Multilayer capacitor and board for mounting the same

Abstract

The present disclosure provides a multilayer capacitor and a board for mounting the same. The multilayer capacitor includes a capacitor body including dielectric layers and a plurality of internal electrodes, and a pair of external electrodes provided on opposite ends of the capacitor body and connected to exposed portions of the internal electrodes, wherein each of the pair of external electrodes includes a conductive layer including a connection portion formed on one end surface of the capacitor body and connected to the internal electrodes, and a strip portion extending from the connection portion to a portion of a surface of the capacitor body adjacent to the end surface, a conductive resin layer covering a corner portion of the connection portion of the conductive layer and having a cut portion such that a portion of an edge of the connection portion is exposed, and a plating layer covering the conductive layer and the conductive resin layer and contacting a portion of the conductive layer through the cut portion.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0146190, filed on November 4, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes. Technical Field

[0002] This disclosure relates to a multilayer capacitor and a plate for mounting the multilayer capacitor. Background Technology

[0003] Compact, high-capacitance multilayer capacitors have been used in a variety of electronic devices.

[0004] In recent years, with the rapid rise of environmentally friendly and electric vehicles, the number of electric drive systems in vehicles has increased, thus increasing the demand for multilayer capacitors required for vehicles.

[0005] As automotive components require high levels of thermal and electrical reliability, the performance requirements for multilayer capacitors are also gradually increasing.

[0006] In particular, a multilayer capacitor structure with strong durability against external vibrations and deformation is needed. Summary of the Invention

[0007] An exemplary embodiment provides a multilayer capacitor with excellent durability against external vibration and deformation, and a plate for mounting the multilayer capacitor.

[0008] According to an exemplary embodiment of the present disclosure, a multilayer capacitor may include: a capacitor body including a dielectric layer and a plurality of inner electrodes; and a pair of outer electrodes disposed on opposite ends of the capacitor body and connected to exposed portions of the plurality of inner electrodes, wherein each of the pair of outer electrodes includes: a conductive layer including a connecting portion and a strip portion, the connecting portion being disposed on an end surface of the capacitor body and connected to a portion of the plurality of inner electrodes, the strip portion extending from the connecting portion to a portion of a surface of the capacitor body adjacent to the end surface; a conductive resin layer covering a corner of the connecting portion of the conductive layer and having a cutout portion such that a portion of the edge of the connecting portion is exposed; and a plating layer covering the conductive layer and the conductive resin layer and contacting a portion of the conductive layer through the cutout portion.

[0009] The cut may be formed at the center of the conductive resin layer, thereby exposing the center of the conductive layer.

[0010] The capacitor body may include a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connecting the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connecting the first surface and the second surface, connecting the third surface and the fourth surface and opposite to each other in a third direction, wherein the plurality of internal electrodes include a first internal electrode and a second internal electrode exposed through the third surface and the fourth surface, respectively.

[0011] The cutout may be formed as a portion of the edge of the connector that is stretched upward from the center of the conductive resin layer to expose a portion of the edge that contacts the fifth or sixth surface of the capacitor body.

[0012] The cutout may be formed to be elongated in a third direction from the center of the conductive resin layer to expose a portion of the edge of the connector that contacts the fifth surface of the capacitor body and a portion of the edge of the connector that contacts the sixth surface of the capacitor body.

[0013] The cutout may be formed as an elongation from the center of the conductive resin layer in the first direction to expose a portion of the edge of the connection that contacts the first or second surface of the capacitor body.

[0014] The cutout may be formed as an elongation from the center of the conductive resin layer in the first direction to expose a portion of the edge of the connector that contacts the first surface of the capacitor body and a portion of the edge of the connector that contacts the second surface of the capacitor body.

[0015] The cutout may be formed to be elongated from the center of the conductive resin layer in the first direction to expose a portion of the edge of the connector that contacts the first surface of the capacitor body and a portion of the edge of the connector that contacts the second surface of the capacitor body, and the cutout may be formed to be elongated from the center of the conductive resin layer in the third direction to expose a portion of the edge of the connector that contacts the fifth surface of the capacitor body and a portion of the edge of the connector that contacts the sixth surface of the capacitor body.

[0016] When viewed from a cross-section of the multilayer capacitor, the cutout can be formed in a cross-shaped (+) configuration.

[0017] The conductive resin layer may contain metal powder particles and resin.

[0018] The metal powder particles may be spherical or flake-shaped.

[0019] The plating may include a nickel plating covering the conductive layer and the conductive resin layer, and a tin (Sn) plating covering the nickel plating.

