Performance evaluation testing apparatus and method for quartz crystal oscillator chips

Abstract

This invention discloses a performance evaluation testing device and method for quartz crystal oscillator chips. The testing device includes a testing apparatus, a crystal resonator, and a testing socket. The testing socket is equipped with a first connecting connector, a second connecting connector, and multiple test contacts. These test contacts are used to make one-to-one contact with multiple pins of the chip under test. A portion of the test contacts is electrically connected to the first connecting connector, which is used for electrical connection to the testing apparatus. Another portion of the test contacts is connected to the second connecting connector, which is used for connection to the crystal resonator. This invention solves the problem that existing testing methods can only test chips of fixed frequencies and one model. It has the advantages of non-destructive testing, good product compatibility, wide application range, high testing accuracy, and high testing efficiency.

Description

Technical Field

[0001] This invention relates to the field of component testing technology, and more specifically, to a performance evaluation testing device and method for quartz crystal oscillator chips. Background Technology

[0002] A quartz crystal oscillator is a quartz crystal device that uses a quartz crystal resonator in conjunction with a crystal oscillator chip to output a waveform at a fixed frequency. The oscillator chip is a key component of the quartz crystal oscillator. Due to the excellent characteristics of quartz crystal components, such as small size, light weight, high reliability, and excellent frequency stability, they are widely used in communications, medical, aerospace, weaponry, and other industries. As a crucial component of the quartz crystal oscillator, the function of the oscillator chip determines the specific function of the quartz crystal oscillator. Furthermore, when the oscillator chip is a key component, its own performance parameters have a decisive influence on the output waveform parameters of the crystal oscillator. Therefore, it is essential to independently and pre-test and evaluate the performance parameters of the quartz crystal oscillator chip.

[0003] Existing performance evaluation and testing methods for quartz crystal oscillator chips typically involve packaging a fixed-frequency crystal resonator and oscillator chip using SMD surface mount technology before evaluation and testing. This method has a long production cycle and can only test combinations of fixed frequencies and one type of chip, thus affecting the subsequent delivery, use, and installation cycle of the crystal oscillator. Summary of the Invention

[0004] The main objective of this invention is to provide a performance evaluation testing device and method for quartz crystal oscillator chips, thereby solving the problem that existing quartz crystal oscillator testing methods can only test fixed frequencies and one type of chip.

[0005] To achieve the above objectives, the present invention provides a performance evaluation and testing apparatus for quartz crystal oscillator chips, comprising a testing device, a crystal resonator, and a testing socket.

[0006] The test socket is provided with a first connector, a second connector, and multiple test contacts. The multiple test contacts are used to make contact with multiple pins of the chip under test one by one. A portion of the multiple test contacts is electrically connected to the first connector, which is used to be electrically connected to the test equipment. Another portion of the multiple test contacts is connected to the second connector, which is used to be connected to the crystal resonator.

[0007] Furthermore, the plurality of test contacts include a first test contact, a second test contact, a third test contact, a fourth test contact, a fifth test contact, and a sixth test contact;

[0008] The first connector includes a first pin, a second pin, a third pin, and a fourth pin;

[0009] The second connector includes a first connector portion and a second connector portion;

[0010] Wherein, the first test contact is electrically connected to the first pin, the second test contact is electrically connected to the second pin, the fifth test contact is electrically connected to the third pin, and the sixth test contact is electrically connected to the fourth pin;

[0011] The third test contact is electrically connected to the first connector, and the fourth test contact is electrically connected to the second connector.

[0012] Furthermore, both the first connector and the second connector are pin sleeves.

[0013] Furthermore, the test socket includes a first surface and a second surface disposed opposite to each other, the plurality of test contacts and the second connecting connector are all disposed on the first surface, and the first connecting connector is disposed on the second surface.

[0014] Furthermore, the first surface includes a first side and a second side opposite to each other, the first test contact, the third test contact and the fifth test contact are sequentially spaced apart on the first side, and the second test contact, the fourth test contact and the sixth test contact are sequentially spaced apart on the second side.

[0015] Furthermore, the second connecting connector is located at the end of the test socket and is spaced apart from the plurality of test contacts.

[0016] Furthermore, the test stand is a long strip-shaped test stand.

[0017] Furthermore, the test contact is a cannula-type contact.

[0018] On the other hand, the present invention also provides a performance evaluation test method for quartz crystal oscillator chips, the method being performed using the aforementioned test apparatus, the method comprising:

[0019] Select the chip under test and a crystal resonator in a suitable frequency range;

[0020] Install the chip under test onto the test socket; connect the first connector to the test equipment, and connect the second connector to the crystal resonator;

[0021] The test equipment and the crystal resonator are used to perform performance evaluation tests on the chip under test at a fixed frequency and waveform.

