Substrate processing apparatus, substrate processing system, and maintenance method
By designing the clamps and lifting mechanism in the substrate processing device, the problem of difficult chamber maintenance was solved, enabling rapid disassembly and transportation of the chamber and improving maintenance efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2021-10-13
- Publication Date
- 2026-07-24
AI Technical Summary
Existing plasma processing devices are difficult to maintain, and it is hard to maintain them quickly and effectively.
A substrate processing device is designed, including a first chamber, a substrate support, a second chamber, a clamp, and a lifting mechanism. The clamp is released from the second chamber by the release mechanism, and the lifting mechanism is used to move the second chamber within the first chamber, thereby realizing the disassembly and transport of the chamber.
This enables rapid and convenient maintenance of the processing space chambers, improving maintenance efficiency.
Smart Images
Figure CN114388330B_ABST
Abstract
Description
Technical Field
[0001] The embodiments disclosed in this invention relate to a substrate processing apparatus, a substrate processing system, and a maintenance method. Background Technology
[0002] A plasma processing apparatus is used in the plasma processing of a substrate. The plasma processing apparatus includes a chamber and a substrate support. The substrate support supports the substrate within the chamber. The substrate is processed according to the chemical species of the plasma generated by the processing gas within the chamber. Patent Document 1 below discloses such a plasma processing apparatus.
[0003] Patent Document 1: Japanese Patent Application Publication No. 2019-197849 Summary of the Invention
[0004] The problem that the invention aims to solve
[0005] The present invention provides a technique for easily maintaining a chamber formed in which a substrate is processed.
[0006] One embodiment provides a substrate processing apparatus. The substrate processing apparatus includes: a first chamber, a substrate support, a second chamber, a clamp, a release mechanism, and a lifting mechanism. The first chamber includes a sidewall providing an opening and a movable portion movable upward and downward within the first chamber. The substrate support is disposed within the first chamber. The second chamber is disposed within the first chamber and, together with the substrate support, forms a processing space in which a substrate placed on the substrate support is processed. The second chamber is detachable from the first chamber and can be transported between the interior space of the first chamber and the exterior of the first chamber via the opening in the sidewall of the first chamber. The clamp releasably secures the second chamber to the movable portion extending from the second chamber. The release mechanism releases the clamp from securing the second chamber. The lifting mechanism moves the movable portion upward and downward.
[0007] Invention Effects
[0008] According to one embodiment of the present invention, the chamber formed in which the substrate is processed can be easily maintained. Attached Figure Description
[0009] Figure 1 This is a diagram illustrating a substrate processing system in one embodiment.
[0010] Figure 2 This is a schematic diagram showing a substrate processing apparatus in one embodiment.
[0011] Figure 3 This is a partially enlarged cross-sectional view of a substrate processing apparatus in one embodiment.
[0012] Figure 4 This is a schematic diagram of the transport module of a substrate processing system in one embodiment.
[0013] Figure 5 This is a diagram showing the state of the substrate processing system during the implementation and maintenance process in one embodiment.
[0014] Figure 6 This is a diagram showing the state of the substrate processing system during the implementation and maintenance process in one embodiment.
[0015] Figure 7 This is a diagram showing the state of the substrate processing system during the implementation and maintenance process in one embodiment.
[0016] Figure 8 This is a diagram showing the state of the substrate processing system during the implementation and maintenance process in one embodiment.
[0017] Figure 9 This is a diagram showing the state of the substrate processing system during the implementation and maintenance process in one embodiment.
[0018] Figure 10 This is a diagram showing the state of the substrate processing system during the implementation and maintenance process in one embodiment.
[0019] Figure 11 This is a partially enlarged cross-sectional view of a substrate processing apparatus in one embodiment.
[0020] Figure 12 This is a diagram showing the state of the substrate processing system during the implementation and maintenance process in one embodiment.
[0021] Figure 13 This is a diagram showing the state of the substrate processing system during the implementation and maintenance process in one embodiment.
[0022] Figure 14 This is a partially enlarged cross-sectional view of the substrate processing apparatus in another embodiment.
[0023] Figure 15 This is a partially enlarged cross-sectional view of the substrate processing apparatus in another embodiment.
[0024] Figure 16 This is a partially enlarged cross-sectional view of the substrate processing apparatus in another embodiment.
[0025] Figure 17 This is a plan view showing a portion of the second chamber, the cover ring, and the edge ring in a substrate processing apparatus according to another example embodiment.
[0026] Figure 18 It is along Figure 17 Cross-sectional view of the XVIII-XVIII line.
[0027] Figure 19 This is a plan view showing a portion of the second chamber, the cover ring, and the edge ring in a substrate processing apparatus according to another example embodiment.
[0028] Figure 20 It is along Figure 19 Cross-sectional view of the XX-XX line. Detailed Implementation
[0029] The various implementation methods will be described below.
[0030] In one embodiment, a substrate processing apparatus is provided. The substrate processing apparatus includes: a first chamber, a substrate support, a second chamber, a clamp, a release mechanism, and a lifting mechanism. The first chamber includes a sidewall providing an opening and a movable portion movable upward and downward within the first chamber. The substrate support is disposed within the first chamber. The second chamber is disposed within the first chamber and, together with the substrate support, forms a processing space in which a substrate placed on the substrate support is processed. The second chamber is detachable from the first chamber and can be transferred between the interior space of the first chamber and the exterior of the first chamber via the sidewall opening of the first chamber. The clamp secures the second chamber to the movable portion extending above the second chamber and is releasable. The release mechanism releases the clamp from securing the second chamber. The lifting mechanism moves the movable portion upward and downward.
[0031] In the substrate processing apparatus of the above embodiment, the substrate is processed in the second chamber. The second chamber is disposed within the first chamber and is fixed within the first chamber. The second chamber can be released from its fixation in the first chamber using a release mechanism. Furthermore, with the second chamber released from its fixation in the first chamber, the second chamber can be moved out of the first chamber through an opening provided on the side wall of the first chamber. Therefore, according to the above embodiment, the chamber in which the processing space for processing the substrate is formed, i.e., the second chamber, can be easily maintained.
[0032] In one embodiment, the second chamber may also include a top extending above the processing space. The clamp may also secure the top in a movable portion of the first chamber in a releasable manner.