[0020] According to an exemplary embodiment, a plate for mounting a multilayer capacitor may include: a substrate having a pair of electrode pads disposed spaced apart from each other on a surface of the substrate; and the multilayer capacitor mounted on the pair of electrode pads such that the pair of external electrodes are respectively connected to the pair of electrode pads.

[0021] According to another exemplary embodiment of this disclosure, a multilayer capacitor may include: a capacitor body including a dielectric layer and a plurality of inner electrodes; and a pair of outer electrodes disposed on opposite ends of the capacitor body and connected to exposed portions of the plurality of inner electrodes. Each of the pair of outer electrodes includes: a conductive layer disposed on one end surface of the capacitor body; a conductive resin layer configured to cover a portion of the conductive layer and having a cutout, wherein a portion of at least one edge of the conductive layer is exposed through the cutout; and a plating layer configured to cover the conductive layer and the conductive resin layer and contact a portion of the conductive layer through the cutout.

[0022] According to another exemplary embodiment of this disclosure, a multilayer capacitor may include: a capacitor body including a dielectric layer and a plurality of inner electrodes; and a pair of outer electrodes disposed on opposite ends of the capacitor body and connected to exposed portions of the plurality of inner electrodes. Each of the pair of outer electrodes includes: a conductive layer disposed on one end surface of the capacitor body; a conductive resin layer configured to cover at least two of the four corners of the conductive layer; and a plating layer configured to cover the conductive layer and the conductive resin layer. The portions of the conductive resin layer respectively covering the at least two corners of the conductive layer are spaced apart from each other. A portion of the edge of the conductive layer is exposed through the space between the portions of the conductive resin layer respectively covering the at least two corners of the conductive layer. Attached Figure Description

[0023] The above and other aspects, features and advantages of the present invention will be more clearly understood by taking into account the accompanying drawings and the following detailed description, in which:

[0024] Figure 1 This is a schematic perspective view of a multilayer capacitor according to exemplary embodiments of the present disclosure;

[0025] Figure 2A and Figure 2B These are respectively shown as applied to Figure 1An exploded perspective view of the first and second internal electrodes of a multilayer capacitor.

[0026] Figure 3 It is along Figure 1 A cross-sectional view taken from line II′;

[0027] Figure 4 It is shown Figure 1 A side view of the structure of the first external electrode in the middle;

[0028] Figure 5 This is a cross-sectional view of a multilayer capacitor according to another exemplary embodiment of this disclosure;

[0029] Figure 6 It is shown Figure 5 A side view of the structure of the first external electrode in the middle;

[0030] Figure 7 This is a cross-sectional view of a multilayer capacitor according to another exemplary embodiment of this disclosure;

[0031] Figure 8 It is shown Figure 7 A side view of the first external electrode; and

[0032] Figure 9 It is shown Figure 7 A schematic cross-sectional view of a multilayer capacitor mounted on a substrate. Detailed Implementation

[0033] Exemplary embodiments of this disclosure will be described in detail with reference to the accompanying drawings.

[0034] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various modifications, variations, and equivalents of the methods, apparatus, and / or systems described herein will be readily understood by those skilled in the art. The order of operations described herein is merely illustrative and is not limited to the order presented, but rather allows for changes that will be readily understood by those skilled in the art, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of functions and structures known to those skilled in the art may be omitted.

[0035] The features described herein may be implemented in various forms and are not to be construed as being limited to the examples described herein. Rather, the examples provided herein are intended to make this disclosure thorough and complete and to fully convey the scope of this disclosure to those skilled in the art.

[0036] Here it should be noted that the use of the term “may” in relation to examples or embodiments (e.g., what an example or embodiment may include or implement) means that there exists at least one example or embodiment that includes or implements such a feature, and is not limited to all examples or embodiments that include or implement such a feature.

[0037] Throughout the specification, when an element such as a layer, region, or substrate is described as being "on" another element, "connected to" another element, or "bonded to" another element, the element may be directly "on" said other element, directly "connected to" said other element, or directly "bonded to" said other element, or there may be one or more other elements between them. In contrast, when an element is described as being "directly on" another element, "directly connected to" another element, or "directly bonded to" another element, there are no other elements between them.

[0038] As used herein, the term “and / or” includes any one of the relevant listed items or any combination of any two or more items.

[0039] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teaching of the examples described herein, the first component, first assembly, first region, first layer, or first part referred to as the first component, first assembly, first region, first layer, or first part may also be referred to as the second component, second assembly, second region, second layer, or second part.

