Electronic devices

Abstract

An electronic device is disclosed, comprising: a window; a display panel disposed below the window; a support member disposed below the display panel; a cover layer disposed below the support member; and an adhesive layer disposed between the support member and the cover layer. Each of the adhesive layer and the cover layer comprises a light-shielding material.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0146725, filed on November 5, 2020, with the Korean Intellectual Property Office (KIPO), the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] The embodiments of this disclosure described herein relate to an electronic device, and more specifically, to an electronic device capable of improving display efficiency and shock resistance by preventing external light incidence. Background Technology

[0004] Electronic devices include active regions that are activated in response to electrical signals. These devices can sense externally applied inputs through the active regions and can simultaneously display various images to provide information to the user. Recently, with the development of electronic devices of various shapes, active regions with diverse shapes have been realized. Summary of the Invention

[0005] Embodiments of this disclosure provide an electronic device that can improve display efficiency and shock resistance by preventing external light from entering.

[0006] According to an embodiment, an electronic device may include: a window; a display panel disposed below the window; a support member disposed below the display panel; a cover layer disposed below the support member; and an adhesive layer disposed between the support member and the cover layer. Each of the adhesive layer and the cover layer includes a light-shielding material.

[0007] The support member may include a plate having metal, and the cover layer may be attached to the lower portion of the plate by the adhesive layer.

[0008] The plate may include a first non-folded region, a folded region, and a second non-folded region arranged in a first direction, and the plate may also include a plurality of openings that overlap with the folded region in a plan view.

[0009] In a plan view, the covering layer may overlap with the folded area of ​​the plate.

[0010] In a plan view, the adhesive layer may overlap with the folded area of ​​the board.

[0011] The light-shielding material included in each of the cover layer and the adhesive layer may include reactive carbon black.

[0012] The covering layer may further include a covering matrix material, which includes silicone resin, polyurethane resin or thermoplastic polyurethane resin, and the first functional group included in the light-shielding material and the second functional group included in the covering matrix material may be chemically bonded.

[0013] The adhesive layer may further include an adhesive matrix material, which includes an acrylic resin, and the first functional group included in the light-shielding material and the third functional group included in the adhesive matrix material may be chemically bonded.

[0014] The electronic device according to an embodiment of the present disclosure further includes: a light-shielding layer disposed on the support member.

[0015] The electronic device according to embodiments of the present disclosure may further include: a lower protective film disposed below the display panel, and an additional adhesive layer disposed between the lower protective film and the light-shielding layer, wherein the additional adhesive layer may contact the lower protective film and the light-shielding layer.

[0016] The covering layer may include a first light-shielding material, the light-shielding layer may include a second light-shielding material, and the first light-shielding material and the second light-shielding material may be different from each other.

[0017] The electronic device according to embodiments of the present disclosure may further include: a buffer member disposed between the support member and the display panel.

[0018] The adhesive layer can contact the lower surface of the support member and the upper surface of the cover layer.

[0019] The electronic device according to embodiments of the present disclosure may further include: a lower support member disposed below the cover layer.

[0020] The covering layer can be a flexible membrane.

[0021] An electronic device may include: a display panel having an unfolded first state or a folded second state; a support member disposed beneath the display panel, including a first non-folded region, a folded region, and a second non-folded region arranged in a first direction, the support member further including a plurality of openings overlapping the folded regions in a plane; a cover layer disposed beneath the support member and overlapping at least the folded regions in a plan view; and an adhesive layer disposed between the support member and the cover layer. Each of the cover layer and the adhesive layer may include a light-shielding material.

[0022] The light-shielding material included in each of the cover layer and the adhesive layer may include reactive carbon black.

[0023] The cover layer may further include a cover matrix material, and the adhesive layer further includes an adhesive matrix material. In the cover layer, the light-shielding material is chemically bonded to the cover matrix material, and in the adhesive layer, the light-shielding material is chemically bonded to the adhesive matrix material.

[0024] According to an embodiment, an electronic device includes: a window; a display panel disposed below the window; a metal plate disposed below the display panel; a light-shielding layer disposed directly on the metal plate; a cover layer disposed below the metal plate; and an adhesive layer disposed between the metal plate and the cover layer. Each of the adhesive layer and the cover layer includes a light-shielding material.

[0025] The metal plate may include a first non-folded region, a folded region, and a second non-folded region arranged in a first direction, and the metal plate further includes a plurality of openings that overlap with the folded region in a plan view. In the plan view, the covering layer may overlap at least with the folded region. Attached Figure Description

[0026] The above and other objects and features of this disclosure will become apparent from the detailed description of embodiments thereof with reference to the accompanying drawings, in which:

[0027] Figure 1A This is a schematic perspective view of an electronic device in an unfolded state according to an embodiment of the present disclosure;

[0028] Figure 1B This is a schematic perspective view of an electronic device in a folded state according to an embodiment of the present disclosure;

[0029] Figures 2A to 2D This is a schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure;

[0030] Figure 3 This is a schematic cross-sectional view of a display panel according to an embodiment of the present disclosure;

[0031] Figure 4 This is a schematic perspective view of some components included in an electronic device according to embodiments of the present disclosure;

[0032] Figure 5A The bonding relationships between materials in a cover layer included in an electronic device according to embodiments of the present disclosure are illustrated schematically.

[0033] Figure 5B The bonding relationship between materials in an adhesive layer included in an electronic device according to embodiments of the present disclosure is illustrated schematically.

[0034] Figure 6AThese are captured images of the light-shielding characteristics evaluation results of an electronic device according to embodiments of the present disclosure; and

[0035] Figure 6B and Figure 6C These are captured images of the evaluation results of the light-shielding characteristics of electronic devices based on comparative examples. Detailed Implementation

[0036] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0037] In the specification, when a component (or region, layer, or part, etc.) is referred to as being "on", "connected to", or "coupled to" another component (or region, layer, or part, etc.), it should be understood that the former may be directly on, directly connected to, or directly coupled to the latter, and may also be on, connected to, or coupled to the latter via a third intermediary component (or region, layer, or part, etc.).

[0038] The same reference numerals refer to the same components. Additionally, in the drawings, for the sake of clarity in describing the technical content, the thickness, proportions, and dimensions of components may be exaggerated. The term "and / or" includes a combination of one or more of the associated listed items.

[0039] The terms “first,” “second,” etc., are used to describe various components, but these components are not limited by these terms. These terms are used only to distinguish one component from another. For example, a first component may be referred to as a second component without departing from the spirit or scope of this disclosure, and vice versa. Unless otherwise stated, the singular form includes the plural form.

[0040] Additionally, the terms "below," "under," "on," and "above" are used to describe the relationships between the components shown in the accompanying drawings. These terms are relative and are described with reference to the directions indicated in the drawings.

[0041] It will be understood that the terms “comprising,” “including,” “having,” etc., indicate the presence of the features, quantities, steps, operations, elements or components or combinations thereof described in the specification, but do not exclude the presence or additional possibility of one or more other features, quantities, steps, operations, elements or components or combinations thereof.

[0042] In the specification, the term "direct setting" can mean that there is no layer, membrane, zone, or plate added between one part and another. For example, the term "direct setting" can mean "setting" between two layers or two components without the use of additional components such as adhesive components.

[0043] For the purposes of its meaning and interpretation, the phrase “at least one of…” is intended to include the meaning of “at least one selected from the group of…”. For example, “at least one of A and B” can be understood as “A, B, or A and B”.

[0044] Unless otherwise defined or implied herein, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that, unless expressly defined herein, terms such as those defined in a general dictionary should be interpreted as having a meaning consistent with their context in the relevant field and their meaning in this disclosure, and should not be interpreted in an idealized or overly formal sense.

[0045] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0046] Figure 1A This is a schematic perspective view of an electronic device in an unfolded state according to an embodiment of the present disclosure. Figure 1B This is a schematic perspective view of an electronic device in a folded state according to an embodiment of the present disclosure. Figure 1A The diagram shows the electronic device 1000 in its deployed state, and Figure 1B The electronic device 1000 is shown in a folded state.

[0047] refer to Figure 1A and Figure 1B The electronic device 1000 can be a device that is activated in response to an electrical signal. For example, the electronic device 1000 can be a mobile phone, a tablet computer, a car navigation system, a game console, or a wearable device, but is not limited thereto. Figure 1A The electronic device 1000 shown is, for example, a mobile phone.