[0033] In one embodiment, the clamp may also include a support and a spring. The support has a lower end configured to suspend the top of the second chamber from it. The spring applies force from the lower end of the support to the movable part of the first chamber towards the top of the second chamber.
[0034] In one embodiment, the release mechanism may also include an air supply that provides air pressure to separate the lower end of the support from the second chamber in order to release the clamp from the top.
[0035] In one embodiment, the substrate processing apparatus may further include a conductor portion and a contact. The conductor portion is disposed along the outer periphery of the substrate support and is grounded. The contact is electrically connected to the conductor portion. The second chamber may also abut against the contact while forming a processing space together with the substrate support. The contact may also extend upward from the conductor portion.
[0036] In one embodiment, the contact may also resiliently contact the second chamber. The contact may also include a spring.
[0037] In one embodiment, the contact may also be a pin. The second chamber may also provide a recess therein into which the pin is inserted. The pin may also have a tapered shape. The recess in the second chamber may also have a tapered shape corresponding to the tapered shape of the pin.
[0038] In one embodiment, the contact may also include a flexible membrane formed of a conductive material. The substrate processing apparatus may also include additional air suppliers that apply air pressure to the membrane and press the membrane into the second chamber.
[0039] In one embodiment, the second chamber may also include a bottom extending below the processing space. The bottom of the second chamber may also abut against the contacts.
[0040] In one embodiment, the substrate processing apparatus may further include a cover ring having an inner edge and an outer edge. An edge ring is disposed on a substrate support. The inner edge of the cover ring may also support the outer edge of the edge ring disposed thereon. The outer edge of the cover ring may also include a plurality of radially projecting protrusions. The second chamber may further include a bottom having an inner edge that divides an inner hole through which the edge ring and the cover ring can pass. The second chamber may also support the cover ring with a plurality of protrusions disposed on the inner edge of the bottom. The inner hole may include a plurality of grooves through which the protrusions can pass and provided by the inner edge.
[0041] In one embodiment, the substrate processing apparatus may also be a plasma processing apparatus.
[0042] In other embodiments, a substrate processing system is provided. The substrate processing system includes: any one of the substrate processing apparatuses described in the various embodiments above, a transport module, and a control unit. The transport module has additional chambers and a transport device. The additional chambers of the transport module include sidewalls providing openings. The transport device transports a second chamber from the interior space of a first chamber through the openings of the first chamber and other chambers to the interior spaces of other chambers. The control unit controls a lifting mechanism, a releasing mechanism, and the transport device. The control unit controls the lifting mechanism to separate the movable part of the first chamber and the second chamber upwards from the substrate support. The control unit controls the releasing mechanism to release the second chamber, which is secured by clamps, so that the second chamber can be transferred to the transport device. The control unit controls the transport device to transport the second chamber from the interior space of the first chamber through the openings of the first chamber and other chambers to the interior spaces of other chambers.
[0043] In one embodiment, the substrate processing apparatus may include a gate valve for opening and closing the opening of the first chamber. The transport module may include gate valves for opening and closing the openings of other chambers and is movable. With other chambers connected to the first chamber, the sidewalls of the first chamber, the sidewalls of the other chambers, the gate valves of the substrate processing apparatus, and the gate valves of the transport module can form a sealed space between them. The substrate processing apparatus may include a venting device for depressurizing this sealed space.
[0044] In another embodiment, a maintenance method is provided. The maintenance method includes a step (a) of separating a second chamber upwards from a substrate support within a first chamber of a substrate processing apparatus. The substrate processing apparatus includes a first chamber, a substrate support, and a second chamber. The first chamber also includes a sidewall providing an opening, and a movable portion extending above the second chamber and movable upwards and downwards within the first chamber. The substrate support is disposed within the first chamber. The second chamber is disposed within the first chamber and, together with the substrate support, forms a processing space in which a substrate placed on the substrate support is processed. The maintenance method further includes a step (b) of releasing the second chamber from the movable portion of the first chamber. The maintenance method further includes a step (c) of transferring the second chamber from the interior space of the first chamber through the opening to the interior space of a chamber of a transfer module.
[0045] Various embodiments will now be described in detail with reference to the accompanying drawings. Furthermore, identical or equivalent parts are labeled with the same symbols in each drawing.
[0046] Figure 1 This is a diagram illustrating a substrate processing system in one embodiment. Figure 1 The substrate processing system PS shown includes: processing modules PM1 to PM6, a transport module CTM, and a control unit MC.
[0047] The substrate processing system PS may also include: stages 2a-2d, containers 4a-4d, calibrator AN, load locking modules LL1 and LL2, and a transfer module TM. Furthermore, the number of stages, containers, and load locking modules in the substrate processing system PS can be any number, or more. The number of processing modules in the substrate processing system PS can also be any number, or more.
[0048] Stages 2a to 2d are arranged along one edge of the loading module LM. Containers 4a to 4d are mounted on stages 2a to 2d respectively. Each container 4a to 4d is, for example, a container called a FOUP (Front Opening Unified Pod). Each container 4a to 4d contains a substrate W inside it.
[0049] The loading module LM includes a chamber. The pressure within the chamber of the loading module LM is set to atmospheric pressure. The loading module LM has a conveying device TU1. The conveying device TU1 is, for example, a conveying robot, controlled by the control unit MC. The conveying device TU1 conveys the substrate W through the chamber of the loading module LM. The conveying device TU1 conveys the substrate W between each container 4a-4d and the calibrator AN, between the calibrator AN and each load locking module LL1, LL2, and between each load locking module LL1, LL2 and each container 4a-4d. The calibrator AN is connected to the loading module LM. The calibrator AN adjusts the position of the substrate W (position calibration).
[0050] Load locking modules LL1 and LL2 are respectively located between the loading module LM and the conveying module TM. Each load locking module LL1 and LL2 provides a pre-pressure reduction chamber. Both load locking modules LL1 and LL2 are connected to the loading module LM via gate valves. Additionally, both load locking modules LL1 and LL2 are connected to the conveying module TM via gate valves.
