Wafer transfer and processing system and method with real-time particulate monitoring

Abstract

The application discloses a wafer conveying and processing system and method with real-time particle monitoring function. The system comprises: a process chamber for processing wafers; a front end module adjacent to the process chamber for conveying wafers into the process chamber; a plurality of sensors arranged in the front end module and the process chamber for detecting particle concentration; and a host computer for receiving and analyzing particle concentration detection data sent by the sensors. The wafer conveying and processing system with real-time particle monitoring function provided by the embodiment of the application can realize real-time monitoring of particle concentration in each area of the wafer conveying and processing environment, does not need to consume wafers, can quickly determine the position of particle generation, helps to control the particle concentration in the wafer conveying and processing environment, and improves work efficiency.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor manufacturing technology, and specifically to a wafer transport and processing system and method with real-time particulate matter monitoring function. Background Technology

[0002] In the semiconductor component manufacturing process, wafer processing is carried out in cleanrooms to improve yield and quality. However, with the continuous advancement of component integration, circuit miniaturization, and wafer enlargement, it is difficult to completely control small particles entirely within a cleanroom, both in terms of cost and technology. Effective management of the particle monitoring process in semiconductor manufacturing equipment (MI) is crucial. When particle levels exceed limits during particle monitoring, the equipment stops operating for root cause analysis, which can be time-consuming from initial analysis to final resolution.

[0003] In semiconductor foundries (FABs), the average weekly rate of particulate matter exceeding limits is approximately 9% for inspection equipment, 8% for film thickness analysis, and 15% for die thickness (CD). The average time from root cause analysis to resolution is about 8 hours. The process for handling particulate matter exceeding limits is divided into 5 stages: stage 1 is overall wafer transfer testing; stage 2 is zone-specific testing; stage 3 is location inspection and cleaning; stage 4 is particulate matter inspection and treatment; and stage 5 is equipment testing, rework, and inspection. Because the process from root cause analysis to resolution of particulate matter exceeding limits is time-consuming, it is crucial to monitor proactively, identify the cause, and address it quickly. This avoids delays in equipment efficiency management and subsequent process monitoring, and also prevents yield-influencing factors caused by measurement equipment. These issues highlight two main problems in equipment management: firstly, difficulty in pinpointing the location of particulate matter exceeding limits; and secondly, the excessive time required to find the root cause. In existing technologies, particle measurement equipment is used to test the particle count of wafers before and after they enter and exit the equipment. The increase in particle count is used as a benchmark to determine whether the levels exceed the limits, and to decide whether to continue operating the equipment or stop it. The drawbacks of existing technologies are that periodic monitoring requires the consumption of a certain number of wafers, and testing with particle measurement equipment may take a considerable amount of time. Furthermore, because it is not performed in real time, it is impossible to know when a particle count exceeding the limit will occur. Summary of the Invention

[0004] The purpose of this disclosure is to provide a wafer transport and processing system and method with real-time particulate matter monitoring. To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general description, nor is it intended to identify key / important components or describe the scope of protection of these embodiments. Its sole purpose is to present some concepts in a simple form as a prelude to the detailed description that follows.

[0005] According to one aspect of the present disclosure, a wafer transport and processing system with real-time particulate matter monitoring function is provided, comprising:

[0006] Process chambers are used to process wafers;

[0007] The equipment front-end module is disposed adjacent to the process chamber and is used to transfer the wafer into the process chamber.

[0008] Several sensors are installed in the front-end module of the device and in the process chamber for detecting particulate matter concentration;

[0009] The host is used to receive and analyze the particulate matter concentration detection data sent by the sensor.

[0010] According to one aspect of the present disclosure, a wafer transport and processing method with real-time particulate matter monitoring function is provided, the method comprising:

[0011] The front-end module of the equipment transfers the wafer into the process chamber;

[0012] The process chamber processes wafers;

[0013] The sensors detect the particulate matter concentration in the front-end module of the equipment and the process chamber;

[0014] The host computer receives and analyzes the particulate matter concentration detection data sent by the sensor.

[0015] One aspect of the technical solution provided by the embodiments of this disclosure may include the following beneficial effects:

[0016] The wafer transport and processing system with real-time particulate matter monitoring function provided in this embodiment can realize real-time monitoring of particulate matter concentration in various areas of the wafer transport and processing environment. It does not require the consumption of wafers, can quickly determine the location of particulate matter generation, helps to control the particulate matter concentration in the wafer transport and processing environment, and improves work efficiency.