[0048] The electronic device 1000 can display images through an active region 1000A. When the electronic device 1000 is deployed, the active region 1000A may include a plane defined by a first direction DR1 and a second direction DR2. The thickness direction of the electronic device 1000 may be parallel to a third direction DR3 that intersects with the first direction DR1 and the second direction DR2. Therefore, the front surface (or upper surface) and rear surface (or lower surface) of each of the components constituting the electronic device 1000 may be defined relative to the third direction DR3.

[0049] The active region 1000A may include a first region 1000A1, a second region 1000A2, and a third region 1000A3. The second region 1000A2 may be bent about a folding axis FX extending in the second direction DR2. Therefore, the first region 1000A1 and the third region 1000A3 may be referred to as non-folding regions; for example, the first region 1000A1 may be referred to as the first non-folding region, the third region 1000A3 may be referred to as the second non-folding region, and the second region 1000A2 may be referred to as the folding region.

[0050] When the electronic device 1000 is folded, the first region 1000A1 and the third region 1000A3 can face each other. Therefore, in the fully folded state, the active region 1000A can be concealed from the outside, and this can be described as folding inward. However, this is only an embodiment, and the operation of the electronic device 1000 is not limited to this.

[0051] For example, in an embodiment, when the electronic device 1000 is folded, the first region 1000A1 and the third region 1000A3 may be opposite each other (or may be facing each other). Therefore, in the folded state, the active region 1000A may be exposed to the outside, and this may be referred to as outward folding.

[0052] Electronic device 1000 may perform only one of the inward folding operation or the outward folding operation. As another example, electronic device 1000 may perform both inward folding and outward folding operations. The same area of ​​electronic device 1000, such as the second area 1000A2, may be folded inward and outward. As another example, one area of ​​electronic device 1000 may be folded inward, and another area of ​​electronic device 1000 may be folded outward.

[0053] Figure 1A and Figure 1B One folded region and two non-folded regions are shown as an example, but the number of folded regions and non-folded regions is not limited thereto. For example, electronic device 1000 may include more than two non-folded regions and folded regions respectively disposed between adjacent non-folded regions.

[0054] Figure 1A and Figure 1B The folding axis FX is shown as parallel to the minor axis of the electronic device 1000 as an example, but this disclosure is not limited thereto. For example, the folding axis FX may extend along the major axis of the electronic device 1000, for example, it may extend in a direction parallel to the first direction DR1. In this case, the first region 1000A1, the second region 1000A2, and the third region 1000A3 may be arranged sequentially in the second direction DR2.

[0055] The sensing areas 100SA1, 100SA2, and 100SA3 can be defined within the electronic device 1000. Figure 1A Three sensing regions 100SA1, 100SA2, and 100SA3 are shown as examples, but the number of sensing regions 100SA1, 100SA2, and 100SA3 is not limited to this.

[0056] The sensing regions 100SA1, 100SA2, and 100SA3 may include a first sensing region 100SA1, a second sensing region 100SA2, and a third sensing region 100SA3. For example, the first sensing region 100SA1 may overlap with the camera module, and the second sensing region 100SA2 and the third sensing region 100SA3 may overlap with the proximity illuminance sensor, but this disclosure is not limited thereto.

[0057] Each of the electronic modules can receive external input transmitted through the first sensing area 100SA1, the second sensing area 100SA2, or the third sensing area 100SA3, and can provide output through the first sensing area 100SA1, the second sensing area 100SA2, or the third sensing area 100SA3.

[0058] A first sensing area 100SA1 may be surrounded by an active area 1000A, and a second sensing area 100SA2 and a third sensing area 100SA3 may be included within the active area 1000A. For example, the second sensing area 100SA2 and the third sensing area 100SA3 may display an image. The transmittance of each of the first sensing area 100SA1, the second sensing area 100SA2, and the third sensing area 100SA3 may be higher than the transmittance of the active area 1000A. Furthermore, the transmittance of the first sensing area 100SA1 may be higher than the transmittance of the second sensing area 100SA2 and the third sensing area 100SA3, respectively.

[0059] According to an embodiment, some of the electronic modules may overlap with the active region 1000A, and other electronic modules may be surrounded by the active region 1000A. Therefore, it is not necessary to provide an area for the electronic modules within the peripheral region 1000NA surrounding the active region 1000A. As a result, the area ratio of the active region 1000A to the entire area of ​​the electronic device 1000 can be increased.

[0060] Figures 2A to 2D This is a schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure. Figures 2A to 2D It is along Figure 1A A schematic cross-sectional view of an electronic device taken by line I-I'. Figure 3 This is a schematic cross-sectional view of a display panel according to an embodiment of the present disclosure.

[0061] refer to Figure 2A The electronic device 1000 may include a display panel 100, an upper functional layer, and a lower functional layer.

[0062] refer to Figure 3 The display panel 100 can be configured to generate images and sense input applied from the outside. For example, the display panel 100 may include a display layer 110 and a sensor layer 120. The thickness of the display panel 100 can be from about 25 micrometers to about 35 micrometers, such as 30 micrometers, and the thickness of the display panel 100 is not limited thereto.

[0063] Display layer 110 can be a configuration used to actually generate an image. Display layer 110 can be an emitting display layer, and, for example, display layer 110 can be an organic light-emitting display layer, a quantum dot display layer, or a micro LED display layer.

[0064] The display layer 110 may include a substrate layer 111, a circuit layer 112, a light-emitting element layer 113, and an encapsulation layer 114.

[0065] The substrate layer 111 may include a synthetic resin film. The synthetic resin film may include a thermosetting resin. The substrate layer 111 may have a multilayer structure. For example, the substrate layer 111 may have a three-layer structure consisting of a synthetic resin film, an adhesive layer, and a synthetic resin film. Specifically, the synthetic resin film may be a polyimide resin layer, and the material of the synthetic resin film is not limited. The synthetic resin film may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyamide resin, and naphthalene-containing resin. Furthermore, the substrate layer 111 may include a glass substrate or an organic / inorganic composite substrate.

[0066] Circuit layer 112 may be disposed on substrate layer 111. Circuit layer 112 may include insulating layer, semiconductor pattern, conductive pattern, and signal lines. The insulating layer, semiconductor layer, and conductive layer may be formed on substrate layer 111 by methods such as coating or vapor deposition, and thereafter the insulating layer, semiconductor layer, and conductive layer may be selectively patterned by photolithography. Then, semiconductor pattern, conductive pattern, and signal lines included in circuit layer 112 may be formed.

[0067] The light-emitting element layer 113 may be disposed on the circuit layer 112. The light-emitting element layer 113 may include a light-emitting element. For example, the light-emitting element layer 113 may include an organic light-emitting material, a quantum dot, a quantum rod, or a micro LED.

[0068] The encapsulation layer 114 may be disposed on the light-emitting element layer 113. The encapsulation layer 114 may include inorganic layers, organic layers and inorganic layers stacked in sequence, but the layers constituting the encapsulation layer 114 are not limited to these.

[0069] The inorganic layer protects the light-emitting element layer 113 from moisture and oxygen, while the organic layer protects the light-emitting element layer 113 from foreign substances such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic organic layer, but this disclosure is not limited thereto.

[0070] Sensor layer 120 can be disposed on display layer 110. Sensor layer 120 can detect external input applied from the outside. External input can be user input. User input can include various types of external input, such as user body parts, light, heat, pen, or pressure.

[0071] The sensor layer 120 can be formed on the display layer 110 via a continuous process. For example, the sensor layer 120 can be directly disposed on the display layer 110. Direct disposal means that a third component is not disposed between the sensor layer 120 and the display layer 110. For example, no additional adhesive component may be disposed between the sensor layer 120 and the display layer 110.

[0072] As another example, sensor layer 120 can be coupled (or connected or bonded) to display layer 110 via an adhesive component. The adhesive component may include a general adhesive or a pressure-sensitive adhesive.

[0073] Return to reference Figure 2A The upper functional layer can be disposed on the display panel 100. For example, the upper functional layer may include an anti-reflective member 200 and an upper member 300.

[0074] The antireflective member 200 may be referred to as an antireflective layer. The antireflective member 200 reduces the reflectivity of external light incident from the outside. The antireflective member 200 may comprise a stretchable synthetic resin film. For example, the antireflective member 200 may be provided such that a polyvinyl alcohol (PVA) film is dyed with an iodine compound. However, this is only an example, and the materials constituting the antireflective member 200 are not limited thereto. The thickness of the antireflective member 200 may be from approximately 25 micrometers to approximately 35 micrometers, for example, approximately 31 micrometers, and the thickness of the antireflective member 200 is not limited thereto.

[0075] The antireflective member 200 according to an embodiment may include a color filter. The color filter may have an arrangement. In the antireflective member 200, the arrangement of the color filter may be determined by taking into account the emitted colors of the pixels included in the display layer 110. The antireflective layer may also include a black matrix adjacent to the color filter.