[0040] For ease of description, spatial relative terms such as “above,” “above,” “below,” and “under” are used herein to describe the relationship between one element and another as shown in the accompanying drawings. Such spatial relative terms are intended to include not only the orientation depicted in the drawings but also the different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “above” relative to another element will be “below” or “under” relative to that other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein will be interpreted accordingly.

[0041] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is intended to include the plural form as well. The terms “comprising,” “including,” and “having” enumerate the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0042] The shapes shown in the accompanying drawings may vary due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that occur during manufacturing.

[0043] The features of the examples described herein can be combined in various ways that will be readily understood after an understanding of the disclosure of this application. Furthermore, although the examples described herein have various configurations, other configurations that will be readily understood after an understanding of the disclosure of this application are possible.

[0044] The accompanying drawings may be drawn off-scale, and for clarity, illustration, and convenience, the relative sizes, scales, and depictions of elements in the drawings may be exaggerated.

[0045] In the following, in order to illustrate exemplary embodiments of the present disclosure, the orientation of the capacitor body 110 shown in the drawings is defined as follows: X, Y and Z represent the length direction, width direction and thickness direction of the capacitor body 110, respectively.

[0046] Furthermore, in this exemplary embodiment, the Z direction may have the same concept as the stacking direction of the stacked dielectric layers.

[0047] In addition, in this exemplary embodiment, the X direction, Y direction and Z direction can be defined as a second direction, a third direction and a first direction, respectively.

[0048] Figure 1 This is a schematic perspective view of a multilayer capacitor according to exemplary embodiments of the present disclosure. Figure 2A and Figure 2B These are respectively shown as applied to Figure 1 An exploded perspective view of the first and second internal electrodes of a multilayer capacitor. Figure 3 It is along Figure 1 A cross-sectional view taken from line II′. Figure 4 It is shown Figure 1 A side view of the structure of the first external electrode in the image.

[0049] Reference Figures 1 to 4 The multilayer capacitor 100 according to this exemplary embodiment includes a capacitor body 110, a first external electrode 130, and a second external electrode 140.

[0050] The capacitor body 110 is obtained by stacking multiple dielectric layers 111 in the Z direction and then sintering them, and the adjacent dielectric layers 111 of the capacitor body 110 can be integrated, such that the boundary between adjacent dielectric layers 111 may not be obvious without the use of a scanning electron microscope (SEM).

[0051] Here, the capacitor body 110 may have a generally hexahedral shape, but this disclosure is not limited thereto. Furthermore, the shape and size of the capacitor body 110 and the number of stacked dielectric layers 111 are not limited to those shown in the accompanying drawings of this exemplary embodiment.

[0052] In this exemplary embodiment, for ease of description, the two surfaces of the capacitor body 110 that are opposite to each other in the Z direction are defined as the first surface 1 and the second surface 2, the two surfaces connected to the first surface 1 and the second surface 2 that are opposite to each other in the X direction are defined as the third surface 3 and the fourth surface 4, and the two surfaces connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and that are opposite to each other in the Y direction are defined as the fifth surface 5 and the sixth surface 6.

[0053] In addition, in this exemplary embodiment, the mounting surface of the multilayer capacitor 100 may be the first surface 1 of the capacitor body 110.

[0054] The dielectric layer 111 may include a ceramic material with a high dielectric constant, and may include, for example, barium titanate (BaTiO3)-based or strontium titanate (SrTiO3)-based ceramic powders, but this disclosure is not limited thereto, as long as sufficient capacitance can be obtained.

[0055] In addition to ceramic powder, dielectric layer 111 may also include ceramic additives, organic solvents, plasticizers, binders and dispersants.

[0056] As ceramic additives, for example, transition metal oxides or transition metal carbides, rare earth elements, magnesium (Mg) or aluminum (Al) can be used.

[0057] The capacitor body 110 may include: an effective region, which contributes to the capacitance formation of the capacitor; an upper cover 112 and a lower cover 113, which are respectively formed to cover the upper and lower surfaces of the effective region in the Z direction.

[0058] The upper cover 112 and the lower cover 113 may have the same material and construction as the dielectric layer 111, except that they do not include the inner electrode.

[0059] The upper cover 112 and the lower cover 113 can be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the effective region in the Z direction, respectively, and are essentially used to prevent damage to the first inner electrode 121 and the second inner electrode 122 due to physical or chemical stress.

