A multi-stage lifting mechanism for semiconductor wafer transmission system

Abstract

The present invention relates to the technical field of mechanical manufacturing, and discloses a multi-stage lifting mechanism for a semiconductor wafer transmission system, comprising a plurality of lifting units connected in series up and down, each of which comprises a driving mechanism, the driving mechanism adopts a synchronous belt transmission structure, one end of which is connected to a primary lifting mechanism, and the other end is connected to a secondary lifting mechanism, the driving mechanism is used to simultaneously drive the primary lifting mechanism and the secondary lifting mechanism to move up and down, thereby driving the entire secondary lifting mechanism to move up and down along the primary lifting mechanism, and then driving the lifting unit at the upper end of two adjacent lifting units to move up and down along the secondary lifting mechanism. The entire device has a simple structure, simple assembly, low maintenance difficulty, and is easy to promote and apply.

Description

Technical Field

[0001] The present invention relates to the technical field of mechanical manufacturing, and in particular to a multi-stage lifting mechanism for a semiconductor wafer transmission system. Background Art

[0002] Semiconductor wafer handling equipment is mostly used in sports occasions with high cleanliness and high positioning accuracy, and the robot is limited to a narrow space and has high requirements for the travel of the lifting axis. The existing technology is relatively mature for simple lifting devices. In terms of the driving method used, there are cylinders, motors, hydraulics, etc., and their specific mechanical transmission structures are also diverse. However, in multi-stage lifting schemes, if only the drive unit is simply added, the economic benefits of the device are poor, and the accuracy is difficult to guarantee; if only the mechanical transmission structure is increased, such as increasing the number of pulleys or gears, it cannot be used in heavy-load occasions, and the transmission is complex, which is easy to cause accumulated errors and the control accuracy is not high. Summary of the invention

[0003] The present invention provides a multi-stage lifting mechanism for a semiconductor wafer transmission system. Each lifting unit uses only a single driving element, which is economical. Although two-stage lifting can be achieved, multi-stage transmission is not used in the device, and the system responsiveness is good.

[0004] The present invention can be achieved through the following technical solutions:

[0005] A multi-stage lifting mechanism for a semiconductor wafer transmission system includes a plurality of lifting units connected in series in sequence from top to bottom, each of the lifting units includes a driving mechanism, the driving mechanism adopts a synchronous belt transmission structure, one end of the driving mechanism is connected to a primary lifting mechanism, and the other end is connected to a secondary lifting mechanism, the driving mechanism is used to simultaneously drive the primary lifting mechanism and the secondary lifting mechanism to move up and down, thereby driving the entire secondary lifting mechanism to move up and down along the primary lifting mechanism, and then driving the upper lifting unit of two adjacent lifting units to move up and down along the secondary lifting mechanism.

[0006] Furthermore, the first-level lifting mechanism and the second-level lifting mechanism both adopt a ball screw structure, two first-level slide rails are arranged parallel to the screw rod in the first-level lifting mechanism, and two second-level slide rails are arranged parallel to the screw rod in the second-level lifting mechanism.

[0007] A mounting plate is arranged on the two primary slide rails, a driving mechanism and a secondary lifting mechanism are arranged on the mounting plate, and a lifting unit at the upper end of two adjacent lifting units is arranged on the two secondary slide rails.

[0008] One end of the driving mechanism is connected to the nut of the primary lifting mechanism, and the other end is connected to one end of the screw rod in the secondary lifting mechanism, so as to drive the mounting plate to move up and down along the two primary slide rails, and at the same time drive the upper lifting unit of the two adjacent lifting units to move up and down along the two secondary slide rails.

[0009] Furthermore, the driving mechanism comprises an electric motor, and a primary driving wheel and a secondary driving wheel are mounted on the output shaft of the electric motor.

[0010] The primary driving wheel is connected to the primary driven wheel through a primary synchronous belt, the primary driven wheel is arranged on a nut of a primary lifting mechanism, the secondary driving wheel is connected to the secondary driven wheel through a secondary synchronous belt, and the secondary driven wheel is arranged at one end of a screw rod in the secondary lifting mechanism.

[0011] Furthermore, the primary driven wheel is sleeved on the nut of the primary lifting mechanism, and the two are tightly matched;

[0012] The secondary driven wheel is sleeved on the screw rod of the secondary lifting mechanism, and the two are tightly matched.

[0013] Furthermore, the mounting plate adopts an L-shaped structure, one side of which is arranged on the nut of the primary lifting mechanism and on the primary slide rail through the primary slider, and the other side is connected to the base plate of the secondary lifting mechanism, and the base plate is used to support the installation of the entire secondary lifting mechanism.

[0014] Furthermore, the upper lifting unit among two adjacent lifting units is arranged on the nut of the secondary lifting mechanism and on the secondary slide rail through the secondary sliding block.