[0017] Other features and advantages of this disclosure will be set forth in the following description and will be apparent in part from the description, or some features and advantages may be inferred from the description or determined without question, or may be learned by practicing embodiments of this disclosure. The objects and other advantages of this disclosure may be realized and obtained by means of the structures particularly pointed out in the written description, claims, and drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of the structure of a wafer transport and processing system with real-time particulate matter monitoring function according to an embodiment of the present disclosure is shown;

[0020] Figure 2 A schematic diagram of the structure of a wafer transport and processing system with real-time particulate matter monitoring function according to another embodiment of the present disclosure is shown;

[0021] Figure 3 A pie chart showing the proportion of particulate matter in each region obtained by host analysis of particulate matter concentration detection data according to an embodiment of this disclosure is shown. Detailed Implementation

[0022] Embodiments of the present disclosure will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the disclosure. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0023] The accompanying drawings illustrate various structural schematics according to embodiments of the present disclosure. These drawings are not to scale, and some details have been enlarged for clarity, and some details may have been omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate from reality due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed.

[0024] In the context of this disclosure, when a layer / element is referred to as being "above" another layer / element, the layer / element may be directly above the other layer / element, or there may be an intermediate layer / element between them. Additionally, if a layer / element is "above" another layer / element in one orientation, then when the orientation is reversed, the layer / element may be "below" the other layer / element.

[0025] like Figure 1 As shown, one embodiment of this application provides a wafer transport and processing system with real-time particulate matter monitoring function, including:

[0026] Process chamber 5 is used for processing wafers;

[0027] The front-end module of the equipment is located adjacent to the process chamber 5 and is used to transfer the wafer into the process chamber 5.

[0028] Several sensors 8 are installed in the front-end module of the equipment and the process chamber 5 to detect particulate matter concentration;

[0029] The host 7 is used to receive and analyze the particulate matter concentration detection data sent by the sensor 8.

[0030] The process chamber 5 includes a chamber body and a wafer stage 6 disposed within the chamber body. The wafer stage 6 is used to process wafers.

[0031] In some embodiments, the process chamber 5 also includes a valve, and the chamber body has an air inlet, a wafer inlet / outlet and an exhaust outlet on its wall; the valve is located at the wafer inlet / outlet of the chamber body and is used to open or close the wafer inlet / outlet.

[0032] The front-end module of the equipment includes a loading port 1, a wafer transport chamber 2, and a robotic arm 3; the robotic arm 3 is disposed inside the wafer transport chamber 2; the loading port 1 is disposed on the outer wall of the wafer transport chamber 2; the robotic arm 3 is used to transfer the wafer on the loading port 1 through the wafer transport chamber 2 to the process chamber 5. In this embodiment, there may be two loading ports 1.

[0033] In some embodiments, the device front-end module further includes a positioner 4, which is disposed within the wafer transport chamber 2. The positioner 4 is disposed on one side wall within the wafer transport chamber 2.

[0034] In some embodiments, the wafer transport and processing system further includes a wafer storage container for holding the wafers, the wafer storage container being placed on the loading port 1.

[0035] In this embodiment, the wafer storage container is a FOUP. FOUP stands for Front-Opening Unified Pod, which is a wafer storage container used for holding and transporting wafers.

[0036] In some embodiments, the wafer storage container is a front-opening wafer cassette, including a front wall plate with an opening, a rear wall plate opposite to the front wall plate, side wall plates on both sides, a top plate, and a bottom plate. An inlet pipe extending from the bottom plate to the top plate is provided on the inner side of one side wall plate, while an outlet pipe extending from the bottom plate to the top plate is provided on the inner side of the other side wall plate. The inlet pipe has multiple inlets from top to bottom, and the outlet pipe has multiple outlets from top to bottom.

[0037] In some embodiments, the host 7 is used to receive and analyze particulate matter concentration detection data sent by the sensor 8, including:

[0038] The host 7 is used to: receive particulate matter concentration detection data sent by the sensor 8, process the particulate matter concentration detection data, obtain processed particulate matter concentration data, and analyze and determine the area and cause of particulate matter generation in the wafer transport and processing system based on the particulate matter concentration data.