[0060] The first internal electrode 121 and the second internal electrode 122 are electrodes with different polarities. The first internal electrode 121 and the second internal electrode 122 are alternately arranged along the Z direction, the dielectric layer 111 is between the first internal electrode 121 and the second internal electrode 122, and one end of the first internal electrode 121 and one end of the second internal electrode 122 can be exposed through the third surface 3 and the fourth surface 4 of the capacitor body 110, respectively.

[0061] In this case, the first inner electrode 121 and the second inner electrode 122 can be electrically insulated from each other by a dielectric layer 111 disposed between them.

[0062] In this manner, the ends of the first inner electrode 121 and the second inner electrode 122, which are alternately exposed through the third surface 3 and the fourth surface 4 of the capacitor body 110, can be electrically connected to the first outer electrode 130 disposed on the third surface 3 of the capacitor body 110 and the second outer electrode 140 disposed on the fourth surface 4 of the capacitor body 110 (described later).

[0063] According to the above configuration, when a predetermined voltage is applied to the first external electrode 130 and the second external electrode 140, charge accumulates between the first internal electrode 121 and the second internal electrode 122.

[0064] Here, the capacitance of the multilayer capacitor 100 is proportional to the overlap area of ​​the first inner electrode 121 and the second inner electrode 122 in the effective region in the Z direction.

[0065] Furthermore, there are no particular limitations on the materials used to form the first internal electrode 121 and the second internal electrode 122, and conductive pastes including at least one of noble metal materials (such as platinum (Pt), palladium (Pd), palladium-silver (Pd-Ag) alloy, nickel (Ni), and copper (Cu) can be used.

[0066] Here, screen printing or gravure printing can be used as the printing method for conductive paste, but this disclosure is not limited to these methods.

[0067] The first external electrode 130 and the second external electrode 140 can be provided with voltages of different polarities, can be disposed at both ends of the capacitor body 110 in the X direction, and can be electrically connected to the exposed portion of the first internal electrode 121 and the exposed portion of the second internal electrode 122.

[0068] Here, the first external electrode 130 includes a first conductive layer 131 formed on the surface of the capacitor body 110 and connected to the first internal electrode, a first conductive resin layer 135 formed to cover the first conductive layer 131, and a first plating layer 133 formed to cover the first conductive resin layer 135. The second external electrode 140 includes a second conductive layer 141 formed on the surface of the capacitor body 110 and connected to the second internal electrode, a second conductive resin layer 145 formed to cover the second conductive layer 141, and a second plating layer 143 formed to cover the second conductive resin layer 145.

[0069] The first conductive layer 131 may include a first connecting portion 131a and a first strip portion 131b.

[0070] The first connecting portion 131a is a portion formed on the third surface 3 of the capacitor body 110 and connected to the exposed portion of the first internal electrode 121, and the first strip portion 131b is a portion extending from the first connecting portion 131a to a portion of the first surface 1 of the capacitor body 110.

[0071] Here, the first strip 131b may further extend to a portion of the fifth surface 5, a portion of the sixth surface 6, and a portion of the second surface 2 of the capacitor body 110 to improve adhesion strength, etc.

[0072] The second conductive layer 141 may include a second connecting portion 141a and a second strip portion 141b.

[0073] The second connecting portion 141a is a portion formed on the fourth surface 4 of the capacitor body 110 and connected to the exposed portion of the second inner electrode 122, and the second strip portion 141b is a portion extending from the second connecting portion 141a to a portion of the first surface 1 of the capacitor body 110.

[0074] Here, the second strip 141b may further extend to a portion of the fifth surface 5, a portion of the sixth surface 6, and a portion of the second surface 2 of the capacitor body 110 to improve adhesion strength, etc.

[0075] The first conductive layer 131 and the second conductive layer 141 are sintered electrode layers and may include at least one of copper (Cu) and silver (Ag), and may also include glass, epoxy resin, etc.

[0076] The first conductive resin layer 135 and the second conductive resin layer 145 can be formed to cover the first conductive layer 131 and the second conductive layer 141, respectively.

[0077] Here, the first conductive resin layer 135 may cover the corner of the first connecting portion 131a of the first conductive layer 131, and may have a first cut portion 136 to expose a portion of the edge of the first connecting portion 131a.

[0078] Furthermore, the second conductive resin layer 145 may cover the corner of the second connection portion 141a of the second conductive layer 141, and may have a second cutout portion 146 to expose a portion of the edge of the second connection portion 141a.

[0079] The first cut portion 136 and the second cut portion 146 may be formed at the center of the first conductive resin layer 135 and the second conductive resin layer 145, respectively, so that the center of the first connecting portion 131a of the first conductive layer 131 and the center of the second connecting portion 141a of the second conductive layer 141 can be exposed.

