the second horizontal copper foil, the first connecting copper foil, the second connecting copper foil and the chemical-resistant plating layer are located in the first receiving space, and a first gap is formed between a portion of the first horizontal copper foil and the first connecting copper foil, and a second gap is formed between another portion of the first horizontal copper foil and the second connecting copper foil; (c3) A fourth horizontal copper foil is formed on the base, wherein the third horizontal copper foil and the fourth horizontal copper foil are located on opposite sides of the first accommodating space, and a third connecting copper foil and a fourth connecting copper foil are formed and respectively inserted into the base, wherein the third connecting copper foil is connected between one end of the third horizontal copper foil and one end of the fourth horizontal copper foil, and the fourth connecting copper foil is connected between the other end of the third horizontal copper foil and the other end of the fourth horizontal copper foil, wherein the third horizontal copper foil, the fourth horizontal copper foil, the third connecting copper foil and the fourth connecting copper foil constitute a second metal layer; (c4) The first gap and the second gap are filled with copper foil, such that the first horizontal copper foil is connected to the first connecting copper foil, and the first horizontal copper foil is connected to the second connecting copper foil, wherein the first connecting copper foil, the second connecting copper foil, the first horizontal copper foil, and the second horizontal copper foil constitute the first metal layer; and (c5) A fifth horizontal copper foil, a sixth horizontal copper foil, a fifth connecting copper foil, and a sixth connecting copper foil are formed on the outside of the second metal layer to cover the second metal layer. The fifth connecting copper foil is connected between one end of the fifth horizontal copper foil and one end of the sixth horizontal copper foil, and the sixth connecting copper foil is connected between the other end of the fifth horizontal copper foil and the other end of the sixth horizontal copper foil. The fifth horizontal copper foil, the sixth horizontal copper foil, the fifth connecting copper foil, and the sixth connecting copper foil constitute a third metal layer. The first metal layer, the second metal layer, the third metal layer, the base, and the top plate constitute the substrate.

27. The manufacturing method of claim 25, wherein step (a) comprises the following steps: (c1) A base, a top plate, a third horizontal copper foil and a chemical resistance coating are provided, wherein the top plate is located on the base, and the base and the top plate together define the first receiving space, and the third horizontal copper foil and the chemical resistance coating are located on opposite sides of the top plate, wherein the chemical resistance coating is located within the first receiving space. (c2) A fourth horizontal copper foil is formed on the base, and the fourth horizontal copper foil and the third horizontal copper foil are located on opposite sides of the first accommodating space; (c3) A third connecting copper foil and a fourth connecting copper foil are formed and passed through the top plate and the base, wherein the two ends of the third connecting copper foil are respectively connected between one end of the third horizontal copper foil and one end of the fourth horizontal copper foil, and the two ends of the fourth connecting copper foil are respectively connected between the other end of the third horizontal copper foil and the other end of the fourth horizontal copper foil, and the third horizontal copper foil, the fourth horizontal copper foil, the third connecting copper foil and the fourth connecting copper foil constitute a second metal layer; (c4) A first horizontal copper foil, a second horizontal copper foil, a first connecting copper foil, and a second connecting copper foil are formed on the inner wall of the first accommodating space, wherein the two ends of the first horizontal copper foil are respectively connected to one end of the first connecting copper foil and one end of the second connecting copper foil, and the two ends of the second horizontal copper foil are respectively connected to the other ends of the first connecting copper foil and the other end of the second connecting copper foil, and the first horizontal copper foil, the second horizontal copper foil, the first connecting copper foil, and the second connecting copper foil constitute a first metal layer; and (c5) A fifth horizontal copper foil, a sixth horizontal copper foil, a fifth connecting copper foil, and a sixth connecting copper foil are formed on the outside of the second metal layer to cover the second metal layer. The fifth connecting copper foil is connected between one end of the fifth horizontal copper foil and one end of the sixth horizontal copper foil, and the sixth connecting copper foil is connected between the other end of the fifth horizontal copper foil and the other end of the sixth horizontal copper foil. The fifth horizontal copper foil, the sixth horizontal copper foil, the fifth connecting copper foil, and the sixth connecting copper foil constitute a third metal layer. The first metal layer, the second metal layer, the third metal layer, the base, and the top plate constitute the substrate.

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