[0076] The antireflective member 200 according to an embodiment may include a destructive interference structure. For example, the destructive interference structure may include a first reflective layer and a second reflective layer disposed in different layers. First reflected light reflected from the first reflective layer and second reflected light reflected from the second reflective layer may interfere with each other destructively, thereby reducing the reflectivity of external light.

[0077] The anti-reflective component 200 can be coupled to the display panel 100 via a first adhesive layer 1010 (additional adhesive layer). The first adhesive layer 1010 can be a transparent adhesive layer, such as a PSA (pressure-sensitive adhesive) film, an OCA (optically clear adhesive) film, or an OCR (optically clear adhesive resin) film. The adhesive layer described below can include ordinary adhesives or pressure-sensitive adhesives. The thickness of the first adhesive layer 1010 can be from about 20 micrometers to about 30 micrometers, for example, about 25 micrometers, and the thickness of the first adhesive layer 1010 is not limited thereto.

[0078] In this embodiment, the first adhesive layer 1010 can be omitted, and the anti-reflective member 200 can be directly disposed on the display panel 100. An additional adhesive layer may not be disposed between the anti-reflective member 200 and the display panel 100.

[0079] The upper component 300 may be disposed on the anti-reflective component 200. The upper component 300 may include a first hard coating layer 310, a protective layer 320, a first upper adhesive layer 330, a window 340, a second upper adhesive layer 350, a black matrix 360, an impact-absorbing layer 370, and a second hard coating layer 380. The components included in the upper component 300 are not limited to those described above. At least some of the above components may be omitted, and other components may be added.

[0080] The first hard coating 310 may be a layer disposed on the outermost surface of the electronic device 1000. The first hard coating 310 may be a functional layer for improving the characteristics of the electronic device 1000 and may be provided by being coated on the protective layer 320. For example, the first hard coating 310 may improve fingerprint resistance, stain resistance, and scratch resistance.

[0081] A protective layer 320 may be disposed beneath the first hard coating layer 310. The protective layer 320 may protect components disposed beneath it. The protective layer 320 may additionally provide the first hard coating layer 310 and an anti-fingerprint layer to improve properties such as chemical resistance and abrasion resistance. The protective layer 320 may comprise a film having an elastic modulus of approximately 15 GPa or less at room temperature. The thickness of the protective layer 320 may be approximately 50 micrometers to approximately 60 micrometers, for example, approximately 55 micrometers, but the thickness of the protective layer 320 is not limited thereto. In embodiments, the protective layer 320 may be omitted. In embodiments, the protective layer 320 may comprise three layers 321, 322, and 323 (see...). Figure 2C ).

[0082] A first upper adhesive layer 330 may be disposed below the protective layer 320. The protective layer 320 and the window 340 may be coupled to each other through the first upper adhesive layer 330. The thickness of the first upper adhesive layer 330 may be from about 20 micrometers to about 30 micrometers, for example, about 25 micrometers, but the thickness of the first upper adhesive layer 330 is not limited to this.

[0083] Window 340 may be disposed below the first upper adhesive layer 330. Window 340 may include an optically transparent insulating material. For example, window 340 may include a glass substrate or a synthetic resin film. When window 340 is a glass substrate, the thickness of window 340 may be about 80 micrometers or less, for example, about 30 micrometers, but the thickness of window 340 is not limited to this.

[0084] When window 340 is a synthetic resin film, window 340 may include a PI (polyimide) film or a PET (polyethylene terephthalate) film.

[0085] Window 340 may have a multilayer structure or a single-layer structure. For example, window 340 may include synthetic resin films coupled to each other by an adhesive, or it may include a glass substrate and a synthetic resin film coupled to each other by an adhesive.

[0086] The second upper adhesive layer 350 may be disposed below the window 340. The window 340 and the shock-absorbing layer 370 may be coupled to each other through the second upper adhesive layer 350. The thickness of the second upper adhesive layer 350 may be from about 30 micrometers to about 40 micrometers, for example, about 35 micrometers, but the thickness of the second upper adhesive layer 350 is not limited to this.

[0087] In an embodiment, the sidewall 340S of the window 340 and the sidewall 350S of the second upper adhesive layer 350 may be disposed inside (or within) the sidewalls of other layers, for example, inside (or within) the sidewall 100S of the display panel 100 and the sidewall 320S of the protective layer 320. The phrase "disposed inside" may indicate that the component is closer to the active region 1000A than the reference component.

[0088] The positional relationship between the layers can be changed by folding the electronic device 1000. In this embodiment, because the sidewall 340S of the window 340 is disposed inside the sidewall 100S of the display panel 100 and the sidewall 320S of the protective layer 320, the possibility of the sidewall 340S of the window 340 protruding from the sidewall 320S of the protective layer 320 can be reduced even if the positional relationship between the layers changes. Therefore, the possibility of external impacts being transmitted through the sidewall 340S of the window 340 can be reduced. As a result, the possibility of cracks appearing in the window 340 can be reduced.

[0089] The first distance 340W between the sidewall 340S of window 340 and the sidewall 320S of protective layer 320 can be greater than or equal to a given distance. Here, the first distance 340W can represent the distance in a direction parallel to the first direction DR1. In a plan view, the first distance 340W can correspond to the distance between sidewall 340S and sidewall 320S.

[0090] The first distance 340W can be, but is not limited to, approximately 180 micrometers to approximately 205 micrometers, for example, approximately 196 micrometers. For example, the first distance 340W can be approximately 50 micrometers or greater, or approximately 300 micrometers. As the first distance 340W becomes larger, the protective layer 320 can protrude more than the window 340, and a portion of the protective layer 320 can be bent and attached to other components, such as a housing. As the area of ​​the protective layer 320 becomes larger, the likelihood that foreign matter introduced from the upper portion of the protective layer 320 will be introduced into the lower portion of the protective layer 320 can be reduced.

[0091] Window 340 and second upper adhesive layer 350 can be adhered (or bonded) to impact-absorbing layer 370 via a lamination process. Considering lamination process tolerances, the area of ​​window 340 and the area of ​​the second upper adhesive layer 350 can each be smaller than the area of ​​impact-absorbing layer 370. The area of ​​the second upper adhesive layer 350 can be smaller than the area of ​​window 340. For example, in the process of attaching window 340, pressure can be applied to the second upper adhesive layer 350. The second upper adhesive layer 350 can be pressurized to stretch in directions parallel to the first direction DR1 and the second direction DR2. The area of ​​the second upper adhesive layer 350 can be smaller than the area of ​​window 340 so that the second upper adhesive layer 350 does not protrude more than window 340.

[0092] With the first upper adhesive layer 330 and the second upper adhesive layer 350 attached, buckling may occur in the window 340 because the window 340 cannot slide during the folding operation of the electronic device 1000. However, in an embodiment, the area of ​​the second upper adhesive layer 350 may be smaller than the area of ​​the window 340. Therefore, the first upper adhesive layer 330 may not be attached to the second upper adhesive layer 350, and the possibility of foreign matter adhering to the second upper adhesive layer 350 can be reduced.

[0093] The second distance 350W between the sidewall 350S of the second upper adhesive layer 350 and the sidewall 320S of the protective layer 320 can be greater than or equal to a given distance. Here, the second distance 350W can represent the distance in a direction parallel to the first direction DR1. In a plan view, the second distance 350W can correspond to the distance between the sidewall 350S and the sidewall 320S.

[0094] The second distance 350W can be approximately 392 micrometers, but this disclosure is not limited thereto. For example, the second distance 350W can be selected from the range of approximately 292 micrometers to approximately 492 micrometers, but this disclosure is not limited thereto. The black matrix 360 can be disposed between the impact absorbing layer 370 and the second upper adhesive layer 350. The black matrix 360 can be provided by printing on the upper surface of the impact absorbing layer 370. The black matrix 360 can overlap with the peripheral region 1000NA. The black matrix 360 can be a colored layer and can be formed by a coating method. The black matrix 360 can include colored organic materials or opaque metals, and the materials constituting the black matrix 360 are not limited thereto.

[0095] Figure 2AThe black matrix 360 is shown as an example disposed on the upper surface of the shock-absorbing layer 370, but the location of the black matrix 360 is not limited thereto. For example, the black matrix 360 may be provided on the upper surface of the protective layer 320, the lower surface of the protective layer 320, the upper surface of the window 340, or the lower surface of the window 340. The black matrix 360 may be provided as multiple layers. A portion of the black matrix 360 may be provided on the upper surface of the shock-absorbing layer 370, and another portion of the black matrix 360 may be provided on the upper surface of the protective layer 320, the lower surface of the protective layer 320, and the upper surface of the window 340, or the lower surface of the window 340.

