Resin laminate and mounting structure

Abstract

The present application provides a resin laminate and a mounting structure, which can move a component to a desired mounting position with high positional accuracy and efficiently arrange the component, and can rotate the component toward a desired orientation with good orientation accuracy and efficiently arrange the component. The resin laminate includes a support and a resin layer laminated on the support, the resin layer having an unhardened region containing a resin composition that is hardened by heat or light and a hardened region containing a hardened product of the resin composition, the periphery of the unhardened region being surrounded by the hardened product of the resin composition in the resin layer so that the unhardened resin composition does not move in a planar direction from the unhardened region, the planar shape of the unhardened region being a geometric shape, and the viscosity of the resin composition in the unhardened region at any temperature in a temperature range of 60°C to 150°C being 100 Pa·s or less.

Description

Technical Field

[0001] The present invention relates to a resin laminate and a mounting structure, and more specifically, to a resin laminate suitable for mounting components (e.g., semiconductor components) and a mounting structure obtained using said resin laminate. Background Technology

[0002] One of the major trends in integrated circuit technology development in recent years has been the reduction of component size. The miniaturization of semiconductor packaging is a crucial factor that not only directly impacts the high performance of integrated circuits but also significantly affects the overall miniaturization, cost reduction, and reliability of electronic systems. Furthermore, as the size of semiconductor components gradually shrinks and integration density increases, higher demands are placed on semiconductor packaging. Against this backdrop, various methods for manufacturing semiconductor packages have been proposed in recent years. For example, Japanese Patent Application Publication No. 2008-021769 (Patent Document 1) discloses a method that mounts semiconductor components with μm-level positioning accuracy by controlling the viscosity of the resin laminated on a substrate.

[0003] [Existing Technical Documents]

[0004] [Patent Literature]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2008-021769 Summary of the Invention

[0006] [The problem the invention aims to solve]

[0007] The object of the present invention is to provide a resin laminate and a mounting structure obtained using the resin laminate, wherein when the resin laminate is used as a substrate for mounting components, the components can be moved to the desired mounting position with high positional accuracy and configured efficiently, and the components can be rotated toward the desired orientation with good accuracy and configured efficiently.

[0008] [Technical means to solve the problem]

[0009] The inventors have made repeated efforts to achieve the aforementioned objective, and have discovered that in a resin laminate comprising a support and a resin layer laminated on the support, the resin layer is configured as follows: a resin layer having an uncured region and a cured region, wherein the uncured region contains a resin composition cured by heat or light, and the cured region contains a cured product of the resin composition; in the resin layer, the uncured region is surrounded by the cured product of the resin composition to prevent the uncured resin composition from moving along the planar direction from the uncured region; the planar shape of the uncured region is configured as a geometric shape; and the viscosity of the resin composition within the uncured region is below 100 Pa·s at any temperature within the temperature range of 60°C to 150°C, thereby allowing for installation at temperatures (60°C to 150°C). At any temperature within the range of 50°C, the viscosity of the resin composition in the uncured area used as the mounting area can be made to be within the specified range. The shape of the uncured area is a geometric shape (geometric pattern). Therefore, in the uncured area, the direction of the surface tension of the uncured resin composition and the magnitude of its force can be adjusted due to its shape. Thus, when used as a substrate for mounting elements, the surface tension of the uncured resin composition can be used to move the configured element to the desired mounting position (the mounting position corresponding to the shape of the mounting area: the design target mounting position) and configure it efficiently with high positional accuracy. Furthermore, the element can be rotated accurately and efficiently toward the desired orientation (the orientation corresponding to the shape of the mounting area: the design target orientation), thereby completing the present invention.

[0010] That is, the resin laminate of the present invention is a resin laminate comprising a support and resin layers laminated on the support, wherein,

[0011] The resin layer has: an uncured region comprising a resin composition cured by heat or light; and a cured region comprising a cured portion of the resin composition.

[0012] In the resin layer, the uncured areas are surrounded by a cured portion of the resin composition to prevent the uncured resin composition from migrating along the planar direction from the uncured areas.

[0013] The unhardened area has a geometric shape in planar shape, and

[0014] The viscosity of the resin composition in the uncured region is less than 100 Pa·s at any temperature within the temperature range of 60°C to 150°C.

[0015] Furthermore, the “planar shape of the uncured region” mentioned here refers to the shape of the uncured region (the shape of the boundary portion between the cured region and the uncured region) when viewed from the normal direction of the surface of the resin layer, and the “planar direction” refers to the direction parallel to the surface of the resin layer (horizontal direction).

[0016] Furthermore, in the resin laminate of the present invention, it is preferable that the resin composition contains a compound having a polymerizable unsaturated group. Additionally, in the resin laminate of the present invention, it is preferable that the resin composition contains a compound having a fluorene backbone. Moreover, in the resin laminate of the present invention, it is preferable that the planar shape of the uncured region is at least one shape selected from the group consisting of circles, ellipses, and polygons (furthermore, the term "polygon" here includes not only ordinary polygons but also shapes with rounded corners (so-called rounded corner shapes)).

[0017] Furthermore, in the resin laminate of the present invention, the uncured region is preferably the region for mounting elements.

[0018] Furthermore, the mounting structure of the present invention includes: a hardened resin laminate, which is formed by hardening the resin layer of the resin laminate of the present invention; and

[0019] The component is configured with the uncured area of ​​the cured resin layer in the cured resin laminate as the mounting area.

[0020] [The effects of the invention]

[0021] According to the present invention, a resin laminate and a mounting structure obtained using the resin laminate are provided. When the resin laminate is used as a substrate for mounting elements, the elements can be moved to the desired mounting position with high positional accuracy and configured efficiently, and the elements can be rotated toward the desired orientation with good accuracy and configured efficiently. Attached Figure Description

[0022] Figure 1 This is a plan view schematically showing the surface of the resin layer in one embodiment of the resin laminate of the present invention from top view.

[0023] Figure 2 This is a cross-sectional view schematically showing one embodiment of the resin laminate of the present invention.

[0024] Explanation of symbols

[0025] 1: Resin layer

[0026] 1A: Hardened area in the resin layer

[0027] 1B: Uncured area in the resin layer

[0028] 2: Support body

[0029] B: Boundary of the unhardened area

[0030] W: Wall surface of the hardened area

[0031] S: Surface of the support

[0032] D1: Arrow Detailed Implementation

[0033] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, as appropriate. Furthermore, in the following description and drawings, the same or equivalent elements will be labeled with the same symbols, and repeated descriptions will be omitted.

[0034] [Resin laminate]

[0035] The resin laminate of the present invention is a resin laminate comprising a support and resin layers laminated on the support, wherein,

[0036] The resin layer has: an uncured region comprising a resin composition cured by heat or light; and a cured region comprising a cured portion of the resin composition.

[0037] In the resin layer, the uncured areas are surrounded by a cured portion of the resin composition to prevent the uncured resin composition from migrating along the planar direction from the uncured areas.

[0038] The unhardened area has a geometric shape in planar shape, and

[0039] The viscosity of the resin composition in the uncured region is less than 100 Pa·s at any temperature within the temperature range of 60°C to 150°C.

[0040] The support included in the resin laminate of the present invention is not particularly limited, and known substrates may be used appropriately depending on the purpose. Transparent substrates or substrates other than transparent substrates may be used. Such transparent substrates may include, for example, glass substrates, transparent films (e.g., polycarbonate, polyethylene terephthalate, polyethersulfone, etc.), and substrates formed by depositing or patterning transparent electrodes such as indium tin oxide (ITO) or gold on their surfaces.

[0041] Furthermore, the resin layer laminated on this support has: an uncured region containing a resin composition that is cured by heat or light (uncured resin composition); and a cured region containing a cured form of the resin composition. The resin composition (uncured resin composition) forming the uncured region of this resin layer is cured by heat or light. Therefore, the resin composition (uncured) preferably contains a compound that is cured by heat or light (hereinafter, as appropriate, referred to as "component (A)").

[0042] There are no particular limitations on the type of compound (component (A)) that is polymerized by heat or light, and it can be any of a monomer, oligomer, or resin. As such an oligomer or resin, any oligomer or resin that is further polymerized by heat or light may be used, and known oligomers or resins may be appropriately utilized. Examples of such compounds that are polymerized by heat or light include epoxy compounds, silicone compounds, styrene compounds, polyimide compounds, polyamides, unsaturated polyester compounds, vinyl ester compounds, epoxy-modified (meth)acrylic compounds, and urethane-modified (meth)acrylic compounds.

[0043] Furthermore, from the viewpoint that it is easier to control the shape of the hardened region (hereinafter referred to as "hardened portion") and the unhardened region (hereinafter referred to as "unhardened portion") when forming the hardened region (hereinafter referred to as "unhardened portion") of the resin layer, it is more preferable to be a compound having a polymerizable unsaturated group in its molecule (hereinafter referred to as "compound containing a polymerizable unsaturated group"). Here, as representative examples of polymerizable unsaturated groups, there are acrylic groups or methacrylic groups (hereinafter referred to together as "(meth)acrylic groups").

[0044] As suitable compounds for use as such polymerizable unsaturated groups, examples include epoxy (meth)acrylate acid adducts, which are obtained by reacting a dicarboxylic acid or tricarboxylic acid or their monoanhydride or tetracarboxylic acid or their dianhydride with a hydroxyl-containing epoxy (meth)acrylate compound obtained by reacting a compound having two or more epoxy groups with (meth)acrylic acid. Furthermore, as compounds having two or more epoxy groups from which epoxy (meth)acrylate acid adducts are derived, bisphenol-type epoxy compounds or phenolic varnish-type epoxy compounds are preferred compounds, and substances containing bisphenol-type epoxy compounds or phenolic varnish-type epoxy compounds are more preferred.