[0015] The beneficial technical effects of the present invention are:

[0016] The driving mechanism of the entire lifting unit is only an electric motor. By controlling the rotation speed of the electric motor, the movement accuracy of the primary lifting mechanism and the secondary lifting mechanism can be directly controlled. With a multi-stage cylinder driving mechanism, the lifting unit of the present invention can realize stepless adjustment lifting control. With a multi-stage gear transmission mechanism, the lifting unit of the present invention can withstand a larger load, has a stronger driving ability and a higher movement accuracy. At the same time, a primary slide rail and a secondary slide rail are added to further ensure the movement guidance and movement accuracy. In addition, the entire device has a simple structure, simple assembly, low maintenance difficulty, and is easy to promote and apply. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The overall structure of the lifting unit of the present invention is shown in FIG. Figure 1 ;

[0018] Figure 2 The overall structure of the lifting unit of the present invention is shown in FIG. Figure 2 ;

[0019] Figure 3 It is a schematic diagram of the state when the two-stage lifting mechanism of the lifting unit of the present invention is unfolded;

[0020] Figure 4 It is a schematic diagram of the state when the two-stage lifting mechanism of the lifting unit of the present invention is retracted;

[0021] Among them, 1-first-level lifting mechanism, 2-second-level lifting mechanism, 3-first-level slide rail, 4-second-level slide rail, 5-mounting plate, 6-base plate, 7-motor, 8-first-level synchronous belt, 9-second-level synchronous belt. DETAILED DESCRIPTION

[0022] The specific implementation of the present invention is described in detail below with reference to the accompanying drawings and preferred embodiments.

[0023] like Figure 1-4 As shown, the present invention provides a multi-stage lifting mechanism for a semiconductor wafer transmission system, including a plurality of lifting units connected in series up and down, each lifting unit including a driving mechanism, the driving mechanism adopts a synchronous belt transmission structure, one end of which is connected to the primary lifting mechanism, and the other end is connected to the secondary lifting mechanism, the driving mechanism is used to simultaneously drive the primary lifting mechanism and the secondary lifting mechanism to move up and down, thereby driving the entire secondary lifting mechanism to move up and down along the primary lifting mechanism, and then driving the lifting unit at the upper end of the two adjacent lifting units to move up and down along the secondary lifting mechanism. The number of lifting units can be set according to actual needs, and each lifting unit is a two-stage lifting structure. If the actual handling equipment only needs a two-stage lifting structure, the lifting unit at the upper end of the two adjacent lifting units can be replaced with a final consignment platform such as an Arm-type manipulator, a Slide manipulator, etc., so that the entire lifting unit only needs one driving mechanism, which reduces the accumulation of multi-stage transmission errors and facilitates the improvement of the overall control accuracy. At the same time, the entire lifting unit has a simple structure, simple assembly, low maintenance difficulty, and is easy to promote and apply.

[0024] Specifically, Figure 1 , 2 As shown, the primary lifting mechanism 1 and the secondary lifting mechanism 2 both adopt a ball screw structure, two primary slide rails 3 are arranged in parallel with the screw in the primary lifting mechanism 1, and two secondary slide rails 4 are arranged in parallel with the screw in the secondary lifting mechanism 2, which are arranged on both sides of the screw, and a mounting plate 5 is arranged on the two primary slide rails 3, and a driving mechanism and a secondary lifting mechanism 2 are arranged on the mounting plate 5. The mounting plate 5 can be an L-shaped structure, one side of which can be mounted on the primary slide rail 3 through a primary slider, and is also connected to the nut of the primary lifting mechanism 1, so that the mounting plate can move along the primary slide rail 3 driven by the nut of the primary lifting mechanism 1, so as to facilitate the entire driving mechanism and the secondary lifting mechanism 2 to move up and down along the primary lifting mechanism 1;

[0025] The other side of the mounting plate 5 is connected to the base plate 6 of the secondary lifting mechanism 2, and the base plate 6 is used to support the installation of the entire secondary lifting mechanism 2, that is, the two secondary slide rails 4 and the ball screw are arranged on the base plate 6, and the upper lifting unit of the two adjacent lifting units is arranged on the two secondary slide rails 4 through the secondary slider. At the same time, the upper lifting unit of the two adjacent lifting units is also connected to the nut of the secondary lifting mechanism 2, so that the upper lifting unit of the two adjacent lifting units can move along the secondary slide rail driven by the nut in the secondary lifting mechanism 2.