[0096] The shock absorbing layer 370 can be a functional layer for protecting the display panel 100 from external impacts. The shock absorbing layer 370 can be selected from films having an elastic modulus of approximately 1 GPa or greater at room temperature. The shock absorbing layer 370 can be a stretched film with optical functions. For example, the shock absorbing layer 370 can be an optical axis control film. The thickness of the shock absorbing layer 370 can be from approximately 35 micrometers to approximately 45 micrometers, for example, approximately 41 micrometers, but the thickness of the shock absorbing layer 370 is not limited to this. In embodiments, the shock absorbing layer 370 can be omitted.

[0097] When the shock-absorbing layer 370 is omitted, the anti-reflective member 200 can be adhered to the window 340 via an adhesive layer. The anti-reflective member 200 can contact the lower surface of the second adhesive layer 1020, and the window 340 can contact the upper surface of the second adhesive layer 1020. When the shock-absorbing layer 370 is omitted, the black matrix 360 can be disposed on the upper surface of the protective layer 320, the lower surface of the protective layer 320, the upper surface of the window 340, or the lower surface of the window 340.

[0098] A second hard coating 380 may be provided on the surface of the impact-absorbing layer 370. The impact-absorbing layer 370 may have a curved surface. The upper surface of the impact-absorbing layer 370 may contact the second upper adhesive layer 350. Therefore, the curved portion of the upper surface of the impact-absorbing layer 370 may be filled with the second upper adhesive layer 350. Therefore, no optical problems may occur on the upper surface of the impact-absorbing layer 370. The lower surface of the impact-absorbing layer 370 may be planarized by the second hard coating 380. For example, if the first hole is cut into the second adhesive layer 1020, the surface exposed by the first hole may have a smooth surface. Therefore, because the second hard coating 380 covers the uneven surface of the impact-absorbing layer 370, haze that may occur on the uneven surface can be prevented.

[0099] The upper component 300 can be coupled to the antireflective component 200 via the second adhesive layer 1020. The second adhesive layer 1020 may include a common adhesive or a pressure-sensitive adhesive. The thickness of the second adhesive layer 1020 may be from about 20 micrometers to about 30 micrometers, for example, about 25 micrometers, and the thickness of the second adhesive layer 1020 is not limited thereto.

[0100] The lower functional layer may be disposed below the display panel 100. For example, the lower functional layer may include a lower protective film 400, a light-shielding layer 500, a first lower component 600, a second lower component 700, and a step compensation component 800. The components included in the lower functional layer are not limited to the above-mentioned components. At least some of the above-mentioned components may be omitted, and other components may be added.

[0101] The lower protective film 400 can be coupled to the rear surface of the display panel 100 via the third adhesive layer 1030. The lower protective film 400 can prevent scratches from appearing on the rear surface of the display panel 100 during the manufacturing process of the display panel 100. The lower protective film 400 can be a colored polyimide film. For example, the lower protective film 400 can be an opaque yellow film, but this disclosure is not limited thereto.

[0102] The thickness of the lower protective film 400 can be from approximately 40 micrometers to approximately 80 micrometers, and for example, approximately 68 micrometers. The thickness of the third adhesive layer 1030 can be from approximately 13 micrometers to approximately 25 micrometers, for example, approximately 18 micrometers. However, the thickness of the lower protective film 400 and the thickness of the third adhesive layer 1030 are not limited thereto.

[0103] The light-shielding layer 500 can be disposed below the lower protective film 400 and above the first lower component 600, which will be described below.

[0104] The light-shielding layer 500 may be a light-shielding coating applied to the upper surface of the first lower member 600. The light-shielding layer 500 may contact the upper surface of the first lower member 600. The first lower member 600 may include a plate 610, the plate 610 being of metal, and the light-shielding layer 500 may contact the upper surface of the plate 610.

[0105] The light-shielding layer 500 may include a light-absorbing light-shielding material, more specifically, a black material, and may function to prevent external light from being reflected by the first lower member 600 positioned below the light-shielding layer 500. The light-shielding layer 500 may include, for example, a black dye or black pigment. In an embodiment, the light-shielding layer 500 may include carbon black as a black pigment. The light-shielding layer 500 may be formed by coating the upper surface of the plate 610 with black ink comprising the light-shielding material.

[0106] In an embodiment, the light-shielding layer 500 may comprise a polymeric resin as a medium in which a black pigment, such as carbon black, is dispersed. The light-shielding layer 500 may comprise carbon black dispersed in a polymeric material such as acrylic resin, melamine resin, or epoxy resin. The light-shielding layer 500 may also comprise cellulose acetate butyrate as a polymeric material. The light-shielding layer 500 may be a monolayer film formed from a polymeric resin in which carbon black is dispersed.

[0107] Figure 2A The illustration shows a light-shielding layer 500 disposed on the upper surface of the plate 610 as an example, but this disclosure is not limited thereto, and the light-shielding layer 500 may be disposed on the lower surface of the plate 610. In embodiments, the light-shielding layer 500 may be disposed on both the upper and lower surfaces of the plate 610. The upper and lower surfaces of the plate 610 may be coated with black ink comprising a light-shielding material, thereby forming the light-shielding layer 500.

[0108] The light-shielding layer 500 can be adhered to the lower protective film 400 via an additional adhesive layer 1050. The additional adhesive layer 1050 can be disposed between the light-shielding layer 500 and the lower protective film 400, thereby coupling the light-shielding layer 500 and the lower protective film 400 to each other. The light-shielding layer 500 can be directly attached to the lower protective film 400 via the additional adhesive layer 1050. In this disclosure, the phrase "direct attachment" or "direct bonding" can mean that a portion of a layer, film, area, or plate is coupled or bonded to another portion (such as a layer, film, area, or plate), wherein only the adhesive layer is between said portion (such as a layer, film, area, or plate) and said other portion (such as a layer, film, area, or plate), and there are no components between said portion (such as a layer, film, area, or plate) and said other portion (such as a layer, film, area, or plate). For example, the phrase "direct attachment" or "direct bonding" can mean that two layers or two components are coupled or bonded to each other by an adhesive layer disposed between them. The light-shielding layer 500 can contact the lower surface of the additional adhesive layer 1050, and the lower protective film 400 can contact the upper surface of the additional adhesive layer 1050.

[0109] In an embodiment, the additional adhesive layer 1050 may not be disposed in the area of ​​the plate 610 in which the opening 611 is defined. For example, the additional adhesive layer 1050 may include a first additional adhesive layer 1050-1 and a second additional adhesive layer 1050-2, and the first additional adhesive layer 1050-1 and the second additional adhesive layer 1050-2 may be spaced apart from each other, wherein the area in which the opening 611 is defined is between the first additional adhesive layer 1050-1 and the second additional adhesive layer 1050-2.

[0110] The thickness of the light-shielding layer 500 can be approximately 7 micrometers or greater and approximately 13 micrometers or less. The thickness of the light-shielding layer 500 can also be approximately 8 micrometers or greater and approximately 12 micrometers or less. When the thickness of the light-shielding layer 500 is approximately 7 micrometers or less, the light-shielding properties of the light-shielding layer 500 may be reduced, and the durability of the light-shielding layer 500 coated on the first lower member 600 may be reduced. When the thickness of the light-shielding layer 500 is greater than approximately 13 micrometers, the folding characteristics of the electronic device 1000 may be reduced due to the thick formation of the light-shielding layer 500 on the first lower member 600, and the film-forming properties of the light-shielding layer 500 may deteriorate.

[0111] A first lower member 600 may be disposed below a light-shielding layer 500. The light-shielding layer 500 may be coated on the first lower member 600, and thereby the light-shielding layer 500 and the first lower member 600 may be in contact with each other. The light-shielding layer 500 may contact the upper surface of a plate 610 included in the first lower member 600. The first lower member 600 may support components disposed on the first lower member 600. Some components of the first lower member 600 may be referred to as support members. In an embodiment, the plate 610 included in the first lower member 600 may be referred to as a support member.

[0112] The first lower component 600 includes a plate 610, an adhesive layer 620, and a cover layer 630. The components included in the first lower component 600 are not limited to those described above, and other components may be added.

[0113] Plate 610 may comprise a material having an elastic modulus of approximately 60 GPa or greater at room temperature. Plate 610 may comprise a metal. Plate 610 may comprise a single metallic material or an alloy of metallic materials. For example, plate 610 may be SUS304, but is not limited thereto. Plate 610 may support components disposed on plate 610. Plate 610 may improve the heat dissipation performance of electronic device 1000.