[0045] Examples of such bisphenol-type epoxy compounds include epoxy compounds with two glycidyl ether groups obtained by reacting bisphenols with epichlorohydrin. In the reaction used to obtain such epoxy compounds with two glycidyl ether groups, oligomerization of diglycidyl ether compounds is generally involved; therefore, the bisphenol-type epoxy compounds obtained by this reaction generally contain epoxy compounds with two or more bisphenol skeletons. Furthermore, examples of bisphenols used in this reaction include: bis(4-hydroxyphenyl)one, bis(4-hydroxy-3,5-dimethylphenyl)one, bis(4-hydroxy-3,5-dichlorophenyl)one, bis(4-hydroxyphenyl)sulfone, bis(4-hydroxy-3,5-dimethylphenyl)sulfone, bis(4-hydroxy-3,5-dichlorophenyl)sulfone, bis(4-hydroxyphenyl)hexafluoropropane, bis(4-hydroxy-3,5-dimethylphenyl)hexafluoropropane, bis(4-hydroxy ... Bis(4-hydroxyphenyl)dimethylsilane, bis(4-hydroxy-3,5-dimethylphenyl)dimethylsilane, bis(4-hydroxy-3,5-dichlorophenyl)dimethylsilane, bis(4-hydroxy-3,5-dichlorophenyl)dimethylsilane, bis(4-hydroxyphenyl)methane, bis(4-hydroxy-3,5-dichlorophenyl)methane, bis(4-hydroxy-3,5-dibromophenyl)methane, 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(4-hydroxy-3,5-dibromophenyl)methane 2,2-bis(4-hydroxy-3,5-dichlorophenyl)propane, 2,2-bis(4-hydroxy-3-methylphenyl)propane, 2,2-bis(4-hydroxy-3-chlorophenyl)propane, bis(4-hydroxyphenyl) ether, bis(4-hydroxy-3,5-dimethylphenyl) ether, bis(4-hydroxy-3,5-dichlorophenyl) ether, 9,9-bis(4-hydroxyphenyl)fluorene, 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, Fluorene, 9,9-bis(4-hydroxy-3-chlorophenyl)fluorene, 9,9-bis(4-hydroxy-3-bromophenyl)fluorene, 9,9-bis(4-hydroxy-3-fluorophenyl)fluorene, 9,9-bis(4-hydroxy-3-methoxyphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dimethylphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dichlorophenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dibromophenyl)fluorene, 4,4'-biphenol, 3,3'-biphenol, etc. Among these, bisphenols containing fluorene-9,9-diyl groups are particularly preferred.

[0046] Furthermore, from the viewpoint of controlling viscoelasticity in the uncured state and suppressing the sinking of components due to surface tension when components are placed in uncured areas, this resin composition preferably contains a compound having a fluorene skeleton. Additionally, as such a compound having a fluorene skeleton, a compound containing a polymerizable unsaturated group represented by the following general formula (1) is a preferred embodiment.

[0047] [Chemistry 1]

[0048]

[0049] Furthermore, in formula (1), Ar is independently an aromatic hydrocarbon group having 6 to 14 carbon atoms, and a portion of the hydrogen atom constituting the carbon bond of the aromatic hydrocarbon group may be substituted with an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an arylalkyl group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a cycloalkylalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or a halogen group. Additionally, in formula (1), R1 is independently an alkylene group having 2 to 4 carbon atoms, and l is independently a number of 0 to 3. Furthermore, this l is preferably selected such that the average number of l in one molecule is 0 to 3, and the average number of l in the composition is 0 to 3. Moreover, in formula (1), G is independently a (meth)acryloyl group, a substituent represented by the following general formula (2) or the following general formula (3), and Y is a tetravalent carboxylic acid residue. Furthermore, in formula (1), Z can be a hydrogen atom or a substituent represented by general formula (4) independently, and one or more can be substituents represented by general formula (4) below. In addition, in formula (1), n ​​is a number with an average value of 1 to 20.

[0050] Here, the aromatic hydrocarbon group can be unsubstituted as long as it is within the range of the number of carbon atoms. Examples include: o-phenylene, m-phenylene, p-phenylene, toluylene, ethylphenylene, n-propylphenylene, isopropylphenylene, straight-chain or branched butylphenylene, pentylphenylene, etc. As long as the number of carbon atoms does not exceed the range, it can be substituted by two to four substituents.

[0051] [Chemistry 2]

[0052]

[0053] [Chemistry 3]

[0054]

[0055] In formulas (2) and (3), R2 is a hydrogen atom or a methyl group, R3 is a divalent alkylene group or an alkylarylene group having 2 to 10 carbon atoms, R4 is a divalent saturated or unsaturated hydrocarbon group having 2 to 20 carbon atoms, and p is a number from 0 to 10. Furthermore, the average value of p in the resin composition is preferably a number from 0 to 5, and more preferably a number from 0 to 2. When the average value of p is within this range, the distribution range of soft structures such as epoxides can be suppressed, thus imparting sufficient curability as a hardened film without reducing the resin properties.

[0056] Here, the alkylene group that can be optionally represented as R3 can be any structure, either linear or branched, such as ethylene, ethylidene, vinylene, vinylidene, propylene, trimethylene, propenylene, isopropylidene, tetramethylene, etc. Alternatively, the alkylarylene group that can be optionally represented as R3 can be an unsubstituted arylene group, provided it falls within the specified carbon number range, such as o-phenylene, m-phenylene, p-phenylene, methylphenylene, ethylphenylene, n-propylphenylene, isopropylphenylene, linear or branched butylphenylene, pentylphenylene, etc.

[0057] [Chemistry 4]

[0058]

[0059] In formula (4), W is a divalent or trivalent carboxylic acid residue, and m is 1 or 2.

[0060] Furthermore, the compound containing a polymerizable unsaturated group represented by the general formula (1) is a compound obtained by using an epoxy compound containing a number of alkylene groups in one molecule as a raw material, and preferably a compound using an aromatic hydrocarbon group in the general formula (1) where Ar has 6 to 14 carbon atoms.

[0061] As an aromatic hydrocarbon group with 6 to 14 carbon atoms, a divalent naphthyl group and a phenylene group whose hydrogen atom can be partially substituted by an alkyl group or the like can be suitable. Here, the compound containing the polymerizable unsaturated group is preferably composed of two naphthyl groups (having a bis-naphthol fluorene skeleton) or two phenylene groups (having a bisphenol fluorene skeleton) bonded to the fluorene group in general formula (1). This is because the amount of gas generated when the hardened film (coating) formed by hardening the compound containing the polymerizable unsaturated group is heated is small.

[0062] Here, a method for manufacturing a compound containing a polymerizable unsaturated group represented by the general formula (1) will be described in more detail. In this method for manufacturing a compound containing a polymerizable unsaturated group represented by the general formula (1), firstly, an epoxy compound (a-1) represented by the following general formula (5) (which may have several alkylene oxides in one molecule, more preferably having a bis(naphthol)fluorene skeleton or a bisphenol fluorene skeleton) is used as the compound having two or more epoxy groups, and then reacted with the epoxy compound (a-1) to obtain an epoxy (meth)acrylate compound. This reaction is performed with any one or both of the (meth)acrylate derivatives represented by the following general formula (6) or the following general formula (7).

[0063] [Chemistry 5]

[0064]

[0065] In formula (5), Ar is independently an aromatic hydrocarbon group having 6 to 14 carbon atoms, and a portion of the hydrogen atom that forms the carbon bond of the aromatic hydrocarbon group may be substituted with an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an arylalkyl group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a cycloalkylalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or a halogen group. R1 is independently an alkylene group having 2 to 4 carbon atoms, and l is independently a number from 0 to 3.

[0066] [Chemistry 6]

[0067]

[0068] [Chemistry 7]

[0069]

[0070] In formulas (6) and (7), R2 is a hydrogen atom or a methyl group, R3 is a divalent alkylene group or an alkylarylene group with 2 to 10 carbon atoms, R4 is a divalent saturated or unsaturated hydrocarbon group with 2 to 20 carbon atoms, and p is a number from 0 to 10.

[0071] The reaction of the epoxy compound (a-1) with the (meth)acrylic acid derivative can be carried out using known methods. For example, Japanese Patent Application Publication No. 4-355450 describes a method in which a diol compound containing polymerizable unsaturated groups is obtained by using about 2 moles of (meth)acrylic acid relative to 1 mole of an epoxy compound having two epoxy groups. The epoxy (meth)acrylic acid compound obtained by this reaction can be a diol (d) containing polymerizable unsaturated groups as represented by the following formula (8) (hereinafter also referred to as "diol (d) represented by general formula (8)").

[0072] [Chemistry 8]

[0073]

[0074] In formula (8), Ar is independently an aromatic hydrocarbon group having 6 to 14 carbon atoms, and a portion of the hydrogen atom that forms the carbon bond of the aromatic hydrocarbon group may be substituted with an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an arylalkyl group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a cycloalkylalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or a halogen group. G is independently (meth)acryloyl group, a substituent represented by the general formula (2) or general formula (3), R1 is independently an alkylene group having 2 to 4 carbon atoms, and l is independently a number of 0 to 3 carbon atoms.

[0075] Here, in the manufacture of compounds containing polymerizable unsaturated groups represented by general formula (1), the synthesis reaction of the diol (d) represented by general formula (8) and the subsequent reaction (the reaction of the diol (d) after the synthesis of diol (d) with a polycarboxylic acid or its anhydride) are generally carried out in a solvent (with a catalyst if necessary).

[0076] Examples of such solvents include: ethyl cellolytic acetate, butyl cellolytic acetate, and other cellolytic solvents; high-boiling-point ether or ester solvents such as diethylene glycol dimethyl ether, ethyl carbitol acetate, butyl carbitol acetate, and propylene glycol monomethyl ether acetate; and ketone solvents such as cyclohexanone and diisobutyl ketone. Furthermore, there are no particular restrictions on the reaction conditions, such as the solvent and catalyst used, but it is preferable, for example, to use a solvent without hydroxyl groups and with a boiling point higher than the reaction temperature.

[0077] Furthermore, for the reaction of epoxy groups with carboxyl or hydroxyl groups, a catalyst is preferred. As such a catalyst, known catalysts can be appropriately used (for example, ammonium salts such as tetraethylammonium bromide and triethylbenzylammonium chloride, triphenylphosphine, and phosphines such as tris(2,6-dimethoxyphenyl)phosphine are disclosed in Japanese Patent Application Publication No. 9-325494).

[0078] Next, in the method for manufacturing a compound containing a polymerizable unsaturated group represented by this general formula (1), a diol (d) represented by general formula (8) obtained by reacting the epoxy compound (a-1) with the (meth)acrylic acid derivative, and a dicarboxylic acid or tricarboxylic acid or their monoanhydride (b) and a tetracarboxylic acid or their dianhydride (c) are reacted to obtain a compound containing a polymerizable unsaturated group represented by general formula (1) (a compound having a carboxyl group and a polymerizable unsaturated group in one molecule).

