Substrate processing apparatus and substrate processing method
Patent Information
- Application Number
- CN202111269786.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-10-30
- Filing Date
- 2021-10-29
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2041-10-29
AI Technical Summary
[0019]根据本发明的衬底处理装置及衬底处理方法,在衬底的面内接触处理液的时间不易产生偏差。
Smart Images

Figure CN114446824B_ABST
Abstract
Claims
1. A substrate processing apparatus comprising: Treatment tank, for storing treatment solution; A substrate holding section holds a substrate in the processing tank, immersing the substrate in the processing liquid stored in the processing tank. A bubble supply component supplies bubbles to the surface of the substrate immersed in the treatment liquid; The treatment fluid replenishment unit replenishes the treatment fluid into the treatment tank; and The control unit gradually reduces the amount of bubbles supplied from the bubble supply unit and replenishes the treatment liquid from the treatment liquid replenishment unit.
2. The substrate processing apparatus according to claim 1, wherein It also includes a storage unit that stores data, the data defining the relationship between a physical quantity corresponding to the amount of bubbles supplied from the bubble supply unit and the amount of processing liquid replenished from the processing liquid replenishment unit, and... Based on the data, the control unit controls the amount of treatment fluid replenished from the treatment fluid replenishment unit.
3. The substrate processing apparatus according to claim 1 or 2, further comprising: Gas supply piping supplies gas to the bubble supply component; and The flow rate adjustment unit adjusts the flow rate of the gas flowing in the gas supply piping.
4. The substrate processing apparatus according to claim 1 or 2, wherein It also includes a processing fluid replenishment unit, which supplies the processing fluid to the processing fluid replenishment component. The treatment fluid replenishment unit has: The replenishment tank stores the treatment solution; Add piping to allow the treatment fluid to flow to the treatment fluid replenishment component; The heating unit adjusts the temperature of the treatment liquid. and A filter is used to filter the treatment liquid.
5. The substrate processing apparatus according to claim 1 or 2, wherein The processing tank has: Inner tank, for storing the treatment solution; and The outer tank recovers the treatment liquid overflowing from the inner tank; and The substrate holding portion holds the substrate within the inner groove.
6. The substrate processing apparatus according to claim 5, further comprising: Circulation piping allows the treatment solution to circulate between the outer tank and the inner tank; and The treatment fluid supply unit is connected to the circulation piping and supplies the treatment fluid to the inner tank.
7. The substrate processing apparatus according to claim 5, wherein The treatment fluid replenishment component replenishes the treatment fluid into the outer tank.
8. A substrate processing method, comprising the following steps: The substrate is immersed in the processing solution stored in the processing tank; Air bubbles are supplied to the surface of the substrate immersed in the treatment solution; and The supply of bubbles is gradually reduced, and the treatment liquid is added to the treatment tank in response to the reduction in the supply.
Citation Information
Patent Citations
Particle removing method and substrate processing apparatus
JP2006100493A
Substrate processing apparatus and substrate processing method
CN108666235A
Liquid processing method, liquid processing apparatus, and storage medium
CN110556294A