[0114] Opening 611 may be defined within a portion of plate 610. Opening 611 may be defined in a region overlapping with the second region 1000A2. In a plan view, for example, when viewed in a third direction DR3, opening 611 may overlap with the second region 1000A2. Opening 611 may allow the shape of a portion of plate 610 to be easily deformed. Figure 2A An opening 611 is shown defined in a portion of plate 610 as an example, but this disclosure is not limited thereto, and the opening 611 may be defined in the shape of a gap in the entire area overlapping with the second region 1000A2.

[0115] The cover layer 630 can be attached to the board 610 via the adhesive layer 620. The upper surface of the adhesive layer 620 can contact the lower surface of the board 610, and the lower surface of the adhesive layer 620 can contact the upper surface of the cover layer 630. Unlike Figure 2A As shown, the adhesive layer 620 may not be disposed in the area of ​​the plate 610 that overlaps with the second region 1000A2. The cover layer 630 may cover (or overlap) the opening 611 of the plate 610. Therefore, it is possible to additionally prevent foreign matter from being introduced into the opening 611. Each of the cover layer 630 and the adhesive layer 620 includes a light-shielding material.

[0116] The cover layer 630 may include a cover substrate material and a light-shielding material. The cover layer 630 may be a cover substrate material and may include a material having an elastic modulus lower than that of the plate 610. The cover layer 630 may be a flexible film. The cover layer 630 may include a material having an elastic modulus of about 30 MPa or less and an elongation of about 100% or greater. For example, the cover layer 630 may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, silicone resin, polyimide resin, polyamide resin, and benzophthalate resin. For example, the cover layer 630 may include thermoplastic polyurethane. The cover layer 630 may be a thermoplastic polyurethane film having a grid pattern formed thereon.

[0117] The capping layer 630 may include, for example, a black dye or black pigment as a light-shielding material. The capping layer 630 may include carbon black. The capping layer 630 may include reactive carbon black. The reactive carbon black included in the capping layer 630 may be chemically bonded to the capping matrix material. The capping layer 630 may include a light-shielding material and a capping matrix material, and the light-shielding material and the capping matrix material may be chemically bonded to each other. The capping layer 630 may include about 1% or more and about 10% or less of a light-shielding material.

[0118] Adhesive layer 620 may include an adhesive matrix material and a light-shielding material. Adhesive layer 620 may include a common adhesive or a pressure-sensitive adhesive as the adhesive matrix material. Adhesive layer 620 may include an acrylic resin as the adhesive matrix material. Adhesive layer 620 may include adhesive materials such as polyurethane, polyacrylamide, polyester, polyepoxy, or polyvinyl acetate. Adhesive layer 620 may include an organic adhesive material such as PSA (pressure-sensitive adhesive). Adhesive layer 620 may include an optically transparent adhesive material.

[0119] Adhesive layer 620 may include, for example, a black dye or black pigment as a light-shielding material. Adhesive layer 620 may include carbon black. Adhesive layer 620 may include reactive carbon black. The reactive carbon black included in adhesive layer 620 may be chemically bonded to the adhesive matrix material. Adhesive layer 620 may include a light-shielding material and an adhesive matrix material, and the light-shielding material and the adhesive matrix material may be chemically bonded to each other. Adhesive layer 620 may include about 1% or more and about 10% or less of a light-shielding material.

[0120] The light-shielding materials included in the cover layer 630 and the adhesive layer 620 and the light-shielding materials included in the aforementioned light-shielding layer 500 may be different from each other. In an embodiment, each of the cover layer 630 and the adhesive layer 620 may include a first light-shielding material, and the light-shielding layer 500 may include a second light-shielding material, and the first light-shielding material and the second light-shielding material may be different from each other, but this disclosure is not limited thereto. The first light-shielding material and the second light-shielding material may be the same.

[0121] The thickness of the plate 610 can be from approximately 120 micrometers to approximately 180 micrometers, for example, approximately 150 micrometers. The thickness of the adhesive layer 620 can be from approximately 4 micrometers to approximately 15 micrometers, for example, approximately 8 micrometers. The thickness of the cover layer 630 can be from approximately 4 micrometers to approximately 15 micrometers, for example, approximately 8 micrometers. However, the thickness of the plate 610, the adhesive layer 620, and the cover layer 630 are not limited to the values ​​mentioned above.

[0122] The second lower member 700 may be disposed below the first lower member 600. The second lower members 700 may be spaced apart from each other. For example, one second lower member 700 may be disposed in the first region 1000A1 and another second lower member 700 may be disposed in the third region 1000A3. In this disclosure, the second lower member 700 may be referred to as a lower support member.

[0123] Each of the second lower members 700 can be attached to the first lower member 600 via a fourth adhesive layer 1040. For example, one fourth adhesive layer 1040 can be attached to the lower surface of the first lower member 600 overlapping with the first region 1000A1, and another fourth adhesive layer 1040 can be attached to the lower surface of the first lower member 600 overlapping with the third region 1000A3. For example, the fourth adhesive layer 1040 may not overlap with the second region 1000A2. The thickness of each of the fourth adhesive layers 1040 can be from about 8 micrometers to about 15 micrometers, for example, about 8 micrometers, but the thickness of each of the fourth adhesive layers 1040 is not limited to this.

[0124] Although not shown in the accompanying drawings, step compensation members 800 may also be disposed between each of the second lower members 700 and the first lower member 600. For example, step compensation members 800 may be provided in the area overlapping with the second region 1000A2. One surface of the step compensation member 800 may have a lower adhesion force than the other surface of the step compensation member 800. For example, the surface may have no adhesion force. This surface may be the surface facing the first lower member 600.

[0125] Each of the second lower components 700 may include a lower plate 710, a heat sink 720, and an insulating film 730. The components included in each of the second lower components 700 are not limited to those described above. At least some of the above-described components may be omitted, and other components may be added.

[0126] Multiple lower plates 710 may be provided. One of the lower plates 710 may overlap with a portion of the first region 1000A1 and the second region 1000A2, and another lower plate 710 may overlap with another portion of the second region 1000A2 and the third region 1000A3.

[0127] The lower plates 710 may be spaced apart from each other in the second region 1000A2. However, the lower plates 710 may be positioned as close as possible to support the area of ​​plate 610 in which the opening 611 is formed. For example, the lower plates 710 may prevent the shape of the area in which the opening 611 of plate 610 is defined from being deformed due to pressure applied from the top of the electronic device 1000.

[0128] The lower plate 710 can prevent the shape of the component provided on the second lower member 700 from being changed by the component provided below the second lower member 700.

[0129] Each of the lower plates 710 may comprise a metal alloy, and for example, each of the lower plates 710 may comprise a copper alloy. However, the materials constituting (or forming) the lower plates 710 are not limited thereto. The thickness of each of the lower plates 710 may be from about 60 micrometers to about 100 micrometers, for example, about 80 micrometers, and the thickness of each of the lower plates 710 is not limited thereto.

[0130] The heat sink 720 can be attached to the underside of each of the lower plates 710. The heat sink 720 can be a thermally conductive sheet with high thermal conductivity. For example, the heat sink 720 may include a heat dissipation layer 721, a first heat dissipation adhesive layer 722, a second heat dissipation adhesive layer 723, and a gap tape 724.

[0131] The gap tape 724 can be attached to a first heat-dissipating adhesive layer 722 and a second heat-dissipating adhesive layer 723 spaced apart from each other, and a heat-dissipating layer 721 is located between the first heat-dissipating adhesive layer 722 and the second heat-dissipating adhesive layer 723. The gap tape 724 can be formed of multiple layers. For example, the gap tape 724 may include a substrate layer, an upper adhesive layer disposed on the upper surface of the substrate layer, and a lower adhesive layer disposed on the lower surface of the substrate layer.

[0132] The heat dissipation layer 721 can be attached to the lower plate 710 via a first heat dissipation adhesive layer 722. The heat dissipation layer 721 can be sealed via the first heat dissipation adhesive layer 722, a second heat dissipation adhesive layer 723, and a gap tape 724. The heat dissipation layer 721 can be a graphitized polymer film. The polymer film can be, for example, a polyimide film. Each of the first heat dissipation adhesive layer 722 and the second heat dissipation adhesive layer 723 can have a thickness of approximately 3 micrometers to approximately 8 micrometers, and can be, for example, approximately 5 micrometers. Each of the heat dissipation layer 721 and the gap tape 724 can have a thickness of approximately 10 micrometers to approximately 25 micrometers, and can be, for example, approximately 17 micrometers. However, the thicknesses of the first heat dissipation adhesive layer 722, the second heat dissipation adhesive layer 723, the heat dissipation layer 721, and the gap tape 724 are not limited to the values ​​described above.