[0079] As the acid component used to synthesize the compound containing a polymerizable unsaturated group represented by general formula (1), it is a polybasic acid component that can react with the hydroxyl group in the diol (d) molecule represented by general formula (8). Preferably, it is a combination of a dicarboxylic acid or a tricarboxylic acid or their monoanhydride (b) and a tetracarboxylic acid or its dianhydride (c). The carboxylic acid residues of the acid component can be either saturated or unsaturated hydrocarbon groups. In addition, these carboxylic acid residues may also contain bonds containing heteroelements such as -O-, -S-, and carbonyl groups.

[0080] Examples of the dicarboxylic or tricarboxylic acids or their monohydric anhydrides (b) include: chain hydrocarbon dicarboxylic or tricarboxylic acids, alicyclic hydrocarbon dicarboxylic or tricarboxylic acids, aromatic hydrocarbon dicarboxylic or tricarboxylic acids or their monohydric anhydrides, etc.

[0081] In addition, examples of monoanhydrides of the aforementioned chain-type dicarboxylic or tricarboxylic acids include: succinic acid, acetylsuccinic acid, maleic acid, adipic acid, itaconic acid, azelaic acid, citramalic acid, malonic acid, glutaric acid, citric acid, tartaric acid, oxoglutaric acid, pimelic acid, sebacic acid, octanoic acid, diethylene glycol, etc., and monoanhydrides of dicarboxylic or tricarboxylic acids with any substituents.

[0082] In addition, examples of the monoanhydrides of alicyclic dicarboxylic acids or tricarboxylic acids include: cyclobutane dicarboxylic acid, cyclopentane dicarboxylic acid, hexahydrophthalic acid, tetrahydrophthalic acid, norbornane dicarboxylic acid, and monoanhydrides of dicarboxylic acids or tricarboxylic acids with any substituents.

[0083] In addition, examples of the aromatic dicarboxylic or tricarboxylic acid monoanhydrides include: phthalic acid, isophthalic acid, trimellitic acid, and other monoanhydrides, as well as dicarboxylic or tricarboxylic acids with any substituents.

[0084] The monoanhydrides of the dicarboxylic or tricarboxylic acids are preferably succinic acid, itaconic acid, tetrahydrophthalic acid, hexahydrotriphenyl phthalic acid, phthalic acid, and trimellitic acid, and more preferably succinic acid, itaconic acid, and tetrahydrophthalic acid.

[0085] Furthermore, among dicarboxylic acids or tricarboxylic acids, their monoanhydrides are preferred. The monoanhydrides of the dicarboxylic acid or tricarboxylic acid may be used alone or in combination with two or more.

[0086] In addition, examples of the tetracarboxylic acid or its dianhydride (c) include chain-type tetracarboxylic acids, alicyclic tetracarboxylic acids, aromatic tetracarboxylic acids, or their dianhydrides.

[0087] Examples of the chain-type tetracarboxylic acids include: butanetetracarboxylic acid, pentanetetracarboxylic acid, hexanetetracarboxylic acid, and chain-type tetracarboxylic acids with substituents such as alicyclic hydrocarbon groups or unsaturated hydrocarbon groups.

[0088] In addition, examples of alicyclic tetracarboxylic acids include: cyclobutane tetracarboxylic acid, cyclopentane tetracarboxylic acid, cyclohexane tetracarboxylic acid, cycloheptane tetracarboxylic acid, norbornane tetracarboxylic acid, and alicyclic tetracarboxylic acids with substituents such as chain hydrocarbon groups or unsaturated hydrocarbon groups.

[0089] In addition, examples of aromatic tetracarboxylic acids include pyromellitic acid, benzophenone tetracarboxylic acid, biphenyl tetracarboxylic acid, diphenyl ether tetracarboxylic acid, diphenyl sulfone tetracarboxylic acid, naphthalene-1,4,5,8-tetracarboxylic acid, and naphthalene-2,3,6,7-tetracarboxylic acid.

[0090] Alternatively, bis(p-phenylene tricarboxylic acid) aryl esters may be used as the tetracarboxylic acid or its dianhydride (c). Here, bis(p-phenylene tricarboxylic acid) aryl esters include, for example, compounds produced by the method described in International Publication No. 2010 / 074065, which are dianhydrides in the form of an aromatic diol (naphthalene glycol, biphenol, terphenyl diol, etc.) reacting with the carboxyl groups of two molecules of trimellitic anhydride and forming an ester bond (hereinafter, the compounds are referred to as bis(p-phenylene tricarboxylic acid) esters of aromatic diols).

[0091] The tetracarboxylic acid or its dianhydride is preferably biphenyltetracarboxylic acid, benzophenone tetracarboxylic acid, or diphenyl ether tetracarboxylic acid, and more preferably biphenyltetracarboxylic acid or diphenyl ether tetracarboxylic acid. Furthermore, the dianhydride of the tetracarboxylic acid or its dianhydride is preferably used. Moreover, bis(p-phenylenetricarbonyl) anhydride ester of naphthalene glycol may preferably be used as the tetracarboxylic acid or its dianhydride (c). In addition, either the tetracarboxylic acid or its dianhydride and the bis(p-phenylenetricarbonyl) anhydride ester of an aromatic diol may be used alone, or two or more may be used in combination.

[0092] There are no particular limitations on the reaction of the diol (d) represented by general formula (8) with acid components (b) and (c), and known methods can be used. For example, Japanese Patent Application Publication No. 9-325494 discloses a method for reacting epoxy (meth)acrylate with tetracarboxylic acid dianhydride at a reaction temperature of 90°C to 140°C.

[0093] Here, in order to make the end of the compound a carboxyl group, it is preferred to carry out the reaction in such a way that the molar ratio of the diol (d), dicarboxylic acid or tricarboxylic acid or their monohydric anhydride (b), tetracarboxylic acid or their dianhydride (c) represented by general formula (8) is (d):(b):(c) = 1.0:0.01 to 1.0:0.2 to 1.0.

[0094] For example, when using monohydric anhydride (b) and dianhydride (c), it is preferable to carry out the reaction in a molar ratio of the amount of acid component [(b) / 2+(c)] to the diol containing polymeric unsaturated groups (d) [[(b) / 2+(c)] / (d)] of 0.5 to 1.0. Here, when the molar ratio is 0.5 or higher, the content of unreacted diol containing polymeric unsaturated groups will not increase, thus improving the long-term stability of the resin composition. On the other hand, when the molar ratio is 1.0 or lower, the end of the compound containing polymeric unsaturated groups represented by formula (2) will not become anhydride, thus suppressing the increase of unreacted dianhydride content, thereby improving the long-term stability of the resin composition. Furthermore, the molar ratios of each component of (b), (c), and (d) can be arbitrarily changed within the range for the purpose of adjusting the acid value and molecular weight of the compound containing polymeric unsaturated groups.

[0095] The weight-average molecular weight (Mw) of polystyrene, obtained by gel permeation chromatography (GPC) of the compound containing polymerizable unsaturated groups represented by general formula (1) (HLC-8220GPC, manufactured by Tosoh Corporation), is not particularly limited, but is generally preferred to be 1,000 to 100,000, more preferably 2,000 to 20,000, and even more preferably 2,000 to 8,000. When the weight-average molecular weight is 1,000 or higher, the reduction in pattern adhesion can be suppressed. Furthermore, when the weight-average molecular weight is 100,000 or lower, it is easier to adjust the solution viscosity of the resin composition solution to a suitable range for coating.

[0096] Another example of a suitable compound containing polymerizable unsaturated groups is a resin having both (meth)acrylic acid groups and carboxyl groups in copolymers such as (meth)acrylic acid and (meth)acrylates. A method for obtaining such a resin (copolymer) having (meth)acrylic acid groups and carboxyl groups can be, for example, as follows: First, copolymerizing (meth)acrylates containing glycidyl methacrylate in a solvent to obtain a copolymer; second, reacting (meth)acrylic acid with the copolymer; third, reacting with an anhydride of a dicarboxylic acid or tricarboxylic acid. Another method for obtaining such a resin (copolymer) having (meth)acrylic acid groups and carboxyl groups can be as follows: First, copolymerizing (meth)acrylic acid and (meth)acrylates in a solvent to obtain a copolymer; second, reacting (meth)acrylic acid glycidyl methacrylate with the copolymer; third, reacting with an anhydride of a dicarboxylic acid or tricarboxylic acid.

[0097] Another example of a suitable compound containing a polymerizable unsaturated group is a carbamate compound, which is obtained by reacting a polyol compound having an ethylene unsaturated bond in its molecule as a first component, a diol compound having a carboxyl group in its molecule as a second component, and a diisocyanate compound as a third component.

[0098] Furthermore, to facilitate curing by heat or light, the resin composition preferably comprises the (A) component (preferably the compound containing a polymerizable unsaturated group) and an epoxy-modified acrylate selected from (meth)acrylates or oligomers thereof (hereinafter, as applicable, simply referred to as "(B) component"). Such (B) component may include an epoxy-modified (meth)acrylate, an epoxy-modified (meth)acrylate oligomer, or both.

[0099] If examples are given of (meth)acrylates (referring to acrylates and / or methacrylates) used as raw materials to obtain such epoxy-modified compounds (component (B)), then: hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, polyethylene glycol (meth)acrylate, polypropylene glycol (meth)acrylate, butanediol mono(meth)acrylate, chlorohydroxypropyl (meth)acrylate, and other substances containing hydroxyl groups, or for example, allyl (meth)acrylate, butoxyethyl (meth)acrylate, butoxytriethylene glycol (meth)acrylate, etc. tert-butylaminoethyl methacrylate, caprolactone (meth)acrylate, butyl methacrylate, hexyl methacrylate, cyanoethyl methacrylate, dimethylaminoethyl methacrylate, diethylamino(meth)acrylate, ethoxyethyl methacrylate, ethylhexyl methacrylate, isodecanyl methacrylate, isoodecyl methacrylate, lauryl methacrylate, octyl methacrylate, stearyl methacrylate, succinic acid (meth)acrylate, methacryloxypropyltrimethoxysilane, methoxyethyl methacrylate, cyclodecyl Aliphatic methacrylates such as trienyl methacrylates, glyceryl methacrylates, glycidyl methacrylates, ethyl methacrylate isocyanate, decafluoroheptyl methacrylates, octafluoropentyl methacrylates, tetrafluoropropyl methacrylates, trifluoroethyl methacrylates, and dibromopropyl methacrylates, or alicyclic modified methacrylates such as cyclohexyl methacrylate, dicyclopentyl methacrylate, dicyclopentenyl methacrylate, isobornyl methacrylate, tetrahydrofurfuryl methacrylate, and morpholine methacrylates. Aromatic methacrylates, such as phenoxyethyl methacrylate, phenoxyhydroxypropyl methacrylate, nonylphenoxy polypropylene glycol methacrylate, phenyl methacrylate, phthalic acid methacrylate, benzyl methacrylate, etc.; phosphorus-containing methacrylates, such as phenoxylated phosphoric acid methacrylate, phosphate methacrylate, butoxylated phosphoric acid methacrylate, octyloxylated phosphoric acid methacrylate, etc.; or water-soluble methacrylates, such as sodium sulfonate methacrylate, etc.