[0080] The first conductive resin layer 135 that contacts the first conductive layer 131 may include a plurality of metal powder particles and resin surrounding the plurality of metal powder particles, and the second conductive resin layer 145 that contacts the second conductive layer 141 may include a plurality of metal powder particles and resin surrounding the plurality of metal powder particles.

[0081] Here, the resin may be one of polymeric resins such as epoxy resin and acrylic resin, but this disclosure is not limited thereto.

[0082] Furthermore, the metal powder particles can be formed using one or an alloy of two or more of Cu, Ag and Sn, but this disclosure is not limited thereto.

[0083] Furthermore, the metal powder particles can be formed into spherical or flake shapes, but this disclosure is not limited thereto.

[0084] Figure 4 This is a view showing the first plating 133 of the first external electrode 130 transparent in the direction facing the third surface of the capacitor body 110.

[0085] The first external electrode 130 and the second external electrode 140 are generally similar in structure, except that the first external electrode 130 is electrically connected to the first internal electrode 121 and the second external electrode 140 is connected to the second internal electrode 122.

[0086] Therefore, the following description will be based on the first external electrode 130, but this description is considered to include the description of the second external electrode 140.

[0087] Reference Figure 4 The first conductive resin layer 135 covers the four corners of the first connection portion 131a, and the first cut portion 136 can extend from the center of the first conductive resin layer 135 toward the sixth surface 6 of the capacitor body 110 in the Y direction.

[0088] Therefore, a portion of the edge of the first connection portion 131a that contacts the sixth surface 6 of the capacitor body 110 can be exposed through the first cutout portion 136.

[0089] Here, although not shown, the first cutout 136 may extend in the Y direction toward the fifth surface 5 of the capacitor body 110, and in this case, a portion of the edge of the first connecting portion 131a that contacts the fifth surface 5 of the capacitor body 110 may be exposed.

[0090] As another exemplary embodiment, although not shown, the first cutout 136 may be formed to extend toward the first surface 1 or the second surface 2 of the capacitor body 110 in the Z direction, and in this case, a portion of the edge of the first connection portion 131a of the first conductive layer 131 in contact with the first surface 1 or a portion of the edge in contact with the second surface 2 may be exposed.

[0091] In addition, such as Figure 4 As shown, the length of the exposed portion of the edge of the first connecting portion 131a that contacts the sixth surface 6 of the capacitor body 110 in the Z direction may be less than the length of the portion of the first cut portion 136 located at the center of the first conductive resin layer 135 in the Z direction.

[0092] The first plating layer 133 may include a first nickel (Ni) plating layer covering the first conductive layer 131 and the first conductive resin layer 135, and a first tin (Sn) plating layer covering the first nickel (Ni) plating layer.

[0093] The second plating layer 143 may include a second nickel (Ni) plating layer covering the second conductive layer 141 and the second conductive resin layer 145, and a second tin (Sn) plating layer covering the second nickel (Ni) plating layer.

[0094] As the operating environment of multilayer capacitors becomes harsher, existing multilayer capacitors are prone to breakage due to vibration or mechanical deformation of the mounting plate.

[0095] To prevent such cracking, a structure has been disclosed in which a conductive electrode layer containing a stretchable resin is formed on the external electrode to reduce stress from the outside.

[0096] Specifically, the structure includes an inner layer for electrically connecting the outer electrode to the inner electrode and an outer conductive resin layer formed on the inner layer, the outer conductive resin layer being primarily used to mitigate external impacts and improve moisture resistance.

[0097] Especially in the case of multilayer capacitors used in vehicle electrical components, the conductive resin layer of the outer electrode is used to mitigate physical shocks (such as vibrations) transmitted from the outside.

[0098] However, vehicle electrical components need to have higher durability to withstand external shocks, but there are limitations to meeting this high level of durability using only existing technology structures.

[0099] In addition, when the external electrode includes a conductive resin layer, the resistance (especially the equivalent series resistance (ESR)) of the multilayer capacitor increases due to the low conductivity of the conductive resin layer itself.

[0100] Furthermore, due to the relatively large coefficient of thermal expansion of the resin, interface degradation may occur near the conductive resin layer in thermal shock environments such as temperature cycling.

[0101] Therefore, a structure is disclosed in which a conductive resin layer is formed only in a portion of the edge of the mounting surface of the multilayer capacitor on the board, so as to prevent ESR from increasing while increasing the board's resistance to deformation and durability.