[0022] By applying the technical solution of this invention and using its testing device, users only need to select the chip under test (DUT) and a crystal resonator of a suitable frequency range, and then mount them on a test socket. This allows for independent and precise evaluation testing of quartz crystal oscillator chips. The entire process eliminates the need to fix the DUT and crystal resonator to the test socket; users can replace the DUT and crystal resonator according to actual testing needs. This solves the problem that existing testing methods can only test chips of fixed frequencies and one type. It features non-destructive testing, good product compatibility, wide application range, high testing accuracy, and high testing efficiency. It enables non-destructive pre-screening of the electrical performance indicators and reliability of quartz crystal oscillator chips before use and assembly, reducing the production cost of supporting products and improving their qualification rate. Attached Figure Description

[0023] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0024] Figure 1 This is a front view of the test stand in the performance evaluation and testing device for quartz crystal oscillator chips disclosed in an embodiment of the present invention;

[0025] Figure 2 This is a top view of the test stand in the performance evaluation test device for quartz crystal oscillator chips disclosed in an embodiment of the present invention.

[0026] Figure 3 This is a side view of the crystal resonator disclosed in an embodiment of the present invention;

[0027] Figure 4 This is a front view of the chip under test in this invention;

[0028] Figure 5 This is a bottom view of the test chip in this invention;

[0029] Figure 6 This is a flowchart of a performance evaluation and testing method for quartz crystal oscillator chips disclosed in an embodiment of the present invention.

[0030] The above figures include the following reference numerals:

[0031] 10. Crystal resonator; 11. Pin; 20. Test socket; 21. Test contact; 211. First test contact; 212. Second test contact; 213. Third test contact; 214. Fourth test contact; 215. Fifth test contact; 216. Sixth test contact; 22. First connector; 221. First pin; 222. Second pin; 223. Third pin; 224. Fourth pin; 23. Second connector; 231. First connector portion; 232. Second connector portion; 201. First surface; 202. Second surface; 2021. First side; 2022. Second side; 30. Chip under test; 31. Pin connector. Detailed Implementation

[0032] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0033] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0034] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0035] Example 1

[0036] See Figures 1 to 5 As shown in the figure, according to an embodiment of the present invention, a performance evaluation test device for a quartz crystal oscillator chip is provided, hereinafter referred to as the test device, which includes a test device (not shown in the figure), a crystal resonator 10 and a test socket 20.

[0037] The testing equipment is used to test the electrical performance of a quartz crystal oscillator. The test socket 20 is provided with multiple test contacts 21, a first connector 22, and a second connector 23. The multiple test contacts 21 are used to make one-to-one contact with multiple pin connectors 31 of the chip under test 30. A portion of the multiple test contacts 21 are used to electrically connect to the first connector 22, which is used to electrically connect to the testing equipment. Another portion of the multiple test contacts 21 are used to connect to the second connector 23, which is used to connect to the crystal resonator 10.

[0038] In a specific embodiment of the present invention, the plurality of test contacts 21 include a first test contact 211, a second test contact 212, a third test contact 213, a fourth test contact 214, a fifth test contact 215, and a sixth test contact 216; and the first connector 22 includes a first pin 221, a second pin 222, a third pin 223, and a fourth pin 224; the second connector 23 includes a first connector portion 231 and a second connector portion 232; in actual connection, the first test contact 211 is electrically connected to the first pin 221, the second test contact 212 is electrically connected to the second pin 222, the fifth test contact 215 is electrically connected to the third pin 223, the sixth test contact 216 is electrically connected to the fourth pin 224; the third test contact 213 is electrically connected to the first connector portion 231, and the fourth test contact 214 is electrically connected to the second connector portion 232.

[0039] Correspondingly, the chip under test 30 is provided with six pin connectors 31. The six pin connectors 31 are installed on the test socket 20 in a one-to-one correspondence with the first test contact 211, the second test contact 212, the third test contact 213, the fourth test contact 214, the fifth test contact 215 and the sixth test contact 216. The operation is simple and does not easily cause damage to the chip under test 30. It is convenient to achieve non-destructive pre-screening of the electrical performance indicators and reliability of the chip before use and assembly.

[0040] Optionally, the test contact 21 in this embodiment is a plug-in contact, that is, the first test contact 211, the second test contact 212, the third test contact 213, the fourth test contact 214, the fifth test contact 215 and the sixth test contact 216 are all plug-in contacts, which are convenient to plug into and connect with the pin connector 31 of the chip under test 30. The structure is simple and easy to operate.