[0039] In some embodiments, sensors 8, wirelessly connected to the host 7, are installed in the wafer transport chamber 2, FOUP, process chamber 5, as well as on the loading port 1, robotic arm 3, locator 4, and wafer stage 6. The sensors 8 are used to count airborne particles in real time and send the detected particle information to the host 7 for particle monitoring. The loading port 1 is located adjacent to the wafer transport chamber 2. The loading port 1, wafer transport chamber 2, robotic arm 3, and locator 4 constitute the EFEM (Equipment Front End Module). The robotic arm 3 of the EFEM transports wafers between the wafer storage container and the process chamber 5, transferring the wafers from the wafer storage container to the wafer stage 6 in the process chamber 5.

[0040] In some embodiments, with the door portion provided at the loading port 1 in close contact with the door provided on the front surface of the FOUP, these doors and the door are opened simultaneously, and the robotic arm 3 provided in the wafer transport chamber 2 can take the wafer out of the FOUP into the wafer transport chamber 2. The robotic arm 3 can also grab the processed wafer on the wafer stage 6, and then store the processed wafer in the FOUP on the loading port 1 via the wafer transport chamber 2.

[0041] The wafer is loaded into a front-end slotted wafer cassette, which is placed in loading port 1. The robotic arm 3 picks up the wafer from the front-end slotted wafer cassette, passes it through wafer transport chamber 2, and sends it into process chamber 5, where it is placed on wafer stage 6 for further processing.

[0042] Sensor 8 can measure the amount of particulate matter in the air by drawing in air, and measure the pollution level of each area in real time. In some embodiments, the data detected by sensor 8 in different areas is configured with SVID codes (Subsystem VendorID), and the data with configured SVID codes is uploaded to host 7 (host 7 can be an automated upper-level TC server), which enables control over the particulate matter status within the measurement system.

[0043] For example, it can distinguish between SVID 0 (Idle), 1 (Spec out), 2 (Error), etc. When the data is 1, the device stops running, thereby avoiding malfunctions caused by the device. It can also quickly grasp the air pollution level of each area through particulate matter data and carry out corresponding cleaning operations, making it convenient to control and manage the equipment.

[0044] Sensor 8 detects particulate matter in each area and transmits the detection data status code to host 7. Host 7 then analyzes the particulate matter source and takes measures such as cleaning. For example:

[0045] ->SVID Transfer Code Definition

[0046] 0:Spec in(idle)

[0047] 1:Spec out

[0048] 2: Error

[0049] 3: Other

[0050] The FOUP in this embodiment includes a front wall panel with an opening, a rear wall panel opposite to the front wall panel, side wall panels on both sides, a top panel, and a bottom panel. An air inlet pipe extending from the bottom panel to the top panel is provided on the inner side of one side wall panel, while an air outlet pipe extending from the bottom panel to the top panel is provided on the inner side of the other side wall panel. The air inlet pipe has multiple air inlets from top to bottom, and the air outlet pipe has multiple air outlets from top to bottom.

[0051] In some embodiments, the FOUP further includes an air blowing device and an air collecting device. One end of the air inlet pipe is connected to the air blowing device for blowing air into the FOUP, and the other end of the air inlet pipe is closed. One end of the air outlet pipe is connected to the air collecting device for collecting the air blown out of the FOUP, and the other end of the air outlet pipe is closed. Multiple air inlets are evenly distributed from top to bottom on the air inlet pipe for evenly blowing air into the longitudinal space inside the FOUP. Multiple air outlets are evenly distributed from top to bottom on the air outlet pipe for evenly discharging air into the longitudinal space inside the FOUP. A sealing valve is also provided at the end of the air inlet pipe connected to the air blowing device, and a sealing valve is also provided at the end of the air outlet pipe connected to the air collecting device.

[0052] The process chamber 5 in this embodiment includes a chamber body, a wafer stage 6 disposed within the chamber body, and a valve. The chamber body has an air inlet, a wafer inlet / outlet, and an exhaust outlet on its wall. The valve is disposed at the wafer inlet / outlet of the chamber body and is used to open or close the wafer inlet / outlet.

[0053] like Figure 2 The image shown is a wafer transport and processing system with real-time particulate matter monitoring function provided in another embodiment of this application. Figure 2 The diagram shows loading port 1, wafer transport chamber 2, process chamber 5, robotic arm 3, locator 4, stage 6, main unit 7, and FOUP 9, as well as 6 sensors. and

[0054] The wafer transport and processing system with real-time particulate matter monitoring function in this application embodiment can realize real-time monitoring of particulate matter concentration without consuming wafers. It helps to control particulate matter in the wafer transport and processing environment, can quickly determine the location of particulate matter generation, and can monitor particulate matter in various areas of the wafer transport and processing environment in real time.