[0100] In addition, as another example of this type of (meth)acrylate, the following can be listed: ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, hexanediol (meth)acrylate, long-chain aliphatic di(meth)acrylate, neopentyl glycol di(meth)acrylate, hydroxypentanoic acid neopentyl glycol di(meth)acrylate, stearic acid modified pentaerythritol di(meth)acrylate, propylene di(meth)acrylate, glycerol (meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, tetramethylene glycol di(meth)acrylate, butanediol di(meth)acrylate, dicyclopentyl di(meth)acrylate. Esters, polyethylene glycol di(meth)acrylate, polypropylene di(meth)acrylate, triglyceride di(meth)acrylate, neopentyl glycol modified trimethylolpropane di(meth)acrylate, allylated cyclohexyl di(meth)acrylate, methoxylated cyclohexyl di(meth)acrylate, acrylated isocyanurate, bis(acryloyloxyneopentyl glycol) adipate, bisphenol A di(meth)acrylate, tetrabromobisphenol A di(meth)acrylate, bisphenol S di(meth)acrylate, butanediol di(meth)acrylate, phthalate di(meth)acrylate, phosphate di(meth)acrylate, zinc di(meth)acrylate, and other difunctional compounds.

[0101] In addition, as another example of such (meth)acrylates, the following can be listed: trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, glycerol tri(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, alkyl-modified dipentaerythritol tri(meth)acrylate, phosphate tri(meth)acrylate, tri(acryloyloxyethyl)isocyanurate, tri(methacryloyloxyethyl)isocyanurate, pentaerythritol tetra(meth)acrylate. Compounds with trifunctionality or higher, such as pentaerythritol tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, di-trimethylolpropane tetraacrylate, alkyl-modified pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxy penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, alkyl-modified dipentaerythritol penta(meth)acrylate, urethane tri(meth)acrylate, ester tri(meth)acrylate, urethane hexa(meth)acrylate, ester hexa(meth)acrylate, etc.

[0102] Furthermore, the (meth)acrylate oligomers that serve as raw materials for the aforementioned epoxy-modified compound (component (B)) can be listed as (meth)acrylate oligomers. Moreover, regarding these monofunctional, difunctional, and trifunctional or higher (meth)acrylates or their oligomers, one of them may be used alone, or two or more may be used together.

[0103] The epoxide-modified compound (component (B)) can crosslink the molecules of component (A) (preferably the compound containing polymerizable unsaturated groups) to each other. To achieve this function, it is preferable to use a substance with trifunctionality or higher. Furthermore, the acrylic equivalent, obtained by dividing the molecular weight of the monomer by the number of (meth)acrylate groups in one molecule, is preferably 50 to 300, and more preferably 80 to 200. In addition, component (B) does not have free carboxyl groups.

[0104] Furthermore, in the resin composition, the content of component (A) relative to the total mass of the solid components is preferably 10% to 90% by mass. Additionally, in the resin composition, the content of component (B) relative to 100 parts by mass of component (A) is preferably 5 parts by mass to 200 parts by mass, more preferably 10 parts by mass to 80 parts by mass. When the content of component (B) is 5 parts by mass or more relative to 100 parts by mass of component (A), the amount of photoreactive functional groups in the resin is sufficient, thus forming a sufficiently cross-linked structure. Furthermore, when the content of component (B) is 200 parts by mass or less relative to 100 parts by mass of component (A), a hardened film with sufficient curability can be obtained, thus making the edges of the pattern more distinct.

[0105] For the purpose of improving adhesion to the support, the resin composition may also contain a compound having an epoxy group (hereinafter, as applicable, simply referred to as "(C) component"). Examples of such (C) components include: bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol fluorene type epoxy compounds, phenolic varnish type epoxy compounds, cresolic varnish type epoxy compounds, phenolic alkyl type epoxy compounds, phenolic varnish compounds containing a naphthalene skeleton, naphthol alkyl type epoxy compounds, triphenolic methane type epoxy compounds, tetraphenolic ethane type epoxy compounds, glycidyl ethers of polyols, glycidyl esters of polycarboxylic acids, and glycidyl methacrylate and methacrylate. The copolymers of esters include copolymers of monomers containing (meth)acrylic acid groups as units, alicyclic epoxy compounds represented by 3',4'-epoxycyclohexylmethyl 3,4-epoxycyclohexane carboxylate, polyfunctional epoxy compounds having a dicyclopentene skeleton, 1,2-epoxy-4-(2-oxacyclopropyl)cyclohexane adducts of 2,2-bis(hydroxymethyl)-1-butanol, epoxidized polybutadiene, and epoxy compounds having a silicone skeleton. Among these components, compounds with an epoxy equivalent of 50 g / eq to 500 g / eq are preferred. Furthermore, epoxy compounds having two or more epoxy groups in one molecule are more preferred. In addition, component (C) may be used alone or in combination of two or more.

[0106] Furthermore, the resin composition, as a resin or a component used to form the resin (hereinafter, both are referred to together as resin components), includes, in addition to components (A), (B), and (C) (including them when a curing agent is used), at least one other unsaturated compound selected from other photopolymerizable monomers and oligomers (hereinafter, as appropriate, simply referred to as "(E) component"). Examples of such (E) component include various vinyl monomers having one or more unsaturated groups (e.g., (meth)acrylic acid, (meth)acrylate, styrene); various oligomers thereof (e.g., hydrocarbon resins containing unsaturated groups); etc. In addition, when the resin composition requires excellent photocurability, i.e., high sensitivity, according to its application, the (E) component is preferably an oligomer or monomer having two (difunctional) or more, more preferably three (trifunctional) or more polymerizable double bonds in one molecule. Regarding the formulation ratio of the oligomers or monomers, generally speaking, if the amount of trifunctional or higher polyfunctional acrylates is too small, photocuring cannot proceed sufficiently, and there is a tendency for the exposed areas to dissolve. In addition, if the amount of trifunctional or higher polyfunctional acrylates is too large, there will be a situation where even the unexposed areas cannot be developed. Depending on the degree of polymerization or the structure of the anhydride, there is a tendency for the non-stickiness to decrease.

[0107] In this resin composition, the proportions of components (C) and (E) relative to 100 parts by mass of component (A) are preferably 0 to 50 parts by mass of component (C) and 0 to 100 parts by mass of component (E), more preferably 10 to 40 parts by mass of component (C) and 0 to 40 parts by mass of component (E). Furthermore, the proportion of component (A) in the resin composition is preferably 30% to 80% by mass, the combined proportion of components (B) and (E) is preferably 10% to 40% by mass, and the proportion of component (C) is preferably about 5% to 50% by mass.

[0108] Furthermore, in order to enable the components in the composition (e.g., components that may be included as components (A), (B), and (E)) to undergo photopolymerization, the resin composition preferably also contains at least one selected from the group consisting of photopolymerization initiators and sensitizers (hereinafter, as applicable, simply referred to as "component (D)"). Known photopolymerization initiators suitable for use as such component (D) can be appropriately utilized, such as radical-generating photopolymerization initiators like Mischel ketone, or cationic-generating photopolymerization initiators like triarylsulfonium salts and diaryliodoses. Such photopolymerization initiators as component (D) can be used alone, or two or more can be used in combination. Furthermore, the photopolymerization initiator used as component (D) is not necessarily required if the resin composition is capable of thermal polymerization, but it is preferable to include it when forming patterns through photosensitization, development, etc.

[0109] Furthermore, examples of known sensitizers (photosensitizers) that can be used as this component (D) include ethyl N,N-dimethylaminobenzoate, isoamyl N,N-dimethylaminobenzoate, triethanolamine, triethylamine, etc., which can be used alone or in combination of two or more. Moreover, it is preferable to use the photopolymerization initiator in combination with the sensitizer (photosensitizer) as the aforementioned component (D).

[0110] The amount of component (D) used relative to 100 parts by mass of component (A) (the total amount of photopolymerization initiator and sensitizer) is preferably 0 to 10 parts by mass, more preferably 0.01 to 10 parts by mass, and particularly preferably 1 to 5 parts by mass. Furthermore, the amount of component (D) used relative to 100 parts by mass of the total amount of the resin components (the total amount of components (A), (B), (C), and (E)) (the total amount of photopolymerization initiator and sensitizer) is preferably 0.1 to 10 parts by mass, more preferably 1 to 5 parts by mass. If the amount of component (D) used exceeds 10 parts by mass, the light absorption ratio increases, and there is a tendency for light to be unable to penetrate to the lower part.

[0111] In addition, the resin composition preferably includes a compound containing a polymerizable unsaturated group as component (A) (more preferably a compound represented by the general formula (1)), component (B), component (C), component (D), and component (E).