[0041] Furthermore, in order to install and position the aforementioned test contacts 21, first connector 22, and second connector 23, in this embodiment, the test base 20 is configured as an elongated test base. The test base 20 includes a first surface 201 and a second surface 202 disposed opposite to each other. The aforementioned multiple test contacts 21 and second connectors 23 are all disposed on the first surface 201, and the first connector 22 is disposed on the second surface 202. This configuration allows for a more dispersed layout of the test base 20, facilitating electrical connections to the chip under test 30, the crystal resonator 10, and the testing equipment. Of course, in other embodiments of the present invention, the aforementioned test contacts 21, first connector 22, and second connector 23 may also be disposed on the same surface of the test base 20. Any other modifications within the scope of the present invention are within the protection scope of the present invention.

[0042] Furthermore, the second connector 23 is located at the end of the test socket 20 and is spaced apart from the test contact 21. That is to say, there is a certain distance between the second connector 23 and the test contact 21. This arrangement can prevent interference between the chip under test 30 and the second connector 23.

[0043] Optionally, in this embodiment, both the first connector 231 and the second connector 232 are pin sleeves, which facilitate plug-in connection with the crystal resonator 10 and make the operation simple and quick.

[0044] Furthermore, in this embodiment, the first surface 201 includes a first side 2021 and a second side 2022 opposite to each other. The first test contact 211, the third test contact 213 and the fifth test contact 215 are sequentially spaced on the first side 2021, and the second test contact 212, the fourth test contact 214 and the sixth test contact 216 are sequentially spaced on the second side 2022. The structure is simple and facilitates contact and encapsulation fixation with the pin connector 31 of the chip under test 30.

[0045] When using the testing device in this embodiment to perform performance evaluation testing on a quartz crystal oscillator chip, firstly, a sample of the chip under test 30 and a crystal resonator 10 of a suitable frequency range are selected. At this time, multiple pin connectors 31 of the chip under test 30 are in contact with multiple test contacts 21 on the test socket 20 in a one-to-one correspondence. Then, the first connection connector 22 on the test socket 20 is connected to the testing equipment, and the crystal resonator 10 is connected to the second connection connector 23 on the test socket 20. Finally, the testing equipment and the crystal resonator 10 are used to generate a fixed frequency and waveform, thereby enabling the evaluation and testing of the electrical performance indicators and reliability of the chip under test 30.

[0046] In other words, by using the testing device of the present invention, only the chip under test 30 and the crystal resonator 10 of a suitable frequency range need to be selected, and the chip under test 30 and the crystal resonator 10 are installed on the test socket 20. Independent and accurate evaluation tests of quartz crystal oscillator chips can be performed. The entire process does not require the chip under test 30 and the crystal resonator 10 to be fixedly packaged on the test socket 20. Users can replace the chip under test 30 and the crystal resonator 10 according to actual testing needs. This can solve the problem that existing testing methods can only test chips of fixed frequencies and one type. It has the characteristics and advantages of non-destructive testing, good product compatibility, wide application range, high testing accuracy and testing efficiency. It can also realize non-destructive pre-screening of electrical performance indicators and reliability of quartz crystal oscillator chips before use and assembly, reduce the production cost of supporting products and improve the qualification rate of supporting products.

[0047] Example 2

[0048] See Figure 6 As shown in the embodiments of the present invention, a performance evaluation test method for quartz crystal oscillator chips is provided. The method is performed using the test device in Embodiment 1. Specifically, the method includes four steps.

[0049] Step S1: Select the chip under test 30 and the crystal resonator 10 in a suitable frequency range. In this step, the chip under test 30 and the crystal resonator 10 can be screened using a screening instrument, and then the corresponding chip under test 30 and crystal resonator 10 can be transferred to the testing device for use according to the actual testing requirements.

[0050] Step S2: Install the chip under test 30 onto the test socket 20. In practice, the chip under test 30 can be clamped by a clamping device and installed onto the test socket 20. During installation, each pin connector 31 of the chip under test 30 is inserted into contact with each test contact 21 on the test socket 20 in a one-to-one correspondence. The operation is simple and does not easily cause damage to the chip under test 30.

[0051] Step S3: Connect the first connector 22 on the test socket 20 to the test equipment, and connect the crystal resonator 10 to the second connector 23. Specifically, use assembly equipment such as a robotic arm to connect the first connector 22 on the test socket 20 to the test equipment, that is, to electrically connect the first pin 221, the second pin 222, the third pin 223, and the fourth pin 224 to the test equipment, and connect the pins 11 of the crystal resonator 10 to the second connector 23, that is, to insert the two pins 11 on the crystal resonator 10 into the first connector 231 and the second connector 232.