[0051] The transfer module TM has a pressure-reducing transfer chamber TC. The transfer module TM has a transfer device TU2. The transfer device TU2 is, for example, a transfer robot, controlled by the control unit MC. The transfer device TU2 transfers the substrate W via the transfer chamber TC. The transfer device TU2 can transfer the substrate W between each load locking module LL1, LL2 and each processing module PM1 to PM6, and between any two processing modules among PM1 to PM6.
[0052] Processing modules PM1 through PM6 are connected to the conveying module TM via gate valves. Processing modules PM1 through PM6 are devices for performing specialized substrate processing. At least one of processing modules PM1 through PM6 is the substrate processing device described later in the embodiments.
[0053] The transfer module CTM has chambers and a transfer device. The transfer module CTM is controlled by the control unit MC. The transfer module CTM has a transfer device. The transfer device of the transfer module CTM transfers materials from the second chamber located in the first chamber of the substrate processing apparatus to the chamber of the transfer module CTM. The details of the transfer module CTM will be described later.
[0054] The control unit (MC) controls various parts of the substrate processing system (PS). The control unit (MC) can be a computer including a processor, storage device, input device, display device, etc. The control unit (MC) runs a control program stored in the storage device and controls various parts of the substrate processing system (PS) based on the recipe data stored in the storage device. For the maintenance method described later, the control of various parts of the substrate processing system (PS) by the control unit (MC) can be implemented within the substrate processing system (PS).
[0055] The substrate processing apparatus in the embodiments will now be described. Figure 2 This is a schematic diagram illustrating a substrate processing apparatus in one embodiment. Figure 3 This is a partially enlarged cross-sectional view of a substrate processing apparatus in one embodiment. Figure 2 and Figure 3 The substrate processing apparatus 1 shown is a capacitively coupled plasma processing apparatus. The substrate processing apparatus 1 includes a first chamber 10, a second chamber 20, and a substrate support 30.
[0056] The first chamber 10 provides internal space. The first chamber 10 is made of a metal such as aluminum. The first chamber 10 is electrically grounded. A corrosion-resistant film can be formed on the surface of the first chamber 10. The corrosion-resistant film is formed, for example, from materials such as aluminum oxide or yttrium oxide.
[0057] The first chamber 10 includes sidewalls 10s. The sidewalls 10s have a generally cylindrical shape. The central axis of the sidewalls 10s extends in the vertical direction. Figure 2 The axis is represented as AX. The sidewall 10s provides a channel 10p. The internal space of the first chamber 10 is connected to the internal space of the transport chamber TC of the transport module TM via channel 10p. Channel 10p can be opened and closed by a gate valve 10g. The substrate W is transported between the internal space of the first chamber 10 and the outside of the first chamber 10 via channel 10p.
[0058] The sidewall 10s also provides an opening 10o. The opening 10o has dimensions through which the second chamber 20 can pass. The internal space of the first chamber 10 can be connected to the internal space of the transport module CTM via the opening 10o. The opening 10o can be opened and closed by a gate valve 10v.
[0059] In one embodiment, a portion of the sidewall 10s has a dual structure formed by an inner sidewall 10i and an outer sidewall 10e. The inner sidewall 10i and the outer sidewall 10e provide a space 10q between them. An opening 10o is formed on the inner sidewall 10i and the outer sidewall 10e. A gate valve 10v is disposed along the inner sidewall 10i for opening and closing the opening 10o.
[0060] The first chamber 10 may also include an upper portion 10u. The upper portion 10u extends from the upper end of the side wall 10s in a direction intersecting the axis AX. The upper portion 10u provides an opening in the region intersecting the axis AX.
[0061] The first chamber 10 also includes a movable part 10m. The movable part 10m is located below the upper part 10u of the first chamber 10 and inside the side wall 10s. The movable part 10m can move upward and downward within the first chamber 10.
[0062] The substrate processing apparatus 1 also includes a lifting mechanism 12. The lifting mechanism 12 moves the movable part 10m upward and downward. The lifting mechanism 12 includes a drive device 12d and a shaft 12s. The movable part 10m is fixed to the shaft 12s. The shaft 12s extends upward from the movable part 10m through an opening in the upper part 10u. The drive device 12d is disposed outside the first chamber 10. The drive device 12d moves the shaft 12s upward and downward. The drive device 12d includes, for example, a motor. By moving the shaft 12s upward and downward, the movable part 10m moves upward and downward.
[0063] The substrate processing apparatus 1 may further include a bellows (vacuum diaphragm) 14. The bellows 14 is disposed between the movable part 10m and the upper part 10u. The bellows 14 separates the internal space of the first chamber 10 from the outside of the first chamber 10. The lower end of the bellows 14 is fixed to the movable part 10m. The upper end of the bellows 14 is fixed to the upper part 10u.
[0064] In one embodiment, the movable part 10m may also include a first component 10a and a second component 10b. The first component 10a and the second component 10b are fixed to each other. The first component 10a has a generally disc-shaped form. The first component 10a is formed of a conductor such as aluminum. The first component 10a can form an upper electrode in the substrate processing apparatus 1. The second component 10b has a generally cylindrical shape. The second component 10b extends along the outer periphery of the first component 10a and extends above the first component 10a. The lower end of the bellows 14 is fixed to the upper end of the second component 10b.
[0065] In one embodiment, the movable part 10m may also form a nozzle together with the top of the second chamber 20 (described later). That is, the movable part 10m may also form part of a nozzle that supplies gas to the processing space S (described later). In this embodiment, the movable part 10m provides a gas diffusion chamber 10d and a plurality of air holes 10h.
[0066] A gas diffusion chamber 10d may also be provided in the first component 10a. A gas supply unit 16 is connected to the gas diffusion chamber 10d. The gas supply unit 16 is located outside the first chamber 10. The gas supply unit 16 includes one or more gas sources used in the substrate processing apparatus 1, one or more flow controllers, and one or more valves. The one or more gas sources are respectively connected to the gas diffusion chamber 10d via corresponding flow controllers and corresponding valves. A plurality of vents 10h extend downward from the gas diffusion chamber 10d.
[0067] The substrate support 30 is disposed within the first chamber 10 and below the movable part 10m. The substrate support 30 is used to support the substrate W placed thereon. The substrate support 30 may also be supported by a support part 31. The support part 31 has a generally cylindrical shape. The support part 31 is formed, for example, of an insulator such as quartz. The support part 31 may also extend upward from the base plate 32. The base plate 32 may be formed of a metal such as aluminum.