[0026] One end of the driving mechanism is connected to the nut of the primary lifting mechanism 1, and the other end is connected to one end of the screw in the secondary lifting mechanism 2, which may specifically include an electric motor 7, on the output shaft of which a primary driving wheel and a secondary driving wheel are mounted, the primary driving wheel is connected to the primary driven wheel via a primary synchronous belt 8, the primary driven wheel is arranged on the nut of the primary lifting mechanism 1, and a set assembly can be adopted, and the two are tightly matched; the secondary driving wheel is connected to the secondary driven wheel via a secondary synchronous belt 9, the secondary driven wheel is arranged at one end of the screw in the secondary lifting mechanism 2, and a set assembly can also be adopted. The two are also tightly matched, so that under the drive of the motor 7, the primary driving wheel and the secondary driving wheel rotate at the same time, and the primary driven wheel and the secondary driven wheel are driven to rotate respectively through the primary synchronous belt 8 and the secondary synchronous belt 9, so that the corresponding nut is driven by the primary driven wheel together with the mounting plate thereon to move up and down along the two primary slide rails 3, and at the same time, the secondary driven wheel drives the lead screw of the secondary lifting mechanism 2 to rotate, thereby driving the corresponding nut together with the lifting unit at the upper end of the two adjacent lifting units thereon to move up and down along the two secondary slide rails 4, so as to realize the final multi-stage lifting movement, such as Figure 3 , 4 shown.

[0027] In summary, the driving mechanism of the entire lifting unit is only an electric motor. The movement accuracy of the first-level lifting mechanism and the second-level lifting mechanism can be directly controlled by controlling the rotation speed of the electric motor. With a multi-level cylinder driving mechanism, the lifting unit of the present invention can realize stepless adjustment lifting control. It adopts a synchronous belt transmission mechanism combined with a ball screw structure and a multi-level gear transmission mechanism. The lifting unit of the present invention can withstand a larger load, has a stronger driving ability, and has a higher movement accuracy. It is more suitable for the actual working conditions of semiconductor wafer handling equipment. At the same time, a first-level slide rail and a second-level slide rail are added to further ensure the movement guidance and movement accuracy. In addition, the entire device has a simple structure, simple assembly, low maintenance difficulty, and is easy to promote and apply.

[0028] Although specific embodiments of the present invention are described above, those skilled in the art should understand that these are merely examples and that various changes or modifications may be made to these embodiments without departing from the principles and essence of the present invention. Therefore, the scope of protection of the present invention is limited by the appended claims.

Claims

1. A multi-stage lifting mechanism for a semiconductor wafer transmission system, characterized in that: It comprises a plurality of lifting units connected in series up and down, each of which comprises a driving mechanism, which adopts a synchronous belt transmission structure, one end of which is connected to the primary lifting mechanism, and the other end of which is connected to the secondary lifting mechanism, and the driving mechanism is used to simultaneously drive the primary lifting mechanism and the secondary lifting mechanism to move up and down, thereby driving the entire secondary lifting mechanism to move up and down along the primary lifting mechanism, and further driving the upper lifting unit of two adjacent lifting units to move up and down along the secondary lifting mechanism; The first-level lifting mechanism and the second-level lifting mechanism both adopt a ball screw structure, two first-level slide rails are arranged in parallel with the screw rod in the first-level lifting mechanism, and two second-level slide rails are arranged in parallel with the screw rod in the second-level lifting mechanism, a mounting plate is arranged on the two first-level slide rails, a driving mechanism and a second-level lifting mechanism are arranged on the mounting plate, and a lifting unit at the upper end of two adjacent lifting units is arranged on the two second-level slide rails, one end of the driving mechanism is connected to the nut of the first-level lifting mechanism, and the other end is connected to one end of the screw rod in the second-level lifting mechanism, so as to drive the mounting plate to move up and down along the two first-level slide rails, and at the same time drive the lifting unit at the upper end of two adjacent lifting units to move up and down along the two second-level slide rails; The driving mechanism comprises an electric motor, a primary driving wheel and a secondary driving wheel are mounted on the output shaft of the electric motor, the primary driving wheel is connected to the primary driven wheel via a primary synchronous belt, the primary driven wheel is arranged on a nut of the primary lifting mechanism, the secondary driving wheel is connected to the secondary driven wheel via a secondary synchronous belt, and the secondary driven wheel is arranged at one end of a screw rod in the secondary lifting mechanism; The primary driven wheel is sleeved on the nut of the primary lifting mechanism, and the two are tightly matched; The secondary driven wheel is sleeved on the screw rod of the secondary lifting mechanism, and the two are tightly matched; The mounting plate adopts an L-shaped structure, one side of which is arranged on the nut of the primary lifting mechanism and on the primary slide rail through the primary slider, and the other side is connected to the base plate of the secondary lifting mechanism. The base plate is used to support the installation of the entire secondary lifting mechanism.

2. The multi-stage lifting mechanism for a semiconductor wafer transfer system according to claim 1, characterized in that: The upper lifting unit among two adjacent lifting units is arranged on the nut of the secondary lifting mechanism and on the secondary slide rail through the secondary sliding block.

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