[0112] Furthermore, as the resin composition forming the uncured region of the resin layer, for example, an uncured resin composition (the substance after solvent removal) obtained by dissolving the resin composition in a solvent can be used. This involves coating a solution (a solution of the resin composition) obtained by dissolving the resin composition in a solvent onto a support or introducing it into a specific region (the region being the uncured region), followed by evaporation to remove the solvent. Examples of solvents that can be used to dissolve such a resin composition include: alcohols such as methanol, ethanol, n-propanol, isopropanol, ethylene glycol, propylene glycol, 3-methoxy-1-butanol, ethylene glycol monobutyl ether, 3-hydroxy-2-butanone, and diacetone alcohol; terpenes such as α-terpineol or β-terpineol; ketones such as acetone, methyl ethyl ketone, cyclohexanone, and N-methyl-2-pyrrolidone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; and cellosolves such as methyl cellosolve, ethyl cellosolve, carbitol, methyl carbitol, ethyl carbitol, butyl carbitol, and diethylene glycol. Diol ethers such as ethyl methyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, triethylene glycol monomethyl ether, and triethylene glycol monoethyl ether; esters such as ethyl acetate, butyl acetate, ethyl lactate, 3-methoxybutyl acetate, 3-methoxy-3-butyl acetate, 3-methoxy-3-methyl-1-butyl acetate, cellolytic acetate, ethyl cellolytic acetate, butyl cellolytic acetate, carbitol acetate, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, and propylene glycol monoethyl ether acetate. By using this solvent to dissolve and mix the components, a homogeneous solution composition can be prepared. This solvent can be used appropriately as needed to obtain the necessary properties such as coatability; one solvent can be used alone, or two or more solvents can be used in combination. Furthermore, from the viewpoint of further efficiently adjusting the solution viscosity of the resin composition solution, it is preferable to use two or more solvents. Furthermore, by using two or more solvents and appropriately adjusting their mixing ratios, the viscosity of the resin composition solution can be easily adjusted. Therefore, when using two or more solvents, not only is the increase or decrease in film thickness easily controlled, but the rate of composition spread can also be adjusted (controlled) to ensure uniform spread on the support during coating, thus further suppressing uneven coating and streaks. Moreover, by combining two or more solvents with different vapor pressures, the drying rate of the composition can be adjusted (controlled) to allow only the film surface to dry immediately after film formation, or conversely, to slow down the drying rate, thereby enabling more uniform heating of the coating during calcination. As a result, when combining two or more solvents with different vapor pressures, the generation of uneven film thickness can be further suppressed. The content of this solvent varies depending on the target solution viscosity, but is preferably 60% to 90% by mass relative to the total amount of the mixture (solution) of the resin composition and solvent.

[0113] Furthermore, to adjust the surface tension of the resin composition, the resin composition may also contain a surfactant as needed. Examples of such surfactants include known surfactants such as silicone-based and fluorinated surfactants. Examples of silicone-based surfactants include side-chain modified polydimethylsiloxanes, bi-terminated polydimethylsiloxanes, single-terminated polydimethylsiloxanes, and bi-terminated polydimethylsiloxanes. Fluorinated surfactants may include polyoxyalkylene ether polymer compounds having perfluoroalkyl sulfonic acid compounds, perfluoroalkyl carboxylic acid compounds, perfluoroalkyl phosphate compounds, perfluoroalkyl ethylene oxide adducts, and perfluoroalkyl ether groups on their side chains. Furthermore, such surfactants may be used alone or in combination with two or more. The amount of surfactant added is preferably determined while measuring the surface tension of the resin composition in a manner that satisfies condition (I) described later, and the preferred range for the amount added is 0.001% by mass to 0.1% by mass in the resin composition. Furthermore, the suitable range of the amount of this surfactant added varies depending on its type. For example, in the case of silicone-based surfactants, it is preferably 0.001% to 0.005% by mass, and in the case of fluorinated surfactants, it is preferably 0.01% to 0.1% by mass.

[0114] Furthermore, the surface tension of the resin composition can be adjusted by changing the amount of this surfactant. When the surface tension of this resin composition is set as σ, and the surface tension of the resin composition after removing the surfactant is set as σ0, it is preferable to satisfy the formula:

[0115] 0.85≦σ / σ0≦1

[0116] The amount of surfactant is adjusted according to the conditions (I) described above. By adjusting the amount of surfactant to meet the conditions (I), when placing the element in the uncured area (uncured portion), there is a tendency to more effectively suppress the sinking of the element. Furthermore, experimentally, σ0 is usually measured before adding the surfactant, and σ is measured after adding the surfactant. Regarding the method for measuring surface tension σ and surface tension σ0, for example, an automatic surface tension meter (model: CBVP-Z, manufactured by Kyowa Interface Science Co., Ltd.) can be used to measure surface tension under conditions of 23°C and 50% humidity.

[0117] Furthermore, additives such as hardeners, hardening accelerators, thermal polymerization inhibitors, antioxidants, plasticizers, fillers, leveling agents, defoamers, and coupling agents may be added to the resin composition as needed.

[0118] As the curing agent suitable for use as such an additive, known compounds generally applicable to epoxy compounds can be appropriately utilized. Thus, as the curing agent, curing agents used as curing agents for epoxy compounds can be suitably utilized, for example: amine compounds, polycarboxylic acid compounds, phenolic resins, amino resins, dicyandiamide, Lewis acid complexes, etc. Furthermore, examples of such polycarboxylic acid compounds include polycarboxylic acids, anhydrides of polycarboxylic acids, and thermally decomposable esters of polycarboxylic acids.

[0119] Furthermore, as the curing accelerator that can be used as the additive, known compounds that are known as curing accelerators, curing catalysts, or potential curing agents of epoxy compounds can be appropriately utilized, for example: tertiary amines, quaternary ammonium salts, tertiary phosphine, quaternary phosphonium salts, borate esters, Lewis acids, organometallic compounds, imidazoles, etc.

[0120] Examples of the thermal polymerization inhibitors and antioxidants that can be used as the additives include: hydroquinone, hydroquinone monomethyl ether, pyrogallol, tert-butylcatechol, phenothiazine, hindered phenolic compounds, etc. Examples of plasticizers include: dibutyl phthalate, dioctyl phthalate, tricresyl phosphate, etc. Furthermore, examples of the filler materials include: nano-sized particles such as silica and titanium dioxide, which do not hinder the transparency of the coating film and can be dispersed in organic solvents. Furthermore, examples of the leveling agents or defoamers include: silicone-based, fluorine-based, and acrylic-based compounds. Additionally, silane coupling agents can be listed as coupling agents that can be used as the additives. In addition, examples of the silane coupling agents include: 3-acryloyloxypropyltrimethoxysilane, 3-(glycidoxy)propyltrimethoxysilane, 3-isocyanopropyltriethoxysilane, 3-ureopropyltriethoxysilane, etc.

[0121] In addition, the resin composition can also be used in the form of a dry film, and can form fine patterns by exposure and development. It can also form uncured areas and cured areas on its film, wherein the uncured areas contain uncured resin composition (resin composition cured by heat or light), and the cured areas contain cured resin composition.

[0122] Furthermore, the resin layer has uncured regions and cured regions. The uncured regions contain a resin composition that is cured by heat or light, and the cured regions contain a cured product of the resin composition. There are no particular limitations on the method used to form this resin layer. For example, a method can be used whereby a solution of the resin composition obtained by dissolving it in a solvent is applied to the surface of a support, the solvent is removed by drying the formed coating (pre-baking can also be performed for this drying), a photomask is then applied to the solvent-removed coating, and ultraviolet light is irradiated to cure the exposed portion (photopolymerization), thereby forming a cured region (cured portion) containing the cured product of the resin composition and an uncured region (uncured portion) containing the uncured resin composition, thus forming a resin layer on the support. Through this photopolymerization, a resin layer having both cured and uncured portions can be formed on the support with even greater efficiency. Furthermore, in this case, the resin composition used as the uncured area forming the resin layer can be a resin composition that, as described above, is applied to a support by coating a solution (a solution of the resin composition) obtained by dissolving it in a solvent, and then the solvent is evaporated (dried away) from the obtained coating, leaving the resin composition remaining in the unexposed areas in an uncured state. In this way, the resin layer can be easily formed using the resin composition.

[0123] Furthermore, in the resin layer, the uncured area is surrounded by a cured portion (cured area) of the resin composition to prevent the uncured resin composition from moving along the planar direction from the uncured area. Additionally, hereinafter, refer to... Figure 1 and Figure 2 The following is a simplified description of a suitable embodiment of the resin laminate of the present invention to illustrate the state of the hardened and unhardened regions. Figure 1 This schematically illustrates a plan view of the surface of the resin layer of a suitable embodiment of the resin laminate of the present invention when viewed from a direction perpendicular to the surface (normal direction). Figure 1 As shown, resin layer 1 has a hardened region 1A and an unhardened region 1B. When viewed from the normal direction of the surface of resin layer 1, the unhardened region 1B exists within the boundary line B between the hardened region 1A and the unhardened region 1B. That is, when viewed from the normal direction of the surface of resin layer 1, the hardened region 1A is formed to surround the unhardened region 1B. Thus, the unhardened region 1B is surrounded by the hardened material of the resin composition (the substance constituting the hardened region 1A), and the planar shape of the unhardened region 1B (the shape depicted by the boundary line B) is a geometric shape (circular in this example). Furthermore, Figure 2 It is a schematic representation of inclusion Figure 1 The A-A' line in the middle and with Figure 1The cross-sectional view shown is a section perpendicular to the plane (a plane parallel to the normal direction of the resin layer surface). For example... Figure 2 As shown, a resin layer 1 comprising a hardened region 1A and an unhardened region 1B is stacked on a support 2. An unhardened region 1B exists within the area enclosed by the wall surface (peripheral wall of the hardened resin composition) W of the hardened region 1A. Thus, the unhardened resin composition within the unhardened region 1B is surrounded by the hardened resin composition, preventing it from moving in a planar direction (as schematically indicated by arrow D1). In other words, the wall surface W of the hardened region 1A and the surface S of the support function as a container for the unhardened resin composition, and are arranged on the support in such a way that the unhardened resin composition within the unhardened region 1B does not move in a planar direction. Thus, the hardened region 1A has a portion that functions as a peripheral wall (frame) surrounding the unhardened region 1B, and together with the surface of the support, it contains (holds) the unhardened resin composition in its unhardened state, preventing the unhardened resin composition from moving from the unhardened region 1B toward the surrounding area (as schematically indicated by arrow D1).