[0052] Step S4: Use the test equipment in conjunction with the crystal resonator 10 to perform performance evaluation tests on the chip under test 30. That is, use the test equipment in conjunction with the crystal resonator 10 to generate a fixed frequency and waveform, thereby enabling the testing and evaluation of the electrical performance indicators and reliability of the chip under test 30.

[0053] The testing method of this invention allows for independent and precise evaluation testing of quartz crystal oscillator chips. The entire process eliminates the need to fix the chip under test (DUT) and crystal resonator to the test socket. Users can replace the DUT and crystal resonator according to actual testing needs. This solves the problem of existing testing methods only being able to test fixed frequencies and one type of chip. Furthermore, it enables separate evaluation and testing of the electrical performance and reliability of quartz crystal oscillator chips. It features non-destructive testing, good product compatibility, wide application range, high testing accuracy, and high testing efficiency. It allows for non-destructive pre-screening of the electrical performance and reliability of quartz crystal oscillator chips before use and assembly, reducing the production cost of supporting products and improving the qualification rate of supporting products.

[0054] As can be seen from the above description, the embodiments of the present invention achieve the following technical effects: Using the testing device of the present invention, only the chip under test and a crystal resonator of a suitable frequency range need to be selected, and the chip under test and the crystal resonator are installed on the test socket. Independent and accurate evaluation testing of the quartz crystal oscillator chip can then be performed. The entire process does not require the chip under test and the crystal resonator to be fixedly packaged on the test socket. Users can replace the chip under test and the crystal resonator according to actual testing needs. This solves the problem that existing testing methods can only test chips of fixed frequencies and one type. It has the characteristics and advantages of non-destructive testing, good product compatibility, wide application range, high testing accuracy, and high testing efficiency. It can achieve non-destructive pre-screening of the electrical performance indicators and reliability of quartz crystal oscillator chips before use and assembly, reducing the production cost of supporting products and improving the qualification rate of supporting products.

[0055] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components in this application is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0056] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A performance evaluation and testing device for quartz crystal oscillator chips, characterized in that, It includes testing equipment, a crystal resonator (10), and a test stand (20). The test socket (20) is provided with a first connector (22), a second connector (23) and a plurality of test contacts (21). The plurality of test contacts (21) are used to make contact with a plurality of pin connectors (31) of the chip under test (30) in a one-to-one correspondence. A portion of the plurality of test contacts (21) is electrically connected to the first connector (22), which is used to be electrically connected to the test equipment. Another portion of the plurality of test contacts (21) is connected to the second connector (23), which is used to be connected to the crystal resonator (10). The plurality of test contacts (21) include a first test contact (211), a second test contact (212), a third test contact (213), a fourth test contact (214), a fifth test contact (215), and a sixth test contact (216). The first connector (22) includes a first pin (221), a second pin (222), a third pin (223), and a fourth pin (224); The second connector (23) includes a first connector portion (231) and a second connector portion (232); Wherein, the first test contact (211) is electrically connected to the first pin (221), the second test contact (212) is electrically connected to the second pin (222), the fifth test contact (215) is electrically connected to the third pin (223), and the sixth test contact (216) is electrically connected to the fourth pin (224); The third test contact (213) is electrically connected to the first connector (231), and the fourth test contact (214) is electrically connected to the second connector (232); The test socket (20) includes a first surface (201) and a second surface (202) disposed opposite to each other. The plurality of test contacts (21) and the second connecting connector (23) are all disposed on the first surface (201), and the first connecting connector (22) is disposed on the second surface (202). The first surface (201) includes a first side (2021) and a second side (2022) opposite to each other. The first test contact (211), the third test contact (213) and the fifth test contact (215) are sequentially spaced on the first side (2021), and the second test contact (212), the fourth test contact (214) and the sixth test contact (216) are sequentially spaced on the second side (2022). Both the first connector (231) and the second connector (232) are pin sleeves; The second connector (23) is located at the end of the test socket (20) and is spaced apart from the test contact (21); The test contact (21) is a tube-type contact; The performance of the chip under test (30) was evaluated using the aforementioned testing apparatus and the following method: Select the chip to be tested (30) and a crystal resonator (10) with a suitable frequency range; The chip under test (30) is installed on the test socket (20), the first connector (22) is connected to the test equipment, and the second connector (23) is connected to the crystal resonator (10). It is not necessary to fix the chip under test (30) and the crystal resonator (10) on the test socket (20), and the chip under test (30) and the crystal resonator (10) can be replaced. The test equipment is used in conjunction with the crystal resonator (10) at a fixed frequency and waveform to perform performance evaluation tests on the chip under test (30).

2. The performance evaluation and testing device for quartz crystal oscillator chips according to claim 1, characterized in that, The test stand (20) is a long strip test stand.

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