[0055] Another embodiment of this application provides a wafer transport and processing method with real-time particulate matter monitoring function, implemented through the system of the above embodiment; the method includes:

[0056] The front-end module of the equipment transfers the wafer into the process chamber 5;

[0057] Process chamber 5 processes wafers;

[0058] Several sensors 8 detect the particulate matter concentration in the front-end module of the equipment and the process chamber 5;

[0059] The host 7 receives and analyzes the particulate matter concentration detection data sent by the sensor 8.

[0060] The particulate matter concentration detection data sent by sensor 8 is analyzed, including:

[0061] Process particulate matter concentration detection data to obtain processed particulate matter concentration data;

[0062] Based on the analysis of particulate matter concentration data, the regions and causes of particulate matter generation within the wafer transport and processing system were determined. Staff then took timely and appropriate measures based on the particulate matter information obtained from the main unit 7.

[0063] like Figure 3 The figure shows a pie chart of the proportion of particulate matter in each region obtained by the host 7 analyzing the particulate matter concentration detection data in one embodiment. As can be seen from the figure, the particulate matter on the slide stage accounts for 60% of the total particulate matter, which is the region with the largest proportion.

[0064] The above description does not provide detailed explanations of the technical aspects of each layer's patterning, etching, etc. However, those skilled in the art should understand that various technical means can be used to form layers and regions of the desired shape. Furthermore, to form the same structure, those skilled in the art can also design methods that are not entirely identical to those described above. Additionally, although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination.

[0065] The embodiments of this disclosure have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of this disclosure. The scope of this disclosure is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this disclosure, and all such substitutions and modifications should fall within the scope of this disclosure.

Claims

1. A wafer transport and processing system with real-time particulate matter monitoring function, characterized in that, include: Process chambers, used to process wafers; The equipment front-end module is disposed adjacent to the process chamber and is used to transfer the wafer into the process chamber. Several sensors are installed in the front-end module of the device and in the process chamber for detecting particulate matter concentration; The host is used to receive and analyze the particulate matter concentration detection data sent by the sensor; The front-end module of the equipment includes a loading port, a wafer transport chamber, and a robotic arm; the robotic arm is disposed inside the wafer transport chamber; the loading port is disposed on the outer side wall of the wafer transport chamber; the robotic arm is used to transfer the wafer on the loading port to the process chamber via the wafer transport chamber; The wafer transfer and processing system also includes a wafer storage container for holding wafers, the wafer storage container being placed on the loading port; The wafer storage container is a front-opening wafer box, including a front wall plate with an opening, a rear wall plate opposite to the front wall plate, side wall plates on both sides, a top plate, and a bottom plate. An air inlet pipe extending from the bottom plate to the top plate is provided on the inner side of one side wall plate, and an air outlet pipe extending from the bottom plate to the top plate is provided on the inner side of the other side wall plate. The air inlet pipe has multiple air inlets from top to bottom, and the air outlet pipe has multiple air outlets from top to bottom.

2. The system according to claim 1, characterized in that, The process chamber includes a chamber body and a wafer stage disposed within the chamber body, the wafer stage being used to process wafers.

3. The system according to claim 2, characterized in that, The process chamber also includes a valve, and the chamber body has an air inlet, a wafer inlet / outlet and an exhaust outlet on its wall; the valve is located at the wafer inlet / outlet of the chamber body and is used to open or close the wafer inlet / outlet.

4. The system according to claim 1, characterized in that, The front-end module of the equipment also includes a locator, which is located in the wafer handling chamber.

5. The system according to claim 1, characterized in that, The host is used to: receive particulate matter concentration detection data sent by the sensor, process the particulate matter concentration detection data, obtain processed particulate matter concentration data, and analyze and determine the area where particulate matter is generated and the cause of particulate matter generation in the wafer transport and processing system based on the particulate matter concentration data.

6. A wafer transport and processing method with real-time particulate matter monitoring function, characterized in that, The system is implemented by any one of claims 1-5; the method includes: The front-end module of the equipment transfers the wafer into the process chamber; The process chamber processes wafers; The sensors detect the particulate matter concentration in the front-end module of the equipment and the process chamber; The host computer receives and analyzes the particulate matter concentration detection data sent by the sensor.

7. The method according to claim 6, characterized in that, The analysis of the particulate matter concentration detection data sent by the sensor includes: The particulate matter concentration detection data is processed to obtain processed particulate matter concentration data. Based on the particulate matter concentration data, the regions in the wafer transport and processing system that generate particulate matter and the causes of particulate matter generation are analyzed and determined.

Images