[0124] Above, refer to Figure 1 and Figure 2 The state of the uncured region has been described, but embodiments of the resin laminate of the present invention (morphology of the resin layer, etc.) are not limited thereto. For example, Figure 1 The planar shape of the unhardened region shown (the planar shape of the outer periphery of the unhardened region: the shape formed by the boundary line with the hardened region) is circular, but the planar shape of the unhardened region is not limited to this; any so-called geometric shape is acceptable. Furthermore, the "geometric shape" mentioned here can also be a circle, an ellipse, a polygon (more preferably a regular polygon: such as an equilateral triangle, square, regular pentagon, regular hexagon, regular octagon, etc.), or various shapes derived from them. Additionally, as this geometric shape (the planar shape of the unhardened region), it is preferable to select at least one shape from the group consisting of circles, ellipses, and polygons (furthermore, the "polygon" mentioned here includes shapes with rounded corners (so-called rounded corner shapes) in addition to ordinary polygons). In this geometric shape, in order to easily control the direction and magnitude of the surface tension during installation, it is preferable to have a shape that is approximately the same as the shape of the element installed in the unhardened region. For example, when installing a square or rectangular element, it is preferable that the planar shape of the unhardened region is either square or rectangular. Furthermore, from the viewpoint of enabling component movement (spontaneous alignment, etc.) in a shorter time, the size of the planar shape of the unhardened area is preferably set to be in the range of 1.2 to 2.0 times the size of the component to be mounted. Additionally, in Figure 1 and Figure 2The resin layer shown has only one uncured area, but there is no particular limit to the number of uncured areas. Multiple uncured areas can be arranged regularly or irregularly, and when viewed from above, geometric patterns can also be formed on the surface of the resin layer.

[0125] Furthermore, the hardened region formed in the resin layer has a structural portion formed in such a way that the hardened portion of the resin composition constituting the region surrounds the unhardened region (such as a portion that functions as a frame containing the unhardened region; a structural portion formed such that the resin composition does not move from the unhardened region in the planar direction). Regarding such hardened and unhardened regions, as described above, they can be easily formed by photocuring with a mask formed in such a way that the unhardened region takes the desired shape after forming a coating containing the resin composition. Thus, a resin layer having the unhardened and hardened regions can be easily formed.

[0126] Furthermore, there is no particular limitation on the film thickness of this resin layer with hardened and unhardened regions; it can be adjusted appropriately according to its application. For example, when used for mounting components, it is preferably set within the range of 5 μm to 1000 μm. If the film thickness of this resin layer is less than 5 μm, there is a tendency for reduced fluidity due to component sinking when mounting components in the unhardened area. On the other hand, if it exceeds 1000 μm, there is a tendency for reduced film uniformity.

[0127] Furthermore, the viscosity of the resin composition in the uncured area of ​​this resin layer (the uncured resin composition) is 100 Pa·s or less (more preferably 0.5 Pa·s to 50 Pa·s) at any temperature within the temperature range of 60°C to 150°C. This resin composition can be achieved by appropriately adjusting the types and amounts of each component contained in the resin composition to achieve a viscosity of 100 Pa·s or less at any temperature within the temperature range of 60°C to 150°C. That is, by appropriately adjusting the types and amounts of each component, such as component (A) or component (B), a resin composition is formed to achieve a desired viscosity within a specific temperature range, thereby enabling the viscosity of the resin composition at any temperature within the temperature range of 60°C to 150°C to be 100 Pa·s or less. In addition, for example, by preparing a resin composition that uses a resin having a fluorene backbone and a weight average molecular weight in the range of 1,000 to 100,000 for component (A), it is possible to obtain a resin composition with a viscosity of 100 Pa·s or less at any temperature in the temperature range of 60°C to 150°C.

[0128] Here, as a method for determining the viscosity of the resin composition in this uncured region, the following method is adopted: using a rheometer as the measuring device, the measuring temperature is measured within a temperature range of room temperature (23°C) to 200°C. In this case, the following method can be appropriately adopted: a film with a thickness of 200 μm containing the same uncured resin composition as the resin composition in the uncured region (for example, a film obtained by drying a coating film of the resin composition solution; the drying conditions are not particularly limited, and can be appropriately selected according to the type of solvent, etc., and the condition of drying at 110°C for 10 minutes can also be used) is prepared as a sample for measurement. Using a rheometer, the viscosity is measured at various temperatures within a temperature range of room temperature (23°C) to 200°C under the conditions of a heating rate of 5°C / min and a load of 7 N (frequency of 1 Hz). Furthermore, as long as the viscosity condition (below 100 Pa) is met at any temperature within the temperature range of 60°C to 150°C, the flowability of the resin composition in the uncured area used as the mounting area can be efficiently improved at the temperature during component installation (temperature range of 60°C to 150°C). This allows the configured component to be installed in the desired mounting position with high positional accuracy, and also enables the component to be rotated (spontaneously aligned) and installed with good orientation accuracy. Therefore, for example, if the resin composition has a viscosity exceeding 100 Pa·s at 60°C, but a viscosity of 100 Pa·s or less at other temperatures (e.g., 90°C) within the temperature range of 60°C to 150°C, then in this invention, it is determined that the resin composition has a viscosity of 100 Pa·s or less at any temperature within the temperature range of 60°C to 150°C. Thus, in this invention, the resin composition in the uncured area only needs to meet the condition that the viscosity is 100 Pa·s or less at any temperature within the stated temperature range. Furthermore, when installing within a temperature range of 60°C to 150°C, considering the heating mode, a resin composition with a viscosity of 100 Pa·s or less at a specific temperature is more preferable. Additionally, regarding the ability to install more efficiently within this uncured region, a resin composition with a viscosity of 100 Pa·s or less within a temperature range of 80°C to 110°C is more preferable.

[0129] Furthermore, the inventors have deduced that, since the viscosity of the resin composition (uncured resin composition) in the uncured region of the resin layer satisfies the aforementioned condition, when mounting an element in that region, the viscosity of the uncured region can be reduced to 100 Pa·s or less when the resin layer is heated to an mounting temperature in the range of 60°C to 150°C (more preferably 80°C to 110°C). This improves the fluidity of the uncured region, and by utilizing the self-alignment phenomenon generated by the surface tension of the liquid surface, the element can be moved and positioned within the uncured region (in the case of multiple uncured regions, the element can also be spontaneously aligned according to each region). In this invention, the element can be rotated toward the desired position with good orientation accuracy and installed efficiently.

[0130] Furthermore, there are no particular limitations on the method for manufacturing the resin laminate of the present invention, which includes the support and the resin layer. For example, the following method can be used: coating a solution of the resin composition onto the surface of the support, pre-baking the formed coating, removing the solvent, attaching a photomask onto the coating after solvent removal, and irradiating it with radiation (exposure) to harden the exposed portion (photopolymerization), thereby forming a hardened region (hardened portion) containing the hardened resin composition and an unhardened region (unhardened portion) containing the unhardened resin composition, and forming a resin layer having the hardened region and the unhardened region on the support, thereby obtaining the resin laminate of the present invention.

[0131] There are no particular limitations on the method for applying the resin composition solution onto this support. Besides known methods such as solution impregnation and spraying, methods using roller coaters, land coaters, slot coaters, or rotary machines can be employed. After coating to the desired thickness using this method, the solvent is removed by pre-baking to evaporate it, thereby forming a coating film containing the solvent-removed resin composition. Furthermore, this pre-baking is preferably performed using an oven, heating plate, or similar heating method. The heating temperature and time during pre-baking are not particularly limited, as long as they are appropriately selected based on the type of solvent contained in the resin composition. For example, pre-baking can be performed at a heating temperature of 60°C to 110°C and a heating time of 1 minute to 30 minutes.

[0132] This type of ultraviolet irradiation (exposure) following pre-baking can also be performed using known exposure equipment. Furthermore, during this type of exposure, exposure is performed using a dielectric photomask, thereby allowing only the portion of the resin composition corresponding to the pattern of the photomask (the exposed portion) to be photosensitive and cured. Additionally, the exposure equipment or irradiation conditions can be appropriately selected based on the type of resin composition, etc. Furthermore, as the light source, ultra-high pressure mercury lamps, high pressure mercury lamps, metal halide lamps, far-ultraviolet lamps, etc., can be appropriately used. By using such a light source for exposure, the resin composition in the exposed portion of the coating (film) can be photocured.

[0133] Furthermore, the radiation used in the exposure can be, for example, visible light, ultraviolet light, far ultraviolet light, electron beams, X-rays, etc., but the wavelength range of the radiation is preferably 250 nm to 450 nm. In this manner, a resin laminate can be obtained.

[0134] Furthermore, when using the resin laminate for mounting components, there are no particular limitations on the method of placing (mounting) the components in the uncured area, but it is preferable to use the following method: after placing the components on the uncured area, heat the resin layer to an installation temperature in the range of 60°C to 150°C (more preferably 80°C to 110°C) so that the viscosity of the uncured area is below 100 Pa·s, and then mount the components in the desired position and orientation.

[0135] Furthermore, when using the resin laminate for mounting components, after placing (mounting) the components in the uncured area of ​​the resin laminate, the uncured area is cured (post-cured). This post-curing method is not particularly limited; it can involve irradiating the uncured area with radiation. Thus, as a method for irradiating the uncured area with radiation, besides exposing the uncured area, the same method as the pre-baking exposure used when obtaining the resin laminate can be employed.

[0136] Furthermore, after the uncured area is cured (post-cured), a heat treatment (post-baking) can be performed at 180°C to 250°C for 20 to 100 minutes, if necessary. However, if the heat resistance of the support or other components used in film formation is low, the resin composition can be formulated to allow post-baking at 80°C to 180°C for 30 to 100 minutes, and post-baking can be performed under these conditions. This post-baking process is performed to improve the adhesion between the patterned coating and the support. Similar to pre-baking, it is preferably performed by heating in an oven, on a heating plate, or similar means.

[0137] In this manner, by configuring (installing) the element in the uncured area of ​​the resin laminate and then curing the uncured area, a mounting structure can be obtained, comprising: a cured resin laminate, which is formed by curing the resin layer of the resin laminate; and an element that configures the area where the uncured area of ​​the cured resin layer in the cured resin laminate exists as the mounting area. Furthermore, when using this mounting structure, the cured film on which the support and element are mounted can be peeled off and used as needed. This element will be described later.

[0138] (Installation structure)

[0139] The mounting structure of the present invention includes: a hardened resin laminate, which is formed by hardening the resin layer of the resin laminate of the present invention; and an element that configures the area where the unhardened region of the hardened resin layer in the hardened resin laminate exists as a mounting area.