[0133] The insulating film 730 can be attached below the heat sink 720. For example, the insulating film 730 can be attached to the second thermal adhesive layer 723. The insulating film 730 can prevent vibration in the electronic device 1000. The thickness of the insulating film 730 can be approximately 15 micrometers, but this disclosure is not limited thereto.

[0134] The step compensation member 800 can be attached to the underside of the plate 610. For example, the adhesive layer 620 can be attached to the underside of a portion of the plate 610, and the step compensation member 800 can be attached to the underside of another portion of the plate 610.

[0135] The step compensation member 800 may include a first compensation adhesive layer 810, a step compensation film 820, and a second compensation adhesive layer 830. The first compensation adhesive layer 810 may be attached to the lower surface of the plate 610. The step compensation film 820 may be a synthetic resin film. The second compensation adhesive layer 830 may be attached to the lower surface of the step compensation film 820 and a group (not shown).

[0136] Although not shown in the accompanying drawings, a buffer membrane including a buffer layer may also be disposed below the second lower member 700 or the step compensation member 800, etc.

[0137] The electronic device according to an embodiment may include a metal plate disposed below a window and a display panel to support the window and the display panel, and may include a cover layer attached to a lower portion of the metal plate by an adhesive layer. Both the cover layer and the adhesive layer disposed below the metal plate may include a light-shielding material. Therefore, the electronic device according to an embodiment can improve its resistance to external impacts, prevent the introduction of external foreign substances, and prevent the display performance of the electronic device from being degraded by light incident from the bottom of the electronic device.

[0138] A compressible buffer layer, such as sponge, is provided between the existing protective film and the first lower component. If this buffer layer is compressed due to an external impact, the window and display panel disposed thereon may also be compressed together, potentially leading to defects such as cracking or warping. By omitting the buffer layer to improve impact resistance, the inclusion of a light-shielding layer within the buffer layer can be omitted, allowing light transmitted through or reflected by the cover layer to be introduced into the display panel. Consequently, the display performance of the electronic device may be reduced.

[0139] The electronic device according to the embodiments allows for the omission of a buffer layer between the protective film and the first lower member, or for the relocation of the buffer layer, and for example, allows the buffer layer to be disposed below a second lower member, etc. In the electronic device of this disclosure, each of the cover layer disposed below the metal plate and the adhesive layer disposed between the cover layer and the metal plate for attaching the cover layer and the metal plate to each other may include a light-shielding material. Therefore, compared to the case where a compressible buffer layer is disposed between the first lower member and the display panel, the impact resistance of the electronic device to external impacts can be improved, and external light incident on the display panel can be prevented by the cover layer and adhesive layer including light-shielding material, thereby preventing degradation of the display performance of the electronic device and improving the display efficiency of the electronic device.

[0140] refer to Figure 2B The electronic device 1000-1 according to an embodiment may include an additional adhesive layer 1050' disposed between a light-shielding layer 500 and a lower protective film 400. The additional adhesive layer 1050' may be disposed between the light-shielding layer 500 and the lower protective film 400, thereby coupling the light-shielding layer 500 and the lower protective film 400 to each other. The light-shielding layer 500 may contact the lower surface of the additional adhesive layer 1050', and the lower protective film 400 may contact the upper surface of the additional adhesive layer 1050'.

[0141] In an embodiment, the additional adhesive layer 1050' may include a first additional adhesive layer 1050-1 disposed on the portion of the plate 610 overlapping with the first region 1000A1, a second additional adhesive layer 1050-2 disposed on the portion of the plate 610 overlapping with the third region 1000A3, and a third additional adhesive layer 1050-3 disposed on the portion of the plate 610 overlapping with the second region 1000A2. The third additional adhesive layer 1050-3 may be disposed on the opening 611 of the plate 610. The third additional adhesive layer 1050-3 may have an upwardly curved shape so as not to contact the portion defining the opening 611 of the plate 610. Because the third additional adhesive layer 1050-3 has an upwardly curved shape, the third additional adhesive layer 1050-3 can contact the lower surface of the lower protective film 400 and can not contact the upper surface of the light-shielding layer 500. The first additional adhesive layer 1050-1, the third additional adhesive layer 1050-3, and the second additional adhesive layer 1050-2 may be integral with each other, and the first additional adhesive layer 1050-1, the third additional adhesive layer 1050-3, and the second additional adhesive layer 1050-2 may extend sequentially.

[0142] refer to Figure 2C The electronic device 1000-2 according to an embodiment may include a buffer member 900 disposed between the display panel 100 and the first lower member 600. The buffer member 900 may be disposed below the display panel 100. The buffer member 900 may be disposed below the lower protective film 400. The buffer member 900 can protect the display panel 100 from impacts transmitted from the bottom of the electronic device 1000-2. The buffer member 900 can improve the impact resistance of the electronic device 1000.

[0143] The buffer member 900 may include a barrier membrane 920 and a buffer layer 930. The buffer member 900 may also include a first buffer adhesive layer 910 and a second buffer adhesive layer 940. The components included in the buffer member 900 are not limited to the components described above, and other components may be added in addition to the components described above.

[0144] The first buffer adhesive layer 910 and the second buffer adhesive layer 940 may comprise a common adhesive or a pressure-sensitive adhesive. The first buffer adhesive layer 910 may be attached to the lower protective film 400, and the second buffer adhesive layer 940 may be attached to the plate 610. The thickness of the first buffer adhesive layer 910 may be approximately 25 micrometers, and the thickness of the second buffer adhesive layer 940 may be approximately 8 micrometers. However, the thicknesses of the first buffer adhesive layer 910 and the second buffer adhesive layer 940 are not limited thereto.

[0145] The barrier film 920 may be a synthetic resin film, such as a polyimide (PI) film, but this disclosure is not limited thereto. The barrier film 920 may include at least one of, for example, polyimide, PA (polyamide), polyetheretherketone, and PET (polyethylene terephthalate).

[0146] The thickness of the barrier film 920 can be approximately 8 micrometers or greater and approximately 40 micrometers or less. For example, the thickness of the barrier film 920 can be approximately 20 micrometers.

[0147] The barrier film 920 can have a high modulus. The barrier film 920 can be provided to improve the impact resistance of the electronic device 1000. The barrier film 920 can prevent the display panel 100 from deforming, thereby improving the impact resistance of the display panel 100.

[0148] The cushioning layer 930 may include foam or sponge, etc. The cushioning layer 930 may be elastic and may have a porous structure.

[0149] The cushioning layer 930 may include polyurethane or thermoplastic polyurethane, but this disclosure is not limited thereto. The cushioning layer 930 is not limited and may include various materials, as long as they can absorb impact.

[0150] The buffer layer 930 can be formed using the barrier film 920 as a base layer. For example, the buffer layer 930 can be formed by applying a mixture comprising polyurethane resin and a foaming agent onto the barrier film 920 and subsequently foaming the foaming agent. The buffer layer 930 can be directly disposed on the lower surface of the barrier film 920. The buffer layer 930 can contact the lower surface of the barrier film 920. Alternatively, the buffer layer 930 can be attached to the lower surface of the barrier film 920 by means of an adhesive member.

[0151] The thickness of the buffer layer 930 can be approximately 80 micrometers or greater and approximately 120 micrometers or less. For example, the thickness of the buffer layer 930 can be approximately 100 micrometers.

[0152] The cushioning member 900 can be attached to the upper surface of the first lower member 600, which is included in the lower support member, via the second cushioning adhesive layer 940. The cushioning member 900 can be attached to the upper surface of the plate 610 via the second cushioning adhesive layer 940.

[0153] refer to Figure 2D According to the embodiment, the electronic device 1000-3 may include a second lower member 700, and each of the second lower members 700 may include a lower plate 710 and a lower buffer member 740.

[0154] The lower cushioning member 740 may be attached to the underside of the lower plate 710. The lower cushioning member 740 may include a lower cushioning layer 741 and a lower cushioning adhesive layer 742. The components included in the lower cushioning member 740 are not limited to those described above, and other components may be added in addition to those described above.

[0155] The lower cushioning adhesive layer 742 may comprise a common adhesive or a pressure-sensitive adhesive. The lower cushioning adhesive layer 742 may be attached between the lower plate 710 and the lower cushioning layer 741. The thickness of the lower cushioning adhesive layer 742 may be from approximately 3 micrometers to approximately 8 micrometers, for example, approximately 5 micrometers. However, the thickness of the lower cushioning adhesive layer 742 is not limited to this.