[0068] The substrate support 30 may include a lower electrode 34 and an electrostatic chuck 36. The lower electrode 34 has a generally disk-shaped form. The central axis of the lower electrode 34 is generally aligned with axis AX. The lower electrode 34 is formed of a conductor such as aluminum. A flow path 34f is provided in the lower electrode 34. The flow path 34f extends, for example, in a vortex-like manner. The flow path 34f is connected to a cooling unit 35. The cooling unit 35 is disposed outside the first chamber 10. The cooling unit 35 supplies refrigerant to the flow path 34f. The refrigerant supplied to the flow path 34f returns to the cooling unit 35.
[0069] The substrate processing apparatus 1 may further include a first high-frequency power supply 41 and a second high-frequency power supply 42. The first high-frequency power supply 41 is a power source that generates first high-frequency electricity. The first high-frequency electricity has a frequency suitable for generating plasma. The frequency of the first high-frequency electricity is, for example, above 27 MHz. The first high-frequency power supply 41 is electrically connected to the lower electrode 34 via a matching device 41m. The matching device 41m has a matching circuit for matching the impedance of the load side (lower electrode 34 side) of the first high-frequency power supply 41 with the output impedance of the first high-frequency power supply 41. Alternatively, the first high-frequency power supply 41 may be connected to the upper electrode via the matching device 41m instead of the lower electrode 34.
[0070] The second high-frequency power supply 42 is a power source that generates a second high-frequency power. This second high-frequency power has a frequency suitable for introducing ions into the substrate W. The frequency of the second high-frequency power is, for example, below 13.56 MHz. The second high-frequency power supply 42 is electrically connected to the lower electrode 34 via a matching converter 42m. The matching converter 42m has a matching circuit for matching the impedance of the load side (lower electrode 18 side) of the second high-frequency power supply 42 with the output impedance of the second high-frequency power supply 42.
[0071] An electrostatic chuck 36 is disposed on the lower electrode 34. The electrostatic chuck 36 includes a body and an electrode 36a. The body of the electrostatic chuck 36 has a generally disc-shaped form. The central axis of the electrostatic chuck 36 is substantially aligned with the axis AX. The body of the electrostatic chuck 36 is made of ceramic. A substrate W is placed on top of the body of the electrostatic chuck 36. The electrode 36a is a film formed of a conductor. The electrode 36a is disposed within the body of the electrostatic chuck 36. The electrode 36a is connected to a DC power supply 36d via a switch 36s. When a voltage from the DC power supply 36d is applied to the electrode 36a, an electrostatic attraction is generated between the electrostatic chuck 36 and the substrate W. Due to the generated electrostatic attraction, the substrate W is attracted by the electrostatic chuck 36 and held by the electrostatic chuck 36. The substrate processing apparatus 1 can provide a gas line for supplying a heat transfer gas (e.g., helium) in the gap between the electrostatic chuck 36 and the back surface of the substrate W.
[0072] The substrate support 30 may also support the edge ring ER disposed thereon. The substrate W is placed on the electrostatic chuck 36 within the area enclosed by the edge ring ER. The edge ring ER is formed, for example, of silicon, quartz, or silicon carbide.
[0073] The substrate processing apparatus 1 may also include an insulating portion 37. The insulating portion 37 is formed of an insulator such as quartz. The insulating portion 37 may have a generally cylindrical shape. The insulating portion 37 extends along the outer periphery of the lower electrode 34 and the outer periphery of the electrostatic chuck 36.
[0074] The substrate processing apparatus 1 may further include a conductor portion 38. The conductor portion 38 is formed of a conductor such as aluminum. The conductor portion 38 may have a generally cylindrical shape. The conductor portion 38 is disposed along the outer periphery of the substrate support 30. Specifically, the conductor portion 38 extends circumferentially outside the insulating portion 37 in the radial direction. The radial direction and the circumferential direction are directions based on the axis AX. The conductor portion 38 is grounded. In one embodiment, the conductor portion 38 is grounded via a base plate 32 and a first chamber 10.
[0075] The substrate processing apparatus 1 may also include a cap ring 39. The cap ring 39 is formed of an insulator such as quartz. The cap ring 39 is annular. The cap ring 39 is disposed on the insulating portion 37 and the conductor portion 38 such that it is located outside the region where the edge ring ER is disposed in the radial direction.
[0076] The substrate processing apparatus 1 may further include a contact 40. The contact 40 is electrically connected to the conductor portion 38. The second chamber 20 abuts against the contact 40 when forming a processing space S together with the substrate support 30. The processing space S is the space in which the substrate W is processed. In one embodiment, the contact 40 is arranged radially outside the collar 39 and extends upward from the conductor portion 38.
[0077] Contact 40 can elastically contact the second chamber 20. For example... Figure 3 As shown, the contact 40 may have a spring 40s. The contact 40 may also have a contact portion 40c. Both the spring 40s and the contact portion 40c are conductive. The lower end of the spring 40s is fixed to the conductor portion 38. The spring 40s extends upward from the conductor portion 38. The contact portion 40c is fixed to the upper end of the spring 40s. The contact portion 40c is the part that contacts the second chamber 20.
[0078] The second chamber 20 is disposed within the first chamber 10 and, together with the substrate support 30, forms the processing space S. The second chamber 20 is made of a metal such as aluminum. A corrosion-resistant film can be formed on the surface of the second chamber 20. The corrosion-resistant film is formed, for example, from materials such as alumina or yttrium oxide.
[0079] The second chamber 20 can be removed from the first chamber 10 and can be transported between the interior space of the first chamber 10 and the exterior of the first chamber 10 via the opening 10o.
[0080] The substrate processing apparatus 1 also includes a clamp 50 and a release mechanism 60. The clamp 50 is used to fix the second chamber 20 onto the first chamber 10 and is capable of being released. The release mechanism 60 is used to release the clamp 50 from fixing the second chamber 20. The clamp 50 and the release mechanism 60 will be described in detail later.
[0081] In one embodiment, the second chamber 20 may include a top 20c. The top 20c extends generally horizontally above the processing space S. With the second chamber 20 fixed in the first chamber 10, the upper surface of the top 20c abuts against the lower surface of the movable part 10m. The top 20c is provided with a plurality of vents 20h. The plurality of vents 20h penetrate the top 20c and open toward the processing space S. The plurality of vents 20h are respectively connected to a plurality of vents 10h.