[0140] Furthermore, components implemented on this mounting structure can include, for example, light-emitting elements (light-emitting diodes, semiconductor lasers, electroluminescence (EL) elements, etc.), light-receiving elements (photodiodes, charge-coupled device (CCD) sensors, metal oxide semiconductor (MOS) sensors, etc.), and electronic components (integrated circuit (IC) chips, etc.). In addition to semiconductor elements (light-emitting elements, light-receiving elements, electron transfer elements, etc.), these components also include piezoelectric elements, thermoelectric elements, optical elements (second harmonic generation elements using nonlinear optical crystals, etc.), dielectric elements (including ferroelectric elements), superconducting elements, and various other components. They can also be tiny parts or components used in various microelectromechanical systems (MEMS) such as optical encoders. There are no particular limitations on the size of the components (chip size), for example, less than 1 mm, less than 300 μm, or less than 100 μm. One or more objects can be mounted on the substrate, as long as their quantity, type, configuration, and spacing are appropriately designed according to the substrate's purpose or function.

[0141] This type of mounting structure can be obtained by configuring elements in the uncured areas of the resin layer of the resin laminate of the present invention as mounting areas, and then curing the uncured areas. This manufacturing method can be the same as the method described in the resin laminate of the present invention. Furthermore, in the present invention, "cured resin laminate" refers to a substance obtained by curing the resin layer of the resin laminate of the present invention, which can be efficiently formed by curing the uncured areas (post-curing: curing can also be achieved by fully exposing the resin layer) (after curing, if necessary, by post-baking the entire resin layer).

[0142] [Example]

[0143] The present invention will now be described in more detail based on embodiments and comparative examples, but the present invention is not limited to the following embodiments.

[0144] (1) First, the abbreviations of the compounds used in Synthesis Example 1 are shown below. In addition, in the synthesis examples, the compounds are referred to by the following abbreviations.

[0145] BPFE: Bisphenol fluorene type epoxy compound (the compound represented by the general formula (5) (where Ar is a compound with a benzene ring), epoxy equivalent 256)

[0146] BPDA: 3,3',4,4'-Biphenyltetracarboxylic acid dianhydride

[0147] THPA: 1,2,3,6-Tetrahydrophthalic anhydride

[0148] TPP: Triphenylphosphine

[0149] AA: Acrylic acid

[0150] PGMEA: Propylene glycol monomethyl ether acetate.

[0151] (2) Next, the following describes the evaluation method for the compound used in Synthesis Example 1, the compound containing polymerizable unsaturated groups obtained in Synthesis Example 1, etc.

[0152] [Determination of solid component concentration]

[0153] Regarding the concentration of solid components, 1g of the compound solution (A) containing polymeric unsaturated groups obtained in Synthesis Example 1 or 1g of the resin composition (B) was immersed in a glass filter [mass: W0(g)] and weighed [mass after immersion: W1(g)]. The mass [W2(g)] after heating at 160°C for 2 hours was determined and calculated using the following formula (I).

[0154] [Concentration of solid components (mass%)] = {(W2-W0) / (W1-W0)} × 100 (I).

[0155] [Determination of epoxy equivalent]

[0156] The epoxy equivalent of BDPF used in Synthesis Example 1 was determined by dissolving BDPF in dioxane, adding a solution of tetraethylammonium bromide in acetic acid, and titrating with a potentiometric titration apparatus "COM-1600" (manufactured by Hiranuma Sangyo Co., Ltd.) using a 1 / 10 N-perchloric acid solution.

[0157] [Determination of acid value]

[0158] The acid value of the compound containing polymeric unsaturated groups obtained in Synthesis Example 1 was determined by dissolving the compound solution (A) containing polymeric unsaturated groups in dioxane, and then titrating it using a potentiometric titration apparatus "COM-1600" (manufactured by Hiranuma Industrial Co., Ltd.) with a 1 / 10 N-KOH aqueous solution.

[0159] [Determination of weight-average molecular weight (Mw)]

[0160] The weight-average molecular weight (Mw) of the compound containing polymerizable unsaturated groups obtained in Synthesis Example 1 was determined using a gel permeation chromatography (GPC) instrument "HLC-8220GPC" (manufactured by Tosoh Corporation, solvent: tetrahydrofuran, columns: TSKgelSuperH-2000 (2 columns) + TSKgelSuperH-3000 (1 column) + TSKgelSuperH-4000 (1 column) + TSKgelSuperH-5000 (1 column) (manufactured by Tosoh Corporation), temperature: 40°C, speed: 0.6 ml / min), and was calculated in the form of a standard polystyrene (PS-oligomer kit manufactured by Tosoh Corporation).

[0161] [Reliability Evaluation]

[0162] Using an evaluation substrate manufactured as described below as a test sample, and a thermal shock testing machine TSB-1L manufactured by TabaiEspec Co., Ltd. as the testing device, a liquid phase immersion test of 250 cycles from -65°C to 125°C (exposure time of 5 minutes each) was conducted. The relationship between the number of cracks generated in the hardened film on the dumbbell-shaped pattern in the evaluation substrate and the number of dumbbell-shaped patterns was determined, thereby determining the reliability of the hardened resin composition (B).

[0163] Reliability = [1 - (Number of cracks / Total number of patterns)] × 100 (%)

[0164] <Preparation of Evaluation Substrate>

[0165] Using a commercially available double-sided copper-clad FR-4 substrate (MCL-E-67 manufactured by Hitachi Chemical Co., Ltd., with 18μm copper wiring thickness), an evaluation pattern depicting 1350 × 4 dumbbell-shaped designs was created. The copper surface was roughened using the Neo Brown Process of Ebara Denko Co., Ltd., to obtain the evaluation substrate. Next, a 20μm thick solution of resin composition (B) was spin-coated onto the evaluation substrate. Subsequently, the obtained coating was heated at 110°C for 10 minutes to remove (dry) the solvent, and then subjected to a 500W high-pressure mercury lamp to achieve 200mJ / cm². 2 The substrate is exposed in an (i-line) manner to photocur it, and then developed with a developer (manufactured by Nippon Steel Chemical & Materials Co., Ltd., trade name V-2590D). It is then post-cured in air at 180°C for 90 minutes to obtain an evaluation substrate with a cured film formed on it.

[0166] [Methods for evaluating resolution]

[0167] A 20 μm thick coating film containing the resin composition (B) was formed. The coating film was then heated at 110°C for 10 minutes to remove (dry) the solvent, and finally subjected to a 500W high-pressure mercury lamp to achieve a flux concentration of 200 mJ / cm². 2 The film was photocured by exposure in an (i-line) manner, and then developed using a developer (manufactured by Nippon Steel Chemicals & Materials Co., Ltd., trade name V-2590D). Finally, it was post-cured at 180°C for 90 minutes under atmospheric conditions to obtain a cured film. In an attempt to form a loop with a film thickness of 20 μm, the minimum line / space width that could form a loop was measured, and the measured value (linewidth) was used as the resolution evaluation.

[0168] [Heat Resistance Evaluation Method]

[0169] As a test sample, a coating film with a thickness of 20 μm containing a solution of resin composition (B) was formed. The coating film was heated at 110°C for 10 minutes to remove (dry) the solvent and obtain a film containing resin composition (B). The glass transition temperature (Tg point) of resin composition (B) was determined using the film by a known dynamic viscoelastic method.

[0170] [Viscosity Measurement]

[0171] As the test sample, a 200 μm thick film containing uncured resin composition (B) was used, obtained by heating (drying) the solvent at 110 °C for 10 minutes after forming a coating containing a solution of resin composition (B). As the test apparatus, a rheometer (manufactured by Anton Paar, trade name "MCR302") was used to measure the viscosity of the resin composition (B) at various temperatures within the temperature range of room temperature (23 °C) to 200 °C under the conditions of a heating rate of 5 °C / min and a load of 7 N (frequency of 1 Hz). Furthermore, when the solution of resin composition (B) is heated at 110°C for more than 10 minutes, even if the heating time is changed (within the range of more than 10 minutes), it can be determined that the obtained dried film contains substantially the same amount of uncured resin composition (B) (it is determined that the solvent is sufficiently removed and the residue is the same). Therefore, the resin composition (B) that forms the uncured area in the embodiments described later can be regarded as the same composition as the composition that forms the test sample.

[0172] (Synthesis example 1)

[0173] <Preparation process of compounds containing polymerizable unsaturated groups>

[0174] In a 250 mL four-necked flask equipped with a reflux condenser, BPFE (46.64 g, 0.09 mol), AA (13.12 g, 0.18 mol), TPP (0.24 g), and PGMEA (40.00 g) were added and stirred at 100 °C–105 °C for 12 hours to obtain the reaction product. Subsequently, PGMEA (20.00 g) was added to adjust the solid content to 50% by mass.

[0175] Subsequently, BPDA (13.45 g, 0.05 mol) and THPA (6.96 g, 0.05 mol) were added to the obtained reaction product, and the mixture was stirred at 115°C to 120°C for 6 hours to obtain a compound solution (A) containing polymerizable unsaturated groups. The solid content concentration of the compound solution (A) obtained in this manner was 57.3% by mass, the acid value (converted from solid content) was 96 mg KOH / g, and the Mw obtained by GPC analysis was 3600. Furthermore, it was clarified that the compound containing polymerizable unsaturated groups in the solution (A) was a compound represented by the general formula (1), depending on its raw materials, etc.

[0176] <Preparation process of solution of resin composition (B)>

[0177] A solution of a polymerizable unsaturated compound containing 60g of polymerizable unsaturated groups (A), 26g of a 6-molar adduct of trimethylolpropane triacrylate ethylene oxide (manufactured by Toa Synthetic Co., Ltd., trade name: Aronix M-360), 12g of tetramethylbiphenyl epoxy resin (manufactured by Shell, trade name: Epikote YX-4000), 0.08g of sensitizer (Mischel ketone), 2g of photopolymerization initiator (manufactured by Ciba-Geigy, trade name: Irgacure 651), and 100g of PGMEA were mixed and dispersed at room temperature (23°C) to obtain a solution of resin composition (B) (solvent: PGMEA, solid content: approximately 50% by mass).

[0178] Furthermore, the resin composition (B) contained in the obtained solution was evaluated using the aforementioned evaluation method, and the resin composition (B) was found to be a substance with a reliability of 100%, a resolution of 20 μm, and a Tg of 200 °C. In addition, the viscosity of the resin composition (B) at various temperatures, measured using a rheometer (the viscosity of the resin composition (B) at various temperatures measured using the method described in the "Viscosity Measurement" section), is as follows.