[0102] However, with this structure, since the mounting orientation of the multilayer capacitors is determined to a specific direction (1 / 4 of all sides), the orientation error of the multilayer capacitors may easily occur during the surface mount process during manufacturing, and even during board mounting operations, the degree of process freedom is reduced.

[0103] An exemplary embodiment of the present disclosure provides a multilayer capacitor having a structure in which a cutout is provided to expose a portion of the edge of the connection portion, while a conductive resin layer covers the four corners of the connection portion of the conductive layer that are susceptible to external impact.

[0104] According to this structure, the durability of multilayer capacitors against plate warping deformation can be increased, and the ESR of multilayer capacitors can be prevented from increasing by allowing a portion of the conductive layer to directly contact the plating through the cutout.

[0105] Furthermore, since the conductive resin layer is formed on at least a portion of the four edges of the conductive layer's connection portion, the multilayer capacitor can be mounted on the board without orientation errors, regardless of its orientation.

[0106] Figure 5 This is a cross-sectional view showing a multilayer capacitor according to another exemplary embodiment of the present disclosure, and Figure 6 It is shown Figure 5 Side view of the first external electrode.

[0107] The following description will be based on the first external electrode 130', but the description is considered to include the description of the second external electrode 140'.

[0108] exist Figure 5 In the figure, reference numerals 144a and 144b indicate the second conductive resin layer of the second external electrode 140', and reference numeral 146' indicates the second cut portion.

[0109] Reference Figure 5 and Figure 6The first cutout 136' of the first conductive resin layer 134 is formed to extend from the center of the first conductive resin layer 134 toward the left and right in the Y direction, such that a portion of the edge of the first connecting portion 131a of the first conductive layer 131 that contacts the fifth surface 5 of the capacitor body 110 and a portion of the edge of the first connecting portion 131a of the first conductive layer 131 that contacts the sixth surface 6 of the capacitor body 110 are exposed.

[0110] Here, the first conductive resin layer 134 can be divided into an upper first-1 conductive resin layer 134a and a lower first-2 conductive resin layer 134b through the first cut portion 136'.

[0111] As another example, although not shown, the first cutout 136' may be formed to extend upward and downward in the Z direction, such that a portion of the edge of the first connection portion 131a of the first conductive layer 131 that contacts the first surface 1 of the capacitor body 110 and a portion of the edge of the first connection portion 131a of the first conductive layer 131 that contacts the second surface 2 of the capacitor body 110 may be exposed.

[0112] Figure 7 This is a cross-sectional view showing a multilayer capacitor according to another exemplary embodiment of the present disclosure, and Figure 8 It is shown Figure 7 Side view of the first external electrode.

[0113] The following description will be based on the first external electrode 130”, but the description is considered to include the description of the second external electrode 140”.

[0114] exist Figure 7 In the figure, reference numerals 142a and 142b indicate the second conductive resin layer of the second external electrode 140”, and reference numeral 146” indicates the second cut portion.

[0115] Reference Figure 7 and Figure 8 The first cutout 136” can be formed to extend to the left and right in the Y direction from the center of the first conductive resin layer 132, such that a portion of the edge of the first connecting portion 131a of the first conductive layer 131 that contacts the fifth surface 5 of the capacitor body 110 and a portion of the edge of the first connecting portion 131a of the first conductive layer 131 that contacts the sixth surface 6 of the capacitor body 110 can be exposed.

[0116] Furthermore, the first cutout 136” may be formed to extend upward and downward in the Z direction from the center of the first conductive resin layer 132, such that a portion of the edge of the first connecting portion 131a of the first conductive layer 131 that contacts the first surface 1 of the capacitor body 110 and a portion of the edge of the first connecting portion 131a of the first conductive layer 131 that contacts the second surface 2 of the capacitor body 110 may be exposed.

[0117] Here, in the first cutout 136”, the portion extending from the center of the first conductive resin layer 132 in the Y direction and the portion extending from the center of the first conductive resin layer 132 in the Z direction can be connected to each other. Therefore, when viewed from the direction facing the third surface 3 of the capacitor body 110, the first cutout 136” can be formed to have a cross-shaped (+) shape as a whole.

[0118] Here, the first conductive resin layer 132 can be divided into four conductive resin layers 132a, 132b, 132c and 132d that are spaced apart from each other and cover the four corners of the first connecting portion 131a of the first conductive layer 131 through the first cut portion 136”.

[0119] Figure 9 It is shown Figure 7 A schematic cross-sectional view of a multilayer capacitor mounted on a substrate.