[0082] In one embodiment, the second chamber 20 may further include a side portion 20s. The side portion 20s extends laterally to the processing space S. The side portion 20s has a generally cylindrical shape. The side portion 20s extends downward from the edge of the top 20c.
[0083] In one embodiment, the second chamber 20 may further include a bottom 20b. The bottom 20b extends from the lower end of the side portion 20s in a direction intersecting the axis AX. When the second chamber 20 and the substrate support 30 together form the processing space S, the bottom 20b abuts against the contact 40.
[0084] Multiple through holes are formed on the bottom 20b. The substrate processing apparatus 1 may also include an exhaust device 70. The exhaust device 70 includes a pressure regulator such as an automatic pressure control valve and a pressure reducing pump such as a turbomolecular pump. The exhaust device 70 is connected to the bottom of the first chamber 10 below the bottom 20b.
[0085] The clamp 50 and the release mechanism 60 will be described below. The clamp 50 fixes the top 20c of the second chamber 20 to the movable part 10m of the first chamber 10 and can be released.
[0086] like Figure 2 and Figure 3 As shown, in one embodiment, the clamp 50 includes a plurality of support portions 52 and a plurality of springs 54. The clamp 50 may also include a plate 56. Alternatively, the number of support portions 52 and the number of springs 54 in the clamp 50 may each be one.
[0087] Each of the multiple support portions 52 has a lower end 52b. The lower end 52b is formed such that the top 20c is suspended from it. Multiple springs 54 are provided such that the top 20c applies force to the movable portion 10m of the first chamber 10.
[0088] In one embodiment, the movable portion 10m of the first chamber 10 provides a cavity 10c. The cavity 10c can extend circumferentially about an axis AX. The cavity 10c is closed by a cover 58. The cover 58 is provided on the movable portion 10m of the first chamber 10 to close the cavity 10c. The movable portion 10m also provides a plurality of holes 10t. The plurality of holes 10t can also be arranged at equal intervals about an axis AX. The plurality of holes 10t extend downward from the cavity 10c and open toward a top 20c. The top 20c provides a plurality of recesses 20r. When the second chamber 20 is fixed in the first chamber 10, the plurality of recesses 20r are respectively connected to the plurality of holes 10t.
[0089] In one embodiment, a plurality of support portions 52 are each formed in a rod shape. The lower ends 52b of each of the plurality of support portions 52 protrude in a horizontal direction. The bottom of each of the plurality of recesses 20r includes an extension 20e. The extension 20e is formed such that the lower ends 52b of the corresponding support portion among the plurality of support portions 52 can be located in that position. In one embodiment, the plurality of support portions 52 may be screws, and the lower ends 52b of the plurality of support portions 52 may also be screw heads.
[0090] Multiple support portions 52 extend downward from the cavity 10c through multiple holes 10t. With the top 20c suspended from the multiple support portions 52, the lower ends 52b of the multiple support portions 52 are respectively disposed in multiple recesses 20r and their extensions 20e.
[0091] The upper ends of multiple support portions 52 are fixed to plate 56 within cavity 10c. Multiple springs 54 are disposed within cavity 10c. The multiple springs 54 are positioned between the surface of the movable portion 10m that divides cavity 10c from below and plate 56. In one embodiment, the multiple springs 54 are helical springs. The multiple springs 54 are arranged such that they surround the multiple support portions 52 within cavity 10c.
[0092] In one embodiment, the release mechanism 60 includes an air supply. To release the clamp 50 from the top 20c, the air supply provides air pressure to separate the lower ends 52b of each of the plurality of supports 52 from the second chamber 20. The air supply of the release mechanism 60 can supply air into the gap between the cover 58 and the plate 56. After air is supplied into the gap between the cover 58 and the plate 56, the plate 56 and the plurality of supports 52 move downwards, and the lower ends 52b of each of the plurality of supports 52 separate from the second chamber 20. That is, the clamp 50 is released from the top 20c. With the clamp 50 released from the top 20c, the second chamber 20 is released from its fixation in the first chamber 10, enabling the second chamber 20 to be moved from the interior space of the first chamber 10 to the exterior of the first chamber 10.
[0093] The following is an explanation of the transfer module CTM. Figure 4 This is a schematic diagram illustrating a transport module of a substrate processing system in one embodiment. The transport module CTM includes a chamber 110. The chamber 110 provides an internal space 112 and an internal space 114. The internal space 112 is disposed above and separated from the internal space 114. The sidewall 110s of the chamber 110 provides an opening 110o that is continuous with the internal space 112. The opening 110o can be opened and closed by a gate valve 116.
[0094] In one embodiment, a portion of the sidewall 110s has a dual structure formed by an inner sidewall 110i and an outer sidewall 110e. The inner sidewall 110i and the outer sidewall 110e provide a space 110q between them. An opening 110o is formed on the inner sidewall 110i and the outer sidewall 110e. A gate valve 110v is disposed along the inner sidewall 110i for opening and closing the opening 110o.
[0095] The transport module CTM also includes a transport device 120. The transport device 120 is a transport robot, including an arm 120a. The transport device 120 is disposed in the internal space 112.
[0096] The transport module CTM also includes an exhaust device 122. The exhaust device 122 is disposed within the internal space 114. The exhaust device 122 is connected to the internal space 112 via valve 124 and to space 110q via valve 126. The exhaust device 122 is used to depressurize both the internal space 112 and space 110q.
[0097] The transport module CTM also includes a moving mechanism 130. The moving mechanism 130 has a main body 132 and multiple wheels 134. The main body 132 houses a power source, such as a battery, and a steering mechanism. The wheels 134 rotate using the power source within the main body 132, moving the transport module CTM in a direction controlled by a guiding mechanism within the main body 132. Alternatively, if the transport module CTM can be moved, the moving mechanism 130 may also employ a mechanism other than a walking-type wheel 561.