[0156] The lower buffer layer 741 may include foam or sponge, etc. The buffer layer 930 may be elastic and may have a porous structure.

[0157] The lower buffer layer 741 may include polyurethane or thermoplastic polyurethane, but this disclosure is not limited thereto. The lower buffer layer 741 is not limited and may include various materials, as long as they can absorb impact.

[0158] The lower buffer member 740 may also include a barrier membrane or the like as a base layer for forming the lower buffer layer 741. The lower buffer layer 741 can be formed by applying a mixture including polyurethane resin and a foaming agent onto the barrier membrane and then foaming the foaming agent.

[0159] Figure 4 This is a schematic perspective view of some components included in an electronic device according to embodiments of the present disclosure. Figure 4 This is a schematic exploded perspective view showing a plate 610 included in a first lower member and an adhesive layer 620 and a cover layer 630 disposed below the plate 610 in an electronic device according to an embodiment.

[0160] refer to Figures 2A to 2D and Figure 4The board 610 included in the electronic device according to the embodiment may include a first non-folded region 610A1, a folded region 610A2, and a second non-folded region 610A3 arranged in a first direction DR1. The folded region 610A2 of the board 610 may overlap with a second region 1000A2 of the active region 1000A of the electronic device 1000. The first non-folded region 610A1 and the second non-folded region 610A3 of the board 610 may be connected to or extend into the folded region 610A2. At least a portion of the first non-folded region 610A1 may overlap with the first region 1000A1 of the active region 1000A of the electronic device 1000, and at least a portion of the second non-folded region 610A3 may overlap with the second region 1000A2 of the active region 1000A of the electronic device 1000. At least a portion of the first non-folded region 610A1 and the second non-folded region 610A3 may overlap with a peripheral region 1000NA of the electronic device 1000. The plate 610 may include a first portion 610-1 that overlaps with the first non-folded region 610A1, a second portion 610-2 that overlaps with the folded region 610A2, and a third portion 610-3 that overlaps with the second non-folded region 610A3.

[0161] An opening 611 overlapping the folded region 610A2 may be defined in the plate 610. The opening 611 may overlap with a second region 1000A2 of the active region 1000A of the electronic device 1000. The opening 611 may be provided in rows. The openings 611 may be provided in rows and may be arranged offset from each other. The openings 611 may be provided in rows and may be arranged in a diamond grid shape. Figures 2A to 2D and Figure 4 The opening 611 is shown to be defined in the folded region 610A2 of the plate 610, but the present disclosure is not limited thereto, and the opening may be defined in the entire region of the plate 610 overlapping with the second region 1000A2 while having a gap shape. For example, the plate 610 may include a first portion 610-1 corresponding to the first non-folded region 610A1 and a third portion 610-3 corresponding to the second non-folded region 610A3, and the second portion 610-2 overlapping with the folded region 610A2 may be omitted, and thus the first portion 610-1 and the third portion 610-3 may be spaced apart from each other with a given gap.

[0162] In the plan view, the covering layer 630 may overlap at least with the folded region 610A2 of the plate 610. In the plan view, the covering layer 630 may overlap with the second portion 610-2 of the plate 610, thereby covering the opening 611 defined in the second portion 610-2. Therefore, the covering layer 630 can prevent foreign matter from being introduced into the opening 611 defined in the plate 610.

[0163] In the plan view, adhesive layer 620 may overlap at least with the folded region 610A2 of plate 610. In the plan view, adhesive layer 620 may be completely overlapped by cover layer 630, and cover layer 630 may be attached to the lower surface of plate 610. However, adhesive layer 620 may be configured to overlap only with the first non-folded region 610A1 and the second non-folded region 610A3 and not with the folded region 610A2 of plate 610.

[0164] The light-blocking layer 500 may include light-blocking openings 511 in the second light-blocking portion. For example, the light-blocking openings 511 may be defined in the second light-blocking portion of the light-blocking layer 500. When viewed in a plan view, the light-blocking openings 511 may overlap with openings 611 defined in the folded region 610A2 of the plate 610, respectively. In detail, the light-blocking openings 511 may be defined to have the same shape and arrangement as the openings 611. For example, the light-blocking openings 511 may be arranged to form rows that can be displaced from each other in an alternating manner. In the process of coating the top surface (upper surface) of the plate 610 with the light-blocking layer 500, a coating (e.g., black ink) containing a light-blocking material (or light-shielding material) may be applied to the remaining area of ​​the plate 610, excluding the openings 611, to form the light-blocking layer 500. Therefore, the light-blocking openings 511 and 611 may completely overlap each other.

[0165] Since the light-blocking opening 511 defined in the light-blocking layer 500 can completely overlap with the opening 611 defined in the plate 610, when viewed in a plan view, the opening 611 defined in the plate 610 can remain open without being covered by the light-blocking layer 500. Therefore, the folding properties of the folded region 610A2 of the plate 610 can be maintained without deterioration, and the shape of the folded region 610A2 can be more easily changed through the folding operation.

[0166] Figure 5A The bonding relationships between materials in a cover layer included in an electronic device according to embodiments of the present disclosure are illustrated schematically. Figure 5B The bonding relationship between materials in an adhesive layer included in an electronic device according to embodiments of the present disclosure is illustrated schematically.

[0167] refer to Figure 2A , Figure 4 and Figure 5A The cover layer 630 according to the embodiment may include a first light-shielding material SM1 and a cover substrate material CBM.

[0168] The first light-shielding material SM1 may include reactive carbon black. The first light-shielding material SM1 may be a material including first functional groups FG1-1 and FG1-2. The first functional groups FG1-1 and FG1-2 may be, for example, carboxyl, carbonyl, amide, ester or hydroxyl groups.

[0169] The cover matrix material (CBM) may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, silicone resin, polyimide resin, polyamide resin, and naphthalene-containing resin. For example, the cover matrix material (CBM) may include thermoplastic polyurethane.

[0170] The cover matrix material CBM can be a material including second functional groups FG2-1 and FG2-2. The second functional groups FG2-1 and FG2-2 can be, for example, carboxyl, carbonyl, amide, ester, amino, epoxy, or carbamate groups.

[0171] In the capping layer 630, the first functional groups FG1-1 and FG1-2 can be chemically bonded to the second functional groups FG2-1 and FG2-2, respectively. Each of the first functional groups FG1-1 and FG1-2 can be chemically bonded to a corresponding one of the second functional groups FG2-1 and FG2-2, respectively. Each of the first functional groups FG1-1 and FG1-2 can be hydrogen-bonded or covalently bonded to each of the second functional groups FG2-1 and FG2-2, respectively. In the capping layer 630 according to the embodiment, the first functional groups FG1-1 and FG1-2 included in the first light-shielding material SM1 and the second functional groups FG2-1 and FG2-2 included in the capping matrix material CBM can be chemically bonded. Therefore, the first light-shielding material SM1 can be uniformly dispersed in the cover layer 630, and the first light-shielding material SM1 can be stably included in the cover layer 630, thereby effectively blocking light incident on the electronic device 1000.

[0172] refer to Figure 2A , Figure 4 and Figure 5B According to the embodiment, the adhesive layer 620 may include a second light-shielding material SM2 and an adhesive matrix material ABM.

[0173] The second light-shielding material SM2 may include reactive carbon black. The second light-shielding material SM2 may be the same as the first light-shielding material SM1 included in the cover layer 630. The second light-shielding material SM2 may be a material including first functional groups FG1-3. The first functional groups FG1-3 may be, for example, carboxyl, carbonyl, amide, ester, or hydroxyl groups.

[0174] Adhesive matrix materials (ABMs) may include acrylic resins. Adhesive matrix materials (ABMs) may include adhesive materials such as polyurethane, polyacrylamide, polyester, polyepoxy, or polyvinyl acetate. Adhesive matrix materials (ABMs) may include organic adhesive materials such as PSA (pressure-sensitive adhesive).

[0175] The adhesive matrix material ABM can be a material including a third functional group FG3. The third functional group FG3 can be, for example, a carboxyl group, carbonyl group, hydroxyl group, ester group, or epoxy group.

[0176] In the adhesive layer 620, the first functional groups FG1-3 can be chemically bonded to the third functional group FG3, respectively. Each of the first functional groups FG1-3 can be chemically bonded to a corresponding one of the third functional groups FG3. Each of the first functional groups FG1-3 can be hydrogen-bonded or covalently bonded to each of the third functional groups FG3, respectively. In the adhesive layer 620 according to the embodiment, the first functional groups FG1-3 included in the second light-shielding material SM2 and the third functional group FG3 included in the adhesive matrix material ABM can be chemically bonded to each other. Therefore, the second light-shielding material SM2 can be uniformly dispersed in the adhesive layer 620, and the second light-shielding material SM2 can be stably included in the adhesive layer 620, thereby effectively blocking light incident inside the electronic device 1000.