[0179] <Viscosity of resin composition (B)>

[0180] 40℃: 3000Pa·s

[0181] 50℃: 800Pa·s

[0182] 60℃: 300Pa·s

[0183] 70℃: 120Pa·s

[0184] 80℃: 50Pa·s

[0185] 90℃: 20Pa·s

[0186] 100℃: 10Pa·s

[0187] 110℃: 6Pa·s

[0188] 120℃: 4Pa·s

[0189] 130℃: 2Pa·s

[0190] 140℃: 2Pa·s

[0191] 150℃: 100Pa·s

[0192] 160℃: 1500Pa·s

[0193] 170℃: 30000Pa·s

[0194] 180℃: 80000Pa·s

[0195] 200℃: 80000Pa·s.

[0196] (Example 1)

[0197] <Installation Experiment 1-1>

[0198] Using a glass substrate as a support, an aluminum substrate measuring 10mm in length, 10mm in width, and 20μm in thickness is mounted as a mounting element in the mounting area on the glass substrate.

[0199] When mounting this type of mount, firstly, a frame shape serving as the non-mounting area is formed on a glass substrate. This frame shape is designed with an internal planar shape of a square with a length of 15 mm and a width of 15 mm, and a depth (height) of 750 μm. Then, a solution of the resin composition (B) obtained in Synthesis Example 1 is allowed to flow into the internal space of this frame shape (a space with a length of 15 mm, a width of 15 mm, and a height of 750 μm), and the solvent is removed by heating at 100°C for 30 minutes, forming an uncured area containing the uncured resin composition (B) and having a planar shape of a square (geometry) with a length of 15 mm and a width of 15 mm. Furthermore, when mounting the mount, this uncured area is used as the mounting area. In addition, an aluminum substrate with a length of 10 mm × a width of 10 mm × a thickness of 20 μm is prepared as the mount.

[0200] Next, in the mounting area (the unhardened area) of the 15mm × 15mm square (planar shape) formed on the glass substrate, the mount (a 10mm × 10mm square aluminum substrate) is embedded (mounted). Shortly after being mounted in this manner, the center of the mount deviates from the center of the square of the mounting area (frame type), and the edges of the mount are not parallel to the edges of the mounting area; the mount is positioned in an angularly offset state.

[0201] Next, the glass substrate on which the mounting element is disposed in the mounting area is heated to 80°C. Furthermore, this heating reduces the viscosity of the resin composition in the mounting area to a value in the range of 100 Pa·s to 1 Pa·s (the viscosity of resin composition (B) at 80°C is 50 Pa·s), thereby significantly increasing the fluidity of the resin composition in the mounting area. Additionally, this heating to 80°C causes the mounting element (a square aluminum substrate) disposed in the mounting area to move naturally towards the center of the mounting area and to begin rotating naturally and slowly. Moreover, after one minute from the start of heating to 80°C, the mounting element is positioned such that its center is located at the center of the mounting area, and the sides of the square mounting area are parallel to the sides of the mounting element (the square aluminum substrate), at which point the movement of the mounting element stops. Subsequently, the resin composition (B) in the mounting area is fully exposed to ultraviolet light to fully harden the mounting area. In this way, the mount (a square aluminum substrate) is firmly fixed to the mounting area, thereby mounting the mount on the mounting area of ​​the glass substrate.

[0202] Based on the results of this installation experiment 1-1, it is evident that by simply heating to the installation temperature (80°C in this experiment), the viscosity of the resin composition within the installation area can be reduced to below 100 Pa·s. Furthermore, the mounted component naturally moves to the desired installation position (designed with the center of the installation area as the installation position) and is installed efficiently with high positional accuracy. Moreover, the mounted component can naturally rotate so that its orientation corresponds to the shape of the installation area. Additionally, it is shown that because rotation can be achieved naturally through heating alone, aligning the mounted component's orientation with the shape of the installation area, even with multiple installation areas, the mounted component can be spontaneously aligned (self-aligned) for installation.

[0203] <Installation Experiment 1-2>

[0204] Within a temperature range of 60°C to 150°C, the heating temperature was varied from 80°C, and the same experiment as Installation Experiment 1-1 (Installation Experiment 1-2) was conducted. It was confirmed that the movement of the mounting component changes with temperature (the length of time it takes for the mounting component to be positioned in the target direction to reach the target installation position). Through this Installation Experiment 1-2, it was confirmed that the mounting component (a square aluminum substrate) can be installed with high positional accuracy and high precision in alignment with the shape corresponding to the installation area within a temperature range of 80°C to 110°C. Furthermore, the viscosity of the resin composition (B) within the temperature range of 80°C to 110°C is consistently below 100 Pa·s, and the fluidity of the resin composition within the installation area is sufficiently improved within this temperature range.

[0205] (Example 2)

[0206] <Installation Experiment 2-1>

[0207] A silicon chip measuring 5mm in length, 5mm in width, and 0.1mm in thickness is mounted on the mounting area of ​​the glass substrate as a carrier.

[0208] When mounting this type of mount, firstly, a glass substrate is used as a support. A solution of the resin composition (B) obtained in Synthesis Example 1 is coated onto the glass substrate to form a coating film with a thickness of 25 μm. The coating film is then heated at 110°C for 15 minutes to remove (dry) the solvent. In order to prevent light from irradiating a square area with a length of 10 mm and a width of 10 mm on the surface of the coating film, a spacer mask is used to expose the coating film from the support side. This forms a hardened area containing the hardened resin composition (B) and an unhardened area containing the unhardened resin composition (B) with a planar shape of 10 mm in length and 10 mm in width, which is formed in a manner surrounded by the hardened area. Thus, a resin layer having the hardened area and the unhardened area is formed on the glass substrate. Then, in the resin layer on this glass substrate, a hardened area containing the resin composition (B) is used as the non-mounting area of ​​the mount, and an unhardened area with a planar shape of 10 mm in length and 10 mm in width is used as the mounting area of ​​the mount. A square silicon chip with a length of 5 mm × width of 5 mm × thickness of 0.1 mm is embedded in this mounting area (the unhardened area). Shortly after being positioned in this manner, the center of the silicon chip (square) is offset from the center of the mounting area (square), and the edges of the silicon chip are not parallel to the edges of the mounting area; the mount is positioned with an angular offset.

[0209] Next, the glass substrate on which the mount is disposed in the mounting area is heated to 80°C. Furthermore, this heating reduces the viscosity of the uncured resin composition (B) in the mounting area to below 100 Pa·s (the viscosity of resin composition (B) at 80°C is 50 Pa·s), thereby significantly increasing the fluidity of the resin composition in the mounting area. Additionally, this heating to 80°C causes the silicon chip disposed in the mounting area to naturally move towards the center of the mounting area and to slowly begin rotating. After one minute from the start of heating to 80°C, the silicon chip is positioned such that its center (square) is located at the center of the mounting area (square), and the edges of the mounting area are parallel to the edges of the silicon chip; in this state, the movement of the silicon chip stops. Subsequently, the resin composition (B) in the mounting area is fully exposed to ultraviolet light to fully cure the mounting area. Thus, the silicon chip is securely fixed to the mounting area, thereby mounting the mount onto the mounting area of ​​the glass substrate.

[0210] According to this installation experiment 2-1, it is evident that by simply heating to the installation temperature (80°C), the viscosity of the resin composition within the installation area can be reduced to below 100 Pa·s. Furthermore, the mounted component naturally moves to the desired installation position (the center of the installation area) and is installed efficiently with high positional accuracy. Moreover, the mounted component can naturally rotate so that its orientation corresponds to the shape of the installation area. Additionally, it is shown that because rotation can be achieved naturally through heating alone, aligning the mounted component's orientation with the shape of the installation area, even when multiple installation areas are provided, the mounted component can be self-aligned (self-aligned) for installation.

[0211] Furthermore, based on the results of installation experiments 2-1 and 1-1, it can be seen that regardless of the type of mounting material, by keeping the viscosity of the resin composition in the mounting area below 100 Pa·s at the installation temperature (80°C in this experiment), the mounting material can be moved naturally toward the desired position and orientation, thereby efficiently manufacturing the desired mounting structure.

[0212] <Installation Experiment 2-2>

[0213] Within a temperature range of 60°C to 150°C, the heating temperature was varied from 80°C, and the same experiment as Installation Experiment 2-1 (Installation Experiment 2-2) was conducted. It was confirmed that the movement of the mount (silicon chip) changed with temperature (the length of time it takes for the mount to be positioned in the target direction to reach the target mounting position). Through this Installation Experiment 2-2, it was confirmed that the mount can be installed with high positional accuracy and high precision in the orientation corresponding to the shape of the mounting area within a temperature range of 80°C to 110°C. Furthermore, the viscosity of the resin composition (B) within the temperature range of 80°C to 110°C is consistently below 100 Pa·s, and the fluidity of the resin composition within the mounting area is sufficiently improved within this temperature range.

[0214] [Industry availability]

[0215] As explained above, according to the present invention, a resin laminate and a mounting structure obtained using the resin laminate can be provided. When used as a substrate for mounting components, the resin laminate enables the components to be moved to the desired mounting position with high positional accuracy and efficiently configured, and also enables the components to be rotated toward the desired orientation with good accuracy and efficiently configured. Therefore, the resin laminate of the present invention is useful as a substrate for mounting components such as semiconductor components.

Claims

1. A resin laminate, comprising a support and a resin layer laminated on the support, characterized in that, The resin layer has: an uncured region comprising a resin composition that is cured by heat or light; and the hardened area, comprising the hardened portion of the resin composition. In the resin layer, the uncured areas are surrounded by a cured portion of the resin composition to prevent the uncured resin composition from migrating along the planar direction from the uncured areas. The unhardened area has a geometric shape in planar shape, and The viscosity of the resin composition in the uncured region is less than 100 Pa·s at any temperature within the temperature range of 60°C to 150°C. The resin composition contains a compound having polymerizable unsaturated groups and a fluorene skeleton.

2. The resin laminate according to claim 1, characterized in that, The unhardened area is the area used to install components.

3. The resin laminate according to claim 1 or 2, characterized in that, The planar shape of the unhardened area is selected from at least one shape chosen from the group consisting of circles, ellipses, and polygons.

4. An installation structure, comprising: A hardened resin laminate, which is formed by hardening the resin layer of a resin laminate as described in any one of claims 1 to 3; as well as The component is configured with the uncured area of ​​the cured resin layer in the cured resin laminate as the mounting area.

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