[0098] The transport module CTM also includes a sensor 138 and a controller 140. The sensor 138 is mounted on the outer wall of the chamber 110. The control unit 140 is located in the internal space 114. The sensor 138 senses the environment around the transport module CTM and outputs the sensing results to the control unit 140. The sensor 138 is, for example, an image sensor, which outputs an image of the area around the transport module CTM to the control unit 140. The control unit 140 may be a computer with storage devices such as a processor and memory, as well as a communication unit. The control unit 140 controls various parts of the transport module CTM. To connect the transport module CTM to the substrate processing device 1, the control unit 140 uses the sensing results from the sensor 138 to control the moving mechanism 130, thereby moving the transport module CTM. Additionally, the control unit 140 also controls the exhaust device 122 and valves 124 and 126.
[0099] Below, refer to Figures 5-13 A maintenance method in one embodiment will be described. Furthermore, the control of the control unit MC used in the maintenance method will also be described. Figures 5-10 and Figures 12-13 These are diagrams illustrating the state of the substrate processing system during the implementation of a maintenance method in one embodiment. Figure 11 This is a partially enlarged cross-sectional view of the substrate processing apparatus in one embodiment. In the maintenance method, for maintenance purposes, the second chamber 20 is removed from the first chamber 10 and transported from the internal space of the first chamber 10 to the internal space of the chamber 110 of the transfer module CTM.
[0100] The maintenance method begins when the second chamber 20 is fixed to the movable part 10m, and the second chamber 20 and the substrate support 30 together form the processing space S. In this state, the second chamber 20 is in contact with the contact 40 and grounded.
[0101] First, in the maintenance method, the CTM transport module is moved, such as... Figure 5 As shown, the chamber 110 of the transport module CTM is connected to the first chamber 10 of the substrate processing apparatus 1. The first chamber 10 and the chamber 110 are connected to each other with openings 10o and 110o respectively. In order to move the transport module CTM, the control unit MC controls the transport module CTM. Specifically, the control unit 140, which receives instructions from the control unit MC, controls the moving mechanism 130, thereby moving the module CTM.
[0102] With chamber 110 connected to the first chamber 10, sidewall 10s, gate valve 10v, sidewall 110s, and gate valve 10v form a sealed space. This sealed space includes space 10q and space 110q. In the maintenance method, the sealed space is depressurized using an exhaust device 122. Simultaneously, the internal space 112 of the transfer module CTM's chamber 110 is also depressurized using the exhaust device 122. To depressurize both the sealed space and the internal space 112, the exhaust device 122 is controlled by a control unit MC. Specifically, the exhaust device 122 is controlled by a control unit 140 that receives commands from the control unit MC.
[0103] Next, in the maintenance method, such as Figure 6 As shown, in order to connect the internal space of the first chamber 10 with the internal space 112 of the transfer module CTM's chamber 110, gate valves 10v and 116 are moved. The movement of gate valves 10v and 116 opens openings 10o and 110o. Gate valves 10v and 116 are controlled by the control unit MC to move them. Gate valve 116 is controlled by the control unit 140, which receives commands from the control unit MC.
[0104] Next, in the maintenance method, such as Figure 7 As shown, the movable part 10m and the second chamber 20 are separated upward from the substrate support 30 within the first chamber 10. The movable part 10m and the second chamber 20 are moved upward by the lifting mechanism 12. The lifting mechanism 12 is controlled by the control unit MC to move the movable part 10m and the second chamber 20 upward. Furthermore, in Figure 7 In the state shown, when the second chamber 20 is separated from the substrate support 30 upwards, the second chamber 20 is also separated from the contact 40.
[0105] Next, in the maintenance method, such as Figure 8As shown, the arm 120a of the conveying device 120 extends from the internal space 112 of the chamber 110 of the conveying module CTM to the lower part of the second chamber 20, and enters the internal space of the first chamber 10. For this purpose, the conveying device 120 is controlled by the control unit MC. Specifically, the conveying device 120 is controlled by the control unit 140, which receives instructions from the control unit MC.
[0106] Next, in the maintenance method, such as Figure 9 As shown, the movable part 10m and the second chamber 20 move downward via the lifting mechanism 12, and the second chamber 20 is placed on the arm 120a. In order to move the movable part 10m and the second chamber 20 downward, the lifting mechanism 12 is controlled by the control unit MC.
[0107] Next, in the maintenance method, such as Figure 10 and Figure 11 As shown, the clamp 50 releases its fixation to the second chamber 20. The release mechanism 60 releases the clamp 50 from the second chamber 20. In one embodiment, the release mechanism 60 supplies air from its air supply to the gap between the cover 58 and the plate 56. This releases the clamp 50 from the second chamber 20. The release mechanism 60 is controlled by the control unit MC to release the clamp 50 from the second chamber 20.
[0108] Next, as Figure 10 and Figure 11 As shown, the second chamber 20 moves horizontally via the conveying device 120. Consequently, the lower ends 52b of the plurality of support portions 52 retract from the extension portion 20e. To enable the second chamber 20 to move horizontally, the conveying device 120 is controlled by a control unit MC. Specifically, the conveying device 120 is controlled by a control unit 140 that receives instructions from the control unit MC.
[0109] Next, in the maintenance method, such as Figure 12 As shown, the movable part 10m moves upward and separates from the second chamber 20. The movable part 10m moves upward via the lifting mechanism 12. To enable the movable part 10m to move upward, the lifting mechanism 12 is controlled by the control unit MC.
[0110] Next, in the maintenance method, such as Figure 13 As shown, the second chamber 20 is conveyed from the interior space of the first chamber 10 through openings 10o and 110o into the interior space 112 of the transfer module CTM's chamber 110. For this purpose, the arm 120a of the transfer device 120 returns to the interior space 112 of the transfer module CTM's chamber 110. The transfer device 120 is controlled by a control unit MC for conveying the second chamber 20. Specifically, the transfer device 120 is controlled by a control unit 140 that receives instructions from the control unit MC.
[0111] like Figure 13 As shown, gate valves 10v and 116 are moved, thereby closing openings 10o and 110o. To move them, gate valves 10v and 116 are controlled by a control unit MC. Gate valve 116 is controlled by a control unit 140 that receives instructions from the control unit MC.