[0120] Reference Figure 9 According to this exemplary embodiment, the mounting plate of the multilayer capacitor includes a substrate 210 and a multilayer capacitor 100. The substrate 210 has a first electrode pad 221 and a second electrode pad 222 disposed at intervals on its surface. The multilayer capacitor 100 is mounted on the upper surface of the substrate 210 such that a first external electrode 130” and a second external electrode 140” are respectively mounted on the first electrode pad 221 and the second electrode pad 222.

[0121] Figure 9 It shows having Figure 7 A multilayer capacitor with a structure is mounted on substrate 210, but this disclosure is not limited thereto. For example, a multilayer capacitor having... Figure 3 or Figure 5 The multilayer capacitor with the structure can be mounted on the substrate 210.

[0122] In addition, in this exemplary embodiment, the multilayer capacitor 100 is described as being bonded to the first electrode pad 221 and the second electrode pad 222 of the substrate 210 by solder 231 and 232 and mounted together with the first electrode pad 221 and the second electrode pad 222 of the substrate 210, but conductive paste may be used instead of solder if needed.

[0123] As described above, according to an exemplary embodiment, the conductive resin layer of the external electrode has a cutout to expose a portion of the edge of the connection portion of the conductive layer, so that a portion of the conductive layer can directly contact the plating layer, thereby improving the warpage resistance of the multilayer capacitor and preventing ESR from increasing.

[0124] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer capacitor, comprising: A capacitor body includes a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connecting the first surface and the second surface to each other and opposite to each other in a second direction, and a fifth surface and a sixth surface connecting the first surface and the second surface to each other, connecting the third surface and the fourth surface to each other and opposite to each other in a third direction, and includes a dielectric layer and a plurality of internal electrodes, the plurality of internal electrodes including a first internal electrode and a second internal electrode exposed through the third surface and the fourth surface, respectively; as well as An outer electrode is disposed on the third and fourth surfaces of the capacitor body and connected to the exposed portions of the plurality of inner electrodes. Each of the outer electrodes comprises: A conductive layer includes a connecting portion and a strip portion, the connecting portion being disposed on one end surface of the capacitor body and connected to a portion of the plurality of internal electrodes, and the strip portion extending from the connecting portion to a portion of the surface of the capacitor body adjacent to the end surface; A conductive resin layer is configured to cover the corner of the connecting portion of the conductive layer and has a cutout, through which a portion of the edge of the connecting portion is exposed; and A plating layer is configured to cover the conductive layer and the conductive resin layer and to contact a portion of the conductive layer through the cutout. The cut portion has a central portion at the center of both the first and third directions, and extends from the center to be elongated in the first direction to expose a portion of the edge of the connection portion that contacts at least one of the first and second surfaces of the capacitor body. Wherein, the length of each side of the middle portion of the cut is greater than the length of the portion of the edge of the cut that contacts at least one of the first and second surfaces.

2. The multilayer capacitor according to claim 1, wherein, The thickness of the coating at the center of the cut is greater than the thickness of the portion of the coating covering the conductive resin layer.

3. The multilayer capacitor according to claim 1, wherein, The conductive resin layer comprises metal powder particles and resin.

4. The multilayer capacitor according to claim 3, wherein, The metal powder particles are spherical or flake-shaped.

5. The multilayer capacitor according to any one of claims 1-4, wherein, The plating layer includes a nickel plating layer covering the conductive layer and the conductive resin layer, and a tin plating layer covering the nickel plating layer.

6. A multilayer capacitor, comprising: A capacitor body includes a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connecting the first surface and the second surface to each other and opposite to each other in a second direction, and a fifth surface and a sixth surface connecting the first surface and the second surface to each other, connecting the third surface and the fourth surface to each other and opposite to each other in a third direction, and includes a dielectric layer and a plurality of internal electrodes, the plurality of internal electrodes including a first internal electrode and a second internal electrode exposed through the third surface and the fourth surface, respectively; as well as An outer electrode is disposed on the third and fourth surfaces of the capacitor body and connected to the exposed portions of the plurality of inner electrodes. Each of the outer electrodes comprises: A conductive layer includes a connecting portion and a strip portion, the connecting portion being disposed on one end surface of the capacitor body and connected to a portion of the plurality of internal electrodes, and the strip portion extending from the connecting portion to a portion of the surface of the capacitor body adjacent to the end surface; A conductive resin layer is configured to cover the corner of the connecting portion of the conductive layer and has a cutout, through which a portion of the edge of the connecting portion is exposed; and A plating layer is configured to cover the conductive layer and the conductive resin layer and to contact a portion of the conductive layer through the cutout. The cut portion extends from the center of the conductive resin layer in the first direction to expose a portion of the edge of the conductive layer that contacts the first surface of the capacitor body and a portion of the edge of the conductive layer that contacts the second surface of the capacitor body. The cut extends in a third direction from the center of the conductive resin layer to expose both a portion of the edge of the conductive layer that contacts the fifth surface of the capacitor body and a portion of the edge of the conductive layer that contacts the sixth surface of the capacitor body.

