A transfer device for wafer transport

By designing a support frame and a transfer device for the wafer stage, the problem that existing wafer transfer stages cannot transport two wafers simultaneously has been solved, enabling the synchronous operation of two polishing and cleaning systems and improving the stability and efficiency of wafer transfer.

CN114388416BActive Publication Date: 2026-06-30BEIJING SEMICORE MICROELECTRONICS EQUIPMENT CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING SEMICORE MICROELECTRONICS EQUIPMENT CO LTD
Filing Date
2022-01-13
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing wafer transfer stations cannot transport two wafers simultaneously, failing to meet the needs of two parallel polishing and cleaning systems.

Method used

A transfer device was designed, comprising a support frame, a accommodating space, and first and second wafer stages. It has three transport ports to restrict the vertical passage and path of the wafers. Independent transfer is achieved through the vertically spaced wafer stages and transport ports, in conjunction with two parallel polishing and cleaning systems.

Benefits of technology

It enables the simultaneous operation of two polishing and cleaning systems, avoids interference between the transfer arms, improves the stability and efficiency of wafer transfer and transmission, reduces the arm span of the transfer arms, and simplifies the installation process.

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Abstract

This invention provides a transfer device for wafer transport, comprising: a support frame with a accommodating space at its top for restricting the vertical movement of wafers; a first wafer stage and a second wafer stage for supporting wafers within the accommodating space, the first and second wafer stages being spaced vertically apart; and a transport port circumferentially open in the accommodating space for horizontal wafer movement, including a first transport port facing a first polishing and cleaning system, a second transport port facing a second polishing and cleaning system, and a third transport port facing an EFEM (Enhanced Embedded Surface Mount Equipment). In this invention, the accommodating space restricts the vertical movement of wafers, and the three transport ports circumferentially define the wafer transport path; the spaced-apart first and second wafer stages each have their own docking transport ports; the two layers of wafers, spaced vertically apart, can be independently transferred and operated through their respective transport ports to facilitate the simultaneous operation of two parallel systems.
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