[0112] As described above, in the substrate processing apparatus 1, the substrate W is processed within the second chamber 20. The second chamber 20 is disposed within and fixed within the first chamber 10. The second chamber 20 can be released from its fixation in the first chamber 10 using the release mechanism 60. Furthermore, with the second chamber 20 released from its fixation in the first chamber 10, the second chamber 20 can be moved out of the first chamber 10 through the opening 10o provided on the side wall of the first chamber 10. Therefore, the second chamber 20 forming the processing space S can be easily maintained.
[0113] Furthermore, based on the substrate processing system PS and the aforementioned maintenance method, the second chamber 20 can be automatically removed from the internal space of the first chamber 10. Therefore, the non-operation period of the substrate processing system PS due to maintenance (e.g., replacement) of the second chamber 20 is shortened.
[0114] Below, refer to Figure 14 . Figure 14 This is a partially enlarged cross-sectional view of a substrate processing apparatus in one embodiment. Figure 14 In the substrate processing apparatus shown, the structure of contact 40 differs from that of contact 40 in substrate processing apparatus 1. Figure 14 In the substrate processing apparatus shown, the contact 40 is a pin. A second chamber 20 provides a recess 20r in which the pin of the contact 40 is inserted. In one embodiment, the pin of the contact 40 may have a tapered shape. The recess 20r of the second chamber 20 may have a tapered shape corresponding to the tapered shape of the pin of the contact 40. Figure 14 Other configurations of the substrate processing apparatus shown may be the same as the corresponding configuration of substrate processing apparatus 1.
[0115] Below, refer to Figure 15 . Figure 15 This is a partially enlarged cross-sectional view of the substrate processing apparatus in other embodiments. Figure 15 In the substrate processing apparatus shown, the structure of contact 40 differs from that of contact 40 in substrate processing apparatus 1. Figure 15 In the substrate processing apparatus shown, the contact 40 includes a membrane. The membrane of the contact 40 is flexible and is formed of a conductive material. The membrane of the contact 40 is mounted on the outer peripheral surface of the conductor portion 38. The membrane of the contact 40, together with the conductor portion 38, forms a pressure chamber 40p within the conductor portion 38.
[0116] Figure 15 The substrate processing apparatus 1 shown provides a flow path 40f. The flow path 40f is connected to the pressure chamber 40p. The flow path 40f is partially formed in the conductor portion 38. Figure 15 The substrate processing apparatus 1 shown also includes an air supply unit 70a and an exhaust unit 71a. The air supply unit 70a is connected to the flow path 40f via a valve 70v. The exhaust unit 71a is a device such as a dry pump, connected to the flow path 40f via a valve 71v. The air supply unit 70a supplies air to the pressure chamber 40p. That is, the air supply unit 70a applies air pressure to the membrane of the contact 40 and presses the membrane tightly against the second chamber 20. In the illustrated example, the membrane of the contact 40 is pressed tightly against the inner edge of the bottom 20b of the second chamber 20. When the air in the pressure chamber 40p is discharged by the exhaust unit 71a, the membrane of the contact 40 separates from the second chamber 20. Figure 15 Other configurations of the substrate processing apparatus shown may be the same as the corresponding configuration of substrate processing apparatus 1.
[0117] Below, refer to Figures 16-20 . Figure 16 This is a partially enlarged cross-sectional view of the substrate processing apparatus in other embodiments. Figure 17 This is a plan view showing a portion of the second chamber, the cover ring, and the edge ring in the substrate processing apparatus of other embodiments. Figure 17 This indicates that the multiple protrusions of the cover ring are positioned on the inner edge of the bottom of the second chamber. Figure 18 It is along Figure 17 The cross-sectional view of the XVIII-XVIII line. Figure 19 This is a plan view showing a portion of the second chamber, the cover ring, and the edge ring in the substrate processing apparatus of other embodiments. Figure 19 This indicates that the positions of the multiple protrusions of the cover ring are consistent with the positions of the multiple notches provided by the inner edge of the bottom of the second chamber. Figure 20 It is along Figure 19 The cross-sectional view of the XX line.
[0118] exist Figures 16-20 In the substrate processing apparatus shown, the cover ring 39 includes an inner edge portion 39i and an outer edge portion. The outer edge portion ERo of the edge ring ER disposed on the substrate support 30 is disposed on the inner edge portion 39i and supported by the inner edge portion 39i. The outer edge portion of the cover ring 39 includes a plurality of protrusions 39p. The plurality of protrusions 39p project radially and are arranged along the circumferential direction.
[0119] The bottom 20b of the second chamber 20 includes an inner edge portion 20i. The inner edge portion 20i forms an inner hole 20p. The inner hole 20p is formed such that the edge ring ER supported by the cover ring 39 can pass through the inner hole 20p from the inside of the second chamber 20 to the outside of the second chamber 20 together with the cover ring 39. The inner hole 20p includes a plurality of grooves 20n. The plurality of grooves 20n are provided by the inner edge portion 20i. The plurality of grooves 20n are arranged circumferentially in the same manner as the plurality of protrusions 39p. The plurality of grooves 20n are formed in such a way that the plurality of protrusions 39p can pass through. The inner edge portion 20i of the bottom 20b of the second chamber 20 is configured to support the plurality of protrusions 39p of the cover ring 39 disposed thereon.
[0120] according to Figures 16-20 In the substrate processing apparatus shown, when the positions of the plurality of protrusions 39p and the plurality of grooves 20n are not aligned, the second chamber 20 can support the edge ring ER together with the cover ring 39. Therefore, the cover ring 39 and the edge ring ER can be moved out of the first chamber 10 along with the second chamber 20. Furthermore, by adjusting the position of the cover ring 39 in the rotational direction so that the positions of the plurality of protrusions 39p align with the positions of the plurality of grooves 20n, the cover ring 39 and the edge ring ER can be removed from the second chamber 20 through the inner hole 20p. Figures 16-20 Other configurations of the substrate processing apparatus shown may be the same as the corresponding configuration of substrate processing apparatus 1.
[0121] The various embodiments have been described above, but the present invention is not limited to the embodiments described above, and various additions, omissions, substitutions, and modifications can be made. In addition, elements from different embodiments can be combined to form other embodiments.
[0122] For example, in other embodiments, the substrate processing apparatus may be an inductively coupled plasma processing apparatus, an electron cyclotron resonance (ECR) plasma processing apparatus, or other types of plasma processing apparatus such as those using microwave-generated plasma. Additionally, in other embodiments, the substrate processing apparatus may also be a substrate processing apparatus configured to perform substrate processing other than plasma processing.