[0177] Figure 6A These are captured images showing the results of an evaluation of the light-shielding characteristics of an electronic device according to an embodiment of the present disclosure. Figure 6B and Figure 6C These are captured images of the evaluation results of the light-shielding characteristics of electronic devices based on comparative examples.

[0178] Figure 6A The image is obtained by photographing the upper portion of a metal plate of an electronic device according to an embodiment, in which a cover layer including a light-shielding material is attached to the lower portion of the metal plate by an adhesive layer including the light-shielding material. Figure 6B The image is obtained by photographing the upper portion of the metal plate of an electronic device having the stacked structure disclosed herein, and in the electronic device, the cover layer disposed under the metal plate and the adhesive layer for bonding the cover layer do not include light-shielding material. Figure 6C The image is obtained by photographing the upper portion of the metal plate of an electronic device having the stacked structure disclosed herein, wherein a cover layer disposed under the metal plate comprises a light-shielding material, and an adhesive layer for bonding the cover layer to the metal plate does not include a light-shielding material. Figures 6A to 6C The diagram shows a cover layer comprising a thermoplastic polyurethane film as the base film, an adhesive layer comprising an acrylic pressure-sensitive adhesive film as the base film, and a light-shielding material comprising reactive carbon black.

[0179] refer to Figure 6AIn the captured image, where a cover layer including a light-shielding material is attached to the lower portion of a metal plate via an adhesive layer including the light-shielding material, as in the electronic device according to the embodiment, it can be seen that the opening pattern formed in the metal plate is not visible because externally incident light is blocked. On the other hand, in the case where... Figure 6B As shown, when neither the cover layer beneath the metal plate nor the adhesive layer for bonding the cover layer contains light-shielding material, the opening pattern is clearly visible, and, as in... Figure 6C As shown, in the case where the overlay layer disposed beneath the metal plate includes a light-shielding material and the adhesive layer used to bond the overlay layer to the metal plate does not include a light-shielding material, it can be seen that the opening pattern is partially visible. More specifically, in cases such as Figure 6A As shown, when the overlay including the light-shielding material is attached to the lower portion of the metal plate via an adhesive layer including the light-shielding material, the OD (optical density) value is measured to be 5. However, in cases where... Figure 6B As shown, when the cover layer disposed under the metal plate and the adhesive layer used to bond the cover layer do not include a light-shielding material, the OD value is measured to be 2.6, and, in the case of... Figure 6C As shown, when the cover layer disposed under the metal plate includes a light-shielding material, and the adhesive layer bonding the cover layer to the metal plate does not include a light-shielding material, the OD value is measured to be 3. Based on the measurement results, the electronic device according to the embodiment can effectively absorb and block external light by attaching a cover layer including a light-shielding material to the lower portion of the metal plate through an adhesive layer including a light-shielding material. Therefore, it can be seen that the display performance of the electronic device is prevented from being degraded by light incident from the bottom of the electronic device.

[0180] According to an embodiment, the buffer layer that can be disposed between the lower protective film and the metal plate of the display panel can be omitted, and the cover film attached under the metal support member and the adhesive film attached to the cover film can include a light-shielding material, thereby improving the impact resistance of the electronic device and blocking light incident from the outside. Therefore, the display efficiency of the electronic device can be improved.

[0181] Although this disclosure has been described with reference to embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications may be made thereto without departing from the spirit and scope of this disclosure as set forth in the appended claims. Therefore, the subject matter disclosed should not be limited to any single embodiment described herein, and the scope of the claimed invention should be determined in accordance with the appended claims.

Claims

1. An electronic device, wherein, The electronic device includes: window; The display panel is located below the window; A support member is disposed below the display panel; A covering layer is disposed beneath the supporting member; and An adhesive layer is disposed between the support member and the cover layer. Each of the adhesive layer and the cover layer includes a light-shielding material. The cover layer further includes a cover matrix material, which includes silicone resin or polyurethane resin, and includes a first functional group in the light-shielding material and a second functional group in the cover matrix material that are chemically bonded together.

2. The electronic device according to claim 1, wherein, The support member includes a plate with metal components, and The cover layer is attached to the lower portion of the board via the adhesive layer.

3. The electronic device according to claim 2, wherein, The plate includes a first non-folded region, a folded region, and a second non-folded region arranged in a first direction, and The plate also includes a plurality of openings that overlap with the folded area in a plan view.

4. The electronic device according to claim 3, wherein, In the plan view, the covering layer overlaps with the folded area of ​​the plate.

5. The electronic device according to claim 3, wherein, In the plan view, the adhesive layer overlaps with the folded area of ​​the board.

6. The electronic device according to claim 1, wherein, The light-shielding material included in each of the cover layer and the adhesive layer comprises reactive carbon black.

7. The electronic device according to claim 1, wherein, The polyurethane resin is a thermoplastic polyurethane resin.

8. The electronic device according to claim 6, wherein, The adhesive layer further includes an adhesive matrix material, which comprises an acrylic resin, and The first functional group included in the light-shielding material and the third functional group included in the adhesive matrix material are chemically bonded.

9. The electronic device according to claim 1, wherein, The electronic device also includes: A light-shielding layer is provided on the supporting member.

10. The electronic device according to claim 9, wherein, The electronic device also includes: The lower protective film is disposed below the display panel, and An additional adhesive layer is disposed between the lower protective film and the light-shielding layer. The additional adhesive layer contacts the lower protective film and the light-shielding layer.

11. The electronic device according to claim 9, wherein, The covering layer includes a first light-shielding material. The light-shielding layer includes a second light-shielding material, and The first light-blocking material and the second light-blocking material are different from each other.

12. The electronic device according to claim 1, further comprising: A buffer component is disposed between the support component and the display panel.

13. The electronic device according to claim 1, wherein, The adhesive layer contacts the lower surface of the support member and the upper surface of the cover layer.

14. The electronic device according to claim 1, wherein, The electronic device also includes: The lower support component is located below the cover layer.

15. The electronic device according to claim 1, wherein, The covering layer is a flexible membrane.

16. An electronic device, wherein, The electronic device includes: The display panel has an unfolded first state or a folded second state; A support member is disposed below the display panel and includes a first non-folding area, a folding area, and a second non-folding area arranged in a first direction. The support member also includes a plurality of openings that overlap with the folding area in a plane. A covering layer, disposed beneath the supporting member and overlapping at least with the folded area in the plan view; and An adhesive layer is disposed between the support member and the cover layer. Each of the covering layer and the adhesive layer includes a light-shielding material. The cover layer further includes a cover matrix material, which includes silicone resin or polyurethane resin, and includes a first functional group in the light-shielding material and a second functional group in the cover matrix material that are chemically bonded together.

17. The electronic device according to claim 16, wherein, The light-shielding material included in each of the cover layer and the adhesive layer comprises reactive carbon black.

18. The electronic device according to claim 16, wherein, The adhesive layer further includes an adhesive matrix material, and In the adhesive layer, the light-shielding material is chemically bonded to the adhesive matrix material.

19. The electronic device according to claim 16, wherein, The display panel includes an active area and a peripheral area outside the active area. In the plan view, the peripheral area does not overlap with the adhesive layer, and The width of the support member in the first direction is greater than each of the width of the display panel in the first direction and the width of the cover layer in the first direction.

20. An electronic device, wherein, The electronic device includes: window; The display panel is located below the window; A metal plate is disposed below the display panel; A light-shielding layer is directly applied to the metal plate; A cover layer is disposed beneath the metal plate; and An adhesive layer is disposed between the metal plate and the cover layer. Each of the adhesive layer and the cover layer includes a light-shielding material. The cover layer further includes a cover matrix material, which includes silicone resin or polyurethane resin, and includes a first functional group in the light-shielding material and a second functional group in the cover matrix material that are chemically bonded together.

21. The electronic device according to claim 20, wherein, The metal plate includes a first non-folded region, a folded region, and a second non-folded region arranged in a first direction, and the metal plate also includes a plurality of openings overlapping the folded regions in a plan view. In the plan view, the covering layer overlaps at least with the folded area.

22. The electronic device according to claim 21, wherein, The light-shielding layer includes multiple openings, and In the plan view, each of the plurality of openings in the light-shielding layer overlaps with the corresponding opening in the plurality of openings in the metal plate.

Images