7. The multilayer capacitor according to claim 6, wherein, When viewed from a cross-section of the multilayer capacitor, the cutout extends into a cross-shaped form.

8. The multilayer capacitor according to any one of claims 6, wherein, The conductive resin layer comprises metal powder particles and resin.

9. The multilayer capacitor according to claim 8, wherein, The metal powder particles are spherical or flake-shaped.

10. The multilayer capacitor according to any one of claims 6-9, wherein, The plating layer includes a nickel plating layer covering the conductive layer and the conductive resin layer, and a tin plating layer covering the nickel plating layer.

11. A multilayer capacitor, comprising: The capacitor body includes a dielectric layer and multiple internal electrodes; as well as An outer electrode is disposed on opposite ends of the capacitor body and connected to the exposed portions of the plurality of inner electrodes. Each of the outer electrodes comprises: A conductive layer is disposed on one end surface of the capacitor body; A conductive resin layer, configured to cover a portion of the conductive layer and having a cutout, through which a portion of at least one edge of the conductive layer is exposed; and A plating layer is configured to cover the conductive layer and the conductive resin layer and to contact a portion of the conductive layer through the cutout. The cut is located at the center of the conductive resin layer, exposing the center of the conductive layer. The cutout has a central portion at its center, and the cutout extends from the center by being elongated from the center of the conductive resin layer, such that a portion of at least one edge of the conductive layer is exposed, and the length of each side of the central portion of the cutout is greater than the length of a portion of the at least one edge.

12. The multilayer capacitor according to claim 11, wherein the thickness of the plating at the center of the cut portion is greater than the thickness of the portion of the plating covering the conductive resin layer.

13. The multilayer capacitor according to claim 11, wherein, Each of the conductive layers includes a connecting portion and a strip portion, the connecting portion being disposed on one end surface of the capacitor body and connected to a portion of the plurality of inner electrodes, and the strip portion extending from the connecting portion to a portion of an adjacent surface of the capacitor body connected to the one end surface of the capacitor body.

14. The multilayer capacitor according to claim 13, wherein, The conductive resin layer extends along the outer surface of the strip to contact the adjacent surface of the capacitor body, and The plating extends along the outer surface of the conductive resin layer to contact the adjacent surface of the capacitor body.

15. A multilayer capacitor, comprising: The capacitor body includes a dielectric layer and multiple internal electrodes; as well as An outer electrode is disposed on opposite ends of the capacitor body and connected to the exposed portions of the plurality of inner electrodes. Each of the outer electrodes comprises: A conductive layer is disposed on one end surface of the capacitor body; A conductive resin layer, configured to cover a portion of the conductive layer and having a cutout, through which a portion of at least one edge of the conductive layer is exposed; and A plating layer is configured to cover the conductive layer and the conductive resin layer and to contact a portion of the conductive layer through the cutout. The cut is located at the center of the conductive resin layer, exposing the center of the conductive layer. The cut-out extends from the center of the conductive resin layer, such that a portion of each of the four edges of the conductive layer is exposed to contact the plating.

16. The multilayer capacitor according to claim 15, wherein, Each of the conductive layers includes a connecting portion and a strip portion, the connecting portion being disposed on one end surface of the capacitor body and connected to a portion of the plurality of inner electrodes, and the strip portion extending from the connecting portion to a portion of an adjacent surface of the capacitor body connected to the one end surface of the capacitor body.

17. The multilayer capacitor according to claim 16, wherein, The conductive resin layer extends along the outer surface of the strip to contact the adjacent surface of the capacitor body, and The plating extends along the outer surface of the conductive resin layer to contact the adjacent surface of the capacitor body.

18. A plate for mounting multilayer capacitors, comprising: A substrate having a pair of electrode pads disposed spaced apart from each other on one surface of the substrate; as well as The multilayer capacitor according to any one of claims 1-17 is mounted on the pair of electrode pads, wherein the pair of outer electrodes are respectively connected to the pair of electrode pads.

Images