[0123] The transfer module CTM can also be stationary and can be connected to and fixed to the first chamber of the substrate processing apparatus having the second chamber 20. Alternatively, the transfer module TM can be used instead of the transfer module CTM as a module for moving the second chamber 20 out of the internal space of the first chamber 10.
[0124] Additionally, the clamp 50 may include a cam mechanism for securing the second chamber 20 to the first chamber 10. The release mechanism 60 may also release the cam mechanism from securing the second chamber 20 by rotating the cam of the cam mechanism.
[0125] As can be seen from the above description, the various embodiments of this disclosure have been described in this specification for illustrative purposes, and various changes can be made without departing from the scope and spirit of this disclosure. Therefore, the various embodiments disclosed in this specification are not intended to limit the scope, and the true scope and spirit are as shown in the appended claims.
[0126] Symbol Explanation
[0127] 1…substrate processing device, 10…first chamber, 10s…side wall, 10o…opening, 10m…movable part, 12…lifting mechanism, 20…second chamber, 30…substrate support, S…processing space, 50…clamp, 60…release mechanism, PS…substrate processing system, CTM…transfer module.
Claims
1. A substrate processing apparatus, characterized in that, The substrate processing apparatus includes: The first chamber includes a sidewall providing an opening, and also includes a movable part that can move upward and downward within the first chamber; A substrate support disposed within the first chamber; The second chamber, which is disposed within the first chamber, forms a processing space together with the substrate support in which the substrate placed on the substrate support is processed, and is detachable from the first chamber and can be transported between the interior space of the first chamber and the exterior of the first chamber via the opening; A clamp that is releasable from the second chamber and is fixed to the movable part extending from the second chamber; A release mechanism to release the clamp from fixing the second chamber; and A lifting mechanism that moves the movable part upwards and downwards.
2. The substrate processing apparatus as described in claim 1, characterized in that, The second chamber includes a top extending above the processing space. The clamp releasably secures the top to the movable part.
3. The substrate processing apparatus as described in claim 2, characterized in that, The clamp includes: It has a support portion at its lower end configured to suspend from the top therefrom; A spring that applies force from the top to the movable part via the lower end of the support portion.
4. The substrate processing apparatus as described in claim 3, characterized in that, The release mechanism includes an air supply that provides air pressure to separate the lower end of the support from the second chamber, thereby releasing the clamp from the top.
5. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that, Also includes: A grounded conductor portion disposed along the outer periphery of the substrate support; and The contact that is electrically connected to the conductor portion, The second chamber, together with the substrate support, forms the processing space and abuts against the contact.
6. The substrate processing apparatus as described in claim 5, characterized in that, The contact is in elastic contact with the second chamber.
7. The substrate processing apparatus as described in claim 6, characterized in that, The contact includes a spring.
8. The substrate processing apparatus as described in claim 5, characterized in that, The contact is a pin. The second chamber provides a recess in which the pin is embedded.
9. The substrate processing apparatus as described in claim 8, characterized in that, The pin has a tapered shape. The recess of the second chamber has a conical shape corresponding to the conical shape of the pin.
10. The substrate processing apparatus as claimed in claim 6, characterized in that, The contact includes a flexible membrane formed of a conductive material. It also includes another air supply that applies air pressure to the membrane and causes the membrane to adhere tightly to the second chamber.
11. The substrate processing apparatus according to any one of claims 5 to 10, characterized in that, The second chamber includes a bottom extending below the processing space, which abuts against the contact.
12. The substrate processing apparatus according to any one of claims 1 to 10, characterized in that, It also includes a cover ring with an inner edge and an outer edge. An edge ring is disposed on the substrate support. The inner edge of the cover ring supports the outer edge of the edge ring disposed thereon. The outer edge of the cover ring includes a plurality of radially projecting protrusions. The second chamber includes a bottom having an inner edge portion that forms an inner hole through which the edge ring and the cover ring can pass, supporting the cover ring with the plurality of protrusions disposed on the inner edge portion of the bottom. The inner hole includes a plurality of grooves through which the plurality of protrusions can pass and which are provided by the inner edge portion.
13. The substrate processing apparatus according to any one of claims 1 to 12, characterized in that, The substrate processing device is a plasma processing device.
14. A substrate processing system, characterized in that, The substrate processing system includes: The substrate processing apparatus as described in any one of claims 1 to 13; A conveying module; which is a conveying module having another chamber including a sidewall providing an opening and a conveying device that conveys the second chamber from the interior space of the first chamber through the opening of the first chamber and the opening of the other chamber to the interior space of the other chamber, and A control unit that controls the lifting mechanism, the release mechanism, and the conveying device. The control unit controls the lifting mechanism to separate the movable part and the second chamber from the substrate support upwards. The control unit controls the release mechanism to release the clamp from the second chamber, thereby transferring the second chamber to the conveying device. The control unit controls the conveying device to convey the second chamber from the interior space of the first chamber through the opening of the first chamber and the opening of the other chamber to the interior space of the other chamber.
15. The substrate processing system as described in claim 14, characterized in that, The substrate processing apparatus further includes a gate valve for opening and closing the opening of the first chamber. The conveying module also includes a gate valve for opening and closing the opening of the other chamber. With the other chamber connected to the first chamber, the sidewall of the first chamber, the sidewall of the other chamber, the gate valve of the substrate processing device, and the gate valve of the conveying module form a sealed space between them. The substrate processing system also includes an exhaust device for depressurizing the sealed space.
16. A maintenance method, characterized in that, include: (a) A step of separating a second chamber upward from a substrate support within a first chamber of a substrate processing apparatus, the substrate processing apparatus comprising: The first chamber includes a sidewall providing an opening, and also includes a movable portion extending over the second chamber and movable upward and downward within the first chamber; The substrate support disposed in the first chamber; and The second chamber is disposed within the first chamber and together with the substrate support forms a processing space in which the substrate placed on the substrate support is processed; (b) The process of releasing the second chamber from the movable part of the first chamber; and (c) The process of transferring the second chamber from the interior space of the first chamber through the opening to the interior space of the chamber of the transfer module.